WO2021131175A1 - Cooling structure and heatsink - Google Patents

Cooling structure and heatsink Download PDF

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Publication number
WO2021131175A1
WO2021131175A1 PCT/JP2020/034119 JP2020034119W WO2021131175A1 WO 2021131175 A1 WO2021131175 A1 WO 2021131175A1 JP 2020034119 W JP2020034119 W JP 2020034119W WO 2021131175 A1 WO2021131175 A1 WO 2021131175A1
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Prior art keywords
cooling
refrigerant
path
heat sink
flow
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PCT/JP2020/034119
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French (fr)
Japanese (ja)
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佑介 上高
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株式会社明電舎
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Priority to CN202080090152.9A priority Critical patent/CN115004362B/en
Publication of WO2021131175A1 publication Critical patent/WO2021131175A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a heat sink cooling structure.
  • the heat sinks shown in Patent Documents 1 to 3 are applied to cool an element having a high heat generation, which is exemplified by a power semiconductor module or the like.
  • a large number of fins are arranged in the inflow path of the refrigerant in order to minimize the pressure loss of the refrigerant, increase the heat dissipation effect, and further minimize the temperature deviation on the entire surface of the element.
  • the fins are closely arranged in the direction of the refrigerant discharge portion. Further, by increasing the contact surface area with the refrigerant from the inflow side to the discharge side of the refrigerant, the flow pressure loss of the refrigerant can be reduced.
  • pin-shaped fins having a small fluid resistance are arranged in a region requiring high cooling performance in order to suppress an increase in pressure loss in the same heat sink. Then, by arranging fins having a shape in which a plurality of meandering grooves are arranged in parallel in a region where relatively low cooling performance is acceptable, an increase in pressure loss can be suppressed.
  • a plurality of pin-shaped fins are erected on the base surface opposite to the heating element, and these fins are housed in a water jacket.
  • the flow resistance is adjusted by partially densely arranging the plurality of fins on the base surface.
  • the heat sink of Patent Document 1 is effective when the calorific value of a plurality of elements arranged in the same heat sink is different, but if the calorific values of the arranged elements are the same, a temperature imbalance occurs and it is effective. I can't say. Further, when the water channels are formed in parallel in the heat sink, it is necessary to provide a water channel wall between the water channels in order to secure the balance of the flow, which causes an increase in pressure loss.
  • the heat sink of Patent Document 2 is formed with a flow path that meanders the flow of the refrigerant, but when the flow rate increases, the pressure loss increases at a considerable rate as compared with the pin-shaped fin structure. Moreover, even if the size is reduced, the cooling efficiency of the pressure loss is lowered.
  • the present invention aims to reduce the pressure loss and reduce the size of the cooling structure of the heat sink to which a plurality of heating elements are attached, while efficiently and uniformly cooling the whole with a fin structure having a simple processing. Make it an issue.
  • one aspect of the present invention has a cooling main body portion to which a plurality of heating elements are mounted in parallel, and the cooling main body portion has an inflow path for a refrigerant and a flow of the refrigerant provided from the inflow path.
  • a path and an outflow path of the refrigerant provided from the flow path are formed, the flow path is formed corresponding to an attachment portion of the heating element, and a plurality of fin portions are formed on one surface of the flow path. Is a densely erected cooling structure.
  • the flow passage is provided with a partition at a portion corresponding to the parallel heating elements.
  • the plurality of fin portions facing the inflow path and the outflow path are formed to have a smaller diameter than the other plurality of fin portions. Has been done.
  • the plurality of fin portions form a cylinder.
  • the plurality of fin portions form a prism, and one corner of the prism faces the flow of the refrigerant.
  • the cooling main body portion has a long plate shape, and the inflow path is formed along one longitudinal end portion of the cooling main body portion, and the outflow.
  • the path is formed along the other longitudinal end of the cooling body, and the outlet of the refrigerant communicating with the outflow path cools the inlet of the refrigerant communicating with the inflow path. It is formed at a diagonal position of the main body.
  • Another aspect of the present invention is a heat sink having any of the above cooling structures.
  • the cooling structure of the heat sink it is possible to reduce the pressure loss and reduce the size while efficiently and uniformly cooling the whole with the fin portion structure having a simple processing.
  • a plurality of elements 2 are attached as a heating element to the heat sink 1 having the cooling structure which is one aspect of the present invention shown in FIG.
  • Examples of the element 2 include a power semiconductor module. Although four elements 2 are attached in this embodiment, the number of heating elements according to the present invention is not limited to the number in this embodiment.
  • the heat sink 1 has a cooling main body 10 to which four elements 2 are mounted in parallel.
  • the cooling main body 10 forms a rectangular parallelepiped in the shape of a long plate, and is made of a steel material having a relatively high thermal conductivity, which is exemplified by an aluminum alloy. Then, an inflow passage 11, a flow passage 12, and an outflow passage 13 are formed inside the cooling main body 10.
  • a refrigerant for example, cooling water
  • the inflow path 11 is formed along the longitudinal direction of the cooling main body 10, that is, along one longitudinal end.
  • the communication surface 111 between the inner surface of the inflow path 11 and the inner surface of the flow passage 12 on the most upstream side forms a curved surface.
  • the communication surface 112 between the inner surface of the inflow path 11 and the inner surface of the flow passage 12 on the most downstream side also forms a curved surface.
  • the refrigerant supplied from the inflow passage 11 flows through the flow passage 12.
  • the flow passage 12 is formed corresponding to the attachment portion of each element 2.
  • a plurality of fin portions 14 are densely erected on one surface of the flow passage 12.
  • the fin portion 14 forms a cylinder.
  • the flow passage 12 is provided with a partition 15 at a portion corresponding to the parallel elements 2.
  • the downstream side corner portion 151 of the end portion of the partition 15 facing the inflow path 11 forms a curved surface.
  • the upstream side corner portion 152 of the end portion of the partition 15 facing the outflow path 13 also forms a curved surface.
  • curved convex portions 153 are provided on the upstream and downstream side surfaces of the partition 15 along the flow direction of the refrigerant. Further, on the inner side surfaces of the flow passages 12 on the most upstream side and the most downstream side, curved surface convex portions 121 having the same shape as the curved surface convex portions 153 are provided along the same direction.
  • the refrigerant supplied from the flow passage 12 flows through the outflow passage 13.
  • the refrigerant flows out from the outlet 18 at the downstream end of the cooling main body 10.
  • the outflow passage 13 is formed so as to face the inflow passage 11 along the longitudinal direction of the cooling main body 10, that is, along the other longitudinal end portion.
  • the outflow port 18 communicating with the outflow passage 13 is formed at a diagonal position of the cooling main body 10 with respect to the inflow port 17 communicating with the inflow passage 11.
  • the communication surface 131 between the inner surface of the outflow passage 13 and the inner surface of the flow passage 12 on the most upstream side forms a curved surface.
  • the communication surface 132 between the inner surface of the outflow passage 13 and the inner surface of the flow passage 12 on the most downstream side also forms a curved surface.
  • the refrigerant in the cooling main body 10, the refrigerant is supplied in parallel corresponding to the attachment portion of the element 2, so that the refrigerant is evenly distributed to the flow passage 12 corresponding to the position of each element 2. Since it is supplied, the pressure loss can be reduced.
  • V Pipe flow velocity [m / s]
  • L Pipe length [m]
  • d Pipe inner diameter [m]
  • hb (0.131 + (0.1632 ⁇ (d / r) ⁇ (7/2))) ⁇ (( ⁇ / 90) ⁇ (1/2)) ⁇ (V ⁇ 2/2 g).
  • r radius of curvature [mm]
  • ⁇ Path angle [°]
  • the heat sink 1 of the present embodiment it is possible to reduce the pressure loss while efficiently and uniformly cooling the whole with a fin structure having a simple processing.
  • the plurality of elements 2 can be cooled by a single heat sink 1, miniaturization can be achieved.
  • the communication surfaces 111 and 112 between the inflow passage 11 and the flow passage 12 form a curved surface, the pressure loss on the most upstream side and the most downstream side of the inflow passage 11 is reduced, and the inflow passage 11 to the most upstream side and The guidance of the refrigerant to the flow passage 12 on the most downstream side becomes smooth.
  • the communication surfaces 131 and 132 between the flow passage 12 and the outflow passage 13 form a curved surface, the pressure loss on the most upstream side and the most downstream side of the outflow passage 13 is reduced, and the upstream side and the most downstream side flow passages. The guidance of the refrigerant from 12 to the outflow passage 13 becomes smooth.
  • the partition 15 in the cooling main body 10 the refrigerant introduced into the inflow passage 11 is guided to the individual flow passages 12.
  • the downstream corner portion 151 of the partition 15 forms a curved surface
  • the pressure loss at the end of the partition 15 facing the inflow path 11 is reduced, and the refrigerant is more smoothly guided to the flow passage 12.
  • the upstream side corner portion 152 of the partition 15 also forms a curved surface, the pressure loss at the end portion of the partition 15 facing the outflow path 13 is reduced, and the flow of the refrigerant becomes smoother.
  • the concentration of the flux on the side surface of the partition 15 is suppressed, and the heat conduction of the heat sink 1 to the element 2 is enhanced, so that the cooling effect of the heat sink 1 is improved. ..
  • the fin portion 14 forms a cylinder, the pressure loss caused by the fin portion 14 can be minimized.
  • the heat sink 1 shown in FIG. 2 has the same embodiment as the heat sink 1 of the first embodiment except that the partition 15 is not provided. In the space having no partition 15, fin portions 14 are added at the same pitch as the fin portions 14 of the first embodiment.
  • the heat sink 1 of the present embodiment in addition to the effect of the heat sink 1 of the first embodiment, the obstacle of the flow of the refrigerant is eliminated and the pressure loss is improved. Further, by adding the fin portion 14, the contact surface area between the inner surface of the cooling main body portion 10 and the refrigerant is expanded, and the cooling performance of the heat sink 1 can be improved.
  • the plurality of fin portions 14 surrounded by the broken lines BL facing the inflow path 11 and the outflow path 13 are larger than the other plurality of fin portions 14. It has the same aspect as the heat sink 1 of the second embodiment except that it is formed to have a small diameter. For example, when the diameter of the other plurality of fin portions 14 is ⁇ 2, the diameter of the plurality of facing fin portions 14 is set to ⁇ 1.5.
  • the resistance on the inflow side and the outflow side of the flow passage 12 can be reduced, and in addition to the effects of the first embodiment and the second embodiment, the pressure loss can be further reduced.
  • the heat sink 1 shown in FIG. 4A has the same embodiment as the heat sink 1 of the second embodiment except that the fin portion 16 is provided instead of the fin portion 14.
  • the fin portion 16 forms a prism, for example, a prism having a square cross section with an aspect ratio of 2 ⁇ 2.
  • One corner portion 161 of the fin portion 16 is arranged so as to face the flow F of the refrigerant (FIG. (B)).
  • the heat sink 1 of the present embodiment since one corner portion 161 of the fin portion 16 faces the flow F of the refrigerant, in addition to the effects of the first embodiment and the second embodiment, the refrigerant and the fin portion Turbulence due to contact with 14 is suppressed, and pressure loss is further reduced.
  • a quadrangular prism having a rhombic cross section is exemplified.
  • the pressure loss can be reduced by arranging the quadrangular prism so that the longer diagonal line of the rhombus follows the flow.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heatsink 1 comprises a cooling body unit 10 to which a plurality of elements 2 are mounted in parallel. In the cooling body unit 10, a refrigerant inflow path 11, circulating paths 12 for the refrigerant supplied from the inflow path 11, and an outflow path 13 for the refrigerant supplied from the circulating paths 12 are formed. The circulating paths 12 are formed in correspondence to the location at which the elements 2 are mounted. A plurality of fins 14 densely rise from one surface of the circulating paths 12.

Description

冷却構造及びヒートシンクCooling structure and heat sink
　本発明は、ヒートシンクの冷却構造に関する。 The present invention relates to a heat sink cooling structure.
　パワー半導体モジュール等に例示される発熱が高い素子を冷却するために例えば特許文献１～３に示されたヒートシンクが適用される。 For example, the heat sinks shown in Patent Documents 1 to 3 are applied to cool an element having a high heat generation, which is exemplified by a power semiconductor module or the like.
　特許文献１のヒートシンクは、冷媒の圧力損失の最小化、放熱効果の増加、さらには、前記素子の全体表面における温度偏差の最小化を図るため、冷媒の流入路にフィンが多数配列される。特に、前記フィンは冷媒の排出部の方向に密に配列される。また、冷媒との接触表面積が当該冷媒の流入側から排出側につれて増大させることで、当該冷媒の流れ圧力損失の減少が図れる。 In the heat sink of Patent Document 1, a large number of fins are arranged in the inflow path of the refrigerant in order to minimize the pressure loss of the refrigerant, increase the heat dissipation effect, and further minimize the temperature deviation on the entire surface of the element. In particular, the fins are closely arranged in the direction of the refrigerant discharge portion. Further, by increasing the contact surface area with the refrigerant from the inflow side to the discharge side of the refrigerant, the flow pressure loss of the refrigerant can be reduced.
　特許文献２のヒートシンクは、同一ヒートシンクでの圧力損失の増加を抑制するために、高冷却性能を必要とする領域に流体抵抗の小さなピン状のフィンが配置される。そして、比較的に低冷却性能でもよい領域には、蛇行した溝を複数並列させた形状を成すフィンが配置されることで、圧力損失の増大の抑制が図られる。 In the heat sink of Patent Document 2, pin-shaped fins having a small fluid resistance are arranged in a region requiring high cooling performance in order to suppress an increase in pressure loss in the same heat sink. Then, by arranging fins having a shape in which a plurality of meandering grooves are arranged in parallel in a region where relatively low cooling performance is acceptable, an increase in pressure loss can be suppressed.
　特許文献３のヒートシンクは、発熱体と反対するベース面に複数のピン状のフィンが立設され、これらのフィンはウォータージャケットに収容される。特に、前記複数のフィンが前記ベース面において部分的に密に配置されることで流動抵抗が調整される。 In the heat sink of Patent Document 3, a plurality of pin-shaped fins are erected on the base surface opposite to the heating element, and these fins are housed in a water jacket. In particular, the flow resistance is adjusted by partially densely arranging the plurality of fins on the base surface.
特開２０１３－９８５３０号公報Japanese Unexamined Patent Publication No. 2013-98530 特開２０１８－１２０９０４号公報JP-A-2018-120904 特開２０１５－２２６０３９号公報Japanese Unexamined Patent Publication No. 2015-226039
　特許文献１のヒートシンクは、同一のヒートシンクに配置される複数の素子の発熱量が個々に異なれば有効だが、配置される素子の発熱量が同じであれば温度のアンバランスが生じ、有効とはいえない。また、このヒートシンク内に水路が並列に形成された場合、流れのバランスを確保するため、各水路間に水路壁を設ける必要があり、これが圧力損失の増大を招く。 The heat sink of Patent Document 1 is effective when the calorific value of a plurality of elements arranged in the same heat sink is different, but if the calorific values of the arranged elements are the same, a temperature imbalance occurs and it is effective. I can't say. Further, when the water channels are formed in parallel in the heat sink, it is necessary to provide a water channel wall between the water channels in order to secure the balance of the flow, which causes an increase in pressure loss.
　特許文献２のヒートシンクは、冷媒の流れを蛇行させる流路が形成されているが、流量が増えると、圧力損失がピン状のフィン構造に比べかなりの割合で増大する。また、小型化しても圧力損失の冷却効率が低下する。 The heat sink of Patent Document 2 is formed with a flow path that meanders the flow of the refrigerant, but when the flow rate increases, the pressure loss increases at a considerable rate as compared with the pin-shaped fin structure. Moreover, even if the size is reduced, the cooling efficiency of the pressure loss is lowered.
　また、特許文献１～３のヒートシンクは、装置構成の制約等により冷媒の流入口と流出口とが冷却本体部において対角の位置で設けられた場合、冷却本体部におけるフィンの配置が一定でないので、冷媒の流れに偏りが生じる。 Further, in the heat sinks of Patent Documents 1 to 3, when the inlet and outlet of the refrigerant are provided at diagonal positions in the cooling main body due to restrictions on the device configuration, the arrangement of fins in the cooling main body is not constant. Therefore, the flow of the refrigerant is biased.
　本発明は、以上の事情を鑑み、複数の発熱体が取り付けられるヒートシンクの冷却構造において、加工が単純なフィン構造で全体を効率よく均一に冷却しつつ圧力損失の低減と小型化を図ることを課題とする。 In view of the above circumstances, the present invention aims to reduce the pressure loss and reduce the size of the cooling structure of the heat sink to which a plurality of heating elements are attached, while efficiently and uniformly cooling the whole with a fin structure having a simple processing. Make it an issue.
　そこで、本発明の一態様は、複数の発熱体が並列して取り付けられる冷却本体部を有し、この冷却本体部には、冷媒の流入路と、この流入路から供された前記冷媒の流通路と、この流通路から供された前記冷媒の流出路とが形成され、前記流通路は、前記発熱体の取り付け部位に対応して形成され、前記流通路の一面には、複数のフィン部が密に立設された冷却構造である。 Therefore, one aspect of the present invention has a cooling main body portion to which a plurality of heating elements are mounted in parallel, and the cooling main body portion has an inflow path for a refrigerant and a flow of the refrigerant provided from the inflow path. A path and an outflow path of the refrigerant provided from the flow path are formed, the flow path is formed corresponding to an attachment portion of the heating element, and a plurality of fin portions are formed on one surface of the flow path. Is a densely erected cooling structure.
　本発明の他の態様は、前記冷却構造において、前記流通路には、並列した前記発熱体の間に対応した部位に仕切りが設けられている。 In another aspect of the present invention, in the cooling structure, the flow passage is provided with a partition at a portion corresponding to the parallel heating elements.
　本発明の他の態様は、前記冷却構造において、前記複数のフィン部のうち、前記流入路及び前記流出路に面した複数の前記フィン部は、他の複数の前記フィン部よりも小径に形成されている。 In another aspect of the present invention, in the cooling structure, among the plurality of fin portions, the plurality of fin portions facing the inflow path and the outflow path are formed to have a smaller diameter than the other plurality of fin portions. Has been done.
　本発明の他の態様は、前記冷却構造において、前記複数のフィン部は円柱を成す。 In another aspect of the present invention, in the cooling structure, the plurality of fin portions form a cylinder.
　本発明の他の態様は、前記冷却構造において、前記複数のフィン部は角柱を成し、この角柱の一つの角部は前記冷媒の流れと対向する。 In another aspect of the present invention, in the cooling structure, the plurality of fin portions form a prism, and one corner of the prism faces the flow of the refrigerant.
　本発明の他の態様は、前記冷却構造において、前記冷却本体部は、長板状を成し、前記流入路は、前記冷却本体部の一方の長手方向端部に沿って形成され、前記流出路は、前記冷却本体部の他方の長手方向端部に沿って形成され、前記流出路に連通する前記冷媒の流出口は、前記流入路に連通する前記冷媒の流入口に対して、前記冷却本体部の対角位置に形成されている。 In another aspect of the present invention, in the cooling structure, the cooling main body portion has a long plate shape, and the inflow path is formed along one longitudinal end portion of the cooling main body portion, and the outflow. The path is formed along the other longitudinal end of the cooling body, and the outlet of the refrigerant communicating with the outflow path cools the inlet of the refrigerant communicating with the inflow path. It is formed at a diagonal position of the main body.
　本発明の他の態様は、前記いずれかの冷却構造を有するヒートシンクである。 Another aspect of the present invention is a heat sink having any of the above cooling structures.
　以上の本発明によれば、ヒートシンクの冷却構造において、加工が単純なフィン部構造で全体を効率よく均一に冷却しつつ圧力損失の低減と小型化を図ることできる。 According to the above invention, in the cooling structure of the heat sink, it is possible to reduce the pressure loss and reduce the size while efficiently and uniformly cooling the whole with the fin portion structure having a simple processing.
本発明の第一実施形態におけるヒートシンクの内部構成を示した平面図。The plan view which showed the internal structure of the heat sink in 1st Embodiment of this invention. 本発明の第二実施形態におけるヒートシンクの内部構成を示した平面図。The plan view which showed the internal structure of the heat sink in the 2nd Embodiment of this invention. 本発明の第三実施形態におけるヒートシンクの内部構成を示した平面図。The plan view which showed the internal structure of the heat sink in the 3rd Embodiment of this invention. （ａ）は本発明の第四実施形態におけるヒートシンクの内部構成を示した平面図、（ｂ）は当該実施形態のフィン部の平面図。(A) is a plan view showing the internal configuration of the heat sink according to the fourth embodiment of the present invention, and (b) is a plan view of the fin portion of the embodiment.
　以下に図面を参照しながら本発明の実施形態について説明する。 An embodiment of the present invention will be described below with reference to the drawings.
　［第一実施形態］
　図１に示された本発明の一態様である冷却構造を有するヒートシンク１は、発熱体として複数の素子２が取り付けられる。素子２としては例えばパワー半導体モジュールが挙げられる。尚、本態様は４つの素子２が取り付けられているが、本発明に係る発熱体の個数は本態様の個数に限定されるものではない。 [First Embodiment]
A plurality of elements 2 are attached as a heating element to the heat sink 1 having the cooling structure which is one aspect of the present invention shown in FIG. Examples of the element 2 include a power semiconductor module. Although four elements 2 are attached in this embodiment, the number of heating elements according to the present invention is not limited to the number in this embodiment.
　ヒートシンク１は４つの素子２が並列して取り付けられる冷却本体部１０を有する。冷却本体部１０は、長板状の直方体を成し、アルミニウム合金に例示される比較的に熱伝導性の高い鋼材から成る。そして、この冷却本体部１０の内部には、流入路１１、流通路１２及び流出路１３が形成される。 The heat sink 1 has a cooling main body 10 to which four elements 2 are mounted in parallel. The cooling main body 10 forms a rectangular parallelepiped in the shape of a long plate, and is made of a steel material having a relatively high thermal conductivity, which is exemplified by an aluminum alloy. Then, an inflow passage 11, a flow passage 12, and an outflow passage 13 are formed inside the cooling main body 10.
　流入路１１は、冷却本体部１０の上流側端部の流入口１７から流入した冷媒（例えば冷却水）が流通する。流入路１１は、冷却本体部１０の長手方向、すなわち、一方の長手方向端部に沿って形成される。流入路１１の内側面と最上流側の流通路１２の内側面との連通面１１１は、曲面を成す。同様に、流入路１１の内側面と最下流側の流通路１２の内側面との連通面１１２も、曲面を成す。 A refrigerant (for example, cooling water) that has flowed in from the inflow port 17 at the upstream end of the cooling main body 10 flows through the inflow path 11. The inflow path 11 is formed along the longitudinal direction of the cooling main body 10, that is, along one longitudinal end. The communication surface 111 between the inner surface of the inflow path 11 and the inner surface of the flow passage 12 on the most upstream side forms a curved surface. Similarly, the communication surface 112 between the inner surface of the inflow path 11 and the inner surface of the flow passage 12 on the most downstream side also forms a curved surface.
　流通路１２は、流入路１１から供された前記冷媒が流通する。流通路１２は、個々の素子２の取り付け部位に対応して形成される。流通路１２の一面には、複数のフィン部１４が密に立設されている。フィン部１４は円柱を成す。このフィン部１４は、例えば、「冷媒の流れ方向に垂直な間隔×当該流れ方向の間隔＝３×２」のピッチで前記冷媒の流れ方向に密に配置される。 The refrigerant supplied from the inflow passage 11 flows through the flow passage 12. The flow passage 12 is formed corresponding to the attachment portion of each element 2. A plurality of fin portions 14 are densely erected on one surface of the flow passage 12. The fin portion 14 forms a cylinder. The fin portions 14 are densely arranged in the flow direction of the refrigerant at a pitch of, for example, "interval perpendicular to the flow direction of the refrigerant x interval in the flow direction = 3 x 2".
　流通路１２には、並列した素子２の間に対応した部位に仕切り１５が設けられる。仕切り１５の流入路１１に面する端部の下流側角部１５１は、曲面を成す。一方、仕切り１５の流出路１３に面する端部の上流側角部１５２も、曲面を成す。さらに、この仕切り１５の上流側及び下流側の側面には、曲面凸部１５３が冷媒の流れ方向に沿って設けられる。そして、最上流側及び最下流側の流通路１２の内側面においても、曲面凸部１５３と同形の曲面凸部１２１が同方向に沿って設けられる。 The flow passage 12 is provided with a partition 15 at a portion corresponding to the parallel elements 2. The downstream side corner portion 151 of the end portion of the partition 15 facing the inflow path 11 forms a curved surface. On the other hand, the upstream side corner portion 152 of the end portion of the partition 15 facing the outflow path 13 also forms a curved surface. Further, curved convex portions 153 are provided on the upstream and downstream side surfaces of the partition 15 along the flow direction of the refrigerant. Further, on the inner side surfaces of the flow passages 12 on the most upstream side and the most downstream side, curved surface convex portions 121 having the same shape as the curved surface convex portions 153 are provided along the same direction.
　流出路１３は、流通路１２から供された前記冷媒が流通する。前記冷媒は、冷却本体部１０の下流側端部の流出口１８から流出する。流出路１３は、流入路１１と対向して、冷却本体部１０の長手方向、すなわち、他方の長手方向端部に沿って形成される。流出路１３と連通する流出口１８は、流入路１１と連通する流入口１７に対して、冷却本体部１０の対角位置に形成される。 The refrigerant supplied from the flow passage 12 flows through the outflow passage 13. The refrigerant flows out from the outlet 18 at the downstream end of the cooling main body 10. The outflow passage 13 is formed so as to face the inflow passage 11 along the longitudinal direction of the cooling main body 10, that is, along the other longitudinal end portion. The outflow port 18 communicating with the outflow passage 13 is formed at a diagonal position of the cooling main body 10 with respect to the inflow port 17 communicating with the inflow passage 11.
　また、流出路１３の内側面と最上流側の流通路１２の内側面との連通面１３１は、曲面を成す。同様に、流出路１３の内側面と最下流側の流通路１２の内側面との連通面１３２も、曲面を成す。 Further, the communication surface 131 between the inner surface of the outflow passage 13 and the inner surface of the flow passage 12 on the most upstream side forms a curved surface. Similarly, the communication surface 132 between the inner surface of the outflow passage 13 and the inner surface of the flow passage 12 on the most downstream side also forms a curved surface.
　以上のヒートシンク１によれば、冷却本体部１０において、素子２の取り付け部位に対応して冷媒が並列に供給されることで、個々の素子２の位置に対応した流通路１２に冷媒が均等に供給されるので、圧力損失の低減が図られる。 According to the above heat sink 1, in the cooling main body 10, the refrigerant is supplied in parallel corresponding to the attachment portion of the element 2, so that the refrigerant is evenly distributed to the flow passage 12 corresponding to the position of each element 2. Since it is supplied, the pressure loss can be reduced.
　一般的に配管に流れる圧力損失の計算式は以下に示される。
Ｐ＝ρ×ｇ×ｈ［Ｐａ］
ρ：流体密度［ｋｇ／ｍ3］
ｇ：重力加速度［ｍ／ｓ2］
ｈ：損失水頭（＝ｈｆ×ｈｂ）［ｍ］
ｈｆ：摩擦損失水頭［ｍ］
ｈｂ：曲り損失水頭［ｍ］
但し、ｈｆ＝４ｆ×（Ｖ＾２／２ｇ）×（Ｌ／ｄ）である（ファニングの式）。
Ｖ：管路流速［ｍ／ｓ］
Ｌ：管長さ［ｍ］
ｄ：管内径［ｍ］
また、ｈｂ＝（０．１３１＋（０．１６３２×（ｄ／ｒ）＾（７／２）））×（（θ／９０）＾（１／２））×（Ｖ＾２／２ｇ）である（非特許文献１）。
ｒ：曲率半径［ｍｍ］
θ：経路角度［°］
　以上の計算式により、流速の二乗に比例して圧力損失が増大するので、並列分岐した冷媒が合流する流入路１１及び流出路１３の径を最大限に設定し、フィン部１４を上述のように密に配置することで、ヒートシンク１の全体的な圧力損失の低減が図られる。 The formula for calculating the pressure loss that generally flows through a pipe is shown below.
P = ρ × g × h [Pa]
ρ: Fluid density [kg / m 3 ]
g: Gravity acceleration [m / s 2 ]
h: Head loss (= hf × hb) [m]
hf: Friction loss head [m]
hb: Bending loss head [m]
However, hf = 4f × (V ^ 2 / 2g) × (L / d) (Fanning's formula).
V: Pipe flow velocity [m / s]
L: Pipe length [m]
d: Pipe inner diameter [m]
Further, hb = (0.131 + (0.1632 × (d / r) ^ (7/2))) × ((θ / 90) ^ (1/2)) × (V ^ 2/2 g). (Non-Patent Document 1).
r: radius of curvature [mm]
θ: Path angle [°]
According to the above formula, the pressure loss increases in proportion to the square of the flow velocity. Therefore, the diameters of the inflow path 11 and the outflow path 13 where the parallel-branched refrigerants merge are set to the maximum, and the fin portion 14 is set as described above. By arranging them densely, the overall pressure loss of the heat sink 1 can be reduced.
　したがって、本実施形態のヒートシンク１によれば、加工が単純なフィン構造で全体を効率よく均一に冷却しつつ圧力損失を低減することができる。特に、単一のヒートシンク１で複数の素子２を冷却できるため、小型化も図ることができる。 Therefore, according to the heat sink 1 of the present embodiment, it is possible to reduce the pressure loss while efficiently and uniformly cooling the whole with a fin structure having a simple processing. In particular, since the plurality of elements 2 can be cooled by a single heat sink 1, miniaturization can be achieved.
　また、流入路１１と流通路１２との連通面１１１，１１２が曲面を成すことで、流入路１１の最上流側及び最下流側での圧力損失が低減し、流入路１１から最上流側及び最下流側の流通路１２への冷媒の案内が円滑なものとなる。さらに、流通路１２と流出路１３との連通面１３１，１３２が曲面を成すことで、流出路１３の最上流及び最下流側での圧力損失が低減し、上流側及び最下流側の流通路１２から流出路１３への冷媒の案内が円滑なものとなる。 Further, since the communication surfaces 111 and 112 between the inflow passage 11 and the flow passage 12 form a curved surface, the pressure loss on the most upstream side and the most downstream side of the inflow passage 11 is reduced, and the inflow passage 11 to the most upstream side and The guidance of the refrigerant to the flow passage 12 on the most downstream side becomes smooth. Further, since the communication surfaces 131 and 132 between the flow passage 12 and the outflow passage 13 form a curved surface, the pressure loss on the most upstream side and the most downstream side of the outflow passage 13 is reduced, and the upstream side and the most downstream side flow passages. The guidance of the refrigerant from 12 to the outflow passage 13 becomes smooth.
　そして、冷却本体部１０に仕切り１５が設けられることで、流入路１１に導入された冷媒が個々の流通路１２に案内される。特に、仕切り１５の下流側角部１５１が曲面を成すことで、流入路１１に面する仕切り１５の端部での圧力損失が低減し、前記冷媒はさらに円滑に流通路１２に案内される。また、仕切り１５の上流側角部１５２も曲面を成すことで、流出路１３に面する仕切り１５の端部での圧力損失が低減し、前記冷媒の流れがさらに円滑なものとなる。 Then, by providing the partition 15 in the cooling main body 10, the refrigerant introduced into the inflow passage 11 is guided to the individual flow passages 12. In particular, since the downstream corner portion 151 of the partition 15 forms a curved surface, the pressure loss at the end of the partition 15 facing the inflow path 11 is reduced, and the refrigerant is more smoothly guided to the flow passage 12. Further, since the upstream side corner portion 152 of the partition 15 also forms a curved surface, the pressure loss at the end portion of the partition 15 facing the outflow path 13 is reduced, and the flow of the refrigerant becomes smoother.
　さらに、仕切り１５の側面に曲面凸部１５３が設けられることで、仕切り１５の側面に対する流束の集中が抑制され、素子２に対するヒートシンク１の熱伝導が高まるので、ヒートシンク１の冷却効果が向上する。  Further, by providing the curved convex portion 153 on the side surface of the partition 15, the concentration of the flux on the side surface of the partition 15 is suppressed, and the heat conduction of the heat sink 1 to the element 2 is enhanced, so that the cooling effect of the heat sink 1 is improved. ..
　そして、フィン部１４が円柱を成すことで、フィン部１４に起因する圧力損失を最低限に抑えることができる。 Then, since the fin portion 14 forms a cylinder, the pressure loss caused by the fin portion 14 can be minimized.
　［第二実施形態］
　図２に示されたヒートシンク１は、仕切り１５を備えていないこと以外は、第一実施形態のヒートシンク１と同様の態様となっている。尚、仕切り１５を有しない空間には、フィン部１４が第一実施形態のフィン部１４と同様のピッチで増設される。 [Second Embodiment]
The heat sink 1 shown in FIG. 2 has the same embodiment as the heat sink 1 of the first embodiment except that the partition 15 is not provided. In the space having no partition 15, fin portions 14 are added at the same pitch as the fin portions 14 of the first embodiment.
　以上の本態様のヒートシンク１によれば、第一実施形態のヒートシンク１の効果に加え、前記冷媒の流れの障害が無くなり、圧力損失が改善される。また、フィン部１４の増設により、冷却本体部１０の内面と冷媒との接触表面積が拡大し、ヒートシンク１の冷却性能の向上も図られる。 According to the heat sink 1 of the present embodiment described above, in addition to the effect of the heat sink 1 of the first embodiment, the obstacle of the flow of the refrigerant is eliminated and the pressure loss is improved. Further, by adding the fin portion 14, the contact surface area between the inner surface of the cooling main body portion 10 and the refrigerant is expanded, and the cooling performance of the heat sink 1 can be improved.
　［第三実施形態］
　図３に示されたヒートシンク１は、前記複数のフィン部１４のうち、流入路１１及び流出路１３に面した破線ＢＬに囲まれた複数のフィン部１４が他の複数のフィン部１４よりも小径に形成されたこと以外は、第二実施形態のヒートシンク１と同様の態様を成す。例えば、前記他の複数のフィン部１４の径がφ２である場合、前記面した複数のフィン部１４の径はφ１．５に設定される。 [Third Embodiment]
In the heat sink 1 shown in FIG. 3, among the plurality of fin portions 14, the plurality of fin portions 14 surrounded by the broken lines BL facing the inflow path 11 and the outflow path 13 are larger than the other plurality of fin portions 14. It has the same aspect as the heat sink 1 of the second embodiment except that it is formed to have a small diameter. For example, when the diameter of the other plurality of fin portions 14 is φ2, the diameter of the plurality of facing fin portions 14 is set to φ1.5.
　以上の本態様のヒートシンク１によれば、流通路１２の流入側、流出側の抵抗を減らすことができ、第一実施形態及び第二実施形態の効果に加え、圧力損失をさらに低減できる。 According to the heat sink 1 of the present embodiment described above, the resistance on the inflow side and the outflow side of the flow passage 12 can be reduced, and in addition to the effects of the first embodiment and the second embodiment, the pressure loss can be further reduced.
　［実施形態４］
　図４（ａ）に示されたヒートシンク１は、フィン部１４の代わりに、フィン部１６を備えたこと以外は、第二実施形態のヒートシンク１と同様の態様となっている。 [Embodiment 4]
The heat sink 1 shown in FIG. 4A has the same embodiment as the heat sink 1 of the second embodiment except that the fin portion 16 is provided instead of the fin portion 14.
　フィン部１６は、角柱、例えば縦横比２×２の横断面正方形の四角柱を成す。フィン部１６は一つの角部１６１が前記冷媒の流れＦと対向して配置される（同図（ｂ））。 The fin portion 16 forms a prism, for example, a prism having a square cross section with an aspect ratio of 2 × 2. One corner portion 161 of the fin portion 16 is arranged so as to face the flow F of the refrigerant (FIG. (B)).
　以上の本態様のヒートシンク１によれば、フィン部１６の一つの角部１６１が前記冷媒の流れＦと対向するので、第一実施形態及び第二実施形態の効果に加え、前記冷媒とフィン部１４との接触に因る乱流が抑制され、圧力損失のさらなる低減が図られる。 According to the heat sink 1 of the present embodiment described above, since one corner portion 161 of the fin portion 16 faces the flow F of the refrigerant, in addition to the effects of the first embodiment and the second embodiment, the refrigerant and the fin portion Turbulence due to contact with 14 is suppressed, and pressure loss is further reduced.
　また、本発明に係るフィン部の他の態様としては、横断面菱形の四角柱が例示される。特に、前記菱形の長い方の対角線が前記流れに沿うように前記四角柱が配置されることで、圧力損失の低減を図ることができる。 Further, as another aspect of the fin portion according to the present invention, a quadrangular prism having a rhombic cross section is exemplified. In particular, the pressure loss can be reduced by arranging the quadrangular prism so that the longer diagonal line of the rhombus follows the flow.

Claims (7)

  1. 　複数の発熱体が並列して取り付けられる冷却本体部を有し、
    　この冷却本体部には、
    冷媒の流入路と、
    この流入路から供された前記冷媒の流通路と、
    この流通路から供された前記冷媒の流出路と
    が形成され、
    　前記流通路は、前記発熱体の取り付け部位に対応して形成され、
    　前記流通路の一面には、複数のフィン部が密に立設された冷却構造。     It has a cooling body where multiple heating elements can be mounted in parallel.
    In this cooling body,
    Refrigerant inflow path and
    The flow path of the refrigerant provided from this inflow path and
    An outflow path for the refrigerant provided from this flow path is formed.
    The flow path is formed corresponding to the attachment site of the heating element.
    A cooling structure in which a plurality of fins are densely erected on one surface of the flow passage.
  2. 　前記流通路には、並列した前記発熱体の間に対応した部位に仕切りが設けられた請求項１に記載の冷却構造。 The cooling structure according to claim 1, wherein the flow passage is provided with a partition at a portion corresponding to the parallel heating elements.
  3. 　前記複数のフィン部のうち、前記流入路及び前記流出路に面した複数のフィン部は、他の複数のフィン部よりも小径に形成された請求項１または２に記載の冷却構造。 The cooling structure according to claim 1 or 2, wherein among the plurality of fin portions, the plurality of fin portions facing the inflow path and the outflow path are formed to have a smaller diameter than the other plurality of fin portions.
  4. 　前記複数のフィン部は、円柱を成す請求項１から３のいずれか１項に記載の冷却構造。 The cooling structure according to any one of claims 1 to 3, wherein the plurality of fin portions form a cylinder.
  5. 　前記複数のフィン部は角柱を成し、この角柱の一つの角部は前記冷媒の流れと対向する請求項１から３のいずれか１項に記載の冷却構造。 The cooling structure according to any one of claims 1 to 3, wherein the plurality of fin portions form a prism, and one corner of the prism forms a prism.
  6. 　前記冷却本体部は、長板状を成し、
    　前記流入路は、前記冷却本体部の一方の長手方向端部に沿って形成され、
    　前記流出路は、前記冷却本体部の他方の長手方向端部に沿って形成され、
    　前記流出路に連通する前記冷媒の流出口は、前記流入路に連通する前記冷媒の流入口に対して、前記冷却本体部の対角位置に形成された請求項１から５のいずれか１項に記載の冷却構造。     The cooling main body has a long plate shape.
    The inflow path is formed along one longitudinal end of the cooling body.
    The outflow path is formed along the other longitudinal end of the cooling body.
    One of claims 1 to 5, wherein the outlet of the refrigerant communicating with the outflow passage is formed at a diagonal position of the cooling main body with respect to the inlet of the refrigerant communicating with the inflow passage. The cooling structure described in.
  7. 　請求項１から６のいずれか１項に記載の冷却構造を有するヒートシンク。 A heat sink having the cooling structure according to any one of claims 1 to 6.
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JP2007214157A (en) * 2006-02-07 2007-08-23 Meidensha Corp Water-cooled cooling structure
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