WO2021135135A1 - Piezoelectric drive structure and imaging module - Google Patents
Piezoelectric drive structure and imaging module Download PDFInfo
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- WO2021135135A1 WO2021135135A1 PCT/CN2020/099644 CN2020099644W WO2021135135A1 WO 2021135135 A1 WO2021135135 A1 WO 2021135135A1 CN 2020099644 W CN2020099644 W CN 2020099644W WO 2021135135 A1 WO2021135135 A1 WO 2021135135A1
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- Prior art keywords
- piezoelectric
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- driving structure
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- piezoelectric driving
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- 238000003384 imaging method Methods 0.000 title claims abstract description 50
- 238000002955 isolation Methods 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 14
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- 238000010586 diagram Methods 0.000 description 18
- 230000033001 locomotion Effects 0.000 description 12
- 238000000034 method Methods 0.000 description 10
- 230000003287 optical effect Effects 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- MNKMDLVKGZBOEW-UHFFFAOYSA-M lithium;3,4,5-trihydroxybenzoate Chemical compound [Li+].OC1=CC(C([O-])=O)=CC(O)=C1O MNKMDLVKGZBOEW-UHFFFAOYSA-M 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
- H04N23/682—Vibration or motion blur correction
- H04N23/685—Vibration or motion blur correction performed by mechanical compensation
- H04N23/687—Vibration or motion blur correction performed by mechanical compensation by shifting the lens or sensor position
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
Definitions
- the invention relates to the technical field of motion control, in particular to a piezoelectric driving structure and an imaging module.
- a driving mechanism such as a VCM motor (Voice Coil Actuator/Voice Coil Motor) is usually used to make the lens or image sensor moveable. , Displace in the direction of the optical axis to focus or zoom, or in the direction perpendicular to the direction of the optical axis to prevent optical jitter.
- VCM motor Vehicle Coil Actuator/Voice Coil Motor
- the driven parts need to be flexibly changed, such as curved motion, or other irregular motions, which is difficult to achieve with the existing drive structure, especially it is more difficult to achieve a flexible drive structure on the order of micrometers. .
- a driving structure can be applied to different driving occasions to meet the movement requirements of the moved components.
- the purpose of the present invention is to provide a piezoelectric driving structure and an imaging module, which can utilize the electrostrictive effect of the piezoelectric element to control the displacement of the moved element in a predetermined direction.
- the present invention provides a piezoelectric driving structure, including:
- the piezoelectric element is located on the support layer.
- the piezoelectric element is separated into a plurality of sub-piezoelectric elements by an electrical isolation structure in the length direction.
- Each of the sub-piezoelectric elements is provided with an independent electrical connection structure.
- Each of the sub-piezoelectric elements is individually energized, and the sub-piezoelectric elements are stretched, which drives the support layer to deform, and a plurality of the sub-piezo-electric elements are energized at the same time, and the piezoelectric elements can drive the support layer Produce warpage.
- the present invention also provides an imaging module, including the above-mentioned piezoelectric driving structure, the piezoelectric driving structure includes a movable end and a fixed end, and the imaging module includes:
- a supporting block for supporting and fixing the fixed end
- the moved element is connected to the movable end, and the moved element includes a lens group, an imaging sensor element, an aperture, a mirror or a lens sheet;
- the external signal connection terminal is electrically connected to the piezoelectric driving structure
- the movable end moves upward or downward relative to the fixed end to move the moved element.
- the beneficial effect of the present invention is that the piezoelectric element is divided into a plurality of isolated sub-piezoelectric elements, a plurality of isolated sub-piezoelectric elements share a support layer, and each independent sub-piezoelectric element can apply a voltage separately, A plurality of sub-piezoelectric elements jointly control the deformation of the support layer.
- the flexible deformation of the piezoelectric drive structure can be realized. To drive the component's linear motion or curved motion or other irregular motion.
- the fixed end of the piezoelectric driving structure is fixed by a supporting block, and the movable end is connected to the moved element.
- each sub-piezoelectric element is warped upward or downward to move the moved element.
- the combination of the piezoelectric drive structure and the support block is light in weight, small in size, simple in structure, low in cost, and can achieve multi-dimensional Movement, suitable for imaging modules with a small space, and the piezoelectric drive structure is purely voltage driven, without electromagnetic interference.
- the end of the movable end of the piezoelectric driving structure extends into the limiting groove to drive the moved element
- the end of the movable end of the piezoelectric actuator is in contact with the limiting groove
- the angle can be small (the end of the movable end is set almost horizontally) to avoid the problem of the piezoelectric driver and the limit slot being stuck.
- the movable end of the piezoelectric driving structure is connected to the connecting piece, and the end of the movable end is in an almost horizontal position to avoid fatigue damage caused by the large-angle bending of the connecting piece , Improve the reliability of the device.
- Fig. 1 shows a schematic diagram of a piezoelectric driving structure according to an embodiment of the present invention.
- Fig. 2 shows a schematic structural diagram of a sub-piezoelectric element with a multilayer structure according to an embodiment of the present invention.
- FIG. 3 shows a schematic diagram of the structure of an imaging module according to an embodiment of the present invention.
- Fig. 4 is a cross-sectional view of Fig. 3 taken along the line A-A'.
- Fig. 5 shows a schematic diagram of the piezoelectric driving structure driving the moved element in an example.
- Fig. 6 shows a schematic diagram of a piezoelectric driving structure driving a moved element according to an embodiment of the present invention.
- Fig. 7 shows a schematic diagram of an imaging module according to another embodiment of the present invention.
- FIG. 11 shows a schematic diagram of an imaging module according to another embodiment of the present invention.
- FIG. 12 shows a schematic diagram of an imaging module according to another embodiment of the present invention.
- FIG. 13 shows a schematic diagram of an imaging module according to another embodiment of the present invention.
- FIG. 14 shows a schematic diagram of an imaging module with a supporting block located under a moved component according to an embodiment of the present invention.
- Fig. 15 shows a schematic structural diagram of a connector according to an embodiment of the present invention.
- Fig. 16 shows a partial top view of connecting the piezoelectric driver and the moved element through the connecting member structure according to an embodiment of the present invention.
- FIG. 17 shows a schematic diagram of the structure of an imaging module according to an embodiment of the present invention.
- FIG. 18 shows a schematic structural diagram of an imaging module according to an embodiment of the present invention.
- FIG. 19 shows a schematic diagram of electrically connecting a moved element and an external signal through a wiring layer of a piezoelectric driving structure according to an embodiment of the present invention.
- FIG. 20 shows a schematic diagram of connecting a moved element and an external signal through a wiring layer of a piezoelectric driving structure according to an embodiment of the present invention.
- FIG. 21 shows a schematic diagram of an imaging module according to an embodiment of the present invention.
- 10-circuit board 200-piezoelectric drive structure; 20-piezoelectric element; 20A-first sub-piezoelectric element; 20B-second sub-piezoelectric element; 21A-first electrode; 21B-first electrode; 211- Odd-numbered electrode; 22A-second electrode; 22B-second electrode; 221-even-numbered electrode; 23-piezoelectric film; 23A-first piezoelectric film; 23B-second piezoelectric film, 24-support layer; 25 -Wiring layer; 251A-first electrode lead-out terminal; 252A-second electrode lead-out terminal; 251B-first electrode lead-out terminal; 252B-second electrode lead-out terminal; 26-conductive structure; 27-electric isolation structure; 30-by Moving element; 40-limit slot; 40B-flexible connector; 41-first film layer; 42-second film layer; 43-third film layer; 50-support block; 51-first layer support block; 52 -Second layer support block; 61-third electrical connection end; 62-fourth electrical connection end
- first element, component, region, layer or section discussed below may be represented as a second element, component, region, layer or section.
- Spatial relationship terms such as “under”, “below”, “below”, “below”, “above”, “above”, etc., in It can be used here for the convenience of description to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that in addition to the orientations shown in the figures, the spatial relationship terms are intended to include different orientations of devices in use and operation. For example, if the device in the drawing is turned over, then elements or features described as “below” or “below” or “under” other elements will be oriented “on” the other elements or features. Therefore, the exemplary terms “below” and “below” can include both an orientation of above and below. The device can be otherwise oriented (rotated by 90 degrees or other orientation) and the spatial descriptors used here are interpreted accordingly.
- the method herein includes a series of steps, and the order of these steps presented herein is not necessarily the only order in which these steps can be performed, and some steps may be omitted and/or some other steps not described herein may be added to this method. If the components in a certain drawing are the same as those in other drawings, although these components can be easily identified in all the drawings, in order to make the description of the drawings more clear, this specification will not describe all the same components. The reference numbers are shown in each figure.
- FIG. 1 shows a piezoelectric driving structure according to an embodiment of the present invention.
- the piezoelectric driving structure 200 includes:
- the piezoelectric element 20 is adhered to the upper surface of the support layer 24.
- the piezoelectric element 20 is isolated into a plurality of sub-piezoelectric elements by an electrical isolation structure in the length direction (in this embodiment, the piezoelectric element 20 is isolated into two sub-piezoelectric elements).
- the first sub-piezoelectric element 20A, the second sub-piezoelectric element 20B), each of the sub-piezoelectric elements is provided with an independent electrode lead-out end, and each of the sub-piezoelectric elements is individually energized, and the sub-piezoelectric elements are individually energized.
- the piezoelectric element expands and contracts, and the support layer 24 is pulled to produce deformation;
- the plurality of sub-piezoelectric elements are respectively energized, and the piezoelectric elements can drive the supporting layer to produce various warping changes.
- the sub-piezoelectric element includes:
- At least one layer of piezoelectric film 23 (in this embodiment, it includes two sub-piezoelectric elements, the first sub-piezoelectric element 20A includes the first piezoelectric film 23A, and the second sub-piezoelectric element 20B includes the first piezoelectric film 23B,
- the first piezoelectric film 23A and the second piezoelectric film 23B are collectively referred to as the piezoelectric film 23), and the electrodes located on the upper and lower surfaces of each layer of the piezoelectric film 23, and the two adjacent layers of the piezoelectric film 23 are shared between the two. Between the electrodes;
- the electrodes are counted sequentially from bottom to top, and are divided into odd-numbered layers of electrodes and even-numbered layers of electrodes;
- the first electrode lead-out end is located on the top surface of the piezoelectric element and is electrically connected to the even-numbered electrode layer; in this embodiment, the first sub-piezoelectric element 20A is provided with a first electrode lead-out end 251A, and the second sub-piezoelectric element 20A is provided with a first electrode lead-out end 251A.
- the element 20A is provided with a second electrode lead-out terminal 251B
- the second electrode lead-out end is located on the top surface of the piezoelectric element and is electrically connected to the odd electrode layer.
- the first sub-piezoelectric element 20A is provided with a second electrode lead-out end 252A
- the second sub-piezoelectric element 20B is provided with a second electrode lead-out end 252B.
- the piezoelectric element 20 is isolated from the movable end to the fixed end by the electrical isolation structure 27 into two sub-piezoelectric elements, which are the first sub-piezoelectric element 20A and the second sub-piezoelectric element, respectively.
- the electric element 20B (as shown in the dashed box, the left side is the first sub-piezoelectric element 20A, and the right side is the second sub-piezoelectric element 20B), and the two sub-piezoelectric elements share the same support layer 24.
- the first sub-piezoelectric element 20A includes a piezoelectric laminate structure on the support layer 24.
- the piezoelectric laminate structure includes stacking a first electrode 21A, a piezoelectric film 23A, and a second electrode 22A in order from top to bottom.
- the first electrode 21A and the second electrode 22A are respectively connected to the first electrode lead-out end 251A and the second electrode lead-out end 252A.
- the second sub-piezoelectric element 20B includes a piezoelectric laminate structure on the support layer 24.
- the piezoelectric laminate structure includes stacking a first electrode 21B, a piezoelectric film 23B, and a second electrode 22B in order from top to bottom. 21B and the second electrode 22B are respectively connected to the first electrode lead-out end 251B and the second electrode lead-out end 252B.
- a wiring layer 25 is further provided above the first sub-piezoelectric element 20A and the second sub-piezoelectric element 20B, the first electrode lead-out terminal 251A, the second electrode lead-out terminal 252A, the first lead-out terminal 251B, and the second
- the lead terminals 252B are all located in the wiring layer 25 and exposed on the upper surface of the wiring layer 25, and the four electrode lead terminals are electrically isolated from each other.
- the four electrode lead-out ends are all located at one end of the piezoelectric element to facilitate the introduction of electrical signals. In this embodiment, they are all located at the end of the first sub-piezoelectric element 20A.
- the first sub-piezoelectric element 20A and the second sub-piezo element 20B are isolated by an electrical isolation structure 27.
- the electrical isolation structure 27 is an insulating dielectric layer, the bottom of which extends to the upper surface of the support layer 24, and the top to the wiring In the layer 25, in other examples, the electrical isolation structure 27 may be formed by an air gap.
- the electrical isolation structure 27 is composed of an air gap, the process steps for filling the insulating material in the air gap can be reduced. At this time, the width of the air gap cannot be too small. When the element is deformed, the two close ends do not contact.
- the piezoelectric laminate structure of the sub-piezoelectric element is not limited to only one piezoelectric film.
- Fig. 2 which is a sub-piezoelectric element with three layers of piezoelectric film.
- the upper and lower surfaces of each piezoelectric film 23 are distributed.
- the electrodes are counted from bottom to top.
- the odd-numbered layers of electrodes 211 are electrically connected to each other by the conductive structure 26.
- the even-numbered electrodes 221 are electrically connected together by another conductive structure 26.
- the part of the conductive structure 26 extending into the piezoelectric laminate structure is located in the wiring layer 25, and only the ends are in contact with the electrodes that need to be electrically connected.
- the tops of the two conductive structures 26 can be respectively used as the first electrode lead-out end and the second electrode lead-out end, so that the first electrode lead-out end and the second electrode lead-out end are both located on the top surface of the sub-piezoelectric element.
- the piezoelectric laminate structure is not limited to include three layers of piezoelectric films, but can also include two layers, four layers, five layers, or six layers.
- the warpage ability of the piezoelectric actuator can be improved. , So that the piezoelectric actuator can move a larger mass of the moved element.
- the polarities of the two adjacent piezoelectric films are opposite, and the opposite polarity means that the crystal directions (polarization directions) of the piezoelectric films are opposite. That is, the two piezoelectric films apply voltages in opposite directions to achieve bending in the same direction.
- the piezoelectric film 23 needs to be made of a piezoelectric material that can be deformed when energized, such as quartz crystal, aluminum nitride, zinc oxide, lead zirconate titanate, barium titanate, lithium gallate, lithium germanate, or titanium germanate, etc. Materials.
- the piezoelectric film 23A and the piezoelectric film 23B have the same material and thickness.
- the piezoelectric film 23A and the piezoelectric film 23B can also have different materials and thicknesses. Different materials are applied with the same voltage and warped. The degree of curvature is different. In a certain range, the thickness of the piezoelectric film is large, and the degree of warpage is large.
- the choice of thickness can be obtained through calculation and experiment. By setting unused materials, different thicknesses can control the deformation of the entire piezoelectric element more flexibly.
- the material of the support layer 24 is a non-conductive dielectric material, such as silicon oxide, silicon nitride, and the like.
- the thickness of the piezoelectric film and the support layer is less than 10 microns.
- FIG. 3 is a schematic diagram of an imaging module according to an embodiment of the present invention.
- FIG. 4 is a cross-sectional view of FIG. 3 along the AA' direction. Please refer to FIGS. 3 and 4.
- the imaging module includes the aforementioned piezoelectric driving structure, wherein the piezoelectric driving structure 200 includes a movable end and a fixed end, and the imaging module further includes:
- the supporting block 50 is used to support and fix the fixed end
- the moved element 30 is connected to the movable end, and the moved element 30 includes a lens group, an imaging sensor element, an aperture, a mirror or a lens sheet;
- the external signal connection terminal is electrically connected to the piezoelectric driving structure 200;
- the movable end moves upward or downward relative to the fixed end to move the moved element 30.
- the fixed end of the piezoelectric driving structure 200 (shown in the dashed frame, to simplify the figure, the dashed frame is not drawn in the following figure) is located on the support block 50, and the movable end extends out of the support block 50 to form a cantilever Structure.
- the entire piezoelectric driving structure 200 may be located on the supporting block 50.
- the piezoelectric driving structure 200 is entirely located on the supporting block 50, it is suitable for occasions where the moving element 30 needs to be lifted upwards.
- the movable end of the piezoelectric driving structure 200 extends out of the supporting block 50, it can be applied to When the moved component 30 is lifted up or moved down.
- Organic curing film bonding is a wafer-level process. In wafer factories or packaging plants, organic curing film bonding is generally used, which has high efficiency and relatively high cost. Adhesive connection is suitable for board-level crafts and suitable for module factories. Its price is low and efficiency is low.
- the material of the support block 50 is a dielectric material, which can be in a ring shape and arranged around the moved element 30 to better support the piezoelectric driving structure 200; or, the support block 50 includes a plurality of sub-support blocks distributed in the circumferential direction, A plurality of sub-support blocks are spaced apart or in contact with each other, thereby saving materials and reducing weight.
- the height of the support block 50 may not be consistent.
- the supporting block 50 may not be ring-shaped, for example, only located on two sides or four sides of the moved element 30.
- a limiting groove 40 is provided on the lower surface of the moved component 30, and the limiting groove 40 is surrounded by three film layers: a first film layer 41, a second film layer 42, and a third film layer 43.
- the limiting groove 40 is not limited to being located on the lower surface of the moved element 30, and may also be located on the upper surface of the moved element 30 or on the side surface of the moved element 30.
- the limiting groove 40 is not limited to being surrounded by the additionally provided film layer, and the limiting groove 40 may also be formed by the moving element 30 itself.
- a recess is formed on the side surface of the moving element 30 to serve as The limiting groove 40, or when the limiting groove is located on the lower surface, the lower surface of the moved component can be used as the upper film layer of the limiting groove 40, when the limiting groove 40 is located on the upper surface, the upper surface of the moved component 30 As the lower film layer of the limit slot.
- the end of the movable end of the piezoelectric driving structure 200 extends into the limiting slot 40.
- the end of the second sub-piezoelectric element 20B extends into the limiting slot 40.
- the moving end is warped upwards or downwards, so that the moved element 30 can be moved up or down as a whole, so as to change the vertical position of the moved element 30 to realize optical autofocus.
- the voltage applied to the piezoelectric driving structure 200 on the side of the moved element 30 can be changed, so that the moved element 30 is tilted, thereby changing the angle of the moved element 30, and correcting the The optical warping angle of the element 30 is moved, thereby realizing optical anti-shake.
- the piezoelectric element of the piezoelectric driving structure 200 is a continuous whole without being divided into a plurality of sub-piezoelectric elements.
- the fixed end of the piezoelectric driving structure 200 is fixed on the support block 50, and the movable end is connected In the limiting groove 40, when the movable end of the piezoelectric driving structure 200 is upwardly warped, the contact angle between the end extending into the limiting groove 40 and the limiting groove 40 is relatively large, and the frictional force with the limiting groove 40 Increase, it will be stuck in severe cases.
- the piezoelectric element of the piezoelectric driving structure is divided into a first sub-piezoelectric element 20A and a second sub-piezoelectric element 20B that are isolated from each other.
- Two sub-piezoelectric elements 20B are applied with a voltage, and when the moved element 30 is moved the same distance, the end of the second sub-piezo element 20B that extends into the limiting groove 40 has a relatively large contact angle with the limiting groove 40 smooth. In this way, the problem of the end of the piezoelectric driver 200 and the limiting groove 40 jamming can be avoided.
- the piezoelectric element of the piezoelectric driving structure 200 can be divided into a plurality of sub-piezoelectric elements, and the desired deformation curve of the piezoelectric driving structure can be obtained by separately controlling the respective voltages.
- a positive voltage is applied to the first sub-piezoelectric element 20A, one end of the first sub-piezoelectric element 20A is warped upward, and a reverse voltage is applied to the second sub-piezoelectric element 20B, so that the second sub-piezoelectric element 20B is applied with a reverse voltage.
- the end of the piezoelectric sub-element 20B close to the first piezoelectric sub-element 20A is warped downward, and the end area of the second piezoelectric sub-element 20B in contact with the limiting groove 40 is horizontally arranged. Get the desired radian by setting the voltage.
- the flexible deformation of the piezoelectric element can be obtained by calculation or experiment.
- the piezoelectric driving structure is located on the top surface of the supporting block 50.
- the first electrode lead-out end 251A and the second electrode lead-out end 252A of the first sub-piezoelectric element 20A, the first electrode lead-out end 251B and the second electrode lead-out end 252B of the second sub-piezoelectric element 20B directly serve as external signal connection ends,
- the circuit board 10 is electrically connected to the circuit board 10 through a lead wire (not shown), so that the circuit board 10 can apply a voltage to the piezoelectric driving structure 200 so that the upper and lower surfaces of the piezoelectric film 23A and the piezoelectric film 23B are separated from each other.
- a pressure difference is generated, so that the piezoelectric film 23A and the piezoelectric film 23B expand and contract, and because the support layer 24 cannot expand or contract, the first sub-piezoelectric element 20A and the second sub-piezoelectric element 20B warp upward or downward after being energized.
- the warpage (the direction of warpage and the degree of warpage depend on the voltage applied to the upper and lower surfaces of the piezoelectric film 23A and the piezoelectric film 23B), so that the piezoelectric driving structure 200 is bent upward or downward as a whole.
- the present invention is not limited to directly electrically connecting the piezoelectric driving structure 200 and the circuit board 10 through a lead wire, and an electrical connection terminal may also be provided on the top surface of the support block 50 to connect two of the sub piezoelectric element 20A and the sub piezoelectric element 20B.
- the lead-out ends of the electrodes are electrically connected to the electrical connection ends by lead wires, and then another interconnection structure (such as lead wires or conductive plugs) is used to electrically connect the electrical connection ends on the top surface of the support block 50 to the circuit board 10, which can be shortened The length of the lead.
- first electrode lead-out end 251A and the second electrode lead-out end 251B of the first sub-piezoelectric element 20A, and the first electrode lead-out end 251B and the second electrode lead-out end 252B of the second sub-piezoelectric element 20B are both used To connect to external circuit signals and are located on one side of the piezoelectric drive structure, for the convenience of description, the first electrode lead-out end and the second electrode lead-out end referred to hereinafter mean that the first electrode lead-out includes two sub-piezoelectric elements. The two sub-piezoelectric components are no longer distinguished between the terminal and the second electrode lead-out terminal.
- the external signal connection end of the imaging module includes a third electrical connection end 61 and a fourth electrical connection end 62.
- the support block 50 includes a first layer support block 51 and a second layer support block 52, and the fixed end of the piezoelectric driving structure is located between the first layer support block 51 and the second layer support block 52.
- the third electrical connection end 61 and the fourth electrical connection end 62 are located on the top surface of the support block 50 and directly above the piezoelectric driving structure.
- the third electrical connection end 61 is electrically connected to the first electrode lead-out end of the piezoelectric drive structure through the conductive plug 63
- the fourth electrical connection end 62 is electrically connected to the second electrode lead-out end of the piezoelectric drive structure through the conductive plug 63
- Two conductive plugs 63 are located in the second layer support block 52.
- the third electrical connection end 61 and the fourth electrical connection end 62 are electrically connected to the circuit board 10 through lead wires, respectively.
- the third electrical connection end 61 and the fourth electrical connection end 62 may also adopt rewiring and compression.
- the first electrode leading end and the second electrode leading end of the electric drive structure are electrically connected,
- the piezoelectric driving structure 200 is a pair, and the pair of piezoelectric driving structures 200 are symmetrically distributed on both sides of the moved element 30.
- the two piezoelectric driving structures 200 warp upward or downward at the same time, they can make The moved element 30 moves up or down.
- the angle of the moved element can be changed in one direction.
- FIG. 8 there are four piezoelectric driving structures, which are distributed on the four sides of the moved element 30.
- the moved element 30 can be moved upward or downward.
- a set of two opposing piezoelectric driving structures can change the angle of the moved element in one direction, and the other set of opposing piezoelectric driving structures can change the angle of the moved element in the other direction.
- FIG. 9 there are three pairs of piezoelectric driving structures, and the three pairs of piezoelectric driving structures are evenly distributed in the circumferential direction.
- the three pairs of piezoelectric driving structures can change the inclination angle of the moved element from three directions.
- two piezoelectric driving structures are connected on opposite sides of the moved element 30, so that the two piezoelectric driving structures are simultaneously warped upward or downward (and the warping amplitude is the same), so that the two piezoelectric
- the driving structure supports one side of the moved element 30 together, which can be suitable for situations where the piezoelectric driving structure has a small size and the moved element 30 has a large size, or is suitable for situations where the mass of the moved element 30 is large.
- the two opposite sides of the moved element 30 are not limited to connecting two piezoelectric driving structures, and three, four, five, etc. can also be connected.
- the piezoelectric driving structure can also be four pairs, five pairs, or six pairs.
- Each pair of piezoelectric driving structures is not limited to being symmetrically arranged along the center of the moved element 30, and can also be arranged asymmetrically. The more, the rotation axis of the moved element 30 can be increased to realize multi-dimensional rotation.
- the moved element 30 is not limited to a square or round shape, and can also have other shapes, which is not limited in the present invention.
- the paired piezoelectric driving structures are beneficial to control the movement of the moved element 30.
- the piezoelectric driving structures may also appear unpaired.
- three piezoelectric driving structures are arranged along the circumference of the moved element 30. To be uniformly distributed, etc., this embodiment will not be illustrated one by one.
- one piezoelectric driving structure corresponds to one limiting slot 40, and the two limiting slots 40 are not limited to being fixed on the lower surface of the moved element 30. As shown in FIG. 11, the two limiting slots 40 are both fixed. On the upper surface of the moved element 30; as shown in Figure 12, one pair of the two limit grooves 40 is fixed on the upper surface of the moved element 30, and the other pair is fixed on the lower surface of the moved element 30.
- the height of the support block 50 supporting the two piezoelectric driving structures is different, that is, in order to support the piezoelectric driving structure, the height of the support block 50 can be adjusted according to the position of the piezoelectric driving structure.
- two piezoelectric driving structures in a pair are distributed on both sides of the center of the moved element 30.
- the two piezoelectric driving structures in a pair may be located under the moved element 30 and overlapped.
- the movable end of the piezoelectric driving structure is selected in the limit slot 40 on the side farther from the moved element 30 (each piezoelectric driving structure is used to move the opposite side of the moved element 30).
- the fixed end of the sub-piezoelectric driving structure is located outside the moved element 30.
- the fixed end of the piezoelectric driving structure may also be located below the moved element 30.
- the fixed position of the supporting block 50 and the piezoelectric driving structure is located outside the moved element 30.
- the fixed position of the supporting block 50 and the piezoelectric driving structure can also be located in the space below the moved element 30, so that the fixed end of the piezoelectric driving structure is closer to the center of the moved element 30 than the movable end.
- the support block 50 is not limited to being completely located directly under the moved element 30, and can also be partially located directly under the moved element 30. In this way, the support block 50 can be completely or partially covered by the moving element 30, which can save The area occupied by the support block 50 reduces the area of the entire imaging module, which is conducive to reducing the size.
- the flexible connecting piece 40B includes: a first part 41B and a second part 42B , Located in the middle part between the first part 41B and the second part 42B, the first end is at least a part of the first part 41B, the second part 42B is a part of the second end, the middle part 43B is a horizontal strip structure, the first part 41B
- the second part 42B also has a vertical beam, and the first end and the second end are connected with the middle part 43B through the vertical beam.
- the width and thickness of the middle part 43B meet the set values, so that the middle part 43B has flexibility.
- the setting values of the width and thickness of the middle part 43B are related to the material of the middle part 43B.
- the middle part 43B is made of different materials, the setting values will change accordingly.
- the setting values only need to be able to ensure the middle part 43B. Just have flexibility.
- the middle part 43B is not limited to a strip structure, but can also be arc-shaped, wave-shaped, etc.; the first part 41B and the second part 42B are not limited to using vertical beams to connect with the middle part 43B, and the present invention is not limited. Furthermore, the first part 41B and the second part 42B may also have flexibility, so that the flexible connecting member 40B is flexible as a whole, which can increase the deformability of the flexible connecting member 40B.
- the movable end of the piezoelectric driving structure is glued to the flexible connecting member 40B, or connected through an organic curing film; the flexible connecting member 40B is glued to the moved element 30, or connected through an organic curing film.
- the part connecting the flexible connecting member and the piezoelectric driving structure may be bent repeatedly at a large angle, which is likely to cause structural fatigue.
- the end of the piezoelectric drive structure when the end of the piezoelectric drive structure is connected to the flexible connector, the end is almost in a horizontal state, which will not bend the flexible connector, increase the life of the flexible connector, and improve the reliability of the device. .
- FIGS. 16 and 17 exemplarily show a plan view and a cross-sectional view of connecting the piezoelectric driving structure through the flexible connecting member 40B.
- the flexible connecting piece 40B is used to connect and connect the moved element 30 and the movable end of the piezoelectric drive structure through the limit slot 40.
- other electrical connection relationships, support block structure distribution or piezoelectric actuators For the position relationship, please refer to the previous text, so I won't repeat it here.
- the moved element 30 when the moved element 30 needs to be connected to an external electrical signal, if the moved element 30 is an imaging sensor element, the top surface of the support block 50 is provided with a first electrical connection terminal 71, and the edge of the imaging sensor element has a first electrical connection terminal 71.
- Two electrical connection ends 72 The closer the first electrical connection end 71 is to the imaging sensor element, the better.
- the first electrical connection end 71 and the second electrical connection end 72 are electrically connected by the flexible electrical connection structure 73.
- the first electrical connection end 71 can be It is electrically connected to the circuit board 10 through leads, so that the circuit board 10 supplies power or signals to the imaging sensor element.
- the first electrical connection terminal 71 is located in the wiring layer 25 on the top surface of the piezoelectric driving structure.
- the wiring layer 25 of the piezoelectric driving structure is further provided with an interconnection line 75, and both ends have a first electrical connection terminal 71 and a fifth electrical connection terminal 74 exposing the wiring layer 25, respectively.
- the first electrical connection end 71 is closer to the moved component 30 than the fifth electrical connection end 74.
- the first electrical connection end 71 and the second electrical connection end 72 are electrically connected through a flexible connector 73, and then the first electrical connection end 71 and the second electrical connection end 72 are electrically connected through a lead 78.
- the five electrical connection terminal 74 is electrically connected to the circuit board 10 so that the circuit board 10 supplies power or signals to the imaging sensor element.
- the length of the flexible connector 73 in this embodiment can be shorter (the first electrical connection end 71 The closer to the imaging sensor element, the shorter the length of the flexible connecting member 73), and when the moved element 30 moves up or down, the flexible connecting member 73 will not be pulled.
- the first electrical connection terminal 71 is not limited to being electrically connected to the circuit board 10 through a lead wire.
- a sixth electrical connection terminal 77 and a fifth electrical connection terminal may be directly formed on the top surface of the support block 50.
- 74 is electrically connected to the sixth electrical connection terminal 77 through the lead 78.
- Another interconnection structure is also provided in the support block 50. The interconnection structure is electrically connected to the sixth electrical connection terminal 77 and the circuit board 10, so that the circuit board 10 can be The mobile element 30 supplies power or transmits signals.
- the flexible connector 73 in this embodiment is a flexible interconnection wire, and the interconnection structure is a conductive plug.
- the sixth electrical connection terminal 77 can also be electrically connected to the circuit board 10 through other interconnection methods, for example, the sixth electrical connection terminal 77 and the circuit board 10 are directly electrically connected with a lead wire, which is not limited by the present invention.
- the moved element 30 is a mirror.
- piezoelectric drive structure There is one piezoelectric drive structure.
- the movable end of a piezoelectric drive structure is connected to one side of the reflector, and the opposite side of the reflector is rotatably connected to a supporting surface.
- the piezoelectric element 20 When the piezoelectric element 20 is energized, it tilts upward or downward. When curved, the mirror is tilted to achieve the purpose of changing the reflection angle.
- one side of the reflector is not limited to one piezoelectric driving structure, and two, three, four, or five can also be provided.
- the reflector is not limited to the piezoelectric driving structure distributed on only one side, and the piezoelectric driving structure may also be distributed on two sides, four sides, or in the circumferential direction.
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Abstract
Disclosed are a piezoelectric drive structure and an imaging module, the piezoelectric drive structure comprising: a support layer; a piezoelectric element, adhesively bonded to the upper surface of the support layer; the piezoelectric element is separated into a plurality of sub-piezoelectric elements by an electrical isolation structure in the length direction, each sub-piezoelectric element being equipped with an independent electrode lead-out terminal, individually energizing each sub-piezoelectric element, the sub-piezoelectric element expanding and contracting, pulling the support layer to generate deformation; energizing each sub-piezoelectric element, such that the piezoelectric element can drive the support layer to produce a variety of warping changes. The imaging module comprises: a piezoelectric drive structure, comprising a movable end and a fixed end; a support block, used for supporting and fixing the fixed end; moved elements connected to the movable end, the moved elements comprising a lens group, an imaging sensor element, an aperture, a mirror, or a lens sheet; an external signal connection terminal, electrically connected to the piezoelectric drive structure; in the energized state, the movable end moves up or down with respect to the fixed end, moving the moved elements.
Description
本发明涉及运动控制技术领域,尤其涉及一种压电驱动结构和成像模组。The invention relates to the technical field of motion control, in particular to a piezoelectric driving structure and an imaging module.
在一些电子终端中,通常会需要让其中的某些部件发生平移、竖直移动或者倾斜,进而实现某些特殊功能。例如目前在一些具有镜头模组的摄像机、照相机和手机等各种电子终端中,通常会通过VCM马达(Voice Coil Actuator/ Voice Coil Motor,音圈马达)等驱动机构来使得可移动透镜或图像传感器,在光轴方向上位移以聚焦或变焦,或者在垂直于光轴方向的方向上位移以防止光学抖动。然而,不同于传统单反相机,在空间体积狭小的手机、***机、照相机等电子终端实现该功能,是一项巨大工程挑战。而且,随着手机等电子终端的成像***越来越复杂,镜头模组越来越重,VCM马达等传统的驱动机构的驱动能力逐渐不足。In some electronic terminals, it is usually necessary to make some parts of them translate, move or tilt vertically to realize some special functions. For example, in some electronic terminals such as cameras, cameras, and mobile phones with lens modules, a driving mechanism such as a VCM motor (Voice Coil Actuator/Voice Coil Motor) is usually used to make the lens or image sensor moveable. , Displace in the direction of the optical axis to focus or zoom, or in the direction perpendicular to the direction of the optical axis to prevent optical jitter. However, unlike traditional SLR cameras, it is a huge engineering challenge to implement this function in electronic terminals such as mobile phones, miniature cameras, and cameras in a small space. Moreover, as the imaging systems of electronic terminals such as mobile phones become more and more complex, and lens modules become heavier, the driving capability of traditional driving mechanisms such as VCM motors is gradually insufficient.
另外,在一些情况下,需要被驱动部件灵活变化,如曲线运动,或其他无规则运动等,现有的驱动结构很难做到,尤其将灵活多变的驱动结构做到微米量级更加困难。In addition, in some cases, the driven parts need to be flexibly changed, such as curved motion, or other irregular motions, which is difficult to achieve with the existing drive structure, especially it is more difficult to achieve a flexible drive structure on the order of micrometers. .
因此,期待一种驱动结构,能够适用于不同的驱动场合,以满足被移动元件的运动需求。Therefore, it is expected that a driving structure can be applied to different driving occasions to meet the movement requirements of the moved components.
本发明的目的在于提供一种压电驱动结构和成像模组,能够利用压电元件的电致伸缩效应来控制被移动元件沿预定方向位移。The purpose of the present invention is to provide a piezoelectric driving structure and an imaging module, which can utilize the electrostrictive effect of the piezoelectric element to control the displacement of the moved element in a predetermined direction.
为了实现上述目的,本发明提供一种压电驱动结构,包括:In order to achieve the above objective, the present invention provides a piezoelectric driving structure, including:
支撑层;Support layer
压电元件,位于所述支撑层上,所述压电元件在长度方向上由电隔离结构隔离成多个子压电元件,每个所述子压电元件设有独立的电连接结构,对每个所述子压电元件单独通电,所述子压电元件产生伸缩 ,带动所述支撑层产生形变,同时对多个所述子压电元件通电,所述压电元件能够带动所述支撑层产生翘曲。The piezoelectric element is located on the support layer. The piezoelectric element is separated into a plurality of sub-piezoelectric elements by an electrical isolation structure in the length direction. Each of the sub-piezoelectric elements is provided with an independent electrical connection structure. Each of the sub-piezoelectric elements is individually energized, and the sub-piezoelectric elements are stretched, which drives the support layer to deform, and a plurality of the sub-piezo-electric elements are energized at the same time, and the piezoelectric elements can drive the support layer Produce warpage.
本发明还提供一种成像模组,包括上述的压电驱动结构,所述压电驱动结构包括可动端和固定端,所述成像模组包括:The present invention also provides an imaging module, including the above-mentioned piezoelectric driving structure, the piezoelectric driving structure includes a movable end and a fixed end, and the imaging module includes:
支撑块,用于支撑固定所述固定端;A supporting block for supporting and fixing the fixed end;
被移动元件,与所述可动端连接,所述被移动元件包括透镜组、成像传感元件、光圈、反射镜或透镜片;The moved element is connected to the movable end, and the moved element includes a lens group, an imaging sensor element, an aperture, a mirror or a lens sheet;
外部信号连接端,与所述压电驱动结构电连接;The external signal connection terminal is electrically connected to the piezoelectric driving structure;
在通电的状态下,所述可动端相对于所述固定端向上或向下移动,以移动所述被移动元件。In the energized state, the movable end moves upward or downward relative to the fixed end to move the moved element.
本发明的有益效果在于:将压电元件分割为多个相互隔离的子压电元件,多个相互隔离的子压电元件共用一个支撑层,每个独立的子压电元件可以单独施加电压,多个子压电元件共同控制支撑层的形变。通过不同的参数设置(如压电材料、压电膜的厚度、施加的电压,每个子压电元件的长度),实现压电驱动结构的灵活变形。以驱动部件的直线运动或曲线运动或其他不规则运动。The beneficial effect of the present invention is that the piezoelectric element is divided into a plurality of isolated sub-piezoelectric elements, a plurality of isolated sub-piezoelectric elements share a support layer, and each independent sub-piezoelectric element can apply a voltage separately, A plurality of sub-piezoelectric elements jointly control the deformation of the support layer. Through different parameter settings (such as the piezoelectric material, the thickness of the piezoelectric film, the applied voltage, the length of each sub-piezoelectric element), the flexible deformation of the piezoelectric drive structure can be realized. To drive the component's linear motion or curved motion or other irregular motion.
另外,压电驱动结构的固定端由支撑块固定,可动端与被移动元件连接,通过对压电驱动器供电,使得每个子压电元件产生向上或向下翘曲,以移动被移动元件,从而可以满足被移动元件的移动需求,并且相较于VCM马达等传统的驱动机构来说,压电驱动结构和支撑块的组合质量轻,体积小,结构简单,成本低,能够实现多维度的运动,适用于空间体积狭小的成像模组中,并且压电驱动结构是纯电压驱动,没有电磁干扰。In addition, the fixed end of the piezoelectric driving structure is fixed by a supporting block, and the movable end is connected to the moved element. By supplying power to the piezoelectric driver, each sub-piezoelectric element is warped upward or downward to move the moved element. This can meet the movement requirements of the moved components, and compared with traditional drive mechanisms such as VCM motors, the combination of the piezoelectric drive structure and the support block is light in weight, small in size, simple in structure, low in cost, and can achieve multi-dimensional Movement, suitable for imaging modules with a small space, and the piezoelectric drive structure is purely voltage driven, without electromagnetic interference.
进一步地,当被移动元件的表面设有限位槽,压电驱动结构的可动端的端部伸入限位槽以驱动被移动元件时,压电驱动器可动端的端部与限位槽的接触角度可以较小(可动端的端部几乎水平设置),以避免压电驱动器与限位槽卡死的问题。Further, when the surface of the moved element is provided with a limiting groove, and the end of the movable end of the piezoelectric driving structure extends into the limiting groove to drive the moved element, the end of the movable end of the piezoelectric actuator is in contact with the limiting groove The angle can be small (the end of the movable end is set almost horizontally) to avoid the problem of the piezoelectric driver and the limit slot being stuck.
进一步地,当被移动元件的表面设有连接件,压电驱动结构的可动端与连接件连接,可动端的端部处于几乎处于水平的位置,避免连接件大角度弯折造成的疲劳损伤,提高了器件的可靠性。Further, when the surface of the moved element is provided with a connecting piece, the movable end of the piezoelectric driving structure is connected to the connecting piece, and the end of the movable end is in an almost horizontal position to avoid fatigue damage caused by the large-angle bending of the connecting piece , Improve the reliability of the device.
图1示出了根据本发明一实施例的一种压电驱动结构的示意图。Fig. 1 shows a schematic diagram of a piezoelectric driving structure according to an embodiment of the present invention.
图2示出了根据本发明一实施例的一种多层结构的子压电元件的结构示意图。Fig. 2 shows a schematic structural diagram of a sub-piezoelectric element with a multilayer structure according to an embodiment of the present invention.
图3示出了根据本发明一实施例的一成像模组结构的示意图。FIG. 3 shows a schematic diagram of the structure of an imaging module according to an embodiment of the present invention.
图4为图3沿A-A’切线的剖视图。Fig. 4 is a cross-sectional view of Fig. 3 taken along the line A-A'.
图5示出了一实例中,压电驱动结构驱动被移动元件的示意图。Fig. 5 shows a schematic diagram of the piezoelectric driving structure driving the moved element in an example.
图6示出了根据本发明一实施例的一种压电驱动结构驱动被移动元件的示意图。Fig. 6 shows a schematic diagram of a piezoelectric driving structure driving a moved element according to an embodiment of the present invention.
图7示出了根据本发明另一实施例的一种成像模组的示意图。Fig. 7 shows a schematic diagram of an imaging module according to another embodiment of the present invention.
图8-图10示出了根据本发明不同实施例的压电驱动结构与被移动元件位置关系图。8-10 show the positional relationship diagrams of the piezoelectric driving structure and the moved element according to different embodiments of the present invention.
图11示出了根据本发明另一实施例的一种成像模组的示意图。FIG. 11 shows a schematic diagram of an imaging module according to another embodiment of the present invention.
图12示出了根据本发明另一实施例的一种成像模组的示意图。FIG. 12 shows a schematic diagram of an imaging module according to another embodiment of the present invention.
图13示出了根据本发明另一实施例的一种成像模组的示意图。FIG. 13 shows a schematic diagram of an imaging module according to another embodiment of the present invention.
图14示出了根据本发明一实施例支撑块位于被移动元件下方的成像模组的示意图。FIG. 14 shows a schematic diagram of an imaging module with a supporting block located under a moved component according to an embodiment of the present invention.
图15示出了根据本发明一实施例的一种连接件的结构示意图。Fig. 15 shows a schematic structural diagram of a connector according to an embodiment of the present invention.
图16示出了根据本发明一实施例的通过连接件结构连接压电驱动器和被移动元件的局部俯视图。Fig. 16 shows a partial top view of connecting the piezoelectric driver and the moved element through the connecting member structure according to an embodiment of the present invention.
图17示出了根据本发明一实施例的一种成像模组结构的示意图。FIG. 17 shows a schematic diagram of the structure of an imaging module according to an embodiment of the present invention.
图18示出了根据本发明一实施例的一种成像模组的结构示意图。FIG. 18 shows a schematic structural diagram of an imaging module according to an embodiment of the present invention.
图19示出了根据本发明一实施例的通过压电驱动结构布线层电连接被移动元件和外部信号的示意图。FIG. 19 shows a schematic diagram of electrically connecting a moved element and an external signal through a wiring layer of a piezoelectric driving structure according to an embodiment of the present invention.
图20示出了根据本发明一实施例的通过压电驱动结构布线层连接被移动元件和外部信号的示意图。FIG. 20 shows a schematic diagram of connecting a moved element and an external signal through a wiring layer of a piezoelectric driving structure according to an embodiment of the present invention.
图21示出了根据本发明一实施例的一种成像模组的示意图。FIG. 21 shows a schematic diagram of an imaging module according to an embodiment of the present invention.
附图标记说明:Description of reference signs:
10-线路板;200-压电驱动结构;20-压电元件;20A-第一子压电元件;20B-第二子压电元件; 21A-第一电极;21B-第一电极;211-奇数层电极;22A-第二电极;22B-第二电极;221-偶数层电极;23-压电膜;23A-第一压电膜;23B-第二压电膜,24-支撑层;25-布线层;251A-第一电极引出端;252A-第二电极引出端;251B-第一电极引出端;252B-第二电极引出端;26-导电结构;27-电隔离结构;30-被移动元件;40-限位槽;40B-柔性连接件;41-第一膜层;42-第二膜层;43-第三膜层;50-支撑块;51-第一层支撑块;52-第二层支撑块;61-第三电连接端; 62-第四电连接端; 63-导电插塞;71-第一电连接端;72-第二电连接端;73-柔性电连接结构;74-第五电连接端;75-互连线; 77-第六电连接端。10-circuit board; 200-piezoelectric drive structure; 20-piezoelectric element; 20A-first sub-piezoelectric element; 20B-second sub-piezoelectric element; 21A-first electrode; 21B-first electrode; 211- Odd-numbered electrode; 22A-second electrode; 22B-second electrode; 221-even-numbered electrode; 23-piezoelectric film; 23A-first piezoelectric film; 23B-second piezoelectric film, 24-support layer; 25 -Wiring layer; 251A-first electrode lead-out terminal; 252A-second electrode lead-out terminal; 251B-first electrode lead-out terminal; 252B-second electrode lead-out terminal; 26-conductive structure; 27-electric isolation structure; 30-by Moving element; 40-limit slot; 40B-flexible connector; 41-first film layer; 42-second film layer; 43-third film layer; 50-support block; 51-first layer support block; 52 -Second layer support block; 61-third electrical connection end; 62-fourth electrical connection end; 63-conductive plug; 71-first electrical connection end; 72-second electrical connection end; 73-flexible electrical connection Structure; 74-fifth electrical connection terminal; 75-interconnect line; 77-sixth electrical connection terminal.
以下结合附图和具体实施例对本发明的技术方案作进一步详细说明。根据下面的说明和附图,本发明的优点和特征将更清楚,然而,需说明的是,本发明技术方案的构思可按照多种不同的形式实施,并不局限于在此阐述的特定实施例。附图均采用非常简化的形式且均使用非精准的比例,仅用以方便、明晰地辅助说明本发明实施例的目的。The technical solution of the present invention will be further described in detail below with reference to the drawings and specific embodiments. According to the following description and drawings, the advantages and features of the present invention will be clearer. However, it should be noted that the concept of the technical solution of the present invention can be implemented in many different forms and is not limited to the specific implementation set forth herein. example. The drawings all adopt a very simplified form and all use imprecise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.
应当明白,当元件或层被称为“在...上”、“与...相邻”、“连接到”或“耦合到”其它元件或层时,其可以直接地在其它元件或层上、与之相邻、连接或耦合到其它元件或层,或者可以存在居间的元件或层。相反,当元件被称为“直接在...上”、“与...直接相邻”、“直接连接到”或“直接耦合到”其它元件或层时,则不存在居间的元件或层。应当明白,尽管可使用术语第一、第二、第三等描述各种元件、部件、区、层和/或部分,这些元件、部件、区、层和/或部分不应当被这些术语限制。这些术语仅仅用来区分一个元件、部件、区、层或部分与另一个元件、部件、区、层或部分。因此,在不脱离本发明教导之下,下面讨论的第一元件、部件、区、层或部分可表示为第二元件、部件、区、层或部分。It should be understood that when an element or layer is referred to as being "on", "adjacent to", "connected to" or "coupled to" other elements or layers, it can be directly on the other elements or layers. On a layer, adjacent to, connected or coupled to other elements or layers, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on", "directly adjacent to", "directly connected to" or "directly coupled to" other elements or layers, there are no intervening elements or layers. Floor. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Therefore, without departing from the teachings of the present invention, the first element, component, region, layer or section discussed below may be represented as a second element, component, region, layer or section.
空间关系术语例如“在...下”、“在...下面”、“下面的”、“在...之下”、“在...之上”、“上面的”等,在这里可为了方便描述而被使用从而描述图中所示的一个元件或特征与其它元件或特征的关系。应当明白,除了图中所示的取向以外,空间关系术语意图还包括使用和操作中的器件的不同取向。例如,如果附图中的器件翻转,然后,描述为“在其它元件下面”或“在其之下”或“在其下”元件或特征将取向为在其它元件或特征“上”。因此,示例性术语“在...下面”和“在...下”可包括上和下两个取向。器件可以另外地取向(旋转90度或其它取向)并且在此使用的空间描述语相应地被解释。Spatial relationship terms such as "under", "below", "below", "below", "above", "above", etc., in It can be used here for the convenience of description to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that in addition to the orientations shown in the figures, the spatial relationship terms are intended to include different orientations of devices in use and operation. For example, if the device in the drawing is turned over, then elements or features described as "below" or "below" or "under" other elements will be oriented "on" the other elements or features. Therefore, the exemplary terms "below" and "below" can include both an orientation of above and below. The device can be otherwise oriented (rotated by 90 degrees or other orientation) and the spatial descriptors used here are interpreted accordingly.
在此使用的术语的目的仅在于描述具体实施例并且不作为本发明的限制。在此使用时,单数形式的“一”、“一个”和“所述/该” 也意图包括复数形式,除非上下文清楚指出另外的方式。还应明白术语“组成”和/或“包括”,当在该说明书中使用时,确定所述特征、整数、步骤、操作、元件和/或部件的存在,但不排除一个或更多其它的特征、整数、步骤、操作、元件、部件和/或组的存在或添加。在此使用时,术语“和/或”包括相关所列项目的任何及所有组合。The purpose of the terms used here is only to describe specific embodiments and not as a limitation of the present invention. When used herein, the singular forms "a", "an" and "the/the" are also intended to include plural forms, unless the context clearly dictates otherwise. It should also be understood that the terms "composition" and/or "including", when used in this specification, determine the existence of the described features, integers, steps, operations, elements and/or components, but do not exclude one or more other The existence or addition of features, integers, steps, operations, elements, parts, and/or groups. As used herein, the term "and/or" includes any and all combinations of related listed items.
如果本文的方法包括一系列步骤,且本文所呈现的这些步骤的顺序并非必须是可执行这些步骤的唯一顺序,且一些的步骤可被省略和/或一些本文未描述的其他步骤可被添加到该方法。若某附图中的构件与其他附图中的构件相同,虽然在所有附图中都可轻易辨认出这些构件,但为了使附图的说明更为清楚,本说明书不会将所有相同构件的标号标于每一图中。If the method herein includes a series of steps, and the order of these steps presented herein is not necessarily the only order in which these steps can be performed, and some steps may be omitted and/or some other steps not described herein may be added to this method. If the components in a certain drawing are the same as those in other drawings, although these components can be easily identified in all the drawings, in order to make the description of the drawings more clear, this specification will not describe all the same components. The reference numbers are shown in each figure.
本发明一实施例提供了一种压电驱动结构,图1示出了根据本发明一实施例的一种压电驱动结构,参照图1,所述压电驱动结构200包括:An embodiment of the present invention provides a piezoelectric driving structure. FIG. 1 shows a piezoelectric driving structure according to an embodiment of the present invention. Referring to FIG. 1, the piezoelectric driving structure 200 includes:
支撑层24;Support layer 24;
压电元件20,粘合于所述支撑层24的上表面,所述压电元件20在长度方向上由电隔离结构隔离成多个子压电元件(本实施例中,隔离成2个子压电元件,第一子压电元件20A,第二子压电元件20B),每个所述子压电元件设有独立的电极引出端,对每个所述子压电元件单独通电,所述子压电元件产生伸缩,拉动所述支撑层24产生形变;The piezoelectric element 20 is adhered to the upper surface of the support layer 24. The piezoelectric element 20 is isolated into a plurality of sub-piezoelectric elements by an electrical isolation structure in the length direction (in this embodiment, the piezoelectric element 20 is isolated into two sub-piezoelectric elements). Element, the first sub-piezoelectric element 20A, the second sub-piezoelectric element 20B), each of the sub-piezoelectric elements is provided with an independent electrode lead-out end, and each of the sub-piezoelectric elements is individually energized, and the sub-piezoelectric elements are individually energized. The piezoelectric element expands and contracts, and the support layer 24 is pulled to produce deformation;
对多个所述子压电元件分别通电,所述压电元件能够带动所述支撑层产生多种翘曲变化。The plurality of sub-piezoelectric elements are respectively energized, and the piezoelectric elements can drive the supporting layer to produce various warping changes.
参照图1,所述子压电元件包括:1, the sub-piezoelectric element includes:
至少一层压电膜23(本实施例中,包括两个子压电元件,第一子压电元件20A包括第一压电膜23A,第二子压电元件20B包括第一压电膜23B,第一压电膜23A和第二压电膜23B统称压电膜23),以及位于每层所述压电膜23上下表面的电极,相邻两层所述压电膜23共用位于两者之间的电极; At least one layer of piezoelectric film 23 (in this embodiment, it includes two sub-piezoelectric elements, the first sub-piezoelectric element 20A includes the first piezoelectric film 23A, and the second sub-piezoelectric element 20B includes the first piezoelectric film 23B, The first piezoelectric film 23A and the second piezoelectric film 23B are collectively referred to as the piezoelectric film 23), and the electrodes located on the upper and lower surfaces of each layer of the piezoelectric film 23, and the two adjacent layers of the piezoelectric film 23 are shared between the two. Between the electrodes;
所述电极从下至上依次计数,分为奇数层电极和偶数层电极;The electrodes are counted sequentially from bottom to top, and are divided into odd-numbered layers of electrodes and even-numbered layers of electrodes;
第一电极引出端,位于所述压电元件的顶面,与所述偶数电极层电连接;本实施例中第一子压电元件20A设有第一电极引出端251A,第二子压电元件20A设有第二电极引出端251BThe first electrode lead-out end is located on the top surface of the piezoelectric element and is electrically connected to the even-numbered electrode layer; in this embodiment, the first sub-piezoelectric element 20A is provided with a first electrode lead-out end 251A, and the second sub-piezoelectric element 20A is provided with a first electrode lead-out end 251A. The element 20A is provided with a second electrode lead-out terminal 251B
第二电极引出端,位于所述压电元件的顶面,与所述奇数电极层电连接。本实施例中第一子压电元件20A设有第二电极引出端252A,第二子压电元件20B设有第二电极引出端252BThe second electrode lead-out end is located on the top surface of the piezoelectric element and is electrically connected to the odd electrode layer. In this embodiment, the first sub-piezoelectric element 20A is provided with a second electrode lead-out end 252A, and the second sub-piezoelectric element 20B is provided with a second electrode lead-out end 252B.
具体地,参考图1,本实施例中,压电元件20从可动端至固定端被电隔离结构27隔离成两个子压电元件,分别为第一子压电元件20A和第二子压电元件20B(如图虚线框中所示,左侧为第一子压电元件20A,右侧为第二子压电元件20B),两个子压电元件共用同一个支撑层24。第一子压电元件20A包括位于支撑层24上的压电叠层结构,压电叠层结构包括从上至下依次堆叠第一电极21A、压电膜23A和第二电极22A,第一电极21A和第二电极22A分别连接与第一电极引出端251A和第二电极引出端252A。第二子压电元件20B包括位于支撑层24上的压电叠层结构,压电叠层结构包括从上至下依次堆叠第一电极21B、压电膜23B和第二电极22B,第一电极21B和第二电极22B分别连接与第一电极引出端251B和第二电极引出端252B。Specifically, referring to FIG. 1, in this embodiment, the piezoelectric element 20 is isolated from the movable end to the fixed end by the electrical isolation structure 27 into two sub-piezoelectric elements, which are the first sub-piezoelectric element 20A and the second sub-piezoelectric element, respectively. The electric element 20B (as shown in the dashed box, the left side is the first sub-piezoelectric element 20A, and the right side is the second sub-piezoelectric element 20B), and the two sub-piezoelectric elements share the same support layer 24. The first sub-piezoelectric element 20A includes a piezoelectric laminate structure on the support layer 24. The piezoelectric laminate structure includes stacking a first electrode 21A, a piezoelectric film 23A, and a second electrode 22A in order from top to bottom. The first electrode 21A and the second electrode 22A are respectively connected to the first electrode lead-out end 251A and the second electrode lead-out end 252A. The second sub-piezoelectric element 20B includes a piezoelectric laminate structure on the support layer 24. The piezoelectric laminate structure includes stacking a first electrode 21B, a piezoelectric film 23B, and a second electrode 22B in order from top to bottom. 21B and the second electrode 22B are respectively connected to the first electrode lead-out end 251B and the second electrode lead-out end 252B.
本实施例中,第一子压电元件20A和第二子压电元件20B上方还设置有布线层25,第一电极引出端251A、第二电极引出端252A、第一引出端251B和第二引出端252B均位于布线层25中,并暴露于布线层25的上表面,且四个电极引出端互相电隔离。四个电极引出端均位于压电元件的一端,方便电信号的引入,本实施例中,均位于第一子压电元件20A的端部。 In this embodiment, a wiring layer 25 is further provided above the first sub-piezoelectric element 20A and the second sub-piezoelectric element 20B, the first electrode lead-out terminal 251A, the second electrode lead-out terminal 252A, the first lead-out terminal 251B, and the second The lead terminals 252B are all located in the wiring layer 25 and exposed on the upper surface of the wiring layer 25, and the four electrode lead terminals are electrically isolated from each other. The four electrode lead-out ends are all located at one end of the piezoelectric element to facilitate the introduction of electrical signals. In this embodiment, they are all located at the end of the first sub-piezoelectric element 20A.
第一子压电元件20A和第二子压电元件20B通过电隔离结构27进行隔离,本方案中,电隔离结构27为一绝缘介质层,底部延伸至支撑层24上表面,顶部延伸至布线层25中,在其他实例中,电隔离结构27可以由空气隙构成。当电隔离结构27由空气隙构成时,可以减少在空气隙中填充绝缘材料的工艺步骤,此时空气隙的宽度不能太小,空气隙的宽度的最小取值以相邻的两个子压电元件形变时,两个靠近的端部不接触为准。The first sub-piezoelectric element 20A and the second sub-piezo element 20B are isolated by an electrical isolation structure 27. In this solution, the electrical isolation structure 27 is an insulating dielectric layer, the bottom of which extends to the upper surface of the support layer 24, and the top to the wiring In the layer 25, in other examples, the electrical isolation structure 27 may be formed by an air gap. When the electrical isolation structure 27 is composed of an air gap, the process steps for filling the insulating material in the air gap can be reduced. At this time, the width of the air gap cannot be too small. When the element is deformed, the two close ends do not contact.
子压电元件的压电叠层结构不限于只有一层压电膜,参考图2,为具有三层压电膜的子压电元件,每一层压电膜23上表面和下表面均分布有电极,相邻两层压电膜23共用位于两者之间的电极,所以三层压电膜23共计4层电极,电极从下至上依次计数,奇数层电极211利用导电结构26电连接在一起,偶数层电极221利用另一导电结构26电连接在一起,导电结构26伸入压电叠层结构的部分位于布线层25中,仅端部与需要电连接的电极接触。两个导电结构26的顶部可以分别作为第一电极引出端和第二电极引出端,使得第一电极引出端、第二电极引出端均位于子压电元件的顶面。The piezoelectric laminate structure of the sub-piezoelectric element is not limited to only one piezoelectric film. Refer to Fig. 2, which is a sub-piezoelectric element with three layers of piezoelectric film. The upper and lower surfaces of each piezoelectric film 23 are distributed. There are electrodes, and two adjacent layers of piezoelectric films 23 share the electrodes between them. Therefore, the three layers of piezoelectric films 23 have 4 layers of electrodes. The electrodes are counted from bottom to top. The odd-numbered layers of electrodes 211 are electrically connected to each other by the conductive structure 26. At the same time, the even-numbered electrodes 221 are electrically connected together by another conductive structure 26. The part of the conductive structure 26 extending into the piezoelectric laminate structure is located in the wiring layer 25, and only the ends are in contact with the electrodes that need to be electrically connected. The tops of the two conductive structures 26 can be respectively used as the first electrode lead-out end and the second electrode lead-out end, so that the first electrode lead-out end and the second electrode lead-out end are both located on the top surface of the sub-piezoelectric element.
本发明中,压电叠层结构不限于包括三层压电膜,还可以包括两层、四层、五层或六层等,通过增加压电膜的数量可以提升压电驱动器翘曲的能力,使得压电驱动器能够移动质量更大的被移动元件。In the present invention, the piezoelectric laminate structure is not limited to include three layers of piezoelectric films, but can also include two layers, four layers, five layers, or six layers. By increasing the number of piezoelectric films, the warpage ability of the piezoelectric actuator can be improved. , So that the piezoelectric actuator can move a larger mass of the moved element.
应理解,为了保证三层压电膜的翘曲方向相同,相邻的两层压电膜的极性相反,极性相反是指压电膜的晶向(极化方向)相反。即两层压电膜施加相反方向的电压,实现向同一方向弯曲。It should be understood that in order to ensure that the warping directions of the three piezoelectric films are the same, the polarities of the two adjacent piezoelectric films are opposite, and the opposite polarity means that the crystal directions (polarization directions) of the piezoelectric films are opposite. That is, the two piezoelectric films apply voltages in opposite directions to achieve bending in the same direction.
压电膜23需要采用通电可发生形变的压电材料制成,例如是石英晶体、氮化铝、氧化锌、锆钛酸铅、钛酸钡、镓酸锂、锗酸锂或锗酸钛等材料,本实例中压电膜23A和压电膜23B的材料和厚度相同,其他实例中,压电膜23A和压电膜23B的材料和厚度也可以不同,不同的材料施加相同的电压,翘曲程度不同。在一定范围内压电膜的厚度大,翘曲程度大,厚度的选择可以通过计算结合实验方式得出。通过设置不用的材料,不同的厚度可以更加灵活的控制整个压电元件的变形。支撑层24的材料则为不导电的介质材料,例如是氧化硅、氮化硅等。The piezoelectric film 23 needs to be made of a piezoelectric material that can be deformed when energized, such as quartz crystal, aluminum nitride, zinc oxide, lead zirconate titanate, barium titanate, lithium gallate, lithium germanate, or titanium germanate, etc. Materials. In this example, the piezoelectric film 23A and the piezoelectric film 23B have the same material and thickness. In other examples, the piezoelectric film 23A and the piezoelectric film 23B can also have different materials and thicknesses. Different materials are applied with the same voltage and warped. The degree of curvature is different. In a certain range, the thickness of the piezoelectric film is large, and the degree of warpage is large. The choice of thickness can be obtained through calculation and experiment. By setting unused materials, different thicknesses can control the deformation of the entire piezoelectric element more flexibly. The material of the support layer 24 is a non-conductive dielectric material, such as silicon oxide, silicon nitride, and the like.
本实施例中,所述压电膜和所述支撑层的厚度小于10微米。In this embodiment, the thickness of the piezoelectric film and the support layer is less than 10 microns.
本实施例中,2个子压电元件共用一个支撑层24,通过对子压电元件设置不同的参数(如压电膜的材料、压电膜的厚度,施加的电压大小、方向,每个子压电元件的长度),使支撑层24产生形变,实现压电驱动结构的灵活变形。所述压电驱动结构可以用于驱动部件的直线运动或曲线运动。本发明一实施例提供了一种成像模组,图3为本发明一实施例的一种成像模组的示意图,图4为图3沿A-A’方向的剖视图,请参考图3和图4,所述成像模组包括上述的压电驱动结构,其中所述压电驱动结构200包括可动端和固定端,所述成像模组还包括:In this embodiment, two sub-piezoelectric elements share a support layer 24. By setting different parameters for the sub-piezoelectric elements (such as the material of the piezoelectric film, the thickness of the piezoelectric film, the magnitude and direction of the applied voltage, each sub-pressure The length of the electrical element), the support layer 24 is deformed, and the flexible deformation of the piezoelectric driving structure is realized. The piezoelectric driving structure can be used to drive the linear motion or the curved motion of the component. An embodiment of the present invention provides an imaging module. FIG. 3 is a schematic diagram of an imaging module according to an embodiment of the present invention. FIG. 4 is a cross-sectional view of FIG. 3 along the AA' direction. Please refer to FIGS. 3 and 4. The imaging module includes the aforementioned piezoelectric driving structure, wherein the piezoelectric driving structure 200 includes a movable end and a fixed end, and the imaging module further includes:
支撑块50,用于支撑固定所述固定端;The supporting block 50 is used to support and fix the fixed end;
被移动元件30,与所述可动端连接,所述被移动元件30包括透镜组、成像传感元件、光圈、反射镜或透镜片;The moved element 30 is connected to the movable end, and the moved element 30 includes a lens group, an imaging sensor element, an aperture, a mirror or a lens sheet;
外部信号连接端,与所述压电驱动结构200电连接;The external signal connection terminal is electrically connected to the piezoelectric driving structure 200;
在通电的状态下,所述可动端相对于所述固定端向上或向下移动,以移动所述被移动元件30。In the energized state, the movable end moves upward or downward relative to the fixed end to move the moved element 30.
参考图4,压电驱动结构200(虚线框中所示,为简化图形,后面图示中不再画虚线框)的固定端位于支撑块50上,可动端伸出支撑块50,形成悬臂的结构。在其他实例中,压电驱动结构200的整体都可以位于支撑块50上。当压电驱动结构200整***于支撑块50上时,适用于需要将被移动元件30向上抬起的场合,当压电驱动结构200的可动端伸出支撑块50时,可以应用在需要将被移动元件30上抬或下移的场合中。支撑块50与压电驱动结构200的固定端通过黏胶连接,或者通过有机固化膜连接。有机固化膜粘合属于晶元级工艺,在晶圆厂或者封装厂一般用有机固化膜粘合,其效率高,成本相对偏高。黏胶连接适用于板级工艺,适用于模组厂,其价格低,效率也偏低。4, the fixed end of the piezoelectric driving structure 200 (shown in the dashed frame, to simplify the figure, the dashed frame is not drawn in the following figure) is located on the support block 50, and the movable end extends out of the support block 50 to form a cantilever Structure. In other examples, the entire piezoelectric driving structure 200 may be located on the supporting block 50. When the piezoelectric driving structure 200 is entirely located on the supporting block 50, it is suitable for occasions where the moving element 30 needs to be lifted upwards. When the movable end of the piezoelectric driving structure 200 extends out of the supporting block 50, it can be applied to When the moved component 30 is lifted up or moved down. The supporting block 50 and the fixed end of the piezoelectric driving structure 200 are connected by glue or by an organic cured film. Organic curing film bonding is a wafer-level process. In wafer factories or packaging plants, organic curing film bonding is generally used, which has high efficiency and relatively high cost. Adhesive connection is suitable for board-level crafts and suitable for module factories. Its price is low and efficiency is low.
进一步,支撑块50的材料为介质材料,其可以呈环形并围绕被移动元件30设置,可以较好的支撑压电驱动结构200;或者,支撑块50包括沿周向分布的多个子支撑块,多个子支撑块相互间隔或接触,从而可以节约材料,减轻重量。当多个压电驱动结构200不在同一平面内时,支撑块50的高度可以不一致。本发明中,支撑块50也可以不是环形的,例如只位于被移动元件30的两侧或四侧等。Further, the material of the support block 50 is a dielectric material, which can be in a ring shape and arranged around the moved element 30 to better support the piezoelectric driving structure 200; or, the support block 50 includes a plurality of sub-support blocks distributed in the circumferential direction, A plurality of sub-support blocks are spaced apart or in contact with each other, thereby saving materials and reducing weight. When the plurality of piezoelectric driving structures 200 are not in the same plane, the height of the support block 50 may not be consistent. In the present invention, the supporting block 50 may not be ring-shaped, for example, only located on two sides or four sides of the moved element 30.
参考图4,在被移动元件30的下表面设有限位槽40,限位槽40由第一膜层41、第二膜层42及第三膜层43,三个膜层围绕而成。限位槽40不限于位于被移动元件30的下表面,也可以位于被移动元件30的上表面,或者位于被移动元件30的侧表面。本发明中,限位槽40不限于由该另外设置的膜层围绕而成,也可以由被移动元件30本身形成限位槽40,比如,在被移动元件30的侧表面形成有凹陷以作为该限位槽40,或者当限位槽位于下表面时,被移动元件的下表面可以作为限位槽40的上膜层,当限位槽40位于上表面时,被移动元件30的上表面作为限位槽的下膜层。Referring to FIG. 4, a limiting groove 40 is provided on the lower surface of the moved component 30, and the limiting groove 40 is surrounded by three film layers: a first film layer 41, a second film layer 42, and a third film layer 43. The limiting groove 40 is not limited to being located on the lower surface of the moved element 30, and may also be located on the upper surface of the moved element 30 or on the side surface of the moved element 30. In the present invention, the limiting groove 40 is not limited to being surrounded by the additionally provided film layer, and the limiting groove 40 may also be formed by the moving element 30 itself. For example, a recess is formed on the side surface of the moving element 30 to serve as The limiting groove 40, or when the limiting groove is located on the lower surface, the lower surface of the moved component can be used as the upper film layer of the limiting groove 40, when the limiting groove 40 is located on the upper surface, the upper surface of the moved component 30 As the lower film layer of the limit slot.
压电驱动结构200通电后,压电驱动结构200可动端的末端伸入限位槽40内,本实施例中为第二子压电元件20B的末端伸入所述限位槽40内,可动端向上或向下翘曲,使得被移动元件30可以整体上升或整体下降,从而改变被移动元件30的垂向位置,实现光学自动对焦。自动对焦完成后,当有需要时,可以改变施加在被移动元件30一侧上的压电驱动结构200的电压,从而使得被移动元件30发生倾斜,进而改变被移动元件30的角度,校正被移动元件30的光学翘曲角度,从而实现光学防抖。After the piezoelectric driving structure 200 is energized, the end of the movable end of the piezoelectric driving structure 200 extends into the limiting slot 40. In this embodiment, the end of the second sub-piezoelectric element 20B extends into the limiting slot 40. The moving end is warped upwards or downwards, so that the moved element 30 can be moved up or down as a whole, so as to change the vertical position of the moved element 30 to realize optical autofocus. After the autofocus is completed, when necessary, the voltage applied to the piezoelectric driving structure 200 on the side of the moved element 30 can be changed, so that the moved element 30 is tilted, thereby changing the angle of the moved element 30, and correcting the The optical warping angle of the element 30 is moved, thereby realizing optical anti-shake.
参考图5,在一个实例中,压电驱动结构200的压电元件为连续的整体,没有分成多个子压电元件,压电驱动结构200的固定端固定在支撑块50上,可动端连接于限位槽40,当压电驱动结构200的可动端向上翘曲时,伸入限位槽40内的端部与限位槽40的接触角度较大,与限位槽40的摩擦力增加,严重时会卡死。Referring to FIG. 5, in an example, the piezoelectric element of the piezoelectric driving structure 200 is a continuous whole without being divided into a plurality of sub-piezoelectric elements. The fixed end of the piezoelectric driving structure 200 is fixed on the support block 50, and the movable end is connected In the limiting groove 40, when the movable end of the piezoelectric driving structure 200 is upwardly warped, the contact angle between the end extending into the limiting groove 40 and the limiting groove 40 is relatively large, and the frictional force with the limiting groove 40 Increase, it will be stuck in severe cases.
参考图6,在本实施例中,压电驱动结构的压电元件分为相互隔离的第一子压电元件20A和第二子压电元件20B,分别对第一子压电元件20A和第二子压电元件20B施加电压,在使被移动元件30移动相同的距离的情况下,第二子压电元件20B的伸入限位槽40内的端部与限位槽40接触的角度较为平滑。从而可以避免压电驱动器200的端部与限位槽40卡死的问题。应当理解,压电驱动结构200的压电元件可以分成多个子压电元件,通过分别控制各自的电压,得到压电驱动结构希望的变形曲线。本实施例中,对第一子压电元件20A施加正向的电压,第一子压电元件20A的一端向上翘曲,对第二子压电元件20B施加电压反向的电压,使第二子压电元件20B与第一子压电元件20A靠近的端部向下翘曲,第二子压电元件20B与限位槽40接触的端部区域水平设置。通过设置电压的大小得到想得到的弧度。Referring to FIG. 6, in this embodiment, the piezoelectric element of the piezoelectric driving structure is divided into a first sub-piezoelectric element 20A and a second sub-piezoelectric element 20B that are isolated from each other. Two sub-piezoelectric elements 20B are applied with a voltage, and when the moved element 30 is moved the same distance, the end of the second sub-piezo element 20B that extends into the limiting groove 40 has a relatively large contact angle with the limiting groove 40 smooth. In this way, the problem of the end of the piezoelectric driver 200 and the limiting groove 40 jamming can be avoided. It should be understood that the piezoelectric element of the piezoelectric driving structure 200 can be divided into a plurality of sub-piezoelectric elements, and the desired deformation curve of the piezoelectric driving structure can be obtained by separately controlling the respective voltages. In this embodiment, a positive voltage is applied to the first sub-piezoelectric element 20A, one end of the first sub-piezoelectric element 20A is warped upward, and a reverse voltage is applied to the second sub-piezoelectric element 20B, so that the second sub-piezoelectric element 20B is applied with a reverse voltage. The end of the piezoelectric sub-element 20B close to the first piezoelectric sub-element 20A is warped downward, and the end area of the second piezoelectric sub-element 20B in contact with the limiting groove 40 is horizontally arranged. Get the desired radian by setting the voltage.
对于压电元件包括多个子压电元件的情况,可以通过计算或实验的方式得到压电元件的灵活变形。继续参考图1和图4,压电驱动结构位于支撑块50的顶面。第一子压电元件20A的第一电极引出端251A和第二电极引出端252A,第二子压电元件20B的第一电极引出端251B和第二电极引出端252B直接作为外部信号连接端,分别通过一根引线(未示出)与线路板10电连接,使得线路板10可以为压电驱动结构200施加电压,以使压电膜23A和压电膜23B的上表面和下表面之间产生压差,从而使得压电膜23A和压电膜23B伸缩,而由于支撑层24无法伸缩,所以导致第一子压电元件20A和第二子压电元件20B在通电后向上或向下翘曲(翘曲的方向、翘曲的程度视在压电膜23A, 压电膜23B上下表面施加的电压而定),从而使压电驱动结构200整体向上或者向下弯曲。For the case where the piezoelectric element includes multiple sub-piezoelectric elements, the flexible deformation of the piezoelectric element can be obtained by calculation or experiment. Continuing to refer to FIGS. 1 and 4, the piezoelectric driving structure is located on the top surface of the supporting block 50. The first electrode lead-out end 251A and the second electrode lead-out end 252A of the first sub-piezoelectric element 20A, the first electrode lead-out end 251B and the second electrode lead-out end 252B of the second sub-piezoelectric element 20B directly serve as external signal connection ends, The circuit board 10 is electrically connected to the circuit board 10 through a lead wire (not shown), so that the circuit board 10 can apply a voltage to the piezoelectric driving structure 200 so that the upper and lower surfaces of the piezoelectric film 23A and the piezoelectric film 23B are separated from each other. A pressure difference is generated, so that the piezoelectric film 23A and the piezoelectric film 23B expand and contract, and because the support layer 24 cannot expand or contract, the first sub-piezoelectric element 20A and the second sub-piezoelectric element 20B warp upward or downward after being energized. The warpage (the direction of warpage and the degree of warpage depend on the voltage applied to the upper and lower surfaces of the piezoelectric film 23A and the piezoelectric film 23B), so that the piezoelectric driving structure 200 is bent upward or downward as a whole.
应理解,本发明不限于直接通过引线电连接压电驱动结构200和线路板10,还可以在支撑块50的顶面设置电连接端,将子压电元件20A和子压电元件20B的两个电极引出端分别与电连接端采用引线电连接,然后再用另外的互联结构(如引线或导电插塞)将支撑块50顶面的电连接端与线路板10电连接即可,这样可以缩短引线的长度。It should be understood that the present invention is not limited to directly electrically connecting the piezoelectric driving structure 200 and the circuit board 10 through a lead wire, and an electrical connection terminal may also be provided on the top surface of the support block 50 to connect two of the sub piezoelectric element 20A and the sub piezoelectric element 20B. The lead-out ends of the electrodes are electrically connected to the electrical connection ends by lead wires, and then another interconnection structure (such as lead wires or conductive plugs) is used to electrically connect the electrical connection ends on the top surface of the support block 50 to the circuit board 10, which can be shortened The length of the lead.
需要说明的是,第一子压电元件20A的第一电极引出端251A和第二电极引出端251B,第二子压电元件20B的第一电极引出端251B和第二电极引出端252B都用于连接外部电路信号,且均位于压电驱动结构的一侧,为方便描述,下文中所称的第一电极引出端和第二电极引出端意味着包括两个子压电元件的第一电极引出端和第二电极引出端,不再对两个子压电元件进行区分。It should be noted that the first electrode lead-out end 251A and the second electrode lead-out end 251B of the first sub-piezoelectric element 20A, and the first electrode lead-out end 251B and the second electrode lead-out end 252B of the second sub-piezoelectric element 20B are both used To connect to external circuit signals and are located on one side of the piezoelectric drive structure, for the convenience of description, the first electrode lead-out end and the second electrode lead-out end referred to hereinafter mean that the first electrode lead-out includes two sub-piezoelectric elements. The two sub-piezoelectric components are no longer distinguished between the terminal and the second electrode lead-out terminal.
请参考图7,成像模组的外部信号连接端包括第三电连接端61和第四电连接端62。支撑块50包括第一层支撑块51和第二层支撑块52,压电驱动结构的固定端位于第一层支撑块51和第二层支撑块52之间。第三电连接端61和第四电连接端62位于支撑块50的顶面且位于压电驱动结构的正上方。第三电连接端61通过导电插塞63与压电驱动结构的第一电极引出端电连接,第四电连接端62通过导电插塞63与压电驱动结构的第二电极引出端电连接,两个导电插塞63位于第二层支撑块52内。第三电连接端61、第四电连接端62分别通过引线与线路板10电连接。Please refer to FIG. 7, the external signal connection end of the imaging module includes a third electrical connection end 61 and a fourth electrical connection end 62. The support block 50 includes a first layer support block 51 and a second layer support block 52, and the fixed end of the piezoelectric driving structure is located between the first layer support block 51 and the second layer support block 52. The third electrical connection end 61 and the fourth electrical connection end 62 are located on the top surface of the support block 50 and directly above the piezoelectric driving structure. The third electrical connection end 61 is electrically connected to the first electrode lead-out end of the piezoelectric drive structure through the conductive plug 63, and the fourth electrical connection end 62 is electrically connected to the second electrode lead-out end of the piezoelectric drive structure through the conductive plug 63, Two conductive plugs 63 are located in the second layer support block 52. The third electrical connection end 61 and the fourth electrical connection end 62 are electrically connected to the circuit board 10 through lead wires, respectively.
应理解,当第三电连接端61和第四电连接端62未正对压电驱动结构的电极引出端时,第三电连接端61和第四电连接端62还可以采用再布线与压电驱动结构的第一电极引出端和第二电极引出端电连接, It should be understood that when the third electrical connection end 61 and the fourth electrical connection end 62 are not directly facing the electrode lead-out ends of the piezoelectric driving structure, the third electrical connection end 61 and the fourth electrical connection end 62 may also adopt rewiring and compression. The first electrode leading end and the second electrode leading end of the electric drive structure are electrically connected,
请继续参考图3,压电驱动结构200为一对,一对压电驱动结构200对称分布于被移动元件30两侧,两个压电驱动结构200同时向上或者向下翘曲时,可以使被移动元件30向上或向下移动。当其中一个压电驱动结构200工作,或者其中一个压电驱动结构200向上翘曲,另一个压电驱动结构200向下翘曲,可以在一个方向上改变被移动元件的角度。Please continue to refer to FIG. 3, the piezoelectric driving structure 200 is a pair, and the pair of piezoelectric driving structures 200 are symmetrically distributed on both sides of the moved element 30. When the two piezoelectric driving structures 200 warp upward or downward at the same time, they can make The moved element 30 moves up or down. When one of the piezoelectric driving structures 200 is working, or one of the piezoelectric driving structures 200 is warped upward, and the other piezoelectric driving structure 200 is warped downward, the angle of the moved element can be changed in one direction.
请参考图8,压电驱动结构为四个,分布在被移动元件30的四侧,四个压电驱动结构同时向上或者向下翘曲时,可以使被移动元件30向上或向下移动。一组相对的两个压电驱动结构,可以在一个方向上改变被移动元件的角度,另外一组相对的压电驱动结构可以从另一个方向上改变被移动元件的角度。Please refer to FIG. 8, there are four piezoelectric driving structures, which are distributed on the four sides of the moved element 30. When the four piezoelectric driving structures warp upward or downward at the same time, the moved element 30 can be moved upward or downward. A set of two opposing piezoelectric driving structures can change the angle of the moved element in one direction, and the other set of opposing piezoelectric driving structures can change the angle of the moved element in the other direction.
请参考图9,压电驱动结构为三对,三对压电驱动结构周向均匀分布, 三对压电驱动结构可以从三个方向上改变被移动元件的倾斜角度。Please refer to FIG. 9, there are three pairs of piezoelectric driving structures, and the three pairs of piezoelectric driving structures are evenly distributed in the circumferential direction. The three pairs of piezoelectric driving structures can change the inclination angle of the moved element from three directions.
请参考图10,被移动元件30相对的两侧均连接两个压电驱动结构,使得两个压电驱动结构同步向上或向下翘曲(且翘曲的幅度相同),这样两个压电驱动结构一起支撑被移动元件30的一侧,可以适用于压电驱动结构尺寸较小,而被移动元件30尺寸较大时的场合,或者适用于被移动元件30质量较大的场合。本发明中,被移动元件30相对的两侧不限于连接两个压电驱动结构,还可以连接三个、四个、五个等。Please refer to FIG. 10, two piezoelectric driving structures are connected on opposite sides of the moved element 30, so that the two piezoelectric driving structures are simultaneously warped upward or downward (and the warping amplitude is the same), so that the two piezoelectric The driving structure supports one side of the moved element 30 together, which can be suitable for situations where the piezoelectric driving structure has a small size and the moved element 30 has a large size, or is suitable for situations where the mass of the moved element 30 is large. In the present invention, the two opposite sides of the moved element 30 are not limited to connecting two piezoelectric driving structures, and three, four, five, etc. can also be connected.
当然,压电驱动结构还可以为四对、五对或六对等,每对压电驱动结构不限于沿被移动元件30的中心对称设置,也可以不对称设置,压电驱动结构的对数越多,可以增加被移动元件30的旋转轴,实现多维度的转动,被移动元件30也不限于是方形或圆形,还可以是其他的形状,本发明不作限制。Of course, the piezoelectric driving structure can also be four pairs, five pairs, or six pairs. Each pair of piezoelectric driving structures is not limited to being symmetrically arranged along the center of the moved element 30, and can also be arranged asymmetrically. The more, the rotation axis of the moved element 30 can be increased to realize multi-dimensional rotation. The moved element 30 is not limited to a square or round shape, and can also have other shapes, which is not limited in the present invention.
可以理解的是,压电驱动结构成对出现有利于控制被移动元件30的移动,实际上,压电驱动结构也可以不成对的出现,例如三个压电驱动结构沿被移动元件30的周向均匀分布等,本实施例不再一一举例说明。It can be understood that the paired piezoelectric driving structures are beneficial to control the movement of the moved element 30. In fact, the piezoelectric driving structures may also appear unpaired. For example, three piezoelectric driving structures are arranged along the circumference of the moved element 30. To be uniformly distributed, etc., this embodiment will not be illustrated one by one.
本发明中,一个压电驱动结构对应一个限位槽40,两个限位槽40不限于均固定在被移动元件30的下表面上,如图11所示,两个限位槽40均固定在被移动元件30的上表面;如图12所示,两个限位槽40中的一对固定在被移动元件30的上表面,另一对固定在被移动元件30的下表面,此时,支撑两个压电驱动结构的支撑块50的高度不同,也就是说,为了支撑压电驱动结构,可以根据压电驱动结构的位置调整支撑块50的高度。In the present invention, one piezoelectric driving structure corresponds to one limiting slot 40, and the two limiting slots 40 are not limited to being fixed on the lower surface of the moved element 30. As shown in FIG. 11, the two limiting slots 40 are both fixed. On the upper surface of the moved element 30; as shown in Figure 12, one pair of the two limit grooves 40 is fixed on the upper surface of the moved element 30, and the other pair is fixed on the lower surface of the moved element 30. The height of the support block 50 supporting the two piezoelectric driving structures is different, that is, in order to support the piezoelectric driving structure, the height of the support block 50 can be adjusted according to the position of the piezoelectric driving structure.
请参考图12,成对的两个压电驱动结构彼此分布在被移动元件30中心两侧。但应理解,如图13所示,成对的两个压电驱动结构可以都位于被移动元件30的下方交叠设置。也就是说,压电驱动结构的可动端选择与被移动元件30距离较远的一侧的限位槽40中(每个压电驱动结构用于移动被移动元件30的对边),此时,压电驱动结构的长度可以增加,在被移动元件30的质量较大时,也能轻松抬起,在本实例中子压电驱动结构的固定端位于被移动元件30的外侧,在其他实例中,压电驱动结构的固定端也可以位于被移动元件30的下方。Please refer to FIG. 12, two piezoelectric driving structures in a pair are distributed on both sides of the center of the moved element 30. However, it should be understood that, as shown in FIG. 13, the two piezoelectric driving structures in a pair may be located under the moved element 30 and overlapped. In other words, the movable end of the piezoelectric driving structure is selected in the limit slot 40 on the side farther from the moved element 30 (each piezoelectric driving structure is used to move the opposite side of the moved element 30). When the length of the piezoelectric driving structure can be increased, it can also be easily lifted when the mass of the moved element 30 is large. In this example, the fixed end of the sub-piezoelectric driving structure is located outside the moved element 30. In an example, the fixed end of the piezoelectric driving structure may also be located below the moved element 30.
进一步,如图13所示,支撑块50与压电驱动结构的固定位置位于被移动元件30的外侧。如图14所示,支撑块50与压电驱动结构的固定位置也可以位于被移动元件30的下方空间,使得压电驱动结构的固定端较可动端更靠近被移动元件30的中心。当然,支撑块50不限于完全位于被移动元件30的正下方,也可以部分位于被移动元件30的正下方,这样一来,支撑块50可以被被移动元件30完全或部分覆盖住,可以节省支撑块50所占的面积,减小整个成像模组的面积,有利于缩小尺寸。Further, as shown in FIG. 13, the fixed position of the supporting block 50 and the piezoelectric driving structure is located outside the moved element 30. As shown in FIG. 14, the fixed position of the supporting block 50 and the piezoelectric driving structure can also be located in the space below the moved element 30, so that the fixed end of the piezoelectric driving structure is closer to the center of the moved element 30 than the movable end. Of course, the support block 50 is not limited to being completely located directly under the moved element 30, and can also be partially located directly under the moved element 30. In this way, the support block 50 can be completely or partially covered by the moving element 30, which can save The area occupied by the support block 50 reduces the area of the entire imaging module, which is conducive to reducing the size.
压电驱动结构的可动端除了通过限位槽40与被移动元件30连接外,还可以通过柔性连接件连接,如图15所示,柔性连接件40B包括:第一部分41B、第二部分42B,位于第一部分41B和第二部分42B之间的中间部分,第一端为第一部分41B的至少一部分,第二部分42B为第二端的一部分,中间部分43B是水平的条状结构,第一部分41B、第二部分42B还具有一竖梁,通过竖梁将第一端及第二端与中间部分43B连接。中间部分43B的宽度、厚度满足设定值,使中间部分43B具有柔韧性,当第一端、第二端受到不同的拉力或推力时,中间部分43B可以发生形变。In addition to connecting the movable end of the piezoelectric driving structure with the moved element 30 through the limiting slot 40, it can also be connected by a flexible connecting piece. As shown in FIG. 15, the flexible connecting piece 40B includes: a first part 41B and a second part 42B , Located in the middle part between the first part 41B and the second part 42B, the first end is at least a part of the first part 41B, the second part 42B is a part of the second end, the middle part 43B is a horizontal strip structure, the first part 41B The second part 42B also has a vertical beam, and the first end and the second end are connected with the middle part 43B through the vertical beam. The width and thickness of the middle part 43B meet the set values, so that the middle part 43B has flexibility. When the first end and the second end are subjected to different pulling or pushing forces, the middle part 43B can be deformed.
应理解,中间部分43B的宽度和厚度的设定值与中间部分43B的材料有关,当中间部分43B选择不同的材料制成时,设定值相应会改变,设定值只要能够保证中间部分43B具有柔韧性即可。It should be understood that the setting values of the width and thickness of the middle part 43B are related to the material of the middle part 43B. When the middle part 43B is made of different materials, the setting values will change accordingly. The setting values only need to be able to ensure the middle part 43B. Just have flexibility.
本发明中,中间部分43B不限于条状结构,还可以是弧形、波浪形等;第一部分41B、第二部分42B也不限于采用竖梁与中间部分43B连接,本发明不作限制。进一步,第一部分41B、第二部分42B也可以具有柔韧性,使得柔性连接件40B整体具有柔韧性,可以增加柔性连接件40B的形变能力。In the present invention, the middle part 43B is not limited to a strip structure, but can also be arc-shaped, wave-shaped, etc.; the first part 41B and the second part 42B are not limited to using vertical beams to connect with the middle part 43B, and the present invention is not limited. Furthermore, the first part 41B and the second part 42B may also have flexibility, so that the flexible connecting member 40B is flexible as a whole, which can increase the deformability of the flexible connecting member 40B.
压电驱动结构的可动端与柔性连接件40B黏胶连接,或者通过有机固化膜连接;柔性连接件40B与被移动元件30黏胶连接,或者通过有机固化膜连接。The movable end of the piezoelectric driving structure is glued to the flexible connecting member 40B, or connected through an organic curing film; the flexible connecting member 40B is glued to the moved element 30, or connected through an organic curing film.
需要说明的是,在其他实例中,如果压电驱动结构通过柔性连接件驱动被移动部件上下移动,柔性连接件与压电驱动结构连接的部分反复大角度弯折容易产生结构疲劳。本实施例中,压电驱动结构的端部与柔性连接件连接时,端部几乎处于水平的状态,不会对柔性连接件产生弯折,增加柔性连接件的寿命,提高了器件的可靠性。It should be noted that, in other examples, if the piezoelectric driving structure is driven by the flexible connecting member to move the moving part up and down, the part connecting the flexible connecting member and the piezoelectric driving structure may be bent repeatedly at a large angle, which is likely to cause structural fatigue. In this embodiment, when the end of the piezoelectric drive structure is connected to the flexible connector, the end is almost in a horizontal state, which will not bend the flexible connector, increase the life of the flexible connector, and improve the reliability of the device. .
为便于理解柔性连接件40B和限位槽40在连接方式上的区别,图16和图17实例性给出了通过柔性连接件40B连接压电驱动结构的俯视图和剖视图。应当理解,采用柔性连接件40B连接和通过限位槽40连接被移动元件30和压电驱动结构的可动端,除了连接方式不同外,其他电连接关系,支撑块结构分布或者压电驱动器的位置关系等可参照前文,此处不再赘述。To facilitate the understanding of the difference between the flexible connecting member 40B and the limiting groove 40 in the connection mode, FIGS. 16 and 17 exemplarily show a plan view and a cross-sectional view of connecting the piezoelectric driving structure through the flexible connecting member 40B. It should be understood that the flexible connecting piece 40B is used to connect and connect the moved element 30 and the movable end of the piezoelectric drive structure through the limit slot 40. In addition to the different connection methods, other electrical connection relationships, support block structure distribution or piezoelectric actuators For the position relationship, please refer to the previous text, so I won't repeat it here.
请参考图18,当被移动元件30需要连接外部电信号时,如被移动元件30为成像传感元件,支撑块50顶面设置有第一电连接端71,成像传感元件的边缘具有第二电连接端72,第一电连接端71越靠近成像传感元件越好,第一电连接端71和第二电连接端72通过柔性电连接结构73电连接,第一电连接端71可以通过引线与线路板10电连接,以使线路板10为成像传感元件供电或提供信号。18, when the moved element 30 needs to be connected to an external electrical signal, if the moved element 30 is an imaging sensor element, the top surface of the support block 50 is provided with a first electrical connection terminal 71, and the edge of the imaging sensor element has a first electrical connection terminal 71. Two electrical connection ends 72. The closer the first electrical connection end 71 is to the imaging sensor element, the better. The first electrical connection end 71 and the second electrical connection end 72 are electrically connected by the flexible electrical connection structure 73. The first electrical connection end 71 can be It is electrically connected to the circuit board 10 through leads, so that the circuit board 10 supplies power or signals to the imaging sensor element.
进一步,当压电驱动结构的固定端位于支撑块50的顶面时,如图19,第一电连接端71位于压电驱动结构顶面的布线层25中。具体的,压电驱动结构的布线层25中还设置有一互连线75,且两端分别具有露出布线层25的第一电连接端71和第五电连接端74。第一电连接端71相较于第五电连接端74更靠近被移动元件30,第一电连接端71与第二电连接端72通过柔性连接件电73电连接,再通过引线78将第五电连接端74与线路板10电连接,以使线路板10为成像传感元件供电或提供信号。Further, when the fixed end of the piezoelectric driving structure is located on the top surface of the support block 50, as shown in FIG. 19, the first electrical connection terminal 71 is located in the wiring layer 25 on the top surface of the piezoelectric driving structure. Specifically, the wiring layer 25 of the piezoelectric driving structure is further provided with an interconnection line 75, and both ends have a first electrical connection terminal 71 and a fifth electrical connection terminal 74 exposing the wiring layer 25, respectively. The first electrical connection end 71 is closer to the moved component 30 than the fifth electrical connection end 74. The first electrical connection end 71 and the second electrical connection end 72 are electrically connected through a flexible connector 73, and then the first electrical connection end 71 and the second electrical connection end 72 are electrically connected through a lead 78. The five electrical connection terminal 74 is electrically connected to the circuit board 10 so that the circuit board 10 supplies power or signals to the imaging sensor element.
相较于直接利用引线将成像传感元件的第二电连接端72与线路板10电连接的方式来说,本实施例中的柔性连接件73的长度可以较短(第一电连接端71离成像传感元件越近,柔性连接件73的长度越短),并且被移动元件30在上移或下移时,也不会拉扯柔性连接件73。Compared with the method of directly using wires to electrically connect the second electrical connection end 72 of the imaging sensor element to the circuit board 10, the length of the flexible connector 73 in this embodiment can be shorter (the first electrical connection end 71 The closer to the imaging sensor element, the shorter the length of the flexible connecting member 73), and when the moved element 30 moves up or down, the flexible connecting member 73 will not be pulled.
本发明中,第一电连接端71不限于通过引线与线路板10电连接,如图20所示,还可以直接在支撑块50的顶面形成第六电连接端77,第五电连接端74通过引线78与第六电连接端77电连接,支撑块50内还设置有另外的互联结构,该互联结构电连接第六电连接端77及线路板10,从而使得线路板10可以为被移动元件30供电或传输信号。本实施例中的柔性连接件73为柔性互联线,互联结构为导电插塞。In the present invention, the first electrical connection terminal 71 is not limited to being electrically connected to the circuit board 10 through a lead wire. As shown in FIG. 20, a sixth electrical connection terminal 77 and a fifth electrical connection terminal may be directly formed on the top surface of the support block 50. 74 is electrically connected to the sixth electrical connection terminal 77 through the lead 78. Another interconnection structure is also provided in the support block 50. The interconnection structure is electrically connected to the sixth electrical connection terminal 77 and the circuit board 10, so that the circuit board 10 can be The mobile element 30 supplies power or transmits signals. The flexible connector 73 in this embodiment is a flexible interconnection wire, and the interconnection structure is a conductive plug.
本发明中,第六电连接端77也可以通过其他的互联方式电连接线路板10,例如直接利用引线电连接第六电连接端77和线路板10,本发明不作限制。In the present invention, the sixth electrical connection terminal 77 can also be electrically connected to the circuit board 10 through other interconnection methods, for example, the sixth electrical connection terminal 77 and the circuit board 10 are directly electrically connected with a lead wire, which is not limited by the present invention.
如图21所示,被移动元件30为反射镜。As shown in FIG. 21, the moved element 30 is a mirror.
压电驱动结构为一个,一个压电驱动结构的可动端与反射镜的一侧相连,反射镜相对的另一侧与一支撑面转动连接,当压电元件20通电时向上或向下翘曲时,反射镜发生倾斜,实现改变反射角度的目的。There is one piezoelectric drive structure. The movable end of a piezoelectric drive structure is connected to one side of the reflector, and the opposite side of the reflector is rotatably connected to a supporting surface. When the piezoelectric element 20 is energized, it tilts upward or downward. When curved, the mirror is tilted to achieve the purpose of changing the reflection angle.
本发明中,反射镜的一侧不限于设置一个压电驱动结构,也可以设置两个、三个、四个或五个等。In the present invention, one side of the reflector is not limited to one piezoelectric driving structure, and two, three, four, or five can also be provided.
应理解,反射镜不限于仅一侧分布压电驱动结构,还可以在两侧、四侧、周向分布压电驱动结构。It should be understood that the reflector is not limited to the piezoelectric driving structure distributed on only one side, and the piezoelectric driving structure may also be distributed on two sides, four sides, or in the circumferential direction.
需要说明的是,本说明书中的各个实施例均采用相关的方式描述,各个实施例之间相同相似的部分互相参见即可,每个实施例重点说明的都是与其他实施例的不同之处。尤其,对于结构实施例而言,由于其基本相似于方法实施例,所以描述的比较简单,相关之处参见方法实施例的部分说明即可。It should be noted that the various embodiments in this specification are described in a related manner, and the same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on the differences from other embodiments. . In particular, for the structural embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the part of the description of the method embodiment.
上述描述仅是对本发明较佳实施例的描述,并非对本发明范围的任何限定,本发明领域的普通技术人员根据上述揭示内容做的任何变更、修饰,均属于权利要求书的保护范围。The above description is only a description of the preferred embodiments of the present invention and does not limit the scope of the present invention in any way. Any changes or modifications made by a person of ordinary skill in the field of the present invention based on the above disclosure shall fall within the protection scope of the claims.
Claims (20)
- 一种压电驱动结构,其特征在于,包括:A piezoelectric driving structure is characterized in that it comprises:支撑层;Support layer压电元件,粘合于所述支撑层的上表面,所述压电元件在长度方向上由电隔离结构隔离成多个子压电元件,每个所述子压电元件设有独立的电极引出端,对每个所述子压电元件单独通电,所述子压电元件产生伸缩,拉动所述支撑层产生形变;The piezoelectric element is adhered to the upper surface of the support layer. The piezoelectric element is separated into a plurality of sub-piezoelectric elements in the length direction by an electrical isolation structure, and each of the sub-piezoelectric elements is provided with an independent electrode lead At the end, each of the sub-piezoelectric elements is individually energized, the sub-piezoelectric elements are stretched, and the support layer is pulled to produce deformation;对多个所述子压电元件分别通电,所述压电元件能够带动所述支撑层产生多种翘曲变化。The plurality of sub-piezoelectric elements are respectively energized, and the piezoelectric elements can drive the supporting layer to produce various warping changes.
- 根据权利要求1所述的压电驱动结构,其特征在于,所述子压电元件包括:The piezoelectric driving structure according to claim 1, wherein the sub-piezoelectric element comprises:至少一层压电膜,以及位于每层所述压电膜上下表面的电极,相邻两层所述压电膜共用位于两者之间的电极; At least one layer of piezoelectric film, and electrodes on the upper and lower surfaces of each layer of the piezoelectric film, and two adjacent layers of the piezoelectric film share the electrodes between the two;所述电极从下至上依次计数,分为奇数层电极和偶数层电极;The electrodes are counted sequentially from bottom to top, and are divided into odd-numbered layers of electrodes and even-numbered layers of electrodes;第一电极引出端,位于所述压电元件的顶面,与所述偶数电极层电连接;The first electrode lead-out end is located on the top surface of the piezoelectric element and is electrically connected to the even-numbered electrode layer;第二电极引出端,位于所述压电元件的顶面,与所述奇数电极层电连接。The second electrode lead-out end is located on the top surface of the piezoelectric element and is electrically connected to the odd electrode layer.
- 根据权利要求2所述的压电驱动结构,其特征在于,还包括布线层,覆盖所述压电元件的顶面,每个所述子压电元件的第一电极引出端和所述第二电极引出端通过所述布线层设置于所述压电元件的一端。The piezoelectric driving structure according to claim 2, further comprising a wiring layer covering the top surface of the piezoelectric element, and the first electrode lead-out end of each of the sub-piezoelectric elements and the second The electrode lead-out end is provided at one end of the piezoelectric element through the wiring layer.
- 根据权利要求2所述的压电驱动结构,其特征在于,不同所述子压电元件的所述压电膜材料相同或者不同;不同所述子压电元件的所述压电膜厚度相同或者不同。The piezoelectric driving structure according to claim 2, wherein the piezoelectric film materials of the different piezoelectric sub-elements are the same or different; the piezoelectric film thicknesses of the different piezoelectric sub-elements are the same or different.
- 根据权利要求1所述的压电驱动结构,所述电隔离结构包括,设置于相邻所述子压电元件之间的绝缘材料层或空气隙。The piezoelectric driving structure according to claim 1, wherein the electrical isolation structure comprises an insulating material layer or an air gap provided between adjacent sub-piezoelectric elements.
- 一种成像模组,包括权利要求1-5任一项所述的压电驱动结构,所述压电驱动结构包括可动端和固定端,其特征在于,还包括:An imaging module, comprising the piezoelectric driving structure according to any one of claims 1 to 5, the piezoelectric driving structure comprising a movable end and a fixed end, and is characterized in that it further comprises:支撑块,用于支撑固定所述固定端;A supporting block for supporting and fixing the fixed end;被移动元件,与所述可动端连接,所述被移动元件包括透镜组、成像传感元件、光圈、反射镜或透镜片;The moved element is connected to the movable end, and the moved element includes a lens group, an imaging sensor element, an aperture, a mirror or a lens sheet;外部信号连接端,与所述压电驱动结构电连接;The external signal connection terminal is electrically connected to the piezoelectric driving structure;在通电的状态下,所述可动端相对于所述固定端向上或向下移动,以移动所述被移动元件。In the energized state, the movable end moves upward or downward relative to the fixed end to move the moved element.
- 根据权利要求6所述的成像模组,其特征在于,还包括柔性连接件,所述柔性连接件包括第一端和第二端,所述第一端与所述被移动元件连接;所述第二端与所述压电驱动结构的可动端连接。The imaging module according to claim 6, further comprising a flexible connector, the flexible connector comprising a first end and a second end, the first end is connected to the moved element; the The second end is connected to the movable end of the piezoelectric driving structure.
- 8、根据权利要求6所述的成像模组,其特征在于,还包括限位槽,设置于所述被移动元件的表面,所述压电驱动结构的可动端置于所述限位槽内。8. The imaging module according to claim 6, further comprising a limiting groove disposed on the surface of the moved element, and the movable end of the piezoelectric driving structure is placed in the limiting groove Inside.
- 根据权利要求8所述的成像模组,其特征在于,所述限位槽由至少一个膜层围绕而成;8. The imaging module of claim 8, wherein the limiting groove is surrounded by at least one film layer;或者,所述限位槽由至少一个膜层及所述被移动元件的表面围绕而成;Or, the limiting groove is surrounded by at least one film layer and the surface of the moving element;或者,所述限位槽由所述被移动元件的侧表面向内凹陷而成。Alternatively, the limiting groove is formed by recessing the side surface of the moved element inward.
- 根据权利要求8所述的成像模组,其特征在于,所述膜层分布于所述被移动元件的边缘;8. The imaging module of claim 8, wherein the film layer is distributed on the edge of the moved element;或者,所述膜层分布于所述被移动元件的整个表面上。Alternatively, the film layer is distributed on the entire surface of the moved element.
- 如权利要求9或10所述的成像模组,其特征在于,所述被移动元件的表面上设置有由上至下依次堆叠的第一膜层、第二膜层和第三膜层,所述第一膜层、第三膜层的两侧相对所述第二膜层向外伸出以形成伸出部,所述伸出部与所述第二膜层的端部围成所述限位槽。The imaging module of claim 9 or 10, wherein the surface of the moved element is provided with a first film layer, a second film layer, and a third film layer stacked sequentially from top to bottom. The two sides of the first film layer and the third film layer protrude outward relative to the second film layer to form a protruding portion, and the protruding portion and the end of the second film layer enclose the limit Bit slot.
- 根据权利要求6所述的成像模组,其特征在于,所述压电驱动结构至少包括一对,每对所述压电驱动结构对称分布于所述被移动元件周边。8. The imaging module of claim 6, wherein the piezoelectric driving structure comprises at least one pair, and each pair of the piezoelectric driving structure is symmetrically distributed around the moved element.
- 根据权利要求12所述的成像模组,其特征在于,每对所述压电驱动结构均连接于所述被移动元件的上表面或下表面;The imaging module of claim 12, wherein each pair of the piezoelectric driving structure is connected to the upper surface or the lower surface of the moved element;或者,每对所述压电驱动结构中的一个连接于所述被移动元件的上表面,另一个连接于所述被移动元件的下表面。Alternatively, one of the piezoelectric driving structures of each pair is connected to the upper surface of the moved element, and the other is connected to the lower surface of the moved element.
- 根据权利要求6所述的成像模组,其特征在于,所述压电驱动结构至少为一对,所述压电驱动结构位于所述被移动元件下方空间。7. The imaging module of claim 6, wherein the piezoelectric driving structure is at least a pair, and the piezoelectric driving structure is located in a space below the moved element.
- 15、根据权利要求6所述的成像模组,其特征在于,成对的两个所述压电驱动结构彼此分布在被移动元件中心两侧;15. The imaging module of claim 6, wherein the two piezoelectric driving structures in a pair are distributed on both sides of the center of the moved element;或者,成对的两个压电驱动结构交叠设置。Or, the two piezoelectric driving structures in a pair are overlapped.
- 根据权利要求14所述的成像模组,其特征在于,所述支撑块与所述压电驱动结构的固定位置位于所述被移动元件下方空间,或者位于外侧。The imaging module according to claim 14, wherein the fixed position of the support block and the piezoelectric driving structure is located in a space below the moved element, or located outside.
- 根据权利要求6所述的成像模组,其特征在于,所述被移动元件包括反射镜;所述压电元件分布在所述反射镜的一侧,所述反射镜相对的另一侧与一支撑面转动连接。The imaging module of claim 6, wherein the moved element comprises a reflector; the piezoelectric element is distributed on one side of the reflector, and the opposite side of the reflector is connected to a mirror. The supporting surface is connected by rotation.
- 根据权利要求6所述的成像模组,其特征在于,所述支撑块为环形,环形中间围成空间,所述被移动元件悬挂于所述空间上方;The imaging module according to claim 6, wherein the supporting block has a ring shape, a space is enclosed in the center of the ring shape, and the moved element is suspended above the space;或者,所述支撑块包括沿周向分布的多个子支撑块,所述多个子支撑块相互间隔或接触。Alternatively, the support block includes a plurality of sub-support blocks distributed along a circumferential direction, and the plurality of sub-support blocks are spaced apart or in contact with each other.
- 根据权利要求6所述的成像模组,其特征在于,所述压电驱动结构整***于所述支撑块上,或者,所述压电驱动结构的可动端伸出所述支撑块。7. The imaging module of claim 6, wherein the piezoelectric driving structure is entirely located on the supporting block, or the movable end of the piezoelectric driving structure extends out of the supporting block.
- 根据权利要求6所述的成像模组,其特征在于,所述压电驱动结构位于所述支撑块的顶面,或者所述支撑块包括从下至上依次堆叠的第一层支撑块、第二层支撑块,所述压电驱动结构的固定端固定于所述第一层支撑块、第二层支撑块之间。The imaging module according to claim 6, wherein the piezoelectric driving structure is located on the top surface of the supporting block, or the supporting block comprises a first layer of supporting blocks and a second layer of supporting blocks that are sequentially stacked from bottom to top. Layer support block, the fixed end of the piezoelectric drive structure is fixed between the first layer support block and the second layer support block.To
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