WO2020215973A1 - 芯片组件及移动终端 - Google Patents
芯片组件及移动终端 Download PDFInfo
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- WO2020215973A1 WO2020215973A1 PCT/CN2020/081309 CN2020081309W WO2020215973A1 WO 2020215973 A1 WO2020215973 A1 WO 2020215973A1 CN 2020081309 W CN2020081309 W CN 2020081309W WO 2020215973 A1 WO2020215973 A1 WO 2020215973A1
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- plate
- main board
- chip
- chip assembly
- board
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/1365—Matching; Classification
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
Definitions
- the present disclosure relates to the field of communication technology, and in particular to a chip assembly and a mobile terminal.
- the fingerprint module mainly includes a fingerprint chip, a fingerprint circuit board, and a reinforcement board.
- the fingerprint circuit board is arranged between the fingerprint chip and the reinforcement board.
- the reinforcement board is conductive to the main board shielding cover through conductive foam.
- the main board shielding cover is arranged on the main board of the mobile terminal to realize the shielding function.
- the space occupied by the reinforcement plate, the conductive foam and the main board shielding cover is relatively large, which makes the structural design of the mobile terminal difficult.
- the reinforcing plate is electrically connected to the main board shielding cover through the conductive foam and is grounded, the conductive foam may have a certain blocking effect, resulting in poor grounding of the fingerprint chip.
- the present disclosure provides a chip assembly and a mobile terminal to solve the problems of difficulty in structural design of the mobile terminal and poor grounding effect of the chip.
- a chip assembly including:
- a chip module includes a chip, a circuit board, and a reinforcing shielding board, the chip is arranged on the circuit board, the circuit board is arranged on the reinforcing shielding board, and the reinforcing shield The board is grounded to the main board, and a device installation space is formed between the reinforced shielding board and the main board;
- a motherboard device the motherboard device is installed in the device installation space.
- a mobile terminal includes the above chip assembly.
- the chip module includes a chip, a circuit board, and a reinforced shielding plate.
- the reinforced shielding plate can realize the reinforcement of the chip and the circuit board on the one hand, and can be grounded with the main board on the other hand, so as
- the motherboard components installed on the motherboard play a shielding role, so there is no need to additionally provide a shielding cover on the motherboard, and the conductive foam between the reinforcing shielding plate and the shielding cover can also be omitted. It can be seen that the space occupied by the chip module and the motherboard after stacking is small, which makes it easier to arrange other devices in the mobile terminal, thereby reducing the difficulty of structural design of the mobile terminal.
- the chip is directly grounded through the reinforced shield plate, which has a better grounding effect.
- FIG. 1 is a cross-sectional view of a chip assembly disclosed in an embodiment of the disclosure
- FIG. 2 is a cross-sectional view of the chip module in the chip assembly disclosed in the embodiment of the disclosure
- FIG. 3 is a top view of the chip module in the chip assembly disclosed in the embodiment of the disclosure.
- FIG. 4 is a cross-sectional view of a chip assembly disclosed in another embodiment of the disclosure.
- the embodiments of the present disclosure disclose a mobile terminal, which includes a housing (not shown in the figure) and a chip assembly.
- the chip assembly can be installed in the housing as a whole or partly in the housing. in vivo.
- the chip assembly may specifically include a motherboard 100, a chip module 200, and a motherboard device 300.
- the main board 100 and the main board device 300 are both installed in the casing, and the main board device 300 is installed on the main board 100.
- the main board device 300 can be electrically connected to the main board 100, so that the main board 100 can supply power to the main board device 300 and can also control the working state of the main board device 300.
- the motherboard device 300 may be a processor, a controller, a sensor, and so on.
- the chip module 200 may be entirely located in the housing, or part of it may be located in the housing.
- the chip module 200 may include a chip 210, a circuit board 220, and a reinforcing shield plate 230.
- the chip 210 is the core device of the entire chip module 200, which is used to perform corresponding functions;
- the circuit board 220 is used to supply power to the chip 210 and control the working state of the chip 210; the reinforcing shielding board 230 can realize the chip 210
- the entire chip module 200 has sufficient rigidity to facilitate the installation of the chip module 200. Therefore, the chip 210 is disposed on the circuit board 220, and the circuit board 220 is disposed on the reinforced shielding plate 230.
- the reinforced shield plate 230 is grounded to the main board 100, that is, the reinforced shield plate 230 is connected to the main board 100, so that the reinforced shield plate 230 is grounded through the main board 100.
- a device installation space 201 is formed between the reinforcing shield plate 230 and the main board 100, and the main board device 300 is installed in the device installation space 201. That is, the reinforced shielding plate 230 covers the main board device 300, and then plays a role of signal shielding.
- the reinforced shielding plate 230 may be configured as a steel sheet.
- the motherboard device 300 located in the device installation space 201 described above may be one or more than one, and is protected by the reinforced shielding plate 230.
- the specific type and quantity of the main board device 300 to be covered can be flexibly selected according to actual needs.
- the chip module 200 in the embodiment of the present disclosure may be any kind of functional module including the above-mentioned chip 210, the circuit board 220, and the reinforcing shield plate 230.
- the chip module 200 may be a fingerprint module, and in the fingerprint module, the circuit board 220 may be a flexible printed circuit (FPC).
- the reinforced shielding plate 230 can realize the reinforcement of the chip 210 and the circuit board 220 on the one hand, and can be grounded to the main board 100 on the other hand, thereby shielding the main board device 300 installed on the main board 100. Therefore, there is no need to additionally provide a shielding cover on the main board 100, and at the same time, the conductive foam between the reinforcing shielding plate 230 and the shielding cover can be omitted. It can be seen that the space occupied by the chip module 200 and the motherboard 100 after stacking is small, making it easier to arrange other devices in the mobile terminal, thereby reducing the difficulty of structural design of the mobile terminal, and reducing the cost of the mobile terminal. At the same time, the chip 210 is directly grounded through the reinforced shielding plate 230, which has a better grounding effect, thereby improving the Electro-Static Discharge (ESD) performance of the mobile terminal.
- ESD Electro-Static Discharge
- the reinforced shielding plate 230 may include a top plate 231 and an annular side plate 232, the annular side plate 232 is connected to the edge of the top plate 231, and the annular side plate 232 surrounds the top plate 231, and the top plate 231 is connected to the The main board 100 is connected.
- the top plate 231 may be configured as a flat plate to better support the chip 210 and the circuit board 220.
- an almost enclosed device installation space 201 can be formed, so that the shielding effect can be better played.
- such a reinforced shielding plate 230 can prevent impurities such as liquid and dust in the external environment from entering the device installation space 201, thereby better protecting the motherboard 100 and the motherboard device 300.
- the reinforced shield plate 230 may be welded to the main board 100.
- the main board 100 is provided with a plurality of grounding pins, and there is a certain interval between the plurality of grounding pins;
- the reinforced shielding plate 230 is provided with a plurality of welding parts, and there is a certain interval between the plurality of welding parts. interval.
- the welding portion here may protrude relative to other parts of the reinforced shield plate 230, or may be flush with other parts of the reinforced shield plate 230, that is, the reinforced shield plate 230 faces the main board 100.
- One side can be flat or curved.
- the multiple welding parts are welded to the multiple grounding pins in one-to-one correspondence, and then multiple solder joints are formed between the reinforced shielding plate 230 and the main board 100.
- the connection strength between the two can be ensured, and on the other hand, The welding area between the two is controlled to prevent the main board 100 and the main board device 300 from being damaged due to high temperature welding.
- the ring-shaped side plate 232 may be arranged in a columnar structure, and the ring-shaped side plate 232 is vertically connected to the edge of the top plate 231 and surrounds the top plate 231.
- the side of the board 232 facing the main board 100 is provided with the aforementioned soldering portion.
- the cross-sectional shape of the annular side plate 232 (that is, the cross-section parallel to the main board 100) can be square, circular, elliptical, triangular, etc. The specific shape can be selected according to requirements, which is not limited herein.
- Such a ring-shaped side plate 232 occupies a relatively small space on the main board 100, which is more convenient for the arrangement of components on the main board 100.
- the chip module 200 further includes a fastener (not shown in the figure), the reinforcing shield plate 230 has a fastening hole 233, and the fastener is connected to the fastening hole 233.
- the fixing hole 233 is matched, and the reinforcing shield plate 230 is detachably connected to the main board 100 through the fastener.
- the fastener here may be a threaded fastener, and specifically may be a structure such as a screw, a stud, or a screw assembly.
- the reinforcing shield plate 230 and the main board 100 When the reinforcing shield plate 230 and the main board 100 are detachably connected, the reinforcing shield plate 230 and the main board 100 can be disassembled and assembled multiple times, so this structure facilitates the maintenance of the chip module 200, the main board 100 and the main board device 300.
- the fastening hole 233 can be opened on the side of the annular side plate 232 facing the main board 100, and one end of the fastener It can pass through the main board 100 and be screwed with the fastening hole 233 to realize the connection between the main board 100 and the reinforced shield plate 230. If this structure is adopted, the fasteners need to penetrate the main board 100, which threatens the structural strength of the main board 100.
- an extension plate 234 may be provided at the edge of the reinforced shielding plate 230, the extension plate 234 extends in a direction parallel to the main board 100, and the extension plate 234 defines the above-mentioned fastening hole 233.
- the reinforced shielding plate 230 includes the annular side plate 232 described above, the extension plate 234 here may be formed to extend from the annular side plate 232 toward the main board 100.
- one end of the fastener passes through the fastening hole 233 and is connected to the main board 100. The fastener does not need to penetrate the main board 100, so the structural strength of the main board 100 can be guaranteed.
- extension plate 234 may be an annular plate, and the annular plate surrounds the annular side plate 232 at this time; the extension plate 234 may also be a structure extending from a part of the annular side plate 232.
- the ground connection between the reinforced shield plate 230 and the main board 100 can be realized by an additional structure, for example, can be realized by inserting pins.
- this solution separates the detachable connection and ground connection of the reinforced shielding plate 230 and the main board 100, resulting in an overly complicated structure of the mobile terminal.
- the fasteners can be arranged as conductive parts, and the reinforced shield plate 230 is grounded to the main board 100 through the fasteners. That is, the fastener can not only realize the detachable connection between the reinforced shield plate 230 and the main board 100, but also can realize the ground connection between the reinforced shield plate 230 and the main board 100, making the structure of the mobile terminal simpler and more compact.
- the mobile terminal disclosed in the embodiments of the present disclosure may be a smart phone, a tablet computer, an e-book reader or a wearable device.
- the mobile terminal may also be other devices, which is not limited in the embodiments of the present disclosure.
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- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
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Abstract
本公开实施例提供一种芯片组件和移动终端,芯片组件包括:主板;芯片模组,包括芯片、电路板和补强屏蔽板,芯片设置于电路板上,电路板设置于补强屏蔽板上,补强屏蔽板与主板接地连接,且所述补强屏蔽板与所述主板之间形成器件安装空间;主板器件,安装于器件安装空间内。
Description
相关申请的交叉引用
本申请主张在2019年4月24日在中国提交的中国专利申请号No.201910335070.5的优先权,其全部内容通过引用包含于此。
本公开涉及通信技术领域,尤其涉及一种芯片组件及移动终端。
随着移动终端行业的迅猛发展,移动终端的性能不断提升,其集成的功能也越来越多样化,这就对移动终端的内部空间提出了较大的挑战。
以指纹模组为例,该指纹模组主要包括指纹芯片、指纹电路板和补强板,指纹电路板设置于指纹芯片和补强板之间,补强板通过导电泡棉与主板屏蔽盖电导通并接地,该主板屏蔽盖设置于移动终端的主板上,以实现屏蔽功能。
然而采用上述结构时,补强板、导电泡棉和主板屏蔽盖叠加后占用的空间较大,导致移动终端的结构设计难度较大。同时,补强板通过导电泡棉与主板屏蔽盖电导通并接地时,由于导电泡棉可能存在一定的阻隔作用,导致指纹芯片的接地效果不佳。
发明内容
本公开提供一种芯片组件及移动终端,以解决移动终端的结构设计难度较大以及芯片的接地效果不佳的问题。
为了解决上述问题,本公开采用下述技术方案:
一种芯片组件,包括:
主板;
芯片模组,所述芯片模组包括芯片、电路板和补强屏蔽板,所述芯片设置于所述电路板上,所述电路板设置于所述补强屏蔽板上,所述补强屏蔽板与所述主板接地连接,且所述补强屏蔽板与所述主板之间形成器件安装空间;
主板器件,所述主板器件安装于所述器件安装空间内。
一种移动终端,包括上述芯片组件。
本公开采用的技术方案能够达到以下有益效果:
本公开提供的芯片组件中,芯片模组包括芯片、电路板和补强屏蔽板,该补强屏蔽板一方面可以实现芯片和电路板的补强,另一方面可以与主板接地连接,进而对主板上安装的主板器件起到屏蔽作用,因此无需在主板上额外设置屏蔽盖,同时也可以省去补强屏蔽板与该屏蔽盖之间的导电泡棉。可见,芯片模组和主板堆叠后所占用的空间较小,使得移动终端内的其他器件更容易布置,从而降低移动终端的结构设计难度。同时,芯片直接通过补强屏蔽板接地,接地效果更好。
此处所说明的附图用来提供对本公开的进一步理解,构成本公开的一部分,本公开的示意性实施例及其说明用于解释本公开,并不构成对本公开的不当限定。在附图中:
图1为本公开实施例公开的芯片组件的剖视图;
图2为本公开实施例公开的芯片组件中,芯片模组的剖视图;
图3为本公开实施例公开的芯片组件中,芯片模组的俯视图;
图4为本公开另一实施例公开的芯片组件的剖视图。
附图标记说明:
100-主板、200-芯片模组、201-器件安装空间、210-芯片、220-电路板、230-补强屏蔽板、231-顶板、232-环形侧板、233-紧固孔、234-延伸板、300-主板器件。
为使本公开的目的、技术方案和优点更加清楚,下面将结合本公开具体实施例及相应的附图对本公开技术方案进行清楚、完整地描述。显然,所描述的实施例仅是本公开一部分实施例,而不是全部的实施例。基于本公开中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有 其他实施例,都属于本公开保护的范围。
以下结合附图,详细说明本公开各个实施例公开的技术方案。
如图1-图3所示,本公开实施例公开一种移动终端,其包括壳体(图中未示出)和芯片组件,该芯片组件可以整体安装于壳体内,也可以部分安装于壳体内。本公开实施例中,芯片组件具体可以包括主板100、芯片模组200和主板器件300。主板100和主板器件300均安装于壳体内,主板器件300安装在主板100上。主板器件300可以与主板100电连接,使得主板100可以为主板器件300供电,也可以控制主板器件300的工作状态。具体地,主板器件300可以是处理器、控制器、传感器等等。
芯片模组200可以整***于壳体内,也可以一部分位于壳体内。该芯片模组200可以包括芯片210、电路板220和补强屏蔽板230。其中,芯片210是整个芯片模组200的核心器件,其用于发挥所对应的功能;电路板220用于向芯片210供电,以及控制芯片210的工作状态;补强屏蔽板230可以实现芯片210和电路板220的补强,使得整个芯片模组200具有足够的刚性,便于芯片模组200的安装。故,芯片210设置于电路板220上,电路板220设置于补强屏蔽板230上。同时,补强屏蔽板230与主板100接地连接,也就是说,补强屏蔽板230与主板100连接,以使补强屏蔽板230通过主板100接地。补强屏蔽板230与主板100之间形成器件安装空间201,主板器件300安装于该器件安装空间201内。即,补强屏蔽板230罩住主板器件300,进而起到信号屏蔽的作用。为了提升补强屏蔽板230的屏蔽效果,以及对芯片210和电路板220的支撑效果,该补强屏蔽板230可以设置为钢片。
需要说明的是,主板100上安装的主板器件300通常有多个,位于上文所述的器件安装空间201内的主板器件300可以是一个,也可以是多个,被补强屏蔽板230所罩住的主板器件300的具体种类、数量等都可以根据实际需求灵活选择。
另外,本公开实施例中的芯片模组200可以是任意一种包含上述芯片210、电路板220和补强屏蔽板230的功能模组。一种具体实施例中,该芯片模组200可以为指纹模组,该指纹模组中,电路板220可以是柔性电路板(Flexible Printed Circuit,FPC)。
本公开实施例中,补强屏蔽板230一方面可以实现芯片210和电路板220的补强,另一方面可以与主板100接地连接,进而对主板100上安装的主板器件300起到屏蔽作用,因此无需在主板100上额外设置屏蔽盖,同时也可以省去补强屏蔽板230与该屏蔽盖之间的导电泡棉。可见,芯片模组200和主板100堆叠后所占用的空间较小,使得移动终端内的其他器件更容易布置,从而降低移动终端的结构设计难度,并且移动终端的成本随之降低。同时,芯片210直接通过补强屏蔽板230接地,接地效果更好,从而提升移动终端的静电释放(Electro-Static discharge,ESD)性能。
为了提升屏蔽效果,补强屏蔽板230可以包括顶板231和环形侧板232,该环形侧板232连接在顶板231的边沿处,且环形侧板232环绕顶板231,顶板231通过环形侧板232与主板100连接。顶板231可以设置为平板,以更好地支撑芯片210和电路板220。此种补强屏蔽板230与主板100连接以后,可以形成几乎封闭的器件安装空间201,因此可以更好地发挥屏蔽作用。同时,此种补强屏蔽板230可以防止外部环境中的液体、灰尘等杂质进入器件安装空间201,进而更好地保护主板100和主板器件300。
一种可选的实施例中,为了简化补强屏蔽板230与主板100的连接工艺,同时提高两者之间的连接强度,补强屏蔽板230可以与主板100焊接。可选地,主板100设有多个接地焊脚,多个接地焊脚之间具有一定的间隔;对应地,补强屏蔽板230设有多个焊接部,多个焊接部之间具有一定的间隔。需要说明的是,这里的焊接部可以相对于补强屏蔽板230的其他部分凸出,也可以与补强屏蔽板230的其他部分平齐,也就是说,补强屏蔽板230朝向主板100的一面可以是平面,也可以是曲面。多个焊接部与多个接地焊脚一一对应地焊接,进而在补强屏蔽板230和主板100之间形成多个焊点,一方面可以保证两者之间的连接强度,另一方面可以控制两者之间的焊接面积,防止主板100以及主板器件300因焊接高温而损坏。
进一步地,当补强屏蔽板230包括顶板231和环形侧板232时,该环形侧板232可以设置为柱状结构,该环形侧板232垂直连接在顶板231的边沿处且环绕顶板231,环形侧板232朝向主板100的一面设有上文所述的焊接部。例如,环形侧板232的横截面(即平行于主板100的截面)形状可以是 方形、圆形、椭圆形、三角形等,具体形状可以根据需求选定,本文对此不做限制。此种环形侧板232在主板100上占用的空间相对较小,更便于主板100上的器件的布置。
如图4所示,另一种可选的实施例中,芯片模组200还包括紧固件(图中未示出),补强屏蔽板230开设紧固孔233,紧固件与该紧固孔233配合,补强屏蔽板230通过该紧固件与主板100可拆卸连接。这里的紧固件可以是螺纹紧固件,具体可以是螺钉、螺柱或者螺旋组件等结构。补强屏蔽板230与主板100可拆卸连接时,补强屏蔽板230和主板100可以多次拆装,因此此种结构便于芯片模组200、主板100以及主板器件300的维修。
当补强屏蔽板230包括上文所述的环形侧板232,且该环形侧板232为柱状结构时,紧固孔233可以开在环形侧板232朝向主板100的一面,紧固件的一端可以穿过主板100,并与紧固孔233螺纹配合,继而实现主板100与补强屏蔽板230之间的连接。如果采用这种结构,紧固件需要穿透主板100,这会对主板100的结构强度带来威胁。为此,可以在补强屏蔽板230的边缘处设置延伸板234,该延伸板234的延伸方向平行于主板100,延伸板234开设上文所述的紧固孔233。当补强屏蔽板230包括上文所述的环形侧板232时,这里的延伸板234可以自环形侧板232朝向主板100的部分延伸形成。采用此种结构后,紧固件的一端穿过紧固孔233,并与主板100连接,紧固件不需要穿透主板100,因此主板100的结构强度可以得到保证。
需要说明的是,上述延伸板234可以是环形板,此时该环形板环绕环形侧板232;延伸板234也可以是自环形侧板232的局部延伸出的结构。
当补强屏蔽板230通过紧固件与主板100连接时,补强屏蔽板230与主板100的接地连接可以通过额外设置的结构实现,例如可以通过插装引脚实现。但是此种方案将补强屏蔽板230和主板100的可拆卸连接和接地连接分开,导致移动终端的结构过于复杂。为了解决这一问题,可以将紧固件设置为导电件,补强屏蔽板230通过紧固件与主板100接地连接。即,紧固件不仅可以实现补强屏蔽板230和主板100的可拆卸连接,还可以实现补强屏蔽板230和主板100的接地连接,使得移动终端的结构更加简单紧凑。
本公开实施例所公开的移动终端可以为智能手机、平板电脑、电子书阅 读器或可穿戴设备。当然,该移动终端也可以是其他设备,本公开实施例对此不做限制。
本公开上文实施例中重点描述的是各个实施例之间的不同,各个实施例之间不同的优化特征只要不矛盾,均可以组合形成更优的实施例,考虑到行文简洁,在此则不再赘述。
以上所述仅为本公开的实施例而已,并不用于限制本公开。对于本领域技术人员来说,本公开可以有各种更改和变化。凡在本公开的精神和原理之内所作的任何修改、等同替换、改进等,均应包含在本公开的权利要求范围之内。
Claims (11)
- 一种芯片组件,包括:主板;芯片模组,所述芯片模组包括芯片、电路板和补强屏蔽板,所述芯片设置于所述电路板上,所述电路板设置于所述补强屏蔽板上,所述补强屏蔽板与所述主板接地连接,且所述补强屏蔽板与所述主板之间形成器件安装空间;主板器件,所述主板器件安装于所述器件安装空间内。
- 根据权利要求1所述的芯片组件,其中,所述芯片模组为指纹模组。
- 根据权利要求1所述的芯片组件,其中,所述补强屏蔽板包括顶板和环形侧板,所述环形侧板连接在所述顶板的边沿处,且所述环形侧板环绕所述顶板,所述顶板通过所述环形侧板与所述主板连接。
- 根据权利要求1所述的芯片组件,其中,所述补强屏蔽板与所述主板焊接。
- 根据权利要求4所述的芯片组件,其中,所述主板设有多个接地焊脚,所述补强屏蔽板设有多个焊接部,多个所述焊接部与多个所述接地焊脚一一对应地焊接。
- 根据权利要求5所述的芯片组件,其中,所述补强屏蔽板包括顶板和环形侧板,所述环形侧板为柱状结构,所述环形侧板垂直连接在所述顶板的边沿处,且所述环形侧板环绕所述顶板,所述环形侧板朝向所述主板的一面设有所述焊接部。
- 根据权利要求1所述的芯片组件,其中,所述芯片模组还包括紧固件,所述补强屏蔽板开设紧固孔,所述紧固件与所述紧固孔配合,所述补强屏蔽板通过所述紧固件与所述主板可拆卸连接。
- 根据权利要求7所述的芯片组件,其中,所述补强屏蔽板的边缘处设置延伸板,所述延伸板的延伸方向平行于所述主板,所述延伸板开设所述紧固孔。
- 根据权利要求7所述的芯片组件,其中,所述紧固件为导电件,所述补强屏蔽板通过所述紧固件与所述主板接地连接。
- 根据权利要求1-9中任一项所述的芯片组件,其中,所述补强屏蔽板为钢片。
- 一种移动终端,包括权利要求1-10中任一项所述的芯片组件。
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