WO2020258878A1 - 显示面板、显示装置及显示面板的制备方法 - Google Patents

显示面板、显示装置及显示面板的制备方法 Download PDF

Info

Publication number
WO2020258878A1
WO2020258878A1 PCT/CN2020/072967 CN2020072967W WO2020258878A1 WO 2020258878 A1 WO2020258878 A1 WO 2020258878A1 CN 2020072967 W CN2020072967 W CN 2020072967W WO 2020258878 A1 WO2020258878 A1 WO 2020258878A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
display panel
emitting diode
layer
encapsulation
Prior art date
Application number
PCT/CN2020/072967
Other languages
English (en)
French (fr)
Inventor
郭恩卿
王程功
李之升
Original Assignee
成都辰显光电有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 成都辰显光电有限公司 filed Critical 成都辰显光电有限公司
Priority to KR1020217038599A priority Critical patent/KR102553837B1/ko
Publication of WO2020258878A1 publication Critical patent/WO2020258878A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Definitions

  • This application relates to the field of display technology, and in particular to a display panel, a display device, and a manufacturing method of the display panel.
  • Micro-Light Emitting Diode (Micro-LED) display technology uses a high-density integrated micro-light-emitting diode array as pixels on the backplane to realize light-emitting display.
  • Micro-LED technology has gradually become a research hot spot, and the industry is looking forward to high-quality Micro-LED products entering the market.
  • High-quality Micro-LED display products are expected to become very promising display solutions following the existing market such as Liquid Crystal Display (LCD) and Organic Light-Emitting Diode (OLED) displays.
  • LCD Liquid Crystal Display
  • OLED Organic Light-Emitting Diode
  • the embodiment of the present application provides a display panel, a display device, and a manufacturing method of the display panel.
  • the encapsulation layer in the display panel can uniformly distribute the light emitted by the light-emitting diode, thereby increasing the light-emitting area, reducing the screen window effect, and improving the screen display effect.
  • the first aspect of the present application provides a display panel, including:
  • the light emitting diode array layer is located on the driving backplane, and the light emitting diode array layer includes a plurality of light emitting diodes;
  • a retaining wall is located between adjacent light-emitting diodes, the retaining wall defines a plurality of accommodating parts, and the accommodating parts are used to accommodate the light-emitting diodes;
  • the packaging layer is arranged on the side of the light emitting diode array layer away from the driving backplane, the packaging layer includes a plurality of packaging units, each packaging unit is isolated by a black matrix, and the packaging unit is arranged corresponding to the light emitting diode;
  • At least one packaging unit is distributed with astigmatism particles.
  • an embodiment of the present application provides a display device, including the display panel of any one of the foregoing embodiments in the first aspect of the present application.
  • an embodiment of the present application provides a method for manufacturing a display panel, including:
  • the light-emitting diode array includes a plurality of light-emitting diodes, and a barrier wall is arranged between adjacent light-emitting diodes;
  • a light-transmitting substrate is provided, a patterned black matrix is formed on the light-transmitting substrate, the mixed glue of astigmatizing particles and light-transmitting adhesive is placed in the channel formed by the black matrix, and the mixed liquid is cured to form a plurality of packages Encapsulation layer of the unit;
  • the encapsulation layer and the light-emitting diode array are aligned and bonded in a manner that the encapsulation unit and the light-emitting diode correspond up and down.
  • the display panel provided by the embodiment of the present application after the light emitted by the light-emitting diode reaches the encapsulation layer, the original path of the light is disrupted by the astigmatic particles in the encapsulation layer, and the encapsulation layer makes the light emitted by the light-emitting diode evenly distributed, thereby increasing the light output Area, reduce the screen window effect, improve the screen display effect.
  • the display panel provided by the embodiment of the present application there is no need to add additional components to the display panel, only astigmatism particles are mixed in the encapsulation layer of the display panel, which can reduce the screen window effect in a simple and easy-to-operate process. effect.
  • FIG. 1 is a schematic structural diagram of a display panel provided by an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a display panel provided by another embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a display panel provided by another embodiment of the present application.
  • FIG. 4 is a schematic flowchart of a method for manufacturing a display panel provided by an embodiment of the present application.
  • a layer or an area when referred to as being “on” or “above” another layer or another area, it can mean that it is directly on the other layer or area, or is in contact with it. There are other layers or regions between another layer and another area. Moreover, if the component is turned over, the layer or area will be “below” or “below” the other layer or area.
  • FIG. 1 is a schematic structural diagram of a display panel according to an embodiment of the present application.
  • the display panel provided by the embodiment of the present application includes a driving backplane 10; a light emitting diode array layer on the driving backplane 10; the light emitting diode array layer includes a plurality of light emitting diodes 20; Between the light-emitting diodes 20, the barrier wall 30 defines a plurality of accommodating portions for accommodating the light-emitting diodes 20; an encapsulation layer 40 disposed on the side of the LED array layer away from the driving backplane 10, the encapsulation layer 40 includes There are a plurality of packaging units 41. Each packaging unit 41 is isolated by a black matrix 50, and the packaging unit 41 is arranged corresponding to the light emitting diode 20, wherein at least one packaging unit 41 is distributed with astigmatizing particles 44.
  • the display panel provided by the embodiment of the present application after the light emitted by the light-emitting diode reaches the encapsulation layer, the original path of the light is disrupted by the astigmatic particles in the encapsulation layer, and the light from the encapsulation layer changes from a point-like distribution to a planar distribution. Thereby increasing the light output area, greatly reducing the screen window effect, and improving the picture display effect. Further, according to the display panel provided by the embodiment of the present application, no additional components are required to be added to the display panel, only astigmatism particles are mixed in the encapsulation layer of the display panel, and the screen window effect can be reduced in a simple and easy-to-operate process. Effect.
  • the packaging layer 40 includes a transparent packaging material.
  • the light scattering particles 44 are uniformly distributed in the transparent packaging material.
  • the encapsulation layer 40 uses a transparent encapsulation material as a matrix, and evenly distributes the astigmatism particles 44 in the matrix.
  • the transparent packaging material is a translucent adhesive.
  • the transparent packaging material includes one or more of epoxy resin, polycarbonate, polymethyl methacrylate, and silicone.
  • the light emitting diode array layer includes a plurality of red light emitting diodes 201, a plurality of green light emitting diodes 202, and a plurality of blue light emitting diodes 203, which constitute sub-pixels of different colors of the display panel.
  • the packaging layer 40 has multiple red packaging units 411, multiple green packaging units 412, and multiple blue light emitting diodes 201, multiple green light emitting diodes 202, and multiple blue light emitting diodes 203, respectively. Through the packaging unit 413.
  • the encapsulation layer 40 includes a plurality of red encapsulation units 411, a plurality of green encapsulation units 412, and a plurality of blue light-transmitting encapsulation units 413 are based on a transparent encapsulation material, and the scattering particles 44 are uniformly distributed in the substrate.
  • the transparent packaging material is a translucent adhesive.
  • the transparent packaging material includes one or more of epoxy resin, polycarbonate, polymethyl methacrylate, and silicone.
  • the light emitting diode array layer includes a plurality of red light emitting diodes 201, a plurality of green light emitting diodes 202, and a plurality of blue light emitting diodes 203, which constitute sub-pixels of different colors of the display panel.
  • the packaging layer 40 has multiple red packaging units 411, multiple green packaging units 412, and multiple blue light emitting diodes 201, multiple green light emitting diodes 202, and multiple blue light emitting diodes 203, respectively.
  • the red packaging unit 411 further includes a red filter material
  • the green packaging unit 412 further includes a green filter material.
  • the multiple red packaging units 411, the multiple green packaging units 412, and the multiple blue light transmitting packaging units 413 in the packaging layer 40 may correspond to multiple red light emitting diodes 201 and multiple green light emitting diodes, respectively. 202 and a plurality of blue light emitting diodes 203, for example, one red package unit 411 corresponds to two red light emitting diodes 201. This correspondence relationship can be adjusted according to actual conditions, and is not limited here.
  • the red filter material has a high transmittance to red light and can absorb green and blue light; the green filter material has a high transmittance to green light and can absorb red and blue light.
  • the blue light transmission package unit does not contain filter materials to prevent the display panel from appearing blue.
  • the encapsulation layer containing the filter material can reduce cross-color, thereby improving the color gamut of the display panel and reducing the screen window effect.
  • the red filter material and the light scattering particles 44 of the red packaging unit 411 are mixed and arranged.
  • the red filter material and the light scattering particles 44 are mixed and cured to form the red packaging unit 411.
  • the red filter material and light scattering particles 44 of the red packaging unit 411 are arranged in layers in the thickness direction of the packaging layer 40.
  • the red packaging unit 411 includes two layers in the thickness direction of the packaging layer 40, and the red filter material is located in In the first layer, the scattering particles 44 are located in the second layer above the first layer.
  • the red packaging unit 411 includes multiple layers in the thickness direction of the packaging layer, and the red filter material and the light scattering particles 44 are stacked in the thickness direction of the packaging layer 40.
  • a layer of red filter material a layer of scattering particles, a layer of red filter material, and so on.
  • the light scattering particles can be mixed with the packaging material to form a layer
  • the red filter material can be a red filter film layer.
  • the green filter material and the light scattering particles 44 of the green packaging unit 412 are mixed and arranged.
  • the green filter material and the light scattering particles 44 are mixed and cured to form the green packaging unit 412.
  • the green filter material and light scattering particles 44 of the green packaging unit 412 are arranged in layers in the thickness direction of the packaging layer.
  • the green packaging unit 411 includes two layers in the thickness direction of the packaging layer 40, and the green filter material is located in the first layer.
  • the layer and scattering particles 44 are located in a second layer above the first layer.
  • the green packaging unit 412 includes multiple layers in the thickness direction of the packaging layer 40, and the green filter material and light scattering particles are stacked in the thickness direction of the packaging layer 40.
  • a layer of green filter material a layer of scattering particles, a layer of green filter material, and so on.
  • the light-scattering particles can be mixed with the light-transmitting adhesive to form a layer
  • the green filter material can be a green filter film.
  • cross-color can be reduced, thereby increasing the color gamut of the display panel and reducing the screen window effect.
  • the light emitting diode array layer only includes a plurality of blue light emitting diodes.
  • the encapsulation layer 40 has a plurality of red encapsulation units 411, a plurality of green encapsulation units 412, and a plurality of blue light-transmitting encapsulation units 413 corresponding to the plurality of blue light emitting diodes.
  • the red packaging unit 411 further includes a red light conversion material
  • the green packaging unit 412 further includes a green light conversion material
  • the blue light transmission packaging unit 413 does not include a light conversion material.
  • Multiple red packaging units 411, multiple green packaging units 412, and multiple blue light transmitting packaging units 413 constitute sub-pixels of different colors of the display panel.
  • the light conversion material converts the blue light emitted by the blue light emitting diode into light of the target color to achieve Color display of the display panel.
  • the light emitting diode array layer includes only a plurality of blue light emitting diodes, or only a plurality of ultraviolet light emitting diodes, or includes a plurality of blue light emitting diodes and a plurality of ultraviolet light emitting diodes.
  • a light conversion layer may be provided between the light emitting diode array layer and at least part of the packaging unit.
  • the light conversion layer is formed of light conversion materials, such as quantum dots or phosphors. The light conversion material can convert the light emitted by the light-emitting diode into the light of the target color, so as to realize the color display.
  • This application does not limit the arrangement of the light emitting diodes.
  • one red light-emitting diode 201, one green light-emitting diode 202, and one blue light-emitting diode 203 can be used as repeating units, and multiple repeating units are repeatedly arranged on the driving backplane 10 in a predetermined pattern to form light Diode array.
  • the repeating unit may also include other combinations, so that the display panel has a higher resolution.
  • Each package unit corresponds to at least one light emitting diode.
  • the packaging unit and the light emitting diode are arranged in one-to-one correspondence.
  • the number of light emitting diodes corresponding to each packaging unit is the same. This application does not limit the specific number of light emitting diodes corresponding to the packaging unit.
  • multiple light-emitting diodes are arranged in a positive matrix, and the number of rows and columns of the light-emitting diodes can be specifically set according to actual conditions.
  • the multiple packaging units of the packaging layer are also arranged in a positive matrix.
  • FIG. 3 is a schematic structural diagram of a display panel provided by another embodiment of the present application.
  • the display panel further includes a first reflective layer 60 located on the side of the light emitting diode 20 away from the driving backplane 10, and the first reflective layer 60 is used to reflect the light emitted by the light emitting diode 20.
  • the first reflective layer 60 may be provided on the side of at least part of the light emitting diode 20 away from the driving backplane 10.
  • the first reflective layer 60 may be a structure with a horizontal surface, or a structure with a curved surface, which is not limited in the present application.
  • a first reflective layer is provided on the upper surface of the light-emitting diode to reflect the light emitted upward from the light-emitting diode so that the light is emitted from the side of the light-emitting diode, avoiding the light from perpendicularly entering the packaging layer, and helping the packaging layer to further evenly distribute light.
  • the area of the first reflective layer 60 is not less than the area of the side of the light emitting diode 20 away from the driving backplane 10. 3, when the area of the first reflective layer 60 is larger than the area of the side of the light emitting diode 20 away from the driving backplane 10, the display panel may further include a transparent support layer 70, located around the light emitting diode 20, for supporting and extending to emit light. The first reflective layer 60 outside the diode 20.
  • the transparent support layer 70 can directly transmit the light emitted by the light emitting diode 20, and the transparent support layer 70 supports the first reflective layer 60 extending beyond the light emitting diode 20 to prevent the first reflective layer 60 from falling off when the display panel is shaken vigorously , Which is beneficial to the stable operation of the light emitting diode 20.
  • the surface of the transparent support layer 70 away from the driving backplane 10 is a roughened surface, and/or the surface of the packaging layer 40 close to the light-emitting diode array layer is a roughened surface.
  • a roughened surface can be understood as a rough surface, and the surface can be treated by mechanical or chemical methods to obtain a microscopic rough structure on the surface to form a roughened surface, which is not limited in this application.
  • a roughened surface is provided, which further disrupts the original path of the light and can further uniformize the light distribution.
  • At least part of the light-emitting diode 20 is a light-emitting diode 20 with a vertical structure.
  • the N electrode and the P electrode of the light emitting diode 20 with a vertical structure are respectively located on both sides of the light emitting layer of the light emitting diode 20.
  • the first reflective layer 60 may be an N electrode or a P electrode of the light emitting diode 20 with a vertical structure.
  • the N electrode or the P electrode of the vertical structure of the light-emitting diode 20 can be set to reflect the light emitted by the light-emitting diode 20, which simplifies the process, and also achieves that the light emitted by the light-emitting diode 20 can be removed from the light-emitting diode 20. It emits from the side to avoid perpendicular incidence of light to the encapsulation layer 40, which is beneficial to the effect of the encapsulation layer 40 to further evenly distribute the light.
  • the N electrode or P electrode of the vertical structure of the light emitting diode 20 covers the entire surface thereof, and the contact area is large, which is beneficial to reduce the voltage of the light emitting diode 20 and improve the efficiency of the light emitting diode 20.
  • the retaining wall 30 defines a plurality of accommodating parts, and the cross-section of the accommodating parts perpendicular to the driving back plate 10 is in an inverted trapezoidal structure.
  • the depth of the receiving part may be higher than the thickness of the light emitting diode 20.
  • the side wall of the retaining wall 30 has a second reflective layer 31 at least on a part of the surface facing the receiving portion.
  • the material of the retaining wall 40 may be photoresist, such as SU-8.
  • the second reflective layer 31 on the sidewall of the retaining wall 40 may be formed of metal, for example, Al, Ag, etc.
  • a barrier wall 30 is provided between adjacent light emitting diodes 20 to prevent crosstalk of light emitted by the light emitting diodes 20.
  • a second reflective layer 31 is provided on the side wall of the retaining wall 30 to improve the light reflection of the light emitting diode 20, so that the light emitted by the light emitting diode 20 can finally reach the upper encapsulation layer 40, thereby improving the light utilization rate.
  • a third reflective layer 51 is formed on at least part of the surface of the black matrix 50 facing the packaging unit.
  • the black matrix 50 can prevent the light crosstalk of each package unit, and the third reflective layer 51 can further disrupt the original path of light, and further improve the uniformity of light distribution.
  • the bottom area of the receiving portion defined by the barrier wall 30 is larger than the area occupied by the light-emitting diodes
  • the display panel further includes a fourth reflective layer 32 located between the light-emitting diode 20 and the barrier wall 30, and the fourth reflective layer 32 is located on the drive backplane 10.
  • the fourth reflective layer 32 is used to reflect the light reaching the upper surface of the driving back plate 10, which can improve the light utilization.
  • the display panel also includes a transparent substrate 80 on the packaging layer 40.
  • the light-transmitting substrate 80 covers the packaging layer 40 and the black matrix 50.
  • the driving backplane 10 includes a driving circuit, which is used to drive the corresponding light emitting diode to emit light.
  • the light emitting diode may be a Micro-LED.
  • Micro-LED has the advantages of low power consumption, high brightness, long life, fast response time, etc., so that the display panel with Micro-LED has good display performance.
  • the driving circuit includes at least a thin film transistor, and the Micro-LED is electrically connected to the thin film transistor.
  • the embodiment of the present application also provides a display device, including the above-mentioned display panel.
  • the display device can be applied to virtual reality equipment, mobile phones, tablet computers, televisions, displays, notebook computers, digital photo frames, navigators, wearable watches, Any product or component with display function such as IoT node. Since the principle of solving the problems of the display device is similar to that of the above-mentioned display panel, the implementation of the display device can refer to the implementation of the above-mentioned display panel, and the repetition will not be repeated.
  • FIG. 4 is a schematic flowchart of a method for manufacturing a display panel provided by an embodiment of the present application. As shown in FIG. 4, the manufacturing method of the display panel of the embodiment of the present application includes the following steps:
  • the manufacturing method of the display panel provided by the embodiment of the present application, after the light emitted by the light emitting diode 20 reaches the encapsulation layer 40, the original path of the light is disrupted by the astigmatism particles 44 in the encapsulation layer 40, and the light exiting from the encapsulation layer 40 passes through the dots.
  • the shape distribution is transformed into a planar distribution, thereby increasing the light emitting area, greatly reducing the screen window effect and improving the picture display effect.
  • there is no need to add an additional mechanism to the display panel only the astigmatic particles 44 are mixed into the encapsulation layer 40 of the display panel, and the effect of reducing the screen window effect can be achieved by a simple and easy-to-operate process.
  • the order of forming the array of light-emitting diodes 20 and the barrier wall 30 is not limited.
  • the method of implantation in S20 can be printing or spin coating.
  • adhesives can be used for bonding.
  • S10 also includes forming a first reflective layer 60 on the side of the light-emitting diode 20 away from the driving backplane 10; and making the accommodating part formed by the barrier wall 30 a cross-section perpendicular to the driving backplane 10 to have an inverted trapezoidal structure.
  • a second reflective layer 31 is formed on at least part of the surface of the retaining wall 30 facing the receiving portion;
  • a transparent support layer 70 is formed around the light emitting diode 20 to support the first reflective layer 60 extending beyond the light emitting diode 20;
  • a fourth reflective layer 32 is formed on the back plate 10, and the fourth reflective layer 32 is located between the light emitting diode 20 and the retaining wall 30.
  • S20 also includes forming a third reflective layer 51 on at least part of the surface of the black matrix 50 facing the packaging unit 41.
  • At least part of the encapsulation unit 41 is provided with a filter material, and the red filter material and the astigmatic particles can be mixed and arranged into a layer to form the red encapsulation unit 411, or the red filter material and the astigmatism particles can be layered in the thickness direction of the encapsulation layer Set to form a red light package unit 411.
  • the green filter material and the light scattering particles may be mixed and arranged into one layer to form the green light encapsulation unit 412, or the green light filter material and the light scattering particles may be layered in the thickness direction of the encapsulation layer 40 to form the green light encapsulation unit 412.
  • the packaging unit 41 is provided with a light conversion material, or at least part of the packaging unit 41 is provided with a light conversion layer between the light emitting diode.
  • light-emitting diodes 20 with a vertical structure can be selected to form an array of light-emitting diodes 20.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)

Abstract

本申请公开了一种显示面板、显示装置及显示面板的制备方法。该显示面板包括：驱动背板；发光二极管阵列层，位于驱动背板上，发光二极管阵列层包括多个发光二极管；挡墙，位于相邻的发光二极管之间，挡墙限定出多个容纳部，容纳部用于容纳发光二极管；封装层，设置于发光二极管阵列层远离驱动背板的一侧，封装层包括多个封装单元，各封装单元通过黑矩阵隔离，封装单元与发光二极管对应设置；其中，至少一个封装单元中分布有散光粒子。根据本申请实施例的显示面板，能够降低纱窗效应，提高画面显示效果。

Description

显示面板、显示装置及显示面板的制备方法
相关申请的交叉引用
本申请要求享有于2019年06月28日提交的名称为“显示面板、显示装置及显示面板的制备方法”的中国专利申请第201910580227.0号的优先权，该申请的全部内容通过引用并入本文中。
技术领域
本申请涉及显示技术领域，尤其涉及显示面板、显示装置及显示面板的制备方法。
背景技术
微发光二极管(Micro-Light Emitting Diode，Micro-LED)显示技术在背板上以高密度集成的微小发光二极管阵列为像素实现发光显示。目前，Micro-LED技术逐渐成为研究热门，工业界期待有高品质的Micro-LED产品进入市场。高品质Micro-LED显示产品可望成为继市场上已有的诸如液晶显示器(Liquid Crystal Display，LCD)、有机发光二极管(Organic Light-Emitting Diode，OLED)显示器等之后非常有希望的显示解决方案。
Micro-LED应用于大尺寸显示面板时，会导致像素的实际点亮面积与非点亮面积之间的比例降低，使导致用户容易感知像素之间的不亮空间，从而使显示面板存在明显的纱窗效应，影响显示面板的显示效果。
发明内容
本申请实施例提供一种显示面板、显示装置及显示面板的制备方法。其中，显示面板中的封装层能够使发光二极管发出的光均匀化分布，从而增大出光面积，降低纱窗效应，提高画面显示效果。
本申请的第一方面提供了一种显示面板，包括：
驱动背板；
发光二极管阵列层，位于驱动背板上，发光二极管阵列层包括多个发光二极管；
挡墙，位于相邻的发光二极管之间，挡墙限定出多个容纳部，容纳部用于容纳发光二极管；
封装层，设置于发光二极管阵列层远离驱动背板的一侧，封装层包括多个封装单元，各封装单元通过黑矩阵隔离，封装单元与发光二极管对应设置；
其中，至少一个封装单元中分布有散光粒子。
第二方面，本申请实施例提供了一种显示装置，包括本申请第一方面前述任一实施方式的显示面板。
第三方面，本申请实施例提供了一种显示面板的制备方法，包括：
提供绑定有发光二极管阵列的驱动背板，发光二极管阵列包括多个发光二极管，相邻的发光二极管之间设置有挡墙；
提供一透光基板，在透光基板上形成图形化的黑矩阵，将散光粒子和透光胶黏剂的混合胶液置入黑矩阵形成的通道内，并固化混合液，形成具有多个封装单元的封装层；
将封装层与发光二极管阵列按照封装单元与发光二极管上下对应的方式进行对位贴合。
根据本申请实施例提供的显示面板，发光二极管出射的光到达封装层后，光的原始路径被封装层中的散光粒子打乱，封装层使发光二极管发出的光均匀化分布，从而增大出光面积，降低纱窗效应，提高画面显示效果。且，根据本申请实施例提供的显示面板，不需要对显示面板增加额外的组件，只需在显示面板的封装层中混合入散光粒子，能够以一种简单易操作的工艺实现降低纱窗效应的效果。
附图说明
图1是本申请一个实施例提供的显示面板的结构示意图；
图2是本申请另一个实施例提供的显示面板的结构示意图；
图3是本申请再一个实施例提供的显示面板的结构示意图；
图4是本申请实施例提供的显示面板的制备方法的流程示意图。
具体实施方式
下面将详细描述本申请的各个方面的特征和示例性实施例，为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及具体实施例，对本申请进行进一步详细描述。此处所描述的具体实施例意在解释本申请，而不是限定本申请。对于本领域技术人员来说，本申请可在不需要这些具体细节中的一些细节的情况下实施。下面对实施例的描述仅仅是为了通过示出本申请的示例来提供对本申请更好的理解。
在描述部件的结构时，当将一层、一个区域称为位于另一层、另一个区域“上面”或“上方”时，可以指直接位于另一层、另一个区域上面，或者在其与另一层、另一个区域之间还包含其它的层或区域。并且，如果将部件翻转，该一层、一个区域将位于另一层、另一个区域“下面”或“下方”。
下面将详细描述本申请的各个方面的特征和示例性实施例。此外，下文中所描述的特征、结构或特性可以以任何合适的方式结合在一个或更多实施例中。
图1是本申请一个实施例的显示面板的结构示意图。如图1所示，本申请实施例提供的显示面板包括驱动背板10；位于驱动背板10上的发光二极管阵列层，发光二极管阵列层包括多个发光二极管20；挡墙30，位于相邻的发光二极管20之间，挡墙30限定出多个容纳部，容纳部用于容纳发光二极管20；设置于发光二极管阵列层上远离驱动背板10的一侧的封装层40，封装层40包括多个封装单元41，各封装单元41通过黑矩阵50隔离，封装单元41与发光二极管20对应设置，其中，至少一个封装单元41中分布有散光粒子44。
根据本申请实施例提供的显示面板，发光二极管出射的光到达封装层后，光的原始路径被封装层中的散光粒子打乱，从封装层出来的光由点状 分布转变为面状分布，从而增大出光面积，大大降低纱窗效应，提高画面显示效果。进一步的，根据本申请实施例提供的显示面板，不需要对显示面板增加额外的组件，只需在显示面板的封装层中混合入散光粒子，能够以一种简单易操作的工艺实现降低纱窗效应的效果。
封装层40包括透明封装材料。散光粒子44均匀分布于透明封装材料中。例如，封装层40以透明封装材料为基体，将散光粒子44均匀分布于基体中。可选地，透明封装材料为透光胶黏剂。透明封装材料包括环氧树脂、聚碳酸酯、聚甲基丙烯酸甲酯、有机硅等的一种或多种。
发光二极管阵列层包括多个红光发光二极管201、多个绿光发光二极管202及多个蓝光发光二极管203，构成显示面板不同颜色的子像素。对应的，封装层40具有与多个红光发光二极管201、多个绿光发光二极管202及多个蓝光发光二极管203分别对应的多个红色封装单元411、多个绿色封装单元412及多个蓝光透过封装单元413。这里的封装层40包括的多个红色封装单元411、多个绿色封装单元412及多个蓝光透过封装单元413是以透明封装材料为基体，散光粒子44均匀分布于基体中。可选地，透明封装材料为透光胶黏剂。透明封装材料包括环氧树脂、聚碳酸酯、聚甲基丙烯酸甲酯、有机硅等的一种或多种。
如图2所示，发光二极管阵列层包括多个红光发光二极管201、多个绿光发光二极管202及多个蓝光发光二极管203，构成显示面板不同颜色的子像素。对应的，封装层40具有与多个红光发光二极管201、多个绿光发光二极管202及多个蓝光发光二极管203分别对应的多个红色封装单元411、多个绿色封装单元412及多个蓝光透过封装单元413。红色封装单元411还包括红色滤光材料，绿色封装单元412还包括绿色滤光材料。在一些实施例中，封装层40中的多个红色封装单元411、多个绿色封装单元412及多个蓝光透过封装单元413可以分别对应多个红光发光二极管201、多个绿光发光二极管202及多个蓝光发光二极管203，例如一个红色封装单元411对应两个红光发光二极管201，这种对应关系可以根据实际情况进行调整，在此不做限定。
红色滤光材料对红光有很高的透过率，且能够吸收绿光和蓝光；绿色 滤光材料对绿光有很高的透过率，且能够吸收红光和蓝光。蓝光透过封装单元不包含滤光材料，防止显示面板出现偏蓝的情况。含有滤光材料的封装层能够减小串色，从而提高显示面板的色域，降低纱窗效应。
红色封装单元411的红色滤光材料和散光粒子44混合设置，例如，将红色滤光材料和散光粒子44进行混合固化，形成红色封装单元411。或者，红色封装单元411的红色滤光材料和散光粒子44在封装层40的厚度方向上分层设置，例如，红色封装单元411在封装层40的厚度方向上包括两层，红色滤光材料位于第一层，散光粒子44位于第一层上方的第二层。又例如，红色封装单元411在封装层的厚度方向上包括多层，红色滤光材料和散光粒子44在封装层40的厚度方向上叠层设置。即一层红色滤光材料、一层散光粒子、一层红色滤光材料，依次类推。分层设置时，散光粒子可以和封装材料混合形成一层，红色滤光材料可以是红色滤光膜层。
绿色封装单元412的绿色滤光材料和散光粒子44混合设置，例如，将绿色滤光材料和散光粒子44进行混合固化，形成绿色封装单元412。或者，绿色封装单元412的绿色滤光材料和散光粒子44在封装层的厚度方向上分层设置，例如，绿色封装单元411在封装层40厚度方向上包括两层，绿色滤光材料位于第一层和散光粒子44位于第一层上方的第二层。又例如，绿色封装单元412在封装层40厚度方向上包括多层，绿色滤光材料和散光粒子在封装层40厚度方向上叠层设置。即一层绿色滤光材料、一层散光粒子、一层绿色滤光材料，依次类推。分层设置时，散光粒子可以和透光胶黏剂混合形成一层，绿色滤光材料可以是绿色滤光膜层。
红色封装单元及绿色封装单元的红色滤光材料和散光粒子无论是混合设置还是分层设置，均能够减小串色，从而提高显示面板的色域，降低纱窗效应。
发光二极管阵列层仅包括多个蓝光发光二极管。对应的，封装层40具有与多个蓝光发光二极管对应的多个红色封装单元411、多个绿色封装单元412及多个蓝光透过封装单元413。红色封装单元411还包括红色光转换材料，绿色封装单元412还包括绿色光转换材料，蓝光透过封装单元413不包括光转换材料。多个红色封装单元411、多个绿色封装单元412及多 个蓝光透过封装单元413构成显示面板不同颜色的子像素，光转换材料将蓝光发光二极管出射的蓝光转换为目标颜色的光，以实现显示面板的彩色化显示。
发光二极管阵列层仅包括多个蓝光发光二极管，或者仅包括多个紫外光发光二极管，或者包括多个蓝光发光二极管和多个紫外光发光二极管。可以在发光二极管阵列层和至少部分封装单元之间设置光转换层。光转换层由光转换材料形成，例如量子点或者荧光粉等。光转换材料能够将发光二极管出射的光转化成目标颜色的光，以实现彩色化显示。
本申请对于发光二极管的排列方式不做限定。例如，针对三基色发光二极管，可以将一个红光发光二极管201、一个绿光发光二极管202及一个蓝光发光二极管203作为重复单元，多个重复单元以预定规律在驱动背板10上重复排列形成发光二极管阵列。重复单元也可以包括其他组合方式，以使显示面板具有较高的分辨率。
每个封装单元至少对应一个发光二极管。例如，封装单元与发光二极管一一对应设置。较佳地，每个封装单元对应的发光二极管的数量相同。本申请对封装单元对应的发光二极管的具体数量不作限定。另外，多个发光二极管呈正矩阵排列，发光二极管的行数和列数可以根据实际情况具体设定。对应的，封装层的多个封装单元也呈正矩阵排列。
图3是本申请再一个实施例提供的显示面板的结构示意图。如图3所示，显示面板还包括第一反射层60，位于发光二极管20远离驱动背板10的一面，第一反射层60用于反射发光二极管20出射的光。可以是在至少部分发光二极管20远离驱动背板10的一面上设置第一反射层60。
第一反射层60可以是表面为水平面的结构，也可以是表面为曲面的结构，本申请对此不作限定。
在发光二极管的上表面设置第一反射层，将发光二极管向上出射的光反射，使光从发光二极管的侧面出射，避免光垂直入射至封装层，有利于封装层将光进一步的均匀分布。
第一反射层60的面积不小于发光二极管20远离驱动背板10的一面的面积。继续参考图3，第一反射层60的面积大于发光二极管20远离驱动背 板10的一面的面积时，显示面板还可以包括透明支撑层70，位于发光二极管20的周围，用于支撑延伸到发光二极管20之外的第一反射层60。
透明支撑层70可以直接透过发光二极管20出射的光，且由透明支撑层70来支撑延伸到发光二极管20之外的第一反射层60，防止显示面板被大力晃动时第一反射层60脱落，有利于发光二极管20的稳定工作。
透明支撑层70的远离驱动背板10的一面为粗化表面，和/或，封装层40靠近发光二极管阵列层的一面为粗化表面。粗化表面可以理解为表面是粗糙的，可以用机械方法或化学方法对表面进行处理，从而在表面得到一种微观粗糙的结构，以形成粗化表面，本申请对此不作限定。
在发光二极管出射的光所经过的路程中，设置粗化表面，进一步打乱了光的原始路径，能够进一步使光均匀化分布。
至少部分发光二极管20为垂直结构的发光二极管20。垂直结构的发光二极管20的N电极及P电极分别位于发光二极管20的发光层的两侧。第一反射层60可以为垂直结构的发光二极管20的N电极或者P电极。如此，只需将垂直结构的发光二极管20的N电极或P电极设置成能够反射发光二极管20出射的光即可，简化了工艺，且同样达到了使发光二极管20出射的光从发光二极管20的侧面出射，避免光垂直入射至封装层40，有利于封装层40将光进一步的均匀分布的效果。且垂直结构的发光二极管20的N电极或P电极覆盖了其整个表面，接触面积大，有利于降低发光二极管20的电压，提高发光二极管20的效率。
继续参考图3，挡墙30限定出多个容纳部，容纳部的垂直于驱动背板10的截面呈倒梯形结构。容纳部的深度可以高于发光二极管20的厚度。挡墙30的侧壁至少在朝向容纳部的部分表面上具有第二反射层31。其中，挡墙40的材料可以为光刻胶，例如SU-8。挡墙40的侧壁上的第二反射层31可以由金属形成，例如，Al、Ag等。
在相邻的发光二极管20之间设置挡墙30，可以防止发光二极管20出射的光串扰。在挡墙30的侧壁上设置第二反射层31，提高发光二极管20的光的反射，使发光二极管20出射的光最终都能到达上方的封装层40，从而提高光的利用率。
继续参考图3，黑矩阵50朝向封装单元的至少部分表面上形成有第三反射层51。黑矩阵50能够防止各封装单元的光串扰，且第三反射层51能够进一步打乱光的原始路径，进一步提高的光分布的均匀性。
继续参考图3，挡墙30限定出的容纳部的底面积大于发光二极管所占据的面积，显示面板还包括第四反射层32，位于发光二极管20与挡墙30之间，且第四反射层32位于驱动背板10上。第四反射层32用来反射到达驱动背板10上表面的光，能够提高光的利用率。
显示面板还包括透光基板80，位于封装层40上。透光基板80覆盖封装层40和黑矩阵50。
驱动背板10包括驱动电路，驱动电路用于驱动对应的发光二极管发光。发光二极管可以是Micro-LED。Micro-LED具有低功耗、高亮度、寿命长、响应时间快等优点，使得具有Micro-LED的显示面板具有良好的显示性能。对于Micro-LED，驱动电路至少包括薄膜晶体管，Micro-LED与薄膜晶体管电连接。
本申请实施例还提供了一种显示装置，包括上述显示面板，该显示装置可以应用于虚拟现实设备、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪、可穿戴手表、物联网节点等任何具有显示功能的产品或部件。由于该显示装置解决问题的原理与上述显示面板相似，因此该显示装置的实施可以参见上述显示面板的实施，重复之处不再赘述。
请参阅图4，本申请实施例还提供一种显示面板的制备方法。图4是本申请实施例提供的一种显示面板的制备方法的流程示意图。如图4所示，本申请实施例的显示面板的制备方法包括以下步骤：
S10，提供绑定有发光二极管阵列的驱动背板，发光二极管阵列包括多个发光二极管，相邻的发光二极管之间设置有挡墙；
S20，提供一透光基板，在透光基板上形成图形化的黑矩阵，将散光粒子和透光胶黏剂的混合液置入黑矩阵形成的通道内，并固化混合液，形成具有多个封装单元的封装层；
S30，将封装层与发光二极管阵列按照封装单元与发光二极管上下对应的方式进行对位贴合。
根据本申请实施例提供的显示面板的制备方法，发光二极管20出射的光到达封装层40后，光的原始路径被封装层40中的散光粒子44打乱，从封装层40出来的光由点状分布转变为面状分布，从而增大出光面积，大大降低了纱窗效应，提高画面显示效果。并且不需要对显示面板增加额外的机构，只需在显示面板的封装层40中混合入散光粒子44，能够以一种简单易操作的工艺实现降低纱窗效应的效果。
其中，在S10中，对发光二极管20阵列和挡墙30的形成顺序不做限定。在S20中植入的方式可以是打印，或者旋涂等。在S30中，可以利用胶黏剂进行贴合。
进一步地，S10还包括，在发光二极管20远离驱动背板10的一面上形成第一反射层60；在使挡墙30形成的容纳部的垂直于驱动背板10的截面呈倒梯形结构，在挡墙30在朝向容纳部的至少部分表面上形成第二反射层31；在发光二极管20的周围形成透明支撑层70，用于支撑延伸到发光二极管20之外的第一反射层60；在驱动背板10上形成第四反射层32，第四反射层32位于发光二极管20与挡墙30之间。
S20还包括，在黑矩阵50在朝向封装单元41的至少部分表面上形成第三反射层51。至少部分的封装单元41设置有滤光材料，可以将红色滤光材料和散光粒子混合设置成一层形成红光封装单元411，或者在封装层的厚度方向上将红色滤光材料和散光粒子分层设置，形成红光封装单元411。可以将绿色滤光材料和散光粒子混合设置成一层形成绿光封装单元412，或者在封装层40的厚度方向上将绿色滤光材料和散光粒子分层设置，形成绿光封装单元412。另外，至少部分的封装单元41设置有光转换材料，或者，至少部分的封装单元41与发光二极管之间设置有光转换层。具体的设置方式在前文中已有概括，在此不做赘述。
另外，可以选择垂直结构的发光二极管20形成发光二极管20阵列。
本申请可以以其他的具体形式实现，而不脱离其精神和本质特征。因此，当前的实施例在所有方面都被看作是示例性的而非限定性的，本申请的范围由所附权利要求而非上述描述定义，并且，落入权利要求的含义和等同物的范围内的全部改变从而都被包括在本申请的范围之中。并且，在 不同实施例中出现的不同技术特征可以进行组合，以取得有益效果。本领域技术人员在研究附图、说明书及权利要求书的基础上，应能理解并实现所揭示的实施例的其他变化的实施例。

Claims (19)

  1. 一种显示面板，包括：
    驱动背板；
    发光二极管阵列层，位于所述驱动背板上，所述发光二极管阵列层包括多个发光二极管；
    挡墙，位于相邻的发光二极管之间，所述挡墙限定出多个容纳部，所述容纳部用于容纳所述发光二极管；
    封装层，设置于所述发光二极管阵列层远离所述驱动背板的一侧，所述封装层包括多个封装单元，各所述封装单元通过黑矩阵隔离，所述封装单元与所述发光二极管对应设置，至少一个所述封装单元中分布有散光粒子。
  2. 根据权利要求1所述的显示面板，其中，所述封装层包括透明封装材料，所述散光粒子均匀分布在所述透明封装材料中。
  3. 根据权利要求2所述的显示面板，其中，所述封装层包括多个红色封装单元、多个绿色封装单元及多个蓝光透过封装单元，至少部分所述红色封装单元还包括红色滤光材料，至少部分所述绿色封装单元还包括绿色滤光材料。
  4. 根据权利要求3所述的显示面板，其中，所述红色封装单元中所述红色滤光材料和散光粒子混合设置或在所述封装层的厚度方向上分层设置。
  5. 根据权利要求3所述的显示面板，其中，所述绿色封装单元中所述绿色滤光材料和散光粒子混合设置或在所述封装层的厚度方向上分层设置。
  6. 根据权利要求1所述的显示面板，其中，所述封装层包括多个红色封装单元、多个绿色封装单元及多个蓝光透过封装单元，至少部分所述红色封装单元还包括红色光转换材料，至少部分所述绿色封装单元还包括绿色光转换材料。
  7. 根据权利要求1所述的显示面板，其中，至少部分所述封装单元与所述发光二极管阵列层之间设有光转换层。
  8. 根据权利要求1所述的显示面板，其中，所述显示面板还包括：
    第一反射层，位于所述发光二极管远离所述驱动背板的一面上，所述第一反射层用于反射所述发光二极管出射的光。
  9. 根据权利要求1所述的显示面板，其中，当所述第一反射层的面积大于所述发光二极管远离所述驱动背板的一面的面积，所述显示面板还包括：
    透明支撑层，位于所述发光二极管的周围，用于支撑延伸到所述发光二极管之外的第一反射层。
  10. 根据权利要求9所述的显示面板，其中，所述透明支撑层的远离所述驱动背板的一面为粗化表面。
  11. 根据权利要求9所述的显示面板，其中，所述封装层靠近所述发光二极管阵列层的一面为粗化表面。
  12. 根据权利要求8-11任一项所述的显示面板，其中，所述发光二极管为垂直结构的发光二极管，所述第一反射层为所述垂直结构的发光二极管的N电极或P电极。
  13. 根据权利要求1所述的显示面板，其中，所述容纳部的垂直于所述驱动背板的截面呈倒梯形结构；所述挡墙朝向所述容纳部的至少部分表面上设有第二反射层。
  14. 根据权利要求1所述的显示面板，其中，所述黑矩阵朝向所述封装单元的至少部分表面上设有第三反射层。
  15. 根据权利要求1所述的显示面板，其中，所述显示面板还包括：
    第四反射层，位于所述发光二极管与所述挡墙之间，且所述第四反射层位于所述驱动背板上。
  16. 根据权利要求1所述的显示面板，其中，所述显示面板还包括：
    透光基板，位于所述封装层上。
  17. 根据权利要求11-16任一项所述的显示面板，其中，所述发光二极管包括Micro-LED。
  18. 一种显示装置，其中，包括如权利要求1-17任一项所述的显示面板。
  19. 一种显示面板的制备方法，包括：
    提供绑定有发光二极管阵列的驱动背板，发光二极管阵列包括多个发光二极管，相邻的发光二极管之间设置有挡墙；
    提供一透光基板，在所述透光基板上形成图形化的黑矩阵，将散光粒子和透光胶黏剂的混合胶液置入所述黑矩阵形成的通道内，并固化所述混合液，形成具有多个封装单元的封装层；
    将所述封装层与所述发光二极管阵列按照封装单元与发光二极管上下对应的方式进行对位贴合。
PCT/CN2020/072967 2019-06-28 2020-01-19 显示面板、显示装置及显示面板的制备方法 WO2020258878A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020217038599A KR102553837B1 (ko) 2019-06-28 2020-01-19 표시 패널, 표시 장치 및 표시 패널의 제조 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910580227.0A CN112151567A (zh) 2019-06-28 2019-06-28 显示面板、显示装置及显示面板的制备方法
CN201910580227.0 2019-06-28

Publications (1)

Publication Number Publication Date
WO2020258878A1 true WO2020258878A1 (zh) 2020-12-30

Family

ID=73891706

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/072967 WO2020258878A1 (zh) 2019-06-28 2020-01-19 显示面板、显示装置及显示面板的制备方法

Country Status (3)

Country Link
KR (1) KR102553837B1 (zh)
CN (1) CN112151567A (zh)
WO (1) WO2020258878A1 (zh)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113471187A (zh) * 2021-06-30 2021-10-01 Tcl华星光电技术有限公司 发光二极管显示面板及发光二极管显示装置
CN113488501A (zh) * 2021-06-30 2021-10-08 上海天马微电子有限公司 显示面板及显示装置
CN114023867A (zh) * 2021-10-19 2022-02-08 武汉大学 一种全彩化Micro-LED显示面板及其制造方法
CN114975392A (zh) * 2022-04-26 2022-08-30 湖北长江新型显示产业创新中心有限公司 显示面板的制作方法及显示面板
CN115933234A (zh) * 2022-11-08 2023-04-07 Tcl华星光电技术有限公司 拼接显示屏
CN117613061A (zh) * 2023-12-12 2024-02-27 惠科股份有限公司 显示面板及其制备方法、电子设备

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112786760B (zh) * 2020-12-31 2022-12-13 厦门天马微电子有限公司 一种显示面板、制备方法及显示装置
CN113192942B (zh) * 2021-04-21 2023-10-17 Tcl华星光电技术有限公司 显示面板
TWI773488B (zh) * 2021-08-18 2022-08-01 友達光電股份有限公司 顯示面板及其製造方法
CN113659058B (zh) * 2021-08-20 2023-10-20 京东方科技集团股份有限公司 一种发光器件及其制备方法、显示装置
CN113903729A (zh) * 2021-09-29 2022-01-07 北海惠科光电技术有限公司 Micro LED显示装置及其制造方法
CN114023899A (zh) * 2021-10-25 2022-02-08 深圳市华星光电半导体显示技术有限公司 显示面板及其制备方法
CN114023868B (zh) * 2021-10-28 2023-12-05 武汉华星光电半导体显示技术有限公司 发光基板及显示装置
CN114141809B (zh) * 2021-11-30 2023-07-25 深圳市华星光电半导体显示技术有限公司 一种显示面板的制备方法及显示面板
CN114242874A (zh) * 2021-12-14 2022-03-25 惠州华星光电显示有限公司 显示屏、显示装置及显示屏的制作方法
US11971623B2 (en) 2021-12-14 2024-04-30 Huizhou China Star Optoelectronics Display Co., Ltd. Display screen, display device and method for manufacturing display screen
WO2024000377A1 (zh) * 2022-06-30 2024-01-04 京东方科技集团股份有限公司 显示面板及其制备方法
WO2024106573A1 (ko) * 2022-11-18 2024-05-23 엘지전자 주식회사 디스플레이 장치 및 디스플레이 장치의 제조 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102751447A (zh) * 2012-07-04 2012-10-24 信利半导体有限公司 光学过渡层材料、光学基板/封装层、oled及各自制法
CN103490018A (zh) * 2013-09-25 2014-01-01 京东方科技集团股份有限公司 有机电致发光器件及其制备方法
US20140027724A1 (en) * 2012-07-25 2014-01-30 Samsung Display Co., Ltd. Organic light emitting display device and manufacturing method thereof
CN105489633A (zh) * 2016-01-15 2016-04-13 京东方科技集团股份有限公司 显示基板及其制备方法、oled显示面板及其制备方法
CN106848095A (zh) * 2017-01-24 2017-06-13 上海天马微电子有限公司 一种有机电致发光显示面板及其制备方法和电子设备

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101764149B (zh) * 2010-01-13 2012-04-18 友达光电股份有限公司 有机发光二极管显示装置
CN103928594A (zh) * 2014-03-21 2014-07-16 京东方科技集团股份有限公司 一种发光装置
CN104538430B (zh) * 2014-12-30 2017-10-13 北京维信诺科技有限公司 一种有机发光显示装置及其制备方法
US10304813B2 (en) * 2015-11-05 2019-05-28 Innolux Corporation Display device having a plurality of bank structures
CN106684108B (zh) * 2015-11-05 2019-10-08 群创光电股份有限公司 发光二极管显示设备
CN105405982A (zh) * 2015-12-09 2016-03-16 深圳市华星光电技术有限公司 有机发光二极管封装结构、封装方法及有机发光二极管
WO2017217703A1 (en) * 2016-06-13 2017-12-21 Seoul Semiconductor Co., Ltd Display apparatus and manufacturing method thereof
CN208722881U (zh) * 2018-06-26 2019-04-09 昆山龙腾光电有限公司 一种有机发光显示面板和显示装置
CN109671365A (zh) * 2019-01-30 2019-04-23 京东方科技集团股份有限公司 Micro-LED显示基板及其制作方法、显示装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102751447A (zh) * 2012-07-04 2012-10-24 信利半导体有限公司 光学过渡层材料、光学基板/封装层、oled及各自制法
US20140027724A1 (en) * 2012-07-25 2014-01-30 Samsung Display Co., Ltd. Organic light emitting display device and manufacturing method thereof
CN103490018A (zh) * 2013-09-25 2014-01-01 京东方科技集团股份有限公司 有机电致发光器件及其制备方法
CN105489633A (zh) * 2016-01-15 2016-04-13 京东方科技集团股份有限公司 显示基板及其制备方法、oled显示面板及其制备方法
CN106848095A (zh) * 2017-01-24 2017-06-13 上海天马微电子有限公司 一种有机电致发光显示面板及其制备方法和电子设备

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113471187A (zh) * 2021-06-30 2021-10-01 Tcl华星光电技术有限公司 发光二极管显示面板及发光二极管显示装置
CN113488501A (zh) * 2021-06-30 2021-10-08 上海天马微电子有限公司 显示面板及显示装置
CN113488501B (zh) * 2021-06-30 2023-12-19 上海天马微电子有限公司 显示面板及显示装置
CN114023867A (zh) * 2021-10-19 2022-02-08 武汉大学 一种全彩化Micro-LED显示面板及其制造方法
CN114975392A (zh) * 2022-04-26 2022-08-30 湖北长江新型显示产业创新中心有限公司 显示面板的制作方法及显示面板
CN115933234A (zh) * 2022-11-08 2023-04-07 Tcl华星光电技术有限公司 拼接显示屏
CN115933234B (zh) * 2022-11-08 2024-04-19 Tcl华星光电技术有限公司 拼接显示屏
CN117613061A (zh) * 2023-12-12 2024-02-27 惠科股份有限公司 显示面板及其制备方法、电子设备

Also Published As

Publication number Publication date
KR102553837B1 (ko) 2023-07-10
KR20210151980A (ko) 2021-12-14
CN112151567A (zh) 2020-12-29

Similar Documents

Publication Publication Date Title
WO2020258878A1 (zh) 显示面板、显示装置及显示面板的制备方法
KR102626353B1 (ko) 표시 패널, 표시 장치 및 표시 패널의 제조 방법
CN112133811B (zh) 显示面板、显示装置及显示面板的制备方法
WO2020258864A1 (zh) 色彩转化组件及其制作方法、显示面板
CN104321694B (zh) 背光单元和显示装置
TWI536081B (zh) 背光單元及使用該背光單元的顯示裝置
TWI720339B (zh) 應用於微型led顯示器之led發光模組及應用該led發光模組所製成之顯示器
WO2016086416A1 (zh) 一种量子点背光模组以及显示装置
JP5519317B2 (ja) ライトユニット及びこれを備える表示装置
JP2010114406A (ja) 照明装置、液晶表示装置、及び照明装置の製造方法
CN110928036A (zh) 显示装置及其显示方法、制备方法
CN110007508A (zh) 彩膜基板、液晶显示面板及液晶显示装置
KR20120075317A (ko) 디스플레이 장치
CN105425469A (zh) 一种背光模组及其制作方法、显示装置
CN104360539A (zh) 一种背光模组及液晶显示器件
CN101071232A (zh) 面光源装置及其制作方法与具此面光源装置的液晶显示器
WO2021203460A1 (zh) 显示模组及显示装置
US11320574B2 (en) Light guide plate, backlight module and display device
WO2023173527A1 (zh) 混接显示装置以及拼接显示装置
CN110389470A (zh) 背光结构和显示装置
CN109031767A (zh) 一种彩膜基板、显示装置及制作方法
JP2010218839A (ja) Ｅｌ素子、液晶ディスプレイ用バックライト装置、照明装置、電子看板装置、ディスプレイ装置及び光取り出しフィルム
CN114509895B (zh) 背光模组及其制备方法和显示装置
CN112216774A (zh) 色彩转换组件、显示面板及制作方法
KR102677686B1 (ko) 표시 패널, 표시 장치 및 표시 패널의 제조 방법

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20832069

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20217038599

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20832069

Country of ref document: EP

Kind code of ref document: A1