WO2020237753A1 - 有机发光二极管显示面板及其封装方法 - Google Patents

有机发光二极管显示面板及其封装方法 Download PDF

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Publication number
WO2020237753A1
WO2020237753A1 PCT/CN2019/091999 CN2019091999W WO2020237753A1 WO 2020237753 A1 WO2020237753 A1 WO 2020237753A1 CN 2019091999 W CN2019091999 W CN 2019091999W WO 2020237753 A1 WO2020237753 A1 WO 2020237753A1
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layer
emitting diode
organic light
light emitting
display panel
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PCT/CN2019/091999
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English (en)
French (fr)
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杨中国
魏锋
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深圳市华星光电半导体显示技术有限公司
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Publication of WO2020237753A1 publication Critical patent/WO2020237753A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment

Definitions

  • the invention relates to the field of display technology, in particular to an organic light emitting diode display panel and a packaging method thereof.
  • the more feasible packaging technology is thin film packaging and surface bonding packaging, and surface bonding packaging is mainly based on surface bonding adhesive (face sealant) bonding barrier film (cover barrier film) And the flexible substrate, and the process of curing the glue, which mainly uses roller bonding or general vacuum bonding process.
  • the surface lamination adhesive must be attached to the barrier film and the flexible substrate, there are two release film removal and two bonding processes, so it is easy to produce bubbles and other defects.
  • TFE Thin film encapsulation
  • IJP ink-jet printing
  • the surface bonding adhesive must be bonded to the barrier film and the flexible substrate. Two times the release film is removed and two times the bonding process, it is easy to produce bubbles and other defects. In addition, it is necessary to improve the reliability of the package structure.
  • an organic light emitting diode display panel packaging method including:
  • a thin film transistor layer is made on the oxide film; a barrier wall is arranged on the thin film transistor layer to form an enclosure; an organic light-emitting diode device layer is made on the thin film transistor layer, the cofferdam Walls enclose the organic light-emitting diode device layer; cover the upper surface and surrounding side surfaces of the organic light-emitting diode device layer with a first water blocking layer; forming a buffer layer on the first water blocking layer; in The upper surface and surrounding surface of the buffer layer and the uncovered area of the upper surface of the first water-blocking layer are covered with a second water-blocking layer; the space in the enclosure is filled with an encapsulating material; a first Barrier film, adsorb the first barrier film with an electronic suction cup, tear off the release film of the first barrier film, and then attach the first barrier
  • the substrate is a glass substrate.
  • the oxide is silicon oxide or oxynitride.
  • the cofferdam wall is formed by inkjet printing a photocurable resin.
  • the first water blocking layer is formed by low temperature plasma chemical vapor deposition.
  • the buffer layer is formed by inkjet printing a thermosetting polymer material.
  • the second water blocking layer is formed by low temperature plasma chemical vapor deposition.
  • the packaging material layer is formed by inkjet printing a thermosetting polymer material.
  • the present invention also provides an organic light emitting diode display panel, which includes:
  • the first water blocking layer, the first resistance A water layer covers the upper surface and surrounding side surfaces of the organic light emitting diode device layer;
  • a buffer layer the buffer layer is disposed on the first water blocking layer;
  • an encapsulation material layer which fills the space in the enclosure;
  • the flexible substrate is composed of polyimide.
  • a layer of silicon oxide or oxynitride film is further covered between the flexible substrate and the thin film transistor layer.
  • the cofferdam wall is a double-layer structure formed by an inner wall and an outer wall.
  • the height of the dam wall is greater than or equal to the sum of the height of the organic light emitting diode device layer, the first water blocking layer, the buffer layer, and the second water blocking layer.
  • the area of the upper surface of the buffer layer is smaller than the area of the upper surface of the first water blocking layer.
  • the cofferdam wall is composed of light curing resin.
  • the present invention also proposes another organic light emitting diode display panel, and the organic light emitting diode display panel includes:
  • the flexible substrate is composed of polyimide; the thin-film transistor layer is arranged on the flexible substrate; the barrier wall is arranged on the thin-film transistor layer to form an enclosure.
  • the barrier wall is a double-layer structure composed of an inner wall and an outer wall; an organic light emitting diode device layer is arranged on the thin film transistor layer, and the barrier wall encloses the organic light emitting diode device layer; first A water blocking layer, covering the upper surface and surrounding side surfaces of the organic light-emitting diode device layer; a buffer layer, arranged on the first water blocking layer; a second water blocking layer, covering the buffer layer The upper surface and the surrounding side surface and the uncovered area of the upper surface of the first water blocking layer; the packaging material layer fills the space in the enclosure; the first barrier film is arranged between the cofferdam wall and the packaging material layer On; and a second barrier film disposed under the flexible substrate.
  • a layer of silicon oxide or oxynitride film is further covered between the flexible substrate and the thin film transistor layer.
  • the height of the dam wall is greater than or equal to the sum of the height of the organic light emitting diode device layer, the first water blocking layer, the buffer layer, and the second water blocking layer.
  • the area of the upper surface of the buffer layer is smaller than the area of the upper surface of the first water blocking layer.
  • the cofferdam wall is composed of light curing resin.
  • the buffer layer of the organic light emitting diode panel of the present invention is between the first water blocking layer and the second water blocking layer, which can reduce the stress between the first water blocking layer and the second water blocking layer, and has a double-layer structure
  • the cofferdam wall can reduce the chance of moisture intrusion, thereby improving the reliability of the device;
  • the present invention uses the film packaging inkjet technology in the packaging of the flexible organic light emitting diode panel in combination with the vacuum bonding process of the electronic suction cup to replace The conventional surface bonding glue and roller or general vacuum bonding process significantly improves the packaging yield of large-size flexible organic light emitting diode panels.
  • Figure 1 is a flow chart of the packaging of the organic light emitting diode display panel of the present invention.
  • FIG. 2 is a schematic cross-sectional view of a preferred embodiment of the organic light emitting diode display panel of the present invention
  • Figure 3 is a schematic diagram of the first barrier film bonding step of the organic light emitting diode display panel of the present invention.
  • FIG. 4 is a schematic diagram of the bonding step of the second barrier film of the organic light emitting diode display panel of the present invention.
  • the organic light emitting diode display panel of the present invention includes: a flexible substrate 200 with a silicon oxide film 2001 deposited on the surface; a thin film transistor layer 201, the thin film transistor layer 201 is disposed on the flexible substrate 200 Above; the cofferdam wall 202 is arranged along the surrounding area above the thin film transistor layer 201 to form an enclosure, and the cofferdam wall 202 is a double-layer structure composed of an inner wall 2021 and an outer wall 2022 Organic light-emitting diode device layer 203, the organic light-emitting diode device layer 203 is fabricated on the thin film transistor layer 201, the barrier wall 202 encloses the organic light-emitting diode device layer 203; the first water blocking layer 204, the first water blocking layer 204 covers the upper surface and surrounding side surfaces of the organic light emitting diode device layer 203; a buffer layer 205, the buffer layer 205 is disposed on the first water blocking layer 204 A second water blocking layer 206, the second
  • the packaging process of the above-mentioned organic light-emitting diode display panel is described in detail as follows: a glass substrate 100 is provided, a polyimide liquid is coated on the glass substrate 100, and the polyamide is cured by baking or the like. Imine solution to form a polyimide film 200; then a silicon oxide film 2001 is deposited on the polyimide film; then a film is coated on the silicon oxide film 2001, photoresist liquid, The thin film transistor layer 201 is produced by exposure, development, and etching methods; then two circles of photocurable resin are sprayed on the surface of the surrounding area on the thin film transistor layer 201 by inkjet printing to form a thickness of about 2 millimeters (mm).
  • the cofferdam wall 202 with the double-layer structure of the inner wall 2021 and the outer wall 2022 forms an enclosure; then, the thin film transistor layer 201 is made by coating photoresist liquid, exposure, development, etching, and evaporation.
  • the organic light-emitting diode device layer 203, the barrier wall 202 encloses the organic light-emitting diode device layer 203; then the upper surface and the surrounding side surface of the organic light-emitting diode device layer 203 are subjected to low-temperature plasma chemical vapor deposition Cover a first water-blocking layer 204; then on the first water-blocking layer 204 by ink-jet printing thermosetting polymer material to form a buffer layer 205; then on the upper and surrounding surfaces of the buffer layer 205 and the The uncovered area on the upper surface of the first water-blocking layer 204 is covered with a second water-blocking layer 206 by low-temperature plasma chemical vapor deposition; and then the space in the enclosure is filled by in
  • a first barrier film 208 is then provided, and the first barrier film 208 is vacuum-adsorbed by the electronic suction cup 10, and after the release film of the first barrier film 208 is removed, the first barrier film 208 is attached to the surface of the dam wall 202 and the encapsulation material layer 207 in a vacuum environment; then the polyimide film 200 is separated from the glass substrate 100.
  • a second barrier film 209 is provided, and then the second barrier film 209 is vacuum sucked by the electronic suction cup 10, and the second barrier film 209 is removed.
  • the second barrier film 209 is attached to the lower surface of the polyimide film 200 in a vacuum environment, and finally the adhesive is cured by ultraviolet light irradiation or other heating methods To complete the package.
  • the buffer layer 205 of the organic light emitting diode panel of the present invention is located between the first water blocking layer 204 and the second water blocking layer 206, which can reduce the stress between the first water blocking layer 204 and the second water blocking layer 206, and
  • the upper cofferdam wall 202 with a double-layer structure can reduce the chance of moisture intrusion, thereby improving the reliability of the device;
  • the present invention uses thin-film packaging inkjet technology in the packaging of flexible organic light-emitting diode panels in combination with the use of electronic suction cups.
  • the vacuum bonding process replaces the conventional surface bonding glue and rollers or general vacuum bonding process, thereby significantly improving the packaging yield of large-size flexible organic light-emitting diode panels.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种有机发光二极管显示面板及其封装方法被提供。所述有机发光二极管显示面板包括：柔性衬底（200）；薄膜电晶体层（201），设置于所述柔性衬底（200）之上；围堰墙（202），设置于所述薄膜电晶体层（201）之上，形成一围蔽；有机发光二极管器件层（203），设置于所述薄膜电晶体层（201）之上；第一阻水层（204），覆于所述有机发光二极管器件层（203）的上表面及周围侧边表面；缓冲层（205），设置于所述第一阻水层（204）之上；第二阻水层（206），覆于所述缓冲层（205）的上表面及周围侧边表面；封装材料层（207），充填所述围蔽内的空间；第一阻隔膜（208），设置于所述围堰墙（202）及封装材料层（207）之上；以及第二阻隔膜（209），设置于所述柔性衬底（200）之下。所述封装方法结合喷墨打印技术和使用电子吸盘的贴合工艺。

Description

有机发光二极管显示面板及其封装方法 技术领域
本发明涉及显示技术领域,具体涉及有机发光二极管显示面板及其封装方法。
 背景技术
目前对于大尺寸柔性有机发光二极管显示面板,比较可行的封装技术是薄膜封装配合面贴合封装,面贴合封装主要是以面贴合胶材(face sealant)贴合阻隔膜(cover barrier film)和柔性基板,并让胶材固化的过程,其主要是采用滚轮贴合或一般真空贴合工艺。
由于面贴合胶材既要与阻隔膜贴合,又要与柔性基板贴合,有两次离型膜撕除和两次贴合过程,因而容易有气泡等不良的产生。
薄膜封装(thin film encapsulation, TFE)和喷墨打印(ink-jet printing, IJP)技术为近年来兴起的新技术,主要用于柔性器件的封装,其所使用的封装材料粘度低,喷墨打印的制程使每滴材料的质量小,扩散距离短,使得其流平性非常好。
 技术问题
由于在大尺寸柔性有机发光二极管显示面板的习知封装制程中,采用滚轮贴合或一般真空贴合工艺,面贴合胶材既要与阻隔膜贴合,又要与柔性基板贴合,有两次离型膜撕除和两次贴合过程,容易有气泡等不良的产生。此外,封装结构的可靠性亦有提升的必要。
 技术解决方案
为解决上述问题,本发明提出一种有机发光二极管显示面板封装方法,包括:
提供一基板,在该基板上涂布聚酰亚胺液,并固化所述聚酰亚胺液以形成一聚酰亚胺薄膜;接着在所述聚酰亚胺薄膜上形成一氧化物薄膜;在所述氧化物薄膜上制作薄膜电晶体层;在所述薄膜电晶体层上设置围堰墙,形成一围蔽;在所述薄膜电晶体层上制作有机发光二极管器件层,所述围堰墙围蔽所述有机发光二极管器件层;在所述有机发光二极管器件层的上表面及周围侧边表面覆上一第一阻水层;在所述第一阻水层上形成缓冲层;在所述缓冲层的上表面及周围表面和所述第一阻水层上表面未被覆盖区域覆上一第二阻水层;将所述围蔽内的空间以封装材料充填;提供一第一阻隔膜,以电子吸盘吸附该第一阻隔膜,撕除该第一阻隔膜的离型膜,然后将该第一阻隔膜贴合于所述围堰墙和封装材料层上的表面;将所述聚酰亚胺薄膜与所述基板分离;提供一第二阻隔膜,以电子吸盘吸附该第二阻隔膜,撕除该第二阻隔膜的离型膜,然后将该第二阻隔膜贴合于所述聚酰亚胺薄膜的下表面,通过紫外光照射或加热使胶材固化以完成封装。
较佳地,所述基板为玻璃基板。
较佳地,所述氧化物为硅氧化物或氮氧化物。
较佳地,所述围堰墙通过喷墨打印一光固化树脂形成。
较佳地,所述第一阻水层通过低温电浆化学气相沉积形成。
较佳地,所述缓冲层通过喷墨打印一热固性高分子材料形成。
较佳地,所述第二阻水层通过低温电浆化学气相沉积形成。
较佳地,所述封装材料层通过喷墨打印一热固性高分子材料形成。
本发明亦提出一种有机发光二极管显示面板,所述有机发光二极管显示面板包括:
柔性衬底;薄膜电晶体层,所述薄膜电晶体层设置于所述柔性衬底之上;围堰墙,所述围堰墙设置于所述薄膜电晶体层之上,形成一围蔽;有机发光二极管器件层,所述有机发光二极管器件层设置于所述薄膜电晶体层之上,所述围堰墙围蔽所述有机发光二极管器件层;第一阻水层,所述第一阻水层覆于所述有机发光二极管器件层的上表面及周围侧边表面;缓冲层,所述缓冲层设置于所述第一阻水层之上;第二阻水层,所述第二阻水层,覆于所述缓冲层的上表面和周围侧边表面以及第一阻水层上表面未被覆盖区域;封装材料层,所述封装材料层充填所述围蔽内的空间;第一阻隔膜,所述第一阻隔膜设置于所述围堰墙及封装材料层之上;以及第二阻隔膜,所述第二阻隔膜设置于所述柔性衬底之下。
较佳地,所述柔性衬底由聚酰亚胺所组成。
较佳地,所述柔性衬底和薄膜电晶体层之间还覆有一层硅氧化物或氮氧化物薄膜。
较佳地,所述围堰墙为一内墙和外墙所构成的双层结构。
较佳地,所述围堰墙的高度大于或等于所述有机发光二极管器件层、第一阻水层、缓冲层、以及第二阻水层的高度之和。
较佳地,所述缓冲层上表面的面积小于所述第一阻水层上表面的面积。
较佳地,所述围堰墙由光固化树脂所组成。
本发明亦提出另一种有机发光二极管显示面板,所述有机发光二极管显示面板包括:
柔性衬底,由聚酰亚胺所组成;薄膜电晶体层,设置于所述柔性衬底之上;围堰墙,设置于所述薄膜电晶体层之上,形成一围蔽,所述围堰墙为一内墙和外墙所构成的双层结构;有机发光二极管器件层,设置于所述薄膜电晶体层之上,所述围堰墙围蔽所述有机发光二极管器件层;第一阻水层,覆于所述有机发光二极管器件层的上表面及周围侧边表面;缓冲层,设置于所述第一阻水层之上;第二阻水层,覆于所述缓冲层的上表面和周围侧边表面以及第一阻水层上表面未被覆盖区域;封装材料层,充填所述围蔽内的空间;第一阻隔膜,设置于所述围堰墙及封装材料层之上;以及第二阻隔膜,设置于所述柔性衬底之下。
较佳地,所述柔性衬底和薄膜电晶体层之间还覆有一层硅氧化物或氮氧化物薄膜。
较佳地,所述围堰墙的高度大于或等于所述有机发光二极管器件层、第一阻水层、缓冲层、以及第二阻水层的高度之和。
较佳地,所述缓冲层上表面的面积小于所述第一阻水层上表面的面积。
较佳地,所述围堰墙由光固化树脂所组成。
 有益效果
本发明的有机发光二极管面板的缓冲层介于第一阻水层和第二阻水层之间,可降低第一阻水层和第二阻水层之间的应力,加上具有双层结构的围堰墙,可减少水气侵入的机会,因此提升装置的可靠度;此外,本发明在柔性有机发光二极管面板的封装中以薄膜封装喷墨技术结合使用电子吸盘的真空贴合工艺，取代习知的面贴合胶和滚轮或一般真空贴合工艺，从而显着提高大尺寸柔性有机发光二极管面板的封装良率。
 附图说明
图1为本发明有机发光二极管显示面板的封装流程图;
图2为本发明有机发光二极管显示面板一较佳实施例的截面示意图；
图 3为本发明有机发光二极管显示面板的第一阻隔膜贴合步骤示意图;以及
图 4为本发明有机发光二极管显示面板的第二阻隔膜贴合步骤示意图。
 本发明的最佳实施方式
以下将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
如图1所示,本发明有机发光二极管显示面板包括:表面沉积有硅氧化物薄膜2001的柔性衬底200;薄膜电晶体层201,所述薄膜电晶体层201设置于所述柔性衬底200之上;围堰墙202, 沿着所述薄膜电晶体层201之上的周围区域设置,形成一围蔽,所述围堰墙202为一内墙2021和外墙2022所构成的双层结构;有机发光二极管器件层203,所述有机发光二极管器件层203制作于所述薄膜电晶体层201之上,所述围堰墙202围蔽所述有机发光二极管器件层203;第一阻水层204,所述第一阻水层204覆于所述有机发光二极管器件层203的上表面及周围侧边表面;缓冲层205,所述缓冲层205设置于所述第一阻水层204之上;第二阻水层206,所述第二阻水层206覆于所述缓冲层205的上表面及周围侧边表面;封装材料层207,所述封装材料层207充填所述围绕空间,并覆于所述第二阻水层206之上;第一阻隔膜208,所述第一阻隔膜208设置于所述围堰墙202及封装材料层207之上;以及第二阻隔膜209,所述第二阻隔膜209设置于所述柔性衬底200之下。
如图2所示,上述有机发光二极管显示面板的封装流程详述如下:提供一玻璃基板100,在该玻璃基板100上涂布聚酰亚胺液,并以烘烤等方式固化所述聚酰亚胺液以形成一聚酰亚胺薄膜200;接着在所述聚酰亚胺薄膜上沉积一硅氧化物薄膜2001;然后在所述硅氧化物薄膜2001上以镀膜、涂布光阻液、曝光、显影以及蚀刻等方法制作薄膜电晶体层201;接着在所述薄膜电晶体层201上的周围区域表面以喷墨打印方式喷涂两圈光固化树脂,制成一约2毫米(mm)之具有内墙2021和外墙2022双层结构的围堰墙202,形成一围蔽;然后在所述薄膜电晶体层201上通过涂布光阻液、曝光、显影、蚀刻以及蒸镀等方法制作有机发光二极管器件层203,所述围堰墙202围蔽所述有机发光二极管器件层203;接着在所述有机发光二极管器件层203的上表面及周围侧边表面通过低温电浆化学气相沉积法覆上一第一阻水层204;然后在所述第一阻水层204上通过喷墨打印热固性高分子材料形成一缓冲层205;接着在所述缓冲层205的上表面及周围表面和所述第一阻水层204上表面未被覆盖区域通过低温电浆化学气相沉积法覆上一第二阻水层206;再通过喷墨打印热固性高分子材料充填所述围蔽内的空间,形成一封装材料层207。
如图3所示,接着提供一第一阻隔膜208,以电子吸盘10真空吸附所述第一阻隔膜208,撕除该第一阻隔膜208的离型膜后,将所述第一阻隔膜208于真空环境下贴合于所述围堰墙202和封装材料层207上的表面;然后将所述聚酰亚胺薄膜200与所述玻璃基板100分离。
如图4所示,所述玻璃基板100完全與聚酰亚胺薄膜200分离之后,提供一第二阻隔膜209,再以上述电子吸盘10真空吸附所述第二阻隔膜209,撕除该第二阻隔膜209的离型膜之后,将所述第二阻隔膜209于真空环境下贴合于所述聚酰亚胺薄膜200的下表面,最后通过紫外光照射或其他加热方式使胶材固化以完成封装。
本发明的有机发光二极管面板的缓冲层205介于第一阻水层204和第二阻水层206之间,可降低第一阻水层204和第二阻水层206之间的应力,加上具有双层结构的围堰墙202,可降低水气侵入的机会,因此提升装置的可靠度;此外,本发明在柔性有机发光二极管面板的封装中以薄膜封装喷墨技术结合使用电子吸盘的真空贴合工艺，取代习知的面贴合胶和滚轮或一般真空贴合工艺，从而显著提高大尺寸柔性有机发光二极管面板的封装良率。
综上所述，虽然本发明已以优选实施例揭露如上,但上述优选实施例并非用以限制本申请,本领域普通技术人员,在不脱离本申请的精神和范围内,均可作各种更动与润饰,因此本申请的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种有机发光二极管显示面板,包括:
    柔性衬底;
    薄膜电晶体层,设置于所述柔性衬底之上;
    围堰墙,设置于所述薄膜电晶体层之上,形成一围蔽;
    有机发光二极管器件层,设置于所述薄膜电晶体层之上,所述围堰墙围蔽所述有机发光二极管器件层;
    第一阻水层,覆于所述有机发光二极管器件层的上表面及周围侧边表面;
    缓冲层,设置于所述第一阻水层之上;
    第二阻水层,覆于所述缓冲层的上表面和周围侧边表面以及第一阻水层上表面未被覆盖区域;
    封装材料层,充填所述围蔽内的空间;
    第一阻隔膜,设置于所述围堰墙及封装材料层之上;以及
    第二阻隔膜,设置于所述柔性衬底之下。
  2. 如权利要求1所述的有机发光二极管显示面板,其中,所述柔性衬底由聚酰亚胺所组成。
  3. 如权利要求1所述的有机发光二极管显示面板,其中,所述柔性衬底和薄膜电晶体层之间还覆有一层硅氧化物或氮氧化物薄膜。
  4. 如权利要求1所述的有机发光二极管显示面板,其中,所述围堰墙为一内墙和外墙所构成的双层结构。
  5. 如权利要求1所述的有机发光二极管显示面板,其中,所述围堰墙的高度大于或等于所述有机发光二极管器件层、第一阻水层、缓冲层、以及第二阻水层的高度之和。
  6. 如权利要求1所述的有机发光二极管显示面板,其中,所述缓冲层上表面的面积小于所述第一阻水层上表面的面积。
  7. 如权利要求1所述的有机发光二极管显示面板,其中,所述围堰墙由光固化树脂所组成。
  8. 一种有机发光二极管显示面板封装方法,包括:
    提供一基板,在该基板上形成一聚酰亚胺薄膜;
    在所述聚酰亚胺薄膜上形成一氧化物薄膜;
    在所述氧化物薄膜上制作薄膜电晶体层;
    在所述薄膜电晶体层上设置围堰墙,形成一围蔽;
    在所述薄膜电晶体层上制作有机发光二极管器件层,所述围堰墙围蔽所述有机发光二极管器件层;
    在所述有机发光二极管器件层的上表面及周围侧边表面覆上一第一阻水层;
    在所述第一阻水层上形成缓冲层;
    在所述缓冲层的上表面及周围表面和所述第一阻水层上表面未被覆盖区域覆上一第二阻水层;
    将所述围蔽内的空间以封装材料充填,形成一封装材料层;
    提供一第一阻隔膜,以电子吸盘吸附该第一阻隔膜,然后将该第一阻隔膜贴合于所述围堰墙和封装材料层上的表面;
    将所述聚酰亚胺薄膜与所述基板分离;
    提供一第二阻隔膜,以电子吸盘吸附该第二阻隔膜,然后将该第二阻隔膜贴合于所述聚酰亚胺薄膜的下表面。
  9. 如权利要求9所述的有机发光二极管显示面板封装方
    法,其中,所述基板为玻璃基板。
  10. 如权利要求9所述的有机发光二极管显示面板封装
    方法,其中,所述氧化物为硅氧化物或氮氧化物。
  11. 如权利要求9所述的有机发光二极管显示面板封装
    方法,其中,所述围堰墙通过喷墨打印一光固化树脂形成。
  12. 如权利要求9所述的有机发光二极管显示面板封装
    方法,其中,所述第一阻水层通过低温电浆化学气相沉积形成。
  13. 如权利要求9所述的有机发光二极管显示面板封装
    方法,其中,所述缓冲层通过喷墨打印一热固性高分子材料形成。
  14. 如权利要求9所述的有机发光二极管显示面板封装
    方法,其中,所述第二阻水层通过低温电浆化学气相沉积形成。
  15. 如权利要求9所述的有机发光二极管显示面板封装
    方法,其中,所述封装材料层通过喷墨打印一热固性高分子材料形成。
  16. 一种有机发光二极管显示面板,包括:
    柔性衬底,由聚酰亚胺所组成;
    薄膜电晶体层,设置于所述柔性衬底之上;
    围堰墙,设置于所述薄膜电晶体层之上,形成一围蔽,所述围堰墙为一内墙和外墙所构成的双层结构;
    有机发光二极管器件层,设置于所述薄膜电晶体层之上,所述围堰墙围蔽所述有机发光二极管器件层;
    第一阻水层,覆于所述有机发光二极管器件层的上表面及周围侧边表面;
    缓冲层,设置于所述第一阻水层之上;
    第二阻水层,覆于所述缓冲层的上表面和周围侧边表面以及第一阻水层上表面未被覆盖区域;
    封装材料层,充填所述围蔽内的空间;
    第一阻隔膜,设置于所述围堰墙及封装材料层之上;以及
    第二阻隔膜,设置于所述柔性衬底之下。
  17. 如权利要求16所述的有机发光二极管显示面板,其中,所述柔性衬底和薄膜电晶体层之间还覆有一层硅氧化物或氮氧化物薄膜。
  18. 如权利要求16所述的有机发光二极管显示面板,其中,所述围堰墙的高度大于或等于所述有机发光二极管器件层、第一阻水层、缓冲层、以及第二阻水层的高度之和。
  19. 如权利要求16所述的有机发光二极管显示面板,其中,所述缓冲层上表面的面积小于所述第一阻水层上表面的面积。
  20. 如权利要求16所述的有机发光二极管显示面板,其中,所述围堰墙由光固化树脂所组成。
PCT/CN2019/091999 2019-05-28 2019-06-20 有机发光二极管显示面板及其封装方法 WO2020237753A1 (zh)

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