WO2020208968A1 - Two-side polishing device - Google Patents

Two-side polishing device Download PDF

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Publication number
WO2020208968A1
WO2020208968A1 PCT/JP2020/007912 JP2020007912W WO2020208968A1 WO 2020208968 A1 WO2020208968 A1 WO 2020208968A1 JP 2020007912 W JP2020007912 W JP 2020007912W WO 2020208968 A1 WO2020208968 A1 WO 2020208968A1
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WO
WIPO (PCT)
Prior art keywords
surface plate
actuator
double
shape
sided polishing
Prior art date
Application number
PCT/JP2020/007912
Other languages
French (fr)
Japanese (ja)
Inventor
佑宜 田中
将史 丸田
Original Assignee
信越半導体株式会社
不二越機械工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 信越半導体株式会社, 不二越機械工業株式会社 filed Critical 信越半導体株式会社
Priority to KR1020217031932A priority Critical patent/KR20210149724A/en
Priority to CN202080026268.6A priority patent/CN113661030A/en
Publication of WO2020208968A1 publication Critical patent/WO2020208968A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/14—Lapping plates for working plane surfaces characterised by the composition or properties of the plate materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Definitions

  • the present invention relates to a hanging type double-sided polishing apparatus.
  • the double-sided polishing device that uses a low thermal expansion material for the surface plate can suppress the deformation of the surface plate due to the processing heat of polishing, it is excellent in the stability of the surface plate shape during polishing and, as a result, the processing accuracy of the wafer (Patent Document). 1).
  • the polishing pad (cloth) attached to the surface plate is worn by dressing and polishing while being affected by the shape accuracy of the surface plate, the shape changes, so a long-term perspective such as stacking polishing batches.
  • the processing accuracy of the wafer could not be kept constant.
  • FIG. 5 shows an example of a polishing pad that is no longer parallel due to the influence of surface plate shape accuracy
  • FIG. 6 shows an example in which the pad causes uneven wear.
  • 101 is a lower surface plate
  • 102 is an upper surface plate
  • 103 and 104 are polishing pads
  • 105 is a sun gear
  • 106 is an internal gear
  • 107 is a carrier.
  • the polishing pads 103 and 104 are not parallel to each other due to the decrease in accuracy of the lower surface plate 101 and the upper surface plate 102.
  • the carrier 107 is arranged between the lower surface plate 101 and the upper surface plate 102, uneven contact between the carrier 107 and the polishing pads 103 and 104 causes uneven wear, and the processing accuracy of the wafer is improved. I could't keep it constant.
  • FIG. 7 shows an example of a conventional double-sided polishing apparatus provided with a movable mechanism of a surface plate.
  • 102 is an upper surface plate
  • 108 is a suspended top plate
  • 109 is a disc.
  • P the force that moves the disc 109 with an air input pressure IN
  • the inclination of the disc 109 that is, Change the shape of the upper surface plate.
  • the disc 109 is made of metal
  • the disc 109 is easily deformed by heat, and the heat deformation is transmitted to the upper surface plate 102, so that the upper surface plate 102 is also easily deformed.
  • the upper surface plate shape can be deformed in only one direction, it cannot correspond to various types of pad shapes.
  • the present invention has been made to solve the above problems, and is a surface plate capable of deforming the surface plate shape into various shapes without promoting thermal deformation of the surface plate in a double-sided polishing apparatus in a suspended form.
  • the purpose is to propose a movable mechanism of.
  • a lower surface plate that is rotatably provided around a rotation shaft and has a polishing pad attached to the upper surface, and a lower surface plate that can move up and down above the lower surface plate and the rotation shaft.
  • a double-sided polishing apparatus including an upper surface plate rotatably provided around the center and a polishing pad attached to the lower surface thereof, and a suspension top plate provided above the upper surface plate, the suspension top plate and the above It is provided with a connecting portion for connecting the upper surface plate and an actuator provided between the suspended top plate and the upper surface plate at a position different from the connecting portion and capable of deforming the shape of the upper surface plate.
  • a double-sided polishing apparatus characterized by the above.
  • the upper surface plate and the suspended top plate are connected by a connecting portion, and the shape of the upper surface plate is deformed by an actuator provided at a position different from the connecting portion. That is, since the connecting portion and the actuator are independent of each other, the metal disc used in the existing technology is unnecessary. In addition, the shape of the upper surface plate can be transformed into various shapes by the actuator. Therefore, it is possible to provide a suspended double-sided polishing device provided with a movable mechanism of the surface plate that does not promote thermal deformation of the surface plate and can deform the surface plate shape into various shapes.
  • the surface plate shape can be deformed according to the pad shape. Therefore, it is possible to keep the processing accuracy of the wafer constant from a long-term viewpoint such as stacking polishing batches.
  • the connecting portion is composed of a plurality of suspension columns arranged on the same circumference in the radial direction of the upper surface plate, and the actuator is on the same circumference in the radial direction of the upper surface plate. It is preferable that one or more are arranged at different positions from the individual suspension columns.
  • the actuator on the circumference of the PCD that is different from the PCD (pitch circle diameter) of the circle drawn by (center points) of the plurality of suspension columns when the rotation axis is the center, the upper It is possible to provide a movable mechanism capable of transforming the platen shape into various shapes.
  • the actuator deforms the shape of the upper surface plate with the plurality of suspension columns as fulcrums.
  • the suspension column as a fulcrum, at least one actuator is operated according to the seesaw principle, and a repulsive force is generated between the suspension top plate and the upper surface plate, so that the upper surface plate is tilted. (Upper surface plate shape) can be easily controlled.
  • a floating joint for connecting the actuator and the upper surface plate is further provided, and the actuator is fixed to the suspension top plate.
  • the upper surface plate is preferably made of a low thermal expansion material having a linear thermal expansion coefficient of 6 ⁇ 10 -6 / K or less.
  • the advantage of the suspended form that the upper surface plate is not easily deformed by heat can be utilized. That is, since the upper surface plate is supported by the connecting portion (for example, a hanging strut), the thermal deformation of the connecting portion can be reduced to the upper surface plate by reducing the number of the connecting portions to the minimum size. It is not transmitted, and the original function of the low thermal expansion material (hard to be deformed by the frictional heat between the wafer and the polishing pad) can be exhibited.
  • the connecting portion for example, a hanging strut
  • a movable mechanism of a surface plate that does not promote thermal deformation of the surface plate and can deform the surface plate shape into various shapes is provided. be able to. Therefore, when both sides of the wafer are polished using the double-sided polishing device, the wafer shape can be stabilized for a long period of time.
  • the present inventors apart from the connecting portion that connects the suspended top plate and the upper surface plate, are different from the connecting portion between the suspended top plate and the upper surface plate. It has been found that by providing an actuator at a position and deforming the upper surface plate shape by the actuator, it is possible to deform the surface plate shape into various shapes without promoting the thermal deformation of the surface plate. That is, since the connecting portion only needs to connect the suspended top plate and the upper surface plate, if the connecting portion is configured with the minimum number and the minimum size, the thermal deformation of the connecting portion becomes the upper surface plate.
  • the present inventor states that the upper surface plate shape can be deformed into various shapes by deforming the upper surface plate shape by an actuator provided independently of the connecting portion. Et al. Found and completed the present invention.
  • the present invention is rotatably provided about a rotation axis and has a lower surface plate having a polishing pad attached to the upper surface, and can move up and down above the lower surface plate and can rotate about the rotation axis.
  • a double-sided polishing apparatus provided with an upper surface plate provided with a polishing pad attached to the lower surface and a suspension top plate provided above the upper surface plate, the suspension top plate and the upper surface plate are connected.
  • Double-sided polishing characterized by comprising an actuator provided between the suspending top plate and the upper surface plate at a position different from the connection portion and capable of deforming the shape of the upper surface plate. It is a device.
  • FIG. 1 shows an outline of the double-sided polishing apparatus of the present invention.
  • the lower platen 1 is rotatably provided around the rotation axis AX, and a polishing pad 7b is attached to the upper surface thereof.
  • the upper surface plate 2 is provided so as to be vertically movable above the lower surface plate 1 and rotatably about the rotation axis AX, and a polishing pad 7a is attached to the lower surface thereof.
  • the carrier 8 that holds the wafer (changed to, for example, a dresser at the time of dressing) 8 is arranged between the lower surface plate 1 and the upper surface plate 2.
  • the hanging top plate 3 is provided above the upper surface plate 2 and is held by the support columns 6.
  • the connecting portion 4 connects the suspended top plate 3 and the upper surface plate 2. Therefore, by moving the hanging top plate 3 up and down, the upper surface plate 2 can be moved up and down in conjunction with this.
  • the actuator 5 is provided between the suspension top plate 3 and the upper surface plate 2 at a position different from that of the connecting portion 4, and can deform the inclination (upper surface plate shape) of the upper surface plate 2.
  • the number of actuators 5 is two, but it may be one or more.
  • the position of the actuator 5 is not particularly limited as long as it is a position different from that of the connecting portion 4.
  • the two actuators 5 are arranged side by side in the radial direction perpendicular to the rotation axis AX.
  • the inclination of the upper surface plate 2 in the radial direction can be deformed by driving either one of the two actuators 5.
  • the upper surface plate 1 and the upper surface plate 1 When the lower surfaces of the upper surface plate 2 are parallel, the actuator 5 on the inner side (the side closer to the rotation axis AX) is driven in a direction of extending, that is, increasing the distance between the suspension top plate 3 and the upper surface plate 2. Then, according to the seesaw principle, the actuator 5 on the outside (the side far from the rotation axis AX) contracts in the direction of narrowing the distance between the suspension top plate 3 and the upper surface plate 2. As a result, the upper surface plate 2 is inclined so that the inner side in the radial direction is lower than the outer side.
  • the outer actuator 5 contracts, that is, is driven in a direction that narrows the distance between the suspension top plate 3 and the upper surface plate 2, the outer actuator 5 is moved above the suspension top plate 3 according to the seesaw principle. It extends in the direction of increasing the distance from the surface plate 2. As a result, the upper surface plate 2 is inclined so that the inner side in the radial direction is higher than the outer side.
  • the shape of the upper surface plate that is, the inclination of the upper surface plate 2 is determined by changing the position of the actuator 5 or by providing a plurality of actuators 5 between the suspension top plate 3 and the upper surface plate 2. By driving the actuator 5 of the above, it can be deformed into various shapes.
  • the upper surface plate is affected by the pad shape. Since the shape can be deformed, it is possible to keep the processing accuracy of the wafer constant from a long-term viewpoint such as stacking polishing batches.
  • the connecting portion 4 may connect the suspension top plate 3 and the upper surface plate, the connecting portion 4 may be configured with the minimum number and the minimum size. Therefore, the thermal deformation of the connecting portion 4 does not affect the upper surface plate 2.
  • FIG. 2 shows the details of the double-sided polishing apparatus of the present invention.
  • FIG. 3A is a plan view showing the positional relationship between the upper surface plate 2 and the connecting portion 4 and the actuator 5, and
  • FIG. 3B is a sectional view of a double-sided polishing apparatus.
  • FIG. 3 shows an example of the structure of the actuator.
  • the double-sided polishing device described below is premised on a 4-way type having each drive unit of, for example, a lower surface plate 1, an upper surface plate 2, a sun gear, and an internal gear.
  • each drive unit of, for example, a lower surface plate 1, an upper surface plate 2, a sun gear, and an internal gear.
  • the sun gear and the internal gear will be omitted here.
  • the lower surface plate 1, the upper surface plate 2, the suspension top plate 3, the connecting portion 4, the actuator 5, the support column 6, and the polishing pads 7a and 7b are the lower surface plate 1, the upper surface plate 2, and the suspension top plate 3 in FIG. 1, respectively.
  • the suspending top plate 3 has a disk shape centered on the rotating shaft AX
  • the upper surface plate 2 has a ring shape centered on the rotating shaft AX.
  • the lower platen 1 is arranged between a sun gear and an internal gear (not shown), and has a disk shape capable of rotating around the sun gear (rotation axis AX).
  • the connecting portion 4 is composed of a plurality of suspension columns arranged on the same circumference C0 in the radial direction of the upper surface plate 2.
  • the connecting portion 4 is composed of six suspension columns arranged on the same circumference C0, but the number of the suspension columns is not limited to this.
  • the material of the connecting portion 4 is not particularly limited, but is, for example, made of metal. However, it is preferable to set the number of the connecting portions 4 to the minimum number and the minimum size so that the thermal deformation of the connecting portions 4 does not affect the upper surface plate 2.
  • the connecting portion 4 functions as a fulcrum when the upper surface plate shape is deformed by the seesaw principle when the actuator 5 described later is driven. Therefore, the connecting portion 4 is preferably columnar, for example, so as to function as the fulcrum.
  • the actuator 5 is arranged on the same circumference C1 and C2 in the radial direction of the upper surface plate 2 and at a position different from that on the same circumference C0 where a plurality of suspension columns as the connecting portion 2 are arranged. ..
  • the same circumferences C1 and C2 in which the actuator 5 is arranged are two, but the same circumference may be one, for example, only one of C1 and C2.
  • the number of actuators 5 may be one or more, but is preferably three or more.
  • the number of actuators 5 arranged on the same circumference C1 is 10, and the number of actuators 5 arranged on the same circumference C2 is also 10.
  • the number of actuators 5 arranged on the same circumference C1 inside the connecting portion 4 and the same outside the connecting portion 4 are the same.
  • the number of actuators 5 arranged on the circumference C2 can be set to be the same. However, the numbers of both may be different from each other.
  • the actuator 5 is placed on the circumference of the PCD different from the circular PCD drawn by (the center point) of the suspension column as the connecting portion 4. It is possible to provide a movable mechanism capable of transforming the board shape into various shapes.
  • the actuator 5 deforms the shape of the upper surface plate with the suspension column as the connecting portion 4 as a fulcrum. That is, when the actuator 5 is not driven, the upper surface of the lower surface plate 1 and the lower surface of the upper surface plate 2 are parallel to each other. In this state, when at least one of the actuators 5 is driven in a direction of increasing or decreasing the distance between the suspension top plate 3 and the upper surface plate 2, the upper surface plate 2 is driven by the seesaw principle with the connecting portion 4 as a fulcrum. Tilt, and the upper surface of the lower surface plate 1 and the lower surface of the upper surface plate 2 are not parallel to each other.
  • the power source of the actuator 5 is not particularly limited as long as it is a mechanism capable of locally changing the distance (distance in the vertical direction) between the suspension top plate 3 and the upper surface plate 2.
  • gas pressure such as air pressure, liquid pressure such as hydraulic pressure, electric force, and the like can be used.
  • the power supply to the actuator 5 can be performed from the outside of the double-sided polishing device, or can be performed inside the double-sided polishing device, for example, via a surface plate rotating shaft using a rotary connector.
  • the actuator 5 is an air cylinder that uses air pressure as a power source.
  • the actuator 5 is an air cylinder and includes a cylinder tube 9 and a piston 10 that is movable in the vertical direction in the cylinder tube 9.
  • the upper surface of the cylinder tube 9 is fixed to the lower surface of the suspension top plate 3.
  • the piston 10 is coupled to the upper surface plate 2 via a floating joint 11.
  • the floating joint 11 absorbs eccentricity when the axis of the piston 10 deviates from the central axis X, eccentricity when the axis of the piston 10 is tilted from the central axis X, and the like.
  • the shape of the upper surface plate that is, the inclination of the upper surface plate 2 can be controlled.
  • the upper surface plate 2 is preferably made of a low thermal expansion material (for example, a metal material) having a linear thermal expansion coefficient of 6 ⁇ 10 -6 / K or less.
  • the thermal deformation of the connecting portions 4 is not transmitted to the upper surface plate, and the original function of the low thermal expansion material (wafer and polishing pad). This is because it is difficult to be deformed by frictional heat).
  • a movable mechanism of the surface plate that can be applied to a hanging double-sided polishing device, does not promote thermal deformation of the surface plate, and can change the surface plate shape into various shapes is provided. Can be provided. Therefore, when both sides of the wafer are polished using the double-sided polishing device, the wafer shape can be stabilized for a long period of time.
  • GBIR Global Backside Ideal Range
  • the actuator is an air cylinder that uses compressed air as a drive source, and when adjusting the inclination of the upper surface plate, compressed air is supplied from an external supply source of the double-sided polishing device to the actuator in the double-sided polishing device. Was operated.
  • the shape of the upper surface plate that is, the inclination of the upper surface plate was deformed according to the pad shape.
  • the inclination of the lower surface plate and the inclination of the upper surface plate were calculated from the measured radius profiles, and adjusted so that the difference between the inclination of the lower surface plate and the inclination of the upper surface plate was 0.020 ⁇ m / mm or less. ..
  • Wafer processing and measurement conditions are as follows.
  • a P-type silicon single crystal wafer having a diameter of 300 mm was used.
  • a foamed polyurethane pad having a Shore A hardness of 85 was used.
  • FRP in which glass fiber was impregnated with epoxy resin was used as an insert on a titanium substrate.
  • Five carriers were set in the double-sided polishing apparatus as one set, and one wafer was set for each carrier.
  • a silica abrasive grain-containing material an average particle size of 35 nm, an abrasive grain concentration of 1.0 wt%, a pH of 10.5, and a KOH base was used.
  • the machining load was set to 180 gf / cm 2 .
  • the processing time was set by back calculation from the polishing rate so that the batch average value of the center thickness of the wafer was within 775 ⁇ 0.5 ⁇ m.
  • the rotation speed of each drive unit was set to an upper surface plate: -13.4 rpm, a lower surface plate: 35 rpm, a sun gear: 25 rpm, and an internal gear: 7 rpm.
  • the dressing of the polishing pad was performed by sliding a dress plate on which diamond abrasive grains were electrodeposited on each of the upper and lower polishing pads while flowing pure water at 120 gf / cm 2 .
  • the sliding contact time was 5 min, and the frequency was every 5 batches.
  • FIG. 4 shows the relationship between cross-life and GBIR for Examples and Comparative Examples.
  • the horizontal axis indicates the cross life and corresponds to the number of batch processes (integrated value).
  • the vertical axis represents GBIR.
  • one plot is the average value of five sheets per batch.
  • the number of batch processes (integrated value) at the time when GBIR reached the standard value 1 was defined as the cross life (average life) in the examples, and it was verified how much the cross life in the examples would be. ..
  • the monitoring transition of GBIR is around 0.4 at the stage where the number of batch processes (integrated value) is small in both the examples and the comparative examples.
  • the cross-life of the examples was about 1.4 with respect to the cross-life of the comparative example (standard value 1). That is, in the examples, it was confirmed that the cross-life within the GBIR standard value of 1 or less was improved about 1.4 times as compared with the comparative example.
  • the wafer shape can be stabilized for a long period of time when both sides of the wafer are polished using a double-sided polishing device.
  • a movable mechanism of the surface plate that does not promote thermal deformation of the surface plate and can deform the surface plate shape into various shapes. Can be provided. Therefore, when both sides of the wafer are polished using the double-sided polishing device, the wafer shape can be stabilized for a long period of time.
  • the present invention is not limited to the above embodiment.
  • the above-described embodiment is an example, and any object having substantially the same configuration as the technical idea described in the claims of the present invention and exhibiting the same effect and effect is the present invention. Is included in the technical scope of.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

The present invention is a two-side polishing device equipped with: a lower platen that is provided so as to be rotatable about a rotating shaft and that has a polishing pad affixed to an upper surface thereof; an upper platen that is provided above the lower platen so as to be movable up and down and rotatable about the rotating shaft and that has a polishing pad affixed to a lower surface thereof; and a suspended top that is provided above the upper platen. The two-side polishing device is characterized by comprising: a connecting part that connects the suspended top and the upper platen; and an actuator that is provided between the suspended top and the upper platen, in a position different from the connecting part, and that is capable of deforming the shape of the upper platen. Due to this configuration, a platen moving mechanism is provided that enables the shape of a platen to be deformed into various shapes without promoting thermal deformation of the platen in a duplex polishing device in a suspended state.

Description

両面研磨装置Double-sided polishing device
　本発明は、吊り下げ形態の両面研磨装置に関する。 The present invention relates to a hanging type double-sided polishing apparatus.
　低熱膨張材を定盤に採用した両面研磨装置は研磨の加工熱による定盤変形を抑止できることから、研磨中の定盤形状精度、結果としてウェーハの加工精度の安定性に優れていた（特許文献１参照）。しかし、定盤に貼り付けられる研磨パッド（クロス）が定盤の形状精度の影響を受けながらドレス及び研磨により摩耗されて形状が変わってしまうために、研磨バッチを重ねていくといった長期的な視点では、上記両面研磨装置でもウェーハの加工精度を一定に保つことができていなかった。 Since the double-sided polishing device that uses a low thermal expansion material for the surface plate can suppress the deformation of the surface plate due to the processing heat of polishing, it is excellent in the stability of the surface plate shape during polishing and, as a result, the processing accuracy of the wafer (Patent Document). 1). However, since the polishing pad (cloth) attached to the surface plate is worn by dressing and polishing while being affected by the shape accuracy of the surface plate, the shape changes, so a long-term perspective such as stacking polishing batches. However, even with the double-sided polishing apparatus, the processing accuracy of the wafer could not be kept constant.
　例えば、図５は、定盤形状精度の影響を受けて平行でなくなった研磨パッドの例を示し、図６は、そのパッドが偏摩耗を引き起こしている例を示す。 For example, FIG. 5 shows an example of a polishing pad that is no longer parallel due to the influence of surface plate shape accuracy, and FIG. 6 shows an example in which the pad causes uneven wear.
　図５及び図６において、１０１は、下定盤、１０２は、上定盤、１０３及び１０４は、研磨パッド、１０５は、サンギア、１０６は、インターナルギア、１０７は、キャリアである。これらの図に示すように、研磨パッド１０３、１０４は、下定盤１０１と上定盤１０２の精度低下に起因して平行でない状態となる。この状態で、キャリア１０７が下定盤１０１と上定盤１０２との間に配置されると、キャリア１０７と研磨パッド１０３、１０４との接触が均等でないために偏摩耗を引き起こし、ウェーハの加工精度が一定に保てなかった。 In FIGS. 5 and 6, 101 is a lower surface plate, 102 is an upper surface plate, 103 and 104 are polishing pads, 105 is a sun gear, 106 is an internal gear, and 107 is a carrier. As shown in these figures, the polishing pads 103 and 104 are not parallel to each other due to the decrease in accuracy of the lower surface plate 101 and the upper surface plate 102. In this state, if the carrier 107 is arranged between the lower surface plate 101 and the upper surface plate 102, uneven contact between the carrier 107 and the polishing pads 103 and 104 causes uneven wear, and the processing accuracy of the wafer is improved. I couldn't keep it constant.
特開２００１－７９７５６号公報Japanese Unexamined Patent Publication No. 2001-79756 特開２００８－４４０９８号公報Japanese Unexamined Patent Publication No. 2008-44098
　そこで、上記のような研磨パッドの偏摩耗を抑制するために、該研磨パッドの形状（定盤形状精度やすでに偏摩耗した状態など）に応じて、定盤形状を変形させることが想起される。しかし、既存技術では、定盤形状を変形させるために定盤を保持する金属製のディスクが必要であり、該ディスクの熱変形が定盤に伝わってしまい、定盤に低熱膨張材を使用した場合の長所を十分に活かすことができていなかった（特許文献２）。 Therefore, in order to suppress the uneven wear of the polishing pad as described above, it is recalled that the surface plate shape is deformed according to the shape of the polishing pad (surface plate shape accuracy, already uneven wear state, etc.). .. However, in the existing technology, a metal disk for holding the surface plate is required to deform the surface plate shape, and the thermal deformation of the surface plate is transmitted to the surface plate, and a low thermal expansion material is used for the surface plate. The advantages of the case could not be fully utilized (Patent Document 2).
　例えば、図７は、定盤の可動機構を備えた従来の両面研磨装置の例を示す。
　同図において、１０２は、上定盤、１０８は、吊り天板、１０９は、ディスクであり、エアーの入力圧ＩＮでディスク１０９を動かす力Ｐを発生させることにより、ディスク１０９の傾き、すなわち、上定盤形状を変化させる。しかし、ディスク１０９が金属製であるために、該ディスク１０９が熱変形し易く、かつ熱変形が上定盤１０２に伝わることで、上定盤１０２も変形し易くなっていた。また、同図の例では、上定盤形状が一方向のみに変形可能であるため、様々な種類のパッド形状に対応できなかった。 For example, FIG. 7 shows an example of a conventional double-sided polishing apparatus provided with a movable mechanism of a surface plate.
In the figure, 102 is an upper surface plate, 108 is a suspended top plate, and 109 is a disc. By generating a force P that moves the disc 109 with an air input pressure IN, the inclination of the disc 109, that is, Change the shape of the upper surface plate. However, since the disc 109 is made of metal, the disc 109 is easily deformed by heat, and the heat deformation is transmitted to the upper surface plate 102, so that the upper surface plate 102 is also easily deformed. Further, in the example of the figure, since the upper surface plate shape can be deformed in only one direction, it cannot correspond to various types of pad shapes.
　このようなことから、低熱膨張材の定盤を前提とした吊り下げ形態の両面研磨装置に適用可能であって、該低熱膨張材の定盤の長所を害せず、かつ様々な種類のパッド形状に応じて定盤形状を様々な形に変形可能である定盤の可動機構が求められていた。 For this reason, it can be applied to a double-sided polishing device in a suspended form on the premise of a surface plate of a low thermal expansion material, does not impair the advantages of the surface plate of the low thermal expansion material, and various types of pads. There has been a demand for a movable mechanism of the surface plate that can change the surface plate shape into various shapes according to the shape.
　本発明は、上記問題を解決するためになされたものであり、吊り下げ形態の両面研磨装置において、定盤の熱変形を助長せず、かつ定盤形状を様々な形に変形可能な定盤の可動機構を提案することを目的とする。 The present invention has been made to solve the above problems, and is a surface plate capable of deforming the surface plate shape into various shapes without promoting thermal deformation of the surface plate in a double-sided polishing apparatus in a suspended form. The purpose is to propose a movable mechanism of.
　上記目的を達成するために、本発明では、回転軸を中心に回転可能に設けられ、上面に研磨パッドが貼り付けられた下定盤と、前記下定盤の上方に上下動可能、かつ前記回転軸を中心に回転可能に設けられ、下面に研磨パッドが貼り付けられた上定盤と、前記上定盤の上方に設けられる吊り天板とを具備する両面研磨装置において、前記吊り天板と前記上定盤とを連結する連結部と、前記吊り天板と前記上定盤との間であって前記連結部と異なる位置に設けられ、上定盤形状を変形可能なアクチュエータとを具備することを特徴とする両面研磨装置を提供する。 In order to achieve the above object, in the present invention, a lower surface plate that is rotatably provided around a rotation shaft and has a polishing pad attached to the upper surface, and a lower surface plate that can move up and down above the lower surface plate and the rotation shaft. In a double-sided polishing apparatus including an upper surface plate rotatably provided around the center and a polishing pad attached to the lower surface thereof, and a suspension top plate provided above the upper surface plate, the suspension top plate and the above It is provided with a connecting portion for connecting the upper surface plate and an actuator provided between the suspended top plate and the upper surface plate at a position different from the connecting portion and capable of deforming the shape of the upper surface plate. Provided is a double-sided polishing apparatus characterized by the above.
　このような両面研磨装置によれば、連結部により上定盤と吊り天板とが連結され、該連結部と異なる位置に設けられたアクチュエータにより上定盤形状が変形される。すなわち、連結部とアクチュエータとが互いに独立であるため、既存技術で使用される金属製のディスクが不要である。また、アクチュエータにより上定盤形状を様々な形に変形可能である。従って、定盤の熱変形を助長せず、かつ定盤形状を様々な形に変形可能な定盤の可動機構を備えた吊り下げ形態の両面研磨装置を提供できる。 According to such a double-sided polishing device, the upper surface plate and the suspended top plate are connected by a connecting portion, and the shape of the upper surface plate is deformed by an actuator provided at a position different from the connecting portion. That is, since the connecting portion and the actuator are independent of each other, the metal disc used in the existing technology is unnecessary. In addition, the shape of the upper surface plate can be transformed into various shapes by the actuator. Therefore, it is possible to provide a suspended double-sided polishing device provided with a movable mechanism of the surface plate that does not promote thermal deformation of the surface plate and can deform the surface plate shape into various shapes.
　また、仮に、定盤の形状精度の影響を受けながらドレス及び研磨が繰り返されることにより、研磨パッドが偏摩耗されてしまったとしても、パッド形状に応じて定盤形状を変形させることが可能となるため、研磨バッチを重ねていくといった長期的な視点において、ウェーハの加工精度を一定に保つことが可能となる。 Further, even if the polishing pad is unevenly worn by repeating dressing and polishing while being affected by the shape accuracy of the surface plate, the surface plate shape can be deformed according to the pad shape. Therefore, it is possible to keep the processing accuracy of the wafer constant from a long-term viewpoint such as stacking polishing batches.
　前記連結部は、前記上定盤の半径方向の同一円周上に配置される複数個の吊り支柱からなり、前記アクチュエータは、前記上定盤の半径方向の同一円周上であって前記複数個の吊り支柱とは異なる位置に１個以上配置されることが好ましい。 The connecting portion is composed of a plurality of suspension columns arranged on the same circumference in the radial direction of the upper surface plate, and the actuator is on the same circumference in the radial direction of the upper surface plate. It is preferable that one or more are arranged at different positions from the individual suspension columns.
　このように、回転軸を中心とした場合に、複数個の吊り支柱（の中心点）が描く円のＰＣＤ（ピッチ円直径）とは異なるＰＣＤの円周上にアクチュエータを配置することで、上定盤形状を様々な形に変形可能な可動機構を提供できる。 In this way, by arranging the actuator on the circumference of the PCD that is different from the PCD (pitch circle diameter) of the circle drawn by (center points) of the plurality of suspension columns when the rotation axis is the center, the upper It is possible to provide a movable mechanism capable of transforming the platen shape into various shapes.
　前記アクチュエータは、前記複数個の吊り支柱を支点にして前記上定盤形状を変形させるものであることが好ましい。 It is preferable that the actuator deforms the shape of the upper surface plate with the plurality of suspension columns as fulcrums.
　このように、吊り支柱を支点にすることで、シーソーの原理により、少なくとも１つのアクチュエータを動作させ、吊り天板と上定盤との間で反発力を生み出すことで、該上定盤の傾斜（上定盤形状）を容易に制御することができる。 In this way, by using the suspension column as a fulcrum, at least one actuator is operated according to the seesaw principle, and a repulsive force is generated between the suspension top plate and the upper surface plate, so that the upper surface plate is tilted. (Upper surface plate shape) can be easily controlled.
　前記アクチュエータと前記上定盤とを連結するフローティングジョイントをさらに具備し、前記アクチュエータは、前記吊り天板に固定されることが好ましい。 It is preferable that a floating joint for connecting the actuator and the upper surface plate is further provided, and the actuator is fixed to the suspension top plate.
　このように、アクチュエータと上定盤とをフローティングジョイントで連結することにより、該アクチュエータと該上定盤との間に発生する偏心及び偏角を吸収することができ、両者の高精度での軸合わせが不要となる。 By connecting the actuator and the upper surface plate with a floating joint in this way, it is possible to absorb the eccentricity and declination generated between the actuator and the upper surface plate, and the shafts of both with high accuracy. No matching is required.
　前記上定盤は、線熱膨張係数が６×１０－６／Ｋ以下の低熱膨張材からなることが好ましい。 The upper surface plate is preferably made of a low thermal expansion material having a linear thermal expansion coefficient of 6 × 10 -6 / K or less.
　このように、上定盤が低熱膨張材であれば、該上定盤が熱変形し難いという吊り下げ形態の長所を生かすことができる。すなわち、上定盤は、連結部（例えば、吊り支柱）で支持されるため、該連結部を最小限の数、かつ最小限のサイズにすることで、連結部の熱変形が上定盤に伝わらなくなり、低熱膨張材の本来の機能（ウェーハと研磨パッドとの摩擦熱により変形し難い）を発揮することができる。 As described above, if the upper surface plate is a low thermal expansion material, the advantage of the suspended form that the upper surface plate is not easily deformed by heat can be utilized. That is, since the upper surface plate is supported by the connecting portion (for example, a hanging strut), the thermal deformation of the connecting portion can be reduced to the upper surface plate by reducing the number of the connecting portions to the minimum size. It is not transmitted, and the original function of the low thermal expansion material (hard to be deformed by the frictional heat between the wafer and the polishing pad) can be exhibited.
　以上のように、本発明によれば、吊り下げ形態の両面研磨装置において、定盤の熱変形を助長せず、かつ定盤形状を様々な形に変形可能な定盤の可動機構を提供することができる。従って、該両面研磨装置を用いてウェーハの両面を研磨する場合に、ウェーハ形状を長期的に安定化させることが可能となる。 As described above, according to the present invention, in the suspended double-sided polishing apparatus, a movable mechanism of a surface plate that does not promote thermal deformation of the surface plate and can deform the surface plate shape into various shapes is provided. be able to. Therefore, when both sides of the wafer are polished using the double-sided polishing device, the wafer shape can be stabilized for a long period of time.
本発明の両面研磨装置の概略を示す部分拡大図である。It is a partially enlarged view which shows the outline of the double-sided polishing apparatus of this invention. 本発明の両面研磨装置の詳細を示す図である。It is a figure which shows the detail of the double-sided polishing apparatus of this invention. アクチュエータの構造例を示す図である。It is a figure which shows the structural example of an actuator. 実施例と比較例とについてクロスライフとＧＢＩＲとの関係を示す図である。It is a figure which shows the relationship between the cross life and GBIR about an Example and a comparative example. 定盤形状精度の影響を受けて平行でなくなった研磨パッドの例を示す図である。It is a figure which shows the example of the polishing pad which became parallel by the influence of the surface plate shape accuracy. 研磨パッドが偏摩耗を引き起こしている例を示す図である。It is a figure which shows the example which causes uneven wear of a polishing pad. 定盤の可動機構を備えた従来の両面研磨装置の例を示す図である。It is a figure which shows the example of the conventional double-sided polishing apparatus provided with the movable mechanism of a surface plate.
　上記のとおり、従来は、長期的な視点においてウェーハの加工精度を一定に保つため、定盤の形状精度の影響を受けながらドレス及び研磨が繰り返されることで発生する研磨パッドの偏摩耗に対しては、パッド形状に応じて定盤形状を変形させることで対応していた。しかし、既存技術では、定盤を保持する金属製のディスクの熱変形が該定盤に伝わってしまう、定盤形状を一方向のみにしか変形できない、といった問題があった。 As described above, conventionally, in order to keep the processing accuracy of the wafer constant from a long-term perspective, the uneven wear of the polishing pad caused by repeated dressing and polishing while being affected by the shape accuracy of the surface plate Corresponded by deforming the surface plate shape according to the pad shape. However, the existing technology has problems that the thermal deformation of the metal disk holding the surface plate is transmitted to the surface plate and that the surface plate shape can be deformed only in one direction.
　本発明者らは、上記問題について鋭意検討を重ねた結果、吊り天板と上定盤とを連結する連結部とは別に、吊り天板と上定盤との間であって連結部と異なる位置にアクチュエータを設け、該アクチュエータにより上定盤形状を変形することで、定盤の熱変形を助長せず、かつ定盤形状を様々な形に変形可能となることを見出した。すなわち、連結部は、吊り天板と上定盤とを連結すればよいため、最小限の数、かつ最小限のサイズで連結部を構成すれば、該連結部の熱変形が上定盤に影響を与えることがない、一方、上定盤形状は、連結部とは独立に設けられたアクチュエータにより変形させれば、該上定盤形状を様々な形に変形できる、といったことを本発明者らは見出し、本発明を完成させた。 As a result of diligent studies on the above problems, the present inventors, apart from the connecting portion that connects the suspended top plate and the upper surface plate, are different from the connecting portion between the suspended top plate and the upper surface plate. It has been found that by providing an actuator at a position and deforming the upper surface plate shape by the actuator, it is possible to deform the surface plate shape into various shapes without promoting the thermal deformation of the surface plate. That is, since the connecting portion only needs to connect the suspended top plate and the upper surface plate, if the connecting portion is configured with the minimum number and the minimum size, the thermal deformation of the connecting portion becomes the upper surface plate. The present inventor states that the upper surface plate shape can be deformed into various shapes by deforming the upper surface plate shape by an actuator provided independently of the connecting portion. Et al. Found and completed the present invention.
　すなわち、本発明は、回転軸を中心に回転可能に設けられ、上面に研磨パッドが貼り付けられた下定盤と、前記下定盤の上方に上下動可能、かつ前記回転軸を中心に回転可能に設けられ、下面に研磨パッドが貼り付けられた上定盤と、前記上定盤の上方に設けられる吊り天板とを具備する両面研磨装置において、前記吊り天板と前記上定盤とを連結する連結部と、前記吊り天板と前記上定盤との間であって前記連結部と異なる位置に設けられ、上定盤形状を変形可能なアクチュエータとを具備することを特徴とする両面研磨装置である。 That is, the present invention is rotatably provided about a rotation axis and has a lower surface plate having a polishing pad attached to the upper surface, and can move up and down above the lower surface plate and can rotate about the rotation axis. In a double-sided polishing apparatus provided with an upper surface plate provided with a polishing pad attached to the lower surface and a suspension top plate provided above the upper surface plate, the suspension top plate and the upper surface plate are connected. Double-sided polishing characterized by comprising an actuator provided between the suspending top plate and the upper surface plate at a position different from the connection portion and capable of deforming the shape of the upper surface plate. It is a device.
　以下、本発明の実施の形態について、添付した図面に基づいて具体的に説明するが、本発明は、これらに限定されるものではない。 Hereinafter, embodiments of the present invention will be specifically described with reference to the attached drawings, but the present invention is not limited thereto.
　図１は、本発明の両面研磨装置の概略を示す。
　下定盤１は、回転軸ＡＸを中心に回転可能に設けられ、上面に研磨パッド７ｂが貼り付けられている。上定盤２は、下定盤１の上方に上下動可能、かつ回転軸ＡＸを中心に回転可能に設けられ、下面に研磨パッド７ａが貼り付けられている。ウェーハを保持するキャリア（ドレス時には、例えば、ドレッサに変更される）８は、下定盤１と上定盤２との間に配置される。 FIG. 1 shows an outline of the double-sided polishing apparatus of the present invention.
The lower platen 1 is rotatably provided around the rotation axis AX, and a polishing pad 7b is attached to the upper surface thereof. The upper surface plate 2 is provided so as to be vertically movable above the lower surface plate 1 and rotatably about the rotation axis AX, and a polishing pad 7a is attached to the lower surface thereof. The carrier 8 that holds the wafer (changed to, for example, a dresser at the time of dressing) 8 is arranged between the lower surface plate 1 and the upper surface plate 2.
　吊り天板３は、上定盤２の上方に設けられ、支柱６により保持される。連結部４は、吊り天板３と上定盤２とを連結する。従って、吊り天板３を上下動させることにより、これに連動して上定盤２を上下動させることができる。 The hanging top plate 3 is provided above the upper surface plate 2 and is held by the support columns 6. The connecting portion 4 connects the suspended top plate 3 and the upper surface plate 2. Therefore, by moving the hanging top plate 3 up and down, the upper surface plate 2 can be moved up and down in conjunction with this.
　アクチュエータ５は、吊り天板３と上定盤２との間であって連結部４と異なる位置に設けられ、上定盤２の傾き（上定盤形状）を変形させることができる。本例では、アクチュエータ５の数は、２個であるが、１個以上であればよい。また、アクチュエータ５の位置も、連結部４と異なる位置であれば、特に限定されることはない。 The actuator 5 is provided between the suspension top plate 3 and the upper surface plate 2 at a position different from that of the connecting portion 4, and can deform the inclination (upper surface plate shape) of the upper surface plate 2. In this example, the number of actuators 5 is two, but it may be one or more. Further, the position of the actuator 5 is not particularly limited as long as it is a position different from that of the connecting portion 4.
　本例では、２個のアクチュエータ５は、回転軸ＡＸに垂直となる半径方向に並んで配置される。この場合、半径方向における上定盤２の傾きを２個のアクチュエータ５のいずれか一方を駆動させることで変形させることが可能となる。 In this example, the two actuators 5 are arranged side by side in the radial direction perpendicular to the rotation axis AX. In this case, the inclination of the upper surface plate 2 in the radial direction can be deformed by driving either one of the two actuators 5.
　例えば、２個のアクチュエータ５が駆動されていない状態（上下方向に伸縮可能な状態で吊り天板３と上定盤２との間に単に接続されている状態）において、下定盤１の上面と上定盤２の下面が平行である場合に、内側（回転軸ＡＸに近い側）のアクチュエータ５が、伸びる、すなわち、吊り天板３と上定盤２との距離を広げる方向に駆動されると、シーソーの原理により、外側（回転軸ＡＸに遠い側）のアクチュエータ５が、吊り天板３と上定盤２との距離を狭める方向に縮む。その結果、上定盤２は、半径方向の内側が外側よりも低い状態に傾くことになる。 For example, in a state where the two actuators 5 are not driven (in a state where they are simply connected between the suspension top plate 3 and the upper surface plate 2 in a state where they can be expanded and contracted in the vertical direction), the upper surface plate 1 and the upper surface plate 1 When the lower surfaces of the upper surface plate 2 are parallel, the actuator 5 on the inner side (the side closer to the rotation axis AX) is driven in a direction of extending, that is, increasing the distance between the suspension top plate 3 and the upper surface plate 2. Then, according to the seesaw principle, the actuator 5 on the outside (the side far from the rotation axis AX) contracts in the direction of narrowing the distance between the suspension top plate 3 and the upper surface plate 2. As a result, the upper surface plate 2 is inclined so that the inner side in the radial direction is lower than the outer side.
　一方、内側のアクチュエータ５が、縮む、すなわち、吊り天板３と上定盤２との距離を狭める方向に駆動されると、シーソーの原理により、外側のアクチュエータ５が、吊り天板３と上定盤２との距離を広げる方向に伸びる。その結果、上定盤２は、半径方向の内側が外側よりも高い状態に傾くことになる。 On the other hand, when the inner actuator 5 contracts, that is, is driven in a direction that narrows the distance between the suspension top plate 3 and the upper surface plate 2, the outer actuator 5 is moved above the suspension top plate 3 according to the seesaw principle. It extends in the direction of increasing the distance from the surface plate 2. As a result, the upper surface plate 2 is inclined so that the inner side in the radial direction is higher than the outer side.
　なお、上定盤形状、すなわち、上定盤２の傾きは、アクチュエータ５の位置を変えることにより、又は吊り天板３と上定盤２との間に複数個のアクチュエータ５を設け、かつ所定のアクチュエータ５を駆動させることにより、様々な形に変形させることができる。 The shape of the upper surface plate, that is, the inclination of the upper surface plate 2, is determined by changing the position of the actuator 5 or by providing a plurality of actuators 5 between the suspension top plate 3 and the upper surface plate 2. By driving the actuator 5 of the above, it can be deformed into various shapes.
　従って、下定盤１及び上定盤２の形状精度の影響を受けながらドレス及び研磨が繰り返されることにより、研磨パッド７ａ、７ｂが偏摩耗されてしまったとしても、パッド形状に応じて上定盤形状を変形させることが可能となるため、研磨バッチを重ねていくといった長期的な視点において、ウェーハの加工精度を一定に保つことが可能となる。 Therefore, even if the polishing pads 7a and 7b are unevenly worn due to repeated dressing and polishing while being affected by the shape accuracy of the lower surface plate 1 and the upper surface plate 2, the upper surface plate is affected by the pad shape. Since the shape can be deformed, it is possible to keep the processing accuracy of the wafer constant from a long-term viewpoint such as stacking polishing batches.
　また、連結部４は、吊り天板３と上定盤とを連結すればよいため、最小限の数、かつ最小限のサイズで連結部４を構成すればよい。このため、連結部４の熱変形が上定盤２に影響を与えることがなくなる。 Further, since the connecting portion 4 may connect the suspension top plate 3 and the upper surface plate, the connecting portion 4 may be configured with the minimum number and the minimum size. Therefore, the thermal deformation of the connecting portion 4 does not affect the upper surface plate 2.
　図２は、本発明の両面研磨装置の詳細を示す。同図（ａ）は、上定盤２と、連結部４及びアクチュエータ５との位置関係を示す平面図であり、同図（ｂ）は、両面研磨装置の断面図である。図３は、アクチュエータの構造例を示す。 FIG. 2 shows the details of the double-sided polishing apparatus of the present invention. FIG. 3A is a plan view showing the positional relationship between the upper surface plate 2 and the connecting portion 4 and the actuator 5, and FIG. 3B is a sectional view of a double-sided polishing apparatus. FIG. 3 shows an example of the structure of the actuator.
　以下に説明する両面研磨装置は、例えば、下定盤１、上定盤２、サンギア、及びインターナルギアの各駆動部を有する４ウェイ式を前提とする。但し、説明を簡単にするため、サンギア及びインターナルギア（図５及び図６参照）については、ここでは省略する。 The double-sided polishing device described below is premised on a 4-way type having each drive unit of, for example, a lower surface plate 1, an upper surface plate 2, a sun gear, and an internal gear. However, for the sake of simplicity, the sun gear and the internal gear (see FIGS. 5 and 6) will be omitted here.
　下定盤１、上定盤２、吊り天板３、連結部４、アクチュエータ５、支柱６、及び研磨パッド７ａ、７ｂは、それぞれ、図１の下定盤１、上定盤２、吊り天板３、連結部４、アクチュエータ５、支柱６、及び研磨パッド７ａ、７ｂに対応する。吊り天板３は、回転軸ＡＸを中心とする円板状であり、上定盤２は、回転軸ＡＸを中心とするリング状である。下定盤１は、図示しないサンギアとインターナルギアとの間に配置され、サンギア（回転軸ＡＸ）を中心として自転が可能な円板状を有する。 The lower surface plate 1, the upper surface plate 2, the suspension top plate 3, the connecting portion 4, the actuator 5, the support column 6, and the polishing pads 7a and 7b are the lower surface plate 1, the upper surface plate 2, and the suspension top plate 3 in FIG. 1, respectively. Corresponds to the connecting portion 4, the actuator 5, the support column 6, and the polishing pads 7a and 7b. The suspending top plate 3 has a disk shape centered on the rotating shaft AX, and the upper surface plate 2 has a ring shape centered on the rotating shaft AX. The lower platen 1 is arranged between a sun gear and an internal gear (not shown), and has a disk shape capable of rotating around the sun gear (rotation axis AX).
　連結部４は、上定盤２の半径方向の同一円周Ｃ０上に配置される複数個の吊り支柱からなる。本例では、連結部４は、同一円周Ｃ０上に配置される６個の吊り支柱からなるが、該吊り支柱の数は、これに限定されることはない。但し、連結部４は、上定盤２を支えることが目的の一つであるため、安定して上定盤２を支えるために同一円周Ｃ０上に３個以上配置することが好ましい。 The connecting portion 4 is composed of a plurality of suspension columns arranged on the same circumference C0 in the radial direction of the upper surface plate 2. In this example, the connecting portion 4 is composed of six suspension columns arranged on the same circumference C0, but the number of the suspension columns is not limited to this. However, since one of the purposes of the connecting portion 4 is to support the upper surface plate 2, it is preferable to arrange three or more connecting portions 4 on the same circumference C0 in order to stably support the upper surface plate 2.
　連結部４の材質は、特に限定されることはないが、例えば、金属製である。但し、連結部４の熱変形が上定盤２に影響しないように、連結部４は、最小限の数、かつ最小限のサイズに設定することが好ましい。 The material of the connecting portion 4 is not particularly limited, but is, for example, made of metal. However, it is preferable to set the number of the connecting portions 4 to the minimum number and the minimum size so that the thermal deformation of the connecting portions 4 does not affect the upper surface plate 2.
　連結部４は、後述するアクチュエータ５が駆動されるときに、シーソーの原理により上定盤形状を変形させるときの支点として機能する。従って、連結部４は、該支点として機能するように、例えば、円柱状であることが好ましい。 The connecting portion 4 functions as a fulcrum when the upper surface plate shape is deformed by the seesaw principle when the actuator 5 described later is driven. Therefore, the connecting portion 4 is preferably columnar, for example, so as to function as the fulcrum.
　アクチュエータ５は、上定盤２の半径方向の同一円周Ｃ１、Ｃ２上であって、連結部２としての複数個の吊り支柱が配置される同一円周Ｃ０上とは異なる位置に配置される。本例では、アクチュエータ５が配置される同一円周Ｃ１、Ｃ２を２つにしているが、該同一円周は、１つ、例えば、Ｃ１及びＣ２のいずれか一方のみであってもよい。また、アクチュエータ５の数は、１個以上であればよいが、３個以上であることが好ましい。 The actuator 5 is arranged on the same circumference C1 and C2 in the radial direction of the upper surface plate 2 and at a position different from that on the same circumference C0 where a plurality of suspension columns as the connecting portion 2 are arranged. .. In this example, the same circumferences C1 and C2 in which the actuator 5 is arranged are two, but the same circumference may be one, for example, only one of C1 and C2. The number of actuators 5 may be one or more, but is preferably three or more.
　本例では、同一円周Ｃ１上に配置されるアクチュエータ５の数を１０個とし、同一円周Ｃ２上に配置されるアクチュエータ５の数も１０個としている。このように、アクチュエータ５が配置される同一円周Ｃ１、Ｃ２を２つとした場合、連結部４の内側の同一円周Ｃ１上に配置されるアクチュエータ５の数と、連結部４の外側の同一円周Ｃ２上に配置されるアクチュエータ５の数とは、同じに設定することができる。但し、両者の数は、互いに異なっていてもよい。 In this example, the number of actuators 5 arranged on the same circumference C1 is 10, and the number of actuators 5 arranged on the same circumference C2 is also 10. In this way, when two actuators 5 are arranged on the same circumference C1 and C2, the number of actuators 5 arranged on the same circumference C1 inside the connecting portion 4 and the same outside the connecting portion 4 are the same. The number of actuators 5 arranged on the circumference C2 can be set to be the same. However, the numbers of both may be different from each other.
　このように、回転軸ＡＸを中心とした場合に、連結部４としての吊り支柱（の中心点）が描く円のＰＣＤとは異なるＰＣＤの円周上にアクチュエータ５を配置することで、上定盤形状を様々な形に変形可能な可動機構を提供できる。 In this way, when the rotation axis AX is centered, the actuator 5 is placed on the circumference of the PCD different from the circular PCD drawn by (the center point) of the suspension column as the connecting portion 4. It is possible to provide a movable mechanism capable of transforming the board shape into various shapes.
　具体的には、アクチュエータ５は、連結部４としての吊り支柱を支点にして上定盤形状を変形させる。すなわち、アクチュエータ５が駆動されていない状態では、下定盤１の上面と上定盤２の下面とは互いに平行である。この状態において、アクチュエータ５のうちの少なくとも１つが吊り天板３と上定盤２との距離を広げる又は狭める方向に駆動されると、連結部４を支点としたシーソーの原理により上定盤２が傾き、下定盤１の上面と上定盤２の下面とが互いに平行でなくなる。 Specifically, the actuator 5 deforms the shape of the upper surface plate with the suspension column as the connecting portion 4 as a fulcrum. That is, when the actuator 5 is not driven, the upper surface of the lower surface plate 1 and the lower surface of the upper surface plate 2 are parallel to each other. In this state, when at least one of the actuators 5 is driven in a direction of increasing or decreasing the distance between the suspension top plate 3 and the upper surface plate 2, the upper surface plate 2 is driven by the seesaw principle with the connecting portion 4 as a fulcrum. Tilt, and the upper surface of the lower surface plate 1 and the lower surface of the upper surface plate 2 are not parallel to each other.
　ここで、アクチュエータ５の構造例を説明する。
　アクチュエータ５は、吊り天板３と上定盤２との距離（上下方向の間隔）を局所的に変更できる機構であれば、その動力源が特に限定されることはない。例えば、アクチュエータ５の動力源は、空気圧などの気体の圧力、油圧などの液体の圧力、電動力などを利用することができる。また、アクチュエータ５への動力供給は、両面研磨装置の外部から行うこともできるし、又は両面研磨装置の内部、例えば、ロータリーコネクタを用いて定盤回転軸経由で行うこともできる。 Here, a structural example of the actuator 5 will be described.
The power source of the actuator 5 is not particularly limited as long as it is a mechanism capable of locally changing the distance (distance in the vertical direction) between the suspension top plate 3 and the upper surface plate 2. For example, as the power source of the actuator 5, gas pressure such as air pressure, liquid pressure such as hydraulic pressure, electric force, and the like can be used. Further, the power supply to the actuator 5 can be performed from the outside of the double-sided polishing device, or can be performed inside the double-sided polishing device, for example, via a surface plate rotating shaft using a rotary connector.
　以下では、動力源として空気圧を用いるエアーシリンダをアクチュエータ５とする例を説明する。
　図３に示すように、アクチュエータ５は、エアーシリンダであり、シリンダチューブ９と、シリンダチューブ９内において上下方向に可動であるピストン１０とを備える。シリンダチューブ９の上面は、吊り天板３の下面に固定される。ピストン１０は、フローティングジョイント１１を介して、上定盤２に結合される。 Hereinafter, an example in which the actuator 5 is an air cylinder that uses air pressure as a power source will be described.
As shown in FIG. 3, the actuator 5 is an air cylinder and includes a cylinder tube 9 and a piston 10 that is movable in the vertical direction in the cylinder tube 9. The upper surface of the cylinder tube 9 is fixed to the lower surface of the suspension top plate 3. The piston 10 is coupled to the upper surface plate 2 via a floating joint 11.
　そして、シリンダチューブ９内の空気１２の圧力が高くなると、ピストン１０は、下方向に移動するため、上定盤２を下方向に押す力を発生させる。また、シリンダチューブ９内の空気１２の圧力が低くなると、ピストン１０は、上方向に移動するため、上定盤２を上方向に引く力を発生させる。この時、フローティングジョイント１１は、ピストン１０の軸が中心軸Ｘからずれた場合の偏心や、ピストン１０の軸が中心軸Ｘから傾いた場合の偏角などを吸収する。 Then, when the pressure of the air 12 in the cylinder tube 9 becomes high, the piston 10 moves downward, so that a force for pushing the upper surface plate 2 downward is generated. Further, when the pressure of the air 12 in the cylinder tube 9 becomes low, the piston 10 moves upward, so that a force for pulling the upper surface plate 2 upward is generated. At this time, the floating joint 11 absorbs eccentricity when the axis of the piston 10 deviates from the central axis X, eccentricity when the axis of the piston 10 is tilted from the central axis X, and the like.
　このように、エアーシリンダをアクチュエータ５とすることで、上定盤形状、すなわち、上定盤２の傾きを制御できる。 In this way, by using the air cylinder as the actuator 5, the shape of the upper surface plate, that is, the inclination of the upper surface plate 2 can be controlled.
　なお、上定盤２は、線熱膨張係数が６×１０－６／Ｋ以下の低熱膨張材（例えば、金属材料）からなることが好ましい。なお、線熱膨張係数は、低ければ低いものほどよく、下限は特にないが、例えば０．１×１０－６／Ｋ以上とすることができる。この場合、連結部４を最小限の数、かつ最小限のサイズにすることで、連結部４の熱変形が上定盤に伝わらなくなり、低熱膨張材の本来の機能（ウェーハと研磨パッドとの摩擦熱により変形し難い）を発揮することができるからである。 The upper surface plate 2 is preferably made of a low thermal expansion material (for example, a metal material) having a linear thermal expansion coefficient of 6 × 10 -6 / K or less. The lower the coefficient of linear thermal expansion, the better, and there is no particular lower limit, but it can be, for example, 0.1 × 10-6 / K or more. In this case, by making the number of connecting portions 4 the minimum number and the minimum size, the thermal deformation of the connecting portions 4 is not transmitted to the upper surface plate, and the original function of the low thermal expansion material (wafer and polishing pad). This is because it is difficult to be deformed by frictional heat).
　以上の両面研磨装置によれば、吊り下げ形態の両面研磨装置に適用可能であり、定盤の熱変形を助長せず、かつ定盤形状を様々な形に変形可能な定盤の可動機構を提供することができる。従って、該両面研磨装置を用いてウェーハの両面を研磨する場合に、ウェーハ形状を長期的に安定化させることが可能となる。 According to the above double-sided polishing device, a movable mechanism of the surface plate that can be applied to a hanging double-sided polishing device, does not promote thermal deformation of the surface plate, and can change the surface plate shape into various shapes is provided. Can be provided. Therefore, when both sides of the wafer are polished using the double-sided polishing device, the wafer shape can be stabilized for a long period of time.
　以下に本発明の実施例を挙げて、本発明を詳細に説明するが、これらは、本発明を限定するものではない。 Hereinafter, the present invention will be described in detail with reference to examples of the present invention, but these are not intended to limit the present invention.
（実施例）
　以下に示す両面研磨装置を用いて、所定のＧＢＩＲ（Ｇｌｏｂａｌ　Ｂａｃｋｓｉｄｅ　Ｉｄｅａｌ　Ｒａｎｇｅ）を実現可能なクロスライフ（研磨パッドの寿命）を検証した。ここで、ＧＢＩＲとは、ウェーハの平坦度を表す指標の一つであり、裏面基準平面からウェーハ表面までの距離の最大値と最小値との差のことである。 (Example)
Using the double-sided polishing device shown below, the cross life (life of the polishing pad) capable of realizing a predetermined GBIR (Global Backside Ideal Range) was verified. Here, GBIR is one of the indexes representing the flatness of the wafer, and is the difference between the maximum value and the minimum value of the distance from the back surface reference plane to the wafer surface.
　・両面研磨装置の詳細
　下定盤、上定盤、サンギア、インターナルギアの各駆動部を有する４ウェイ式で２０Ｂサイズの両面研磨装置を用いた。上定盤と吊り天板とは、同一円周上に配置される６個の吊り支柱で連結し、各吊り支柱の材料は、ＳＵＳ（ステンレス鋼材）とした。下定盤及び上定盤の材料は、常温付近で熱膨張係数が小さいインバー（熱膨張係数＝１．５×１０－６／Ｋ～４．０×１０－６／Ｋ）とした。 -Details of double-sided polishing device A 4-way type 20B size double-sided polishing device having each drive unit of lower surface plate, upper surface plate, sun gear, and internal gear was used. The upper surface plate and the suspension top plate were connected by six suspension columns arranged on the same circumference, and the material of each suspension column was SUS (stainless steel). Material below platen and the upper platen was the invar thermal expansion coefficient at about room temperature is small (coefficient of thermal expansion = 1.5 × 10 -6 /K~4.0×10 -6 / K).
　６個の吊り支柱が配置される同一円周のＰＣＤに対して、それよりも３００ｍｍ小さいＰＣＤを有する同一円周上、すなわち、６個の吊り支柱が配置される同一円周から内側に１５０ｍｍ離れた同一円周上に、１０個のアクチュエータを配置した。また、６個の吊り支柱が配置される同一円周のＰＣＤに対して、それよりも３００ｍｍ大きいＰＣＤを有する同一円周上、すなわち、６個の吊り支柱が配置される同一円周から外側に１５０ｍｍ離れた同一円周上に、１０個のアクチュエータを配置した。 On the same circumference with a PCD 300 mm smaller than the PCD with the same circumference where the 6 suspension columns are arranged, that is, 150 mm inward from the same circumference where the 6 suspension columns are arranged. Ten actuators were placed on the same circumference. Further, with respect to the PCD having the same circumference in which the six suspension columns are arranged, the PCD having a PCD 300 mm larger than that is on the same circumference, that is, from the same circumference in which the six suspension columns are arranged to the outside. Ten actuators were placed on the same circumference 150 mm apart.
　アクチュエータは、圧縮空気を駆動源としたエアーシリンダとし、上定盤の傾斜を調整する際には、両面研磨装置の外部の供給源から該両面研磨装置内のアクチュエータに圧縮空気を供給してアクチュエータを動作させた。 The actuator is an air cylinder that uses compressed air as a drive source, and when adjusting the inclination of the upper surface plate, compressed air is supplied from an external supply source of the double-sided polishing device to the actuator in the double-sided polishing device. Was operated.
　そして、ウェーハの研磨及びドレスを繰り返し行うに当たって、上定盤形状、すなわち、上定盤の傾きをパッド形状に応じて変形させた。但し、下定盤と上定盤の傾斜度は、それぞれ測定した半径プロファイルから算出し、下定盤の傾斜度と上定盤の傾斜度との差が０．０２０μｍ／ｍｍ以下となるように調整した。 Then, in repeatedly polishing and dressing the wafer, the shape of the upper surface plate, that is, the inclination of the upper surface plate was deformed according to the pad shape. However, the inclination of the lower surface plate and the inclination of the upper surface plate were calculated from the measured radius profiles, and adjusted so that the difference between the inclination of the lower surface plate and the inclination of the upper surface plate was 0.020 μm / mm or less. ..
　・実験内容
　ウェーハの加工（研磨）及び測定条件は、以下の通りである。
　ウェーハは、直径３００ｍｍのＰ型シリコン単結晶ウェーハを用いた。
　研磨パッドは、ショアＡ硬度８５の発泡ポリウレタンパッドを用いた。
　キャリアは、チタン基板に、インサートとしてガラス繊維にエポキシ樹脂を含浸したＦＲＰを用いた。キャリアは、５枚を１セットとして上記両面研磨装置にセットし、ウェーハは、キャリア１枚毎に１枚をセットした。
　スラリーは、シリカ砥粒含有、平均粒径３５ｎｍ、砥粒濃度１．０ｗｔ％、ｐＨ１０．５、ＫＯＨベースを用いた。 -Experimental details Wafer processing (polishing) and measurement conditions are as follows.
As the wafer, a P-type silicon single crystal wafer having a diameter of 300 mm was used.
As the polishing pad, a foamed polyurethane pad having a Shore A hardness of 85 was used.
As the carrier, FRP in which glass fiber was impregnated with epoxy resin was used as an insert on a titanium substrate. Five carriers were set in the double-sided polishing apparatus as one set, and one wafer was set for each carrier.
As the slurry, a silica abrasive grain-containing material, an average particle size of 35 nm, an abrasive grain concentration of 1.0 wt%, a pH of 10.5, and a KOH base was used.
　加工荷重は、１８０ｇｆ／ｃｍ２に設定した。
　加工時間は、ウェーハの中心厚みのバッチ平均値が７７５±０．５μｍに収まるように、研磨レートから逆算して設定した。
　各駆動部の回転速度は、上定盤：－１３．４ｒｐｍ、下定盤：３５ｒｐｍ、サンギア：２５ｒｐｍ、及びインターナルギア：７ｒｐｍに設定した。
　研磨パッドのドレッシングは、ダイヤ砥粒が電着されたドレスプレートを１２０ｇｆ／ｃｍ２で純水を流しながら上下の各研磨パッドに摺接させることで行った。摺接時間は、５ｍｉｎとし、頻度は、５バッチ毎に実施した。
　加工後のウェーハに対しては、ＳＣ－１洗浄を条件（ＮＨ４ＯＨ：Ｈ２Ｏ２：Ｈ２Ｏ＝１：１：１５）で行った。 The machining load was set to 180 gf / cm 2 .
The processing time was set by back calculation from the polishing rate so that the batch average value of the center thickness of the wafer was within 775 ± 0.5 μm.
The rotation speed of each drive unit was set to an upper surface plate: -13.4 rpm, a lower surface plate: 35 rpm, a sun gear: 25 rpm, and an internal gear: 7 rpm.
The dressing of the polishing pad was performed by sliding a dress plate on which diamond abrasive grains were electrodeposited on each of the upper and lower polishing pads while flowing pure water at 120 gf / cm 2 . The sliding contact time was 5 min, and the frequency was every 5 batches.
For the processed wafer, SC-1 cleaning was performed under the condition (NH 4 OH: H 2 O 2 : H 2 O = 1: 1: 15).
　・ＧＢＩＲの算出
　以上の実験内容の下で、ウェーハの研磨及びドレスを繰り返し行い、洗浄後のウェーハについてそのフラットネスを測定し、かつＧＢＩＲを算出した。なお、フラットネスは、洗浄後のウェーハをＫＬＡ　ＴｅｎｃｏｒのＷａｆｅｒＳｉｇｈｔを用いて測定した。ＧＢＩＲは、ウェーハのエッジから２ｍｍの領域を除外して算出した。 -Calculation of GBIR Under the above experimental contents, the wafer was repeatedly polished and dressed, the flatness of the washed wafer was measured, and the GBIR was calculated. The flatness was measured by measuring the washed wafer using KLA Tencor's WaferSight. GBIR was calculated excluding the region 2 mm from the edge of the wafer.
（比較例）
　・両面研磨装置の詳細
　比較例では、上記実施例の両面研磨装置において、アクチュエータ（エアーシリンダ）を有しないものを用いた。すなわち、上定盤形状を変形させることなく、下定盤の上面と上定盤の下面が常に平行な状態の両面研磨装置を用いた。
　・実験内容
　ウェーハの加工及び測定条件は、上記実施例の実験内容と同じ条件とした。
　・ＧＢＩＲの算出
　上記実施例と同じ算出方法によりＧＢＩＲの算出を行った。 (Comparison example)
-Details of double-sided polishing device In the comparative example, the double-sided polishing device of the above-described embodiment without an actuator (air cylinder) was used. That is, a double-sided polishing device was used in which the upper surface of the lower surface plate and the lower surface of the upper surface plate were always parallel without deforming the shape of the upper surface plate.
-Experimental contents The wafer processing and measurement conditions were the same as the experimental contents of the above Examples.
-Calculation of GBIR GBIR was calculated by the same calculation method as in the above embodiment.
（検証結果）
　図４は、実施例と比較例とについてクロスライフとＧＢＩＲとの関係を示す。
　同図において、横軸は、クロスライフを示し、バッチ処理数（積算値）に対応する。縦軸は、ＧＢＩＲを示す。なお、実施例及び比較例ともに、１プロットは、1バッチ５枚の平均値である。 (inspection result)
FIG. 4 shows the relationship between cross-life and GBIR for Examples and Comparative Examples.
In the figure, the horizontal axis indicates the cross life and corresponds to the number of batch processes (integrated value). The vertical axis represents GBIR. In both Examples and Comparative Examples, one plot is the average value of five sheets per batch.
　ここで、ＧＢＩＲ及びクロスライフともに、比較例を基準に規格化することで、実施例における効果が明確化されるようにした。すなわち、ＧＢＩＲは、バッチ処理数（積算値）が増えるに従い、次第に増加していく。そこで、比較例において、ウェーハのＧＢＩＲが所定値に達した時点を規格値１とし、かつＧＢＩＲが規格値１であるときのバッチ処理数（積算値）をクロスライフ（平均寿命）の規格値１とした。 Here, by standardizing both GBIR and cross-life based on comparative examples, the effects in the examples were clarified. That is, GBIR gradually increases as the number of batch processes (integrated value) increases. Therefore, in the comparative example, the time when the GBIR of the wafer reaches a predetermined value is set to the standard value 1, and the number of batch processes (integrated value) when the GBIR is the standard value 1 is set to the standard value 1 of the cross life (average life). And said.
　そして、実施例において、ＧＢＩＲが規格値１に達した時点でのバッチ処理数（積算値）を実施例におけるクロスライフ（平均寿命）とし、実施例におけるクロスライフがどの位になるかを検証した。 Then, in the examples, the number of batch processes (integrated value) at the time when GBIR reached the standard value 1 was defined as the cross life (average life) in the examples, and it was verified how much the cross life in the examples would be. ..
　同図から明らかなように、ＧＢＩＲのモニタリング推移は、実施例及び比較例ともに、バッチ処理数（積算値）が少ない段階では０．４近傍である。しかし、比較例のクロスライフ（規格値１）に対して、実施例のクロスライフは、約１．４となった。すなわち、実施例では、比較例に対して、ＧＢＩＲの規格値１以下に収まるクロスライフが約１．４倍に向上することが確認された。 As is clear from the figure, the monitoring transition of GBIR is around 0.4 at the stage where the number of batch processes (integrated value) is small in both the examples and the comparative examples. However, the cross-life of the examples was about 1.4 with respect to the cross-life of the comparative example (standard value 1). That is, in the examples, it was confirmed that the cross-life within the GBIR standard value of 1 or less was improved about 1.4 times as compared with the comparative example.
　以上の結果から分かるように、実施例では、両面研磨装置を用いてウェーハの両面を研磨する場合に、ウェーハ形状を長期的に安定化させることが可能であることが立証された。 As can be seen from the above results, in the examples, it was proved that the wafer shape can be stabilized for a long period of time when both sides of the wafer are polished using a double-sided polishing device.
　以上、説明してきたように、本発明によれば、吊り下げ形態の両面研磨装置において、定盤の熱変形を助長せず、かつ定盤形状を様々な形に変形可能な定盤の可動機構を提供することができる。従って、該両面研磨装置を用いてウェーハの両面を研磨する場合に、ウェーハ形状を長期的に安定化させることが可能となる。 As described above, according to the present invention, in the suspended double-sided polishing apparatus, a movable mechanism of the surface plate that does not promote thermal deformation of the surface plate and can deform the surface plate shape into various shapes. Can be provided. Therefore, when both sides of the wafer are polished using the double-sided polishing device, the wafer shape can be stabilized for a long period of time.
　なお、本発明は、上記実施形態に限定されるものではない。上記実施形態は例示であり、本発明の特許請求の範囲に記載された技術的思想と実質的に同一な構成を有し、同様な作用効果を奏するものは、いかなるものであっても本発明の技術的範囲に包含される。 The present invention is not limited to the above embodiment. The above-described embodiment is an example, and any object having substantially the same configuration as the technical idea described in the claims of the present invention and exhibiting the same effect and effect is the present invention. Is included in the technical scope of.

Claims (5)

  1. 　回転軸を中心に回転可能に設けられ、上面に研磨パッドが貼り付けられた下定盤と、前記下定盤の上方に上下動可能、かつ前記回転軸を中心に回転可能に設けられ、下面に研磨パッドが貼り付けられた上定盤と、前記上定盤の上方に設けられる吊り天板とを具備する両面研磨装置において、
    　前記吊り天板と前記上定盤とを連結する連結部と、
    　前記吊り天板と前記上定盤との間であって前記連結部と異なる位置に設けられ、上定盤形状を変形可能なアクチュエータとを具備することを特徴とする両面研磨装置。     A lower surface plate that is rotatably provided around a rotation axis and has a polishing pad attached to the upper surface, and a lower surface plate that can move up and down above the lower surface plate and is rotatably provided around the rotation axis and is polished on the lower surface. In a double-sided polishing apparatus provided with an upper surface plate to which a pad is attached and a suspended top plate provided above the upper surface plate.
    A connecting portion that connects the suspended top plate and the upper surface plate,
    A double-sided polishing apparatus provided between the suspended top plate and the upper surface plate at a position different from that of the connecting portion, and provided with an actuator capable of deforming the shape of the upper surface plate.
  2. 　前記連結部は、前記上定盤の半径方向の同一円周上に配置される複数個の吊り支柱からなり、前記アクチュエータは、前記上定盤の半径方向の同一円周上であって前記複数個の吊り支柱とは異なる位置に１個以上配置されることを特徴とする請求項１に記載の両面研磨装置。 The connecting portion is composed of a plurality of suspension columns arranged on the same circumference in the radial direction of the upper surface plate, and the actuator is on the same circumference in the radial direction of the upper surface plate. The double-sided polishing apparatus according to claim 1, wherein one or more of the suspension columns are arranged at different positions.
  3. 　前記アクチュエータは、前記複数個の吊り支柱を支点にして前記上定盤形状を変形させるものであることを特徴とする請求項２に記載の両面研磨装置。 The double-sided polishing apparatus according to claim 2, wherein the actuator deforms the shape of the upper surface plate by using the plurality of suspension columns as fulcrums.
  4. 　前記アクチュエータと前記上定盤とを連結するフローティングジョイントをさらに具備し、
    　前記アクチュエータは、前記吊り天板に固定されることを特徴とする請求項１から請求項３のいずれか１項に記載の両面研磨装置。     A floating joint for connecting the actuator and the upper surface plate is further provided.
    The double-sided polishing apparatus according to any one of claims 1 to 3, wherein the actuator is fixed to the suspended top plate.
  5. 　前記上定盤は、線熱膨張係数が６×１０－６／Ｋ以下の低熱膨張材からなることを特徴とする請求項１から請求項４のいずれか１項に記載の両面研磨装置。 The double-sided polishing apparatus according to any one of claims 1 to 4, wherein the upper surface plate is made of a low thermal expansion material having a linear thermal expansion coefficient of 6 × 10 -6 / K or less.
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