WO2021101350A1 - Planar transformer and power supply - Google Patents

Planar transformer and power supply Download PDF

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Publication number
WO2021101350A1
WO2021101350A1 PCT/KR2020/016602 KR2020016602W WO2021101350A1 WO 2021101350 A1 WO2021101350 A1 WO 2021101350A1 KR 2020016602 W KR2020016602 W KR 2020016602W WO 2021101350 A1 WO2021101350 A1 WO 2021101350A1
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WO
WIPO (PCT)
Prior art keywords
winding
input
transformer
coupling
power supply
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PCT/KR2020/016602
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French (fr)
Korean (ko)
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박찬웅
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박찬웅
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Publication of WO2021101350A1 publication Critical patent/WO2021101350A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F30/00Fixed transformers not covered by group H01F19/00
    • H01F30/06Fixed transformers not covered by group H01F19/00 characterised by the structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/02Casings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/02Casings
    • H01F27/027Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/06Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/34Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00Coils
    • H01F5/04Arrangements of electric connections to coils, e.g. leads
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M5/00Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases
    • H02M5/02Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into dc
    • H02M5/04Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into dc by static converters
    • H02M5/10Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into dc by static converters using transformers
    • H02M5/12Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into dc by static converters using transformers for conversion of voltage or current amplitude only
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/144Stacked arrangements of planar printed circuit boards
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00Coils
    • H01F5/04Arrangements of electric connections to coils, e.g. leads
    • H01F2005/046Details of formers and pin terminals related to mounting on printed circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/06Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
    • H01F2027/065Mounting on printed circuit boards

Definitions

  • the present invention relates to a planar transformer of a switching type power supply device in which two output windings are combined in a sandwich structure on both sides of an input winding constituted by conductors on the surface of a multilayer PCB. It relates to a technology that reduces the number of sides to lower the unit cost of a planar transformer, increases power efficiency, and lowers the influence of noise to the outside through the line of a power supply device.
  • the electrical grounding of the primary side of the power supply device referred to in this specification is a line connected to the "-" side terminal of the input voltage filter capacitor 12 or 12-1, or of the input voltage filter capacitor 12 or 12-1. It refers to the line connected to the "+" side terminal.
  • 1 is an example of the structure of a sandwich structure planar transformer used in a switching power supply device of a general mobile phone charger.
  • the planar transformer includes cores 1 and 5 of the transformer, a first output winding 2, a multilayer PCB part 3, and a second output winding 4.
  • the multilayer PCB part 3 has a hole in the center through which the center of the upper core 1 and the lower core 5 of the transformer passes, and the primary side of the transformer along the periphery of the hole in the center of the multilayer PCB part 3
  • the elements of the PCB are composed of several layers of conductors on the side of the PCB.
  • the first output winding 2 is closely coupled with one end surface of the multilayer PCB unit 3, and the second output winding 4 is closely coupled with the other end surface of the multilayer PCB unit 3.
  • the first output winding 2, the multilayer PCB unit 3, and the second output winding 4 are assembled by being fitted in the centers of the upper core 1 and the lower core 5 to constitute a transformer.
  • FIG. 2 is an exemplary embodiment of a power supply device for a mobile phone charger in the prior art, in which the output voltage varies in a wide range of 3.3V to 11V.
  • the AC input voltage of the power supply is rectified and smoothed by the input voltage filter capacitor 12.
  • Input of the transformer 6 connected between the "+" terminal of the input voltage filter capacitor 12 and one terminal of the switching device 13 (for example, "Drain” of the MOS_FET) by opening and closing of the switching element 13
  • the flow of current in the winding 7 is controlled.
  • the switching element 13 is turned off, the voltage induced in the first output winding 2 and the second output winding 4 of the transformer 6 is rectified and smoothed by the rectifier 22 and the capacitor 23. And supply the output voltage to the load.
  • the sum of the voltages induced in the first auxiliary winding 8 and the second auxiliary winding 9 of the transformer 6 is rectified and smoothed by the diode 15 and the capacitor 16 to power the controller 14. It is supplied by voltage.
  • the sum of the voltages induced in the first auxiliary winding 8 and the second auxiliary winding 9 is divided by the resistor 17 and the resistor 18 and applied to the control unit 14 as a feedback signal of the output voltage. And control the output voltage of the power supply.
  • the diode 19, the capacitor 20, and the resistor 21 suppress a spike voltage generated by energy accumulated in the leakage inductance of the input winding 7 when the switching element 13 is turned off.
  • FIG. 3 is an example of a conventional multilayer PCB unit 3 included in the planar transformer 6 of the power supply device of FIG. 2.
  • a first offset winding 10 is formed on the PCB surface of the first layer, and the second auxiliary winding 9 and the conductor surface 9 are formed on the PCB surface of the second layer. 1) is constructed, and the first winding (7-1) to the sixth winding (7-6) of the input winding (7) are formed on the PCB surface from the third layer to the eighth layer. The first auxiliary winding 8 and the conductor surface 8-1 are formed, and the second offset winding 11 is formed on the surface of the tenth layer.
  • the sum of the number of turns of the first auxiliary winding 8 and the second auxiliary winding 9 is 3.3V, which is capable of supplying a sufficient power supply voltage to the control unit 14. It should have the number of turns, but it should have the number of turns as small as possible to reduce power consumption at no load.
  • the first output winding (2) is 5 turns
  • the input winding (7) is divided from the third layer to the eighth layer, 7 turns per layer, and consists of 42 turns divided on the 6-layer PCB surface. do.
  • the first auxiliary winding 8 is formed on the PCB surface of the ninth layer by 7 turns
  • the second auxiliary winding 9 is formed on the PCB surface of the second layer by 6 turns.
  • the voltage induced at 13 turns which is the sum of the first auxiliary winding 8 and the second auxiliary winding 9, is rectified and supplied to the control unit 14 as a power supply voltage.
  • the control unit 14 In the second layer of the PCB surface, except for the area occupied by the second auxiliary winding (9), one point is occupied by the conductor surface (9-1) connected to the electrical ground of the primary side of the power supply, and the conductor surface (9-1). ) Blocks a part of the capacitive coupling that the input winding 7 creates with the first output winding 2.
  • the space excluding the area occupied by the first auxiliary winding 8 on the PCB of the ninth layer is occupied by the conductor surface 8-1 connected to the electrical ground of the primary side of the power supply device, and the conductor surface 8 -1) blocks a part of the capacitive coupling that the input winding 7 creates with the second output winding 4.
  • the first output winding 2 of the transformer 6 is closely coupled to the first offset winding 10 located on the first layer of the multilayer PCB unit 3, and the second output winding 4 is connected to the tenth layer. It is in close contact with the second offset winding 11 to be coupled.
  • the input winding 7, the first auxiliary winding 8, and the second auxiliary winding 9 all have the same polarity of fluctuation of potential.
  • the first output winding (2), the second output winding, the first offset winding (10) and the second offset winding (11) have a polarity of fluctuation of potential opposite to that of the fluctuation of potential of input winding (7).
  • the capacitive coupling created by the input winding 7 and the first auxiliary winding 8 and the second auxiliary winding 9 into the first output winding 2 and the second output winding 4 is the output line of the power supply ( 24) has a noise potential.
  • the input winding 7 and the first auxiliary winding 8 and the second auxiliary winding 9 are the first output winding 2 and the second output.
  • the first output winding (2) and the second output winding (4) generate a capacitive coupling of the switching frequency components that are similar in size and reverse polarity to the capacitive coupling of the switching frequency components generated by the winding (4).
  • the sum of the capacitive coupling of the switching frequency components generated by the first and second output windings (2) and the second output windings (4) of the device is brought close to "zero", and is sent to the outside through the line of the power supply. Lower the impact of noise.
  • the first offset winding 10 and the second offset winding 11 positioned on the PCB surface of both end layers of the multilayer PCB part 3 of FIG. 3 are used for insulation between the conductor constituting the winding and the conductor.
  • the input winding (7), the first auxiliary winding (8) and the second auxiliary winding (9) are connected to the first output winding ( 2) and the second output winding (4) create a large capacitive coupling of the switching frequency components.
  • the first offset winding 10 and the second offset winding 11 are the number of turns of 11 turns, which is more than twice the number of turns of 5 turns of the first output winding 2 and the second output winding 4 It has a first output winding (2) and a second output winding (4) by generating a capacitive coupling of the switching frequency component of reverse polarity, the first output winding (2) and the second output winding (4). Try to bring the sum of the capacitive couplings of the switching frequency components to be close to "zero".
  • the capacitive coupling generated from one element to the first output winding (2) and the second output winding (4) is divided into the first output winding (2) and the second output winding (4). Even if canceled by the reverse polarity capacitive coupling produced by the two different elements, the size of the capacitive coupling produced by the first output winding (2) and the second output winding (4), respectively, cannot be completely matched. In addition, since the size of the capacitive bonds generated by the two different elements, respectively, varies from product to product, the remaining amount of capacitive bonds after the offset is made may be large depending on the product. The remaining amount of capacitive coupling after cancellation is inevitably increased as the size of the capacitive coupling generated by one element into the first output winding 2 and the second output winding 4 increases.
  • the input winding 7, the first auxiliary winding 8, and the second auxiliary winding 9 are the switching generated by the first output winding (2) and the second output winding (4).
  • the size of the capacitive coupling of the frequency components is quite large. Therefore, the residual amount of the capacitive coupling of the switching frequency component after cancellation by the reverse polarity capacitive coupling generated by the first offset winding 10 and the second offset winding 11 is naturally large, and such a multilayer PCB unit ( The power supply using 3) has the disadvantage of having a large influence of the noise of the switching frequency component on the outside.
  • the first offset winding 10 and the second offset winding 11 are in phase compared to the voltage of the input winding 7 due to the influence of their own distribution capacity and leakage inductance. It has a delayed voltage.
  • the waveform of the voltage of the high-frequency component included in the voltages of the first offset winding 10 and the second offset winding 11 is the waveform of the input winding 7 and the first auxiliary winding 8 and the second auxiliary winding 9. It is different from the voltage waveform of the high-frequency component included in the voltage.
  • Sexual coupling cannot be canceled by capacitive coupling generated by the first offset winding 10 and the second offset winding 11.
  • the transformer 6 used in the conventional power supply device of FIG. 2 includes a first auxiliary winding 8, a second auxiliary winding 9, a first offset winding 10, and a second offset winding 11.
  • a first auxiliary winding 8 By increasing the distance between the input winding 7 and the first output winding 2 and the second output winding 4, magnetic coupling is prevented, thereby increasing leakage inductance and lowering power efficiency.
  • the thickness and width of the conductor that will constitute the input winding 7 and the gap between the conductors, etc., in consideration of the magnitude of the current flowing through the input winding 7 It should be determined, and it can be wound around 8 turns on the first layer of the PCB. For example, if the number of turns of the input winding 7 is 40 turns, it is possible to configure 8 turns per layer, and thus a 5-layer PCB surface is required. A two-layer PCB surface is required for the first offset winding 10 and the second offset winding 11. At least one layer of PCB side is required for the auxiliary windings (8 and 9).
  • the minimum number of layers of a laminated PCB that can be configured is a total of 9 layers.
  • the multilayer PCB part is manufactured by attaching a plurality of double-sided PCBs in order to connect all layers by a through hole, and consists of an even number of layers. Therefore, the minimum number of layers of the laminated PCB that can be configured is 10 layers, and there is room to use one layer of the PCB.
  • the input winding 7 is formed on the 6-layer PCB surface, and the auxiliary windings are divided into a first auxiliary winding 8 and a second auxiliary winding 9.
  • the first offset winding 10 and the second offset winding 11 are configured on the two-layer PCB surface, thus having a total of 10 layers of the PCB surface.
  • the input winding 7 is configured by 7 turns per layer in one embodiment, and by 42 turns per 6-layer PCB surface.
  • the transformer 6 used in the conventional power supply device of FIG. 2 includes a high-priced multilayer PCB 3 having a total of 10 layers of PCB, and has a disadvantage of increasing the manufacturing cost of the power supply device.
  • the multilayer PCB part of a planar transformer with a sandwich winding structure of the prior art has to include many components on the primary side of the power supply, so it requires a 10-layer PCB, which is expensive, and increases the manufacturing cost of the power supply.
  • the first auxiliary winding 8 and the second auxiliary winding 9 and the first offset winding 10 and the second offset winding of the multilayer PCB unit 3 of the transformer 6 used in the conventional power supply device ( 11) has a disadvantage of increasing the leakage inductance of the input winding 7 and lowering power efficiency by increasing the loss of the power supply device.
  • the input winding (7), the first auxiliary winding (8) and the second auxiliary winding (9) of the transformer (6) used in the conventional power supply device is the first output winding (2) and the second output winding (4). Since the capacitive coupling generated by the power supply is large, the power supply device has a disadvantage that greatly affects the noise of the switching frequency component and the high frequency component to the outside.
  • the present invention is to solve all of these drawbacks of the prior art.
  • An input voltage filter capacitor for achieving the above object A control unit; A switching element; And in the transformer of the power supply device including the transformer,
  • the transformer is the transformer
  • the core of the transformer is the core of the transformer
  • a multilayer PCB unit comprising elements on the primary side of the transformer wound around the core of the transformer by conductors on the multiple layers of the PCB;
  • the multilayer PCB unit The multilayer PCB unit,
  • a first input winding connected between one terminal of the input voltage filter capacitor of the power supply and one terminal of the switching element;
  • a second input winding connected between the other terminal of the switching device of the power supply and the other terminal of the input voltage filter capacitor
  • a first coupling portion positioned at a portion of one end layer of the multilayer PCB portion
  • a second coupling part positioned at the other part of one end layer of the multilayer PCB part
  • the capacitive coupling of the switching frequency components of the same polarity as the polarity of the capacitive coupling of the switching frequency components generated by the first input winding to the first output winding is performed by the first coupling unit. Is created as an output winding,
  • a capacitive coupling of a switching frequency component having a polarity opposite to that of a capacitive coupling of a switching frequency component generated by the first input winding to the first output winding is performed by the second coupling unit. Is created as an output winding,
  • a capacitive coupling of a switching frequency component generated by the first input winding as the second output winding and a capacitive coupling of a switching frequency component of an opposite polarity are performed by the third coupling unit.
  • the power supply Noise of the switching frequency component of the power supply to the outside by bringing the sum of the capacitive coupling of the switching frequency components generated by the first and second output windings of the primary side of the device closer to "zero" It is characterized by lowering the influence of.
  • an input voltage filter capacitor for achieving the above object; A control unit; A switching element; And in the transformer of the power supply device including the transformer,
  • the transformer is the transformer
  • the core of the transformer is the core of the transformer
  • a multilayer PCB unit comprising elements on the primary side of the transformer wound around the core of the transformer by conductors on the multiple layers of the PCB;
  • the multilayer PCB unit The multilayer PCB unit,
  • a first input winding connected between one terminal of the input voltage filter capacitor of the power supply and one terminal of the switching element
  • a second input winding connected between the other terminal of the switching element of the power supply and the other terminal of the input voltage filter capacitor
  • the second input winding is divided into a first winding of a second input winding and a second winding of a second input winding
  • the first winding of the second input winding is located on the PCB surface of one end layer of the multilayer PCB part, the second winding of the second input winding is located on the PCB surface of the other end layer of the multilayer PCB part,
  • the power supply device by capacitive coupling of switching frequency components generated by the first winding of the second input winding and the second winding of the second input winding as the first output winding and the second output winding, the By making the sum of the capacitive coupling of the switching frequency components generated by the first and second output windings of all the elements on the primary side of the power supply close to "zero", the influence of noise from the power supply to the outside is reduced. It is characterized by lowering.
  • an input voltage filter capacitor for achieving the above object; A control unit; A switching element; And in the transformer of the power supply device including the transformer,
  • the transformer is the transformer
  • the core of the transformer is the core of the transformer
  • a multilayer PCB unit comprising elements on the primary side of the transformer wound around the core of the transformer by conductors on the multiple layers of the PCB;
  • the multilayer PCB unit The multilayer PCB unit,
  • a first input winding connected between one terminal of the input voltage filter capacitor of the power supply and one terminal of the switching element;
  • a second input winding connected between the other terminal of the switching device of the power supply and the other terminal of the input voltage filter capacitor
  • the coupling part is located on the PCB surface of one end layer of the multilayer PCB part, and the second input winding is located on the PCB surface of the other end layer of the multilayer PCB part,
  • an input voltage filter capacitor for achieving the above object; A control unit; A switching element; And in the transformer of the power supply device including the transformer,
  • the transformer is the transformer
  • the core of the transformer is the core of the transformer
  • a multilayer PCB unit comprising elements on the primary side of the transformer wound around the core of the transformer by conductors on the multiple layers of the PCB;
  • the multilayer PCB unit The multilayer PCB unit,
  • An input winding connected between one terminal of the input voltage filter capacitor of the power supply and one terminal of the switching element;
  • a first coupling portion positioned at a portion of one end layer of the multilayer PCB portion
  • a second coupling part positioned at the other part of one end layer of the multilayer PCB part
  • a capacitive coupling of a switching frequency component of the same polarity as that of a capacitive coupling of a switching frequency component generated by the input winding as the first output winding is performed by the first coupling unit.
  • a capacitive coupling of a switching frequency component having a polarity opposite to that of a capacitive coupling of a switching frequency component generated by the input winding as the first output winding is performed by the second coupling unit.
  • a capacitive coupling of a switching frequency component generated by the input winding to the second output winding and a capacitive coupling of a switching frequency component of an opposite polarity are generated as the second output winding by the third coupling unit.
  • the power supply device by capacitive coupling of switching frequency components generated by the first output winding and the second output winding by the first coupling portion, the second coupling portion, and the third coupling portion, the power supply
  • the sum of the capacitive coupling of the switching frequency components generated by the first and second output windings of all elements on the primary side of the device is close to "zero", thereby reducing the influence of noise from the power supply to the outside. It is characterized by that.
  • an input voltage filter capacitor for achieving the above object; A control unit; A switching element; And in the transformer of the power supply device including the transformer,
  • the transformer is the transformer
  • the core of the transformer is the core of the transformer
  • a multilayer PCB unit comprising elements on the primary side of the transformer wound around the core of the transformer by conductors on the multiple layers of the PCB;
  • the multilayer PCB unit The multilayer PCB unit,
  • An input winding connected between one terminal of the input voltage filter capacitor of the power supply and one terminal of the switching element;
  • a coupling part positioned on a layer at one end of the multilayer PCB part
  • the offset winding has a variation of a potential of a polarity equal to that of a variation of potential of the first output winding
  • the coupling portion includes a conductor surface connected to a point between one end point of the offset winding and the other end point,
  • all elements of the primary side of the power supply unit are formed by capacitive coupling of switching frequency components generated by the first output winding and the second output winding by the coupling unit and the offset winding.
  • the transformer according to the present invention provides an advantage that the cost of the transformer is much lower and the power efficiency is increased by configuring a multilayer PCB part by a PCB surface having a much smaller number of layers compared to the conventional technology, and also to the outside of the power supply device. It provides the advantage of lowering the influence of noise.
  • FIG. 1 is an example of a structural diagram of a planar transformer having a sandwich winding structure.
  • FIG. 3 is an example of a conventional multilayer PCB unit included in FIG. 2.
  • FIG. 4 is an embodiment of a power supply device using a multilayer PCB unit according to the present invention.
  • Figure 5 is an embodiment of a multi-layer PCB unit according to the present invention.
  • 6 to 21 are other embodiments of the multilayer PCB unit according to the present invention.
  • FIG. 4 is an embodiment of a power supply device using a multilayer PCB unit according to the present invention.
  • the input winding 7 is composed of a six-layer PCB surface
  • the second offset winding 11 are each composed of a single-layer PCB surface, requiring a total of 10 layers of PCB surfaces.
  • the number of layers on the PCB surface constituting the input winding (7) must be reduced, and a part of the input winding (7) is divided into the first auxiliary winding (8) and the second auxiliary winding (8).
  • the winding 9, the first offset winding 10, and the second offset winding 11 must perform a role.
  • the input winding 7 of the prior art is connected to the “+” terminal and the switching element 13 of the input voltage filter capacitor 12-1.
  • a second input winding 25 connected between one terminal of -1) and the other terminal of the switching element 13-1 and the “-” terminal of the input voltage filter capacitor 12-1 It is divided into input windings 26, and the second input winding 26 plays the role of the first auxiliary winding 8, the second auxiliary winding 9, and the second offset winding 11 at the same time, 1
  • the components on the vehicle side are composed of 6 layers of PCB.
  • the AC input voltage is rectified and smoothed by the input voltage filter capacitor 12-1.
  • the switching element 13-1 By opening and closing the switching element 13-1, it is connected between the "+" terminal of the input voltage filter capacitor 12-1 and one terminal of the switching element 13-1 (for example, "Drain” of the MOS_FET).
  • the second input winding connected between the first input winding 25 and the other terminal of the switching element 13-1 (for example, the source of the MOS_FET) and the "-" terminal of the input voltage filter capacitor 12-1 (26) The flow of current is controlled.
  • the voltage induced in the first output winding 2-1 and the second output winding 4-1 is rectified and smoothed by the rectifier 22-1 and the capacitor 23-1, so that the output voltage is applied to the load. Supply.
  • the sum of the voltages of the first winding 26-1 and the second winding 26-2 of the second input winding 26 or the voltage of the second input winding 26 is the diode 15-1 and the capacitor ( It is rectified and smoothed by 16-1), and supplied as a power supply voltage to the control unit 14-1.
  • the sum of the voltages of the first winding 26-1 and the second winding 26-2 of the second input winding 26 or the voltage of the second input winding 26 is equal to the resistance 17-1 and It is divided by the resistor 18-1 and applied to the control unit 14-1 as a feedback signal of the output voltage to control the output voltage of the power supply.
  • the diode 19-1, the capacitor 20-1, and the resistor 21-1 are applied to the energy accumulated in the leakage inductance of the first input winding 25 when the switching element 13-1 is turned off. Suppress the spike voltage generated by it.
  • the polarity of the variation of the potential of the first input winding 25 is opposite to the polarity of the variation of the potential of the first output winding 2-1 and the second output winding 4-1.
  • the polarity of the variation of the potential of the second input winding 26 is the same as the polarity of the variation of the potential of the first output winding 2-1 and the second output winding 4-1.
  • the polarity of the capacitive coupling of the switching frequency components generated from the first input winding 25 to the first output winding 2-1 or the second output winding 4-1 is first from the second input winding 26. It is opposite to the polarity of the capacitive coupling of the switching frequency component generated by the output winding 2-1 or the second output winding 4-1.
  • the first output winding 2-1 of the transformer 6-1 is coupled to the first coupling portion 27-1 of the first layer of the multilayer PCB unit 3-1.
  • the second output winding 4-1 is in close contact with the part 27-2, and the second output winding 4-1 is in close contact with the third coupling part 28 located in the sixth layer of the multilayer PCB part 3-1.
  • 5 to 21 show various embodiments of a multilayer PCB unit according to the present invention.
  • All the embodiments of the multilayer PCB unit shown in FIGS. 5 to 21 are a terminal (a) connected to the "-" terminal of the input voltage filter capacitor 12-1 of the power supply device and a switching element 13-1 of the power supply device.
  • the terminal (b) connected to the other terminal of (for example, “Source” of the MOS_FET) and the terminal (c) connected to the “+” terminal of the input voltage filter capacitor (12-1) of the power supply and the power supply It has a terminal d connected to one terminal of the switching device 13-1 (for example, “Drain” of MOS_FET).
  • the second input winding 26 is connected between the terminal (a) and the terminal (b), and the first input winding 25 is connected between the terminal (c) and the terminal (d).
  • Visible multilayer PCB section (3-1 or 3-1a or 3-2 or 3-3 or 3-4 or 3-5 or 3-6 or 3-7 or 3-8 or 3-9 or 3-10 or 3 -11 or 3-12 or 3-13 or 3-14 or 3-15 or 3-16) is the first coupling part (27-1 or 29-1 or 30-1 or 31) on the PCB side of the first layer.
  • -1 or 32-1 or 33-1 or 34-1 or 36-1 or 37-1 or 38-1 or 39-1 or 40-1 or 42-1 and the second coupling part (27-2 or 29 -2 or 30-2 or 31-2 or 32-2 or 33-2 or 34-2 or 36-2 or 37-2 or 38-2 or 39-2 or 40-2 or 42-2)
  • the third coupling portion 28 or 28a is formed on the last layer.
  • Multilayer PCB section shown in Figs. 5 to 21 (3-1 or 3-1a or 3-2 or 3-3 or 3-4 or 3-5 or 3-6 or 3-7 or 3-8 or 3-9 Or 3-10 or 3-11 or 3-12 or 3-13 or 3-14 or 3-15 or 3-16), all have Through Holes (e and f and g and h and i) at the same location. .
  • Multilayer PCB section shown in Figs. 5 to 21 (3-1 or 3-1a or 3-2 or 3-3 or 3-4 or 3-5 or 3-6 or 3-7 or 3-8 or 3-9 Or 3-10 or 3-11 or 3-12 or 3-13 or 3-14 or 3-15 or 3-16), which constitutes the third coupling part (28 or 28a) of the PCB side of the sixth layer.
  • Capacitive coupling of the switching frequency components is largely generated from the first input winding 25 to the second output winding 4-1 through the blank surface 26-6 without a conductor made of a gap between the conductor and the conductor, etc. .
  • the third coupling unit 28 or 28a removes the capacitive coupling of the switching frequency components generated by the first input winding 25 as the second output winding 4-1 and the capacitive coupling of the switching frequency components of the opposite polarity. It is created with two output windings 4-1, and the sum of capacitive couplings created with the second output winding 4-1 is lowered.
  • FIGS. 5 to 21 (3-1 or 3-1a or 3-2 or 3-3 or 3-4 or 3-5 or 3-6 or 3-7 or 3-8 or 3- 9 or 3-10 or 3-11 or 3-12 or 3-13 or 3-14 or 3-15 or 3-16).
  • the number of turns of the second input winding 26 required to obtain a power supply voltage to be supplied to the control unit 14-1 is two layers. It is for a power supply that must be configured by the PCB side.
  • the windings supplying the power supply voltage of 7.5V or more to be supplied to the control unit 14-1 are the first output winding 2-1 and the second output winding ( You must have a number of turns greater than 2.5 times the number of turns in 4-1).
  • the second input winding 26 supplies a power supply voltage to the control unit 14-1.
  • the number of turns of the first input winding 25 and the second input winding 26, which can be maximally configured by a conductor on the PCB surface of one layer, is determined by the amount of current flowing and the distance between the conductors. In consideration, it is about 8 turns.
  • the first winding 25-1 to the third winding 25-3 of the first input winding 25 Is composed of 8 turns on the PCB surface of the first layer and 24 turns on the PCB surface of the 3 layers, and the first winding 26-1 and the second winding 26-2 of the second input winding 26, It consists of 5 turns and 8 turns on the first layer of PCB and 13 turns on the second layer of PCB, and the input winding has a total number of turns of 37.
  • a first coupling part 27-1 and a second coupling part 27-2 are formed on the PCB surface of the first layer, and the second coupling part 27-2 is formed on the PCB surface of the second layer.
  • the first winding 26-1 and the conductor surface 26-5 of the input winding 26 are formed, and the first winding 25- of the first input winding 25 is formed on the PCB surface from the third to fifth layers.
  • 1) to third windings 25-3 are formed, and a third coupling part 28 is formed on the PCB surface of the end layer.
  • the first coupling part 27-1 is a conductor surface 27-3 connected to the "+" terminal of the input voltage filter capacitor 12-1, which is the electrical ground of the primary side of the power supply device through the terminal c. ).
  • the second coupling portion 27-2 is constituted by a conductor surface 27-5 to which the potential of the starting point of the second winding 26-2 of the second input winding 26 is connected.
  • the 3rd coupling part 28 is comprised by the 2nd winding 26-2 of the 2nd input winding 26.
  • the first coupling part 27-1 connects the terminal c and the starting point of the first winding 25-1 of the first input winding 25 through a through hole g. .
  • the end points of the first winding (25-1) and the second winding (25-2) of the first input winding (25) are the second winding of the first input winding (25) through through holes (h and f), respectively. It is connected to the starting point of (25-2) and the third winding (25-3).
  • the end point of the third winding 25-3 of the first input winding 25 is connected to the terminal d.
  • the starting point of the first winding 26-1 of the second input winding 26 is connected to the terminal b.
  • the end point of the first winding 26-1 of the second input winding 26 is connected to the starting point of the second winding 26-2 of the second input winding 26 through a through hole (e).
  • the second coupling part 27-2 is connected to the starting point of the second winding 26-2 of the second input winding 26 through a through hole (e).
  • the PCB surface of the second layer of the multilayer PCB unit 3-1 of FIG. 5 includes the first winding 26-1 and the conductor surface 26-5 of the second input winding 26.
  • the conductor surface 26-5 is formed by filling a part of the PCB surface of one layer except the area occupied by the first winding 26-1 of the second input winding 26 with the conductor surface, and through hole ( g) is connected to the electrical ground of the primary side of the power supply through the first coupling portion 27-1 and the terminal c, and the first input winding 25 is used as the first output winding 2-1. It blocks capacitive binding. If the voltage to be supplied to the control unit 14-1 of the power supply device of FIG. 4 is high and the number of turns of the second input winding 26 is large, the conductor surface 26-5 disappears.
  • the first coupling section 27-1 having the electrical ground potential of the primary side of the power supply unit is formed from the first input winding 25 to the first output winding (
  • the capacitive coupling of the switching frequency components of the same polarity as the capacitive coupling of the switching frequency components generated by 2-1) is generated by the first output winding 2-1.
  • the size of the capacitive coupling created by the first coupling part 27-1 to the first output winding 2-1 is a small ratio of the area occupied by the first coupling part 27-1 on the PCB surface of the first layer. As it gets smaller, it can be easily adjusted by hand.
  • a second coupling part composed of a conductor surface 27-5 to which the potential of the starting point of the second winding 26-2 of the second input winding 26 is connected.
  • the capacitive coupling of the switching frequency components generated from the first input winding 25 to the first output winding 2-1 and the capacitive coupling of the switching frequency components of the opposite polarity is the first output winding. It is created with (2-1).
  • the size of the capacitive coupling generated by the second coupling portion 27-2 to the first output winding 2-1 increases as the potential of the second coupling portion 27-2 increases, and the PCB surface of the first layer As the ratio of the area occupied by the second coupling part 27-2 increases, it can be easily adjusted by hand.
  • the size of the sum of the capacitive couplings generated by the first coupling portion 27-1 and the second coupling portion 27-2 of the multilayer PCB portion 3-1 and the first output winding 2-1 The polarity can be easily set by various methods, including adjusting the ratio of the area occupied by the first coupling portion 27-1 and the second coupling portion 27-2 on the PCB surface of the first layer.
  • the first coupling portion (27-1), the second coupling portion (27-2) and the third coupling portion (28) are divided into the first output winding (2-1) and the second output winding (4-1). The size and polarity of the sum of the resulting capacitive bonds can also be easily set.
  • the first coupling unit 27-1 and the second coupling unit 27-2 and the second coupling unit 27-2 of the multilayer PCB unit 3-1 are provided.
  • the three coupling unit 28 sets the size and polarity of the capacitive coupling of the switching frequency components generated by the first output winding 2-1 and the second output winding 4-1,
  • the sum of the capacitive coupling of the switching frequency components generated by the first output winding (2-1) and the second output winding (4-1) of all elements is close to "zero", and the switching frequency component of the line of the power supply Lowers the noise to a very low level.
  • the multilayer PCB unit 3 of FIG. 3 has a large number of turns of 11 turns each on the PCB surface of both end layers.
  • the input winding (7), the first auxiliary winding (8) and the second winding through the blank surface (10-6 or 11-6) excluding the conductor constituting the first offset winding (10) and the second offset winding (11).
  • the auxiliary winding 9 produces a large capacitive coupling of the switching frequency components with the first output winding 2 and the second output winding 4.
  • the second coupling part 27-2 to which the start point of the second winding 26-2 of the second input winding 26 having a number of turns of 8 turns is connected is a first output winding having a number of turns of 5 turns. It has a potential that is about three times the average potential (potential of 2.5 turns) of the total area of (2-1), and a capacitive coupling of the switching frequency components is generated by the second output winding 4-1.
  • the third coupling unit 28 has a potential of 1.6 times the potential of the first output winding 2-1 and generates a capacitive coupling of the switching frequency components to the second output winding 4-1.
  • the surface 26-6 is a blank surface 11- excluding the area of the conductor constituting the second offset winding 11 having turns of 11 turns from the PCB surface of the end layer of the multilayer PCB part 3 of FIG. 3. It is 30% smaller than 6). Therefore, the capacitive coupling of the switching frequency components generated from the first input winding 25 to the second output winding 4-1 through the blank surface 26-6 without a conductor is a blank surface without a conductor in FIG.
  • the first input winding 25 hardly generates a capacitive coupling of the switching frequency components to the first output winding 2-1. Therefore, the capacitiveness of the switching frequency component generated by the first input winding 25 as the first output winding 2-1 and the second output winding 4-1 in the multilayer PCB unit 3-1 of FIG. 5
  • the input winding 7, the first auxiliary winding 8, and the second auxiliary winding 9 have the first output winding 2 and the second output winding ( It is about 1/4 of the size of the capacitive coupling of the switching frequency component generated by 4).
  • the capacitive coupling of the switching frequency components generated by the first input winding 25 as the first output winding 2-1 and the second output winding 4-1 Since the size is much smaller than that of the multilayer PCB part 3 of FIG. 3, the reverse generated by the first coupling part 27-1, the second coupling part 27-2, and the third coupling part 28.
  • the residual amount of the capacitive coupling of the switching frequency component after cancellation by the capacitive coupling of the polarity is also much smaller than that of the multilayer PCB unit 3 of FIG. 3. Therefore, the power supply device using the multilayer PCB unit 3-1 of FIG. 5 has an advantage of reducing the influence of noise of the switching frequency component externally compared to the prior art.
  • the capacitiveness of the switching frequency component generated from the first input winding 25 to the first output winding 2-1 and the second output winding 4-1 in the multilayer PCB unit 3-1 of FIG. 5 Since the size of the coupling is much smaller than that of the multilayer PCB unit 3 of FIG. 3, the capacity generated from the first input winding 25 to the first output winding 2-1 and the second output winding 4-1 The size of the capacitive coupling of the high-frequency component included in the sexual coupling is also small.
  • the power supply device using the multilayer PCB unit 3-1 of FIG. 5 has an advantage that the influence of noise of high-frequency components to the outside is much smaller than that of the prior art.
  • the multilayer PCB unit 3-1 according to the present invention shown in the embodiment of FIG. 5 may be composed of a six-layer PCB surface, so that the multilayer PCB unit 3 of the prior art is composed of a 10-layer PCB surface. Compared to this, the price is much lower.
  • the magnetic coupling between the input winding and the first output winding 2-1 and the second output winding 4-1 is high, so that the efficiency of power transmission is increased.
  • FIG. 6 shows a total of 6 layers of the PCB surface for a power supply device in which the number of turns of the second input winding 26 required to obtain a power supply voltage to be supplied to the control unit 14-1 can be configured by a single-layer PCB surface.
  • An exemplary embodiment of the multilayer PCB unit 3-1a configured by the multilayer PCB unit 3-1a is shown, and the multilayer PCB unit 3-1a may replace the multilayer PCB unit 3-1 of the power supply device of FIG. 4.
  • the second input winding 26 when the lowest output voltage is 5V, the second input winding 26 is a first output winding ( 2-1) and the second output winding (4-1) must have a number of turns greater than 1.5 times the number of turns.
  • the number of turns of the first output winding 2-1 and the second output winding 4-1 is 5 turns
  • the number of turns of the second input winding 26 of the multilayer PCB unit 3-1a of FIG. 6 is It is about 8 turns, and it can be configured on a single-layer PCB surface even considering the current flowing.
  • the first input winding 25 is composed of 8 turns on the PCB surface of one layer and 32 turns of the PCB surface of 4 layers.
  • the second input winding 26 is composed of 8 turns on the PCB surface of one layer. Therefore, one embodiment of the transformer 6-1a has a total input winding of 40 turns.
  • the multilayer PCB part 3-1a of FIG. 6 comprises a first coupling part 27-1 and a second coupling part 27-2 on the PCB surface of the first layer, and the PCB surface of the second layer to the fifth layer.
  • the first winding 25-1 to the fourth winding 25-4 of the first input winding 25 are formed, and a third coupling part 28 is formed on the PCB surface of the end layer.
  • the first coupling portion 27-1 is constituted by a conductor surface 27-3 connected to the electrical ground of the primary side of the power supply device.
  • the second coupling portion 27-2 is constituted by a conductor surface 27-5 to which the potential of the starting point of the second input winding 26 is connected.
  • the 3rd coupling part 28 is comprised by the 2nd input winding 26.
  • the starting point of the first winding 25-1 of the first input winding 25 is connected to the terminal c.
  • the end points of the first winding (25-1), the second winding (25-2), and the third winding (25-3) of the first input winding (25) are through holes (g, h, and f), respectively.
  • the first input winding 25 is connected to the starting points of the second winding 25-2, the third winding 25-3, and the fourth winding 25-4.
  • the end point of the fourth winding 25-4 of the first input winding 25 is connected to the terminal d.
  • the starting point of the second input winding 26 is connected to the terminal (b) through the through hole (e) and the second coupling portion (27-2).
  • the end point of the second input winding 26 is connected to the terminal (a).
  • the first coupling part 27-1 connected to the electrical ground of the primary side of the power supply device has a first input winding 25 and a first output winding 2
  • the capacitive coupling of the switching frequency components of the same polarity as the capacitive coupling of the switching frequency components generated by -1) is generated by the first output winding 2-1.
  • the size of the capacitive coupling created by the first coupling part 27-1 to the first output winding 2-1 is a small ratio of the area occupied by the first coupling part 27-1 on the PCB surface of the first layer. As it gets smaller, it can be easily adjusted by hand.
  • the second coupling portion 27-2 constituted by the conductor surface 27-5 to which the starting point of the second input winding 26 is connected, the first input winding 25 is the first output winding 2-1.
  • the capacitive coupling of the switching frequency component generated by) and the capacitive coupling of the switching frequency component of the opposite polarity are generated by the first output winding 2-1.
  • the size of the capacitive coupling generated by the second coupling portion 27-2 to the first output winding 2-1 increases as the potential of the second coupling portion 27-2 increases, and the PCB surface of the first layer As the ratio of the area occupied by the second coupling part 27-2 increases, it can be easily adjusted by hand.
  • the size of the sum of the capacitive couplings generated by the first coupling portion 27-1 and the second coupling portion 27-2 of the multilayer PCB portion 3-1a and the first output winding 2-1 The polarity can be easily set by various methods, including adjusting the ratio of the area occupied by the first coupling portion 27-1 and the second coupling portion 27-2 on the PCB surface of the first layer.
  • the first coupling portion (27-1), the second coupling portion (27-2) and the third coupling portion (28) are divided into the first output winding (2-1) and the second output winding (4-1). The size and polarity of the sum of the resulting capacitive bonds can also be easily set.
  • the first coupling portion 27-1 and the second coupling portion 27-2 and the second coupling portion 27-2 of the multilayer PCB portion 3-1a By appropriately setting the size and polarity of the sum of capacitive couplings of the switching frequency components generated by the three-coupling unit 28 by the first output winding 2-1 and the second output winding 4-1, The sum of the capacitive coupling of the switching frequency components generated by the first and second output windings (2-1) and the second output windings (4-1) on the vehicle side is close to "zero", and the output line of the power supply is The noise of the switching frequency component is very low.
  • the first input winding 25 is connected to the first output winding 2-1 and the second output winding 4 in the multilayer PCB unit 3-1a of FIG. 6.
  • the magnitude of the capacitive coupling of the switching frequency components generated by -1) is determined by the input winding 7 and the first auxiliary winding 8 and the second auxiliary winding 9 in the multilayer PCB unit 3 of FIG. Since it is much smaller about 1/4 of the size of the capacitive coupling of the switching frequency component generated by the first output winding 2 and the second output winding 4, the power supply using the multilayer PCB unit 3-1a of FIG. 6
  • the device has both an advantage of having a much smaller effect of noise of a switching frequency component and a much smaller effect of noise of a high frequency component.
  • the first coupling portion 27-1 is passed through another through hole, not shown, to one of the first input windings 25. By connecting to a point, the first coupling portion 27-1 may have a variable potential.
  • FIG. 7 shows a multilayer PCB unit 3-2 composed of a six-layer PCB surface, which is another embodiment of the present invention, and the multilayer PCB unit 3-2 is a multilayer PCB unit 3 of the power supply device of Fig. 4. Can be substituted for -1).
  • the multilayer PCB part 3-2 of FIG. 7 comprises a first coupling part 29-1 and a second coupling part 29-2 on the first-layer PCB surface, and the second-layer PCB surface is a second
  • the first winding (26-1) of the input winding (26) and the conductor surface (26-5) are formed, and the first winding (25-1) of the first input winding (25) is formed on the PCB surface of the third to fifth layers.
  • the first coupling portion 29-1 is constituted by a conductor surface 29-3 connected to the electrical ground of the primary side of the power supply device.
  • a potential of a part of the second winding 26-2 of the second input winding 26 or a potential of a part of the first winding 26-1 passes through the through hole (j). It is constituted by a conductor face (29-5) connected through.
  • the 3rd coupling part 28 is comprised by the 2nd winding 26-2 of the 2nd input winding 26.
  • the terminal c is the first winding 25 of the first input winding 25 through the first coupling part 29-1 and the through hole g. It is connected to the starting point of 1).
  • the end points of the first winding (25-1) and the second winding (25-2) of the first input winding (25) are the second winding of the first input winding (25) through through holes (h and f), respectively. It is connected to the starting point of (25-2) and the third winding (25-3).
  • the end point of the third winding 25-3 of the first input winding 25 is connected to the terminal d.
  • the starting point of the first winding 26-1 of the second input winding 26 is connected to the terminal b, and the end point of the first winding 26-1 of the second input winding 26 is Through Hole ( It is connected to the starting point of the second winding 26-2 of the second input winding 26 through e).
  • the end point of the second winding 26-2 of the second input winding 26 is connected to the terminal (a).
  • the second coupling part 29-2 is formed at a point between the start point and the end point of the first winding 26-1 of the second input winding 26 or the second winding 26- It is connected to a point between the start point and the end point of 2).
  • the first coupling part 29-1 connected to the electrical ground of the primary side of the power supply device has a first input winding 25 and a first output winding 2
  • the capacitive coupling of the switching frequency components of the same polarity as the capacitive coupling of the switching frequency components generated by -1) is generated by the first output winding 2-1.
  • the size of the capacitive coupling that the first coupling part 29-1 creates with the first output winding 2-1 is a small ratio of the area occupied by the first coupling part 27-1 on the PCB surface of the first layer. As it gets smaller, it can be easily adjusted by hand.
  • the second coupling unit 29-2 constituted by -5) is a capacitive coupling of the switching frequency components generated by the first input winding 25 as the first output winding 2-1 and switching of the opposite polarity.
  • the capacitive coupling of the frequency components is generated by the first output winding (2-1).
  • the size of the capacitive coupling generated by the second coupling portion 29-2 to the first output winding 2-1 increases as the potential of the second coupling portion 29-2 increases, and from the PCB surface of the first layer As the ratio of the area occupied by the second coupling portion 29-2 increases, it can be easily adjusted. Therefore, the size of the sum of the capacitive couplings generated by the first coupling portion 29-1 and the second coupling portion 29-2 of the multilayer PCB portion 3-2 and the first output winding 2-1
  • the polarity can be easily set by various methods, including adjusting the ratio of the area occupied by the first coupling portion 29-1 and the second coupling portion 29-2 on the PCB surface of the first layer.
  • first coupling portion (29-1), the second coupling portion (29-2) and the third coupling portion (28) are divided into the first output winding (2-1) and the second output winding (4-1).
  • the size and polarity of the sum of the resulting capacitive bonds can also be easily set.
  • the first coupling unit 29-1 and the second coupling unit 29-2 and the second coupling unit 29-2 of the multilayer PCB unit 3-2 are provided.
  • the sum of the capacitive coupling of the switching frequency components generated by the first and second output windings (2-1) and the second output windings (4-1) on the vehicle side is close to "zero", and the output line of the power supply is The noise of the switching frequency component is very low.
  • the capacitive coupling of the switching frequency components generated by the first input winding 25 by the first output winding 2-1 and the second output winding 4-1 The size of the input winding 7 and the first auxiliary winding 8 and the second auxiliary winding 9 in the multilayer PCB unit 3 of FIG. 3 are similar to the multilayer PCB unit 3-1 of FIG. Since it is much smaller about 1/4 of the size of the capacitive coupling of the switching frequency component generated by the first output winding 2 and the second output winding 4, the power supply using the multilayer PCB unit 3-2 of FIG. 7 Compared to the prior art, the device has both the advantage of reducing the influence of noise of the switching frequency component to the outside and the advantage of significantly reducing the influence of the noise of the high frequency component.
  • the multilayer PCB unit 3-3 may replace the multilayer PCB unit 3-1 of the power supply device of FIG. 4.
  • the multilayer PCB part 3-3 of FIG. 8 comprises a first coupling part 30-1 and a second coupling part 30-2 on the PCB surface of the first layer, and a second input on the surface of the second layer.
  • the first winding 26-1 of the winding 26 is formed, and the second winding 25-2 to the fourth winding 25-4 of the first input winding 25 are formed on the PCB surface of the third to fifth layers. ), and a third coupling part 28 on the surface of the sixth layer.
  • the first coupling part 30-1 is a conductor surface connected to the first winding 25-1 of the first input winding 25 and a part of the first winding 25-1 of the first input winding 25 ( 30-6).
  • the second coupling part 30-2 is constituted by a conductor surface 30-5 connected to the starting point of the second winding 26-2 of the second input winding 26 through a through hole (e).
  • the third coupling portion 28 is constituted by the second winding 26-2 of the second input winding 26.
  • the terminal c is connected to the starting point of the first winding 25-1 of the first input winding 25, and The end point is connected to the start point of the second winding 25-2 of the first input winding 25 through the Through Hole (g).
  • the end points of the second winding 25-2 and the third winding 25-3 of the first input winding 25 are the third winding of the first input winding 25 through through holes (h and f), respectively. It is connected to the starting point of (25-3) and the fourth winding (25-4).
  • the end point of the fourth winding 25-4 of the first input winding 25 is connected to the terminal d.
  • the starting point of the first winding 26-1 of the second input winding 26 is connected to the terminal b, and the end point of the first winding 26-1 of the second input winding 26 is Through Hole ( It is connected to the starting point of the second winding 26-2 of the second input winding 26 through e).
  • the end point of the second winding 26-2 of the second input winding 26 is connected to the terminal (a).
  • the second coupling part 30-2 is connected to the starting point of the second winding 26-2 of the second input winding 26 through a through hole (e).
  • the first coupling part 30-1 composed of the connected conductor surface 30-6 is the second winding 25-2 and the third winding 25-3 and the fourth winding of the first input winding 25.
  • the capacitive coupling of the switching frequency components of the same polarity as the capacitive coupling of the switching frequency components generated by the first output winding (2-1) (25-4) is generated as the first output winding (2-1).
  • the size of the capacitive coupling generated by the first coupling part 30-1 to the first output winding 2-1 is the first input winding 25 constituting the first coupling part 30-1.
  • the size of the capacitive coupling generated by the second coupling portion 30-2 to the first output winding 2-1 increases as the potential of the second coupling portion 30-2 increases, and the PCB surface of the first layer
  • the polarity can be easily set by various methods, including adjusting the ratio of the area occupied by the first coupling portion 30-1 and the second coupling portion 30-2 on the first layer of the PCB.
  • first coupling portion (30-1), the second coupling portion (30-2) and the third coupling portion (28) are divided into the first output winding (2-1) and the second output winding (4-1).
  • the size and polarity of the sum of the resulting capacitive bonds can also be easily set.
  • the first coupling unit 30-1 and the second coupling unit 30-2 and the second coupling unit 30-2 of the multilayer PCB unit 3-3 are used.
  • the sum of the capacitive coupling of the switching frequency components generated by the first and second output windings (2-1) and the second output windings (4-1) on the vehicle side is close to "zero", The noise of the switching frequency component is very low.
  • the size of the capacitive coupling of the switching frequency components generated by the first input winding 25 to the first output winding 2-1 is In the PCB part 3, the input winding 7 and the first auxiliary winding 8 are much smaller than the size of the capacitive coupling of the switching frequency components generated by the first output winding 2.
  • the multilayer PCB unit 3-3 of FIG. 8 is much smaller than the size of the capacitive coupling of the switching frequency components generated by the first output winding 2.
  • the capacity of the switching frequency component generated from the first input winding 25 to the first output winding 2-1 and the second output winding 4-1 The size of the sum of the sex combinations is the input winding 7 and the first auxiliary winding 8 and the second auxiliary winding 9 in the multilayer PCB unit 3 of FIG. 3 as the first output winding 2 and the second output. It is much smaller than the sum of the capacitive couplings of the switching frequency components produced by the winding 4. Therefore, the power supply device using the multilayer PCB unit 3-3 of FIG. 8 has an advantage of reducing the influence of noise of the switching frequency component and the high frequency component externally compared to the prior art.
  • FIG. 9 shows a multilayer PCB part 3-4 formed by a 6-layer PCB surface, which is another embodiment of the present invention.
  • the multilayer PCB unit 3-4 may replace the multilayer PCB unit 3-1 of the power supply device of FIG. 4.
  • the multilayer PCB part 3-4 of FIG. 9 comprises a first coupling part 31-1 and a second coupling part 31-2 on the first-layer PCB surface, and
  • the first winding (26-1) of the input winding (26) and the conductor surface (26-5) connected to a point between the starting point and the ending point of the second input winding (26) are formed, and from the third layer to the fifth layer.
  • the first winding 25-1 to the third winding 25-3 of the first input winding 25 are formed on the PCB surface of the layer, and the third coupling part 28 is formed on the surface of the sixth layer.
  • the first coupling portion 31-1 is composed of a conductor surface 31-3 connected to the electrical ground of the primary side of the power supply device.
  • the second coupling portion 31-2 is composed of an empty surface 31-4 without a conductor.
  • the third coupling unit 28 is composed of the second winding 26-2 of the second input winding 26.
  • the terminal (c) is connected to the first coupling part 31-1, and the first input winding 25 of the first input winding 25 through the through hole (g). It is connected to the starting point of the winding 25-1.
  • the end points of the first winding 25-1 and the second winding 25-2 of the first input winding 25 are connected to the second winding 25 of the first input winding 25 through through holes (h and f). It is connected to the starting point of -2) and the third winding (25-3).
  • the end point of the third winding 25-3 of the first input winding 25 is connected to the terminal d.
  • the starting point of the first winding 26-1 of the second input winding 26 is connected to the terminal b, and the end point of the first winding 26-1 of the second input winding 26 is Through Hole ( It is connected to the starting point of the second winding 26-2 of the second input winding 26 through e).
  • the end point of the second winding 26-2 of the second input winding 26 is connected to the terminal (a).
  • the first coupling part 31-1 constituted by the conductor surface 31-3 connected to the electrical ground of the primary side of the power supply device is a first input
  • the capacitive coupling of the switching frequency components of the same polarity as the capacitive coupling of the switching frequency components generated by the first output winding 2-1 by the winding 25 is generated as the first output winding 2-1.
  • the size of the capacitive coupling created by the first coupling part 31-1 to the first output winding 2-1 is the ratio of the area occupied by the first coupling part 27-1 on the PCB surface of the first layer. The smaller it is, the smaller it is, so it can be easily adjusted by hand.
  • the conductor face 26-5 connected to a point of the first input winding 25 is through a second coupling portion 31-2 constituted by a blank face 31-4 without a conductor of the first layer.
  • the capacitive coupling of the switching frequency components generated by the first output winding 2-1 and the capacitive coupling of the switching frequency components of the opposite polarity are generated by the first output winding 2-1.
  • the first input winding 25 also generates a capacitive coupling of the switching frequency components to the first output winding 2-1 through the second coupling portion 31-2 of the first layer.
  • the magnitude of the capacitive coupling of the switching frequency component generated by the first output winding 2-1 by the second coupling unit 31-2 is the first winding 26-1 of the second input winding 26
  • the first input winding (25) is created as the first output winding (2-1) from the sum of the capacitive coupling of the switching frequency components generated by the transient conductor surface (26-5) as the first output winding (2-1). Is the value obtained by subtracting the capacitive coupling of the switching frequency components.
  • the size of the capacitive coupling generated by the second coupling part 31-2 to the first output winding 2-1 is larger as the area of the second coupling part 31-2 increases, and the second input winding ( The larger the number of turns of the first winding 26-1 of 26) and the number of turns of the second winding 26-2, the larger the number of turns, the larger the area of the conductor surface 26-5, the larger the first coupling portion 31-1. The smaller the area of) is, the larger it is.
  • the size of the sum of the capacitive couplings generated by the first output winding 2-1 by the first coupling portion 31-1 and the second coupling portion 31-2 of the multilayer PCB portion 3-4 The polarity of and can be easily set by various methods, including adjusting the ratio of the area occupied by the first coupling portion 31-1 and the second coupling portion 31-2 on the PCB surface of the first layer.
  • the first output winding (2-1) and the second output winding (4-1) by the first coupling portion (31-1), the second coupling portion (31-2) and the third coupling portion (28) The size and polarity of the sum of the capacitive bonds produced by can also be easily set.
  • the first coupling unit 31-1 and the second coupling unit 31-2 and the second coupling unit 31-2 of the multilayer PCB unit 3-4 are provided.
  • the size and polarity of the sum of the capacitive couplings of the switching frequency components generated by the first output winding 2-1 and the second output winding 4-1 by the three coupling unit 28 are appropriately set,
  • the sum of the capacitive coupling of the switching frequency components generated by the first output winding (2-1) and the second output winding (4-1) of all the elements on the primary side is close to "zero", and the output line of the power supply
  • the noise of the switching frequency component of is very low.
  • the capacitive coupling of the switching frequency components generated by the first output winding (2-1) by the conductor surface (26-5) connected to the starting point of the first input winding (25) is the first output winding (2-1) It is applicable only when it is greater than the capacitive coupling of the switching frequency component generated by
  • FIG. 10 shows a multilayer PCB unit 3-5 composed of a six-layer PCB surface, which is another embodiment of the present invention, and the multilayer PCB unit 3-5 is a multilayer PCB unit 3 of the power supply device of FIG. 4. Can be substituted for -1).
  • a first coupling portion 32-1 and a second coupling portion 32-2 are formed on the first-layer PCB surface, and FIG. 4 is formed on the second-layer PCB surface.
  • the first winding 26-1 of the second input winding 26 and the conductor side 26-7 connected to the electrical ground of the primary side of the power supply of the power supply unit are formed, and the PCB surface of the third layer to the fifth layer is formed.
  • the second winding 25-2 to the fourth winding 25-4 of the first input winding 25 are formed, and a third coupling part 28 is formed on the PCB surface of the end layer.
  • the first coupling part 32-1 is a first conductor surface connected to a part of the first winding 25-1 and the first winding 25-1 of the first input winding 25 on the PCB surface of the first layer. It is composed by (25-5).
  • the second coupling portion 32-2 is constituted by an empty surface 32-4 without a conductor in the first layer of the PCB surface.
  • the 3rd coupling part 28 is comprised by the 2nd winding 26-2 of the 2nd input winding 26.
  • the starting point of the first winding 25-1 of the first input winding 25 is connected to the terminal c.
  • the end points of the first winding 25-1, the second winding 25-2, and the third winding 25-3 of the first input winding 25 are through holes (g and h and f),
  • the first input winding 25 is connected to the starting points of the second winding 25-2, the third winding 25-3, and the fourth winding 25-4.
  • the end point of the fourth winding 25-4 of the first input winding 25 is connected to the terminal d.
  • the starting point of the first winding 26-1 of the second input winding 26 is connected to the terminal b, and the end point of the first winding 26-1 of the second input winding 26 is Through Hole ( It is connected to the starting point of the second winding 26-2 of the second input winding 26 through e).
  • the end point of the second winding 26-2 of the second input winding 26 is connected to the terminal (a).
  • the first coupling unit 32-1 consisting of) is the capacitance of the switching frequency component of the same polarity as the capacitive coupling of the switching frequency components generated from the first input winding 25 to the first output winding 2-1.
  • the gender coupling is created with the first output winding (2-1).
  • the size of the capacitive coupling generated by the first coupling part 32-1 into the first output winding 2-1 is the first input winding 25 constituting the first coupling part 32-1.
  • the smaller the number of turns of one winding 25-1 is, the smaller it is, and the smaller the area of the first conductor surface 25-5 is, the smaller it is, so it can be easily adjusted by hand.
  • the first winding 26-1 of the second input winding 26 located on the second layer and the conductor surface connected to the electrical ground of the primary side of the power supply device (26-7) is the capacitive coupling of the switching frequency components generated by the first input winding 25 as the first output winding 2-1 through the blank surface 32-4 without a conductor in the first layer.
  • the capacitive coupling of the switching frequency component of the opposite polarity to is generated by the first output winding 2-1.
  • the first input winding 25 also generates a capacitive coupling of the switching frequency components to the first output winding 2-1 through the blank surface 32-4 without a conductor of the first layer.
  • the empty surface 32-4 without a conductor constitutes the second coupling portion 32-2.
  • the magnitude of the capacitive coupling of the switching frequency component generated by the first output winding 2-1 by the second coupling unit 32-2 is equal to that of the first winding 26-1 of the second input winding 26.
  • the switching frequency generated by the first input winding 25 by the first output winding 2-1 from the capacitive coupling of the switching frequency components generated by the conductor surface 26-7 by the first output winding 2-1 It is the value minus the capacitive binding of the component.
  • the size of the capacitive coupling generated by the second coupling part 32-2 to the first output winding 2-1 increases as the area of the second coupling part 32-2 increases, and the second input winding 26 ), the larger the number of turns, the larger the area, and the larger the area of the conductor surface 26-7 is, the easier adjustment is possible.
  • the size of the sum of the capacitive couplings generated by the first coupling portion 32-1 and the second coupling portion 32-2 of the multilayer PCB portion 3-5 and the first output winding 2-1 The polarity can be easily set by adjusting the ratio of the area occupied by the first coupling portion 32-1 and the second coupling portion 32-2 on the PCB surface of the first layer.
  • the first output winding (2-1) and the second output winding (4-1) by the first coupling portion (32-1), the second coupling portion (32-2) and the third coupling portion (28) The size and polarity of the sum of the capacitive bonds produced by can also be easily set.
  • the first coupling unit 32-1 and the second coupling unit 32-2 and the second coupling unit 32-2 of the multilayer PCB unit 3-5 are provided.
  • the size and polarity of the sum of the capacitive couplings of the switching frequency components generated by the first output winding 2-1 and the second output winding 4-1 by the three coupling unit 28 are appropriately set,
  • the sum of the capacitive coupling of the switching frequency components generated by the first output winding (2-1) and the second output winding (4-1) of all the elements on the primary side is close to "zero", and the output line of the power supply
  • the noise of the switching frequency component of is very low.
  • the first winding 26-1 and the conductor surface 26-7 of the second input winding 26 are the first output winding 2-1. It is applicable only when the capacitive coupling of the switching frequency components generated by the first input winding 25 is larger than the capacitive coupling of the switching frequency components generated by the first output winding 2-1.
  • FIG. 11 shows a multilayer PCB unit 3-6 composed of a six-layer PCB surface, which is another embodiment of the present invention, and the multilayer PCB unit 3-6 is a multilayer PCB unit 3 of the power supply device of FIG. 4. Can be substituted for -1).
  • the multilayer PCB part 3-6 of FIG. 11 comprises a first coupling part 33-1 and a second coupling part 33-2 on the first-layer PCB surface, and a second coupling part 33-1 and a second coupling part 33-2 on the second-layer PCB surface.
  • the first coupling part 33-1 is constituted by the first winding 25-1 of the first input winding 25 connected between the terminal c and the through hole j on the first layer of the PCB. do.
  • the second coupling part 33-2 is formed by the second winding 26-2 of the second input winding 26 connected between the Through Hole (k) and the Through Hole (e) on the PCB surface of the first layer. It is composed.
  • the third coupling portion 28 is constituted by the third winding 26-3 of the second input winding 26.
  • the first winding 25-1 of the first input winding 25 is between the terminal c of the first layer PCB and the through hole j. Connected.
  • the second winding 26-2 of the second input winding 26 is connected between the Through Hole (k) and Through Hole (e) of the first layer of the PCB.
  • the first winding (26-1) of the second input winding (26) is connected between the terminal (b) of the second layer PCB and the Through Hole (k), and the Through Hole (j) of the second layer PCB
  • the second winding 25-2 of the first input winding 25 is connected between the through holes g.
  • the end points of the first winding (25-1), the second winding (25-2), the third winding (25-3) and the fourth winding (25-4) of the first input winding (25) are through hole (j). And g, h and f), the second winding (25-2), the third winding (25-3), the fourth winding (25-4) and the fifth winding (25-) of the first input winding (25). It is connected to the starting point of 5). The end point of the fifth winding 25-5 of the first input winding 25 is connected to the terminal d.
  • the end points of the first winding 26-1 and the second winding 26-2 of the second input winding 26 are passed through the through holes (k and e), and the second winding of the second input winding 26 ( It is connected to the starting point of 26-2) and the third winding 26-3.
  • the end point of the third winding 26-3 of the second input winding 26 is connected to the terminal (a).
  • the sum of the voltages of the first winding 26-1, the second winding 26-2, and the third winding 26-3 of the second input winding 26 is It is rectified and smoothed by the diode 15-1 and the capacitor 16-1, and supplied as a power supply voltage to the control unit 14-1.
  • the sum of the voltages of the first winding 26-1, the second winding 26-2, and the third winding 26-3 of the second input winding 26 is the resistance 17-1 of FIG. ) And the resistance 18-1 and applied as a control input of the control unit 14-1 to control the output voltage of the power supply.
  • the first winding 25-1 of the first input winding 25 constituting the first coupling unit 33-1 is the first input winding 25.
  • the capacitive coupling of the switching frequency components of the same polarity as the capacitive coupling of the switching frequency components generated from the first output winding 2-1 is generated as the first output winding 2-1.
  • the size of the capacitive coupling generated by the first coupling unit 33-1 to the first output winding 2-1 is, as the number of turns of the first winding 25-1 of the first input winding 25 decreases. It becomes smaller, and the narrower the conductor surface of the first winding 25-1 of the first input winding 25 is, the smaller it is, so it can be easily adjusted by hand.
  • the second winding 26-2 of the second input winding 26 constituting the second coupling unit 33-2 is the first input winding 25.
  • the capacitive coupling of the switching frequency components generated from the first output winding 2-1 and the capacitive coupling of the switching frequency components of the opposite polarity are generated as the first output winding 2-1.
  • the size of the capacitive coupling generated by the second coupling unit 33-2 to the first output winding 2-1 is the second winding 26-2 and the third winding 26 of the second input winding 26.
  • the number of turns of -3) increases, the number of turns increases, and the wider the conductor surface of the second winding 26-2 of the second input winding 26 increases, the easier adjustment is possible.
  • the size of the sum of the capacitive couplings generated by the first coupling portion 33-1 and the second coupling portion 33-2 of the multilayer PCB portion 3-6 and the first output winding 2-1 Polarity can be easily set.
  • the first coupling portion (33-1), the second coupling portion (33-2) and the third coupling portion (28) are divided into the first output winding (2-1) and the second output winding (4-1). The size and polarity of the sum of the resulting capacitive bonds can also be easily set.
  • the first coupling unit 33-1 and the second coupling unit 33-2 and the second coupling unit 33-2 of the multilayer PCB unit 3-6 are provided.
  • the sum of the capacitive coupling of the switching frequency components generated by the first and second output windings (2-1) and the second output windings (4-1) on the vehicle side is close to "zero", and the output line of the power supply is The noise of the switching frequency component is very low.
  • the second coupling unit 33-2 is the second winding 26-2 or the third winding 26 of the second input winding 26. It can also be configured by -3).
  • the multilayer PCB unit 3-7 may replace the multilayer PCB unit 3-1 of the power supply device of FIG. 4.
  • the multilayer PCB part 3-7 of FIG. 12 comprises a first coupling part 34-1 and a second coupling part 34-2 on the PCB surface of the first layer, and the PCB surface of the second layer to the fifth layer.
  • the first winding 25-1 to the fourth winding 25-4 of the first input winding 25 are formed, and a third coupling part 28 is formed on the PCB surface of the end layer.
  • the first coupling portion 34-1 is constituted by a conductor surface 34-3 connected to the electrical ground of the primary side of the power supply device.
  • the second coupling part 34-2 is a conductor surface connected to a part of the first winding 26-1 of the second input winding 26 and the first winding 26-1 of the second input winding 26 It is composed by (26-5).
  • the third coupling portion 28 is constituted by the second winding 26-2 of the second input winding 26.
  • the conductor surface 34-3 connected to the electrical ground of the primary side of the power supply device constituting the first coupling part 34-1 is a first-layer PCB It is connected to the terminal (a) on the side.
  • the first winding 26-1 of the second input winding 26 constituting the second coupling portion 34-2 is connected between the terminal (b) of the PCB surface of the first layer and the through hole (e). .
  • the starting point of the first winding 25-1 of the first input winding 25 is connected to the terminal c.
  • the end points of the first winding (25-1), the second winding (25-2), and the third winding (25-3) of the first input winding (25) are the first through holes (f and i and g).
  • the end point of the fourth winding 25-4 of the first input winding 25 is connected to the terminal d.
  • the starting point of the first winding 26-1 of the second input winding 26 is connected to the terminal b, and the end point of the first winding 26-1 of the second input winding 26 is Through Hole ( It is connected to the starting point of the second winding 26-2 of the second input winding 26 through e).
  • the end point of the second winding 26-2 of the second input winding 26 is connected to the terminal (a).
  • FIG. 13 shows a multilayer PCB part 3-8 composed of a six-layer PCB surface, which is another embodiment of the present invention.
  • the multilayer PCB unit 3-8 may replace the multilayer PCB unit 3-1 of the power supply device of FIG. 4.
  • the multilayer PCB part 3-8 of FIG. 13 comprises a first coupling part 34-1 and a second coupling part 34-2 on the first-layer PCB surface, and most of the second-layer PCB surface In the area, a conductor surface 35 connected to the electrical ground of the primary side of the power supply device is formed, and a passage connecting the terminal (d) and the through hole (g) is formed in a partial area of the PCB surface of the second layer.
  • the first coupling portion 34-1 is constituted by a conductor surface 34-3 connected to the electrical ground of the primary side of the power supply device.
  • the second coupling part 34-2 is a conductor surface connected to a part of the first winding 26-1 of the second input winding 26 and the first winding 26-1 of the second input winding 26 It is composed by (26-5).
  • the third coupling portion 28 is constituted by the second winding 26-2 of the second input winding 26.
  • the conductor surface 35 formed on the second-layer PCB surface effectively blocks the first input winding 25 from capacitively coupling with the first output winding 2-1.
  • the starting point of the first winding 25-1 of the first input winding 25 is connected to the terminal c.
  • the end points of the first winding 25-1 and the second winding 25-2 of the first input winding 25 are connected to the second winding 25 of the first input winding 25 through through holes f and i. It is connected to the starting point of -2) and the third winding (25-3).
  • the end point of the third winding 25-3 of the first input winding 25 is connected to the terminal d through the through hole g.
  • the starting point of the first winding 26-1 of the second input winding 26 is connected to the terminal b, and the end point of the first winding 26-1 of the second input winding 26 is Through Hole ( It is connected to the starting point of the second winding 26-2 of the second input winding 26 through e).
  • the end point of the second winding 26-2 of the second input winding 26 is connected to the terminal (a).
  • the conductor surface 34-3 of the first coupling portion 34-1 is connected to the terminal (a).
  • the conductor face 35 is connected to the terminal a.
  • the first coupling portion 34- consisting of a conductor surface 34-3 connected to the electrical ground of the primary side of the power supply device. 1) is the capacitive coupling of the switching frequency components of the same polarity as the capacitive coupling of the switching frequency components generated from the first input winding 25 to the first output winding 2-1. ).
  • the size of the capacitive coupling generated by the first coupling part 34-1 to the first output winding 2-1 is the area of the conductor surface 34-3 constituting the first coupling part 34-1. The smaller it is, the smaller it is, so it can be easily adjusted by hand.
  • the first winding 26-1 of the second input winding 26 and the first winding of the second input winding 26 ( The second coupling part 34-2 formed by the conductor surface 26-5 connected to a part of 26-1) is generated from the first input winding 25 to the first output winding 2-1.
  • the capacitive coupling of the switching frequency component and the capacitive coupling of the switching frequency component of opposite polarity are generated by the first output winding 2-1.
  • the size of the capacitive coupling generated by the second coupling unit 34-2 to the first output winding 2-1 is the number of turns of the first winding 26-1 of the second input winding 26 and the second
  • the size and polarity of the sum of bonds can be easily set.
  • the size and polarity of the sum of the capacitive bonds produced by can also be easily set.
  • the first coupling unit 34-1 and the second coupling unit of the multilayer PCB unit 3-7 or 3-8 The size and polarity of the sum of capacitive coupling of switching frequency components generated by the first output winding (2-1) and the second output winding (4-1) by the part 34-2 and the third coupling part 28
  • the sum of the capacitive coupling of the switching frequency components generated by the first output winding (2-1) and the second output winding (4-1) by all the elements on the primary side of the power supply is "zero". Close, and very low the noise of the switching frequency component of the output line of the power supply.
  • the second coupling unit 34-2 is the first winding 26-1 of the second input winding 26.
  • the third coupling portion 28 is constituted by the first winding 26-1 of the second input winding 26.
  • the multilayer PCB unit 3-11 may replace the multilayer PCB unit 3-1 of the power supply device of FIG. 4.
  • the multilayer PCB part 3-11 of FIG. 14 comprises a first coupling part 37-1 and a second coupling part 37-2 on the first layer of the PCB, and the second to fifth layers of the PCB
  • the first winding 25-1 to the fourth winding 25-4 of the first input winding 25 are formed, and a third coupling part 28a is formed on the PCB surface of the end layer.
  • the first coupling portion 37-1 is constituted by a conductor surface 37-3 connected to the electrical ground of the primary side of the power supply device.
  • the second coupling portion 37-2 is constituted by the first winding 26-1 of the second input winding 26.
  • the third coupling portion 28a includes a conductor surface 26-5 connected to the starting point of the first winding 26-1 of the second input winding 26 and the second winding 26 of the second input winding 26. It is composed by -2).
  • the starting point of the first winding 25-1 of the first input winding 25 is connected to the terminal c.
  • the end points of the first winding (25-1), the second winding (25-2), and the third winding (25-3) of the first input winding (25) are the first through holes (f and i and g). It is connected to the starting points of the second winding 25-2, the third winding 25-3, and the fourth winding 25-4 of the input winding 25.
  • the end point of the fourth winding 25-4 of the first input winding 25 is connected to the terminal d.
  • the starting point of the first winding 26-1 of the second input winding 26 is connected to the terminal b, and the end point of the first winding 26-1 of the second input winding 26 is Through Hole ( It is connected to the starting point of the second winding 26-2 of the second input winding 26 through e).
  • the end point of the second winding 26-2 of the second input winding 26 is connected to the terminal (a).
  • the conductor face 26-5 is connected to the terminal b.
  • the conductor surface 37-3 constituting the first coupling portion 37-1 is connected to the terminal a.
  • the first coupling part 37-1 composed of a conductor surface 37-3 connected to the electrical ground of the primary side of the power supply device is a first input winding.
  • Capacitive coupling of switching frequency components of the same polarity as the capacitive coupling of switching frequency components generated from (25) to the first output winding 2-1 is generated as the first output winding 2-1.
  • the size of the capacitive coupling generated by the first coupling part 37-1 to the first output winding 2-1 is the area of the conductor surface 37-3 constituting the first coupling part 37-1. The smaller it is, the smaller it is, so it can be easily adjusted by hand.
  • the second coupling portion 37-2 constituted by the first winding 26-1 of the second input winding 26 is a first input winding 25.
  • a capacitive coupling of the switching frequency component generated from the first output winding 2-1 and the capacitive coupling of the switching frequency component of the opposite polarity are generated as the first output winding 2-1.
  • the size of the capacitive coupling generated by the second coupling part 37-2 to the first output winding 2-1 is the number of turns of the first winding 26-1 of the second input winding 26 and the second Since the number of turns of the winding 26-2 increases, it can be easily adjusted.
  • the size of the sum of the capacitive couplings generated by the first coupling portion 37-1 and the second coupling portion 37-2 of the multilayer PCB portion 3-11 and the first output winding 2-1 Polarity can be easily set.
  • the first coupling portion 37-1, the second coupling portion 37-2, and the third coupling portion 28a are formed into the first output winding 2-1 and the second output winding 4-1. The size and polarity of the sum of the resulting capacitive bonds can also be easily set.
  • the first coupling portion 37-1 and the second coupling portion 37-2 and the second coupling portion 37-2 of the multilayer PCB unit 3-11 By appropriately setting the size and polarity of the sum of capacitive couplings of the switching frequency components generated by the three-coupler 28a of the first output winding 2-1 and the second output winding 4-1, The sum of the capacitive coupling of the switching frequency components generated by the first and second output windings (2-1) and the second output windings (4-1) on the vehicle side is close to "zero", and the output line of the power supply is The noise of the switching frequency component is very low.
  • the multilayer PCB unit 3-12 is a multilayer PCB unit 3 of the power supply device of Fig. 4. Can be substituted for -1).
  • the multilayer PCB part 3-12 of FIG. 15 includes a first coupling part 38-1 and a second coupling part 38-2 on the PCB surface of the first layer, and a second coupling part 38-1 on the PCB surface of the second layer.
  • the first winding 26-1 of the input winding 26 is formed, and the first winding 25-1 to the third winding 25- of the first input winding 25 are formed on the PCB surface of the third to fifth layers. 3), and a third coupling part 28 on the surface of the sixth layer.
  • the first coupling portion 38-1 is composed of a conductor surface 38-3 connected to the electrical ground of the primary side of the power supply.
  • the second coupling portion 38-2 is composed of an empty surface 38-4 without a conductor.
  • the third coupling unit 28 is composed of the second winding 26-2 of the second input winding 26.
  • the terminal (c) is the first winding (25-1) of the first input winding (25) through the passage of the PCB surface of the first layer and the Through Hole (g). Is connected to the starting point of.
  • the end points of the first winding 25-1 and the second winding 25-2 of the first input winding 25 are connected to the second winding 25 of the first input winding 25 through through holes (h and f). It is connected to the starting point of -2) and the third winding (25-3).
  • the end point of the third winding 25-3 of the first input winding 25 is connected to the terminal d.
  • the starting point of the first winding 26-1 of the second input winding 26 is connected to the terminal b, and the end point of the first winding 26-1 of the second input winding 26 is Through Hole ( It is connected to the starting point of the second winding 26-2 of the second input winding 26 through e).
  • the end point of the second winding 26-2 of the second input winding 26 is connected to the terminal (a).
  • the conductor surface 38-3 connected to the electrical ground of the primary side of the power supply device constituting the first coupling part 38-1 is a first input winding.
  • Capacitive coupling of switching frequency components of the same polarity as the capacitive coupling of switching frequency components generated from (25) to the first output winding 2-1 is generated as the first output winding 2-1.
  • the size of the capacitive coupling created by the first coupling part 38-1 to the first output winding 2-1 is a small ratio of the area occupied by the first coupling part 38-1 on the PCB surface of the first layer. As it gets smaller, it can be easily adjusted by hand.
  • the first winding 26-1 of the second input winding 26 positioned on the second layer is a blank surface 38-4 without a conductor of the first layer.
  • the capacitive coupling of the switching frequency components generated from the first input winding 25 to the first output winding 2-1 and the capacitive coupling of the switching frequency components of the opposite polarity are performed in the first output winding (2-1). ).
  • the first input winding 25 also generates a capacitive coupling of the switching frequency components to the first output winding 2-1 through the blank surface 38-4 without a conductor of the first layer.
  • the empty surface 38-4 without a conductor constitutes the second coupling portion 38-2.
  • the magnitude of the capacitive coupling of the switching frequency component generated by the first output winding 2-1 by the second coupling unit 38-2 is the first winding 26-1 of the second input winding 26.
  • the size of the capacitive coupling generated by the second coupling portion 38-2 to the first output winding 2-1 is larger as the area of the second coupling portion 38-2 increases, and the second input winding 26 ), the larger the number of turns of the first winding 26-1 and the second winding 26-2, the larger the number of turns, and the smaller the area of the first coupling portion 38-1 is larger.
  • the size of the sum of the capacitive couplings generated by the first output winding 2-1 by the first coupling portion 38-1 and the second coupling portion 38-2 of the multilayer PCB portion 3-12 The polarity of and can be easily set by various methods, including adjusting the ratio of the area occupied by the first coupling portion 38-1 and the second coupling portion 38-2 on the PCB surface of the first layer.
  • the size and polarity of the sum of the capacitive bonds produced by can also be easily set.
  • the first coupling unit 38-1 and the second coupling unit 38-2 and the second coupling unit 38-2 of the multilayer PCB unit 3-12 are provided.
  • the size and polarity of the sum of the capacitive couplings of the switching frequency components generated by the first output winding 2-1 and the second output winding 4-1 by the three coupling unit 28 are appropriately set,
  • the sum of the capacitive coupling of the switching frequency components generated by the first output winding (2-1) and the second output winding (4-1) of all the elements on the primary side is close to "zero", and the output line of the power supply
  • the noise of the switching frequency component of is very low.
  • the switching frequency component generated by the first winding 26-1 of the second input winding 26 as the first output winding 2-1 is applicable only when the capacitive coupling of the first input winding 25 is greater than the capacitive coupling of the switching frequency components generated by the first output winding 2-1.
  • FIG. 16 shows a multilayer PCB part 3-13 composed of a 6-layer PCB surface, which is another embodiment of the present invention, and the multilayer PCB part 3-13 is a multilayer PCB part 3 of the power supply device of FIG. 4. Can be substituted for -1).
  • a first coupling part 39-1 and a second coupling part 39-2 are formed on the PCB surface of the first layer, and the second coupling part 39-2 is formed on the PCB surface of the second layer.
  • the first winding 26-1 of the input winding 26 is formed, and the second winding 25-2 to the fourth winding 25- of the first input winding 25 are formed on the PCB surface of the third to fifth layers. 4) is configured, and a third coupling part 28 is configured on the PCB surface of the end layer.
  • the first coupling part 32-1 is a first conductor surface connected to a part of the first winding 25-1 and the first winding 25-1 of the first input winding 25 on the PCB surface of the first layer.
  • the second coupling portion 39-2 is constituted by an empty surface 39-4 without a conductor in the first layer of the PCB surface.
  • the 3rd coupling part 28 is comprised by the 2nd winding 26-2 of the 2nd input winding 26.
  • the starting point of the first winding 25-1 of the first input winding 25 is connected to the terminal c.
  • the end points of the first winding (25-1), the second winding (25-2), and the third winding (25-3) of the first input winding (25) are the first through holes (g, h, and f). It is connected to the starting points of the second winding 25-2, the third winding 25-3, and the fourth winding 25-4 of the input winding 25.
  • the end point of the fourth winding 25-4 of the first input winding 25 is connected to the terminal d.
  • the starting point of the first winding 26-1 of the second input winding 26 is connected to the terminal b, and the end point of the first winding 26-1 of the second input winding 26 is Through Hole ( It is connected to the starting point of the second winding 26-2 of the second input winding 26 through e).
  • the end point of the second winding 26-2 of the second input winding 26 is connected to the terminal (a).
  • the first coupling part 39-1 consisting of
  • the gender coupling is created with the first output winding (2-1).
  • the size of the capacitive coupling generated by the first coupling part 39-1 to the first output winding 2-1 is the first of the first input winding 25 constituting the first coupling part 39-1. The smaller the number of turns of the winding 25-1 is, the smaller it is, and the smaller the area of the first conductor surface 25-5 is, the smaller it is, so it can be easily adjusted.
  • the first winding 26-1 of the second input winding 26 located on the second layer covers the blank surface 39-4 without a conductor of the first layer.
  • the capacitive coupling of the switching frequency components generated by the first output winding 2-1 and the capacitive coupling of the switching frequency components of the opposite polarity are converted into the first output winding 2-1.
  • the first input winding 25 also generates a capacitive coupling of the switching frequency components to the first output winding 2-1 through the blank surface 39-4 without a conductor of the first layer.
  • the empty surface 39-4 without a conductor constitutes the second coupling portion 32-2.
  • the magnitude of the capacitive coupling of the switching frequency components generated by the first output winding 2-1 by the second coupling unit 39-2 is the first winding 26-1 of the second input winding 26.
  • the size of the capacitive coupling generated by the second coupling part 39-2 to the first output winding 2-1 is that the number of turns of the first winding 25-1 of the first input winding 25 is small.
  • the polarity and polarity can be easily set by various methods, including adjusting the ratio of the area occupied by the first coupling portion 39-1 and the second coupling portion 39-2 on the first-layer PCB surface.
  • first output winding (2-1) and the second output winding (4-1) by the first coupling portion (39-1), the second coupling portion (39-2) and the third coupling portion (28) The size and polarity of the sum of the capacitive bonds produced by can also be easily set.
  • the first coupling portion 39-1 and the second coupling portion 39-2 and the second coupling portion 39-2 of the multilayer PCB portion 3-5 are appropriately set.
  • the sum of the capacitive coupling of the switching frequency components generated by the first output winding (2-1) and the second output winding (4-1) of all the elements on the primary side is close to "zero", and the output line of the power supply
  • the noise of the switching frequency component of is very low.
  • the switching frequency component generated by the first winding 26-1 of the second input winding 26 as the first output winding 2-1 is applicable only when the capacitive coupling of the first input winding 25 is greater than the capacitive coupling of the switching frequency components generated by the first output winding 2-1.
  • FIG. 17 shows a multilayer PCB unit 3-9 constituted by a six-layer PCB surface, which is another embodiment of the present invention, and the multilayer PCB unit 3-9 is a multilayer PCB unit 3 of the power supply device of FIG. 4. Can be substituted for -1).
  • the multilayer PCB part 3-9 of FIG. 17 comprises a first coupling part 36-1 and a second coupling part 36-2 on the first layer of the PCB, and the second to fifth layers of the PCB
  • the first winding 25-1 to the fourth winding 25-4 of the first input winding 25 are formed, and a third coupling part 28 is formed on the PCB surface of the end layer.
  • the first coupling portion 36-1 is constituted by an empty surface 36-4 without a conductor in the first layer of the PCB surface.
  • the second coupling portion 36-2 is constituted by the first winding 26-1 of the second input winding 26.
  • the third coupling portion 28 is constituted by the second winding 26-2 of the second input winding 26.
  • the starting point of the first winding 25-1 of the first input winding 25 is connected to the terminal c.
  • the end points of the first winding (25-1), the second winding (25-2), and the third winding (25-3) of the first input winding (25) are the first through holes (f and i and g). It is connected to the starting points of the second winding 25-2, the third winding 25-3, and the fourth winding 25-4 of the input winding 25.
  • the end point of the fourth winding 25-4 of the first input winding 25 is connected to the terminal d.
  • the starting point of the first winding 26-1 of the second input winding 26 is connected to the terminal b, and the end point of the first winding 26-1 of the second input winding 26 is Through Hole ( It is connected to the starting point of the second winding 26-2 of the second input winding 26 through e).
  • the end point of the second winding 26-2 of the second input winding 26 is connected to the terminal (a).
  • FIG. 18 shows a multilayer PCB unit 3-10 composed of a six-layer PCB surface, which is another embodiment of the present invention, and the multilayer PCB unit 3-10 is a multilayer PCB unit 3 of the power supply device of FIG. Can be substituted for -1).
  • the multilayer PCB part 3-10 of FIG. 18 comprises a first coupling part 36-1 and a second coupling part 36-2 on the first-layer PCB surface, and most of the second-layer PCB surface In the area, a conductor surface 35 connected to the electrical ground of the primary side of the power supply device is formed, and a passage connecting the terminal (d) and the through hole (g) is formed in a partial area of the PCB surface of the second layer. , Compose the first winding (25-1) to the third winding (25-3) of the first input winding 25 on the PCB surface of the third to fifth layers, and a third coupling part ( 28).
  • the first coupling portion 36-1 is constituted by an empty surface 36-4 without a conductor.
  • the second coupling portion 36-2 is constituted by the first winding 26-1 of the second input winding 26.
  • the third coupling portion 28 is constituted by the second winding 26-2 of the second input winding 26.
  • the conductor surface 35 formed on the second-layer PCB surface effectively blocks the capacitive coupling of the first input winding 25 to the first output winding 2-1.
  • the starting point of the first winding 25-1 of the first input winding 25 is connected to the terminal c.
  • the end points of the first winding 25-1 and the second winding 25-2 of the first input winding 25 are connected to the second winding 25 of the first input winding 25 through through holes f and i. It is connected to the starting point of -2) and the third winding (25-3).
  • the end point of the third winding 25-3 of the first input winding 25 is connected to the terminal d through the through hole g.
  • the starting point of the first winding 26-1 of the second input winding 26 is connected to the terminal b, and the end point of the first winding 26-1 of the second input winding 26 is Through Hole ( It is connected to the starting point of the second winding 26-2 of the second input winding 26 through e).
  • the end point of the second winding 26-2 of the second input winding 26 is connected to the terminal (a).
  • the capacitiveness of the switching frequency components of the same polarity as the capacitive coupling of the switching frequency components generated by the first output winding 2-1 The coupling is created as the first output winding 2-1 by the first coupling portion 36-1 composed of a blank surface 36-4 without a conductor.
  • the size of the capacitive coupling generated by the first coupling part 36-1 to the first output winding 2-1 is a blank surface 36- without a conductor constituting the first coupling part 36-1.
  • the second coupling portion 36-2 constituted by the first winding 26-1 of the second input winding 26 Is the capacitive coupling of the switching frequency components generated from the first input winding 25 to the first output winding 2-1 and the capacitive coupling of the switching frequency components of the opposite polarity to the first output winding 2-1.
  • the size of the capacitive coupling generated by the second coupling unit 36-2 to the first output winding 2-1 is the number of turns of the first winding 26-1 of the second input winding 26 and the second
  • the size and polarity of the sum of bonds can be easily set.
  • the size and polarity of the sum of the capacitive bonds produced by can also be easily set.
  • the first coupling unit 36-1 and the second combination of the multilayer PCB unit 3-9 or 3-10 Size and polarity of the sum of capacitive coupling of switching frequency components generated by the first output winding (2-1) and the second output winding (4-1) by the part 36-2 and the third coupling part 28
  • the sum of the capacitive coupling of the switching frequency components generated by the first output winding (2-1) and the second output winding (4-1) by all the elements on the primary side of the power supply is "zero". Close, and very low the noise of the switching frequency component of the output line of the power supply.
  • FIG. 19 and 20 show a multilayer PCB part (3-14 or 3-15) constituted by a six-layer PCB surface, which is another embodiment of the present invention, and the multilayer PCB part (3-14 or 3-15) is It can replace the multilayer PCB part 3-1 of the power supply device of FIG. 4.
  • the multilayer PCB unit 3-14 of FIG. 19 is different from the multilayer PCB unit 3-9 of FIG. 17 only on the first layer of the PCB, and the configurations from the second to the sixth layers are the same.
  • the multilayer PCB unit 3-15 of FIG. 20 is different from the multilayer PCB unit 3-10 of FIG. 18 only on the first layer of the PCB, and the configurations from the second layer to the sixth layer are the same.
  • the first coupling part 40-1 and the second input composed of a blank surface 40-4 on the first-layer PCB surface
  • a second coupling portion 40-2 composed of the first winding 26-1 of the winding 26 is formed.
  • the first coupling part 40-1 and the second coupling part 40-1 constituted by a blank surface 40-4 on the first-layer PCB surface
  • the second coupling portion 40-2 composed of the first winding 26-1 of the input winding 26 is configured, but compared to the multilayer PCB portion 3-9 or 3-10 of FIG. 17 or 18
  • the area of the blank surface 40-4 is remarkably small, and the width of a part of the conductor of the first winding 26-1 of the second input winding 26 is remarkably wide.
  • the multilayer PCB unit 3-14 or 3-15 of FIG. 19 or 20 is generated from the first input winding 25 to the first output winding 2-1 and the second output winding 4-1. It is effective when the capacitive coupling of the switching frequency components is large.
  • FIG. 21 shows a multilayer PCB unit 3-16 composed of a six-layer PCB surface, which is another embodiment of the present invention, and the multilayer PCB unit 3-16 is a multilayer PCB unit 3 of the power supply device of FIG. Can be substituted for -1).
  • the multilayer PCB part 3-16 of FIG. 21 comprises a first coupling part 42-1 and a second coupling part 42-2 on the first layer of the PCB, and the second to fifth layers of the PCB
  • the first winding 25-1 to the fourth winding 25-4 of the first input winding 25 are formed, and a third coupling part 28 is formed on the PCB surface of the end layer.
  • the first coupling portion 42-1 is constituted by an empty surface 42-4 without a conductor in the first layer of the PCB surface.
  • the second coupling portion 42-2 is constituted by a conductor surface 42-5 that occupies most of the surface of the first layer of the PCB, and the starting point of the second input winding 26 or the second input winding 26 ) Is connected to a point between the start point and the end point.
  • the third coupling portion 28 is constituted by a second input winding 26.
  • the starting point of the first winding 25-1 of the first input winding 25 is connected to the terminal c.
  • the end points of the first winding (25-1), the second winding (25-2), and the third winding (25-3) of the first input winding (25) are the first through holes (g, h, and f). It is connected to the starting points of the second winding 25-2, the third winding 25-3, and the fourth winding 25-4 of the input winding 25.
  • the end point of the fourth winding 25-4 of the first input winding 25 is connected to the terminal d.
  • the starting point of the second input winding 26 is connected to the terminal b, and is connected to the terminal a through the through hole e of the second input winding 26 and the conductor surface 42-5.
  • the first coupling part 42-1 is formed by a blank surface 42-4 without a conductor on the first-layer PCB surface, and the first input winding ( 25) to the first output winding 2-1 to generate a capacitive coupling of the switching frequency components.
  • the size of the capacitive coupling generated by the first coupling part 42-1 to the first output winding 2-1 is a small ratio of the area occupied by the first coupling part 42-1 on the PCB surface of the first layer. As it gets smaller, it can be easily adjusted by hand.
  • the second coupling part 42-2 occupies most of the surface of the first layer of the PCB and is connected to the starting point of the second input winding 26 or a point between the starting point and the ending point of the second input winding 26. It is constituted by the conductor surface 42-5 to be formed, and effectively blocks the capacitive coupling of the first input winding 25 to the first output winding 2-1.
  • the second coupling unit 42-2 is a capacitive coupling of the switching frequency components generated by the first input winding 25 as the first output winding 2-1 or the second output winding 4-1. The capacitive coupling of the switching frequency component of the opposite polarity to is generated by the first output winding 2-1.
  • the size of the capacitive coupling generated by the second coupling portion 42-2 to the first output winding 2-1 increases as the variation of the potential of the second coupling portion 42-2 increases, and the second Since the larger the area occupied by the coupling portion 42-2 increases, it can be easily adjusted by hand. Therefore, the size and polarity of the sum of capacitive couplings generated by the first output winding 2-1 by the second coupling portion 42-2 of the multilayer PCB portion 3-16 of FIG. 21 can be easily set. .
  • first output winding (2-1) and the second output winding (4-1) by the first coupling portion (42-1), the second coupling portion (42-2) and the third coupling portion (28) The size and polarity of the sum of the capacitive bonds produced by can also be easily set.
  • the first coupling unit 42-1 and the second coupling unit 42-2 and the second coupling unit 42-2 of the multilayer PCB unit 3-16 are provided.
  • the size and polarity of the sum of the capacitive couplings of the switching frequency components generated by the first output winding 2-1 and the second output winding 4-1 by the three coupling unit 28 are appropriately set,
  • the sum of the capacitive coupling of the switching frequency components generated by the first output winding (2-1) and the second output winding (4-1) of all the elements on the primary side is close to "zero", and the output line of the power supply
  • the noise of the switching frequency component of is very low.
  • the multilayer PCB part 3-16 is capacitive from the first input winding 25 to the first output winding 2-1 by the conductor surface 42-5 that occupies most of the PCB surface of the first layer. It effectively blocks the formation of bonds. Therefore, as described with respect to the multilayer PCB unit 3-1 of FIG. 5, the power supply device using the multilayer PCB unit 3-16 reduces the noise of the switching frequency component and the noise of the high frequency component to the outside compared to the prior art. It has the advantage of having a much smaller impact.
  • the multilayer PCB unit shown in FIGS. 5 to 21 (3-1 or 3-1a or 3-2 or 3-3 or 3-4 or 3-5 or 3-6 or 3-7 or 3-8 or 3-9 or 3-10 or 3-11 or 3-12 or 3-13 or 3-14 or 3-15 or 3-16) can be composed of 6 layers of PCB side, so 10 layers of PCB side Compared to the conventional multilayer PCB unit 3 consisting of, the price is much lower.
  • the first input winding 25 and the second input winding 26 have a magnetically high degree of coupling to the first output winding 2-1 and the second output winding 4-1. , It has the advantage of increasing the efficiency of power transmission.
  • the multilayer PCB unit shown in FIGS. 5 to 9 and 12 and 13 and 19 to 21 (3-1 or 3-1a or 3-2 or 3-3 or 3-4 or 3-7 or 3
  • the power supply using -8 or 3-14 or 3-15 or 3-16) has the advantage of having much less influence of noise of switching frequency components and high frequency components to the outside compared to the prior art.
  • the multilayer PCB unit (3-5 or 3-6 3-9 or 3-10 or 3-11 or 3-12 or 3-13) shown in FIGS. 10 and 11 and 14 to 18 The influence of noise to be applied maintains a level comparable to that of the prior art.
  • the second winding 25-2 to the third winding 25-3 of the first input winding 25 and the first winding of the second input winding 26 ( 26-1)
  • the position of the PCB surface of the second winding 25-2 to the fourth winding 25-4 of the first input winding 25 may be variously changed by a person skilled in the art.
  • elements included in the PCB surface including the first winding 26-1 of the second input winding 26 or the PCB surface including the second winding 26-2 may be changed by a person skilled in the art.
  • the first winding 26-1 and the second winding 26-2 of the second input winding 26 may be connected in parallel to each other.
  • a multilayer PCB unit 3-17 included in the transformer according to the present invention in particular, a multilayer PCB unit 3 of a conventional transformer 6 constituted by a 10-layer PCB surface. It is configured to be able to replace.
  • the multilayer PCB part 3-17 of FIG. 22 comprises a first coupling part 43-1 and a second coupling part 43-2 on the PCB surface of the first layer of the multilayer PCB part 3-17, and , To configure the third coupling portion 45 on the PCB surface of the end layer.
  • Elements constituting the second to ninth layers of the PCB surface coincide with the multilayer PCB part 3 of FIG.
  • the first coupling portion 43-1 is constituted by a conductor surface 43-3 connected to the electrical ground on the primary side of the power supply device.
  • the second coupling portion 43-2 is constituted by a conductor surface 43-5 connected to the starting point of the offset winding 44 through a Through hole (i).
  • the 3rd coupling part 45 is comprised by the offset winding 44.
  • the conductor surface 43-5 may be connected to a point between the start point and the end point of the offset winding 44.
  • the configuration of the second to ninth layer PCB surface of the multilayer PCB unit 3-17 of FIG. 22 is identical to that of the multilayer PCB unit 3 of FIG. 3.
  • the first coupling part 43-1 having the electric ground potential of the primary side of the power supply device is a capacitive coupling of the switching frequency components generated from the first input winding 25 to the first output winding 2-1.
  • the second coupling portion 43-2 to which the potential of the starting point of the offset winding 44 is connected is opposite to the capacitive coupling of the switching frequency components generated from the first input winding 25 to the first output winding 2-1. Capacitive coupling of the switching frequency components of the polarity is generated by the first output winding 2-1.
  • the first coupling portion 43-1 and the second coupling part 43-2 have a maximum size of twice the capacitive coupling of the switching frequency components generated by the offset winding 44 as the first output winding 2
  • the capacitive coupling of the switching frequency components of is produced by the first output winding (2).
  • the offset winding 44 is the second
  • the magnitude of the capacitive coupling of the switching frequency components generated by the output winding 4 is the capacitive coupling of the switching frequency components generated by the second offset winding 11 of the prior art in FIG. It becomes 1/3 of the size. Therefore, the number of turns of the offset winding 44 can be reduced to about 7 turns.
  • the number of turns of the offset winding 44 is reduced to 7 turns, which is less than 11 turns of the second offset winding 11 of FIG. 3, the number of gaps between the conductors constituting the offset winding 44 is also shown. Since it is reduced by 6 intervals from 10 intervals of the second offset winding 11 of the prior art of 3, the area of the empty surface 43-6 without a conductor in the PCB surface of the end layer is reduced by 40%. Therefore, the capacitive coupling generated by the input winding (7), the first auxiliary winding (8) and the second auxiliary winding (9) to the second output winding (4) through the blank surface (43-6) is also reduced by 40%. do.
  • the number of turns of the offset winding 44 can be reduced to be smaller than that of 7 turns, and thus, the input winding 7 and the first auxiliary winding 8 and the second auxiliary winding 9 are converted to the second output winding ( The size of capacitive bonds produced by 4) is further reduced.
  • the sum of the capacitive coupling of the switching frequency components generated by the and the second output winding 4 is close to "zero", and the noise of the switching frequency component of the output line of the power supply is very low.
  • the multilayer PCB section 3-17 of Fig. 22 is composed of a 10-layer PCB surface
  • the input winding 7 and the The size of the capacitive coupling created by the first auxiliary winding 8 and the second auxiliary winding 9 to the first output winding 2 and the second output winding 4 is in the multilayer PCB unit 3 of FIG. Since it is much smaller than that, the capacitive coupling after cancellation is achieved by the reverse polarity capacitive coupling generated by the first coupling portion 43-1, the second coupling portion 43-2, and the third coupling portion 45.
  • the residual amount of is also significantly reduced compared to the multilayer PCB unit 3 of FIG. 3, and has an advantage that the influence of noise of the switching frequency component and the high-frequency component to the outside is much smaller than that of the prior art.
  • the first coupling part 43-1 of the multilayer PCB part 3-17 shown in FIG. 22 may be configured by a blank surface without a conductor, or may be configured by a part of the input winding 7. Alternatively, it may be configured by a conductor surface connected to a part of the input winding 7.
  • the second coupling portion 43-2 may be configured by an offset winding 44.
  • the third coupling portion 45 may be configured by a conductor surface connected to a point between the start point and the end point of the offset winding 44.
  • the first coupling portion 43-1 and the second coupling portion 43-2 are shown in FIGS. 5 to 5 by a person skilled in the art.
  • the first coupling part shown in Fig. 21 (27-1 or 29-1 or 30-1 or 31-1 or 32-1 or 33-1 or 34-1 or 36-1 or 37-1 or 38-1 or 39 -1 or 40-1 or 42-1) and the second coupling part (27-2 or 29-2 or 30-2 or 31-2 or 32-2 or 33-2 or 34-2 or 36-2 or 37 -2 or 38-2 or 39-2 or 40-2 or 42-2).
  • 1 is the transformer core
  • 2 and 2-1 is the first output winding
  • 3-8 and 3-9 and 3-10 and 3-11 and 3-12 and 3-13 and 3-14 and 3-15 and 3-16 and 3-17 are multi-layer PCB parts
  • 4 and 4-1 are The second output winding
  • 5 is the transformer core
  • 6 and 6-1 is the transformer
  • 7 is the input winding
  • 8 is the first auxiliary winding
  • 9 is the second auxiliary winding
  • 10 is the first offset winding
  • 11 is the second offset winding.
  • 12 is an input voltage filter capacitor
  • 13 and 13-1 are switching elements
  • 14 and 14-1 are control units
  • 15 and 15-1 are diodes
  • 16 and 16-1 are capacitors
  • 17 and 17-1 are resistors
  • 18 And 18-1 are resistors
  • 19 and 19-1 are diodes
  • 20 and 20-1 are capacitors
  • 21 and 21-1 are resistors
  • 22 are rectifiers
  • 23 are capacitors
  • 24 are output lines
  • 25 are the first input winding
  • 25-1 is the first winding of the first input winding
  • 25-2 is the second winding of the first input winding
  • 25-3 is the third winding of the first input winding
  • 25-4 is the first winding of the first input winding.
  • 25-5 is the 5th winding of the 1st input winding
  • 26 is the 2nd input winding
  • 26-1 is the 1st winding of the 2nd input winding
  • 26-2 is the 2nd winding of the 2nd input winding
  • 26 -3 is the third winding of the second input winding
  • 26-5 is the conductor side
  • 26-6 is the blank side
  • 36-1, 37-1, 38-1, 39-1, 40-1, and 43-1 are the first joint
  • 27-2, 29-2, 30-2, 31-2, 32 -2, 33-2, 34-2, 36-2, 37-2, 38-2, 39-2, 40-2, 42 and 43-2 are the second joints
  • 27-3 and 29-3 31-3 and 34-3 and 37-3 and 38-3 and 40-3 and 43-3 are conductor faces
  • 34-4 and 36-4 and 37-4 and 38-4 and 39-4 and 40-4 and 43-4 are empty

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  • Microelectronics & Electronic Packaging (AREA)
  • Dc-Dc Converters (AREA)

Abstract

The present invention relates to a planar transformer of a switching type power supply device in which two output windings are coupled in a sandwich structure to both sides of an input winding composed of conductors on a multi-layered PCB surface. The present invention relates to a technology for lowering the unit cost of the planar transformer by reducing the number of surfaces of a multi-layered PCB included in the transformer, increasing power efficiency, and reducing the influence of noise on the outside through a line of the power supply device.

Description

평면형 트랜스포머 및 전원장치Flat type transformer and power supply
본 발명은, 여러 층의 PCB 면의 도체에 의해 구성되는 입력권선의 양 측면에 2개의 출력권선이 샌드위치의 구조로 결합하는 스위칭형 전원 장치의 평면형 트랜스포머에 관한 것으로, 트랜스포머에 포함되는 다층 PCB의 면 수를 줄여서 평면형 트랜스포머의 단가를 낮추고, 전력 효율을 높이며, 전원장치의 선로를 통해서 외부로 미치는 노이즈의 영향을 낮추는 기술에 관한 것이다.The present invention relates to a planar transformer of a switching type power supply device in which two output windings are combined in a sandwich structure on both sides of an input winding constituted by conductors on the surface of a multilayer PCB. It relates to a technology that reduces the number of sides to lower the unit cost of a planar transformer, increases power efficiency, and lowers the influence of noise to the outside through the line of a power supply device.
이 명세서에서 언급하는 전원장치의 일차측의 전기적인 접지란, 입력전압필터캐패시터(12 혹은 12-1)의 "-" 측 단자에 연결되는 선로 혹은 입력전압필터캐패시터(12 혹은 12-1)의 "+" 측 단자에 연결되는 선로를 말한다.The electrical grounding of the primary side of the power supply device referred to in this specification is a line connected to the "-" side terminal of the input voltage filter capacitor 12 or 12-1, or of the input voltage filter capacitor 12 or 12-1. It refers to the line connected to the "+" side terminal.
도 1은 일반적인 휴대폰 충전기의 스위칭형 전원장치에 사용되는 샌드위치 구조의 평면형 트랜스포머의 구조의 일례이다.1 is an example of the structure of a sandwich structure planar transformer used in a switching power supply device of a general mobile phone charger.
도 1에서, 평면형 트랜스포머는 트랜스포머의 코어(1과 5), 제1출력권선(2), 다층PCB부(3)와 그리고 제2출력권선(4)를 포함한다. 다층PCB부(3)는, 중앙에 트랜스포머의 상측 코어(1)와 하측 코어(5)의 중심부가 통과하는 구멍을 가지며, 다층PCB부(3)의 중심부의 구멍의 주변을 따라서 트랜스포머의 1차측의 요소들이 여러 층의 PCB 면의 도체에 의해 구성된다. 제1출력권선(2)은 다층PCB부(3)의 한쪽 끝 면과 밀착하여 결합하고, 제2출력권선(4)은 다층PCB부(3)의 다른 한쪽 끝 면과 밀착하여 결합한다. 제1출력권선(2)과 다층PCB부(3)와 제2출력권선(4)은 상측 코어(1)와 하측 코어(5)의 중심부에 끼워져서 조립되어 트랜스포머를 구성한다.In Fig. 1, the planar transformer includes cores 1 and 5 of the transformer, a first output winding 2, a multilayer PCB part 3, and a second output winding 4. The multilayer PCB part 3 has a hole in the center through which the center of the upper core 1 and the lower core 5 of the transformer passes, and the primary side of the transformer along the periphery of the hole in the center of the multilayer PCB part 3 The elements of the PCB are composed of several layers of conductors on the side of the PCB. The first output winding 2 is closely coupled with one end surface of the multilayer PCB unit 3, and the second output winding 4 is closely coupled with the other end surface of the multilayer PCB unit 3. The first output winding 2, the multilayer PCB unit 3, and the second output winding 4 are assembled by being fitted in the centers of the upper core 1 and the lower core 5 to constitute a transformer.
도 2는, 출력전압이 3.3V ~ 11V의 넓은 범위로 변화하는 종래 기술의 휴대폰 충전기의 전원장치의 일 실시예이다.2 is an exemplary embodiment of a power supply device for a mobile phone charger in the prior art, in which the output voltage varies in a wide range of 3.3V to 11V.
도 2에 있어서, 전원장치의 교류 입력 전압은 정류되고 입력전압필터캐패시터(12)에 의해 평활된다. 스위칭소자(13)의 개폐에 의해 입력전압필터캐패시터(12)의 "+" 측 단자와 스위칭소자(13)의 한 단자(예를 들어서 MOS_FET의 “Drain”) 사이에 연결된 트랜스포머(6)의 입력권선(7)의 전류의 흐름이 제어된다. 스위칭소자(13)가 턴 오프 된 후에 트랜스포머(6)의 제1출력권선(2)과 제2출력권선(4)에 유도되는 전압은, 정류기(22)와 캐패시터(23)에 의해 정류되고 평활되어, 부하에 출력전압을 공급한다. 트랜스포머(6)의 제1보조권선(8)과 제2보조권선(9)에 유도되는 전압의 합은, 다이오드(15)와 캐패시터(16)에 의해 정류되고 평활되어, 제어부(14)에 전원 전압으로 공급된다. 또한, 제1보조권선(8)과 제2보조권선(9)에 유도되는 전압의 합은, 저항(17)과 저항(18)에 의해 분압되고 제어부(14)에 출력 전압의 피드백 신호로 인가되어, 전원장치의 출력전압을 제어한다. 다이오드(19)와 캐패시터(20)와 저항(21)은, 스위칭소자(13)가 Turn off될 때, 입력권선(7)의 Leakage Inductance에 축적된 에너지에 의해 발생되는 Spike 전압을 억제한다. In Fig. 2, the AC input voltage of the power supply is rectified and smoothed by the input voltage filter capacitor 12. Input of the transformer 6 connected between the "+" terminal of the input voltage filter capacitor 12 and one terminal of the switching device 13 (for example, "Drain" of the MOS_FET) by opening and closing of the switching element 13 The flow of current in the winding 7 is controlled. After the switching element 13 is turned off, the voltage induced in the first output winding 2 and the second output winding 4 of the transformer 6 is rectified and smoothed by the rectifier 22 and the capacitor 23. And supply the output voltage to the load. The sum of the voltages induced in the first auxiliary winding 8 and the second auxiliary winding 9 of the transformer 6 is rectified and smoothed by the diode 15 and the capacitor 16 to power the controller 14. It is supplied by voltage. In addition, the sum of the voltages induced in the first auxiliary winding 8 and the second auxiliary winding 9 is divided by the resistor 17 and the resistor 18 and applied to the control unit 14 as a feedback signal of the output voltage. And control the output voltage of the power supply. The diode 19, the capacitor 20, and the resistor 21 suppress a spike voltage generated by energy accumulated in the leakage inductance of the input winding 7 when the switching element 13 is turned off.
도 3은 도 2의 전원장치의 평면형 트랜스포머(6)에 포함되는 종래기술의 다층PCB부(3)의 일례이다.FIG. 3 is an example of a conventional multilayer PCB unit 3 included in the planar transformer 6 of the power supply device of FIG. 2.
도 3의 종래기술의 다층PCB부(3)는, 첫째 층의 PCB 면에 제1상쇄권선(10)이 구성되고, 둘째층의 PCB 면에 제2보조권선(9)과 도체 면(9-1)이 구성되고, 셋째 층부터 여덟째 층까지의 PCB 면에 입력권선(7)의 제1권선(7-1) 내지 제6권선(7-6)이 구성되고, 아홉째 층의 PCB 면에 제1보조권선(8)과 도체 면(8-1)이 구성되고, 열째 층의 면에 제2상쇄권선(11)이 구성된다.In the prior art multilayer PCB unit 3 of FIG. 3, a first offset winding 10 is formed on the PCB surface of the first layer, and the second auxiliary winding 9 and the conductor surface 9 are formed on the PCB surface of the second layer. 1) is constructed, and the first winding (7-1) to the sixth winding (7-6) of the input winding (7) are formed on the PCB surface from the third layer to the eighth layer. The first auxiliary winding 8 and the conductor surface 8-1 are formed, and the second offset winding 11 is formed on the surface of the tenth layer.
도 2의 전원 장치에 있어서, 제1보조권선(8)과 제2보조권선(9)의 턴 수의 합은, 출력전압이 3.3V일 때, 제어부(14)에 충분한 전원 전압을 공급할 수 있는 턴 수를 가져야 하지만, 무 부하 시의 전력 소모를 줄이기 위해 가능한 한 작은 턴 수를 가져야 한다. 종래 기술의 일 실시예로서, 제1출력권선(2)이 5턴일 때, 입력권선(7)은 셋째 층부터 여덟째 층까지, 한 층에 7 턴씩, 6층의 PCB면에 나뉘어 42턴으로 구성된다. 제1보조권선(8)은 7턴으로 아홉째 층의 PCB면에 구성되고, 제2보조권선(9)은 6턴으로 두번째 층의 PCB면에 구성된다. 제1보조권선(8)과 제2보조권선(9)의 합인 13턴에 유도된 전압은 정류되어 제어부(14)에 전원 전압으로 공급된다. 둘째층의 PCB 면에서 제2보조권선(9)이 차지하는 면적을 제외한 공간은 한 점이 전원장치의 일차측의 전기적인 접지로 연결되는 도체 면(9-1)이 차지하고, 도체 면(9-1)은 입력권선(7)이 제1출력권선(2)으로 생성하는 용량성 결합의 일부분을 차단한다. 또한, 아홉째 층의 PCB 면에서 제1보조권선(8)이 차지하는 면적을 제외한 공간은 한 점이 전원장치의 일차측의 전기적인 접지로 연결되는 도체 면(8-1)이 차지하고, 도체 면(8-1)은 입력권선(7)이 제2출력권선(4)으로 생성하는 용량성 결합의 일부분을 차단한다.In the power supply device of Fig. 2, the sum of the number of turns of the first auxiliary winding 8 and the second auxiliary winding 9 is 3.3V, which is capable of supplying a sufficient power supply voltage to the control unit 14. It should have the number of turns, but it should have the number of turns as small as possible to reduce power consumption at no load. As an embodiment of the prior art, when the first output winding (2) is 5 turns, the input winding (7) is divided from the third layer to the eighth layer, 7 turns per layer, and consists of 42 turns divided on the 6-layer PCB surface. do. The first auxiliary winding 8 is formed on the PCB surface of the ninth layer by 7 turns, and the second auxiliary winding 9 is formed on the PCB surface of the second layer by 6 turns. The voltage induced at 13 turns, which is the sum of the first auxiliary winding 8 and the second auxiliary winding 9, is rectified and supplied to the control unit 14 as a power supply voltage. In the second layer of the PCB surface, except for the area occupied by the second auxiliary winding (9), one point is occupied by the conductor surface (9-1) connected to the electrical ground of the primary side of the power supply, and the conductor surface (9-1). ) Blocks a part of the capacitive coupling that the input winding 7 creates with the first output winding 2. In addition, the space excluding the area occupied by the first auxiliary winding 8 on the PCB of the ninth layer is occupied by the conductor surface 8-1 connected to the electrical ground of the primary side of the power supply device, and the conductor surface 8 -1) blocks a part of the capacitive coupling that the input winding 7 creates with the second output winding 4.
트랜스포머(6)의 제1출력권선(2)은 다층PCB부(3)의 첫번째 층에 위치하는 제1상쇄권선(10)과 밀착하여 결합하고, 제2출력권선(4)은 열번째 층에 위치하는 제2상쇄권선(11)과 밀착하여 결합한다.The first output winding 2 of the transformer 6 is closely coupled to the first offset winding 10 located on the first layer of the multilayer PCB unit 3, and the second output winding 4 is connected to the tenth layer. It is in close contact with the second offset winding 11 to be coupled.
도 2의 종래의 전원 장치에 있어서, 입력권선(7)과 제1보조권선(8)과 제2보조권선(9)은, 모두 동일한 전위의 변동의 극성을 가진다. 제1출력권선(2)과 제2출력권선과 제1상쇄권선(10)과 제2상쇄권선(11)은 입력권선(7)의 전위의 변동의 극성과 반대인 전위의 변동의 극성을 가진다. 입력권선(7)과 제1보조권선(8)과 제2보조권선(9)이 제1출력권선(2)과 제2출력권선(4)으로 생성하는 용량성 결합은 전원 장치의 출력선로(24)가 노이즈 전위를 갖게 한다. 제1상쇄권선(10)과 제2상쇄권선(11)은, 입력권선(7)과 제1보조권선(8)과 제2보조권선(9)이 제1출력권선(2)과 제2출력권선(4)으로 생성하는 스위칭 주파수 성분의 용량성 결합과 크기는 비슷하고 역 극성인 스위칭 주파수 성분의 용량성 결합을 제1출력권선(2)과 제2출력권선(4)으로 생성시켜서, 전원장치의 1차측의 요소들이 제1출력권선(2)과 제2출력권선(4)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합을 “영”에 근접시켜서, 전원장치의 선로를 통해서 외부로 미치는 노이즈의 영향을 낮춘다.In the conventional power supply device of Fig. 2, the input winding 7, the first auxiliary winding 8, and the second auxiliary winding 9 all have the same polarity of fluctuation of potential. The first output winding (2), the second output winding, the first offset winding (10) and the second offset winding (11) have a polarity of fluctuation of potential opposite to that of the fluctuation of potential of input winding (7). . The capacitive coupling created by the input winding 7 and the first auxiliary winding 8 and the second auxiliary winding 9 into the first output winding 2 and the second output winding 4 is the output line of the power supply ( 24) has a noise potential. For the first offset winding 10 and the second offset winding 11, the input winding 7 and the first auxiliary winding 8 and the second auxiliary winding 9 are the first output winding 2 and the second output. The first output winding (2) and the second output winding (4) generate a capacitive coupling of the switching frequency components that are similar in size and reverse polarity to the capacitive coupling of the switching frequency components generated by the winding (4). The sum of the capacitive coupling of the switching frequency components generated by the first and second output windings (2) and the second output windings (4) of the device is brought close to "zero", and is sent to the outside through the line of the power supply. Lower the impact of noise.
그런데, 도 3의 다층PCB부(3)의 양쪽 끝 층의 PCB 면에 위치하는 제1상쇄권선(10)과 제2상쇄권선(11)은, 권선을 구성하는 도체와 도체 사이에 절연을 위한 간격이 있으며, 이 간격은 도체가 없는 빈 면(10-6 혹은 11-6)을 구성한다. 양쪽 끝 층의 PCB 면의 도체가 없는 빈 면(10-6 혹은 11-6)을 통해서 입력권선(7)과 제1보조권선(8)과 제2보조권선(9)이 제1출력권선(2)과 제2출력권선(4)으로 스위칭 주파수 성분의 용량성 결합을 크게 생성한다. 일례로서, 제1상쇄권선(10)과 제2상쇄권선(11)은, 제1출력권선(2)과 제2출력권선(4)의 5턴의 턴 수보다 2배 이상인 11턴의 턴 수를 가지며, 제1출력권선(2)과 제2출력권선(4)으로 역 극성의 스위칭 주파수 성분의 용량성 결합을 생성시켜서, 제1출력권선(2)과 제2출력권선(4)으로 생성되는 스위칭 주파수 성분의 용량성 결합의 합을 “영”에 근접시키려 한다. By the way, the first offset winding 10 and the second offset winding 11 positioned on the PCB surface of both end layers of the multilayer PCB part 3 of FIG. 3 are used for insulation between the conductor constituting the winding and the conductor. There is a gap, which constitutes an empty side (10-6 or 11-6) without conductors. The input winding (7), the first auxiliary winding (8) and the second auxiliary winding (9) are connected to the first output winding ( 2) and the second output winding (4) create a large capacitive coupling of the switching frequency components. As an example, the first offset winding 10 and the second offset winding 11 are the number of turns of 11 turns, which is more than twice the number of turns of 5 turns of the first output winding 2 and the second output winding 4 It has a first output winding (2) and a second output winding (4) by generating a capacitive coupling of the switching frequency component of reverse polarity, the first output winding (2) and the second output winding (4). Try to bring the sum of the capacitive couplings of the switching frequency components to be close to "zero".
도 2의 전원 장치에서, 한 요소로부터 제1출력권선(2)과 제2출력권선(4)으로 생성되는 용량성 결합을 다른 요소가 제1출력권선(2)과 제2출력권선(4)으로 생성하는 역 극성의 용량성 결합에 의해 상쇄시키더라도, 두 개의 다른 요소가 각각 제1출력권선(2)과 제2출력권선(4)으로 생성하는 용량성 결합의 크기가 완전히 일치할 수 없고, 두 개의 다른 요소가 각각 생성하는 용량성 결합의 크기도 제품마다 편차가 있기 때문에, 제품에 따라 상쇄가 이루어진 후의 용량성 결합의 잔량이 클 수 있다. 상쇄가 이루어진 후의 용량성 결합의 잔량은, 한 요소가 제1출력권선(2)과 제2출력권선(4)으로 생성하는 용량성 결합의 크기가 클수록 커질 수밖에 없다.In the power supply of Fig. 2, the capacitive coupling generated from one element to the first output winding (2) and the second output winding (4) is divided into the first output winding (2) and the second output winding (4). Even if canceled by the reverse polarity capacitive coupling produced by the two different elements, the size of the capacitive coupling produced by the first output winding (2) and the second output winding (4), respectively, cannot be completely matched. In addition, since the size of the capacitive bonds generated by the two different elements, respectively, varies from product to product, the remaining amount of capacitive bonds after the offset is made may be large depending on the product. The remaining amount of capacitive coupling after cancellation is inevitably increased as the size of the capacitive coupling generated by one element into the first output winding 2 and the second output winding 4 increases.
그런데, 도 2의 전원 장치에서, 입력권선(7)과 제1보조권선(8)과 제2보조권선(9)이 제1출력권선(2)과 제2출력권선(4)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 크기가 상당히 크다. 그러므로, 제1상쇄권선(10)과 제2상쇄권선(11)이 생성하는 역 극성의 용량성 결합에 의해 상쇄가 이루어진 후의 스위칭 주파수 성분의 용량성 결합의 잔량도 당연히 크며, 이러한 다층PCB부(3)를 사용하는 전원 장치는 외부에 스위칭 주파수 성분의 노이즈의 영향을 크게 미치게 되는 단점을 가진다.By the way, in the power supply device of Fig. 2, the input winding 7, the first auxiliary winding 8, and the second auxiliary winding 9 are the switching generated by the first output winding (2) and the second output winding (4). The size of the capacitive coupling of the frequency components is quite large. Therefore, the residual amount of the capacitive coupling of the switching frequency component after cancellation by the reverse polarity capacitive coupling generated by the first offset winding 10 and the second offset winding 11 is naturally large, and such a multilayer PCB unit ( The power supply using 3) has the disadvantage of having a large influence of the noise of the switching frequency component on the outside.
또한, 도 2의 전원 장치에서, 제1상쇄권선(10)과 제2상쇄권선(11)은, 자체의 분포용량과 Leakage Inductance등의 영향에 의해, 입력권선(7)의 전압에 비해 위상이 지연된 전압을 갖는다. 제1상쇄권선(10)과 제2상쇄권선(11)의 전압에 포함되는 고주파 성분의 전압의 파형은, 입력권선(7)과 제1보조권선(8)과 제2보조권선(9)의 전압에 포함되는 고주파 성분의 전압 파형과 다르다. 그로 인해, 입력권선(7)과 제1보조권선(8)과 제2보조권선(9)이 제1출력권선(2)과 제2출력권선(4)으로 생성하는 다른 파형의 고주파 성분의 용량성 결합은 제1상쇄권선(10)과 제2상쇄권선(11)이 생성하는 용량성 결합에 의해 상쇄시키지 못한다. 입력권선(7)과 제1보조권선(8)과 제2보조권선(9)이 제1출력권선(2)과 제2출력권선(4)으로 생성하는 스위칭 주파수 성분의 용량성 결합과 그 용량성 결합에 포함된 고주파 성분의 용량성 결합이 상당히 크므로, 상쇄시키지 못하는 고주파 성분의 용량성 결합도 상당히 커진다. 그로 인해, 전원 장치의 출력 선로(24)는 매우 큰 고주파 노이즈의 전위를 가지게 된다. 따라서, 도 3의 다층PCB부(3)를 사용하는 전원장치는 외부에 고주파 성분의 노이즈의 영향을 크게 미치게 되는 단점을 가진다.In addition, in the power supply device of FIG. 2, the first offset winding 10 and the second offset winding 11 are in phase compared to the voltage of the input winding 7 due to the influence of their own distribution capacity and leakage inductance. It has a delayed voltage. The waveform of the voltage of the high-frequency component included in the voltages of the first offset winding 10 and the second offset winding 11 is the waveform of the input winding 7 and the first auxiliary winding 8 and the second auxiliary winding 9. It is different from the voltage waveform of the high-frequency component included in the voltage. Therefore, the capacity of the high-frequency components of different waveforms generated by the input winding 7 and the first auxiliary winding 8 and the second auxiliary winding 9 by the first output winding 2 and the second output winding 4 Sexual coupling cannot be canceled by capacitive coupling generated by the first offset winding 10 and the second offset winding 11. The capacitive combination of the switching frequency components generated by the input winding (7), the first auxiliary winding (8) and the second auxiliary winding (9) as the first output winding (2) and the second output winding (4) and their capacity Since the capacitive coupling of the high-frequency component included in the sexual coupling is considerably large, the capacitive coupling of the high-frequency component that cannot be canceled is also considerably large. Therefore, the output line 24 of the power supply device has a potential of very large high-frequency noise. Accordingly, the power supply device using the multilayer PCB unit 3 of FIG. 3 has a disadvantage in that external noise of high-frequency components is greatly influenced.
또한, 도 2의 종래의 전원장치에 사용되는 트랜스포머(6)는, 제1보조권선(8)과 제2보조권선(9)과 제1상쇄권선(10)과 제2상쇄권선(11)이 입력권선(7)과 제1출력권선(2)과 제2출력권선(4) 사이의 거리를 증가시켜서 자기적인 결합을 방해하여 Leakage inductance를 높이며, 전력 효율을 낮추는 단점을 가진다.In addition, the transformer 6 used in the conventional power supply device of FIG. 2 includes a first auxiliary winding 8, a second auxiliary winding 9, a first offset winding 10, and a second offset winding 11. By increasing the distance between the input winding 7 and the first output winding 2 and the second output winding 4, magnetic coupling is prevented, thereby increasing leakage inductance and lowering power efficiency.
한편, 종래의 기술에서 도 3의 다층PCB부(3)의 층 수를 낮출 수 있는 여지가 있는지 살펴본다.Meanwhile, it will be looked at whether there is room for reducing the number of layers of the multilayer PCB unit 3 of FIG. 3 in the prior art.
다층 PCB의 도체 면에 의해 입력권선(7)을 구성하는 경우, 입력권선(7)을 통해서 흐르는 전류의 크기를 감안하여 입력권선(7)을 구성할 도체의 두께와 폭과 도체 사이의 간격 등을 결정하여야 하는데, 1 층의 PCB면에 대략 8 턴 정도가 감길 수 있다. 예를 들어, 입력권선(7)의 턴 수가 40 턴인 경우, 1층에 8턴씩 구성할 수 있으므로, 5층의 PCB 면이 필요하다. 제1상쇄권선(10)과 제2상쇄권선(11)을 위해 2 층의 PCB 면이 필요하다. 보조권선(8과 9)을 위해 최소한 1 층의 PCB 면이 필요하다. 또한, 홀수로 구성되는 입력권선(7)과 보조권선(8과 9)의 한 끝을 트랜스포머(6)의 단자로 연결할 1 층의 PCB 면이 필요하다. 그래서, 최소로 구성할 수 있는 적층 PCB의 층 수는 총 9층이다. 그런데, 다층PCB부는, 모든 층을 Through Hole에 의해 연결되게 하기 위하여, 복수의 양면 PCB를 붙여서 제작되며, 짝수 층으로 이루어진다. 따라서, 최소로 구성할 수 있는 적층 PCB의 층 수는 총 10층이며, 한 층의 PCB 면을 활용할 여유가 있다.In the case of configuring the input winding 7 by the conductor surface of the multilayer PCB, the thickness and width of the conductor that will constitute the input winding 7 and the gap between the conductors, etc., in consideration of the magnitude of the current flowing through the input winding 7 It should be determined, and it can be wound around 8 turns on the first layer of the PCB. For example, if the number of turns of the input winding 7 is 40 turns, it is possible to configure 8 turns per layer, and thus a 5-layer PCB surface is required. A two-layer PCB surface is required for the first offset winding 10 and the second offset winding 11. At least one layer of PCB side is required for the auxiliary windings (8 and 9). In addition, a one-layer PCB surface is required to connect one end of the input winding 7 and the auxiliary windings 8 and 9 composed of odd numbers to the terminals of the transformer 6. So, the minimum number of layers of a laminated PCB that can be configured is a total of 9 layers. By the way, the multilayer PCB part is manufactured by attaching a plurality of double-sided PCBs in order to connect all layers by a through hole, and consists of an even number of layers. Therefore, the minimum number of layers of the laminated PCB that can be configured is 10 layers, and there is room to use one layer of the PCB.
도 2에 사용되는 도 3의 다층PCB부(3)는, 입력권선(7)을 6층의 PCB 면에 구성하였고, 보조권선을 제1보조권선(8)과 제2보조권선(9)으로 나누어 2층의 PCB면에 구성하였고, 제1상쇄권선(10)과 제2상쇄권선(11)을 2층의 PCB면에 구성하였으므로, 총 10층의 PCB면을 가진다. 그에 따라, 입력권선(7)은, 일 실시예에 있어서, 1 층에 7턴씩 구성되어, 6 층의 PCB면에 42턴으로 구성된다.In the multilayer PCB unit 3 of FIG. 3 used in FIG. 2, the input winding 7 is formed on the 6-layer PCB surface, and the auxiliary windings are divided into a first auxiliary winding 8 and a second auxiliary winding 9. Divided into a two-layer PCB surface, the first offset winding 10 and the second offset winding 11 are configured on the two-layer PCB surface, thus having a total of 10 layers of the PCB surface. Accordingly, the input winding 7 is configured by 7 turns per layer in one embodiment, and by 42 turns per 6-layer PCB surface.
이와 같이 도 2의 종래의 전원장치에 사용되는 트랜스포머(6)는, 총 10층의 PCB 면을 가지는 높은 가격의 다층 PCB(3)를 포함하며, 전원장치의 제조 원가를 높이는 단점을 가진다.As described above, the transformer 6 used in the conventional power supply device of FIG. 2 includes a high-priced multilayer PCB 3 having a total of 10 layers of PCB, and has a disadvantage of increasing the manufacturing cost of the power supply device.
종래 기술의 샌드위치 권선 구조를 갖는 평면형 트랜스포머의 다층PCB부는, 전원장치의 1차측의 많은 구성 요소들을 포함하여야 했기 때문에 10 층의 PCB의 면이 필요하여 고가이고, 전원장치의 제조 원가를 높이는 단점을 가진다. 또한, 종래의 전원장치에 사용되는 트랜스포머(6)의 다층PCB부(3)의 제1보조권선(8)과 제2보조권선(9)과 제1상쇄권선(10)과 제2상쇄권선(11)은 입력권선(7)의 Leakage inductance를 높이며, 전원 장치의 손실을 증가시켜서 전력 효율을 낮추는 단점을 가진다. 또한 종래의 전원장치에 사용되는 트랜스포머(6)의 입력권선(7)과 제1보조권선(8)과 제2보조권선(9)이 제1출력권선(2)과 제2출력권선(4)으로 생성하는 용량성 결합이 커서, 전원 장치가 외부로 스위칭 주파수 성분 및 고주파 성분의 노이즈의 영향을 크게 미치는 단점을 가진다.The multilayer PCB part of a planar transformer with a sandwich winding structure of the prior art has to include many components on the primary side of the power supply, so it requires a 10-layer PCB, which is expensive, and increases the manufacturing cost of the power supply. Have. In addition, the first auxiliary winding 8 and the second auxiliary winding 9 and the first offset winding 10 and the second offset winding of the multilayer PCB unit 3 of the transformer 6 used in the conventional power supply device ( 11) has a disadvantage of increasing the leakage inductance of the input winding 7 and lowering power efficiency by increasing the loss of the power supply device. In addition, the input winding (7), the first auxiliary winding (8) and the second auxiliary winding (9) of the transformer (6) used in the conventional power supply device is the first output winding (2) and the second output winding (4). Since the capacitive coupling generated by the power supply is large, the power supply device has a disadvantage that greatly affects the noise of the switching frequency component and the high frequency component to the outside.
본 발명은 종래 기술의 이러한 단점들을 모두 해결하기 위한 것이다.The present invention is to solve all of these drawbacks of the prior art.
상술한 목적을 달성하기 위한, 입력전압필터캐패시터와; 제어부와; 스위칭소자와; 그리고 트랜스포머를 포함하는 전원장치의 트랜스포머에 있어서,An input voltage filter capacitor for achieving the above object; A control unit; A switching element; And in the transformer of the power supply device including the transformer,
상기 트랜스포머는,The transformer,
트랜스포머의 코어와;The core of the transformer;
상기 트랜스포머의 코어에 감겨지는 상기 트랜스포머의 1차측의 요소들을 여러 층의 PCB 면의 도체에 의해 구성하는 다층PCB부와; A multilayer PCB unit comprising elements on the primary side of the transformer wound around the core of the transformer by conductors on the multiple layers of the PCB;
상기 트랜스포머의 코어에 감겨지고, 상기 다층PCB부의 한 쪽 끝 층과 결합하여 에너지를 인출하는 제1출력권선과; 그리고A first output winding wound around the core of the transformer and combined with one end layer of the multilayer PCB to extract energy; And
상기 트랜스포머의 코어에 감겨지고, 상기 다층PCB부의 다른 한 쪽 끝 층과 결합하여 에너지를 인출하는 제2출력권선을 포함하고,A second output winding wound around the core of the transformer and combined with the other end layer of the multilayer PCB unit to extract energy,
상기 다층PCB부는,The multilayer PCB unit,
상기 전원장치의 상기 입력전압필터캐패시터의 일측 단자와 상기 스위칭소자의 일측 단자 사이에 연결되는 제1입력권선과; A first input winding connected between one terminal of the input voltage filter capacitor of the power supply and one terminal of the switching element;
상기 전원장치의 상기 스위칭소자의 다른 일측 단자와 상기 입력전압필터캐패시터의 다른 일측 단자 사이에 연결되는 제2입력권선과;A second input winding connected between the other terminal of the switching device of the power supply and the other terminal of the input voltage filter capacitor;
상기 다층PCB부의 한 쪽 끝 층의 일 부분에 위치하는 제1결합부와;A first coupling portion positioned at a portion of one end layer of the multilayer PCB portion;
상기 다층PCB부의 한 쪽 끝 층의 다른 일 부분에 위치하는 제2결합부와; 그리고A second coupling part positioned at the other part of one end layer of the multilayer PCB part; And
상기 다층PCB부의 다른 한 쪽 끝 층에 위치하는 제3결합부를 포함하되,Including a third coupling portion located on the other end layer of the multi-layer PCB portion,
상기 전원장치에서, 상기 제1입력권선이 상기 제1출력권선으로 생성하는 스위칭 주파수 성분의 용량성 결합의 극성과 같은 극성의 스위칭 주파수 성분의 용량성 결합이 상기 제1결합부에 의해 상기 제1출력권선으로 생성되고,In the power supply device, the capacitive coupling of the switching frequency components of the same polarity as the polarity of the capacitive coupling of the switching frequency components generated by the first input winding to the first output winding is performed by the first coupling unit. Is created as an output winding,
상기 전원장치에서, 상기 제1입력권선이 상기 제1출력권선으로 생성하는 스위칭 주파수 성분의 용량성 결합의 극성과 반대 극성의 스위칭 주파수 성분의 용량성 결합이 상기 제2결합부에 의해 상기 제1출력권선으로 생성되고,In the power supply device, a capacitive coupling of a switching frequency component having a polarity opposite to that of a capacitive coupling of a switching frequency component generated by the first input winding to the first output winding is performed by the second coupling unit. Is created as an output winding,
상기 전원장치에서, 상기 제1입력권선이 상기 제2출력권선으로 생성하는 스위칭 주파수 성분의 용량성 결합과 반대 극성의 스위칭 주파수 성분의 용량성 결합이 상기 제3결합부에 의해 상기 제2출력권선으로 생성되고,In the power supply device, a capacitive coupling of a switching frequency component generated by the first input winding as the second output winding and a capacitive coupling of a switching frequency component of an opposite polarity are performed by the third coupling unit. Is created with
상기 전원장치에서, 상기 제1결합부와 상기 제2결합부와 상기 제3결합부에 의해 상기 제1출력권선과 상기 제2출력권선으로 생성되는 스위칭 주파수 성분의 용량성 결합에 의해, 상기 전원장치의 1차측의 모든 요소들이 상기 제1출력권선과 제2출력권선으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합을 "영"에 근접시킴으로써, 상기 전원장치가 외부로 미치는 스위칭 주파수 성분의 노이즈의 영향을 낮추는 것을 특징으로 한다.In the power supply device, by capacitive coupling of switching frequency components generated by the first output winding and the second output winding by the first coupling portion, the second coupling portion, and the third coupling portion, the power supply Noise of the switching frequency component of the power supply to the outside by bringing the sum of the capacitive coupling of the switching frequency components generated by the first and second output windings of the primary side of the device closer to "zero" It is characterized by lowering the influence of.
또한, 상술한 목적을 달성하기 위한, 입력전압필터캐패시터와; 제어부와; 스위칭소자와; 그리고 트랜스포머를 포함하는 전원장치의 트랜스포머에 있어서,In addition, an input voltage filter capacitor for achieving the above object; A control unit; A switching element; And in the transformer of the power supply device including the transformer,
상기 트랜스포머는,The transformer,
트랜스포머의 코어와;The core of the transformer;
상기 트랜스포머의 코어에 감겨지는 상기 트랜스포머의 1차측의 요소들을 여러 층의 PCB 면의 도체에 의해 구성하는 다층PCB부와;A multilayer PCB unit comprising elements on the primary side of the transformer wound around the core of the transformer by conductors on the multiple layers of the PCB;
상기 트랜스포머의 코어에 감겨지고, 상기 다층PCB부의 한 쪽 끝 층과 결합하여 에너지를 인출하는 제1출력권선과; 그리고A first output winding wound around the core of the transformer and combined with one end layer of the multilayer PCB to extract energy; And
상기 트랜스포머의 코어에 감겨지고, 상기 다층PCB부의 다른 한 쪽 끝 층과 결합하여 에너지를 인출하는 제2출력권선을 포함하고,A second output winding wound around the core of the transformer and combined with the other end layer of the multilayer PCB unit to extract energy,
상기 다층PCB부는,The multilayer PCB unit,
상기 전원장치의 상기 입력전압필터캐패시터의 일측 단자와 상기 스위칭소자의 일측 단자 사이에 연결되는 제1입력권선과; 그리고A first input winding connected between one terminal of the input voltage filter capacitor of the power supply and one terminal of the switching element; And
상기 전원장치의 상기 스위칭소자의 다른 일측 단자와 상기 입력전압필터캐패시터의 다른 일측 단자 사이에 연결되는 제2입력권선을 포함하되,A second input winding connected between the other terminal of the switching element of the power supply and the other terminal of the input voltage filter capacitor,
상기 제2입력권선은 제2입력권선의 제1권선과 제2입력권선의 제2권선으로 나뉘어지고,The second input winding is divided into a first winding of a second input winding and a second winding of a second input winding,
상기 제2입력권선의 제1권선은 상기 다층PCB부의 한 쪽 끝 층의 PCB면에 위치하고, 상기 제2입력권선의 제2권선은 상기 다층PCB부의 다른 한 쪽 끝 층의 PCB면에 위치하며, The first winding of the second input winding is located on the PCB surface of one end layer of the multilayer PCB part, the second winding of the second input winding is located on the PCB surface of the other end layer of the multilayer PCB part,
상기 전원장치에서, 상기 제2입력권선의 제1권선과 상기 제2입력권선의 제2권선이 상기 제1출력권선과 상기 제2출력권선으로 생성하는 스위칭 주파수 성분의 용량성 결합에 의해, 상기 전원장치의 1차측의 모든 요소들이 상기 제1출력권선과 제2출력권선으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합을 "영"에 근접시킴으로써, 상기 전원장치가 외부로 미치는 노이즈의 영향을 낮추는 것을 특징으로 한다.In the power supply device, by capacitive coupling of switching frequency components generated by the first winding of the second input winding and the second winding of the second input winding as the first output winding and the second output winding, the By making the sum of the capacitive coupling of the switching frequency components generated by the first and second output windings of all the elements on the primary side of the power supply close to "zero", the influence of noise from the power supply to the outside is reduced. It is characterized by lowering.
또한 상술한 목적을 달성하기 위한, 입력전압필터캐패시터와; 제어부와; 스위칭소자와; 그리고 트랜스포머를 포함하는 전원장치의 트랜스포머에 있어서,In addition, an input voltage filter capacitor for achieving the above object; A control unit; A switching element; And in the transformer of the power supply device including the transformer,
상기 트랜스포머는,The transformer,
트랜스포머의 코어와;The core of the transformer;
상기 트랜스포머의 코어에 감겨지는 상기 트랜스포머의 1차측의 요소들을 여러 층의 PCB 면의 도체에 의해 구성하는 다층PCB부와;A multilayer PCB unit comprising elements on the primary side of the transformer wound around the core of the transformer by conductors on the multiple layers of the PCB;
상기 트랜스포머의 코어에 감겨지고, 상기 다층PCB부의 한 쪽 끝 층과 결합하여 에너지를 인출하는 제1출력권선과; 그리고A first output winding wound around the core of the transformer and combined with one end layer of the multilayer PCB to extract energy; And
상기 트랜스포머의 코어에 감겨지고, 상기 다층PCB부의 다른 한 쪽 끝 층과 결합하여 에너지를 인출하는 제2출력권선을 포함하고,A second output winding wound around the core of the transformer and combined with the other end layer of the multilayer PCB unit to extract energy,
상기 다층PCB부는,The multilayer PCB unit,
상기 전원장치의 상기 입력전압필터캐패시터의 일측 단자와 상기 스위칭소자의 일측 단자 사이에 연결되는 제1입력권선과; A first input winding connected between one terminal of the input voltage filter capacitor of the power supply and one terminal of the switching element;
상기 전원장치의 상기 스위칭소자의 다른 일측 단자와 상기 입력전압필터캐패시터의 다른 일측 단자 사이에 연결되는 제2입력권선과; 그리고A second input winding connected between the other terminal of the switching device of the power supply and the other terminal of the input voltage filter capacitor; And
상기 제2입력권선의 한쪽 끝점과 다른 한쪽 끝 점 사이의 한 점에 연결되는 도체 면을 포함하는 결합부를 포함하되,Including a coupling portion including a conductor surface connected to a point between one end point and the other end point of the second input winding,
상기 다층PCB부의 한 쪽 끝 층의 PCB면에 상기 결합부가 위치하고, 상기 다층PCB부의 다른 한 쪽 끝 층의 PCB면에 상기 제2입력권선이 위치하고,The coupling part is located on the PCB surface of one end layer of the multilayer PCB part, and the second input winding is located on the PCB surface of the other end layer of the multilayer PCB part,
상기 전원장치에서, 상기 결합부와 상기 제2입력권선이 상기 제1출력권선과 상기 제2출력권선으로 생성하는 스위칭 주파수 성분의 용량성 결합에 의해, 상기 전원장치의 1차측의 모든 요소들이 상기 제1출력권선과 제2출력권선으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합을 "영"에 근접시킴으로써, 상기 전원장치가 외부로 미치는 스위칭 주파수 성분의 노이즈의 영향을 낮추는 것을 특징으로 한다.In the power supply device, by capacitive coupling of switching frequency components generated by the first output winding and the second output winding of the coupling portion and the second input winding, all elements of the primary side of the power supply device are By bringing the sum of the capacitive coupling of the switching frequency components generated by the first output winding and the second output winding to "zero", the influence of the noise of the switching frequency component exerted by the power supply to the outside is reduced.
또한 상술한 목적을 달성하기 위한, 입력전압필터캐패시터와; 제어부와; 스위칭소자와; 그리고 트랜스포머를 포함하는 전원장치의 트랜스포머에 있어서,In addition, an input voltage filter capacitor for achieving the above object; A control unit; A switching element; And in the transformer of the power supply device including the transformer,
상기 트랜스포머는,The transformer,
트랜스포머의 코어와;The core of the transformer;
상기 트랜스포머의 코어에 감겨지는 상기 트랜스포머의 1차측의 요소들을 여러 층의 PCB 면의 도체에 의해 구성하는 다층PCB부와;A multilayer PCB unit comprising elements on the primary side of the transformer wound around the core of the transformer by conductors on the multiple layers of the PCB;
상기 트랜스포머의 코어에 감겨지고, 상기 다층PCB부의 한 쪽 끝 층과 결합하여 에너지를 인출하는 제1출력권선과; 그리고A first output winding wound around the core of the transformer and combined with one end layer of the multilayer PCB to extract energy; And
상기 트랜스포머의 코어에 감겨지고, 상기 다층PCB부의 다른 한 쪽 끝 층과 결합하여 에너지를 인출하는 제2출력권선을 포함하고,A second output winding wound around the core of the transformer and combined with the other end layer of the multilayer PCB unit to extract energy,
상기 다층PCB부는,The multilayer PCB unit,
상기 전원장치의 상기 입력전압필터캐패시터의 일측 단자와 상기 스위칭소자의 일측 단자 사이에 연결되는 입력권선과; An input winding connected between one terminal of the input voltage filter capacitor of the power supply and one terminal of the switching element;
상기 다층PCB부의 한 쪽 끝 층의 일 부분에 위치하는 제1결합부와;A first coupling portion positioned at a portion of one end layer of the multilayer PCB portion;
상기 다층PCB부의 한 쪽 끝 층의 다른 일 부분에 위치하는 제2결합부와; 그리고A second coupling part positioned at the other part of one end layer of the multilayer PCB part; And
상기 다층PCB부의 다른 한 쪽 끝 층에 위치하는 제3결합부를 포함하되,Including a third coupling portion located on the other end layer of the multi-layer PCB portion,
상기 전원장치에서, 상기 입력권선이 상기 제1출력권선으로 생성하는 스위칭 주파수 성분의 용량성 결합의 극성과 같은 극성의 스위칭 주파수 성분의 용량성 결합이 상기 제1결합부에 의해 상기 제1출력권선으로 생성되고,In the power supply device, a capacitive coupling of a switching frequency component of the same polarity as that of a capacitive coupling of a switching frequency component generated by the input winding as the first output winding is performed by the first coupling unit. Is created with
상기 전원장치에서, 상기 입력권선이 상기 제1출력권선으로 생성하는 스위칭 주파수 성분의 용량성 결합의 극성과 반대 극성의 스위칭 주파수 성분의 용량성 결합이 상기 제2결합부에 의해 상기 제1출력권선으로 생성되고,In the power supply device, a capacitive coupling of a switching frequency component having a polarity opposite to that of a capacitive coupling of a switching frequency component generated by the input winding as the first output winding is performed by the second coupling unit. Is created with
상기 전원장치에서, 상기 입력권선이 상기 제2출력권선으로 생성하는 스위칭 주파수 성분의 용량성 결합과 반대 극성의 스위칭 주파수 성분의 용량성 결합이 상기 제3결합부에 의해 상기 제2출력권선으로 생성되며,In the power supply device, a capacitive coupling of a switching frequency component generated by the input winding to the second output winding and a capacitive coupling of a switching frequency component of an opposite polarity are generated as the second output winding by the third coupling unit. And
상기 전원장치에서, 상기 제1결합부와 상기 제2결합부와 상기 제3결합부에 의해 상기 제1출력권선과 상기 제2출력권선으로 생성되는 스위칭 주파수 성분의 용량성 결합에 의해, 상기 전원장치의 1차측의 모든 요소들이 상기 제1출력권선과 제2출력권선으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합을 "영"에 근접시킴으로써, 상기 전원장치가 외부로 미치는 노이즈의 영향을 낮추는 것을 특징으로 한다. In the power supply device, by capacitive coupling of switching frequency components generated by the first output winding and the second output winding by the first coupling portion, the second coupling portion, and the third coupling portion, the power supply The sum of the capacitive coupling of the switching frequency components generated by the first and second output windings of all elements on the primary side of the device is close to "zero", thereby reducing the influence of noise from the power supply to the outside. It is characterized by that.
또한 상술한 목적을 달성하기 위한, 입력전압필터캐패시터와; 제어부와; 스위칭소자와; 그리고 트랜스포머를 포함하는 전원장치의 트랜스포머에 있어서,In addition, an input voltage filter capacitor for achieving the above object; A control unit; A switching element; And in the transformer of the power supply device including the transformer,
상기 트랜스포머는,The transformer,
트랜스포머의 코어와;The core of the transformer;
상기 트랜스포머의 코어에 감겨지는 상기 트랜스포머의 1차측의 요소들을 여러 층의 PCB 면의 도체에 의해 구성하는 다층PCB부와;A multilayer PCB unit comprising elements on the primary side of the transformer wound around the core of the transformer by conductors on the multiple layers of the PCB;
상기 트랜스포머의 코어에 감겨지고, 상기 다층PCB부의 한 쪽 끝 층과 결합하여 에너지를 인출하는 제1출력권선과; 그리고A first output winding wound around the core of the transformer and combined with one end layer of the multilayer PCB to extract energy; And
상기 트랜스포머의 코어에 감겨지고, 상기 다층PCB부의 다른 한 쪽 끝 층과 결합하여 에너지를 인출하는 제2출력권선을 포함하고,A second output winding wound around the core of the transformer and combined with the other end layer of the multilayer PCB unit to extract energy,
상기 다층PCB부는,The multilayer PCB unit,
상기 전원장치의 상기 입력전압필터캐패시터의 일측 단자와 상기 스위칭소자의 일측 단자 사이에 연결되는 입력권선과; An input winding connected between one terminal of the input voltage filter capacitor of the power supply and one terminal of the switching element;
상기 다층PCB부의 한 쪽 끝의 층에 위치하는 결합부와; 그리고 A coupling part positioned on a layer at one end of the multilayer PCB part; And
상기 다층PCB부의 다른 한 쪽 끝 층에 위치하는 상쇄권선을 포함하되,Including an offset winding located on the other end layer of the multilayer PCB unit,
상기 상쇄권선은 상기 제1출력권선의 전위의 변동의 극성과 같은 극성의 전위의 변동을 가지며,The offset winding has a variation of a potential of a polarity equal to that of a variation of potential of the first output winding,
상기 결합부는 상기 상쇄권선의 한쪽 끝점과 다른 한쪽 끝 점 사이의 한 점에 연결되는 도체 면을 포함하며,The coupling portion includes a conductor surface connected to a point between one end point of the offset winding and the other end point,
상기 전원장치에서, 상기 결합부와 상기 상쇄권선이 상기 제1출력권선과 상기 제2출력권선으로 생성하는 스위칭 주파수 성분의 용량성 결합에 의해, 상기 전원장치의 1차측의 모든 요소들이 상기 제1출력권선과 제2출력권선으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합을 "영"에 근접시킴으로써, 상기 전원장치가 외부로 미치는 노이즈의 영향을 낮추는 것을 특징으로 한다. In the power supply unit, all elements of the primary side of the power supply unit are formed by capacitive coupling of switching frequency components generated by the first output winding and the second output winding by the coupling unit and the offset winding. By bringing the sum of the capacitive coupling of the switching frequency components generated by the output winding and the second output winding to "zero", the influence of noise exerted by the power supply to the outside is reduced.
또한, 이 발명에 따르는 상술한 트랜스포머를 포함하는 스위칭형 전원장치가 제공된다.Further, there is provided a switching type power supply including the above-described transformer according to the present invention.
또한, 이 발명에 따르는 상술한 전원장치를 포함하는 제조된 물품이 제공된다.Also provided is a manufactured article comprising the above-described power supply device according to the present invention.
본 발명에 따르는 트랜스포머는, 종래의 기술에 비해 훨씬 적은 층 수의 PCB면에 의해 다층PCB부를 구성함으로써, 트랜스포머의 가격이 훨씬 낮아지고, 전력 효율이 높아지는 장점을 제공하며, 또한 전원 장치의 외부로 미치는 노이즈의 영향을 낮추는 장점을 제공한다.The transformer according to the present invention provides an advantage that the cost of the transformer is much lower and the power efficiency is increased by configuring a multilayer PCB part by a PCB surface having a much smaller number of layers compared to the conventional technology, and also to the outside of the power supply device. It provides the advantage of lowering the influence of noise.
도 1은 샌드위치 권선 구조의 평면형 트랜스포머의 구조도의 일례.1 is an example of a structural diagram of a planar transformer having a sandwich winding structure.
도 2는 종래 기술의 전원장치의 일 실시예.2 is an embodiment of a power supply device of the prior art.
도 3은 도 2에 포함되는 종래 기술의 다층PCB부의 일례.3 is an example of a conventional multilayer PCB unit included in FIG. 2.
도 4는 본 발명에 따르는 다층PCB부를 사용하는 전원 장치의 일 실시예.4 is an embodiment of a power supply device using a multilayer PCB unit according to the present invention.
도 5는 본 발명에 따르는 다층PCB부의 일 실시예.Figure 5 is an embodiment of a multi-layer PCB unit according to the present invention.
도 6 내지 도 21은 본 발명에 따르는 다층PCB부의 다른 일 실시예들.6 to 21 are other embodiments of the multilayer PCB unit according to the present invention.
도 22는 본 발명에 따르는 다층PCB부의 또 다른 일 실시예.22 is another embodiment of a multilayer PCB unit according to the present invention.
이하, 본 발명에 따르는 다층PCB부와 그 다층PCB부를 사용하는 전원 장치에 대하여 첨부한 도면을 참조하여 상세하게 설명한다. Hereinafter, a multilayer PCB unit and a power supply device using the multilayer PCB unit according to the present invention will be described in detail with reference to the accompanying drawings.
도 4는, 본 발명에 따르는 다층PCB부를 사용하는 전원장치의 일 실시예이다.4 is an embodiment of a power supply device using a multilayer PCB unit according to the present invention.
종래기술의 전원 장치인 도 2의 경우, 입력권선(7)이 6층의 PCB 면에 의해 구성되고, 제1보조권선(8)과 제2보조권선(9)과 제1상쇄권선(10)과 제2상쇄권선(11)이 각각 1층의 PCB 면에 의해 구성되어, 총 10층의 PCB면이 필요했다. 다층PCB부를 6층의 PCB 면에 의해 구성하기 위해서는, 입력권선(7)을 구성하는 PCB 면의 층 수를 줄여야 하고, 입력권선(7)의 일부분이 제1보조권선(8)과 제2보조권선(9)과 제1상쇄권선(10)과 제2상쇄권선(11)이 수행하는 역할을 수행해야만 한다.In the case of FIG. 2, which is a power supply device of the prior art, the input winding 7 is composed of a six-layer PCB surface, and the first auxiliary winding 8 and the second auxiliary winding 9 and the first offset winding 10 And the second offset winding 11 are each composed of a single-layer PCB surface, requiring a total of 10 layers of PCB surfaces. In order to configure the multilayer PCB part by the 6-layer PCB surface, the number of layers on the PCB surface constituting the input winding (7) must be reduced, and a part of the input winding (7) is divided into the first auxiliary winding (8) and the second auxiliary winding (8). The winding 9, the first offset winding 10, and the second offset winding 11 must perform a role.
도 4의 전원장치에 사용되는 본 발명에 따르는 다층PCB부(3-1)는, 종래 기술의 입력권선(7)을 입력전압필터캐패시터(12-1)의 “+” 단자와 스위칭소자(13-1)의 한 단자 사이에 연결되는 제1입력권선(25)과 스위칭소자(13-1)의 다른 한 단자와 입력전압필터캐패시터(12-1)의 “-” 단자 사이에 연결되는 제2입력권선(26)으로 나누어 구성하며, 제2입력권선(26)이 제1보조권선(8)과 제2보조권선(9)과 제2상쇄권선(11)의 역할을 동시에 수행하게 하여, 1차측의 구성 요소들을 6층의 PCB면에 의해 구성한 것이다.In the multilayer PCB unit 3-1 according to the present invention used in the power supply device of FIG. 4, the input winding 7 of the prior art is connected to the “+” terminal and the switching element 13 of the input voltage filter capacitor 12-1. A second input winding 25 connected between one terminal of -1) and the other terminal of the switching element 13-1 and the “-” terminal of the input voltage filter capacitor 12-1 It is divided into input windings 26, and the second input winding 26 plays the role of the first auxiliary winding 8, the second auxiliary winding 9, and the second offset winding 11 at the same time, 1 The components on the vehicle side are composed of 6 layers of PCB.
도 4의 본 발명에 따르는 전원 장치에 있어서, 교류 입력 전압은 정류되고 입력전압필터캐패시터(12-1)에 의해 평활된다. 스위칭소자(13-1)의 개폐에 의해 입력전압필터캐패시터(12-1)의 "+" 측 단자와 스위칭소자(13-1)의 한 단자(예를 들어서 MOS_FET의 “Drain”) 사이에 연결된 제1입력권선(25)과 스위칭소자(13-1)의 다른 한 단자(예를 들어서 MOS_FET의 Source)와 입력전압필터캐패시터(12-1)의 "-" 측 단자 사이에 연결된 제2입력권선(26)의 전류의 흐름이 제어된다. 제1출력권선(2-1)과 제2출력권선(4-1)에 유도되는 전압은, 정류기(22-1)와 캐패시터(23-1)에 의해 정류되고 평활되어, 부하에 출력전압을 공급한다. 제2입력권선(26)의 제1권선(26-1)과 제2권선(26-2)의 전압의 합 혹은 제2입력권선(26)의 전압은, 다이오드(15-1)와 캐패시터(16-1)에 의해 정류되고 평활되어, 제어부(14-1)에 전원 전압으로 공급된다. 또한, 제2입력권선(26)의 제1권선(26-1)과 제2권선(26-2)의 전압의 합 혹은 제2입력권선(26)의 전압은, 저항(17-1)과 저항(18-1)에 의해 분압되고 제어부(14-1)에 출력 전압의 피드백 신호로 인가되어, 전원장치의 출력전압을 제어한다. 다이오드(19-1)와 캐패시터(20-1)와 저항(21-1)은, 스위칭소자(13-1)가 Turn off될 때, 제1입력권선(25)의 Leakage Inductance에 축적된 에너지에 의해 발생되는 Spike 전압을 억제한다.In the power supply device according to the invention of Fig. 4, the AC input voltage is rectified and smoothed by the input voltage filter capacitor 12-1. By opening and closing the switching element 13-1, it is connected between the "+" terminal of the input voltage filter capacitor 12-1 and one terminal of the switching element 13-1 (for example, "Drain" of the MOS_FET). The second input winding connected between the first input winding 25 and the other terminal of the switching element 13-1 (for example, the source of the MOS_FET) and the "-" terminal of the input voltage filter capacitor 12-1 (26) The flow of current is controlled. The voltage induced in the first output winding 2-1 and the second output winding 4-1 is rectified and smoothed by the rectifier 22-1 and the capacitor 23-1, so that the output voltage is applied to the load. Supply. The sum of the voltages of the first winding 26-1 and the second winding 26-2 of the second input winding 26 or the voltage of the second input winding 26 is the diode 15-1 and the capacitor ( It is rectified and smoothed by 16-1), and supplied as a power supply voltage to the control unit 14-1. Further, the sum of the voltages of the first winding 26-1 and the second winding 26-2 of the second input winding 26 or the voltage of the second input winding 26 is equal to the resistance 17-1 and It is divided by the resistor 18-1 and applied to the control unit 14-1 as a feedback signal of the output voltage to control the output voltage of the power supply. The diode 19-1, the capacitor 20-1, and the resistor 21-1 are applied to the energy accumulated in the leakage inductance of the first input winding 25 when the switching element 13-1 is turned off. Suppress the spike voltage generated by it.
도 4의 전원 장치에 있어서, 제1입력권선(25)의 전위의 변동의 극성은 제1출력권선(2-1)과 제2출력권선(4-1)의 전위의 변동의 극성과 반대이고, 제2입력권선(26)의 전위의 변동의 극성은 제1출력권선(2-1)과 제2출력권선(4-1)의 전위의 변동의 극성과 같다. 제1입력권선(25)으로부터 제1출력권선(2-1) 혹은 제2출력권선(4-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합의 극성은 제2입력권선(26)으로부터 제1출력권선(2-1) 혹은 제2출력권선(4-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합의 극성과 반대이다.In the power supply device of Fig. 4, the polarity of the variation of the potential of the first input winding 25 is opposite to the polarity of the variation of the potential of the first output winding 2-1 and the second output winding 4-1. , The polarity of the variation of the potential of the second input winding 26 is the same as the polarity of the variation of the potential of the first output winding 2-1 and the second output winding 4-1. The polarity of the capacitive coupling of the switching frequency components generated from the first input winding 25 to the first output winding 2-1 or the second output winding 4-1 is first from the second input winding 26. It is opposite to the polarity of the capacitive coupling of the switching frequency component generated by the output winding 2-1 or the second output winding 4-1.
도 4의 전원 장치에 있어서, 트랜스포머(6-1)의 제1출력권선(2-1)은 다층PCB부(3-1)의 첫번째 층의 제1결합부(27-1)와 제2결합부(27-2)에 밀착하여 결합하고, 제2출력권선(4-1)은 다층PCB부(3-1)의 여섯째 층에 위치하는 제3결합부(28)와 밀착하여 결합한다.In the power supply device of Fig. 4, the first output winding 2-1 of the transformer 6-1 is coupled to the first coupling portion 27-1 of the first layer of the multilayer PCB unit 3-1. The second output winding 4-1 is in close contact with the part 27-2, and the second output winding 4-1 is in close contact with the third coupling part 28 located in the sixth layer of the multilayer PCB part 3-1.
도 5 내지 도21은, 본 발명에 따르는 다층PCB부의 다양한 실시예들을 보인다. 5 to 21 show various embodiments of a multilayer PCB unit according to the present invention.
이하 도 5 내지 도21에 대한 설명에 사용되는 소자의 명칭 중에서 “입력전압필터캐패시터(12-1)” 혹은 “스위칭소자(13-1)” 혹은 “제1출력권선(2-1)” 혹은 “제2출력권선(4-1)” 혹은 “제어부(14-1)”이라는 명칭은, 비록 명칭 앞에 “도 4의 전원 장치의”라는 설명 문구가 없더라도, “도 4의 전원 장치의 입력전압필터캐패시터(12-1)” 혹은 “도 4의 전원 장치의 스위칭소자(13-1)” 혹은 “도 4의 전원 장치의 제1출력권선(2-1)” 혹은 “도 4의 전원 장치의 제2출력권선(4-1)” 혹은 “도 4의 전원 장치의 제어부(14-1)”로 해석된다.Hereinafter, among the names of elements used in the description of FIGS. 5 to 21, “input voltage filter capacitor (12-1)” or “switching element (13-1)” or “first output winding (2-1)” or The name “second output winding (4-1)” or “control unit (14-1)” means “the input voltage of the power supply unit of Fig. 4” even if there is no description of “of the power supply unit of Fig. 4” before the name. Filter capacitor 12-1” or “switching element 13-1 of the power supply unit of Fig. 4” or “first output winding 2-1 of the power supply unit of Fig. 4” or “the power supply unit of Fig. 4 It is interpreted as “the second output winding 4-1” or “the control unit 14-1 of the power supply unit of Fig. 4”.
도 5 내지 도21에서 보이는 모든 다층PCB부의 실시예들은, 전원 장치의 입력전압필터캐패시터(12-1)의 "-" 단자에 연결되는 단자(a)와 전원 장치의 스위칭소자(13-1)의 다른 한 단자(예를 들어서 MOS_FET의 “Source”)에 연결되는 단자(b)와 전원 장치의 입력전압필터캐패시터(12-1)의 "+" 단자에 연결되는 단자(c)와 전원 장치의 스위칭소자(13-1)의 한 단자(예를 들어서 MOS_FET의 “Drain”)에 연결되는 단자(d)를 가진다. 단자(a)와 단자(b) 사이에 제2입력권선(26)이 연결되고, 단자(c)와 단자(d) 사이에 제1입력권선(25)이 연결된다.도 5 내지 도21에서 보이는 다층PCB부(3-1 혹은 3-1a 혹은 3-2 혹은 3-3 혹은 3-4 혹은 3-5 혹은 3-6 혹은 3-7 혹은 3-8 혹은 3-9 혹은 3-10 혹은 3-11 혹은 3-12 혹은 3-13 혹은 3-14 혹은 3-15 혹은 3-16)는, 첫 번째 층의 PCB 면에 제1결합부(27-1 혹은 29-1 혹은 30-1 혹은 31-1 혹은 32-1 혹은 33-1 혹은 34-1 혹은 36-1 혹은 37-1 혹은 38-1 혹은 39-1 혹은 40-1 혹은 42-1)와 제2결합부(27-2 혹은 29-2 혹은 30-2 혹은 31-2 혹은 32-2 혹은 33-2 혹은 34-2 혹은 36-2 혹은 37-2 혹은 38-2 혹은 39-2 혹은 40-2 혹은 42-2)가 구성되며, 마지막 층에 제3결합부(28 혹은 28a)가 구성된다.All the embodiments of the multilayer PCB unit shown in FIGS. 5 to 21 are a terminal (a) connected to the "-" terminal of the input voltage filter capacitor 12-1 of the power supply device and a switching element 13-1 of the power supply device. The terminal (b) connected to the other terminal of (for example, “Source” of the MOS_FET) and the terminal (c) connected to the “+” terminal of the input voltage filter capacitor (12-1) of the power supply and the power supply It has a terminal d connected to one terminal of the switching device 13-1 (for example, “Drain” of MOS_FET). The second input winding 26 is connected between the terminal (a) and the terminal (b), and the first input winding 25 is connected between the terminal (c) and the terminal (d). Visible multilayer PCB section (3-1 or 3-1a or 3-2 or 3-3 or 3-4 or 3-5 or 3-6 or 3-7 or 3-8 or 3-9 or 3-10 or 3 -11 or 3-12 or 3-13 or 3-14 or 3-15 or 3-16) is the first coupling part (27-1 or 29-1 or 30-1 or 31) on the PCB side of the first layer. -1 or 32-1 or 33-1 or 34-1 or 36-1 or 37-1 or 38-1 or 39-1 or 40-1 or 42-1) and the second coupling part (27-2 or 29 -2 or 30-2 or 31-2 or 32-2 or 33-2 or 34-2 or 36-2 or 37-2 or 38-2 or 39-2 or 40-2 or 42-2) , The third coupling portion 28 or 28a is formed on the last layer.
도 5 내지 도21에서 보이는 다층PCB부(3-1 혹은 3-1a 혹은 3-2 혹은 3-3 혹은 3-4 혹은 3-5 혹은 3-6 혹은 3-7 혹은 3-8 혹은 3-9 혹은 3-10 혹은 3-11 혹은 3-12 혹은 3-13 혹은 3-14 혹은 3-15 혹은 3-16)는, 모두 동일한 위치에 Through Hole(e와 f와 g와 h와 i)를 갖는다.Multilayer PCB section shown in Figs. 5 to 21 (3-1 or 3-1a or 3-2 or 3-3 or 3-4 or 3-5 or 3-6 or 3-7 or 3-8 or 3-9 Or 3-10 or 3-11 or 3-12 or 3-13 or 3-14 or 3-15 or 3-16), all have Through Holes (e and f and g and h and i) at the same location. .
도 5 내지 도21에서 보이는 다층PCB부(3-1 혹은 3-1a 혹은 3-2 혹은 3-3 혹은 3-4 혹은 3-5 혹은 3-6 혹은 3-7 혹은 3-8 혹은 3-9 혹은 3-10 혹은 3-11 혹은 3-12 혹은 3-13 혹은 3-14 혹은 3-15 혹은 3-16)에 있어서, 여섯째 층의 PCB 면의 제3결합부(28 혹은 28a)를 구성하는 도체와 도체 사이의 간격 등으로 이루어지는 도체가 없는 빈 면(26-6)을 통해 제1입력권선(25)으로부터 제2출력권선(4-1)으로 스위칭 주파수 성분의 용량성 결합이 크게 생성된다. 제3결합부(28 혹은 28a)는 제1입력권선(25)이 제2출력권선(4-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합과 반대 극성의 스위칭 주파수 성분의 용량성 결합을 제2출력권선(4-1)으로 생성하여, 제2출력권선(4-1)으로 생성되는 용량성 결합의 합을 낮춘다.Multilayer PCB section shown in Figs. 5 to 21 (3-1 or 3-1a or 3-2 or 3-3 or 3-4 or 3-5 or 3-6 or 3-7 or 3-8 or 3-9 Or 3-10 or 3-11 or 3-12 or 3-13 or 3-14 or 3-15 or 3-16), which constitutes the third coupling part (28 or 28a) of the PCB side of the sixth layer. Capacitive coupling of the switching frequency components is largely generated from the first input winding 25 to the second output winding 4-1 through the blank surface 26-6 without a conductor made of a gap between the conductor and the conductor, etc. . The third coupling unit 28 or 28a removes the capacitive coupling of the switching frequency components generated by the first input winding 25 as the second output winding 4-1 and the capacitive coupling of the switching frequency components of the opposite polarity. It is created with two output windings 4-1, and the sum of capacitive couplings created with the second output winding 4-1 is lowered.
이하 도 5 내지 도21에서 보이는 다층PCB부(3-1 혹은 3-1a 혹은 3-2 혹은 3-3 혹은 3-4 혹은 3-5 혹은 3-6 혹은 3-7 혹은 3-8 혹은 3-9 혹은 3-10 혹은 3-11 혹은 3-12 혹은 3-13 혹은 3-14 혹은 3-15 혹은 3-16)에 대해서 상세히 설명한다.Hereinafter, the multilayer PCB section shown in FIGS. 5 to 21 (3-1 or 3-1a or 3-2 or 3-3 or 3-4 or 3-5 or 3-6 or 3-7 or 3-8 or 3- 9 or 3-10 or 3-11 or 3-12 or 3-13 or 3-14 or 3-15 or 3-16).
도 5는, 본 발명에 따르는 다층PCB부(3-1)의 일 실시예로서, 특히 제어부(14-1)에 공급할 전원 전압을 얻기 위해 필요한 제2입력권선(26)의 턴 수가 2층의 PCB면에 의해 구성되어야 하는 전원 장치를 위한 것이다. 5 is an embodiment of the multilayer PCB unit 3-1 according to the present invention. In particular, the number of turns of the second input winding 26 required to obtain a power supply voltage to be supplied to the control unit 14-1 is two layers. It is for a power supply that must be configured by the PCB side.
도 4의 전원 장치에 있어서, 출력 전압이 3.3V로 낮은 경우, 제어부(14-1)에 공급할 7.5V 이상의 전원 전압을 공급하는 권선은 제1출력권선(2-1)과 제2출력권선(4-1)의 턴 수의 2.5 배보다 큰 턴 수를 가져야 한다. 도 4에서, 제2입력권선(26)이 제어부(14-1)에 전원 전압을 공급한다. 일 실시예로서, 1 층의 PCB면에 도체에 의해 최대로 구성할 수 있는 제1입력권선(25)과 제2입력권선(26)의 턴 수는, 흐르는 전류의 크기와 도체 간의 간격 등을 감안하여, 대략 8 턴 정도이다. 제1출력권선(2-1)과 제2출력권선(4-1)의 턴 수가 5 턴일 때, 제1입력권선(25)의 제1권선(25-1) 내지 제3권선(25-3)이 1 층의 PCB면에 각각 8 턴씩 3 층의 PCB면에 24 턴으로 구성되고, 제2입력권선(26)의 제1권선(26-1)과 제2권선(26-2)이, 각각 1 층의 PCB면에 5 턴과 8 턴씩, 2 층의 PCB면에 13 턴으로 구성되어, 입력권선은 총 37턴의 턴 수를 가진다.In the power supply device of Fig. 4, when the output voltage is as low as 3.3V, the windings supplying the power supply voltage of 7.5V or more to be supplied to the control unit 14-1 are the first output winding 2-1 and the second output winding ( You must have a number of turns greater than 2.5 times the number of turns in 4-1). In Fig. 4, the second input winding 26 supplies a power supply voltage to the control unit 14-1. As an embodiment, the number of turns of the first input winding 25 and the second input winding 26, which can be maximally configured by a conductor on the PCB surface of one layer, is determined by the amount of current flowing and the distance between the conductors. In consideration, it is about 8 turns. When the number of turns of the first output winding 2-1 and the second output winding 4-1 is 5 turns, the first winding 25-1 to the third winding 25-3 of the first input winding 25 ) Is composed of 8 turns on the PCB surface of the first layer and 24 turns on the PCB surface of the 3 layers, and the first winding 26-1 and the second winding 26-2 of the second input winding 26, It consists of 5 turns and 8 turns on the first layer of PCB and 13 turns on the second layer of PCB, and the input winding has a total number of turns of 37.
도 5의 다층PCB부(3-1)는, 첫째 층의 PCB 면에 제1결합부(27-1)와 제2결합부(27-2)가 구성되고, 둘째층의 PCB 면에 제2입력권선(26)의 제1권선(26-1)과 도체 면(26-5)가 구성되고, 셋째층부터 다섯째 층까지의 PCB 면에 제1입력권선(25)의 제1권선(25-1) 내지 제3권선(25-3)가 구성되고, 끝 층의 PCB 면에 제3결합부(28)가 구성된다. 제1결합부(27-1)는 단자(c)를 통해서 전원 장치의 1차측의 전기적인 접지인 입력전압필터캐패시터(12-1)의 "+" 측 단자에 연결되는 도체 면(27-3)에 의해 구성된다. 제2결합부(27-2)는 제2입력권선(26)의 제2권선(26-2)의 시작점의 전위가 연결된 도체 면(27-5)에 의해 구성된다. 제3결합부(28)는, 제2입력권선(26)의 제2권선(26-2)에 의해 구성된다.In the multilayer PCB part 3-1 of FIG. 5, a first coupling part 27-1 and a second coupling part 27-2 are formed on the PCB surface of the first layer, and the second coupling part 27-2 is formed on the PCB surface of the second layer. The first winding 26-1 and the conductor surface 26-5 of the input winding 26 are formed, and the first winding 25- of the first input winding 25 is formed on the PCB surface from the third to fifth layers. 1) to third windings 25-3 are formed, and a third coupling part 28 is formed on the PCB surface of the end layer. The first coupling part 27-1 is a conductor surface 27-3 connected to the "+" terminal of the input voltage filter capacitor 12-1, which is the electrical ground of the primary side of the power supply device through the terminal c. ). The second coupling portion 27-2 is constituted by a conductor surface 27-5 to which the potential of the starting point of the second winding 26-2 of the second input winding 26 is connected. The 3rd coupling part 28 is comprised by the 2nd winding 26-2 of the 2nd input winding 26.
도 5에 있어서, 제1결합부(27-1)는, Through Hole(g)을 통해서 단자(c)와 제1입력권선(25)의 제1권선(25-1)의 시작점 사이를 연결한다. 제1입력권선(25)의 제1권선(25-1)과 제2권선(25-2)의 끝 점은 각각 Through Hole(h와 f)을 통해서 제1입력권선(25)의 제2권선(25-2)과 제3권선(25-3)의 시작점에 연결된다. 제1입력권선(25)의 제3권선(25-3)의 끝 점은 단자(d)로 연결된다. 제2입력권선(26)의 제1권선(26-1)의 시작 점은 단자(b)로 연결된다. 제2입력권선(26)의 제1권선(26-1)의 끝 점은 Through Hole(e)을 통해서 제2입력권선(26)의 제2권선(26-2)의 시작점에 연결된다. 제2결합부(27-2)는, Through Hole(e)을 통해서 제2입력권선(26)의 제2권선(26-2)의 시작점에 연결된다.In FIG. 5, the first coupling part 27-1 connects the terminal c and the starting point of the first winding 25-1 of the first input winding 25 through a through hole g. . The end points of the first winding (25-1) and the second winding (25-2) of the first input winding (25) are the second winding of the first input winding (25) through through holes (h and f), respectively. It is connected to the starting point of (25-2) and the third winding (25-3). The end point of the third winding 25-3 of the first input winding 25 is connected to the terminal d. The starting point of the first winding 26-1 of the second input winding 26 is connected to the terminal b. The end point of the first winding 26-1 of the second input winding 26 is connected to the starting point of the second winding 26-2 of the second input winding 26 through a through hole (e). The second coupling part 27-2 is connected to the starting point of the second winding 26-2 of the second input winding 26 through a through hole (e).
도 5의 다층PCB부(3-1)의 둘째층의 PCB 면은 제2입력권선(26)의 제1권선(26-1)과 도체 면(26-5)을 포함한다. 도체 면(26-5)은, 한 층의 PCB 면에서 제2입력권선(26)의 제1권선(26-1)이 차지하는 면적을 제외한 부분의 일부분을 도체 면으로 채워서 구성된 것이고, Through hole(g)와 제1결합부(27-1)와 단자(c)를 통해서 전원 장치의 1차측의 전기적인 접지에 연결되며, 제1입력권선(25)이 제1출력권선(2-1)으로 용량성으로 결합하는 것을 차단한다. 만일, 도 4의 전원 장치의 제어부(14-1)에 공급해야 할 전압이 높아서 제2입력권선(26)의 턴 수가 큰 경우에는, 도체 면(26-5)은 없어지게 된다.The PCB surface of the second layer of the multilayer PCB unit 3-1 of FIG. 5 includes the first winding 26-1 and the conductor surface 26-5 of the second input winding 26. The conductor surface 26-5 is formed by filling a part of the PCB surface of one layer except the area occupied by the first winding 26-1 of the second input winding 26 with the conductor surface, and through hole ( g) is connected to the electrical ground of the primary side of the power supply through the first coupling portion 27-1 and the terminal c, and the first input winding 25 is used as the first output winding 2-1. It blocks capacitive binding. If the voltage to be supplied to the control unit 14-1 of the power supply device of FIG. 4 is high and the number of turns of the second input winding 26 is large, the conductor surface 26-5 disappears.
도 5의 다층PCB부(3-1)에 있어서, 전원 장치의 1차측의 전기적인 접지의 전위를 가지는 제1결합부(27-1)는 제1입력권선(25)으로부터 제1출력권선(2-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합과 같은 극성의 스위칭 주파수 성분의 용량성 결합을 제1출력권선(2-1)으로 생성한다. 제1결합부(27-1)가 제1출력권선(2-1)으로 생성하는 용량성 결합의 크기는 첫번째 층의 PCB 면에서 제1결합부(27-1)가 차지하는 면적의 비율이 작을수록 작아지므로, 손 쉽게 조절이 가능하다. 도 5의 다층PCB부(3-1)에 있어서, 제2입력권선(26)의 제2권선(26-2)의 시작점의 전위가 연결된 도체 면(27-5)으로 구성되는 제2결합부(27-2)는, 제1입력권선(25)으로부터 제1출력권선(2-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합과 반대 극성의 스위칭 주파수 성분의 용량성 결합을 제1출력권선(2-1)으로 생성한다. 제2결합부(27-2)가 제1출력권선(2-1)으로 생성하는 용량성 결합의 크기는, 제2결합부(27-2)의 전위가 높을수록 커지고, 첫번째 층의 PCB 면에서 제2결합부(27-2)가 차지하는 면적의 비율이 클수록 커지므로, 손 쉽게 조절이 가능하다. 그러므로, 다층PCB부(3-1)의 제1결합부(27-1)와 제2결합부(27-2)가 제1출력권선(2-1)으로 생성하는 용량성 결합의 합의 크기와 극성은 첫번째 층의 PCB 면에서 제1결합부(27-1)와 제2결합부(27-2)가 차지하는 면적의 비율의 조절을 포함하여 여러가지 방법에 의해 손쉽게 설정할 수 있다. 또한, 제1결합부(27-1)와 제2결합부(27-2)와 제3결합부(28)가 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 용량성 결합의 합의 크기와 극성도 손쉽게 설정할 수 있다.In the multilayer PCB section 3-1 of FIG. 5, the first coupling section 27-1 having the electrical ground potential of the primary side of the power supply unit is formed from the first input winding 25 to the first output winding ( The capacitive coupling of the switching frequency components of the same polarity as the capacitive coupling of the switching frequency components generated by 2-1) is generated by the first output winding 2-1. The size of the capacitive coupling created by the first coupling part 27-1 to the first output winding 2-1 is a small ratio of the area occupied by the first coupling part 27-1 on the PCB surface of the first layer. As it gets smaller, it can be easily adjusted by hand. In the multilayer PCB part 3-1 of FIG. 5, a second coupling part composed of a conductor surface 27-5 to which the potential of the starting point of the second winding 26-2 of the second input winding 26 is connected. In (27-2), the capacitive coupling of the switching frequency components generated from the first input winding 25 to the first output winding 2-1 and the capacitive coupling of the switching frequency components of the opposite polarity is the first output winding. It is created with (2-1). The size of the capacitive coupling generated by the second coupling portion 27-2 to the first output winding 2-1 increases as the potential of the second coupling portion 27-2 increases, and the PCB surface of the first layer As the ratio of the area occupied by the second coupling part 27-2 increases, it can be easily adjusted by hand. Therefore, the size of the sum of the capacitive couplings generated by the first coupling portion 27-1 and the second coupling portion 27-2 of the multilayer PCB portion 3-1 and the first output winding 2-1 The polarity can be easily set by various methods, including adjusting the ratio of the area occupied by the first coupling portion 27-1 and the second coupling portion 27-2 on the PCB surface of the first layer. In addition, the first coupling portion (27-1), the second coupling portion (27-2) and the third coupling portion (28) are divided into the first output winding (2-1) and the second output winding (4-1). The size and polarity of the sum of the resulting capacitive bonds can also be easily set.
따라서, 다층PCB부(3-1)를 사용하는 도 4의 전원 장치는, 다층PCB부(3-1)의 제1결합부(27-1)와 제2결합부(27-2)와 제3결합부(28)가 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 크기와 극성을 설정하여, 전원 장치의 1차측의 모든 요소들이 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합을 “영”에 근접시키며, 전원장치의 선로의 스위칭 주파수 성분의 noise를 아주 낮게 낮춘다.Accordingly, in the power supply device of FIG. 4 using the multilayer PCB unit 3-1, the first coupling unit 27-1 and the second coupling unit 27-2 and the second coupling unit 27-2 of the multilayer PCB unit 3-1 are provided. The three coupling unit 28 sets the size and polarity of the capacitive coupling of the switching frequency components generated by the first output winding 2-1 and the second output winding 4-1, The sum of the capacitive coupling of the switching frequency components generated by the first output winding (2-1) and the second output winding (4-1) of all elements is close to "zero", and the switching frequency component of the line of the power supply Lowers the noise to a very low level.
한편, 종래 기술인 도 3의 다층PCB부(3)의 일 실시예에 대해서 설명한 바와 같이, 도 3의 다층PCB부(3)는, 양쪽 끝 층의 PCB 면에서 각각 11 턴의 큰 턴 수를 가지는 제1상쇄권선(10)과 제2상쇄권선(11)를 구성하는 도체를 제외한 빈 면(10-6 혹은 11-6)을 통해서 입력권선(7)과 제1보조권선(8)과 제2보조권선(9)이 제1출력권선(2)과 제2출력권선(4)으로 스위칭 주파수 성분의 용량성 결합을 크게 생성한다.Meanwhile, as described for an embodiment of the conventional multilayer PCB unit 3 of FIG. 3, the multilayer PCB unit 3 of FIG. 3 has a large number of turns of 11 turns each on the PCB surface of both end layers. The input winding (7), the first auxiliary winding (8) and the second winding through the blank surface (10-6 or 11-6) excluding the conductor constituting the first offset winding (10) and the second offset winding (11). The auxiliary winding 9 produces a large capacitive coupling of the switching frequency components with the first output winding 2 and the second output winding 4.
도 5의 일 실시예에 있어서, 제1출력권선(2-1)과 제2출력권선(4-1)이 5턴 일 때, 제2입력권선(26)의 제2권선(26-2)은 8턴의 턴 수를 가진다. 8턴의 턴 수를 가지는 제2입력권선(26)의 제2권선(26-2)의 시작점이 연결되는 제2결합부(27-2)는, 5턴의 턴 수를 가지는 제1출력권선(2-1)의 전체 면적의 평균 전위(2.5턴의 전위)의 약 3배의 전위를 가지고, 제2출력권선(4-1)으로 스위칭 주파수 성분의 용량성 결합을 생성한다. 제3결합부(28)는 제1출력권선(2-1)의 전위의 1.6배의 전위를 가지고 제2출력권선(4-1)으로 스위칭 주파수 성분의 용량성 결합을 생성한다.5, when the first output winding 2-1 and the second output winding 4-1 are 5 turns, the second winding 26-2 of the second input winding 26 Has 8 turns. The second coupling part 27-2 to which the start point of the second winding 26-2 of the second input winding 26 having a number of turns of 8 turns is connected is a first output winding having a number of turns of 5 turns. It has a potential that is about three times the average potential (potential of 2.5 turns) of the total area of (2-1), and a capacitive coupling of the switching frequency components is generated by the second output winding 4-1. The third coupling unit 28 has a potential of 1.6 times the potential of the first output winding 2-1 and generates a capacitive coupling of the switching frequency components to the second output winding 4-1.
도 5의 다층PCB부(3-1)의 끝 층의 PCB 면에서 8턴의 턴 수를 가지는 제2입력권선(26)의 제2권선(26-2)을 구성하는 도체의 면적을 제외한 빈 면(26-6)은 도 3의 다층PCB부(3)의 끝 층의 PCB 면에서 11턴의 턴 수를 가지는 제2상쇄권선(11)을 구성하는 도체의 면적을 제외한 빈 면(11-6)에 비해 30% 작다. 그러므로, 제1입력권선(25)으로부터 도체가 없는 빈 면(26-6)을 통해 제2출력권선(4-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합은 도 3에서 도체가 없는 빈 면(11-6)을 통해 입력권선(7)과 제1보조권선(8)과 제2보조권선(9)으로부터 제2출력권선(4)으로 생성되는 스위칭 주파수 성분의 용량성 결합에 비해 훨씬 작다. 게다가, 전원 장치의 1차측의 전기적인 접지에 연결된 제1결합부(27-1)와 제2입력권선(26)의 제2권선(26-2)의 시작점에 연결된 제2결합부(27-2)는, 도 5의 다층PCB부(3-1)의 첫 번째 층의 PCB 면의 대부분의 면적을 차지하며, 제1입력권선(25)이 제1출력권선(2-1)으로 용량성으로 결합하는 것을 효과적으로 차단한다. 그러므로, 제1입력권선(25)은 제1출력권선(2-1)으로 스위칭 주파수 성분의 용량성 결합을 거의 생성하지 못한다. 따라서, 도 5의 다층PCB부(3-1)에서 제1입력권선(25)이 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 크기는, 도 3의 다층PCB부(3)에서 입력권선(7)과 제1보조권선(8)과 제2보조권선(9)이 제1출력권선(2)과 제2출력권선(4)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 크기의 1/4 정도이다.The blank excluding the area of the conductor constituting the second winding 26-2 of the second input winding 26 having a number of turns of 8 turns from the PCB surface of the end layer of the multilayer PCB part 3-1 of FIG. 5 The surface 26-6 is a blank surface 11- excluding the area of the conductor constituting the second offset winding 11 having turns of 11 turns from the PCB surface of the end layer of the multilayer PCB part 3 of FIG. 3. It is 30% smaller than 6). Therefore, the capacitive coupling of the switching frequency components generated from the first input winding 25 to the second output winding 4-1 through the blank surface 26-6 without a conductor is a blank surface without a conductor in FIG. It is much smaller than the capacitive combination of the switching frequency components generated from the input winding (7) and the first auxiliary winding (8) and the second auxiliary winding (9) to the second output winding (4) through (11-6). . In addition, the first coupling portion 27-1 connected to the electrical ground of the primary side of the power supply and the second coupling portion 27- connected to the starting point of the second winding 26-2 of the second input winding 26. 2) occupies most of the PCB surface of the first layer of the multilayer PCB part 3-1 of FIG. 5, and the first input winding 25 is the first output winding 2-1, which is capacitive. Effectively block the combination of Therefore, the first input winding 25 hardly generates a capacitive coupling of the switching frequency components to the first output winding 2-1. Therefore, the capacitiveness of the switching frequency component generated by the first input winding 25 as the first output winding 2-1 and the second output winding 4-1 in the multilayer PCB unit 3-1 of FIG. 5 In the multilayer PCB part 3 of FIG. 3, the input winding 7, the first auxiliary winding 8, and the second auxiliary winding 9 have the first output winding 2 and the second output winding ( It is about 1/4 of the size of the capacitive coupling of the switching frequency component generated by 4).
도 5의 다층PCB부(3-1)에서 제1입력권선(25)이 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 크기가 도 3의 다층PCB부(3)에 비해 훨씬 작으므로, 그에 따라 제1결합부(27-1)와 제2결합부(27-2)와 제3결합부(28)이 생성하는 역 극성의 용량성 결합에 의해서 상쇄가 이루어진 후의 스위칭 주파수 성분의 용량성 결합의 잔량도 도 3의 다층PCB부(3)에 비해 훨씬 작다. 그러므로, 도 5의 다층PCB부(3-1)를 사용하는 전원 장치는 종래기술에 비해 외부로 스위칭 주파수 성분의 노이즈의 영향을 작게 미치는 장점을 가진다.In the multilayer PCB unit 3-1 of FIG. 5, the capacitive coupling of the switching frequency components generated by the first input winding 25 as the first output winding 2-1 and the second output winding 4-1 Since the size is much smaller than that of the multilayer PCB part 3 of FIG. 3, the reverse generated by the first coupling part 27-1, the second coupling part 27-2, and the third coupling part 28. The residual amount of the capacitive coupling of the switching frequency component after cancellation by the capacitive coupling of the polarity is also much smaller than that of the multilayer PCB unit 3 of FIG. 3. Therefore, the power supply device using the multilayer PCB unit 3-1 of FIG. 5 has an advantage of reducing the influence of noise of the switching frequency component externally compared to the prior art.
또한, 도 5의 다층PCB부(3-1)에서 제1입력권선(25)으로부터 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 크기가 도 3의 다층PCB부(3)에 비해 훨씬 작으므로, 제1입력권선(25)으로부터 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 용량성 결합에 포함되는 고주파 성분의 용량성 결합의 크기도 작다. 제2결합부(27-2)와 제3결합부(28)의 전압이, 위상의 지연으로 인해, 제1입력권선(25)에 비해 고주파 성분의 전압의 파형이 다르더라도, 제1결합부(27-1)와 제2결합부(27-2)와 제3결합부(28)가 생성하는 역 극성의 용량성 결합에 의해서 상쇄시키지 못하는 제1입력권선(25)과 제1출력권선(2-1)과 제2출력권선(4-1) 사이의 고주파 성분의 용량성 결합의 크기도 훨씬 작다. 그러므로, 도 5의 다층PCB부(3-1)를 사용하는 전원 장치는 종래기술에 비해 외부로 고주파 성분의 노이즈의 영향을 훨씬 작게 미치는 장점을 가진다.In addition, the capacitiveness of the switching frequency component generated from the first input winding 25 to the first output winding 2-1 and the second output winding 4-1 in the multilayer PCB unit 3-1 of FIG. 5 Since the size of the coupling is much smaller than that of the multilayer PCB unit 3 of FIG. 3, the capacity generated from the first input winding 25 to the first output winding 2-1 and the second output winding 4-1 The size of the capacitive coupling of the high-frequency component included in the sexual coupling is also small. Even if the voltage of the second coupling portion 27-2 and the third coupling portion 28 differs from the first input winding 25 in the waveform of the voltage of the high-frequency component due to the phase delay, the first coupling portion The first input winding 25 and the first output winding that cannot be canceled by the capacitive coupling of reverse polarity generated by the (27-1), the second coupling portion 27-2, and the third coupling portion 28 The size of the capacitive coupling of the high frequency component between 2-1) and the second output winding 4-1 is also much smaller. Therefore, the power supply device using the multilayer PCB unit 3-1 of FIG. 5 has an advantage that the influence of noise of high-frequency components to the outside is much smaller than that of the prior art.
또한, 도 5의 실시예에서 보인 본 발명에 따르는 다층PCB부(3-1)는 6층의 PCB 면으로 구성될 수 있어서, 10층의 PCB 면으로 구성되는 종래 기술의 다층PCB부(3)에 비해서 가격이 훨씬 낮아지는 장점을 가진다. In addition, the multilayer PCB unit 3-1 according to the present invention shown in the embodiment of FIG. 5 may be composed of a six-layer PCB surface, so that the multilayer PCB unit 3 of the prior art is composed of a 10-layer PCB surface. Compared to this, the price is much lower.
또한, 종래 기술에 비해 입력권선과 제1출력권선(2-1)과 제2출력권선(4-1) 사이의 자기적인 결합도가 높아서 전력 전달의 효율이 높아지는 장점을 가진다.In addition, compared to the prior art, the magnetic coupling between the input winding and the first output winding 2-1 and the second output winding 4-1 is high, so that the efficiency of power transmission is increased.
도 6은, 제어부(14-1)에 공급할 전원 전압을 얻기 위해 필요한 제2입력권선(26)의 턴 수가 1층의 PCB면에 의해 구성될 수 있는 전원 장치를 위하여 총 6층의 PCB면에 의해 구성된 다층PCB부(3-1a)의 일 실시예를 보이며, 다층PCB부(3-1a)는 도 4의 전원 장치의 다층PCB부(3-1)를 대체할 수 있다.6 shows a total of 6 layers of the PCB surface for a power supply device in which the number of turns of the second input winding 26 required to obtain a power supply voltage to be supplied to the control unit 14-1 can be configured by a single-layer PCB surface. An exemplary embodiment of the multilayer PCB unit 3-1a configured by the multilayer PCB unit 3-1a is shown, and the multilayer PCB unit 3-1a may replace the multilayer PCB unit 3-1 of the power supply device of FIG. 4.
도 4의 전원 장치에 있어서, 가장 낮은 출력 전압이 5V인 경우에, 제2입력권선(26)은, 제어부(14-1)에 공급할 7.5V 이상의 전원 전압을 인출하기 위하여, 제1출력권선(2-1)과 제2출력권선(4-1)의 턴 수의 1.5 배보다 큰 턴 수를 가져야 한다. 제1출력권선(2-1)과 제2출력권선(4-1)의 턴 수가 각각 5턴인 경우, 도 6의 다층PCB부(3-1a)의 제2입력권선(26)의 턴 수는 8턴 정도이며, 흐르는 전류를 감안하더라도 1 층의 PCB 면에 구성될 수 있다. 이 경우, 제1입력권선(25)은, 1 층의 PCB면에 8 턴씩 구성하여, 4 층의 PCB면에 32 턴으로 구성된다. 제2입력권선(26)은 1 층의 PCB면에 8 턴으로 구성된다. 그러므로, 트랜스포머(6-1a)의 일 실시예는 총 40턴의 입력권선을 가진다.In the power supply device of Fig. 4, when the lowest output voltage is 5V, the second input winding 26 is a first output winding ( 2-1) and the second output winding (4-1) must have a number of turns greater than 1.5 times the number of turns. When the number of turns of the first output winding 2-1 and the second output winding 4-1 is 5 turns, the number of turns of the second input winding 26 of the multilayer PCB unit 3-1a of FIG. 6 is It is about 8 turns, and it can be configured on a single-layer PCB surface even considering the current flowing. In this case, the first input winding 25 is composed of 8 turns on the PCB surface of one layer and 32 turns of the PCB surface of 4 layers. The second input winding 26 is composed of 8 turns on the PCB surface of one layer. Therefore, one embodiment of the transformer 6-1a has a total input winding of 40 turns.
도 6의 다층PCB부(3-1a)는, 첫째 층의 PCB 면에 제1결합부(27-1)와 제2결합부(27-2)를 구성하고, 둘째 층부터 다섯째 층의 PCB 면에 제1입력권선(25)의 제1권선(25-1) 내지 제4권선(25-4)을 구성하고, 끝 층의 PCB 면에 제3결합부(28)를 구성한다. 제1결합부(27-1)는 전원 장치의 1차측의 전기적인 접지에 연결되는 도체 면(27-3)에 의해 구성된다. 제2결합부(27-2)는 제2입력권선(26)의 시작점의 전위가 연결되는 도체 면(27-5)에 의해 구성된다. 제3결합부(28)는, 제2입력권선(26)에 의해 구성된다. The multilayer PCB part 3-1a of FIG. 6 comprises a first coupling part 27-1 and a second coupling part 27-2 on the PCB surface of the first layer, and the PCB surface of the second layer to the fifth layer. The first winding 25-1 to the fourth winding 25-4 of the first input winding 25 are formed, and a third coupling part 28 is formed on the PCB surface of the end layer. The first coupling portion 27-1 is constituted by a conductor surface 27-3 connected to the electrical ground of the primary side of the power supply device. The second coupling portion 27-2 is constituted by a conductor surface 27-5 to which the potential of the starting point of the second input winding 26 is connected. The 3rd coupling part 28 is comprised by the 2nd input winding 26.
도 6의 다층PCB부(3-1a)에 있어서, 제1입력권선(25)의 제1권선(25-1)의 시작점은 단자(c)로 연결된다. 제1입력권선(25)의 제1권선(25-1)과 제2권선(25-2)과 제3권선(25-3)의 끝 점은 각각 Through Hole(g와 h와 f)을 통해서 제1입력권선(25)의 제2권선(25-2)과 제3권선(25-3)과 제4권선(25-4)의 시작점에 연결된다. 제1입력권선(25)의 제4권선(25-4)의 끝 점은 단자(d)에 연결된다. 제2입력권선(26)의 시작점은, Through Hole(e)와 제2결합부(27-2)를 통해서 단자(b)로 연결된다. 제2입력권선(26)의 끝 점은 단자(a)로 연결된다.In the multilayer PCB part 3-1a of FIG. 6, the starting point of the first winding 25-1 of the first input winding 25 is connected to the terminal c. The end points of the first winding (25-1), the second winding (25-2), and the third winding (25-3) of the first input winding (25) are through holes (g, h, and f), respectively. The first input winding 25 is connected to the starting points of the second winding 25-2, the third winding 25-3, and the fourth winding 25-4. The end point of the fourth winding 25-4 of the first input winding 25 is connected to the terminal d. The starting point of the second input winding 26 is connected to the terminal (b) through the through hole (e) and the second coupling portion (27-2). The end point of the second input winding 26 is connected to the terminal (a).
도 6의 다층PCB부(3-1a)에 있어서, 전원 장치의 1차측의 전기적인 접지에 연결되는 제1결합부(27-1)는 제1입력권선(25)이 제1출력권선(2-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합과 같은 극성의 스위칭 주파수 성분의 용량성 결합을 제1출력권선(2-1)으로 생성한다. 제1결합부(27-1)가 제1출력권선(2-1)으로 생성하는 용량성 결합의 크기는 첫번째 층의 PCB 면에서 제1결합부(27-1)가 차지하는 면적의 비율이 작을수록 작아지므로, 손 쉽게 조절이 가능하다. 제2입력권선(26)의 시작점이 연결되는 도체 면(27-5)에 의해 구성되는 제2결합부(27-2)는, 제1입력권선(25)이 제1출력권선(2-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합과 반대 극성의 스위칭 주파수 성분의 용량성 결합을 제1출력권선(2-1)으로 생성한다. 제2결합부(27-2)가 제1출력권선(2-1)으로 생성하는 용량성 결합의 크기는, 제2결합부(27-2)의 전위가 높을수록 커지고, 첫번째 층의 PCB 면에서 제2결합부(27-2)가 차지하는 면적의 비율이 클수록 커지므로, 손 쉽게 조절이 가능하다. 그러므로, 다층PCB부(3-1a)의 제1결합부(27-1)와 제2결합부(27-2)가 제1출력권선(2-1)으로 생성하는 용량성 결합의 합의 크기와 극성은 첫번째 층의 PCB 면에서 제1결합부(27-1)와 제2결합부(27-2)가 차지하는 면적의 비율의 조절을 포함하여 여러가지 방법에 의해 손쉽게 설정할 수 있다. 또한, 제1결합부(27-1)와 제2결합부(27-2)와 제3결합부(28)가 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 용량성 결합의 합의 크기와 극성도 손쉽게 설정할 수 있다.In the multilayer PCB part 3-1a of FIG. 6, the first coupling part 27-1 connected to the electrical ground of the primary side of the power supply device has a first input winding 25 and a first output winding 2 The capacitive coupling of the switching frequency components of the same polarity as the capacitive coupling of the switching frequency components generated by -1) is generated by the first output winding 2-1. The size of the capacitive coupling created by the first coupling part 27-1 to the first output winding 2-1 is a small ratio of the area occupied by the first coupling part 27-1 on the PCB surface of the first layer. As it gets smaller, it can be easily adjusted by hand. The second coupling portion 27-2 constituted by the conductor surface 27-5 to which the starting point of the second input winding 26 is connected, the first input winding 25 is the first output winding 2-1. The capacitive coupling of the switching frequency component generated by) and the capacitive coupling of the switching frequency component of the opposite polarity are generated by the first output winding 2-1. The size of the capacitive coupling generated by the second coupling portion 27-2 to the first output winding 2-1 increases as the potential of the second coupling portion 27-2 increases, and the PCB surface of the first layer As the ratio of the area occupied by the second coupling part 27-2 increases, it can be easily adjusted by hand. Therefore, the size of the sum of the capacitive couplings generated by the first coupling portion 27-1 and the second coupling portion 27-2 of the multilayer PCB portion 3-1a and the first output winding 2-1 The polarity can be easily set by various methods, including adjusting the ratio of the area occupied by the first coupling portion 27-1 and the second coupling portion 27-2 on the PCB surface of the first layer. In addition, the first coupling portion (27-1), the second coupling portion (27-2) and the third coupling portion (28) are divided into the first output winding (2-1) and the second output winding (4-1). The size and polarity of the sum of the resulting capacitive bonds can also be easily set.
따라서, 다층PCB부(3-1a)를 사용하는 도 4의 전원 장치는, 다층PCB부(3-1a)의 제1결합부(27-1)와 제2결합부(27-2)와 제3결합부(28)가 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합의 크기와 극성을 적절히 설정하여, 전원 장치의 1차측의 모든 요소들이 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합을 “영”에 근접시키며, 전원장치의 출력선로의 스위칭 주파수 성분의 noise를 아주 낮게 낮춘다.Accordingly, in the power supply device of FIG. 4 using the multilayer PCB unit 3-1a, the first coupling portion 27-1 and the second coupling portion 27-2 and the second coupling portion 27-2 of the multilayer PCB portion 3-1a By appropriately setting the size and polarity of the sum of capacitive couplings of the switching frequency components generated by the three-coupling unit 28 by the first output winding 2-1 and the second output winding 4-1, The sum of the capacitive coupling of the switching frequency components generated by the first and second output windings (2-1) and the second output windings (4-1) on the vehicle side is close to "zero", and the output line of the power supply is The noise of the switching frequency component is very low.
도 5의 다층PCB부(3-1)와 마찬가지로, 도 6의 다층PCB부(3-1a)에서 제1입력권선(25)이 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 크기는, 도 3의 다층PCB부(3)에서 입력권선(7)과 제1보조권선(8)과 제2보조권선(9)이 제1출력권선(2)과 제2출력권선(4)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 크기의 1/4 정도로 훨씬 작으므로, 도 6의 다층PCB부(3-1a)를 사용하는 전원 장치는 종래기술에 비해 외부로 스위칭 주파수 성분의 노이즈의 영향을 훨씬 작게 미치는 장점과 고주파 성분의 노이즈의 영향을 훨씬 작게 미치는 장점을 모두 가진다.Like the multilayer PCB unit 3-1 of FIG. 5, the first input winding 25 is connected to the first output winding 2-1 and the second output winding 4 in the multilayer PCB unit 3-1a of FIG. 6. The magnitude of the capacitive coupling of the switching frequency components generated by -1) is determined by the input winding 7 and the first auxiliary winding 8 and the second auxiliary winding 9 in the multilayer PCB unit 3 of FIG. Since it is much smaller about 1/4 of the size of the capacitive coupling of the switching frequency component generated by the first output winding 2 and the second output winding 4, the power supply using the multilayer PCB unit 3-1a of FIG. 6 Compared to the prior art, the device has both an advantage of having a much smaller effect of noise of a switching frequency component and a much smaller effect of noise of a high frequency component.
도시하지는 않았지만, 도 5와 도 6의 다른 실시예로서, 첫째 층의 PCB 면에서, 제1결합부(27-1)를 도시되지 않은 또 다른 Through hole을 통해서 제1입력권선(25)의 한 점에 연결하여, 제1결합부(27-1)가 변동하는 전위를 가지게 할 수도 있다. Although not shown, as another embodiment of FIGS. 5 and 6, in the first layer of the PCB, the first coupling portion 27-1 is passed through another through hole, not shown, to one of the first input windings 25. By connecting to a point, the first coupling portion 27-1 may have a variable potential.
도 7은 본 발명의 또 다른 일 실시예인 6층의 PCB면에 의해 구성된 다층PCB부(3-2)를 보이며, 다층PCB부(3-2)는 도 4의 전원 장치의 다층PCB부(3-1)를 대체할 수 있다.7 shows a multilayer PCB unit 3-2 composed of a six-layer PCB surface, which is another embodiment of the present invention, and the multilayer PCB unit 3-2 is a multilayer PCB unit 3 of the power supply device of Fig. 4. Can be substituted for -1).
도 7의 다층PCB부(3-2)는, 첫째 층의 PCB 면에 제1결합부(29-1)와 제2결합부(29-2)를 구성하고, 둘째층의 PCB 면은 제2입력권선(26)의 제1권선(26-1)과 도체 면(26-5)을 구성하고, 셋째 층부터 다섯째 층의 PCB 면에 제1입력권선(25)의 제1권선(25-1) 내지 제3권선(25-3)을 구성하고, 끝 층의 PCB 면에 제3결합부(28)를 구성한다. 제1결합부(29-1)는 전원 장치의 1차측의 전기적인 접지에 연결되는 도체 면(29-3)에 의해 구성된다. 제2결합부(29-2)는 제2입력권선(26)의 제2권선(26-2)의 일부분의 전위나 제1권선(26-1)의 일부분의 전위가 Through hole(j)를 통해서 연결된 도체 면(29-5)에 의해 구성된다. 제3결합부(28)는, 제2입력권선(26)의 제2권선(26-2)에 의해 구성된다.The multilayer PCB part 3-2 of FIG. 7 comprises a first coupling part 29-1 and a second coupling part 29-2 on the first-layer PCB surface, and the second-layer PCB surface is a second The first winding (26-1) of the input winding (26) and the conductor surface (26-5) are formed, and the first winding (25-1) of the first input winding (25) is formed on the PCB surface of the third to fifth layers. ) To third windings 25-3, and a third coupling part 28 on the PCB surface of the end layer. The first coupling portion 29-1 is constituted by a conductor surface 29-3 connected to the electrical ground of the primary side of the power supply device. In the second coupling part 29-2, a potential of a part of the second winding 26-2 of the second input winding 26 or a potential of a part of the first winding 26-1 passes through the through hole (j). It is constituted by a conductor face (29-5) connected through. The 3rd coupling part 28 is comprised by the 2nd winding 26-2 of the 2nd input winding 26.
도 7의 다층PCB부(3-2)에 있어서, 단자(c)는 제1결합부(29-1)와 Through Hole(g)을 통해서 제1입력권선(25)의 제1권선(25-1)의 시작점에 연결된다. 제1입력권선(25)의 제1권선(25-1)과 제2권선(25-2)의 끝 점은 각각 Through Hole(h와 f)을 통해서 제1입력권선(25)의 제2권선(25-2)과 제3권선(25-3)의 시작점에 연결된다. 제1입력권선(25)의 제3권선(25-3)의 끝 점은 단자(d)에 연결된다. 제2입력권선(26)의 제1권선(26-1)의 시작점은 단자(b)에 연결되고, 제2입력권선(26)의 제1권선(26-1)의 끝 점은 Through Hole(e)을 통해서 제2입력권선(26)의 제2권선(26-2)의 시작점에 연결된다. 제2입력권선(26)의 제2권선(26-2)의 끝 점은 단자(a)로 연결된다. 제2결합부(29-2)는, Through Hole(j)을 통해서 제2입력권선(26)의 제1권선(26-1)의 시작점부터 끝 점 사이의 한 점 혹은 제2권선(26-2)의 시작점부터 끝 점 사이의 한 점에 연결된다.In the multilayer PCB part 3-2 of FIG. 7, the terminal c is the first winding 25 of the first input winding 25 through the first coupling part 29-1 and the through hole g. It is connected to the starting point of 1). The end points of the first winding (25-1) and the second winding (25-2) of the first input winding (25) are the second winding of the first input winding (25) through through holes (h and f), respectively. It is connected to the starting point of (25-2) and the third winding (25-3). The end point of the third winding 25-3 of the first input winding 25 is connected to the terminal d. The starting point of the first winding 26-1 of the second input winding 26 is connected to the terminal b, and the end point of the first winding 26-1 of the second input winding 26 is Through Hole ( It is connected to the starting point of the second winding 26-2 of the second input winding 26 through e). The end point of the second winding 26-2 of the second input winding 26 is connected to the terminal (a). The second coupling part 29-2 is formed at a point between the start point and the end point of the first winding 26-1 of the second input winding 26 or the second winding 26- It is connected to a point between the start point and the end point of 2).
도 7의 다층PCB부(3-2)에 있어서, 전원 장치의 1차측의 전기적인 접지에 연결되는 제1결합부(29-1)는 제1입력권선(25)이 제1출력권선(2-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합과 같은 극성의 스위칭 주파수 성분의 용량성 결합을 제1출력권선(2-1)으로 생성한다. 제1결합부(29-1)가 제1출력권선(2-1)으로 생성하는 용량성 결합의 크기는 첫번째 층의 PCB 면에서 제1결합부(27-1)가 차지하는 면적의 비율이 작을수록 작아지므로, 손 쉽게 조절이 가능하다. 제2입력권선(26)의 제1권선(26-1)의 시작점부터 끝 점 사이의 한 점 혹은 제2권선(26-2)의 시작점부터 끝 점 사이의 한 점에 연결되는 도체 면(29-5)에 의해 구성되는 제2결합부(29-2)는, 제1입력권선(25)이 제1출력권선(2-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합과 반대 극성의 스위칭 주파수 성분의 용량성 결합을 제1출력권선(2-1)으로 생성한다. 제2결합부(29-2)가 제1출력권선(2-1)으로 생성하는 용량성 결합의 크기는 제2결합부(29-2)의 전위가 높을수록 커지고, 첫번째 층의 PCB 면에서 제2결합부(29-2)가 차지하는 면적의 비율이 클수록 커지므로, 손 쉽게 조절이 가능하다. 그러므로, 다층PCB부(3-2)의 제1결합부(29-1)와 제2결합부(29-2)가 제1출력권선(2-1)으로 생성하는 용량성 결합의 합의 크기와 극성은 첫번째 층의 PCB 면에서 제1결합부(29-1)와 제2결합부(29-2)가 차지하는 면적의 비율의 조절을 포함하여 여러가지 방법에 의해 손쉽게 설정할 수 있다. 또한, 제1결합부(29-1)와 제2결합부(29-2)와 제3결합부(28)가 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 용량성 결합의 합의 크기와 극성도 손쉽게 설정할 수 있다.In the multilayer PCB part 3-2 of FIG. 7, the first coupling part 29-1 connected to the electrical ground of the primary side of the power supply device has a first input winding 25 and a first output winding 2 The capacitive coupling of the switching frequency components of the same polarity as the capacitive coupling of the switching frequency components generated by -1) is generated by the first output winding 2-1. The size of the capacitive coupling that the first coupling part 29-1 creates with the first output winding 2-1 is a small ratio of the area occupied by the first coupling part 27-1 on the PCB surface of the first layer. As it gets smaller, it can be easily adjusted by hand. A conductor surface 29 connected to a point between the start point and the end point of the first winding 26-1 of the second input winding 26 or a point between the start point and the end point of the second winding 26-2. The second coupling unit 29-2 constituted by -5) is a capacitive coupling of the switching frequency components generated by the first input winding 25 as the first output winding 2-1 and switching of the opposite polarity. The capacitive coupling of the frequency components is generated by the first output winding (2-1). The size of the capacitive coupling generated by the second coupling portion 29-2 to the first output winding 2-1 increases as the potential of the second coupling portion 29-2 increases, and from the PCB surface of the first layer As the ratio of the area occupied by the second coupling portion 29-2 increases, it can be easily adjusted. Therefore, the size of the sum of the capacitive couplings generated by the first coupling portion 29-1 and the second coupling portion 29-2 of the multilayer PCB portion 3-2 and the first output winding 2-1 The polarity can be easily set by various methods, including adjusting the ratio of the area occupied by the first coupling portion 29-1 and the second coupling portion 29-2 on the PCB surface of the first layer. In addition, the first coupling portion (29-1), the second coupling portion (29-2) and the third coupling portion (28) are divided into the first output winding (2-1) and the second output winding (4-1). The size and polarity of the sum of the resulting capacitive bonds can also be easily set.
따라서, 다층PCB부(3-2)를 사용하는 도 4의 전원 장치는, 다층PCB부(3-2)의 제1결합부(29-1)와 제2결합부(29-2)와 제3결합부(28)가 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합의 크기와 극성을 적절히 설정하여, 전원 장치의 1차측의 모든 요소들이 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합을 “영”에 근접시키며, 전원장치의 출력선로의 스위칭 주파수 성분의 noise를 아주 낮게 낮춘다.Accordingly, in the power supply device of FIG. 4 using the multilayer PCB unit 3-2, the first coupling unit 29-1 and the second coupling unit 29-2 and the second coupling unit 29-2 of the multilayer PCB unit 3-2 are provided. By appropriately setting the size and polarity of the sum of capacitive couplings of the switching frequency components generated by the three-coupling unit 28 by the first output winding 2-1 and the second output winding 4-1, The sum of the capacitive coupling of the switching frequency components generated by the first and second output windings (2-1) and the second output windings (4-1) on the vehicle side is close to "zero", and the output line of the power supply is The noise of the switching frequency component is very low.
도 7의 다층PCB부(3-2)에서 제1입력권선(25)이 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 크기는, 도 5의 다층PCB부(3-1)와 마찬가지로, 도 3의 다층PCB부(3)에서 입력권선(7)과 제1보조권선(8)과 제2보조권선(9)이 제1출력권선(2)과 제2출력권선(4)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 크기의 1/4 정도로 훨씬 작으므로, 도 7의 다층PCB부(3-2)를 사용하는 전원 장치는 종래기술에 비해 외부로 스위칭 주파수 성분의 노이즈의 영향을 작게 미치는 장점과 고주파 성분의 노이즈의 영향을 훨씬 작게 미치는 장점을 모두 가진다.In the multilayer PCB unit 3-2 of FIG. 7, the capacitive coupling of the switching frequency components generated by the first input winding 25 by the first output winding 2-1 and the second output winding 4-1 The size of the input winding 7 and the first auxiliary winding 8 and the second auxiliary winding 9 in the multilayer PCB unit 3 of FIG. 3 are similar to the multilayer PCB unit 3-1 of FIG. Since it is much smaller about 1/4 of the size of the capacitive coupling of the switching frequency component generated by the first output winding 2 and the second output winding 4, the power supply using the multilayer PCB unit 3-2 of FIG. 7 Compared to the prior art, the device has both the advantage of reducing the influence of noise of the switching frequency component to the outside and the advantage of significantly reducing the influence of the noise of the high frequency component.
도 8은 본 발명의 또 다른 일 실시예인 6층의 PCB면에 의해 구성된 다층PCB부(3-3)를 보인다. 다층PCB부(3-3)는 도 4의 전원 장치의 다층PCB부(3-1)를 대체할 수 있다.8 shows a multilayer PCB part 3-3 formed by a 6-layer PCB surface, which is another embodiment of the present invention. The multilayer PCB unit 3-3 may replace the multilayer PCB unit 3-1 of the power supply device of FIG. 4.
도 8의 다층PCB부(3-3)는, 첫째 층의 PCB 면에 제1결합부(30-1)와 제2결합부(30-2)를 구성하고, 둘째층의 면에 제2입력권선(26)의 제1권선(26-1)을 구성하고, 셋째 층부터 다섯째 층의 PCB 면에 제1입력권선(25)의 제2권선(25-2) 내지 제4권선(25-4)을 구성하고, 여섯째 층의 면에 제3결합부(28)를 구성한다. 제1결합부(30-1)는 제1입력권선(25)의 제1권선(25-1)과 제1입력권선(25)의 제1권선(25-1)의 일부분에 연결된 도체 면(30-6)에 의해 구성된다. 제2결합부(30-2)는 Through Hole(e)을 통해서 제2입력권선(26)의 제2권선(26-2)의 시작점에 연결되는 도체 면(30-5)에 의해 구성된다. 제3결합부(28)는 제2입력권선(26)의 제2권선(26-2)에 의해 구성된다.The multilayer PCB part 3-3 of FIG. 8 comprises a first coupling part 30-1 and a second coupling part 30-2 on the PCB surface of the first layer, and a second input on the surface of the second layer. The first winding 26-1 of the winding 26 is formed, and the second winding 25-2 to the fourth winding 25-4 of the first input winding 25 are formed on the PCB surface of the third to fifth layers. ), and a third coupling part 28 on the surface of the sixth layer. The first coupling part 30-1 is a conductor surface connected to the first winding 25-1 of the first input winding 25 and a part of the first winding 25-1 of the first input winding 25 ( 30-6). The second coupling part 30-2 is constituted by a conductor surface 30-5 connected to the starting point of the second winding 26-2 of the second input winding 26 through a through hole (e). The third coupling portion 28 is constituted by the second winding 26-2 of the second input winding 26.
도 8의 다층PCB부(3-3)에 있어서, 단자(c)는 제1입력권선(25)의 제1권선(25-1)의 시작점에 연결되고, 제1권선(25-1)의 끝점은 Through Hole(g)을 통해서 제1입력권선(25)의 제2권선(25-2)의 시작점에 연결된다. 제1입력권선(25)의 제2권선(25-2)과 제3권선(25-3)의 끝 점은 각각 Through Hole(h와 f)을 통해서 제1입력권선(25)의 제3권선(25-3)과 제4권선(25-4)의 시작점에 연결된다. 제1입력권선(25)의 제4권선(25-4)의 끝 점은 단자(d)에 연결된다. 제2입력권선(26)의 제1권선(26-1)의 시작점은 단자(b)에 연결되고, 제2입력권선(26)의 제1권선(26-1)의 끝 점은 Through Hole(e)을 통해서 제2입력권선(26)의 제2권선(26-2)의 시작점에 연결된다. 제2입력권선(26)의 제2권선(26-2)의 끝 점은 단자(a)에 연결된다. 제2결합부(30-2)는 Through Hole(e)을 통해서 제2입력권선(26)의 제2권선(26-2)의 시작점에 연결된다.In the multilayer PCB part 3-3 of FIG. 8, the terminal c is connected to the starting point of the first winding 25-1 of the first input winding 25, and The end point is connected to the start point of the second winding 25-2 of the first input winding 25 through the Through Hole (g). The end points of the second winding 25-2 and the third winding 25-3 of the first input winding 25 are the third winding of the first input winding 25 through through holes (h and f), respectively. It is connected to the starting point of (25-3) and the fourth winding (25-4). The end point of the fourth winding 25-4 of the first input winding 25 is connected to the terminal d. The starting point of the first winding 26-1 of the second input winding 26 is connected to the terminal b, and the end point of the first winding 26-1 of the second input winding 26 is Through Hole ( It is connected to the starting point of the second winding 26-2 of the second input winding 26 through e). The end point of the second winding 26-2 of the second input winding 26 is connected to the terminal (a). The second coupling part 30-2 is connected to the starting point of the second winding 26-2 of the second input winding 26 through a through hole (e).
도 8의 다층PCB부(3-3)에 있어서, 제1입력권선(25)의 제1권선(25-1)과 제1입력권선(25)의 제1권선(25-1)의 일부분에 연결된 도체 면(30-6)으로 구성되는 제1결합부(30-1)는 제1입력권선(25)의 제2권선(25-2)과 제3권선(25-3)과 제4권선(25-4)이 제1출력권선(2-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합과 같은 극성의 스위칭 주파수 성분의 용량성 결합을 제1출력권선(2-1)으로 생성한다. 제1결합부(30-1)가 제1출력권선(2-1)으로 생성하는 용량성 결합의 크기는, 제1결합부(30-1)를 구성하는 제1입력권선(25)의 제1권선(25-1)의 턴 수가 작을수록 작아지고 도체 면(30-6)의 면적이 작을수록 작아지므로, 손 쉽게 조절이 가능하다. 도 8의 다층PCB부(3-3)에 있어서, 제2입력권선(26)의 제2권선(26-2)의 시작점에 연결되는 도체 면(30-5)에 의해 구성되는 제2결합부(30-2)는, 제1입력권선(25)이 제1출력권선(2-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합과 반대 극성의 스위칭 주파수 성분의 용량성 결합을 제1출력권선(2-1)으로 생성한다. 제2결합부(30-2)가 제1출력권선(2-1)으로 생성하는 용량성 결합의 크기는, 제2결합부(30-2)의 전위가 높을수록 커지고, 첫번째 층의 PCB 면에서 제2결합부(30-2)가 차지하는 면적의 비율이 클수록 커지므로, 손 쉽게 조절이 가능하다. 그러므로, 다층PCB부(3-3)의 제1결합부(30-1)와 제2결합부(30-2)가 제1출력권선(2-1)으로 생성하는 용량성 결합의 합의 크기와 극성은 첫번째 층의 PCB 면에서 제1결합부(30-1)와 제2결합부(30-2)가 차지하는 면적의 비율의 조절을 포함하여 여러가지 방법에 의해 손쉽게 설정할 수 있다. 또한, 제1결합부(30-1)와 제2결합부(30-2)와 제3결합부(28)가 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 용량성 결합의 합의 크기와 극성도 손쉽게 설정할 수 있다.In the multilayer PCB unit 3-3 of FIG. 8, a part of the first winding 25-1 of the first input winding 25 and the first winding 25-1 of the first input winding 25 The first coupling part 30-1 composed of the connected conductor surface 30-6 is the second winding 25-2 and the third winding 25-3 and the fourth winding of the first input winding 25. The capacitive coupling of the switching frequency components of the same polarity as the capacitive coupling of the switching frequency components generated by the first output winding (2-1) (25-4) is generated as the first output winding (2-1). The size of the capacitive coupling generated by the first coupling part 30-1 to the first output winding 2-1 is the first input winding 25 constituting the first coupling part 30-1. The smaller the number of turns of one winding 25-1 is, the smaller it is, and the smaller the area of the conductor surface 30-6 is, the smaller it is, so it can be easily adjusted by hand. In the multilayer PCB part 3-3 of FIG. 8, a second coupling part constituted by a conductor surface 30-5 connected to the starting point of the second winding 26-2 of the second input winding 26 In (30-2), the capacitive coupling of the switching frequency components generated by the first input winding 25 as the first output winding 2-1 and the capacitive coupling of the switching frequency components of the opposite polarity is the first output winding. It is created with (2-1). The size of the capacitive coupling generated by the second coupling portion 30-2 to the first output winding 2-1 increases as the potential of the second coupling portion 30-2 increases, and the PCB surface of the first layer The larger the ratio of the area occupied by the second coupling part 30-2 increases, so it can be easily adjusted by hand. Therefore, the size of the sum of the capacitive couplings generated by the first coupling portion 30-1 and the second coupling portion 30-2 of the multilayer PCB portion 3-3 and the first output winding 2-1 The polarity can be easily set by various methods, including adjusting the ratio of the area occupied by the first coupling portion 30-1 and the second coupling portion 30-2 on the first layer of the PCB. In addition, the first coupling portion (30-1), the second coupling portion (30-2) and the third coupling portion (28) are divided into the first output winding (2-1) and the second output winding (4-1). The size and polarity of the sum of the resulting capacitive bonds can also be easily set.
따라서, 다층PCB부(3-3)를 사용하는 도 4의 전원 장치는, 다층PCB부(3-3)의 제1결합부(30-1)와 제2결합부(30-2)와 제3결합부(28)가 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합의 크기와 극성을 적절히 설정하여, 전원 장치의 1차측의 모든 요소들이 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합을 “영”에 근접시키며, 전원장치의 출력선로의 스위칭 주파수 성분의 noise를 아주 낮게 낮춘다.Therefore, in the power supply device of FIG. 4 using the multilayer PCB unit 3-3, the first coupling unit 30-1 and the second coupling unit 30-2 and the second coupling unit 30-2 of the multilayer PCB unit 3-3 are used. By appropriately setting the size and polarity of the sum of capacitive couplings of the switching frequency components generated by the three-coupling unit 28 by the first output winding 2-1 and the second output winding 4-1, The sum of the capacitive coupling of the switching frequency components generated by the first and second output windings (2-1) and the second output windings (4-1) on the vehicle side is close to "zero", The noise of the switching frequency component is very low.
도 8의 다층PCB부(3-3)에서, 첫번째 층의 PCB 면에서 제2결합부(30-2)가 차지하는 면적에서 제1입력권선(25)과 제1출력권선(2-1) 사이의 용량성 결합이 차단된다. 따라서, 도 8의 다층PCB부(3-3)에서, 제1입력권선(25)이 제1출력권선(2-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 크기는, 도 3의 다층PCB부(3)에서 입력권선(7)과 제1보조권선(8)이 제1출력권선(2)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 크기보다 훨씬 작다. 또한, 도 8의 다층PCB부(3-3)에서, 제1입력권선(25)으로부터 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합의 크기는, 도 3의 다층PCB부(3)에서 입력권선(7)과 제1보조권선(8)과 제2보조권선(9)이 제1출력권선(2)과 제2출력권선(4)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합의 크기보다 훨씬 작다. 그러므로, 도 8의 다층PCB부(3-3)를 사용하는 전원 장치는 종래기술에 비해 외부로 스위칭 주파수 성분과 고주파 성분의 노이즈의 영향을 작게 미치는 장점을 가진다.In the multilayer PCB part 3-3 of FIG. 8, between the first input winding 25 and the first output winding 2-1 in the area occupied by the second coupling part 30-2 on the first-layer PCB surface. The capacitive binding of is blocked. Accordingly, in the multilayer PCB unit 3-3 of FIG. 8, the size of the capacitive coupling of the switching frequency components generated by the first input winding 25 to the first output winding 2-1 is In the PCB part 3, the input winding 7 and the first auxiliary winding 8 are much smaller than the size of the capacitive coupling of the switching frequency components generated by the first output winding 2. In addition, in the multilayer PCB unit 3-3 of FIG. 8, the capacity of the switching frequency component generated from the first input winding 25 to the first output winding 2-1 and the second output winding 4-1 The size of the sum of the sex combinations is the input winding 7 and the first auxiliary winding 8 and the second auxiliary winding 9 in the multilayer PCB unit 3 of FIG. 3 as the first output winding 2 and the second output. It is much smaller than the sum of the capacitive couplings of the switching frequency components produced by the winding 4. Therefore, the power supply device using the multilayer PCB unit 3-3 of FIG. 8 has an advantage of reducing the influence of noise of the switching frequency component and the high frequency component externally compared to the prior art.
도 9는 본 발명의 또 다른 일 실시예인 6층의 PCB면에 의해 구성된 다층PCB부(3-4)를 보인다. 다층PCB부(3-4)는 도 4의 전원 장치의 다층PCB부(3-1)를 대체할 수 있다.9 shows a multilayer PCB part 3-4 formed by a 6-layer PCB surface, which is another embodiment of the present invention. The multilayer PCB unit 3-4 may replace the multilayer PCB unit 3-1 of the power supply device of FIG. 4.
도 9의 다층PCB부(3-4)는, 첫째 층의 PCB 면에 제1결합부(31-1)와 제2결합부(31-2)를 구성하고, 둘째층의 PCB 면에 제2입력권선(26)의 제1권선(26-1)과 제2입력권선(26)의 시작 점과 끝 점 사이의 한 점에 연결되는 도체 면(26-5)을 구성하고, 셋째 층부터 다섯째 층의 PCB 면에 제1입력권선(25)의 제1권선(25-1) 내지 제3권선(25-3)을 구성하고, 여섯째 층의 면에 제3결합부(28)를 구성한다. 제1결합부(31-1)는 전원 장치의 1차측의 전기적인 접지에 연결되는 도체 면(31-3)으로 구성된다. 제2결합부(31-2)는 도체가 없는 빈 면(31-4)으로 구성된다. 제3결합부(28)는 제2입력권선(26)의 제2권선(26-2)으로 구성된다.The multilayer PCB part 3-4 of FIG. 9 comprises a first coupling part 31-1 and a second coupling part 31-2 on the first-layer PCB surface, and The first winding (26-1) of the input winding (26) and the conductor surface (26-5) connected to a point between the starting point and the ending point of the second input winding (26) are formed, and from the third layer to the fifth layer. The first winding 25-1 to the third winding 25-3 of the first input winding 25 are formed on the PCB surface of the layer, and the third coupling part 28 is formed on the surface of the sixth layer. The first coupling portion 31-1 is composed of a conductor surface 31-3 connected to the electrical ground of the primary side of the power supply device. The second coupling portion 31-2 is composed of an empty surface 31-4 without a conductor. The third coupling unit 28 is composed of the second winding 26-2 of the second input winding 26.
도 9의 다층PCB부(3-4)에 있어서, 단자(c)는, 제1결합부(31-1)에 연결되고, Through Hole(g)을 통해서 제1입력권선(25)의 제1권선(25-1)의 시작점에 연결된다. 제1입력권선(25)의 제1권선(25-1)과 제2권선(25-2)의 끝점은 Through Hole(h와 f)을 통해서 제1입력권선(25)의 제2권선(25-2)과 제3권선(25-3)의 시작점에 연결된다. 제1입력권선(25)의 제3권선(25-3)의 끝 점은 단자(d)에 연결된다. 제2입력권선(26)의 제1권선(26-1)의 시작점은 단자(b)에 연결되고, 제2입력권선(26)의 제1권선(26-1)의 끝 점은 Through Hole(e)을 통해서 제2입력권선(26)의 제2권선(26-2)의 시작점에 연결된다. 제2입력권선(26)의 제2권선(26-2)의 끝 점은 단자(a)로 연결된다.In the multilayer PCB part 3-4 of FIG. 9, the terminal (c) is connected to the first coupling part 31-1, and the first input winding 25 of the first input winding 25 through the through hole (g). It is connected to the starting point of the winding 25-1. The end points of the first winding 25-1 and the second winding 25-2 of the first input winding 25 are connected to the second winding 25 of the first input winding 25 through through holes (h and f). It is connected to the starting point of -2) and the third winding (25-3). The end point of the third winding 25-3 of the first input winding 25 is connected to the terminal d. The starting point of the first winding 26-1 of the second input winding 26 is connected to the terminal b, and the end point of the first winding 26-1 of the second input winding 26 is Through Hole ( It is connected to the starting point of the second winding 26-2 of the second input winding 26 through e). The end point of the second winding 26-2 of the second input winding 26 is connected to the terminal (a).
도 9의 다층PCB부(3-4)에 있어서, 전원 장치의 1차측의 전기적인 접지에 연결되는 도체 면(31-3)에 의해 구성되는 제1결합부(31-1)는 제1입력권선(25)이 제1출력권선(2-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합과 같은 극성의 스위칭 주파수 성분의 용량성 결합을 제1출력권선(2-1)으로 생성한다. 제1결합부(31-1)에 의해 제1출력권선(2-1)으로 생성되는 용량성 결합의 크기는 첫번째 층의 PCB 면에서 제1결합부(27-1)가 차지하는 면적의 비율이 작을수록 작아지므로, 손 쉽게 조절이 가능하다. 도 9의 다층PCB부(3-4)에 있어서, 두번째 층에 위치하는 제2입력권선(26)의 제1권선(26-1)과 제2입력권선(26)의 시작 점과 끝 점 사이의 한 점에 연결된 도체 면(26-5)은, 첫번째 층의 도체가 없는 빈 면(31-4)에 의해 구성되는 제2결합부(31-2)를 통해서, 제1입력권선(25)이 제1출력권선(2-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합과 반대 극성의 스위칭 주파수 성분의 용량성 결합을 제1출력권선(2-1)으로 생성한다. 제1입력권선(25)도 첫번째 층의 제2결합부(31-2)를 통해서 제1출력권선(2-1)으로 스위칭 주파수 성분의 용량성 결합을 생성한다. 제2결합부(31-2)에 의해 제1출력권선(2-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합의 크기는, 제2입력권선(26)의 제1권선(26-1)과 도체 면(26-5)이 제1출력권선(2-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합으로부터 제1입력권선(25)이 제1출력권선(2-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합을 뺀 값이다. 제2결합부(31-2)에 의해 제1출력권선(2-1)으로 생성되는 용량성 결합의 크기는, 제2결합부(31-2)의 면적이 클수록 크고, 제2입력권선(26)의 제1권선(26-1)의 턴 수와 제2권선(26-2)의 턴 수가 클수록 크고, 도체 면(26-5)의 면적이 클수록 크고, 제1결합부(31-1)의 면적이 작을수록 크다. 그러므로, 다층PCB부(3-4)의 제1결합부(31-1)와 제2결합부(31-2)에 의해 제1출력권선(2-1)으로 생성되는 용량성 결합의 합의 크기와 극성은, 첫번째 층의 PCB 면에서 제1결합부(31-1)와 제2결합부(31-2)가 차지하는 면적의 비율의 조절을 포함하여, 여러가지 방법에 의해 손쉽게 설정할 수 있다. 또한, 제1결합부(31-1)와 제2결합부(31-2)와 제3결합부(28)에 의해 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성되는 용량성 결합의 합의 크기와 극성도 손쉽게 설정할 수 있다.In the multilayer PCB part 3-4 of FIG. 9, the first coupling part 31-1 constituted by the conductor surface 31-3 connected to the electrical ground of the primary side of the power supply device is a first input The capacitive coupling of the switching frequency components of the same polarity as the capacitive coupling of the switching frequency components generated by the first output winding 2-1 by the winding 25 is generated as the first output winding 2-1. The size of the capacitive coupling created by the first coupling part 31-1 to the first output winding 2-1 is the ratio of the area occupied by the first coupling part 27-1 on the PCB surface of the first layer. The smaller it is, the smaller it is, so it can be easily adjusted by hand. In the multilayer PCB unit 3-4 of FIG. 9, between the start and end points of the first winding 26-1 and the second input winding 26 of the second input winding 26 located on the second layer. The conductor face 26-5 connected to a point of the first input winding 25 is through a second coupling portion 31-2 constituted by a blank face 31-4 without a conductor of the first layer. The capacitive coupling of the switching frequency components generated by the first output winding 2-1 and the capacitive coupling of the switching frequency components of the opposite polarity are generated by the first output winding 2-1. The first input winding 25 also generates a capacitive coupling of the switching frequency components to the first output winding 2-1 through the second coupling portion 31-2 of the first layer. The magnitude of the capacitive coupling of the switching frequency component generated by the first output winding 2-1 by the second coupling unit 31-2 is the first winding 26-1 of the second input winding 26 The first input winding (25) is created as the first output winding (2-1) from the sum of the capacitive coupling of the switching frequency components generated by the transient conductor surface (26-5) as the first output winding (2-1). Is the value obtained by subtracting the capacitive coupling of the switching frequency components. The size of the capacitive coupling generated by the second coupling part 31-2 to the first output winding 2-1 is larger as the area of the second coupling part 31-2 increases, and the second input winding ( The larger the number of turns of the first winding 26-1 of 26) and the number of turns of the second winding 26-2, the larger the number of turns, the larger the area of the conductor surface 26-5, the larger the first coupling portion 31-1. The smaller the area of) is, the larger it is. Therefore, the size of the sum of the capacitive couplings generated by the first output winding 2-1 by the first coupling portion 31-1 and the second coupling portion 31-2 of the multilayer PCB portion 3-4 The polarity of and can be easily set by various methods, including adjusting the ratio of the area occupied by the first coupling portion 31-1 and the second coupling portion 31-2 on the PCB surface of the first layer. In addition, the first output winding (2-1) and the second output winding (4-1) by the first coupling portion (31-1), the second coupling portion (31-2) and the third coupling portion (28) The size and polarity of the sum of the capacitive bonds produced by can also be easily set.
따라서, 다층PCB부(3-4)를 사용하는 도 4의 전원 장치는, 다층PCB부(3-4)의 제1결합부(31-1)와 제2결합부(31-2)와 제3결합부(28)에 의해 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합의 합의 크기와 극성을 적절히 설정하여, 전원 장치의 1차측의 모든 요소들이 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합을 “영”에 근접시키며, 전원장치의 출력선로의 스위칭 주파수 성분의 noise를 아주 낮게 낮춘다.Accordingly, in the power supply device of FIG. 4 using the multilayer PCB unit 3-4, the first coupling unit 31-1 and the second coupling unit 31-2 and the second coupling unit 31-2 of the multilayer PCB unit 3-4 are provided. The size and polarity of the sum of the capacitive couplings of the switching frequency components generated by the first output winding 2-1 and the second output winding 4-1 by the three coupling unit 28 are appropriately set, The sum of the capacitive coupling of the switching frequency components generated by the first output winding (2-1) and the second output winding (4-1) of all the elements on the primary side is close to "zero", and the output line of the power supply The noise of the switching frequency component of is very low.
단, 도 9의 다층PCB부(3-4)의 실시예는, 제2입력권선(26)의 제1권선(26-1)과 제2입력권선(26)의 제1권선(26-1)의 시작점에 연결된 도체 면(26-5)이 제1출력권선(2-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합이 제1입력권선(25)이 제1출력권선(2-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합보다 큰 경우에만 적용 가능하다.However, in the embodiment of the multilayer PCB unit 3-4 of FIG. 9, the first winding 26-1 of the second input winding 26 and the first winding 26-1 of the second input winding 26 ), the capacitive coupling of the switching frequency components generated by the first output winding (2-1) by the conductor surface (26-5) connected to the starting point of the first input winding (25) is the first output winding (2-1) It is applicable only when it is greater than the capacitive coupling of the switching frequency component generated by
도 10은 본 발명의 또 다른 일 실시예인 6층의 PCB면에 의해 구성된 다층PCB부(3-5)를 보이며, 다층PCB부(3-5)는 도 4의 전원 장치의 다층PCB부(3-1)를 대체할 수 있다.FIG. 10 shows a multilayer PCB unit 3-5 composed of a six-layer PCB surface, which is another embodiment of the present invention, and the multilayer PCB unit 3-5 is a multilayer PCB unit 3 of the power supply device of FIG. 4. Can be substituted for -1).
도 10의 다층PCB부(3-5)는, 첫째 층의 PCB 면에 제1결합부(32-1)와 제2결합부(32-2)가 구성되고, 둘째층의 PCB 면에 도 4의 전원 장치의 1차측의 전기적인 접지에 연결되는 도체 면(26-7)과 제2입력권선(26)의 제1권선(26-1)이 구성되고, 셋째 층부터 다섯째 층의 PCB 면에 제1입력권선(25)의 제2권선(25-2) 내지 제4권선(25-4)이 구성되고, 끝 층의 PCB 면에 제3결합부(28)가 구성된다. 제1결합부(32-1)는 첫째 층의 PCB 면에서 제1입력권선(25)의 제1권선(25-1)과 제1권선(25-1)의 일부분에 연결되는 제1도체면(25-5)에 의해 구성된다. 제2결합부(32-2)는 첫째 층의 PCB 면에서 도체가 없는 빈 면(32-4)에 의해 구성된다. 제3결합부(28)는, 제2입력권선(26)의 제2권선(26-2)에 의해 구성된다.In the multilayer PCB part 3-5 of FIG. 10, a first coupling portion 32-1 and a second coupling portion 32-2 are formed on the first-layer PCB surface, and FIG. 4 is formed on the second-layer PCB surface. The first winding 26-1 of the second input winding 26 and the conductor side 26-7 connected to the electrical ground of the primary side of the power supply of the power supply unit are formed, and the PCB surface of the third layer to the fifth layer is formed. The second winding 25-2 to the fourth winding 25-4 of the first input winding 25 are formed, and a third coupling part 28 is formed on the PCB surface of the end layer. The first coupling part 32-1 is a first conductor surface connected to a part of the first winding 25-1 and the first winding 25-1 of the first input winding 25 on the PCB surface of the first layer. It is composed by (25-5). The second coupling portion 32-2 is constituted by an empty surface 32-4 without a conductor in the first layer of the PCB surface. The 3rd coupling part 28 is comprised by the 2nd winding 26-2 of the 2nd input winding 26.
도 10의 다층PCB부(3-5)에 있어서, 제1입력권선(25)의 제1권선(25-1)의 시작점은 단자(c)에 연결된다. 제1입력권선(25)의 제1권선(25-1)과 제2권선(25-2)과 제3권선(25-3)의 끝점은, Through Hole(g와 h와 f)을 통해서, 제1입력권선(25)의 제2권선(25-2)과 제3권선(25-3)과 제4권선(25-4)의 시작점에 연결된다. 제1입력권선(25)의 제4권선(25-4)의 끝 점은 단자(d)에 연결된다. 제2입력권선(26)의 제1권선(26-1)의 시작점은 단자(b)에 연결되고, 제2입력권선(26)의 제1권선(26-1)의 끝 점은 Through Hole(e)을 통해서 제2입력권선(26)의 제2권선(26-2)의 시작점에 연결된다. 제2입력권선(26)의 제2권선(26-2)의 끝 점은 단자(a)에 연결된다. In the multilayer PCB section 3-5 of FIG. 10, the starting point of the first winding 25-1 of the first input winding 25 is connected to the terminal c. The end points of the first winding 25-1, the second winding 25-2, and the third winding 25-3 of the first input winding 25 are through holes (g and h and f), The first input winding 25 is connected to the starting points of the second winding 25-2, the third winding 25-3, and the fourth winding 25-4. The end point of the fourth winding 25-4 of the first input winding 25 is connected to the terminal d. The starting point of the first winding 26-1 of the second input winding 26 is connected to the terminal b, and the end point of the first winding 26-1 of the second input winding 26 is Through Hole ( It is connected to the starting point of the second winding 26-2 of the second input winding 26 through e). The end point of the second winding 26-2 of the second input winding 26 is connected to the terminal (a).
도 10의 다층PCB부(3-5)에 있어서, 제1입력권선(25)의 제1권선(25-1)과 제1권선(25-1)에 연결되는 제1도체면(25-5)으로 구성되는 제1결합부(32-1)는 제1입력권선(25)으로부터 제1출력권선(2-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합과 같은 극성의 스위칭 주파수 성분의 용량성 결합을 제1출력권선(2-1)으로 생성한다. 제1결합부(32-1)에 의해 제1출력권선(2-1)으로 생성되는 용량성 결합의 크기는 제1결합부(32-1)를 구성하는 제1입력권선(25)의 제1권선(25-1)의 턴 수가 작을수록 작아지고, 제1도체면(25-5)의 면적이 작을수록 작아지므로, 손 쉽게 조절이 가능하다. In the multilayer PCB part 3-5 of FIG. 10, the first conductor surface 25-5 connected to the first winding 25-1 and the first winding 25-1 of the first input winding 25 The first coupling unit 32-1 consisting of) is the capacitance of the switching frequency component of the same polarity as the capacitive coupling of the switching frequency components generated from the first input winding 25 to the first output winding 2-1. The gender coupling is created with the first output winding (2-1). The size of the capacitive coupling generated by the first coupling part 32-1 into the first output winding 2-1 is the first input winding 25 constituting the first coupling part 32-1. The smaller the number of turns of one winding 25-1 is, the smaller it is, and the smaller the area of the first conductor surface 25-5 is, the smaller it is, so it can be easily adjusted by hand.
도 10의 다층PCB부(3-5)에 있어서, 두번째 층에 위치하는 제2입력권선(26)의 제1권선(26-1)과 전원 장치의 1차측의 전기적인 접지에 연결되는 도체 면(26-7)은, 첫번째 층의 도체가 없는 빈 면(32-4)을 통해서, 제1입력권선(25)이 제1출력권선(2-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합과 반대 극성의 스위칭 주파수 성분의 용량성 결합을 제1출력권선(2-1)으로 생성한다. 제1입력권선(25)도 첫번째 층의 도체가 없는 빈 면(32-4)을 통해서 제1출력권선(2-1)으로 스위칭 주파수 성분의 용량성 결합을 생성한다. 도체가 없는 빈 면(32-4)은 제2결합부(32-2)를 구성한다. 제2결합부(32-2)에 의해서 제1출력권선(2-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합의 크기는 제2입력권선(26)의 제1권선(26-1)과 도체 면(26-7)이 제1출력권선(2-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합으로부터 제1입력권선(25)이 제1출력권선(2-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합을 뺀 값이다. 제2결합부(32-2)에 의해 제1출력권선(2-1)으로 생성되는 용량성 결합의 크기는 제2결합부(32-2)의 면적이 클수록 커지고, 제2입력권선(26)의 턴 수가 클수록 커지고, 도체 면(26-7)의 면적이 클수록 커지므로, 손 쉽게 조절이 가능하다. In the multilayer PCB part 3-5 of FIG. 10, the first winding 26-1 of the second input winding 26 located on the second layer and the conductor surface connected to the electrical ground of the primary side of the power supply device (26-7) is the capacitive coupling of the switching frequency components generated by the first input winding 25 as the first output winding 2-1 through the blank surface 32-4 without a conductor in the first layer. The capacitive coupling of the switching frequency component of the opposite polarity to is generated by the first output winding 2-1. The first input winding 25 also generates a capacitive coupling of the switching frequency components to the first output winding 2-1 through the blank surface 32-4 without a conductor of the first layer. The empty surface 32-4 without a conductor constitutes the second coupling portion 32-2. The magnitude of the capacitive coupling of the switching frequency component generated by the first output winding 2-1 by the second coupling unit 32-2 is equal to that of the first winding 26-1 of the second input winding 26. The switching frequency generated by the first input winding 25 by the first output winding 2-1 from the capacitive coupling of the switching frequency components generated by the conductor surface 26-7 by the first output winding 2-1 It is the value minus the capacitive binding of the component. The size of the capacitive coupling generated by the second coupling part 32-2 to the first output winding 2-1 increases as the area of the second coupling part 32-2 increases, and the second input winding 26 ), the larger the number of turns, the larger the area, and the larger the area of the conductor surface 26-7 is, the easier adjustment is possible.
그러므로, 다층PCB부(3-5)의 제1결합부(32-1)와 제2결합부(32-2)가 제1출력권선(2-1)으로 생성하는 용량성 결합의 합의 크기와 극성은 첫번째 층의 PCB 면에서 제1결합부(32-1)와 제2결합부(32-2)가 차지하는 면적의 비율의 조정에 의해 손쉽게 설정할 수 있다. 또한, 제1결합부(32-1)와 제2결합부(32-2)와 제3결합부(28)에 의해 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성되는 용량성 결합의 합의 크기와 극성도 손쉽게 설정할 수 있다.Therefore, the size of the sum of the capacitive couplings generated by the first coupling portion 32-1 and the second coupling portion 32-2 of the multilayer PCB portion 3-5 and the first output winding 2-1 The polarity can be easily set by adjusting the ratio of the area occupied by the first coupling portion 32-1 and the second coupling portion 32-2 on the PCB surface of the first layer. In addition, the first output winding (2-1) and the second output winding (4-1) by the first coupling portion (32-1), the second coupling portion (32-2) and the third coupling portion (28) The size and polarity of the sum of the capacitive bonds produced by can also be easily set.
따라서, 다층PCB부(3-5)를 사용하는 도 4의 전원 장치는, 다층PCB부(3-5)의 제1결합부(32-1)와 제2결합부(32-2)와 제3결합부(28)에 의해 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합의 합의 크기와 극성을 적절히 설정하여, 전원 장치의 1차측의 모든 요소들이 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합을 “영”에 근접시키며, 전원장치의 출력선로의 스위칭 주파수 성분의 noise를 아주 낮게 낮춘다.Accordingly, in the power supply device of FIG. 4 using the multilayer PCB unit 3-5, the first coupling unit 32-1 and the second coupling unit 32-2 and the second coupling unit 32-2 of the multilayer PCB unit 3-5 are provided. The size and polarity of the sum of the capacitive couplings of the switching frequency components generated by the first output winding 2-1 and the second output winding 4-1 by the three coupling unit 28 are appropriately set, The sum of the capacitive coupling of the switching frequency components generated by the first output winding (2-1) and the second output winding (4-1) of all the elements on the primary side is close to "zero", and the output line of the power supply The noise of the switching frequency component of is very low.
도 10의 다층PCB부(3-5)의 실시예는, 제2입력권선(26)의 제1권선(26-1)과 도체 면(26-7)이 제1출력권선(2-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합이 제1입력권선(25)이 제1출력권선(2-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합보다 큰 경우에만 적용 가능하다.In the embodiment of the multilayer PCB part 3-5 of FIG. 10, the first winding 26-1 and the conductor surface 26-7 of the second input winding 26 are the first output winding 2-1. It is applicable only when the capacitive coupling of the switching frequency components generated by the first input winding 25 is larger than the capacitive coupling of the switching frequency components generated by the first output winding 2-1.
도 11은 본 발명의 또 다른 일 실시예인 6층의 PCB면에 의해 구성된 다층PCB부(3-6)를 보이며, 다층PCB부(3-6)는 도 4의 전원 장치의 다층PCB부(3-1)를 대체할 수 있다.FIG. 11 shows a multilayer PCB unit 3-6 composed of a six-layer PCB surface, which is another embodiment of the present invention, and the multilayer PCB unit 3-6 is a multilayer PCB unit 3 of the power supply device of FIG. 4. Can be substituted for -1).
도 11의 다층PCB부(3-6)는, 첫째 층의 PCB 면에 제1결합부(33-1)와 제2결합부(33-2)를 구성하고, 둘째층의 PCB 면에 제2입력권선(26)의 제1권선(26-1)과 제1입력권선(25)의 제2권선(25-2)을 구성하고, 셋째 층부터 다섯째 층의 PCB 면에 제1입력권선(25)의 제3권선(25-3) 내지 제5권선(25-5)을 구성하고, 끝 층의 PCB 면에 제3결합부(28)를 구성한다. 제1결합부(33-1)는 첫째 층의 PCB 면에서 단자(c)와 Through Hole(j)의 사이에 연결되는 제1입력권선(25)의 제1권선(25-1)에 의해 구성된다. 제2결합부(33-2)는 첫째 층의 PCB 면의 Through Hole(k)와 Through Hole(e)의 사이에 연결되는 제2입력권선(26)의 제2권선(26-2)에 의해 구성된다. 제3결합부(28)은 제2입력권선(26)의 제3권선(26-3)에 의해 구성된다.The multilayer PCB part 3-6 of FIG. 11 comprises a first coupling part 33-1 and a second coupling part 33-2 on the first-layer PCB surface, and a second coupling part 33-1 and a second coupling part 33-2 on the second-layer PCB surface. Configure the first winding 26-1 of the input winding 26 and the second winding 25-2 of the first input winding 25, and the first input winding 25 on the PCB surface of the third to fifth layers. ) Of the third winding 25-3 to the fifth winding 25-5, and a third coupling part 28 on the PCB surface of the end layer. The first coupling part 33-1 is constituted by the first winding 25-1 of the first input winding 25 connected between the terminal c and the through hole j on the first layer of the PCB. do. The second coupling part 33-2 is formed by the second winding 26-2 of the second input winding 26 connected between the Through Hole (k) and the Through Hole (e) on the PCB surface of the first layer. It is composed. The third coupling portion 28 is constituted by the third winding 26-3 of the second input winding 26.
도 11의 다층PCB부(3-6)에 있어서, 첫째 층의 PCB 면의 단자(c)와 Through Hole(j)의 사이에 제1입력권선(25)의 제1권선(25-1)이 연결된다. 첫째 층의 PCB 면의 Through Hole(k)와 Through Hole(e)의 사이에 제2입력권선(26)의 제2권선(26-2)이 연결된다. 둘째 층의 PCB 면의 단자(b)와 Through Hole(k) 사이에 제2입력권선(26)의 제1권선(26-1)이 연결되며, 둘째 층의 PCB 면의 Through Hole(j)와 Through Hole(g)의 사이에 제1입력권선(25)의 제2권선(25-2)이 연결된다. 제1입력권선(25)의 제1권선(25-1)과 제2권선(25-2)과 제3권선(25-3)과 제4권선(25-4)의 끝점은 Through Hole(j와 g와 h와 f)을 통해서 제1입력권선(25)의 제2권선(25-2)과 제3권선(25-3)과 제4권선(25-4)과 제5권선(25-5)의 시작점에 연결된다. 제1입력권선(25)의 제5권선(25-5)의 끝 점은 단자(d)에 연결된다. 제2입력권선(26)의 제1권선(26-1)과 제2권선(26-2)의 끝 점은 Through Hole(k와 e)을 통해서 제2입력권선(26)의 제2권선(26-2)와 제3권선(26-3)의 시작점에 연결된다. 제2입력권선(26)의 제3권선(26-3)의 끝 점은 단자(a)로 연결된다. In the multilayer PCB part 3-6 of FIG. 11, the first winding 25-1 of the first input winding 25 is between the terminal c of the first layer PCB and the through hole j. Connected. The second winding 26-2 of the second input winding 26 is connected between the Through Hole (k) and Through Hole (e) of the first layer of the PCB. The first winding (26-1) of the second input winding (26) is connected between the terminal (b) of the second layer PCB and the Through Hole (k), and the Through Hole (j) of the second layer PCB The second winding 25-2 of the first input winding 25 is connected between the through holes g. The end points of the first winding (25-1), the second winding (25-2), the third winding (25-3) and the fourth winding (25-4) of the first input winding (25) are through hole (j). And g, h and f), the second winding (25-2), the third winding (25-3), the fourth winding (25-4) and the fifth winding (25-) of the first input winding (25). It is connected to the starting point of 5). The end point of the fifth winding 25-5 of the first input winding 25 is connected to the terminal d. The end points of the first winding 26-1 and the second winding 26-2 of the second input winding 26 are passed through the through holes (k and e), and the second winding of the second input winding 26 ( It is connected to the starting point of 26-2) and the third winding 26-3. The end point of the third winding 26-3 of the second input winding 26 is connected to the terminal (a).
도4의 전원 장치에서, 제2입력권선(26)의 제1권선(26-1)과 제2권선(26-2)과 제3권선(26-3)의 전압의 합은, 도 4의 다이오드(15-1)와 캐패시터(16-1)에 의해 정류되고 평활되어, 제어부(14-1)에 전원 전압으로 공급된다. 또한, 제2입력권선(26)의 제1권선(26-1)과 제2권선(26-2)과 제3권선(26-3)의 전압의 합은, 도 4의 저항(17-1)과 저항(18-1)에 의해 분압되고 제어부(14-1)의 제어 입력으로 인가되어, 전원장치의 출력전압을 제어한다.In the power supply device of Fig. 4, the sum of the voltages of the first winding 26-1, the second winding 26-2, and the third winding 26-3 of the second input winding 26 is It is rectified and smoothed by the diode 15-1 and the capacitor 16-1, and supplied as a power supply voltage to the control unit 14-1. In addition, the sum of the voltages of the first winding 26-1, the second winding 26-2, and the third winding 26-3 of the second input winding 26 is the resistance 17-1 of FIG. ) And the resistance 18-1 and applied as a control input of the control unit 14-1 to control the output voltage of the power supply.
도 11의 다층PCB부(3-6)에 있어서, 제1결합부(33-1)를 구성하는 제1입력권선(25)의 제1권선(25-1)은 제1입력권선(25)으로부터 제1출력권선(2-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합과 같은 극성의 스위칭 주파수 성분의 용량성 결합을 제1출력권선(2-1)으로 생성한다. 제1결합부(33-1)가 제1출력권선(2-1)으로 생성하는 용량성 결합의 크기는, 제1입력권선(25)의 제1권선(25-1)의 턴 수가 작을수록 작아지고, 제1입력권선(25)의 제1권선(25-1)의 도체 면이 좁을수록 작아지므로, 손 쉽게 조절이 가능하다. 도 11의 다층PCB부(3-6)에 있어서, 제2결합부(33-2)를 구성하는 제2입력권선(26)의 제2권선(26-2)은 제1입력권선(25)으로부터 제1출력권선(2-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합과 반대 극성의 스위칭 주파수 성분의 용량성 결합을 제1출력권선(2-1)으로 생성한다. 제2결합부(33-2)가 제1출력권선(2-1)으로 생성하는 용량성 결합의 크기는 제2입력권선(26)의 제2권선(26-2)과 제3권선(26-3)의 턴 수가 클수록 커지고, 제2입력권선(26)의 제2권선(26-2)의 도체 면이 넓을수록 커지므로, 손 쉽게 조절이 가능하다. 그러므로, 다층PCB부(3-6)의 제1결합부(33-1)와 제2결합부(33-2)가 제1출력권선(2-1)으로 생성하는 용량성 결합의 합의 크기와 극성은 손쉽게 설정할 수 있다. 또한, 제1결합부(33-1)와 제2결합부(33-2)와 제3결합부(28)가 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 용량성 결합의 합의 크기와 극성도 손쉽게 설정할 수 있다.In the multilayer PCB unit 3-6 of FIG. 11, the first winding 25-1 of the first input winding 25 constituting the first coupling unit 33-1 is the first input winding 25. The capacitive coupling of the switching frequency components of the same polarity as the capacitive coupling of the switching frequency components generated from the first output winding 2-1 is generated as the first output winding 2-1. The size of the capacitive coupling generated by the first coupling unit 33-1 to the first output winding 2-1 is, as the number of turns of the first winding 25-1 of the first input winding 25 decreases. It becomes smaller, and the narrower the conductor surface of the first winding 25-1 of the first input winding 25 is, the smaller it is, so it can be easily adjusted by hand. In the multilayer PCB unit 3-6 of FIG. 11, the second winding 26-2 of the second input winding 26 constituting the second coupling unit 33-2 is the first input winding 25. The capacitive coupling of the switching frequency components generated from the first output winding 2-1 and the capacitive coupling of the switching frequency components of the opposite polarity are generated as the first output winding 2-1. The size of the capacitive coupling generated by the second coupling unit 33-2 to the first output winding 2-1 is the second winding 26-2 and the third winding 26 of the second input winding 26. As the number of turns of -3) increases, the number of turns increases, and the wider the conductor surface of the second winding 26-2 of the second input winding 26 increases, the easier adjustment is possible. Therefore, the size of the sum of the capacitive couplings generated by the first coupling portion 33-1 and the second coupling portion 33-2 of the multilayer PCB portion 3-6 and the first output winding 2-1 Polarity can be easily set. In addition, the first coupling portion (33-1), the second coupling portion (33-2) and the third coupling portion (28) are divided into the first output winding (2-1) and the second output winding (4-1). The size and polarity of the sum of the resulting capacitive bonds can also be easily set.
따라서, 다층PCB부(3-6)를 사용하는 도 4의 전원 장치는, 다층PCB부(3-6)의 제1결합부(33-1)와 제2결합부(33-2)와 제3결합부(28)가 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합의 크기와 극성을 적절히 설정하여, 전원 장치의 1차측의 모든 요소들이 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합을 “영”에 근접시키며, 전원장치의 출력선로의 스위칭 주파수 성분의 noise를 아주 낮게 낮춘다.Accordingly, in the power supply device of FIG. 4 using the multilayer PCB unit 3-6, the first coupling unit 33-1 and the second coupling unit 33-2 and the second coupling unit 33-2 of the multilayer PCB unit 3-6 are provided. By appropriately setting the size and polarity of the sum of capacitive couplings of the switching frequency components generated by the three-coupling unit 28 by the first output winding 2-1 and the second output winding 4-1, The sum of the capacitive coupling of the switching frequency components generated by the first and second output windings (2-1) and the second output windings (4-1) on the vehicle side is close to "zero", and the output line of the power supply is The noise of the switching frequency component is very low.
도시하지는 않았지만, 도 11의 다층PCB부(3-6)에 있어서, 제2결합부(33-2)는 제2입력권선(26)의 제2권선(26-2) 혹은 제3권선(26-3)에 의해 구성될 수도 있다.Although not shown, in the multilayer PCB unit 3-6 of FIG. 11, the second coupling unit 33-2 is the second winding 26-2 or the third winding 26 of the second input winding 26. It can also be configured by -3).
도 12는 본 발명의 또 다른 일 실시예인 6층의 PCB면에 의해 구성된 다층PCB부(3-7)를 보인다. 다층PCB부(3-7)는 도 4의 전원 장치의 다층PCB부(3-1)를 대체할 수 있다.12 shows a multilayer PCB part 3-7 formed by a six-layer PCB surface, which is another embodiment of the present invention. The multilayer PCB unit 3-7 may replace the multilayer PCB unit 3-1 of the power supply device of FIG. 4.
도 12의 다층PCB부(3-7)는, 첫째 층의 PCB 면에 제1결합부(34-1)와 제2결합부(34-2)를 구성하고, 둘째 층부터 다섯째 층의 PCB 면에 제1입력권선(25)의 제1권선(25-1) 내지 제4권선(25-4)을 구성하고, 끝 층의 PCB 면에 제3결합부(28)를 구성한다. 제1결합부(34-1)는 전원장치의 1차측의 전기적인 접지에 연결되는 도체 면(34-3)에 의해 구성된다. 제2결합부(34-2)는 제2입력권선(26)의 제1권선(26-1)과 제2입력권선(26)의 제1권선(26-1)의 일부분에 연결되는 도체 면(26-5)에 의해 구성된다. 제3결합부(28)는 제2입력권선(26)의 제2권선(26-2)에 의해 구성된다.The multilayer PCB part 3-7 of FIG. 12 comprises a first coupling part 34-1 and a second coupling part 34-2 on the PCB surface of the first layer, and the PCB surface of the second layer to the fifth layer. The first winding 25-1 to the fourth winding 25-4 of the first input winding 25 are formed, and a third coupling part 28 is formed on the PCB surface of the end layer. The first coupling portion 34-1 is constituted by a conductor surface 34-3 connected to the electrical ground of the primary side of the power supply device. The second coupling part 34-2 is a conductor surface connected to a part of the first winding 26-1 of the second input winding 26 and the first winding 26-1 of the second input winding 26 It is composed by (26-5). The third coupling portion 28 is constituted by the second winding 26-2 of the second input winding 26.
도 12의 다층PCB부(3-7)에 있어서, 제1결합부(34-1)를 구성하는 전원장치의 1차측의 전기적인 접지에 연결되는 도체 면(34-3)은 첫째 층의 PCB 면의 단자(a)에 연결된다. 제2결합부(34-2)를 구성하는 제2입력권선(26)의 제1권선(26-1)은 첫째 층의 PCB 면의 단자(b)와 Through Hole(e)의 사이에 연결된다. 제1입력권선(25)의 제1권선(25-1)의 시작점은 단자(c)에 연결된다. 제1입력권선(25)의 제1권선(25-1)과 제2권선(25-2)과 제3권선(25-3)의 끝점은 Through Hole(f와 i와 g)을 통해서 제1입력권선(25)의 제2권선(25-2)과 제3권선(25-3)과 제4권선(25-4)의 시작점에 연결된다. 제1입력권선(25)의 제4권선(25-4)의 끝 점은 단자(d)에 연결된다. 제2입력권선(26)의 제1권선(26-1)의 시작점은 단자(b)에 연결되고, 제2입력권선(26)의 제1권선(26-1)의 끝 점은 Through Hole(e)을 통해서 제2입력권선(26)의 제2권선(26-2)의 시작점에 연결된다. 제2입력권선(26)의 제2권선(26-2)의 끝 점은 단자(a)에 연결된다.In the multilayer PCB part 3-7 of FIG. 12, the conductor surface 34-3 connected to the electrical ground of the primary side of the power supply device constituting the first coupling part 34-1 is a first-layer PCB It is connected to the terminal (a) on the side. The first winding 26-1 of the second input winding 26 constituting the second coupling portion 34-2 is connected between the terminal (b) of the PCB surface of the first layer and the through hole (e). . The starting point of the first winding 25-1 of the first input winding 25 is connected to the terminal c. The end points of the first winding (25-1), the second winding (25-2), and the third winding (25-3) of the first input winding (25) are the first through holes (f and i and g). It is connected to the starting points of the second winding 25-2, the third winding 25-3, and the fourth winding 25-4 of the input winding 25. The end point of the fourth winding 25-4 of the first input winding 25 is connected to the terminal d. The starting point of the first winding 26-1 of the second input winding 26 is connected to the terminal b, and the end point of the first winding 26-1 of the second input winding 26 is Through Hole ( It is connected to the starting point of the second winding 26-2 of the second input winding 26 through e). The end point of the second winding 26-2 of the second input winding 26 is connected to the terminal (a).
도 13은 본 발명의 또 다른 일 실시예인 6층의 PCB면에 의해 구성된 다층PCB부(3-8)를 보인다. 다층PCB부(3-8)는 도 4의 전원 장치의 다층PCB부(3-1)를 대체할 수 있다.13 shows a multilayer PCB part 3-8 composed of a six-layer PCB surface, which is another embodiment of the present invention. The multilayer PCB unit 3-8 may replace the multilayer PCB unit 3-1 of the power supply device of FIG. 4.
도 13의 다층PCB부(3-8)는, 첫째 층의 PCB 면에 제1결합부(34-1)와 제2결합부(34-2)를 구성하고, 둘째층의 PCB 면의 대부분의 면적에 전원장치의 1차측의 전기적인 접지에 연결되는 도체 면(35)을 구성하고, 둘째층의 PCB 면의 일부분의 면적에 단자 (d)와 Through hole(g)를 연결하는 통로를 구성하고, 셋째 층부터 다섯째 층의 PCB 면에 각각 제1입력권선(25)의 제1권선(25-1) 내지 제3권선(25-3)을 구성하고, 끝 층의 PCB 면에 제3결합부(28)를 구성한다. 제1결합부(34-1)는 전원장치의 1차측의 전기적인 접지에 연결되는 도체 면(34-3)에 의해 구성된다. 제2결합부(34-2)는 제2입력권선(26)의 제1권선(26-1)과 제2입력권선(26)의 제1권선(26-1)의 일부분에 연결되는 도체 면(26-5)에 의해 구성된다. 제3결합부(28)는 제2입력권선(26)의 제2권선(26-2)에 의해 구성된다. 둘째층의 PCB 면에 구성되는 도체 면(35)은 제1입력권선(25)이 제1출력권선(2-1)과 용량성으로 결합하는 것을 효과적으로 차단한다.The multilayer PCB part 3-8 of FIG. 13 comprises a first coupling part 34-1 and a second coupling part 34-2 on the first-layer PCB surface, and most of the second-layer PCB surface In the area, a conductor surface 35 connected to the electrical ground of the primary side of the power supply device is formed, and a passage connecting the terminal (d) and the through hole (g) is formed in a partial area of the PCB surface of the second layer. , Compose the first winding (25-1) to the third winding (25-3) of the first input winding (25) on the PCB of the third to fifth layers, respectively, and a third coupling part on the PCB surface of the end layer. Make up (28). The first coupling portion 34-1 is constituted by a conductor surface 34-3 connected to the electrical ground of the primary side of the power supply device. The second coupling part 34-2 is a conductor surface connected to a part of the first winding 26-1 of the second input winding 26 and the first winding 26-1 of the second input winding 26 It is composed by (26-5). The third coupling portion 28 is constituted by the second winding 26-2 of the second input winding 26. The conductor surface 35 formed on the second-layer PCB surface effectively blocks the first input winding 25 from capacitively coupling with the first output winding 2-1.
도 13의 다층PCB부(3-8)에 있어서, 제1입력권선(25)의 제1권선(25-1)의 시작점은 단자(c)에 연결된다. 제1입력권선(25)의 제1권선(25-1)과 제2권선(25-2)의 끝점은 Through Hole(f와 i)을 통해서 제1입력권선(25)의 제2권선(25-2)과 제3권선(25-3)의 시작점에 연결된다. 제1입력권선(25)의 제3권선(25-3)의 끝 점은 Through hole(g)를 통해서 단자(d)에 연결된다. 제2입력권선(26)의 제1권선(26-1)의 시작점은 단자(b)에 연결되고, 제2입력권선(26)의 제1권선(26-1)의 끝 점은 Through Hole(e)을 통해서 제2입력권선(26)의 제2권선(26-2)의 시작점에 연결된다. 제2입력권선(26)의 제2권선(26-2)의 끝 점은 단자(a)에 연결된다. 제1결합부(34-1)의 도체 면(34-3)은 단자(a)에 연결된다. 도체 면(35)는 단자(a)에 연결된다.In the multilayer PCB part 3-8 of FIG. 13, the starting point of the first winding 25-1 of the first input winding 25 is connected to the terminal c. The end points of the first winding 25-1 and the second winding 25-2 of the first input winding 25 are connected to the second winding 25 of the first input winding 25 through through holes f and i. It is connected to the starting point of -2) and the third winding (25-3). The end point of the third winding 25-3 of the first input winding 25 is connected to the terminal d through the through hole g. The starting point of the first winding 26-1 of the second input winding 26 is connected to the terminal b, and the end point of the first winding 26-1 of the second input winding 26 is Through Hole ( It is connected to the starting point of the second winding 26-2 of the second input winding 26 through e). The end point of the second winding 26-2 of the second input winding 26 is connected to the terminal (a). The conductor surface 34-3 of the first coupling portion 34-1 is connected to the terminal (a). The conductor face 35 is connected to the terminal a.
도 12 혹은 도 13의 다층PCB부(3-7 혹은 3-8)에 있어서, 전원장치의 1차측의 전기적인 접지에 연결되는 도체 면(34-3)으로 구성되는 제1결합부(34-1)는 제1입력권선(25)으로부터 제1출력권선(2-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합과 같은 극성의 스위칭 주파수 성분의 용량성 결합을 제1출력권선(2-1)으로 생성한다. 제1결합부(34-1)가 제1출력권선(2-1)으로 생성하는 용량성 결합의 크기는 제1결합부(34-1)를 구성하는 도체 면(34-3)의 면적이 작을수록 작아지므로, 손 쉽게 조절이 가능하다. 도 12 혹은 도 13의 다층PCB부(3-7 혹은 3-8)에 있어서, 제2입력권선(26)의 제1권선(26-1)과 제2입력권선(26)의 제1권선(26-1)의 일부분에 연결되는 도체 면(26-5)에 의해 구성되는 제2결합부(34-2)는 제1입력권선(25)으로부터 제1출력권선(2-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합과 반대 극성의 스위칭 주파수 성분의 용량성 결합을 제1출력권선(2-1)으로 생성한다. 제2결합부(34-2)가 제1출력권선(2-1)으로 생성하는 용량성 결합의 크기는 제2입력권선(26)의 제1권선(26-1)의 턴 수와 제2권선(26-2)의 턴 수가 클수록 커지고, 도체 면(26-5)의 면적이 클수록 커지므로, 손 쉽게 조절이 가능하다. 그러므로, 다층PCB부(3-7 혹은 3-8)의 제1결합부(34-1)와 제2결합부(34-2)에 의해 제1출력권선(2-1)으로 생성되는 용량성 결합의 합의 크기와 극성은 손쉽게 설정할 수 있다. 또한, 제1결합부(34-1)와 제2결합부(34-2)와 제3결합부(28)에 의해 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성되는 용량성 결합의 합의 크기와 극성도 손쉽게 설정할 수 있다.In the multilayer PCB section 3-7 or 3-8 of FIG. 12 or 13, the first coupling portion 34- consisting of a conductor surface 34-3 connected to the electrical ground of the primary side of the power supply device. 1) is the capacitive coupling of the switching frequency components of the same polarity as the capacitive coupling of the switching frequency components generated from the first input winding 25 to the first output winding 2-1. ). The size of the capacitive coupling generated by the first coupling part 34-1 to the first output winding 2-1 is the area of the conductor surface 34-3 constituting the first coupling part 34-1. The smaller it is, the smaller it is, so it can be easily adjusted by hand. In the multilayer PCB unit 3-7 or 3-8 of FIG. 12 or 13, the first winding 26-1 of the second input winding 26 and the first winding of the second input winding 26 ( The second coupling part 34-2 formed by the conductor surface 26-5 connected to a part of 26-1) is generated from the first input winding 25 to the first output winding 2-1. The capacitive coupling of the switching frequency component and the capacitive coupling of the switching frequency component of opposite polarity are generated by the first output winding 2-1. The size of the capacitive coupling generated by the second coupling unit 34-2 to the first output winding 2-1 is the number of turns of the first winding 26-1 of the second input winding 26 and the second The larger the number of turns of the winding 26-2 is, the larger is, and the larger the area of the conductor surface 26-5 is, the larger is, so it can be easily adjusted by hand. Therefore, the capacitive generated by the first output winding (2-1) by the first coupling portion (34-1) and the second coupling portion (34-2) of the multilayer PCB portion (3-7 or 3-8) The size and polarity of the sum of bonds can be easily set. In addition, the first output winding (2-1) and the second output winding (4-1) by the first coupling portion (34-1), the second coupling portion (34-2) and the third coupling portion (28). The size and polarity of the sum of the capacitive bonds produced by can also be easily set.
따라서, 다층PCB부(3-7 혹은 3-8)를 사용하는 도 4의 전원 장치는, 다층PCB부(3-7 혹은 3-8)의 제1결합부(34-1)와 제2결합부(34-2)와 제3결합부(28)에 의해 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합의 합의 크기와 극성을 적절히 설정하여, 전원 장치의 1차측의 모든 요소들이 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합을 “영”에 근접시키며, 전원장치의 출력선로의 스위칭 주파수 성분의 noise를 아주 낮게 낮춘다.Therefore, in the power supply device of FIG. 4 using the multilayer PCB unit 3-7 or 3-8, the first coupling unit 34-1 and the second coupling unit of the multilayer PCB unit 3-7 or 3-8 The size and polarity of the sum of capacitive coupling of switching frequency components generated by the first output winding (2-1) and the second output winding (4-1) by the part 34-2 and the third coupling part 28 By setting appropriately, the sum of the capacitive coupling of the switching frequency components generated by the first output winding (2-1) and the second output winding (4-1) by all the elements on the primary side of the power supply is "zero". Close, and very low the noise of the switching frequency component of the output line of the power supply.
도시하지는 않았지만, 도 12나 도 13의 다층PCB부(3-7 혹은 3-8)에 있어서, 제2결합부(34-2)는 제2입력권선(26)의 제1권선(26-1) 대신 제2입력권선(26)의 제2권선(26-2)에 의해 구성될 수도 있다. 이 경우, 제3결합부(28)는 제2입력권선(26)의 제1권선(26-1)에 의해 구성된다.Although not shown, in the multilayer PCB unit 3-7 or 3-8 of Figs. 12 and 13, the second coupling unit 34-2 is the first winding 26-1 of the second input winding 26. ) May be configured by the second winding 26-2 of the second input winding 26 instead. In this case, the third coupling portion 28 is constituted by the first winding 26-1 of the second input winding 26.
도 14는 본 발명의 또 다른 일 실시예인 6층의 PCB면에 의해 구성된 다층PCB부(3-11)를 보인다. 다층PCB부(3-11)는 도 4의 전원 장치의 다층PCB부(3-1)를 대체할 수 있다.14 shows a multilayer PCB part 3-11 formed by a 6-layer PCB surface, which is another embodiment of the present invention. The multilayer PCB unit 3-11 may replace the multilayer PCB unit 3-1 of the power supply device of FIG. 4.
도 14의 다층PCB부(3-11)는, 첫째 층의 PCB 면에 제1결합부(37-1)와 제2결합부(37-2)를 구성하고, 둘째 층부터 다섯째 층의 PCB 면에 제1입력권선(25)의 제1권선(25-1) 내지 제4권선(25-4)을 구성하고, 끝 층의 PCB 면에 제3결합부(28a)를 구성한다. 제1결합부(37-1)는 전원장치의 1차측의 전기적인 접지에 연결되는 도체 면(37-3)에 의해 구성된다. 제2결합부(37-2)는 제2입력권선(26)의 제1권선(26-1)에 의해 구성된다. 제3결합부(28a)는 제2입력권선(26)의 제1권선(26-1)의 시작점에 연결되는 도체 면(26-5)과 제2입력권선(26)의 제2권선(26-2)에 의해 구성된다. The multilayer PCB part 3-11 of FIG. 14 comprises a first coupling part 37-1 and a second coupling part 37-2 on the first layer of the PCB, and the second to fifth layers of the PCB The first winding 25-1 to the fourth winding 25-4 of the first input winding 25 are formed, and a third coupling part 28a is formed on the PCB surface of the end layer. The first coupling portion 37-1 is constituted by a conductor surface 37-3 connected to the electrical ground of the primary side of the power supply device. The second coupling portion 37-2 is constituted by the first winding 26-1 of the second input winding 26. The third coupling portion 28a includes a conductor surface 26-5 connected to the starting point of the first winding 26-1 of the second input winding 26 and the second winding 26 of the second input winding 26. It is composed by -2).
도 14의 다층PCB부(3-11)에 있어서, 제1입력권선(25)의 제1권선(25-1)의 시작점은 단자(c)에 연결된다. 제1입력권선(25)의 제1권선(25-1)과 제2권선(25-2)과 제3권선(25-3)의 끝점은 Through Hole(f와 i와 g)을 통해서 제1입력권선(25)의 제2권선(25-2)과 제3권선(25-3)과 제4권선(25-4)의 시작점에 연결된다. 제1입력권선(25)의 제4권선(25-4)의 끝 점은 단자(d)에 연결된다. 제2입력권선(26)의 제1권선(26-1)의 시작점은 단자(b)에 연결되고, 제2입력권선(26)의 제1권선(26-1)의 끝 점은 Through Hole(e)을 통해서 제2입력권선(26)의 제2권선(26-2)의 시작점에 연결된다. 제2입력권선(26)의 제2권선(26-2)의 끝 점은 단자(a)에 연결된다. 도체 면(26-5)은 단자(b)에 연결된다. 제1결합부(37-1)를 구성하는 도체 면(37-3)은 단자(a)에 연결된다.In the multilayer PCB part 3-11 of FIG. 14, the starting point of the first winding 25-1 of the first input winding 25 is connected to the terminal c. The end points of the first winding (25-1), the second winding (25-2), and the third winding (25-3) of the first input winding (25) are the first through holes (f and i and g). It is connected to the starting points of the second winding 25-2, the third winding 25-3, and the fourth winding 25-4 of the input winding 25. The end point of the fourth winding 25-4 of the first input winding 25 is connected to the terminal d. The starting point of the first winding 26-1 of the second input winding 26 is connected to the terminal b, and the end point of the first winding 26-1 of the second input winding 26 is Through Hole ( It is connected to the starting point of the second winding 26-2 of the second input winding 26 through e). The end point of the second winding 26-2 of the second input winding 26 is connected to the terminal (a). The conductor face 26-5 is connected to the terminal b. The conductor surface 37-3 constituting the first coupling portion 37-1 is connected to the terminal a.
도 14의 다층PCB부(3-11)에 있어서, 전원장치의 1차측의 전기적인 접지에 연결되는 도체 면(37-3)으로 구성되는 제1결합부(37-1)는 제1입력권선(25)으로부터 제1출력권선(2-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합과 같은 극성의 스위칭 주파수 성분의 용량성 결합을 제1출력권선(2-1)으로 생성한다. 제1결합부(37-1)가 제1출력권선(2-1)으로 생성하는 용량성 결합의 크기는 제1결합부(37-1)를 구성하는 도체 면(37-3)의 면적이 작을수록 작아지므로, 손 쉽게 조절이 가능하다. 도 14의 다층PCB부(3-11)에 있어서, 제2입력권선(26)의 제1권선(26-1)에 의해 구성되는 제2결합부(37-2)는 제1입력권선(25)으로부터 제1출력권선(2-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합과 반대 극성의 스위칭 주파수 성분의 용량성 결합을 제1출력권선(2-1)으로 생성한다. 제2결합부(37-2)가 제1출력권선(2-1)으로 생성하는 용량성 결합의 크기는 제2입력권선(26)의 제1권선(26-1)의 턴 수와 제2권선(26-2)의 턴 수가 클수록 커지므로, 손 쉽게 조절이 가능하다. 그러므로, 다층PCB부(3-11)의 제1결합부(37-1)와 제2결합부(37-2)가 제1출력권선(2-1)으로 생성하는 용량성 결합의 합의 크기와 극성은 손쉽게 설정할 수 있다. 또한, 제1결합부(37-1)와 제2결합부(37-2)와 제3결합부(28a)가 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 용량성 결합의 합의 크기와 극성도 손쉽게 설정할 수 있다.In the multilayer PCB part 3-11 of FIG. 14, the first coupling part 37-1 composed of a conductor surface 37-3 connected to the electrical ground of the primary side of the power supply device is a first input winding. Capacitive coupling of switching frequency components of the same polarity as the capacitive coupling of switching frequency components generated from (25) to the first output winding 2-1 is generated as the first output winding 2-1. The size of the capacitive coupling generated by the first coupling part 37-1 to the first output winding 2-1 is the area of the conductor surface 37-3 constituting the first coupling part 37-1. The smaller it is, the smaller it is, so it can be easily adjusted by hand. In the multilayer PCB unit 3-11 of FIG. 14, the second coupling portion 37-2 constituted by the first winding 26-1 of the second input winding 26 is a first input winding 25. A capacitive coupling of the switching frequency component generated from the first output winding 2-1 and the capacitive coupling of the switching frequency component of the opposite polarity are generated as the first output winding 2-1. The size of the capacitive coupling generated by the second coupling part 37-2 to the first output winding 2-1 is the number of turns of the first winding 26-1 of the second input winding 26 and the second Since the number of turns of the winding 26-2 increases, it can be easily adjusted. Therefore, the size of the sum of the capacitive couplings generated by the first coupling portion 37-1 and the second coupling portion 37-2 of the multilayer PCB portion 3-11 and the first output winding 2-1 Polarity can be easily set. In addition, the first coupling portion 37-1, the second coupling portion 37-2, and the third coupling portion 28a are formed into the first output winding 2-1 and the second output winding 4-1. The size and polarity of the sum of the resulting capacitive bonds can also be easily set.
따라서, 다층PCB부(3-11)를 사용하는 도 4의 전원 장치는, 다층PCB부(3-11)의 제1결합부(37-1)와 제2결합부(37-2)와 제3결합부(28a)가 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합의 크기와 극성을 적절히 설정하여, 전원 장치의 1차측의 모든 요소들이 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합을 “영”에 근접시키며, 전원장치의 출력선로의 스위칭 주파수 성분의 noise를 아주 낮게 낮춘다.Accordingly, in the power supply device of FIG. 4 using the multilayer PCB unit 3-11, the first coupling portion 37-1 and the second coupling portion 37-2 and the second coupling portion 37-2 of the multilayer PCB unit 3-11 By appropriately setting the size and polarity of the sum of capacitive couplings of the switching frequency components generated by the three-coupler 28a of the first output winding 2-1 and the second output winding 4-1, The sum of the capacitive coupling of the switching frequency components generated by the first and second output windings (2-1) and the second output windings (4-1) on the vehicle side is close to "zero", and the output line of the power supply is The noise of the switching frequency component is very low.
도 15는 본 발명의 또 다른 일 실시예인 6층의 PCB면에 의해 구성된 다층PCB부(3-12)를 보이며, 다층PCB부(3-12)는 도 4의 전원 장치의 다층PCB부(3-1)를 대체할 수 있다.15 shows a multilayer PCB unit 3-12 composed of a six-layer PCB surface, which is another embodiment of the present invention, and the multilayer PCB unit 3-12 is a multilayer PCB unit 3 of the power supply device of Fig. 4. Can be substituted for -1).
도 15의 다층PCB부(3-12)는, 첫째 층의 PCB 면에 제1결합부(38-1)와 제2결합부(38-2)를 구성하고, 둘째층의 PCB 면에 제2입력권선(26)의 제1권선(26-1)을 구성하고, 셋째 층부터 다섯째 층의 PCB 면에 제1입력권선(25)의 제1권선(25-1) 내지 제3권선(25-3)을 구성하고, 여섯째 층의 면에 제3결합부(28)를 구성한다. 제1결합부(38-1)는 전원 장치의 1차측의 전기적인 접지에 연결되는 도체 면(38-3)으로 구성된다. 제2결합부(38-2)는 도체가 없는 빈 면(38-4)으로 구성된다. 제3결합부(28)는 제2입력권선(26)의 제2권선(26-2)으로 구성된다.The multilayer PCB part 3-12 of FIG. 15 includes a first coupling part 38-1 and a second coupling part 38-2 on the PCB surface of the first layer, and a second coupling part 38-1 on the PCB surface of the second layer. The first winding 26-1 of the input winding 26 is formed, and the first winding 25-1 to the third winding 25- of the first input winding 25 are formed on the PCB surface of the third to fifth layers. 3), and a third coupling part 28 on the surface of the sixth layer. The first coupling portion 38-1 is composed of a conductor surface 38-3 connected to the electrical ground of the primary side of the power supply. The second coupling portion 38-2 is composed of an empty surface 38-4 without a conductor. The third coupling unit 28 is composed of the second winding 26-2 of the second input winding 26.
도 15의 다층PCB부(3-12)에 있어서, 단자(c)는 첫째 층의 PCB 면의 통로와 Through Hole(g)을 통해서 제1입력권선(25)의 제1권선(25-1)의 시작점에 연결된다. 제1입력권선(25)의 제1권선(25-1)과 제2권선(25-2)의 끝점은 Through Hole(h와 f)을 통해서 제1입력권선(25)의 제2권선(25-2)과 제3권선(25-3)의 시작점에 연결된다. 제1입력권선(25)의 제3권선(25-3)의 끝 점은 단자(d)에 연결된다. 제2입력권선(26)의 제1권선(26-1)의 시작점은 단자(b)에 연결되고, 제2입력권선(26)의 제1권선(26-1)의 끝 점은 Through Hole(e)을 통해서 제2입력권선(26)의 제2권선(26-2)의 시작점에 연결된다. 제2입력권선(26)의 제2권선(26-2)의 끝 점은 단자(a)로 연결된다.In the multilayer PCB part 3-12 of FIG. 15, the terminal (c) is the first winding (25-1) of the first input winding (25) through the passage of the PCB surface of the first layer and the Through Hole (g). Is connected to the starting point of. The end points of the first winding 25-1 and the second winding 25-2 of the first input winding 25 are connected to the second winding 25 of the first input winding 25 through through holes (h and f). It is connected to the starting point of -2) and the third winding (25-3). The end point of the third winding 25-3 of the first input winding 25 is connected to the terminal d. The starting point of the first winding 26-1 of the second input winding 26 is connected to the terminal b, and the end point of the first winding 26-1 of the second input winding 26 is Through Hole ( It is connected to the starting point of the second winding 26-2 of the second input winding 26 through e). The end point of the second winding 26-2 of the second input winding 26 is connected to the terminal (a).
도 15의 다층PCB부(3-12)에 있어서, 제1결합부(38-1)를 구성하는 전원 장치의 1차측의 전기적인 접지에 연결되는 도체 면(38-3)은 제1입력권선(25)으로부터 제1출력권선(2-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합과 같은 극성의 스위칭 주파수 성분의 용량성 결합을 제1출력권선(2-1)으로 생성한다. 제1결합부(38-1)가 제1출력권선(2-1)으로 생성하는 용량성 결합의 크기는 첫번째 층의 PCB 면에서 제1결합부(38-1)가 차지하는 면적의 비율이 작을수록 작아지므로, 손 쉽게 조절이 가능하다. 도 15의 다층PCB부(3-12)에 있어서, 두번째 층에 위치하는 제2입력권선(26)의 제1권선(26-1)은, 첫번째 층의 도체가 없는 빈 면(38-4)을 통해서, 제1입력권선(25)으로부터 제1출력권선(2-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합과 반대 극성의 스위칭 주파수 성분의 용량성 결합을 제1출력권선(2-1)으로 생성한다. 제1입력권선(25)도 첫번째 층의 도체가 없는 빈 면(38-4)을 통해서 제1출력권선(2-1)으로 스위칭 주파수 성분의 용량성 결합을 생성한다. 도체가 없는 빈 면(38-4)은 제2결합부(38-2)를 구성한다. 제2결합부(38-2)에 의해 제1출력권선(2-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합의 크기는 제2입력권선(26)의 제1권선(26-1)이 제1출력권선(2-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합으로부터 제1입력권선(25)이 제1출력권선(2-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합을 뺀 값이다. 제2결합부(38-2)에 의해 제1출력권선(2-1)으로 생성되는 용량성 결합의 크기는 제2결합부(38-2)의 면적이 클수록 크고, 제2입력권선(26)의 제1권선(26-1)과 제2권선(26-2)의 턴 수가 클수록 크고, 제1결합부(38-1)의 면적이 작을수록 크다. 그러므로, 다층PCB부(3-12)의 제1결합부(38-1)와 제2결합부(38-2)에 의해 제1출력권선(2-1)으로 생성되는 용량성 결합의 합의 크기와 극성은 첫번째 층의 PCB 면에서 제1결합부(38-1)와 제2결합부(38-2)가 차지하는 면적의 비율의 조절을 포함하여 여러가지 방법에 의해 손쉽게 설정할 수 있다. 또한, 제1결합부(38-1)와 제2결합부(38-2)와 제3결합부(28)에 의해 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성되는 용량성 결합의 합의 크기와 극성도 손쉽게 설정할 수 있다.In the multilayer PCB part 3-12 of FIG. 15, the conductor surface 38-3 connected to the electrical ground of the primary side of the power supply device constituting the first coupling part 38-1 is a first input winding. Capacitive coupling of switching frequency components of the same polarity as the capacitive coupling of switching frequency components generated from (25) to the first output winding 2-1 is generated as the first output winding 2-1. The size of the capacitive coupling created by the first coupling part 38-1 to the first output winding 2-1 is a small ratio of the area occupied by the first coupling part 38-1 on the PCB surface of the first layer. As it gets smaller, it can be easily adjusted by hand. In the multilayer PCB part 3-12 of FIG. 15, the first winding 26-1 of the second input winding 26 positioned on the second layer is a blank surface 38-4 without a conductor of the first layer. Through this, the capacitive coupling of the switching frequency components generated from the first input winding 25 to the first output winding 2-1 and the capacitive coupling of the switching frequency components of the opposite polarity are performed in the first output winding (2-1). ). The first input winding 25 also generates a capacitive coupling of the switching frequency components to the first output winding 2-1 through the blank surface 38-4 without a conductor of the first layer. The empty surface 38-4 without a conductor constitutes the second coupling portion 38-2. The magnitude of the capacitive coupling of the switching frequency component generated by the first output winding 2-1 by the second coupling unit 38-2 is the first winding 26-1 of the second input winding 26. The value obtained by subtracting the capacitive coupling of the switching frequency components generated by the first input winding 25 by the first output winding (2-1) from the capacitive coupling of the switching frequency components generated by the first output winding (2-1) to be. The size of the capacitive coupling generated by the second coupling portion 38-2 to the first output winding 2-1 is larger as the area of the second coupling portion 38-2 increases, and the second input winding 26 ), the larger the number of turns of the first winding 26-1 and the second winding 26-2, the larger the number of turns, and the smaller the area of the first coupling portion 38-1 is larger. Therefore, the size of the sum of the capacitive couplings generated by the first output winding 2-1 by the first coupling portion 38-1 and the second coupling portion 38-2 of the multilayer PCB portion 3-12 The polarity of and can be easily set by various methods, including adjusting the ratio of the area occupied by the first coupling portion 38-1 and the second coupling portion 38-2 on the PCB surface of the first layer. In addition, the first output winding (2-1) and the second output winding (4-1) by the first coupling portion (38-1), the second coupling portion (38-2) and the third coupling portion (28). The size and polarity of the sum of the capacitive bonds produced by can also be easily set.
따라서, 다층PCB부(3-12)를 사용하는 도 4의 전원 장치는, 다층PCB부(3-12)의 제1결합부(38-1)와 제2결합부(38-2)와 제3결합부(28)에 의해 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합의 합의 크기와 극성을 적절히 설정하여, 전원 장치의 1차측의 모든 요소들이 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합을 “영”에 근접시키며, 전원장치의 출력선로의 스위칭 주파수 성분의 noise를 아주 낮게 낮춘다.Accordingly, in the power supply device of FIG. 4 using the multilayer PCB unit 3-12, the first coupling unit 38-1 and the second coupling unit 38-2 and the second coupling unit 38-2 of the multilayer PCB unit 3-12 are provided. The size and polarity of the sum of the capacitive couplings of the switching frequency components generated by the first output winding 2-1 and the second output winding 4-1 by the three coupling unit 28 are appropriately set, The sum of the capacitive coupling of the switching frequency components generated by the first output winding (2-1) and the second output winding (4-1) of all the elements on the primary side is close to "zero", and the output line of the power supply The noise of the switching frequency component of is very low.
단, 도 15의 다층PCB부(3-12)의 실시예는, 제2입력권선(26)의 제1권선(26-1)이 제1출력권선(2-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합이 제1입력권선(25)이 제1출력권선(2-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합보다 큰 경우에만 적용 가능하다.However, in the embodiment of the multilayer PCB unit 3-12 of FIG. 15, the switching frequency component generated by the first winding 26-1 of the second input winding 26 as the first output winding 2-1 It is applicable only when the capacitive coupling of the first input winding 25 is greater than the capacitive coupling of the switching frequency components generated by the first output winding 2-1.
도 16은 본 발명의 또 다른 일 실시예인 6층의 PCB면에 의해 구성된 다층PCB부(3-13)를 보이며, 다층PCB부(3-13)는 도 4의 전원 장치의 다층PCB부(3-1)를 대체할 수 있다.FIG. 16 shows a multilayer PCB part 3-13 composed of a 6-layer PCB surface, which is another embodiment of the present invention, and the multilayer PCB part 3-13 is a multilayer PCB part 3 of the power supply device of FIG. 4. Can be substituted for -1).
도 16의 다층PCB부(3-13)는, 첫째 층의 PCB 면에 제1결합부(39-1)와 제2결합부(39-2)가 구성되고, 둘째층의 PCB 면에 제2입력권선(26)의 제1권선(26-1)이 구성되고, 셋째 층부터 다섯째 층의 PCB 면에 제1입력권선(25)의 제2권선(25-2) 내지 제4권선(25-4)이 구성되고, 끝 층의 PCB 면에 제3결합부(28)가 구성된다. 제1결합부(32-1)는 첫째 층의 PCB 면에서 제1입력권선(25)의 제1권선(25-1)과 제1권선(25-1)의 일부분에 연결되는 제1도체면(25-5)에 의해 구성된다. 제2결합부(39-2)는 첫째 층의 PCB 면에서 도체가 없는 빈 면(39-4)에 의해 구성된다. 제3결합부(28)는, 제2입력권선(26)의 제2권선(26-2)에 의해 구성된다.In the multilayer PCB part 3-13 of FIG. 16, a first coupling part 39-1 and a second coupling part 39-2 are formed on the PCB surface of the first layer, and the second coupling part 39-2 is formed on the PCB surface of the second layer. The first winding 26-1 of the input winding 26 is formed, and the second winding 25-2 to the fourth winding 25- of the first input winding 25 are formed on the PCB surface of the third to fifth layers. 4) is configured, and a third coupling part 28 is configured on the PCB surface of the end layer. The first coupling part 32-1 is a first conductor surface connected to a part of the first winding 25-1 and the first winding 25-1 of the first input winding 25 on the PCB surface of the first layer. It is composed by (25-5). The second coupling portion 39-2 is constituted by an empty surface 39-4 without a conductor in the first layer of the PCB surface. The 3rd coupling part 28 is comprised by the 2nd winding 26-2 of the 2nd input winding 26.
도 16의 다층PCB부(3-13)에 있어서, 제1입력권선(25)의 제1권선(25-1)의 시작점은 단자(c)에 연결된다. 제1입력권선(25)의 제1권선(25-1)과 제2권선(25-2)과 제3권선(25-3)의 끝점은 Through Hole(g와 h와 f)을 통해서 제1입력권선(25)의 제2권선(25-2)과 제3권선(25-3)과 제4권선(25-4)의 시작점에 연결된다. 제1입력권선(25)의 제4권선(25-4)의 끝 점은 단자(d)에 연결된다. 제2입력권선(26)의 제1권선(26-1)의 시작점은 단자(b)에 연결되고, 제2입력권선(26)의 제1권선(26-1)의 끝 점은 Through Hole(e)을 통해서 제2입력권선(26)의 제2권선(26-2)의 시작점에 연결된다. 제2입력권선(26)의 제2권선(26-2)의 끝 점은 단자(a)에 연결된다.In the multilayer PCB part 3-13 of FIG. 16, the starting point of the first winding 25-1 of the first input winding 25 is connected to the terminal c. The end points of the first winding (25-1), the second winding (25-2), and the third winding (25-3) of the first input winding (25) are the first through holes (g, h, and f). It is connected to the starting points of the second winding 25-2, the third winding 25-3, and the fourth winding 25-4 of the input winding 25. The end point of the fourth winding 25-4 of the first input winding 25 is connected to the terminal d. The starting point of the first winding 26-1 of the second input winding 26 is connected to the terminal b, and the end point of the first winding 26-1 of the second input winding 26 is Through Hole ( It is connected to the starting point of the second winding 26-2 of the second input winding 26 through e). The end point of the second winding 26-2 of the second input winding 26 is connected to the terminal (a).
도 16의 다층PCB부(3-13)에 있어서, 제1입력권선(25)의 제1권선(25-1)과 제1권선(25-1)에 연결되는 제1도체면(25-5)으로 구성되는 제1결합부(39-1)는 제1입력권선(25)으로부터 제1출력권선(2-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합과 같은 극성의 스위칭 주파수 성분의 용량성 결합을 제1출력권선(2-1)으로 생성한다. 제1결합부(39-1)가 제1출력권선(2-1)으로 생성하는 용량성 결합의 크기는 제1결합부(39-1)를 구성하는 제1입력권선(25)의 제1권선(25-1)의 턴 수가 작을수록 작아지고, 제1도체면(25-5)의 면적이 작을수록 작아지므로, 손 쉽게 조절이 가능하다.In the multilayer PCB part 3-13 of FIG. 16, the first conductor surface 25-5 connected to the first winding 25-1 and the first winding 25-1 of the first input winding 25 The first coupling part 39-1 consisting of) is the capacitance of the switching frequency component of the same polarity as the capacitive coupling of the switching frequency components generated from the first input winding 25 to the first output winding 2-1. The gender coupling is created with the first output winding (2-1). The size of the capacitive coupling generated by the first coupling part 39-1 to the first output winding 2-1 is the first of the first input winding 25 constituting the first coupling part 39-1. The smaller the number of turns of the winding 25-1 is, the smaller it is, and the smaller the area of the first conductor surface 25-5 is, the smaller it is, so it can be easily adjusted.
도 16의 다층PCB부(3-13)에 있어서, 두번째 층에 위치하는 제2입력권선(26)의 제1권선(26-1)은 첫번째 층의 도체가 없는 빈 면(39-4)을 통해서 제1입력권선(25)이 제1출력권선(2-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합과 반대 극성의 스위칭 주파수 성분의 용량성 결합을 제1출력권선(2-1)으로 생성한다. 제1입력권선(25)도 첫번째 층의 도체가 없는 빈 면(39-4)을 통해서 제1출력권선(2-1)으로 스위칭 주파수 성분의 용량성 결합을 생성한다. 도체가 없는 빈 면(39-4)은 제2결합부(32-2)를 구성한다. 제2결합부(39-2)에 의해서 제1출력권선(2-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합의 크기는 제2입력권선(26)의 제1권선(26-1)이 제1출력권선(2-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합으로부터 제1입력권선(25)이 제1출력권선(2-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합을 뺀 값이다. 제2결합부(39-2)에 의해 제1출력권선(2-1)으로 생성되는 용량성 결합의 크기는, 제1입력권선(25)의 제1권선(25-1)의 턴 수가 작을수록 커지고, 제1도체면(25-5)의 면적이 작을수록 커지고, 제1입력권선(25)의 제1권선(25-1)을 구성하는 도체의 면적이 작을수록 커지므로, 손 쉽게 조절이 가능하다. 그러므로, 다층PCB부(3-13)의 제1결합부(39-1)와 제2결합부(39-2)에 의해 제1출력권선(2-1)으로 생성되는 용량성 결합의 합의 크기와 극성은 첫번째 층의 PCB 면에서 제1결합부(39-1)와 제2결합부(39-2)가 차지하는 면적의 비율의 조절을 포함하여 여러가지 방법에 의해 손쉽게 설정할 수 있다. 또한, 제1결합부(39-1)와 제2결합부(39-2)와 제3결합부(28)에 의해 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성되는 용량성 결합의 합의 크기와 극성도 손쉽게 설정할 수 있다.In the multi-layer PCB section 3-13 of FIG. 16, the first winding 26-1 of the second input winding 26 located on the second layer covers the blank surface 39-4 without a conductor of the first layer. Through the first input winding 25, the capacitive coupling of the switching frequency components generated by the first output winding 2-1 and the capacitive coupling of the switching frequency components of the opposite polarity are converted into the first output winding 2-1. Generate. The first input winding 25 also generates a capacitive coupling of the switching frequency components to the first output winding 2-1 through the blank surface 39-4 without a conductor of the first layer. The empty surface 39-4 without a conductor constitutes the second coupling portion 32-2. The magnitude of the capacitive coupling of the switching frequency components generated by the first output winding 2-1 by the second coupling unit 39-2 is the first winding 26-1 of the second input winding 26. The value obtained by subtracting the capacitive coupling of the switching frequency components generated by the first input winding 25 by the first output winding (2-1) from the capacitive coupling of the switching frequency components generated by the first output winding (2-1) to be. The size of the capacitive coupling generated by the second coupling part 39-2 to the first output winding 2-1 is that the number of turns of the first winding 25-1 of the first input winding 25 is small. The larger the size, the smaller the area of the first conductor surface 25-5 is, the larger the area, and the smaller the area of the conductor constituting the first winding 25-1 of the first input winding 25, the larger it is. This is possible. Therefore, the size of the sum of the capacitive couplings generated by the first output winding 2-1 by the first coupling portion 39-1 and the second coupling portion 39-2 of the multilayer PCB portion 3-13 The polarity and polarity can be easily set by various methods, including adjusting the ratio of the area occupied by the first coupling portion 39-1 and the second coupling portion 39-2 on the first-layer PCB surface. In addition, the first output winding (2-1) and the second output winding (4-1) by the first coupling portion (39-1), the second coupling portion (39-2) and the third coupling portion (28) The size and polarity of the sum of the capacitive bonds produced by can also be easily set.
따라서, 다층PCB부(3-5)를 사용하는 도 4의 전원 장치는, 다층PCB부(3-5)의 제1결합부(39-1)와 제2결합부(39-2)와 제3결합부(28)에 의해 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합의 합의 크기와 극성을 적절히 설정하여, 전원 장치의 1차측의 모든 요소들이 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합을 “영”에 근접시키며, 전원장치의 출력선로의 스위칭 주파수 성분의 noise를 아주 낮게 낮춘다.Accordingly, in the power supply device of FIG. 4 using the multilayer PCB unit 3-5, the first coupling portion 39-1 and the second coupling portion 39-2 and the second coupling portion 39-2 of the multilayer PCB portion 3-5. The size and polarity of the sum of the capacitive couplings of the switching frequency components generated by the first output winding 2-1 and the second output winding 4-1 by the three coupling unit 28 are appropriately set, The sum of the capacitive coupling of the switching frequency components generated by the first output winding (2-1) and the second output winding (4-1) of all the elements on the primary side is close to "zero", and the output line of the power supply The noise of the switching frequency component of is very low.
단, 도 16의 다층PCB부(3-13)의 실시예는, 제2입력권선(26)의 제1권선(26-1)이 제1출력권선(2-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합이 제1입력권선(25)이 제1출력권선(2-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합보다 큰 경우에만 적용 가능하다.However, in the embodiment of the multilayer PCB section 3-13 of FIG. 16, the switching frequency component generated by the first winding 26-1 of the second input winding 26 as the first output winding 2-1 It is applicable only when the capacitive coupling of the first input winding 25 is greater than the capacitive coupling of the switching frequency components generated by the first output winding 2-1.
도 17은 본 발명의 또 다른 일 실시예인 6층의 PCB면에 의해 구성된 다층PCB부(3-9)를 보이며, 다층PCB부(3-9)는 도 4의 전원 장치의 다층PCB부(3-1)를 대체할 수 있다.FIG. 17 shows a multilayer PCB unit 3-9 constituted by a six-layer PCB surface, which is another embodiment of the present invention, and the multilayer PCB unit 3-9 is a multilayer PCB unit 3 of the power supply device of FIG. 4. Can be substituted for -1).
도 17의 다층PCB부(3-9)는, 첫째 층의 PCB 면에 제1결합부(36-1)와 제2결합부(36-2)를 구성하고, 둘째 층부터 다섯째 층의 PCB 면에 제1입력권선(25)의 제1권선(25-1) 내지 제4권선(25-4)을 구성하고, 끝 층의 PCB 면에 제3결합부(28)를 구성한다. 제1결합부(36-1)는 첫째 층의 PCB 면에서 도체가 없는 빈 면(36-4)에 의해 구성된다. 제2결합부(36-2)는 제2입력권선(26)의 제1권선(26-1)에 의해 구성된다. 제3결합부(28)는 제2입력권선(26)의 제2권선(26-2)에 의해 구성된다.The multilayer PCB part 3-9 of FIG. 17 comprises a first coupling part 36-1 and a second coupling part 36-2 on the first layer of the PCB, and the second to fifth layers of the PCB The first winding 25-1 to the fourth winding 25-4 of the first input winding 25 are formed, and a third coupling part 28 is formed on the PCB surface of the end layer. The first coupling portion 36-1 is constituted by an empty surface 36-4 without a conductor in the first layer of the PCB surface. The second coupling portion 36-2 is constituted by the first winding 26-1 of the second input winding 26. The third coupling portion 28 is constituted by the second winding 26-2 of the second input winding 26.
도 17의 다층PCB부(3-9)에 있어서, 제1입력권선(25)의 제1권선(25-1)의 시작점은 단자(c)에 연결된다. 제1입력권선(25)의 제1권선(25-1)과 제2권선(25-2)과 제3권선(25-3)의 끝점은 Through Hole(f와 i와 g)을 통해서 제1입력권선(25)의 제2권선(25-2)과 제3권선(25-3)과 제4권선(25-4)의 시작점에 연결된다. 제1입력권선(25)의 제4권선(25-4)의 끝 점은 단자(d)에 연결된다. 제2입력권선(26)의 제1권선(26-1)의 시작점은 단자(b)에 연결되고, 제2입력권선(26)의 제1권선(26-1)의 끝 점은 Through Hole(e)을 통해서 제2입력권선(26)의 제2권선(26-2)의 시작점에 연결된다. 제2입력권선(26)의 제2권선(26-2)의 끝 점은 단자(a)에 연결된다.In the multilayer PCB section 3-9 of FIG. 17, the starting point of the first winding 25-1 of the first input winding 25 is connected to the terminal c. The end points of the first winding (25-1), the second winding (25-2), and the third winding (25-3) of the first input winding (25) are the first through holes (f and i and g). It is connected to the starting points of the second winding 25-2, the third winding 25-3, and the fourth winding 25-4 of the input winding 25. The end point of the fourth winding 25-4 of the first input winding 25 is connected to the terminal d. The starting point of the first winding 26-1 of the second input winding 26 is connected to the terminal b, and the end point of the first winding 26-1 of the second input winding 26 is Through Hole ( It is connected to the starting point of the second winding 26-2 of the second input winding 26 through e). The end point of the second winding 26-2 of the second input winding 26 is connected to the terminal (a).
도 18은 본 발명의 또 다른 일 실시예인 6층의 PCB면에 의해 구성된 다층PCB부(3-10)를 보이며, 다층PCB부(3-10)는 도 4의 전원 장치의 다층PCB부(3-1)를 대체할 수 있다.FIG. 18 shows a multilayer PCB unit 3-10 composed of a six-layer PCB surface, which is another embodiment of the present invention, and the multilayer PCB unit 3-10 is a multilayer PCB unit 3 of the power supply device of FIG. Can be substituted for -1).
도 18의 다층PCB부(3-10)는, 첫째 층의 PCB 면에 제1결합부(36-1)와 제2결합부(36-2)를 구성하고, 둘째층의 PCB 면의 대부분의 면적에 전원장치의 1차측의 전기적인 접지에 연결되는 도체 면(35)을 구성하고, 둘째층의 PCB 면의 일부분의 면적에 단자 (d)와 Through hole(g)를 연결하는 통로를 구성하고, 셋째 층부터 다섯째 층의 PCB 면에 제1입력권선(25)의 제1권선(25-1) 내지 제3권선(25-3)을 구성하고, 끝 층의 PCB 면에 제3결합부(28)를 구성한다. 제1결합부(36-1)는 도체가 없는 빈 면(36-4)에 의해 구성된다. 제2결합부(36-2)는 제2입력권선(26)의 제1권선(26-1)에 의해 구성된다. 제3결합부(28)는 제2입력권선(26)의 제2권선(26-2)에 의해 구성된다. 둘째층의 PCB 면에 구성되는 도체 면(35)은 제1입력권선(25)이 제1출력권선(2-1)으로 용량성으로 결합하는 것을 효과적으로 차단한다.The multilayer PCB part 3-10 of FIG. 18 comprises a first coupling part 36-1 and a second coupling part 36-2 on the first-layer PCB surface, and most of the second-layer PCB surface In the area, a conductor surface 35 connected to the electrical ground of the primary side of the power supply device is formed, and a passage connecting the terminal (d) and the through hole (g) is formed in a partial area of the PCB surface of the second layer. , Compose the first winding (25-1) to the third winding (25-3) of the first input winding 25 on the PCB surface of the third to fifth layers, and a third coupling part ( 28). The first coupling portion 36-1 is constituted by an empty surface 36-4 without a conductor. The second coupling portion 36-2 is constituted by the first winding 26-1 of the second input winding 26. The third coupling portion 28 is constituted by the second winding 26-2 of the second input winding 26. The conductor surface 35 formed on the second-layer PCB surface effectively blocks the capacitive coupling of the first input winding 25 to the first output winding 2-1.
도 18의 다층PCB부(3-10)에 있어서, 제1입력권선(25)의 제1권선(25-1)의 시작점은 단자(c)에 연결된다. 제1입력권선(25)의 제1권선(25-1)과 제2권선(25-2)의 끝점은 Through Hole(f와 i)을 통해서 제1입력권선(25)의 제2권선(25-2)과 제3권선(25-3)의 시작점에 연결된다. 제1입력권선(25)의 제3권선(25-3)의 끝 점은 Through hole(g)를 통해서 단자(d)에 연결된다. 제2입력권선(26)의 제1권선(26-1)의 시작점은 단자(b)에 연결되고, 제2입력권선(26)의 제1권선(26-1)의 끝 점은 Through Hole(e)을 통해서 제2입력권선(26)의 제2권선(26-2)의 시작점에 연결된다. 제2입력권선(26)의 제2권선(26-2)의 끝 점은 단자(a)에 연결된다.In the multilayer PCB part 3-10 of FIG. 18, the starting point of the first winding 25-1 of the first input winding 25 is connected to the terminal c. The end points of the first winding 25-1 and the second winding 25-2 of the first input winding 25 are connected to the second winding 25 of the first input winding 25 through through holes f and i. It is connected to the starting point of -2) and the third winding (25-3). The end point of the third winding 25-3 of the first input winding 25 is connected to the terminal d through the through hole g. The starting point of the first winding 26-1 of the second input winding 26 is connected to the terminal b, and the end point of the first winding 26-1 of the second input winding 26 is Through Hole ( It is connected to the starting point of the second winding 26-2 of the second input winding 26 through e). The end point of the second winding 26-2 of the second input winding 26 is connected to the terminal (a).
도 17 혹은 도 18의 다층PCB부(3-9 혹은 3-10)에 있어서, 제1출력권선(2-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합과 같은 극성의 스위칭 주파수 성분의 용량성 결합이 도체가 없는 빈 면(36-4)으로 구성되는 제1결합부(36-1)에 의해 제1출력권선(2-1)으로 생성된다. 제1결합부(36-1)에 의해 제1출력권선(2-1)으로 생성되는 용량성 결합의 크기는, 제1결합부(36-1)를 구성하는 도체가 없는 빈 면(36-4)의 면적이 작을수록 작아지므로, 손 쉽게 조절이 가능하다. 도 17 혹은 도 18의 다층PCB부(3-9 혹은 3-10)에 있어서, 제2입력권선(26)의 제1권선(26-1)에 의해 구성되는 제2결합부(36-2)는 제1입력권선(25)으로부터 제1출력권선(2-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합과 반대 극성의 스위칭 주파수 성분의 용량성 결합을 제1출력권선(2-1)으로 생성한다. 제2결합부(36-2)가 제1출력권선(2-1)으로 생성하는 용량성 결합의 크기는 제2입력권선(26)의 제1권선(26-1)의 턴 수와 제2권선(26-2)의 턴 수가 클수록 커지고, 제2입력권선(26)의 제1권선(26-1)의 도체 면의 면적이 클수록 커지고, 첫째 층에서 도체가 없는 빈 면(36-4)의 면적이 작을수록 커지므로, 손 쉽게 조절이 가능하다. 그러므로, 다층PCB부(3-9 혹은 3-10)의 제1결합부(36-1)와 제2결합부(36-2)에 의해 제1출력권선(2-1)으로 생성되는 용량성 결합의 합의 크기와 극성은 손쉽게 설정할 수 있다. 또한, 제1결합부(36-1)와 제2결합부(36-2)와 제3결합부(28)에 의해 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성되는 용량성 결합의 합의 크기와 극성도 손쉽게 설정할 수 있다.In the multilayer PCB unit 3-9 or 3-10 of FIG. 17 or 18, the capacitiveness of the switching frequency components of the same polarity as the capacitive coupling of the switching frequency components generated by the first output winding 2-1 The coupling is created as the first output winding 2-1 by the first coupling portion 36-1 composed of a blank surface 36-4 without a conductor. The size of the capacitive coupling generated by the first coupling part 36-1 to the first output winding 2-1 is a blank surface 36- without a conductor constituting the first coupling part 36-1. The smaller the area of 4) is, the smaller it is, so it can be easily adjusted by hand. In the multilayer PCB unit 3-9 or 3-10 of FIG. 17 or 18, the second coupling portion 36-2 constituted by the first winding 26-1 of the second input winding 26 Is the capacitive coupling of the switching frequency components generated from the first input winding 25 to the first output winding 2-1 and the capacitive coupling of the switching frequency components of the opposite polarity to the first output winding 2-1. Generate. The size of the capacitive coupling generated by the second coupling unit 36-2 to the first output winding 2-1 is the number of turns of the first winding 26-1 of the second input winding 26 and the second The larger the number of turns of the winding 26-2, the larger the number of turns, the larger the area of the conductor surface of the first winding 26-1 of the second input winding 26 increases, and the empty surface without a conductor in the first layer (36-4) The smaller the area is, the larger it is, so it can be easily adjusted by hand. Therefore, the capacitive generated by the first output winding (2-1) by the first coupling portion (36-1) and the second coupling portion (36-2) of the multilayer PCB portion (3-9 or 3-10) The size and polarity of the sum of bonds can be easily set. In addition, the first output winding (2-1) and the second output winding (4-1) by the first coupling portion (36-1), the second coupling portion (36-2) and the third coupling portion (28). The size and polarity of the sum of the capacitive bonds produced by can also be easily set.
따라서, 다층PCB부(3-9 혹은 3-10)를 사용하는 도 4의 전원 장치는, 다층PCB부(3-9 혹은 3-10)의 제1결합부(36-1)와 제2결합부(36-2)와 제3결합부(28)에 의해 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합의 합의 크기와 극성을 적절히 설정하여, 전원 장치의 1차측의 모든 요소들이 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합을 “영”에 근접시키며, 전원장치의 출력선로의 스위칭 주파수 성분의 noise를 아주 낮게 낮춘다.Therefore, in the power supply device of FIG. 4 using the multilayer PCB unit 3-9 or 3-10, the first coupling unit 36-1 and the second combination of the multilayer PCB unit 3-9 or 3-10 Size and polarity of the sum of capacitive coupling of switching frequency components generated by the first output winding (2-1) and the second output winding (4-1) by the part 36-2 and the third coupling part 28 By setting appropriately, the sum of the capacitive coupling of the switching frequency components generated by the first output winding (2-1) and the second output winding (4-1) by all the elements on the primary side of the power supply is "zero". Close, and very low the noise of the switching frequency component of the output line of the power supply.
도 19와 도 20은 본 발명의 또 다른 일 실시예인 6층의 PCB면에 의해 구성된 다층PCB부(3-14 혹은 3-15)를 보이며, 다층PCB부(3-14 혹은 3-15)는 도 4의 전원 장치의 다층PCB부(3-1)를 대체할 수 있다.19 and 20 show a multilayer PCB part (3-14 or 3-15) constituted by a six-layer PCB surface, which is another embodiment of the present invention, and the multilayer PCB part (3-14 or 3-15) is It can replace the multilayer PCB part 3-1 of the power supply device of FIG. 4.
도 19의 다층PCB부(3-14)는, 도 17의 다층PCB부(3-9)와 첫째 층의 PCB 면만 다르고, 둘째 층부터 여섯째 층까지의 구성은 동일하다. The multilayer PCB unit 3-14 of FIG. 19 is different from the multilayer PCB unit 3-9 of FIG. 17 only on the first layer of the PCB, and the configurations from the second to the sixth layers are the same.
도 20의 다층PCB부(3-15)는, 도 18의 다층PCB부(3-10)와 첫째 층의 PCB 면만 다르고, 둘째 층부터 여섯째 층까지의 구성은 동일하다. The multilayer PCB unit 3-15 of FIG. 20 is different from the multilayer PCB unit 3-10 of FIG. 18 only on the first layer of the PCB, and the configurations from the second layer to the sixth layer are the same.
도 17 혹은 도 18의 다층PCB부(3-9 혹은 3-10)의 경우에는 첫째 층의 PCB 면에 빈 면(40-4)으로 구성되는 제1결합부(40-1)와 제2입력권선(26)의 제1권선(26-1)으로 구성되는 제2결합부(40-2)가 구성된다. 도 19 혹은 도 20의 다층PCB부(3-14 혹은 3-15)의 경우에도, 첫째 층의 PCB 면에 빈 면(40-4)으로 구성되는 제1결합부(40-1)와 제2입력권선(26)의 제1권선(26-1)으로 구성되는 제2결합부(40-2)가 구성되지만, 도 17 혹은 도 18의 다층PCB부(3-9 혹은 3-10)에 비해서 빈 면(40-4)의 면적이 현저히 작고, 제2입력권선(26)의 제1권선(26-1)의 도체의 일부분의 폭이 현저히 넓다.In the case of the multilayer PCB part 3-9 or 3-10 of FIG. 17 or 18, the first coupling part 40-1 and the second input composed of a blank surface 40-4 on the first-layer PCB surface A second coupling portion 40-2 composed of the first winding 26-1 of the winding 26 is formed. In the case of the multilayer PCB part 3-14 or 3-15 of FIG. 19 or 20, the first coupling part 40-1 and the second coupling part 40-1 constituted by a blank surface 40-4 on the first-layer PCB surface The second coupling portion 40-2 composed of the first winding 26-1 of the input winding 26 is configured, but compared to the multilayer PCB portion 3-9 or 3-10 of FIG. 17 or 18 The area of the blank surface 40-4 is remarkably small, and the width of a part of the conductor of the first winding 26-1 of the second input winding 26 is remarkably wide.
도 19 혹은 도 20의 다층PCB부(3-14 혹은 3-15)는, 제1입력권선(25)으로부터 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합이 큰 경우에 유효하다.The multilayer PCB unit 3-14 or 3-15 of FIG. 19 or 20 is generated from the first input winding 25 to the first output winding 2-1 and the second output winding 4-1. It is effective when the capacitive coupling of the switching frequency components is large.
도 21은 본 발명의 또 다른 일 실시예인 6층의 PCB면에 의해 구성된 다층PCB부(3-16)를 보이며, 다층PCB부(3-16)는 도 4의 전원 장치의 다층PCB부(3-1)를 대체할 수 있다.FIG. 21 shows a multilayer PCB unit 3-16 composed of a six-layer PCB surface, which is another embodiment of the present invention, and the multilayer PCB unit 3-16 is a multilayer PCB unit 3 of the power supply device of FIG. Can be substituted for -1).
도 21의 다층PCB부(3-16)는, 첫째 층의 PCB 면에 제1결합부(42-1)와 제2결합부(42-2)를 구성하고, 둘째 층부터 다섯째 층의 PCB 면에 제1입력권선(25)의 제1권선(25-1) 내지 제4권선(25-4)을 구성하고, 끝 층의 PCB 면에 제3결합부(28)를 구성한다. 제1결합부(42-1)는 첫째 층의 PCB 면에서 도체가 없는 빈 면(42-4)에 의해 구성된다. 제2결합부(42-2)는, 첫째 층의 PCB 면의 대부분의 면적을 차지하는 도체 면(42-5)에 의해 구성되고, 제2입력권선(26)의 시작점 혹은 제2입력권선(26)의 시작점부터 끝 점 사이의 한 점에 연결된다. 제3결합부(28)는 제2입력권선(26)에 의해 구성된다. The multilayer PCB part 3-16 of FIG. 21 comprises a first coupling part 42-1 and a second coupling part 42-2 on the first layer of the PCB, and the second to fifth layers of the PCB The first winding 25-1 to the fourth winding 25-4 of the first input winding 25 are formed, and a third coupling part 28 is formed on the PCB surface of the end layer. The first coupling portion 42-1 is constituted by an empty surface 42-4 without a conductor in the first layer of the PCB surface. The second coupling portion 42-2 is constituted by a conductor surface 42-5 that occupies most of the surface of the first layer of the PCB, and the starting point of the second input winding 26 or the second input winding 26 ) Is connected to a point between the start point and the end point. The third coupling portion 28 is constituted by a second input winding 26.
도 21의 다층PCB부(3-16)에 있어서, 제1입력권선(25)의 제1권선(25-1)의 시작점은 단자(c)에 연결된다. 제1입력권선(25)의 제1권선(25-1)과 제2권선(25-2)과 제3권선(25-3)의 끝점은 Through Hole(g와 h와 f)을 통해서 제1입력권선(25)의 제2권선(25-2)과 제3권선(25-3)과 제4권선(25-4)의 시작점에 연결된다. 제1입력권선(25)의 제4권선(25-4)의 끝 점은 단자(d)에 연결된다. 제2입력권선(26)의 시작점은 단자(b)에 연결되고, 제2입력권선(26)의 Through Hole(e)와 도체 면(42-5)을 통해서 단자(a)에 연결된다.In the multilayer PCB part 3-16 of FIG. 21, the starting point of the first winding 25-1 of the first input winding 25 is connected to the terminal c. The end points of the first winding (25-1), the second winding (25-2), and the third winding (25-3) of the first input winding (25) are the first through holes (g, h, and f). It is connected to the starting points of the second winding 25-2, the third winding 25-3, and the fourth winding 25-4 of the input winding 25. The end point of the fourth winding 25-4 of the first input winding 25 is connected to the terminal d. The starting point of the second input winding 26 is connected to the terminal b, and is connected to the terminal a through the through hole e of the second input winding 26 and the conductor surface 42-5.
도 21의 다층PCB부(3-16)에 있어서, 제1결합부(42-1)는 첫째 층의 PCB 면에서 도체가 없는 빈 면(42-4)에 의해 구성되며, 제1입력권선(25)으로부터 제1출력권선(2-1)으로 스위칭 주파수 성분의 용량성 결합이 생성되게 한다. 제1결합부(42-1)가 제1출력권선(2-1)으로 생성하는 용량성 결합의 크기는 첫번째 층의 PCB 면에서 제1결합부(42-1)가 차지하는 면적의 비율이 작을수록 작아지므로, 손 쉽게 조절이 가능하다. 제2결합부(42-2)는, 첫째 층의 PCB 면의 대부분의 면적을 차지하고 제2입력권선(26)의 시작점 혹은 제2입력권선(26)의 시작점부터 끝 점 사이의 한 점에 연결되는 도체 면(42-5)에 의해 구성되고, 제1입력권선(25)이 제1출력권선(2-1)으로 용량성으로 결합하는 것을 효과적으로 차단한다. 또한, 제2결합부(42-2)는, 제1입력권선(25)이 제1출력권선(2-1) 혹은 제2출력권선(4-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합과 반대 극성의 스위칭 주파수 성분의 용량성 결합을 제1출력권선(2-1)으로 생성한다. 제2결합부(42-2)가 제1출력권선(2-1)으로 생성하는 용량성 결합의 크기는 제2결합부(42-2)의 전위의 변동폭이 클수록 커지고, 첫째 층에서 제2결합부(42-2)가 차지하는 면적이 클수록 커지므로, 손 쉽게 조절이 가능하다. 그러므로, 도 21의 다층PCB부(3-16)의 제2결합부(42-2)에 의해 제1출력권선(2-1)으로 생성되는 용량성 결합의 합의 크기와 극성은 손쉽게 설정할 수 있다. 또한, 제1결합부(42-1)와 제2결합부(42-2)와 제3결합부(28)에 의해 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성되는 용량성 결합의 합의 크기와 극성도 손쉽게 설정할 수 있다.In the multilayer PCB part 3-16 of FIG. 21, the first coupling part 42-1 is formed by a blank surface 42-4 without a conductor on the first-layer PCB surface, and the first input winding ( 25) to the first output winding 2-1 to generate a capacitive coupling of the switching frequency components. The size of the capacitive coupling generated by the first coupling part 42-1 to the first output winding 2-1 is a small ratio of the area occupied by the first coupling part 42-1 on the PCB surface of the first layer. As it gets smaller, it can be easily adjusted by hand. The second coupling part 42-2 occupies most of the surface of the first layer of the PCB and is connected to the starting point of the second input winding 26 or a point between the starting point and the ending point of the second input winding 26. It is constituted by the conductor surface 42-5 to be formed, and effectively blocks the capacitive coupling of the first input winding 25 to the first output winding 2-1. In addition, the second coupling unit 42-2 is a capacitive coupling of the switching frequency components generated by the first input winding 25 as the first output winding 2-1 or the second output winding 4-1. The capacitive coupling of the switching frequency component of the opposite polarity to is generated by the first output winding 2-1. The size of the capacitive coupling generated by the second coupling portion 42-2 to the first output winding 2-1 increases as the variation of the potential of the second coupling portion 42-2 increases, and the second Since the larger the area occupied by the coupling portion 42-2 increases, it can be easily adjusted by hand. Therefore, the size and polarity of the sum of capacitive couplings generated by the first output winding 2-1 by the second coupling portion 42-2 of the multilayer PCB portion 3-16 of FIG. 21 can be easily set. . In addition, the first output winding (2-1) and the second output winding (4-1) by the first coupling portion (42-1), the second coupling portion (42-2) and the third coupling portion (28) The size and polarity of the sum of the capacitive bonds produced by can also be easily set.
따라서, 다층PCB부(3-16)를 사용하는 도 4의 전원 장치는, 다층PCB부(3-16)의 제1결합부(42-1)와 제2결합부(42-2)와 제3결합부(28)에 의해 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합의 합의 크기와 극성을 적절히 설정하여, 전원 장치의 1차측의 모든 요소들이 제1출력권선(2-1)과 제2출력권선(4-1)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합을 “영”에 근접시키며, 전원장치의 출력선로의 스위칭 주파수 성분의 noise를 아주 낮게 낮춘다.Accordingly, in the power supply device of FIG. 4 using the multilayer PCB unit 3-16, the first coupling unit 42-1 and the second coupling unit 42-2 and the second coupling unit 42-2 of the multilayer PCB unit 3-16 are provided. The size and polarity of the sum of the capacitive couplings of the switching frequency components generated by the first output winding 2-1 and the second output winding 4-1 by the three coupling unit 28 are appropriately set, The sum of the capacitive coupling of the switching frequency components generated by the first output winding (2-1) and the second output winding (4-1) of all the elements on the primary side is close to "zero", and the output line of the power supply The noise of the switching frequency component of is very low.
다층PCB부(3-16)는, 첫째 층의 PCB 면의 대부분의 면적을 차지하는 도체 면(42-5)에 의해 제1입력권선(25)으로부터 제1출력권선(2-1)으로 용량성 결합이 생성되지 못하도록 효과적으로 차단한다. 따라서, 도 5의 다층PCB부(3-1)에 대하여 설명한 바와 같이, 다층PCB부(3-16)를 사용하는 전원 장치는 종래기술에 비해 외부로 스위칭 주파수 성분의 노이즈와 고주파 성분의 노이즈의 영향을 훨씬 작게 미치게 되는 장점을 가진다.The multilayer PCB part 3-16 is capacitive from the first input winding 25 to the first output winding 2-1 by the conductor surface 42-5 that occupies most of the PCB surface of the first layer. It effectively blocks the formation of bonds. Therefore, as described with respect to the multilayer PCB unit 3-1 of FIG. 5, the power supply device using the multilayer PCB unit 3-16 reduces the noise of the switching frequency component and the noise of the high frequency component to the outside compared to the prior art. It has the advantage of having a much smaller impact.
이와 같은, 도 5 내지 도 21에서 보인 다층PCB부(3-1 혹은 3-1a 혹은 3-2 혹은 3-3 혹은 3-4 혹은 3-5 혹은 3-6 혹은 3-7 혹은 3-8 혹은 3-9 혹은 3-10 혹은 3-11 혹은 3-12 혹은 3-13 혹은 3-14 혹은 3-15 혹은 3-16)는, 6층의 PCB 면으로 구성될 수 있어서, 10층의 PCB 면으로 구성되는 종래 기술의 다층PCB부(3)에 비해서 가격이 훨씬 낮아지는 장점을 가진다. 또한 종래 기술에 비해 제1입력권선(25)과 제2입력권선(26)이 제1출력권선(2-1)과 제2출력권선(4-1)으로 자기적으로 높은 결합도를 가지므로, 전력 전달의 효율이 높아지는 장점을 가진다.As such, the multilayer PCB unit shown in FIGS. 5 to 21 (3-1 or 3-1a or 3-2 or 3-3 or 3-4 or 3-5 or 3-6 or 3-7 or 3-8 or 3-9 or 3-10 or 3-11 or 3-12 or 3-13 or 3-14 or 3-15 or 3-16) can be composed of 6 layers of PCB side, so 10 layers of PCB side Compared to the conventional multilayer PCB unit 3 consisting of, the price is much lower. In addition, compared to the prior art, the first input winding 25 and the second input winding 26 have a magnetically high degree of coupling to the first output winding 2-1 and the second output winding 4-1. , It has the advantage of increasing the efficiency of power transmission.
또한, 도 5 내지 도 9와 도 12와 도 13과 도 19 내지 도 21에서 보인 다층PCB부(3-1 혹은 3-1a 혹은 3-2 혹은 3-3 혹은 3-4 혹은 3-7 혹은 3-8 혹은 3-14 혹은 3-15 혹은 3-16)을 사용하는 전원 장치는, 종래기술에 비해 외부로 스위칭 주파수 성분과 고주파 성분의 노이즈의 영향을 훨씬 작게 미치는 장점을 가진다. 다만, 도 10과 도 11과 도 14 내지 도 18에서 보인 다층PCB부(3-5 혹은 3-6 3-9 혹은 3-10 혹은 3-11 혹은 3-12 혹은 3-13)은, 외부로 미치는 노이즈의 영향이 종래 기술과 대등한 수준을 유지한다.In addition, the multilayer PCB unit shown in FIGS. 5 to 9 and 12 and 13 and 19 to 21 (3-1 or 3-1a or 3-2 or 3-3 or 3-4 or 3-7 or 3 The power supply using -8 or 3-14 or 3-15 or 3-16) has the advantage of having much less influence of noise of switching frequency components and high frequency components to the outside compared to the prior art. However, the multilayer PCB unit (3-5 or 3-6 3-9 or 3-10 or 3-11 or 3-12 or 3-13) shown in FIGS. 10 and 11 and 14 to 18 The influence of noise to be applied maintains a level comparable to that of the prior art.
도시하지는 않았지만, 도 4 내지 도 21에 있어서, 제1입력권선(25)의 제2권선(25-2) 내지 제3권선(25-3)과 제2입력권선(26)의 제1권선(26-1) 혹은 제1입력권선(25)의 제2권선(25-2) 내지 제4권선(25-4)이 구성되는 PCB면의 위치는 통상의 기술자에 의해 다양하게 바뀔 수 있다. 또한, 제2입력권선(26)의 제1권선(26-1)이 포함되는 PCB면이나 제2권선(26-2)이 포함되는 PCB면에 포함되는 요소들은 통상의 기술자에 의해 달라질 수 있다. 또한, 통상의 기술자에 의해 제2입력권선(26)의 제1권선(26-1)과 제2권선(26-2)은 병렬로 접속되어 구성될 수도 있다.Although not shown, in FIGS. 4 to 21, the second winding 25-2 to the third winding 25-3 of the first input winding 25 and the first winding of the second input winding 26 ( 26-1) Alternatively, the position of the PCB surface of the second winding 25-2 to the fourth winding 25-4 of the first input winding 25 may be variously changed by a person skilled in the art. In addition, elements included in the PCB surface including the first winding 26-1 of the second input winding 26 or the PCB surface including the second winding 26-2 may be changed by a person skilled in the art. . Also, by a person skilled in the art, the first winding 26-1 and the second winding 26-2 of the second input winding 26 may be connected in parallel to each other.
도 22는, 본 발명에 따르는 트랜스포머에 포함되는 다층PCB부(3-17)의 일 실시예로서, 특히 10층의 PCB면에 의해 구성되는 종래 기술의 트랜스포머(6)의 다층PCB부(3)를 대체할 수 있도록 구성한 것이다.22 is an embodiment of a multilayer PCB unit 3-17 included in the transformer according to the present invention, in particular, a multilayer PCB unit 3 of a conventional transformer 6 constituted by a 10-layer PCB surface. It is configured to be able to replace.
도 22의 다층PCB부(3-17)은, 다층PCB부(3-17)의 첫째 층의 PCB 면에 제1결합부(43-1)와 제2결합부(43-2)를 구성하고, 끝 층의 PCB 면에 제3결합부(45)를 구성한다. 둘째 층 내지 아홉 번째 층의 PCB면이 구성하는 요소들은 도 3의 다층PCB부(3)과 일치한다. 다층PCB부(3-17)에 있어서, 제1결합부(43-1)는 전원 장치의 1차측의 전기적인 접지에 연결된 도체 면(43-3)에 의해 구성된다. 제2결합부(43-2)는 상쇄권선(44)의 시작점이 Through hole(i)를 통해서 연결된 도체 면(43-5)에 의해 구성된다. 제3결합부(45)는, 상쇄권선(44)에 의해 구성된다. 도체 면(43-5)은 상쇄권선(44)의 시작점부터 끝 점 사이의 한 점에 연결될 수도 있다.The multilayer PCB part 3-17 of FIG. 22 comprises a first coupling part 43-1 and a second coupling part 43-2 on the PCB surface of the first layer of the multilayer PCB part 3-17, and , To configure the third coupling portion 45 on the PCB surface of the end layer. Elements constituting the second to ninth layers of the PCB surface coincide with the multilayer PCB part 3 of FIG. In the multilayer PCB portion 3-17, the first coupling portion 43-1 is constituted by a conductor surface 43-3 connected to the electrical ground on the primary side of the power supply device. The second coupling portion 43-2 is constituted by a conductor surface 43-5 connected to the starting point of the offset winding 44 through a Through hole (i). The 3rd coupling part 45 is comprised by the offset winding 44. The conductor surface 43-5 may be connected to a point between the start point and the end point of the offset winding 44.
도 22의 다층PCB부(3-17)의 두 번째 층 내지 아홉 번째 층의 PCB면의 구성은 도 3의 다층PCB부(3)과 일치한다.The configuration of the second to ninth layer PCB surface of the multilayer PCB unit 3-17 of FIG. 22 is identical to that of the multilayer PCB unit 3 of FIG. 3.
도 22의 다층PCB부(3-17)의 일 실시예에 있어서, In an embodiment of the multilayer PCB unit 3-17 of FIG. 22,
전원 장치의 1차측의 전기적인 접지의 전위를 가지는 제1결합부(43-1)는 제1입력권선(25)으로부터 제1출력권선(2-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합과 같은 극성의 스위칭 주파수 성분의 용량성 결합을 제1출력권선(2-1)으로 생성한다. 상쇄권선(44)의 시작점의 전위가 연결된 제2결합부(43-2)는 제1입력권선(25)으로부터 제1출력권선(2-1)으로 생성되는 스위칭 주파수 성분의 용량성 결합과 반대 극성의 스위칭 주파수 성분의 용량성 결합을 제1출력권선(2-1)으로 생성한다. 그러나, 제1결합부(43-1)와 제2결합부(43-2)의 차단에 의해 입력권선(7)과 제1보조권선(8)과 제2보조권선(9)은 제1출력권선(2)으로 용량성 결합을 거의 생성하지 않는다. 상쇄권선(44)의 시작점이 연결되는 제2결합부(43-2)의 전체 면적의 평균 전위는 상쇄권선(44)의 전체 면적의 평균 전위의 2 배이다. 그러므로, 제1결합부(43-1)와 제2결합부(43-2)는 상쇄권선(44)이 제1출력권선(2)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 최대 2배 크기의 스위칭 주파수 성분의 용량성 결합을 제1출력권선(2)으로 생성한다. 제1결합부(43-1)와 제2결합부(43-2)와 상쇄권선(44)이 제1출력권선(2)과 제2출력권선(4)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합의 크기가 도 3의 종래기술의 제2상쇄권선(11)이 제2출력권선(4)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 크기와 같다면, 상쇄권선(44)이 제2출력권선(4)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 크기를 도 3의 종래기술의 제2상쇄권선(11)이 제2출력권선(4)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 크기의 1/3이 된다. 그러므로, 상쇄권선(44)의 턴 수는 약 7턴으로 감소할 수 있다. 그런데, 상쇄권선(44)의 턴 수가 도 3의 종래기술의 제2상쇄권선(11)의 11 턴보다 작은 7턴으로 감소하면, 상쇄권선(44)을 구성하는 도체 사이의 간격의 개수도 도 3의 종래기술의 제2상쇄권선(11)의 10개의 간격에서 6개의 간격으로 감소하므로, 끝 층의 PCB면에서 도체가 없는 빈 면(43-6)의 면적이 40%나 감소한다. 그래서, 빈 면(43-6)을 통해서 입력권선(7)과 제1보조권선(8)과 제2보조권선(9)이 제2출력권선(4)으로 생성하는 용량성 결합도 40% 감소한다. 따라서, 상쇄권선(44)의 턴 수는 7턴 보다도 더 작게 줄일 수 있고, 그로 인해, 입력권선(7)과 제1보조권선(8)과 제2보조권선(9)이 제2출력권선(4)으로 생성하는 용량성 결합의 크기는 더욱 감소한다.The first coupling part 43-1 having the electric ground potential of the primary side of the power supply device is a capacitive coupling of the switching frequency components generated from the first input winding 25 to the first output winding 2-1. The capacitive coupling of the switching frequency components of the same polarity as is generated by the first output winding 2-1. The second coupling portion 43-2 to which the potential of the starting point of the offset winding 44 is connected is opposite to the capacitive coupling of the switching frequency components generated from the first input winding 25 to the first output winding 2-1. Capacitive coupling of the switching frequency components of the polarity is generated by the first output winding 2-1. However, by blocking the first coupling part 43-1 and the second coupling part 43-2, the input winding 7 and the first auxiliary winding 8 and the second auxiliary winding 9 are output as the first. Almost no capacitive coupling is created with the winding (2). The average potential of the total area of the second coupling portion 43-2 to which the start point of the offset winding 44 is connected is twice the average potential of the total area of the offset winding 44. Therefore, the first coupling portion 43-1 and the second coupling portion 43-2 have a maximum size of twice the capacitive coupling of the switching frequency components generated by the offset winding 44 as the first output winding 2 The capacitive coupling of the switching frequency components of is produced by the first output winding (2). Capacitiveness of the switching frequency component generated by the first and second coupling parts 43-1 and 43-2 and the offset winding 44 as the first and second output windings 2 and 4 If the size of the sum of the couplings is the same as the size of the capacitive coupling of the switching frequency components generated by the second offset winding 11 of the prior art in FIG. 3 as the second output winding 4, the offset winding 44 is the second The magnitude of the capacitive coupling of the switching frequency components generated by the output winding 4 is the capacitive coupling of the switching frequency components generated by the second offset winding 11 of the prior art in FIG. It becomes 1/3 of the size. Therefore, the number of turns of the offset winding 44 can be reduced to about 7 turns. By the way, if the number of turns of the offset winding 44 is reduced to 7 turns, which is less than 11 turns of the second offset winding 11 of FIG. 3, the number of gaps between the conductors constituting the offset winding 44 is also shown. Since it is reduced by 6 intervals from 10 intervals of the second offset winding 11 of the prior art of 3, the area of the empty surface 43-6 without a conductor in the PCB surface of the end layer is reduced by 40%. Therefore, the capacitive coupling generated by the input winding (7), the first auxiliary winding (8) and the second auxiliary winding (9) to the second output winding (4) through the blank surface (43-6) is also reduced by 40%. do. Therefore, the number of turns of the offset winding 44 can be reduced to be smaller than that of 7 turns, and thus, the input winding 7 and the first auxiliary winding 8 and the second auxiliary winding 9 are converted to the second output winding ( The size of capacitive bonds produced by 4) is further reduced.
도 22의 다층PCB부(3-17)를 사용하는 도 2의 전원 장치는, 첫째 층의 PCB면에서 제1결합부(43-1)가 차지하는 면적의 비율과 제2결합부(43-2)가 차지하는 면적의 비율을 조절하거나, 상쇄권선(44)의 턴 수 혹은 상쇄권선(44)을 구성하는 도체의 면적을 조절하여, 전원 장치의 1차측의 모든 요소들이 제1출력권선(2)과 제2출력권선(4)으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합을 “영”에 근접시키며, 전원장치의 출력선로의 스위칭 주파수 성분의 noise를 아주 낮게 낮춘다.In the power supply device of FIG. 2 using the multilayer PCB portion 3-17 of FIG. 22, the ratio of the area occupied by the first coupling portion 43-1 on the first-layer PCB surface and the second coupling portion 43-2 ), by adjusting the ratio of the area occupied by the offset winding 44, or by adjusting the number of turns of the offset winding 44 or the area of the conductor constituting the offset winding 44, all elements on the primary side of the power supply device are converted to the first output winding (2) The sum of the capacitive coupling of the switching frequency components generated by the and the second output winding 4 is close to "zero", and the noise of the switching frequency component of the output line of the power supply is very low.
도 22의 다층PCB부(3-17)가 비록 10층의 PCB면에 의해 구성되지만, 도 22의 다층PCB부(3-17)를 사용하는 도 2의 전원 장치에서, 입력권선(7)과 제1보조권선(8)과 제2보조권선(9)이 제1출력권선(2)과 제2출력권선(4)으로 생성하는 용량성 결합의 크기가 도 3의 다층PCB부(3)에 비해 훨씬 작으므로, 제1결합부(43-1)와 제2결합부(43-2)와 제3결합부(45)가 생성하는 역 극성의 용량성 결합에 의해서 상쇄가 이루어진 후의 용량성 결합의 잔량도 도 3의 다층PCB부(3)에 비해 훨씬 감소하고, 종래기술에 비해 외부로 스위칭 주파수 성분과 고주파 성분의 노이즈의 영향을 훨씬 작게 미치게 되는 장점을 가진다.Although the multilayer PCB section 3-17 of Fig. 22 is composed of a 10-layer PCB surface, in the power supply device of Fig. 2 using the multilayer PCB unit 3-17 of Fig. 22, the input winding 7 and the The size of the capacitive coupling created by the first auxiliary winding 8 and the second auxiliary winding 9 to the first output winding 2 and the second output winding 4 is in the multilayer PCB unit 3 of FIG. Since it is much smaller than that, the capacitive coupling after cancellation is achieved by the reverse polarity capacitive coupling generated by the first coupling portion 43-1, the second coupling portion 43-2, and the third coupling portion 45. The residual amount of is also significantly reduced compared to the multilayer PCB unit 3 of FIG. 3, and has an advantage that the influence of noise of the switching frequency component and the high-frequency component to the outside is much smaller than that of the prior art.
도시하지는 않았지만, 도 22에 보인 다층PCB부(3-17)의 제1결합부(43-1)는 도체가 없는 빈 면에 의해 구성될 수도 있고, 입력권선(7)의 일부분에 의해 구성될 수도 있고, 입력권선(7)의 일부분에 연결되는 도체 면에 의해 구성될 수도 있다. 제2결합부(43-2)는 상쇄권선(44)에 의해 구성될 수도 있다. 제3결합부(45)는 상쇄권선(44)의 시작점과 끝 점 사이의 한 점에 연결되는 도체 면에 의해 구성될 수도 있다.Although not shown, the first coupling part 43-1 of the multilayer PCB part 3-17 shown in FIG. 22 may be configured by a blank surface without a conductor, or may be configured by a part of the input winding 7. Alternatively, it may be configured by a conductor surface connected to a part of the input winding 7. The second coupling portion 43-2 may be configured by an offset winding 44. The third coupling portion 45 may be configured by a conductor surface connected to a point between the start point and the end point of the offset winding 44.
도시하지는 않았지만, 도 22에 보인 다층PCB부(3-17)의 일 실시예에서, 제1결합부(43-1)와 제2결합부(43-2)는 통상의 기술자에 의해 도 5 내지 도 21에서 보인 제1결합부(27-1 혹은 29-1 혹은 30-1 혹은 31-1 혹은 32-1 혹은 33-1 혹은 34-1 혹은 36-1 혹은 37-1 혹은 38-1 혹은 39-1 혹은 40-1 혹은 42-1)와 제2결합부(27-2 혹은 29-2 혹은 30-2 혹은 31-2 혹은 32-2 혹은 33-2 혹은 34-2 혹은 36-2 혹은 37-2 혹은 38-2 혹은 39-2 혹은 40-2 혹은 42-2)의 형태로 변경되어 구성될 수도 있다.Although not shown, in one embodiment of the multilayer PCB unit 3-17 shown in FIG. 22, the first coupling portion 43-1 and the second coupling portion 43-2 are shown in FIGS. 5 to 5 by a person skilled in the art. The first coupling part shown in Fig. 21 (27-1 or 29-1 or 30-1 or 31-1 or 32-1 or 33-1 or 34-1 or 36-1 or 37-1 or 38-1 or 39 -1 or 40-1 or 42-1) and the second coupling part (27-2 or 29-2 or 30-2 or 31-2 or 32-2 or 33-2 or 34-2 or 36-2 or 37 -2 or 38-2 or 39-2 or 40-2 or 42-2).
<부호의 설명><Explanation of code>
1은 트랜스포머 코어, 2와 2-1은 제1출력권선, 3과 3-1과 3-1a와 3-2와 3-3과 3-4와 3-5와 3-6과 3-7과 3-8과 3-9와 3-10과 3-11과 3-12와 3-13과 3-14와 3-15와 3-16과 3-17은 다층PCB부, 4와 4-1은 제2출력권선, 5는 트랜스포머 코어, 6과 6-1은 트랜스포머, 7은 입력권선, 8은 제1보조권선, 9는 제2보조권선, 10은 제1상쇄권선, 11은 제2상쇄권선, 12는 입력전압필터캐패시터, 13과 13-1은 스위칭소자, 14와 14-1은 제어부, 15와 15-1은 다이오드, 16과 16-1은 캐패시터, 17과 17-1은 저항, 18과 18-1은 저항, 19와 19-1은 다이오드, 20과 20-1은 캐패시터, 21과 21-1은 저항, 22는 정류기, 23은 캐패시터, 24는 출력선로, 25는 제1입력권선, 25-1은 제1입력권선의 제1권선, 25-2는 제1입력권선의 제2권선, 25-3은 제1입력권선의 제3권선, 25-4는 제1입력권선의 제4권선, 25-5은 제1입력권선의 제5권선, 26은 제2입력권선, 26-1은 제2입력권선의 제1권선, 26-2는 제2입력권선의 제2권선, 26-3은 제2입력권선의 제3권선, 26-5는 도체 면, 26-6은 빈 면, 27-1과 29-1과 30-1과 31-1과 32-1과 33-1과 34-1과 36-1과 37-1과 38-1과 39-1과 40-1과 43-1은 제1결합부, 27-2와 29-2와 30-2와 31-2와 32-2와 33-2와 34-2와 36-2와 37-2와 38-2와 39-2와 40-2와 42와 43-2는 제2결합부, 27-3과 29-3과 31-3과 34-3과 37-3과 38-3과 40-3과 43-3은 도체 면, 27-4와 29-4와 30-4와 31-4와 32-4와 33-4와 34-4와 36-4와 37-4와 38-4와 39-4와 40-4와 43-4는 빈 면, 27-5와 29-5와 30-5와 33-5와 43-5는 도체 면, 28과 28a와 45는 제3결합부, 35와 41은 도체 면, 44은 상쇄권선, 44-6은 빈 면.1 is the transformer core, 2 and 2-1 is the first output winding, 3 and 3-1 and 3-1a and 3-2 and 3-3 and 3-4 and 3-5 and 3-6 and 3-7 3-8 and 3-9 and 3-10 and 3-11 and 3-12 and 3-13 and 3-14 and 3-15 and 3-16 and 3-17 are multi-layer PCB parts, and 4 and 4-1 are The second output winding, 5 is the transformer core, 6 and 6-1 is the transformer, 7 is the input winding, 8 is the first auxiliary winding, 9 is the second auxiliary winding, 10 is the first offset winding, and 11 is the second offset winding. , 12 is an input voltage filter capacitor, 13 and 13-1 are switching elements, 14 and 14-1 are control units, 15 and 15-1 are diodes, 16 and 16-1 are capacitors, 17 and 17-1 are resistors, 18 And 18-1 are resistors, 19 and 19-1 are diodes, 20 and 20-1 are capacitors, 21 and 21-1 are resistors, 22 are rectifiers, 23 are capacitors, 24 are output lines, 25 are the first input winding , 25-1 is the first winding of the first input winding, 25-2 is the second winding of the first input winding, 25-3 is the third winding of the first input winding, and 25-4 is the first winding of the first input winding. 4 windings, 25-5 is the 5th winding of the 1st input winding, 26 is the 2nd input winding, 26-1 is the 1st winding of the 2nd input winding, 26-2 is the 2nd winding of the 2nd input winding, 26 -3 is the third winding of the second input winding, 26-5 is the conductor side, 26-6 is the blank side, 27-1 and 29-1 and 30-1 and 31-1 and 32-1 and 33-1 34-1, 36-1, 37-1, 38-1, 39-1, 40-1, and 43-1 are the first joint, 27-2, 29-2, 30-2, 31-2, 32 -2, 33-2, 34-2, 36-2, 37-2, 38-2, 39-2, 40-2, 42 and 43-2 are the second joints, 27-3 and 29-3 31-3 and 34-3 and 37-3 and 38-3 and 40-3 and 43-3 are conductor faces, 27-4 and 29-4 and 30-4 and 31-4 and 32-4 and 33-4 And 34-4 and 36-4 and 37-4 and 38-4 and 39-4 and 40-4 and 43-4 are empty sides, 27-5 and 29-5 and 30-5 and 33-5 and 43- 5 is the conductor face, 28 and 28a and 45 are the third joint, 35 and 4 1 is the conductor side, 44 is the offset winding, and 44-6 is the blank side.
이상 첨부한 도면을 참조하여 본 발명의 실시예를 설명하였지만, 통상의 기술자는 본 발명이 그 기술적 사상이나 필수적인 특징을 변경하지 않고서 여러 가지의 다른 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 설명한 실시예들은 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 한다.Although the embodiments of the present invention have been described above with reference to the accompanying drawings, those of ordinary skill in the art will understand that the present invention can be implemented in various other forms without changing the technical spirit or essential features thereof. Therefore, it should be understood that the embodiments described above are illustrative and non-limiting in all respects.

Claims (35)

  1. 입력전압필터캐패시터와; 제어부와; 스위칭소자와; 그리고 트랜스포머를 포함하는 전원장치의 트랜스포머에 있어서,An input voltage filter capacitor; A control unit; A switching element; And in the transformer of the power supply device including the transformer,
    상기 트랜스포머는,The transformer,
    트랜스포머의 코어와;The core of the transformer;
    상기 트랜스포머의 코어에 감겨지는 상기 트랜스포머의 1차측의 요소들을 여러 층의 PCB 면의 도체에 의해 구성하는 다층PCB부와; A multilayer PCB unit comprising elements on the primary side of the transformer wound around the core of the transformer by conductors on the multiple layers of the PCB;
    상기 트랜스포머의 코어에 감겨지고, 상기 다층PCB부의 한 쪽 끝 층과 결합하여 에너지를 인출하는 제1출력권선과; 그리고A first output winding wound around the core of the transformer and combined with one end layer of the multilayer PCB to extract energy; And
    상기 트랜스포머의 코어에 감겨지고, 상기 다층PCB부의 다른 한 쪽 끝 층과 결합하여 에너지를 인출하는 제2출력권선을 포함하고,A second output winding wound around the core of the transformer and combined with the other end layer of the multilayer PCB unit to extract energy,
    상기 다층PCB부는,The multilayer PCB unit,
    상기 전원장치의 상기 입력전압필터캐패시터의 일측 단자와 상기 스위칭소자의 일측 단자 사이에 연결되는 제1입력권선과; A first input winding connected between one terminal of the input voltage filter capacitor of the power supply and one terminal of the switching element;
    상기 전원장치의 상기 스위칭소자의 다른 일측 단자와 상기 입력전압필터캐패시터의 다른 일측 단자 사이에 연결되는 제2입력권선과;A second input winding connected between the other terminal of the switching device of the power supply and the other terminal of the input voltage filter capacitor;
    상기 다층PCB부의 한 쪽 끝 층의 일 부분에 위치하는 제1결합부와;A first coupling portion positioned at a portion of one end layer of the multilayer PCB portion;
    상기 다층PCB부의 한 쪽 끝 층의 다른 일 부분에 위치하는 제2결합부와; 그리고A second coupling part positioned at the other part of one end layer of the multilayer PCB part; And
    상기 다층PCB부의 다른 한 쪽 끝 층에 위치하는 제3결합부를 포함하되,Including a third coupling portion located on the other end layer of the multi-layer PCB portion,
    상기 전원장치에서, 상기 제1입력권선이 상기 제1출력권선으로 생성하는 스위칭 주파수 성분의 용량성 결합의 극성과 같은 극성의 스위칭 주파수 성분의 용량성 결합이 상기 제1결합부에 의해 상기 제1출력권선으로 생성되고,In the power supply device, the capacitive coupling of the switching frequency components of the same polarity as the polarity of the capacitive coupling of the switching frequency components generated by the first input winding to the first output winding is performed by the first coupling unit. Is created as an output winding,
    상기 전원장치에서, 상기 제1입력권선이 상기 제1출력권선으로 생성하는 스위칭 주파수 성분의 용량성 결합의 극성과 반대 극성의 스위칭 주파수 성분의 용량성 결합이 상기 제2결합부에 의해 상기 제1출력권선으로 생성되고,In the power supply device, a capacitive coupling of a switching frequency component having a polarity opposite to that of a capacitive coupling of a switching frequency component generated by the first input winding to the first output winding is performed by the second coupling unit. Is created as an output winding,
    상기 전원장치에서, 상기 제1입력권선이 상기 제2출력권선으로 생성하는 스위칭 주파수 성분의 용량성 결합과 반대 극성의 스위칭 주파수 성분의 용량성 결합이 상기 제3결합부에 의해 상기 제2출력권선으로 생성되고,In the power supply device, a capacitive coupling of a switching frequency component generated by the first input winding as the second output winding and a capacitive coupling of a switching frequency component of an opposite polarity are performed by the third coupling unit. Is created with
    상기 전원장치에서, 상기 제1결합부와 상기 제2결합부와 상기 제3결합부에 의해 상기 제1출력권선과 상기 제2출력권선으로 생성되는 스위칭 주파수 성분의 용량성 결합에 의해, 상기 전원장치의 1차측의 모든 요소들이 상기 제1출력권선과 제2출력권선으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합을 "영"에 근접시킴으로써, 상기 전원장치가 외부로 미치는 스위칭 주파수 성분의 노이즈의 영향을 낮추는 것을 특징으로 하는 트랜스포머.In the power supply device, by capacitive coupling of switching frequency components generated by the first output winding and the second output winding by the first coupling portion, the second coupling portion, and the third coupling portion, the power supply Noise of the switching frequency component of the power supply to the outside by bringing the sum of the capacitive coupling of the switching frequency components generated by the first and second output windings of the primary side of the device closer to "zero" Transformer, characterized in that lowering the influence of.
  2. 제1항의 트랜스포머에 있어서, 상기 제1결합부는 상기 전원 장치의 1차측의 전기적인 접지로 연결되는 도체 면을 포함하는 것을 특징으로 하는 트랜스포머.The transformer according to claim 1, wherein the first coupling part comprises a conductor surface connected to the electrical ground of the primary side of the power supply device.
  3. 제1항의 트랜스포머에 있어서, 상기 제1결합부는 상기 제1입력권선의 일부분을 포함하는 것을 특징으로 하는 트랜스포머.The transformer of claim 1, wherein the first coupling part includes a part of the first input winding.
  4. 제1항의 트랜스포머에 있어서, 상기 제1결합부는 상기 제1입력권선의 한쪽 끝점과 다른 한쪽 끝 점 사이의 한 점에 연결되는 도체면을 포함하는 것을 특징으로 하는 트랜스포머.The transformer of claim 1, wherein the first coupling portion comprises a conductor surface connected to a point between one end point of the first input winding and the other end point.
  5. 제1항의 트랜스포머에 있어서, 상기 제2입력권선은 일측 끝 점이 상기 스위칭소자의 다른 일측 단자로 연결되는 제2입력권선의 제1권선과 일측 끝 점이 상기 입력전압필터캐패시터의 다른 일측 단자로 연결되는 제2입력권선의 제2권선으로 나뉘어지고, 상기 제2결합부는 상기 제2입력권선의 제1권선과 상기 제2입력권선의 제2권선의 연결점에 연결되는 도체 면을 포함하는 것을 특징으로 하는 트랜스포머.The transformer of claim 1, wherein the second input winding has one end point connected to the other end point of the second input winding and one end point connected to the other end point of the input voltage filter capacitor. It is divided into a second winding of the second input winding, and the second coupling portion includes a conductor surface connected to a connection point between the first winding of the second input winding and the second winding of the second input winding. Transformer.
  6. 제1항의 트랜스포머에 있어서, 상기 제2입력권선은 일측 끝 점이 상기 스위칭소자의 다른 일측 단자로 연결되는 제2입력권선의 제1권선과 일측 끝 점이 상기 입력전압필터캐패시터의 다른 일측 단자로 연결되는 제2입력권선의 제2권선으로 나뉘어지고, 상기 제2결합부는 상기 제2입력권선의 제2권선의 한쪽 끝점과 다른 한쪽 끝 점 사이의 한 점에 연결되는 도체 면을 포함하는 것을 특징으로 하는 트랜스포머.The transformer of claim 1, wherein the second input winding has one end point connected to the other end point of the second input winding and one end point connected to the other end point of the input voltage filter capacitor. It is divided into a second winding of the second input winding, and the second coupling portion includes a conductor surface connected to a point between one end point of the second winding of the second input winding and the other end point. Transformer.
  7. 제1항의 트랜스포머에 있어서, 상기 제2입력권선은 일측 끝 점이 상기 스위칭소자의 다른 일측 단자로 연결되는 제2입력권선의 제1권선과 일측 끝 점이 상기 입력전압필터캐패시터의 다른 일측 단자로 연결되는 제2입력권선의 제2권선으로 나뉘어지고, 상기 제2결합부는 상기 제2입력권선의 제1권선의 한쪽 끝점과 다른 한쪽 끝 점 사이의 한 점에 연결되는 도체 면을 포함하는 것을 특징으로 하는 트랜스포머.The transformer of claim 1, wherein the second input winding has one end point connected to the other end point of the second input winding and one end point connected to the other end point of the input voltage filter capacitor. It is divided into a second winding of the second input winding, and the second coupling portion includes a conductor surface connected to a point between one end point of the first winding of the second input winding and the other end point. Transformer.
  8. 제1항의 트랜스포머에 있어서, 상기 제2결합부는 상기 스위칭소자의 다른 일측 단자로 연결되는 상기 제2입력권선의 일측 끝 점에 연결되는 도체 면을 포함하는 것을 특징으로 하는 트랜스포머.The transformer of claim 1, wherein the second coupling part comprises a conductor surface connected to one end point of the second input winding connected to the other terminal of the switching device.
  9. 제1항의 트랜스포머에 있어서, 상기 제2입력권선은 일측 끝 점이 상기 스위칭소자의 다른 일측 단자로 연결되는 제2입력권선의 제1권선과 일측 끝 점이 상기 입력전압필터캐패시터의 다른 일측 단자로 연결되는 제2입력권선의 제2권선으로 나뉘어지고, 상기 제2결합부는 상기 제2입력권선의 제1권선을 포함하는 것을 특징으로 하는 트랜스포머.The transformer of claim 1, wherein the second input winding has one end point connected to the other end point of the second input winding and one end point connected to the other end point of the input voltage filter capacitor. The transformer, wherein the second input winding is divided into a second winding, and the second coupling unit includes a first winding of the second input winding.
  10. 제1항의 트랜스포머에 있어서, 상기 제2입력권선은 일측 끝 점이 상기 스위칭소자의 다른 일측 단자로 연결되는 제2입력권선의 제1권선과 일측 끝 점이 상기 입력전압필터캐패시터의 다른 일측 단자로 연결되는 제2입력권선의 제2권선으로 나뉘어지고, 상기 제2결합부는 상기 제2입력권선의 제2권선을 포함하는 것을 특징으로 하는 트랜스포머.The transformer of claim 1, wherein the second input winding has one end point connected to the other end point of the second input winding and one end point connected to the other end point of the input voltage filter capacitor. A transformer, wherein the second input winding is divided into a second winding, and the second coupling unit includes a second winding of the second input winding.
  11. 제1항의 트랜스포머에 있어서, 상기 제2입력권선은 일측 끝 점이 상기 스위칭소자의 다른 일측 단자로 연결되는 제2입력권선의 제1권선과 일측 끝 점이 상기 입력전압필터캐패시터의 다른 일측 단자로 연결되는 제2입력권선의 제3권선과 상기 제2입력권선의 제1권선과 상기 제2입력권선의 제3권선 사이에 연결되는 제2입력권선의 제2권선으로 나뉘어지고, 상기 제2결합부는 상기 제2입력권선의 제1권선을 포함하는 것을 특징으로 하는 트랜스포머.The transformer of claim 1, wherein the second input winding has one end point connected to the other end point of the second input winding and one end point connected to the other end point of the input voltage filter capacitor. The second input winding is divided into a third winding of the second input winding and a second winding of the second input winding connected between the first winding of the second input winding and the third winding of the second input winding, and the second coupling unit A transformer comprising a first winding of a second input winding.
  12. 제1항의 트랜스포머에 있어서, 상기 제2입력권선은 일측 끝 점이 상기 스위칭소자의 다른 일측 단자로 연결되는 제2입력권선의 제1권선과 일측 끝 점이 상기 입력전압필터캐패시터의 다른 일측 단자로 연결되는 제2입력권선의 제3권선과 상기 제2입력권선의 제1권선과 상기 제2입력권선의 제3권선 사이에 연결되는 제2입력권선의 제2권선으로 나뉘어지고, 상기 제2결합부는 상기 제2입력권선의 제2권선을 포함하는 것을 특징으로 하는 트랜스포머.The transformer of claim 1, wherein the second input winding has one end point connected to the other end point of the second input winding connected to the other end point of the input voltage filter capacitor. The second input winding is divided into a third winding of the second input winding and a second winding of the second input winding connected between the first winding of the second input winding and the third winding of the second input winding, and the second coupling unit A transformer comprising a second winding of a second input winding.
  13. 제1항의 트랜스포머에 있어서, 상기 제2입력권선은 일측 끝 점이 상기 스위칭소자의 다른 일측 단자로 연결되는 제2입력권선의 제1권선과 일측 끝 점이 상기 입력전압필터캐패시터의 다른 일측 단자로 연결되는 제2입력권선의 제3권선과 상기 제2입력권선의 제1권선과 상기 제2입력권선의 제3권선 사이에 연결되는 제2입력권선의 제2권선으로 나뉘어지고, 상기 제2결합부는 상기 제2입력권선의 제3권선을 포함하는 것을 특징으로 하는 트랜스포머.The transformer of claim 1, wherein the second input winding has one end point connected to the other end point of the second input winding connected to the other end point of the input voltage filter capacitor. The second input winding is divided into a third winding of the second input winding and a second winding of the second input winding connected between the first winding of the second input winding and the third winding of the second input winding, and the second coupling unit A transformer comprising a third winding of the second input winding.
  14. 제1항의 트랜스포머에 있어서, 상기 제2결합부는 상기 제2입력권선의 일부분에 연결되는 도체 면을 포함하는 것을 특징으로 하는 트랜스포머.The transformer of claim 1, wherein the second coupling part includes a conductor surface connected to a portion of the second input winding.
  15. 제1항의 트랜스포머에 있어서, 상기 제2입력권선은 일측 끝 점이 상기 스위칭소자의 다른 일측 단자로 연결되는 제2입력권선의 제1권선과 일측 끝 점이 상기 입력전압필터캐패시터의 다른 일측 단자로 연결되는 제2입력권선의 제2권선으로 나뉘어지고, 상기 제3결합부는 상기 제2입력권선의 제2권선을 포함하는 것을 특징으로 하는 트랜스포머.The transformer of claim 1, wherein the second input winding has one end point connected to the other end point of the second input winding connected to the other end point of the input voltage filter capacitor. A transformer, wherein the second input winding is divided into a second winding, and the third coupling unit includes a second winding of the second input winding.
  16. 제1항의 트랜스포머에 있어서, 상기 제2입력권선은 일측 끝 점이 상기 스위칭소자의 다른 일측 단자로 연결되는 제2입력권선의 제1권선과 일측 끝 점이 상기 입력전압필터캐패시터의 다른 일측 단자로 연결되는 제2입력권선의 제2권선으로 나뉘어지고, 상기 제3결합부는 상기 제2입력권선의 제1권선을 포함하는 것을 특징으로 하는 트랜스포머.The transformer of claim 1, wherein the second input winding has one end point connected to the other end point of the second input winding connected to the other end point of the input voltage filter capacitor. The transformer, wherein the second input winding is divided into a second winding, and the third coupling unit includes a first winding of the second input winding.
  17. 제1항의 트랜스포머에 있어서, 상기 제3결합부는 상기 제2입력권선을 포함하는 것을 특징으로 하는 트랜스포머.The transformer of claim 1, wherein the third coupling part includes the second input winding.
  18. 제1항의 트랜스포머에 있어서, 상기 제3결합부는 상기 제2입력권선의 한쪽 끝점과 다른 한쪽 끝 점 사이의 한 점에 연결되는 도체 면을 포함하는 것을 특징으로 하는 트랜스포머.The transformer according to claim 1, wherein the third coupling portion includes a conductor surface connected to a point between one end point of the second input winding and the other end point.
  19. 입력전압필터캐패시터와; 제어부와; 스위칭소자와; 그리고 트랜스포머를 포함하는 전원장치의 트랜스포머에 있어서,An input voltage filter capacitor; A control unit; A switching element; And in the transformer of the power supply device including the transformer,
    상기 트랜스포머는,The transformer,
    트랜스포머의 코어와;The core of the transformer;
    상기 트랜스포머의 코어에 감겨지는 상기 트랜스포머의 1차측의 요소들을 여러 층의 PCB 면의 도체에 의해 구성하는 다층PCB부와;A multilayer PCB unit comprising elements on the primary side of the transformer wound around the core of the transformer by conductors on the multiple layers of the PCB;
    상기 트랜스포머의 코어에 감겨지고, 상기 다층PCB부의 한 쪽 끝 층과 결합하여 에너지를 인출하는 제1출력권선과; 그리고A first output winding wound around the core of the transformer and combined with one end layer of the multilayer PCB to extract energy; And
    상기 트랜스포머의 코어에 감겨지고, 상기 다층PCB부의 다른 한 쪽 끝 층과 결합하여 에너지를 인출하는 제2출력권선을 포함하고,A second output winding wound around the core of the transformer and combined with the other end layer of the multilayer PCB unit to extract energy,
    상기 다층PCB부는,The multilayer PCB unit,
    상기 전원장치의 상기 입력전압필터캐패시터의 일측 단자와 상기 스위칭소자의 일측 단자 사이에 연결되는 제1입력권선과; 그리고A first input winding connected between one terminal of the input voltage filter capacitor of the power supply and one terminal of the switching element; And
    상기 전원장치의 상기 스위칭소자의 다른 일측 단자와 상기 입력전압필터캐패시터의 다른 일측 단자 사이에 연결되는 제2입력권선을 포함하되,A second input winding connected between the other terminal of the switching element of the power supply and the other terminal of the input voltage filter capacitor,
    상기 제2입력권선은 제2입력권선의 제1권선과 제2입력권선의 제2권선으로 나뉘어지고,The second input winding is divided into a first winding of a second input winding and a second winding of a second input winding,
    상기 제2입력권선의 제1권선은 상기 다층PCB부의 한 쪽 끝 층의 PCB면에 위치하고, 상기 제2입력권선의 제2권선은 상기 다층PCB부의 다른 한 쪽 끝 층의 PCB면에 위치하며, The first winding of the second input winding is located on the PCB surface of one end layer of the multilayer PCB part, the second winding of the second input winding is located on the PCB surface of the other end layer of the multilayer PCB part,
    상기 전원장치에서, 상기 제2입력권선의 제1권선과 상기 제2입력권선의 제2권선이 상기 제1출력권선과 상기 제2출력권선으로 생성하는 스위칭 주파수 성분의 용량성 결합에 의해, 상기 전원장치의 1차측의 모든 요소들이 상기 제1출력권선과 제2출력권선으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합을 "영"에 근접시킴으로써, 상기 전원장치가 외부로 미치는 노이즈의 영향을 낮추는 것을 특징으로 하는 트랜스포머.In the power supply device, the first winding of the second input winding and the second winding of the second input winding are capacitively combined with a switching frequency component generated by the first output winding and the second output winding, By making the sum of the capacitive coupling of the switching frequency components generated by the first and second output windings of all the elements on the primary side of the power supply close to "zero", the effect of noise from the power supply to the outside is reduced. Transformer, characterized in that to lower.
  20. 제19항의 트랜스포머에 있어서, 상기 제2입력권선의 제1권선과 상기 제2입력권선의 제2권선은 직렬로 연결되는 것을 특징으로 하는 트랜스포머.The transformer of claim 19, wherein the first winding of the second input winding and the second winding of the second input winding are connected in series.
  21. 제19항의 트랜스포머에 있어서, 상기 제2입력권선의 제1권선과 상기 제2입력권선의 제2권선은 병렬로 연결되는 것을 특징으로 하는 트랜스포머.The transformer of claim 19, wherein the first winding of the second input winding and the second winding of the second input winding are connected in parallel.
  22. 제19항의 트랜스포머에 있어서, 상기 제2입력권선의 제1권선의 일부분에 도체 면이 연결되는 것을 특징으로 하는 트랜스포머.The transformer according to claim 19, wherein a conductor surface is connected to a part of the first winding of the second input winding.
  23. 제19항의 트랜스포머에 있어서, 상기 제2입력권선의 제1권선의 일부분의 폭이 다른 부분보다 넓은 것을 특징으로 하는 트랜스포머.The transformer according to claim 19, wherein a width of a part of the first winding of the second input winding is wider than that of another part.
  24. 제19항의 트랜스포머에 있어서, 상기 제2입력권선의 제2권선의 일부분에 도체 면이 연결되는 것을 특징으로 하는 트랜스포머.The transformer according to claim 19, wherein a conductor surface is connected to a part of the second winding of the second input winding.
  25. 제19항의 트랜스포머에 있어서, 상기 제2입력권선의 제2권선의 일부분의 폭이 다른 부분보다 넓은 것을 특징으로 하는 트랜스포머.The transformer according to claim 19, wherein a width of a part of the second winding of the second input winding is wider than that of another part.
  26. 입력전압필터캐패시터와; 제어부와; 스위칭소자와; 그리고 트랜스포머를 포함하는 전원장치의 트랜스포머에 있어서,An input voltage filter capacitor; A control unit; A switching element; And in the transformer of the power supply device including the transformer,
    상기 트랜스포머는,The transformer,
    트랜스포머의 코어와;The core of the transformer;
    상기 트랜스포머의 코어에 감겨지는 상기 트랜스포머의 1차측의 요소들을 여러 층의 PCB 면의 도체에 의해 구성하는 다층PCB부와;A multilayer PCB unit comprising elements on the primary side of the transformer wound around the core of the transformer by conductors on the multiple layers of the PCB;
    상기 트랜스포머의 코어에 감겨지고, 상기 다층PCB부의 한 쪽 끝 층과 결합하여 에너지를 인출하는 제1출력권선과; 그리고A first output winding wound around the core of the transformer and combined with one end layer of the multilayer PCB to extract energy; And
    상기 트랜스포머의 코어에 감겨지고, 상기 다층PCB부의 다른 한 쪽 끝 층과 결합하여 에너지를 인출하는 제2출력권선을 포함하고,A second output winding wound around the core of the transformer and combined with the other end layer of the multilayer PCB unit to extract energy,
    상기 다층PCB부는,The multilayer PCB unit,
    상기 전원장치의 상기 입력전압필터캐패시터의 일측 단자와 상기 스위칭소자의 일측 단자 사이에 연결되는 제1입력권선과; A first input winding connected between one terminal of the input voltage filter capacitor of the power supply and one terminal of the switching element;
    상기 전원장치의 상기 스위칭소자의 다른 일측 단자와 상기 입력전압필터캐패시터의 다른 일측 단자 사이에 연결되는 제2입력권선과; 그리고A second input winding connected between the other terminal of the switching device of the power supply and the other terminal of the input voltage filter capacitor; And
    상기 제2입력권선의 한쪽 끝점과 다른 한쪽 끝 점 사이의 한 점에 연결되는 도체 면을 포함하는 결합부를 포함하되,Including a coupling portion including a conductor surface connected to a point between one end point and the other end point of the second input winding,
    상기 다층PCB부의 한 쪽 끝 층의 PCB면에 상기 결합부가 위치하고, 상기 다층PCB부의 다른 한 쪽 끝 층의 PCB면에 상기 제2입력권선이 위치하고,The coupling part is located on the PCB surface of one end layer of the multilayer PCB part, and the second input winding is located on the PCB surface of the other end layer of the multilayer PCB part,
    상기 전원장치에서, 상기 결합부와 상기 제2입력권선이 상기 제1출력권선과 상기 제2출력권선으로 생성하는 스위칭 주파수 성분의 용량성 결합에 의해, 상기 전원장치의 1차측의 모든 요소들이 상기 제1출력권선과 제2출력권선으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합을 "영"에 근접시킴으로써, 상기 전원장치가 외부로 미치는 스위칭 주파수 성분의 노이즈의 영향을 낮추는 것을 특징으로 하는 트랜스포머.In the power supply device, by capacitive coupling of switching frequency components generated by the first output winding and the second output winding of the coupling portion and the second input winding, all elements of the primary side of the power supply device are A transformer, characterized in that the influence of noise of the switching frequency component exerted by the power supply to the outside is reduced by making the sum of the capacitive coupling of the switching frequency components generated by the first and second output windings approach "zero". .
  27. 입력전압필터캐패시터와; 제어부와; 스위칭소자와; 그리고 트랜스포머를 포함하는 전원장치의 트랜스포머에 있어서,An input voltage filter capacitor; A control unit; A switching element; And in the transformer of the power supply device including the transformer,
    상기 트랜스포머는,The transformer,
    트랜스포머의 코어와;The core of the transformer;
    상기 트랜스포머의 코어에 감겨지는 상기 트랜스포머의 1차측의 요소들을 여러 층의 PCB 면의 도체에 의해 구성하는 다층PCB부와;A multilayer PCB unit comprising elements on the primary side of the transformer wound around the core of the transformer by conductors on the multiple layers of the PCB;
    상기 트랜스포머의 코어에 감겨지고, 상기 다층PCB부의 한 쪽 끝 층과 결합하여 에너지를 인출하는 제1출력권선과; 그리고A first output winding wound around the core of the transformer and combined with one end layer of the multilayer PCB to extract energy; And
    상기 트랜스포머의 코어에 감겨지고, 상기 다층PCB부의 다른 한 쪽 끝 층과 결합하여 에너지를 인출하는 제2출력권선을 포함하고,A second output winding wound around the core of the transformer and combined with the other end layer of the multilayer PCB unit to extract energy,
    상기 다층PCB부는,The multilayer PCB unit,
    상기 전원장치의 상기 입력전압필터캐패시터의 일측 단자와 상기 스위칭소자의 일측 단자 사이에 연결되는 입력권선과; An input winding connected between one terminal of the input voltage filter capacitor of the power supply and one terminal of the switching element;
    상기 다층PCB부의 한 쪽 끝 층의 일 부분에 위치하는 제1결합부와;A first coupling portion positioned at a portion of one end layer of the multilayer PCB portion;
    상기 다층PCB부의 한 쪽 끝 층의 다른 일 부분에 위치하는 제2결합부와; 그리고A second coupling part positioned at the other part of one end layer of the multilayer PCB part; And
    상기 다층PCB부의 다른 한 쪽 끝 층에 위치하는 제3결합부를 포함하되,Including a third coupling portion located on the other end layer of the multi-layer PCB portion,
    상기 전원장치에서, 상기 입력권선이 상기 제1출력권선으로 생성하는 스위칭 주파수 성분의 용량성 결합의 극성과 같은 극성의 스위칭 주파수 성분의 용량성 결합이 상기 제1결합부에 의해 상기 제1출력권선으로 생성되고,In the power supply device, a capacitive coupling of a switching frequency component of the same polarity as that of a capacitive coupling of a switching frequency component generated by the input winding as the first output winding is performed by the first coupling unit. Is created with
    상기 전원장치에서, 상기 입력권선이 상기 제1출력권선으로 생성하는 스위칭 주파수 성분의 용량성 결합의 극성과 반대 극성의 스위칭 주파수 성분의 용량성 결합이 상기 제2결합부에 의해 상기 제1출력권선으로 생성되고,In the power supply device, a capacitive coupling of a switching frequency component having a polarity opposite to that of a capacitive coupling of a switching frequency component generated by the input winding as the first output winding is performed by the second coupling unit. Is created with
    상기 전원장치에서, 상기 입력권선이 상기 제2출력권선으로 생성하는 스위칭 주파수 성분의 용량성 결합과 반대 극성의 스위칭 주파수 성분의 용량성 결합이 상기 제3결합부에 의해 상기 제2출력권선으로 생성되며,In the power supply device, a capacitive coupling of a switching frequency component generated by the input winding to the second output winding and a capacitive coupling of a switching frequency component of an opposite polarity are generated as the second output winding by the third coupling unit. And
    상기 전원장치에서, 상기 제1결합부와 상기 제2결합부와 상기 제3결합부에 의해 상기 제1출력권선과 상기 제2출력권선으로 생성되는 스위칭 주파수 성분의 용량성 결합에 의해, 상기 전원장치의 1차측의 모든 요소들이 상기 제1출력권선과 제2출력권선으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합을 "영"에 근접시킴으로써, 상기 전원장치가 외부로 미치는 노이즈의 영향을 낮추는 것을 특징으로 하는 트랜스포머.In the power supply device, by capacitive coupling of switching frequency components generated by the first output winding and the second output winding by the first coupling portion, the second coupling portion, and the third coupling portion, the power supply The sum of the capacitive coupling of the switching frequency components generated by the first and second output windings of all elements on the primary side of the device is close to "zero", thereby reducing the influence of noise from the power supply to the outside. Transformer, characterized in that.
  28. 제27항의 트랜스포머에 있어서, 상기 제1결합부는 상기 전원 장치의 1차측의 전기적인 접지로 연결되는 도체 면을 포함하는 것을 특징으로 하는 트랜스포머.28. The transformer of claim 27, wherein the first coupling portion includes a conductor surface connected to the electrical ground of the primary side of the power supply device.
  29. 제27항의 트랜스포머에 있어서, 상기 제1결합부는 상기 입력권선의 일부분을 포함하는 것을 특징으로 하는 트랜스포머.28. The transformer of claim 27, wherein the first coupling portion includes a portion of the input winding.
  30. 제27항의 트랜스포머에 있어서, 상기 제1결합부는 상기 입력권선의 한쪽 끝점과 다른 한쪽 끝 점 사이의 한 점에 연결되는 도체면을 포함하는 것을 특징으로 하는 트랜스포머.28. The transformer of claim 27, wherein the first coupling portion includes a conductor surface connected to a point between one end point of the input winding and the other end point.
  31. 제27항의 트랜스포머에 있어서, 상기 제2결합부는 일측 끝점이 1차측의 전기적인 접지에 연결되는 상쇄권선을 포함하되, 상기 상쇄권선은 상기 제2출력권선의 전위의 변동의 극성과 같은 전위의 변동을 가지며, 상기 제3결합부는 상기 상쇄권선의 한쪽 끝점과 다른 한쪽 끝 점 사이의 한 점에 연결되는 도체 면을 포함하는 것을 특징으로 하는 트랜스포머.28. The transformer of claim 27, wherein the second coupling part includes a cancellation winding having one end point connected to the electrical ground of the primary side, and the offset winding is a variation of a potential such as a polarity of a variation of the potential of the second output winding. And the third coupling portion comprises a conductor surface connected to a point between one end point of the offset winding and the other end point.
  32. 제27항의 트랜스포머에 있어서, 상기 제3결합부는 일측 끝점이 1차측의 전기적인 접지에 연결되는 상쇄권선을 포함하되, 상기 상쇄권선은 상기 제2출력권선의 전위의 변동의 극성과 같은 전위의 변동을 가지며, 상기 제2결합부는 상기 상쇄권선의 한쪽 끝점과 다른 한쪽 끝 점 사이의 한 점에 연결되는 도체 면을 포함하는 것을 특징으로 하는 트랜스포머.28. The transformer of claim 27, wherein the third coupling part includes a cancellation winding whose one end point is connected to the electrical ground of the primary side, wherein the offset winding is a variation of a potential such as a polarity of a variation of the potential of the second output winding. And the second coupling portion comprises a conductor surface connected to a point between one end point of the offset winding and the other end point.
  33. 입력전압필터캐패시터와; 제어부와; 스위칭소자와; 그리고 트랜스포머를 포함하는 전원장치의 트랜스포머에 있어서,An input voltage filter capacitor; A control unit; A switching element; And in the transformer of the power supply device including the transformer,
    상기 트랜스포머는,The transformer,
    트랜스포머의 코어와;The core of the transformer;
    상기 트랜스포머의 코어에 감겨지는 상기 트랜스포머의 1차측의 요소들을 여러 층의 PCB 면의 도체에 의해 구성하는 다층PCB부와;A multilayer PCB unit comprising elements on the primary side of the transformer wound around the core of the transformer by conductors on the multiple layers of the PCB;
    상기 트랜스포머의 코어에 감겨지고, 상기 다층PCB부의 한 쪽 끝 층과 결합하여 에너지를 인출하는 제1출력권선과; 그리고A first output winding wound around the core of the transformer and combined with one end layer of the multilayer PCB to extract energy; And
    상기 트랜스포머의 코어에 감겨지고, 상기 다층PCB부의 다른 한 쪽 끝 층과 결합하여 에너지를 인출하는 제2출력권선을 포함하고,A second output winding wound around the core of the transformer and combined with the other end layer of the multilayer PCB unit to extract energy,
    상기 다층PCB부는,The multilayer PCB unit,
    상기 전원장치의 상기 입력전압필터캐패시터의 일측 단자와 상기 스위칭소자의 일측 단자 사이에 연결되는 입력권선과; An input winding connected between one terminal of the input voltage filter capacitor of the power supply and one terminal of the switching element;
    상기 다층PCB부의 한 쪽 끝의 층에 위치하는 결합부와; 그리고 A coupling part positioned on a layer at one end of the multilayer PCB part; And
    상기 다층PCB부의 다른 한 쪽 끝 층에 위치하는 상쇄권선을 포함하되,Including an offset winding located on the other end layer of the multilayer PCB unit,
    상기 상쇄권선은 상기 제1출력권선의 전위의 변동의 극성과 같은 극성의 전위의 변동을 가지며,The offset winding has a variation of a potential of a polarity equal to that of a variation of potential of the first output winding,
    상기 결합부는 상기 상쇄권선의 한쪽 끝점과 다른 한쪽 끝 점 사이의 한 점에 연결되는 도체 면을 포함하며,The coupling portion includes a conductor surface connected to a point between one end point of the offset winding and the other end point,
    상기 전원장치에서, 상기 결합부와 상기 상쇄권선이 상기 제1출력권선과 상기 제2출력권선으로 생성하는 스위칭 주파수 성분의 용량성 결합에 의해, 상기 전원장치의 1차측의 모든 요소들이 상기 제1출력권선과 제2출력권선으로 생성하는 스위칭 주파수 성분의 용량성 결합의 합을 "영"에 근접시킴으로써, 상기 전원장치가 외부로 미치는 노이즈의 영향을 낮추는 것을 특징으로 하는 트랜스포머.In the power supply unit, all elements of the primary side of the power supply unit are formed by capacitive coupling of switching frequency components generated by the first output winding and the second output winding by the coupling unit and the offset winding. A transformer, characterized in that the influence of noise exerted by the power supply to the outside is reduced by making the sum of the capacitive coupling of the switching frequency components generated by the output winding and the second output winding approach "zero".
  34. 제1항 내지 제33항 중 어느 한 항의 트랜스포머를 포함하는 것을 특징으로 하는 스위칭형 전원 장치.A switching type power supply device comprising the transformer of any one of claims 1 to 33.
  35. 제34항의 스위칭형 전원 장치를 포함하는 것을 특징으로 하는 제조된 물품.An article of manufacture comprising the switched power supply of claim 34.
PCT/KR2020/016602 2019-11-22 2020-11-23 Planar transformer and power supply WO2021101350A1 (en)

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KR20190151270 2019-11-22
KR10-2019-0151270 2019-11-22
KR10-2019-0153707 2019-11-26
KR20190153707 2019-11-26
KR20190163944 2019-12-10
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0869935A (en) * 1994-06-21 1996-03-12 Sumitomo Special Metals Co Ltd Manufacture of multilayered printed coil board, printed coil board, and multilayered printed coil board
US6211767B1 (en) * 1999-05-21 2001-04-03 Rompower Inc. High power planar transformer
JP2001145341A (en) * 1999-11-16 2001-05-25 Origin Electric Co Ltd Power semiconductor switching circuit and converter circuit
KR20160123581A (en) * 2015-04-16 2016-10-26 박찬웅 Transformer and power supply for cancelling noise generated by lines and windings
KR101904997B1 (en) * 2010-11-09 2018-10-08 박찬웅 Switching Type Power Supply for Cancelling Electrical Noise and Apparatus Comprising the Same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0869935A (en) * 1994-06-21 1996-03-12 Sumitomo Special Metals Co Ltd Manufacture of multilayered printed coil board, printed coil board, and multilayered printed coil board
US6211767B1 (en) * 1999-05-21 2001-04-03 Rompower Inc. High power planar transformer
JP2001145341A (en) * 1999-11-16 2001-05-25 Origin Electric Co Ltd Power semiconductor switching circuit and converter circuit
KR101904997B1 (en) * 2010-11-09 2018-10-08 박찬웅 Switching Type Power Supply for Cancelling Electrical Noise and Apparatus Comprising the Same
KR20160123581A (en) * 2015-04-16 2016-10-26 박찬웅 Transformer and power supply for cancelling noise generated by lines and windings

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