WO2021102686A1 - 均温板及其制造方法 - Google Patents
均温板及其制造方法 Download PDFInfo
- Publication number
- WO2021102686A1 WO2021102686A1 PCT/CN2019/120971 CN2019120971W WO2021102686A1 WO 2021102686 A1 WO2021102686 A1 WO 2021102686A1 CN 2019120971 W CN2019120971 W CN 2019120971W WO 2021102686 A1 WO2021102686 A1 WO 2021102686A1
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- WO
- WIPO (PCT)
- Prior art keywords
- copper
- body portion
- copper foil
- foil layer
- thermally conductive
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 title claims abstract description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 94
- 239000011889 copper foil Substances 0.000 claims abstract description 84
- 239000000758 substrate Substances 0.000 claims abstract description 72
- 239000000543 intermediate Substances 0.000 claims abstract description 45
- 239000012530 fluid Substances 0.000 claims abstract description 36
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 31
- 238000009713 electroplating Methods 0.000 claims abstract description 18
- 238000003466 welding Methods 0.000 claims abstract description 7
- 238000003825 pressing Methods 0.000 claims abstract 2
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000003860 storage Methods 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- -1 polypropylene Polymers 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920006380 polyphenylene oxide Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- C25D7/00—Electroplating characterised by the article coated
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
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Definitions
- the application relates to a uniform temperature plate and a manufacturing method thereof.
- the electronic component generates a large amount of heat during the working process. If the heat is not conducted in time, it will accumulate inside the electronic component, causing the temperature of the electronic component to increase, affecting its performance, and even damaging the electronic component. Therefore, the industry has been committed to the development of various heat dissipation components to solve the heat dissipation problem of electronic components, and a temperature equalizing plate is a very common type of heat dissipation component.
- the commonly used temperature equalizing plate is mainly composed of a shell, a working fluid and a supporting structure.
- a hollow accommodating cavity is formed inside the housing, and the accommodating cavity is filled with working fluid.
- the working fluid absorbs the heat dissipated by the electronic components and then turns into steam. When it is cold, it becomes a liquid and can be recycled.
- the phase change of the working fluid is used to transfer heat to achieve the effect of heat dissipation.
- the commonly used uniform temperature plate usually adds a metal mesh or metal fiber to increase the storage capacity of the working fluid.
- the metal mesh or metal fiber must be combined with the shell. The body is connected as a whole, resulting in complicated structural parts of the temperature equalization plate and many manufacturing processes.
- the present application provides a uniform temperature plate, which has the characteristics of low thermal resistance, simple structure, and convenient manufacture.
- a method for manufacturing a temperature equalizing plate including the steps:
- a copper-clad substrate is provided, and the copper-clad substrate includes a copper foil layer.
- a photoresist layer is pressed on the copper foil layer, and the photoresist layer covers the copper foil layer.
- the photoresist layer is exposed and developed to form an outer opening and a plurality of inner openings, the outer opening surrounds the plurality of inner openings, and the copper foil layer is exposed to the outer opening and the plurality of inner openings Open up.
- Electroplating is performed on the plurality of inner openings to form a plurality of thermally conductive bumps, and electroplating is performed on the outer openings to form a connecting bump, the connecting bump surrounds the plurality of thermally conductive bumps, each of the thermally conductive bumps Comprising a first body portion and a first cover body portion electrically connected to the first body portion, the first body portion is filled in the inner opening and one side is electrically connected to the copper foil layer, the The first cover part is electrically connected to the other side of the first body part away from the copper foil layer, and the width of the first cover part is greater than the width of the first body part.
- the photoresist layer is removed to obtain an intermediate.
- the two intermediates are stacked so that the connecting bump of one of the intermediates corresponds to the connecting bump of the other intermediate, and then the two corresponding connecting bumps are welded to connect the two
- a closed chamber is generated between the intermediates, a vacuum is drawn in the closed chamber, and working fluid is injected into the closed chamber to obtain the uniform temperature plate.
- the connecting bump includes a second body portion and a second cover body portion electrically connected to the second body portion, and the second body portion is filled in the outer opening and is electrically connected to the A copper foil layer, the second cover body part is electrically connected to the other side of the second body part away from the copper foil layer, and the width of the second cover body part is larger than the second body part.
- the height of the first body portion and the second body portion are the same, and the first body portion is flush with the second body portion and the photoresist layer.
- the roughness Rz of the outer surface of the second cover is less than 2 microns.
- the shape of the first body portion is a rectangular parallelepiped, the length of the bottom surface of each first body portion is 20-300 microns, the width of the bottom surface is 20-300 microns, and the height of the first body portion is 25-300 microns. 60 micrometers, and the distance between two adjacent first body parts is 30-300 micrometers.
- a method for manufacturing a uniform temperature plate including:
- a copper-clad substrate is provided, and the copper-clad substrate includes a copper foil layer.
- a photoresist layer is laminated on the copper foil layer, and the photoresist layer covers the copper foil layer.
- the photoresist layer is exposed and developed to form an outer opening and a plurality of inner openings, the outer opening surrounds the plurality of inner openings, and the copper foil layer is exposed to the outer opening and the plurality of inner openings Open up.
- Electroplating is performed on the plurality of inner openings to form a plurality of thermally conductive bumps, and electroplating is performed on the outer openings to form a connecting bump, the connecting bump surrounds the plurality of thermally conductive bumps, each of the thermally conductive bumps Comprising a first body portion and a first cover body portion electrically connected to the first body portion, the first body portion is filled in the inner opening and one side is electrically connected to the copper foil layer, the The first cover part is electrically connected to the other side of the first body part away from the copper foil layer, and the width of the first cover part is greater than the width of the first body part.
- the photoresist layer is removed to obtain an intermediate.
- One of the intermediates and the other copper-clad substrate are laminated so that the connecting bumps of the intermediate are opposite to the copper foil layer of the copper-clad substrate, and then the connecting bumps and the copper-clad substrate are soldered.
- the copper foil layer generates a closed chamber between the intermediate body and the copper-clad substrate, vacuum is drawn in the closed chamber, and a working fluid is injected to obtain the uniform temperature plate.
- the method further includes:
- a capillary structure is arranged between the intermediate body and the copper-clad substrate.
- a temperature equalizing plate comprising two oppositely arranged copper-clad substrates, each of the copper-clad substrates includes a copper foil layer, and the copper foil layer of at least one of the copper-clad substrates faces the other of the copper-clad substrates.
- the copper substrate protrudes to form a plurality of thermally conductive bumps and a connecting bump.
- the connecting bumps surround the plurality of thermally conductive bumps.
- the connecting bumps of one copper-clad substrate are connected to the other through a solder body.
- the copper-clad substrate forms a cavity between the two copper-clad substrates, and the cavity contains a plurality of the thermally conductive bumps, and a working fluid is contained between the thermally conductive bumps.
- each of the copper-clad substrates is formed with the plurality of the thermally conductive bumps and one connecting bump, the connecting bump surrounds the plurality of thermally conductive bumps, and the two connecting bumps are opposite to each other.
- a closed cavity is formed between the two copper-clad substrates.
- a capillary structure is provided between the thermally conductive bumps and the copper foil layer.
- the conductive bumps are formed on the copper foil layer by electroplating, and the conductive bumps can enhance the thermal conductivity between the copper foil layer and the conductive bumps and reduce the thermal resistance.
- the outer surface of the conductive bump obtained by electroplating has a lower roughness, which is convenient for subsequent welding.
- the conductive bump includes a bump pillar and a bump cover, and the bump cover covers the area where the bump pillar is located and the area surrounding the bump pillar, and two adjacent bumps cover the area where the bump pillar is located and the area surrounding the bump pillar.
- Each of the conductive bumps and the copper foil layer between the two adjacent conductive bumps are jointly enclosed to form a fluid storage area, which is beneficial to increase the storage capacity of working fluid, and the bump pillars and The shape and size of the bump cover can be changed as required.
- FIG. 1 is a schematic diagram of the structure of a copper-clad substrate provided by the first embodiment of the present application.
- FIG. 2 is a schematic diagram of the structure of forming a photoresist layer on the copper-clad substrate shown in FIG. 1.
- FIG. 3 is a schematic diagram of the structure after etching on the photoresist layer of the copper-clad substrate shown in FIG. 2.
- FIG. 4 is a schematic diagram of the structure of the copper-clad substrate shown in FIG. 3 after electroplating is performed in the area to be electroplated.
- Fig. 5 is a schematic structural diagram of an intermediate provided by the first embodiment of the present application.
- Fig. 6 is a plan view of the intermediate body shown in Fig. 5.
- Fig. 7 is a schematic structural diagram of a first uniform temperature plate formed after two intermediates shown in Fig. 5 are superimposed.
- Fig. 8 is a schematic structural diagram of a second uniform temperature plate provided by a second embodiment of the present application.
- Fig. 9 is a schematic structural diagram of a third uniform temperature plate provided by a third embodiment of the present application.
- the first copper foil layer 101 is the first copper foil layer 101
- the first main body department 411 The first main body department 411
- the second main body department 421 The second main body department 421
- the first average temperature board 50a The first average temperature board 50a
- the third average temperature board 50c is the third average temperature board 50c.
- an element when an element is referred to as being “fixed to” another element, it can be directly on the other element or a central element may also be present.
- an element When an element is considered to be “connected” to another element, it can be directly connected to the other element or an intermediate element may be present at the same time.
- an element When an element is considered to be “disposed on” another element, it can be directly disposed on the other element or a centered element may exist at the same time.
- the first embodiment of the present application provides a manufacturing method of the first uniform temperature plate 50a (please refer to FIG. 7), which includes the following steps:
- the copper-clad substrate 10 is selected from any one of a double-sided copper-clad laminate or a single-sided copper-clad laminate.
- the copper-clad substrate 10 is a double-sided copper-clad laminate, and the copper-clad substrate 10 includes successive layers.
- a first copper foil layer 101, an insulating layer 102 and a second copper foil layer 103 are provided.
- the material of the insulating layer 102 can be selected from epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polypropylene (PP), and polyimide resin.
- Polyimide (PI) polyethylene terephthalate (PET), polyethylene naphthalate (PEN) and other resins.
- the copper-clad substrate 10 is a flexible copper-clad substrate, and the material of the insulating layer 102 is PI.
- the thickness of the insulating layer 102 made of PI is 5-50 microns, preferably 12 microns.
- a photoresist layer 30 is laminated on the first copper foil layer 101, and the photoresist layer 30 covers the first copper foil layer 101.
- the thickness of the photoresist layer 30 is 25-60 microns, preferably 40 microns.
- the photoresist layer 30 is exposed and developed to form an outer opening 311 and a plurality of inner openings 312, the outer opening 311 surrounds the plurality of inner openings 312, and the first copper
- the foil layer 101 is exposed to the outer opening 311 and the plurality of inner openings 312.
- the inner opening 311 is roughly rectangular parallelepiped, with a length of 20 micrometers to 300 micrometers, and a width of 20 micrometers to 300 micrometers.
- the length and width are both 50 micrometers.
- Each of the thermally conductive bumps 41 includes a first body portion 411 and a first cover portion 412 electrically connected to the first body portion 411.
- the first body portion 411 is filled in the inner opening 312 and One side is electrically connected to the first copper foil layer 101
- the first cover portion 412 is electrically connected to the other side of the first main body portion 411 away from the first copper foil layer 101
- the width of a cover portion 412 is greater than the width of the first body portion 411, so that the first cover portion 412 not only covers the first body portion 411, but also covers the photoresist layer 30 and surrounds the first body portion 411. A part of the main body 411.
- the connecting bump 42 includes a second body portion 421 and a second cover portion 422 electrically connected to the second body portion 421.
- the second body portion 421 is filled in the outer opening 311 and is electrically connected.
- the second cover portion 422 is electrically connected to the other side of the second body portion 421 away from the first copper foil layer 101, and the second cover
- the width of the portion 422 is greater than that of the second body portion 421, so that the second cover portion 422 not only covers the second body portion 421, but also covers the photoresist layer 30 surrounding the second body portion 421 section.
- the first body portion 411 and the second body portion 421 have the same height, and the first body portion 411 and the second body portion 421 are The photoresist layer 30 is flush.
- the height H1 of the first body portion 411 and the second body portion 421 is 25-60 microns, preferably 40 microns.
- the shape of the first body portion 411 is approximately a rectangular parallelepiped, and the length L of the bottom surface of the first body portion 411 is 20 to 300 microns, preferably 50 microns.
- the width D of the bottom surface of the first body portion 411 is 20-300 microns, preferably 50 microns.
- the first body portion 411 may be any of prisms, cylinders, elliptic cylinders, etc. Shape cylinder.
- the material of the thermally conductive bump 41 and the connecting bump 42 is copper. In other embodiments of the present application, the thermally conductive bump 41 and the connecting bump 42 are made of copper. The material can also be iron, silver, tin and other conductive metals.
- the two adjacent thermally conductive bumps 41 and the first copper foil layer 101 of the intermediate 50 are surrounded to form a fluid storage area 81, and the fluid storage area 81 is used for Store the working fluid 80 (see Figure 7).
- the end of the fluid storage area 81 adjacent to the first copper foil layer 101 is larger than the end away from the first copper foil layer 101, which is beneficial to increase the storage capacity of the working fluid 80.
- the cross-sectional shapes of the first cover portion 412 and the second cover portion 422 are the same, and both are approximately oval, and the second cover The height H2 of the portion 422 is 10-40 microns, preferably 15 microns.
- the cross-sectional shape of the first cover portion 412 and the second cover portion 422 may also be polygonal, Any shape such as an ellipse, and the cross-sectional shape of the first cover portion 412 and the second cover portion 422 may also be different.
- the cross-section of the first cover portion 412 may be a rectangle, and the first cover portion 412 may have a rectangular cross-section.
- the cross-sectional shape of the two cover parts 422 may be an ellipse.
- the distance S between two adjacent heat conducting bumps 41 is 30-300 microns, preferably 50 microns.
- the roughness Rz of the outer surface of the second cover portion 422 on the side away from the second main body portion 421 is less than 2 microns.
- the roughness Rz refers to the sum of the average value of the largest profile peak height and the average of the five largest profile valley depths within the sampling length of the outer surface of the second cover portion 422.
- step S5 the step of connecting two corresponding second cover portions 422 includes welding the corresponding second cover portions 422 to connect the second cover A solder body 90 is formed between the portions 422, and the solder body 90 fills the gap between the second cover portions 422 to form the closed cavity 70a. Since the surface roughness of the second cover portion 422 is relatively low (Rz ⁇ 2 microns), the corresponding second cover portion 422 and the solder body between the filler and the second cover portion 422 90 has good contact strength, so that the bonding strength of the two intermediates 50 can be improved.
- the surface roughness of the second cover portion 422 is high and not conducive to welding, it is necessary to weld between the two oppositely disposed first copper foil layers 101, which requires a higher capillary rate. Big bottom copper can be realized.
- the two intermediate bodies 50 can be welded together, so that the requirement for the selection of the bottom copper material can be reduced.
- the working fluid 80 in step S5 may be a low boiling point solvent such as water, ethanol, methanol.
- the second embodiment of the present application also provides a manufacturing method of the second uniform temperature plate 50b.
- one of the intermediates 50 and the other copper-clad substrate 10 may also be laminated, so that the second cover portion 422 of the intermediate 50 and the copper-clad substrate 10
- the first copper foil layer 101 faces each other, and then connects the second cover portion 422 on the outside and the first copper foil layer 101 to create a closed cavity between the intermediate 50 and the copper-clad substrate 10 70b, vacuum is drawn in the enclosed chamber 70b, and the working fluid 80 is injected to obtain the second uniform temperature plate 50b.
- the third embodiment of the present application also provides a method for manufacturing a third uniform temperature plate 50c.
- the method further includes disposing a capillary structure 60 between the intermediate body 50 and the copper-clad substrate 10.
- the capillary structure 60 may be disposed on the second cover portion 422 located in the center of the intermediate body 50, and the capillary structure 60 includes a metal mesh or metal fiber, such as a copper mesh or thin copper wire, and finally
- the third uniform temperature plate 50c is obtained, and since the height of the capillary structure 60 is slightly larger than the height of the solder body 90, the middle portion of the copper-clad substrate 10 protrudes to form an arc-shaped structure.
- the capillary structure 60 has more gaps (not shown in the figure), and the working fluid can be contained in the gaps, so that more working fluid can be accommodated. At the same time, the capillary structure 60 has an excellent thermal conductivity rate, which can further improve The heat transfer capability of the third uniform temperature plate 50c.
- the present application also provides a first uniform temperature plate 50a as described in the first embodiment.
- the first uniform temperature plate 50a includes two oppositely arranged copper-clad substrates 10, each of which is
- the copper substrate 10 includes a first copper foil layer 101, an insulating layer 102, and a second copper foil layer 103 stacked in sequence.
- the first copper foil layers 101 of the two copper-clad substrates 10 are arranged opposite to each other.
- the first copper foil layer 101 of each copper-clad substrate 10 protrudes toward the other copper-clad substrate 10 to form a plurality of thermally conductive bumps 41 and a connecting bump 42.
- the connecting bumps 42 surround the plurality of copper-clad substrates.
- thermally conductive bumps 41 two adjacent thermally conductive bumps 41 and the first copper foil layer 101 between the two adjacent thermally conductive bumps 41 are jointly enclosed to form a fluid storage area 81.
- the connecting bump 42 is connected by a solder body 90 to form a closed chamber 70 a between the two copper-clad substrates 10, and the closed chamber 70 a is filled with a working fluid 80.
- the present application also provides a second uniform temperature plate 50b as described in the second embodiment.
- the second uniform temperature plate 50b includes two oppositely disposed copper-clad substrates 10, each of which is
- the copper substrate 10 includes a first copper foil layer 101, an insulating layer 102, and a second copper foil layer 103 stacked in sequence.
- the first copper foil layers 101 of the two copper-clad substrates 10 are arranged opposite to each other.
- the first copper foil layer 101 of one of the copper-clad substrates 10 protrudes toward the other of the copper-clad substrate 10 to form a plurality of thermally conductive bumps 41 and a connecting bump 42.
- the connecting bumps 42 surround a plurality of The thermally conductive bumps 41, two adjacent thermally conductive bumps 41 and the first copper foil layer 101 between the two adjacent thermally conductive bumps 41 are jointly enclosed to form a fluid storage area 81, so
- the connecting bump 42 is connected to the first copper foil layer 101 of the other copper-clad substrate 10 through a solder body 90 to form a closed cavity 70b between the two copper-clad substrates 10, the closed cavity
- the chamber 70b is filled with a working fluid 80.
- the present application also provides a third uniform temperature plate 50c as described in the third embodiment.
- the third uniform temperature plate 50c further includes The capillary structure 60 between the thermally conductive bump 41 and the copper-clad substrate 10 is fixed on the thermally conductive bump 41, and the connecting bump 42 is connected to another through a solder body 90
- the first copper foil layer 101 of the copper-clad substrate 10 forms a closed cavity 70c between the two copper-clad substrates 10. Since the height of the capillary structure 60 is slightly larger than the height of the solder body 90, The middle part of the copper-clad substrate 10 protrudes to form an arc structure.
- the heat generated by the heating element is generated by the heating element 91 and the second copper foil layer 103
- the contacted area passes through the second copper foil layer 103 and the insulating layer 102 into the first copper foil layer 101, and the working fluid attached to the first copper foil layer 101 absorbs the heat and
- the working liquid that changes from liquid to gaseous state diffuses to other areas of the closed chamber 70a of the first uniform temperature plate 50a, and changes from gaseous state to liquid state, and releases heat in other areas.
- the heat generated by the heating element 91 is radiated from the first uniform temperature plate 50a to the area where the first uniform temperature plate 50a is located, which is beneficial to increase the heat dissipation rate.
- the thermal conductive bumps are formed on the copper foil layer by electroplating, and the thermal conductive bumps can enhance the thermal conductivity between the copper foil layer and the thermal conductive bumps and reduce the thermal resistance.
- the outer surface of the connecting bump obtained by electroplating has a lower roughness, which is convenient for subsequent welding.
- the thermally conductive bumps include a first body and a first cover, and the width of the first cover is greater than the width of the first body, so that two adjacent thermally conductive bumps and the
- the copper foil layers are jointly surrounded to form a fluid storage area, and the end of the fluid storage area near the first copper foil layer is larger than the end far away from the first copper foil layer, which is beneficial to increase the storage capacity of the working fluid, Moreover, the shape and size of the first body and the first cover can be changed as required.
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Abstract
本申请提出一种均温板的制造方法,包括:提供一具有铜箔层的覆铜基板,压合一光阻层,曝光,显影以形成一外侧开口及多个内侧开口;在多个内侧开口进行电镀形成多个导热凸块,在外侧开口进行电镀形成一连接凸块,所述连接凸块包围多个所述导热凸块,移除光阻层以获得一个中间体;将两个中间体层叠,使得其中一中间体的连接凸块与另一中间体的连接凸块对应,然后焊接两个相对应的连接凸块以在两个中间体之间产生封闭腔室,抽真空,向封闭腔室注入工作流体,即得到所述均温板。本申请提供通过电镀的方式在铜箔层上形成导电凸块可以明显增强铜箔层与导电凸块之间的导热效率,降低热阻。本申请还提供一种均温板。
Description
本申请涉及一种均温板及其制造方法。
电子元件在工作过程中会产生大量的热量,若这些热量未能及时传导出去将会累积于该电子元件的内部,导致该电子元件的温度升高并影响其效能,甚至损坏该电子元件。因此,业界一直致力于研发各种散热元件以解决电子元件的散热问题,均温板就是很常见的一种散热元件。
常用的均温板主要由壳体、工作流体及支撑结构构成。壳体内部形成有中空的容置腔,容置腔填充有工作流体。工作流体吸收电子元件散发的热量后变成蒸汽,遇冷后变成液态而可循环使用,通过工作流体发生相变进行热量的传递,达到散热的功效。
但是,常用的均温板为提高工作流体的储量,通常额外增加金属网或金属纤维以增大工作流体的存储量,而且为进一步降低热阻还必须将该金属网或金属纤维与所述壳体连成一体,导致均温板结构部件复杂且制作工艺较多。
发明内容
鉴于此,本申请提供一种均温板,该均温板具有热阻低,结构简单,制作方便的特点。
另,还有必要提供一种均温板的制造方法。
一种均温板的制造方法,包括步骤:
提供一覆铜基板,所述覆铜基板包括铜箔层。
在所述铜箔层上压合一光阻层,所述光阻层覆盖所述铜箔层。
对所述光阻层进行曝光,显影以形成一外侧开口及多个内侧开口,所述外侧开口包围所述多个内侧开口,所述铜箔层暴露于所述外侧开口及所述多个内侧开口。
在多个所述内侧开口进行电镀形成多个导热凸块,在所述外侧开口进行电镀形成一连接凸块,所述连接凸块包围多个所述导热凸块,每一所述导热凸块包括一第一主体部及电性连接所述第一主体部的一第一盖体部,所述第一主体部填充于所述内侧开口且一侧电性连接所述铜箔层,所述第一盖体部电性连接于所述第一主体部远离所述铜箔层的另一侧,所述第一盖体部的宽度大于所述第一主体部的宽度。
移除所述光阻层以获得一个中间体。
将两个所述中间体层叠,使得其中一所述中间体的所述连接凸块与另一所述中间体的连接凸块对应,然后焊接两个相对应的所述连接凸块以在两个所述中间体之间产生封闭腔室,并在所述封闭腔室内抽真空,向所述封闭腔室注入工作流体,即得到所述均温板。
进一步地,所述连接凸块包括一第二主体部及电性连接所述第二主体部的一第二盖体部,所述第二主体部填充于所述外侧开口且电性连接所述铜箔层,所述第二盖体部电性连接于所述第二主体部远离所述铜箔层的另一侧,且所述第二盖体部的宽度大于所述第二主体部。
进一步地,所述第一主体部与所述第二主体部的高度相同,且所述第一主体部与所述第二主体部和所述光阻层平齐。
进一步地,所述第二盖体的外表面的粗糙度Rz<2微米。
进一步地,所述第一主体部形状为长方体,每一所述第一主体部的底面长度为20~300微米,底面宽度度为20~300微米,所述第一主体部的高度为25~60微米,且相邻两个所述第一主体部的距离为30~300微米。
一种均温板的制造方法,包括:
提供一覆铜基板,所述覆铜基板包括铜箔层。
所述铜箔层上压合一光阻层,所述光阻层覆盖所述铜箔层。
对所述光阻层进行曝光,显影以形成一外侧开口及多个内侧开口,所述外侧开口包围所述多个内侧开口,所述铜箔层暴露于所述外侧开口及所述多个内侧开口。
在多个所述内侧开口进行电镀形成多个导热凸块,在所述外侧开口进行电镀形成一连接凸块,所述连接凸块包围多个所述导热凸块,每一所述导热凸块包括一第一主体部及电性连接所述第一主体部的一第一盖体部,所述第一主体部填充于所述内侧开口且一侧电性连接所述铜箔层,所述第一盖体部电性连接于所述第一主体部远离所述铜箔层的另一侧,所述第一盖体部的宽度大于所述第一主体部的宽度。
移除所述光阻层以获得一个中间体。
将一个所述中间体与另一所述覆铜基板层叠,使得所述中间体的所述连接凸块与所述覆铜基板的所述铜箔层相对,然后焊接所述连接凸块和所述铜箔层以在所述中间体和所述覆铜基板之间产生封闭腔室,并在所述封闭腔室内抽真空,注入工作流体,即得到所述均温板。
进一步地,在焊接所述连接凸块和所述铜箔层之前,还包括:
在所述中间体与所述覆铜基板之间设置毛细结构。
一种均温板,所述均温板包括两个相对设置的覆铜基板,每一所述覆铜基板包括铜箔层,至少一所述覆铜基板的铜箔层朝向另一所述覆铜基板凸出形成多个导热凸块及一个连接凸块,所述连接凸块包围多个所述导热凸块,一所述覆铜基板的所述连接凸块通过一焊锡体连接另一所述覆铜基板以在两个所述覆铜基板之间形成一腔室,所述腔室包容多个所述导热凸块,工作流体收容于所述导热凸块之间。
进一步地,每一所述覆铜基板均形成有所述多个所述导热凸块及一个连接凸块,所述连接凸块包围多个所述导热凸块,两个所述连接凸块相对应且 通过一焊锡体连接,从而在两个所述覆铜基板之间形成一封闭腔室。
进一步地,所述导热凸块及所述铜箔层之间的设置毛细结构。
本申请提供的均温板的制造方法具有以下优点:
(一)通过电镀的方式在所述铜箔层上形成导电凸块,所述导电凸块可以增强铜箔层与所述导电凸块之间的导热效率,降低热阻。
(二)通过电镀的方式获得的导电凸块的外表面具有较低的粗糙度,方便后续进行焊接。
(三)所述导电凸块包括凸块柱体及凸块盖体,且所述凸块盖体覆盖所述凸块柱体所在区域及围绕所述凸块柱体的区域,相邻的两个所述导电凸块及所述相邻两个导电凸块之间的所述铜箔层共同围设形成一流体储存区,有利于提高工作流体的储存量,而且所述凸块柱体及所述凸块盖体的形状及大小可以根据需要进行改变。
图1是本申请第一实施例提供的覆铜基板的结构示意图。
图2是在图1所示的覆铜基板上形成光阻层的结构示意图。
图3是在图2所示覆铜基板的光阻层上进行蚀刻后的结构示意图。
图4是在图3所示的覆铜基板的待电镀区进行电镀后的结构示意图。
图5是本申请第一实施例提供的中间体的结构示意图。
图6是图5所示的中间体的俯视图。
图7是两个图5所示的中间体叠合后形成的第一均温板的结构示意图。
图8是本申请第二实施例提供的第二均温板的结构示意图。
图9是本申请第三实施例提供的第三均温板的结构示意图。
主要元件符号说明
覆铜基板 10
第一铜箔层 101
绝缘层 102
第二铜箔层 103
光阻层 30
导热凸块 41
连接凸块 42
第一主体部 411
第一盖体部 412
第二主体部 421
第二盖体部 422
中间体 50
第一均温板 50a
第二均温板 50b
第三均温板 50c
毛细结构 60
封闭腔室 70a、70b、70c
工作流体 80
流体储存区 81
焊锡体 90
发热元件 91
如下具体实施方式将结合上述附图进一步说明本申请。
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域普通技术人员在没有作 出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。
需要说明的是,当元件被称为“固定于”另一个元件,它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件,它可以是直接连接到另一个元件或者可能同时存在居中元件。当一个元件被认为是“设置于”另一个元件,它可以是直接设置在另一个元件上或者可能同时存在居中元件。
除非另有定义,本文所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。本文中在本申请的说明书中所使用的术语只是为了描述具体的实施例的目的,不是旨在于限制本申请。
为能进一步阐述本申请达成预定目的所采取的技术手段及功效,以下结合附图及较佳实施方式,对本申请作如下详细说明。
本申请第一实施例提供一种第一均温板50a(请参见图7)的制作方法,包括以下步骤:
S1:请参见图1,提供一覆铜基板10。所述覆铜基板10选自双面覆铜板或单面覆铜板中的任意一种,在本实施例中,所述覆铜基板10为双面覆铜板,所述覆铜基板10包括依次层叠设置的一第一铜箔层101、一绝缘层102及一第二铜箔层103。
所述绝缘层102的材质可以选自环氧树脂(epoxy resin)、聚丙烯(polypropylene,PP)、BT树脂、聚苯醚(Polyphenylene Oxide,PPO)、聚丙烯(polypropylene,PP)、聚酰亚胺(polyimide,PI)、聚对苯二甲酸乙二醇酯(Polyethylene Terephthalate,PET)以及聚萘二甲酸乙二醇酯(Polyethylene Naphthalate,PEN)等树脂中的一种。在本实施例中,所述覆铜基板10为柔性的覆铜基板,所述绝缘层102的材质为PI。
本申请第一实施例中,PI材质的所述绝缘层102的厚度为5~50微米,优选地为12微米。
S2:请参见图2,在所述第一铜箔层101上压合一光阻层30,所述光阻层 30覆盖所述第一铜箔层101。
本申请第一实施例中,所述光阻层30的厚度为25~60微米,优选地为40微米。
S3:请参见图3,对所述光阻层30进行曝光,显影以形成一外侧开口311及多个内侧开口312,所述外侧开口311包围所述多个内侧开口312,所述第一铜箔层101暴露于所述外侧开口311及所述多个内侧开口312。
本申请第一实施例中,所述内侧开口311大致呈长方体状,长度为20微米~300微米,宽度为20微米~300微米,优选地,长度及宽度均为50微米。
S4:请参见图4,在多个所述内侧开口312进行电镀形成多个导热凸块41,在所述外侧开口311进行电镀形成一连接凸块42,所述连接凸块42包围多个所述导热凸块41。
每一所述导热凸块41包括一第一主体部411及电性连接所述第一主体部411的一第一盖体部412,所述第一主体部411填充于所述内侧开口312且一侧电性连接所述第一铜箔层101,所述第一盖体部412电性连接于所述第一主体部411远离所述第一铜箔层101的另一侧,所述第一盖体部412的宽度大于所述第一主体部411的宽度,使得所述第一盖体部412不仅覆盖所述第一主体部411,而且还覆盖所述光阻层30围绕所述第一主体部411的部分。
所述连接凸块42包括一第二主体部421及电性连接所述第二主体部421的一第二盖体部422,所述第二主体部421填充于所述外侧开口311且电性连接所述第一铜箔层101,所述第二盖体部422电性连接于所述第二主体部421远离所述第一铜箔层101的另一侧,且所述第二盖体部422的宽度大于所述第二主体部421,使得所述第二盖体部422不仅覆盖所述第二主体部421,而且还覆盖所述光阻层30围绕所述第二主体部421的部分。
在本申请第一实施例中,请参见图4,所述第一主体部411与所述第二主体部421高度相同,且所述第一主体部411与所述第二主体部421和所述光阻层30平齐,具体地,所述第一主体部411及所述第二主体部421的高度 H1为25~60微米,优选为40微米。
在本申请第一实施例中,请参见图6,所述第一主体部411形状大致为长方体,所述第一主体部411的底面长度L为20~300微米,优选为50微米,所述第一主体部411的底面宽度D度为20~300微米,优选为50微米,在本申请的其他实施例中,所述第一主体部411可以为棱柱体、圆柱体、椭圆柱体等任意形状柱体。
在本申请的其他实施例中,所述导热凸块41及所述连接凸块42的材质为铜,在本申请的其他实施例中,所述导热凸块41及所述连接凸块42的材质还可以是铁、银、锡等其他导电金属。
S5:请参见图5,移除所述光阻层30以获得一个中间体50。
在本申请第一实施例中,所述中间体50的相邻的两个所述导热凸块41及所述第一铜箔层101围设形成流体储存区81,所述流体储存区81用于储存工作流体80(请参见图7)。所述流体储存区81邻近所述第一铜箔层101的端部大于远离所述第一铜箔层101的端部,有利于提高工作流体80的储存量。
在本申请的第一实施例中,请参见图5,所述第一盖体部412及所述第二盖体部422的截面形状相同,均大致呈椭圆形,且所述第二盖体部422的高度H2为10~40微米,优选为15微米,在本申请的其他实施例中,所述第一盖体部412及所述第二盖体部422的截面形状也可以是多边形、椭圆形等任意形状,且所述第一盖体部412及所述第二盖体部422的截面形状也可以不同,例如,所述第一盖体部412的截面可以是长方形,所述第二盖体部422的截面形状可以是椭圆形。
在本申请第一实施例中,请参见图5,相邻两个所述导热凸块41的距离S为30~300微米,优选为50微米。
在本申请的第一实施例中,请参见图5,所述第二盖体部422远离所述第二主体部421一侧的外表面的粗糙度Rz<2微米。其中所述粗糙度Rz指在 第二盖体部422外表面的取样长度内最大的轮廓峰高的平均值与五个最大的轮廓谷深的平均值之和。
S6:请参见图7,将两个所述中间体50层叠,使得其中一所述中间体50的所述第二盖体部422与另一所述中间体50的第二盖体部422对应,然后连接两个相对应的所述第二盖体部422以在两个所述中间体50之间产生封闭腔室70a,并在所述封闭腔室70a内抽真空,向所述流体储存区81注入工作流体80,即得到所述第一均温板50a。在本申请第一实施例中,将两个所述中间体50层叠时,所述第一盖体部412相对应,在本申请的其他实施例中,两个所述中间体50的所述第一盖体部412还可以相互错开。
在本申请的第一实施例中,步骤S5中,连接两个相对应的所述第二盖体部422的步骤包括焊接对应的所述第二盖体部422以在所述第二盖体部422之间形成焊锡体90,所述焊锡体90填充于所述第二盖体部422之间的间隙以形成所述封闭腔室70a。由于所述第二盖体部422的表面粗糙度较低(Rz<2微米),使得相对应的所述第二盖体部422与填充与所述第二盖体部422之间的焊锡体90具有良好的接触强度,从而可以提高两个所述中间体50的结合强度。在其它情况下,若所述第二盖体部422表面粗糙度较高不利于焊接时,需要将相对设置的两个所述第一铜箔层101之间进行焊接,这需要选择毛细率较大的底铜才能实现。本申请通过设置所述第二盖体部422的表面粗糙度,使得所述两个所述中间体50可以焊接在一起,因此可以使得底铜选材要求降低。
在本申请的第一实施例中,步骤S5中所述工作流体80可以为水、乙醇、甲醇等低沸点溶剂。
如图8所示,本申请第二实施例还提供一种第二均温板50b的制作方法。
在本申请的第二实施例的制作方法中,与所述第一实施例不同之处在于:
步骤S5中,还可以是将一个所述中间体50与另一所述覆铜基板10层叠,使得所述中间体50的所述第二盖体部422与所述覆铜基板10的所述第 一铜箔层101相对,然后连接位于外侧的所述第二盖体部422和所述第一铜箔层101以在所述中间体50和所述覆铜基板10之间产生封闭腔室70b,并在所述封闭腔室70b内抽真空,注入工作流体80,即得到所述第二均温板50b。
如图9所示,本申请第三实施例还提供一种第三均温板50c的制作方法。
在本申请的第三实施例的制作方法中,与所述第二实施例不同之处在于:
步骤S5中,在连接位于外侧的所述导电凸块40和所述第一铜箔层101之前还包括在所述中间体50与所述覆铜基板10之间设置毛细结构60。所述毛细结构60可以设置于位于所述中间体50的中心的部分的所述第二盖体部422上,所述毛细结构60包括金属网或金属纤维,例如铜网或者细铜丝,最后得到所述第三均温板50c,且由于所述毛细结构60的高度稍大于所述焊锡体90的高度,使得所述覆铜基板10中间部分凸出以呈一弧状结构。所述毛细结构60具有较多间隙(图未示),工作流体可以***述间隙内,从而可以容纳更多的工作流流体,同时,所述毛细结构60具有优良的导热速率,可进一步提高所述第三均温板50c的传热能力。
请参见图7,本申请还提供一种如第一实施例所述的第一均温板50a,所述第一均温板50a包括两个相对设置的覆铜基板10,每一所述覆铜基板10包括依次层叠设置的第一铜箔层101、绝缘层102及第二铜箔层103。两个所述覆铜基板10的第一铜箔层101相对设置。每一所述覆铜基板10的第一铜箔层101朝向另一所述覆铜基板10凸出形成多个导热凸块41及一个连接凸块42,所述连接凸块42包围多个所述导热凸块41,相邻的两个所述导热凸块41及所述相邻两个导热凸块41之间的所述第一铜箔层101共同围设形成一流体储存区81。所述连接凸块42通过一焊锡体90连接以在两个所述覆铜基板10之间以形成一封闭腔室70a,所述封闭腔室70a中填充有工作流体80。
请参见图8,本申请还提供一种如第二实施例所述的第二均温板50b,所述第二均温板50b包括两个相对设置的覆铜基板10,每一所述覆铜基板10包括依次层叠设置的第一铜箔层101、绝缘层102及第二铜箔层103。两个所 述覆铜基板10的第一铜箔层101相对设置。其中一所述覆铜基板10的第一铜箔层101朝向另一所述覆铜基板10凸出形成多个导热凸块41及一连接凸块42,所述连接凸块42包围多个所述导热凸块41,相邻的两个所述导热凸块41及所述相邻两个导热凸块41之间的所述第一铜箔层101共同围设形成一流体储存区81,所述连接凸块42通过一焊锡体90连接另一所述覆铜基板10的第一铜箔层101,以在两个所述覆铜基板10之间形成一封闭腔室70b,所述封闭腔室70b中填充有工作流体80。
请参见图9,本申请还提供一种如第三实施例所述的第三均温板50c,与第二实施例不同之处在于,所述第三均温板50c还包括形成于所述导热凸块41及所述覆铜基板10之间的毛细结构60,所述毛细结构60固定在位于所述导热凸块41之上,所述连接凸块42通过一焊锡体90连接另一所述覆铜基板10的第一铜箔层101,以在两个所述覆铜基板10之间形成一封闭腔室70c,由于所述毛细结构60的高度稍大于所述焊锡体90的高度,使得所述覆铜基板10中间部分凸出以呈一弧状结构。
以第一均温板50a为例,请参见图7,具体应用在发热元件91(例如,CPU)时,所述发热元件产生的热量由所述发热元件91与所述第二铜箔层103接触的区域经过所述第二铜箔层103及所述绝缘层102传入所述第一铜箔层101,附着于所述第一铜箔层101上的所述工作液体吸收所述热量并由液态变成气态,变成气态的所述工作液体扩散到所述第一均温板50a的封闭腔室70a的其他区域,并由气态变回液态,并在其他区域放出热量,由此所述发热元件91所产生的热量由所述第一均温板50a发散到所述第一均温板50a所在的区域,有利于提高散热速率。
本申请提供的均温板具有以下优点:
(一)通过电镀的方式在所述铜箔层上形成导热凸块,所述导热凸块可以增强铜箔层与所述导热凸块之间的导热效率,降低热阻。
(二)通过电镀的方式获得的连接凸块的外表面具有较低的粗糙度,方 便后续进行焊接。
(三)所述导热凸块包括第一主体及第一盖体,且所述第一盖体的宽度大于所述第一主体的宽度,使得相邻的两个所述导热凸块及所述铜箔层共同围设形成一流体储存区,所述流体储存区临近所述第一铜箔层的端部大于远离所述第一铜箔层的端部,有利于提高工作流体的储存量,而且所述第一主体及所述第一盖体的形状及大小可以根据需要进行改变。
以上说明仅仅是对本申请一种优化的具体实施方式,但在实际的应用过程中不能仅仅局限于这种实施方式。对本领域的普通技术人员来说,根据本申请的技术构思做出的其他变形和改变,都应该属于本申请权利要求的保护范围。
Claims (10)
- 一种均温板的制造方法,其特征在于,包括:提供一覆铜基板,所述覆铜基板包括铜箔层;在所述铜箔层上压合一光阻层,所述光阻层覆盖所述铜箔层;对所述光阻层进行曝光,显影以形成一外侧开口及多个内侧开口,所述外侧开口包围所述多个内侧开口,所述铜箔层暴露于所述外侧开口及所述多个内侧开口;在多个所述内侧开口进行电镀形成多个导热凸块,在所述外侧开口进行电镀形成一连接凸块,所述连接凸块包围多个所述导热凸块,每一所述导热凸块包括一第一主体部及电性连接所述第一主体部的一第一盖体部,所述第一主体部填充于所述内侧开口且一侧电性连接所述铜箔层,所述第一盖体部电性连接于所述第一主体部远离所述铜箔层的另一侧,所述第一盖体部的宽度大于所述第一主体部的宽度;移除所述光阻层以获得一个中间体;将两个所述中间体层叠,使得其中一所述中间体的所述连接凸块与另一所述中间体的连接凸块对应,然后焊接两个相对应的所述连接凸块以在两个所述中间体之间产生封闭腔室,并在所述封闭腔室内抽真空,向所述封闭腔室注入工作流体,即得到所述均温板。
- 如权利要求1所述的均温板的制造方法,其特征在于,所述连接凸块包括一第二主体部及电性连接所述第二主体部的一第二盖体部,所述第二主体部填充于所述外侧开口且电性连接所述铜箔层,所述第二盖体部电性连接于所述第二主体部远离所述铜箔层的另一侧,且所述第二盖体部的宽度大于所述第二主体部。
- 如权利要求2所述的均温板的制造方法,其特征在于,所述第一主体部与所述第二主体部的高度相同,且所述第一主体部与所述第二主体部和所 述光阻层平齐。
- 如权利要求2所述的均温板的制造方法,其特征在于,所述第二盖体的外表面的粗糙度Rz<2微米。
- 如权利要求3所述的均温板的制造方法,其特征在于,所述第一主体部形状为长方体,每一所述第一主体部的底面长度为20~300微米,底面宽度度为20~300微米,所述第一主体部的高度为25~60微米,且相邻两个所述第一主体部的距离为30~300微米。
- 一种均温板的制造方法,其特征在于,包括:提供一覆铜基板,所述覆铜基板包括铜箔层;所述铜箔层上压合一光阻层,所述光阻层覆盖所述铜箔层;对所述光阻层进行曝光,显影以形成一外侧开口及多个内侧开口,所述外侧开口包围所述多个内侧开口,所述铜箔层暴露于所述外侧开口及所述多个内侧开口;在多个所述内侧开口进行电镀形成多个导热凸块,在所述外侧开口进行电镀形成一连接凸块,所述连接凸块包围多个所述导热凸块,每一所述导热凸块包括一第一主体部及电性连接所述第一主体部的一第一盖体部,所述第一主体部填充于所述内侧开口且一侧电性连接所述铜箔层,所述第一盖体部电性连接于所述第一主体部远离所述铜箔层的另一侧,所述第一盖体部的宽度大于所述第一主体部的宽度;移除所述光阻层以获得一个中间体;将一个所述中间体与另一所述覆铜基板层叠,使得所述中间体的所述连接凸块与所述覆铜基板的所述铜箔层相对,然后焊接所述连接凸块和所述铜箔层以在所述中间体和所述覆铜基板之间产生封闭腔室,并在所述封闭腔室内抽真空,注入工作流体,即得到所述均温板。
- 如权利要求6所述的均温板的制造方法,其特征在于,在焊接所述连接凸块和所述铜箔层之前,还包括:在所述中间体与所述覆铜基板之间设置毛细结构。
- 一种均温板,其特征在于,所述均温板包括两个相对设置的覆铜基板,每一所述覆铜基板包括铜箔层,至少一所述覆铜基板的铜箔层朝向另一所述覆铜基板凸出形成多个导热凸块及一个连接凸块,所述连接凸块包围多个所述导热凸块,一所述覆铜基板的所述连接凸块通过一焊锡体连接另一所述覆铜基板以在两个所述覆铜基板之间形成一腔室,所述腔室包容多个所述导热凸块,工作流体收容于所述导热凸块之间。
- 如权利要求8所述的均温板,其特征在于,每一所述覆铜基板均形成有所述多个所述导热凸块及一个连接凸块,所述连接凸块包围多个所述导热凸块,两个所述连接凸块相对应且通过一焊锡体连接,从而在两个所述覆铜基板之间形成一封闭腔室。
- 如权利要求9所述的均温板,其特征在于,所述导热凸块及所述铜箔层之间的设置毛细结构。
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