WO2021027455A1 - 具有抗干扰性能的光收发一体组件及bob光模块 - Google Patents

具有抗干扰性能的光收发一体组件及bob光模块 Download PDF

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Publication number
WO2021027455A1
WO2021027455A1 PCT/CN2020/101262 CN2020101262W WO2021027455A1 WO 2021027455 A1 WO2021027455 A1 WO 2021027455A1 CN 2020101262 W CN2020101262 W CN 2020101262W WO 2021027455 A1 WO2021027455 A1 WO 2021027455A1
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WIPO (PCT)
Prior art keywords
bosa
pcb board
assembly
square
assembled
Prior art date
Application number
PCT/CN2020/101262
Other languages
English (en)
French (fr)
Inventor
石胜兵
张先勇
唐超群
刘水亮
刘玉明
谢冬冬
Original Assignee
烽火通信科技股份有限公司
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Application filed by 烽火通信科技股份有限公司 filed Critical 烽火通信科技股份有限公司
Priority to BR112022001747A priority Critical patent/BR112022001747A2/pt
Publication of WO2021027455A1 publication Critical patent/WO2021027455A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4237—Welding
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4287—Optical modules with tapping or launching means through the surface of the waveguide

Definitions

  • the present invention relates to the technical field of optical fiber communication, in particular to an integrated optical transceiver assembly and a BOB (BOSA on Board, BOB) optical module with anti-interference performance.
  • BOB BOSA on Board, BOB
  • BOSA Bi-Directional Optical Sub-Assembly
  • BOSA shell (BOSA shell includes BOSA square jacket, TOSA structure and pigtail structure) has obvious antenna effect, it has strong coupling effect with external WIFI signal, which also leads to packet loss in BOSA communication
  • the problem is that even if the size of the BOSA housing is changed (such as adjusting the ROSA, TOSA lead length and the interval length of ROSA, TOSA on BOSA), since the inverted F antenna structure of the BOSA housing has not been changed, it is still not possible for the WIFI signal 5G frequency band.
  • Increasing the isolation between the BOSA housing and the external WIFI signal naturally cannot improve the anti-interference performance; and for other frequency bands, even by changing the size of the BOSA housing, it has the effect of improving the isolation between the BOSA housing and the external WIFI signal. But this effect is not obvious.
  • the first is to add a splitter diverter, isolator, etc. inside the BOSA.
  • This method requires changing the internal structure of the BOSA, the process is more complicated, and the mold needs to be reopened;
  • the second method is to use the shielding cover externally. This method will cause the PCB board area to be too large, and the cost of the shielding cover is higher.
  • the prior art has defects and contradictions, and it is necessary to propose new methods to improve the anti-interference performance of BOSA components.
  • the purpose of the present invention is to provide an integrated optical transceiver assembly and BOB optical module with anti-interference performance, which not only solves the problem of large PCB board area caused by the use of an external shielding cover, but also avoids modification Internal structure of BOSA components.
  • an integrated optical transceiver assembly with anti-interference performance which includes:
  • the BOSA housing includes:
  • ROSA structure one end of which is assembled on the bottom wall of the BOSA square jacket, and the other end is used for assembly on the PCB board;
  • Conductor grounding structure one end of which is assembled on the BOSA square jacket, and the other end is used for assembly on the PCB board.
  • the conductor grounding structure is located outside the ROSA structure and is used to attach the BOSA shell The induced radiation current is guided to the ground plane of the PCB board.
  • the conductor grounding structure includes at least one piece of metal sheet, one end of the metal sheet is assembled on the side wall of the BOSA square casing, and the other end is formed with a welding part for connecting with the PCB board.
  • the welding part is substantially perpendicular to the metal sheet.
  • the welding part is formed by bending one end of the metal sheet away from the BOSA square jacket toward the side of the ROSA structure or away from the side of the ROSA structure.
  • the metal sheet is inserted into the PCB board, and a part of the metal sheet located in the PCB board forms the welding part.
  • the conductor grounding structure includes at least one BOSA grounding pin, one end of the BOSA grounding pin is assembled on the bottom wall of the BOSA square casing, and the other end is used to connect with the PCB board.
  • the BOSA ground pin is located at the corner of the bottom wall of the BOSA square jacket.
  • the BOSA ground pin is located on one of the four corners of the bottom wall of the BOSA square jacket;
  • the two BOSA ground pins are respectively located on two of the four corners of the bottom wall of the BOSA square jacket, and the two BOSA ground pins are located on the bottom wall of the BOSA square jacket Diagonal
  • the three BOSA ground pins are respectively located on three of the four corners of the bottom wall of the BOSA square jacket;
  • the four BOSA ground pins are respectively located on the four corners of the bottom wall of the BOSA square jacket.
  • the conductor grounding structure includes a metal sleeve, one end of the metal sleeve is assembled on the bottom wall of the BOSA square jacket, and the other end is used to connect with the PCB board.
  • the horizontal projection of the metal sleeve is located within the horizontal projection range of the BOSA square jacket.
  • the present invention also provides a BOB optical module, which includes:
  • the TOSA circuit board of the TOSA structure, the ROSA structure and the conductor grounding structure are all assembled on the PCB board.
  • the present invention also provides an integrated optical transceiver assembly with anti-interference performance, which includes:
  • the BOSA housing includes:
  • ROSA structure one end of which is assembled on the bottom wall of the BOSA square jacket, and the other end is used for assembly on the PCB board;
  • One end of the conductor grounding structure is used for assembling on the BOSA square jacket, and the other end is used for assembling on the PCB board.
  • the conductor ground structure is located outside the ROSA structure and is used to guide the induced radiation current on the BOSA shell to the ground plane of the PCB board.
  • the method adopted by the present invention is to add a conductor grounding structure.
  • One end of the conductor grounding structure is assembled on the BOSA square casing, and the other end is assembled on the PCB board.
  • the conductor grounding structure is used to connect the BOSA housing and the ground plane of the PCB board. Connected together, so that the induced radiation current on the BOSA housing flows directly to the ground plane of the PCB board, eliminating the radiation effect of the BOSA housing, thereby destroying the antenna effect of the BOSA housing and reducing the coupling effect between it and the external WIFI signal , Thereby improving the isolation between the BOSA housing and the external WIFI signal, and ultimately improving the anti-interference performance of the BOSA component.
  • the present invention does not need to modify the internal structure of BOSA components, has no effect on the packaging process of BOSA components, and therefore has broader Universality and convenience;
  • the present invention wraps the BOSA assembly in the shielding area of the shielding cover to avoid the BOSA assembly from being interfered by external signals.
  • the present invention removes the shielding cover and only connects the shielding cover through the conductor grounding structure.
  • the induced radiation current on the BOSA shell directly flows to the ground plane of the PCB board, thereby destroying the antenna effect of the BOSA shell, and the conductor grounding structure is only outside the ROSA structure, which not only saves costs, but also reduces the PCB layout area , Provide convenience for structure miniaturization.
  • Figure 1 is a schematic diagram of the structural comparison between BOB optical module (left) and inverted F antenna (right);
  • Figure 2 is a schematic structural diagram of an optical transceiver integrated assembly with anti-interference performance provided by an embodiment of the present invention (the conductor grounding structure adopts a metal sheet);
  • Figure 3 is a schematic diagram of the structure of Figure 2 when mounted on a PCB board;
  • FIG. 4 is a schematic diagram of the back structure of FIG. 3;
  • FIG. 5 is a schematic diagram of the structure of an integrated optical transceiver assembly with anti-interference performance provided by an embodiment of the present invention (the conductor grounding structure adopts BOSA grounding pins);
  • Figure 6 is a schematic diagram of the structure of Figure 5 when mounted on a PCB board;
  • FIG. 7 is a schematic structural diagram of an optical transceiver integrated assembly with anti-interference performance provided by an embodiment of the present invention (the conductor grounding structure adopts a metal sleeve);
  • Figure 8 is a schematic diagram of the structure of Figure 7 when mounted on a PCB board;
  • FIG. 9 is a diagram of isolation between the optical transceiver integrated component and the on-board antenna on the PCB board provided by an embodiment of the present invention (the conductor grounding structure is not installed);
  • FIG. 10 is a diagram of isolation between the optical transceiver integrated component and the on-board antenna on the PCB provided by an embodiment of the present invention (the conductor grounding structure has been installed, and the conductor grounding structure uses metal sheets).
  • the first embodiment of the present invention provides an integrated optical transceiver assembly with anti-interference performance.
  • the integrated optical transceiver assembly includes a BOSA housing, a ROSA structure 4, and a conductor grounding structure; a BOSA housing
  • the body includes a BOSA square jacket 1, a TOSA structure 2 and a pigtail structure 3.
  • the BOSA square jacket 1 can adopt a cubic or rectangular structure.
  • the TOSA structure 2 is set at one end of the BOSA square jacket 1, and the TOSA circuit board 20 of the TOSA structure 2 is used for Set on the PCB board 5; the pigtail structure 3 is set on the other end of the BOSA square jacket 1; one end of the ROSA structure 4 is set on the bottom wall of the BOSA square jacket 1, and the other end is used for assembly on the PCB board 5.
  • the ROSA structure 4 has multiple ROSA pins 40, and the ROSA pins 40 are soldered on the PCB board 5.
  • ROSA pins 40 there are five ROSA pins 40; one end of the conductor grounding structure is assembled on the BOSA square jacket 1, and the other end is used for assembly Set on the PCB board 5, the conductor grounding structure is located outside the ROSA structure 4, and the conductor grounding structure is used to guide the induced radiation current on the BOSA housing to the ground plane of the PCB board 5.
  • the present invention proposes the antenna effect of the BOSA housing for the first time, and regards the BOSA assembly mounted on the PCB board 5 as an inverted F antenna.
  • the purpose of the present invention is to reduce the antenna effect of the BOSA housing, thereby improving the anti-interference performance of the BOSA assembly.
  • the method adopted by the present invention improves the isolation between the BOSA housing and the external WIFI signal 5G frequency band, and ultimately improves the anti-interference of the BOSA component The performance has a very good effect, but the method adopted by the present invention is not only applicable to the 5G frequency band.
  • the method adopted by the present invention is to add a conductor grounding structure.
  • One end of the conductor grounding structure is assembled on the BOSA square casing, and the other end is assembled on the PCB board.
  • the conductor grounding structure is used to connect the BOSA housing and the ground plane of the PCB board. Connected together, so that the induced radiation current on the BOSA housing flows directly to the ground plane of the PCB board, eliminating the radiation effect of the BOSA housing, thereby destroying the antenna effect of the BOSA housing and reducing the coupling effect between it and the external WIFI signal , Thereby improving the isolation between the BOSA housing and the external WIFI signal, and ultimately improving the anti-interference performance of the BOSA component.
  • the present invention does not need to modify the internal structure of BOSA components, has no effect on the packaging process of BOSA components, and therefore has broader Universality and convenience;
  • the present invention wraps the BOSA assembly in the shielding area of the shielding cover to avoid the BOSA assembly from being interfered by external signals.
  • the present invention removes the shielding cover and only connects the shielding cover through the conductor grounding structure.
  • the induced radiation current on the BOSA shell directly flows to the ground plane of the PCB board, thereby destroying the antenna effect of the BOSA shell, and the conductor grounding structure is only outside the ROSA structure, which not only saves costs, but also reduces the PCB layout area , Provide convenience for structure miniaturization.
  • the second embodiment of the present invention provides an integrated optical transceiver assembly with anti-interference performance.
  • the difference between this embodiment and the first embodiment is that this embodiment provides a conductor
  • the specific structure form of the grounding structure specifically, the conductor grounding structure includes at least one metal sheet 6, one end of the metal sheet 6 is assembled on the side wall of the BOSA square casing 1, and the other end is formed with a welding part 60 for connecting with the PCB board 5.
  • the metal sheet 6 is welded to the PCB board 5 through the welding part 60, the size of the welding part 60 is not limited, and the welding part 60 is subject to welding.
  • two metal sheets 6 are provided, and they are respectively arranged on the two side walls of the BOSA square casing 1, and the ROSA structure 4 is located between the two metal sheets 6.
  • the width of the metal sheet 6 is preferably not less than the width of the BOSA square jacket 1 to ensure a better anti-interference effect.
  • the width of the metal sheet 6 is approximately equal to the BOSA square jacket The width of 1, see Figure 2.
  • the metal sheet 6 preferably can completely cover the side wall of the BOSA square jacket 1 so that the BOSA component has a better anti-interference effect.
  • the welding part 60 is substantially perpendicular to the metal sheet 6 so that the welding part 60 can be flush with the PCB board 5; the welding part 60 is located on the side of the ROSA structure 4 at the end of the metal sheet 6 away from the BOSA square casing 1 or It is bent in a direction away from the side where the ROSA structure 4 is located.
  • the metal sheet 6 can also be directly inserted into the PCB board 5 so that the part located in the PCB board 5 forms a welding portion 60.
  • this bending design can easily connect the BOSA square jacket 1 to the ground plane of the PCB board through the metal sheet 6 so that the induced radiation current on the BOSA square jacket 1 is directly
  • the flow to the ground plane of the PCB board 5 eliminates the radiation effect of the BOSA housing, thereby eliminating the antenna effect of the BOSA square housing.
  • three metal sheets 6 can also be provided.
  • the three metal sheets 6 are connected in a U-shaped structure. Except for the two outer sheets connected to the two side walls of the BOSA square jacket 1, the middle sheet 6 is set on the BOSA Square jacket 1 on the top wall.
  • the third embodiment of the present invention provides an integrated optical transceiver assembly with anti-interference performance.
  • This embodiment provides a conductor grounding structure
  • the specific structure form, specifically, the conductor grounding structure includes at least one BOSA grounding pin 7.
  • One end of the BOSA grounding pin 7 is assembled on the bottom wall of the BOSA square casing 1, and the other end is used to connect to the PCB board 5.
  • This embodiment adopts BOSA The grounding pin 7 makes the induced radiation current on the BOSA square casing 1 flow directly to the ground plane of the PCB board 5, thereby eliminating the radiation effect of the BOSA housing, thereby eliminating the antenna effect of the BOSA square housing.
  • the BOSA grounding pins 7 are arranged at the four corners of the bottom wall of the BOSA square jacket 1.
  • the BOSA grounding pin 7 When there is only one BOSA grounding pin 7, the BOSA grounding pin 7 is set on one of the four corners of the bottom wall of the BOSA square jacket 1. When there are two BOSA grounding pins 7, it needs to be located on the opposite corner of the bottom wall of the BOSA square jacket 1. When the BOSA grounding pin 7 is 3, install them on any three of the four corners of the bottom wall of the BOSA square jacket 1. When the BOSA grounding pin 7 is greater than or equal to 4, four of them The BOSA grounding pins 7 are respectively installed on the four corners of the bottom wall of the BOSA square jacket 1, as shown in FIG. 5. In this embodiment, the BOSA grounding pins 7 are provided at four corners, and the ROSA structure 4 is located on the four BOSAs. In the space enclosed by the grounding pin 7.
  • the BOSA ground pin 7 can be embedded in the PCB board 5, but the part penetrating the PCB board 5 should not exceed the length of the ROSA pin 40 penetrating the PCB board 5.
  • the fourth embodiment of the present invention provides an integrated optical transceiver assembly with anti-interference performance.
  • This embodiment provides a conductor grounding structure
  • the specific structure form, specifically, the conductor grounding structure includes a metal sleeve 8.
  • the metal sleeve 8 can adopt a cylindrical structure or a square structure. One end of the metal sleeve 8 is assembled on the bottom wall of the BOSA square casing 1, and the other end is used for Connect with PCB board 5.
  • the ROSA structure 4 passes through the middle of the metal sleeve 8 and is soldered on the PCB board 5 through ROSA pins 40.
  • the bottom surface of the metal sleeve 8 is welded on the ground plane of the PCB board 5 by SMT, and the ROSA structure 4 is just wrapped around the metal sleeve 8.
  • the metal sleeve 8, the ground plane of the PCB board 5 and the BOSA square jacket 1 just form a shielding cover, which wraps the easily disturbed ROSA structure 4 in the BOSA assembly, which can ground the BOSA shell and eliminate Its antenna effect, and the formed shield structure can resist the interference of external signals, achieving a double effect.
  • the horizontal projection of the metal sleeve 8 is within the horizontal projection range of the BOSA square casing 1.
  • the height of the metal sleeve 8 does not affect the welding of the ROSA structure 4.
  • the metal sleeve 8 is welded first, and then the BOSA square jacket 1 is clamped on the metal frame to weld the pins 40 of the ROSA structure 4 and the TOSA structure 2 TOSA circuit board 20, finally reduce the length of ROSA pin 40.
  • the top of the metal sleeve 8 can be directly supported or closely attached to the bottom of the BOSA square jacket 1, and the bottom end can be resisted or closely attached to the PCB board 5 without welding.
  • the butt joint structure can also be welded on the PCB board 5, and the bottom end of the metal sleeve 8 resists or closely fits in
  • the docking structure can adopt a shape adapted to the metal sleeve 8, and the docking structure is provided with a docking groove adapted to the metal sleeve 8.
  • the docking structure when the metal sleeve 8 adopts a square structure, the docking structure also adopts a square structure.
  • a butting groove is formed on the end surface of the butting structure, and the bottom end of the metal sleeve 8 is just butted and held or tightly fitted in the butting groove.
  • the fifth embodiment of the present invention provides a BOB (BOSA on Board, BOB for short) optical module, which includes a PCB board 5 and an optical transceiver assembly as described above. 4, three of the four corners on the PCB board 5 are provided with a first antenna 9, a second antenna 10, and a third antenna 11; the TOSA circuit board 20 and the ROSA structure 4 of the TOSA structure 2 Both the conductor grounding structure and the conductor grounding structure are assembled on the PCB board 5, and the BOSA housing induced radiation current is guided to the PCB board 5 through the conductor grounding structure.
  • BOB BOSA on Board, BOB for short optical module
  • the BOB optical module when the present invention is not implemented is simulated.
  • the BOB optical module provided in this embodiment is simulated, wherein the conductor grounding structure adopts two pieces Metal sheet 6 (that is, the optical transceiver assembly in Figure 2 is welded on the PCB board 5 to obtain the BOB optical module in Figure 3 for simulation), the simulation results are shown in Figures 9 and 10:
  • Figure 9 is a simulation of HFSS, when the method of the present invention is not implemented, one of the five pins of the ROSA structure (denoted as Pin) and the three on-board antennas on the PCB (ie the first antenna 9, the second
  • the simulation result of the isolation between the antenna 10 and the third antenna 11 it can be found that the third antenna 11 (denoted as T1), the first antenna 9 (denoted as T2) and the second antenna 10 (denoted as T3) and the pin Pin
  • the average isolation between the 5GHz frequency band is about -45dB (the isolation between the third antenna 11 and pin Pin is recorded as T1_pin, the isolation between the first antenna 9 and pin Pin is recorded as T2_pin, and the isolation between the second antenna 10 and pin Pin is marked as T2_pin.
  • the isolation is denoted as T3_pin).
  • Figure 10 is a diagram of one of the five pins of the ROSA structure obtained by HFSS simulation (denoted as Pin) and the three on-board antennas on the PCB board (namely the first antenna 9 , The simulation results of the isolation between the second antenna 10 and the third antenna 11), you can find the third antenna 11 (denoted as T1), the first antenna 9 (denoted as T2) and the second antenna 10 (denoted as T3)
  • T1 the third antenna 11
  • T2 the first antenna 9
  • T3 the second antenna 10
  • the isolation between the pin and Pin in the 5GHz frequency band is around -70dB on average. That is, by implementing the method of the present invention, the isolation between the BOSA and the onboard antennas (ie, the first antenna 9, the second antenna 10, and the third antenna 11) is increased by about 25 dB in the 5 GHz frequency band.
  • the BOSA is wrapped in a shielding cover, and the third antenna 11, the first antenna 9 and the second antenna 10 tested by the vector network analyzer are in the 5GHz frequency band between any pin of the ROSA structure
  • the average isolation is around -65dB. That is, the method of the present invention can achieve the effect of anti-interference, and the shielding cover can be removed by implementing the method of the present invention, thereby saving production costs.
  • the sixth embodiment of the present invention provides an integrated optical transceiver assembly with anti-interference performance, which includes a BOSA housing, a ROSA structure 4 and a conductor grounding structure;
  • the BOSA housing includes a BOSA square Jacket 1, TOSA structure 2 and pigtail structure 3;
  • TOSA structure 2 is set at one end of BOSA square jacket 1, and TOSA circuit board 20 of TOSA structure 2 is used for assembly on PCB board 5;
  • pigtail structure 3 is set at The other end of the BOSA square jacket 1; one end of the ROSA structure 4 is assembled on the bottom wall of the BOSA square jacket 1, and the other end is used for assembly on the PCB board 5;
  • one end of the conductor grounding structure is used for assembly on the BOSA square jacket 1, and the other end Used for assembly on the PCB board 5.
  • the conductor grounding structure is assembled on the BOSA square casing 1, the conductor grounding structure is located outside the ROSA structure 4 and is used to guide the induced radiation current on the BOSA housing to the PCB board 5.
  • the present invention regards the BOSA component mounted on the PCB board 5 as an inverted F antenna, and grounds the BOSA shell by using the metal sheet 6, the BOSA ground pin 7, and the metal sleeve 8 to ground the BOSA shell.
  • the radiation current is introduced into the ground plane of the PCB board 5, which eliminates the antenna effect of the BOSA housing, thereby improving its anti-interference ability.
  • the method proposed by the present invention is flexible and changeable, does not need to change the internal structure of BOSA components, does not need to add sensitive components such as beam splitters, isolators, etc., does not need a shielding cover, opens up more space to the PCB board 5, and has a more compact Operability, more general applicability and lower production costs.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Light Guides In General And Applications Therefor (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

一种具有抗干扰性能的光收发一体组件及BOB光模块，包括BOSA壳体、ROSA结构（4）和导体接地结构；BOSA壳体包括BOSA方形外套（1）、TOSA结构（2）和尾纤结构（3），TOSA结构（2）组设于BOSA方形外套（1）一端，且TOSA结构（2）的TOSA电路板（20）用于组设于PCB板（5）上；尾纤结构（3）组设于BOSA方形外套（1）另一端；ROSA结构（4）一端组设于BOSA方形外套（1）底壁，另一端用于组设于PCB板（5）上；导体接地结构位于ROSA结构（4）外侧，并用于将BOSA壳体上的感应辐射电流导引至PCB板（5）地平面上。保证抗干扰性能的同时，既解决了使用外部屏蔽罩导致PCB板（5）面积偏大的问题，也避免更改BOSA组件内部结构。

Description

具有抗干扰性能的光收发一体组件及BOB光模块 技术领域
本发明涉及光纤通信技术领域，具体涉及一种具有抗干扰性能的光收发一体组件及BOB(BOSA on Board，简称BOB)光模块。
背景技术
互联网的飞速发展，使得各种高宽带高速率光纤网络的需求不断增强，传统的传输技术已经很难满足传输容量与速度的要求。为了满足新一代高速宽带网络的需求，需要相应的高性能收发光组件，而光收发一体组件(Bi-Directional Optical Sub-Assembly，简写为：BOSA)是收发光组件中应用最为广泛的器件。随着EPON(以太无源光网络，Ethernet Passive Optical Network)、GPON(吉比特无源光网络，Gigabit-capable Passive Optical Networks)和XGPON(万兆吉比特无源光网络，XG-Passive Optical Network)通信的不断发展，网络WIFI信号源的不断增加，对光信号的抗干扰性提出了更为严格的要求。目前BOSA本身对外部信号的抗干扰能力较弱，易受外界信号的干扰而导致通信丢包，其中的一个重要原因是当BOSA组件安装在PCB板上后，由于TOSA(光发射器件，Transmitter Optical Subassembly)结构的TOSA电路板以及ROSA(光接收器件，Receiver Optical Subassembly)结构的针脚都焊接在PCB板上，使得BOSA组件整体形成一个倒F天线(参见图1所示)，而该倒F天线的驻波恰好在WIFI信号5G频段(具体的覆盖范围为5.15GHz～5.85GHz)。由于BOSA壳体(BOSA壳体包括BOSA方形外套、TOSA结构和尾纤结 构)具有明显的天线效应，使得它与外界WIFI信号具有很强的耦合效应，这也就导致了BOSA通信中的丢包问题，即使改变BOSA壳体的尺寸(比如调节ROSA、TOSA引线长度以及ROSA、TOSA在BOSA上的间隔长度)，由于并未改变BOSA壳体的倒F天线结构，对于WIFI信号5G频段，仍然无法提高BOSA壳体与外部WIFI信号的隔离度，自然也无法提高抗干扰性能；而且对于其他频段，即使通过改变BOSA壳体的尺寸方式，有提高BOSA壳体与外部WIFI信号的隔离度的效果，但这种效果并不明显。
为了提高BOSA组件的隔离度，通常有两种方法：第一种是在BOSA内部增加分光偏离器、隔离器等，这种方法需要改变BOSA内部结构，工艺较为复杂，并且需要重新开模；第二种是在外部采用屏蔽罩的方法，这种方法会导致PCB板面积偏大，并且屏蔽罩的成本较高。现有技术存在缺陷矛盾，需要提出新的方法来提高BOSA组件的抗干扰性能。
发明内容
针对现有技术中存在的缺陷，本发明的目的在于提供一种具有抗干扰性能的光收发一体组件及BOB光模块，既解决了使用外部屏蔽罩导致PCB板面积偏大的问题，也避免更改BOSA组件内部结构。
为达到以上目的，本发明采取的技术方案是：一种具有抗干扰性能的光收发一体组件，其包括：
BOSA壳体，所述BOSA壳体包括：
-BOSA方形外套；
-TOSA结构，其组设于所述BOSA方形外套一端，且所述TOSA结构的TOSA电路板用于组设于PCB板上；
-尾纤结构，其组设于所述BOSA方形外套另一端；
ROSA结构，其一端组设于所述BOSA方形外套底壁，另一端用于组设于所述PCB板上；
导体接地结构，其一端组设于所述BOSA方形外套上，另一端用于组设于所述PCB板上，所述导体接地结构位于所述ROSA结构外侧，并用于将所述BOSA壳体上的感应辐射电流导引至所述PCB板地平面上。
进一步地，所述导体接地结构包括至少一片金属片，所述金属片一端组设于所述BOSA方形外套侧壁上，且另一端形成有用于与所述PCB板相连的焊接部。
进一步地，所述焊接部与所述金属片大致垂直。
进一步地，所述焊接部由所述金属片远离所述BOSA方形外套的一端朝所述ROSA结构所在侧或朝远离所述ROSA结构所在侧的方向弯折而成。
进一步地，所述金属片插接于所述PCB板，且所述金属片位于所述PCB板中的部分形成所述焊接部。
进一步地，所述BOSA方形外套组设有所述金属片的侧壁被所述金属片完全覆盖。
进一步地，所述导体接地结构包括至少一个BOSA接地脚，所述BOSA接地脚一端组设于所述BOSA方形外套底壁上，且另一端用于与所述PCB板相连。
进一步地，所述BOSA接地脚位于所述BOSA方形外套底壁角落。
进一步地，当所述BOSA接地脚有一个时，所述BOSA接地脚位于所述BOSA方形外套底壁四个角落的其中一个上；
当所述BOSA接地脚有两个时，两所述BOSA接地脚分别位于 所述BOSA方形外套底壁四个角落的其中两个上，且两所述BOSA接地脚位于所述BOSA方形外套底壁对角线上；
当所述BOSA接地脚有三个时，三个所述BOSA接地脚分别位于所述BOSA方形外套底壁四个角落的其中三个上；
当所述BOSA接地脚有四个时，四个所述BOSA接地脚分别位于所述BOSA方形外套底壁四个角落上。
进一步地，所述导体接地结构包括金属套筒，所述金属套筒一端组设于组设于所述BOSA方形外套底壁上，且另一端用于与所述PCB板相连。
进一步地，所述金属套筒的水平投影位于所述BOSA方形外套的水平投影范围内。
本发明还提供了一种BOB光模块，其包括：
PCB板；
如上任一所述的光收发一体组件，所述TOSA结构的TOSA电路板、所述ROSA结构和所述导体接地结构均组设于所述PCB板上。
本发明还提供了一种具有抗干扰性能的光收发一体组件，其包括：
BOSA壳体，所述BOSA壳体包括：
-BOSA方形外套；
-TOSA结构，其组设于所述BOSA方形外套一端，且所述TOSA结构的TOSA电路板用于组设于PCB板上；
-尾纤结构，其组设于所述BOSA方形外套另一端；
ROSA结构，其一端组设于所述BOSA方形外套底壁，另一端用于组设于所述PCB板上；
导体接地结构，其一端用于组设于所述BOSA方形外套上，另 一端用于组设于所述PCB板上，当所述导体接地结构组设于所述BOSA方形外套上时，所述导体接地结构位于所述ROSA结构外侧，并用于将所述BOSA壳体上的感应辐射电流导引至所述PCB板地平面上。
与现有技术相比，本发明的优点在于：
本发明采用的方式是增加一个导体接地结构，该导体接地结构一端组设在BOSA方形外套上，另一端组设于PCB板上，利用该导体接地结构，将BOSA壳体与PCB板的地平面连接在一起，使得BOSA壳体上的感应辐射电流直接流到PCB板的地平面，消除BOSA壳体的辐射效应，以此来破坏BOSA壳体的天线效应，降低它与外界WIFI信号的耦合效应，从而提高BOSA壳体与外部WIFI信号的隔离度，最终提高了BOSA组件的抗干扰性能。
本发明相比于现有技术中通过在BOSA组件内部添加分光偏离器、隔离器等方法而言，本发明不需要更改BOSA组件内部结构，对BOSA组件的封装工艺没有影响，因此具有更广的普适性和便捷性；
本发明相比于现有技术中通过焊接屏蔽罩的方法，将BOSA组件整体包裹在屏蔽罩的屏蔽区来避免BOSA组件受到外界信号干扰而言，本发明去掉屏蔽罩，仅仅通过导体接地结构将BOSA壳体上的感应辐射电流直接流到PCB板的地平面，以此来破坏BOSA壳体的天线效应，而且导体接地结构仅仅在ROSA结构外侧，不但节约了成本，而且可以减少PCB布板面积，为结构小型化提供便利。
附图说明
图1为BOB光模块(左)与倒F天线(右)结构对比示意图；
图2为本发明实施例提供的具有抗干扰性能的光收发一体组件 结构示意图(导体接地结构采用金属片)；
图3为图2安装在PCB板上时的结构示意图；
图4为图3的背面结构示意图；
图5为本发明实施例提供的具有抗干扰性能的光收发一体组件结构示意图(导体接地结构采用BOSA接地脚)；
图6为图5安装在PCB板上时的结构示意图；
图7为本发明实施例提供的具有抗干扰性能的光收发一体组件结构示意图(导体接地结构采用金属套筒)；
图8为图7安装在PCB板上时的结构示意图；
图9为本发明实施例提供的光收发一体组件与PCB板上板载天线之间的隔离度图(未安装导体接地结构)；
图10为本发明实施例提供的光收发一体组件与PCB板上板载天线之间的隔离度图(已安装导体接地结构，且导体接地结构采用金属片)。
图中：1、BOSA方形外套；2、TOSA结构；20、TOSA电路板；3、尾纤结构；4、ROSA结构；40、ROSA针脚；5、PCB板；6、金属片；60、焊接部；7、BOSA接地脚；8、金属套筒；9、第一天线；10、第二天线；11、第三天线。
具体实施方式
以下结合附图及实施例对本发明作进一步详细说明。
参见图2和图3所示，本发明第一个实施例提供了一种具有抗干扰性能的光收发一体组件，该光收发一体组件包括BOSA壳体、ROSA结构4以及导体接地结构；BOSA壳体包括BOSA方形外套1、TOSA结构2和尾纤结构3，BOSA方形外套1可以采用立方体或长方体结构，TOSA结构2组设于BOSA方形外套1一端，且TOSA结构2 的TOSA电路板20用于组设于PCB板5上；尾纤结构3组设于BOSA方形外套1另一端；ROSA结构4一端组设于BOSA方形外套1底壁，另一端用于组设于PCB板5上，具体的，ROSA结构4具有多个ROSA针脚40，ROSA针脚40焊接在PCB板5上，本实施例中ROSA针脚40有五个；导体接地结构一端组设于BOSA方形外套1上，另一端用于组设于PCB板5上，导体接地结构位于ROSA结构4外侧，导体接地结构用于将所述BOSA壳体上的感应辐射电流导引至所述PCB板5地平面上。
本发明首次提出BOSA壳体的天线效应，将安装在PCB板5上的BOSA组件视为一个倒F天线，本发明的目的是消减BOSA壳体的天线效应，从而提高BOSA组件的抗干扰性能。
由于BOSA壳体所形成的倒F天线的驻波恰好在WIFI信号5G频段，因此，本发明采用的方法，对提高BOSA壳体与外部WIFI信号5G频段的隔离度，最终提高BOSA组件的抗干扰性能，具有非常好的效果，但是，本发明所采用的方法，不仅仅只适用于5G频段。
本发明采用的方式是增加一个导体接地结构，该导体接地结构一端组设在BOSA方形外套上，另一端组设于PCB板上，利用该导体接地结构，将BOSA壳体与PCB板的地平面连接在一起，使得BOSA壳体上的感应辐射电流直接流到PCB板的地平面，消除BOSA壳体的辐射效应，以此来破坏BOSA壳体的天线效应，降低它与外界WIFI信号的耦合效应，从而提高BOSA壳体与外部WIFI信号的隔离度，最终提高了BOSA组件的抗干扰性能。
本发明相比于现有技术中通过在BOSA组件内部添加分光偏离器、隔离器等方法而言，本发明不需要更改BOSA组件内部结构，对BOSA组件的封装工艺没有影响，因此具有更广的普适性和便捷 性；
本发明相比于现有技术中通过焊接屏蔽罩的方法，将BOSA组件整体包裹在屏蔽罩的屏蔽区来避免BOSA组件受到外界信号干扰而言，本发明去掉屏蔽罩，仅仅通过导体接地结构将BOSA壳体上的感应辐射电流直接流到PCB板的地平面，以此来破坏BOSA壳体的天线效应，而且导体接地结构仅仅在ROSA结构外侧，不但节约了成本，而且可以减少PCB布板面积，为结构小型化提供便利。
参见图2、图3和图4所示，本发明第二个实施例提供了一种具有抗干扰性能的光收发一体组件，本实施例与实施例一的区别在于，本实施例提供了导体接地结构的具体结构形式，具体地，导体接地结构包括至少一片金属片6，金属片6一端组设于BOSA方形外套1侧壁上，且另一端形成有用于与PCB板5相连的焊接部60，通过焊接部60将金属片6焊接在PCB板5上，焊接部60的大小没有限制，以能够焊接为准。为了确保感应辐射电流引流的效果能够更好，在图2中，金属片6设置有两片，且分别设置在BOSA方形外套1两个侧壁上，ROSA结构4位于两金属片6之间。
沿尾纤结构3的轴向，金属片6的宽度最好不小于BOSA方形外套1的宽度，确保能够具有更好的抗干扰效果，本实施例中，金属片6的宽度大致等于BOSA方形外套1的宽度，参见图2所示。
参见图2所示，本实施例中，金属片6最好能够完全覆盖BOSA方形外套1侧壁，以使BOSA组件具有更好的抗干扰效果。
参见图2所示，焊接部60与金属片6大致垂直，使得焊接部60与PCB板5能够平齐贴合；焊接部60由金属片6远离BOSA方形外套1的一端ROSA结构4所在侧或朝远离ROSA结构4所在侧的方向弯折而成，当然了，金属片6也可以直接插到PCB板5中，使得 位于PCB板5中的部分形成焊接部60。
若采用朝远离ROSA结构4所在侧方向弯折设计，这样的弯折设计可以方便地将BOSA方形外套1通过金属片6与PCB板的地平面连接，使得BOSA方形外套1上的感应辐射电流直接流到PCB板5的地平面，消除BOSA壳体的辐射效应，从而消除BOSA方壳体的天线效应。
若采用朝ROSA结构4所在侧的方向弯折或直接插到PCB板5的设计，这样的弯折设计可以给BOSA组件附近预留更多的布板空间，为后期设备小型化提供便利。
本实施例还可以设置三片金属片6，三片金属片6连接呈U型结构，除了位于外侧的两片连接在BOSA方形外套1两侧壁上外，中间的一片金属片6设置在BOSA方形外套1顶壁上。
参见图5和图6所示，本发明第三个实施例提供了一种具有抗干扰性能的光收发一体组件，本实施例与实施例一的区别在于，本实施例提供了导体接地结构的具体结构形式，具体地，导体接地结构包括至少一个BOSA接地脚7，BOSA接地脚7一端组设于BOSA方形外套1底壁上，且另一端用于与PCB板5相连，本实施例通过BOSA接地脚7使得BOSA方形外套1上的感应辐射电流直接流到PCB板5的地平面，消除BOSA壳体的辐射效应，从而消除BOSA方壳体的天线效应。
为了获得更好的抗干扰效果，BOSA接地脚7设置在BOSA方形外套1底壁的四个角落。
当BOSA接地脚7只有一个时，BOSA接地脚7设置在BOSA方形外套1底壁四个角落的其中一个上；当BOSA接地脚7有2个时，需要位于BOSA方形外套1底壁的对角线两端；当BOSA接地 脚7为3个时，将它们分别安装在BOSA方形外套1底壁四个角落的任意三个即可；当BOSA接地脚7大于等于4个时，其中有四个BOSA接地脚7分别安装在BOSA方形外套1底壁的四个角落上，参见图5所示，本实施例BOSA接地脚7设置有四个，且位于四个角落，ROSA结构4位于四个BOSA接地脚7所围设的空间中。
实际焊接时，BOSA接地脚7可以嵌入PCB板5内，但贯穿出PCB板5的部分不要超过ROSA针脚40贯穿出PCB板5的长度。
参见图7和图8所示，本发明第四个实施例提供了一种具有抗干扰性能的光收发一体组件，本实施例与实施例一的区别在于，本实施例提供了导体接地结构的具体结构形式，具体地，导体接地结构包括金属套筒8，金属套筒8可以采用圆柱筒结构或方形结构，金属套筒8一端组设于BOSA方形外套1底壁上，且另一端用于与PCB板5相连。
ROSA结构4从金属套筒8中间穿过并通过ROSA针脚40焊接在PCB板5上。金属套筒8的底面通过SMT焊接在PCB板5的地平面上，金属套筒8的四周刚好包裹住ROSA结构4。通过该设计方案，金属套筒8、PCB板5的地平面和BOSA方形外套1刚好构成一个屏蔽罩，将BOSA组件中易受干扰的ROSA结构4包裹其中，既能够将BOSA壳体接地，消除它的天线效应，而且形成的屏蔽罩结构又能抵抗外界信号的干扰，达到双重效果。
为了确保金属套筒8与BOSA方形外套1有着良好的连接，金属套筒8的水平投影位于BOSA方形外套1的水平投影范围内。
金属套筒8的高度以不影响ROSA结构4的焊接为准，在实际操作中，先焊接金属套筒8，然后将BOSA方形外套1卡在金属框上面焊接ROSA结构4的针脚40和TOSA结构2的TOSA电路板20， 最后消减ROSA针脚40长度。
此外，当导体接地结构采用金属套筒8时，金属套筒8顶端可以直接抵持或紧密贴合在BOSA方形外套1底部，底端抵持或紧密贴合在PCB板5上，而不用焊接；为了更好地将所述BOSA壳体上的感应辐射电流导引至PCB板5地平面上，还可以在PCB板5上焊接对接结构，金属套筒8底端抵持或紧密贴合在对接结构上，而对接结构可采用与金属套筒8适配的形状，对接结构上开设有与金属套筒8适配的对接槽，比如金属套筒8采用方形结构时，对接结构也采用方形结构，对接结构端面上开设对接槽，金属套筒8底端正好对接且抵持或紧密贴合在对接槽中。
参见图3或图6或图8所示，本发明第五个实施例提供了一种BOB(BOSA on Board，简称BOB)光模块，其包括PCB板5和如上述任一的光收发一体组件，参见图4所示，PCB板5上四个角落中的其中三个角落分别设有第一天线9、第二天线10和第三天线11；TOSA结构2的TOSA电路板20、ROSA结构4和导体接地结构均组设于PCB板5上，通过导体接地结构，将BOSA壳体感应辐射电流导引至PCB板5上。
为了更直观地理解本实施例的抗干扰效果，作为对照，对未实施本发明时的BOB光模块进行仿真，同时，对本实施例提供的BOB光模块进行仿真，其中，导体接地结构采用两片金属片6(即将图2中的光收发一体组件焊接在PCB板5上得到图3的BOB光模块进行仿真)，仿真结果见图9和图10所示：
图9为用HFSS仿真得到的在未实施本发明方法时，ROSA结构的五个针脚中的其中一个针脚(记为Pin)与PCB板上3个板载天线(即第一天线9、第二天线10和第三天线11)之间的隔离度仿真结 果，可以发现第三天线11(记为T1)、第一天线9(记为T2)和第二天线10(记为T3)与针脚Pin之间在5GHz频段的隔离度平均处于-45dB左右(第三天线11与针脚Pin的隔离度记为T1_pin，第一天线9与针脚Pin的隔离度记为T2_pin，第二天线10与针脚Pin的隔离度记为T3_pin)。
图10为本发明导体接地结构采用金属片6时，用HFSS仿真得到的ROSA结构的五个针脚中的其中一个针脚(记为Pin)与PCB板上3个板载天线(即第一天线9、第二天线10和第三天线11)之间的隔离度仿真结果，可以发现第三天线11(记为T1)、第一天线9(记为T2)和第二天线10(记为T3)与针脚Pin之间在5GHz频段的隔离度平均处于-70dB左右。即实施本发明中的方法，BOSA与板载天线(即第一天线9、第二天线10和第三天线11)之间的隔离度在5GHz频段提高了约25dB。在实际测试中，同等情况下，采用屏蔽罩将BOSA包裹其中，使用矢量网络分析仪测试的第三天线11、第一天线9和第二天线10与ROSA结构的任意一个针脚之间在5GHz频段的隔离度平均处于-65dB左右。即本发明中的方法，可以达到抗干扰的效果，实施本发明的方法可以去掉屏蔽罩，从而节约了生产成本。
参见图2和图3所示，本发明第六个实施例提供了一种具有抗干扰性能的光收发一体组件，其包括BOSA壳体、ROSA结构4和导体接地结构；BOSA壳体包括BOSA方形外套1、TOSA结构2和尾纤结构3；TOSA结构2组设于BOSA方形外套1一端，且TOSA结构2的TOSA电路板20用于组设于PCB板5上；尾纤结构3组设于BOSA方形外套1另一端；ROSA结构4一端组设于BOSA方形外套1底壁，另一端用于组设于PCB板5上；导体接地结构一端用于组设于BOSA 方形外套1上，另一端用于组设于PCB板5上，当导体接地结构组设于BOSA方形外套1上时，导体接地结构位于ROSA结构4外侧，并用于将BOSA壳体上的感应辐射电流导引至PCB板5地平面上。
总之，本发明将安装在PCB板5上的BOSA组件看成一个倒F天线，通过采用金属片6、BOSA接地脚7、金属套筒8方法将BOSA壳体接地，将BOSA壳体上面的感应辐射电流引入到PCB板5的地平面，消除了BOSA壳体的天线效应，从而提高它的抗干扰能力。本发明提出的方法，灵活多变，不需要更改BOSA组件的内部结构，不需要增加分光偏离器、隔离器等敏感器件，不需要屏蔽罩，给PCB板5开放出更多空间，具有更简洁操作性，更普遍的适用性和更低的生产成本。
本发明不局限于上述实施方式，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本发明的保护范围之内。本说明书中未作详细描述的内容属于本领域专业技术人员公知的现有技术。

Claims (13)

  1. 一种具有抗干扰性能的光收发一体组件，其特征在于，其包括：
    BOSA壳体，所述BOSA壳体包括：
    -BOSA方形外套(1)；
    -TOSA结构(2)，其组设于所述BOSA方形外套(1)一端，且所述TOSA结构(2)的TOSA电路板(20)用于组设于PCB板(5)上；
    -尾纤结构(3)，其组设于所述BOSA方形外套(1)另一端；
    ROSA结构(4)，其一端组设于所述BOSA方形外套(1)底壁，另一端用于组设于所述PCB板(5)上；
    导体接地结构，其一端组设于所述BOSA方形外套(1)上，另一端用于组设于所述PCB板(5)上，所述导体接地结构位于所述ROSA结构(4)外侧，并用于将所述BOSA壳体上的感应辐射电流导引至所述PCB板(5)地平面上。
  2. 如权利要求1所述的具有抗干扰性能的光收发一体组件，其特征在于：所述导体接地结构包括至少一片金属片(6)，所述金属片(6)一端组设于所述BOSA方形外套(1)侧壁上，且另一端形成有用于与所述PCB板(5)相连的焊接部(60)。
  3. 如权利要求2所述的具有抗干扰性能的光收发一体组件，其特征在于：所述焊接部(60)与所述金属片(6)大致垂直。
  4. 如权利要求2所述的具有抗干扰性能的光收发一体组件，其特征在于：所述焊接部(60)由所述金属片(6)远离所述BOSA方形外套(1)的一端朝所述ROSA结构(4)所在侧或朝远离所述ROSA结构(4)所在侧的方向弯折而成。
  5. 如权利要求2所述的具有抗干扰性能的光收发一体组件，其特征在于：所述金属片(6)插接于所述PCB板(5)，且所述金属片(6)位于所述PCB板(5)中的部分形成所述焊接部(60)。
  6. 如权利要求2所述的具有抗干扰性能的光收发一体组件，其特征在于：所述BOSA方形外套(1)组设有所述金属片(6)的侧壁被所述金属片(6)完全覆盖。
  7. 如权利要求1所述的具有抗干扰性能的光收发一体组件，其特征在于：所述导体接地结构包括至少一个BOSA接地脚(7)，所述BOSA接地脚(7)一端组设于所述BOSA方形外套(1)底壁上，且另一端用于与所述PCB板(5)相连。
  8. 如权利要求7所述的具有抗干扰性能的光收发一体组件，其特征在于：所述BOSA接地脚(7)位于所述BOSA方形外套(1)底壁角落。
  9. 如权利要求8所述的具有抗干扰性能的光收发一体组件，其特征在于：
    当所述BOSA接地脚(7)有一个时，所述BOSA接地脚(7)位于所述BOSA方形外套(1)底壁四个角落的其中一个上；
    当所述BOSA接地脚(7)有两个时，两所述BOSA接地脚(7)分别位于所述BOSA方形外套(1)底壁四个角落的其中两个上，且两所述BOSA接地脚(7)位于所述BOSA方形外套(1)底壁对角线上；
    当所述BOSA接地脚(7)有三个时，三个所述BOSA接地脚(7)分别位于所述BOSA方形外套(1)底壁四个角落的其中三个上；
    当所述BOSA接地脚(7)有四个时，四个所述BOSA接地脚(7)分别位于所述BOSA方形外套(1)底壁四个角落上。
  10. 如权利要求1所述的具有抗干扰性能的光收发一体组件，其特征在于：所述导体接地结构包括金属套筒(8)，所述金属套筒(8)一端组设于组设于所述BOSA方形外套(1)底壁上，且另一端用于与所述PCB板(5)相连。
  11. 如权利要求10所述的具有抗干扰性能的光收发一体组件，其特征在于：所述金属套筒(8)的水平投影位于所述BOSA方形外套(1)的水平投影范围内。
  12. 一种BOB光模块，其特征在于，其包括：
    PCB板(5)；
    如权利要求1至11任一所述的光收发一体组件，所述TOSA结构(2)的TOSA电路板(20)、所述ROSA结构(4)和所述导体接地结构均组设于所述PCB板(5)上。
  13. 一种具有抗干扰性能的光收发一体组件，其特征在于，其包括：
    BOSA壳体，所述BOSA壳体包括：
    -BOSA方形外套(1)；
    -TOSA结构(2)，其组设于所述BOSA方形外套(1)一端，且所述TOSA结构(2)的TOSA电路板(20)用于组设于PCB板(5)上；
    -尾纤结构(3)，其组设于所述BOSA方形外套(1)另一端；
    ROSA结构(4)，其一端组设于所述BOSA方形外套(1)底壁，另一端用于组设于所述PCB板(5)上；
    导体接地结构，其一端用于组设于所述BOSA方形外套(1)上，另一端用于组设于所述PCB板(5)上，当所述导体接地结构组设于所述BOSA方形外套(1)上时，所述导体接地结构位于所述ROSA 结构(4)外侧，并用于将所述BOSA壳体上的感应辐射电流导引至所述PCB板(5)地平面上。
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