WO2021103132A1 - 显示面板和显示装置 - Google Patents

显示面板和显示装置 Download PDF

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Publication number
WO2021103132A1
WO2021103132A1 PCT/CN2019/124220 CN2019124220W WO2021103132A1 WO 2021103132 A1 WO2021103132 A1 WO 2021103132A1 CN 2019124220 W CN2019124220 W CN 2019124220W WO 2021103132 A1 WO2021103132 A1 WO 2021103132A1
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WO
WIPO (PCT)
Prior art keywords
substrate
display panel
driving circuit
display device
disposed
Prior art date
Application number
PCT/CN2019/124220
Other languages
English (en)
French (fr)
Inventor
姜贝
Original Assignee
深圳市华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市华星光电半导体显示技术有限公司 filed Critical 深圳市华星光电半导体显示技术有限公司
Priority to US16/627,783 priority Critical patent/US11430930B2/en
Publication of WO2021103132A1 publication Critical patent/WO2021103132A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0296—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices involving a specific disposition of the protective devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2310/00—Command of the display device
    • G09G2310/02—Addressing, scanning or driving the display screen or processing steps related thereto
    • G09G2310/0264—Details of driving circuits
    • G09G2310/0267—Details of drivers for scan electrodes, other than drivers for liquid crystal, plasma or OLED displays
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
    • G09G2330/04—Display protection
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • This application relates to the field of display technology, and in particular to a display panel and a display device.
  • Mini-LED mini light-emitting diode
  • Micro-LED micro-light-emitting diode
  • the Mini-LED and Micro-LED are set on the driver backplane, so that the driver backplane drives the Mini -LED or Micro-LED emits light to realize the display.
  • There is a display area and an external lead connection area on the driver backplane and there is a drive circuit in the display area and the external lead connection area, but the external lead connection area cannot be displayed, making the LED display screen There is a border, which affects viewing.
  • the existing LED display screen has the technical problem that the outer lead area is large, resulting in a large frame.
  • the present application provides a display panel and a display device, which are used to solve the technical problem that the existing LED display screen has a large external lead area, resulting in a large frame.
  • the present application provides a display panel, which includes:
  • the drive circuit layer is attached to the substrate and includes a drive circuit.
  • the drive circuit includes a first part, a second part, and a connecting part connecting the first part and the second part.
  • the first part is arranged on a side of the substrate.
  • Side, the second part is arranged on a side of the substrate away from the first part;
  • the light-emitting layer is arranged on a side of the first part away from the substrate and connected to the first part;
  • the encapsulation layer is arranged on a side of the light-emitting layer away from the first part;
  • the projection area of the second part on the substrate is located in the projection area of the first part on the substrate.
  • the substrate includes a first substrate, a second substrate, and an optical glue disposed between the first substrate and the second substrate, and the first part is disposed on the first substrate On the side far away from the second substrate, the second part is disposed on the side of the second substrate away from the first substrate.
  • the size of the first substrate is the same as the size of the second substrate.
  • a first alignment terminal is provided on the first substrate, and a second alignment terminal that is matched with the first alignment terminal is provided on the second substrate.
  • the first alignment terminal includes a protrusion
  • the second alignment terminal includes a groove mated with the first alignment terminal
  • the first aligning terminal includes a groove
  • the second aligning terminal includes a protrusion that matches with the first aligning terminal
  • the second part of the driving circuit includes an electrostatic protection circuit
  • the electrostatic protection circuit is disposed on the lower side of the substrate
  • the substrate includes an upper side, a lower side, a left side, and a right side.
  • the connecting part is arranged on the lower side surface of the substrate.
  • the second part of the driving circuit includes a gate driving circuit
  • the gate driving circuit is disposed on both sides of the substrate
  • the substrate includes an upper side surface, a lower side surface, and a left side surface.
  • the connection part is arranged on the left side and the right side of the substrate.
  • the light emitting layer includes a mini light emitting diode chip
  • the mini light emitting diode chip includes a red mini light emitting diode chip, a green mini light emitting diode chip, and a blue mini light emitting diode chip.
  • the connecting part includes a plurality of connecting wires and binding terminals located at two ends of the connecting wire, and the binding terminals are respectively connected to the first part and the second part.
  • the present application provides a display device, which includes:
  • a display panel including a substrate, a driving circuit layer, a light emitting layer, and an encapsulation layer.
  • the driving circuit layer is attached to the substrate and includes a driving circuit.
  • the driving circuit includes a first part, a second part, and a connection.
  • the connecting part of the first part and the second part, the first part is arranged on one side of the substrate, and the second part is arranged on the side of the substrate away from the first part;
  • the light-emitting layer is arranged on the The first part is on the side away from the substrate and connected to the first part;
  • the encapsulation layer is disposed on the side of the light-emitting layer away from the first part; wherein, the projection area of the second part on the substrate is located The first part is in the projection area on the substrate;
  • a chip on film, the chip on film is connected to the second part.
  • the second part includes metal traces and connection terminals, and the flip chip film is connected to the connection terminals.
  • the substrate includes a first substrate, a second substrate, and an optical glue disposed between the first substrate and the second substrate, and the first part is disposed on the first substrate On the side far away from the second substrate, the second part is disposed on the side of the second substrate away from the first substrate.
  • the size of the first substrate is the same as the size of the second substrate.
  • a first alignment terminal is provided on the first substrate, and a second alignment terminal that is matched with the first alignment terminal is provided on the second substrate.
  • the first alignment terminal includes a protrusion
  • the second alignment terminal includes a groove mated with the first alignment terminal
  • the second part of the driving circuit includes an electrostatic protection circuit
  • the electrostatic protection circuit is disposed on the lower side of the substrate
  • the substrate includes an upper side, a lower side, a left side, and a right side.
  • the connecting part is arranged on the lower side surface of the substrate.
  • the second part of the driving circuit includes a gate driving circuit, the gate driving circuit is arranged on both sides of the substrate, and the substrate includes an upper side surface, a lower side surface, and a left side surface. And the right side, the connection part is arranged on the left side and the right side of the substrate.
  • the light emitting layer includes a mini light emitting diode chip
  • the mini light emitting diode chip includes a red mini light emitting diode chip, a green mini light emitting diode chip, and a blue mini light emitting diode chip.
  • the connecting part includes a plurality of connecting wires and binding terminals located at two ends of the connecting wire, and the binding terminals are respectively connected to the first part and the second part.
  • the present application provides a display panel and a display device.
  • the display panel includes a substrate, a drive circuit layer, a light emitting layer, and an encapsulation layer.
  • the drive circuit layer is attached to the substrate and includes a drive circuit.
  • the drive circuit includes a first A part, a second part, and a connecting part connecting the first part and the second part, the first part is arranged on one side of the substrate, and the second part is arranged on the side of the substrate away from the first part;
  • the light-emitting layer is disposed on the side of the first part away from the substrate and connected to the first part; the encapsulation layer is disposed on the side of the light-emitting layer away from the first part; wherein, the second part is at the side of the first part.
  • the projection area on the substrate is located in the projection area of the first part on the substrate; by dividing the drive circuit of the drive circuit layer into a first part, a second part and a connecting part, the first part is located on one side of the substrate, The second part is located on the other side of the substrate, and the projection area of the second part on the substrate is located in the projection area of the first part on the substrate, so that the second part is located in the display area, thereby eliminating external leads that cannot be displayed
  • the connection area eliminates the frame of the display panel, thereby solving the technical problem that the existing LED display has a large external lead area, which leads to a larger frame.
  • Fig. 1 is a schematic diagram of a conventional display device.
  • FIG. 2 is a first schematic diagram of a display panel provided by an embodiment of the application.
  • FIG. 3 is a second schematic diagram of a display panel provided by an embodiment of the application.
  • FIG. 4 is a schematic diagram of a substrate provided by an embodiment of the application.
  • FIG. 5 is a third schematic diagram of a display panel provided by an embodiment of the application.
  • FIG. 6 is a schematic diagram of a display device provided by an embodiment of the application.
  • FIG. 7 is a flowchart of a manufacturing method of a display panel provided by an embodiment of the application.
  • FIG. 8 is a state diagram of the display panel corresponding to the manufacturing method of the display panel provided by the embodiment of the application.
  • the present application provides a display panel and a display device.
  • the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the application, and are not used to limit the application.
  • the present application addresses the technical problem that the existing LED display screen has a large external lead area, resulting in a large frame.
  • the embodiments of the present application are used to solve this problem.
  • the existing LED display device includes a substrate 11, a drive circuit layer 13 on the substrate, a light-emitting chip 14 on the drive circuit layer, and an encapsulation layer 15 on the light-emitting chip, a flip chip film 12 and a drive circuit layer 13 connection, where the drive circuit of the drive circuit layer 13 extends from the display area 161 to the external lead connection area 162 and is connected to the flip chip film 12.
  • the external lead area is large and the external lead area cannot be displayed, resulting in the frame of the LED display Larger, that is, the existing LED display has a large external lead area, which leads to the technical problem of a large frame.
  • an embodiment of the present application provides a display panel, and the display panel includes:
  • the driving circuit layer 22 is attached to the substrate 21 and includes a driving circuit.
  • the driving circuit includes a first part 221, a second part 222, and a connecting part 223 connecting the first part 221 and the second part 222.
  • the first part 221 is disposed on a side of the substrate 21, and the second part 222 is disposed on a side of the substrate 21 away from the first part 221;
  • the light-emitting layer 23 is disposed on a side of the first part 221 away from the substrate 21 and connected to the first part 221;
  • the encapsulation layer 24 is disposed on a side of the light-emitting layer 23 away from the first portion 221;
  • the projection area of the second part 222 on the substrate 21 is located in the projection area of the first part 221 on the substrate 21.
  • An embodiment of the present application provides a display panel, which includes a substrate, a driving circuit layer, a light emitting layer, and an encapsulation layer.
  • the driving circuit layer is attached to the substrate and includes a driving circuit.
  • the driving circuit includes a first part. , A second part and a connecting part connecting the first part and the second part, the first part is arranged on one side of the substrate, and the second part is arranged on the side of the substrate away from the first part;
  • the light-emitting layer is arranged on the side of the first part away from the substrate and connected to the first part; the encapsulation layer is arranged on the side of the light-emitting layer away from the first part; wherein, the second part is on the side of the first part.
  • the projection area on the substrate is located within the projection area of the first part on the substrate; by dividing the drive circuit of the drive circuit layer into a first part, a second part and a connecting part, the first part is located on one side of the substrate, The second part is located on the other side of the substrate, and the projection area of the second part on the substrate is located in the projection area of the first part on the substrate, so that the second part is located in the display area, thereby eliminating external lead connections that cannot be displayed Area, eliminates the frame of the display panel, thereby solving the technical problem that the existing LED display has a large external lead area, which leads to a larger frame.
  • the projection area refers to the largest area formed by the projection of the traces of the first part or the second part of the drive circuit, that is, when the projection of the second part of the trace does not fall on the projection of the first part of the trace , But the projection of the second part of the trace falls within the largest area formed by the projection of the first part of the trace. At this time, the projection of the second part is also located in the projection area of the first part.
  • the substrate 21 includes a first substrate 211, a second substrate 212, and an optical glue disposed between the first substrate 211 and the second substrate 212, and the The first part 221 is provided on the side of the first substrate 211 away from the second substrate 212, and the second part 222 is provided on the side of the second substrate 212 away from the first substrate 211, in order to drive The first part and the second part of the circuit are both placed in the display area.
  • the first part and the second part of the drive can be prepared on the front and back of the substrate, respectively, so that the first and second parts of the drive circuit Are located in the display area, or the substrate is divided into a first substrate and a second substrate, so that the first part and the second part of the driving circuit are formed on the first substrate and the second substrate, respectively, and then the first substrate and the second substrate are separated by optical glue.
  • the two substrates are connected so that the first part and the second part of the drive circuit are prepared separately, so as to avoid damaging the first part when the second part is prepared on the back after the first part is prepared on the front of the substrate, making the preparation process simpler and the preparation The first part and the second part of the obtained driving circuit are complete.
  • the size of the first substrate is the same as the size of the second substrate, that is, the length of the first substrate is equal to the length of the second substrate, and the width of the first substrate is equal to the width of the second substrate.
  • the thickness of the first substrate is equal to the thickness of the second substrate, and the size of the first substrate is the same as the size of the second substrate, so that when the first substrate and the second substrate are provided, the same substrate is selected as the first substrate and the second substrate that is, the size of the first substrate and the second substrate are the same, and the thickness of the first substrate can be selected according to the thickness requirements of the substrate, so that the thickness of the obtained substrate will not be too thick and the display panel will not be too thick, nor will the substrate be too thin. This causes damage to the substrate, and at the same time, the obtained substrate is a four-sided aligned substrate, and there is no excess part of the substrate.
  • a first alignment terminal is provided on the first substrate, and a second alignment terminal that matches with the first alignment terminal is provided on the second substrate.
  • the first alignment terminal can be provided on the first substrate, and the second alignment terminal can be provided on the second substrate, so that the first The pair of aligning terminals are matched with the second aligning terminals, so that the first substrate and the second substrate are accurately attached.
  • the aligning terminals can be matched with grooves and protrusions.
  • the first aligning terminals are convex.
  • the second alignment terminal is a groove that fits with the protrusion; or the first alignment terminal is a groove, and the second alignment terminal is a protrusion that fits with the groove, so that the first substrate and The second substrate is aligned by the first alignment terminal and the second alignment terminal. It should be noted that considering that there is an adhesive optical adhesive between the first substrate and the second substrate, the optical adhesive is applied to the second substrate. When on a substrate or a second substrate, the first alignment terminal or the second alignment terminal needs to be exposed, so that the first alignment terminal and the second alignment terminal are matched and aligned.
  • scales can be provided on the side surfaces of the first substrate and the second substrate, scales can be provided on the corresponding two adjacent side surfaces of the first substrate and the second substrate, or on the first substrate and the second substrate.
  • the corresponding four sides of the substrate are provided with graduations, and the first substrate and the second substrate are aligned by aligning the graduations.
  • an embodiment of the present application provides a substrate.
  • the substrate 21 includes an upper side 411, a lower side 412, a left side 413, a right side 414, an upper side, a lower side 415, a left side, and a right side 416.
  • the upper side is opposite to the lower side, the left side is opposite to the right side, the upper side is opposite to the lower side, and the left side is opposite to the right side.
  • the second part of the driving circuit includes an electrostatic protection circuit 512, which is disposed on the lower side of the substrate 21, and the substrate includes an upper side and a lower side.
  • the side surface, the left side surface and the right side surface, the connection part is arranged on the lower side surface of the substrate.
  • the static electricity protection circuit is placed in the lower non-display area of the display panel, thereby causing the display There is a frame on the lower side of the panel.
  • the static electricity protection circuit is placed on the lower side of the substrate so that the static electricity protection circuit is located in the display area of the display panel, and then a connecting part is provided on the lower side of the back of the substrate to make the connecting part
  • the electrostatic protection circuit is connected to the first part of the front surface of the substrate, so that the electrostatic protection circuit works normally, so that the width of the lower frame of the display panel is reduced without affecting the operation of the electrostatic protection circuit.
  • the second part of the driving circuit includes a gate driving circuit 511, and the gate driving circuit 211 is disposed on both sides of the substrate 21, and the substrate includes an upper side surface. , The lower side, the left side and the right side, the connection parts are arranged on the left side and the right side of the substrate.
  • gate drivers are provided in the non-display areas on both sides of the display panel. Circuit, so that there is no need to use chips on both sides, but the gate drive circuit will also cause the display panel to have frames on both sides.
  • the gate drive circuit is arranged on the left and right sides of the back of the substrate, and then connected The parts are arranged on the left and right sides of the substrate, so that the gate driving circuit is connected to the first part, so that the gate driving circuit works normally while the left and right frames of the display panel are reduced.
  • the light-emitting layer includes a mini light-emitting diode chip
  • the mini light-emitting diode chip includes a red mini light-emitting diode chip, a green mini light-emitting diode chip, and a blue mini light-emitting diode chip; in the arrangement of the light-emitting layer, The red mini LED chip, the green mini LED chip, and the blue mini LED chip are used as the light source.
  • the driving circuit drives the mini LED chip to emit light, thereby making the light emitting layer Emit various colors of light to realize the picture display.
  • the light-emitting layer includes a micro-light-emitting diode chip
  • the micro-light-emitting diode chip includes a red micro-light-emitting diode chip, a green micro-light-emitting diode chip, and a blue micro-light-emitting diode chip.
  • the connecting part includes a plurality of connecting wires and binding terminals at both ends of the connecting wire, and the binding terminals are respectively connected to the first part and the second part; when the connecting part is provided, Set the two ends of the connecting wire of the connecting part in the binding terminal, and then connect the binding terminal to one end of the first part of the wiring and one end of the second part of the wiring, so as to realize the first part and the second part. Normally connected, so that the first part, the second part, and the connecting part form a complete driving circuit, so that the display panel works normally.
  • an embodiment of the present application provides a display device, which includes:
  • a display panel the display panel includes a substrate 21, a driving circuit layer 22, a light-emitting layer 23, and an encapsulation layer 24.
  • the driving circuit layer 22 is attached to the substrate 21 and includes a driving circuit.
  • the driving circuit includes a first part 221, a second part 222, and a connecting part 223 connecting the first part 221 and the second part 222, the first part 221 is disposed on one side of the substrate 21, and the second part 222 is disposed on the substrate 21 away from the substrate 21.
  • the light-emitting layer 23 is disposed on the side of the first part 221 away from the substrate 21 and connected to the first part 221; the encapsulation layer 24 is disposed on the light-emitting layer 23 away from the One side of the first part 221; wherein the projection area of the second part 222 on the substrate 21 is located in the projection area of the first part 221 on the substrate 21;
  • the chip on film 61 is connected to the second part 222.
  • An embodiment of the present application provides a display device, the display device includes a display panel and a flip chip film, the display panel includes a substrate, a driving circuit layer, a light emitting layer, and an encapsulation layer, and the driving circuit layer is attached to the substrate.
  • the driving circuit includes a first part, a second part and a connecting part connecting the first part and the second part, the first part is arranged on one side of the substrate, and the second part is arranged on the The side of the substrate away from the first part; the light-emitting layer is disposed on the side of the first part away from the substrate and connected to the first part; the encapsulation layer is disposed on a side of the light-emitting layer away from the first part Side; wherein the projection area of the second part on the substrate is located in the projection area of the first part on the substrate; the flip chip film is connected to the second part; by connecting the drive circuit layer
  • the driving circuit is divided into a first part, a second part and a connecting part, so that the first part is located on one side of the substrate, the second part is located on the other side of the substrate, and the projection area of the second part on the substrate is located on the first part on the substrate
  • the second part is located in the display area, which eliminates the external lead connection area that
  • the second part includes metal traces and connection terminals, and the flip chip film is connected to the connection terminals.
  • the flip chip film is connected to the driving circuit, the flip chip is connected to the driving circuit to control the driving circuit.
  • the film is connected to the connecting terminal of the second part, and since the second part is connected to the first part through the connecting part, the flip chip film controls the operation of the driving circuit, thereby controlling the display of the display device.
  • the substrate includes a first substrate, a second substrate, and an optical glue disposed between the first substrate and the second substrate, and the first part is disposed on The first substrate is on a side away from the second substrate, and the second part is disposed on a side of the second substrate away from the first substrate.
  • the size of the first substrate is the same as the size of the second substrate.
  • the first substrate is provided with a first alignment terminal
  • the second substrate is provided with a second alignment terminal that cooperates with the first alignment terminal. Terminal.
  • the first aligning terminal includes a protrusion
  • the second aligning terminal includes a groove mated with the first aligning terminal
  • the first aligning terminal includes a groove
  • the second aligning terminal includes a protrusion that matches with the first aligning terminal
  • the second part of the driving circuit includes an electrostatic protection circuit
  • the electrostatic protection circuit is disposed on the lower side of the substrate
  • the substrate includes an upper side, a lower side, On the left side and the right side, the connection part is arranged on the lower side of the substrate.
  • the second part of the driving circuit includes a gate driving circuit
  • the gate driving circuit is disposed on both sides of the substrate
  • the substrate includes an upper side surface and a lower side surface.
  • the side surface, the left side surface and the right side surface, the connection part is arranged on the left side surface and the right side surface of the substrate.
  • the light emitting layer includes a mini light emitting diode chip
  • the mini light emitting diode chip includes a red mini light emitting diode chip, a green mini light emitting diode chip, and a blue mini light emitting diode chip.
  • the connecting part includes a plurality of connecting wires and binding terminals located at two ends of the connecting wire, and the binding terminals are respectively connected to the first part and the second part.
  • an embodiment of the present application provides a method for preparing a display panel, and the method for preparing a display panel includes:
  • the driving circuit forms a driving circuit layer
  • the embodiment of the present application provides a method for manufacturing a display panel.
  • the display panel prepared by the method for manufacturing the display panel includes a substrate, a driving circuit layer, a light-emitting layer, and an encapsulation layer.
  • the driving circuit layer is attached to the substrate and includes:
  • the driving circuit includes a first part, a second part, and a connection part connecting the first part and the second part.
  • the first part is arranged on one side of the substrate, and the second part is arranged far away from the substrate.
  • the projection area of the second part on the substrate is located in the projection area of the first part on the substrate; by dividing the driving circuit of the driving circuit layer into a first part, a second part and a connecting part, The first part is located on one side of the substrate, and the second part is located on the other side of the substrate, and the projection area of the second part on the substrate is located in the projection area of the first part on the substrate, so that the second part is located in the display area Therefore, the external lead connection area that cannot be displayed is eliminated, and the frame of the display panel is eliminated, thereby solving the technical problem that the existing LED display screen has a large external lead area, resulting in a larger frame.
  • the step of preparing the connecting portion includes using inkjet printing or printing to form the connecting portion.
  • FIG. 8 As shown in FIG. 8, (a) in FIG. 8 is a state diagram of the display panel corresponding to step S1 in FIG. 7; (b) in FIG. 8 is a state diagram of the display panel corresponding to step S2 in FIG. 7; (C) in FIG. 8 is a state diagram of the display panel corresponding to step S3 in FIG. 7; (d) in FIG. 8 is a state diagram of the display panel corresponding to step S4 in FIG. 7.
  • the embodiments of the present application provide a display panel, a manufacturing method thereof, and a display device.
  • the display panel includes a substrate, a driving circuit layer, a light-emitting layer, and an encapsulation layer.
  • the driving circuit layer is attached to the substrate and includes a driving circuit,
  • the driving circuit includes a first part, a second part, and a connecting part connecting the first part and the second part.
  • the first part is disposed on one side of the substrate, and the second part is disposed on the substrate away from the first part.
  • the light-emitting layer is arranged on the side of the first part away from the substrate and connected to the first part; the encapsulation layer is arranged on the side of the light-emitting layer away from the first part; wherein, The projection area of the second part on the substrate is located in the projection area of the first part on the substrate; by dividing the driving circuit of the driving circuit layer into a first part, a second part and a connecting part, the first part Located on one side of the substrate, the second part is located on the other side of the substrate, and the projection area of the second part on the substrate is located in the projection area of the first part on the substrate, so that the second part is located in the display area, thereby eliminating The external lead connection area that cannot be displayed is eliminated, and the frame of the display panel is eliminated, thereby solving the technical problem that the existing LED display screen has a large external lead area, resulting in a larger frame.

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Abstract

一种显示面板和显示装置，显示面板通过将驱动电路层的驱动电路划分为第一部分（221）、第二部分（222）和连接部分（223），使得第一部分（221）和第二部分（222）位于基板（21）的对立两侧，且使得第二部分（222）在基板（21）上的投影区域位于第一部分（221）在基板（21）上的投影区域内，使得第二部分（222）位于显示区域内，消除了无法显示的外部引线连接区域，消除了显示面板的边框。

Description

显示面板和显示装置
本申请要求于2019年11月27日提交中国专利局、申请号为201911180488.X、发明名称为“显示面板和显示装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及显示技术领域，尤其是涉及一种显示面板和显示装置。
 背景技术
现有LED（Light-Emitting Diode，发光二极管）显示屏采用Mini-LED（迷你发光二极管）或者Micro-LED（微型发光二极管）作为发光层，将Mini-LED和Micro-LED设置在驱动背板上，使得驱动背板驱动Mini-LED或者Micro-LED发光，实现显示，在驱动背板上存在显示区域和外部引线连接区域，在显示区域和外部引线连接区域存在驱动电路，但由于外部引线连接区域无法显示，使得LED显示屏存在边框，影响观看。
所以，现有LED显示屏存在外部引线区域较大，导致边框较大的技术问题。
 技术问题
本申请提供一种显示面板和显示装置，用于解决现有LED显示屏存在外部引线区域较大，导致边框较大的技术问题。
 技术解决方案
为解决上述问题，本申请提供的技术方案如下：
本申请提供一种显示面板，该显示面板包括：
基板；
驱动电路层，与所述基板贴合设置，包括驱动电路，所述驱动电路包括第一部分、第二部分以及连接所述第一部分和第二部分的连接部分，所述第一部分设置于基板的一侧，所述第二部分设置于所述基板远离所述第一部分的一侧；
发光层，设置于所述第一部分远离基板的一侧，与所述第一部分连接；
封装层，设置于所述发光层远离所述第一部分的一侧；
其中，所述第二部分在所述基板上的投影区域位于所述第一部分在所述基板上的投影区域内。
在本申请提供的显示面板中，所述基板包括第一基板、第二基板、以及设置于所述第一基板和第二基板之间的光学胶，所述第一部分设置于所述第一基板远离所述第二基板的一侧，所述第二部分设置于所述第二基板远离所述第一基板的一侧。
在本申请提供的显示面板中，所述第一基板的尺寸与所述第二基板的尺寸相同。
在本申请提供的显示面板中，所述第一基板上设有第一对位端子，所述第二基板上设有与所述第一对位端子配合的第二对位端子。
在本申请提供的显示面板中，所述第一对位端子包括凸起，所述第二对位端子包括与所述第一对位端子配合的凹槽。
在本申请提供的显示面板中，所述第一对位端子包括凹槽，所述第二对位端子包括与所述第一对位端子配合的凸起。
在本申请提供的显示面板中，所述驱动电路的第二部分包括静电防护电路，所述静电防护电路设置于所述基板下侧，所述基板包括上侧面、下侧面、左侧面和右侧面，所述连接部分设置于所述基板的下侧面。
在本申请提供的显示面板中，所述驱动电路的第二部分包括栅极驱动电路，所述栅极驱动电路设置于所述基板两侧，所述基板包括上侧面、下侧面、左侧面和右侧面，所述连接部分设置于所述基板的左侧面和右侧面。
在本申请提供的显示面板中，所述发光层包括迷你发光二极管芯片，所述迷你发光二极管芯片包括红色迷你发光二极管芯片、绿色迷你发光二极管芯片和蓝色迷你发光二极管芯片。
在本申请提供的显示面板中，述连接部分包括多条连接线和位于所述连接线两端的绑定端子，所述绑定端子分别与第一部分和第二部分连接。
同时，本申请提供一种显示装置，该显示装置包括：
显示面板，所述显示面板包括基板、驱动电路层、发光层和封装层，所述驱动电路层与所述基板贴合设置，包括驱动电路，所述驱动电路包括第一部分、第二部分以及连接所述第一部分和第二部分的连接部分，所述第一部分设置于基板的一侧，所述第二部分设置于所述基板远离所述第一部分的一侧；所述发光层设置于所述第一部分远离基板的一侧，与所述第一部分连接；所述封装层设置于所述发光层远离所述第一部分的一侧；其中，所述第二部分在所述基板上的投影区域位于所述第一部分在所述基板上的投影区域内；
覆晶薄膜，所述覆晶薄膜与所述第二部分连接。
在本申请提供的显示装置中，所述第二部分包括金属走线和连接端子，所述覆晶薄膜与所述连接端子连接。
在本申请提供的显示装置中，所述基板包括第一基板、第二基板、以及设置于所述第一基板和第二基板之间的光学胶，所述第一部分设置于所述第一基板远离所述第二基板的一侧，所述第二部分设置于所述第二基板远离所述第一基板的一侧。
在本申请提供的显示装置中，所述第一基板的尺寸与所述第二基板的尺寸相同。
在本申请提供的显示装置中，所述第一基板上设有第一对位端子，所述第二基板上设有与所述第一对位端子配合的第二对位端子。
在本申请提供的显示装置中，所述第一对位端子包括凸起，所述第二对位端子包括与所述第一对位端子配合的凹槽。
在本申请提供的显示装置中，所述驱动电路的第二部分包括静电防护电路，所述静电防护电路设置于所述基板下侧，所述基板包括上侧面、下侧面、左侧面和右侧面，所述连接部分设置于所述基板的下侧面。
在本申请提供的显示装置中，所述驱动电路的第二部分包括栅极驱动电路，所述栅极驱动电路设置于所述基板两侧，所述基板包括上侧面、下侧面、左侧面和右侧面，所述连接部分设置于所述基板的左侧面和右侧面。
在本申请提供的显示装置中，所述发光层包括迷你发光二极管芯片，所述迷你发光二极管芯片包括红色迷你发光二极管芯片、绿色迷你发光二极管芯片和蓝色迷你发光二极管芯片。
在本申请提供的显示装置中，所述连接部分包括多条连接线和位于所述连接线两端的绑定端子，所述绑定端子分别与第一部分和第二部分连接。
 有益效果
本申请提供一种显示面板和显示装置，该显示面板包括基板、驱动电路层、发光层和封装层，所述驱动电路层与所述基板贴合设置，包括驱动电路，所述驱动电路包括第一部分、第二部分以及连接所述第一部分和第二部分的连接部分，所述第一部分设置于基板的一侧，所述第二部分设置于所述基板远离所述第一部分的一侧；所述发光层设置于所述第一部分远离基板的一侧，与所述第一部分连接；所述封装层设置于所述发光层远离所述第一部分的一侧；其中，所述第二部分在所述基板上的投影区域位于所述第一部分在所述基板上的投影区域内；通过将驱动电路层的驱动电路划分为第一部分、第二部分和连接部分，使得第一部分位于基板的一侧，第二部分位于基板的另一侧，且使得第二部分在基板上的投影区域位于第一部分在基板上的投影区域内，从而使得第二部分位于显示区域内，从而消除了无法显示的外部引线连接区域，消除了显示面板的边框，从而解决了现有LED显示屏存在外部引线区域较大，导致边框较大的技术问题。
 附图说明
图1为现有显示装置示意图。
图2为本申请实施例提供的显示面板的第一示意图。
图3为本申请实施例提供的显示面板的第二示意图。
图4为本申请实施例提供的基板的示意图。
图5为本申请实施例提供的显示面板的第三示意图。
图6为本申请实施例提供的显示装置的示意图。
图7为本申请实施例提供的显示面板的制备方法的流程图。
图8为本申请实施例提供的显示面板的制备方法对应的显示面板的状态图。
 本发明的实施方式
本申请提供一种显示面板和显示装置，为使本申请的目的、技术方案及效果更加清楚、明确，以下参照附图并举实施例对本申请进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本申请，并不用于限定本申请。
本申请针对现有LED显示屏存在外部引线区域较大，导致边框较大的技术问题，本申请实施例用以解决该问题。
如图1 所示，现有LED显示装置包括基板11、位于基板上的驱动电路层13、位于驱动电路层的发光芯片14和位于发光芯片上的封装层15，覆晶薄膜12与驱动电路层13连接，其中，驱动电路层13的驱动电路从显示区161延伸至外部引线连接区162与覆晶薄膜12连接，由于外部引线区域较大，且外部引线区域无法显示，导致LED显示屏的边框较大，即现有LED显示屏存在外部引线区域较大，导致边框较大的技术问题。
如图2所示，本申请实施例提供一种显示面板，该显示面板包括：
基板21；
驱动电路层22，与所述基板21贴合设置，包括驱动电路，所述驱动电路包括第一部分221、第二部分222以及连接所述第一部分221和第二部分222的连接部分223，所述第一部分221设置于基板21的一侧，所述第二部分222设置于所述基板21远离所述第一部分221的一侧；
发光层23，设置于所述第一部分221远离基板21的一侧，与所述第一部分221连接；
封装层24，设置于所述发光层23远离所述第一部分221的一侧；
其中，所述第二部分222在所述基板21上的投影区域位于所述第一部分221在所述基板21上的投影区域内。
本申请实施例提供一种显示面板，该显示面板包括基板、驱动电路层、发光层和封装层，所述驱动电路层与所述基板贴合设置，包括驱动电路，所述驱动电路包括第一部分、第二部分以及连接所述第一部分和第二部分的连接部分，所述第一部分设置于基板的一侧，所述第二部分设置于所述基板远离所述第一部分的一侧；所述发光层设置于所述第一部分远离基板的一侧，与所述第一部分连接；所述封装层设置于所述发光层远离所述第一部分的一侧；其中，所述第二部分在所述基板上的投影区域位于所述第一部分在所述基板上的投影区域内；通过将驱动电路层的驱动电路划分为第一部分、第二部分和连接部分，使得第一部分位于基板的一侧，第二部分位于基板的另一侧，且使得第二部分在基板上的投影区域位于第一部分在基板上的投影区域内，从而使得第二部分位于显示区域内，从而消除了无法显示的外部引线连接区域，消除了显示面板的边框，从而解决了现有LED显示屏存在外部引线区域较大，导致边框较大的技术问题。
需要说明的是，投影区域指驱动电路的第一部分或者第二部分的走线的投影构成的最大的区域，即在第二部分的走线的投影不落在第一部分的走线的投影上时，但第二部分的走线的投影落在第一部分的走线的投影构成的最大的区域内，这时，第二部分的投影也位于第一部分的投影区域内。
在一种实施例中，如图3所示，所述基板21包括第一基板211、第二基板212、以及设置于所述第一基板211和第二基板212之间的光学胶，所述第一部分221设置于所述第一基板211远离所述第二基板212的一侧，所述第二部分222设置于所述第二基板212远离所述第一基板211的一侧，为了将驱动电路的第一部分和第二部分都放置在显示区内，在一种情况下，可以分别在基板的正面和背面制备驱动的第一部分和第二部分，从而使得驱动电路的第一部分与第二部分均位于显示区，或者将基板划分为第一基板和第二基板，使得分别在第一基板和第二基板上形成驱动电路的第一部分和第二部分，然后通过光学胶将第一基板和第二基板连接起来，使得分别制备驱动电路的第一部分和第二部分，从而避免在基板的正面制备完成第一部分后，在背面制备第二部分时，损伤第一部分，使得制备过程较为简单，且制备得到的驱动电路的第一部分和第二部分完整。
在一种实施例中，所述第一基板的尺寸与所述第二基板的尺寸相同，即第一基板的长度与第二基板的长度相等、第一基板的宽度与第二基板的宽度相等，第一基板的厚度与第二基板的厚度相等，第一基板的尺寸与第二基板的尺寸相同，使得提供第一基板和第二基板时，选择相同的基板作为第一基板和第二基板即可，第一基板和第二基板的尺寸相同，同时可以根据基板的厚度需求选择第一基板的厚度，使得得到的基板厚度不会太厚导致显示面板过厚，也不会由于基板过薄导致基板损伤，同时，得到的基板是四侧对齐的基板，不会出现基板有超出的部分。
在一种实施例中，所述第一基板上设有第一对位端子，所述第二基板上设有与所述第一对位端子配合的第二对位端子，在第一基板与第二基板贴合形成基板时，需要使得第一基板与第二基板准确贴合，可分别在第一基板上设置第一对位端子，在第二基板上设置第二对位端子，使得第一对位端子和第二对位端子配合，从而使得第一基板与第二基板准确贴合，其中，对位端子可以采取凹槽与凸起的配合方式配合，例如第一对位端子为凸起，第二对位端子为与所述凸起配合的凹槽；或者第一对位端子为凹槽，第二对位端子为与所述凹槽配合的凸起，从而使得第一基板和第二基板通过第一对位端子和第二对位端子对位，需要说明的是，考虑到第一基板和第二基板之间设有粘合的光学胶，在将光学胶涂布到第一基板或者第二基板上时，需要将第一对位端子或者第二对位端子露出，从而使得第一对位端子与第二对位端子配合对位。
在一种实施例中，可以在第一基板和第二基板的侧面设置刻度、可在第一基板和第二基板的相应的两个相邻的侧面设置刻度，或者在第一基板和第二基板的相应四个侧面设置刻度，通过将刻度对齐，使得第一基板和第二基板对齐。
如图4所示，本申请实施例提供一种基板，该基板21包括上侧411、下侧412、左侧413、右侧414、上侧面、下侧面415、左侧面、右侧面416，所述上侧与下侧相对，所述左侧与右侧相对，所述上侧面与下侧面相对，所述左侧面与右侧面相对。
在一种实施例中，如图5所示，所述驱动电路的第二部分包括静电防护电路512，所述静电防护电路512设置于所述基板21下侧，所述基板包括上侧面、下侧面、左侧面和右侧面，所述连接部分设置于所述基板的下侧面，在现有显示面板中，会将静电防护电路放置在显示面板的下侧非显示区中，从而造成显示面板的下侧存在边框，本申请实施例通过将静电防护电路放置在基板的下侧，使得静电防护电路位于显示面板的显示区内，然后通过在基板背面的下侧面设置连接部分，使得连接部分将静电防护电路与基板正面的第一部分连接，从而使得静电防护电路正常工作，从而在不影响静电防护电路工作的同时，减小显示面板的下边框的宽度。
在一种实施例中，如图5所示，所述驱动电路的第二部分包括栅极驱动电路511，所述栅极驱动电路211设置于所述基板21两侧，所述基板包括上侧面、下侧面、左侧面和右侧面，所述连接部分设置于所述基板的左侧面和右侧面，在现有技术中，会在显示面板的两侧非显示区设置栅极驱动电路，从而使得两侧无需使用芯片，但栅极驱动电路同样会造成显示面板存在两侧的边框，本申请实施例通过将栅极驱动电路设置于基板背面的左侧和右侧，然后将连接部分设置在基板的左侧面和右侧面，使得栅极驱动电路与第一部分连接，从而使得栅极驱动电路正常工作的同时，显示面板的左右边框减小。
在一种实施例中，所述发光层包括迷你发光二极管芯片，所述迷你发光二极管芯片包括红色迷你发光二极管芯片、绿色迷你发光二极管芯片和蓝色迷你发光二极管芯片；在发光层的设置中，以红色迷你发光二极管芯片、绿色迷你发光二极管芯片、蓝色迷你发光二极管芯片作为发光源，通过将三种迷你发光二极管芯片与驱动电路连接，使得驱动电路驱动迷你发光二极管芯片发光，从而使得发光层发出各种色彩的光线，从而实现画面显示。
在一种实施例中，所述发光层包括微型发光二极管芯片，所述微型发光二极管芯片包括红色微型发光二极管芯片、绿色微型发光二极管芯片和蓝色微型发光二极管芯片。
在一种实施例中，所述连接部分包括多条连接线和位于所述连接线两端的绑定端子，所述绑定端子分别与第一部分和第二部分连接；在设置连接部分时，可将连接部分的连接线的两端设置在绑定端子内，然后将绑定端子分别与第一部分的走线的一端和第二部分的走线的一端连接，从而实现第一部分和第二部分的正常连接，从而使得第一部分、第二部分、连接部分形成完整的驱动电路，使得显示面板正常工作。
如图6所示，本申请实施例提供一种显示装置，该显示装置包括：
显示面板，所述显示面板包括基板21、驱动电路层22、发光层23和封装层24，所述驱动电路层22与所述基板21贴合设置，包括驱动电路，所述驱动电路包括第一部分221、第二部分222以及连接所述第一部分221和第二部分222的连接部分223，所述第一部分221设置于基板21的一侧，所述第二部分222设置于所述基板21远离所述第一部分221的一侧；所述发光层23设置于所述第一部分221远离基板21的一侧，与所述第一部分221连接；所述封装层24设置于所述发光层23远离所述第一部分221的一侧；其中，所述第二部分222在所述基板21上的投影区域位于所述第一部分221在所述基板21上的投影区域内；
覆晶薄膜61，所述覆晶薄膜61与所述第二部分222连接。
本申请实施例提供一种显示装置，该显示装置包括显示面板和覆晶薄膜，所述显示面板包括基板、驱动电路层、发光层和封装层，所述驱动电路层与所述基板贴合设置，包括驱动电路，所述驱动电路包括第一部分、第二部分以及连接所述第一部分和第二部分的连接部分，所述第一部分设置于基板的一侧，所述第二部分设置于所述基板远离所述第一部分的一侧；所述发光层设置于所述第一部分远离基板的一侧，与所述第一部分连接；所述封装层设置于所述发光层远离所述第一部分的一侧；其中，所述第二部分在所述基板上的投影区域位于所述第一部分在所述基板上的投影区域内；所述覆晶薄膜与所述第二部分连接；通过将驱动电路层的驱动电路划分为第一部分、第二部分和连接部分，使得第一部分位于基板的一侧，第二部分位于基板的另一侧，且使得第二部分在基板上的投影区域位于第一部分在基板上的投影区域内，从而使得第二部分位于显示区域内，从而消除了无法显示的外部引线连接区域，消除了显示面板的边框，从而解决了现有LED显示屏存在外部引线区域较大，导致边框较大的技术问题。
在一种实施例中，所述第二部分包括金属走线和连接端子，所述覆晶薄膜与所述连接端子连接，在覆晶薄膜与驱动电路连接，从而控制驱动电路时，将覆晶薄膜与第二部分的连接端子连接，由于第二部分通过连接部分与第一部分连接，使得覆晶薄膜控制驱动电路工作，进而控制显示装置显示。
在一种实施例中，在所述显示装置中，所述基板包括第一基板、第二基板、以及设置于所述第一基板和第二基板之间的光学胶，所述第一部分设置于所述第一基板远离所述第二基板的一侧，所述第二部分设置于所述第二基板远离所述第一基板的一侧。
在一种实施例中，在所述显示装置中，所述第一基板的尺寸与所述第二基板的尺寸相同。
在一种实施例中，在所述显示装置中，所述第一基板上设有第一对位端子，所述第二基板上设有与所述第一对位端子配合的第二对位端子。
在一种实施例中，在所述显示装置中，所述第一对位端子包括凸起，所述第二对位端子包括与所述第一对位端子配合的凹槽。
在一种实施例中，在所述显示装置中，所述第一对位端子包括凹槽，所述第二对位端子包括与所述第一对位端子配合的凸起。
在一种实施例中，在所述显示装置中，所述驱动电路的第二部分包括静电防护电路，所述静电防护电路设置于所述基板下侧，所述基板包括上侧面、下侧面、左侧面和右侧面，所述连接部分设置于所述基板的下侧面。
在一种实施例中，在所述显示装置中，所述驱动电路的第二部分包括栅极驱动电路，所述栅极驱动电路设置于所述基板两侧，所述基板包括上侧面、下侧面、左侧面和右侧面，所述连接部分设置于所述基板的左侧面和右侧面。
在一种实施例中，在所述显示装置中，所述发光层包括迷你发光二极管芯片，所述迷你发光二极管芯片包括红色迷你发光二极管芯片、绿色迷你发光二极管芯片和蓝色迷你发光二极管芯片。
在一种实施例中，在所述显示装置中，所述连接部分包括多条连接线和位于所述连接线两端的绑定端子，所述绑定端子分别与第一部分和第二部分连接。
如图7所示，本申请实施例提供一种显示面板制备方法，该显示面板制备方法包括：
S1，提供第一基板和第二基板；
S2，分别在所述第一基板制备驱动电路的第一部分、在所述第二基板上制备驱动电路的第二部分；
S3，将设有第一部分的第一基板与设有第二部分的第二基板通过光学胶贴合，所述第一部分设置于所述第一基板远离所述第二基板的一侧，所述第二部分设置于所述第二基板远离所述第一基板的一侧；
S4，在第一基板、第二基板和光学胶的侧面形成驱动电路的连接部分，所述连接部分连接第一部分和第二部分，所述第一部分、第二部分和连接部分形成驱动电路，所述驱动电路形成驱动电路层；
S5，在所述第一部分上形成发光层；
S6，在所述发光层上形成封装层。
本申请实施例提供一种显示面板的制备方法，该显示面板的制备方法制备的显示面板包括基板、驱动电路层、发光层和封装层，所述驱动电路层与所述基板贴合设置，包括驱动电路，所述驱动电路包括第一部分、第二部分以及连接所述第一部分和第二部分的连接部分，所述第一部分设置于基板的一侧，所述第二部分设置于所述基板远离所述第一部分的一侧；所述发光层设置于所述第一部分远离基板的一侧，与所述第一部分连接；所述封装层设置于所述发光层远离所述第一部分的一侧；其中，所述第二部分在所述基板上的投影区域位于所述第一部分在所述基板上的投影区域内；通过将驱动电路层的驱动电路划分为第一部分、第二部分和连接部分，使得第一部分位于基板的一侧，第二部分位于基板的另一侧，且使得第二部分在基板上的投影区域位于第一部分在基板上的投影区域内，从而使得第二部分位于显示区域内，从而消除了无法显示的外部引线连接区域，消除了显示面板的边框，从而解决了现有LED显示屏存在外部引线区域较大，导致边框较大的技术问题。
在一种实施例中，制备所述连接部分的步骤包括使用喷墨打印或者印刷形成连接部分。
如图8所示，图8中的（a）为对应图7中的步骤S1的显示面板状态图；图8中的（b）为对应图7中的步骤S2的显示面板的状态图；图8中的（c）为对应图7中的步骤S3的显示面板的状态图；图8中的（d）为对应图7中的步骤S4的显示面板的状态图。
根据以上实施例可知：
本申请实施例提供一种显示面板及其制备方法、显示装置，该显示面板包括基板、驱动电路层、发光层和封装层，所述驱动电路层与所述基板贴合设置，包括驱动电路，所述驱动电路包括第一部分、第二部分以及连接所述第一部分和第二部分的连接部分，所述第一部分设置于基板的一侧，所述第二部分设置于所述基板远离所述第一部分的一侧；所述发光层设置于所述第一部分远离基板的一侧，与所述第一部分连接；所述封装层设置于所述发光层远离所述第一部分的一侧；其中，所述第二部分在所述基板上的投影区域位于所述第一部分在所述基板上的投影区域内；通过将驱动电路层的驱动电路划分为第一部分、第二部分和连接部分，使得第一部分位于基板的一侧，第二部分位于基板的另一侧，且使得第二部分在基板上的投影区域位于第一部分在基板上的投影区域内，从而使得第二部分位于显示区域内，从而消除了无法显示的外部引线连接区域，消除了显示面板的边框，从而解决了现有LED显示屏存在外部引线区域较大，导致边框较大的技术问题。
可以理解的是，对本领域普通技术人员来说，可以根据本申请的技术方案及其发明构思加以等同替换或改变，而所有这些改变或替换都应属于本申请所附的权利要求的保护范围。

Claims (20)

  1. 一种显示面板，其包括：
    基板；
    驱动电路层，与所述基板贴合设置，包括驱动电路，所述驱动电路包括第一部分、第二部分以及连接所述第一部分和第二部分的连接部分，所述第一部分设置于基板的一侧，所述第二部分设置于所述基板远离所述第一部分的一侧；
    发光层，设置于所述第一部分远离基板的一侧，与所述第一部分连接；
    封装层，设置于所述发光层远离所述第一部分的一侧；
    其中，所述第二部分在所述基板上的投影区域位于所述第一部分在所述基板上的投影区域内。
  2. 如权利要求1所述的显示面板，其中，所述基板包括第一基板、第二基板、以及设置于所述第一基板和第二基板之间的光学胶，所述第一部分设置于所述第一基板远离所述第二基板的一侧，所述第二部分设置于所述第二基板远离所述第一基板的一侧。
  3. 如权利要求2所述的显示面板，其中，所述第一基板的尺寸与所述第二基板的尺寸相同。
  4. 如权利要求3所述的显示面板，其中，所述第一基板上设有第一对位端子，所述第二基板上设有与所述第一对位端子配合的第二对位端子。
  5. 如权利要求4所述的显示面板，其中，所述第一对位端子包括凸起，所述第二对位端子包括与所述第一对位端子配合的凹槽。
  6. 如权利要求4所述的显示面板，其中，所述第一对位端子包括凹槽，所述第二对位端子包括与所述第一对位端子配合的凸起。
  7. 如权利要求1所述的显示面板，其中，所述驱动电路的第二部分包括静电防护电路，所述静电防护电路设置于所述基板下侧，所述基板包括上侧面、下侧面、左侧面和右侧面，所述连接部分设置于所述基板的下侧面。
  8. 如权利要求1所述的显示面板，其中，所述驱动电路的第二部分包括栅极驱动电路，所述栅极驱动电路设置于所述基板两侧，所述基板包括上侧面、下侧面、左侧面和右侧面，所述连接部分设置于所述基板的左侧面和右侧面。
  9. 如权利要求1所述的显示面板，其中，所述发光层包括迷你发光二极管芯片，所述迷你发光二极管芯片包括红色迷你发光二极管芯片、绿色迷你发光二极管芯片和蓝色迷你发光二极管芯片。
  10. 如权利要求1所述的显示面板，其中，所述连接部分包括多条连接线和位于所述连接线两端的绑定端子，所述绑定端子分别与第一部分和第二部分连接。
  11. 一种显示装置，其包括：
    显示面板，所述显示面板包括基板、驱动电路层、发光层和封装层，所述驱动电路层与所述基板贴合设置，包括驱动电路，所述驱动电路包括第一部分、第二部分以及连接所述第一部分和第二部分的连接部分，所述第一部分设置于基板的一侧，所述第二部分设置于所述基板远离所述第一部分的一侧；所述发光层设置于所述第一部分远离基板的一侧，与所述第一部分连接；所述封装层设置于所述发光层远离所述第一部分的一侧；其中，所述第二部分在所述基板上的投影区域位于所述第一部分在所述基板上的投影区域内；
    覆晶薄膜，所述覆晶薄膜与所述第二部分连接。
  12. 如权利要求11所述的显示装置，其中，所述第二部分包括金属走线和连接端子，所述覆晶薄膜与所述连接端子连接。
  13. 如权利要求11所述的显示装置，其中，所述基板包括第一基板、第二基板、以及设置于所述第一基板和第二基板之间的光学胶，所述第一部分设置于所述第一基板远离所述第二基板的一侧，所述第二部分设置于所述第二基板远离所述第一基板的一侧。
  14. 如权利要求13所述的显示装置，其中，所述第一基板的尺寸与所述第二基板的尺寸相同。
  15. 如权利要求14所述的显示装置，其中，所述第一基板上设有第一对位端子，所述第二基板上设有与所述第一对位端子配合的第二对位端子。
  16. 如权利要求15所述的显示装置，其中，所述第一对位端子包括凸起，所述第二对位端子包括与所述第一对位端子配合的凹槽。
  17. 如权利要求11所述的显示装置，其中，所述驱动电路的第二部分包括静电防护电路，所述静电防护电路设置于所述基板下侧，所述基板包括上侧面、下侧面、左侧面和右侧面，所述连接部分设置于所述基板的下侧面。
  18. 如权利要求11所述的显示装置，其中，所述驱动电路的第二部分包括栅极驱动电路，所述栅极驱动电路设置于所述基板两侧，所述基板包括上侧面、下侧面、左侧面和右侧面，所述连接部分设置于所述基板的左侧面和右侧面。
  19. 如权利要求11所述的显示装置，其中，所述发光层包括迷你发光二极管芯片，所述迷你发光二极管芯片包括红色迷你发光二极管芯片、绿色迷你发光二极管芯片和蓝色迷你发光二极管芯片。
  20. 如权利要求11所述的显示装置，其中，所述连接部分包括多条连接线和位于所述连接线两端的绑定端子，所述绑定端子分别与第一部分和第二部分连接。
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