WO2020186862A1 - 一种光模块 - Google Patents

一种光模块 Download PDF

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Publication number
WO2020186862A1
WO2020186862A1 PCT/CN2019/127211 CN2019127211W WO2020186862A1 WO 2020186862 A1 WO2020186862 A1 WO 2020186862A1 CN 2019127211 W CN2019127211 W CN 2019127211W WO 2020186862 A1 WO2020186862 A1 WO 2020186862A1
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WO
WIPO (PCT)
Prior art keywords
light
laser
chip
optical
laser box
Prior art date
Application number
PCT/CN2019/127211
Other languages
English (en)
French (fr)
Inventor
杜光超
唐永正
吴涛
慕建伟
隋少帅
韩继弘
陈思涛
邵乾
Original Assignee
青岛海信宽带多媒体技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201910199347.6A external-priority patent/CN111694113A/zh
Priority claimed from CN201910199953.8A external-priority patent/CN111694114A/zh
Priority claimed from CN201910199334.9A external-priority patent/CN111694111B/zh
Application filed by 青岛海信宽带多媒体技术有限公司 filed Critical 青岛海信宽带多媒体技术有限公司
Priority to EP19920189.8A priority Critical patent/EP3940438A4/en
Publication of WO2020186862A1 publication Critical patent/WO2020186862A1/zh
Priority to US17/235,367 priority patent/US11828991B2/en
Priority to US18/472,503 priority patent/US20240012210A1/en
Priority to US18/472,563 priority patent/US20240012211A1/en
Priority to US18/472,638 priority patent/US20240012212A1/en

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements

Definitions

  • This application relates to the field of optical fiber communication, and in particular to an optical module.
  • the silicon optical chip is arranged on the surface of the circuit board and is electrically connected to the circuit board through wire bonding; the silicon optical chip is connected to the optical interface of the optical module through an optical fiber ribbon to realize optical signals entering and leaving the silicon optical chip. Since the silicon material used in the silicon optical chip is not an ideal luminescent material for the laser chip, the light-emitting unit cannot be integrated in the silicon optical chip manufacturing process, so the silicon optical chip needs to be provided with light from an external light source.
  • the embodiment of the present application provides an optical module, which provides an external light source for the silicon optical chip in the optical module.
  • an embodiment of the present application provides an optical module, including a substrate, a silicon optical chip, and a laser box.
  • the bottom surface of the silicon optical chip and the bottom surface of the laser box are respectively disposed on the substrate, and the side surface of the laser box emits light.
  • the side of the chip receives light from the laser box.
  • the laser box includes a laser chip and a sealed light-transmitting part
  • the sealed light-transmitting part forms a side surface of the laser box
  • the light exit direction of the laser chip is perpendicular to the light-incident surface of the sealed light-transmitting part
  • the light-incident surface of the sealed light-transmitting part is not parallel to the light-emitting surface of the sealed light-transmitting part.
  • the laser box includes a first laser chip and a second laser chip, and the first laser chip and the second laser chip emit light of the same wavelength.
  • the light emitting direction of the laser chip is parallel to the axial direction of the laser box.
  • the side surface of the silicon optical chip is arranged in parallel with the light emitting surface of the sealed light-transmitting member.
  • it further includes a circuit board, and the substrate is arranged on the surface of the circuit board or embedded in the circuit board.
  • circuit board the circuit board is provided with an opening penetrating the upper and lower surfaces, and the silicon optical chip and the laser box are arranged in the opening
  • the laser box further includes a focusing lens, and the focusing lens is located between the laser chip and the sealed light-transmitting part.
  • the laser box further includes a collimating lens, and the collimating lens is located between the focusing lens and the laser chip.
  • the laser box further includes an isolator, and the focusing lens is arranged between the isolator and the laser chip.
  • it further includes an upper casing, a lower casing, the laser box and the silicon optical chip located between the upper casing and the lower casing;
  • the laser box includes a cover, a cover, at least two laser chips, at least two focusing lenses, and a blocking block;
  • the upper surface of the cover plate is in thermally conductive contact with the upper housing, and the lower surface of the cover plate is in thermally conductive contact with the at least two laser chips;
  • the cover plate has a through hole penetrating the upper and lower surfaces, and the blocking block is arranged in the through hole;
  • the at least two focusing lenses are arranged below the through hole and on the cover;
  • the light emitted by the laser chip exits the laser box through the focusing lens, and the silicon optical chip receives the light from the laser box.
  • the silicon optical chip and the laser box are respectively arranged on the substrate. This relative positional relationship between the silicon optical chip and the laser box can realize the light emission from the side of the laser box and the light from the silicon optical chip.
  • the side surface receives the light from the laser box to realize the external light source for the silicon optical chip.
  • an embodiment of the present application also provides an optical module, including an upper housing, a lower housing, a laser box and a silicon optical chip located between the upper housing and the lower housing;
  • the laser box It includes a cover body, a cover plate, at least two laser chips, at least two focusing lenses, and a blocking block; the upper surface of the cover plate is in thermal contact with the upper housing, and the lower surface of the cover plate is in contact with the at least two
  • the cover plate has a through hole penetrating through the upper and lower surfaces, and the blocking block is arranged in the through hole; the at least two focusing lenses are arranged under the through hole and are located On the cover; the light emitted by the laser chip exits the laser box through the focusing lens, and the silicon optical chip receives the light from the laser box.
  • the circuit board is located between the upper casing and the lower casing, the circuit board is provided with openings penetrating the upper and lower surfaces, the silicon optical chip and the laser box They are respectively arranged in the openings.
  • it further includes a substrate, the laser box and the silicon optical chip are respectively located on the substrate, and the substrate is in thermally conductive contact with the lower casing.
  • the substrate includes a groove, and the laser chip is located in the groove.
  • the laser box further includes a conductive substrate, the lower surface of the conductive substrate is provided with the laser chip; the upper surface of the conductive substrate is in thermal contact with the lower surface of the cover plate to realize the laser The chip is in thermal contact with the lower surface of the cover plate.
  • the laser box further includes a sealed light-transmitting member, the sealed light-transmitting member forms a side surface of the laser box, and the light passing through the focusing lens is emitted out of the laser box by the sealed light-transmitting member.
  • the at least two laser chips emit light of the same wavelength respectively.
  • the laser box further includes an isolator, and the isolator is located between the focusing lens and the sealed light-transmitting member.
  • the laser box and the silicon optical chip are located between the upper housing and the lower housing.
  • the laser box includes a cover, a cover, at least two laser chips, at least two focusing lenses, and a blocking block,
  • the laser chip is in thermally conductive contact with the cover of the laser box, and the cover is in thermally conductive contact with the upper shell, realizing that the laser chip conducts heat to the upper shell; the light emitted by the optical chip is emitted out of the laser box through the focusing lens, and the silicon optical chip receives from the laser box
  • the cover plate has through holes penetrating the upper and lower surfaces. At least two lenses are arranged under the through holes and are located on the cover. The positions of the lenses can be adjusted through the through holes, which facilitates the active coupling and adjustment of the optical path of the laser box. Improve the coupling efficiency between at least two optical paths and the silicon optical chip.
  • Figure 1 is a schematic diagram of the connection relationship of an optical communication terminal
  • Figure 2 is a schematic diagram of the structure of an optical network unit
  • FIG. 3 is a schematic structural diagram of an optical module provided by an embodiment of the present invention.
  • FIG. 4 is an exploded schematic diagram of an optical module structure provided by an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of the assembly relationship between the circuit board, the silicon optical chip and the laser box provided by the embodiment of the present invention.
  • FIG. 6 is a schematic diagram of an exploded structure of the assembly relationship between a silicon optical chip and a laser box provided by an embodiment of the present invention
  • FIG. 7 is a schematic structural diagram of another exploded angle of the assembly relationship between the silicon optical chip and the laser box provided by the embodiment of the present invention.
  • FIG. 8 is a schematic diagram of the structural relationship between a silicon optical chip and a laser box provided by an embodiment of the present invention.
  • 9A is a schematic diagram of the optical coupling relationship between a silicon optical chip and a laser box provided by an embodiment of the present invention.
  • 9B is a cross-sectional view of the optical coupling relationship between a silicon optical chip and a laser box provided by an embodiment of the present invention.
  • 10A is a schematic diagram of the optical path structure of a laser box provided by an embodiment of the present invention.
  • 10B is a schematic diagram of the optical path structure of another laser box provided by an embodiment of the present invention.
  • Figure 11 is an exploded view of a laser box structure provided by an embodiment of the present invention.
  • FIG. 12 is a schematic diagram of an exploded structure of a laser box provided by an embodiment of the present invention.
  • Figure 13 is a schematic cross-sectional view of a laser box provided by an embodiment of the present invention.
  • Optical communication realizes that signals are transmitted using two different carriers, electric and optical.
  • Optical fiber communication uses information-carrying optical signals to be transmitted in optical waveguides, and the passive transmission characteristics of light in optical fibers and other optical waveguides can achieve low-cost, low-loss information transmission; while computers and other information processing equipment use electrical signals. Therefore, it is necessary to realize the mutual conversion of electrical and optical signals in optical fiber communication systems.
  • Figure 1 is a schematic diagram of the connection relationship of an optical communication terminal.
  • the connection of an optical communication terminal mainly includes an optical network unit 100, an optical module 200, an optical fiber 101 and a network cable 103;
  • One end of the optical fiber is connected to the remote server, and one end of the network cable is connected to the local information processing equipment.
  • the connection between the local information processing equipment and the remote server is completed by the connection of the optical fiber and the network cable; and the connection between the optical fiber and the network cable is performed by the optical network with optical modules The unit is complete.
  • the optical port of the optical module 200 is connected to the optical fiber 101 to establish a bidirectional optical signal connection with the optical fiber; the electrical port of the optical module 200 is connected to the optical network unit 100 to establish a bidirectional electrical signal connection with the optical network unit; the optical module implements optical signals Mutual conversion with electrical signals, so as to realize the connection between the optical fiber and the optical network unit; in practical applications, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network unit 100, from the optical network unit 100 The electrical signal is converted by the optical module into an optical signal and input into the optical fiber. Since the optical module 200 is a tool for realizing mutual conversion of photoelectric signals and does not have the function of processing data, the information does not change during the foregoing photoelectric conversion process.
  • the optical network unit has an optical module interface 102, which is used to connect to the optical module and establish a two-way electrical signal connection with the optical module; the optical network unit has a network cable interface 104, which is used to connect to a network cable and establish a two-way electrical signal connection with the network cable; The connection between the module and the network cable is established through the optical network unit.
  • the optical network unit can transmit the signal from the optical module to the network cable and the signal from the network cable to the optical module. Therefore, the optical network unit is used as the optical module.
  • the upper computer can monitor the work of the optical module.
  • the remote server establishes a two-way signal transmission channel with the local information processing equipment through optical fibers, optical modules, optical network units and network cables.
  • the information processing equipment includes routers, switches, electronic computers, etc.; the optical network unit, as the upper computer of the optical module, can provide data signals to the optical module and receive data signals from the optical module.
  • the upper computer of the optical module includes optical line terminals and the like in addition to the optical network unit.
  • FIG. 2 is a schematic diagram of the optical network unit structure.
  • the optical network unit 100 has a circuit board 105, and a cage 106 is provided on the surface of the circuit board 105; an electrical connector is provided in the cage 106 for accessing optical module electrical ports such as golden fingers;
  • a heat sink 107 is provided on the cage 106, and the heat sink 107 has a convex structure such as fins to increase the heat dissipation area.
  • the optical module 200 is inserted into the optical network unit 100, that is, the electrical port of the optical module is inserted into the electrical connector in the cage 106, and the optical port of the optical module is connected to the optical fiber 101.
  • the cage 106 is located on the circuit board and wraps the electrical connectors on the circuit board in the cage; the optical module 200 is inserted into the cage 106, and the optical module 200 is fixed by the cage 106.
  • the heat generated by the optical module 200 can be transmitted to The cage 106 then spreads through the radiator 107 on the cage.
  • the upper housing of the optical module 200 is closer to the radiator 107 on the cage than the lower housing of the optical module. With the aid of the radiator, the upper housing of the optical module 200 can achieve more efficient heat dissipation than the lower housing. For the components in the optical module 200, heat is conducted to the upper housing of the optical module, which can better dissipate heat.
  • Optical modules play a key role in photoelectric conversion in the above-mentioned optical communication connections.
  • a silicon-based optoelectronic chip packaging method has gradually matured in the optical module industry. It combines silicon-based integrated circuit technology with optical waveguide technology, and uses chip The growth process produces a chip with integrated photoelectric conversion function and electro-optical conversion function.
  • the silicon material used in the silicon optical chip is not an ideal luminescent material for the laser chip, and the light-emitting unit cannot be integrated in the manufacturing process of the silicon optical chip, the silicon optical chip needs to be provided with light from an external light source.
  • the present application provides an optical module.
  • the optical module provided in the present application will be further described below with reference to FIGS. 3 to 11.
  • 3 is a schematic structural diagram of an optical module provided by an embodiment of the present invention
  • FIG. 4 is an exploded schematic diagram of an optical module structure provided by an embodiment of the present invention.
  • the optical module 200 provided by the embodiment of the present invention includes an upper housing 201, a lower housing 202, an unlocking handle 203, a circuit board 300, a substrate, a silicon optical chip 400, a laser box 500, and an optical fiber With 304a, 304b and fiber interface 306, the silicon optical chip 400 and the laser box 500 are respectively arranged on the same side surface of the circuit board 300.
  • the upper shell 201 and the lower shell 202 form a wrapping cavity with two openings, which can be opened at both ends in the same direction, or at two openings in different directions; one of the openings is an electrical port 204, It is used to insert into an upper computer such as an optical network unit, and the other opening is an optical port 205 for external optical fiber access, so that external light can be connected to internal optical fiber.
  • the circuit board 300, the silicon optical chip 400 and the laser box 500 and other optoelectronic devices are located in the package cavity.
  • the upper casing 201 and the lower casing 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.
  • the upper housing 201 and the lower housing 202 are combined in an assembly manner to facilitate the installation of components such as the circuit board 300 into the wrapping cavity.
  • the upper housing 201 and the lower housing 202 form a wrapping cavity, which can facilitate the assembly
  • the unlocking handle 203 is located on the outer wall of the lower housing 202, and the unlocking handle 203 can be moved on the outer wall surface by pulling the end of the unlocking handle 203.
  • the unlocking handle 203 clamps the optical module into the cage 106 of the host computer, and the unlocking handle 203 is pulled to release the engagement relationship between the optical module and the host computer, and the optical module is removed from the cage 106 of the host computer. Draw it out.
  • the bottom surface of the silicon optical chip 400 and the bottom surface of the laser box 500 are respectively disposed on the substrate, and there is an optical connection between the silicon optical chip 400 and the laser box 500. Since the optical path is very sensitive to the positional relationship between the silicon optical chip 400 and the laser box 500, and materials with different expansion coefficients will cause different degrees of deformation, it is not conducive to the realization of the preset optical path. Therefore, in the embodiment of the present invention, the silicon optical chip 400 and the laser box 500 are arranged on the same substrate, and the substrate of the same material is deformed, which will equally affect the positions of the silicon optical chip 400 and the laser box 500 and reduce the deformation. The relative position of the silicon optical chip 400 and the laser box 500 is changed.
  • the expansion coefficient of the substrate material is similar to that of the silicon optical chip 400 and/or the laser box 500.
  • the main material of the silicon optical chip is silicon
  • the main material of the laser box is Kovar metal
  • the bottom can be made of silicon or glass.
  • the circuit board 300 has an opening 301 penetrating the upper and lower surfaces, and the silicon optical chip 400 and/or the laser box 500 are arranged in the opening.
  • the silicon optical chip 400 and/or the laser box 500 can simultaneously dissipate heat to the upper surface of the circuit board 300 and the lower surface of the circuit board 300.
  • the substrate 302 is arranged on one side of the circuit board 300, and the silicon optical chip 400 and/or laser box 500 Pass through the opening of the circuit board 300 to dissipate heat to the substrate, so that the substrate 302 has the effect of supporting and dissipating heat at the same time.
  • the circuit board 300 is not provided with openings and the substrate is provided on the circuit board.
  • the substrate may be provided on the surface of the circuit board or embedded in the circuit board, so that the silicon optical chip 400 and the laser box 500 are provided on the substrate. On the surface.
  • the light-emitting side surface of the laser box 500 and the light-incident side surface of the silicon optical chip 400 need to be at the same height plane. Since the silicon optical chip 400 is made by a chip growth and etching process, it has a high degree of integration and a relatively small volume; while the volume of the laser box 500 is relatively large, and the side height of the laser box 500 is greater than that of the silicon optical chip 400 Therefore, it is necessary to provide a groove 308 on the substrate to set the laser box 500 in the groove 308.
  • the silicon optical chip 400 is arranged on the surface of the substrate, and the surface of the substrate is relatively higher than the groove 308, so as to balance the height difference between the silicon optical chip 400 and the laser box 500.
  • the end surface of the circuit board 300 has a golden finger 307, which is composed of a plurality of independent pins.
  • the circuit board 300 is inserted into the electrical connector in the cage, and the golden finger 307 is connected to the elastic piece in the electrical connector. Conduction connection.
  • gold fingers 307 may be provided on only one side surface of the circuit board. Considering that the number of pins is relatively large, gold fingers 307 may also be provided on both the lower surface of the circuit board.
  • the golden finger 307 is used to establish an electrical connection with the host computer, and the specific electrical connection may be power supply, grounding, I2C signal, communication data signal, etc.
  • the bottom surface of the laser box 500 is disposed on the substrate 302, the laser box 500 emits light through the side surface, and the light emitted from the laser box 500 enters the silicon optical chip 400.
  • the light provided by the laser box 500 to the silicon optical chip 400 is light with a single wavelength and stable power, and does not carry data.
  • the light is modulated by the silicon optical chip 400 to load the data to be transmitted into the light.
  • the bottom surface of the silicon optical chip 400 is disposed on the substrate 302, and the side surface of the silicon optical chip 400 receives light from the laser box 500.
  • the modulation of the emitted light and the demodulation of the received light are completed by the silicon optical chip 400.
  • the surface of the silicon optical chip 400 is provided with pads that are electrically connected to the circuit board 300; in one implementation, the circuit board 300 provides the silicon optical chip 400 with data signals from the upper computer, and the silicon optical chip 400 transfers the data The signal is modulated into light, and the optical signal from the outside is demodulated into an electrical signal by the silicon optical chip 400, and then output to the host computer through the circuit board 300.
  • the multiple optical fibers of the silicon optical chip 400 are combined into an optical fiber ribbon, and the optical fiber ribbon is connected to an optical fiber connector and an optical fiber interface 306.
  • the optical fiber connector is connected to the silicon optical chip 400, and the optical fiber interface is used to connect to an external optical fiber.
  • the optical fiber connector 303a is connected to the optical fiber ribbon 304a
  • the optical fiber connector 303b is connected to the optical fiber ribbon 304b
  • the optical fiber ribbon 304a and the optical fiber ribbon 304b are respectively connected to the optical fiber interface 306.
  • the optical fiber connector 303a is used to transmit the emitted light from the silicon optical chip 400 to the optical fiber interface 306, and the optical fiber connector 303b is used to transmit the received light transmitted from the optical fiber interface 306 to the silicon optical chip 400.
  • the light emitted by the laser box 500 enters the silicon optical chip 400, is modulated into an optical signal by the silicon optical chip 400, and is transmitted to the optical fiber interface 306 through the optical fiber connector 303a to realize the light emission process of the optical module.
  • the external light is transmitted to the silicon optical chip 400 through the optical fiber interface 306 and the optical fiber connector 303b, and the electrical signal is demodulated by the silicon optical chip 400 and then output to the host computer to realize the light receiving process of the optical module.
  • the present application needs to assemble the circuit board 300, the silicon optical chip 400 and the laser box 500 according to predetermined positions to form a predetermined light propagation path.
  • FIG. 5 is a schematic diagram of the assembly relationship between the circuit board 300, the silicon optical chip 400 and the laser box 500 provided by an embodiment of the present invention.
  • the silicon optical chip 400 and the laser box 500 are arranged in the opening 301 of the circuit board at the same height level, so that the side surface of the laser box 500 and the side surface of the silicon optical chip 400 Optical coupling between.
  • the silicon optical chip 400 is optically coupled with the optical fiber connector 303a and the optical fiber connector 303b, respectively.
  • One end of the optical fiber connector 303a is optically coupled to the silicon optical chip 400, and the other end is connected to the optical fiber ribbon 304a.
  • One end of the optical fiber connector 303b is optically coupled to the silicon optical chip 400, and the other end is connected to the optical fiber ribbon 304b.
  • the optical fiber connectors 303a, 303b and the laser box 500 are arranged on the side of the silicon optical chip 400 at the same height level, and the optical fiber ribbons 304a, 304b are located on the same side surface of the circuit board.
  • the axial direction of the laser box 500 and the side surface of the coupling position of the silicon optical chip 400 are in a non-vertical angle relationship, that is, the silicon optical chip 400 is arranged obliquely relative to the laser box 500, and the side of the laser box 500 coupled with the silicon optical chip 400 is an inclined plane.
  • the sides of the two optical fiber connectors 303a, 303b coupled with the silicon optical chip 400 are all inclined surfaces, and the sides of the silicon optical chip 400 coupled with the laser box 500 and the optical fiber connector are planes, and the plane is parallel to the side of the laser box 500.
  • FIG. 6 is an exploded structural schematic diagram of the assembly relationship between a silicon optical chip and a laser box provided by an embodiment of the present invention
  • FIG. 7 is another exploded structural schematic view of an assembly relationship between a silicon optical chip and a laser box provided by an embodiment of the present invention.
  • the side of the silicon optical chip 400 has a first light hole 401, a second light hole 402, and a third light hole 403, and the light holes have several light channels.
  • the first optical hole 401 is optically coupled with the optical fiber connector 303b
  • the second optical hole 402 is optically coupled with the laser box 400.
  • the second light hole has two or more light incident channels that receive light of the same wavelength.
  • the third optical hole 403 is optically coupled with the optical fiber connector 303a.
  • the silicon optical chip 400 sets the optical hole on the side, so that the coupling position relationship between the laser box 500, the optical fiber connector and the silicon optical chip 400 is changed, and the laser box 400 is changed at the same time. structure.
  • the optical fiber connector 303a has a plurality of optical fibers 305a for docking with the third optical hole 403
  • the optical fiber connector 303b has a plurality of optical fibers 305b for docking with the first optical hole 401
  • the laser box 500 has a sealed light-transmitting part 508, a sealed light-transmitting part
  • the side surface of the laser box is formed to be connected to the second light hole 402.
  • the optical fiber connector includes an upper substrate, a lower substrate and an optical fiber.
  • the lower substrate is provided with a groove, the optical fiber is arranged in the groove, and the upper substrate covers the lower substrate.
  • the optical fiber connector 303a includes an upper substrate 307a, a lower substrate 306a, and an optical fiber 305a;
  • the optical fiber connector 303b includes an upper substrate 307b, a lower substrate 306b, and an optical fiber 305b.
  • the laser box includes a cover body 501 and a cover plate 502, and optoelectronic devices such as laser chips are arranged in the package cavity formed by the cover body and the cover plate.
  • the silicon optical chip 400 has a Mach-Zehnder modulator inside to realize power modulation.
  • Mach-Zehnder modulator modulation adopts the principle of light interference of the same wavelength.
  • a Mach-Zehnder modulator is equipped with two interference arms, and a beam of light is input to a single interference arm.
  • a total of two beams of the same wavelength need to be provided to a Mach-Zehnder modulator.
  • the light on the interference arm will fuse into a beam of light.
  • a single-wavelength light can be provided to the silicon optical chip 400.
  • the light splitting waveguide inside the silicon optical chip 400 divides the single-wavelength light into two beams of the same wavelength, and inputs them to the two Mach-Zehnder modulators.
  • On the interference arm it is also possible to provide two beams of light with the same wavelength to the silicon optical chip 400, and the two beams of light with the same wavelength are directly input into the two interference arms of the Mach-Zehnder modulator;
  • the light on the interference arm is fused, and on the premise of using a single same optical power chip, the solution of providing two beams of light to the silicon optical chip can provide higher optical power than the solution of providing one beam.
  • the silicon optical chip 400 provided by the embodiment of the present invention has a plurality of optical channels optically coupled with the laser box 500 on the side, and multiple channels of light with the same wavelength can be input into the silicon optical chip 400 through these optical channels, which are Mach-Zehnder modulators
  • Each of the interference arms provides the same wavelength of light, and the luminous power of a single laser chip is limited. Superimposing the light of multiple laser chips can increase the optical power of a single wavelength.
  • the structural relationship and optical path between the silicon optical chip 400 and the laser box 500 can realize the optical modulation function through the working principle and structure of the silicon optical chip 400, that is, the laser box 500 emits light with stable power. Light does not carry information.
  • the silicon optical chip 400 modulates light with stable power into light with fluctuating power, and light with fluctuating power carries information.
  • the present application also adjusts the structural relationship between the silicon optical chip 400 and the laser box 500, as well as its installation and matching components.
  • the installation relationship between the silicon optical chip 400 and the laser box 500 and matching components will be described in detail.
  • FIG. 8 is a schematic diagram of the structure relationship between a silicon optical chip and a laser box provided by an embodiment of the present invention
  • FIG. 9A is a schematic diagram of an optical coupling relationship between a silicon optical chip and a laser box provided by an embodiment of the present invention
  • FIG. 11 is an exploded view of a laser box structure provided by an embodiment of the present invention.
  • the laser box of the embodiment of the present invention can provide two beams of light with the same wavelength to the silicon optical chip to increase the power of the emitted light.
  • the laser box provided by the embodiment of the present invention includes a cover body 501, a cover plate 502, a sealed light-transmitting member 508, a conductive substrate located in the housing, a laser chip located on the conductive substrate, a lens located in the housing, and isolation in the housing Device.
  • the cover body 501 and the cover plate 502 form a package cavity, and the sealed light-transmitting part, the conductive substrate, the laser chip, the lens and the isolator are located in the package cavity.
  • a relatively closed cavity is formed by the cover 501 and the cover 502, and the sealing light-transmitting member is used to seal the laser box 500. It is arranged on the optical path toward the silicon optical chip 400 and is located between the cover 501 and the cover 502. Between the cover plates 502, the light inside the cavity enters the silicon optical chip 400 after passing through the sealed light-transmitting part. Specifically, the light may enter the sealed light-transmitting part after passing through the focusing lens, and then enter the silicon optical chip 400.
  • the sealed light-transmitting part is a part of the laser box 500 that is optically coupled with the silicon optical chip 400. Its light-emitting surface is the side surface where the laser box 500 and the silicon optical chip 400 are coupled, and its light-emitting surface is inclined with respect to the laser box 500 as a whole.
  • the conductive substrate has a variety of feasible designs. One possible way is shown in Figure 8, Figure 9A, and Figure 9B.
  • the conductive substrate is partly located in the cavity and partly outside the cavity.
  • the part located in the cavity is provided with a laser chip located in the cavity.
  • the external part is electrically connected to the circuit board 300; another feasible way is that the conductive substrate is completely located in the cavity, the laser chip is located on the conductive substrate, and the laser box 500 has other electrical connection structures that are electrically connected to the conductive substrate. There can be many matching relationships between the conductive substrate and the laser chip.
  • One type can be as shown in Figure 8, one laser chip is provided on a conductive substrate, and the other can be as shown in Figure 9, and a conductive substrate 503 is provided with two
  • a conductive substrate 503 is provided with two
  • other coordination methods are not shown one by one in the embodiments of the present application.
  • the laser chip, lens, and isolator are located in the cavity; there are two ways to set up the lens, one way is to set a lens in the direction of the laser chip's light output, specifically a focusing lens, located between the laser chip and the sealed light-transmitting part.
  • a lens in the direction of the laser chip's light output, specifically a focusing lens, located between the laser chip and the sealed light-transmitting part.
  • a focusing lens located between the laser chip and the sealed light-transmitting part.
  • laser chip set two lenses specifically a collimator lens and a focusing lens
  • the light emitted by the chip is transformed into collimated light by the collimating lens.
  • the collimated light can maintain a small optical power attenuation during the long-distance optical transmission process.
  • the focusing lens receives the collimated light to converge and couple the light into the silicon light. In the chip.
  • the isolator is used to prevent the light emitted by the laser chip from returning to the laser chip after emission, so the isolator is arranged in the direction of the laser chip's light output.
  • the isolator is arranged in the direction away from the lens to the laser chip. That is, a focusing lens is arranged between the isolator and the laser chip.
  • the laser box provided by the embodiment of the present invention includes a cover 501, a cover 502, a first conductive substrate 503a, a second conductive substrate 503b, a first laser chip 504a, and a The two laser chips 504b, the first collimating lens 505a, the second collimating lens 505b, the first focusing lens 506a, the second focusing lens 506b, the isolator 507, the light-sealing transparent member 508, the first blocking substrate 510 and the second The substrate 509 is blocked.
  • the first conductive substrate 503a and the second conductive substrate 503b are located between the first sealing substrate 510 and the second sealing substrate 509.
  • the first sealing substrate 510, the first conductive substrate 503a, the second conductive substrate 503b, and the The two blocking substrates 509, the cover body 501 and the cover plate 502 together form a sealing structure;
  • the sealing light-transmitting member 508, the cover body 501 and the cover plate 508 form a sealing structure, so that the cover body 501, the cover plate 502, and the first conductive substrate 503a ,
  • the second conductive substrate 503b, the first blocking substrate 510, the second blocking substrate 509, and the light-sealing transparent member 508 together form a sealed cavity;
  • the first conductive substrate 503a is partly located in the cavity and partly outside the cavity;
  • the conductive substrate 503b is partly located in the cavity and partly outside the cavity;
  • the common conductive substrate is a metalized ceramic, and a circuit pattern is formed on the ceramic surface to
  • the portion of the first conductive substrate 503a located in the cavity is provided with a first laser chip 504a, and a first collimating lens 505a, a first focusing lens 506a, an isolator 507 and a sealed light transmission are sequentially arranged along the light emitting direction of the first laser chip 504a 508;
  • the portion of the second conductive substrate 503b located in the cavity is provided with a second laser chip 504b, and a second collimating lens 505b, a second focusing lens 506b, an isolator 507 and Sealing light-transmitting member 508;
  • the first collimating lens 505a, the first focusing lens 506a, the second collimating lens 505b, the second focusing lens 506b, and the isolator 507 are all arranged on the cover 501; in the embodiment of the present invention, two lasers The two beams of light emitted by the chip share an isolator and a sealed light-transmitting part.
  • the first laser chip 504a and the second laser chip 504b emit light of the same wavelength, thereby forming two lights emitted by the first laser chip 504a and the second laser chip 504b, and the two lights of the same wavelength are finally increased The light output power of the silicon optical chip 400.
  • the light emitted by the first laser chip 504a is collimated by the first collimating lens 505a, and then directed toward the first focusing lens 506a, directed toward the isolator 507 through the first focusing lens 506a, and directed toward the sealing light transmitting member 508 through the isolator. Finally, the laser box 500 is emitted. By adjusting the first focusing lens 506a, the direction of the final emitted light can be changed.
  • the light emitted by the second laser chip 504b is collimated by the second collimating lens 505b, then directed toward the second focusing lens 506b, directed toward the isolator 507 through the second focusing lens 506b, and directed toward the sealing and transparent through the isolator 507.
  • the optical member 508 finally emits the laser box 500.
  • the second focusing lens 506b By adjusting the second focusing lens 506b, the direction of the final emitted light can be changed.
  • the directions in which the two lights finally exit can be adjusted independently of each other, which facilitates independent active optical coupling.
  • the light output direction of the first laser chip 504a is parallel to the axial direction of the laser box, and the single beam of light emitted by it is divergent. After being converged by the first collimating lens 505a, collimated parallel light is formed.
  • the parallel light can achieve a long distance low Loss transmission meets the needs of subsequent optical path design and structural design; the first converging lens 506a converges the collimated parallel light into convergent light, which reduces the spot area and concentrates light energy, which is beneficial to improve the optical coupling efficiency.
  • the light output direction of the second laser chip 504b is parallel to the axis of the laser box, and the single beam of light emitted by it is divergent.
  • a collimated parallel light is formed.
  • the parallel light can achieve a longer distance
  • the second converging lens 506b converges the collimated parallel light into convergent light, which reduces the spot area and concentrates light energy, which is beneficial to improve the optical coupling efficiency.
  • the isolator receives the light from the direction of the converging lens, allows the light to pass through in one direction and cuts off in the opposite direction, thereby acting as an isolation function to prevent the light passing through the isolator from being reflected back into the laser chip.
  • the light-sealing and light-transmitting member functions to seal the laser box and transmit light, forming a side surface of the laser box for emitting light.
  • the laser box contains optoelectronic devices such as laser chips.
  • the working environment needs to be sealed to a certain degree to prevent the influence of water vapor on the devices and the light path.
  • the sealed light-transmitting parts play a role in sealing the laser box; at the same time, the light emitted by the laser chip
  • the laser box needs to be emitted, and the sealed light-transmitting part is a component set on the edge of the laser box, and needs to have light-transmitting properties for the laser to emit.
  • the light beam is emitted from the light-emitting surface of the sealed light-transmitting part to realize the emission from the laser box.
  • the emitted light beam enters the silicon optical chip 400.
  • the light beam is required to enter the light-incident surface of the silicon optical chip 400 at a non-perpendicular angle.
  • the light-receiving waveguide structure in the silicon optical chip 400 and the light-incident surface of the silicon optical chip 400 are arranged at an acute angle, which requires that the light beam is refracted on the light-incident surface of the silicon optical chip 400 and enters in a direction facing the waveguide structure. , This direction is not consistent with the direction of the laser chip.
  • a sealed light-transmitting part is designed in the laser box, and the light output direction of the laser box is changed through the optical structure of the sealed light-transmitting part, so as to meet the light incident requirements of the silicon optical chip.
  • the sealed light-transmitting member provided by the embodiment of the present invention includes two non-parallel but opposite side surfaces, one of which is a light-incident surface and the other side is a light-emitting surface, and the light-incident surface and the light-emitting surface of the sealed light-transmitting member are in non-parallel directions Setting, that is, the included angle is not 0°, and the light exit surface is obviously inclined relative to the light entrance surface.
  • the sealed light-transmitting member 508 is a hexahedron, wherein two pairs of opposite side surfaces are in a parallel relationship, and the other pair of opposite side surfaces are in a non-parallel relationship.
  • the light beam enters the sealed light-transmitting part at an angle perpendicular to the light-incident surface of the sealed light-transmitting part 508, is refracted on the light-emitting surface, and is refracted again by the surface of the silicon optical chip 400 to meet the light-incoming requirements of the silicon optical chip 400.
  • the light incident surface of the sealed light-transmitting part 508 is perpendicular to the direction of the incoming light beam. As shown in FIG.
  • the light incident surface of the sealed light-transmitting part 508 is perpendicular to the light exit direction of the laser chip.
  • the light emitted by the laser chip is not transmitted during the transmission process. Change the direction; it can also be other optical path structures.
  • the light emitted by the laser chip changes direction during transmission, and the light reaching the sealed light-transmitting part is perpendicular to the light-incident surface of the sealed light-transmitting part.
  • the sealed light-transmitting part is a device through which the light beam inevitably passes, and the light beam passes through the laser box last. Therefore, by using the sealed light-transmitting part to change the light transmission direction, it is relatively simple to meet the requirements of the silicon optical chip.
  • Light angle requirements The light incident surface and the light exit surface of the sealed light-transmitting part are in a non-parallel relationship. By setting the angle between the light entrance surface and the light-exiting surface, the light enters and exits from the light-incident surface and the light exit surface of the light-transmitting part.
  • the light propagation direction is close to the waveguide structure of the silicon optical chip, and combined with the light refraction factor, it can be realized that the light propagation direction is directly opposite to the waveguide structure of the silicon optical chip.
  • An optical glue is filled between the side surface of the laser box and the side surface of the silicon optical chip, and the refractive index of the glue is greater than that of air and smaller than the refractive index of the silicon optical chip.
  • the optical glue 514 is filled between the silicon optical chip 400 and the sealing light-transmitting member 508, so that there is no air layer between the side surface of the laser box 500 and the side surface of the silicon optical chip 400, and the light passes through the sealing After the light part 508 is shot out, it directly enters the glue instead of the air.
  • the refractive index relationship is: gas ⁇ liquid ⁇ solid, for example, the refractive index of air is 1, the refractive index of the silicon optical chip is 1.46; the prismatic glass is 1.53; then the refractive index of the glue in this embodiment is between 1.46 and 1.53
  • the refractive index of the glue is 1.53, but it can also be slightly larger than 1.53.
  • the glue is classified into structural glue, thermal glue, optical glue, conductive glue, etc. In addition to preventing dust, glue also prevents light from scattering when passing through the gap between the prismatic glass and the waveguide.
  • the optical module provided in the present application can form a complete optical path structure through the silicon optical chip 400 and the sealed light-transmitting member 508. In actual applications, it can be further adjusted according to the needs of the application environment to form a variety of optical path structures. details as follows:
  • FIG. 10A is a schematic diagram of the optical path structure of a laser box provided by an embodiment of the present invention
  • FIG. 10B is a schematic diagram of the optical path structure of another laser box provided by an embodiment of the present invention.
  • the silicon optical chip, the sealed light transmission member, and the transmission of light The direction is rotated at a certain angle compared to Fig. 10A. As shown in FIGS.
  • the sealed light-transmitting member includes two non-parallel but opposite sides, one of which is the light-incident surface 508a and the other is the light-emitting surface 508b There is a gap between the light-incident surface 400a of the silicon optical chip 400 and the sealed light-transmitting part, and the light beam sequentially passes through the light-incident surface 508a of the sealed light-transmitting part 508, the light-emitting surface 508b of the sealed light-transmitting part 508, the gap, and the silicon light chip 400
  • Only the light incident surface 400a of the laser chip can enter the silicon optical chip 400, and the light beam is refracted on the light emitting surface 508b of the sealed light transmitting member 508 and the light incident surface 400a of the silicon optical chip 400, so that the light exit direction of the laser chip and the light enter the silicon optical chip.
  • the propagation direction is parallel.
  • the light emitted by the second laser chip 504b is not parallel to the axial direction of the laser box 500, and the light emitted by the second laser chip 504b is perpendicular to the light exit surface of the second laser chip 504b, sealing the light entrance surface of the light transmitting member 508 508a is perpendicular to the propagation direction of light, the beam does not undergo refraction, and the beam keeps its original propagation direction and enters the light-emitting surface 508b of the sealed light-transmitting part.
  • the light-emitting surface 508b of the sealed light-transmitting part is parallel to the light-incident surface 400a of the silicon optical chip 400.
  • Refraction occurs at the light exit surface 508b, and the refracted light beam enters the light entrance surface 400a of the silicon optical chip 400, and enters the silicon optical chip 400 after being refracted again.
  • the refractive index of the silicon optical chip 400 is similar to the refractive index of the sealing light-transmitting part 508.
  • the light beam is refracted at the light-emitting surface 508b of the sealing light-transmitting part 508, and then refracted at the light-incident surface 400a of the silicon optical chip 400. It is equivalent to that light enters medium B from medium A and then enters medium A from medium B.
  • the incident angle in medium A is equal to the refraction angle in medium B.
  • the silicon optical chip 400 In the silicon optical chip 400, light is usually required to enter the light-incident surface 400a of the silicon optical chip 400 at an incident angle of 11.6°, and the refraction angle ⁇ after the light enters the silicon optical chip 400 is 8°, which requires the light exit direction of the laser chip It is at an angle of 8° with the light-emitting surface of the sealed light-transmitting part, that is, the laser chip provides an incident angle ⁇ of 8° on the light-emitting surface of the sealed light-transmitting part.
  • the structural design of the sealed light-transmitting part 508 is adopted to reduce the light output direction of the laser chip relative to the silicon optical chip.
  • the angle of 400 is required, and refraction is more conducive to maintaining the shape of the spot than reflection, which is conducive to improving the coupling efficiency.
  • the light-emitting direction of the laser chip is not parallel to the axis direction of the laser box.
  • This non-parallel design makes the production process need to take the axis direction of the laser box as a reference, and rotate the laser chip or lens, which brings great influence to the production process. It is difficult, and the axial direction of the laser box is parallel to the light-emitting direction of the laser chip, which is easy to produce.
  • the sealed light transmissive member and the silicon optical chip in FIG. 10A can be rotated at a certain angle to obtain the design shown in FIG. 10B.
  • the light incident surface 508a of the sealed light-transmitting member 508 is perpendicular to the light exit direction of the laser chip
  • the light exit surface of the laser box is at a non-perpendicular angle to the axis direction of the laser box
  • the light incident surface 400a of the silicon optical chip 400 is opposite
  • the axial direction of the laser box is at a non-vertical angle.
  • the laser box 500 and the silicon optical chip 400 are arranged in the opening of the circuit board, and the opening of the circuit board is an irregular square to adapt to the above structure.
  • Both the silicon optical chip 400 and the laser box 500 are independently manufactured products, and the laser box 500 provides light to the silicon optical chip 400. Since the light directed to the silicon optical chip 400 has a specific direction requirement, and the manufacturing process of the laser box 500 and the optical coupling method of the laser box 500 and the silicon optical chip 400 limit the light output direction of the laser chip, there is a gap between these two directions. Larger angle changes, the use of conventional light reflection to achieve this angle change will bring about technical problems of low coupling efficiency.
  • this application uses a sealed light-transmitting part to refract light, between the laser chip and the silicon optical chip, Designing the angle relationship between the light entrance surface and the light exit surface of the sealed light transmitting member 508 can achieve this angle change, which can alleviate the problem of reduced coupling efficiency, and the sealed light transmitting member, as an optical device that can be independently and freely designed, is relatively convenient in design and operation.
  • the laser chip will generate a lot of heat (Heat) when it is working, the generated heat will increase the temperature of the working environment, and a higher working environment temperature will cause the laser chip power to decrease and wavelength shift. Therefore, in order to improve The power of the chip reduces the wavelength shift, and it is necessary to provide heat dissipation channels for the laser chip.
  • Heat heat
  • the assembly sequence of the laser box 500 is based on the cover 501, the components are arranged on the cover 501, and then the cover 502 is closed, and the assembly sequence of the optical module is the following housing 202
  • the lower casing 202 is provided with components, and then the upper casing 201 is covered.
  • This assembly sequence makes the cover 502 of the laser box 500 face the upper housing 201 of the optical module, and the cover 501 of the laser box faces the lower housing 202 of the optical module.
  • the upper housing 201 of the optical module is smaller than the lower housing 202 of the optical module. With better heat dissipation channels, the cover 501 of the laser box can dissipate heat through the upper housing 201 of the optical module.
  • an embodiment of the present invention also provides a laser box structure, wherein the lower surface of the cover plate 502 is in thermal contact with at least two laser chips, and the upper surface of the cover plate 502 is in thermal contact with at least two laser chips.
  • the upper housing 201 of the optical module is in thermal contact.
  • the specific thermally conductive contact structure may be: a conductive substrate is provided on the lower surface of the cover plate 502, and the lower surface of the conductive substrate is provided with a laser chip, that is, the conductive substrate is provided on the lower surface of the laser box cover plate 502 on the side facing the upper housing 201 of the optical module ,
  • the conductive substrate faces the side of the lower housing of the optical module with a laser chip; the upper surface of the cover 502 is in contact with the upper housing 201 of the optical module through a thermal conductive member such as a thermal conductive glue. So far, the heat generated by the laser chip is conducted to the laser box cover 502 through the conductive substrate, and is transferred from the laser box cover 502 to the upper housing 201 of the optical module.
  • Figure 13 is a schematic cross-sectional view of a laser box provided by an embodiment of the present invention.
  • Figure 12 and Figure 13 show a specific laser box structure.
  • the second laser chip 504b is arranged on the lower surface of the conductive substrate 503b, the conductive substrate 503b is arranged on the inner surface of the laser box cover plate 502, and the second laser chip 504b is arranged between the conductive substrate and the inner surface of the cover plate.
  • the second blocking member 509 is attached to the upper surface of the conductive substrate 503b in a large area to form a thermally conductive contact structure, so that the conductive substrate 503b is arranged on the lower surface of the cover plate 502, and the heat of the conductive substrate 503b Conducted to the cover 502 of the laser box.
  • the upper surface of the conductive substrate 503b can also be directly attached to the inner surface of the cover plate 502, and whether to use the second blocking member can be flexibly set according to the thermal contact structure requirements and the sealing requirements.
  • the laser chip 504b conducts heat to the conductive substrate 503b, the conductive substrate 503b directly or indirectly conducts the heat to the cover 502 of the laser box, and the cover 502 of the laser box conducts the heat to the upper housing 201 of the optical module.
  • the heat generated by the laser chip 504b is radiated from the upper case 201.
  • the conductive substrate 503b and the cover 501 are hermetically connected by the first blocking member 510, the laser chip 504b is suspended above the cover 501, and no heat conduction channel is formed between the laser chip 504b and the cover 501, and the laser chip 504b
  • the heat is mainly dissipated through the cover plate 502.
  • the silicon optical chip 400 and the laser box are carried by the substrate 302, and the substrate is in thermal contact with the lower case 202 of the optical module.
  • the heat generated by the silicon optical chip 400 is mainly transferred from the substrate 302 to the lower case of the optical module. 202 distributed.
  • the heat of the laser box is mainly dissipated through the upper housing 201 of the optical module
  • the heat of the silicon optical chip 400 is mainly dissipated through the lower housing 202 of the optical module, which relieves the heat of the silicon optical chip 400 and the laser box 500 from being concentrated on the same side of the optical module.
  • the laser chip can be fixed on the cover plate 502 of the laser box by default.
  • the cover plate 502 is not closed, the optical path of the laser box is not completely formed, and the laser chip cannot be electrically coupled with the active optical path; after the cover plate 502 is closed, the outside world cannot move the position of the devices inside the laser chip. Coupling cannot be achieved. Therefore, if the laser box is assembled according to the preset position, there is a large position error. This position error causes a large position gap between the preset optical path and the actual optical path, which greatly affects the efficiency of optical coupling, especially in the laser box. When there are more than two beams, the position between the beams cannot be modulated. It is very difficult to align the two beams with the two light inlets of the silicon optical chip at the same time, and it is even more difficult to achieve the alignment of more than three beams.
  • an embodiment of the present invention provides a laser box to realize the active coupling of the above-mentioned laser box.
  • a through hole 512 is provided on the cover of the laser box
  • focusing lenses 506 a and 506 b are provided under the through hole 512
  • the focusing lenses 506 a and 506 b are provided on the cover body 501.
  • a spacer 513 may be provided between the focus lens and the cover 501.
  • the focusing lens is located below the through hole, an external adjustment device enters the laser box through the through hole to adjust the position of the focusing lens. That is, change the position or angle of the lens to change the exit position of the beam.
  • the lens can be adjusted.
  • the laser chip emits light, the light is directed to the light hole of the silicon optical chip to realize active coupling.
  • the laser box further includes a blocking block 511, and the blocking block 511 is used to block the through hole 512.
  • collimating lenses 505a and 505b can be arranged on the inner surface (lower surface) of the cover plate to match the light path of the laser chip.

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Abstract

一种光模块（200），光模块（200）的电路板（300）设置有贯穿上下表面的开口（301），便于将激光盒（500）设置在开口（301）中，硅光芯片（400）设置在电路板（300）上，激光盒（500）设置在电路板（300）开口（301）中且位于衬底（302）上，使硅光芯片（400）与激光盒（500）处于同一水平位置高度，硅光芯片（400）与激光盒（500）之间的这一相对位置关系，可以实现激光盒（500）的侧面出光、硅光芯片（400）的侧面接收来自激光盒（500）的光，实现为硅光芯片（400）提供外部光源。

Description

一种光模块
本申请要求在2019年3月15日提交中国专利局、申请号为201910199334.9、发明名称为“一种光模块”；在2019年3月15日提交中国专利局、申请号为201910199347.6、发明名称为“一种光模块”以及在2019年3月15日提交中国专利局、申请号为201910199953.8、发明名称为“一种光模块”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及光纤通信领域，尤其涉及一种光模块。
背景技术
由硅光芯片实现光电转换功能已经成为高速光模块目前采用的一种主流方案。在硅光光模块中，硅光芯片设置在电路板表面，通过打线与电路板实现电连接；硅光芯片通过光纤带与光模块的光接口连接，实现光信号进出硅光芯片。由于硅光芯片采用的硅材料不是理想的激光芯片发光材料，不能在硅光芯片制作过程集成发光单元，所以硅光芯片需要由外部光源提供光。
发明内容
本申请实施例提供一种光模块，为光模块中的硅光芯片提供外部光源。
一方面，本申请实施例提供一种光模块，包括衬底、硅光芯片及激光盒，硅光芯片的底面及激光盒的底面分别设置在衬底上，激光盒的侧面射出光，硅光芯片的侧面接收来自激光盒的光。
可选的，所述激光盒包括激光芯片及密封透光件，所述密封透光件形成所述激光盒的侧面，所述激光芯片的出光方向与所述密封透光件的入光面垂直，所述密封透光件的入光面与所述密封透光件的出光面不平行。
可选的，所述激光盒包括第一激光芯片及第二激光芯片，所述第一激光芯片与所述第二激光芯片发出相同波长的光。
可选的，所述激光芯片的出光方向与所述激光盒的轴线方向平行。
可选的，所述硅光芯片的侧面与所述密封透光件的出光面平行设置。
可选的，还包括电路板，所述衬底设置在所述电路板表面或嵌入所述电路板。
可选的，还包括电路板，所述电路板设置有贯穿上下表面的开口，所述硅光芯片及所述激光盒设置在所述开口中
可选的，所述激光盒中还包括聚焦透镜，所述聚焦透镜位于所述激光芯片及所述密封透光件之间。
可选的，所述激光盒中还包括准直透镜，所述准直透镜位于所述聚焦透镜及所述激光芯片之间。
可选的，所述激光盒中还包括隔离器，所述隔离器与所述激光芯片之间设置有所 述聚焦透镜。
可选的，还包括上壳体、下壳体、所述激光盒及硅光芯片位于所述上壳体及所述下壳体之间；
所述激光盒包括盖体、盖板、至少两个激光芯片、至少两个聚焦透镜以及堵块；
所述盖板的上表面与所述上壳体导热接触，所述盖板的下表面与所述至少两个激光芯片导热接触；
所述盖板具有贯穿上、下表面的通孔，所述堵块设置在所述通孔中；
所述至少两个聚焦透镜设置在所述通孔下方，位于所述盖体上；
所述激光芯片发出的光通过所述聚焦透镜射出所述激光盒，所述硅光芯片接收来自所述激光盒的光。本申请实施例提供的光模块，将硅光芯片及激光盒分别设置在衬底上，硅光芯片与激光盒之间的这一相对位置关系，可以实现激光盒的侧面出光、硅光芯片的侧面接收来自激光盒的光，实现为硅光芯片提供外部光源。
另一方面，本申请实施例还提供一种光模块，包括上壳体、下壳体、位于所述上壳体及所述下壳体之间的激光盒及硅光芯片；所述激光盒包括盖体、盖板、至少两个激光芯片、至少两个聚焦透镜以及堵块；所述盖板的上表面与所述上壳体导热接触，所述盖板的下表面与所述至少两个激光芯片导热接触；所述盖板具有贯穿上、下表面的通孔，所述堵块设置在所述通孔中；所述至少两个聚焦透镜设置在所述通孔下方，位于所述盖体上；所述激光芯片发出的光通过所述聚焦透镜射出所述激光盒，所述硅光芯片接收来自所述激光盒的光。
可选的，还包括电路板，所述电路板位于所述上壳体及所述下壳体之间，所述电路板设置有贯穿上下表面的开口，所述硅光芯片及所述激光盒分别设置在所述开口中。
可选的，还包括衬底，所述激光盒及所述硅光芯片分别位于所述衬底上，所述衬底与所述下壳体导热接触。
可选的，所述衬底包括凹槽，所述激光芯片位于所述凹槽中。
可选的，所述激光盒还包括导电基板，所述导电基板的下表面设置有所述激光芯片；所述导电基板的上表面与所述盖板的下表面导热接触，以实现所述激光芯片与所述盖板下表面的导热接触。
可选的，所述激光盒还包括密封透光件，所述密封透光件形成所述激光盒的侧面，通过所述聚焦透镜的光由所述密封透光件射出所述激光盒。
可选的，所述至少两个激光芯片分别发出相同波长的光。
可选的，所述激光盒还包括隔离器，所述隔离器位于所述聚焦透镜与所述密封透光件之间。
本发明实施例提供的光模块，激光盒及硅光芯片位于上壳体及下壳体之间，激光盒包括盖体、盖板、至少两个激光芯片、至少两个聚焦透镜以及堵块，激光芯片与激光盒的盖板导热接触，盖板与上壳体导热接触，实现了激光芯片将热量传导至上壳体；光芯片发出的光通过聚焦透镜射出激光盒，硅光芯片接收来自激光盒的光，盖板具有贯穿上、下表面的通孔，至少两个透镜设置在通孔下方，位于盖体上，可以通过通孔调节透镜的位置，便于对激光盒进行有源耦合调节光路，提高至少两条光路与硅光芯片之间的耦合效率。
附图说明
下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为光通信终端连接关系示意图；
图2为光网络单元结构示意图；
图3为本发明实施例提供的一种光模块结构示意图；
图4为本发明实施例提供的一种光模块结构***示意图；
图5为本发明实施例提供的电路板、硅光芯片及激光盒装配关系示意图；
图6为本发明实施例提供的硅光芯片及激光盒装配关系分解结构示意图；
图7为本发明实施例提供的硅光芯片及激光盒装配关系另一分解角度结构示意图；
图8为本发明实施例提供的硅光芯片及激光盒结构关系示意图；
图9A为本发明实施例提供的硅光芯片及激光盒光耦合关系示意图；
图9B为本发明实施例提供的硅光芯片及激光盒光耦合关系剖面图；
图10A为本发明实施例提供的一种激光盒光路结构示意图；
图10B为本发明实施例提供的另一种激光盒光路结构示意图；
图11为本发明实施例提供的一种激光盒结构分解图；
图12为本发明实施例提供的激光盒分解结构示意图；
图13为本发明实施例提供的激光盒剖面示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
光通信实现将信号采用电和光两种不同的载体进行传输。光纤通信使用携带信息的光信号在光波导中传输，利用光在光纤等光波导中的无源传输特性可以实现低成本、低损耗的信息传输；而计算机等信息处理设备采用的是电信号，因此需要在光纤通信***中实现电信号与光信号的相互转换。
图1为光通信终端连接关系示意图。如图1所示，光通信终端的连接主要包括光网络单元100、光模块200、光纤101及网线103；
光纤的一端连接远端服务器，网线的一端连接本地信息处理设备，本地信息处理设备与远端服务器的连接由光纤与网线的连接完成；而光纤与网线之间的连接由具有光模块的光网络单元完成。
光模块200的光口与光纤101连接，与光纤建立双向的光信号连接；光模块200的电口接入光网络单元100中，与光网络单元建立双向的电信号连接；光模块实现光信号与电信号的相互转换，从而实现在光纤与光网络单元之间建立连接；实际应用中，来自光纤的光信号由光模块转换为电信号后输入至光网络单元100中，来自光网络单元100的电信号由光模块转换为光信号输入至光纤中。由于光模块200是实现光电信号相互转换的工具， 不具有处理数据的功能，因此在上述光电转换过程中，信息并不发生变化。
光网络单元具有光模块接口102，用于接入光模块，与光模块建立双向的电信号连接；光网络单元具有网线接口104，用于接入网线，与网线建立双向的电信号连接；光模块与网线之间通过光网络单元建立连接，实际应用中，光网络单元可以将来自光模块的信号传递给网线，以及将来自网线的信号传递给光模块，因此，光网络单元作为光模块的上位机，可以监控光模块的工作。
至此，远端服务器通过光纤、光模块、光网络单元及网线，与本地信息处理设备之间建立双向的信号传递通道。
上述方案中，所述的信息处理设备包括路由器、交换机、电子计算机等；光网络单元作为光模块的上位机，可以向光模块提供数据信号，并接收来自光模块的数据信号。另外，光模块的上位机除光网络单元之外还包括光线路终端等。
图2为光网络单元结构示意图。如图2所示，在光网络单元100中具有电路板105，在电路板105的表面设置有笼子106；在笼子106中设置有电连接器，用于接入金手指等光模块电口；在笼子106上设置有散热器107，散热器107具有增大散热面积的翅片等凸起结构。
光模块200***光网络单元100中，即光模块的电口***笼子106中的电连接器，光模块的光口与光纤101连接。
笼子106位于电路板上，将电路板上的电连接器包裹在笼子中；光模块200***笼子106中，由笼子106固定光模块200，光模块200产生的热量可通过光模块壳体传导给笼子106，再通过笼子上的散热器107进行扩散。一般地，光模块200的上壳体较光模块的下壳体更靠近笼子上的散热器107，借助散热器，光模块200的上壳体较下壳体可以实现更高效率的散热，对于光模块200中的器件来说，将热量向光模块的上壳体传导，可以更好的进行散热。
光模块在上述光通信连接中起到光电转换的关键作用，目前一种硅基光电芯片的封装方式在光模块行业逐渐成熟，其将硅基集成电路技术与光波导技术结合到一起，以芯片生长制作工艺制作出集成光电转换功能及电光转换功能的芯片。然而，由于硅光芯片采用的硅材料不是理想的激光芯片发光材料，并且不能在硅光芯片制作过程集成发光单元，所以硅光芯片需要由外部光源提供光。
为了给光模块中的硅光芯片提供外部光源，本申请提供一种光模块，下面结合图3-图11对本申请提供的光模块进行进一步说明。其中，图3为本发明实施例提供的一种光模块结构示意图，图4为本发明实施例提供的一种光模块结构***示意图。
如图3、图4所示，本发明实施例提供的光模块200包括上壳体201、下壳体202、解锁手柄203、电路板300、衬底、硅光芯片400、激光盒500、光纤带304a、304b及光纤接口306，其中，硅光芯片400及激光盒500分别设置在电路板300的同侧表面。
上壳体201与下壳体202形成具有两个开口的包裹腔体，具体可以是在同一方向的两端开口，也可以是在不同方向上的两处开口；其中一个开口为电口204，用于***光网络单元等上位机中，另一个开口为光口205，用于外部光纤接入，以使外部光线连接内部光纤。电路板300、硅光芯片400及激光盒500等光电器件位于包裹腔体中。
上壳体201及下壳体202采用金属材料，以利于电磁屏蔽以及散热。采用上壳体201、 下壳体202结合的装配方式，便于将电路板300等器件安装到包裹腔体中，本申请通过上壳体201和下壳体202形成包裹腔体，可以方便在装配电路板300等器件时，进行定位部件、散热及电磁屏蔽结构的部署，有利于自动化实施生产。解锁手柄203位于下壳体202的外壁，通过拉动解锁手柄203的末端可以在使解锁手柄203在外壁表面移动。光模块***上位机时由解锁手柄203将光模块卡合在上位机的笼子106里，并通过拉动解锁手柄203以解除光模块与上位机的卡合关系，将光模块从上位机的笼子106里抽出。
硅光芯片400的底面及激光盒500的底面分别设置在衬底上，硅光芯片400与激光盒500之间具有光连接。由于光路对硅光芯片400及激光盒500之间的位置关系非常敏感，并且不同膨胀系数的材料会导致不同程度的形变，不利于预设光路的实现。因此，本发明实施例中，将硅光芯片400及激光盒500设置在同一衬底上，同一材料的衬底发生形变，将等同的影响硅光芯片400及激光盒500的位置，减小形变对硅光芯片400与激光盒500相对位置的改变。可选的，衬底材料的膨胀系数与硅光芯片400和/或激光盒500材质的膨胀系数相近，例如，如果硅光芯片的主材料是硅，激光盒的主材料是可伐金属，衬底可以选用硅或玻璃等材料制成。
衬底与电路板300的位置关系有多种，其中一种方式如图4所示，电路板300具有贯穿上下表面的开口301，硅光芯片400和/或激光盒500设置在开口中。硅光芯片400和/或激光盒500可以向电路板300上表面方向及电路板300下表面方向同时散热，衬底302设置在电路板300的一侧，硅光芯片400和/或激光盒500穿过电路板300的开口，进而向衬底散热，使衬底302同时具有承托及散热的效果。另一种方式中，电路板300不设置开口，衬底设置在电路板上，具体可以是衬底设置在电路板表面或嵌入电路板中，使硅光芯片400和激光盒500设置在衬底表面上。
硅光芯片400与激光盒500之间要实现光耦合，就需要激光盒500的出光侧面与硅光芯片400的入光侧面处于同一高度平面。由于硅光芯片400采用芯片生长刻蚀工艺制作，具有较高的集成度，体积相对较小；而激光盒500的体积相对较大，并且激光盒500的侧面高度大于硅光芯片400的侧面高度，因此需要在衬底上设置凹槽308，以将激光盒500设置在凹槽308中。将硅光芯片400设置在衬底的表面，并将衬底的表面相对高于凹槽308，从而平衡硅光芯片400与激光盒500之间的高度差。
电路板300端部表面具有金手指307，金手指307由相互独立的多个引脚组成的，电路板300***笼子中的电连接器中，由金手指307与电连接器中的卡接弹片导通连接。在具体实现中，可以仅在电路板的一侧表面设置金手指307，考虑到引脚数量需求较大，也可在电路板上下表面均设置金手指307。金手指307用于与上位机建立电连接，具体的电连接可以是供电、接地、I2C信号、通信数据信号等。
本申请提供的技术方案中，激光盒500的底面设置在衬底302上，激光盒500通过侧面出光，其发出的光进入硅光芯片400中。激光盒500向硅光芯片400提供的光为波长单一、功率稳定的光，不携带数据，并通过硅光芯片400对光进行调制，以将要传输的数据加载到光中。
硅光芯片400的底面设置在衬底302上，硅光芯片400的侧面接收来自激光盒500的光。发射光的调制以及接收光的解调由硅光芯片400完成。硅光芯片400的表面设置有与电路板300打线电连接的焊盘；在一种实现方式中，电路板300向硅光芯片400提供来自 上位机的数据信号，由硅光芯片400将数据信号调制到光中，来自外部的光信号经硅光芯片400解调成电信号后，通过电路板300输出至上位机中。
硅光芯片400的多根光纤合并成光纤带，光纤带连接光纤接头以及光纤接口306，光纤接头与硅光芯片400连接，光纤接口用于与外部光纤连接。如图5所示，光纤接头303a与光纤带304a连接，光纤接头303b与光纤带304b连接，光纤带304a和光纤带304b分别与光纤接口306连接。光纤接头303a用于将硅光芯片400传来的发射光传输至光纤接口306中，光纤接头303b用于将光纤接口306传来的接收光传输至硅光芯片400中。
激光盒500发出的光进入硅光芯片400中，经硅光芯片400调制成光信号后，通过光纤接头303a传输至光纤接口306，实现光模块的光发射过程。外部光通过光纤接口306、光纤接头303b传输至硅光芯片400中，经硅光芯片400解调出电信号后输出至上位机，实现光模块的光接收过程。
为了实现上述光信号的调制与解调过程，本申请需要通过将电路板300、硅光芯片400及激光盒500按照预定位置进行装配，以形成预定的光传播路径。
图5为本发明实施例提供的电路板300、硅光芯片400及激光盒500装配关系示意图。如图5所示，在一种可行的方案中，硅光芯片400及激光盒500以相同的高度位阶设置在电路板的开口301中，使激光盒500的侧面与硅光芯片400的侧面之间进行光耦合。
此外，硅光芯片400分别与光纤接头303a、光纤接头303b进行光耦合。光纤接头303a一端与硅光芯片400进行光耦合，另一端与光纤带304a连接。光纤接头303b的一端与硅光芯片400进行光耦合，另一端与光纤带304b连接。光纤接头303a、303b与激光盒500以相同的高度位阶设置在硅光芯片400的侧边，光纤带304a、304b位于电路板的同侧表面。
激光盒500的轴线方向与硅光芯片400的耦合位置侧面呈非垂直角度关系，即硅光芯片400相对与激光盒500倾斜设置，激光盒500与硅光芯片400耦合的侧面为斜面。并且两个光纤接头303a、303b与硅光芯片400耦合的侧面均为斜面，硅光芯片400与激光盒500及光纤接头耦合的侧面为平面，且该平面与激光盒500的侧面平行。
图6为本发明实施例提供的硅光芯片及激光盒装配关系分解结构示意图，图7为本发明实施例提供的硅光芯片及激光盒装配关系另一分解角度结构示意图。如图6、图7所示，为了实现上述光耦合关系，硅光芯片400的侧面上具有第一光孔401、第二光孔402及第三光孔403，光孔中具有若干个光通道，其中，第一光孔401与光纤接头303b进行光耦合；第二光孔402与激光盒400进行光耦合。可选的，第二光孔中具有接收相同波长光的两个以上入光通道。第三光孔403与光纤接头303a进行光耦合，硅光芯片400将光孔设置在侧面上，使得激光盒500、光纤接头与硅光芯片400的耦合位置关系发生改变，同时改变激光盒400的结构。光纤接头303a具有若干光纤305a，用于与第三光孔403对接，光纤接头303b具有若干光纤305b，用于与第一光孔401对接，激光盒500具有密封透光件508，密封透光件形成激光盒的侧面，用于与第二光孔402对接。
为了实现耦合，光纤接头包括上基板、下基板及光纤，下基板设置有凹槽，光纤设置在凹槽中，上基板盖合在下基板上。如图7所示，光纤接头303a包括上基板307a、下基板306a及光纤305a；光纤接头303b包括上基板307b、下基板306b及光纤305b。激光盒包括盖体501及盖板502，在盖体与盖板形成的包裹腔中设置有激光芯片等光电器件。
硅光芯片400内部具有马赫曾德调制器，以实现功率调制。马赫曾德调制器调制采用同波长光干涉原理，一个马赫曾德调制器设置有两个干涉臂，单个干涉臂上输入一束光，一共需要向一个马赫曾德调制器提供两束同波长的光，经马赫曾德调制器调制后，干涉臂上的光会融合为一束光。可以向硅光芯片400提供一束单一波长的光，由硅光芯片400内部的分光波导，将一束单一波长的光分为两束同波长的光，分别输入马赫曾德调制器的两个干涉臂上；也可以向硅光芯片400提供两束同波长的光，这两束同波长的光直接分别输入马赫曾德调制器的两个干涉臂上；由于马赫曾德调制器最终将各干涉臂上的光进行融合，在采用单个相同光功率芯片的前提下，向硅光芯片提供两束光的方案，比提供一束光的方案，可以提供更高的光功率。
本发明实施例提供的硅光芯片400在侧面具有多个与激光盒500光耦合的光通道，通过这些光通道可以将多路相同波长的光输入硅光芯片400中，为马赫曾德调制器的各个干涉臂提供相同波长的光，单个激光芯片的发光功率有限，叠加多个激光芯片的光可以提升单个波长的光功率。
本发明实施例中，硅光芯片400与激光盒500的结构关系及光路，可通过硅光芯片400的工作原理和结构实现光调制功能，即，激光盒500发出功率稳定的光，功率稳定的光不携带信息，硅光芯片400将功率稳定的光调制为功率波动的光，功率波动的光携带有信息。
为了实现硅光芯片400与激光盒500具有更好的光耦合关系，本申请还对硅光芯片400与激光盒500的结构关系，以及其安装配合组件进行调整，下面结合图8-图11对硅光芯片400与激光盒500以及配合组件的安装关系进行详细说明。
图8为本发明实施例提供的硅光芯片及激光盒结构关系示意图，图9A为本发明实施例提供的硅光芯片及激光盒光耦合关系示意图，图9B为本发明实施例提供的硅光芯片及激光盒光耦合关系剖面图,图11为本发明实施例提供的一种激光盒结构分解图。如图8、图9A、图9B、图11所示，本发明实施例的激光盒可以向硅光芯片提供两束相同波长的光，以增加发射光的功率。本发明实施例提供的激光盒中包括盖体501、盖板502、密封透光件508、位于壳体内的导电基板、位于导电基板上的激光芯片、位于壳体内的透镜以及位于壳体内的隔离器。盖体501与盖板502形成包裹腔，密封透光件、导电基板、激光芯片、透镜及隔离器位于该包裹腔中。
本申请实施例中，由盖体501与盖板502形成相对封闭的腔体，密封透光件用于密封激光盒500，其设置在射向硅光芯片400的光路上，位于盖体501与盖板502之间，腔体内部的光经密封透光件后射入硅光芯片400中，具体可以是光经聚焦透镜后射入密封透光件中，进而进入硅光芯片400中。密封透光件是激光盒500中与硅光芯片400进行光耦合的部件，其出光面为激光盒500与硅光芯片400耦合的侧面，其出光面相对激光盒500整体呈斜面。
导电基板具有多种可行的设计，一种可行的方式如图8、图9A、图9B所示，导电基板部分位于腔体内、部分位于腔体外，位于腔体内的部分设置有激光芯片，位于腔体外的部分与电路板300电连接；另一种可行的方式为，导电基板完全位于腔体内，激光芯片位于导电基板上，激光盒500具有其他电连接结构与导电基板电连接。导电基板与激光芯片的配合关系可以有多种，一种可以如图8所示，一个导电基板上设置一个激光芯片，另一种则可以如图9所示，一个导电基板503设置有两个激光芯片，其他配合方式在本申请实 施例中不再一一示出。
激光芯片、透镜以及隔离器位于腔体内；透镜的设置有两种方式，一种方式为在激光芯片的出光方向设置一个透镜，具体为聚焦透镜，位于激光芯片及密封透光件之间，用于将激光芯片发出的光汇聚以便后续耦合；另一种方式如图8、图9A、图11所示，在激光芯片的出光方向设置两个透镜，具体分别为准直透镜和聚焦透镜，激光芯片发出的光经准直透镜变为准直光，准直光可以在较长距离的光传输过程中保持较小的光功率衰减，聚焦透镜接收准直光，以将光汇聚耦合进硅光芯片中。
隔离器用于防止激光芯片发出的光经发射后回到激光芯片中，所以隔离器设置在激光芯片出光方向上，可选的，本发明实施例中隔离器设置在透镜背向激光芯片的方向，即隔离器与激光芯片之间设置有聚焦透镜。
如图8、图9A及图11所示，本发明实施例提供的激光盒中，包括盖体501、盖板502、第一导电基板503a、第二导电基板503b、第一激光芯片504a、第二激光芯片504b、第一准直透镜505a、第二准直透镜505b、第一聚焦透镜506a、第二聚焦透镜506b、隔离器507、密封透光件508、第一封堵基板510及第二封堵基板509。
其中，第一导电基板503a及第二导电基板503b位于第一封堵基板510及第二封堵基板509之间，第一封堵基板510、第一导电基板503a、第二导电基板503b、第二封堵基板509、盖体501及盖板502一起形成密封结构；密封透光件508、盖体501及盖板508形成密封结构，从而使得盖体501、盖板502、第一导电基板503a、第二导电基板503b、第一封堵基板510、第二封堵基板509、密封透光件508一起形成密封的腔体；第一导电基板503a部分位于腔体内，部分位于腔体外；第二导电基板503b部分位于腔体内，部分位于腔体外；常见的导电基板为金属化陶瓷，在陶瓷表面形成电路图样，以实现不同的电连接需要；常见的封堵基板为陶瓷、可伐金属、凝固后的胶水或压铸金属等可以实现密封的物体；常见的密封透光件为玻璃或凝固后的胶水。
第一导电基板503a位于腔体内的部分设置有第一激光芯片504a，沿第一激光芯片504a的出光方向依次设置有第一准直透镜505a、第一聚焦透镜506a、隔离器507及密封透光件508；第二导电基板503b位于腔体内的部分设置有第二激光芯片504b，沿第二激光芯片504b的出光方向依次设置有第二准直透镜505b、第二聚焦透镜506b、隔离器507及密封透光件508；第一准直透镜505a、第一聚焦透镜506a、第二准直透镜505b、第二聚焦透镜506b、隔离器507均设置在盖体501上；本发明实施例中两激光芯片发出的两束光共用一个隔离器及一个密封透光件，可选的，可以为单束光单独设置单个隔离器及密封透光件，即设置两个隔离器及两个密封透光件，此种设置仍属于本申请的保护范围；
实际应用中，第一激光芯片504a及第二激光芯片504b发出相同波长的光，由此形成由第一激光芯片504a及第二激光芯片504b发出的两束光，相同波长的两束光最终提高硅光芯片400的出光功率。
第一激光芯片504a发出的光经第一准直透镜505a准直后，射向第一聚焦透镜506a，经第一聚焦透镜506a射向隔离器507，经隔离器射向密封透光件508，最终射出激光盒500。通过对第一聚焦透镜506a的调节，可以改变最终出射光的方向。同理，第二激光芯片504b发出的光经第二准直透镜505b准直后，射向第二聚焦透镜506b，经第二聚焦透镜506b射向隔离器507，经隔离器507射向密封透光件508，最终射出激光盒500。通过对第二聚焦 透镜506b的调节，可以改变最终出射光的方向。通过对第一聚焦透镜506a及第二聚焦透镜506b的调节，可以相互独立的调节两路光最终出射的方向，便于相互独立的实现有源光耦合。
第一激光芯片504a的出光方向与激光盒的轴线方向平行，其发出的单束光呈发散状，经第一准直透镜505a汇聚后形成准直平行光，平行光可以实现较长距离的低损耗传输，以满足后续光路设计、结构设计的需要；第一汇聚透镜506a将准直平行光汇聚成汇聚光，汇聚光缩小光斑面积集中光能量，利于提升光耦合效率。
同理，第二激光芯片504b的出光方向与激光盒的轴线平行，其发出的单束光呈发散状，经第二准直透镜505b汇聚后形成准直平行光，平行光可以实现较长距离的低损耗传输，以满足后续光路设计、结构设计的需要；第二汇聚透镜506b将准直平行光汇聚成汇聚光，汇聚光缩小光斑面积集中光能量，利于提升光耦合效率。
隔离器接收汇聚透镜方向传来的光，允许光单方向通过、反方向截止，从而起到隔离作用，用于防止通过隔离器的光反射回激光芯片中。
密封透光件起到密封激光盒以及透射光的作用，形成激光盒用于出光的侧面。激光盒内部具有激光芯片等光电器件，其工作环境需要一定程度的密封，以防止水汽等对器件以及光路的折射影响，密封透光件起到密封激光盒的作用；同时，激光芯片发出的光需要射出激光盒，密封透光件作为设置在激光盒边缘的组成部件，需要具有透光性，以让激光射出。
光束从密封透光件的出光面射出，实现从激光盒中射出。射出后的光束进入硅光芯片400中，为了防止光束在进入硅光芯片400时产生反射，缓解反射带来的光功率损失，要求光束以非垂直角度射入硅光芯片400的入光面，可选的，硅光芯片400内接收光的波导结构与硅光芯片400的入光面呈锐角设置，这要求光束在硅光芯片400入光面折射后，以正对波导结构的方向射入，这一方向与激光芯片的出光方向并不一致。
本发明实施例在激光盒中设计密封透光件，通过密封透光件的光学结构改变激光盒的出光方向，以满足硅光芯片的入光要求。本发明实施例提供的密封透光件包括两个不平行但相对的侧面，其中一个侧面为入光面，另一个侧面为出光面，密封透光件的入光面与出光面呈非平行方向设置，即呈非0°的夹角，其出光面相对于入光面呈明显的倾斜。
如图9A、图9B所示，密封透光件508为六面体，其中两对相对的侧面均呈平行关系，另一对相对侧面呈不平行关系。光束以垂直密封透光件508入光面的角度射入密封透光件中，在出光面发生折射，经硅光芯片400表面再次折射后，满足硅光芯片400的入光要求。密封透光件508的入光面与射来的光束方向垂直，如图9A所示，密封透光件508的入光面与激光芯片的出光方向垂直，激光芯片发出的光在传输过程中未改变方向；也可以是其他光路结构，激光芯片发出的光在传输过程中改变方向，到达密封透光件的光垂直与密封透光件的入光面。
本发明实施例中，密封透光件是光束必然经过的器件，光束在激光盒中最后通过的器件，所以通过使用密封透光件改变光的传输方向，可以相对简便的满足硅光芯片的入光角度要求。密封透光件的入光面与出光面之间呈非平行关系，通过设置入光面与出光面之间的角度，使得光自密封透光件的入光面射入、出光面射出后，光的传播方向接近硅光芯片的波导结构，结合光的折射因素，可以实现光的传播方向正对硅光芯片的波导结构。
在激光盒的侧面与硅光芯片的侧面之间填充光学胶水，胶水的折射率大于空气的折射率，小于所述硅光芯片的折射率。如图9A、图9B所示，光学胶水514填充在硅光芯片400与密封透光件508之间，使得激光盒500的侧面与硅光芯片400的侧面之间没有空气层，光从密封透光件508射出后直接进入胶水中，而非空气中。
通常情况下，折射率关系为：气体＜液体＜固体，例如，空气折射率为1，硅光芯片折射率为1.46；棱形玻璃为1.53；则本实施例中胶水折射率在1.46和1.53之间，如，胶水折射率为1.53，也可以略微大于1.53。胶水分类结构胶、导热胶、光学胶、导电胶等；胶水除防止尘土外，还有防止光在通过棱形玻璃和波导之间的空隙时发生散射。
基于上述结构关系，本申请提供的光模块可以通过硅光芯片400、密封透光件508形成完整的光路结构，实际应用中可以根据应用环境的需要，进一步进行调整，以形成多种光路结构，具体如下：
图10A为本发明实施例提供的一种激光盒光路结构示意图；图10B为本发明实施例提供的另一种激光盒光路结构示意图，图10B中硅光芯片、密封透光件及光的传播方向较图10A进行一定角度的旋转。图10A、图10B所示，以第二激光芯片504b发出的光束为例，密封透光件包括两个不平行但相对的侧面，其中一个侧面为入光面508a，另一个侧面为出光面508b，硅光芯片400的入光面400a与密封透光件之间隔有间隙，光束依次通过密封透光件508的入光面508a、密封透光件508的出光面508b、间隙、硅光芯片400的入光面400a才能进入硅光芯片400中，光束在密封透光件508的出光面508b以及硅光芯片400的入光面400a发生折射，使激光芯片的出光方向与光进入硅光芯片后的传播方向平行。
图10A中，第二激光芯片504b发出的光与激光盒500的轴线方向不平行，第二激光芯片504b发出的光与第二激光芯片504b的出光面垂直，密封透光件508的入光面508a与光的传播方向垂直，光束不发生折射，光束保持原传播方向射入密封透光件的出光面508b，密封透光件的出光面508b与硅光芯片400的入光面400a平行，光束在出光面508b处发生折射，折射后的光束射入硅光芯片400的入光面400a，再次发生折射后进入硅光芯片400中。硅光芯片400材质的折射率与密封透光件508材质的折射率相近，光束在密封透光件508的出光面508b处发生折射，然后在硅光芯片400的入光面400a处发生折射，等同于光从介质A射入介质B，然后由介质B射入介质A，在介质A中的入射角等于在介质B中的折射角。
硅光芯片400中，通常会要求光以11.6°的入射角射入硅光芯片400的入光面400a，光进入硅光芯片400后的折射角θ为8°，这要求激光芯片的出光方向与密封透光件的出光面呈8°角，即激光芯片在密封透光件的出光面提供8°的入射角α。如果激光芯片发出的光直接射入硅光芯片400的入光面400a，则需要提供11.6°的入射角，采用密封透光件508的结构设计，减小激光芯片的出光方向相对于硅光芯片400的角度要求，而且折射相对于反射，更有利于维持光斑形状，利于提升耦合效率。
如图10A所示，激光芯片的出光方向与激光盒的轴线方向不平行，这种不平行的设计使得生产工艺需要以激光盒的轴线方向为参考，旋转激光芯片或透镜，对生产工艺带来困难，而激光盒的轴向方向与激光芯片的出光方向平行，这易于生产。
为了实现激光芯片的出光方向与激光盒的轴线方向平行，可将图10A中密封透光件及硅光芯片旋转一定角度，得到如图10B所示的设计。如图10B所示，密封透光件508的入 光面508a与激光芯片的出光方向垂直，激光盒的出光面相对激光盒的轴线方向呈非垂直角度，硅光芯片400的入光面400a相对激光盒的轴线方向呈非垂直角度，将激光盒500及硅光芯片400设置在电路板的开口中，电路板的开口是不规则的方形以适应上述结构。
硅光芯片400以及激光盒500均是独立制作的产品，由激光盒500向硅光芯片400提供光。由于射向硅光芯片400的光具有特定的方向要求，并且激光盒500的制作工艺、激光盒500与硅光芯片400的光耦合方式限定激光芯片的出光方向，使得这两个方向之间存在较大的角度变化，采用常规光反射的方式实现这一角度变化会带来耦合效率较低的技术问题，因此，本申请采用密封透光件折射光，在激光芯片及硅光芯片之间，设计密封透光件508入光面、出光面的角度关系，实现这一角度变化，可以缓解耦合效率降低的问题，而且密封透光件作为可独立自由设计的光学器件，设计、操作相对便利。
另外，由于激光芯片工作时会产生较大的热量(Heat)，产生的热量会升高工作环境的温度，而较高的工作环境温度会导致激光芯片功率降低、波长偏移，因此，为了提高芯片的功率，缓解波长偏移，需要向激光芯片提供散热渠道。
在本申请光模块的装配过程中，激光盒500的装配顺序是以盖体501为底，在盖体501上设置器件，然后合上盖板502，并且光模块的装配顺序是以下壳体202为底，在下壳体202上设置器件，然后盖上上壳体201。这种装配顺序使得激光盒500的盖板502朝向光模块的上壳体201，激光盒的盖体501朝向光模块下壳体202，光模块的上壳体201比光模块的下壳体202具有更佳的散热渠道，激光盒的盖体501可以通过光模块的上壳体201进行散热。
为了使光模块的上壳体201能用于散热，本发明实施例还提供一种激光盒结构，其中，盖板502的下表面与至少两个激光芯片导热接触，盖板502的上表面与光模块上壳体201导热接触。具体的导热接触结构可以是：导电基板设置在盖板502的下表面，导电基板的下表面设置激光芯片，即导电基板朝向光模块上壳体201的一侧设置在激光盒盖板502下表面，导电基板朝向光模块下壳体的一侧设置激光芯片；盖板502的上表面通过导热胶等导热件与光模块上壳体201接触。至此，激光芯片产生的热量通过导电基板传导至激光盒盖板502，由激光盒的盖板502传到至光模块的上壳体201。
图13为本发明实施例提供的激光盒剖面示意图。图12、图13给出一种具体的激光盒结构。以第二激光芯片504b为例，第二激光芯片504b设置在导电基板503b的下表面，导电基板503b设置在激光盒盖板502的内表面，在导电基板与盖板内表面之间设置有第二封堵件509，第二封堵件509大面积贴合在导电基板503b的上表面以形成导热接触结构，从而将导电基板503b设置在盖板502的下表面，同时将导电基板503b的热量传导至激光盒的盖板502上。也可以将导电基板503b的上表面直接贴在盖板502的内表面上，是否使用第二封堵件可以根据导热接触结构要求以及密封要求灵活设置。如此，激光芯片504b将热量传导至导电基板503b，由导电基板503b直接或间接将热量传导至激光盒的盖板502，由激光盒的盖板502将热量传导至光模块的上壳体201，使激光芯片504b产生的热量从上壳体201散发出去。
并且，导电基板503b与盖体501之间由第一封堵件510密封连接，激光芯片504b悬浮在盖体501的上方，激光芯片504b与盖体501之间未形成热传导渠道，激光芯片504b的热量主要通过盖板502散发。通过电路板300的开口，硅光芯片400及激光盒由衬底302 承载，衬底与光模块下壳体202导热接触，硅光芯片400产生的热量主要由衬底302向光模块下壳体202散发。因此，激光盒的热量主要通过光模块上壳体201散发，硅光芯片400的热量主要通过光模块下壳体202散发，缓解硅光芯片400及激光盒500的热量向光模块同一侧集中，充分利用光模块上下两侧的散热渠道。
由于导电基板设置在盖板502的内表面，激光芯片设置在导电基板上，结合激光盒的装配顺序，可以使激光芯片预设固定在激光盒的盖板502上。在未合上盖板502时，激光盒的光路未完整形成，无法对激光芯片进行带电有源光路耦合；在合上盖板502后，外界无法对激光芯片内部的器件进行位置移动，有源耦合无法实现。因此，按照预设位置装配好激光盒，存在较大的位置误差，这一位置误差导致预设光路与实际光路存在较大的位置差距，极大影响光耦合的效率，尤其是在激光盒提供两路以上的光束时，光束之间的位置无法调制，让两束光束同时与硅光芯片的两个进光口对齐是非常困难的，实现三路以上的光对齐更加困难。
对此，本发明实施例提供一种激光盒，以实现上述激光盒的有源耦合。如图12、图13所示，在激光盒的盖板上设置有通孔512，在通孔512的下方设置有聚焦透镜506a、506b，聚焦透镜506a、506b设置在盖体501上。为了调节聚焦透镜的高度，可以在聚焦透镜及盖体501之间设置垫块513。将激光盒的盖板502合上后，激光芯片的位置固定，对激光芯片加电发光，光通过透镜射出，外界的调整装置可以通过通孔512伸入激光盒中。由于聚焦透镜位于通孔的下方，外界的调整装置从通孔进入激光盒、对聚焦透镜进行位置调整。即改变透镜的位置或角度，以改变光束的射出位置。在完成激光盒与硅光芯片的相对固定后，可以通过对透镜的调整。在激光芯片发光状态下，将光对其至硅光芯片的光孔，实现有源耦合。为了实现对激光盒的密封，激光盒还包括堵块511，使用堵块511将通孔512堵住。
可选的，结合透镜的具体尺寸，可以将准直透镜505a、505b设置在盖板的内表面(下表面)，以实现与激光芯片出光光路的匹配。
最后应说明的是：以上实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。

Claims (19)

  1. 一种光模块，包括衬底、硅光芯片及激光盒，所述硅光芯片的底面及所述激光盒的底面分别设置在所述衬底上，所述激光盒的侧面射出光，所述硅光芯片的侧面接收来自所述激光盒的光。
  2. 如权利要求1所述的光模块，其中，所述激光盒包括激光芯片及密封透光件，所述密封透光件形成所述激光盒的侧面，所述激光芯片的出光方向与所述密封透光件的入光面垂直，所述密封透光件的入光面与所述密封透光件的出光面不平行。
  3. 如权利要求1所述的光模块，其中，所述激光盒包括第一激光芯片及第二激光芯片，所述第一激光芯片与所述第二激光芯片发出相同波长的光。
  4. 如权利要求2或3任一所述的光模块，其中，所述激光芯片的出光方向与所述激光盒的轴线方向平行。
  5. 如权利要求2所述的光模块，其中，所述硅光芯片的侧面与所述密封透光件的出光面平行设置。
  6. 如权利要求1所述的光模块，其中，还包括电路板，所述衬底设置在所述电路板表面或嵌入所述电路板。
  7. 如权利要求1所述的光模块，其中，还包括电路板，所述电路板设置有贯穿上下表面的开口，所述硅光芯片及所述激光盒设置在所述开口中
  8. 如权利要求2所述的光模块，其中，所述激光盒中还包括聚焦透镜，所述聚焦透镜位于所述激光芯片及所述密封透光件之间。
  9. 如权利要求8述的光模块，其中，所述激光盒中还包括准直透镜，所述准直透镜位于所述聚焦透镜及所述激光芯片之间。
  10. 如权利要求8所述的光模块，其中，所述激光盒中还包括隔离器，所述隔离器与所述激光芯片之间设置有所述聚焦透镜。
  11. 如权利要求1所述的光模块，其中，还包括上壳体、下壳体、所述激光盒及硅光芯片位于所述上壳体及所述下壳体之间；
    所述激光盒包括盖体、盖板、至少两个激光芯片、至少两个聚焦透镜以及堵块；
    所述盖板的上表面与所述上壳体导热接触，所述盖板的下表面与所述至少两个激光芯片导热接触；
    所述盖板具有贯穿上、下表面的通孔，所述堵块设置在所述通孔中；
    所述至少两个聚焦透镜设置在所述通孔下方，位于所述盖体上；
    所述激光芯片发出的光通过所述聚焦透镜射出所述激光盒，所述硅光芯片接收来自所述激光盒的光。
  12. 一种光模块，包括上壳体、下壳体、位于所述上壳体及所述下壳体之间的激光盒及硅光芯片；
    所述激光盒包括盖体、盖板、至少两个激光芯片、至少两个聚焦透镜以及堵块；
    所述盖板的上表面与所述上壳体导热接触，所述盖板的下表面与所述至少两个激光芯片导热接触；
    所述盖板具有贯穿上、下表面的通孔，所述堵块设置在所述通孔中；
    所述至少两个聚焦透镜设置在所述通孔下方，位于所述盖体上；
    所述激光芯片发出的光通过所述聚焦透镜射出所述激光盒，所述硅光芯片接收来自所述激光盒的光。
  13. 如权利要求12所述的光模块，其中，还包括电路板，所述电路板位于所述上壳体及所述下壳体之间，所述电路板设置有贯穿上下表面的开口，所述硅光芯片及所述激光盒分别设置在所述开口中。
  14. 如权利要求13所述的光模块，其中，还包括衬底，所述激光盒及所述硅光芯片分别位于所述衬底上，所述衬底与所述下壳体导热接触。
  15. 如权利要求15所述的光模块，其中，所述衬底包括凹槽，所述激光芯片位于所述凹槽中。
  16. 如权利要求12至15任一所述的光模块，其中，所述激光盒还包括导电基板，所述导电基板的下表面设置有所述激光芯片；所述导电基板的上表面与所述盖板的下表面导热接触，以实现所述激光芯片与所述盖板下表面的导热接触。
  17. 如权利要求16所述的光模块，其中，所述激光盒还包括密封透光件，所述密封透光件形成所述激光盒的侧面，通过所述聚焦透镜的光由所述密封透光件射出所述激光盒。
  18. 如权利要求17所述的光模块，其中，所述至少两个激光芯片分别发出相同波长的光。
  19. 如权利要求17所述的光模块，其中，所述激光盒还包括隔离器，所述隔离器位于所述聚焦透镜与所述密封透光件之间。
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