WO2020177412A1 - 图像传感器及其制备方法、图像识别方法、电子设备 - Google Patents
图像传感器及其制备方法、图像识别方法、电子设备 Download PDFInfo
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Definitions
- the embodiments of the present application relate to the technical field of image sensors, such as an image sensor and a preparation method thereof, an image recognition method, and electronic equipment.
- the image sensor converts optical images into electrical signals.
- image sensors With the development of the computer and communication industries, there is an increasing need for high-performance image sensors in various fields such as digital cameras, video cameras, personal communication systems (PCS), game consoles, cameras, and medical micro cameras.
- PCS personal communication systems
- an image sensor may include an image sensor chip and a lens covering the image sensor chip.
- the imaged object is imaged on the image sensor chip through the lens, and then the image sensor is controlled by a control unit arranged on the periphery of the image sensor chip.
- the chip is exposed to convert light signals into electrical signals, thereby obtaining an image of the imaged object.
- the image sensor in the related art requires a larger area of the image sensor chip. Due to the high price of the image sensor chip, the cost of the image sensor is higher.
- the embodiments of the present application provide an image sensor, a manufacturing method thereof, an image recognition method, and an electronic device, so as to avoid the high manufacturing cost of the image sensor in the related art.
- an embodiment of the present application provides an image sensor, including: a sensor unit array, the sensor unit array includes a plurality of sensor units, a plurality of the sensor unit arrays are arranged; each sensor unit is configured as A partial size image of the imaging object is generated, and each sensor unit includes at least one interconnection structure; an encapsulation layer covering the sensor unit array, the encapsulation layer exposing the interconnection structure of each sensor unit; The rewiring layer on the side of the encapsulation layer, the rewiring layer is electrically connected to the interconnection structure; the circuit board on the side of the rewiring layer away from the encapsulation layer, the circuit board and the rewiring layer Electric connection.
- an embodiment of the present application also provides a method for manufacturing an image sensor, including: providing a base substrate; forming a sensor unit array on the base substrate, the sensor unit array including a plurality of sensor units, A plurality of the sensor units are arranged in an array; each sensor unit is configured to generate a partial size image of an imaging object, and each sensor unit includes at least one interconnection structure; an encapsulation layer is prepared on the base substrate, The packaging layer covers the sensor unit array and exposes the interconnection structure of each sensor unit; a rewiring layer is prepared on the side of the packaging layer away from the base substrate, and the rewiring layer is connected to The interconnection structure is electrically connected; a circuit board is prepared on the side of the redistribution layer away from the encapsulation layer, and the circuit board is electrically connected to the redistribution layer.
- an embodiment of the present application also provides an image recognition method, using the image sensor provided in the first aspect, including: acquiring multiple partial size recognition images generated by the sensor unit array; and recognizing images based on the multiple partial sizes , Acquiring the position information of at least two image feature points; according to the position information of the at least two image feature points, using an image feature point recognition algorithm to recognize the recognition image collected by the image sensor.
- an embodiment of the present application also provides an electronic device, including the image sensor provided in the first aspect.
- FIG. 1 is a schematic structural diagram of an image sensor provided by an embodiment of the present application.
- FIG. 2 is a schematic structural diagram of a sensor unit provided by an embodiment of the present application.
- FIG. 3 is a schematic structural diagram of another sensor unit provided by an embodiment of the present application.
- FIG. 4 is a schematic structural diagram of another sensor unit provided by an embodiment of the present application.
- FIG. 5 is a schematic structural diagram of another sensor unit provided by an embodiment of the present application.
- FIG. 6 is a schematic structural diagram of another sensor unit provided by an embodiment of the present application.
- FIG. 7 is a schematic structural diagram of another sensor unit provided by an embodiment of the present application.
- FIG. 8 is a schematic structural diagram of another sensor unit provided by an embodiment of the present application.
- FIG. 9 is a schematic structural diagram of another sensor unit provided by an embodiment of the present application.
- FIG. 10 is a schematic structural diagram of another sensor unit provided by an embodiment of the present application.
- FIG. 11 is a schematic diagram of an imaging principle of an image sensor provided by an embodiment of the present application.
- FIG. 12 is a schematic diagram of the principle of taking pictures of an image sensor according to an embodiment of the present application.
- FIG. 13 is a schematic flowchart of an image recognition method provided by an embodiment of the present application.
- FIG. 14 is a schematic diagram of the principle of an image recognition method provided by an embodiment of the present application.
- 15 is a schematic diagram of the imaging principle of the image sensor to recognize the face image provided by an embodiment of the present application.
- FIG. 16 is a schematic diagram of a drawing principle of a face image recognition by an image sensor according to an embodiment of the present application.
- FIG. 17 is a schematic flowchart of an image sensor manufacturing method according to an embodiment of the present application.
- 18-24 are schematic structural diagrams of various steps of an image sensor manufacturing method provided by an embodiment of the present application.
- An embodiment of the present application provides an image sensor, including: a sensor unit array, the sensor unit array includes a plurality of sensor units, the plurality of sensor unit arrays are arranged; each sensor unit is configured to generate a partial size image of an imaging object, and each The sensor unit includes at least one interconnection structure; an encapsulation layer covering the sensor unit array, the encapsulation layer exposing the interconnection structure of each sensor unit; a redistribution layer on one side of the encapsulation layer, which is electrically connected to the interconnection structure; The wiring layer is away from the circuit board on the side of the packaging layer, and the circuit board is electrically connected to the rewiring layer.
- the image sensor includes a sensor unit array, the sensor unit array includes a plurality of sensor units, and by setting the sensor includes a plurality of sensor units arranged in an array, each sensor unit generates a partial size image of the imaging object, which is compared with the whole
- the sensor chip provided on the chip can save the coverage area of the sensor chip, and can effectively reduce the total volume of the entire image sensor without affecting the imaging quality, easy to realize the miniaturization design of the image sensor, and save the preparation cost of the image sensor ;
- each sensor unit includes at least one interconnection structure, the entire sensor unit array is connected to the circuit board through the interconnection structure and the rewiring layer, and the entire image sensor is packaged using a fan-out process to ensure a good packaging effect.
- FIG. 1 is a schematic structural diagram of an image sensor provided by an embodiment of the present application.
- the image sensor provided by an embodiment of the present application may include: a sensor unit array 10, which includes a plurality of sensor units 101 , A plurality of sensor units 101 are arranged in an array; each sensor unit 101 is configured to generate a partial size image of an imaging object, and each sensor unit 101 includes at least one interconnection structure 1014; an encapsulation layer 20 covering the sensor unit array 10, The encapsulation layer 20 exposes the interconnection structure 1014 of each sensor unit 101; the redistribution layer 30 on the side of the encapsulation layer 20 is electrically connected to the interconnection structure 1014; the redistribution layer 30 is located on the side away from the encapsulation layer 20 The circuit board 40 is electrically connected to the redistribution layer 30.
- the image sensor provided by an embodiment of the present application may include a sensor unit array 10, a plurality of sensor units 101 in the sensor unit array 10 are arranged in an array, and each sensor unit 101 generates a partial size image of an imaging object,
- the embodiment of the invention creatively applies the concept of "splitting into parts" to the image sensor, and applies the image sensor chip designed on the entire surface in the related technology.
- the sensor unit array 10 includes a plurality of independently arranged sensor units 101, and each sensor unit 101 generates a partial size image of an imaging object.
- the technical solutions of the embodiments of the present application can reduce the coverage area of the image sensor chip and save the manufacturing cost of the image sensor.
- each sensor unit 101 includes at least one interconnection structure 1014, and each interconnection structure 1014 is electrically connected to the redistribution layer 30, and the redistribution layer 30 is connected to the circuit board 40 ,
- the electrical connection relationship between the sensor unit 101 and the circuit board is realized through the interconnection structure 1014 and the rewiring layer 30.
- the graph line sensor in the embodiment of the present application is packaged using a fan-out process. Compared with the way that the sensor unit 101 is directly connected to the circuit board 40 through wires, more sensor units 101 can be integrated in the image sensor, and the integration flexibility is good. ; And can ensure that the image sensor packaging effect is good.
- the image sensor provided by the embodiment of the present application includes a plurality of sensor units arranged in an array, and each sensor unit generates a partial size image of the imaged object. Compared with the sensor chip provided in the whole chip, the sensor can be saved. The coverage area of the chip can effectively reduce the total volume of the entire image sensor without affecting the imaging quality, easy to realize the miniaturization design of the image sensor, and save the preparation cost of the image sensor; at the same time, each sensor unit includes at least An interconnection structure, the entire sensor unit array is connected to the circuit board through a rewiring layer, and the entire image sensor is packaged by fan-out technology to ensure a good packaging effect.
- FIG. 2 is a schematic structural diagram of a sensor unit provided by an embodiment of the present application.
- the sensor unit 101 provided by an embodiment of the present application may further include a package cover 1011; a sensor chip 1012 located on one side of the package cover 1011
- the sensor chip 1012 is configured to generate a partial size image of the imaging object; at least one optical element 1013 is located on the photosensitive side of the sensor chip 1012, and the optical element 1013 is configured to receive part of the incident light of the imaging object and image part of the incident light on the sensor chip ⁇ 1012.
- the packaging cover 1011 may be a flexible substrate, and its material may include polyimide, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyarylate, and poly At least one of ether sulfone; the package cover 1011 may also be a rigid substrate, for example, a silicon wafer, a glass substrate or other rigid substrates.
- the embodiment of the application does not limit the type and material of the substrate.
- the optical element 1013 is arranged corresponding to each sensor chip 1012. When the image sensor is working, the optical element 1013 receives part of the incident light from the imaging object and images the part of the incident light on the corresponding sensor chip 1012, and the sensor chip 1012 generates a partial size image of the imaging object.
- the distance u between the optical element 1013 and the sensor chip 1012 can be adjusted so that the image area is smaller than the object area by a certain multiple, and the size of the sensor chip 1012 is controlled. This provides a degree of freedom for the design of the sensor chip 1012 and ensures that the size of each sensor chip 1012 is flexible.
- the optical element 1013 may be located between the film layer where the package cover 1011 is located and the film layer where the sensor chip 1012 is located, as shown in FIG. 2; or the optical element 1013 may also be located on a side of the package cover 1011 away from the sensor chip. Side 1012, as shown in FIG. 3, is not limited in comparison with the embodiments of the present application.
- each sensor chip 1012 may correspond to at least one optical element 1013.
- FIG. 2 uses an example in which each sensor chip 1012 may correspond to one optical element 1013.
- FIG. 4 uses each sensor chip 1012 to correspond to two optical elements.
- the optical element 1013 is described as an example, which is not limited in the embodiment of the present application.
- the interconnection structure 1014 may include at least one of metal solder balls, metal pads, and metal bumps, which is not limited in the embodiment of the present application, and the interconnection structure 1014 only needs to satisfy electrical and mechanical connections. That is, the drawings in the embodiments of the present application only take the interconnection structure 1014 as a metal solder ball as an example for illustration.
- Figures 5, 6 and 7 are all schematic structural diagrams of another display panel provided by an embodiment of the present application.
- the sensor unit provided by the embodiment of the present application may also include
- the coating 1015 on at least one surface of the package cover 1011 has an opening formed in the coating 1015; the vertical projection of the opening on the plane of the package cover 1011 and the vertical projection of the optical element 1013 on the plane of the package cover 1011 exist Overlapping area.
- FIG. 5 takes the coating 1015 provided on the side of the package cover 1011 facing the sensor chip 1012 as an example for illustration
- FIG. 6 takes the coating 1015 provided on the side of the package cover 1011 away from the sensor chip 1012 as an example.
- FIG. 7 takes the coating 1015 provided on both sides of the package cover plate 1011 as an example for illustration.
- a coating 1015 is provided on at least one surface of the package cover 1011, and an opening is formed in the coating 1015.
- the vertical projection of the element 1013 on the plane where the package cover 1011 is located has an overlapping area to ensure that a specific aperture is formed through the coating 1015 and the opening in the coating 1015, and the light emitted by the imaging object reaches the optical element 1013 through the specific aperture. Ensure that interference light can be filtered out and the image quality of the image sensor can be enhanced.
- the optical element 1013 may be at least one of a lens, an imaging hole, and a collimator.
- Figures 1 to 7 take the optical element 1013 as a lens as an example.
- FIGS. 8 and 9 take the optical element 1013 as an imaging hole as an example for description.
- the sensor unit 101 provided by an embodiment of the present application may further include a gasket 1016, and the gasket 1016 is located on the film layer where the package cover 1011 is located and the film layer where the sensor chip 1012 is located. between.
- a spacer 1016 is provided between the package cover 1011 and the sensor chip 1012, and the thickness of the spacer 1016 can be adjusted to achieve the purpose of adjusting the distance between the optical element 1013 and the sensor chip 1012, that is, the purpose of adjusting the image distance It is ensured that the sensor unit 101 provided by the embodiment of the present application is the sensor unit 101 with adjustable image distance, and the function of the sensor unit is flexible and diverse.
- FIG. 10 is a schematic structural diagram of another sensor unit provided by an embodiment of the present application.
- the sensor unit 101 may also not include the spacer 1016.
- the sensor unit 101 provided is a sensor unit 101 with an adjustable image distance, and at the same time, the structure of the sensor unit 101 can be ensured to be simple.
- the image sensor provided by the embodiment of the present application includes a sensor unit array 10, which includes a plurality of sensor units 101. Each sensor unit 101 generates a partial size image of an imaging object.
- the entire sensor unit array 10 can The full-size image of the imaging object is generated, and the partial size image of the imaging object can also be generated, and the comparison of the embodiments of the present application is not limited.
- the full-size image of the imaging object generated by the sensor unit array 10 is compared with the preset imaging object image to perform image recognition.
- the application embodiment will not repeat this description; the embodiment of the application focuses on describing how to perform image recognition when the sensor unit array 10 generates a partial size image of an imaging object, which will be described below.
- FIG. 11 is a schematic diagram of the imaging principle of an image sensor provided by an embodiment of the present application
- FIG. 12 is a schematic diagram of the imaging principle of an image sensor provided by an embodiment of the present application, as shown in FIG. 11 and FIG. 12, the sensor unit 101
- the imaging object coverage area S is formed based on the incident light of the imaging object, and the distance between the coverage areas S of two adjacent sensor units 101 is L, where L>0.
- the embodiment of the present application creatively proposes an image recognition method using "image feature point recognition".
- FIG. 13 is a schematic flowchart of an image recognition method provided by an embodiment of the present application.
- FIG. 14 is a schematic diagram of the principle of an image recognition method provided by an embodiment of the present application. As shown in FIG. 13 and FIG. 14, the application is implemented
- the image recognition method provided in the example may include step S110 to step S130.
- step S110 a plurality of partial size recognition images generated by the sensor unit array are acquired.
- a plurality of partial size recognition images generated by the sensor unit array are acquired, and this step is completed by the image sensor acquisition provided in the embodiment of the present application.
- step S120 based on the multiple partial size recognition images, position information of at least two image feature points is acquired.
- the recognition image finally collected by the image sensor is an array composed of multiple partial size recognition images, and each partial size recognition image has a certain probability to include feature points on the recognition image that can be used for recognition. , As the black dot in Figure 14.
- each sensor cell array may include M rows and N columns of sensor cells, each sensor cell may include X rows and Y columns of pixels. Therefore, for an image feature point that falls within the coverage of the sensor unit, it can be represented by a coordinate (x, y, m, n, ⁇ ) in the feature space.
- the fingerprint cross point is taken as the feature point of the image, and the angle at the position of the fingerprint cross point is taken as the feature angle of the image feature point as an example for illustration.
- step S130 according to the location information of the at least two image feature points, an image feature point recognition algorithm is used to recognize the recognition image collected by the image sensor.
- an image feature point recognition algorithm is used to recognize the recognition image collected by the image sensor.
- the image feature point recognition algorithm can use the image feature point recognition algorithm known in the art.
- the image feature point recognition algorithm can refer to the document “Direct gray-scale minutiae detection in fingerprints", doi:10.1109/TPAMI.2007.250596 "Pores and ridges High-resolution fingerprint matching using level 3 features", doi:10.1016/S0031-3203(98)00107-1 document “Fingerprint minutiae extraction from skeletonized binary images” and doi:10.1109/ICCACS.2015.7361357 The document “Extraction of high confidence minutiae points from fingerprint images”.
- the image recognition method provided by the embodiment of the present application is based on the recognition image collected by the image sensor provided in the embodiment of the present application.
- using an image feature point recognition algorithm to recognize the recognition image collected by the image sensor may include: calculating any two image feature points based on the location information of the at least two image feature points. The distance between image feature points; according to the distance between any two image feature points, the image feature point recognition algorithm is used to identify the recognition image collected by the image sensor.
- each sensor unit in the entire sensor unit array since the position of each sensor unit in the entire sensor unit array is known, the collection of all image feature points located within the coverage of the sensor unit can be obtained with certainty.
- the distance between each image feature point in the set can be calculated accurately.
- the coordinates of the internal members of the entire image feature point set are unique and certain, and can be used by image recognition algorithms based on image feature points to realize the image recognition function.
- the multiple partial size recognition images generated by the sensor unit array may further include: multiple acquisitions of multiple partial size entry images generated by the sensor unit array, generating partial size entry into the image library; entry according to the partial size Image library, using image stitching algorithm to generate full-size input images.
- image recognition can generally be divided into two processes: image entry and image recognition.
- image entry process the system can require the object to be entered to move multiple times in the image entry plane of the image sensor, and multiple acquisitions generated by the sensor unit array Enter images in multiple partial sizes, and generate partial sizes into the image library. Then enter the image library according to the partial size, and use the image stitching algorithm to cut and stitch the partial size of the entered image to generate a complete entry image that contains all the image feature point information.
- the subsequent image recognition process based on the acquired recognition image containing part of the image feature points, it is compared with the input image containing all image feature points to perform image recognition.
- the image recognition method provided in the embodiment of the application only takes fingerprint recognition as an example for description. It is understandable that the image distance of the sensor unit and the focal length of the optical element in the image sensor provided in the embodiment of the application are both Adjustable, so the object distance of the sensor unit in the embodiment of the application is also adjustable. Therefore, the image sensor provided in the embodiment of the application can also recognize objects with different object distances, for example, with a face recognition algorithm, the embodiment of the application provides The image sensor can realize face recognition, as shown in Figure 15 and Figure 16.
- An embodiment of the present application also provides a method for manufacturing an image sensor. As shown in FIG. 17, the method for manufacturing an image sensor provided in an embodiment of the present application may include step S210 to step S250.
- step S210 a base substrate is provided.
- FIG. 18 is a schematic diagram of the structure of preparing a base substrate provided by an embodiment of the present application.
- the base substrate 50 can be a flexible substrate or a rigid substrate. And the material is limited.
- a sensor unit array is formed on the base substrate, the sensor unit array includes a plurality of sensor units, and the plurality of sensor unit arrays are arranged; each sensor unit is configured to generate an imaging object A partial size image, and each of the sensor units includes at least one interconnection structure.
- FIG. 19 is a schematic structural diagram of forming a sensor unit array 10 on a base substrate according to an embodiment of the present application. As shown in FIG. 19, a plurality of sensor units 101 are arrayed on the base substrate 50 to form the sensor unit array 10.
- the sensor unit array 10 may be adhered to the base substrate 50 by glue.
- the material of the interconnection structure 1014 is mainly solder metal.
- solder metal For example, Sn, Ag, Cu, Pb, Au, Ni, Zn, Mo, Ta, Bi, In, etc. and their alloys.
- step S230 an encapsulation layer is prepared on the base substrate, the encapsulation layer covers the sensor unit array and exposes the interconnection structure of each sensor unit.
- preparing an encapsulation layer on the base substrate, the encapsulation layer covering the sensor unit array, and exposing the interconnection structure of each sensor unit may include: preparing an encapsulation layer on the base substrate, and the encapsulation layer Encapsulate the sensor unit array; thin the packaging layer to expose the interconnect structure of each sensor unit.
- FIG. 20 is a schematic diagram of the structure of preparing the encapsulation layer provided by an embodiment of the present application
- FIG. 21 is a schematic diagram of the structure of thinning the encapsulation layer provided by an embodiment of the present application, as shown in FIG. 20 and FIG. 21, first on the substrate
- the encapsulation layer 20 is prepared on the substrate 50 to ensure that the encapsulation layer 20 completely covers the sensor unit array 10, and then the encapsulation layer 20 is thinned to expose the interconnection structure 1014 of each sensor unit 101 for subsequent operations.
- step S240 a rewiring layer is prepared on the side of the packaging layer away from the base substrate, and the rewiring layer is electrically connected to the interconnection structure.
- preparing the redistribution layer 20 may include a series of thin film deposition, electroplating, photolithography, development, and etching processes.
- the material of the redistribution layer 20 may be a metal material, such as Al, Au, Cr, Ni, Cu, Mo, Ti, Ta, Ni-Cr, W, etc. and alloys thereof.
- step S250 a circuit board is prepared on a side of the redistribution layer away from the encapsulation layer, and the circuit board is electrically connected to the redistribution layer.
- FIG. 23 is a schematic structural diagram of preparing a circuit board according to an embodiment of the present application. As shown in FIG. 23, a circuit board 40 is prepared on the side of the redistribution layer 30 away from the packaging layer 20 to realize the electrical connection between the sensor unit 101 and the circuit board 40. connection.
- the method for preparing the image sensor includes a plurality of sensor units arranged in an array, and each sensor unit generates a partial size image of the imaged object. Compared with the entire sensor chip, It can save the coverage area of the sensor chip, and can effectively reduce the total volume of the entire image sensor without affecting the imaging quality, easy to realize the miniaturization design of the image sensor, and save the preparation cost of the image sensor; at the same time, each sensor The unit includes at least one interconnection structure, the entire sensor unit array is connected to the circuit board through a rewiring layer, and the entire image sensor is packaged using a fan-out process to ensure a good packaging effect.
- the method for manufacturing the image sensor provided in the embodiment of the present application may further include peeling off the base substrate.
- FIG. 24 is a schematic structural diagram of the final image sensor obtained after peeling off the base substrate 50 provided by an embodiment of the present application.
- the base substrate 50 is set to carry the sensor chip array 10 for subsequent preparation of the redistribution layer 30 and the circuit.
- the base substrate 10 can be peeled off to ensure the thin design of the image sensor.
- the embodiment of the present application also provides an electronic device, and the electronic device may include the image sensor provided in the embodiment of the present application, which will not be repeated here.
- the electronic setting device provided in the embodiment of the present application may be a camera, a video camera, a card punch, a lens module, or other electronic devices that need to use an image sensor, and the embodiments of the present application will not list them one by one.
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Abstract
Description
Claims (14)
- 一种图像传感器,包括:传感器单元阵列,所述传感器单元阵列包括多个传感器单元,多个所述传感器单元阵列排布;每个所述传感器单元设置为生成成像物体的部分尺寸图像,且每个所述传感器单元包括至少一个互联结构;包覆所述传感器单元阵列的封装层,所述封装层暴露出每个所述传感器单元的互联结构;位于所述封装层一侧的重布线层,所述重布线层与所述互联结构电连接;位于所述重布线层远离所述封装层一侧的电路板,所述电路板与所述重布线层电连接。
- 根据权利要求1所述的图像传感器,其中,每个所述传感器单元基于成像物体的入射光线形成成像物体覆盖区域;相邻两个所述传感器单元的覆盖区域之间的距离为L,其中,L>0。
- 根据权利要求1所述的图像传感器,其中,所述传感器单元还包括:封装盖板;位于所述封装盖板一侧的传感器芯片,所述传感器芯片设置为生成成像物体的部分尺寸图像;位于所述传感器芯片感光侧一侧的至少一个光学元件,所述光学元件设置为接收所述成像物体的部分入射光线并将所述部分入射光线成像在所述传感器芯片上。
- 根据权利要求3所述的图像传感器,其中,所述光学元件位于所述封装盖板所在膜层与所述传感器芯片所在膜层之间;或者所述光学元件位于所述封装盖板远离所述传感器芯片的一侧。
- 根据权利要求3所述的图像传感器,其中,所述传感器单元还包括位于所述封装盖板至少一侧表面的涂层,所述涂层中形成有开口;所述开口在所述封装盖板所在平面上的垂直投影与所述光学元件在所述封装盖板所在平面上的垂直投影存在交叠区域。
- 根据权利要求3所述的图像传感器,其中,所述传感器单元还包括垫片,所述垫片位于所述封装盖板所在膜层与所述传感器芯片所在膜层之间。
- 根据权利要求3所述的图像传感器,其中,所述光学元件包括透镜、成像孔以及准直器中的至少一种。
- 一种图像传感器的制备方法,包括:提供一衬底基板;在所述衬底基板上形成传感器单元阵列,所述传感器单元阵列包括多个传感器单元,多个所述传感器单元阵列排布;每个所述传感器单元设置为生成成像物体的部分尺寸图像,且每个所述传感器单元包括至少一个互联结构;在所述衬底基板上制备封装层,所述封装层包覆所述传感器单元阵列,且暴露出每个所述传感器单元的互联结构;在所述封装层远离所述衬底基板的一侧制备重布线层,所述重布线层与所述互联结构电连接;在所述重布线层远离所述封装层的一侧制备电路板,所述电路板与所述重布线层电连接。
- 根据权利要求8所述的图像传感器的制备方法,其中,在所述衬底基板上制备封装层,所述封装层包覆所述传感器单元阵列,且暴露出每个所述传感器单元的互联结构,包括:在所述衬底基板上制备封装层,所述封装层包覆所述传感器单元阵列;对所述封装层进行减薄处理,暴露出每个所述传感器单元的互联结构。
- 根据权利要求8所述的图像传感器的制备方法,还包括:剥离所述衬底基板。
- 一种图像识别方法,采用权利要求1-7任一项所述的图像传感器,包括:获取传感器单元阵列生成的多个部分尺寸识别图像;基于所述多个部分尺寸识别图像,获取至少两个图像特征点的位置信息;根据所述至少两个图像特征点的位置信息,采用图像特征点识别算法,识别所述图像传感器采集的识别图像。
- 根据权利要求11所述的图像识别方法,其中,所述根据所述至少两个图像特征点的位置信息,采用图像特征点识别算法,识别所述图像传感器采集的识别图像,包括:根据所述至少两个图像特征点的位置信息,计算任意两个图像特征点之间的距离;根据所述任意两个图像特征点之间的距离,采用图像特征点识别算法,识别所述图像传感器采集的识别图像。
- 根据权利要求11所述的图像识别方法,其中,所述获取传感器单元阵列生成的多个部分尺寸识别图像之前,还包括:多次获取传感器单元阵列生成的多个部分尺寸录入图像,生成部分尺寸录入图像库;根据所述部分尺寸录入图像库,采用图像拼接算法生成完整尺寸录入图像。
- 一种电子设备,包括权利要求1-7任一项所述的图像传感器。
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