WO2020258979A1 - Display panel, manufacturing method thereof, and motherboard - Google Patents

Display panel, manufacturing method thereof, and motherboard Download PDF

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Publication number
WO2020258979A1
WO2020258979A1 PCT/CN2020/083535 CN2020083535W WO2020258979A1 WO 2020258979 A1 WO2020258979 A1 WO 2020258979A1 CN 2020083535 W CN2020083535 W CN 2020083535W WO 2020258979 A1 WO2020258979 A1 WO 2020258979A1
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WIPO (PCT)
Prior art keywords
electrode
interdigital
acoustic wave
base substrate
motherboard
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PCT/CN2020/083535
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French (fr)
Chinese (zh)
Inventor
付帮然
李兴亮
高英强
陈华斌
宋勇志
Original Assignee
京东方科技集团股份有限公司
北京京东方显示技术有限公司
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Publication of WO2020258979A1 publication Critical patent/WO2020258979A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination

Definitions

  • the embodiments of the present disclosure relate to a display panel, a manufacturing method thereof, and a motherboard.
  • Micro-LED display has the advantages of fast response time, high image quality, high contrast, high color gamut, long life, and low power consumption.
  • Micro-LED technology has developed into one of the hot spots of display technology in the future.
  • Micro LED technology faces considerable technical challenges.
  • the embodiments of the present disclosure provide a display panel, a manufacturing method thereof, and a motherboard.
  • a motherboard including: a base substrate, a plurality of target areas on the base substrate, a piezoelectric film and an acoustic wave excitation structure; wherein the acoustic wave excitation structure is located In areas other than the multiple target areas and in contact with the piezoelectric film, the acoustic wave excitation structure is used to generate surface acoustic waves under the control of a driving signal;
  • each of the target areas includes: located on the base substrate On the insulating layer, and a plurality of grooves for accommodating micro light-emitting diodes on the side of the insulating layer away from the base substrate; and the piezoelectric film is located in the grooves other than each of the grooves Area, each of the grooves has a driving electrode and a first magnetic structure.
  • the plurality of target regions are arranged in an array;
  • the acoustic wave excitation structure includes: a plurality of first interdigital electrodes extending in a column direction and arranged in a row direction; two first interdigital electrodes adjacent in the row direction There is at least one of the plurality of target regions between the electrodes.
  • L 1 m*(a 1 +b 1 ); where a 1 is the first a fork finger width of the interdigital electrode, b 1 means an electrode finger pitch of the first fork, m is an integer greater than zero.
  • the plurality of target regions are arranged in an array;
  • the acoustic wave excitation structure includes: a plurality of first interdigital electrodes extending in a column direction and arranged in a row direction, and a plurality of first interdigital electrodes extending in a row direction and arranged in a column direction.
  • Second interdigital electrodes wherein there is at least one target area between two adjacent first interdigital electrodes in the row direction, and at least one second interdigital electrode is provided between two adjacent second interdigital electrodes in the column direction One of the target areas.
  • the first interdigital electrode includes: at least two first sub-interdigital electrodes extending in the column direction and arranged in the column direction; and/or, the second interdigital electrode includes: extending in the row direction and extending along the At least two second sub-interdigital electrodes arranged in a row direction.
  • the first magnetic structure is located on the side of the drive electrode away from the base substrate; and the orthographic projection of the first magnetic structure on the base substrate is located on the drive electrode in the same groove In the range of the orthographic projection on the base substrate.
  • the motherboard further includes: a micro light emitting diode located in the groove;
  • the micro light emitting diode includes: a first extraction electrode on the same side and a second magnetic structure that is magnetically opposite to the first magnetic structure , And a second extraction electrode on the other side opposite to the first extraction electrode; wherein, the first extraction electrode of the micro light-emitting diode and the driving electrode located in the same groove Electric connection.
  • At least one embodiment of the present disclosure also provides a display panel, including: a base substrate, an insulating layer on the base substrate, and a piezoelectric film on a side of the insulating layer away from the base substrate;
  • the insulating layer has a plurality of grooves on one side away from the base substrate; each of the grooves has a driving electrode and a first magnetic structure, and is located one side away from the base substrate.
  • the micro light-emitting diode includes: a first extraction electrode on the same side and a second magnetic structure that is magnetically opposite to the first magnetic structure, and a first extraction electrode on the other side Oppositely arranged second lead electrodes; wherein, the first lead electrodes of the micro light emitting diode are electrically connected to the driving electrodes in the same groove.
  • the first extraction electrode of the micro light-emitting diode and the driving electrode are bonded and connected by a contact material.
  • At least one embodiment of the present disclosure further provides a manufacturing method of a display panel, including: providing a suspension in which a plurality of micro-light-emitting diodes are suspended; each of the micro-light-emitting diodes includes: two extraction electrodes on two sides, respectively, And a second magnetic structure on one side that is magnetically opposite to the first magnetic structure; immersing the mother board according to any one of claims 1 to 7 in the suspension; applying a drive signal to the acoustic wave excitation structure To generate surface acoustic waves, so that the plurality of micro light-emitting diodes respectively fall into the plurality of grooves in the plurality of target regions;
  • a contact material for the binding process is formed in each groove in the mother board; and each of the micro light-emitting diodes is heated Binding with the driving electrode in the corresponding groove.
  • the mother board is placed in a closed space, and nitrogen gas is introduced to keep the air pressure in the closed space at least 3 standard atmospheres.
  • the suspension includes the plurality of micro light-emitting diodes suspended in an ultrapure water stage.
  • FIG. 1 is a schematic top view of an example of a motherboard provided by an embodiment of the disclosure
  • FIG. 2 is a schematic cross-sectional view of an example of a motherboard provided by an embodiment of the disclosure
  • FIG. 3 is a schematic diagram of parallel surface acoustic wave control microparticles generated by two parallel first interdigital electrodes in an embodiment of the disclosure
  • Figure 4 is a schematic cross-sectional view corresponding to Figure 3;
  • FIG. 5 is a schematic diagram of vertical surface acoustic wave control microparticles generated by a first interdigital electrode and a second interdigital electrode that are perpendicular to each other in an embodiment of the disclosure;
  • FIG. 6 is a schematic top view of another example of a motherboard provided by an embodiment of the disclosure.
  • FIG. 7 is a schematic top view of another example of a motherboard provided by an embodiment of the disclosure.
  • FIG. 8 is a schematic top view of another example of a motherboard provided by an embodiment of the disclosure.
  • FIG. 9 is a schematic cross-sectional view of another example of a motherboard provided by an embodiment of the disclosure.
  • FIG. 10 is a schematic cross-sectional view of a display panel provided by an embodiment of the disclosure.
  • FIG. 11 is a flowchart of a manufacturing method of a display panel provided by an embodiment of the disclosure.
  • the technical difficulty in the Micro LED process is: After the photolithography step of the Micro LED, the LED bare chip particles need to be directly removed from the substrate (for example, The sapphire substrate) is transferred to the target substrate, and the lead electrode on the LED needs to be connected to the target substrate, and the transfer amount is very large each time, which requires very high stability and accuracy of the transfer process.
  • the mainstream mass transfer technologies mainly include chip-level welding, epitaxial level welding, thin-film transfer, and thin-film transfer technologies.
  • related technical solutions that directly or indirectly realize mass transfer are complex and costly.
  • With LED crystal The further reduction of particles makes it difficult to meet the requirements for stability and accuracy of the transfer process.
  • the embodiments of the present disclosure provide a display panel, a manufacturing method thereof, and a motherboard.
  • the embodiment of the present disclosure provides a motherboard, as shown in Figs. 1 and 2, wherein Fig. 1 is a schematic structural diagram of the motherboard provided by an embodiment of the present disclosure, and Fig. 2 is a schematic cross-sectional view at the line segment AB in Fig. 1 .
  • the mother board includes: a base substrate 101, a plurality of target regions 102 on the base substrate 101, a piezoelectric film 107 and an acoustic wave excitation structure 100.
  • the acoustic wave excitation structure 100 is located in an area other than the plurality of target areas 102 and is in contact with the piezoelectric film 107.
  • the acoustic wave excitation structure 100 is used to generate surface acoustic waves under the control of a driving signal.
  • Each target area 102 includes an insulating layer 106 located on the base substrate 101, and a plurality of grooves 103 located on the side of the insulating layer 106 away from the base substrate 101 for accommodating micro light-emitting diodes.
  • the piezoelectric film 107 is located in an area other than the plurality of grooves 103, and each groove 103 has a driving electrode 108 and a first magnetic structure 109.
  • the acoustic wave excitation structure generates surface acoustic waves under the control of the drive signal, and the generated surface acoustic waves can be controlled to accurately fall into the grooves through the standing wave effect of the generated surface acoustic waves in the fluid.
  • the motherboard provided by the embodiment of the present disclosure can realize the massive transfer of micro light-emitting diodes, the manufacturing process is simple and efficient, and the process cost can be effectively reduced.
  • the acoustic wave excitation structure 100 is provided in areas other than the target area 102.
  • the surface acoustic wave emitted by the acoustic wave excitation structure 100 is a kind of surface acoustic wave along the base substrate.
  • the elastic acoustic wave propagating on the surface can concentrate energy on the surface of the base substrate, and can effectively realize the operation of driving and separating the fluid on the surface of the base substrate and the particles in the fluid.
  • the array arrangement of the micro light emitting diodes in the target area 102 can be controlled, and grooves 103 can be arranged at the corresponding positions of the micro light emitting diode array arrangement.
  • the size of can be set slightly larger than the micro light emitting diode to be transferred, and the micro light emitting diode can be controlled to accurately fall into each groove 103.
  • the shape of the groove 103 can be selected according to needs. In the figure, a circle is taken as an example for description, but it is not limited to the above-mentioned shape of the groove 103, and may be other shapes.
  • FIG. 2 is a schematic diagram of placing the master plate in the suspension.
  • each groove 103 has a driving electrode 108 and a first magnetic structure 109.
  • a second magnetic structure that is magnetically opposite to the first magnetic structure can be provided on the micro light-emitting diode to be transferred, so that during the transfer process, the magnetic attraction between the first magnetic structure 109 and the second magnetic structure can be used to control
  • the micro light emitting diode is attached to the driving electrode in the groove with the side with the second magnetic structure to prevent the micro light emitting diode from being flipped.
  • FIG. 2 only uses two of the grooves 103 as an example for schematic illustration, and the number of grooves 103 may be multiple.
  • Micro LED technology is to reduce the length of ordinary light-emitting diodes (LEDs) to only 50um in length, which is about 1% of the size of ordinary LEDs.
  • micro-level Micro LEDs can be moved to the base substrate.
  • red (R), green (G), and blue (B) micro light-emitting diodes can be transferred to the base substrate to form an RGB full-color display, or only blue-emitting micro light-emitting diodes can be transferred.
  • the light-emitting diodes will be subsequently realized in full color through quantum dots and fluorescent technology.
  • surface acoustic waves can propagate from solid to liquid.
  • the superposition of two rows of surface acoustic waves that propagate in opposite directions and the same frequency can form a surface acoustic wave standing wave.
  • a pressure potential well is formed in the liquid and can be used to control microparticles.
  • the force received by the microparticles is mainly composed of the primary radiation force and the secondary radiation force.
  • the primary radiation force is the force of the standing wave field itself on the microparticles, and the secondary radiation force is generated by the scattering of sound waves between the microparticles. Among them, the secondary radiation force is small and negligible.
  • the main radiation force can be decomposed into an axial component and a transverse component.
  • the transverse component is perpendicular to the direction of sound wave propagation, and the axial component is along the direction of sound wave propagation.
  • the force is greater than the lateral force.
  • the axial force pushes the micro-particles to the node of the standing wave.
  • the lateral force gathers the micro-particles and restricts their position.
  • the axial radiation force formula shows the acoustic force
  • the size is proportional to the square of the amplitude of the sound wave and the volume of the particle.
  • the relational expression of the axial component force F r is as follows:
  • P 0 is the acoustic wave amplitude
  • V c is the volume of the microparticle
  • ⁇ is the acoustic contrast factor
  • ⁇ c is the particle density
  • ⁇ c is the compressibility coefficient of the particle
  • ⁇ w is related to ⁇ w
  • the wave number k is 2 ⁇ / ⁇
  • x is the distance between the microparticle and the node.
  • the acoustic contrast factor may change significantly with changes in density and compressibility, thereby affecting the direction of acoustic force, that is, whether the microparticles are pushed toward the node or the antinode.
  • the acoustic wave excitation structure 100 includes a plurality of interdigital electrodes.
  • FIG. 3 two first interdigital electrodes 104 extending in the column direction and arranged in the row direction included in the acoustic wave excitation structure 100 are taken as an example for schematic illustration.
  • FIG. 4 shows the mother board shown in FIG. 3 being placed in the suspension 204
  • the cross-sectional schematic diagram in Figure 4 the curve on the surface of the mother board in Figure 4 represents the acoustic waveform generated by the acoustic excitation structure, and the intersection of the acoustic waveform represents the node of the standing wave.
  • the piezoelectric film When AC driving signals are applied to the two bus lines of the first interdigital electrode 104, the piezoelectric film will produce periodic strain due to the piezoelectric effect, although the surface acoustic wave generated by each pair of interdigital electrodes in the first interdigital electrode 104 is excited It is weak, but when the period of the first interdigital electrode 104 is an integer multiple of the wavelength of the surface acoustic wave, the mutual superposition and enhancement of the acoustic waves can be generated, and at this time, a stronger surface acoustic wave can be excited.
  • the process accuracy can generate surface acoustic waves with a wavelength of several micrometers to hundreds of micrometers through the excitation of the interdigital structure, and by coupling the surface acoustic waves in different propagation directions with each other, different types of performance acoustic waves can also be obtained.
  • the interdigital width is a 1
  • the interdigital distance is b 1
  • the surface acoustic wave wavelength ⁇ 1 generated by the acoustic wave excitation structure 100 can be determined according to the following relationship:
  • ⁇ 1 2*(a 1 +b 1 );
  • the parallel surface acoustic waves generated by the two first interdigital structures 104 are coupled to generate a surface acoustic wave standing wave.
  • the surface acoustic wave standing wave can generate a pressure potential well in the liquid, so that the micro particles in the liquid can be manipulated.
  • the surface acoustic wave standing waves generated by the two first interdigital structures 104 can make the microparticles P Gathered at each node position and arranged in sequence along the column direction, the distance d 1 between adjacent microparticles P in the row direction is ⁇ 1 /2, that is, a 1 +b 1 , the microparticle P at the edge position
  • grooves can be provided at the positions of each node, so that the microparticles P fall into the corresponding grooves, and grooves can be provided at the position where each microparticle P in FIG. 3 is located.
  • the micro particles P are micro light emitting diodes, and the position of each groove can be determined according to the pixel distribution on the display panel to which the micro light emitting diode is to be transferred. For example, in a display panel, if the distance between two adjacent pixels in the row direction is ⁇ 1 /2, the distance between two adjacent pixels in the column direction is twice the diameter of the microparticle P in FIG. 3, Then, grooves are provided at the microparticles P in each odd row in FIG. 3.
  • the distance between adjacent nodes can also be adjusted by adjusting the interdigital width and interdigital distance in the first interdigital electrode 104 to adjust the distance between adjacent grooves in the row direction.
  • FIG. 5 takes two perpendicular first interdigital electrodes 104 and second interdigital electrodes 105 included in the acoustic wave excitation structure 100 as an example for illustration, so as to excite two rows of perpendicular surface acoustic waves. After the two rows of mutually perpendicular surface acoustic waves are coupled, a standing wave node with lattice distribution is formed.
  • the mother board shown in FIG. 5 is placed in the suspension, and under the action of the surface acoustic wave, the microparticles will form an array-like distribution at each standing wave node, as shown in each microparticle P in FIG. 5.
  • the width of the interdigital fingers is a 1
  • the distance between the fingers is b 1.
  • the microparticles P are arrayed in the standing wave field. Distributed at each node position, the distance d 1 between two adjacent micro particles in the row direction is ⁇ 1 /2, and the distance d 2 between two adjacent micro particles in the column direction is ⁇ 2 /2, and the edge is slightly smaller.
  • the distance between the particles and the center of the first interdigital electrode 104 is n ⁇ 1 /2, and the distance between the edge micro particles and the center of the second interdigital electrode 105 is n ⁇ 2 /2, where ⁇ 1 and ⁇ 2 satisfy the following relationship:
  • grooves can also be provided at the microparticles P shown in FIG. 5, so that the microparticles P fall into the corresponding grooves.
  • Each microparticle P in FIG. 5 can be provided at the location where Groove.
  • the micro particles P are micro light emitting diodes, and the position of each groove can be determined according to the pixel distribution on the display panel to which the micro light emitting diode is to be transferred. For example, in a display panel, if the distance between two adjacent pixels in the row direction is ⁇ 1 /2, and the distance between two adjacent pixels in the column direction is ⁇ 2 /2, it can be shown in Figure 5 A groove is provided at each microparticle P shown.
  • the distance between adjacent nodes in the row direction can be adjusted by adjusting the interdigital width and the interdigital distance of the first interdigital electrode 104, so as to adjust the distance between adjacent grooves in the row direction.
  • the width of the fingers of the finger electrode 105 and the finger pitch are used to adjust the distance between adjacent nodes in the column direction to adjust the distance between adjacent grooves in the column direction.
  • the acoustic wave excitation structure 100 may include a plurality of interdigital electrodes 104, 105.
  • a plurality of target areas 102 are arranged in an array
  • the acoustic wave excitation structure 100 includes: a plurality of first interdigital electrodes 104 extending in the column direction and arranged in the row direction;
  • the superimposition of the surface acoustic waves generated by the two adjacent first interdigital electrodes 104 in the row direction can enhance the energy of the surface acoustic wave, improve the ability to control the movement of the micro light emitting diode, and ensure that the micro light emitting diode can fall into the corresponding groove.
  • the distance L 1 between two adjacent grooves 103 in the row direction in the target area 102 satisfies the following relationship:
  • L 1 m*(a 1 +b 1 );
  • a 1 is the interdigital width of the first interdigital electrode
  • b 1 is the interdigital distance of the first interdigital electrode
  • m is an integer greater than zero.
  • the distance between two adjacent grooves 103 in the row direction in FIG. 1 is an integer multiple of the distance between two adjacent microparticles P in the row direction in FIG. 3, so as to ensure that the micro light emitting diode can fall during the transfer process.
  • the distance between two adjacent grooves 103 in the row direction in FIG. 1 is an integer multiple of the distance between two adjacent microparticles P in the row direction in FIG. 3, so as to ensure that the micro light emitting diode can fall during the transfer process.
  • the distance between two adjacent grooves 103 in the row direction in FIG. 1 is an integer multiple of the distance between two adjacent microparticles P in the row direction in FIG. 3, so as to ensure that the micro light emitting diode can fall during the transfer process.
  • a plurality of target areas 102 are arranged in an array
  • the acoustic wave excitation structure 100 includes: a plurality of first interdigital electrodes 104 extending in a column direction and arranged in a row direction, and a plurality of second interdigital electrodes 105 extending in a row direction and arranged in a column direction;
  • the surface acoustic wave obtained by electrical signal excitation has standing wave nodes distributed in a lattice, and each first interdigital electrode 104 and each second interdigital electrode 104
  • the superposition of the surface acoustic wave generated by the interdigital electrode 105 can enhance the energy of the surface acoustic wave and improve the ability to control the movement of the micro-light-emitting diode, so that more micro-light-emitting diodes can be moved, and the process of batch transfer of the micro-light-emitting diodes for multiple display panels is realized.
  • each first interdigital electrode 104 may include: at least two first sub-interdigital electrodes 1041 extending in the column direction and arranged in the column direction. .
  • the length of the target area 102 in the column direction can be made longer, so that a display panel with a larger area can be manufactured.
  • the second interdigital electrode 105 includes: at least two second sub-interdigital electrodes 1051 extending in the row direction and arranged in the row direction. In this way, under the same process accuracy, the length of the target area 102 in the row direction can be made longer, so that a display panel with a larger area can be manufactured.
  • At least two first sub-interdigital electrodes 1041 and at least two second sub-interdigital electrodes 1051 may also be included in both the row and column directions.
  • the number of first sub-interdigital electrodes 1041 in the first interdigital electrode 104 and the number of second sub-interdigital electrodes 1051 in the second interdigital electrode 105 can be set according to the size of the target area required. That is to say, the number of the first interdigital electrode 1041 and the second interdigital electrode 1051 is not limited to the two exemplified above, and the first interdigital electrode and the second interdigital electrode may also include other numbers of sub-interdigital electrodes, respectively. Refers to the electrode.
  • the distance L 1 between two adjacent grooves in the row direction in the target area 102, and the two adjacent grooves in the column direction satisfies the following relationship:
  • L 1 m*(a 1 +b 1 );
  • L 2 n*(a 2 +b 2 );
  • a 1 is the interdigital width of the first interdigital electrode
  • b 1 is the interdigital distance of the first interdigital electrode
  • a 2 is the interdigital width of the second interdigital electrode
  • b 2 is the finger of the second interdigital electrode. Spacing, m and n are integers greater than zero.
  • the distance d 1 of two adjacent micro particles P in the row direction is determined by the interdigital width a 1 and the interdigital distance b 1 of the first interdigital electrode 104.
  • each groove 103 corresponds to the position of the microparticle P in Fig. 5, one of the two adjacent grooves 103 in the row direction
  • the distance between L 1 is an integer multiple of d 1 , so L 1 is m*(a 1 +b 1 ).
  • the distance L 2 between two adjacent grooves 103 in the column direction is d 2 Is an integer multiple of, so L 2 is n*(a 2 +b 2 ).
  • the interdigital width is in the range of 50-100 ⁇ m, and the acoustic wave wavelength is in the range of 200-400 ⁇ m.
  • the number N of interdigital pairs determines the bandwidth of the acoustic wave excitation structure and the excitation intensity of the surface acoustic wave.
  • the number of interdigital pairs may be 30, but the embodiment of the present disclosure is not limited thereto.
  • the width of the first interdigital structure in the column direction or the width of the second interdigital structure in the row direction can be expressed as the delay line distance L, and the delay line distance L cannot be too long.
  • L may be about 500 ⁇ , and the attenuation of surface acoustic wave energy is reduced by the arrayed arrangement of interdigital electrodes.
  • the target area 102 is approximately a L*L square area.
  • the acoustic aperture of the first interdigital electrode 104 is A 1
  • the acoustic aperture of the second interdigital electrode 105 is A 2
  • the acoustic aperture responds to the length of the interdigital electrode and can affect the excitation intensity of the interdigital electrode.
  • the acoustic aperture can be set to (L- ⁇ )/n.
  • the first magnetic structure 109 is located on the side of the driving electrode 108 away from the base substrate 101.
  • the orthographic projection of the first magnetic structure 109 on the base substrate 101 is located within the range of the orthographic projection of the drive electrodes 108 in the same groove 103 on the base substrate 101.
  • the size of the first magnetic structure 109 is smaller than the size of the drive electrode 108 in the same groove 103, and the drive electrode 108 will not be blocked by the first magnetic structure 109, so that the drive electrode 108 can be connected to the micro drive electrode 108 through the contact material 110 later.
  • the light-emitting diode 20 is bonded and connected.
  • the first magnetic structure 109 with conductivity may also be used.
  • the piezoelectric film 107 can be made of aluminum nitride piezoelectric film material.
  • the piezoelectric film 107 has better acid and alkali resistance, which improves the reliability of the display panel.
  • the piezoelectric film 107 can be prepared by magnetron sputtering or chemical vapor deposition, and the thickness of the piezoelectric film 107 is about 10 ⁇ m.
  • each driving electrode 108 is formed on the base substrate 101 at a position corresponding to each groove 103 to be formed, and then an insulating layer 106 is formed on the film layer where the driving electrode 108 is located, and the insulating layer 106 is patterned, for example An etching process can be used to form each groove 103 penetrating the insulating layer 106, so that the driving electrode 108 is located at the bottom of the corresponding groove 103, and then a pattern of the piezoelectric film 107 is formed on the insulating layer 106; or, An insulating layer 106 and a piezoelectric film 107 are sequentially formed on the film layer where the driving electrode 108 is located, and then an etching process is used to form grooves 103 penetrating the insulating layer 106 and the piezoelectric film 107.
  • FIG. 9 is a schematic diagram of the structure after the mother board is taken out of the suspension after the micro-light emitting diode is transferred.
  • the motherboard further includes a micro light emitting diode 20 located in the groove 103.
  • the micro light-emitting diode 20 includes: a first extraction electrode 201 on the same side, a second magnetic structure 202 that is magnetically opposite to the first magnetic structure 109, and a second extraction electrode on the other side opposite to the first extraction electrode 201 203; the first lead electrode 201 of the micro light emitting diode 20 is electrically connected to the driving electrode 108 located in the same groove 103.
  • the mother board in the embodiment of the present disclosure can be used to transfer micro light emitting diode chips with lead electrodes located on both sides.
  • the magnetic structure of a magnetic structure 109 is opposite to that of the second magnetic structure 202.
  • the first lead electrode 201 of the micro light emitting diode 20 can be electrically connected with the driving electrode 108 in the groove by magnetic attraction, and the micro light emitting diode 20 can be accurately controlled. It is electrically connected with the corresponding driving electrode 108 to prevent the micro light-emitting diode 20 from flipping.
  • the size of the second magnetic structure 202 can be set to be smaller than the size of the first extraction electrode 201, so that the first extraction electrode 201 will not be blocked by the second magnetic structure 202, and the contact material 110 can be used later.
  • the micro light emitting diode 20 and the driving electrode 108 are bonded and connected.
  • the second magnetic structure 202 with electrical conductivity may also be used.
  • the embodiments of the present disclosure also provide a display panel, which can be applied to any products or components with display functions such as mobile phones, tablet computers, televisions, displays, notebook computers, digital photo frames, navigators, etc. Since the principle of solving the problem of the display panel is similar to the above-mentioned motherboard, the implementation of the display panel can refer to the implementation of the above-mentioned motherboard, and the repetition will not be repeated.
  • a display panel provided by an embodiment of the present disclosure includes: a base substrate 101, an upper insulating layer 106 located on the base substrate 101, and a piezoelectric element located on the side of the insulating layer 106 away from the base substrate 101 ⁇ 107 ⁇ Film 107.
  • the insulating layer 106 has a plurality of grooves 103 on the side away from the base substrate 101.
  • Each groove 103 has a driving electrode 108 and a first magnetic structure 109, and a micro light emitting diode 20 located on the side of the first magnetic structure 109 away from the base substrate 101; the micro light emitting diode 20 includes: first lead wires located on the same side The electrode 201 and the second magnetic structure 202 magnetically opposite to the first magnetic structure 109, and the second extraction electrode 203 disposed opposite to the first extraction electrode 201 on the other side.
  • the first lead electrode 201 of the micro light emitting diode 20 is electrically connected to the driving electrode 108 located in the same groove 103.
  • the base substrate may be, for example, a glass substrate, a quartz substrate, a plastic substrate, etc., but the disclosed embodiments of the board are not limited thereto.
  • the display panel in the embodiment of the present disclosure is obtained by cutting the mother board after transferring the micro light emitting diode.
  • the display panel shown in FIG. 10 can be obtained by cutting along the edge of the target area 102 in the motherboard.
  • the resulting display panel does not have an acoustic wave excitation structure, thereby avoiding the acoustic wave excitation structure Occupying the frame area of the display panel is conducive to narrowing the frame of the display panel.
  • cutting can also be performed in a certain area inside the target area 102, and the size of the area to be cut can be determined according to the required size of the display panel.
  • the first lead electrode 201 of the micro light emitting diode 20 and the driving electrode 108 are bonded and connected by the contact material 110.
  • materials such as tin or silver can be used as the contact material and bonded by welding, or alloy materials such as AuSn can also be used as the contact material and bonded by the eutectic method.
  • the embodiment of the present disclosure also provides a manufacturing method of the display panel. As shown in FIG. 11, the method includes:
  • each micro-light-emitting diode includes: two extraction electrodes respectively located on two sides, and a second magnetic structure located on one side and magnetically opposite to the first magnetic structure;
  • S303 Apply a driving signal to the acoustic wave excitation structure to generate surface acoustic waves, so that a plurality of micro light-emitting diodes respectively fall into the grooves in the target area of the motherboard;
  • the suspension may be ultrapure water, or a surfactant may be added to the ultrapure water. Except for water molecules, ultrapure water has almost no impurities, no bacteria, viruses and other substances. It will not react with inorganic substances such as silicon and metals, and will not corrode the extraction electrode and the second magnetic material in the micro-light emitting diode, and it can also maintain The micro light-emitting diode suspended in the suspension has a stable surface specificity.
  • step S302 as shown in FIG. 2 and FIG. 9, the mother board without the micro light emitting diode in the groove is immersed in the suspension.
  • a drive signal is applied to the acoustic wave excitation structure to generate surface acoustic waves.
  • the micro light emitting diode 20 is moved to the node position of the surface acoustic wave under the control of the surface acoustic wave.
  • the grooves 103 are respectively located at the node positions, and under the action of the magnetic attraction between the first magnetic structure 109 and the second magnetic structure 202, the side of the micro light emitting diode 20 with the first extraction electrode 201 can be made to face the liner.
  • the base substrate 101 falls into the groove 103.
  • step S304 the micro light-emitting diodes in the groove are fixed, and the first lead electrode of the micro light-emitting diode can be fixedly connected with the driving electrode in the groove by binding.
  • micro light emitting diodes can also be used in the subsequent transfer process to avoid wasting micro light emitting diodes and save manufacturing costs .
  • the mother board is cut to obtain multiple display panels, thereby realizing the batch transfer of the micro light-emitting diodes from the multiple display panels, and the manufacturing efficiency is high.
  • the edge of the target area in the mother board or part of the target area can be cut, so that the cut display panel does not have an acoustic wave excitation structure, which is beneficial to narrow the frame of the display panel.
  • step S302 it may further include:
  • the foregoing step S305 may include:
  • micro light-emitting diodes are bound to the driving electrodes in the corresponding grooves by heating.
  • a contact material for the bonding process is formed in each groove.
  • the contact material can be tin, silver, or AuSn alloy, etc., so that the micro light-emitting diode and the driving electrode can be subsequently bonded.
  • the micro light emitting diode falls into the corresponding groove. At this time, the micro light emitting diode is only fixed in the groove by magnetic attraction, and the first lead electrode and the driving electrode in the micro light emitting diode are not fixedly connected .
  • step S305 the mother board is placed in a closed space, and nitrogen or other inert gas is introduced to keep the chamber pressure at least 3 standard atmospheric pressures to prevent the suspension from boiling during welding, resulting in micro-light emitting diodes in the groove The location of has moved.
  • step S305 the mother board is removed from the suspension, which can avoid the movement of the micro light-emitting diodes in the groove due to the flow of the suspension during the removal.
  • the acoustic wave excitation structure generates surface acoustic waves under the control of the driving signal, and the standing wave effect of the generated surface acoustic waves in the fluid can control the accurate landing of the micro light emitting diodes.
  • the motherboard provided by the embodiments of the present disclosure can realize the massive transfer of micro light-emitting diodes, the manufacturing process is simple and efficient, and the process cost can be effectively reduced.
  • the massive transfer of micro-light-emitting diodes can be realized only by depositing piezoelectric films and acoustic wave excitation devices. The process is simple and effective, and the process cost can be effectively reduced.
  • the motherboard provided by the embodiments of the present disclosure can adjust the surface acoustic wave simply by adjusting the interval and period of the interdigital electrodes, and then adjust the position of the micro light emitting diode on the motherboard. And the spacing, the massive transfer of higher precision micro light emitting diodes is realized, and the process cost is low.

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Abstract

A display panel, a manufacturing method thereof, and a motherboard. The motherboard comprises a base substrate (101), a plurality of target regions (102) located on the base substrate (101), a piezoelectric film (107), and an acoustic wave excitation structure (100). The acoustic wave excitation structure (100) is located in a region other than the plurality of target regions (102), and is in contact with the piezoelectric film (107). The acoustic wave excitation structure (100) can generate a surface acoustic wave under the control of a driving signal. Each of the target regions (102) comprises: an insulating layer (106) located on the base substrate; and a plurality of recesses (103) used to accommodate micro-LEDs and located on a side of the insulating layer (106) facing away from the base substrate (101). The piezoelectric film (107) is located in a region other than the plurality of recesses (103). A driving electrode (108) and a first magnetic structure (109) are provided in each of the recesses (103).

Description

显示面板、其制作方法及母板Display panel, its manufacturing method and motherboard
相关申请的交叉引用Cross references to related applications
本申请要求于2019年06月25日向CNIPA提交的名称为“一种显示面板、其制作方法及母板”的中国专利申请No.201910555373.8的优先权，其全文为所有目的通过引用合并于本文。This application claims the priority of Chinese Patent Application No. 201910555373.8 filed with CNIPA on June 25, 2019, entitled "A display panel, its manufacturing method and motherboard", the full text of which is incorporated herein by reference for all purposes.
技术领域Technical field
本公开的实施例涉及一种显示面板、其制作方法及母板。The embodiments of the present disclosure relate to a display panel, a manufacturing method thereof, and a motherboard.
背景技术Background technique
微发光二极管(Micro-LED)显示具有反应时间快、画质高、对比度高、色域高、寿命长、功耗低等优点，Micro-LED技术已发展成未来显示技术的热点之一，然而，目前Micro LED技术面临相当多的技术挑战。Micro-LED display has the advantages of fast response time, high image quality, high contrast, high color gamut, long life, and low power consumption. Micro-LED technology has developed into one of the hot spots of display technology in the future. However, At present, Micro LED technology faces considerable technical challenges.
发明内容Summary of the invention
本公开实施例提供一种显示面板、其制作方法及母板。本公开的至少一个实施例提供一种母板，包括：衬底基板，位于所述衬底基板之上的多个目标区域，以及压电薄膜和声波激励结构；其中，所述声波激励结构位于除所述多个目标区域以外的区域，并与所述压电薄膜接触，述声波激励结构用于在驱动信号的控制下产生表面声波；每个所述目标区域包括：位于所述衬底基板上的绝缘层，以及位于所述绝缘层远离所述衬底基板一侧的用于容置微发光二极管的多个凹槽；以及所述压电薄膜位于除各所述所述凹槽以外的区域，每一个所述凹槽内具有驱动电极和第一磁性结构。The embodiments of the present disclosure provide a display panel, a manufacturing method thereof, and a motherboard. At least one embodiment of the present disclosure provides a motherboard, including: a base substrate, a plurality of target areas on the base substrate, a piezoelectric film and an acoustic wave excitation structure; wherein the acoustic wave excitation structure is located In areas other than the multiple target areas and in contact with the piezoelectric film, the acoustic wave excitation structure is used to generate surface acoustic waves under the control of a driving signal; each of the target areas includes: located on the base substrate On the insulating layer, and a plurality of grooves for accommodating micro light-emitting diodes on the side of the insulating layer away from the base substrate; and the piezoelectric film is located in the grooves other than each of the grooves Area, each of the grooves has a driving electrode and a first magnetic structure.
例如，所述多个目标区域呈阵列排布；所述声波激励结构包括：沿列方向延伸且沿行方向排列的多个第一叉指电极；在行方向相邻的两个第一叉指电极之间具有所述多个目标区域中的至少一个。For example, the plurality of target regions are arranged in an array; the acoustic wave excitation structure includes: a plurality of first interdigital electrodes extending in a column direction and arranged in a row direction; two first interdigital electrodes adjacent in the row direction There is at least one of the plurality of target regions between the electrodes.
例如，所述多个目标区域中在行方向上相邻的两个凹槽之间的距离L 1满足以下关系：L 1＝m*(a 1+b 1)；其中，a 1为所述第一叉指电极的叉指宽度，b 1为所述第一叉指电极的指间距，m为大于零的整数。 For example, the distance L 1 between two adjacent grooves in the row direction in the multiple target areas satisfies the following relationship: L 1 =m*(a 1 +b 1 ); where a 1 is the first a fork finger width of the interdigital electrode, b 1 means an electrode finger pitch of the first fork, m is an integer greater than zero.
例如，所述多个目标区域呈阵列排布；所述声波激励结构包括：沿列方向延伸且沿行方向排列的多个第一叉指电极，以及沿行方向延伸且沿列方向排列的多个第二叉指电极；其中，在行方向相邻的两个第一叉指电极之间具有至少一个所述目标区域，以及在列方向相邻的两个第二叉指电极之间具有至少一个所述目标区域。For example, the plurality of target regions are arranged in an array; the acoustic wave excitation structure includes: a plurality of first interdigital electrodes extending in a column direction and arranged in a row direction, and a plurality of first interdigital electrodes extending in a row direction and arranged in a column direction. Second interdigital electrodes; wherein there is at least one target area between two adjacent first interdigital electrodes in the row direction, and at least one second interdigital electrode is provided between two adjacent second interdigital electrodes in the column direction One of the target areas.
例如，所述第一叉指电极包括：沿列方向延伸且沿列方向排列的至少两个第一子叉指电极；和/或，所述第二叉指电极包括：沿行方向延伸且沿行方向排列的至少两个第二子叉指电极。For example, the first interdigital electrode includes: at least two first sub-interdigital electrodes extending in the column direction and arranged in the column direction; and/or, the second interdigital electrode includes: extending in the row direction and extending along the At least two second sub-interdigital electrodes arranged in a row direction.
例如，每个目标区域中在行方向上相邻的两个凹槽之间的距离L 1，以及列方向上相邻的两个凹槽之间的距离L 2满足以下关系：L 1＝m*(a 1+b 1)；L 2＝n*(a 2+b 2)；其中，a 1为所述第一叉指电极的叉指宽度，b 1为所述第一叉指电极的指间距；a 2为所述第二叉指电极的叉指宽度，以及b 2为所述第二叉指电极的指间距，m和n为大于零的整数。 For example, each row in the target region between the distance L 1, and two grooves adjacent in the column direction a distance between two adjacent grooves in a direction L 2 satisfy the following relationship: L 1 = m * (a 1 +b 1 ); L 2 =n*(a 2 +b 2 ); where a 1 is the interdigital width of the first interdigital electrode, and b 1 is the first interdigital electrode. Pitch; a 2 is the width of the fingers of the second interdigital electrode, and b 2 is the pitch of the fingers of the second interdigital electrode, m and n are integers greater than zero.
例如，所述第一磁性结构位于所述驱动电极背离衬底基板的一侧；以及所述第一磁性结构在所述衬底基板上的正投影位于同一所述凹槽内的所述驱动电极在所述衬底基板上的正投影的范围内。For example, the first magnetic structure is located on the side of the drive electrode away from the base substrate; and the orthographic projection of the first magnetic structure on the base substrate is located on the drive electrode in the same groove In the range of the orthographic projection on the base substrate.
例如，所述母板还包括：位于所述凹槽内的微发光二极管；所述微发光二极管包括：位于同一侧的第一引出电极和与所述第一磁性结构磁性相反的第二磁性结构，以及位于另一侧的与所述第一引出电极相对设置的第二引出电极；其中，所述微发光二极管的所述第一引出电极与位于同一个所述凹槽内的所述驱动电极电连接。For example, the motherboard further includes: a micro light emitting diode located in the groove; the micro light emitting diode includes: a first extraction electrode on the same side and a second magnetic structure that is magnetically opposite to the first magnetic structure , And a second extraction electrode on the other side opposite to the first extraction electrode; wherein, the first extraction electrode of the micro light-emitting diode and the driving electrode located in the same groove Electric connection.
本公开的至少一个实施例还提供一种显示面板，包括：衬底基板，位于 所述衬底基板上的绝缘层，以及位于所述绝缘层远离所述衬底基板一侧的压电薄膜；其中，所述绝缘层远离所述衬底基板的一侧具有多个凹槽；每一个所述凹槽内具有驱动电极和第一磁性结构，以及位于所述第一磁性结构远离衬底基板一侧的微发光二极管；所述微发光二极管包括：位于同一侧的第一引出电极和与所述第一磁性结构磁性相反的第二磁性结构，以及位于另一侧的与所述第一引出电极相对设置的第二引出电极；其中，所述微发光二极管的所述第一引出电极位于同一个所述凹槽内的所述驱动电极电连接。At least one embodiment of the present disclosure also provides a display panel, including: a base substrate, an insulating layer on the base substrate, and a piezoelectric film on a side of the insulating layer away from the base substrate; Wherein, the insulating layer has a plurality of grooves on one side away from the base substrate; each of the grooves has a driving electrode and a first magnetic structure, and is located one side away from the base substrate. The micro light-emitting diode includes: a first extraction electrode on the same side and a second magnetic structure that is magnetically opposite to the first magnetic structure, and a first extraction electrode on the other side Oppositely arranged second lead electrodes; wherein, the first lead electrodes of the micro light emitting diode are electrically connected to the driving electrodes in the same groove.
例如，所述微发光二极管的所述第一引出电极与所述驱动电极通过接触材料绑定连接。For example, the first extraction electrode of the micro light-emitting diode and the driving electrode are bonded and connected by a contact material.
本公开的至少一个实施例还提供一种显示面板的制作方法，包括：提供悬浮有多个微发光二极管的悬浮液；每个所述微发光二极管包括：分别位于两侧的两个引出电极，以及位于一侧的且与第一磁性结构磁性相反的第二磁性结构；将权利要求1～7任一项所述的母板浸泡在所述悬浮液中；向所述声波激励结构施加驱动信号以产生表面声波，以使多个所述微发光二极管分别落入到所述多个目标区域中的多个凹槽内；At least one embodiment of the present disclosure further provides a manufacturing method of a display panel, including: providing a suspension in which a plurality of micro-light-emitting diodes are suspended; each of the micro-light-emitting diodes includes: two extraction electrodes on two sides, respectively, And a second magnetic structure on one side that is magnetically opposite to the first magnetic structure; immersing the mother board according to any one of claims 1 to 7 in the suspension; applying a drive signal to the acoustic wave excitation structure To generate surface acoustic waves, so that the plurality of micro light-emitting diodes respectively fall into the plurality of grooves in the plurality of target regions;
对每个凹槽内的所述微发光二极管进行固定；以及对所述母板进行切割，以得到多个显示面板。Fixing the micro light emitting diode in each groove; and cutting the mother board to obtain a plurality of display panels.
例如，将所述母板浸泡在所述悬浮液中之前，在所述母板中的每个凹槽内形成用于绑定工艺的接触材料；以及采用加热的方式将各所述微发光二极管与对应的凹槽内的驱动电极进行绑定。For example, before the mother board is immersed in the suspension, a contact material for the binding process is formed in each groove in the mother board; and each of the micro light-emitting diodes is heated Binding with the driving electrode in the corresponding groove.
例如：向所述声波激励结构施加驱动信号以产生表面声波，使所述微发光二极管在表面声波的控制下移动到表面声波的波节位置处，其中，所述母板上的所述多个凹槽分别位于各波节的位置，并且在所述第一磁性结构和所述第二磁性结构之间的磁性引力的作用下，使所述微发光二极管的第一引出电极的一侧朝向所述衬底基板落入到所述凹槽中。For example: applying a drive signal to the acoustic wave excitation structure to generate a surface acoustic wave, so that the micro light-emitting diode moves to the node position of the surface acoustic wave under the control of the surface acoustic wave, wherein the plurality of The grooves are respectively located at the positions of the respective nodes, and under the action of the magnetic attraction between the first magnetic structure and the second magnetic structure, the side of the first lead-out electrode of the micro light emitting diode faces the The base substrate falls into the groove.
例如，将所述母板置于密闭空间，通入氮气，使所述密闭空间的气压至 少保持3个标准大气压以上。For example, the mother board is placed in a closed space, and nitrogen gas is introduced to keep the air pressure in the closed space at least 3 standard atmospheres.
例如，所述悬浮液包括超纯水一级其中悬浮的所述多个微发光二极管。For example, the suspension includes the plurality of micro light-emitting diodes suspended in an ultrapure water stage.
附图说明Description of the drawings
以下将结合附图对本公开的实施例进行更详细的说明，以使本领域普通技术人员更加清楚地理解本公开的实施例，其中：Hereinafter, the embodiments of the present disclosure will be described in more detail in conjunction with the accompanying drawings, so that those of ordinary skill in the art can understand the embodiments of the present disclosure more clearly, in which:
图1为本公开实施例提供的母板的一示例的俯视结构示意图；FIG. 1 is a schematic top view of an example of a motherboard provided by an embodiment of the disclosure;
图2为本公开实施例提供的母板的一示例的截面示意图；2 is a schematic cross-sectional view of an example of a motherboard provided by an embodiment of the disclosure;
图3为本公开实施例中两个平行的第一叉指电极产生的平行表面声波控制微颗粒的示意图；3 is a schematic diagram of parallel surface acoustic wave control microparticles generated by two parallel first interdigital electrodes in an embodiment of the disclosure;
图4为对应于图3的截面示意图；Figure 4 is a schematic cross-sectional view corresponding to Figure 3;
图5为本公开实施例中相互垂直的第一叉指电极和第二叉指电极产生的垂直表面声波控制微颗粒的示意图；5 is a schematic diagram of vertical surface acoustic wave control microparticles generated by a first interdigital electrode and a second interdigital electrode that are perpendicular to each other in an embodiment of the disclosure;
图6为本公开实施例提供的母板的另一示例的俯视结构示意图；6 is a schematic top view of another example of a motherboard provided by an embodiment of the disclosure;
图7为本公开实施例提供的母板的又一示例的俯视结构示意图；FIG. 7 is a schematic top view of another example of a motherboard provided by an embodiment of the disclosure;
图8为本公开实施例提供的母板的又一示例的俯视结构示意图；8 is a schematic top view of another example of a motherboard provided by an embodiment of the disclosure;
图9为本公开实施例提供的母板的另一示例的截面示意图；9 is a schematic cross-sectional view of another example of a motherboard provided by an embodiment of the disclosure;
图10为本公开实施例提供的显示面板的截面示意图；10 is a schematic cross-sectional view of a display panel provided by an embodiment of the disclosure;
图11为本公开实施例提供的显示面板的制作方法流程图。FIG. 11 is a flowchart of a manufacturing method of a display panel provided by an embodiment of the disclosure.
具体实施方式Detailed ways
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本公开一部分实施例，并不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在无需做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。需要注意的是，自始至终相同或类似的标号表示相同或类似的元件或具有相同 或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本公开，而不能理解为对本公开的限制。The technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by a person of ordinary skill in the art without creative work are within the protection scope of the present disclosure. It should be noted that the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary, and are only used to explain the present disclosure, and cannot be understood as a limitation to the present disclosure.
除非另外定义，此处使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“上”、“下”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。Unless otherwise defined, the technical terms or scientific terms used herein shall have the usual meanings understood by those with ordinary skills in the field to which this disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity, or importance, but are only used to distinguish different components. "Include" or "include" and other similar words mean that the element or item appearing before the word encompasses the element or item listed after the word and its equivalents, but does not exclude other elements or items. "Up", "Down", etc. are only used to indicate the relative position relationship. When the absolute position of the described object changes, the relative position relationship may also change accordingly.
发明人注意到：Micro LED工艺中的巨量转移技术是目前最困难的关键工艺，Micro LED工艺中的技术难点为：Micro LED在光刻步骤后，需要将LED裸芯片颗粒直接从基板(例如蓝宝石基板)转移到目标基板上，并且需要将LED上的引出电极与目标基板相连，且每次转移量非常大，对转移工艺的稳定性和精确度要求非常高。The inventor noticed that the mass transfer technology in the Micro LED process is currently the most difficult key process. The technical difficulty in the Micro LED process is: After the photolithography step of the Micro LED, the LED bare chip particles need to be directly removed from the substrate (for example, The sapphire substrate) is transferred to the target substrate, and the lead electrode on the LED needs to be connected to the target substrate, and the transfer amount is very large each time, which requires very high stability and accuracy of the transfer process.
主流的巨量转移技术主要有芯片级焊接、外延级焊接、薄膜转移，以及薄膜转移技术，但是，相关的直接或间接实现巨量转移的技术方案，工艺复杂且成本较高，随着LED晶粒颗粒的进一步缩小，难以实现对转移工艺稳定性和精确度的要求。The mainstream mass transfer technologies mainly include chip-level welding, epitaxial level welding, thin-film transfer, and thin-film transfer technologies. However, related technical solutions that directly or indirectly realize mass transfer are complex and costly. With LED crystal The further reduction of particles makes it difficult to meet the requirements for stability and accuracy of the transfer process.
本公开的实施例提供了一种显示面板、其制作方法及母板。The embodiments of the present disclosure provide a display panel, a manufacturing method thereof, and a motherboard.
下面结合附图，对本公开实施例提供的显示面板、其制作方法及母板的具体实施方式进行详细地说明。附图中各膜层的厚度和形状不反映真实比例，只是用于示意说明本公开的内容。In the following, specific implementations of the display panel, the manufacturing method thereof, and the motherboard provided by the embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The thickness and shape of each film layer in the drawings do not reflect the true ratio, but are merely used to illustrate the content of the present disclosure.
本公开的实施例提供了一种母板，如图1和图2所示，其中，图1为本公开实施例提供的母板的结构示意图，图2为图1中线段AB处的截面示意图。该母板包括：衬底基板101，位于衬底基板101上的多个目标区域102，压电薄膜107和声波激励结构100。The embodiment of the present disclosure provides a motherboard, as shown in Figs. 1 and 2, wherein Fig. 1 is a schematic structural diagram of the motherboard provided by an embodiment of the present disclosure, and Fig. 2 is a schematic cross-sectional view at the line segment AB in Fig. 1 . The mother board includes: a base substrate 101, a plurality of target regions 102 on the base substrate 101, a piezoelectric film 107 and an acoustic wave excitation structure 100.
声波激励结构100位于除所述多个目标区域102以外的区域，并与压电薄膜107接触，声波激励结构100用于在驱动信号的控制下产生表面声波。The acoustic wave excitation structure 100 is located in an area other than the plurality of target areas 102 and is in contact with the piezoelectric film 107. The acoustic wave excitation structure 100 is used to generate surface acoustic waves under the control of a driving signal.
每个目标区域102包括：位于衬底基板101上的绝缘层106，以及位于绝缘层106远离衬底基板101一侧的用于容置微发光二极管的多个凹槽103。Each target area 102 includes an insulating layer 106 located on the base substrate 101, and a plurality of grooves 103 located on the side of the insulating layer 106 away from the base substrate 101 for accommodating micro light-emitting diodes.
压电薄膜107位于除所述多个凹槽103以外的区域，每一个凹槽103内具有驱动电极108和第一磁性结构109。The piezoelectric film 107 is located in an area other than the plurality of grooves 103, and each groove 103 has a driving electrode 108 and a first magnetic structure 109.
本公开实施例提供的母板，声波激励结构在驱动信号的控制下产生表面声波，通过产生的表面声波在流体中的驻波效应，可以控制微发光二极管准确的落入到各凹槽内。本公开实施例提供的母板可以实现对微发光二极管的巨量转移，制作工艺简单高效，可有效降低工艺成本。In the mother board provided by the embodiments of the present disclosure, the acoustic wave excitation structure generates surface acoustic waves under the control of the drive signal, and the generated surface acoustic waves can be controlled to accurately fall into the grooves through the standing wave effect of the generated surface acoustic waves in the fluid. The motherboard provided by the embodiment of the present disclosure can realize the massive transfer of micro light-emitting diodes, the manufacturing process is simple and efficient, and the process cost can be effectively reduced.
如图1所示，在衬底基板101上具有多个目标区域102，在除目标区域102以外的区域设有声波激励结构100，声波激励结构100发出的表面声波是一种沿衬底基板的表面传播的弹性声波，能够将能量汇聚于衬底基板的表面，可以有效实现对衬底基板表面的流体及流体中颗粒的驱动、分离等操作。As shown in FIG. 1, there are multiple target areas 102 on the base substrate 101, and the acoustic wave excitation structure 100 is provided in areas other than the target area 102. The surface acoustic wave emitted by the acoustic wave excitation structure 100 is a kind of surface acoustic wave along the base substrate. The elastic acoustic wave propagating on the surface can concentrate energy on the surface of the base substrate, and can effectively realize the operation of driving and separating the fluid on the surface of the base substrate and the particles in the fluid.
例如，可以通过控制声波激励结构产生的表面声波的驻波波形，控制微发光二极管在目标区域102内阵列排布，并且在微发光二极管阵列排布的对应位置处设置凹槽103，凹槽103的尺寸可以设置为稍大于待转移的微发光二极管，可以控制微发光二极管准确的落入到各凹槽103内。凹槽103的形状可以根据需要来选择，图中以圆形为例进行的说明，但是并不限于凹槽103的上述形状，还可以是其它形状。图2为将母板置于悬浮液的示意图。如图2所示，在每一个凹槽103内具有驱动电极108和第一磁性结构109。例如，在待转移的微发光二极管上可以设置与第一磁性结构磁性相反的第二磁性结构，这样在转移过程中，可以通过第一磁性结构109与第二磁性结构之间的磁性引力，控制微发光二极管以具有第二磁性结构的一面与凹槽内的驱动电极贴合，防止微发光二极管倒装。为了更清楚的示意母板的结构，图2中仅以其中的两个凹槽103为例进行示意说明，凹槽103的数量可以为多个。For example, by controlling the standing wave waveform of the surface acoustic wave generated by the acoustic wave excitation structure, the array arrangement of the micro light emitting diodes in the target area 102 can be controlled, and grooves 103 can be arranged at the corresponding positions of the micro light emitting diode array arrangement. The size of can be set slightly larger than the micro light emitting diode to be transferred, and the micro light emitting diode can be controlled to accurately fall into each groove 103. The shape of the groove 103 can be selected according to needs. In the figure, a circle is taken as an example for description, but it is not limited to the above-mentioned shape of the groove 103, and may be other shapes. Figure 2 is a schematic diagram of placing the master plate in the suspension. As shown in FIG. 2, each groove 103 has a driving electrode 108 and a first magnetic structure 109. For example, a second magnetic structure that is magnetically opposite to the first magnetic structure can be provided on the micro light-emitting diode to be transferred, so that during the transfer process, the magnetic attraction between the first magnetic structure 109 and the second magnetic structure can be used to control The micro light emitting diode is attached to the driving electrode in the groove with the side with the second magnetic structure to prevent the micro light emitting diode from being flipped. In order to illustrate the structure of the mother board more clearly, FIG. 2 only uses two of the grooves 103 as an example for schematic illustration, and the number of grooves 103 may be multiple.
微发光二极管(Micro LED)技术是将普通发光二极管(LED)微缩至长度仅50um以下，大约是普通LED尺寸的1％，通过巨量转移技术，可以将微米等级的Micro LED搬移到衬底基板上，从而形成各种尺寸Micro LED显示器。例如，可以通过将红(R)色、绿(G)色和蓝(B)色的微发光二极管分别转移到衬底基板上，以形成RGB全彩显示器，或者，可以只转移发蓝光的微发光二极管，后续通过量子点及荧光技术实现全彩化。Micro LED technology is to reduce the length of ordinary light-emitting diodes (LEDs) to only 50um in length, which is about 1% of the size of ordinary LEDs. Through mass transfer technology, micro-level Micro LEDs can be moved to the base substrate. To form various sizes of Micro LED displays. For example, red (R), green (G), and blue (B) micro light-emitting diodes can be transferred to the base substrate to form an RGB full-color display, or only blue-emitting micro light-emitting diodes can be transferred. The light-emitting diodes will be subsequently realized in full color through quantum dots and fluorescent technology.
由于声波在固体表面和液体中的传播速率不匹配，表面声波能够从固体传播到液体中，两列相向传播、频率一致的表面声波之间相互叠加能够形成表面声波驻波，表面声波驻波能在液体中形成压力势阱并可以用来对微颗粒进行操作控制。在驻波场中，微颗粒受到的作用力主要由主辐射力和次辐射力组成，主辐射力是驻波场本身对微颗粒的作用力，次辐射力则是微颗粒之间散射声波产生的力，其中，次辐射力较小可忽略，主辐射力可以分解为轴向分力和横向分力，横向分力垂直于声波传播方向，轴向分力沿声波传播方向，轴向分力的作用力要大于横向分力，轴向分力将微颗粒推向驻波节点，同时横向分力将微颗粒聚拢在一起并限制他们所处的位置，轴向辐射力的公式表明声学力的大小正比于声波振幅的平方以及微粒的体积。轴向分力F r的关系式如下： Because the propagation rate of sound waves on the solid surface and in the liquid does not match, surface acoustic waves can propagate from solid to liquid. The superposition of two rows of surface acoustic waves that propagate in opposite directions and the same frequency can form a surface acoustic wave standing wave. A pressure potential well is formed in the liquid and can be used to control microparticles. In the standing wave field, the force received by the microparticles is mainly composed of the primary radiation force and the secondary radiation force. The primary radiation force is the force of the standing wave field itself on the microparticles, and the secondary radiation force is generated by the scattering of sound waves between the microparticles. Among them, the secondary radiation force is small and negligible. The main radiation force can be decomposed into an axial component and a transverse component. The transverse component is perpendicular to the direction of sound wave propagation, and the axial component is along the direction of sound wave propagation. The force is greater than the lateral force. The axial force pushes the micro-particles to the node of the standing wave. At the same time, the lateral force gathers the micro-particles and restricts their position. The axial radiation force formula shows the acoustic force The size is proportional to the square of the amplitude of the sound wave and the volume of the particle. The relational expression of the axial component force F r is as follows:
Figure PCTCN2020083535-appb-000001
Figure PCTCN2020083535-appb-000001
Figure PCTCN2020083535-appb-000002
Figure PCTCN2020083535-appb-000002
其中，P 0为声波振幅，V c为微颗粒体积，φ为声学对比因子，ρ c是微粒密度，β c为微粒的可压缩系数，φ、ρ c、β c与微粒周围介质的相应性质ρ w和β w有关，波数k为2π/λ，x是微颗粒距离波节的距离。声学对比因子随密度和可压缩性的变化可能会有明显的改变，从而影响声学力的方向，即微颗粒推向波节还是波腹，通常，固体微颗粒在水溶性介质中会被推向波节， 而对于气泡、油滴等则会被推向驻波波腹，因而，在本公开实施例中，可以利用表面声波将微发光二极管推向波节的位置处。 Among them, P 0 is the acoustic wave amplitude, V c is the volume of the microparticle, φ is the acoustic contrast factor, ρ c is the particle density, β c is the compressibility coefficient of the particle, φ, ρ c , β c and the corresponding properties of the medium surrounding the particle ρ w is related to β w , the wave number k is 2π/λ, and x is the distance between the microparticle and the node. The acoustic contrast factor may change significantly with changes in density and compressibility, thereby affecting the direction of acoustic force, that is, whether the microparticles are pushed toward the node or the antinode. Generally, solid microparticles will be pushed toward The nodes are pushed to the antinodes of the standing wave for bubbles, oil droplets, etc. Therefore, in the embodiments of the present disclosure, surface acoustic waves can be used to push the micro light-emitting diodes to the positions of the nodes.
声波激励结构100包括多个叉指电极。The acoustic wave excitation structure 100 includes a plurality of interdigital electrodes.
图3中以声波激励结构100包括的沿列方向延伸且沿行方向排列的两个第一叉指电极104为例进行示意说明，图4为将图3所示的母板置于悬浮液204中的截面示意图，图4中母板表面处的曲线表示声波激励结构产生的声波波形，声波波形的交点处表示驻波的波节处。In FIG. 3, two first interdigital electrodes 104 extending in the column direction and arranged in the row direction included in the acoustic wave excitation structure 100 are taken as an example for schematic illustration. FIG. 4 shows the mother board shown in FIG. 3 being placed in the suspension 204 The cross-sectional schematic diagram in Figure 4, the curve on the surface of the mother board in Figure 4 represents the acoustic waveform generated by the acoustic excitation structure, and the intersection of the acoustic waveform represents the node of the standing wave.
当第一叉指电极104的两根总线上施加交流的驱动信号时，由于压电效应，压电薄膜会产生周期性应变，虽然第一叉指电极104中每对叉指激励产生的表面声波较弱，但是当第一叉指电极104的周期为表面声波的波长的整数倍时，可以产生声波的互相叠加增强，此时可激励产生较强的表面声波。工艺精度可以通过叉指结构激励产生波长几微米到几百微米的表面声波，通过沿不同传播方向上的表面声波相互耦合，还可以获得不同类型的表现声波。When AC driving signals are applied to the two bus lines of the first interdigital electrode 104, the piezoelectric film will produce periodic strain due to the piezoelectric effect, although the surface acoustic wave generated by each pair of interdigital electrodes in the first interdigital electrode 104 is excited It is weak, but when the period of the first interdigital electrode 104 is an integer multiple of the wavelength of the surface acoustic wave, the mutual superposition and enhancement of the acoustic waves can be generated, and at this time, a stronger surface acoustic wave can be excited. The process accuracy can generate surface acoustic waves with a wavelength of several micrometers to hundreds of micrometers through the excitation of the interdigital structure, and by coupling the surface acoustic waves in different propagation directions with each other, different types of performance acoustic waves can also be obtained.
如图3所示，第一叉指电极104中，叉指宽度均为a 1，指间距均为b 1，则该声波激励结构100产生的表面声波波长λ 1可以按以下关系式确定： As shown in FIG. 3, in the first interdigital electrode 104, the interdigital width is a 1 , and the interdigital distance is b 1 , and the surface acoustic wave wavelength λ 1 generated by the acoustic wave excitation structure 100 can be determined according to the following relationship:
λ 1＝2*(a 1+b 1)； λ 1 =2*(a 1 +b 1 );
两个第一叉指结构104产生的相互平行的表面声波耦合，可产生表面声波驻波，表面声波驻波可在液体中产生压力势阱，从而可对液体中微颗粒进行操控，根据驻波场对微颗粒的作用机制，固体微颗粒在驻波场中汇聚在波节位置，如图3和图4所示，两个第一叉指结构104产生的表面声波驻波可以使微颗粒P聚集在各波节位置处，并沿列方向依次排列，在行方向上相邻的微颗粒P之间的距离d 1为λ 1/2，即a 1+b 1，边缘位置处的微颗粒P距第一叉指电极104中心的距离T 1为半波长的整数倍，即T 1＝nλ 1/2。 The parallel surface acoustic waves generated by the two first interdigital structures 104 are coupled to generate a surface acoustic wave standing wave. The surface acoustic wave standing wave can generate a pressure potential well in the liquid, so that the micro particles in the liquid can be manipulated. According to the standing wave The action mechanism of the field on the microparticles, the solid microparticles converge at the node position in the standing wave field, as shown in Figures 3 and 4, the surface acoustic wave standing waves generated by the two first interdigital structures 104 can make the microparticles P Gathered at each node position and arranged in sequence along the column direction, the distance d 1 between adjacent microparticles P in the row direction is λ 1 /2, that is, a 1 +b 1 , the microparticle P at the edge position The distance T 1 from the center of the first interdigital electrode 104 is an integer multiple of the half wavelength, that is, T 1 =nλ 1 /2.
如图3所示，可以在各波节位置处设置凹槽，从而使微颗粒P落入到对应的凹槽中，图3中每一个微颗粒P所在的位置处都可以设置凹槽。例如，微颗粒P为微发光二极管，可以根据将要转移微发光二极管的显示面板上的 像素分布，来确定各凹槽的位置。例如，在显示面板中，若行方向上相邻的两个像素之间的距离为λ 1/2，列方向上相邻的两个像素之间的距离为图3微颗粒P直径的两倍，则在图3中各奇数行的微颗粒P处均设置凹槽。此外，也可以通过调节第一叉指电极104中的叉指宽度和指间距来调节相邻的波节之间的距离，以调节行方向上相邻凹槽之间的距离。 As shown in FIG. 3, grooves can be provided at the positions of each node, so that the microparticles P fall into the corresponding grooves, and grooves can be provided at the position where each microparticle P in FIG. 3 is located. For example, the micro particles P are micro light emitting diodes, and the position of each groove can be determined according to the pixel distribution on the display panel to which the micro light emitting diode is to be transferred. For example, in a display panel, if the distance between two adjacent pixels in the row direction is λ 1 /2, the distance between two adjacent pixels in the column direction is twice the diameter of the microparticle P in FIG. 3, Then, grooves are provided at the microparticles P in each odd row in FIG. 3. In addition, the distance between adjacent nodes can also be adjusted by adjusting the interdigital width and interdigital distance in the first interdigital electrode 104 to adjust the distance between adjacent grooves in the row direction.
图5以声波激励结构100包括的两个相互垂直的第一叉指电极104和第二叉指电极105为例进行说明，从而激发两列相互垂直的表面声波。这两列相互垂直的表面声波耦合后，形成点阵分布的驻波节点。将图5所示的母板置于悬浮液中，在该表面声波的作用下，微颗粒会在各个驻波节点形成阵列状分布，如图5中的各微颗粒P。FIG. 5 takes two perpendicular first interdigital electrodes 104 and second interdigital electrodes 105 included in the acoustic wave excitation structure 100 as an example for illustration, so as to excite two rows of perpendicular surface acoustic waves. After the two rows of mutually perpendicular surface acoustic waves are coupled, a standing wave node with lattice distribution is formed. The mother board shown in FIG. 5 is placed in the suspension, and under the action of the surface acoustic wave, the microparticles will form an array-like distribution at each standing wave node, as shown in each microparticle P in FIG. 5.
如图5所示，第一叉指电极104中，插指宽度均为a 1，指间距均为b 1，根据驻波场对微颗粒P的作用机制，微颗粒P在驻波场中阵列分布于各波节位置，在行方向上相邻的两个微颗粒的距离d 1为λ 1/2，在列方向上相邻的两个微颗粒的距离d 2为λ 2/2，边缘微颗粒距第一叉指电极104中心距离均为nλ 1/2，边缘微颗粒距第二叉指电极105中心距离均为nλ 2/2其中，λ 1和λ 2满足以下关系： As shown in FIG. 5, in the first interdigital electrode 104, the width of the interdigital fingers is a 1 , and the distance between the fingers is b 1. According to the mechanism of the standing wave field on the microparticles P, the microparticles P are arrayed in the standing wave field. Distributed at each node position, the distance d 1 between two adjacent micro particles in the row direction is λ 1 /2, and the distance d 2 between two adjacent micro particles in the column direction is λ 2 /2, and the edge is slightly smaller. The distance between the particles and the center of the first interdigital electrode 104 is nλ 1 /2, and the distance between the edge micro particles and the center of the second interdigital electrode 105 is nλ 2 /2, where λ 1 and λ 2 satisfy the following relationship:
λ 1＝2*(a 1+b 1)；λ 2＝2*(a 2+b 2)； λ 1 =2*(a 1 +b 1 ); λ 2 =2*(a 2 +b 2 );
并且，边缘位置处的微颗粒P距第一叉指电极104中心的距离T 1为半波长的整数倍，即T 1＝nλ 1/2，边缘位置处的微颗粒P距第二叉指电极105中心的距离T 2为半波长的整数倍，即T 2＝nλ 2/2。 In addition, the distance T 1 of the microparticle P at the edge position from the center of the first interdigital electrode 104 is an integer multiple of half the wavelength, that is, T 1 =nλ 1 /2, and the microparticle P at the edge position is away from the second interdigital electrode. The distance T 2 from the center of 105 is an integer multiple of half the wavelength, that is, T 2 =nλ 2 /2.
与图3类似，也可以在图5所示的微颗粒P处设置凹槽，从而使微颗粒P落入到对应的凹槽中，图5中每一个微颗粒P所在的位置处都可以设置凹槽。例如，微颗粒P为微发光二极管，可以根据将要转移微发光二极管的显示面板上的像素分布，来确定各凹槽的位置。例如，在显示面板中，若行方向上相邻的两个像素之间的距离为λ 1/2，列方向上相邻的两个像素之间的距离为λ 2/2，则可以在图5所示的每一个微颗粒P处均设置凹槽。若行方向上相邻 的两个像素之间的距离为λ 1/2，列方向上相邻的两个像素之间的距离为λ 2，则可以在图5所示的各奇数行的微颗粒P处均设置凹槽。此外，可以通过调节第一叉指电极104的叉指宽度和指间距来调节行方向相邻的波节之间的距离，以调节行方向上相邻凹槽之间的距离，通过调节第二叉指电极105的叉指宽度和指间距来调节列方向相邻的波节之间的距离，以调节列方向上相邻凹槽之间的距离。 Similar to FIG. 3, grooves can also be provided at the microparticles P shown in FIG. 5, so that the microparticles P fall into the corresponding grooves. Each microparticle P in FIG. 5 can be provided at the location where Groove. For example, the micro particles P are micro light emitting diodes, and the position of each groove can be determined according to the pixel distribution on the display panel to which the micro light emitting diode is to be transferred. For example, in a display panel, if the distance between two adjacent pixels in the row direction is λ 1 /2, and the distance between two adjacent pixels in the column direction is λ 2 /2, it can be shown in Figure 5 A groove is provided at each microparticle P shown. If the distance between two adjacent pixels in the row direction is λ 1 /2, and the distance between two adjacent pixels in the column direction is λ 2 , then the microparticles in each odd row shown in FIG. 5 There are grooves at P. In addition, the distance between adjacent nodes in the row direction can be adjusted by adjusting the interdigital width and the interdigital distance of the first interdigital electrode 104, so as to adjust the distance between adjacent grooves in the row direction. The width of the fingers of the finger electrode 105 and the finger pitch are used to adjust the distance between adjacent nodes in the column direction to adjust the distance between adjacent grooves in the column direction.
例如，为了减弱表面声波能量的衰减，所述声波激励结构100可以包括多个叉指电极104,105。For example, in order to reduce the attenuation of surface acoustic wave energy, the acoustic wave excitation structure 100 may include a plurality of interdigital electrodes 104, 105.
例如，在本公开实施例提供的母板中，如图1所示，多个目标区域102呈阵列排布；For example, in the motherboard provided by the embodiment of the present disclosure, as shown in FIG. 1, a plurality of target areas 102 are arranged in an array;
声波激励结构100包括：沿列方向延伸且沿行方向排列的多个第一叉指电极104；The acoustic wave excitation structure 100 includes: a plurality of first interdigital electrodes 104 extending in the column direction and arranged in the row direction;
在行方向相邻的两个第一叉指电极104之间具有至少一个目标区域102。There is at least one target area 102 between two adjacent first interdigital electrodes 104 in the row direction.
在行方向上相邻的两个第一叉指电极104产生的表面声波叠加，可以增强表面声波的能量，提高控制微发光二极管移动的能力，保证微发光二极管能够落入到对应的凹槽内。The superimposition of the surface acoustic waves generated by the two adjacent first interdigital electrodes 104 in the row direction can enhance the energy of the surface acoustic wave, improve the ability to control the movement of the micro light emitting diode, and ensure that the micro light emitting diode can fall into the corresponding groove.
例如，本公开实施例提供的母板中，如图1所示，目标区域102中在行方向上相邻的两个凹槽103之间的距离L 1满足以下关系： For example, in the motherboard provided by the embodiment of the present disclosure, as shown in FIG. 1, the distance L 1 between two adjacent grooves 103 in the row direction in the target area 102 satisfies the following relationship:
L 1＝m*(a 1+b 1)； L 1 =m*(a 1 +b 1 );
其中，a 1为第一叉指电极的叉指宽度，b 1为第一叉指电极的指间距，m为大于零的整数。 Among them, a 1 is the interdigital width of the first interdigital electrode, b 1 is the interdigital distance of the first interdigital electrode, and m is an integer greater than zero.
也就是图1中行方向上相邻两个凹槽103之间的距离为图3中行方向上相邻两个微颗粒P之间的距离的整数倍，从而保证微发光二极管在转移过程中能够落入到对应位置处的凹槽中。That is, the distance between two adjacent grooves 103 in the row direction in FIG. 1 is an integer multiple of the distance between two adjacent microparticles P in the row direction in FIG. 3, so as to ensure that the micro light emitting diode can fall during the transfer process. Into the groove at the corresponding position.
或者，本公开实施例提供的母板中，如图6所示，多个目标区域102呈 阵列排布；Alternatively, in the motherboard provided by the embodiment of the present disclosure, as shown in FIG. 6, a plurality of target areas 102 are arranged in an array;
声波激励结构100包括：沿列方向延伸且沿行方向排列的多个第一叉指电极104，以及沿行方向延伸且沿列方向排列的多个第二叉指电极105；The acoustic wave excitation structure 100 includes: a plurality of first interdigital electrodes 104 extending in a column direction and arranged in a row direction, and a plurality of second interdigital electrodes 105 extending in a row direction and arranged in a column direction;
在行方向相邻的两个第一叉指电极104之间具有至少一个目标区域103，在列方向相邻的两个第二叉指电极105之间具有至少一个目标区域103。There is at least one target area 103 between two adjacent first interdigital electrodes 104 in the row direction, and at least one target area 103 between two adjacent second interdigital electrodes 105 in the column direction.
通过设置相互垂直的第一叉指电极104和第二叉指电极105，通过电信号激励得到的表面声波具有呈点阵分布的驻波节点，并且，各第一叉指电极104和各第二叉指电极105产生的表面声波叠加，可以增强表面声波的能量，提高控制微发光二极管移动的能力，从而能够移动更多个微发光二极管，实现多个显示面板批量转移微发光二极管的工艺。By arranging the first interdigital electrode 104 and the second interdigital electrode 105 perpendicular to each other, the surface acoustic wave obtained by electrical signal excitation has standing wave nodes distributed in a lattice, and each first interdigital electrode 104 and each second interdigital electrode 104 The superposition of the surface acoustic wave generated by the interdigital electrode 105 can enhance the energy of the surface acoustic wave and improve the ability to control the movement of the micro-light-emitting diode, so that more micro-light-emitting diodes can be moved, and the process of batch transfer of the micro-light-emitting diodes for multiple display panels is realized.
例如，在本公开实施例提供的母板中，如图7所示，每个第一叉指电极104可以包括：沿列方向延伸且沿列方向排列的至少两个第一子叉指电极1041。这样，在相同的工艺精度下，可以使目标区域102在列方向上的长度更长，从而可以制作面积更大的显示面板。For example, in the motherboard provided by the embodiment of the present disclosure, as shown in FIG. 7, each first interdigital electrode 104 may include: at least two first sub-interdigital electrodes 1041 extending in the column direction and arranged in the column direction. . In this way, under the same process accuracy, the length of the target area 102 in the column direction can be made longer, so that a display panel with a larger area can be manufactured.
如图8所示，第二叉指电极105包括：沿行方向延伸且沿行方向排列的至少两个第二子叉指电极1051。这样，在相同的工艺精度下，可以使目标区域102在行方向上的长度更长，从而可以制作面积更大的显示面板。As shown in FIG. 8, the second interdigital electrode 105 includes: at least two second sub-interdigital electrodes 1051 extending in the row direction and arranged in the row direction. In this way, under the same process accuracy, the length of the target area 102 in the row direction can be made longer, so that a display panel with a larger area can be manufactured.
例如，基于图7-8的实施例，还可以在行和列方向上都包括至少两个第一子叉指电极1041和至少两个第二子叉指电极1051。For example, based on the embodiments of FIGS. 7-8, at least two first sub-interdigital electrodes 1041 and at least two second sub-interdigital electrodes 1051 may also be included in both the row and column directions.
例如，可以根据需要的目标区域的大小，来设置第一叉指电极104中第一子叉指电极1041的个数，以及第二叉指电极105中第二子叉指电极1051的个数，也就是说，第一子叉指电极1041和第二子叉指电极1051的数量不限于上面示例说明的两个，第一叉指电极和第二叉指电极也可以分别包括其他数量的子叉指电极。For example, the number of first sub-interdigital electrodes 1041 in the first interdigital electrode 104 and the number of second sub-interdigital electrodes 1051 in the second interdigital electrode 105 can be set according to the size of the target area required. That is to say, the number of the first interdigital electrode 1041 and the second interdigital electrode 1051 is not limited to the two exemplified above, and the first interdigital electrode and the second interdigital electrode may also include other numbers of sub-interdigital electrodes, respectively. Refers to the electrode.
例如，本公开实施例提供的母板中，如图6所示，目标区域102中在行方向上相邻的两个凹槽之间的距离L 1，以及列方向上相邻的两个凹槽之间的 距离L 2满足以下关系： For example, in the motherboard provided by the embodiment of the present disclosure, as shown in FIG. 6, the distance L 1 between two adjacent grooves in the row direction in the target area 102, and the two adjacent grooves in the column direction The distance between L 2 satisfies the following relationship:
L 1＝m*(a 1+b 1)；L 2＝n*(a 2+b 2)； L 1 =m*(a 1 +b 1 ); L 2 =n*(a 2 +b 2 );
其中，a 1为第一叉指电极的叉指宽度，b 1为第一叉指电极的指间距；a 2为第二叉指电极的叉指宽度，b 2为第二叉指电极的指间距，m和n为大于零的整数。 Where a 1 is the interdigital width of the first interdigital electrode, b 1 is the interdigital distance of the first interdigital electrode; a 2 is the interdigital width of the second interdigital electrode, and b 2 is the finger of the second interdigital electrode. Spacing, m and n are integers greater than zero.
参照图5，在行方向上相邻的两个微颗粒P的距离d 1由第一叉指电极104的叉指宽度a 1和指间距b 1确定。例如，d 1＝λ 1/2＝a 1+b 1，在图6中，由于各凹槽103对应于图5中微颗粒P的位置，因而在行方向上相邻的两个凹槽103之间的距离L 1为d 1的整数倍，因而L 1为m*(a 1+b 1)，同理，在列方向上相邻的两个凹槽103之间的距离L 2为d 2的整数倍，因而L 2为n*(a 2+b 2)。 Referring to FIG. 5, the distance d 1 of two adjacent micro particles P in the row direction is determined by the interdigital width a 1 and the interdigital distance b 1 of the first interdigital electrode 104. For example, d 1 =λ 1 /2=a 1 +b 1 , in Fig. 6, since each groove 103 corresponds to the position of the microparticle P in Fig. 5, one of the two adjacent grooves 103 in the row direction The distance between L 1 is an integer multiple of d 1 , so L 1 is m*(a 1 +b 1 ). Similarly, the distance L 2 between two adjacent grooves 103 in the column direction is d 2 Is an integer multiple of, so L 2 is n*(a 2 +b 2 ).
如图6所示，在本公开实施例中，上述第一叉指电极104和第二叉指电极105可以设置为等间距的叉指电极，即叉指宽度与指间距相同，可得λ 1＝4a 1；λ 2＝4a 2。由于声表面波在母板表面的声速恒定，由ν＝λf，其中，ν表示声速，λ表示声波波长，f表示工作频率，波长直接决定声波激励结构的工作频率。在微流驱动方面，过高的工作频率会导致声波振幅减小，降低声波激励结构的工作性能，因而需控制声波激励结构具有比较低的工作频率，同时，叉指宽度的大小影响光刻工艺的良率，过窄的叉指宽度会使良率降低，因此，也需要考虑制造叉指宽度的可行性。 As shown in FIG. 6, in the embodiment of the present disclosure, the first interdigital electrode 104 and the second interdigital electrode 105 can be arranged as interdigital electrodes with equal intervals, that is, the interdigital width is the same as the interdigital distance, and λ 1 =4a 1 ; λ 2 =4a 2 . Since the sound velocity of the surface acoustic wave on the surface of the mother board is constant, ν=λf, where ν represents the speed of sound, λ represents the wavelength of the sound wave, and f represents the working frequency. The wavelength directly determines the working frequency of the acoustic wave excitation structure. In terms of microfluidic drive, too high operating frequency will reduce the amplitude of the acoustic wave and reduce the performance of the acoustic wave excitation structure. Therefore, it is necessary to control the acoustic wave excitation structure to have a relatively low operating frequency. At the same time, the size of the interdigital width affects the lithography process Too narrow interdigital width will reduce the yield. Therefore, it is also necessary to consider the feasibility of manufacturing interdigital width.
在本公开的实施例中，例如，第一叉指结构104和第二叉指结构105中，叉指宽度在50～100μm的范围内，声波波长在200～400μm的范围内。In an embodiment of the present disclosure, for example, in the first interdigital structure 104 and the second interdigital structure 105, the interdigital width is in the range of 50-100 μm, and the acoustic wave wavelength is in the range of 200-400 μm.
此外，在第一叉指结构104和第二叉指结构105中，叉指对(pair)数N决定了声波激励结构的带宽及声表面波的激发强度，叉指对数越高，带宽越窄，品质因数越高，同时也会增大声波强度，提高驱动颗粒能力，但是叉指对数过多会增加工艺难度、占用面积，增加成本。In addition, in the first interdigital structure 104 and the second interdigital structure 105, the number N of interdigital pairs (pair) determines the bandwidth of the acoustic wave excitation structure and the excitation intensity of the surface acoustic wave. The higher the number of interdigital pairs, the greater the bandwidth. Narrow, the higher the quality factor, it will also increase the intensity of the sound wave and improve the ability to drive particles, but too many interdigital logarithms will increase process difficulty, occupy area, and increase cost.
在本公开实施例中，叉指对数可以为30，但是本公开的实施例并不限于此。In the embodiment of the present disclosure, the number of interdigital pairs may be 30, but the embodiment of the present disclosure is not limited thereto.
由于声表面波在流体中的衰减，第一叉指结构在列方向上的宽度或第二叉指结构在行方向上的宽度可以表示为延迟线距离L，延迟线距离L不能过长。例如，本公开的实施例中L可约为500λ，并通过叉指电极的阵列化排布减弱表面声波能量的衰减。如图6所示，第一叉指电极104和第二叉指电极105的延迟线距离相等时，目标区域102大致为L*L的正方形区域。Due to the attenuation of the surface acoustic wave in the fluid, the width of the first interdigital structure in the column direction or the width of the second interdigital structure in the row direction can be expressed as the delay line distance L, and the delay line distance L cannot be too long. For example, in the embodiment of the present disclosure, L may be about 500λ, and the attenuation of surface acoustic wave energy is reduced by the arrayed arrangement of interdigital electrodes. As shown in FIG. 6, when the delay line distances of the first interdigital electrode 104 and the second interdigital electrode 105 are equal, the target area 102 is approximately a L*L square area.
如图5所示，第一叉指电极104的声孔径为A 1，第二叉指电极105的声孔径为A 2。声孔径反应叉指电极的长度，可以影响插指电极的激发强度。可以将声孔径设置为稍小于对应的延迟线距离，例如可设置为A＝L-λ，λ表示声波波长，当叉指电极具有n个子叉指电极时，其声孔径可设置为(L-λ)/n。 As shown in FIG. 5, the acoustic aperture of the first interdigital electrode 104 is A 1 , and the acoustic aperture of the second interdigital electrode 105 is A 2 . The acoustic aperture responds to the length of the interdigital electrode and can affect the excitation intensity of the interdigital electrode. The acoustic aperture can be set to be slightly smaller than the corresponding delay line distance. For example, it can be set as A=L-λ, where λ represents the acoustic wave wavelength. When the interdigital electrode has n sub-interdigital electrodes, the acoustic aperture can be set to (L- λ)/n.
例如，在本公开实施例提供的母板中，如图2所示，第一磁性结构109位于驱动电极108背离衬底基板101的一侧。For example, in the motherboard provided by the embodiment of the present disclosure, as shown in FIG. 2, the first magnetic structure 109 is located on the side of the driving electrode 108 away from the base substrate 101.
第一磁性结构109在衬底基板101上的正投影位于同一凹槽103内的驱动电极108在衬底基板101上的正投影的范围内。The orthographic projection of the first magnetic structure 109 on the base substrate 101 is located within the range of the orthographic projection of the drive electrodes 108 in the same groove 103 on the base substrate 101.
也就是说，第一磁性结构109的尺寸小于同一凹槽103内的驱动电极108的尺寸，驱动电极108不会被第一磁性结构109遮挡，使后续可以通过接触材料110将驱动电极108与微发光二极管20绑定连接。In other words, the size of the first magnetic structure 109 is smaller than the size of the drive electrode 108 in the same groove 103, and the drive electrode 108 will not be blocked by the first magnetic structure 109, so that the drive electrode 108 can be connected to the micro drive electrode 108 through the contact material 110 later. The light-emitting diode 20 is bonded and connected.
此外，为了提高驱动电极108与微发光二极管20之间的导电性能，也可以采用具有导电性能的第一磁性结构109。In addition, in order to improve the conductivity between the driving electrode 108 and the micro light emitting diode 20, the first magnetic structure 109 with conductivity may also be used.
例如，上述压电薄膜107可以采用氮化铝压电薄膜材料，压电薄膜107具有较好的耐酸碱性，提高显示面板的可靠性。例如，可以通过磁控溅射或化学气相沉积制备压电薄膜107，且压电薄膜107的厚度约为10μm。For example, the piezoelectric film 107 can be made of aluminum nitride piezoelectric film material. The piezoelectric film 107 has better acid and alkali resistance, which improves the reliability of the display panel. For example, the piezoelectric film 107 can be prepared by magnetron sputtering or chemical vapor deposition, and the thickness of the piezoelectric film 107 is about 10 μm.
例如，先在衬底基板101上对应于将要形成的各凹槽103的位置处形成各驱动电极108，然后在驱动电极108所在膜层上形成绝缘层106，对绝缘层106进行图形化，例如可以采用刻蚀工艺，以形成贯穿绝缘层106的各凹槽 103，使驱动电极108位于对应的凹槽103的底部，然后在绝缘层106上形成压电薄膜107的图形；或者，也可以在驱动电极108所在膜层上依次形成绝缘层106和压电薄膜107，然后采用刻蚀工艺形成贯穿绝缘层106和压电薄膜107的各凹槽103。For example, firstly, each driving electrode 108 is formed on the base substrate 101 at a position corresponding to each groove 103 to be formed, and then an insulating layer 106 is formed on the film layer where the driving electrode 108 is located, and the insulating layer 106 is patterned, for example An etching process can be used to form each groove 103 penetrating the insulating layer 106, so that the driving electrode 108 is located at the bottom of the corresponding groove 103, and then a pattern of the piezoelectric film 107 is formed on the insulating layer 106; or, An insulating layer 106 and a piezoelectric film 107 are sequentially formed on the film layer where the driving electrode 108 is located, and then an etching process is used to form grooves 103 penetrating the insulating layer 106 and the piezoelectric film 107.
图9为转移微发光二极管后将母板从悬浮液中取出后的结构示意图。如图9所示，所述母板还包括位于凹槽103内的微发光二极管20。微发光二极管20包括：位于同一侧的第一引出电极201和与第一磁性结构109磁性相反的第二磁性结构202，以及位于另一侧的与第一引出电极201相对设置的第二引出电极203；微发光二极管20的第一引出电极201与位于同一个凹槽103内的驱动电极108电连接。FIG. 9 is a schematic diagram of the structure after the mother board is taken out of the suspension after the micro-light emitting diode is transferred. As shown in FIG. 9, the motherboard further includes a micro light emitting diode 20 located in the groove 103. The micro light-emitting diode 20 includes: a first extraction electrode 201 on the same side, a second magnetic structure 202 that is magnetically opposite to the first magnetic structure 109, and a second extraction electrode on the other side opposite to the first extraction electrode 201 203; the first lead electrode 201 of the micro light emitting diode 20 is electrically connected to the driving electrode 108 located in the same groove 103.
本公开实施例中的母板可以用于转移引出电极位于两侧的微发光二极管芯片，通过在凹槽103内设置第一磁性结构109以及在微发光二极管20上设置第二磁性结构202，第一磁性结构109和第二磁性结构202的磁性相反，利用磁性吸引力可以将微发光二极管20的第一引出电极201与凹槽内的驱动电极108实现电连接，可以准确的控制微发光二极管20与对应的驱动电极108实现电连接，防止微发光二极管20倒装。The mother board in the embodiment of the present disclosure can be used to transfer micro light emitting diode chips with lead electrodes located on both sides. By arranging the first magnetic structure 109 in the groove 103 and the second magnetic structure 202 on the micro light emitting diode 20, The magnetic structure of a magnetic structure 109 is opposite to that of the second magnetic structure 202. The first lead electrode 201 of the micro light emitting diode 20 can be electrically connected with the driving electrode 108 in the groove by magnetic attraction, and the micro light emitting diode 20 can be accurately controlled. It is electrically connected with the corresponding driving electrode 108 to prevent the micro light-emitting diode 20 from flipping.
例如，在微发光二极管20中，第二磁性结构202的尺寸可以设置为小于第一引出电极201的尺寸，使第一引出电极201不会被第二磁性结构202遮挡，后续可以通过接触材料110将微发光二极管20与驱动电极108绑定连接。此外，为了提高微发光二极管20与驱动电极108之间的导电性能，也可以采用具有导电性能的第二磁性结构202。For example, in the micro-light emitting diode 20, the size of the second magnetic structure 202 can be set to be smaller than the size of the first extraction electrode 201, so that the first extraction electrode 201 will not be blocked by the second magnetic structure 202, and the contact material 110 can be used later. The micro light emitting diode 20 and the driving electrode 108 are bonded and connected. In addition, in order to improve the electrical conductivity between the micro light emitting diode 20 and the driving electrode 108, the second magnetic structure 202 with electrical conductivity may also be used.
本公开的实施例还提供了一种显示面板，该显示面板可以应用于手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。由于该显示面板解决问题的原理与上述母板相似，因此该显示面板的实施可以参见上述母板的实施，重复之处不再赘述。The embodiments of the present disclosure also provide a display panel, which can be applied to any products or components with display functions such as mobile phones, tablet computers, televisions, displays, notebook computers, digital photo frames, navigators, etc. Since the principle of solving the problem of the display panel is similar to the above-mentioned motherboard, the implementation of the display panel can refer to the implementation of the above-mentioned motherboard, and the repetition will not be repeated.
本公开实施例提供的一种显示面板，如图10所示，包括：衬底基板101， 位于衬底基板101的上绝缘层106，以及位于绝缘层106远离衬底基板101一侧的压电薄膜107。绝缘层106远离衬底基板101的一侧具有多个凹槽103。每一个凹槽103内具有驱动电极108和第一磁性结构109，以及位于第一磁性结构109远离衬底基板101一侧的微发光二极管20；微发光二极管20包括：位于同一侧的第一引出电极201和与第一磁性结构109磁性相反的第二磁性结构202，以及位于另一侧的与第一引出电极201相对设置的第二引出电极203。微发光二极管20的第一引出电极201与位于同一个凹槽103内的驱动电极108电连接。A display panel provided by an embodiment of the present disclosure, as shown in FIG. 10, includes: a base substrate 101, an upper insulating layer 106 located on the base substrate 101, and a piezoelectric element located on the side of the insulating layer 106 away from the base substrate 101膜107。 Film 107. The insulating layer 106 has a plurality of grooves 103 on the side away from the base substrate 101. Each groove 103 has a driving electrode 108 and a first magnetic structure 109, and a micro light emitting diode 20 located on the side of the first magnetic structure 109 away from the base substrate 101; the micro light emitting diode 20 includes: first lead wires located on the same side The electrode 201 and the second magnetic structure 202 magnetically opposite to the first magnetic structure 109, and the second extraction electrode 203 disposed opposite to the first extraction electrode 201 on the other side. The first lead electrode 201 of the micro light emitting diode 20 is electrically connected to the driving electrode 108 located in the same groove 103.
衬底基板例如可以为玻璃基板，石英基板，塑料基板等，但是板公开的实施例并不限于此。The base substrate may be, for example, a glass substrate, a quartz substrate, a plastic substrate, etc., but the disclosed embodiments of the board are not limited thereto.
本公开实施例中的显示面板为对转移有微发光二极管后的母板进行切割后得到的。以图1所示的母板为例，可以沿着母板中的目标区域102的边缘进行切割得到图10所示的显示面板，得到的显示面板中不具有声波激励结构，从而避免声波激励结构占用显示面板的边框区域，有利于显示面板的窄边框化。此外，也可以在目标区域102的内部的某个区域进行切割，可以根据需要的显示面板的尺寸确定需要切割的区域的大小。The display panel in the embodiment of the present disclosure is obtained by cutting the mother board after transferring the micro light emitting diode. Taking the motherboard shown in FIG. 1 as an example, the display panel shown in FIG. 10 can be obtained by cutting along the edge of the target area 102 in the motherboard. The resulting display panel does not have an acoustic wave excitation structure, thereby avoiding the acoustic wave excitation structure Occupying the frame area of the display panel is conducive to narrowing the frame of the display panel. In addition, cutting can also be performed in a certain area inside the target area 102, and the size of the area to be cut can be determined according to the required size of the display panel.
例如，本公开实施例提供的显示面板中，如图10所示，微发光二极管20的第一引出电极201与驱动电极108通过接触材料110绑定连接。For example, in the display panel provided by the embodiment of the present disclosure, as shown in FIG. 10, the first lead electrode 201 of the micro light emitting diode 20 and the driving electrode 108 are bonded and connected by the contact material 110.
例如，可以采用锡或银等材料作为接触材料，并采用焊接的方式进行绑定，或者，也可以采用AuSn等合金材料作为接触材料，并采用共晶的方式进行绑定。For example, materials such as tin or silver can be used as the contact material and bonded by welding, or alloy materials such as AuSn can also be used as the contact material and bonded by the eutectic method.
本公开的实施例还提供了一种所述显示面板的制作方法，如图11所示，该方法包括：The embodiment of the present disclosure also provides a manufacturing method of the display panel. As shown in FIG. 11, the method includes:
S301、提供悬浮有多个微发光二极管的悬浮液，每个微发光二极管包括：分别位于两侧的两个引出电极，以及位于一侧的且与第一磁性结构磁性相反的第二磁性结构；S301, providing a suspension in which a plurality of micro-light-emitting diodes are suspended, each micro-light-emitting diode includes: two extraction electrodes respectively located on two sides, and a second magnetic structure located on one side and magnetically opposite to the first magnetic structure;
S302、将带有目标区域的母板浸泡在悬浮液中，所述目标区域包括多个凹槽；S302. Soak the mother board with the target area in the suspension, the target area including a plurality of grooves;
S303、向声波激励结构施加驱动信号以产生表面声波，以使多个微发光二极管分别落入到所述母板的目标区域中的各凹槽内；S303: Apply a driving signal to the acoustic wave excitation structure to generate surface acoustic waves, so that a plurality of micro light-emitting diodes respectively fall into the grooves in the target area of the motherboard;
S304、对各凹槽内的所述微发光二极管进行固定；S304. Fix the micro light-emitting diodes in each groove;
S305、对母板进行切割，以得到多个显示面板。S305. Cutting the mother board to obtain multiple display panels.
在上述步骤S301中，悬浮液可以为超纯水，或者也可以在超纯水内添加表面活性剂。超纯水除了水分子外，几乎没有杂质，也没有细菌、病毒等物质，不会与硅等无机物及金属反应，不会腐蚀微发光二极管中的引出电极和第二磁性材料，也可以保持悬浮在悬浮液中的微发光二极管具有稳定的表面特定。In the above step S301, the suspension may be ultrapure water, or a surfactant may be added to the ultrapure water. Except for water molecules, ultrapure water has almost no impurities, no bacteria, viruses and other substances. It will not react with inorganic substances such as silicon and metals, and will not corrode the extraction electrode and the second magnetic material in the micro-light emitting diode, and it can also maintain The micro light-emitting diode suspended in the suspension has a stable surface specificity.
在上述步骤S302中，如图2和图9所示，将凹槽内不具有微发光二极管的母板浸泡于悬浮液中。In the above step S302, as shown in FIG. 2 and FIG. 9, the mother board without the micro light emitting diode in the groove is immersed in the suspension.
在上述步骤S303中，同样参照图2和图9，向声波激励结构施加驱动信号以产生表面声波，微发光二极管20在表面声波的控制下移动到表面声波的波节位置处，母板上的各凹槽103分别位于波节的位置，并且在第一磁性结构109和第二磁性结构202之间的磁性引力的作用下，可使微发光二极管20具有第一引出电极201的一侧朝向衬底基板101落入到凹槽103中。In the above step S303, referring also to Figures 2 and 9, a drive signal is applied to the acoustic wave excitation structure to generate surface acoustic waves. The micro light emitting diode 20 is moved to the node position of the surface acoustic wave under the control of the surface acoustic wave. The grooves 103 are respectively located at the node positions, and under the action of the magnetic attraction between the first magnetic structure 109 and the second magnetic structure 202, the side of the micro light emitting diode 20 with the first extraction electrode 201 can be made to face the liner. The base substrate 101 falls into the groove 103.
在上述步骤S304中，对凹槽内的各微发光二极管进行固定，可以采用绑定的方式，将微发光二极管的第一引出电极与凹槽内的驱动电极实现固定连接。In the above step S304, the micro light-emitting diodes in the groove are fixed, and the first lead electrode of the micro light-emitting diode can be fixedly connected with the driving electrode in the groove by binding.
然后，将母板从悬浮液中取出，并清洗去除残留在母板上的其他微发光二极管，去除掉的微发光二极管还可以在后续转移工艺中继续使用，避免浪费微发光二极管，节省制作成本。Then, take the mother board out of the suspension, and clean and remove other micro light emitting diodes remaining on the mother board. The removed micro light emitting diodes can also be used in the subsequent transfer process to avoid wasting micro light emitting diodes and save manufacturing costs .
在上述步骤S305中，对母板进行切割，得到多个显示面板，从而实现了多个显示面板批量转移微发光二极管，制作效率高。在切割过程中，可以对 母板中的目标区域的边缘或目标区域中的部分区域进行切割，以使切割得到的显示面板中不具有声波激励结构，有利于显示面板的窄边框化。In the above step S305, the mother board is cut to obtain multiple display panels, thereby realizing the batch transfer of the micro light-emitting diodes from the multiple display panels, and the manufacturing efficiency is high. During the cutting process, the edge of the target area in the mother board or part of the target area can be cut, so that the cut display panel does not have an acoustic wave excitation structure, which is beneficial to narrow the frame of the display panel.
此外，在本公开实施例提供的上述制作方法中，上述步骤S302之前，还可以包括：In addition, in the foregoing manufacturing method provided by the embodiment of the present disclosure, before the foregoing step S302, it may further include:
在母板中的各凹槽内形成用于绑定工艺的接触材料；Forming contact materials for the bonding process in each groove in the motherboard;
上述步骤S305可以包括：The foregoing step S305 may include:
采用加热的方式将各微发光二极管与对应的凹槽内的驱动电极进行绑定。The micro light-emitting diodes are bound to the driving electrodes in the corresponding grooves by heating.
在步骤S302之前，在各凹槽内形成用于绑定工艺的接触材料，接触材料可以为锡、银或AuSn合金等材料，以便后续将微发光二极管与驱动电极进行绑定。在步骤S303中，微发光二极管落入到对应的凹槽内，此时，微发光二极管只是通过磁性引力固定在凹槽内，微发光二极管中的第一引出电极与驱动电极并没有实现固定连接。在步骤S305中，将母板置于密闭空间，通入氮气，或其它惰性气体，使腔室气压至少保持3个标准大气压以上，防止在焊接时悬浮液沸腾，导致凹槽内的微发光二极管的位置发生移动。在步骤S305之后，再将母板从悬浮液中取出，可以避免取出过程中由于悬浮液的流动导致凹槽内的微发光二极管移动。Before step S302, a contact material for the bonding process is formed in each groove. The contact material can be tin, silver, or AuSn alloy, etc., so that the micro light-emitting diode and the driving electrode can be subsequently bonded. In step S303, the micro light emitting diode falls into the corresponding groove. At this time, the micro light emitting diode is only fixed in the groove by magnetic attraction, and the first lead electrode and the driving electrode in the micro light emitting diode are not fixedly connected . In step S305, the mother board is placed in a closed space, and nitrogen or other inert gas is introduced to keep the chamber pressure at least 3 standard atmospheric pressures to prevent the suspension from boiling during welding, resulting in micro-light emitting diodes in the groove The location of has moved. After step S305, the mother board is removed from the suspension, which can avoid the movement of the micro light-emitting diodes in the groove due to the flow of the suspension during the removal.
本公开实施例提供的显示面板、其制作方法及母板，声波激励结构在驱动信号的控制下产生表面声波，通过产生的表面声波在流体中的驻波效应，可以控制微发光二极管准确的落入到各凹槽内。本公开实施例提供的母板可以实现对微发光二极管的巨量转移，制作工艺简单高效，可有效降低工艺成本。本公开实施例中，只需通过沉积压电薄膜和声波激励器件就能够实现对微发光二极管的巨量转移，工艺简单有效，可以有效降低工艺成本，并且随着微发光二极管晶粒尺寸的进一步缩小，对转移精度的要求进一步提升，本公开实施例提供的母板能够简单的通过调节叉指电极的间距和周期，实现对表面声波的调节，进而调节微发光二极管落在母板上的位置和间距，实现更 高精度微发光二极管的巨量转移，并且工艺成本低。In the display panel, the manufacturing method and the motherboard provided by the embodiments of the present disclosure, the acoustic wave excitation structure generates surface acoustic waves under the control of the driving signal, and the standing wave effect of the generated surface acoustic waves in the fluid can control the accurate landing of the micro light emitting diodes. Into each groove. The motherboard provided by the embodiments of the present disclosure can realize the massive transfer of micro light-emitting diodes, the manufacturing process is simple and efficient, and the process cost can be effectively reduced. In the embodiments of the present disclosure, the massive transfer of micro-light-emitting diodes can be realized only by depositing piezoelectric films and acoustic wave excitation devices. The process is simple and effective, and the process cost can be effectively reduced. Reduced, the requirements for transfer accuracy are further improved. The motherboard provided by the embodiments of the present disclosure can adjust the surface acoustic wave simply by adjusting the interval and period of the interdigital electrodes, and then adjust the position of the micro light emitting diode on the motherboard. And the spacing, the massive transfer of higher precision micro light emitting diodes is realized, and the process cost is low.
以下几点需要说明：The following points need to be explained:
(1)本公开实施例附图只涉及到与本公开实施例涉及到的结构，其他结构可参考通常设计。(1) The drawings of the embodiments of the present disclosure only refer to the structures related to the embodiments of the present disclosure, and other structures can refer to the usual design.
(2)在不冲突的情况下，本公开的实施例及实施例中的特征可以相互组合以得到新的实施例，而这些新的实施例都应属于本公开的范围。(2) Without conflict, the embodiments of the present disclosure and the features in the embodiments can be combined with each other to obtain new embodiments, and these new embodiments should all belong to the scope of the present disclosure.
以上所述，仅为本公开的示例实施例，本公开的保护范围并不局限于此，任何熟悉本技术领域的普通技术人员在本公开实施例揭露的技术范围内，可轻易想到的变化或替换，都应涵盖在本公开的保护范围之内。The above are only exemplary embodiments of the present disclosure, and the protection scope of the present disclosure is not limited thereto. Any person skilled in the art can easily think of changes or changes within the technical scope disclosed in the embodiments of the present disclosure. All replacements shall be covered within the protection scope of the present disclosure.

Claims (15)

  1. 一种母板，包括：A motherboard, including:
    衬底基板，位于所述衬底基板之上的多个目标区域，以及压电薄膜和声波激励结构；其中，A base substrate, a plurality of target areas located on the base substrate, a piezoelectric film and an acoustic wave excitation structure; wherein,
    所述声波激励结构位于除所述多个目标区域以外的区域，并与所述压电薄膜接触，所述声波激励结构用于在驱动信号的控制下产生表面声波；The acoustic wave excitation structure is located in an area other than the multiple target areas and is in contact with the piezoelectric film, and the acoustic wave excitation structure is used to generate surface acoustic waves under the control of a driving signal;
    每个所述目标区域包括：位于所述衬底基板上的绝缘层，以及位于所述绝缘层远离所述衬底基板一侧的用于容置微发光二极管的多个凹槽；以及Each of the target areas includes: an insulating layer on the base substrate, and a plurality of grooves for accommodating micro light-emitting diodes on the side of the insulating layer away from the base substrate; and
    所述压电薄膜位于除各所述所述凹槽以外的区域，每一个所述凹槽内具有驱动电极和第一磁性结构。The piezoelectric film is located in an area other than each of the grooves, and each of the grooves has a driving electrode and a first magnetic structure.
  2. 如权利要求1所述的母板，其中，所述多个目标区域呈阵列排布；3. The motherboard of claim 1, wherein the plurality of target areas are arranged in an array;
    所述声波激励结构包括：沿列方向延伸且沿行方向排列的多个第一叉指电极；The acoustic wave excitation structure includes: a plurality of first interdigital electrodes extending in a column direction and arranged in a row direction;
    在行方向相邻的两个第一叉指电极之间具有所述多个目标区域中的至少一个。At least one of the plurality of target regions is provided between two adjacent first interdigital electrodes in the row direction.
  3. 如权利要求1或2所述的母板，其中，所述多个目标区域中在行方向上相邻的两个凹槽之间的距离L 1满足以下关系： 3. The motherboard of claim 1 or 2, wherein the distance L 1 between two adjacent grooves in the row direction in the plurality of target regions satisfies the following relationship:
    L 1＝m*(a 1+b 1)； L 1 =m*(a 1 +b 1 );
    其中，a 1为所述第一叉指电极的叉指宽度，b 1为所述第一叉指电极的指间距，m为大于零的整数。 Wherein, a 1 is the interdigital width of the first interdigital electrode, b 1 is the interdigital distance of the first interdigital electrode, and m is an integer greater than zero.
  4. 如权利要求1-3任一项所述的母板，其中，所述多个目标区域呈阵列排布；3. The motherboard of any one of claims 1-3, wherein the multiple target areas are arranged in an array;
    所述声波激励结构包括：沿列方向延伸且沿行方向排列的多个第一叉指电极，以及沿行方向延伸且沿列方向排列的多个第二叉指电极；The acoustic wave excitation structure includes: a plurality of first interdigital electrodes extending in a column direction and arranged in a row direction, and a plurality of second interdigital electrodes extending in a row direction and arranged in a column direction;
    其中，在行方向相邻的两个第一叉指电极之间具有至少一个所述目标区 域，以及在列方向相邻的两个第二叉指电极之间具有至少一个所述目标区域。Wherein, there is at least one target area between two adjacent first interdigital electrodes in the row direction, and at least one said target area between two adjacent second interdigital electrodes in the column direction.
  5. 如权利要求4所述的母板，其中，所述第一叉指电极包括：沿列方向延伸且沿列方向排列的至少两个第一子叉指电极；和/或，8. The motherboard of claim 4, wherein the first interdigital electrode comprises: at least two first sub-interdigital electrodes extending in the column direction and arranged in the column direction; and/or,
    所述第二叉指电极包括：沿行方向延伸且沿行方向排列的至少两个第二子叉指电极。The second interdigital electrode includes: at least two second sub-interdigital electrodes extending in the row direction and arranged in the row direction.
  6. 如权利要求4或5所述的母板，其中，每个目标区域中在行方向上相邻的两个凹槽之间的距离L 1，以及列方向上相邻的两个凹槽之间的距离L 2满足以下关系： The motherboard according to claim 4 or 5, wherein the distance L 1 between two adjacent grooves in the row direction in each target area, and the distance between two adjacent grooves in the column direction The distance L 2 satisfies the following relationship:
    L 1＝m*(a 1+b 1)；L 2＝n*(a 2+b 2)； L 1 =m*(a 1 +b 1 ); L 2 =n*(a 2 +b 2 );
    其中，a 1为所述第一叉指电极的叉指宽度，b 1为所述第一叉指电极的指间距；a 2为所述第二叉指电极的叉指宽度，以及b 2为所述第二叉指电极的指间距，m和n为大于零的整数。 Where a 1 is the interdigital width of the first interdigital electrode, b 1 is the interdigital distance of the first interdigital electrode; a 2 is the interdigital width of the second interdigital electrode, and b 2 is For the finger spacing of the second interdigital electrode, m and n are integers greater than zero.
  7. 如权利要求1～6任一项所述的母板，其中，所述第一磁性结构位于所述驱动电极背离衬底基板的一侧；以及8. The motherboard of any one of claims 1 to 6, wherein the first magnetic structure is located on a side of the driving electrode away from the base substrate; and
    所述第一磁性结构在所述衬底基板上的正投影位于同一所述凹槽内的所述驱动电极在所述衬底基板上的正投影的范围内。The orthographic projection of the first magnetic structure on the base substrate is located within the range of the orthographic projection of the drive electrodes in the same groove on the base substrate.
  8. 如权利要求1～6任一项所述的母板，还包括：位于所述凹槽内的微发光二极管；8. The motherboard according to any one of claims 1 to 6, further comprising: a micro light emitting diode located in the groove;
    所述微发光二极管包括：位于同一侧的第一引出电极和与所述第一磁性结构磁性相反的第二磁性结构，以及位于另一侧的与所述第一引出电极相对设置的第二引出电极；The micro-light emitting diode includes: a first extraction electrode on the same side and a second magnetic structure opposite to the first magnetic structure, and a second extraction electrode on the other side opposite to the first extraction electrode. electrode;
    其中，所述微发光二极管的所述第一引出电极与位于同一个所述凹槽内的所述驱动电极电连接。Wherein, the first lead electrode of the micro light emitting diode is electrically connected to the driving electrode located in the same groove.
  9. 一种显示面板，包括：衬底基板，位于所述衬底基板上的绝缘层，以及位于所述绝缘层远离所述衬底基板一侧的压电薄膜；A display panel includes: a base substrate, an insulating layer on the base substrate, and a piezoelectric film on the side of the insulating layer away from the base substrate;
    其中，所述绝缘层远离所述衬底基板的一侧具有多个凹槽；每一个所述凹槽内具有驱动电极和第一磁性结构，以及位于所述第一磁性结构远离衬底基板一侧的微发光二极管；Wherein, the insulating layer has a plurality of grooves on one side away from the base substrate; each of the grooves has a driving electrode and a first magnetic structure, and is located one side away from the base substrate. Micro LED on the side;
    所述微发光二极管包括：位于同一侧的第一引出电极和与所述第一磁性结构磁性相反的第二磁性结构，以及位于另一侧的与所述第一引出电极相对设置的第二引出电极；The micro-light emitting diode includes: a first extraction electrode on the same side and a second magnetic structure opposite to the first magnetic structure, and a second extraction electrode on the other side opposite to the first extraction electrode. electrode;
    其中，所述微发光二极管的所述第一引出电极位于同一个所述凹槽内的所述驱动电极电连接。Wherein, the first lead-out electrode of the micro light-emitting diode is electrically connected to the driving electrode in the same groove.
  10. 如权利要求9所述的显示面板，其中，所述微发光二极管的所述第一引出电极与所述驱动电极通过接触材料绑定连接。9. The display panel of claim 9, wherein the first lead-out electrode of the micro light-emitting diode and the driving electrode are bonded and connected by a contact material.
  11. 一种显示面板的制作方法，包括：A manufacturing method of a display panel includes:
    提供悬浮有多个微发光二极管的悬浮液；每个所述微发光二极管包括：分别位于两侧的两个引出电极，以及位于一侧的且与第一磁性结构磁性相反的第二磁性结构；Providing a suspension in which a plurality of micro-light-emitting diodes are suspended; each of the micro-light-emitting diodes includes: two extraction electrodes on two sides, and a second magnetic structure on one side that is magnetically opposite to the first magnetic structure;
    将权利要求1～7任一项所述的母板浸泡在所述悬浮液中；Immersing the mother board according to any one of claims 1 to 7 in the suspension;
    向所述声波激励结构施加驱动信号以产生表面声波，以使多个所述微发光二极管分别落入到所述多个目标区域中的多个凹槽内；Applying a driving signal to the acoustic wave excitation structure to generate a surface acoustic wave, so that the plurality of micro light-emitting diodes respectively fall into the plurality of grooves in the plurality of target regions;
    对每个凹槽内的所述微发光二极管进行固定；以及Fixing the micro light emitting diode in each groove; and
    对所述母板进行切割，以得到多个显示面板。The motherboard is cut to obtain multiple display panels.
  12. 如权利要求11所述的制作方法，还包括：将所述母板浸泡在所述悬浮液中之前，11. The manufacturing method of claim 11, further comprising: before immersing the mother board in the suspension,
    在所述母板中的每个凹槽内形成用于绑定工艺的接触材料；以及Forming a contact material for the bonding process in each groove in the motherboard; and
    采用加热的方式将各所述微发光二极管与对应的凹槽内的驱动电极进行绑定。The micro light-emitting diodes are bound to the driving electrodes in the corresponding grooves by heating.
  13. 根据权利要求12所述的方法，还包括：向所述声波激励结构施加驱动信号以产生表面声波，使所述微发光二极管在表面声波的控制下移动到表 面声波的波节位置处，其中，所述母板上的所述多个凹槽分别位于各波节的位置，并且在所述第一磁性结构和所述第二磁性结构之间的磁性引力的作用下，使所述微发光二极管的第一引出电极的一侧朝向所述衬底基板落入到所述凹槽中。The method according to claim 12, further comprising: applying a driving signal to the acoustic wave excitation structure to generate a surface acoustic wave, so that the micro light-emitting diode moves to a node position of the surface acoustic wave under the control of the surface acoustic wave, wherein, The plurality of grooves on the motherboard are respectively located at the positions of each node, and under the action of the magnetic attraction between the first magnetic structure and the second magnetic structure, the micro light emitting diode One side of the first extraction electrode faces the base substrate and falls into the groove.
  14. 根据权利要求13所述的方法，还包括：将所述母板置于密闭空间，通入氮气，使所述密闭空间的气压至少保持3个标准大气压以上。The method according to claim 13, further comprising: placing the mother board in a confined space and venting nitrogen gas so that the air pressure in the confined space is maintained at least 3 standard atmospheres.
  15. 根据权利要求10-14任一项所述的方法，所述悬浮液包括超纯水，以及其中悬浮的所述多个微发光二极管。The method according to any one of claims 10-14, the suspension comprises ultrapure water, and the plurality of micro light emitting diodes suspended therein.
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