WO2021027170A1 - 显示面板 - Google Patents

显示面板 Download PDF

Info

Publication number
WO2021027170A1
WO2021027170A1 PCT/CN2019/119319 CN2019119319W WO2021027170A1 WO 2021027170 A1 WO2021027170 A1 WO 2021027170A1 CN 2019119319 W CN2019119319 W CN 2019119319W WO 2021027170 A1 WO2021027170 A1 WO 2021027170A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
electromagnetic shielding
shielding structure
display panel
conductive layer
Prior art date
Application number
PCT/CN2019/119319
Other languages
English (en)
French (fr)
Inventor
孙佳佳
Original Assignee
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/641,657 priority Critical patent/US11183551B2/en
Publication of WO2021027170A1 publication Critical patent/WO2021027170A1/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/0418—Control or interface arrangements specially adapted for digitisers for error correction or compensation, e.g. based on parallax, calibration or alignment
    • G06F3/04182—Filtering of noise external to the device and not generated by digitiser components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133334—Electromagnetic shields
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04107—Shielding in digitiser, i.e. guard or shielding arrangements, mostly for capacitive touchscreens, e.g. driven shields, driven grounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14678—Contact-type imagers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Definitions

  • This application relates to the technical field of display panels, and in particular to a display panel.
  • OLED devices Compared with traditional LCDs, OLED devices have the advantages of light weight, wide viewing angle, fast response time, low temperature resistance, and high luminous efficiency. Therefore, they have been regarded as the next generation of new display technology in the display panel industry, especially OLED can be used on flexible substrates. It is a huge advantage of the OLED display panel that is made into a curved flexible display screen.
  • the structure of OLED devices is roughly divided into flexible substrate, array (Array) layer, light-emitting (EL) layer, thin film encapsulation (TFE) layer and touch (Touch) layer.
  • the TFE layer is divided into the first inorganic layer. Layer, organic layer and second inorganic layer.
  • the thickness reduction of OLED panels has become a current research focus in this field. Since the TFE layer is the thickest in the OLED panel (more than 14 microns), it has become the current research focus to achieve the thickness of the entire OLED panel by thinning the TFE layer.
  • both layers contain circuits.
  • the TFE layer is thinned to a certain extent, that is, when the distance between the touch layer and the array layer is too small, Due to the charge induction between the lines, the circuits in the array layer will be interfered by the electrodes in the touch layer, causing display abnormalities.
  • the embodiment of the present application provides a display panel to solve the display abnormality problem caused by the too small distance between the touch layer and the array layer in the display panel.
  • the embodiment of the present application provides a display panel, including:
  • Electromagnetic shielding structure
  • An array layer arranged in the electromagnetic shielding structure
  • a touch layer provided outside the electromagnetic shielding structure and located on one side of the electromagnetic shielding structure;
  • the control chip, the electromagnetic shielding structure is connected to the zero potential point of the control chip.
  • the display panel further includes a light-emitting layer
  • the light-emitting layer is arranged in the electromagnetic shielding structure and is located on a side of the array layer close to the touch layer.
  • the display panel further includes a thin film encapsulation layer, and the thin film encapsulation layer includes a first inorganic layer, an organic layer, and a second inorganic layer;
  • the first inorganic layer is arranged in the electromagnetic shielding structure and covers the light-emitting layer; the organic layer and the second inorganic layer are arranged outside the electromagnetic shielding structure, and the organic layer is located in the Between the electromagnetic shielding structure and the touch layer, the second inorganic layer covers the organic layer and the electromagnetic shielding structure.
  • the display panel further includes a barrier layer
  • the barrier layer is arranged outside the electromagnetic shielding structure and located on a side of the electromagnetic shielding structure away from the touch layer.
  • the display panel further includes a base substrate
  • the base substrate is arranged on a side of the barrier layer away from the electromagnetic shielding structure.
  • the electromagnetic shielding structure includes a first conductive layer and a second conductive layer
  • the second conductive layer extends to the periphery of the first conductive layer to overlap with the first conductive layer to enclose a containing space, and the array layer is disposed in the containing space.
  • the material of the first conductive layer and the second conductive layer are the same, and the material includes aluminum, silver, copper, magnesium, metal alloy or ITO.
  • the electromagnetic shielding structure is a hollow mesh structure.
  • the grids in the hollow mesh structure are square, rectangular or rhombus.
  • the embodiment of the present application also provides a display panel, including:
  • Electromagnetic shielding structure
  • An array layer provided in the electromagnetic shielding structure.
  • a touch layer arranged outside the electromagnetic shielding structure and located on one side of the electromagnetic shielding structure.
  • the display panel further includes a light-emitting layer
  • the light-emitting layer is arranged in the electromagnetic shielding structure and is located on a side of the array layer close to the touch layer.
  • the display panel further includes a thin film encapsulation layer, and the thin film encapsulation layer includes a first inorganic layer, an organic layer, and a second inorganic layer;
  • the first inorganic layer is arranged in the electromagnetic shielding structure and covers the light-emitting layer; the organic layer and the second inorganic layer are arranged outside the electromagnetic shielding structure, and the organic layer is located in the Between the electromagnetic shielding structure and the touch layer, the second inorganic layer covers the organic layer and the electromagnetic shielding structure.
  • the display panel further includes a barrier layer
  • the barrier layer is arranged outside the electromagnetic shielding structure and located on a side of the electromagnetic shielding structure away from the touch layer.
  • the display panel further includes a base substrate
  • the base substrate is arranged on a side of the barrier layer away from the electromagnetic shielding structure.
  • the electromagnetic shielding structure includes a first conductive layer and a second conductive layer
  • the second conductive layer extends to the periphery of the first conductive layer to overlap with the first conductive layer to enclose a containing space, and the array layer is disposed in the containing space.
  • the material of the first conductive layer and the second conductive layer are the same, and the material includes aluminum, silver, copper, magnesium, metal alloy or ITO.
  • the electromagnetic shielding structure is a hollow mesh structure.
  • the grids in the hollow mesh structure are square, rectangular or rhombus.
  • the electromagnetic shielding structure is arranged, the array layer is arranged in the electromagnetic shielding structure, the touch layer is arranged outside the electromagnetic shielding structure, and the electromagnetic shielding structure can effectively shield the interference of external electromagnetic wave signals, so that the array layer and the touch After the spacing between the layers is reduced, the circuits in the array layer will not be interfered by the electromagnetic signals of the circuits in the touch layer, which ensures the normal display of the display panel.
  • FIG. 1 is a schematic diagram of a structure of a display panel provided by an embodiment of the application
  • FIG. 2 is a first top view of an electromagnetic shielding structure in a display panel provided by an embodiment of the application
  • FIG. 3 is a second top view of the electromagnetic shielding structure in the display panel provided by the embodiment of the application.
  • FIG. 4 is a third top view of the electromagnetic shielding structure in the display panel provided by the embodiment of the application.
  • FIG. 5 is a schematic flowchart of a manufacturing method of a display panel provided by an embodiment of the application.
  • step 201 is a schematic structural diagram of step 201 in the manufacturing method of the display panel provided by the embodiment of the application;
  • step 202 in the manufacturing method of the display panel provided by the embodiment of the application.
  • FIG. 8 is a schematic structural diagram of step 203 in the manufacturing method of the display panel provided by an embodiment of the application.
  • connection should be interpreted broadly unless otherwise clearly specified and limited.
  • it can be a fixed connection or a detachable connection. Connected or integrally connected; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication between two components.
  • connection should be interpreted broadly unless otherwise clearly specified and limited.
  • it can be a fixed connection or a detachable connection. Connected or integrally connected; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication between two components.
  • an embodiment of the present application provides a display panel including an electromagnetic shielding structure 1, an array layer 2 and a touch layer 3.
  • the array layer 2 is arranged in the electromagnetic shielding structure 1, that is, the electromagnetic shielding structure 1 is arranged around the array layer 2, the touch layer 3 is arranged outside the electromagnetic shielding structure 1, and the touch layer 3 is located on one side of the electromagnetic shielding structure 1.
  • 3 is arranged in parallel with the array layer 2.
  • the electromagnetic shielding structure 1 may be a hollow structure, specifically a hollow mesh structure, so that the electromagnetic shielding structure 1 constitutes a closed electromagnetic shielding net.
  • the closed electromagnetic shielding net is composed of a plurality of grids, as shown in FIGS. 2 to 4, the grids are square, rectangular, or diamond-shaped, and the grids may also have other shapes, which are not specifically limited here.
  • the array layer 2 includes TFT transistors and driving circuits
  • the touch layer 3 includes sensing electrodes.
  • an electromagnetic shielding structure 1 is arranged on the periphery of the array layer 2 to shield the electromagnetic wave signals outside the electromagnetic shielding structure 1, so that the array layer 2 in the electromagnetic shielding structure 1 will not receive electromagnetic signals from the electrodes of the touch layer 3 Interference, so that the distance between the array layer 2 and the touch layer 3 can be reduced, and the normal display of the display panel can be ensured.
  • the display panel further includes a light-emitting layer 4; the light-emitting layer 4 is provided in the electromagnetic shielding structure 1, and is located on the side of the array layer 2 close to the touch layer 3. .
  • the array layer 2 sends a control signal to the light-emitting layer 4 to control the light-emitting layer 4 to emit light.
  • the light-emitting layer 4 and the array layer 2 are jointly arranged in the electromagnetic shielding structure 1 to ensure that the light-emitting layer 4 and the array layer 2 The signals transmitted therebetween are not interfered by the electromagnetic signals of the electrodes in the touch layer 3.
  • the display panel further includes a thin film encapsulation layer 5, and the thin film encapsulation layer 5 includes a first inorganic layer 51, an organic layer 52 and a second inorganic layer 53.
  • the first inorganic layer 51 is provided in the electromagnetic shielding structure 1 and covers the light-emitting layer 4; the organic layer 52 and the second inorganic layer 53 are provided outside the electromagnetic shielding structure 1, and The organic layer 52 is located between the electromagnetic shielding structure 1 and the touch layer 3, and the second inorganic layer 53 covers the organic layer 52 and the electromagnetic shielding structure 1.
  • the first inorganic layer 51 needs to cover the light-emitting layer 4 to prevent water and oxygen from entering the light-emitting layer 4, so the first inorganic layer 51 is disposed in the electromagnetic shielding structure 1.
  • the organic layer 52 and the second inorganic layer 53 may be disposed outside the electromagnetic shielding structure 1. Specifically, the organic layer 52 is disposed on the electromagnetic shielding structure 1, and the second inorganic layer 53 is disposed on the electromagnetic shielding structure 1 and the organic layer 52 to The electromagnetic shielding structure 1 and the light emitting layer 4 in the electromagnetic shielding structure 1 are further packaged.
  • the display panel further includes a barrier layer 6; the barrier layer 6 is provided outside the electromagnetic shielding structure 1, and is located on a side of the electromagnetic shielding structure 1 away from the touch layer 3. side.
  • the electromagnetic shielding structure 1 is disposed on the barrier layer 6, and the barrier layer 6 is an inorganic layer with the function of blocking water and oxygen, and is combined with the encapsulation layer 5 to protect the light emitting layer 4 in the electromagnetic shielding structure 1.
  • the display panel further includes a base substrate 7; the base substrate 7 is provided on a side of the barrier layer 6 away from the electromagnetic shielding structure 1.
  • the barrier layer 6 is provided on the base substrate 7, and the base substrate 7 may be a flexible substrate.
  • the display panel further includes a control chip (not shown in the figure); the electromagnetic shielding structure 1 is connected to the zero potential point of the control chip 8.
  • control chip can be bound to the side or bottom of the display panel, and the electromagnetic shielding structure 1 is connected to the zero potential point of the control chip to ensure that the electromagnetic shielding structure is at zero potential.
  • the electromagnetic shielding structure 1 includes a first conductive layer 11 and a second conductive layer 12; the second conductive layer 12 extends to the periphery of the first conductive layer 11 so as to communicate with the first conductive layer 11 Overlap to form an accommodating space, and the array layer is arranged in the accommodating space.
  • the first conductive layer 11 and the second conductive layer 12 are disposed opposite to each other, and the second conductive layer 12 extends toward the first conductive layer 11 and extends to the edge around the first conductive layer 11 to communicate with the first conductive layer 11
  • the layer 11 surrounds a closed structure, and the closed structure has an accommodating space for arranging the array layer 2, the light emitting layer 4, and the first inorganic layer 51.
  • the first conductive layer 11 also extends to the control chip to connect with the zero potential point of the control chip to ensure that the first conductive layer 11 and the second conductive layer 12 are always at the zero potential.
  • both the first conductive layer 11 and the second conductive layer 12 are hollow mesh structures, and the hollow mesh structure is composed of multiple grids, as shown in FIGS. 2 to 4, the grids are square, rectangular or Rhombus, the grid may also have other shapes, and there is no specific limitation here.
  • the material of the first conductive layer 11 and the second conductive layer 12 are the same, and the material can be a metal, including but not limited to simple metals such as aluminum Al, silver Ag, copper Cu, magnesium Mg, etc., or a metal alloy, or Other materials that are conductive, such as ITO.
  • the embodiment of the application can set an electromagnetic shielding structure, so that the array layer is arranged in the electromagnetic shielding structure, the touch layer is arranged outside the electromagnetic shielding structure, and the electromagnetic shielding structure can effectively shield external electromagnetic wave signal interference, so that the array layer and the touch layer After the distance between the two is reduced, the circuits in the array layer will not be interfered by the electromagnetic signals of the circuits in the touch layer, and the display of the display panel is guaranteed to be normal.
  • an embodiment of the present application also provides a manufacturing method of a display panel, including:
  • a base substrate is provided, and a barrier layer is formed on the base substrate.
  • the base substrate 7 is a flexible substrate
  • a barrier layer 6 is formed on the flexible substrate 7
  • the barrier layer 6 is an inorganic layer 6 having a water and oxygen barrier function.
  • first conductive layer Form a first conductive layer, an array layer, a light emitting layer and a first inorganic layer in sequence on the barrier layer.
  • a first conductive layer 11 is formed on the barrier layer 6, and the first conductive layer 11 is processed by etching or the like to form a hollow mesh structure.
  • the hollow mesh structure consists of more It is composed of a grid, and the grid is square, rectangular or diamond-shaped.
  • the material of the first conductive layer 11 may be a metal, including but not limited to simple metals such as aluminum Al, silver Ag, copper Cu, magnesium Mg, etc., or a metal alloy, or other conductive materials, such as ITO.
  • the first conductive layer 11 may extend to the connection point of the external control chip to connect to the zero potential point of the control chip.
  • the array layer 2 is formed on the first conductive layer 11, the light emitting layer 4 is formed on the array layer 2, and the first inorganic layer 51 is formed on the light emitting layer 4.
  • the array layer 2 includes a TFT transistor and a driving circuit for controlling the light-emitting layer 4.
  • the first inorganic layer 51 needs to cover the light-emitting layer 4 to prevent water and oxygen from entering the light-emitting layer 4.
  • a second conductive layer is formed on the first inorganic layer, and the second conductive layer is extended to the first conductive layer along the side surfaces of the array layer, the light emitting layer and the first inorganic layer, so as to overlap with the first conductive layer to form Electromagnetic shielding structure.
  • the second conductive layer 12 is formed on the first inorganic layer 51.
  • the second conductive layer 12 and the first conductive layer 11 are overlapped with each other, and the surface of the second conductive layer 12 and the side surfaces of the first conductive layer 11 and the second conductive layer 12 are applied by etching techniques.
  • the lap joints form a hollow mesh structure.
  • the material of the second conductive layer 12 is the same as the manufacturing process and material of the first conductive layer 11.
  • the first conductive layer 11 and the second conductive layer 12 form an electromagnetic shielding structure 1, and the array layer 2 is arranged in the electromagnetic shielding structure 1 to ensure that the array layer 2 is not interfered by external electromagnetic signals.
  • the first conductive layer 11 is connected to the zero potential point of the control chip, so that the electromagnetic shielding structure 1 is connected to the zero potential point of the control chip to ensure that the electromagnetic shielding structure is always at zero potential.
  • an organic layer 52 is formed on the second conductive layer 12 in the electromagnetic shielding structure 1, and a second inorganic layer 53 is formed on the organic layer 52 and the electromagnetic shielding structure 1.
  • the touch layer 3 is formed on the layer 53.
  • the first inorganic layer 51, the organic layer 52 and the second inorganic layer 53 constitute the encapsulation layer 5, which can be thinned.
  • the touch layer 3 is arranged outside the electromagnetic shielding structure 1, so that the array layer 2 in the electromagnetic shielding structure 1 will not be interfered by the electromagnetic signal from the electrodes of the touch layer 3, ensuring the normal display of the display panel, and the manufacturing method is simple and has extremely strong feasibility.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种显示面板，包括：电磁屏蔽结构（1）；设于所述电磁屏蔽结构（1）内的阵列层（2）；设于所述电磁屏蔽结构（1）外，且位于所述电磁屏蔽结构（1）一侧的触摸层（3）。

Description

显示面板
本申请要求于2019年8月15日提交中国专利局、申请号为201910753701.5、发明名称为“一种显示面板”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及显示面板技术领域，尤其涉及一种显示面板。
 背景技术
OLED器件因其较传统LCD相比具有重量轻巧，广视角，响应时间快，耐低温，发光效率高等优点，因此在显示面板行业一直被视为下一代新型显示技术，特别是OLED可以在柔性基板上做成弯曲的柔性显示屏，这更是OLED显示面板的巨大优势。
现有技术中，OLED器件的结构大体分为柔性基板、阵列（Array）层、发光（EL）层、薄膜封装（TFE）层和触摸（Touch）层，其中，TFE层又分为第一无机层、有机层和第二无机层。为实现OLED器件的弯折性，OLED面板的厚度减薄成为了当前此领域的研究热点。由于OLED面板中TFE层厚度最厚（超过14微米），所以通过减薄TFE层来实现整个OLED面板的厚度成为了当前的研究重点。
但是，由于TFE层的上方为触摸层，下方为阵列层，两个膜层内部均包含电路，当TFE膜层减薄到一定程度时，即当触摸层与阵列层之间的距离过小时，由于线路间的电荷感应，阵列层内的电路会受到触摸层内电极的干扰，造成显示异常。
 技术问题
本申请实施例提供一种显示面板，以解决显示面板中触摸层与阵列层之间的间距过小导致的显示异常问题。
 技术解决方案
本申请实施例提供了一种显示面板，包括：
电磁屏蔽结构；
设于所述电磁屏蔽结构内的阵列层；
设于所述电磁屏蔽结构外，且位于所述电磁屏蔽结构一侧的触摸层；以及，
控制芯片，所述电磁屏蔽结构与所述控制芯片的零电势点连接。
进一步地，所述显示面板还包括发光层；
所述发光层设于所述电磁屏蔽结构内，且位于所述阵列层靠近所述触摸层的一侧。
进一步地，所述显示面板还包括薄膜封装层，所述薄膜封装层包括第一无机层、有机层和第二无机层；
所述第一无机层设于所述电磁屏蔽结构内，且覆盖所述发光层；所述有机层和所述第二无机层设于所述电磁屏蔽结构外，且所述有机层位于所述电磁屏蔽结构与所述触摸层之间，所述第二无机层覆盖所述有机层和所述电磁屏蔽结构。
进一步地，所述显示面板还包括阻隔层；
所述阻隔层设于所述电磁屏蔽结构外，且位于所述电磁屏蔽结构远离所述触摸层的一侧。
进一步地，所述显示面板还包括衬底基板；
所述衬底基板设于所述阻隔层远离所述电磁屏蔽结构的一侧。
进一步地，所述电磁屏蔽结构包括第一导电层和第二导电层；
所述第二导电层延伸至所述第一导电层的四周，以与所述第一导电层搭接，围合成容置空间，所述阵列层设于所述容置空间中。
进一步地，所述第一导电层和所述第二导电层的材料相同，且所述材料包括铝、银、铜、镁、金属合金或ITO。
进一步地，所述电磁屏蔽结构为镂空网状结构。
进一步地，所述镂空网状结构中的网格呈方形、矩形或菱形。
本申请实施例还提供了一种显示面板，包括：
电磁屏蔽结构；
设于所述电磁屏蔽结构内的阵列层；以及，
设于所述电磁屏蔽结构外，且位于所述电磁屏蔽结构一侧的触摸层。
进一步地，所述显示面板还包括发光层；
所述发光层设于所述电磁屏蔽结构内，且位于所述阵列层靠近所述触摸层的一侧。
进一步地，所述显示面板还包括薄膜封装层，所述薄膜封装层包括第一无机层、有机层和第二无机层；
所述第一无机层设于所述电磁屏蔽结构内，且覆盖所述发光层；所述有机层和所述第二无机层设于所述电磁屏蔽结构外，且所述有机层位于所述电磁屏蔽结构与所述触摸层之间，所述第二无机层覆盖所述有机层和所述电磁屏蔽结构。
进一步地，所述显示面板还包括阻隔层；
所述阻隔层设于所述电磁屏蔽结构外，且位于所述电磁屏蔽结构远离所述触摸层的一侧。
进一步地，所述显示面板还包括衬底基板；
所述衬底基板设于所述阻隔层远离所述电磁屏蔽结构的一侧。
进一步地，所述电磁屏蔽结构包括第一导电层和第二导电层；
所述第二导电层延伸至所述第一导电层的四周，以与所述第一导电层搭接，围合成容置空间，所述阵列层设于所述容置空间中。
进一步地，所述第一导电层和所述第二导电层的材料相同，且所述材料包括铝、银、铜、镁、金属合金或ITO。
进一步地，所述电磁屏蔽结构为镂空网状结构。
进一步地，所述镂空网状结构中的网格呈方形、矩形或菱形。
 有益效果
本申请的有益效果为：设置电磁屏蔽结构，使阵列层设置在电磁屏蔽结构内，触摸层设置在电磁屏蔽结构外，而电磁屏蔽结构能够有效屏蔽外部的电磁波信号干扰，以在阵列层与触摸层之间的间距减小后，阵列层中的电路不会受到触摸层中电路的电磁信号干扰，保证显示面板的显示正常。
 附图说明
下面结合附图，通过对本申请的具体实施方式详细描述，将使本申请的技术方案及其它有益效果显而易见。
图1为本申请实施例提供的显示面板的一种结构示意图；
图2为本申请实施例提供的显示面板中电磁屏蔽结构的第一种俯视图；
图3为本申请实施例提供的显示面板中电磁屏蔽结构的第二种俯视图；
图4为本申请实施例提供的显示面板中电磁屏蔽结构的第三种俯视图；
图5为本申请实施例提供的显示面板的制作方法的流程示意图；
图6为本申请实施例提供的显示面板的制作方法中步骤201的结构示意图；
图7为本申请实施例提供的显示面板的制作方法中步骤202的结构示意图；
图8为本申请实施例提供的显示面板的制作方法中步骤203的结构示意图。
 本发明的实施方式
这里所公开的具体结构和功能细节仅仅是代表性的，并且是用于描述本申请的示例性实施例的目的。但是本申请可以通过许多替换形式来具体实现，并且不应当被解释成仅仅受限于这里所阐述的实施例。
在本申请的描述中，需要理解的是，术语“中心”、“横向”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。另外，术语“包括”及其任何变形，意图在于覆盖不排他的包含。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
这里所使用的术语仅仅是为了描述具体实施例而不意图限制示例性实施例。除非上下文明确地另有所指，否则这里所使用的单数形式“一个”、“一项”还意图包括复数。还应当理解的是，这里所使用的术语“包括”和/或“包含”规定所陈述的特征、整数、步骤、操作、单元和/或组件的存在，而不排除存在或添加一个或更多其他特征、整数、步骤、操作、单元、组件和/或其组合。
下面结合附图和实施例对本申请作进一步说明。
如图1所示，本申请实施例提供了一种显示面板，包括电磁屏蔽结构1、阵列层2和触摸层3。其中，阵列层2设于电磁屏蔽结构1内，即电磁屏蔽结构1包裹阵列层2设置，触摸层3设于电磁屏蔽结构1外，且触摸层3位于电磁屏蔽结构1的一侧，触摸层3与阵列层2平行设置。
其中，电磁屏蔽结构1可以为镂空结构，具体为镂空网状结构，使电磁屏蔽结构1构成封闭电磁屏蔽网。封闭电磁屏蔽网由多个网格构成，如图2至4所示，所述网格呈方形、矩形或菱形，所述网格还可以呈其他形状，在此不做具体限制。
阵列层2包括TFT晶体管和驱动电路，触摸层3包括感应电极。为了减薄OLED厚度，需减小阵列层2与触摸层3之间的间距，而阵列层2与触摸层3之间的间距过小，阵列层2中的电路会受到触摸层3中电极的电磁信号干扰，因此在阵列层2***设置电磁屏蔽结构1，以对电磁屏蔽结构1外部的电磁波信号进行屏蔽，使电磁屏蔽结构1内的阵列层2不会受到来自触摸层3电极的电磁信号干扰，从而使得阵列层2与触摸层3之间的间距能够得以减小，且保证显示面板的正常显示。
进一步地，如图1所示，所述显示面板还包括发光层4；所述发光层4设于所述电磁屏蔽结构1内，且位于所述阵列层2靠近所述触摸层3的一侧。
本实施例中，阵列层2通过向发光层4发送控制信号，以控制发光层4发光，发光层4与阵列层2共同设置在电磁屏蔽结构1中，以保证发光层4与阵列层2之间传输的信号不被触摸层3中电极的电磁信号干扰。
进一步地，如图1所示，所述显示面板还包括薄膜封装层5，所述薄膜封装层5包括第一无机层51、有机层52和第二无机层53。所述第一无机层51设于所述电磁屏蔽结构1内，且覆盖所述发光层4；所述有机层52和所述第二无机层53设于所述电磁屏蔽结构1外，且所述有机层52位于所述电磁屏蔽结构1与所述触摸层3之间，所述第二无机层53覆盖所述有机层52和所述电磁屏蔽结构1。
其中，第一无机层51需覆盖发光层4，以隔绝水氧进入发光层4，因此将第一无机层51设置在电磁屏蔽结构1内。有机层52和第二无机层53可以设置在电磁屏蔽结构1外，具体地，有机层52设于电磁屏蔽结构1上，第二无机层53设于电磁屏蔽结构1和有机层52上，以对电磁屏蔽结构1以及电磁屏蔽结构1中的发光层4进行进一步地封装。
进一步地，如图1所示，所述显示面板还包括阻隔层6；所述阻隔层6设于所述电磁屏蔽结构1外，且位于所述电磁屏蔽结构1远离所述触摸层3的一侧。
本实施例中，电磁屏蔽结构1设于阻隔层6上，阻隔层6为具有阻隔水氧功能的无机层，与封装层5相结合，保护电磁屏蔽结构1中的发光层4。
进一步地，如图1所示，所述显示面板还包括衬底基板7；所述衬底基板7设于所述阻隔层6远离所述电磁屏蔽结构1的一侧。
本实施例中，阻隔层6设于衬底基板7上，衬底基板7可以为柔性基板。
进一步地，如图1所示，所述显示面板还包括控制芯片（图中未示出）；所述电磁屏蔽结构1与所述控制芯片8的零电势点连接。
本实施例中，控制芯片可以绑定在显示面板的侧部或者底部，电磁屏蔽结构1与控制芯片的零电势点连接，以保证电磁屏蔽结构处于零电势。
具体地，所述电磁屏蔽结构1包括第一导电层11和第二导电层12；所述第二导电层12延伸至所述第一导电层11的四周，以与所述第一导电层11搭接，围合成容置空间，所述阵列层设于所述容置空间中。
本实施例中，第一导电层11与第二导电层12相对设置，第二导电层12朝向第一导电层11延伸，并延伸至第一导电层11四周的边缘处，以与第一导电层11围合成一封闭结构，且该封闭结构中具有容置空间，用于设置阵列层2、发光层4、第一无机层51。另外，第一导电层11还延伸至控制芯片处，以与控制芯片的零电势点连接，以保证第一导电层11和第二导电层12始终处于零电势。
具体地，第一导电层11与第二导电层12均为镂空网状结构，该镂空网状结构由多个网格构成，如图2至4所示，所述网格呈方形、矩形或菱形，所述网格还可以呈其他形状，在此不做具体限制。另外，第一导电层11与第二导电层12的材料相同，其材料可以是金属，包括但不限于铝Al、银Ag、铜Cu、镁Mg等金属单质，也可以是金属合金，还可以是导电的其他材料，例如ITO等。
本申请实施例能够设置电磁屏蔽结构，使阵列层设置在电磁屏蔽结构内，触摸层设置在电磁屏蔽结构外，而电磁屏蔽结构能够有效屏蔽外部的电磁波信号干扰，以在阵列层与触摸层之间的间距减小后，阵列层中的电路不会受到触摸层中电路的电磁信号干扰，保证显示面板的显示正常。
如图5所示，本申请实施例还提供一种显示面板的制作方法，包括：
201、提供衬底基板，并在所述衬底基板上形成阻隔层。
本实施例中，如图6所示，衬底基板7为柔性基板，柔性基板7上形成阻隔层6，阻隔层6为一层具有阻隔水氧功能的无机层6。
202、在阻隔层上依次形成第一导电层、阵列层、发光层和第一无机层。
本实施例中，如图7所示，在阻隔层6上形成第一导电层11，并通过蚀刻等方式对第一导电层11进行处理，形成镂空网状结构，该镂空网状结构由多个网格构成，所述网格呈方形、矩形或菱形等。第一导电层11的材料可以是金属，包括但不限于铝Al、银Ag、铜Cu、镁Mg等金属单质，也可以是金属合金，还可以是导电的其他材料，例如ITO等。另外，第一导电层11可以延伸至外界控制芯片的连接处，以与控制芯片的零电势点连接。
在第一导电层11上形成阵列层2，在阵列层2上形成发光层4，在发光层4上形成第一无机层51。其中，阵列层2包括TFT晶体管和驱动电路，用于控制发光层4。第一无机层51需覆盖发光层4，以隔绝水氧进入发光层4。
203、在第一无机层上形成第二导电层，并将第二导电层沿阵列层、发光层和第一无机层的侧面延伸至第一导电层，以与第一导电层搭接，形成电磁屏蔽结构。
本实施例中，如图8所示，在第一无机层51上形成第二导电层12。通过掩膜版开口设计，使得第二导电层12与第一导电层11四周相互搭接，并通过蚀刻等技术在第二导电层12的表面以及第一导电层11与第二导电层12侧面搭接处形成镂空网状结构。第二导电层12的材料与第一导电层11的制作工艺和材料均相同。第一导电层11与第二导电层12形成电磁屏蔽结构1，阵列层2设置在电磁屏蔽结构1内，以保证阵列层2不被外部电磁信号干扰。第一导电层11与控制芯片的零电势点连接，使得电磁屏蔽结构1与控制芯片的零电势点连接，以保证电磁屏蔽结构始终处于零电势。
204、在电磁屏蔽结构上形成有机层、第二无机层和触摸层。
本实施例中，如图1所示，在电磁屏蔽结构1中的第二导电层12上形成有机层52，在有机层52和电磁屏蔽结构1上形成第二无机层53，在第二无机层53上形成触摸层3。其中，第一无机层51、有机层52和第二无机层53构成封装层5，可以减薄设置。触摸层3设置在电磁屏蔽结构1外，使得电磁屏蔽结构1内的阵列层2不会受到来自触摸层3电极的电磁信号干扰，保证显示面板的正常显示，且制作方法简单，具有极强的可行性。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (18)

  1. 一种显示面板，其中，包括：
    电磁屏蔽结构；
    设于所述电磁屏蔽结构内的阵列层；
    设于所述电磁屏蔽结构外，且位于所述电磁屏蔽结构一侧的触摸层；以及，
    控制芯片，所述电磁屏蔽结构与所述控制芯片的零电势点连接。
  2. 如权利要求1所述的显示面板，其中，所述显示面板还包括发光层；
    所述发光层设于所述电磁屏蔽结构内，且位于所述阵列层靠近所述触摸层的一侧。
  3. 如权利要求2所述的显示面板，其中，所述显示面板还包括薄膜封装层，所述薄膜封装层包括第一无机层、有机层和第二无机层；
    所述第一无机层设于所述电磁屏蔽结构内，且覆盖所述发光层；所述有机层和所述第二无机层设于所述电磁屏蔽结构外，且所述有机层位于所述电磁屏蔽结构与所述触摸层之间，所述第二无机层覆盖所述有机层和所述电磁屏蔽结构。
  4. 如权利要求1所述的显示面板，其中，所述显示面板还包括阻隔层；
    所述阻隔层设于所述电磁屏蔽结构外，且位于所述电磁屏蔽结构远离所述触摸层的一侧。
  5. 如权利要求4所述的显示面板，其中，所述显示面板还包括衬底基板；
    所述衬底基板设于所述阻隔层远离所述电磁屏蔽结构的一侧。
  6. 如权利要求1所述的显示面板，其中，所述电磁屏蔽结构包括第一导电层和第二导电层；
    所述第二导电层延伸至所述第一导电层的四周，以与所述第一导电层搭接，围合成容置空间，所述阵列层设于所述容置空间中。
  7. 如权利要求6所述的显示面板，其中，所述第一导电层和所述第二导电层的材料相同，且所述材料包括铝、银、铜、镁、金属合金或ITO。
  8. 如权利要求1所述的显示面板，其中，所述电磁屏蔽结构为镂空网状结构。
  9. 如权利要求8所述的显示面板，其中，所述镂空网状结构中的网格呈方形、矩形或菱形。
  10. 一种显示面板，其中，包括：
    电磁屏蔽结构；
    设于所述电磁屏蔽结构内的阵列层；以及，
    设于所述电磁屏蔽结构外，且位于所述电磁屏蔽结构一侧的触摸层。
  11. 如权利要求10所述的显示面板，其中，所述显示面板还包括发光层；
    所述发光层设于所述电磁屏蔽结构内，且位于所述阵列层靠近所述触摸层的一侧。
  12. 如权利要求11所述的显示面板，其中，所述显示面板还包括薄膜封装层，所述薄膜封装层包括第一无机层、有机层和第二无机层；
    所述第一无机层设于所述电磁屏蔽结构内，且覆盖所述发光层；所述有机层和所述第二无机层设于所述电磁屏蔽结构外，且所述有机层位于所述电磁屏蔽结构与所述触摸层之间，所述第二无机层覆盖所述有机层和所述电磁屏蔽结构。
  13. 如权利要求10所述的显示面板，其中，所述显示面板还包括阻隔层；
    所述阻隔层设于所述电磁屏蔽结构外，且位于所述电磁屏蔽结构远离所述触摸层的一侧。
  14. 如权利要求13所述的显示面板，其中，所述显示面板还包括衬底基板；
    所述衬底基板设于所述阻隔层远离所述电磁屏蔽结构的一侧。
  15. 如权利要求10所述的显示面板，其中，所述电磁屏蔽结构包括第一导电层和第二导电层；
    所述第二导电层延伸至所述第一导电层的四周，以与所述第一导电层搭接，围合成容置空间，所述阵列层设于所述容置空间中。
  16. 如权利要求15所述的显示面板，其中，所述第一导电层和所述第二导电层的材料相同，且所述材料包括铝、银、铜、镁、金属合金或ITO。
  17. 如权利要求10所述的显示面板，其中，所述电磁屏蔽结构为镂空网状结构。
  18. 如权利要求17所述的显示面板，其中，所述镂空网状结构中的网格呈方形、矩形或菱形。
PCT/CN2019/119319 2019-08-15 2019-11-19 显示面板 WO2021027170A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/641,657 US11183551B2 (en) 2019-08-15 2019-11-19 Display panel having an electromagnetic shielding structure

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910753701.5 2019-08-15
CN201910753701.5A CN110571249A (zh) 2019-08-15 2019-08-15 一种显示面板

Publications (1)

Publication Number Publication Date
WO2021027170A1 true WO2021027170A1 (zh) 2021-02-18

Family

ID=68775536

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/119319 WO2021027170A1 (zh) 2019-08-15 2019-11-19 显示面板

Country Status (3)

Country Link
US (1) US11183551B2 (zh)
CN (1) CN110571249A (zh)
WO (1) WO2021027170A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11374080B2 (en) * 2019-04-19 2022-06-28 Chengdu Boe Optoelectronics Technology Co., Ltd. Flexible display screen and display device
CN116300182B (zh) * 2023-05-11 2023-08-25 惠科股份有限公司 显示面板和显示装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201374047Y (zh) * 2009-02-25 2009-12-30 成都君锐信息技术有限公司 一种电磁屏蔽型声波触摸屏
US20100265206A1 (en) * 2009-04-21 2010-10-21 Industrial Technology Research Institute Touch-sensing display apparatus and fabricating method thereof
US20150145808A1 (en) * 2013-11-28 2015-05-28 Samsung Display Co., Ltd. Display device including touch sensor
CN108227978A (zh) * 2016-12-09 2018-06-29 乐金显示有限公司 电子装置
CN110148681A (zh) * 2019-04-30 2019-08-20 武汉华星光电半导体显示技术有限公司 有机发光二极管显示面板及其制造方法、显示器

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI317086B (en) * 2006-04-14 2009-11-11 Ritdisplay Corp Top-emitting organic led display having transparent touch panel
CN103164062B (zh) * 2011-12-15 2016-05-25 瀚宇彩晶股份有限公司 触控面板与触控显示装置
JP6119518B2 (ja) * 2013-02-12 2017-04-26 ソニー株式会社 センサ装置、入力装置及び電子機器
WO2016061839A1 (zh) * 2014-10-20 2016-04-28 太阳真空玻璃有限公司 真空板材及其制造方法
US9983342B2 (en) * 2015-05-01 2018-05-29 Apple Inc. Backlight structures for an electronic device with sensor circuitry
CN206379157U (zh) * 2016-12-26 2017-08-04 云谷（固安）科技有限公司 一种显示装置
US10275634B2 (en) * 2017-03-16 2019-04-30 Qualcomm Incorporated Ultrasonic fingerprint sensor with acoustic shielding
KR102344763B1 (ko) * 2017-06-19 2021-12-29 삼성디스플레이 주식회사 패널 하부 시트 및 이를 포함하는 표시 장치
KR102342822B1 (ko) * 2017-07-14 2021-12-23 삼성디스플레이 주식회사 표시 장치
CN109524559B (zh) * 2017-09-19 2020-10-30 云谷（固安）科技有限公司 薄膜封装结构和触控显示装置
CN108493351A (zh) * 2018-01-31 2018-09-04 云谷（固安）科技有限公司 薄膜封装结构、显示装置及显示装置的制备方法
TWI718463B (zh) * 2018-12-28 2021-02-11 友達光電股份有限公司 顯示裝置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201374047Y (zh) * 2009-02-25 2009-12-30 成都君锐信息技术有限公司 一种电磁屏蔽型声波触摸屏
US20100265206A1 (en) * 2009-04-21 2010-10-21 Industrial Technology Research Institute Touch-sensing display apparatus and fabricating method thereof
US20150145808A1 (en) * 2013-11-28 2015-05-28 Samsung Display Co., Ltd. Display device including touch sensor
CN108227978A (zh) * 2016-12-09 2018-06-29 乐金显示有限公司 电子装置
CN110148681A (zh) * 2019-04-30 2019-08-20 武汉华星光电半导体显示技术有限公司 有机发光二极管显示面板及其制造方法、显示器

Also Published As

Publication number Publication date
US11183551B2 (en) 2021-11-23
CN110571249A (zh) 2019-12-13
US20210036084A1 (en) 2021-02-04

Similar Documents

Publication Publication Date Title
TWI671898B (zh) 有機發光二極體顯示器
CN109669572B (zh) 触控显示面板及其制作方法、触控显示装置
CN104409467B (zh) 一种触控面板及其制作方法和显示装置
CN109992160A (zh) 触控显示面板及触控显示装置
US11963382B2 (en) Display substrate and preparation method thereof, and display device
JP2020532043A (ja) 表示基板及びその製造方法、表示装置
CN104112767B (zh) 阵列基板、有机发光二极管显示面板和显示装置
CN210379052U (zh) 阵列基板和显示装置
JP2018074161A (ja) 有機発光表示装置
US11340745B2 (en) Touch structure and method for manufacturing the same, touch substrate and touch display device
CN108717957B (zh) 有机发光显示面板和有机发光显示装置
CN108470762A (zh) 一种柔性显示面板和显示装置
TWI747461B (zh) 具有基板孔的顯示裝置
TW201508968A (zh) 有機發光顯示設備及其製造方法
WO2021022594A1 (zh) 阵列基板、显示面板及阵列基板的制作方法
WO2022100342A1 (zh) 触控显示面板及其制备方法、触控显示装置
CN111796718A (zh) 触控显示面板及其制备方法、显示装置
US20220407032A1 (en) Display panel and preparation method therefor, and display device
WO2020237911A1 (zh) 可折叠的显示面板及其制作方法
WO2022052226A1 (zh) 一种显示面板及显示装置
WO2021027170A1 (zh) 显示面板
WO2021036088A1 (zh) 显示面板及显示装置
WO2021174623A1 (zh) 一种显示面板
KR102473220B1 (ko) 터치 센서를 가지는 전계 발광 표시 장치
WO2020220426A1 (zh) 有机发光二极管显示面板及其制造方法、显示器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19941425

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19941425

Country of ref document: EP

Kind code of ref document: A1