TWM616791U - Heat-dissipation module - Google Patents
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- TWM616791U TWM616791U TW110203721U TW110203721U TWM616791U TW M616791 U TWM616791 U TW M616791U TW 110203721 U TW110203721 U TW 110203721U TW 110203721 U TW110203721 U TW 110203721U TW M616791 U TWM616791 U TW M616791U
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Abstract
本創作一種散熱模組,包括一基座、至少二熱管及複數散熱單元,該至少二熱管設有一吸熱端與一從該吸熱端向外延伸的散熱端,該吸熱端設於該基座上,該至少二熱管的散熱端位於該基座上方且呈高、低交錯設置,該複數散熱單元係結合至該等熱管的散熱端且彼此間隔設置,透過本創作的複數散熱單元分層間隔的設計,得達到增加散熱面積和可避免氣流受阻,藉以有效大幅提升散熱效率。 The invention creates a heat dissipation module, which includes a base, at least two heat pipes, and a plurality of heat dissipation units. The at least two heat pipes are provided with a heat absorption end and a heat dissipation end extending outward from the heat absorption end. The heat absorption end is arranged on the base The heat dissipation ends of the at least two heat pipes are located above the base and are arranged in a high and low staggered manner. The plurality of heat dissipation units are coupled to the heat dissipation ends of the heat pipes and are spaced apart from each other. The design can increase the heat dissipation area and avoid the obstruction of the airflow, thereby effectively improving the heat dissipation efficiency.
Description
本創作有關於一種散熱模組,尤指一種可避免氣流受阻並可增加散熱面積得以有效提升散熱效率的散熱模組。 This creation relates to a heat dissipation module, especially a heat dissipation module that can avoid airflow obstruction and increase the heat dissipation area to effectively improve the heat dissipation efficiency.
許多電子裝置(如電腦)日益增進且效能提高,使電子裝置內的電子元件會產生很高的熱量,必需要透過散熱器進行散熱以降低溫度,才能保持工作效率及減少電子元件損壞機會。而現有一般散熱器分為有鋁擠型散熱鰭片或扣接堆疊式散熱鰭片構成,但這些所述散熱器的每一散熱鰭片彼此的間隔距離和高度是固定一致,使得通過每一散熱鰭片的上方和下方及間距的氣流會被限制是一樣且通過的氣流流長也會相同,所以當現有該散熱器貼觸在一發熱源(如中央處理器或圖形處理晶片)以導出熱能,並藉由其上散熱鰭片將熱能向外散出時,使吹拂於散熱鰭片的上、下方氣流流量被限制是一樣,進而帶走熱能相對也有限以致於容易造成積熱的問題。 Many electronic devices (such as computers) are increasing day by day and their performance is increasing. The electronic components in the electronic devices will generate a high amount of heat, which must be dissipated through a radiator to reduce the temperature in order to maintain working efficiency and reduce the chance of damage to the electronic components. The existing general heat sinks are composed of aluminum extruded heat dissipation fins or buckle stacked heat dissipation fins, but the spacing and height of each heat dissipation fin of these heat sinks are fixed and consistent, so that each The airflow above and below the fins and the spacing will be restricted to be the same and the length of the airflow will be the same, so when the existing radiator is attached to a heat source (such as a central processing unit or a graphics processing chip) to export When the heat energy is dissipated by the upper heat dissipation fins, the air flow on the upper and lower sides of the heat dissipation fins is restricted, and the heat energy taken away is relatively limited, so that it is easy to cause heat accumulation problems. .
而隨著電子元件的瓦數及效能提高,使得必須透過增加現有散熱器的散熱鰭片的數量與增高散熱鰭片來增加散熱面積,但在電子裝置的有限空間內僅可放置的散熱器是在相同面積下,若需要獲得較多的散熱面積,則必須增加散熱鰭片的數量,例如10公分 x 10公分的面積裡雖增加了很多散熱鰭片,可是鰭片數量越多則相鄰的散熱鰭片之間的間距(氣流通道)則會越夾窄(即兩相鄰的散熱鰭片之間的間距會縮小),如此會使流過散熱鰭片的氣流受到的阻力(流場阻抗)較 大,且進入散熱鰭片間距內的風量也因此大大減少,以致散熱效率不佳。若是將散熱鰭片增高拉長的話,則因每一散熱鰭片的厚度很薄容易造成變形或碰損,若將每一散熱鰭片的厚度增厚時,則又會使散熱鰭片數量減少,進而導致散熱面積減少的問題。 With the increase in the wattage and performance of electronic components, it is necessary to increase the heat dissipation area by increasing the number of heat dissipation fins of the existing heat sinks and increasing the heat dissipation fins. However, the only heat sinks that can be placed in the limited space of electronic devices are In the same area, if you need to obtain more heat dissipation area, you must increase the number of heat dissipation fins. For example, although a lot of heat dissipation fins are added to the area of 10 cm x 10 cm, the more fins are adjacent to each other. The distance between the heat sink fins (air flow channel) will be narrower (that is, the distance between two adjacent heat sink fins will be reduced), so that the air flow through the heat sink fins will be subjected to resistance (flow field resistance) ) Is more The amount of air entering the spacing of the heat dissipation fins is also greatly reduced, resulting in poor heat dissipation efficiency. If the heat dissipation fins are increased and elongated, the thickness of each heat dissipation fin is easy to cause deformation or collision damage. If the thickness of each heat dissipation fin is increased, the number of heat dissipation fins will be reduced. , Which in turn leads to the problem of reduced heat dissipation area.
所以如何在有限空間內的散熱器在相同面積之下,要怎麼利用散熱器上方空間來增加散熱面積呢,令業者便想到將兩個獨立的散熱器以雙層相互直接堆疊或搭接設置之方式進行組合來得到更多的散熱面積,但卻延伸出另一問題,就是因一散熱器是直接抵壓在另一散熱器設置散熱鰭片之部位,且疊設於上方散熱器具有相當的重量,以致於往往令設置在下方散熱器之散熱鰭片無法承受疊設在上方的散熱器的重量壓置進而產生變形(或損壞),以導致散熱效率不佳,因此所述散熱鰭片結構強度問題仍然未被解決,且也是業者仍需努力克服的問題之一。 So how can the radiators in a limited space be under the same area? How to use the space above the radiators to increase the heat dissipation area, so the industry thought of stacking two independent radiators directly or overlapping each other in two layers. Ways to combine to get more heat dissipation area, but another problem is extended, because one radiator is directly pressed against another radiator where the heat dissipation fins are arranged, and the radiator stacked on top has considerable Because of the weight, the heat sink fins arranged on the lower heat sink cannot bear the weight of the heat sink stacked on the upper part, which causes deformation (or damage), resulting in poor heat dissipation efficiency. Therefore, the heat dissipating fin structure The strength problem is still unresolved, and it is also one of the problems that the industry still needs to work hard to overcome.
是以,要如何解決上述習用之問題與缺失,即為本案之創作人與從事此行業之相關廠商所亟欲研究改善之方向所在者。 Therefore, how to solve the above-mentioned conventional problems and deficiencies is the direction that the creators of this project and the related manufacturers engaged in this industry urgently want to study and improve.
本創作之一目的在提供一種可達到增加散熱面積和可避免氣流受阻以有效提升散熱效率的散熱模組。 One purpose of this creation is to provide a heat dissipation module that can increase the heat dissipation area and avoid airflow obstruction to effectively improve the heat dissipation efficiency.
為達上述目的,本創作係提供一種散熱模組,包括一基座、至少二熱管及複數散熱單元,該至少二熱管設有一吸熱端與一從該吸熱端向外延伸的散熱端,該吸熱端設於該基座上,該至少二熱管的該散熱端位於該基座上方且呈高、低交錯設置,複數散熱單元結合於熱管的該散熱端,且該複數散熱單元係彼此呈間隔設置。 In order to achieve the above-mentioned objective, the present invention provides a heat dissipation module, which includes a base, at least two heat pipes, and a plurality of heat dissipation units. The at least two heat pipes are provided with a heat absorption end and a heat dissipation end extending outward from the heat absorption end. The radiating ends of the at least two heat pipes are located above the pedestal and arranged in a high and low staggered manner. A plurality of radiating units are combined with the radiating end of the heat pipe, and the plurality of radiating units are spaced apart from each other. .
本創作另提供一種散熱模組,包括一基座、至少一熱管及至少一散熱單元,該基座具有一頂側及一底側,該頂側設置有複數基座鰭片,該至少一熱管設有一吸熱端與一從該吸熱端向外延伸的散熱端,該吸熱端設於該基座上,該基座與位於上方的該散熱端呈高、低設置,且該散熱單元與該複數基座鰭片係具有一間距。 This creation also provides a heat dissipation module, including a base, at least one heat pipe, and at least one heat dissipation unit. The base has a top side and a bottom side. The top side is provided with a plurality of base fins, and the at least one heat pipe A heat-absorbing end and a heat-dissipating end extending outward from the heat-absorbing end are provided. The heat-absorbing end is arranged on the base, and the base and the heat dissipating end located above are arranged high and low, and the heat dissipating unit and the plurality of The base fins have a pitch.
因此,透過分層及或交錯之間隔配置設計來調整高、低或前、後的複數散熱鰭片或複數散熱鰭片與複數基座鰭片之設置位置,除達到增加散熱面積又可避免氣流受阻,進以有效提升散熱效率。 Therefore, through the layered and or staggered spaced design to adjust the high, low, or front and back of the plurality of heat dissipation fins or the placement of the plurality of heat dissipation fins and the plurality of base fins, in addition to increasing the heat dissipation area, it can also avoid airflow. If it is blocked, it can effectively improve the heat dissipation efficiency.
前述基座具有一頂側與一底側,該基座之底側具有複數凹槽,該複數凹槽係可容設並結合該熱管的吸熱端,並令該熱管的吸熱端係與該基座的底側平齊。 The aforementioned base has a top side and a bottom side. The bottom side of the base has a plurality of grooves. The bottom side of the seat is flush.
前述至少二熱管的該吸熱端的一上側接觸貼設該基座的該底側,該至少二熱管之其中至少一該吸熱端的一下側與一發熱元件相貼設。 An upper side of the heat-absorbing end of the aforementioned at least two heat pipes is in contact with the bottom side of the base, and a lower side of at least one of the heat-absorbing ends of the at least two heat pipes is attached to a heating element.
前述每一散熱單元具有複數散熱鰭片,兩兩散熱鰭片之間界定一氣流通道,該至少二熱管的散熱端其上該複數散熱鰭片的氣流通道係相同或不相同。 Each of the foregoing heat dissipation units has a plurality of heat dissipation fins, and an air flow channel is defined between the two heat dissipation fins, and the heat dissipation ends of the at least two heat pipes have the same or different air flow channels on the plurality of heat dissipation fins.
前述基座為一均溫板、一熱板、一導熱塊或一散熱器。 The aforementioned base is a uniform temperature plate, a hot plate, a heat conduction block or a heat sink.
前述至少一熱管的散熱端其上該複數散熱鰭片的氣流通道的寬度大於、等於或小於該另至少一熱管的散熱端其上該複數散熱鰭片的氣流通道的寬度。 The width of the air flow channel of the plurality of heat dissipation fins on the heat dissipation end of the at least one heat pipe is greater than, equal to or less than the width of the air flow channel of the plurality of heat dissipation fins on the heat dissipation end of the other at least one heat pipe.
前述散熱模組更包含至少一風扇,該風扇選擇設置在該基座的一側邊或該複數散熱鰭片的一側邊或置中,用以導引一氣流流向該複數散熱鰭片進行熱交換。 The aforementioned heat dissipation module further includes at least one fan, and the fan is selectively arranged on one side of the base or one side or in the middle of the plurality of heat dissipation fins to guide an air flow to the plurality of heat dissipation fins for heat exchange.
所述至少二熱管的該散熱端位於該基座上方且呈前、後交錯設置。 The heat dissipating ends of the at least two heat pipes are located above the base and are arranged alternately in front and back.
前述散熱單元包含複數散熱鰭片及一二相流散熱結構,該複數散熱鰭片的一側與該二相流散熱結構的一上側相貼設,該熱管的該散熱端與該二相流散熱結 構的一下側相接觸或與該二相流散熱結構具有的一腔室直接連通相接。所述該二相流散熱結構為一均溫板或一熱板。 The aforementioned heat dissipation unit includes a plurality of heat dissipation fins and a two-phase flow heat dissipation structure. One side of the plurality of heat dissipation fins is attached to an upper side of the two-phase flow heat dissipation structure, and the heat dissipation end of the heat pipe is connected to the two-phase flow heat dissipation structure. Knot The lower side of the structure is in contact with or directly communicates with a chamber of the two-phase flow heat dissipation structure. The two-phase flow heat dissipation structure is a uniform temperature plate or a hot plate.
1:散熱模組 1: Cooling module
11:基座 11: Pedestal
111:頂側 111: top side
112:底側 112: bottom side
113:凹槽 113: Groove
115:基座鰭片 115: base fin
116:間距 116: Spacing
12:熱管 12: Heat pipe
121:吸熱端 121: Endothermic
122:散熱端 122: heat sink
14:散熱單元 14: Cooling unit
141:散熱鰭片 141: cooling fins
143:二相流散熱結構 143: Two-phase flow heat dissipation structure
15:氣流通道 15: Airflow channel
2:風扇 2: fan
3:發熱元件 3: heating element
第1圖為本創作之一實施例之分解立體示意圖。 Figure 1 is an exploded three-dimensional schematic diagram of an embodiment of the creation.
第2圖為本創作之一實施例之組合剖面示意圖。 Figure 2 is a schematic diagram of a combined cross-section of an embodiment of the creation.
第3A圖為本創作之散熱模組與風扇之實施態樣示意圖。 Figure 3A is a schematic diagram of the implementation of the cooling module and fan created.
第3B圖為本創作之風扇排出的氣流流向較高層、較低層複數散熱鰭片的氣流流量不相同之實施態樣示意圖。 Figure 3B is a schematic diagram of an implementation state where the air flow from the fan of the creation to the higher and lower layers of the plurality of heat dissipation fins is different.
第4圖為本創作之一實施例之組合立體之另一實施示意圖。 Figure 4 is a schematic diagram of another implementation of the combined stereo according to an embodiment of the creation.
第5圖為本創作之其他替代實施例之組合立體示意圖。 Figure 5 is a combined three-dimensional schematic diagram of other alternative embodiments of the creation.
本創作之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。 The above-mentioned purpose of this creation and its structural and functional characteristics will be described based on the preferred embodiments of the accompanying drawings.
本創作提供一種散熱模組,參閱第1、2圖,該散熱模組1包括一基座11、至少二熱管12及複數散熱單元14,該基座11可選擇為一均溫板、一熱板、一導熱塊或一散熱器,在本實施例的基座11選擇為金屬材質(如銅材質、鋁材質、鈦材質、不銹鋼或合金材質)所構成的導熱塊說明,但並不侷限於此。該基座11具有一頂側111、一底側112與複數凹槽113,該複數凹槽113係凹設形成在該基座11的底側112上,該複數凹槽113用以供容設該複數熱管12的一吸熱端121且相結合,每一熱管12設有前述吸熱端121與一從該吸熱端121向外延伸的散熱端122,該吸熱端121設於該基座11的底側112,且與該基座11的底側112相平齊,並每一凹槽113的形狀係與每一熱管12的形狀相配合設置。在一可行實施例,可省略沒有設置所
述凹槽113,該複數熱管12的吸熱端121直接係結合該基座11內,或是該複數熱管12的吸熱端121選擇設置貼設在該基座11的頂側111或底側112上相接觸。
This creation provides a heat dissipation module. Refer to Figures 1 and 2. The
在另外一實施例,該基座11係可具有一供汽液相變化的腔室(如均溫板或熱板;圖中未示),該複數熱管12的吸熱端121係與該腔室內相接設可呈連通或不相連通。
In another embodiment, the
該至少二熱管12的散熱端122位於該基座11的頂側111上方且呈高、低交錯設置,在本實施例表示該複數熱管12設置在該基座11的相對側,但並不侷限於此,於具體實時在不同應用中,所述熱管12的數量可為二隻熱管12以上設置在該基座11的同側(如第3A、4圖)或不同側上,且多隻熱管12的散熱端122在該基座11的頂側111上方以多層方式呈高、低及/或前、後交錯隔開設置。並所述複數熱管12的吸熱端121的一上側則接觸貼設在該基座11的底側112,該複數熱管12中之二熱管12吸熱端121的一下側直接係與一發熱元件3(如中央處理器或圖形處理器或單晶片或其他電子元件)相貼設接觸,所述複數熱管12的散熱端122位在該基座11上方形成如同高、低分層隔開設置。如下為了方便敘述下文將所述複數熱管12中位於上方二熱管12的散熱端122簡稱為上層(較高層)二散熱端122,其位於下方的另二熱管12的散熱端122簡稱為下層(較低層)二散熱端122。
The heat dissipating ends 122 of the at least two
該複數散熱單元14係結合於該複數熱管12的散熱端122(如上層二散熱端122和下層二散熱端122),且該複數散熱單元14彼此係間隔設置,並每一散熱單元14包含複數散熱鰭片141,兩兩散熱鰭片141之間界定一氣流通道15,該氣流通道15係被用以導引一外在氣流進入帶走更多散熱單元14上的熱量以進行熱交換。該下層複數散熱單元14分別與上層散熱單元14和基座11之間相隔開一間距116,該
間距116被用以供外部氣流(如自然對流或強制對流)通過該等散熱單元之複數散熱鰭片141,以避免氣流受阻增加熱交換效率。
The plurality of
所述各散熱單元14之該複數散熱鰭片141的氣流通道15係相同或不相同。
The
在本實施例所述上層散熱端122其上的散熱單元14的氣流通道15係選擇與下層二散熱端122其上的散熱單元14的氣流通道15不相同,亦即上層散熱單元14的複數散熱鰭片141的氣流通道15的寬度係大於下層散熱單元14的複數散熱鰭片141的氣流通道15的寬度。在本實施例中在下層比較熱的區域散熱鰭片較多,令下層散熱鰭片141彼此間的氣流通道15較窄,而上層散熱鰭片141彼此間的氣流通道15則較寬可讓氣流快速通過且增加氣流進入的流量,藉由這樣設計使得可改變通過的氣流之流場可增進或引導氣流可更為順暢向散熱單元進行熱交換。另外,不管是增加散熱鰭141片間之氣流通道15的寬度提升氣流進入之流量,又或者是減少散熱鰭片141間之氣流通道的寬度換取更多的散熱鰭片141之設置數量進而增加散熱面積,都可有利於有效提升熱交換效率,又本創作之上、下層散熱單元14可同時提供多種之設計組合,故本案相較於習知散熱器無論是鰭片間的通道或鰭片數量皆為固定無法更改,所以本創作之設計上提供了更彈性的鰭片配置選擇。
In this embodiment, the
因此,透過本創作此散熱模組1應用空間上方來增加散熱面積的設計,利用該複數散熱單元14於基座11上採分層間隔高度(即高低差)變化來獲得更多放置散熱鰭片141的數量來增加散熱面積,以及藉由高低設計的複數散熱單元14相錯開(如前、後錯開或左、右錯開)來避免氣流受阻,以有效增加通過該散熱鰭片141的流量及達到提升散熱模組1整體散熱效能。且本創作的散熱模組1可應用在一
電子裝置(如電腦、通訊裝置或伺服器;圖中未示)內,以在有限空間下對電子裝置內的發熱元件3達到較佳的散熱功效。
Therefore, through the creation of the design of the
在其他一些實施例,所述上層(較高層)散熱單元14的複數散熱鰭片141的氣流通道15的寬度係小於或等於下層(較低層)散熱單元14的複數散熱鰭片141的氣流通道15的寬度。在又一些實施例,所述複數散熱單元14(如上層散熱單元14及/或下層散熱單元14)是在該熱管12的散熱端122(如上層散熱端122及/或下層散熱端122)整段上可選擇設置在該散熱端122的前段、中段和後段其中任一段或任二段來分段排列設置。在另外一些實施例,該複數散熱單元14(如上層散熱單元14及/或下層散熱單元14)的底側貼設在一均溫板(或熱板)上側,且該熱管12的散熱端122(如上層散熱端122及/或下層散熱端122)與均溫板(或熱板)下側相接。
In some other embodiments, the width of the
在另外一替代實施例,參閱第3A、3B圖,該散熱模組1更包含至少一風扇2(如軸流風扇或離心風扇),該風扇2選擇設置在該基座11的一側邊或該複數散熱鰭片141的一側邊或置中,用以導引氣流流向該複數散熱鰭片141進行熱交換,來達到強制散熱,在此替代實施的風扇2設置在該基座11的一側邊,該風扇2的一出風口係朝相對上、下層(較高、低層)複數散熱鰭片141的氣流通道15方向排出氣流,且流過所述上層(較高層)複數散熱鰭片141的氣流流阻(流場阻抗)係多於下層(較低層)複數散熱鰭片141的氣流流阻(流場阻抗)。但不侷限於此,在又一替代實施例,也可改設計流過所述上層複數散熱鰭片141的氣流流阻(或散熱面積)少於下層複數散熱鰭片141的氣流流阻(或散熱面積)。
In another alternative embodiment, referring to Figures 3A and 3B, the
在其他一替代實施例,參閱第5圖,該基座11更包含複數基座鰭片115,該複數基座鰭片115係一體設置在該基座11的頂側111上以構成散熱器,在此替代實施所述熱管12與散熱單元14選擇為單熱管12與單散熱單元14說明,該基座11與其上
複數基座鰭片115跟位於上方熱管12的散熱端122與其上散熱單元14呈高、低間隔設置,且該散熱單元14和該複數基座鰭片115之間相隔開另一間距116。並該散熱單元14更包含一二相流散熱結構143(如均溫板或一熱板),所述複數散熱鰭片141的一側與二相流散熱結構143的一上側相貼設,該熱管12的散熱端122與該二相流散熱結構143的一下側相接觸,或是與該二相流散熱結構143之腔室直接連通相接,所以透過該散熱單元14和複數基座鰭片115分層間隔的概念來調整較高層、較低層的散熱面積及氣流流阻,藉以有效達到增加散熱面積和可避免氣流受阻,藉以有效提升散熱效率。
In another alternative embodiment, referring to FIG. 5, the base 11 further includes a plurality of
1:散熱模組 1: Cooling module
11:基座 11: Pedestal
111:頂側 111: top side
116:間距 116: Spacing
12:熱管 12: Heat pipe
121:吸熱端 121: Endothermic
122:散熱端 122: heat sink
14:散熱單元 14: Cooling unit
141:散熱鰭片 141: cooling fins
15:氣流通道 15: Airflow channel
Claims (11)
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