WO2020255365A1 - Image synthesis device, image acquisition device, image processing system, and image processing method - Google Patents

Image synthesis device, image acquisition device, image processing system, and image processing method Download PDF

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Publication number
WO2020255365A1
WO2020255365A1 PCT/JP2019/024626 JP2019024626W WO2020255365A1 WO 2020255365 A1 WO2020255365 A1 WO 2020255365A1 JP 2019024626 W JP2019024626 W JP 2019024626W WO 2020255365 A1 WO2020255365 A1 WO 2020255365A1
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Prior art keywords
image
imaging conditions
composite
electronic component
images
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PCT/JP2019/024626
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French (fr)
Japanese (ja)
Inventor
一也 小谷
勇太 横井
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株式会社Ｆｕｊｉ
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Priority to PCT/JP2019/024626 priority Critical patent/WO2020255365A1/en
Priority to JP2021528589A priority patent/JP7383708B2/en
Publication of WO2020255365A1 publication Critical patent/WO2020255365A1/en
Priority to JP2023078839A priority patent/JP7433498B2/en

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules

Definitions

  • the present disclosure relates to an image synthesizer, an image acquisition device, an image processing system, and an image processing method used when acquiring appropriate imaging conditions of a substrate component.
  • the transfer state of flux to the bump of the electronic component is inspected.
  • the preset inspection data and the actual image of the substrate component are compared.
  • the inspection data it is necessary to acquire data according to the inspection purpose (for example, size, color, contrast, etc. of the substrate component) from the image of the substrate component. If the imaging conditions of the substrate component are appropriate, the image becomes clear, so that desired data can be acquired with high accuracy. Therefore, high-precision inspection data can be created. As described above, the accuracy of the inspection data depends on the imaging conditions when imaging the substrate component.
  • an object of the present disclosure is to provide an image synthesizer, an image acquisition device, an image processing system, and an image processing method capable of easily acquiring appropriate imaging conditions of a substrate component.
  • the image synthesizing apparatus of the present disclosure creates a composite image from a plurality of composite images of the same substrate component imaged under different imaging conditions, and captures the plurality of composite images used for creating the composite image. Acquire proper imaging conditions from the conditions.
  • the image acquisition device of the present disclosure images the same substrate component under different imaging conditions, and automatically acquires a plurality of composite images of the substrate component associated with the imaging conditions.
  • the image processing system of the present disclosure is an image processing system including the image synthesizer and the image acquisition device, and the image acquisition device is a substrate component associated with the image pickup condition in the image synthesizer.
  • the image compositing device transmits a plurality of composite images, creates a composite image using the received plurality of composite images, and captures the plurality of composite images used for creating the composite image. Acquire proper imaging conditions from the conditions.
  • the image processing method of the present disclosure includes an image acquisition step of imaging the same substrate component under different imaging conditions and automatically acquiring a plurality of composite images of the substrate component associated with the imaging conditions.
  • the image compositing device of the present disclosure it is possible to create a composite image suitable for the purpose of use of the image from a plurality of compositing images. In addition, it is possible to easily acquire appropriate imaging conditions for acquiring the composite image without actually capturing an image similar to the composite image.
  • a plurality of composite images can be automatically acquired in a state associated with the imaging conditions. Therefore, it is possible to easily acquire appropriate imaging conditions when creating a composite image.
  • the image compositing device can create a compositing image based on a plurality of compositing images automatically acquired by the image acquiring device. Further, the image compositing device can acquire the appropriate imaging conditions based on the imaging conditions associated with the compositing image.
  • a composite image can be created in the condition acquisition step based on a plurality of composite images automatically acquired in the image acquisition step.
  • appropriate imaging conditions can be acquired in the condition acquisition step based on the imaging conditions associated with the composite image.
  • FIG. 1 is a schematic diagram of an image processing system.
  • FIG. 2 is a partial top view of the electronic component mounting machine.
  • FIG. 3 is an enlarged view within the frame III of FIG.
  • FIG. 4 is a sectional view taken in the IV-IV direction of FIG.
  • FIG. 5 is a schematic diagram of imaging conditions in the image acquisition step.
  • FIG. 6 is a schematic diagram of an imaging condition, a composite image, an appropriate imaging condition, and a composite image in the condition acquisition step.
  • FIG. 1 shows a schematic diagram of an image processing system.
  • the image processing system 1 includes an image compositing device 2, a production line 3, and a camera stand 4.
  • the camera stand 4 is arranged outside the production line 3.
  • the image compositing device 2 includes a control device 20, an input device (for example, a keyboard, a touch panel, etc.) 21 and a display device (for example, a display, a touch panel that also serves as the input device 21) 22.
  • the control device 20 includes a calculation unit (for example, a CPU) 200 and a storage unit (for example, ROM, RAM, etc.) 201.
  • the production line 3 includes a solder printing machine 30, a solder printing inspection machine 31, a plurality of electronic component mounting machines 32, a pre-reflow board appearance inspection machine 33, a reflow furnace 34, and a post-reflow board appearance inspection machine 35. It has.
  • the image synthesizer 2 and each image acquisition device (solder printing machine 30, solder printing inspection machine 31, electronic component mounting machine 32, pre-reflow board appearance inspection machine 33, post-reflow board appearance inspection machine 35, camera stand 4) It is possible to communicate in both directions.
  • the substrate is conveyed along the production line 3 from the upstream side (solder printing machine 30 side) to the downstream side (board appearance inspection machine 35 side after reflow).
  • FIG. 2 shows a partial top view of the electronic component mounting machine of the present embodiment.
  • FIG. 3 shows an enlarged view in the frame III of FIG.
  • FIG. 4 shows a sectional view in the IV-IV direction of FIG.
  • the electronic component mounting machine 32 inspects the suction state of the electronic component 91 with respect to the suction nozzle 326 by comparing the actual image of the electronic component 91 with the preset inspection data.
  • the electronic component mounting machine 32 includes a control device 320, an input device 321, an image processing device 322, a camera unit (parts camera) 323, a component supply unit 324, and a substrate transfer.
  • a unit (belt conveyor) 325 and a suction nozzle 326 are provided.
  • the control device 320 includes a calculation unit 320a and a storage unit 320b.
  • the storage unit 320b stores the imaging program and inspection data of the electronic component 91.
  • the imaging program is executed in the image acquisition step of the image processing method described later.
  • the inspection data includes dimensional data (for example, size, color, etc.) of the electronic component 91.
  • the dimensional data of the electronic component 91 is acquired by imaging the electronic component 91 using the appropriate imaging conditions acquired by the image processing method described later. Further, as will be described later, the proper imaging condition is also used when the electronic component mounting machine 32 inspects the electronic component 91.
  • the substrate 9 is erected between the pair of belts 325a of the substrate transport portion 325.
  • the substrate 9 is conveyed through the substrate conveying portion 325 from the left side (upstream side) to the right side (downstream side).
  • the suction nozzle 326 shown in FIGS. 3 to 4 uses an XY robot (not shown) to suck the electronic component 91 between the component supply unit 324 and the substrate 9 shown in FIG. 2 in the front-back and left-right directions (horizontal direction). It is possible to move in the direction).
  • the camera unit 323 is arranged between the component supply unit 324 and the substrate transport unit 325 (that is, the substrate 9). As shown in FIGS. 3 to 4, the camera unit 323 captures an image of the electronic component 91 being conveyed from the component supply unit 324 to the substrate 9 from below.
  • the camera unit 323 includes an imaging device (for example, a CCD camera, a CMOS camera, etc.) 323a, a lighting device 323b, and an optical system (not shown) such as a lens.
  • the lighting device 323b includes a side-illuminated lighting unit 50, a coaxial falling oblique lighting unit 51, and a half mirror 52.
  • the half mirror 52 is a reflecting mirror having a predetermined transmittance.
  • the half mirror 52 is arranged above the image pickup apparatus 323a.
  • the half mirror 52 is arranged at an angle of 45 ° with respect to the perpendicular line L extending upward from the image pickup apparatus 323a.
  • the coaxial falling oblique illumination unit 51 is arranged on the left side (horizontally adjacent to each other) of the half mirror 52.
  • the illumination light of the coaxial oblique illumination unit 51 is reflected by the half mirror 52 at 90 ° and is applied to the electronic component 91 from below.
  • the side-illuminating unit 50 is arranged above the half mirror 52.
  • the side illuminating unit 50 has an upward cup shape having an opening 500 at the lower bottom portion.
  • the side-illuminated illumination unit 50 includes a lower stage portion 50a, a middle stage portion 50b, and an upper stage portion 50c.
  • the lower portion 50a, the middle portion 50b, and the upper portion 50c each have an annular shape.
  • the lower portion 50a, the middle portion 50b, and the upper portion 50c are each formed by connecting a plurality of light source cells C in the circumferential direction.
  • the middle stage portion 50b is arranged on the upper side of the lower stage portion 50a, and the upper stage portion 50c is arranged on the upper side of the middle stage portion 50b.
  • the illumination light of the lower portion 50a, the middle portion 50b, and the upper portion 50c is applied to the electronic component 91 from different angles (angles with respect to the perpendicular line L).
  • the image pickup apparatus 323a images the electronic component 91 from below.
  • the image processing device 322 performs predetermined image processing on the image captured by the image pickup device 323a.
  • the solder printing machine 30, the solder printing inspection machine 31, the pre-reflow substrate appearance inspection machine 33, the post-reflow substrate appearance inspection machine 35, and the camera stand 4 are the same camera units as the above-mentioned camera unit 323 and image processing device 322, respectively. , Equipped with an image processing device.
  • the inspection data is stored in the storage unit 320b of the electronic component mounting machine 32.
  • the inspection data includes dimensional data of the electronic component 91.
  • the image processing method of the present embodiment is executed in order to acquire appropriate imaging conditions capable of capturing an optimum image for creating the dimensional data.
  • the image processing method of the present embodiment is executed in order to acquire appropriate imaging conditions capable of capturing an optimum image for inspection of the electronic component 91 at the time of actual production of the substrate 9.
  • the image processing method of the present embodiment includes an image acquisition step and a condition acquisition step.
  • the image acquisition step is executed by the electronic component mounting machine 32.
  • the condition acquisition step is executed by the image synthesizer 2.
  • FIG. 5 shows a schematic diagram of imaging conditions in the image acquisition step.
  • the lighting portions coaxial falling oblique illumination portion 51, lower portion 50a, middle stage portion 50b, upper stage portion 50c
  • the lighting color of each lighting portion can be switched to R (red), G (green), and B (blue), respectively.
  • the exposure time (lighting time) of each lighting portion can be independently switched to 10 patterns.
  • the lighting intensity of each lighting portion can be independently switched to 5 patterns. In the case of the example shown in FIG.
  • the "different imaging conditions" in the present disclosure include factors (lighting portion, lighting color, exposure time, lighting intensity) such as the imaging device 323a and the lighting device 323b adopted in the imaging conditions among the plurality of imaging conditions. Etc.), which means that at least one is different.
  • the calculation unit 320a executes the imaging program of the storage unit 320b. Specifically, as shown in FIGS. 3 to 4, the calculation unit 320a first moves the suction nozzle 326 with the electronic component 91 to the image pickup area E of the image pickup apparatus 323a. Next, the calculation unit 320a executes all the imaging conditions shown in FIG. 5 from # 1 to # 600. The calculation unit 320a acquires the compositing images A1 to A600 of the electronic component 91. The calculation unit 320a stores the composition data (data of the composition images A1 to A600 in the state associated with the imaging conditions # 1 to # 600) in the storage unit 320b.
  • the composite image A1 is stored in the storage unit 320b in a state associated with the imaging condition # 1
  • the composite image A2 is stored in the storage unit 320b in a state associated with the imaging condition # 2.
  • the calculation unit 320a transmits the compositing data to the image compositing device 2.
  • the image synthesizer 2 creates a composite image using the received composite data, and acquires appropriate imaging conditions for creating inspection data.
  • the optimum composite image (clear composite image) can be obtained by combining the imaging conditions # 1 to # 4.
  • FIG. 6 shows a schematic diagram of an imaging condition, a composite image, an appropriate imaging condition, and a composite image in the condition acquisition step.
  • dotted hatching is performed on the bright portion of the lower surface of the lighting portion (coaxial falling oblique illumination portion 51, lower portion 50a, middle stage portion 50b, upper stage portion 50c) and the electronic component 91 that are lit.
  • the operator inputs the imaging conditions # 1 to # 4 via the input device 21.
  • the calculation unit 200 reads out the composite images A1 to A4 associated with the imaging conditions # 1 to # 4 from the storage unit 201.
  • the calculation unit 200 synthesizes the composite images A1 to A4 to create the composite image B.
  • the calculation unit 200 displays the composite image B on the display device 22.
  • the operator confirms the composite image B of the display device 22.
  • the operator determines that the composite image B of the display device 22 is clear and suitable for acquiring the dimensional data of the electronic component 91, the operator approves the composite image B as an inspection image via the input device 21.
  • the calculation unit 200 synthesizes the imaging conditions # 1 to # 4 to create an appropriate imaging condition.
  • the calculation unit 200 stores the appropriate imaging conditions and the composite image B in the storage unit 201. Further, the calculation unit 200 transmits appropriate data (composite image B, appropriate imaging conditions) to the electronic component mounting machine 32.
  • appropriate data composite image B, appropriate imaging conditions
  • the worker adds the new composite images A5 to A600 to the composite images A1 to A600. Is added, or at least a part of the composite images A1 to A4 is exchanged to create a suitable composite image B on the display device 22.
  • the arithmetic unit 320a of the electronic component mounting machine 32 drives the camera unit 323 to image the electronic component 91 using the received appropriate imaging conditions, and acquires the dimensional data of the electronic component 91. To do. Then, the inspection data is completed.
  • the calculation unit 320a drives the camera unit 323 to image the actual electronic component 91 using the appropriate imaging conditions. Then, the inspection data is compared with the actual image of the electronic component 91, and the suction state of the electronic component 91 with respect to the suction nozzle 326 is inspected.
  • a plurality of composite images A1 to A600 can be automatically acquired in a state associated with imaging conditions # 1 to # 600. it can. Therefore, as shown in FIG. 6, appropriate imaging conditions can be easily acquired when the composite image B is created.
  • a plurality of compositing images A1 to A4 automatically acquired by the electronic component mounting machine 32 in the image acquisition step.
  • the composite image B can be created by the image compositing device 2 compositing in the condition acquisition step. Further, in the condition acquisition step, the image compositing device 2 synthesizes the imaging conditions # 1 to # 4 associated with the compositing images A1 to A4, so that the appropriate imaging conditions can be acquired.
  • the image synthesizer 2 shown in FIG. 1 transmits appropriate data (composite image B, appropriate imaging conditions) to the electronic component mounting machine 32 in the condition acquisition step.
  • the electronic component mounting machine 32 can image the electronic component 91 under appropriate imaging conditions and acquire the dimensional data of the electronic component 91. Then, the electronic component mounting machine 32 can complete the inspection data of the electronic component 91.
  • the electronic component mounting machine 32 can image the electronic component 91 using appropriate imaging conditions when inspecting the electronic component 91 during the production of the substrate 9. If appropriate imaging conditions are used, it is possible to acquire an image similar to the composite image B (an image in which the shape, color, etc. of the electronic component 91 can be easily discriminated). Therefore, the inspection accuracy (pass / fail determination accuracy) of the electronic component 91 can be improved.
  • each lighting portion may be lit in units of the light source cell C shown in FIG. As shown by the frame D in FIG. 3, each lighting portion may be lit in units of a plurality of light source cells C adjacent to each other in the radial direction. Of course, each lighting portion may be lit in units of a plurality of light source cells C adjacent to each other in the circumferential direction.
  • the electronic component mounting machine 32 may acquire an image in a state where all four lighting parts are turned off in the image acquisition step as a difference image.
  • the image compositing device 2 may remove the difference image from the composite image B shown in FIG. 6 in the condition acquisition step. By doing so, the noise caused by the image when all the lights are turned off can be excluded from the composite image B. Therefore, a clearer composite image B can be obtained.
  • the image synthesizer 2 shown in FIG. 1 and an image acquisition device (solder printing machine 30, solder printing inspection machine 31, electronic component mounting machine 32, pre-reflow board appearance inspection machine 33, post-reflow board appearance inspection machine 35, camera stand 4).
  • the communication method is not particularly limited. It may be wired or wireless. Further, the image synthesizer 2 and the image acquisition device may not be able to communicate with each other.
  • data for example, composite data (data of composite images A1 to A600 in a state associated with imaging conditions # 1 to # 600 shown in FIG. 5), appropriate data (composite image B, appropriate imaging conditions), etc.
  • a transportable storage medium flash memory (SSD, USB flash, SD card, etc.), hard disk, optical disk (CD, DVD, Blu-ray disc, etc.
  • cloud storage online storage
  • the image compositing device 2 and the image acquisition device may be arranged in the same place or in different places.
  • the image synthesizer 2 and the image acquisition device may be arranged in the same factory.
  • the image composition device 2 and the image acquisition device may be integrated as the image composition device 2 or the image acquisition device.
  • the image compositing device 2 and the image acquisition device may be separately arranged in different places (for example, an office and a factory) within the same user (user of the image compositing device 2 and the image acquisition device).
  • the image compositing device 2 and the image acquisition device may be arranged separately for the user of the image acquisition device and the manufacturer. That is, the proper imaging conditions of the user-owned image acquisition device and the composite image B may be provided by the manufacturer-owned image synthesizer 2. In this case, the number of users may be singular or plural.
  • the appropriate imaging conditions may be used.
  • the dimensional data of the electronic component 91 can be acquired from the CAD data of the electronic component 91 or the like without actually imaging the electronic component 91. Therefore, the electronic component mounting machine 32 may use appropriate imaging conditions at least when the electronic component 91 is imaged during the production of the substrate 9 and the image for inspection is acquired.
  • the solder printing machine 30 is an execution device, an image similar to a composite image (an image in which the substrate main body and the positioning mark of the substrate main body can be easily distinguished) is acquired for inspection of the mark on the substrate 9. Therefore, appropriate imaging conditions may be used.
  • the solder printing inspection machine 31 is an execution device, it is appropriate to acquire an image similar to a composite image (for example, an image in which the substrate body and the solder can be easily distinguished) for the inspection of the solder.
  • the imaging conditions may be used.
  • a composite image for example, a substrate body, a pad (land), and solder
  • imaging conditions may be used.
  • the applications of the camera stand 4 for example, a solder printing machine 30, a solder printing inspection machine 31, an electronic component mounting machine 32, a pre-reflow board appearance inspection machine 33, a post-reflow board appearance inspection
  • Appropriate imaging conditions may be used according to the substitute of the camera unit 323 of the machine 35 or the like).
  • the number of composite images A1 to A600 acquired in the image acquisition step may be two or more.
  • a plurality of the same composite images may be composited.
  • the destination of the composite image B and the appropriate imaging conditions in the condition acquisition step does not have to be the image acquisition device.
  • the transmission destination may be a communication terminal (PC, smartphone, tablet PC, etc.) other than the image acquisition device.
  • the use of the image processing system 1 shown in FIG. 1 is not limited. For example, it can be used when creating a production program for the substrate 9 before the start of production for the substrate 9. Further, the image processing system 1 can be used even when the substrate component is changed during the production of the substrate 9. For example, in the middle of production of the substrate 9, an arbitrary electronic component 91 may be changed to an electronic component 91 of the same type as the electronic component 91 and of a different manufacturer. In this case, the color of the electronic component 91 may change before and after the change. Even in such a case, if the image processing system 1 is used, it is possible to acquire the composite image B and the appropriate imaging conditions according to the changed electronic component 91.
  • the "board component” of the present disclosure includes everything that constitutes the board 9. For example, a substrate body, a pad, an electronic component 91, a solder, a flux, a positioning mark, and the like are included.
  • the "appropriate imaging condition" of the present disclosure does not have to be the optimum imaging condition.
  • the imaging conditions may be such that the purpose of use of the image can be easily achieved with respect to the imaging conditions of the individual composite images.
  • the proper imaging condition for the composite image B shown in FIG. 6 does not have to be the optimum imaging condition.
  • the imaging conditions # 1 to # 600 of the individual composite images A1 to A600 shown in FIG. 5 the imaging conditions may be sufficient to easily achieve the purpose of use of the image (acquisition of dimensional data, inspection of electronic component 91). .. At the very least, it suffices if the intended use of the image can be achieved by using appropriate imaging conditions.
  • Image processing system 2 Image compositing device 3: Production line 4: Camera stand (image acquisition device), 9: Board, 20: Control device, 21: Input device, 22: Display device, 30: Solder printing Machine (image acquisition device), 31: Solder printing inspection machine (image acquisition device), 32: Electronic component mounting machine (image acquisition device), 33: Pre-reflow board appearance inspection machine (image acquisition device), 34: Reflow furnace, 35: Substrate appearance inspection machine after reflow (image acquisition device), 50: Side-illuminated illumination unit, 50a: Lower stage, 50b: Middle stage, 50c: Upper stage, 51: Coaxial tilted illumination unit, 52: Half mirror, 91 : Electronic component (board component), 200: Calculation unit, 201: Storage unit, 320: Control device, 320a: Calculation unit, 320b: Storage unit, 321: Input device, 322: Image processing device, 323: Camera unit, 323a: Imaging device, 323b: Lighting device, 324: Parts supply unit, 325: Substrate transport

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Image Processing (AREA)

Abstract

The present disclosure addresses the problem of providing an image synthesis device (2), an image acquisition device (32), an image processing system (1), and an image processing method, that can easily acquire an optimum image-capturing condition of a substrate structure (91). The image synthesis device (2) generates a synthesized image (B) from a plurality of images to be synthesized (A1-A600) regarding the same substrate structure (91) imaged under different image-capturing conditions (#1-#600), and acquires the optimum image-capturing condition from the image-capturing conditions (#1-#4) of the plurality of images (A1-A4) to be synthesized used for generating the synthesized image (B).

Description

画像合成装置、画像取得装置、画像処理システム、画像処理方法Image synthesizer, image acquisition device, image processing system, image processing method
　本開示は、基板構成物の適正撮像条件を取得する際に用いられる、画像合成装置、画像取得装置、画像処理システム、画像処理方法に関する。 The present disclosure relates to an image synthesizer, an image acquisition device, an image processing system, and an image processing method used when acquiring appropriate imaging conditions of a substrate component.
　特許文献１のバンプ付電子部品搭載装置においては、電子部品のバンプに対するフラックスの転写状態が検査される。当該フラックスなどの基板構成物の検査においては、予め設定された検査データと、基板構成物の実際の画像と、が比較される。当該検査データの作成においては、基板構成物の画像から、検査目的に応じたデータ（例えば、基板構成物のサイズ、色、コントラストなど）を取得する必要がある。基板構成物の撮像条件が適切であれば、画像が鮮明になるので、所望のデータを精度よく取得することができる。このため、高精度の検査データを作成することができる。このように、検査データの精度は、基板構成物を撮像する際の撮像条件に依存している。 In the device for mounting an electronic component with a bump of Patent Document 1, the transfer state of flux to the bump of the electronic component is inspected. In the inspection of the substrate component such as the flux, the preset inspection data and the actual image of the substrate component are compared. In creating the inspection data, it is necessary to acquire data according to the inspection purpose (for example, size, color, contrast, etc. of the substrate component) from the image of the substrate component. If the imaging conditions of the substrate component are appropriate, the image becomes clear, so that desired data can be acquired with high accuracy. Therefore, high-precision inspection data can be created. As described above, the accuracy of the inspection data depends on the imaging conditions when imaging the substrate component.
特開２０１８－５６２１８号公報JP-A-2018-56218
　適正な撮像条件を取得するためには、作業者は、「基板構成物を撮像する際の撮像条件を設定し、当該撮像条件で基板構成物を撮像し、取得された画像が検査データの作成に適しているか否かを検証する」という一連の作業を、適正な撮像条件が見つかるまで、何回も繰り返す必要がある。しかしながら、当該作業は、非常に煩雑である。また、当該作業は、作業者の熟練度に依存する。そこで、本開示は、基板構成物の適正撮像条件を簡単に取得可能な画像合成装置、画像取得装置、画像処理システム、画像処理方法を提供することを目的とする。 In order to acquire appropriate imaging conditions, the operator "sets the imaging conditions when imaging the substrate component, images the substrate component under the imaging conditions, and the acquired image creates inspection data. It is necessary to repeat a series of operations of "verifying whether or not it is suitable for the image" many times until an appropriate imaging condition is found. However, the work is very complicated. In addition, the work depends on the skill level of the worker. Therefore, an object of the present disclosure is to provide an image synthesizer, an image acquisition device, an image processing system, and an image processing method capable of easily acquiring appropriate imaging conditions of a substrate component.
　本開示の画像合成装置は、異なる撮像条件で撮像された同一の基板構成物に関する複数の合成用画像から合成画像を作成し、前記合成画像の作成に用いた複数の前記合成用画像の前記撮像条件から、適正撮像条件を取得する。 The image synthesizing apparatus of the present disclosure creates a composite image from a plurality of composite images of the same substrate component imaged under different imaging conditions, and captures the plurality of composite images used for creating the composite image. Acquire proper imaging conditions from the conditions.
　本開示の画像取得装置は、異なる撮像条件で同一の基板構成物を撮像し、前記撮像条件に関連付けられた前記基板構成物の複数の合成用画像を、自動的に取得する。 The image acquisition device of the present disclosure images the same substrate component under different imaging conditions, and automatically acquires a plurality of composite images of the substrate component associated with the imaging conditions.
　本開示の画像処理システムは、前記画像合成装置と、前記画像取得装置と、を備える画像処理システムであって、前記画像取得装置は、前記画像合成装置に、撮像条件に関連付けられた基板構成物の複数の合成用画像を送信し、前記画像合成装置は、受信した複数の前記合成用画像を用いて合成画像を作成し、前記合成画像の作成に用いた複数の前記合成用画像の前記撮像条件から、適正撮像条件を取得する。 The image processing system of the present disclosure is an image processing system including the image synthesizer and the image acquisition device, and the image acquisition device is a substrate component associated with the image pickup condition in the image synthesizer. The image compositing device transmits a plurality of composite images, creates a composite image using the received plurality of composite images, and captures the plurality of composite images used for creating the composite image. Acquire proper imaging conditions from the conditions.
　本開示の画像処理方法は、異なる撮像条件で同一の基板構成物を撮像し、前記撮像条件に関連付けられた前記基板構成物の複数の合成用画像を、自動的に取得する画像取得ステップと、取得された複数の前記合成用画像を用いて合成画像を作成し、前記合成画像の作成に用いた複数の前記合成用画像の前記撮像条件から、適正撮像条件を取得する条件取得ステップと、を有する。 The image processing method of the present disclosure includes an image acquisition step of imaging the same substrate component under different imaging conditions and automatically acquiring a plurality of composite images of the substrate component associated with the imaging conditions. A condition acquisition step of creating a composite image using the acquired plurality of the composite images and acquiring appropriate imaging conditions from the imaging conditions of the plurality of composite images used for creating the composite image. Have.
　本開示の画像合成装置によると、複数の合成用画像から、画像の使用目的に適した合成画像を作成することができる。また、当該合成画像と同様の画像を実際に撮像することなく、当該合成画像を取得するための適正撮像条件を、簡単に取得することができる。 According to the image compositing device of the present disclosure, it is possible to create a composite image suitable for the purpose of use of the image from a plurality of compositing images. In addition, it is possible to easily acquire appropriate imaging conditions for acquiring the composite image without actually capturing an image similar to the composite image.
　本開示の画像取得装置によると、複数の合成用画像を、撮像条件に関連付けられた状態で、自動的に取得することができる。このため、合成画像作成時に、簡単に適正撮像条件を取得することができる。 According to the image acquisition device of the present disclosure, a plurality of composite images can be automatically acquired in a state associated with the imaging conditions. Therefore, it is possible to easily acquire appropriate imaging conditions when creating a composite image.
　本開示の画像処理システムによると、画像取得装置が自動的に取得した複数の合成用画像を基に、画像合成装置が合成画像を作成することができる。また、合成用画像に関連付けられた撮像条件を基に、画像合成装置が適正撮像条件を取得することができる。 According to the image processing system of the present disclosure, the image compositing device can create a compositing image based on a plurality of compositing images automatically acquired by the image acquiring device. Further, the image compositing device can acquire the appropriate imaging conditions based on the imaging conditions associated with the compositing image.
　本開示の画像処理方法によると、画像取得ステップで自動的に取得した複数の合成用画像を基に、条件取得ステップで合成画像を作成することができる。また、合成用画像に関連付けられた撮像条件を基に、条件取得ステップで適正撮像条件を取得することができる。 According to the image processing method of the present disclosure, a composite image can be created in the condition acquisition step based on a plurality of composite images automatically acquired in the image acquisition step. In addition, appropriate imaging conditions can be acquired in the condition acquisition step based on the imaging conditions associated with the composite image.
図１は、画像処理システムの模式図である。FIG. 1 is a schematic diagram of an image processing system. 図２は、電子部品実装機の部分上面図である。FIG. 2 is a partial top view of the electronic component mounting machine. 図３は、図２の枠ＩＩＩ内の拡大図である。FIG. 3 is an enlarged view within the frame III of FIG. 図４は、図３のＩＶ－ＩＶ方向断面図である。FIG. 4 is a sectional view taken in the IV-IV direction of FIG. 図５は、画像取得ステップにおける撮像条件の模式図である。FIG. 5 is a schematic diagram of imaging conditions in the image acquisition step. 図６は、条件取得ステップにおける撮像条件、合成用画像、適正撮像条件、合成画像の模式図である。FIG. 6 is a schematic diagram of an imaging condition, a composite image, an appropriate imaging condition, and a composite image in the condition acquisition step.
　以下、本開示の画像合成装置、画像取得装置、画像処理システム、画像処理方法の実施の形態について説明する。 Hereinafter, embodiments of the image compositing device, image acquisition device, image processing system, and image processing method of the present disclosure will be described.
　（画像処理システム）
　まず、本実施形態の画像処理システムの構成について説明する。図１に、画像処理システムの模式図を示す。図１に示すように、画像処理システム１は、画像合成装置２と、生産ライン３と、カメラスタンド４と、を備えている。カメラスタンド４は、生産ライン３外に配置されている。 (Image processing system)
First, the configuration of the image processing system of the present embodiment will be described. FIG. 1 shows a schematic diagram of an image processing system. As shown in FIG. 1, the image processing system 1 includes an image compositing device 2, a production line 3, and a camera stand 4. The camera stand 4 is arranged outside the production line 3.
　画像合成装置２は、制御装置２０と、入力装置（例えばキーボード、タッチパネルなど）２１と、表示装置（例えばディスプレイ、入力装置２１兼用のタッチパネルなど）２２と、を備えている。制御装置２０は、演算部（例えばＣＰＵなど）２００と、記憶部（例えばＲＯＭ、ＲＡＭなど）２０１と、を備えている。生産ライン３は、はんだ印刷機３０と、はんだ印刷検査機３１と、複数の電子部品実装機３２と、リフロー前基板外観検査機３３と、リフロー炉３４と、リフロー後基板外観検査機３５と、を備えている。画像合成装置２と各画像取得装置（はんだ印刷機３０、はんだ印刷検査機３１、電子部品実装機３２、リフロー前基板外観検査機３３、リフロー後基板外観検査機３５、カメラスタンド４）とは、双方向に通信可能である。基板は、生産ライン３を、上流側（はんだ印刷機３０側）から下流側（リフロー後基板外観検査機３５側）に向かって、搬送される。 The image compositing device 2 includes a control device 20, an input device (for example, a keyboard, a touch panel, etc.) 21 and a display device (for example, a display, a touch panel that also serves as the input device 21) 22. The control device 20 includes a calculation unit (for example, a CPU) 200 and a storage unit (for example, ROM, RAM, etc.) 201. The production line 3 includes a solder printing machine 30, a solder printing inspection machine 31, a plurality of electronic component mounting machines 32, a pre-reflow board appearance inspection machine 33, a reflow furnace 34, and a post-reflow board appearance inspection machine 35. It has. The image synthesizer 2 and each image acquisition device (solder printing machine 30, solder printing inspection machine 31, electronic component mounting machine 32, pre-reflow board appearance inspection machine 33, post-reflow board appearance inspection machine 35, camera stand 4) It is possible to communicate in both directions. The substrate is conveyed along the production line 3 from the upstream side (solder printing machine 30 side) to the downstream side (board appearance inspection machine 35 side after reflow).
　次に、本実施形態の画像取得装置の一例である、電子部品実装機３２の構成について説明する。図２に、本実施形態の電子部品実装機の部分上面図を示す。図３に、図２の枠ＩＩＩ内の拡大図を示す。図４に、図３のＩＶ－ＩＶ方向断面図を示す。電子部品実装機３２は、電子部品９１の実際の画像と、予め設定された検査データと、を比較することにより、吸着ノズル３２６に対する電子部品９１の吸着状態の検査を行う。 Next, the configuration of the electronic component mounting machine 32, which is an example of the image acquisition device of the present embodiment, will be described. FIG. 2 shows a partial top view of the electronic component mounting machine of the present embodiment. FIG. 3 shows an enlarged view in the frame III of FIG. FIG. 4 shows a sectional view in the IV-IV direction of FIG. The electronic component mounting machine 32 inspects the suction state of the electronic component 91 with respect to the suction nozzle 326 by comparing the actual image of the electronic component 91 with the preset inspection data.
　図１～図４に示すように、電子部品実装機３２は、制御装置３２０と、入力装置３２１と、画像処理装置３２２と、カメラユニット（パーツカメラ）３２３と、部品供給部３２４と、基板搬送部（ベルトコンベア）３２５と、吸着ノズル３２６と、を備えている。制御装置３２０は、演算部３２０ａと、記憶部３２０ｂと、を備えている。記憶部３２０ｂには、電子部品９１の撮像プログラム、検査データが格納されている。撮像プログラムは、後述の画像処理方法の画像取得ステップで実行される。検査データには、電子部品９１の寸法データ（例えばサイズ、色など）が含まれている。電子部品９１の寸法データは、後述の画像処理方法で取得される適正撮像条件を用いて電子部品９１を撮像することにより、取得される。また、後述するように、当該適正撮像条件は、電子部品実装機３２が電子部品９１を検査する際にも使用される。 As shown in FIGS. 1 to 4, the electronic component mounting machine 32 includes a control device 320, an input device 321, an image processing device 322, a camera unit (parts camera) 323, a component supply unit 324, and a substrate transfer. A unit (belt conveyor) 325 and a suction nozzle 326 are provided. The control device 320 includes a calculation unit 320a and a storage unit 320b. The storage unit 320b stores the imaging program and inspection data of the electronic component 91. The imaging program is executed in the image acquisition step of the image processing method described later. The inspection data includes dimensional data (for example, size, color, etc.) of the electronic component 91. The dimensional data of the electronic component 91 is acquired by imaging the electronic component 91 using the appropriate imaging conditions acquired by the image processing method described later. Further, as will be described later, the proper imaging condition is also used when the electronic component mounting machine 32 inspects the electronic component 91.
　図２にハッチングで示すように、基板搬送部３２５の一対のベルト３２５ａ間には、基板９が架設されている。基板９は、左側（上流側）から右側（下流側）に向かって、基板搬送部３２５を搬送される。図３～図４に示す吸着ノズル３２６は、電子部品９１を吸着した状態で、ＸＹロボット（図略）により、図２に示す部品供給部３２４と基板９との間を、前後左右方向（水平方向）に移動可能である。 As shown by hatching in FIG. 2, the substrate 9 is erected between the pair of belts 325a of the substrate transport portion 325. The substrate 9 is conveyed through the substrate conveying portion 325 from the left side (upstream side) to the right side (downstream side). The suction nozzle 326 shown in FIGS. 3 to 4 uses an XY robot (not shown) to suck the electronic component 91 between the component supply unit 324 and the substrate 9 shown in FIG. 2 in the front-back and left-right directions (horizontal direction). It is possible to move in the direction).
　図２に示すように、カメラユニット３２３は、部品供給部３２４と、基板搬送部３２５（つまり基板９）と、の間に配置されている。図３～図４に示すように、カメラユニット３２３は、部品供給部３２４から基板９に搬送される途中の電子部品９１を、下側から撮像する。カメラユニット３２３は、撮像装置（例えばＣＣＤカメラ、ＣＭＯＳカメラなど）３２３ａと、照明装置３２３ｂと、レンズなどの光学系（図略）と、を備えている。 As shown in FIG. 2, the camera unit 323 is arranged between the component supply unit 324 and the substrate transport unit 325 (that is, the substrate 9). As shown in FIGS. 3 to 4, the camera unit 323 captures an image of the electronic component 91 being conveyed from the component supply unit 324 to the substrate 9 from below. The camera unit 323 includes an imaging device (for example, a CCD camera, a CMOS camera, etc.) 323a, a lighting device 323b, and an optical system (not shown) such as a lens.
　照明装置３２３ｂは、側射照明部５０と、同軸落斜照明部５１と、ハーフミラー５２と、を備えている。ハーフミラー５２は、所定の透過率を有する反射鏡である。ハーフミラー５２は、撮像装置３２３ａの上側に配置されている。撮像装置３２３ａから上側に延在する垂線Ｌに対して、ハーフミラー５２は、４５°傾斜して配置されている。同軸落斜照明部５１は、ハーフミラー５２の左側（水平方向隣り）に配置されている。同軸落斜照明部５１の照明光は、ハーフミラー５２で９０°反射され、下側から電子部品９１に照射される。側射照明部５０は、ハーフミラー５２の上側に配置されている。側射照明部５０は、下底部に開口５００を有する、上向きのカップ状を呈している。側射照明部５０は、下段部５０ａと、中段部５０ｂと、上段部５０ｃと、を備えている。下段部５０ａ、中段部５０ｂ、上段部５０ｃは、各々、環状を呈している。下段部５０ａ、中段部５０ｂ、上段部５０ｃは、各々、複数の光源セルＣが周方向に連なることにより、構成されている。下段部５０ａの上側には中段部５０ｂが、中段部５０ｂの上側には上段部５０ｃが、各々、配置されている。下段部５０ａ、中段部５０ｂ、上段部５０ｃの照明光は、互いに異なる角度（垂線Ｌに対する角度）から、電子部品９１に照射される。撮像装置３２３ａは、電子部品９１を下側から撮像する。画像処理装置３２２は、撮像装置３２３ａが撮像した画像に所定の画像処理を施す。なお、はんだ印刷機３０、はんだ印刷検査機３１、リフロー前基板外観検査機３３、リフロー後基板外観検査機３５、カメラスタンド４は、各々、上述のカメラユニット３２３、画像処理装置３２２同様のカメラユニット、画像処理装置を備えている。 The lighting device 323b includes a side-illuminated lighting unit 50, a coaxial falling oblique lighting unit 51, and a half mirror 52. The half mirror 52 is a reflecting mirror having a predetermined transmittance. The half mirror 52 is arranged above the image pickup apparatus 323a. The half mirror 52 is arranged at an angle of 45 ° with respect to the perpendicular line L extending upward from the image pickup apparatus 323a. The coaxial falling oblique illumination unit 51 is arranged on the left side (horizontally adjacent to each other) of the half mirror 52. The illumination light of the coaxial oblique illumination unit 51 is reflected by the half mirror 52 at 90 ° and is applied to the electronic component 91 from below. The side-illuminating unit 50 is arranged above the half mirror 52. The side illuminating unit 50 has an upward cup shape having an opening 500 at the lower bottom portion. The side-illuminated illumination unit 50 includes a lower stage portion 50a, a middle stage portion 50b, and an upper stage portion 50c. The lower portion 50a, the middle portion 50b, and the upper portion 50c each have an annular shape. The lower portion 50a, the middle portion 50b, and the upper portion 50c are each formed by connecting a plurality of light source cells C in the circumferential direction. The middle stage portion 50b is arranged on the upper side of the lower stage portion 50a, and the upper stage portion 50c is arranged on the upper side of the middle stage portion 50b. The illumination light of the lower portion 50a, the middle portion 50b, and the upper portion 50c is applied to the electronic component 91 from different angles (angles with respect to the perpendicular line L). The image pickup apparatus 323a images the electronic component 91 from below. The image processing device 322 performs predetermined image processing on the image captured by the image pickup device 323a. The solder printing machine 30, the solder printing inspection machine 31, the pre-reflow substrate appearance inspection machine 33, the post-reflow substrate appearance inspection machine 35, and the camera stand 4 are the same camera units as the above-mentioned camera unit 323 and image processing device 322, respectively. , Equipped with an image processing device.
　（画像処理方法）
　次に、本実施形態の画像処理方法について説明する。上述したように、電子部品実装機３２の記憶部３２０ｂには、検査データが格納されている。検査データには、電子部品９１の寸法データが含まれている。本実施形態の画像処理方法は、当該寸法データの作成に最適な画像を撮像可能な適正撮像条件を取得するために、実行される。並びに、本実施形態の画像処理方法は、実際の基板９の生産時に、電子部品９１の検査に最適な画像を撮像可能な適正撮像条件を取得するために、実行される。本実施形態の画像処理方法は、画像取得ステップと、条件取得ステップと、を有する。画像取得ステップは、電子部品実装機３２により実行される。条件取得ステップは、画像合成装置２により実行される。 (Image processing method)
Next, the image processing method of the present embodiment will be described. As described above, the inspection data is stored in the storage unit 320b of the electronic component mounting machine 32. The inspection data includes dimensional data of the electronic component 91. The image processing method of the present embodiment is executed in order to acquire appropriate imaging conditions capable of capturing an optimum image for creating the dimensional data. In addition, the image processing method of the present embodiment is executed in order to acquire appropriate imaging conditions capable of capturing an optimum image for inspection of the electronic component 91 at the time of actual production of the substrate 9. The image processing method of the present embodiment includes an image acquisition step and a condition acquisition step. The image acquisition step is executed by the electronic component mounting machine 32. The condition acquisition step is executed by the image synthesizer 2.
　画像取得ステップにおいては、電子部品実装機３２が、カメラユニット３２３を用いて電子部品９１の撮像を行う。カメラユニット３２３は、同一の電子部品９１に対して、全ての撮像条件の合成用画像を取得する。図５に、画像取得ステップにおける撮像条件の模式図を示す。図５に示すように、照明装置３２３ｂの点灯部位（同軸落斜照明部５１、下段部５０ａ、中段部５０ｂ、上段部５０ｃ）は４箇所である。また、各点灯部位の点灯色は、各々、Ｒ（赤）、Ｇ（緑）、Ｂ（青）に切替可能である。また、各点灯部位の露光時間（点灯時間）は、各々、独立して１０パターンに切替可能である。また、各点灯部位の点灯強度は、各々、独立して５パターンに切替可能である。図５に示す例の場合、撮像条件の数は、合計６００（＝４（点灯部位）×３（Ｒ、Ｇ、Ｂ）×１０（露光時間）×５（点灯強度））である。このように、本開示における「異なる撮像条件」とは、複数の撮像条件間において、撮像条件に採用される撮像装置３２３ａや照明装置３２３ｂなどの要因（点灯部位、点灯色、露光時間、点灯強度など）のうち、少なくとも一つが異なることをいう。 In the image acquisition step, the electronic component mounting machine 32 images the electronic component 91 using the camera unit 323. The camera unit 323 acquires composite images of all imaging conditions for the same electronic component 91. FIG. 5 shows a schematic diagram of imaging conditions in the image acquisition step. As shown in FIG. 5, there are four lighting portions (coaxial falling oblique illumination portion 51, lower portion 50a, middle stage portion 50b, upper stage portion 50c) of the lighting device 323b. Further, the lighting color of each lighting portion can be switched to R (red), G (green), and B (blue), respectively. Further, the exposure time (lighting time) of each lighting portion can be independently switched to 10 patterns. Further, the lighting intensity of each lighting portion can be independently switched to 5 patterns. In the case of the example shown in FIG. 5, the total number of imaging conditions is 600 (= 4 (lighting portion) × 3 (R, G, B) × 10 (exposure time) × 5 (lighting intensity)). As described above, the "different imaging conditions" in the present disclosure include factors (lighting portion, lighting color, exposure time, lighting intensity) such as the imaging device 323a and the lighting device 323b adopted in the imaging conditions among the plurality of imaging conditions. Etc.), which means that at least one is different.
　作業者が図１に示す入力装置３２１を介して撮像指示を入力すると、演算部３２０ａは、記憶部３２０ｂの撮像プログラムを実行する。具体的には、演算部３２０ａは、図３～図４に示すように、まず、電子部品９１付きの吸着ノズル３２６を、撮像装置３２３ａの撮像エリアＥまで移動させる。次に、演算部３２０ａは、図５に示す撮像条件を、♯１から♯６００まで全て実行する。演算部３２０ａは、電子部品９１の合成用画像Ａ１～Ａ６００を取得する。演算部３２０ａは、記憶部３２０ｂに、合成用データ（撮像条件♯１～♯６００に関連付けられた状態の合成用画像Ａ１～Ａ６００のデータ）を格納する。例えば、合成用画像Ａ１は撮像条件♯１に、合成用画像Ａ２は撮像条件♯２に、各々関連付けられた状態で記憶部３２０ｂに格納される。演算部３２０ａは、合成用データを、画像合成装置２に送信する。 When the operator inputs an imaging instruction via the input device 321 shown in FIG. 1, the calculation unit 320a executes the imaging program of the storage unit 320b. Specifically, as shown in FIGS. 3 to 4, the calculation unit 320a first moves the suction nozzle 326 with the electronic component 91 to the image pickup area E of the image pickup apparatus 323a. Next, the calculation unit 320a executes all the imaging conditions shown in FIG. 5 from # 1 to # 600. The calculation unit 320a acquires the compositing images A1 to A600 of the electronic component 91. The calculation unit 320a stores the composition data (data of the composition images A1 to A600 in the state associated with the imaging conditions # 1 to # 600) in the storage unit 320b. For example, the composite image A1 is stored in the storage unit 320b in a state associated with the imaging condition # 1, and the composite image A2 is stored in the storage unit 320b in a state associated with the imaging condition # 2. The calculation unit 320a transmits the compositing data to the image compositing device 2.
　条件取得ステップにおいては、画像合成装置２が、受信した合成用データを用いて、合成画像を作成し、検査データ作成用の適正撮像条件を取得する。以下、一例として、作業者が、撮像条件♯１～♯４を組み合わせると最適な合成画像（鮮明な合成画像）が得られると考えた場合を想定する。図６に、条件取得ステップにおける撮像条件、合成用画像、適正撮像条件、合成画像の模式図を示す。なお、図６においては、点灯している点灯部位（同軸落斜照明部５１、下段部５０ａ、中段部５０ｂ、上段部５０ｃ）、電子部品９１の下面のうち明るい部分に点線ハッチングを施す。 In the condition acquisition step, the image synthesizer 2 creates a composite image using the received composite data, and acquires appropriate imaging conditions for creating inspection data. Hereinafter, as an example, it is assumed that the operator thinks that the optimum composite image (clear composite image) can be obtained by combining the imaging conditions # 1 to # 4. FIG. 6 shows a schematic diagram of an imaging condition, a composite image, an appropriate imaging condition, and a composite image in the condition acquisition step. In FIG. 6, dotted hatching is performed on the bright portion of the lower surface of the lighting portion (coaxial falling oblique illumination portion 51, lower portion 50a, middle stage portion 50b, upper stage portion 50c) and the electronic component 91 that are lit.
　作業者は、入力装置２１を介して、撮像条件♯１～♯４を入力する。演算部２００は、記憶部２０１から、撮像条件♯１～♯４に関連付けられた合成用画像Ａ１～Ａ４を読み出す。演算部２００は、合成用画像Ａ１～Ａ４を合成し、合成画像Ｂを作成する。演算部２００は、表示装置２２に合成画像Ｂを表示する。作業者は、表示装置２２の合成画像Ｂを確認する。作業者は、表示装置２２の合成画像Ｂが鮮明であり電子部品９１の寸法データの取得に適していると判断した場合、入力装置２１を介して、検査用画像として合成画像Ｂを承認する。演算部２００は、撮像条件♯１～♯４を合成し、適正撮像条件を作成する。演算部２００は、記憶部２０１に、適正撮像条件および合成画像Ｂを格納する。また、演算部２００は、適正データ（合成画像Ｂ、適正撮像条件）を、電子部品実装機３２に送信する。なお、条件取得ステップにおいて、作業者が検査用画像として合成画像Ｂを承認しない場合（合成画像Ｂが好適でない場合）、作業者は、合成用画像Ａ１～Ａ４に新たな合成用画像Ａ５～Ａ６００を追加したり、合成用画像Ａ１～Ａ４のうち少なくとも一部を交換したりして、表示装置２２上において、好適な合成画像Ｂを作成する。 The operator inputs the imaging conditions # 1 to # 4 via the input device 21. The calculation unit 200 reads out the composite images A1 to A4 associated with the imaging conditions # 1 to # 4 from the storage unit 201. The calculation unit 200 synthesizes the composite images A1 to A4 to create the composite image B. The calculation unit 200 displays the composite image B on the display device 22. The operator confirms the composite image B of the display device 22. When the operator determines that the composite image B of the display device 22 is clear and suitable for acquiring the dimensional data of the electronic component 91, the operator approves the composite image B as an inspection image via the input device 21. The calculation unit 200 synthesizes the imaging conditions # 1 to # 4 to create an appropriate imaging condition. The calculation unit 200 stores the appropriate imaging conditions and the composite image B in the storage unit 201. Further, the calculation unit 200 transmits appropriate data (composite image B, appropriate imaging conditions) to the electronic component mounting machine 32. In the condition acquisition step, when the worker does not approve the composite image B as the inspection image (when the composite image B is not suitable), the worker adds the new composite images A5 to A600 to the composite images A1 to A600. Is added, or at least a part of the composite images A1 to A4 is exchanged to create a suitable composite image B on the display device 22.
　基板９の生産に先立って、電子部品実装機３２の演算部３２０ａは、カメラユニット３２３を駆動して、受信した適正撮像条件を用いて電子部品９１を撮像し、電子部品９１の寸法データを取得する。そして、検査データを完成させる。実際の基板９の生産時に、演算部３２０ａは、カメラユニット３２３を駆動して、当該適正撮像条件を用いて、実際の電子部品９１を撮像する。そして、検査データと電子部品９１の実際の画像とを比較し、吸着ノズル３２６に対する電子部品９１の吸着状態を検査する。 Prior to the production of the substrate 9, the arithmetic unit 320a of the electronic component mounting machine 32 drives the camera unit 323 to image the electronic component 91 using the received appropriate imaging conditions, and acquires the dimensional data of the electronic component 91. To do. Then, the inspection data is completed. At the time of actual production of the substrate 9, the calculation unit 320a drives the camera unit 323 to image the actual electronic component 91 using the appropriate imaging conditions. Then, the inspection data is compared with the actual image of the electronic component 91, and the suction state of the electronic component 91 with respect to the suction nozzle 326 is inspected.
　（作用効果）
　次に、本実施形態の画像合成装置２、電子部品実装機３２、画像処理システム１、画像処理方法の作用効果について説明する。図６に示すように、本実施形態の画像合成装置２によると、複数の合成用画像Ａ１～Ａ４から、検査データの設定に適した合成画像Ｂを作成することができる。また、当該合成画像Ｂと同様の画像を実際に撮像することなく、当該合成画像Ｂを取得するための適正撮像条件を、簡単に取得することができる。 (Action effect)
Next, the operation and effect of the image synthesizer 2, the electronic component mounting machine 32, the image processing system 1, and the image processing method of the present embodiment will be described. As shown in FIG. 6, according to the image synthesizer 2 of the present embodiment, a composite image B suitable for setting inspection data can be created from a plurality of composite images A1 to A4. Further, it is possible to easily acquire appropriate imaging conditions for acquiring the composite image B without actually capturing an image similar to the composite image B.
　図５に示すように、本実施形態の電子部品実装機３２によると、複数の合成用画像Ａ１～Ａ６００を、撮像条件♯１～♯６００に関連付けられた状態で、自動的に取得することができる。このため、図６に示すように、合成画像Ｂ作成時に、簡単に適正撮像条件を取得することができる。 As shown in FIG. 5, according to the electronic component mounting machine 32 of the present embodiment, a plurality of composite images A1 to A600 can be automatically acquired in a state associated with imaging conditions # 1 to # 600. it can. Therefore, as shown in FIG. 6, appropriate imaging conditions can be easily acquired when the composite image B is created.
　図５～図６に示すように、本実施形態の画像処理システム１および画像処理方法によると、画像取得ステップで、電子部品実装機３２が自動的に取得した複数の合成用画像Ａ１～Ａ４を、条件取得ステップで、画像合成装置２が合成することにより、合成画像Ｂを作成することができる。また、条件取得ステップで、画像合成装置２が合成用画像Ａ１～Ａ４に関連付けられた撮像条件♯１～♯４を合成することにより、適正撮像条件を取得することができる。 As shown in FIGS. 5 to 6, according to the image processing system 1 and the image processing method of the present embodiment, a plurality of compositing images A1 to A4 automatically acquired by the electronic component mounting machine 32 in the image acquisition step. , The composite image B can be created by the image compositing device 2 compositing in the condition acquisition step. Further, in the condition acquisition step, the image compositing device 2 synthesizes the imaging conditions # 1 to # 4 associated with the compositing images A1 to A4, so that the appropriate imaging conditions can be acquired.
　図１に示す画像合成装置２は、条件取得ステップにおいて、電子部品実装機３２に、適正データ（合成画像Ｂ、適正撮像条件）を送信する。電子部品実装機３２は、適正撮像条件で電子部品９１を撮像し、電子部品９１の寸法データを取得することができる。そして、電子部品実装機３２は、電子部品９１の検査データを完成させることができる。また、電子部品実装機３２は、基板９の生産時に、電子部品９１を検査する際に、適正撮像条件を用いて電子部品９１を撮像することができる。適正撮像条件を用いると、合成画像Ｂ（電子部品９１の形状、色などを判別しやすい画像）と同様の画像を取得することができる。このため、電子部品９１の検査精度（合否判定精度）を向上させることができる。 The image synthesizer 2 shown in FIG. 1 transmits appropriate data (composite image B, appropriate imaging conditions) to the electronic component mounting machine 32 in the condition acquisition step. The electronic component mounting machine 32 can image the electronic component 91 under appropriate imaging conditions and acquire the dimensional data of the electronic component 91. Then, the electronic component mounting machine 32 can complete the inspection data of the electronic component 91. In addition, the electronic component mounting machine 32 can image the electronic component 91 using appropriate imaging conditions when inspecting the electronic component 91 during the production of the substrate 9. If appropriate imaging conditions are used, it is possible to acquire an image similar to the composite image B (an image in which the shape, color, etc. of the electronic component 91 can be easily discriminated). Therefore, the inspection accuracy (pass / fail determination accuracy) of the electronic component 91 can be improved.
　（その他）
　以上、本開示の画像合成装置、画像取得装置、画像処理システム、画像処理方法の実施の形態について説明した。しかしながら、実施の形態は上記形態に特に限定されるものではない。当業者が行いうる種々の変形的形態、改良的形態で実施することも可能である。 (Other)
The embodiments of the image compositing device, the image acquisition device, the image processing system, and the image processing method of the present disclosure have been described above. However, the embodiment is not particularly limited to the above embodiment. It is also possible to carry out in various modified forms and improved forms that can be performed by those skilled in the art.
　図５に示す撮像条件に採用される撮像装置３２３ａや照明装置３２３ｂなどの要因（点灯部位、点灯色、露光時間、点灯強度など）は特に限定しない。また、各点灯部位（同軸落斜照明部５１、下段部５０ａ、中段部５０ｂ、上段部５０ｃ）の点灯パターンは特に限定しない。図３に示す光源セルＣ単位で、各点灯部位を点灯させてもよい。図３に枠Ｄで示すように、径方向に隣り合う複数の光源セルＣ単位で、各点灯部位を点灯させてもよい。勿論、周方向に隣り合う複数の光源セルＣ単位で、各点灯部位を点灯させてもよい。また、露光時間のパターン数、点灯強度のパターン数は特に限定しない。点灯部位の配置数は特に限定しない。３箇所以下や５箇所以上であってもよい。図３に示す下段部５０ａ、中段部５０ｂ、上段部５０ｃの配置形状、配置段数は特に限定しない。配置形状は、多角形（四角形、六角形、八角形など）環状、円環状であってもよい。配置段数は、２段以下、４段以上であってもよい。 Factors (lighting site, lighting color, exposure time, lighting intensity, etc.) such as the image pickup device 323a and the lighting device 323b adopted in the imaging conditions shown in FIG. 5 are not particularly limited. Further, the lighting pattern of each lighting portion (coaxial falling oblique illumination portion 51, lower portion 50a, middle stage portion 50b, upper stage portion 50c) is not particularly limited. Each lighting portion may be lit in units of the light source cell C shown in FIG. As shown by the frame D in FIG. 3, each lighting portion may be lit in units of a plurality of light source cells C adjacent to each other in the radial direction. Of course, each lighting portion may be lit in units of a plurality of light source cells C adjacent to each other in the circumferential direction. The number of exposure time patterns and the number of lighting intensity patterns are not particularly limited. The number of lighting parts arranged is not particularly limited. It may be 3 or less or 5 or more. The arrangement shape and the number of arrangement stages of the lower stage portion 50a, the middle stage portion 50b, and the upper stage portion 50c shown in FIG. 3 are not particularly limited. The arrangement shape may be polygonal (quadrangle, hexagon, octagon, etc.) ring or ring. The number of arrangement stages may be 2 or less and 4 or more.
　電子部品実装機３２は、画像取得ステップにおいて、４箇所の点灯部位が全て消灯している状態の画像を、差分用画像として取得してもよい。画像合成装置２は、条件取得ステップにおいて、図６に示す合成画像Ｂから差分用画像を除去してもよい。こうすると、全消灯時の画像に起因するノイズを、合成画像Ｂから排除することができる。このため、より鮮明な合成画像Ｂを取得することができる。 The electronic component mounting machine 32 may acquire an image in a state where all four lighting parts are turned off in the image acquisition step as a difference image. The image compositing device 2 may remove the difference image from the composite image B shown in FIG. 6 in the condition acquisition step. By doing so, the noise caused by the image when all the lights are turned off can be excluded from the composite image B. Therefore, a clearer composite image B can be obtained.
　図１に示す画像合成装置２と、画像取得装置（はんだ印刷機３０、はんだ印刷検査機３１、電子部品実装機３２、リフロー前基板外観検査機３３、リフロー後基板外観検査機３５、カメラスタンド４）と、の通信方法は特に限定しない。有線でも無線でもよい。また、画像合成装置２と、画像取得装置と、は通信不可能でもよい。この場合、データ（例えば、合成用データ（図５に示す撮像条件♯１～♯６００に関連付けられた状態の合成用画像Ａ１～Ａ６００のデータ）、適正データ（合成画像Ｂ、適正撮像条件）など）の送受は、搬送可能な記憶媒体（フラッシュメモリ（ＳＳＤ、ＵＳＢフラッシュ、ＳＤカードなど）、ハードディスク、光ディスク（ＣＤ、ＤＶＤ、ブルーレイディスクなど）を介して行えばよい。また、データの送受を、クラウドストレージ（オンラインストレージ）を介して行ってもよい。 The image synthesizer 2 shown in FIG. 1 and an image acquisition device (solder printing machine 30, solder printing inspection machine 31, electronic component mounting machine 32, pre-reflow board appearance inspection machine 33, post-reflow board appearance inspection machine 35, camera stand 4). ) And, the communication method is not particularly limited. It may be wired or wireless. Further, the image synthesizer 2 and the image acquisition device may not be able to communicate with each other. In this case, data (for example, composite data (data of composite images A1 to A600 in a state associated with imaging conditions # 1 to # 600 shown in FIG. 5), appropriate data (composite image B, appropriate imaging conditions), etc. ) May be transmitted / received via a transportable storage medium (flash memory (SSD, USB flash, SD card, etc.), hard disk, optical disk (CD, DVD, Blu-ray disc, etc.). It may be done via cloud storage (online storage).
　画像合成装置２と画像取得装置とは、同一の場所に配置されていても、異なる場所に配置されていてもよい。例えば、画像合成装置２と画像取得装置とは、同一の工場に配置されていてもよい。また、画像合成装置２と画像取得装置とは、画像合成装置２または画像取得装置として、一体化されていてもよい。また、画像合成装置２と画像取得装置とは、同一のユーザー（画像合成装置２、画像取得装置のユーザー）内において、異なる場所（例えば事務所と工場）に分かれて配置されていてもよい。また、画像合成装置２と画像取得装置とは、画像取得装置のユーザーとメーカーとに分かれて配置されていてもよい。すなわち、ユーザー所有の画像取得装置の適正撮像条件や合成画像Ｂを、メーカー所有の画像合成装置２で、提供してもよい。この場合、ユーザー数は単数であっても複数であってもよい。 The image compositing device 2 and the image acquisition device may be arranged in the same place or in different places. For example, the image synthesizer 2 and the image acquisition device may be arranged in the same factory. Further, the image composition device 2 and the image acquisition device may be integrated as the image composition device 2 or the image acquisition device. Further, the image compositing device 2 and the image acquisition device may be separately arranged in different places (for example, an office and a factory) within the same user (user of the image compositing device 2 and the image acquisition device). Further, the image compositing device 2 and the image acquisition device may be arranged separately for the user of the image acquisition device and the manufacturer. That is, the proper imaging conditions of the user-owned image acquisition device and the composite image B may be provided by the manufacturer-owned image synthesizer 2. In this case, the number of users may be singular or plural.
　画像合成装置２および画像取得装置のうち少なくとも一方と、合成画像Ｂや適正撮像条件を実際に使用する装置（実行装置）と、は同一であっても異なっていてもよい。また、適正データ（合成画像Ｂ、適正撮像条件）は、合成画像Ｂ、適正撮像条件のうち、少なくとも一方を備えていればよい。例えば、適正データは、合成画像Ｂのみであっても、適正撮像条件のみであってもよい。適正データが適正撮像条件を備える場合、当該適正撮像条件の使用目的（用途）は特に限定しない。例えば、電子部品実装機３２が実行装置である場合は、基板９の生産時に、電子部品９１を撮像し、検査用の画像を取得する際に、適正撮像条件を使用すればよい。また、電子部品９１の検査データを作成する際に（電子部品９１の寸法データを取得する際に）、適正撮像条件を使用すればよい。ただし、電子部品９１の寸法データは、実際に電子部品９１を撮像しなくても、電子部品９１のＣＡＤデータなどから取得することができる。このため、電子部品実装機３２は、少なくとも、基板９の生産時に、電子部品９１を撮像し、検査用の画像を取得する際に、適正撮像条件を使用すればよい。また、はんだ印刷機３０が実行装置である場合は、基板９のマークの検査用として、合成画像（基板本体と、基板本体の位置決めマークと、を判別しやすい画像）と同様の画像を取得するために、適正撮像条件を用いればよい。また、はんだ印刷検査機３１が実行装置である場合は、はんだの検査用として、合成画像（例えば、基板本体と、はんだと、を判別しやすい画像）と同様の画像を取得するために、適正撮像条件を用いればよい。また、リフロー前基板外観検査機３３やリフロー後基板外観検査機３５が実行装置である場合は、基板９の外観の検査用として、合成画像（例えば、基板本体と、パッド（ランド）と、はんだと、電子部品と、を判別しやすい画像）と同様の画像を取得するために、適正撮像条件を用いればよい。カメラスタンド４が実行装置である場合は、当該カメラスタンド４の用途（例えば、はんだ印刷機３０、はんだ印刷検査機３１、電子部品実装機３２、リフロー前基板外観検査機３３、リフロー後基板外観検査機３５などのカメラユニット３２３の代用など）に応じて、適正撮像条件を用いればよい。 At least one of the image compositing device 2 and the image acquisition device and the device (execution device) that actually uses the composite image B and the appropriate imaging conditions may be the same or different. Further, the appropriate data (composite image B, proper imaging condition) may include at least one of the composite image B and the proper imaging condition. For example, the appropriate data may be only the composite image B or only the appropriate imaging conditions. When the appropriate data has the appropriate imaging conditions, the purpose (use) of the appropriate imaging conditions is not particularly limited. For example, when the electronic component mounting machine 32 is an execution device, appropriate imaging conditions may be used when the electronic component 91 is imaged at the time of production of the substrate 9 and an image for inspection is acquired. Further, when creating the inspection data of the electronic component 91 (when acquiring the dimensional data of the electronic component 91), the appropriate imaging conditions may be used. However, the dimensional data of the electronic component 91 can be acquired from the CAD data of the electronic component 91 or the like without actually imaging the electronic component 91. Therefore, the electronic component mounting machine 32 may use appropriate imaging conditions at least when the electronic component 91 is imaged during the production of the substrate 9 and the image for inspection is acquired. Further, when the solder printing machine 30 is an execution device, an image similar to a composite image (an image in which the substrate main body and the positioning mark of the substrate main body can be easily distinguished) is acquired for inspection of the mark on the substrate 9. Therefore, appropriate imaging conditions may be used. Further, when the solder printing inspection machine 31 is an execution device, it is appropriate to acquire an image similar to a composite image (for example, an image in which the substrate body and the solder can be easily distinguished) for the inspection of the solder. The imaging conditions may be used. When the pre-reflow substrate appearance inspection machine 33 and the post-reflow substrate appearance inspection machine 35 are execution devices, a composite image (for example, a substrate body, a pad (land), and solder) is used for inspecting the appearance of the substrate 9. In order to acquire an image similar to the image) in which it is easy to distinguish between the electronic component and the electronic component, appropriate imaging conditions may be used. When the camera stand 4 is an execution device, the applications of the camera stand 4 (for example, a solder printing machine 30, a solder printing inspection machine 31, an electronic component mounting machine 32, a pre-reflow board appearance inspection machine 33, a post-reflow board appearance inspection) Appropriate imaging conditions may be used according to the substitute of the camera unit 323 of the machine 35 or the like).
　画像取得ステップにおける合成用画像Ａ１～Ａ６００の取得数は、２枚以上であればよい。条件取得ステップにおいては、同一の合成用画像を複数枚合成してもよい。例えば、図５の合成用画像Ａ１を２枚合成すると、点灯強度２（＝１＋１）の合成画像を取得することができる。条件取得ステップにおける、合成画像Ｂや適正撮像条件の送信先は、画像取得装置でなくてもよい。例えば、送信先は、画像取得装置以外の通信端末（ＰＣ、スマートフォン、タブレット型ＰＣなど）であってもよい。 The number of composite images A1 to A600 acquired in the image acquisition step may be two or more. In the condition acquisition step, a plurality of the same composite images may be composited. For example, when two composite images A1 of FIG. 5 are combined, a composite image having a lighting intensity of 2 (= 1 + 1) can be obtained. The destination of the composite image B and the appropriate imaging conditions in the condition acquisition step does not have to be the image acquisition device. For example, the transmission destination may be a communication terminal (PC, smartphone, tablet PC, etc.) other than the image acquisition device.
　図１に示す画像処理システム１の用途は限定しない。例えば、基板９の生産開始前に、基板９の生産プログラムを作成する際に用いることができる。また、基板９の生産途中で、基板構成物が変更される場合も、画像処理システム１を用いることができる。例えば、基板９の生産途中で、任意の電子部品９１が、当該電子部品９１と同種かつ異メーカーの電子部品９１に、変更される場合がある。この場合、変更前後で電子部品９１の色などが変わってしまう場合がある。このような場合であっても、画像処理システム１を用いると、変更後の電子部品９１に応じた合成画像Ｂや適正撮像条件を取得することができる。 The use of the image processing system 1 shown in FIG. 1 is not limited. For example, it can be used when creating a production program for the substrate 9 before the start of production for the substrate 9. Further, the image processing system 1 can be used even when the substrate component is changed during the production of the substrate 9. For example, in the middle of production of the substrate 9, an arbitrary electronic component 91 may be changed to an electronic component 91 of the same type as the electronic component 91 and of a different manufacturer. In this case, the color of the electronic component 91 may change before and after the change. Even in such a case, if the image processing system 1 is used, it is possible to acquire the composite image B and the appropriate imaging conditions according to the changed electronic component 91.
　本開示の「基板構成物」には、基板９を構成するあらゆる物が含まれる。例えば、基板本体、パッド、電子部品９１、はんだ、フラックス、位置決めマークなどが含まれる。本開示の「適正撮像条件」は、最適撮像条件でなくてもよい。個々の合成用画像の撮像条件に対して、画像の使用目的を達成しやすい撮像条件であればよい。例えば、図６に示す合成画像Ｂ用の適正撮像条件は、最適撮像条件でなくてもよい。図５に示す個々の合成用画像Ａ１～Ａ６００の撮像条件♯１～♯６００に対して、画像の使用目的（寸法データの取得、電子部品９１の検査）を達成しやすい撮像条件であればよい。少なくとも、適正撮像条件を用いて、画像の使用目的を達成できればよい。 The "board component" of the present disclosure includes everything that constitutes the board 9. For example, a substrate body, a pad, an electronic component 91, a solder, a flux, a positioning mark, and the like are included. The "appropriate imaging condition" of the present disclosure does not have to be the optimum imaging condition. The imaging conditions may be such that the purpose of use of the image can be easily achieved with respect to the imaging conditions of the individual composite images. For example, the proper imaging condition for the composite image B shown in FIG. 6 does not have to be the optimum imaging condition. For the imaging conditions # 1 to # 600 of the individual composite images A1 to A600 shown in FIG. 5, the imaging conditions may be sufficient to easily achieve the purpose of use of the image (acquisition of dimensional data, inspection of electronic component 91). .. At the very least, it suffices if the intended use of the image can be achieved by using appropriate imaging conditions.
　１：画像処理システム、２：画像合成装置、３：生産ライン、４：カメラスタンド（画像取得装置）、９：基板、２０：制御装置、２１：入力装置、２２：表示装置、３０：はんだ印刷機（画像取得装置）、３１：はんだ印刷検査機（画像取得装置）、３２：電子部品実装機（画像取得装置）、３３：リフロー前基板外観検査機（画像取得装置）、３４：リフロー炉、３５：リフロー後基板外観検査機（画像取得装置）、５０：側射照明部、５０ａ：下段部、５０ｂ：中段部、５０ｃ：上段部、５１：同軸落斜照明部、５２：ハーフミラー、９１：電子部品（基板構成物）、２００：演算部、２０１：記憶部、３２０：制御装置、３２０ａ：演算部、３２０ｂ：記憶部、３２１：入力装置、３２２：画像処理装置、３２３：カメラユニット、３２３ａ：撮像装置、３２３ｂ：照明装置、３２４：部品供給部、３２５：基板搬送部、３２５ａ：ベルト、３２６：吸着ノズル、５００：開口、Ａ１～Ａ６００：合成用画像、Ｂ：合成画像、Ｃ：光源セル、Ｅ：撮像エリア、♯１～♯６００：撮像条件 1: Image processing system 2: Image compositing device 3: Production line 4: Camera stand (image acquisition device), 9: Board, 20: Control device, 21: Input device, 22: Display device, 30: Solder printing Machine (image acquisition device), 31: Solder printing inspection machine (image acquisition device), 32: Electronic component mounting machine (image acquisition device), 33: Pre-reflow board appearance inspection machine (image acquisition device), 34: Reflow furnace, 35: Substrate appearance inspection machine after reflow (image acquisition device), 50: Side-illuminated illumination unit, 50a: Lower stage, 50b: Middle stage, 50c: Upper stage, 51: Coaxial tilted illumination unit, 52: Half mirror, 91 : Electronic component (board component), 200: Calculation unit, 201: Storage unit, 320: Control device, 320a: Calculation unit, 320b: Storage unit, 321: Input device, 322: Image processing device, 323: Camera unit, 323a: Imaging device, 323b: Lighting device, 324: Parts supply unit, 325: Substrate transport unit, 325a: Belt, 326: Adsorption nozzle, 500: Opening, A1-A600: Composite image, B: Composite image, C: Light source cell, E: Imaging area, # 1 to # 600: Imaging conditions

Claims (5)

  1. 　異なる撮像条件で撮像された同一の基板構成物に関する複数の合成用画像から合成画像を作成し、
    　前記合成画像の作成に用いた複数の前記合成用画像の前記撮像条件から、適正撮像条件を取得する画像合成装置。     Create a composite image from multiple composite images of the same substrate configuration captured under different imaging conditions.
    An image compositing device that acquires appropriate imaging conditions from the imaging conditions of a plurality of compositing images used for creating the composite image.
  2. 　異なる撮像条件で同一の基板構成物を撮像し、前記撮像条件に関連付けられた前記基板構成物の複数の合成用画像を、自動的に取得する画像取得装置。 An image acquisition device that images the same substrate component under different imaging conditions and automatically acquires a plurality of composite images of the substrate component associated with the imaging conditions.
  3. 　請求項１に記載の画像合成装置と、請求項２に記載の画像取得装置と、を備える画像処理システムであって、
    　前記画像取得装置は、前記画像合成装置に、撮像条件に関連付けられた基板構成物の複数の合成用画像を送信し、
    　前記画像合成装置は、受信した複数の前記合成用画像を用いて合成画像を作成し、前記合成画像の作成に用いた複数の前記合成用画像の前記撮像条件から、適正撮像条件を取得する画像処理システム。     An image processing system including the image compositing device according to claim 1 and the image acquisition device according to claim 2.
    The image acquisition device transmits a plurality of compositing images of the substrate components associated with the imaging conditions to the image compositing device.
    The image compositing device creates a composite image using the plurality of received composite images, and acquires appropriate imaging conditions from the imaging conditions of the plurality of composite images used for creating the composite image. Processing system.
  4. 　前記画像合成装置は、前記画像取得装置に、前記合成画像および前記適正撮像条件のうち、少なくとも一方を送信する請求項３に記載の画像処理システム。 The image processing system according to claim 3, wherein the image synthesizer transmits at least one of the composite image and the appropriate imaging conditions to the image acquisition device.
  5. 　異なる撮像条件で同一の基板構成物を撮像し、前記撮像条件に関連付けられた前記基板構成物の複数の合成用画像を、自動的に取得する画像取得ステップと、
    　取得された複数の前記合成用画像を用いて合成画像を作成し、前記合成画像の作成に用いた複数の前記合成用画像の前記撮像条件から、適正撮像条件を取得する条件取得ステップと、
    を有する画像処理方法。     An image acquisition step in which the same substrate component is imaged under different imaging conditions and a plurality of composite images of the substrate component associated with the imaging conditions are automatically acquired.
    A condition acquisition step of creating a composite image using the acquired plurality of the composite images and acquiring appropriate imaging conditions from the imaging conditions of the plurality of composite images used for creating the composite image.
    Image processing method having.
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