WO2020140580A1 - 一种滤波天线 - Google Patents

一种滤波天线 Download PDF

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Publication number
WO2020140580A1
WO2020140580A1 PCT/CN2019/113378 CN2019113378W WO2020140580A1 WO 2020140580 A1 WO2020140580 A1 WO 2020140580A1 CN 2019113378 W CN2019113378 W CN 2019113378W WO 2020140580 A1 WO2020140580 A1 WO 2020140580A1
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WO
WIPO (PCT)
Prior art keywords
filter
antenna
metal layer
electrically connected
resonant cavity
Prior art date
Application number
PCT/CN2019/113378
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English (en)
French (fr)
Inventor
邾志民
买剑春
Original Assignee
瑞声声学科技(深圳)有限公司
瑞声科技(南京)有限公司
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Application filed by 瑞声声学科技(深圳)有限公司, 瑞声科技(南京)有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Publication of WO2020140580A1 publication Critical patent/WO2020140580A1/zh

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04Resonant antennas
    • H01Q9/0407Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0414Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/20Frequency-selective devices, e.g. filters
    • H01P1/207Hollow waveguide filters
    • H01P1/208Cascaded cavities; Cascaded resonators inside a hollow waveguide structure
    • H01P1/2088Integrated in a substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • H01Q21/06Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061Two dimensional planar arrays
    • H01Q21/065Patch antenna array
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04Resonant antennas
    • H01Q9/0407Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/045Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular feeding means

Definitions

  • the present invention relates to the field of microwave communication, and in particular to a filter antenna device used in the field of communication electronic products.
  • the present invention proposes an integrated, miniaturized filter antenna, specifically including a radiation structure, a filter structure and a feed structure, the radiation structure is a plurality of antenna elements stacked on top of each other, the The filter structure is a plurality of resonant cavities arranged one above the other and sequentially coupled and connected.
  • the filter structure includes an input end and an output end.
  • the radiation structure and the filter structure are arranged one above the other and electrically connected to each other through the output end
  • One end of the feeding structure is electrically connected to the input end of the filtering structure, and the other end is used for external power supply.
  • the radiating structure includes a first antenna unit adjacent to the filter structure and a second antenna unit disposed at a side of the first antenna unit away from the filter structure, the first antenna unit
  • the output terminal is electrically connected to the filter structure, and the second antenna unit and the first antenna unit are coupled together.
  • both the first antenna unit and the second antenna unit are the microstrip patch antennas.
  • each of the resonant cavities of the filter structure includes metal layers disposed at intervals and metallized vias arranged around the periphery of the metal layer and electrically connected to the metal layer.
  • a coupling gap is formed on the metal layer of each resonant cavity to couple and communicate with the resonant cavity adjacent thereto.
  • the coupling gaps of the two adjacent metal layers are arranged in a staggered manner.
  • the number of the resonant cavity is four.
  • the input end of the filter structure includes a first metal probe
  • the output end of the filter structure includes a second metal probe
  • the first metal probe is electrically connected to the feed An electrical structure and the metal layer of the resonant cavity adjacent to the feeding structure that is remote from the feeding structure
  • the second metal probe electrically connects the radiating structure and the resonance adjacent to the radiating structure The metal layer of the cavity away from the radiating structure.
  • the feeding structure is a microstrip feeder.
  • the present invention achieves a corresponding filtering effect by integrating the filter and the antenna while taking good account of the performance of the antenna, effectively reducing the size through the laminated structure to achieve miniaturization, and using the multi-level SIW cavity level
  • the broadband filter performance is obtained by using a combination of antennas, and the broadband antenna radiation performance is obtained using a stacked antenna.
  • a compact broadband filter antenna is obtained, which can effectively suppress the interference of out-of-band spurious signals.
  • FIG. 1 is a schematic perspective view of the overall structure of a filter antenna device provided by the present invention.
  • FIG. 2 is a schematic exploded view of a partial structure of a filter antenna device provided by the present invention.
  • FIG. 3 is a cross-sectional view of the filter antenna device shown in FIG. 1 along line C-C;
  • FIG. 4 is a reflection coefficient diagram of a filter antenna device provided by the present invention.
  • FIG. 5 is a diagram of the overall efficiency of the filter antenna device provided by the present invention
  • 6 is a gain diagram of a filter antenna device provided by the present invention.
  • the radiation structure 2 the filter structure 3, the feed structure 11, the first antenna unit 12, the second antenna unit 21, the first resonant cavity 22, the second resonant cavity 23, the third resonant cavity 24 ,
  • the fourth resonant cavity 31 the microstrip feeder 41, the first patch layer 42, the second patch layer 44, the first metal layer 45, the second metal layer 46, the third metal layer 47, the fourth metal layer 48, Fifth metal layer 51, first dielectric substrate 52, second dielectric substrate 53, third dielectric substrate 54, fourth dielectric substrate 55, fifth dielectric substrate 56, sixth dielectric substrate 57, seventh dielectric substrate 61, first Through hole 62, second through hole 63, third through hole 64, fourth through hole 65, fifth through hole 66, sixth through hole 71, first metal probe 72, second metal probe 81, first Coupling gap 82, second coupling gap 83, third coupling gap 91, first metallization via 92, second metallization via 93, third metallization via 94, fourth metallization via A, input terminal B.
  • a filter antenna proposed in this embodiment includes a radiation structure 1, a filter structure 2, and a feeding structure 3;
  • the radiation structure 1 is a plurality of antennas stacked on top of each other Units, specifically a first antenna unit 11 and a second antenna unit 12, the first antenna unit 11 and the second antenna unit 12 are spaced apart and coupled to radiate electromagnetic wave signals outward;
  • the filter structure is stacked on top of each other and coupled in sequence A plurality of resonant cavities, specifically a first resonant cavity 21, a second resonant cavity 22, a third resonant cavity 23, and a fourth resonant cavity 24, and the four resonant cavities are sequentially coupled and connected;
  • the filter structure further includes an input terminal A and an output terminal B.
  • the radiation structure 1 and the filter structure 2 are stacked one above the other and are electrically connected through the output terminal B.
  • the feed structure 3 is electrically connected to the input terminal A of the filter structure 2 and the other end Used for external power supply.
  • both the first antenna unit 11 and the second antenna unit 12 are microstrip patch antennas, the first antenna unit 11 is adjacent to the filter structure 2, and the second antenna unit 12 is spaced apart from the first
  • the side of the antenna unit 11 away from the filter structure is specifically a first patch layer 41, a first dielectric substrate 51, a second patch layer 42, and a second dielectric substrate 52 arranged in this order from top to bottom.
  • the first patch layer 41 and the first dielectric substrate 51 together constitute the second antenna unit 12; the second patch layer 42 and the second dielectric substrate 52 together constitute the first antenna unit 11.
  • microstrip patch antenna can be selected according to the actual use, such as rectangular, circular, circular, triangular, sector, serpentine, etc.
  • a square microstrip patch antenna is used, namely The shapes of the first patch layer 41 and the second patch layer 42 are square.
  • the filter structure 2 is a SIW cavity filter, specifically a first metal layer 44, a third dielectric substrate 53, a second metal layer 45, a fourth dielectric substrate 54, a third The metal layer 46, the fifth dielectric substrate 55, the fourth metal layer 47, the sixth dielectric substrate 56 and the fifth metal layer 48; the periphery of the third dielectric substrate 53 is arranged at a plurality of intervals and is electrically connected to the first metal layer 44 And the first metalized through hole 91 of the second metal layer 45, the first metal layer 44, the third dielectric substrate 53, the second metal layer 45 and the first metalized through hole 91 together form the first resonance Cavity 21; the periphery of the fourth dielectric substrate 54 is arranged with a plurality of second metallization vias 92 spaced apart and electrically connected to the second metal layer 45 and the third metal layer 46, the second metal layer 45, the fourth dielectric substrate 54.
  • the third metal layer 46 and the second metallized through hole 92 together form the second resonant cavity 22;
  • the periphery of the fifth dielectric substrate 55 is arranged at a plurality of intervals and electrically connected to the third metal layer 46
  • the third metalized through hole 93 of the fourth metal layer 47, the third metal layer 46, the fifth dielectric substrate 55, the fourth metal layer 47 and the third metalized through hole 93 together form the third resonance Cavity 23;
  • the periphery of the sixth dielectric substrate 56 is arranged with a plurality of fourth metallization through holes 94 electrically connected to the fourth metal layer 47 and the fifth metal layer 48, the fourth metal layer 47, the sixth dielectric
  • the substrate 56, the fifth metal layer 48, and the fourth metallized via 94 collectively surround the fourth resonant cavity 24.
  • a first coupling gap 81, a second coupling gap 82, and a third coupling gap 83 are provided on the second metal layer 45, the third metal layer 46, and the fourth metal layer 47, respectively, the first resonance cavity 21 and the second resonance
  • the cavity 22 is coupled and communicated through the first coupling gap 81, the second resonant cavity 22 and the third resonant cavity 23 are connected through the second coupling gap 82, and the third resonant cavity 23 and the fourth resonant cavity 24 are connected through the third
  • the coupling gap 83 couples and communicates.
  • the shape of the coupling gap can be specifically selected according to the actual use requirements, and rectangular, circular, trapezoidal, etc. can be used.
  • the shapes of the first coupling gap 81, the second coupling gap 82, and the third coupling gap 83 may be the same or different, depending on the actual The specific selection of the use requirements, this In the embodiment, the three coupling gaps have the same shape, and all rectangular coupling gaps are selected.
  • the specific arrangement positions of the three coupling gaps with the same shape may use an overlapping arrangement mode or a non-overlapping arrangement mode, and the overlapping arrangement means that the projections of the three coupling gaps completely overlap.
  • the first coupling gap 81 and the third coupling gap 83 are arranged in an overlapping manner, and are respectively located on both sides of the second metal layer 45 and the fourth metal layer 47; the second coupling gap 82 and the first coupling gap 81, the third The three coupling gaps are arranged in a non-overlapping manner, are vertically arranged with each other, and are located on both sides of the third metal layer 46.
  • the input end A of the filtering structure 2 includes a first metal probe 71
  • the output end B includes a second metal probe 72
  • the second metal probe 72 implements the second metal layer 45 and the second
  • the electrical connection of the two patch layers 42 realizes the electrical connection of the radiation structure 1 and the filter structure 2
  • the first metal probe 71 realizes the electrical connection of the fourth metal layer 47 and the feeding structure 3.
  • the second dielectric substrate 52 has a first through hole 61
  • the first metal layer 44 has a second through hole 62
  • the third dielectric substrate 53 has a third through hole 63.
  • the second metal probe 72 Used for cooperation with the second metal probe 72, that is, the second metal probe 72 penetrates the first through hole 61, the second through hole 62, and the third through hole 63 to connect the second metal layer 45 and the first Two patch layers 42; a fourth through hole 64 is opened on the sixth dielectric substrate 56, and a fifth through hole 65 is opened on the fifth metal layer 48 for use with the first metal probe 71, That is, the first metal probe 71 penetrates the fourth through hole 64 and the fifth through hole 65 to connect the fourth metal layer 47 and the feeding structure 3.
  • the feeding structure 3 includes a microstrip feed line 31 and a seventh dielectric substrate 57, the seventh dielectric substrate 57 has a sixth through hole 66, and the microstrip feed line 31 is located on the seventh dielectric substrate Far from the bottom surface of the filter structure 3, the first metal probe 71 is electrically connected to the microstrip feed line 31 through the sixth through hole 66.
  • different feeding structures can be selected according to the usage, such as coplanar waveguides, coaxial feeders, etc., not limited to microstrip feeders.
  • the dielectric substrates in the filter structure all use LTCC materials.
  • FIG. 4 is a simulation diagram of the reflection performance of the filter antenna
  • FIG. 5 is a simulation diagram of the efficiency performance of the filter antenna
  • 6 is a simulation diagram of the filter antenna gain performance.
  • the filter antenna proposed by the present invention has an antenna return loss of less than 10dB (reflection coefficient of less than -10dB), an out-of-band suppression of more than 20dB, and a maximum gain fluctuation of less than 0.6dB in the 25.66-29.6GHz frequency band. , Effectively suppress the interference of out-of-band spurious signals, and effectively improve the antenna performance.
  • the filter antenna proposed by the present invention improves the performance of the antenna while realizing the antenna Miniaturized design.

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  • Computer Networks & Wireless Communication (AREA)
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Abstract

一种滤波天线,其特征在于,包括辐射结构、滤波结构和馈电结构,所述辐射结构为上下层叠设置多个天线单元,所述滤波结构为上下层叠设置且依次耦合连通的多个谐振腔,所述滤波结构包括一输入端和一输出端,所述辐射结构与所述滤波结构上下层叠设置且通过所述输出端互相电连接,所述馈电结构一端与所述滤波结构的所述输入端电连接,另一端用于外接电源。本发明通过叠层结构有效的减小体积实现小型化,利用多级SIW 腔级联获得宽带的滤波性能,能够在宽带频率范围内有效的抑制带外杂散信号的干扰。

Description

种滤波天线 技术领域
[0001] 本发明涉及微波通信领域, 尤其涉及一种运用在通讯电子产品领域的滤波天线 器件。
背景技术
[0002] 随着 5G作为全球业界的研发焦点, 发展 5G技术制定 5G标准已经成为业界共识 。 毫米波独有的高载频、 大带宽特性是实现 5G超高数据传输速率的主要手段。 毫米波频段丰富的带宽资源为高速传输速率提供了保障, 但是由于该频段电磁 波剧烈的空间损耗, 利用毫米波频段的无线通信***需要采用相控阵的架构。 通过移相器使得各个阵元的相位按一定规律分布, 从而形成高增益波束, 并且 通过相移的改变使得波束在一定空间范围内扫描。 天线与滤波器作为射频前端 ***中不可缺少的部件, 在兼顾天线性能的同时, 必然向着集成化、 小型化的 方向发展, 如何在保证天线性能的同时解决小型化的结构设计, 是目前天线技 术研发中面临的难题。
发明概述
技术问题
问题的解决方案
技术解决方案
[0003] 为了解决上述问题, 本发明提出了一种集成化、 小型化的滤波天线, 具体包括 辐射结构、 滤波结构和馈电结构, 所述辐射结构为上下层叠设置多个天线单元 , 所述滤波结构为上下层叠设置且依次耦合连通的多个谐振腔, 所述滤波结构 包括一输入端和一输出端, 所述辐射结构与所述滤波结构上下层叠设置且通过 所述输出端互相电连接, 所述馈电结构一端与所述滤波结构的所述输入端电连 接, 另一端用于外接电源。
[0004] 进一步的, 所述辐射结构包括邻近所述滤波结构的第一天线单元和间隔设置于 所述第一天线单元远离所述滤波结构一侧的第二天线单元, 所述第一天线单元 通过所述输出端与所述滤波结构电连接, 所述第二天线单元与所述第一天线单 元稱合。
[0005] 进一步的, 第一天线单元和所述第二天线单元均为所述微带贴片天线。
[0006] 进一步的, 所述滤波结构的每个所述谐振腔包括间隔设置的金属层和排布于所 述金属层周缘且电连接所述金属层的金属化通孔。
[0007] 进一步的, 每个所述谐振腔的所述金属层上开设有耦合间隙以耦合连通与之相 邻的所述谐振腔。
[0008] 进一步的, 相邻两金属层的耦合间隙错位排布。
[0009] 进一步的, 所述谐振腔的数量为 4个。
[0010] 进一步的, 所述滤波结构的所述输入端包括第一金属探针, 所述滤波结构的所 述输出端包括第二金属探针, 所述第一金属探针电连接所述馈电结构和邻近所 述馈电结构的所述谐振腔的远离所述馈电结构的所述金属层, 所述第二金属探 针电连接所述辐射结构和邻近所述辐射结构的所述谐振腔的远离所述辐射结构 的所述金属层。
[0011] 进一步的, 所述馈电结构为微带馈线。
发明的有益效果
有益效果
[0012] 本发明通过将滤波器与天线集成在一起, 在很好地兼顾了天线性能的同时实现 相应的滤波效果, 通过叠层结构有效的减小体积实现小型化, 利用多级 SIW腔 级联获得宽带的滤波性能, 使用叠层天线获得宽带的的天线辐射性能, 最终获 得了一款紧凑的宽带的滤波天线, 能够有效的抑制带外杂散信号的干扰。
对附图的简要说明
附图说明
[0013] 图 1为本发明提供的滤波天线器件的整体结构的立体结构示意图;
[0014] 图 2为本发明提供的滤波天线器件的部分结构的分解结构示意图;
[0015] 图 3为图 1所示的滤波天线器件沿 C-C线的剖视图;
[0016] 图 4为本发明提供的滤波天线器件的反射系数图;
[0017] 图 5为本发明提供的滤波天线器件的总效率图; [0018] 图 6为本发明提供的滤波天线器件的增益图。
[0019] 图中, 1、 辐射结构 2、 滤波结构 3、 馈电结构 11、 第一天线单元 12、 第二天线 单元 21、 第一谐振腔 22、 第二谐振腔 23、 第三谐振腔 24、 第四谐振腔 31、 微带 馈线 41、 第一贴片层 42、 第二贴片层 44、 第一金属层 45、 第二金属层 46、 第三 金属层 47、 第四金属层 48、 第五金属层 51、 第一介质基板 52、 第二介质基板 53 、 第三介质基板 54、 第四介质基板 55、 第五介质基板 56、 第六介质基板 57、 第 七介质基板 61、 第一通孔 62、 第二通孔 63、 第三通孔 64、 第四通孔 65、 第五通 孔 66、 第六通孔 71、 第一金属探针 72、 第二金属探针 81、 第一耦合间隙 82、 第 二耦合间隙 83、 第三耦合间隙 91、 第一金属化通孔 92、 第二金属化通孔 93、 第 三金属化通孔 94、 第四金属化通孔 A、 输入端 B、 输出端。
发明实施例
具体实施方式
[0020] 下面通过具体实施方式结合图 1至图 6对本发明作进一步详细说明, 以便能够更 好地理解本发明的内容以及其各方面的优点。 在以下的实施例中, 提供以下具 体实施方式的目的是便于对本发明的内容更清楚透彻的理解, 而不是对本发明 的限制。
[0021] 实施例 1
[0022] 如图 1至图 3所示, 本实施例中提出的一种滤波天线, 包括辐射结构 1、 滤波结 构 2和馈电结构 3 ; 所述辐射结构 1为上下层叠设置的多个天线单元, 具体为第一 天线单元 11和第二天线单元 12, 第一天线单元 11和第二天线单元 12间隔且耦合 , 向外辐射电磁波信号; 所述滤波结构为上下层叠设置且依次耦合连通的多个 谐振腔, 具体为第一谐振腔 21、 第二谐振腔 22、 第三谐振腔 23和第四谐振腔 24 , 四个谐振腔之间依次耦合连接; 所述滤波结构还包括一输入端 A和一输出端 B , 辐射结构 1与滤波结构 2上下层叠设置且通过所述输出端 B电连接, 所述馈电结 构 3—端与滤波结构 2的所述输入端 A电连接, 另一端用于外接电源。
[0023] 需要说明的是, 文中的“上下层叠设置”是指本发明的附图 1中的位置关系, 若 所述滤波天线的摆放状态发生改变, 则多个天线单元之间、 多个谐振腔、 辐射 结构与滤波结构之间就不再是上下层叠设置。 [0024] 第一天线单元 11与第二天线单元 12均为微带贴片天线, 所述第一天线单元 11邻 近所述滤波结构 2, 所述第二天线单元 12间隔设置于所述第一天线单元 11远离所 述滤波结构的一侧, 具体为自上而下依次排列的第一贴片层 41、 第一介质基板 5 1、 第二贴片层 42、 第二介质基板 52。 第一贴片层 41、 第一介质基板 51共同组成 第二天线单元 12; 第二贴片层 42、 第二介质基板 52共同组成第一天线单元 11。
[0025] 微带贴片天线的具体结构可根据实际使用情况选择, 例如使用矩形、 圆形、 圆 环、 三角形、 扇形、 蛇形等, 本实施例中, 使用正方形微带贴片天线, 即第一 贴片层 41、 第二贴片层 42的形状为正方形。
[0026] 所述滤波结构 2为 SIW腔体滤波器, 具体为自上而下依次排列的第一金属层 44 、 第三介质基板 53、 第二金属层 45、 第四介质基板 54、 第三金属层 46、 第五介 质基板 55、 第四金属层 47、 第六介质基板 56和第五金属层 48 ; 第三介质基板 53 的周缘排布有多个间隔设置且电连接第一金属层 44和第二金属层 45的第一金属 化通孔 91, 第一金属层 44、 第三介质基板 53、 第二金属层 45及所述第一金属化 通孔 91共同围成所述第一谐振腔 21 ; 第四介质基板 54的周缘排布有多个间隔设 置且电连接第二金属层 45和第三金属层 46的第二金属化通孔 92, 第二金属层 45 、 第四介质基板 54、 第三金属层 46及所述第二金属化通孔 92共同围成所述第二 谐振腔 22; 第五介质基板 55的周缘排布有多个间隔设置且电连接第三金属层 46 和第四金属层 47的第三金属化通孔 93, 第三金属层 46、 第五介质基板 55、 第四 金属层 47及所述第三金属化通孔 93共同围成所述第三谐振腔 23 ; 第六介质基板 5 6的周缘排布有多个间隔设置且电连接第四金属层 47和第五金属层 48的第四金属 化通孔 94, 第四金属层 47、 第六介质基板 56、 第五金属层 48及所述第四金属化 通孔 94共同围成所述第四谐振腔 24。 第二金属层 45、 第三金属层 46、 第四金属 层 47上分别设有第一耦合间隙 81、 第二耦合间隙 82和第三耦合间隙 83 , 所述第 一谐振腔 21与第二谐振腔 22通过第一耦合间隙 81耦合连通, 所述第二谐振腔 22 与第三谐振腔 23通过第二耦合间隙 82稱合连通, 所述第三谐振腔 23与第四谐振 腔 24通过第三耦合间隙 83耦合连通。 耦合间隙的形状可根据实际使用需求具体 选择, 可使用矩形、 圆形、 梯形等, 第一耦合间隙 81、 第二耦合间隙 82和第三 耦合间隙 83的形状可以相同也可以不同, 可根据实际的使用需求具体选择, 本 实施例中, 三个耦合间隙的形状相同, 均选取矩形耦合间隙。
[0027] 三个形状相同的耦合间隙的具体排列位置可以使用重叠排列方式或非重叠排列 方式, 所述重叠排列即三个耦合间隙的投影完全重合。 本实施例中, 第一耦合 间隙 81和第三耦合间隙 83重叠排列, 且分别位于第二金属层 45、 第四金属层 47 的两侧; 第二耦合间隙 82与第一耦合间隙 81、 第三耦合间隙非重叠排列、 互为 垂直排列关系, 且位于第三金属层 46的两侧。
[0028] 本实施例中, 所述滤波结构 2的输入端 A包括第一金属探针 71, 输出端 B包括第 二金属探针 72, 第二金属探针 72实现第二金属层 45与第二贴片层 42的电连接, 实现辐射结构 1和滤波结构 2的电连接; 第一金属探针 71实现第四金属层 47与馈 电结构 3电连接。
[0029] 本实施例中, 所述第二介质基板 52上开有第一通孔 61, 第一金属层 44上开有第 二通孔 62, 第三介质基板 53上开设有第三通孔 63 , 用于与第二金属探针 72配合 使用, 即所述第二金属探针 72贯穿第一通孔 61、 第二通孔 62和第三通孔 63以连 接第二金属层 45与第二贴片层 42; 所述第六介质基板 56上开有第四通孔 64、 所 述第五金属层 48上开有第五通孔 65 , 用于与第一金属探针 71配合使用, 即第一 金属探针 71贯穿第四通孔 64和第五通孔 65以连接第四金属层 47与馈电结构 3。
[0030] 本实施例中, 所述馈电结构 3包括微带馈线 31和第七介质基板 57, 所述第七介 质基板 57上具有第六通孔 66, 微带馈线 31位于第七介质基板远离滤波结构 3的底 面, 第一金属探针 71穿过第六通孔 66与微带馈线 31电连接。 实际使用中, 可根 据使用情况选择不同的馈电结构, 如共面波导、 同轴馈线等, 不局限于微带馈 线。
[0031] 此外, 本实施例中, 滤波结构中的介质基板均使用 LTCC材料。
[0032] 如图 4、 图 5、 图 6所示, 为本发明所提出的的滤波天线的性能仿真图, 图 4为滤 波天线反射性能仿真图、 图 5为滤波天线效率性能仿真图、 图 6为滤波天线增益 性能仿真图。 可以看出, 本发明所提出的滤波天线, 在 25.66-29.6GHz频带范围 内, 天线回波损耗小于 10dB (反射系数小于 -10dB) , 带外抑制在 20dB以上, 带 内最大增益波动小于 0.6dB, 有效抑制了带外杂散信号的干扰, 有效提高了天线 性能。 综上所述, 本发明所提出的滤波天线在提高天线性能的同时实现了天线 的小型化设计。
[0033] 以上所述的仅是本发明的实施方式, 在此应当指出, 对于本领域的普通技术人 员来说, 在不脱离本发明创造构思的前提下, 所做出的变形和改变均属于本发 明的保护范围。

Claims

权利要求书
[权利要求 1] 一种滤波天线, 其特征在于, 包括辐射结构、 滤波结构和馈电结构, 所述辐射结构为上下层叠设置多个天线单元, 所述滤波结构为上下层 叠设置且依次耦合连通的多个谐振腔, 所述滤波结构包括一输入端和 一输出端, 所述辐射结构与所述滤波结构上下层叠设置且通过所述输 出端互相电连接, 所述馈电结构一端与所述滤波结构的所述输入端电 连接, 另一端用于外接电源。
[权利要求 2] 根据权利要求 1所述的一种滤波天线, 其特征在于, 所述辐射结构包 括邻近所述滤波结构的第一天线单元和间隔设置于所述第一天线单元 远离所述滤波结构一侧的第二天线单元, 所述第一天线单元通过所述 输出端与所述滤波结构电连接, 所述第二天线单元与所述第一天线单 元稱合。
[权利要求 3] 根据权利要求 2所述的一种滤波天线, 其特征在于, 第一天线单元和 所述第二天线单元均为所述微带贴片天线。
[权利要求 4] 根据权利要求 1所述的一种滤波天线, 其特征在于, 所述滤波结构的 每个所述谐振腔包括间隔设置的金属层和排布于所述金属层周缘且电 连接所述金属层的金属化通孔。
[权利要求 5] 根据权利要求 4所述的一种滤波天线, 其特征在于, 每个所述谐振腔 的所述金属层上开设有耦合间隙以耦合连通与之相邻的所述谐振腔。
[权利要求 6] 根据权利要求 5所述的一种滤波天线, 其特征在于, 相邻两金属层的 耦合间隙错位排布。
[权利要求 7] 根据权利要求 1所述的一种滤波天线, 其特征在于, 所述谐振腔的数 量为 4个。
[权利要求 8] 根据权利要求 4所述的一种滤波天线, 其特征在于, 所述滤波结构的 所述输入端包括第一金属探针, 所述滤波结构的所述输出端包括第二 金属探针, 所述第一金属探针电连接所述馈电结构和邻近所述馈电结 构的所述谐振腔的远离所述馈电结构的所述金属层, 所述第二金属探 针电连接所述辐射结构和邻近所述辐射结构的所述谐振腔的远离所述 辐射结构的所述金属层。
[权利要求 9] 根据权利要求 1所述的一种滤波天线, 其特征在于, 所述馈电结构为 微带馈线。
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