WO2020191808A1 - Photoinduced conductive electrode plate-based micro-electroforming device and micro-electroforming method therefor - Google Patents

Photoinduced conductive electrode plate-based micro-electroforming device and micro-electroforming method therefor Download PDF

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WO2020191808A1
WO2020191808A1 PCT/CN2019/081558 CN2019081558W WO2020191808A1 WO 2020191808 A1 WO2020191808 A1 WO 2020191808A1 CN 2019081558 W CN2019081558 W CN 2019081558W WO 2020191808 A1 WO2020191808 A1 WO 2020191808A1
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electrode plate
light source
electroforming
micro
area
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PCT/CN2019/081558
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French (fr)
Chinese (zh)
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邓宇
岑腾飞
梁广洋
郭钟宁
谭蓉
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广东工业大学
佛山市铬维科技有限公司
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Publication of WO2020191808A1 publication Critical patent/WO2020191808A1/en

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • the invention relates to the technical field of photoconductive micro electroforming, in particular to a micro electroforming device based on a photoconductive electrode plate and a micro electroforming method thereof.
  • Micro-electroforming technology has the same working principle and similar process as traditional electroforming technology, but this technology is used to make micro devices or micro-structures, and it is more related to micro-scale issues, which is significantly different from traditional large-device electroforming. It has a strong response to environmental interference, and is widely used in aviation, aerospace, precision machinery, plastic molds, microelectronics and other fields.
  • the existing micro electroforming processes mainly include X-ray lithography, over-plating electroforming and Ni-PTFE composite electroforming.
  • X-ray lithography requires synchrotron radiation, and deep X-ray lithography is very costly.
  • the electroforming requirements are very strict, high precision and high quality electroforming microstructures are difficult to obtain, and the X-ray lithography electroforming process is cumbersome and the operation is complicated.
  • Over-plating micro-electroforming microstructures will have different defects at the junction of electroforming parts, and the defects will increase significantly with the increase of the pitch/line width ratio of the electroforming structure.
  • the side wall of the groove will play a certain shielding effect on the bottom of the groove, resulting in relatively thin power lines at the bottom of the groove and thinner thickness of the deposited layer.
  • the uneven distribution of the metal deposition layer makes the shape of the deep groove tend to be small and gourd-like.
  • Ni-PTFE composite micro-electroforming is still an electroforming method based on X-ray lithography technology, so mask-assisted processing is still required when electroforming microstructures; in addition, this method must perform a series of treatments on the electroforming liquid to ensure the The casting is normal, so the electroforming process is complicated.
  • the present invention provides a micro electroforming device based on a photoconductive electrode plate and a micro electroforming method thereof.
  • a micro electroforming device based on a photoconductive electrode plate and a micro electroforming method thereof.
  • the technical problem to be solved by the present invention is to provide a micro electroforming device based on a photoconductive electrode plate and a micro electroforming method thereof.
  • a photoconductive layer on the electrode plate, the micro electroforming is realized and the processing process is simplified. , Reduce the production of pulse power, save production cost.
  • the present invention proposes a photoconductive electrode plate-based micro electroforming device, which includes a power supply, a first electrode plate electrically connected to the power supply, and a second electrode plate electrically connected to the power supply.
  • the second electrode plate is a transparent electrode plate, and the light emitted by the light source passes through the second electrode plate and irradiates part of the surface of the photoconductive layer, forming an insulating area and Conductive area
  • the insulating area is an area on the photoconductive layer that is not illuminated by the light source
  • the conductive area is an area on the photoconductive layer that is illuminated by the light source
  • the metal ions in the electrolyte are reduced to metal atoms, and the surface of the conductive region of the metal atoms grows crystal nuclei to form a micro electroforming structure.
  • the photoconductive layer is made of metal photoelectric material or polymer photoelectric material.
  • the photoconductive layer is made of selenium, zinc oxide or cadmium sulfide.
  • the second electrode plate is made of conductive glass or conductive plastic.
  • the light source is a pulsed light source
  • the power supply is a DC power supply
  • the power supply is a pulse power supply.
  • the first electrode plate is an anode electrode plate
  • the second electrode plate is a cathode electrode plate.
  • a micro electroforming method based on the described micro electroforming device includes the following steps:
  • the power supply supplies power to form an electric field between the first electrode plate and the second electrode plate;
  • a light source being a point light source arranged in an array, the light source irradiating the photoconductive layer through the second electrode plate, and forming an array of conductive areas on the photoconductive layer ;
  • the metal ions inside the electrolyte are reduced to metal atoms, and the metal atoms are deposited on the interface between the conductive area and the electrolyte to realize the generation and growth of crystal nuclei and form an electroformed layer with columnar structure arranged in an array;
  • the shape and size of the cross-section of the electroformed layer of the columnar structure are the same as the shape and size of the point light source.
  • a micro electroforming method based on the described micro electroforming device includes the following steps:
  • the power supply supplies power to form an electric field between the first electrode plate and the second electrode plate;
  • the light source irradiates the photoconductive layer through the second electrode plate to form a first conductive region with an area a1 on the photoconductive layer. At this time, the area of the light source is also a1;
  • the metal ions in the electrolyte are reduced to metal atoms, and the metal atoms are deposited on the interface between the first conductive area and the electrolyte to realize the generation and growth of crystal nuclei and form the first electroforming layer;
  • S4 Increase the area of the light source to a2, and form a second conductive area around the first conductive area.
  • the area of the second conductive area is a2-a1.
  • the metal ions in the electrolyte are reduced to metal atoms.
  • step S4 until the preset pyramid-like structure is formed.
  • the present invention has the following beneficial effects:
  • the micro electroforming device based on the photoconductive electrode plate provided by the present invention utilizes the characteristic of the photoconductive layer to conduct electricity under light, and controls the area and shape of electroforming by controlling the shape and area of the light source, eliminating the need for traditional The production of electroforming masks simplifies the processing process and saves production costs.
  • the micro electroforming device based on the photoconductive electrode plate provided by the present invention adopts a low-cost direct current power source and pulse light source to cooperate with each other to realize the effect of a traditional pulse power source, ensure the accuracy of electroforming, and does not need to make a pulse power source.
  • the micro-electroforming method based on the micro-electroforming device provided by the present invention does not require steps such as making a mask, and directly realizes the change of the electroforming structure through the change of the light source, the process is simple, the operation accuracy is high, and the production cost is low.
  • Figure 1 is a schematic diagram of the structure of a micro electroforming device based on a photoconductive electrode plate of the present invention
  • Embodiment 1 of the micro electroforming method based on the micro electroforming device of the present invention is a flowchart of Embodiment 1 of the micro electroforming method based on the micro electroforming device of the present invention
  • Embodiment 3 is a flowchart of Embodiment 2 of the micro electroforming method based on the micro electroforming device of the present invention
  • Embodiment 4 is a schematic structural diagram of Embodiment 2 of the micro electroforming method based on the micro electroforming device of the present invention.
  • a photoconductive electrode plate-based micro electroforming device includes a power supply 1, a first electrode plate electrically connected to the power supply 1, a second electrode plate electrically connected to the power supply 1, The second electrode plate 3, the photoconductive layer 4 on the surface of the second electrode plate 3 close to the first electrode plate 2, the electrolyte 5 for realizing the electrolysis reaction, and the second electrode plate for irradiating 3 of the light source 6;
  • the second electrode plate 3 is a transparent electrode plate, and the light emitted by the light source 6 is transmitted through the second electrode plate 3 and irradiated on a part of the surface of the photoconductive layer 4, on the photoconductive layer 4 An insulating region 41 and a conductive region 42 are formed thereon;
  • the insulating area 41 is an area on the photoconductive layer 4 that is not illuminated by the light source 6, and the conductive area 42 is an area on the photoconductive layer 4 that is illuminated by the light source 6 ;
  • the metal ions in the electrolyte 5 are reduced to metal atoms, and the surface of the conductive region 42 of the metal atoms grows crystal nuclei to form a micro electroforming structure.
  • the power supply 1 is used to provide current to the first electrode plate 2 and the second electrode plate 3 to facilitate the electrolysis reaction of the first electrode plate 2 and the second electrode plate 3 in the electrolyte 5 to realize electroforming .
  • the power supply 1 can be a pulse power supply or a DC power supply.
  • the power supply 1 is a DC power supply, which is used to reduce the production of pulse power supplies and save production costs.
  • the first electrode plate 2 is connected to the power supply 1, and both the first electrode plate 2 and the second electrode plate 3 are located inside the electrolyte 5 to facilitate mutual cooperation and realize the electrolysis reaction.
  • the first electrode plate 2 is an anode electrode plate.
  • the second electrode plate 3 is connected to the power supply 1 and cooperates with the first electrode plate 2 to realize an electrolysis reaction.
  • the second electrode plate 3 is a transparent electrode plate.
  • the second electrode plate 3 is made of conductive glass and conductive glass. Made of transparent conductive materials such as plastic.
  • the first electrode plate 2 is an anode electrode plate.
  • the second electrode plate 3 is a cathode electrode plate, which facilitates the reduction of metal ions in the electrolyte 5 during the electrolysis reaction process and the photoconductivity Metal is deposited on the surface of layer 4 to realize the micro electroforming process of the present invention.
  • the photoconductive layer 4 is located on the surface of the second electrode plate 3 close to the side of the first electrode plate 2, and is made of metal photoelectric material or polymer photoelectric material. Specifically, the photoconductive layer 4 The layer 4 is made of materials such as selenium, zinc oxide, cadmium sulfide, etc. The material of the photoconductive layer 4 is specifically selected according to actual needs.
  • the photoconductive layer 4 has the characteristic of light conductivity, the area exposed to light will form a conductive area 42 and the area without light will form an insulating area 41.
  • the electrolytic solution 5 is used to realize the electrolysis reaction, and contains metal ions and anions, so that during the electrolysis reaction, the metal ions are reduced and deposited on the surface of the photoconductive layer 4.
  • the light source 6 is used to illuminate the photoconductive layer 4 to facilitate the formation of insulating regions 41 and conductive regions 42 on the photoconductive layer 4. Therefore, the shape of the light source 6 of the present invention is based on the specific needs of the electroformed microstructure When the shape changes, if a columnar structure arranged in an array is required, the light source 6 is a point light source arranged in an array.
  • the light source 6 is a pulse light source, which realizes pulse electroforming, thereby improving the precision of electroforming.
  • the power supply 1 of the present invention is a DC power supply
  • the light source 6 is a pulsed light source.
  • the combination of a DC power supply and a pulsed light source realizes the effect of a traditional pulsed power supply. There is no need to make a pulsed power supply, and the electroforming accuracy remains unchanged, which saves production costs. .
  • the power supply 1 supplies power
  • an electric field is formed between the first electrode plate 2 and the second electrode plate 3
  • the light emitted by the light source 6 transmits through the first electrode plate 2 and the second electrode plate 3.
  • the two electrodes 3 are irradiated on the photoconductive layer 4 to form a conductive area 42 on the photoconductive layer 4.
  • the metal ions in the electrolyte 5 are reduced to metal atoms and adsorbed on the surface of the conductive area 42, and the metal atoms are inserted
  • the surface of the conductive region 42 undergoes the generation and growth of crystal nuclei, thereby realizing the micro electroforming process of the present invention.
  • the present invention also provides a micro electroforming method based on the above micro electroforming device.
  • the columnar structure arranged in an array the light source 6 is a point light source arranged in an array, and the shape and size of the point light source are the same as the cross-sectional shape and size of the columnar structure, specifically including the following steps:
  • the power supply 1 supplies power to form an electric field between the first electrode plate 2 and the second electrode plate 3.
  • S2 Provide point light sources arranged in an array.
  • the light sources irradiate the photoconductive layer 4 through the second electrode plate 3 to form conductive areas 42 arranged in an array on the photoconductive layer 4.
  • the metal ions in the electrolyte 5 are reduced to metal atoms, and the metal atoms are deposited on the interface between the conductive area 42 and the electrolyte 5 to realize the generation and growth of crystal nuclei and form an electroformed layer.
  • the electroformed layer is a metal layer, it can also conduct electricity, and metal ions will be continuously deposited on the cross section between the electroformed layer and the electrolyte 5. After the required thickness is obtained, the light source and power supply 1 can be turned off. Complete the entire electroforming process.
  • the light source 6 is a variable area light source, which specifically includes the following steps:
  • the power supply 1 supplies power to form an electric field between the first electrode plate 2 and the second electrode plate 3.
  • the light source 6 irradiates the photoconductive layer 4 through the second electrode plate 3, and forms a first conductive region with an area a1 on the photoconductive layer 4. At this time, the light source area is also a1.
  • the metal ions in the electrolyte 5 are reduced to metal atoms, and the metal atoms are deposited on the interface between the first conductive area and the electrolyte 5 to realize the generation and growth of crystal nuclei and form the first electroforming layer.
  • S4 Increase the area of the light source 6 to a2, and form a second conductive area around the first conductive area.
  • the area of the second conductive area is a2-a1.
  • the metal ions in the electrolyte 5 are reduced to metal atoms.
  • the interface between an electroformed layer and the electrolyte 5 and the cross-section of the second conductive area and the electrolyte 5 are deposited to realize the generation and growth of crystal nuclei to form a second electroformed layer, where a2 is greater than a1.
  • step S4 Repeat step S4 until a preset pyramid-like structure is formed, and the entire electroforming process can be completed.
  • the present invention has the following beneficial effects:
  • the micro electroforming device based on the photoconductive electrode plate provided by the present invention utilizes the characteristic of the photoconductive layer to conduct electricity under light, and controls the area and shape of electroforming by controlling the shape and area of the light source, eliminating the need for traditional The production of electroforming masks simplifies the processing process and saves production costs.
  • the micro electroforming device based on the photoconductive electrode plate provided by the present invention adopts a low-cost direct current power source and pulse light source to cooperate with each other to realize the effect of a traditional pulse power source, ensure the accuracy of electroforming, and does not need to make a pulse power source.
  • the micro-electroforming method based on the micro-electroforming device provided by the present invention does not require steps such as making a mask, and directly realizes the change of the electroforming structure through the change of the light source, the process is simple, the operation accuracy is high, and the production cost is low.

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Abstract

Disclosed is a photoinduced conductive electrode plate-based micro-electroforming device, comprising a power supply, a first electrode plate electrically connected to the power supply, a second electrode plate electrically connected to the power supply, a photoinduced conductive layer located on one side of the surface of the second electrode plate close to the first electrode plate, an electrolyte used for achieving an electrolytic reaction, and a light source used for irradiating the second electrode plate. Accordingly, the present invention further provides a micro-electroforming method based on the micro-electroforming device. According to the photoinduced conductive electrode plate-based micro-electroforming device provided in the present invention, the characteristic that the photoinduced conductive layer is conductive by means of illumination is utilized, the shape and the area of the light source are controlled to control the area and the shape of electroforming, manufacturing of a mask in conventional electroforming processing is omitted, the processing process is simplified, and the production cost is saved.

Description

一种基于光致导电电极板的微电铸装置及其微电铸方法Micro electroforming device based on photoconductive electrode plate and micro electroforming method thereof 技术领域Technical field
本发明涉及一种光致导电微电铸技术领域，具体地，涉及一种基于光致导电电极板的微电铸装置及其微电铸方法。The invention relates to the technical field of photoconductive micro electroforming, in particular to a micro electroforming device based on a photoconductive electrode plate and a micro electroforming method thereof.
背景技术Background technique
随着MEMS(Micro-Electro-Mechanical System，微机电***)技术的广泛研究与发展，在继承传统电铸工艺技术特点的基础上，形成了一种非硅基微结构加工的重要技术——微电铸工艺。微电铸技术与传统电铸技术有着相同的工作原理和相似的工艺过程，但该技术用于制作微器件或者微结构，更多涉及的是微米级尺度问题，与传统大器件电铸有着显著的差别，且对于环境干扰有着较强的响应，广泛应用于航空、航天、精密机械、塑料模具、微电子等领域。With the extensive research and development of MEMS (Micro-Electro-Mechanical System, Micro-Electro-Mechanical System) technology, on the basis of inheriting the characteristics of traditional electroforming technology, an important technology of non-silicon-based microstructure processing has been formed-micro Electroforming process. Micro-electroforming technology has the same working principle and similar process as traditional electroforming technology, but this technology is used to make micro devices or micro-structures, and it is more related to micro-scale issues, which is significantly different from traditional large-device electroforming. It has a strong response to environmental interference, and is widely used in aviation, aerospace, precision machinery, plastic molds, microelectronics and other fields.
现有的微电铸工艺主要有X光光刻技术、Over-plating电铸和Ni-PTFE复合电铸三种，其中X光光刻技术需要同步辐射光，深X射线光刻的成本很高，而且不易实现；由于微结构尺寸小且大高宽比，使得电铸要求非常严格，高精度高质量电铸微结构难以获得，并且X光光刻电铸加工过程繁琐，操作复杂。The existing micro electroforming processes mainly include X-ray lithography, over-plating electroforming and Ni-PTFE composite electroforming. X-ray lithography requires synchrotron radiation, and deep X-ray lithography is very costly. , And not easy to achieve; due to the small size of the microstructure and the large aspect ratio, the electroforming requirements are very strict, high precision and high quality electroforming microstructures are difficult to obtain, and the X-ray lithography electroforming process is cumbersome and the operation is complicated.
Over-plating微电铸加工微结构时电铸部分的交接处会出现不同情况的瑕疵，而且瑕疵会随着电铸结构的间距/线宽比的增加显著增大，另外当电铸高深宽比的复杂零件，槽侧壁对槽底会起到一定的屏蔽作用，导致槽底电力线相对稀薄，沉积层厚度较薄。随着电铸过程的推进，金属沉积层的不均匀分布使深槽的形状趋于口小地大的葫芦状。Over-plating micro-electroforming microstructures will have different defects at the junction of electroforming parts, and the defects will increase significantly with the increase of the pitch/line width ratio of the electroforming structure. In addition, when the electroforming has a high aspect ratio For the complicated parts of the steel, the side wall of the groove will play a certain shielding effect on the bottom of the groove, resulting in relatively thin power lines at the bottom of the groove and thinner thickness of the deposited layer. With the advancement of the electroforming process, the uneven distribution of the metal deposition layer makes the shape of the deep groove tend to be small and gourd-like.
Ni-PTFE复合微电铸依然是基于X光光刻技术的电铸方法，因此电铸微结构的时候依然需要掩模辅助加工；此外该方法必须对电铸液进行一系列的处理来保证电铸的正常的进行，因此电铸过程繁琐。Ni-PTFE composite micro-electroforming is still an electroforming method based on X-ray lithography technology, so mask-assisted processing is still required when electroforming microstructures; in addition, this method must perform a series of treatments on the electroforming liquid to ensure the The casting is normal, so the electroforming process is complicated.
另一方面，上述电铸方法，通常为了提高电铸精度，一般会采用精密高频脉冲电源进行加工，电源复杂，成本高昂。On the other hand, in the above electroforming methods, in order to improve the accuracy of electroforming, a precision high-frequency pulse power supply is generally used for processing, which is complicated and costly.
基于上述微电铸方法的种种不足之处，有必要提出一种新型电铸装置，解决以上问题。Based on the shortcomings of the above-mentioned micro-electroforming method, it is necessary to propose a new type of electroforming device to solve the above problems.
本发明提出一种基于光致导电电极板的微电铸装置及其微电铸方法，通过在电极板上设置光致导电层，实现了微电铸，简化了加工过程，减少了脉冲电源的制作，节约生产成本。The present invention provides a micro electroforming device based on a photoconductive electrode plate and a micro electroforming method thereof. By arranging a photoconductive layer on the electrode plate, the micro electroforming is realized, the processing process is simplified, and the pulse power supply is reduced. Production, saving production costs.
发明内容Summary of the invention
本发明要解决的技术问题是提供一种基于光致导电电极板的微电铸装置及其微电铸方法，通过在电极板上设置光致导电层，实现了微电铸，简化了加工过程，减少了脉冲电源的制作，节约生产成本。The technical problem to be solved by the present invention is to provide a micro electroforming device based on a photoconductive electrode plate and a micro electroforming method thereof. By arranging a photoconductive layer on the electrode plate, the micro electroforming is realized and the processing process is simplified. , Reduce the production of pulse power, save production cost.
为了解决上述技术问题，本发明提出一种基于光致导电电极板的微电铸装置，包括供电电源、与所述供电电源电连接的第一电极板、与所述供电电源电连接的第二电极板、位于所述第二电极板表面靠近所述第一电极板一侧的光致导电层、用于实现电解反应的电解液以及用于照射所述第二电极板的光源；In order to solve the above technical problems, the present invention proposes a photoconductive electrode plate-based micro electroforming device, which includes a power supply, a first electrode plate electrically connected to the power supply, and a second electrode plate electrically connected to the power supply. An electrode plate, a photoconductive layer on the surface of the second electrode plate close to the first electrode plate, an electrolyte for realizing an electrolysis reaction, and a light source for illuminating the second electrode plate;
所述第二电极板为透明电极板，所述光源发出的光透过所述第二电极板照射在所述光致导电层的部分表面上，在所述光致导电层上形成绝缘区和导电区；The second electrode plate is a transparent electrode plate, and the light emitted by the light source passes through the second electrode plate and irradiates part of the surface of the photoconductive layer, forming an insulating area and Conductive area
其中，所述绝缘区为所述光致导电层上未被所述光源照射到的区域，所述导电区为所述光致导电层上被所述光源照射到的区域；Wherein, the insulating area is an area on the photoconductive layer that is not illuminated by the light source, and the conductive area is an area on the photoconductive layer that is illuminated by the light source;
通电后，电解液中的金属离子被还原成金属原子，金属原子所述导电区的表面进行晶核的长大，形成微电铸结构。After being energized, the metal ions in the electrolyte are reduced to metal atoms, and the surface of the conductive region of the metal atoms grows crystal nuclei to form a micro electroforming structure.
优选地，所述光致导电层由金属光电材料或高分子光电材质制成。Preferably, the photoconductive layer is made of metal photoelectric material or polymer photoelectric material.
优选地，所述光致导电层由硒、氧化锌或硫化镉制成。Preferably, the photoconductive layer is made of selenium, zinc oxide or cadmium sulfide.
优选地，所述第二电极板由导电玻璃或导电塑料制成。Preferably, the second electrode plate is made of conductive glass or conductive plastic.
优选地，所述光源为脉冲光源，所述供电电源为直流电源。Preferably, the light source is a pulsed light source, and the power supply is a DC power supply.
优选地，所述供电电源为脉冲电源。Preferably, the power supply is a pulse power supply.
优选地，所述第一电极板为阳极电极板；Preferably, the first electrode plate is an anode electrode plate;
所述第二电极板为阴极电极板。The second electrode plate is a cathode electrode plate.
一种基于所述的微电铸装置的微电铸方法，包括以下步骤：A micro electroforming method based on the described micro electroforming device includes the following steps:
S1、供电电源供电，在第一电极板与第二电极板之间形成电场；S1. The power supply supplies power to form an electric field between the first electrode plate and the second electrode plate;
S2、提供光源，所述光源为阵列排布的点光源，所述光源透过所述第二电极板照射在光致导电层上，在所述光致导电层上形成阵列排布的导电区；S2. Provide a light source, the light source being a point light source arranged in an array, the light source irradiating the photoconductive layer through the second electrode plate, and forming an array of conductive areas on the photoconductive layer ；
S3、电解液内部的金属离子被还原成金属原子，金属原子在所述导电区与 电解液的界面上沉积，实现晶核的生成和长大，形成阵列排布的柱状结构的电铸层；S3. The metal ions inside the electrolyte are reduced to metal atoms, and the metal atoms are deposited on the interface between the conductive area and the electrolyte to realize the generation and growth of crystal nuclei and form an electroformed layer with columnar structure arranged in an array;
其中，该柱状结构的电铸层的截面的形状及大小与所述点光源的形状及大小相同。Wherein, the shape and size of the cross-section of the electroformed layer of the columnar structure are the same as the shape and size of the point light source.
一种基于所述的微电铸装置的微电铸方法，包括以下步骤：A micro electroforming method based on the described micro electroforming device includes the following steps:
S1、供电电源供电，在第一电极板与第二电极板之间形成电场；S1. The power supply supplies power to form an electric field between the first electrode plate and the second electrode plate;
S2、光源透过所述第二电极板照射在光致导电层上，在光致导电层上形成面积为a1的第一导电区，此时，光源面积也为a1；S2. The light source irradiates the photoconductive layer through the second electrode plate to form a first conductive region with an area a1 on the photoconductive layer. At this time, the area of the light source is also a1;
S3、电解液内部的金属离子被还原成金属原子，金属原子在第一导电区与电解液的界面上沉积，实现晶核的生成和长大，形成第一电铸层；S3. The metal ions in the electrolyte are reduced to metal atoms, and the metal atoms are deposited on the interface between the first conductive area and the electrolyte to realize the generation and growth of crystal nuclei and form the first electroforming layer;
S4、增加光源面积为a2，在第一导电区的周围形成第二导电区，第二导电区的面积为a2-a1，电解液内部的金属离子被还原成金属原子，金属原子在第一电铸层与电解液的界面和第二导电区与电解液的界面上沉积，实现晶核的生成和长大，形成第二电铸层，其中，a2大于a1；S4. Increase the area of the light source to a2, and form a second conductive area around the first conductive area. The area of the second conductive area is a2-a1. The metal ions in the electrolyte are reduced to metal atoms. Deposit on the interface between the casting layer and the electrolyte and the interface between the second conductive area and the electrolyte to realize the generation and growth of crystal nuclei and form the second electroformed layer, where a2 is greater than a1;
重复步骤S4,直至形成预设的类金字塔结构。Repeat step S4 until the preset pyramid-like structure is formed.
与现有技术相比，本发明的有益效果在于：Compared with the prior art, the present invention has the following beneficial effects:
1、本发明提供的基于光致导电电极板的微电铸装置，利用光致导电层受光照导电的特性，通过控制光源的形状及面积来控制电铸呈的面积及形状，省去了传统电铸加工的掩膜的制作，简化了加工过程，节约了生产成本。1. The micro electroforming device based on the photoconductive electrode plate provided by the present invention utilizes the characteristic of the photoconductive layer to conduct electricity under light, and controls the area and shape of electroforming by controlling the shape and area of the light source, eliminating the need for traditional The production of electroforming masks simplifies the processing process and saves production costs.
2、本发明提供的基于光致导电电极板的微电铸装置，采用成本低廉的直流电源和脉冲光源相互配合，实现了传统脉冲电源的效果，保证了电铸精度，且无须制作脉冲电源。2. The micro electroforming device based on the photoconductive electrode plate provided by the present invention adopts a low-cost direct current power source and pulse light source to cooperate with each other to realize the effect of a traditional pulse power source, ensure the accuracy of electroforming, and does not need to make a pulse power source.
3、本发明提供的基于微电铸装置的微电铸方法，无须制作掩膜等步骤，直接通过光源的改变实现电铸结构的改变，工艺简单，操作精度高，生产成本低。3. The micro-electroforming method based on the micro-electroforming device provided by the present invention does not require steps such as making a mask, and directly realizes the change of the electroforming structure through the change of the light source, the process is simple, the operation accuracy is high, and the production cost is low.
附图说明Description of the drawings
图1为本发明基于光致导电电极板的微电铸装置的结构示意图；Figure 1 is a schematic diagram of the structure of a micro electroforming device based on a photoconductive electrode plate of the present invention;
图2为本发明基于所述微电铸装置的微电铸方法的实施例一的流程图；2 is a flowchart of Embodiment 1 of the micro electroforming method based on the micro electroforming device of the present invention;
图3为本发明基于所述微电铸装置的微电铸方法的实施例二的流程图；3 is a flowchart of Embodiment 2 of the micro electroforming method based on the micro electroforming device of the present invention;
图4为本发明基于所述微电铸装置的微电铸方法的实施例二的结构示意图。4 is a schematic structural diagram of Embodiment 2 of the micro electroforming method based on the micro electroforming device of the present invention.
具体实施方式detailed description
为了使本领域的技术人员更好地理解本发明的技术方案，下面结合附图和优选实施例对本发明作进一步的详细说明。In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and preferred embodiments.
如图1所示，一种基于光致导电电极板的微电铸装置，包括供电电源1、与所述供电电源1电连接的第一电极板2、与所述供电电源1电连接的第二电极板3、位于所述第二电极板3表面靠近所述第一电极板2一侧的光致导电层4、用于实现电解反应的电解液5以及用于照射所述第二电极板3的光源6；As shown in Figure 1, a photoconductive electrode plate-based micro electroforming device includes a power supply 1, a first electrode plate electrically connected to the power supply 1, a second electrode plate electrically connected to the power supply 1, The second electrode plate 3, the photoconductive layer 4 on the surface of the second electrode plate 3 close to the first electrode plate 2, the electrolyte 5 for realizing the electrolysis reaction, and the second electrode plate for irradiating 3 of the light source 6;
所述第二电极板3为透明电极板，所述光源6发出的光透过所述第二电极板3照射在所述光致导电层4的部分表面上，在所述光致导电层4上形成绝缘区41和导电区42；The second electrode plate 3 is a transparent electrode plate, and the light emitted by the light source 6 is transmitted through the second electrode plate 3 and irradiated on a part of the surface of the photoconductive layer 4, on the photoconductive layer 4 An insulating region 41 and a conductive region 42 are formed thereon;
其中，所述绝缘区41为所述光致导电层4上未被所述光源6照射到的区域，所述导电区42为所述光致导电层4上被所述光源6照射到的区域；Wherein, the insulating area 41 is an area on the photoconductive layer 4 that is not illuminated by the light source 6, and the conductive area 42 is an area on the photoconductive layer 4 that is illuminated by the light source 6 ；
通电后，电解液5中的金属离子被还原成金属原子，金属原子所述导电区42的表面进行晶核的长大，形成微电铸结构。After energization, the metal ions in the electrolyte 5 are reduced to metal atoms, and the surface of the conductive region 42 of the metal atoms grows crystal nuclei to form a micro electroforming structure.
所述供电电源1用于给所述第一电极板2和第二电极板3提供电流，便于第一电极板2和第二电极板3在所述电解液5内部进行电解反应，实现电铸。所述供电电源1可以为脉冲电源，也可以为直流电源，本实施例中，所述供电电源1为直流电源，用于减少脉冲电源的制作，节约生产成本。The power supply 1 is used to provide current to the first electrode plate 2 and the second electrode plate 3 to facilitate the electrolysis reaction of the first electrode plate 2 and the second electrode plate 3 in the electrolyte 5 to realize electroforming . The power supply 1 can be a pulse power supply or a DC power supply. In this embodiment, the power supply 1 is a DC power supply, which is used to reduce the production of pulse power supplies and save production costs.
所述第一电极板2与所述供电电源1相连接，其与所述第二电极板3均位于所述电解液5内部，便于相互配合，实现电解反应。本实施例中，所述第一电极板2为阳极电极板。The first electrode plate 2 is connected to the power supply 1, and both the first electrode plate 2 and the second electrode plate 3 are located inside the electrolyte 5 to facilitate mutual cooperation and realize the electrolysis reaction. In this embodiment, the first electrode plate 2 is an anode electrode plate.
所述第二电极板3与所述供电电源1相连接，其与所述第一电极板2相互配合，实现电解反应。为了便于所述光源6发出的光能够顺利的照射到所述光致导电层4上，所述第二电极板3为透明电极板，具体的，所述第二电极板3由导电玻璃、导电塑料等透明导电材料制成。The second electrode plate 3 is connected to the power supply 1 and cooperates with the first electrode plate 2 to realize an electrolysis reaction. In order to facilitate the light emitted by the light source 6 to be smoothly irradiated on the photoconductive layer 4, the second electrode plate 3 is a transparent electrode plate. Specifically, the second electrode plate 3 is made of conductive glass and conductive glass. Made of transparent conductive materials such as plastic.
此处，所述第一电极板2为阳极电极板，相应的，所述第二电极板3为阴极电极板，便于电解反应过程中，电解液5中的金属离子还原，并在光致导电层4的表面沉积金属，实现本发明的微电铸过程。Here, the first electrode plate 2 is an anode electrode plate. Correspondingly, the second electrode plate 3 is a cathode electrode plate, which facilitates the reduction of metal ions in the electrolyte 5 during the electrolysis reaction process and the photoconductivity Metal is deposited on the surface of layer 4 to realize the micro electroforming process of the present invention.
所述光致导电层4位于所述第二电极板3的表面靠近所述第一电极板2的 一侧，其由金属光电材料或高分子光电材质制成，具体的，所述光致导电层4由硒、氧化锌、硫化镉等材料制成，具体根据实际需要，选择所述光致导电层4的材料。The photoconductive layer 4 is located on the surface of the second electrode plate 3 close to the side of the first electrode plate 2, and is made of metal photoelectric material or polymer photoelectric material. Specifically, the photoconductive layer 4 The layer 4 is made of materials such as selenium, zinc oxide, cadmium sulfide, etc. The material of the photoconductive layer 4 is specifically selected according to actual needs.
此处需要说明的是，由于所述光致导电层4具有光照导电的特性，故其受到光照的区域会形成导电区42，没有光照的区域会形成绝缘区41。It should be noted here that because the photoconductive layer 4 has the characteristic of light conductivity, the area exposed to light will form a conductive area 42 and the area without light will form an insulating area 41.
所述电解液5用于实现电解反应，其内含有金属离子及阴离子，便于电解反应时，金属离子被还原，沉积于所述光致导电层4的表面。The electrolytic solution 5 is used to realize the electrolysis reaction, and contains metal ions and anions, so that during the electrolysis reaction, the metal ions are reduced and deposited on the surface of the photoconductive layer 4.
所述光源6用于照射所述光致导电层4，便于在所述光致导电层4上形成绝缘区41和导电区42，故本发明的光源6形状根据具体需要电铸的微结构的形状的变化而变化，如需要阵列排布的柱状结构时，则所述光源6为阵列排布的点光源。The light source 6 is used to illuminate the photoconductive layer 4 to facilitate the formation of insulating regions 41 and conductive regions 42 on the photoconductive layer 4. Therefore, the shape of the light source 6 of the present invention is based on the specific needs of the electroformed microstructure When the shape changes, if a columnar structure arranged in an array is required, the light source 6 is a point light source arranged in an array.
为了提高微电铸结构的精度，实现脉冲电铸，本实施例中，所述光源6为脉冲光源，实现了脉冲电铸，从而提高电铸精度。In order to improve the precision of the micro electroforming structure and realize pulse electroforming, in this embodiment, the light source 6 is a pulse light source, which realizes pulse electroforming, thereby improving the precision of electroforming.
本发明的供电电源1为直流电源，光源6为脉冲光源，采用直流电源与脉冲光源的结合，实现了传统脉冲电源的效果，无须制作脉冲电源，且电铸精度保持不变，节约了生产成本。The power supply 1 of the present invention is a DC power supply, and the light source 6 is a pulsed light source. The combination of a DC power supply and a pulsed light source realizes the effect of a traditional pulsed power supply. There is no need to make a pulsed power supply, and the electroforming accuracy remains unchanged, which saves production costs. .
本发明提供的基于光致导电电极板的微电铸装置，电铸时，供电电源1供电，在第一电极板2与第二电极板3之间形成电场，光源6发出的光透过第二电极3板照射于光致导电层4上，在光致导电层4上形成导电区42，电解液5中的金属离子被还原成金属原子，并吸附在导电区42表面，金属原子置入导电区42表面进行晶核的生成和长大，从而实现了本发明的微电铸过程。In the micro electroforming device based on the photoconductive electrode plate provided by the present invention, during electroforming, the power supply 1 supplies power, an electric field is formed between the first electrode plate 2 and the second electrode plate 3, and the light emitted by the light source 6 transmits through the first electrode plate 2 and the second electrode plate 3. The two electrodes 3 are irradiated on the photoconductive layer 4 to form a conductive area 42 on the photoconductive layer 4. The metal ions in the electrolyte 5 are reduced to metal atoms and adsorbed on the surface of the conductive area 42, and the metal atoms are inserted The surface of the conductive region 42 undergoes the generation and growth of crystal nuclei, thereby realizing the micro electroforming process of the present invention.
相应的本发明还提供基于上述微电铸装置的微电铸方法。Correspondingly, the present invention also provides a micro electroforming method based on the above micro electroforming device.
下面通过两个具体实施例说明通过上述微电铸装置电铸阵列排布的柱状结构和类金字塔结构的过程：The following two specific embodiments illustrate the process of the columnar structure and the pyramid-like structure arranged by the electroforming array of the micro electroforming device:
实施例一Example one
如图2所示，阵列排布的柱状结构，光源6为阵列排布的点光源，且该点光源的形状及大小与柱状结构的截面形状及大小相同，具体包括以下步骤：As shown in FIG. 2, the columnar structure arranged in an array, the light source 6 is a point light source arranged in an array, and the shape and size of the point light source are the same as the cross-sectional shape and size of the columnar structure, specifically including the following steps:
S1、供电电源1供电，在所述第一电极板2与所述第二电极板3之间形成电场。S1. The power supply 1 supplies power to form an electric field between the first electrode plate 2 and the second electrode plate 3.
S2、提供阵列排布的点光源，该光源透过所述第二电极板3照射在光致导 电层4上，在光致导电层4上形成阵列排布的导电区42。S2. Provide point light sources arranged in an array. The light sources irradiate the photoconductive layer 4 through the second electrode plate 3 to form conductive areas 42 arranged in an array on the photoconductive layer 4.
S3、电解液5内部的金属离子被还原成金属原子，金属原子在导电区42与电解液5的界面上沉积，实现晶核的生成和长大，形成电铸层。S3. The metal ions in the electrolyte 5 are reduced to metal atoms, and the metal atoms are deposited on the interface between the conductive area 42 and the electrolyte 5 to realize the generation and growth of crystal nuclei and form an electroformed layer.
此处由于电铸层为金属层，亦可以导电，金属离子就会不断的在电铸层与电解液5之间的截面上沉积，得到所需的厚度后，关闭光源和供电电源1即可完成整个电铸过程。Since the electroformed layer is a metal layer, it can also conduct electricity, and metal ions will be continuously deposited on the cross section between the electroformed layer and the electrolyte 5. After the required thickness is obtained, the light source and power supply 1 can be turned off. Complete the entire electroforming process.
实施方式二Implementation mode two
如图3-4所示，类金字塔结构，光源6为面积可变的光源，具体包括以下步骤：As shown in Figure 3-4, with a pyramid-like structure, the light source 6 is a variable area light source, which specifically includes the following steps:
S1、供电电源1供电，在所述第一电极板2与所述第二电极板3之间形成电场。S1. The power supply 1 supplies power to form an electric field between the first electrode plate 2 and the second electrode plate 3.
S2、光源6透过所述第二电极板3照射在光致导电层4上，在光致导电层4上形成面积为a1的第一导电区，此时，光源面积也为a1。S2. The light source 6 irradiates the photoconductive layer 4 through the second electrode plate 3, and forms a first conductive region with an area a1 on the photoconductive layer 4. At this time, the light source area is also a1.
S3、电解液5内部的金属离子被还原成金属原子，金属原子在第一导电区与电解液5的界面上沉积，实现晶核的生成和长大，形成第一电铸层。S3. The metal ions in the electrolyte 5 are reduced to metal atoms, and the metal atoms are deposited on the interface between the first conductive area and the electrolyte 5 to realize the generation and growth of crystal nuclei and form the first electroforming layer.
S4、增加光源6面积为a2，在第一导电区的周围形成第二导电区，第二导电区的面积为a2-a1，电解液5内部的金属离子被还原成金属原子，金属原子在第一电铸层与电解液5的界面和第二导电区与电解液5的截面上沉积，实现晶核的生成和长大，形成第二电铸层，其中，a2大于a1。S4. Increase the area of the light source 6 to a2, and form a second conductive area around the first conductive area. The area of the second conductive area is a2-a1. The metal ions in the electrolyte 5 are reduced to metal atoms. The interface between an electroformed layer and the electrolyte 5 and the cross-section of the second conductive area and the electrolyte 5 are deposited to realize the generation and growth of crystal nuclei to form a second electroformed layer, where a2 is greater than a1.
重复步骤S4,直至形成预设的类金字塔结构，即可完成整个电铸过程。Repeat step S4 until a preset pyramid-like structure is formed, and the entire electroforming process can be completed.
与现有技术相比，本发明的有益效果在于：Compared with the prior art, the present invention has the following beneficial effects:
1、本发明提供的基于光致导电电极板的微电铸装置，利用光致导电层受光照导电的特性，通过控制光源的形状及面积来控制电铸呈的面积及形状，省去了传统电铸加工的掩膜的制作，简化了加工过程，节约了生产成本。1. The micro electroforming device based on the photoconductive electrode plate provided by the present invention utilizes the characteristic of the photoconductive layer to conduct electricity under light, and controls the area and shape of electroforming by controlling the shape and area of the light source, eliminating the need for traditional The production of electroforming masks simplifies the processing process and saves production costs.
2、本发明提供的基于光致导电电极板的微电铸装置，采用成本低廉的直流电源和脉冲光源相互配合，实现了传统脉冲电源的效果，保证了电铸精度，且无须制作脉冲电源。2. The micro electroforming device based on the photoconductive electrode plate provided by the present invention adopts a low-cost direct current power source and pulse light source to cooperate with each other to realize the effect of a traditional pulse power source, ensure the accuracy of electroforming, and does not need to make a pulse power source.
3、本发明提供的基于微电铸装置的微电铸方法，无须制作掩膜等步骤，直接通过光源的改变实现电铸结构的改变，工艺简单，操作精度高，生产成本低。3. The micro-electroforming method based on the micro-electroforming device provided by the present invention does not require steps such as making a mask, and directly realizes the change of the electroforming structure through the change of the light source, the process is simple, the operation accuracy is high, and the production cost is low.
以上所述是本发明的优选实施方式，应当指出，对于本技术领域的普通技 术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本发明的保护范围。The above are the preferred embodiments of the present invention. It should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and modifications can be made, and these improvements and modifications are also considered This is the protection scope of the present invention.

Claims (9)

  1. 一种基于光致导电电极板的微电铸装置，其特征在于，包括供电电源、与所述供电电源电连接的第一电极板、与所述供电电源电连接的第二电极板、位于所述第二电极板表面靠近所述第一电极板一侧的光致导电层、用于实现电解反应的电解液以及用于照射所述第二电极板的光源；A micro electroforming device based on a photoconductive electrode plate, characterized in that it comprises a power supply, a first electrode plate electrically connected to the power supply, a second electrode plate electrically connected to the power supply, and The photoconductive layer on the surface of the second electrode plate close to the side of the first electrode plate, the electrolyte used to realize the electrolysis reaction, and the light source used to illuminate the second electrode plate;
    所述第二电极板为透明电极板，所述光源发出的光透过所述第二电极板照射在所述光致导电层的部分表面上，在所述光致导电层上形成绝缘区和导电区；The second electrode plate is a transparent electrode plate, and the light emitted by the light source passes through the second electrode plate and irradiates part of the surface of the photoconductive layer, forming an insulating area and Conductive area
    其中，所述绝缘区为所述光致导电层上未被所述光源照射到的区域，所述导电区为所述光致导电层上被所述光源照射到的区域；Wherein, the insulating area is an area on the photoconductive layer that is not illuminated by the light source, and the conductive area is an area on the photoconductive layer that is illuminated by the light source;
    通电后，电解液中的金属离子被还原成金属原子，金属原子所述导电区的表面进行晶核的长大，形成微电铸结构。After being energized, the metal ions in the electrolyte are reduced to metal atoms, and the surface of the conductive region of the metal atoms grows crystal nuclei to form a micro electroforming structure.
  2. 如权利要求1所述的基于光致导电电极板的微电铸装置，其特征在于，所述光致导电层由金属光电材料或高分子光电材质制成。The micro electroforming device based on the photoconductive electrode plate according to claim 1, wherein the photoconductive layer is made of metal photoelectric material or polymer photoelectric material.
  3. 如权利要求1或2所述的基于光致导电电极板的微电铸装置，其特征在于，所述光致导电层由硒、氧化锌或硫化镉制成。The micro electroforming device based on the photoconductive electrode plate according to claim 1 or 2, wherein the photoconductive layer is made of selenium, zinc oxide or cadmium sulfide.
  4. 如权利要求1所述的基于光致导电电极板的微电铸装置，其特征在于，所述第二电极板由导电玻璃或导电塑料制成。The micro electroforming device based on the photoconductive electrode plate according to claim 1, wherein the second electrode plate is made of conductive glass or conductive plastic.
  5. 如权利要求1所述的基于光致导电电极板的微电铸装置，其特征在于，所述光源为脉冲光源，所述供电电源为直流电源。The micro electroforming device based on the photoconductive electrode plate of claim 1, wherein the light source is a pulsed light source, and the power supply is a DC power source.
  6. 如权利要求1所述的基于光致导电电极板的微电铸装置，其特征在于，所述供电电源为脉冲电源。The micro electroforming device based on the photoconductive electrode plate of claim 1, wherein the power supply is a pulse power supply.
  7. 如权利要求1所述的基于光致导电电极板的微电铸装置，其特征在于，所述第一电极板为阳极电极板；The micro-electroforming device based on the photoconductive electrode plate according to claim 1, wherein the first electrode plate is an anode electrode plate;
    所述第二电极板为阴极电极板。The second electrode plate is a cathode electrode plate.
  8. 一种基于权利要求1-7任一项所述的微电铸装置的微电铸方法，其特征在于，包括以下步骤：A micro electroforming method based on the micro electroforming device of any one of claims 1-7, characterized in that it comprises the following steps:
    S1、供电电源供电，在第一电极板与第二电极板之间形成电场；S1. The power supply supplies power to form an electric field between the first electrode plate and the second electrode plate;
    S2、提供光源，所述光源为阵列排布的点光源，所述光源透过所述第二电极板照射在光致导电层上，在所述光致导电层上形成阵列排布的导电区；S2. Provide a light source, the light source being a point light source arranged in an array, the light source irradiating the photoconductive layer through the second electrode plate, and forming an array of conductive areas on the photoconductive layer ；
    S3、电解液内部的金属离子被还原成金属原子，金属原子在所述导电区与电解液的界面上沉积，实现晶核的生成和长大，形成阵列排布的柱状结构的电铸层；S3. The metal ions in the electrolyte are reduced to metal atoms, and the metal atoms are deposited on the interface between the conductive area and the electrolyte to realize the generation and growth of crystal nuclei and form an electroformed layer with columnar structure arranged in an array;
    其中，该柱状结构的电铸层的截面的形状及大小与所述点光源的形状及大小相同。Wherein, the shape and size of the cross-section of the electroformed layer of the columnar structure are the same as the shape and size of the point light source.
  9. 一种基于权利要求1-7任一项所述的微电铸装置的微电铸方法，其特征在于，包括以下步骤：A micro electroforming method based on the micro electroforming device of any one of claims 1-7, characterized in that it comprises the following steps:
    S1、供电电源供电，在第一电极板与第二电极板之间形成电场；S1. The power supply supplies power to form an electric field between the first electrode plate and the second electrode plate;
    S2、光源透过所述第二电极板照射在光致导电层上，在光致导电层上形成面积为a1的第一导电区，此时，光源面积也为a1；S2. The light source irradiates the photoconductive layer through the second electrode plate to form a first conductive region with an area a1 on the photoconductive layer. At this time, the area of the light source is also a1;
    S3、电解液内部的金属离子被还原成金属原子，金属原子在第一导电区与电解液的界面上沉积，实现晶核的生成和长大，形成第一电铸层；S3. The metal ions in the electrolyte are reduced to metal atoms, and the metal atoms are deposited on the interface between the first conductive area and the electrolyte to realize the generation and growth of crystal nuclei and form the first electroforming layer;
    S4、增加光源面积为a2，在第一导电区的周围形成第二导电区，第二导电区的面积为a2-a1，电解液内部的金属离子被还原成金属原子，金属原子在第一电铸层与电解液的界面和第二导电区与电解液的界面上沉积，实现晶核的生成和长大，形成第二电铸层，其中，a2大于a1；S4. Increase the area of the light source to a2, and form a second conductive area around the first conductive area. The area of the second conductive area is a2-a1. The metal ions in the electrolyte are reduced to metal atoms. Deposit on the interface between the casting layer and the electrolyte and the interface between the second conductive area and the electrolyte to realize the generation and growth of crystal nuclei and form the second electroformed layer, where a2 is greater than a1;
    重复步骤S4,直至形成预设的类金字塔结构。Repeat step S4 until the preset pyramid-like structure is formed.
PCT/CN2019/081558 2019-03-25 2019-04-04 Photoinduced conductive electrode plate-based micro-electroforming device and micro-electroforming method therefor WO2020191808A1 (en)

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