WO2021082055A1 - Mems sensor assembly manufacturing method and mems sensor assembly manufactured by method - Google Patents

Mems sensor assembly manufacturing method and mems sensor assembly manufactured by method Download PDF

Info

Publication number
WO2021082055A1
WO2021082055A1 PCT/CN2019/116570 CN2019116570W WO2021082055A1 WO 2021082055 A1 WO2021082055 A1 WO 2021082055A1 CN 2019116570 W CN2019116570 W CN 2019116570W WO 2021082055 A1 WO2021082055 A1 WO 2021082055A1
Authority
WO
WIPO (PCT)
Prior art keywords
filter membrane
mems sensor
heat
sensor assembly
adhesive layer
Prior art date
Application number
PCT/CN2019/116570
Other languages
French (fr)
Chinese (zh)
Inventor
游振江
林育菁
Original Assignee
潍坊歌尔微电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 潍坊歌尔微电子有限公司 filed Critical 潍坊歌尔微电子有限公司
Publication of WO2021082055A1 publication Critical patent/WO2021082055A1/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00158—Diaphragms, membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
    • B01D46/54—Particle separators, e.g. dust precipitators, using ultra-fine filter sheets or diaphragms
    • B01D46/543—Particle separators, e.g. dust precipitators, using ultra-fine filter sheets or diaphragms using membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00349—Creating layers of material on a substrate
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Definitions

  • the present disclosure mainly relates to a method for manufacturing a MEMS sensor component, and a MEMS sensor component manufactured by the method.
  • a particle filter is deployed in some MEMS sensor components, which prevents certain types of debris from entering the MEMS sensor.
  • a screen made of fine metal wires, or a porous structure formed of a silicon substrate with multiple through holes is often used as a dustproof film in a particle filter.
  • the nano dustproof film is easily damaged by conventional mechanical transfer and peeling processes during its manufacturing process. Therefore, there is an urgent need for a MEMS sensor assembly manufacturing method that can transfer and peel the film without damaging the film.
  • An object of the present disclosure is to provide a new technical solution for a method of manufacturing a MEMS sensor assembly.
  • a method of manufacturing a MEMS sensor assembly comprising: providing a filter membrane, including coating a buffer material on a side of a substrate covered with a heat-releasing adhesive layer so as to Forming a buffer layer on the heat-releasing adhesive layer, depositing a filter film material on the buffer layer to form a filter film, heating the substrate so that the buffer layer and the filter film are bonded together in a heat release The agent layer is pushed away from the substrate and the buffer layer is removed from the filter membrane.
  • the method further includes providing a MEMS sensor with an opening and capable of sensing through the opening.
  • the method also includes bonding the filter membrane to the MEMS sensor such that the filter membrane covers the opening.
  • the heat-releasing adhesive layer is composed of polymer microcapsules that are expanded by heat.
  • heating the substrate so that the buffer layer and the filter film are pushed away from the substrate under the action of the heat release adhesive layer includes: heating the substrate to cause the The polymer microcapsules expand together, so that the surface of the heat-releasing adhesive layer becomes uneven.
  • the buffer material is photoresist.
  • the filter membrane material is an amorphous metal material.
  • the amorphous metal material is metallic glass.
  • the filter membrane has a thickness of 5 nm to 5 ⁇ m.
  • the filter membrane has a thickness of 20 nm to 1000 nm.
  • a MEMS sensor assembly which is manufactured using the method according to the first aspect of the present disclosure.
  • the MEMS sensor component is used in a microphone module or a microphone chip.
  • the method according to the present disclosure can protect the nano-film from damage due to the conventional mechanical transfer process, thereby greatly improving the yield rate.
  • Fig. 1 schematically shows an embodiment of the method for manufacturing a MEMS sensor assembly according to the present disclosure, in which Fig. 1(A), Fig. 1(B), Fig. 1(C) and Fig. 1(D) sequentially show the filter The various steps in the film manufacturing process.
  • the present disclosure provides a method for manufacturing a MEMS sensor component and a MEMS sensor component manufactured by the method.
  • the MEMS sensor component can be used in acoustic equipment, for example, in a microphone chip or a microphone module.
  • the MEMS sensor assembly can also be used in other types of equipment, which will not be described in detail here.
  • Fig. 1 schematically shows an embodiment of a method for manufacturing a MEMS sensor assembly according to the present disclosure, in which Fig. 1(A), Fig. 1(B), Fig. 1(C) and Fig. 1(D) are shown in sequence The various steps in the membrane manufacturing process are described.
  • a buffer material is coated on the side of the substrate 100 covered with the heat-releasing adhesive layer 106 to form the buffer layer 102 on the heat-releasing adhesive layer 106.
  • the heat-releasing adhesive layer 106 may be composed of polymer microcapsules expanded by heat.
  • the buffer material may be a photoresist, so that it can be easily removed by common means such as light.
  • a filter membrane material is deposited on the buffer layer 102 to form a filter membrane 104.
  • the filter membrane material may be an amorphous metal material.
  • the filter membrane material is metallic glass.
  • Various metallic glass materials can be selected according to the manufacturing method and required performance.
  • the filter membrane 104 has a thickness of 5 nm to 5 ⁇ m, preferably 20 nm to 1000 nm.
  • metallic glass is isotropic and uniform, there are basically no defects such as grain boundaries and segregation caused by polycrystalline structure, and its size effect is small. Therefore, when designing the micro filter, it is not necessary to consider the changes in physical properties due to anisotropy and size, which facilitates the structural design of the micro filter. In addition, because metallic glass is an alloy composed of multiple elements, the range of material selection in the design of a micro filter is widened, and a higher performance micro filter can be designed and manufactured.
  • the substrate 100 may be heated by means of, for example, a heat source 108.
  • the heat is conducted to the heat release adhesive layer 106.
  • This causes the polymer microcapsules on the heat-releasing adhesive layer 106 to simultaneously expand together, so that the surface of the heat-releasing adhesive layer 106 becomes uneven, thereby causing the adhesive force of the heat-releasing adhesive layer 106 to disappear. Due to the disappearance of the adhesive force and the expansion of the polymer microcapsules, the buffer layer 102 to be adhered and the filter membrane 104 formed thereon are pushed away (away from) the substrate 100 at the same time, and will not be physically damaged in the process.
  • the buffer layer 102 has been removed to form the final product filter membrane 104.
  • the filter membrane manufacturing process shown in Figures (A) to (D) eliminates the direct physical interaction between the substrate 100 and the filter membrane 104, which is common in traditional mechanical transfer and peeling processes. Therefore, the risk of physical damage to the filter membrane 104 during the manufacturing process is greatly reduced.
  • the filter membrane provided in the manner shown in FIGS. 1(A) to (D) may be bonded to a MEMS sensor (not shown), thereby forming a MEMS sensor assembly.
  • the MEMS sensor has an opening, and the object to be measured can be contacted through the opening for sensing.
  • the process of providing the MEMS sensor is well known to those skilled in the art, and will not be repeated here.
  • Combining the filter membrane to the MEMS sensor can include making the filter membrane cover the opening of the sensor, so that the filter membrane can play a filtering role, and prevent particles, water and other debris from entering the MEMS sensor assembly without affecting the sensor's sensing function. in.

Abstract

A method for manufacturing an MEMS sensor assembly, comprising: providing a filter membrane (104), comprising coating a buffer material on one surface of a substrate (100) where a heat release adhesive layer (106) covers to form a buffer layer (102) on the heat release adhesive layer (106), and depositing a filter membrane material on the buffer layer (102) to form the filter membrane (104); heating the substrate (100) so that the buffer layer (102) and the filter membrane (104) together are pushed away from the substrate (100) under the action of the heat release adhesive layer (106); removing the buffer layer (102) from the filter membrane (104); providing an MEMS sensor having an opening and capable of sensing by means of the opening; and bonding the filter membrane (104) to the MEMS sensor so that the filter membrane (104) covers the opening. The method reduces the risk of physical damage to the filter membrane (104) in a manufacturing process.

Description

MEMS传感器组件制造方法、以及以该法制造的MEMS传感器组件MEMS sensor component manufacturing method, and MEMS sensor component manufactured by the method 技术领域Technical field
本公开内容主要涉及用于制造MEMS传感器组件的方法，以及以该方法制造的MEMS传感器组件。The present disclosure mainly relates to a method for manufacturing a MEMS sensor component, and a MEMS sensor component manufactured by the method.
背景技术Background technique
现今，诸如笔记本电脑、平板电脑之类的便携式计算设备十分普遍，诸如智能手机之类的便携式通信设备也是如此。然而，这样的设备中留给麦克风或扬声器的内部空间十分有限。因此，麦克风和扬声器尺寸越来越小，并且变得越来越紧凑。此外，由于麦克风和扬声器部署在紧凑的便携式设备中，它们通常需要靠近设备的相关的声学输入或输出端口，故而容易因颗粒和水的进入而造成其中的MEMS传感器的故障。Nowadays, portable computing devices such as notebook computers and tablet computers are very common, as are portable communication devices such as smart phones. However, the internal space left for microphones or speakers in such devices is very limited. Therefore, microphones and speakers are getting smaller and smaller in size and becoming more and more compact. In addition, because microphones and speakers are deployed in compact portable devices, they usually need to be close to the related acoustic input or output ports of the device, so the ingress of particles and water can easily cause the malfunction of the MEMS sensor therein.
在现有技术中，在有些MEMS传感器组件中会部署有颗粒过滤器，其防止某些类型的碎屑进入MEMS传感器中。In the prior art, a particle filter is deployed in some MEMS sensor components, which prevents certain types of debris from entering the MEMS sensor.
当前，由细金属丝制成的丝网，或是由具有多个通孔的硅基板来形成的多孔结构，常常被用作颗粒过滤器中的防尘膜。然而，纳米防尘膜在其制造过程中容易因常规的机械转移和剥离工艺而受损。因此，亟需一种能够在不损坏薄膜的前提下将薄膜转移和剥离的MEMS传感器组件制造方法。Currently, a screen made of fine metal wires, or a porous structure formed of a silicon substrate with multiple through holes, is often used as a dustproof film in a particle filter. However, the nano dustproof film is easily damaged by conventional mechanical transfer and peeling processes during its manufacturing process. Therefore, there is an urgent need for a MEMS sensor assembly manufacturing method that can transfer and peel the film without damaging the film.
发明内容Summary of the invention
本公开内容的一个目的是提供一种制造MEMS传感器组件的方法的新技术方案。An object of the present disclosure is to provide a new technical solution for a method of manufacturing a MEMS sensor assembly.
根据本公开内容的第一方面，提供了一种制造MEMS传感器组件的方法，该方法包括：提供滤膜，包括将缓冲材料涂覆在基板的覆盖有热释 放粘合剂层的一面以在所述热释放粘合剂层上形成缓冲层、将滤膜材料沉积在所述缓冲层上以形成滤膜、对所述基板加热从而使得所述缓冲层与所述滤膜一起在热释放粘合剂层的作用下被推离所述基板、以及从所述滤膜上除去所述缓冲层。所述方法还包括提供MEMS传感器，所述MEMS传感器上具有开口并且能够经由该开口进行感测。所述方法还包括将所述滤膜结合到所述MEMS传感器上，使得所述滤膜覆盖所述开口。According to a first aspect of the present disclosure, there is provided a method of manufacturing a MEMS sensor assembly, the method comprising: providing a filter membrane, including coating a buffer material on a side of a substrate covered with a heat-releasing adhesive layer so as to Forming a buffer layer on the heat-releasing adhesive layer, depositing a filter film material on the buffer layer to form a filter film, heating the substrate so that the buffer layer and the filter film are bonded together in a heat release The agent layer is pushed away from the substrate and the buffer layer is removed from the filter membrane. The method further includes providing a MEMS sensor with an opening and capable of sensing through the opening. The method also includes bonding the filter membrane to the MEMS sensor such that the filter membrane covers the opening.
可选地，所述热释放粘合剂层由受热膨胀的聚合物微囊构成。Optionally, the heat-releasing adhesive layer is composed of polymer microcapsules that are expanded by heat.
可选地，对所述基板加热从而使得所述缓冲层与所述滤膜一起在所述热释放粘合剂层的作用下被推离所述基板包括：对所述基板加热以使得所述聚合物微囊一起膨胀，从而使得所述热释放粘合剂层的表面变得凹凸不平。Optionally, heating the substrate so that the buffer layer and the filter film are pushed away from the substrate under the action of the heat release adhesive layer includes: heating the substrate to cause the The polymer microcapsules expand together, so that the surface of the heat-releasing adhesive layer becomes uneven.
可选地，所述缓冲材料是光致抗蚀剂。Optionally, the buffer material is photoresist.
可选地，所述滤膜材料是非晶金属材料。Optionally, the filter membrane material is an amorphous metal material.
可选地，所述非晶金属材料是金属玻璃。Optionally, the amorphous metal material is metallic glass.
可选地，所述滤膜具有5nm至5μm的厚度。Optionally, the filter membrane has a thickness of 5 nm to 5 μm.
可选地，所述滤膜具有20nm至1000nm的厚度。Optionally, the filter membrane has a thickness of 20 nm to 1000 nm.
根据本公开内容的第二方面，提供了一种MEMS传感器组件，其是采用根据本公开内容的第一方面的方法来制造的。According to a second aspect of the present disclosure, there is provided a MEMS sensor assembly, which is manufactured using the method according to the first aspect of the present disclosure.
可选地，所述MEMS传感器组件是用在麦克风模组或麦克风芯片中的。Optionally, the MEMS sensor component is used in a microphone module or a microphone chip.
在一个实施例中，根据本公开内容的方法能够保护纳米薄膜免于因常规机械转移工艺而受损，从而使得良率大为提高。In one embodiment, the method according to the present disclosure can protect the nano-film from damage due to the conventional mechanical transfer process, thereby greatly improving the yield rate.
通过以下参照附图对本公开内容的示例性实施例的详细描述，本公开内容的其它特征及其优点将会变得清楚。Through the following detailed description of exemplary embodiments of the present disclosure with reference to the accompanying drawings, other features and advantages of the present disclosure will become clear.
附图说明Description of the drawings
被结合在说明书中并构成说明书的一部分的附图示出了本公开内容的实施例，并且连同其说明一起用于解释本公开内容的原理。The drawings incorporated in the specification and constituting a part of the specification illustrate embodiments of the present disclosure, and together with the description thereof, serve to explain the principle of the present disclosure.
图1概略示出了根据本公开内容的MEMS传感器组件制造方法的一 个实施方案，其中图1(A)、图1(B)、图1(C)和图1(D)依次示出了滤膜制造过程中的各个步骤。Fig. 1 schematically shows an embodiment of the method for manufacturing a MEMS sensor assembly according to the present disclosure, in which Fig. 1(A), Fig. 1(B), Fig. 1(C) and Fig. 1(D) sequentially show the filter The various steps in the film manufacturing process.
具体实施方式Detailed ways
现在将参照附图来详细描述本公开内容的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本公开内容的范围。Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that unless specifically stated otherwise, the relative arrangement, numerical expressions and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present disclosure.
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本公开内容及其应用或使用的任何限制。The following description of at least one exemplary embodiment is actually only illustrative, and in no way serves as any limitation to the present disclosure and its application or use.
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论，但在适当情况下，所述技术、方法和设备应当被视为说明书的一部分。The technologies, methods, and equipment known to those of ordinary skill in the relevant fields may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be regarded as part of the specification.
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。In all examples shown and discussed herein, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of the exemplary embodiment may have different values.
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。It should be noted that similar reference numerals and letters indicate similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.
本公开内容提供了一种MEMS传感器组件制造方法、以及以该法制造的MEMS传感器组件。该MEMS传感器组件可以用在声学设备中，例如用在麦克风芯片或麦克风模组中。当然，对于本领域技术人员而言，该MEMS传感器组件也可以用在其它类型的设备中，在此不再具体说明。The present disclosure provides a method for manufacturing a MEMS sensor component and a MEMS sensor component manufactured by the method. The MEMS sensor component can be used in acoustic equipment, for example, in a microphone chip or a microphone module. Of course, for those skilled in the art, the MEMS sensor assembly can also be used in other types of equipment, which will not be described in detail here.
图1概略示出了根据本公开内容的用于制造MEMS传感器组件的方法的一个实施方案，其中图1(A)、图1(B)、图1(C)和图1(D)依次示出了滤膜制造过程中的各个步骤。Fig. 1 schematically shows an embodiment of a method for manufacturing a MEMS sensor assembly according to the present disclosure, in which Fig. 1(A), Fig. 1(B), Fig. 1(C) and Fig. 1(D) are shown in sequence The various steps in the membrane manufacturing process are described.
如图1(A)所示，首先，缓冲材料被涂覆在基板100的覆盖有热释放粘合剂层106的一面，以在热释放粘合剂层106上形成缓冲层102。热释放粘合剂层106可以由受热膨胀的聚合物微囊构成。缓冲材料可以是光致抗蚀剂，从而容易通过常用手段例如光照来将其除去。As shown in FIG. 1(A), first, a buffer material is coated on the side of the substrate 100 covered with the heat-releasing adhesive layer 106 to form the buffer layer 102 on the heat-releasing adhesive layer 106. The heat-releasing adhesive layer 106 may be composed of polymer microcapsules expanded by heat. The buffer material may be a photoresist, so that it can be easily removed by common means such as light.
如图1(B)所示，在缓冲层102上沉积滤膜材料从而形成滤膜104。 在一个实施方案中，滤膜材料可以是非晶金属材料。优选地，滤膜材料是金属玻璃。可以根据制造方法和所需性能选择各种金属玻璃材料。在一个实施例中，滤膜104具有5nm至5μm，优选20nm至1000nm的厚度。As shown in FIG. 1(B), a filter membrane material is deposited on the buffer layer 102 to form a filter membrane 104. In one embodiment, the filter membrane material may be an amorphous metal material. Preferably, the filter membrane material is metallic glass. Various metallic glass materials can be selected according to the manufacturing method and required performance. In one embodiment, the filter membrane 104 has a thickness of 5 nm to 5 μm, preferably 20 nm to 1000 nm.
由于金属玻璃是各向同性和均匀的，故而基本上不存在由于多晶结构引起的缺陷诸如晶粒边界和偏析等，并且其尺寸效应小。因此，在设计微型过滤器时，不必考虑由于各向异性和尺寸引起的物理性质的变化，这方便了微型过滤器的结构设计。另外，由于金属玻璃是由多种元素组成的合金，因此微型过滤器设计中材料选择的范围变宽，并且可以设计和制造更高性能的微型过滤器。Since metallic glass is isotropic and uniform, there are basically no defects such as grain boundaries and segregation caused by polycrystalline structure, and its size effect is small. Therefore, when designing the micro filter, it is not necessary to consider the changes in physical properties due to anisotropy and size, which facilitates the structural design of the micro filter. In addition, because metallic glass is an alloy composed of multiple elements, the range of material selection in the design of a micro filter is widened, and a higher performance micro filter can be designed and manufactured.
如图1(C)所示，对基板100加热可以借助于例如热源108。当基板100受热时，热传导到热释放粘合剂层106。这导致热释放粘合剂层106上聚合物微囊同时一起膨胀，使得热释放粘合剂层106的表面变得凹凸不平，从而导致热释放粘合剂层106的粘合力消失。由于粘合力的消失和聚合物微囊的膨胀，被粘的缓冲层102与形成于其上的滤膜104被同时推离(背离)基板100，在该过程中不会受到物理损坏。As shown in FIG. 1(C), the substrate 100 may be heated by means of, for example, a heat source 108. When the substrate 100 is heated, the heat is conducted to the heat release adhesive layer 106. This causes the polymer microcapsules on the heat-releasing adhesive layer 106 to simultaneously expand together, so that the surface of the heat-releasing adhesive layer 106 becomes uneven, thereby causing the adhesive force of the heat-releasing adhesive layer 106 to disappear. Due to the disappearance of the adhesive force and the expansion of the polymer microcapsules, the buffer layer 102 to be adhered and the filter membrane 104 formed thereon are pushed away (away from) the substrate 100 at the same time, and will not be physically damaged in the process.
如图1(D)所示，缓冲层102已被移除，形成最终产品滤膜104。As shown in FIG. 1(D), the buffer layer 102 has been removed to form the final product filter membrane 104.
如图(A)至(D)所示的滤膜制造过程免除了在基板100和滤膜104之间的直接的物理相互作用，而那在传统的机械转移和剥离过程中是常见的。因此，滤膜104在制造过程中受到物理损坏的风险大大降低。The filter membrane manufacturing process shown in Figures (A) to (D) eliminates the direct physical interaction between the substrate 100 and the filter membrane 104, which is common in traditional mechanical transfer and peeling processes. Therefore, the risk of physical damage to the filter membrane 104 during the manufacturing process is greatly reduced.
按照如图1(A)至(D)所示的方式提供的滤膜可被结合到MEMS传感器(未示出)上，由此形成MEMS传感器组件。MEMS传感器上具有开口，并且能够经由该开口接触待测物从而进行感测。提供MEMS传感器的工艺为本领域技术人员熟知，在此不再赘述。将滤膜结合到MEMS传感器上可以包括使得滤膜覆盖传感器的开口，从而使得滤膜能够起到过滤作用，在不影响传感器的感测功能的前提下防止颗粒、水等碎屑进入MEMS传感器组件中。The filter membrane provided in the manner shown in FIGS. 1(A) to (D) may be bonded to a MEMS sensor (not shown), thereby forming a MEMS sensor assembly. The MEMS sensor has an opening, and the object to be measured can be contacted through the opening for sensing. The process of providing the MEMS sensor is well known to those skilled in the art, and will not be repeated here. Combining the filter membrane to the MEMS sensor can include making the filter membrane cover the opening of the sensor, so that the filter membrane can play a filtering role, and prevent particles, water and other debris from entering the MEMS sensor assembly without affecting the sensor's sensing function. in.
虽然已经通过例子对本公开内容的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上例子仅是为了进行说明，而不是为了限制本公开内容的范围。本领域的技术人员应该理解，可在不脱离本公 开内容的范围和精神的情况下，对以上实施例进行修改。本公开内容的范围由所附权利要求来限定。Although some specific embodiments of the present disclosure have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present disclosure. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the content of this disclosure. The scope of the present disclosure is defined by the appended claims.

Claims (10)

  1. 一种制造MEMS传感器组件的方法，其特征在于，包括：A method of manufacturing a MEMS sensor assembly, characterized in that it comprises:
    提供滤膜，包括：Provide membranes, including:
    将缓冲材料涂覆在基板的覆盖有热释放粘合剂层的一面，以在所述热释放粘合剂层上形成缓冲层，Coating a buffer material on the side of the substrate covered with the heat-releasing adhesive layer to form a buffer layer on the heat-releasing adhesive layer,
    将滤膜材料沉积在所述缓冲层上以形成滤膜；Depositing a filter membrane material on the buffer layer to form a filter membrane;
    对所述基板加热，从而使得所述缓冲层与所述滤膜一起在所述热释放粘合剂层的作用下被推离所述基板；以及Heating the substrate, so that the buffer layer and the filter film are pushed away from the substrate under the action of the heat release adhesive layer; and
    从所述滤膜上除去所述缓冲层；Removing the buffer layer from the filter membrane;
    提供MEMS传感器，所述MEMS传感器上具有开口并且能够经由该开口进行感测；以及Provide a MEMS sensor, which has an opening and can be sensed through the opening; and
    将所述滤膜结合到所述MEMS传感器上，使得所述滤膜覆盖所述开口。The filter membrane is bonded to the MEMS sensor so that the filter membrane covers the opening.
  2. 根据权利要求1所述的方法，其特征在于，所述热释放粘合剂层由受热膨胀的聚合物微囊构成。The method according to claim 1, wherein the heat-releasing adhesive layer is composed of polymer microcapsules that expand by heat.
  3. 根据权利要求2所述的方法，其特征在于，对所述基板加热从而使得所述缓冲层与所述滤膜一起在所述热释放粘合剂层的作用下被推离所述基板包括：The method of claim 2, wherein heating the substrate so that the buffer layer and the filter film are pushed away from the substrate under the action of the heat-releasing adhesive layer together comprising:
    对所述基板加热以使得所述聚合物微囊一起膨胀，从而使得所述热释放粘合剂层的表面变得凹凸不平。The substrate is heated to expand the polymer microcapsules together, so that the surface of the heat-releasing adhesive layer becomes uneven.
  4. 根据权利要求1所述的方法，其特征在于，所述缓冲材料是光致抗蚀剂。The method of claim 1, wherein the buffer material is a photoresist.
  5. 根据权利要求1所述的方法，其特征在于，所述滤膜材料是非晶金属材料。The method according to claim 1, wherein the filter membrane material is an amorphous metal material.
  6. 根据权利要求5所述的方法，其特征在于，所述非晶金属材料是金属玻璃。The method according to claim 5, wherein the amorphous metal material is metallic glass.
  7. 根据权利要求1所述的方法，其特征在于，所述滤膜具有5nm至5μm的厚度。The method according to claim 1, wherein the filter membrane has a thickness of 5 nm to 5 μm.
  8. 根据权利要求7所述的方法，其特征在于，所述滤膜具有20nm至1000nm的厚度。The method according to claim 7, wherein the filter membrane has a thickness of 20 nm to 1000 nm.
  9. 一种MEMS传感器组件，其特征在于是采用根据权利要求1至8中任意一项所述的方法来制造的。A MEMS sensor assembly characterized by being manufactured by the method according to any one of claims 1 to 8.
  10. 根据权利要求9所述的MEMS传感器组件，其特征在于，所述MEMS传感器组件是用在麦克风模组或麦克风芯片中的。The MEMS sensor assembly according to claim 9, wherein the MEMS sensor assembly is used in a microphone module or a microphone chip.
PCT/CN2019/116570 2019-10-31 2019-11-08 Mems sensor assembly manufacturing method and mems sensor assembly manufactured by method WO2021082055A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201911056438.0A CN110775940B (en) 2019-10-31 2019-10-31 Method for manufacturing MEMS sensor assembly, and MEMS sensor assembly manufactured by the method
CN201911056438.0 2019-10-31

Publications (1)

Publication Number Publication Date
WO2021082055A1 true WO2021082055A1 (en) 2021-05-06

Family

ID=69388399

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/116570 WO2021082055A1 (en) 2019-10-31 2019-11-08 Mems sensor assembly manufacturing method and mems sensor assembly manufactured by method

Country Status (2)

Country Link
CN (1) CN110775940B (en)
WO (1) WO2021082055A1 (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106744664A (en) * 2016-11-22 2017-05-31 歌尔股份有限公司 The method and MEMS sensor of screen pack are formed in MEMS sensor
CN107105378A (en) * 2017-06-05 2017-08-29 歌尔股份有限公司 MEMS chip, microphone and preparation method and method for packing
CN107615364A (en) * 2015-05-27 2018-01-19 夏普株式会社 The manufacture method of display panel
WO2018064804A1 (en) * 2016-10-08 2018-04-12 Goertek. Inc Mems device and electronics apparatus
CN109890748A (en) * 2017-06-09 2019-06-14 歌尔股份有限公司 MEMS microphone, its manufacturing method and electronic equipment
CN110191409A (en) * 2019-05-23 2019-08-30 深圳市伊声声学科技有限公司 A kind of manufacturing method of waterproof ventilated membrane
CN110267173A (en) * 2019-06-28 2019-09-20 歌尔股份有限公司 A kind of microfilter and acoustic equipment

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5669835A (en) * 1979-11-09 1981-06-11 Japan Electronic Ind Dev Assoc<Jeida> Method for forming thin film pattern
AU780338B2 (en) * 1999-12-08 2005-03-17 Baxter International Inc. Microporous filter membrane, method of making microporous filter membrane and separator employing microporous filter membranes
US20080102648A1 (en) * 2006-11-01 2008-05-01 Taiwan Semiconductor Manufacturing Company, Ltd. Method and System For Making Photo-Resist Patterns
CN105051137A (en) * 2013-03-15 2015-11-11 日东电工株式会社 Adhesive sheet

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107615364A (en) * 2015-05-27 2018-01-19 夏普株式会社 The manufacture method of display panel
WO2018064804A1 (en) * 2016-10-08 2018-04-12 Goertek. Inc Mems device and electronics apparatus
CN106744664A (en) * 2016-11-22 2017-05-31 歌尔股份有限公司 The method and MEMS sensor of screen pack are formed in MEMS sensor
CN107105378A (en) * 2017-06-05 2017-08-29 歌尔股份有限公司 MEMS chip, microphone and preparation method and method for packing
CN109890748A (en) * 2017-06-09 2019-06-14 歌尔股份有限公司 MEMS microphone, its manufacturing method and electronic equipment
CN110191409A (en) * 2019-05-23 2019-08-30 深圳市伊声声学科技有限公司 A kind of manufacturing method of waterproof ventilated membrane
CN110267173A (en) * 2019-06-28 2019-09-20 歌尔股份有限公司 A kind of microfilter and acoustic equipment

Also Published As

Publication number Publication date
CN110775940B (en) 2023-08-15
CN110775940A (en) 2020-02-11

Similar Documents

Publication Publication Date Title
US10233075B2 (en) Method for forming filter net on MEMS sensor and MEMS sensor
US10815122B2 (en) MEMS microphone and preparation method thereof
US11722808B2 (en) Micro-filter and acoustic device
WO2021135110A1 (en) Dustproof structure and mems microphone packaging structure used for mems device
CN208063457U (en) MEMS (MEMS) energy converter and MEMS (MEMS) microphone assembly
CN109890748A (en) MEMS microphone, its manufacturing method and electronic equipment
US20110073967A1 (en) Apparatus and method of forming a mems acoustic transducer with layer transfer processes
US20160286317A1 (en) Capacitive silicon microphone and fabrication method thereof
WO2021135124A1 (en) Dustproof structure, microphone packaging structure and electronic device
CN110944276A (en) A dustproof construction and MEMS microphone packaging structure for MEMS device
CN103832967B (en) The processing method of MEMS sensor
CN103818872B (en) MEMS and the method manufacturing MEMS
TW200952508A (en) MEMS microphone package and MEMS microphone chip thereof
WO2020258364A1 (en) Microfilter and acoustic device
CN108600928A (en) MEMS device and its manufacturing method
WO2020258362A1 (en) Microfilter and acoustic device
CN105744388B (en) The manufacturing method of acoustic sensor and acoustic sensor
US8198715B2 (en) MEMS device and process
WO2021082055A1 (en) Mems sensor assembly manufacturing method and mems sensor assembly manufactured by method
WO2021082052A1 (en) Microfilter and mems sensor assembly
WO2021135119A1 (en) Dustproof structure for mems device and mems microphone packaging structure
WO2020258361A1 (en) Microfilter and acoustic device
WO2021082044A1 (en) Mems sensor assembly manufacturing method and sensor assembly manufactured by means of said method
WO2021082054A1 (en) Micro-nano structure assembly manufacturing method and micro-nano structure assembly manufactured by the method
WO2021082051A1 (en) Micro-nano structure assembly manufacturing method, and micro-nano structure assembly manufactured by means of same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19950657

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19950657

Country of ref document: EP

Kind code of ref document: A1