WO2020108143A1 - 一种阵列基板、显示面板及显示装置 - Google Patents

一种阵列基板、显示面板及显示装置 Download PDF

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Publication number
WO2020108143A1
WO2020108143A1 PCT/CN2019/111505 CN2019111505W WO2020108143A1 WO 2020108143 A1 WO2020108143 A1 WO 2020108143A1 CN 2019111505 W CN2019111505 W CN 2019111505W WO 2020108143 A1 WO2020108143 A1 WO 2020108143A1
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Prior art keywords
repair
sub
line
array substrate
lines
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PCT/CN2019/111505
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English (en)
French (fr)
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龙春平
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京东方科技集团股份有限公司
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Priority to US16/759,016 priority Critical patent/US11764227B2/en
Publication of WO2020108143A1 publication Critical patent/WO2020108143A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136259—Repairing; Defects
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306—Details
    • G02F1/1309—Repairing; Testing
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133388—Constructional arrangements; Manufacturing methods with constructional differences between the display region and the peripheral region
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136259—Repairing; Defects
    • G02F1/136263—Line defects
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136259—Repairing; Defects
    • G02F1/136272—Auxiliary lines
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136286—Wiring, e.g. gate line, drain line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
    • H01L21/76892—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern
    • H01L21/76894—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern using a laser, e.g. laser cutting, laser direct writing, laser repair
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits

Definitions

  • the present application relates to the field of display technology, in particular to an array substrate, a display panel and a display device.
  • Thin film transistor liquid crystal display (Thin Film Transistor Liquid Crystal, TFT-LCD) has the advantages of small size, low power consumption, no radiation, etc., occupying a dominant position in the current flat panel display market, widely used in desktop computers, notebook computers, Personal digital assistants, mobile phones, televisions, monitors and other fields.
  • TFT-LCD Thin film transistor liquid crystal display
  • the structure of the array substrate and its manufacturing process determine the product performance, yield and price of TFT-LCD.
  • the array stage of the array substrate due to various reasons (such as over-etching, or the presence of foreign objects (Particle), etc.), will cause the data lines on the array substrate (Data) Line and/or Gate Line (Gate Line) is broken (ie, Open is bad).
  • the cell (Cut) process may also scratch the panel edge (Lead) area, resulting in a defective Open in the Lead part of the Data Line or Gate Line.
  • Embodiments of the present application provide an array substrate, a display panel, and a display device, which are used to solve the problem of defective Open in the Lead part of the Data or Line in the prior art.
  • an embodiment of the present application provides an array substrate including a base substrate, the base substrate having a display area and a non-display area surrounding the display area, the display area including a plurality of strips extending in a first direction Signal line
  • the non-display area includes at least three repair leads, and solder terminals connected to each of the repair leads in one-to-one correspondence, and each of the signal lines intersects at least one orthographic projection of the repair leads on the base substrate Stacked area.
  • each of the repair leads includes a portion that extends along a second direction, and the second direction and the first direction are intersected;
  • the overlapping area is present in the orthographic projection of the portion of the signal line and the repair lead extending in the second direction on the base substrate.
  • each of the repair leads includes one first sub-repair line and multiple second sub-repair lines;
  • the first sub-repair line is connected to the solder terminal, and each of the second sub-repair line and the first sub-repair line are orthogonal to each other on the base substrate Overlapping regions, and each of the second sub-repair lines includes a portion extending in the second direction;
  • the signal lines are divided into multiple groups; each group of the signal lines is insulated and overlapped with at least one portion of the second sub-repair line extending in the second direction.
  • the second sub-repair line and the first sub-repair line of at least one other repair lead on the base substrate Orthographic projections have overlapping areas.
  • an orthographic projection of the second sub-repair line and the first sub-repair line of all the repair leads on the base substrate There are overlapping areas.
  • At least one group of the signal lines is insulated and overlapped with at least two of the second sub-repair lines.
  • the second sub-repair lines insulated and overlapped with the same group of the signal lines belong to the same repair lead; or, the same The second sub-repair lines insulated and overlapped by the signal lines belong to different repair leads.
  • the overlapping area between the first sub-repair line and the second sub-repair line is electrically connected or insulated and overlapped.
  • the overlapping area between the first sub-repair line and the second sub-repair line when the overlapping area between the first sub-repair line and the second sub-repair line is electrically connected, the The first sub-repair line and the second sub-repair line are located in the same film layer;
  • the first sub-repair line and the second sub-repair line are located in different layers.
  • the solder terminal and the first sub-repair line are located in the same film layer, and the second sub-repair line and the signal line Located on different layers.
  • the number of the signal lines in each group is the same.
  • the signal line includes a gate line or a data line.
  • an embodiment of the present application also provides a display panel, including any of the above array substrates provided by the embodiment of the present application.
  • an embodiment of the present application further provides a display device, including the above-mentioned display panel provided by the embodiment of the present application.
  • FIG. 1 is a schematic structural diagram of an array substrate provided by an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of an array substrate provided by another embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of an array substrate provided by another embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of an array substrate provided by another embodiment of the present application.
  • the array substrate provided by the embodiment of the present application includes a base substrate 1 having a display area and a non-display area surrounding the display area.
  • FIGS. 1 to 4 only illustrate Part of the display area and part of the non-display area, the display area includes a plurality of signal lines 2 extending along the first direction Y;
  • the non-display area includes at least three repair leads 3, and solder terminals 4 corresponding to each repair lead 3 in one-to-one correspondence.
  • Each signal line 2 and at least one repair lead 3 have an overlapping area C in an orthographic projection on the base substrate 1.
  • the array substrate provided by the embodiment of the present application includes a base substrate, the base substrate has a display area and a non-display area, and the display area includes a plurality of signal lines; the non-display area includes at least three repair leads, and each repair lead is connected in a one-to-one correspondence For the solder terminal, there is an overlap area between each signal line and the orthographic projection of at least one repair lead on the base substrate.
  • the repair lead is provided with an overlapping area with the orthographic projection of the signal line on the base substrate.
  • the repair lead When the signal line is broken, the repair lead is melted by the laser to connect the broken signal line without affecting the display panel Normal display, thereby realizing the repair function of the signal line; and by setting at least three repair leads in this application, the number of repaired signal lines can be increased, which is beneficial to improve the display yield.
  • each repair lead 3 includes a portion extending along a second direction X, and the second direction X and the first direction Y are intersected; specifically, the signal line 2 There is an overlapping area with the orthographic projection of the portion of the repair lead 3 extending in the second direction X on the base substrate 1.
  • overlapping the signal line 2 with the repair lead 3 extending along the second direction X is beneficial to shorten the length of the repair lead 3, reduce the area of the repair lead 3, and improve repair
  • the spacing between the leads 3 reduces the probability of a short circuit, which can greatly facilitate the repair of the arrangement of the leads 3.
  • first direction Y and the second direction X may be perpendicular, as shown in FIGS. 1 to 4, the first direction Y is perpendicular to an edge of the base substrate 1, and the second direction X is parallel to the edge;
  • the signal line 2 is perpendicular to an edge of the base substrate 1 and overlaps with the portion of the repair lead 3 parallel to the edge.
  • the non-display areas in FIGS. 1 to 4 are all schematically illustrated by including two repair leads 3 partially extending along the second direction X, but
  • the non-display area of the array substrate provided in the embodiments of the present application includes at least three repair leads 3 partially extending along the second direction X, and the structures of the other repair leads 3 and the relationship with the signal line 2 are both
  • the structure of the two repair leads 3 shown in FIGS. 1 to 4 is the same, and will not be repeated here.
  • the signal lines 2 are divided into multiple groups of signal lines;
  • Each repair lead 3 includes one first sub-repair line 31 and multiple second sub-repair lines 32;
  • each repair lead 3 the first sub-repair line 31 and the solder terminal 4 are connected in a one-to-one correspondence, and the orthographic projection of the first sub-repair line 31 and each second sub-repair line 32 on the base substrate 1 has an overlapping area D ;
  • Each group of signal lines 2 is insulated and overlapped with at least one second sub-repair line 32.
  • each group includes 4 signal lines as an example for illustration.
  • you can use All signal lines on the array substrate are divided into multiple groups, and the number of each group is set according to actual needs. Specifically, as shown in FIGS.
  • each group of signal lines 2 is insulated and overlapped with only one second sub-repair line 32, so that when a certain group of signal lines 2 breaks, the laser can be used to communicate with the group of signals
  • the second sub-repair line 32 overlapped by the line 2 melts to connect the disconnected signal line 2 to realize the repair function of the signal line 2; since the signal line 2 and the second sub-repair line 32 are insulated and overlapped, the signal When the line 2 is normal, the insulated second sub-repair line 32 will not affect the normal display function of the display panel. As shown in FIG.
  • each group of signal lines 2 is insulated and overlapped with a plurality of second sub-repair lines 32, so that when there are many locations where the signal line 2 is disconnected, the plurality of second sub-repair lines 32 can be melted by laser while When multiple locations are repaired, or when one position of the signal line 2 is broken, a plurality of second sub-repair lines 32 can be used to repair a broken position of the signal line 2, which can improve the repair yield of the signal line 2.
  • the array substrate provided in the embodiment of the present application may include 8 repair leads, each repair lead includes 15 second repair lines, and each second repair line overlaps 48 data lines, so that it can correspond to Data line repair guarantee for FHD1920 series products.
  • the insulation overlap means that the signal line and the second sub-repair line are not electrically connected, but are overlapped by providing an insulation layer between the signal line and the second sub-repair line, that is, only overlap No contact; only when the signal line repair is required, the laser is used to melt the insulation lap part to achieve the electrical connection. When the signal line repair is not required, the insulation lap does not affect the normal display function.
  • the second sub-repair line 32 and the first sub-repair line 31 of at least one other repair lead 3 are on the base substrate
  • the orthographic projection on 1 has an overlapping area D, and'the other at least one repair lead' refers to the repair lead except the repair lead to which the second sub-repair line belongs.
  • the second sub-repair line 32 only overlaps with the orthographic projection of the first sub-repair line 31 of one repair lead 3 on the base substrate 1, so that a disconnection occurs in the signal line 2
  • the overlapping area D of the second sub-repair line 32 and the first sub-repair line 31 and the overlapping area C of the second sub-repair line 32 and the signal line are fused by laser to connect the signal line 2 where the disconnection occurs, to achieve The repair function of the signal line 2; as shown in FIG.
  • the orthographic projections of the second sub-repair line 32 and the first sub-repair line 31 of the plurality of repair leads 3 on the base substrate 1 all have overlapping areas D, so that When the signal line 2 is broken, multiple first sub-repair lines 31 can be used to repair the broken signal line 2 at the same time, which can improve the repair yield of the signal line 2; of course, as shown in FIG. There may be an overlap region D between the second sub-repair line 32 and the first sub-repair line 31 of the plurality of repair leads 3 on the base substrate 1, and part of the second sub-repair line 32 only has one repair lead 3
  • the orthographic projection of the first sub-repair line 31 on the base substrate 1 has an overlapping area D, which is not limited herein.
  • an orthographic projection of the second sub-repair line 32 and the first sub-repair line 31 of all the repair leads 3 on the base substrate 1 There are overlapping regions D, so that when the signal line 2 is broken, all the first sub-repair lines 31 can be used to repair the broken signal line 2 at the same time, which can greatly improve the repair yield of the signal line 2.
  • At least one group of signal lines 2 is insulated and overlapped with at least two second sub-repair lines 32.
  • at least two second sub-repair lines 32 can be used to repair the signal lines of the same group, thereby further improving the repair yield of the signal line 2.
  • the second sub-repair line 32 insulated and overlapped with the same group of signal lines 2 may belong to the same repair lead 3;
  • the second sub-repair line 32 insulated and overlapped by the group signal line 2 may also belong to different repair leads 3.
  • the second sub-repair lines 32 insulated and overlapped with the same set of signal lines 2 all belong to the same repair lead 3; in the right three sets of signal lines 2,
  • the second sub-repair lines 32 insulated and overlapped with the same group of signal lines 2 belong to different repair leads 3.
  • the top second sub-repair line 32 belongs to the same repair Lead 3, the following three second sub-repair lines 32 belong to different repair leads 3.
  • the second sub-repair lines 32 insulated and overlapped with the same group of signal lines 2 at least part of the second sub-repair lines 32 may be There is an overlapping area D with the orthographic projection of the first sub-repair line 31 of the at least one other repair lead 3 on the base substrate 1, and the'at least one other repair lead' refers to the repair lead except the second sub-repair line Repair leads outside.
  • all the second sub-repair lines 32 insulated from the same group of signal lines 2 and the first sub-repair lines 31 of at least one other repair lead 3 are present in the orthographic projection on the base substrate 1 Overlapping area D.
  • the overlapping area D between the first sub-repair line 31 and the second sub-repair line 32 may be electrically connected or Use insulation lap.
  • the first sub-repair line 31 and the second sub-repair line 32 when the overlapping area D between the first sub-repair line 31 and the second sub-repair line 32 is electrically connected , The first sub-repair line 31 and the second sub-repair line 32 can be located in the same film layer; in this way, the first sub-repair line 31 and the second sub-repair line 32 can be prepared by one patterning process; When the overlapping area D between the two sub-repair lines 32 is insulated and overlapped, the first sub-repair line 31 and the second sub-repair line 32 may be located in different layers.
  • the solder terminal 4 and the first sub-repair line 31 are located in the same film layer, so that the solder terminal 4 can be prepared by a patterning process
  • the first sub-repair line 31; the second sub-repair line 32 and the signal line 2 are located in different layers, specifically, an insulating layer is provided between the second sub-repair line 32 and the signal line 2.
  • the number of signal lines 2 in each group is the same.
  • the number of signal lines 2 in each group may also be different, which is not limited herein.
  • the signal lines may include gate lines or data lines.
  • the data line is used as an example for description.
  • the gate line may also be used.
  • the repair principle of the gate line is the same as that of the data line, and details are not described herein.
  • embodiments of the present application further provide a display panel, including any of the above-mentioned array substrates provided by the embodiments of the present application.
  • the principle of the display panel to solve the problem is similar to that of the aforementioned array substrate, so the implementation of the display panel can refer to the implementation of the aforementioned array substrate, and the repetitive points will not be repeated here.
  • an embodiment of the present application further provides a display device, including the above-mentioned display panel provided by the embodiment of the present application.
  • the principle of the display device to solve the problem is similar to that of the foregoing display panel, so the implementation of the display device can refer to the implementation of the foregoing display panel, and the repetitive points will not be repeated here.
  • the array substrate includes a base substrate, the base substrate has a display area and a non-display area surrounding the display area, and the display area includes a plurality of signals extending in the first direction
  • the non-display area includes at least three repair leads, and solder terminals connected to each repair lead in a one-to-one correspondence.
  • Each signal line and at least one repair lead have an overlapped area on the front projection of the base substrate.
  • the repair lead is provided with an overlapping area with the orthographic projection of the signal line on the base substrate.
  • the repair lead When the signal line is broken, the repair lead is melted by the laser to connect the broken signal line without affecting the display panel Normal display, thereby realizing the repair function of the signal line; and by setting at least three repair leads in this application, the number of repaired signal lines can be increased, which is beneficial to improve the display yield.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Liquid Crystal (AREA)

Abstract

一种阵列基板、显示面板及显示装置，阵列基板包括衬底基板(1)，衬底基板(1)具有显示区域和包围显示区域的非显示区域，显示区域包括沿第一方向(Y)延伸的多条信号线(2)；非显示区域包括至少三条修复引线(3)，以及与各修复引线(3)一一对应相连的焊接端子(4)，各信号线(2)与至少一条修复引线(3)在衬底基板(1)上的正投影存在交叠区域(C)。通过设置与信号线(2)在衬底基板(1)上的正投影存在交叠区域(C)的修复引线(3)，在信号线(2)出现断路时，利用激光将修复引线(3)熔融，使发生断路的信号线(2)连通，不会影响显示面板正常显示，由此实现信号线(2)的修复功能；并且通过设置至少三条修复引线(3)，能够提高修复信号线(2)的数量，有利于提高显示良率。

Description

一种阵列基板、显示面板及显示装置
相关申请的交叉引用
本申请要求在2018年11月28日提交中国专利局、申请号为201821979286.2、申请名称为“一种阵列基板、显示面板及显示装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及显示技术领域，特别涉及一种阵列基板、显示面板及显示装置。
背景技术
薄膜晶体管液晶显示器(Thin Film Transistor Liquid Crystal Display，TFT-LCD)具有体积小、功耗低、无辐射等优点，在当前的平板显示器市场中占据了主导地位，广泛应用于台式电脑、笔记本电脑、个人数字助理、手机、电视、监视器等领域。对于TFT-LCD来说，阵列基板的结构及其制造工艺决定了TFT-LCD的产品性能、成品率和价格。
在TFT-LCD的显示面板(Panel)的生产中，阵列基板的阵列(Array)工艺阶段由于各种原因(如过刻，或者存在异物(Particle)等原因)，会使阵列基板上的数据线(Data Line)和/或栅极线(Gate Line)出现断路(即Open不良)。阵列基板成盒后切割(Cell Cut)工艺也可能会对Panel边缘(Lead)区域划伤，从而造成Data Line或Gate Line的Lead部分出现Open不良。
因此，本领域技术人员亟需提出一种能够有效解决Data Line或Gate Line的Lead部分出现Open不良的问题的方案。
发明内容
本申请实施例提供一种阵列基板、显示面板及显示装置，用以解决现有 技术中Data Line或Gate Line的Lead部分出现Open不良的问题。
因此，本申请实施例提供了一种阵列基板，包括衬底基板，所述衬底基板具有显示区域和包围所述显示区域的非显示区域，所述显示区域包括沿第一方向延伸的多条信号线；
所述非显示区域包括至少三条修复引线，以及与各所述修复引线一一对应相连的焊接端子，各所述信号线与至少一条所述修复引线在所述衬底基板上的正投影存在交叠区域。
可选地，在具体实施时，各所述修复引线包括沿第二方向延伸的部分，所述第二方向和所述第一方向交叉设置；
所述信号线与所述修复引线的沿第二方向延伸的部分在所述衬底基板上的正投影存在所述交叠区域。
可选地，在具体实施时，每一所述修复引线包括一条第一子修复线和多条第二子修复线；
每一所述修复引线中，所述第一子修复线与所述焊接端子相连，各所述第二子修复线与所述第一子修复线在所述衬底基板上的正投影存在交叠区域，且各所述第二子修复线包括沿第二方向延伸的部分；
在本申请实施例提供的上述阵列基板中，所述信号线分为多组；各组所述信号线与至少一条所述第二子修复线的沿第二方向延伸的部分绝缘搭接。
可选地，在具体实施时，在本申请实施例提供的上述阵列基板中，所述第二子修复线与其它至少一条所述修复引线的第一子修复线在所述衬底基板上的正投影存在交叠区域。
可选地，在具体实施时，在本申请实施例提供的上述阵列基板中，所述第二子修复线与全部所述修复引线的第一子修复线在所述衬底基板上的正投影均存在交叠区域。
可选地，在具体实施时，在本申请实施例提供的上述阵列基板中，至少一组所述信号线与至少两条所述第二子修复线绝缘搭接。
可选地，在具体实施时，在本申请实施例提供的上述阵列基板中，与同 一组所述信号线绝缘搭接的所述第二子修复线属于同一所述修复引线；或者，与同一组所述信号线绝缘搭接的所述第二子修复线属于不同所述修复引线。
可选地，在具体实施时，在本申请实施例提供的上述阵列基板中，所述第一子修复线与所述第二子修复线之间的交叠区域采用电连接或采用绝缘搭接。
可选地，在具体实施时，在本申请实施例提供的上述阵列基板中，在所述第一子修复线与所述第二子修复线之间的交叠区域采用电连接时，所述第一子修复线与所述第二子修复线位于同一膜层；
在所述第一子修复线与所述第二子修复线之间的交叠区域采用绝缘搭接时，所述第一子修复线与所述第二子修复线位于不同膜层。
可选地，在具体实施时，在本申请实施例提供的上述阵列基板中，所述焊接端子和所述第一子修复线位于同一膜层，所述第二子修复线和所述信号线位于不同膜层。
可选地，在具体实施时，在本申请实施例提供的上述阵列基板中，每组所述信号线的数量相同。
可选地，在具体实施时，在本申请实施例提供的上述阵列基板中，所述信号线包括栅线或数据线。
相应地，本申请实施例还提供了一种显示面板，包括本申请实施例提供的上述任一阵列基板。
相应地，本申请实施例还提供了一种显示装置，包括本申请实施例提供的上述显示面板。
附图说明
图1为本申请实施例提供的一种阵列基板的结构示意图；
图2为本申请另一实施例提供的一种阵列基板的结构示意图；
图3为本申请另一实施例提供的一种阵列基板的结构示意图；
图4为本申请另一实施例提供的一种阵列基板的结构示意图。
具体实施方式
为了使本申请的目的，技术方案和优点更加清楚，下面结合附图，对本申请实施例提供的阵列基板、显示面板及显示装置的具体实施方式进行详细地说明。
附图中各层薄膜厚度和形状不反映阵列基板的真实比例，目的只是示意说明本申请内容。
本申请实施例提供的阵列基板，如图1至图4所示，包括衬底基板1，衬底基板1具有显示区域和包围显示区域的非显示区域，图1至图4中仅示意出了部分显示区域和部分非显示区域，显示区域包括沿第一方向Y延伸的多条信号线2；
非显示区域包括至少三条修复引线3，以及与各修复引线3一一对应相连的焊接端子4，各信号线2与至少一条修复引线3在衬底基板1上的正投影存在交叠区域C。
本申请实施例提供的阵列基板包括衬底基板，衬底基板具有显示区域非显示区域，显示区域包括多条信号线；非显示区域包括至少三条修复引线，以及与各修复引线一一对应相连的焊接端子，各信号线与至少一条修复引线在衬底基板上的正投影存在交叠区域。本申请通过设置与信号线在衬底基板上的正投影存在交叠区域的修复引线，在信号线出现断路时，利用激光将修复引线熔融，使发生断路的信号线连通，不会影响显示面板正常显示，由此实现信号线的修复功能；并且本申请通过设置至少三条修复引线，能够提高修复信号线的数量，从而有利于提高显示良率。
在具体实施时，在本申请实施例提供的上述阵列基板中，各修复引线3包括沿第二方向X延伸的部分，该第二方向X和第一方向Y交叉设置；具体的，信号线2与所述修复引线3的沿第二方向X延伸的部分在衬底基板1上的正投影存在交叠区域。
本申请实施例提供的阵列基板中，将信号线2与修复引线3沿第二方向X 延伸的部分交叠，有利于缩短修复引线3的长度，减小修复引线3的占地面积，提高修复引线3之间的间距、减小发生短路的概率，可以大大方便修复引线3的布置。
可选的，第一方向Y和第二方向X可以垂直，如图1至图4所示，第一方向Y垂直于衬底基板1的一侧边缘，第二方向X与该边缘平行；即，信号线2垂直于衬底基板1的一个边缘，并与修复引线3中平行于该边缘的部分相交叠。
在具体实施时，在本申请实施例提供的上述阵列基板中，图1至图4中的非显示区域均以包括部分沿第二方向X延伸的两条修复引线3为例进行示意说明，但在实际应用中，本申请实施例提供的阵列基板的非显示区域均包括部分沿第二方向X延伸的至少三条修复引线3，其它各修复引线3的结构以及与信号线2之间的关系均与图1至图4中示意出的两条修复引线3的结构相同，在此不做赘述。
在具体实施时，在本申请实施例提供的上述阵列基板中，如图1至图4所示，信号线2分为多组信号线；
每一修复引线3包括一条第一子修复线31和多条第二子修复线32；
每一修复引线3中，第一子修复线31与焊接端子4一一对应相连，第一子修复线31与各第二子修复线32在衬底基板1上的正投影存在交叠区域D；
各组信号线2与至少一条第二子修复线32绝缘搭接。
在具体实施时，在本申请实施例提供的上述阵列基板中，图1至图4中均以6组信号线、每组包括4条信号线为例进行示意说明，当然具体实施时，可以将阵列基板上的所有信号线划分为多组，每一组的数量根据实际需要进行设定。具体地，如图1和图2所示，每组信号线2仅与一条第二子修复线32绝缘搭接，这样某一组信号线2中出现断路时，可以利用激光将与该组信号线2搭接的第二子修复线32熔融，使发生断路的信号线2连通，实现信号线2的修复功能；由于信号线2与第二子修复线32是绝缘搭接的，因此在信号线2正常时，绝缘搭接的第二子修复线32不会影响显示面板的正常显示功 能。如图3所示，各组信号线2与多条第二子修复线32绝缘搭接，这样在信号线2出现断路的位置较多时，可以通过激光熔融多条第二子修复线32，同时进行多个位置的修复，或在信号线2出现一个位置断路时，可以通过多条第二子修复线32对信号线2的一个断路位置进行修复，这样可以提高信号线2的修复良率。
具体的，例如，本申请实施例提供的阵列基板，可以包括8条修复引线，各修复引线包括15条第二修复线，每条第二修复线搭接48条数据线，这样，则可以对应FHD1920系列产品的数据线修复保障。
需要说明的是，绝缘搭接是指信号线与第二子修复线之间不是电连接，而是通过在信号线与第二子修复线之间设置绝缘层来实现交叠，即只搭接不接触；只有在需要信号线修复的时候，才利用激光熔融绝缘搭接部分以实现电连接，在不需要进行信号线修复时，绝缘搭接不影响正常显示功能。
在具体实施时，在本申请实施例提供的上述阵列基板中，如图1至图3所示，第二子修复线32与其它至少一条修复引线3的第一子修复线31在衬底基板1上的正投影存在交叠区域D，‘其它至少一条修复引线’，是指除了该第二子修复线所属的修复引线之外的修复引线。具体地，如图1所示，第二子修复线32仅与一条修复引线3的第一子修复线31在衬底基板1上的正投影存在交叠区域D，这样在信号线2出现断路时，利用激光熔融第二子修复线32与第一子修复线31的交叠区域D，以及第二子修复线32与信号线的交叠区域C，使发生断路的信号线2连通，实现信号线2的修复功能；如图2所示，第二子修复线32与多条修复引线3的第一子修复线31在衬底基板1上的正投影均存在交叠区域D，这样在信号线2出现断路时，可以利用多条第一子修复线31同时对断路的信号线2进行修复，这样可以提高信号线2的修复良率；当然具体实施时，如图3所示，也可以部分第二子修复线32与多条修复引线3的第一子修复线31在衬底基板1上的正投影均存在交叠区域D，部分第二子修复线32仅与一条修复引线3的第一子修复线31在衬底基板1上的正投影存在交叠区域D，在此不做限定。
在具体实施时，在本申请实施例提供的上述阵列基板中，如图2所示，第二子修复线32与全部修复引线3的第一子修复线31在衬底基板1上的正投影均存在交叠区域D，这样在信号线2出现断路时，可以利用全部的第一子修复线31同时对断路的信号线2进行修复，这样可以大大提高信号线2的修复良率。
在具体实施时，在本申请实施例提供的上述阵列基板中，如图3所示，至少有一组信号线2与至少两条第二子修复线32绝缘搭接。这样当上述一组信号线2中的信号线出现断路时，可以通过至少两条第二子修复线32对同一组的信号线进行修复，进一步提高信号线2的修复良率。
在具体实施时，在本申请实施例提供的上述阵列基板中，如图4所示，与同一组信号线2绝缘搭接的第二子修复线32可以属于同一修复引线3；或者，与同一组信号线2绝缘搭接的第二子修复线32也可以属于不同修复引线3。具体地，如图4所示，左侧三组信号线2中，与同一组信号线2绝缘搭接的第二子修复线32全部属于同一修复引线3；右侧三组信号线2中，与同一组信号线2绝缘搭接的第二子修复线32属于不同修复引线3，如右侧每组信号线2中沿第一方向Y上，最上面一条第二子修复线32属于同一修复引线3，下面三条第二子修复线32属于不同的修复引线3。
在具体实施时，在本申请实施例提供的上述阵列基板中，如图3所示，与同一组信号线2绝缘搭接的第二子修复线32中，至少部分第二子修复线32可以与其它至少一条修复引线3的第一子修复线31在衬底基板1上的正投影存在交叠区域D，‘其它至少一条修复引线’，是指除了该第二子修复线所属的修复引线之外的修复引线。当然，具体实施时，也可以是与同一组信号线2绝缘搭接的全部第二子修复线32与其它至少一条修复引线3的第一子修复线31在衬底基板1上的正投影存在交叠区域D。
在具体实施时，在本申请实施例提供的上述阵列基板中，如图1-4所示，第一子修复线31与第二子修复线32之间的交叠区域D可以采用电连接或采用绝缘搭接。
在具体实施时，在本申请实施例提供的上述阵列基板中，如图1-4所示，在第一子修复线31与第二子修复线32之间的交叠区域D采用电连接时，第一子修复线31与第二子修复线32可以位于同一膜层；这样可以通过一次构图工艺制备第一子修复线31与第二子修复线32；在第一子修复线31与第二子修复线32之间的交叠区域D采用绝缘搭接时，第一子修复线31与第二子修复线32可以位于不同膜层。
在具体实施时，在本申请实施例提供的上述阵列基板中，如图1-4所示，焊接端子4和第一子修复线31位于同一膜层，这样可以通过一次构图工艺制备焊接端子4和第一子修复线31；第二子修复线32和信号线2位于不同膜层，具体地，第二子修复线32和信号线2之间设置绝缘层。
在具体实施时，在本申请实施例提供的上述阵列基板中，如图1-4所示，为了统一制作工艺，每组信号线2的数量相同。当然，每组信号线2的数量也可以不相同，在此不做限定。
在具体实施时，在本申请实施例提供的上述阵列基板中，信号线可以包括栅线或数据线。如图1-4所示，本申请实施例中是以数据线为例进行说明的，当然也可以是栅线，栅线的修复原理与数据线的修复原理相同，在此不做赘述。
基于同一申请构思，本申请实施例还提供了一种显示面板，包括本申请实施例提供的上述任一种阵列基板。该显示面板解决问题的原理与前述阵列基板相似，因此该显示面板的实施可以参见前述阵列基板的实施，重复之处在此不再赘述。
基于同一申请构思，本申请实施例还提供了一种显示装置，包括本申请实施例提供的上述显示面板。该显示装置解决问题的原理与前述显示面板相似，因此该显示装置的实施可以参见前述显示面板的实施，重复之处在此不再赘述。
本申请实施例提供的阵列基板、显示面板及显示装置，该阵列基板包括衬底基板，衬底基板具有显示区域和包围显示区域的非显示区域，显示区域 包括沿第一方向延伸的多条信号线；非显示区域包括至少三条修复引线，以及与各修复引线一一对应相连的焊接端子，各信号线与至少一条修复引线在衬底基板上的正投影存在交叠区域。本申请通过设置与信号线在衬底基板上的正投影存在交叠区域的修复引线，在信号线出现断路时，利用激光将修复引线熔融，使发生断路的信号线连通，不会影响显示面板正常显示，由此实现信号线的修复功能；并且本申请通过设置至少三条修复引线，能够提高修复信号线的数量，从而有利于提高显示良率。
显然，本领域的技术人员可以对本申请进行各种改动和变型而不脱离本申请的精神和范围。这样，倘若本申请的这些修改和变型属于本申请权利要求及其等同技术的范围之内，则本申请也意图包含这些改动和变型在内。

Claims (14)

  1. 一种阵列基板，包括衬底基板，所述衬底基板具有显示区域和包围所述显示区域的非显示区域，所述显示区域包括沿第一方向延伸的多条信号线；
    所述非显示区域包括至少三条修复引线，以及与各所述修复引线一一对应相连的焊接端子，各所述信号线与至少一条所述修复引线在所述衬底基板上的正投影存在交叠区域。
  2. 如权利要求1所述的阵列基板，其中，各所述修复引线包括沿第二方向延伸的部分，所述第二方向和所述第一方向交叉设置；
    所述信号线与所述修复引线的沿第二方向延伸的部分在所述衬底基板上的正投影存在所述交叠区域。
  3. 如权利要求2所述的阵列基板，其中，
    每一所述修复引线包括一条第一子修复线和多条第二子修复线；
    每一所述修复引线中，所述第一子修复线与所述焊接端子相连，各所述第二子修复线与所述第一子修复线在所述衬底基板上的正投影存在交叠区域，且各所述第二子修复线包括沿第二方向延伸的部分；
    所述信号线分为多组；各组所述信号线与至少一条所述第二子修复线的沿第二方向延伸的部分绝缘搭接。
  4. 如权利要求3所述的阵列基板，其中，所述第二子修复线与其它至少一条所述修复引线的第一子修复线在所述衬底基板上的正投影存在交叠区域。
  5. 如权利要求4所述的阵列基板，其中，所述第二子修复线与全部所述修复引线的第一子修复线在所述衬底基板上的正投影均存在交叠区域。
  6. 如权利要求3所述的阵列基板，其中，至少一组所述信号线与至少两条所述第二子修复线绝缘搭接。
  7. 如权利要求6所述的阵列基板，其中，与同一组所述信号线绝缘搭接的所述第二子修复线属于同一所述修复引线；或者，与同一组所述信号线绝缘搭接的所述第二子修复线属于不同所述修复引线。
  8. 如权利要求3所述的阵列基板，其中，所述第一子修复线与所述第二子修复线之间的交叠区域采用电连接或采用绝缘搭接。
  9. 如权利要求8所述的阵列基板，其中，在所述第一子修复线与所述第二子修复线之间的交叠区域采用电连接时，所述第一子修复线与所述第二子修复线位于同一膜层；
    在所述第一子修复线与所述第二子修复线之间的交叠区域采用绝缘搭接时，所述第一子修复线与所述第二子修复线位于不同膜层。
  10. 如权利要求3所述的阵列基板，其中，所述焊接端子和所述第一子修复线位于同一膜层，所述第二子修复线和所述信号线位于不同膜层。
  11. 如权利要求3-10任一项所述的阵列基板，其中，每组所述信号线的数量相同。
  12. 如权利要求1-10任一项所述的阵列基板，其中，所述信号线包括栅线或数据线。
  13. 一种显示面板，包括如权利要求1-12任一项所述的阵列基板。
  14. 一种显示装置，包括如权利要求13所述的显示面板。
PCT/CN2019/111505 2018-11-28 2019-10-16 一种阵列基板、显示面板及显示装置 WO2020108143A1 (zh)

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