WO2020108143A1 - 一种阵列基板、显示面板及显示装置 - Google Patents
一种阵列基板、显示面板及显示装置 Download PDFInfo
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- WO2020108143A1 WO2020108143A1 PCT/CN2019/111505 CN2019111505W WO2020108143A1 WO 2020108143 A1 WO2020108143 A1 WO 2020108143A1 CN 2019111505 W CN2019111505 W CN 2019111505W WO 2020108143 A1 WO2020108143 A1 WO 2020108143A1
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- 239000000758 substrate Substances 0.000 title claims abstract description 107
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 238000003466 welding Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 230000003252 repetitive effect Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136259—Repairing; Defects
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133388—Constructional arrangements; Manufacturing methods with constructional differences between the display region and the peripheral region
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136259—Repairing; Defects
- G02F1/136263—Line defects
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136259—Repairing; Defects
- G02F1/136272—Auxiliary lines
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
- H01L21/76892—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern
- H01L21/76894—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern using a laser, e.g. laser cutting, laser direct writing, laser repair
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
Definitions
- the present application relates to the field of display technology, in particular to an array substrate, a display panel and a display device.
- Thin film transistor liquid crystal display (Thin Film Transistor Liquid Crystal, TFT-LCD) has the advantages of small size, low power consumption, no radiation, etc., occupying a dominant position in the current flat panel display market, widely used in desktop computers, notebook computers, Personal digital assistants, mobile phones, televisions, monitors and other fields.
- TFT-LCD Thin film transistor liquid crystal display
- the structure of the array substrate and its manufacturing process determine the product performance, yield and price of TFT-LCD.
- the array stage of the array substrate due to various reasons (such as over-etching, or the presence of foreign objects (Particle), etc.), will cause the data lines on the array substrate (Data) Line and/or Gate Line (Gate Line) is broken (ie, Open is bad).
- the cell (Cut) process may also scratch the panel edge (Lead) area, resulting in a defective Open in the Lead part of the Data Line or Gate Line.
- Embodiments of the present application provide an array substrate, a display panel, and a display device, which are used to solve the problem of defective Open in the Lead part of the Data or Line in the prior art.
- an embodiment of the present application provides an array substrate including a base substrate, the base substrate having a display area and a non-display area surrounding the display area, the display area including a plurality of strips extending in a first direction Signal line
- the non-display area includes at least three repair leads, and solder terminals connected to each of the repair leads in one-to-one correspondence, and each of the signal lines intersects at least one orthographic projection of the repair leads on the base substrate Stacked area.
- each of the repair leads includes a portion that extends along a second direction, and the second direction and the first direction are intersected;
- the overlapping area is present in the orthographic projection of the portion of the signal line and the repair lead extending in the second direction on the base substrate.
- each of the repair leads includes one first sub-repair line and multiple second sub-repair lines;
- the first sub-repair line is connected to the solder terminal, and each of the second sub-repair line and the first sub-repair line are orthogonal to each other on the base substrate Overlapping regions, and each of the second sub-repair lines includes a portion extending in the second direction;
- the signal lines are divided into multiple groups; each group of the signal lines is insulated and overlapped with at least one portion of the second sub-repair line extending in the second direction.
- the second sub-repair line and the first sub-repair line of at least one other repair lead on the base substrate Orthographic projections have overlapping areas.
- an orthographic projection of the second sub-repair line and the first sub-repair line of all the repair leads on the base substrate There are overlapping areas.
- At least one group of the signal lines is insulated and overlapped with at least two of the second sub-repair lines.
- the second sub-repair lines insulated and overlapped with the same group of the signal lines belong to the same repair lead; or, the same The second sub-repair lines insulated and overlapped by the signal lines belong to different repair leads.
- the overlapping area between the first sub-repair line and the second sub-repair line is electrically connected or insulated and overlapped.
- the overlapping area between the first sub-repair line and the second sub-repair line when the overlapping area between the first sub-repair line and the second sub-repair line is electrically connected, the The first sub-repair line and the second sub-repair line are located in the same film layer;
- the first sub-repair line and the second sub-repair line are located in different layers.
- the solder terminal and the first sub-repair line are located in the same film layer, and the second sub-repair line and the signal line Located on different layers.
- the number of the signal lines in each group is the same.
- the signal line includes a gate line or a data line.
- an embodiment of the present application also provides a display panel, including any of the above array substrates provided by the embodiment of the present application.
- an embodiment of the present application further provides a display device, including the above-mentioned display panel provided by the embodiment of the present application.
- FIG. 1 is a schematic structural diagram of an array substrate provided by an embodiment of the present application.
- FIG. 2 is a schematic structural diagram of an array substrate provided by another embodiment of the present application.
- FIG. 3 is a schematic structural diagram of an array substrate provided by another embodiment of the present application.
- FIG. 4 is a schematic structural diagram of an array substrate provided by another embodiment of the present application.
- the array substrate provided by the embodiment of the present application includes a base substrate 1 having a display area and a non-display area surrounding the display area.
- FIGS. 1 to 4 only illustrate Part of the display area and part of the non-display area, the display area includes a plurality of signal lines 2 extending along the first direction Y;
- the non-display area includes at least three repair leads 3, and solder terminals 4 corresponding to each repair lead 3 in one-to-one correspondence.
- Each signal line 2 and at least one repair lead 3 have an overlapping area C in an orthographic projection on the base substrate 1.
- the array substrate provided by the embodiment of the present application includes a base substrate, the base substrate has a display area and a non-display area, and the display area includes a plurality of signal lines; the non-display area includes at least three repair leads, and each repair lead is connected in a one-to-one correspondence For the solder terminal, there is an overlap area between each signal line and the orthographic projection of at least one repair lead on the base substrate.
- the repair lead is provided with an overlapping area with the orthographic projection of the signal line on the base substrate.
- the repair lead When the signal line is broken, the repair lead is melted by the laser to connect the broken signal line without affecting the display panel Normal display, thereby realizing the repair function of the signal line; and by setting at least three repair leads in this application, the number of repaired signal lines can be increased, which is beneficial to improve the display yield.
- each repair lead 3 includes a portion extending along a second direction X, and the second direction X and the first direction Y are intersected; specifically, the signal line 2 There is an overlapping area with the orthographic projection of the portion of the repair lead 3 extending in the second direction X on the base substrate 1.
- overlapping the signal line 2 with the repair lead 3 extending along the second direction X is beneficial to shorten the length of the repair lead 3, reduce the area of the repair lead 3, and improve repair
- the spacing between the leads 3 reduces the probability of a short circuit, which can greatly facilitate the repair of the arrangement of the leads 3.
- first direction Y and the second direction X may be perpendicular, as shown in FIGS. 1 to 4, the first direction Y is perpendicular to an edge of the base substrate 1, and the second direction X is parallel to the edge;
- the signal line 2 is perpendicular to an edge of the base substrate 1 and overlaps with the portion of the repair lead 3 parallel to the edge.
- the non-display areas in FIGS. 1 to 4 are all schematically illustrated by including two repair leads 3 partially extending along the second direction X, but
- the non-display area of the array substrate provided in the embodiments of the present application includes at least three repair leads 3 partially extending along the second direction X, and the structures of the other repair leads 3 and the relationship with the signal line 2 are both
- the structure of the two repair leads 3 shown in FIGS. 1 to 4 is the same, and will not be repeated here.
- the signal lines 2 are divided into multiple groups of signal lines;
- Each repair lead 3 includes one first sub-repair line 31 and multiple second sub-repair lines 32;
- each repair lead 3 the first sub-repair line 31 and the solder terminal 4 are connected in a one-to-one correspondence, and the orthographic projection of the first sub-repair line 31 and each second sub-repair line 32 on the base substrate 1 has an overlapping area D ;
- Each group of signal lines 2 is insulated and overlapped with at least one second sub-repair line 32.
- each group includes 4 signal lines as an example for illustration.
- you can use All signal lines on the array substrate are divided into multiple groups, and the number of each group is set according to actual needs. Specifically, as shown in FIGS.
- each group of signal lines 2 is insulated and overlapped with only one second sub-repair line 32, so that when a certain group of signal lines 2 breaks, the laser can be used to communicate with the group of signals
- the second sub-repair line 32 overlapped by the line 2 melts to connect the disconnected signal line 2 to realize the repair function of the signal line 2; since the signal line 2 and the second sub-repair line 32 are insulated and overlapped, the signal When the line 2 is normal, the insulated second sub-repair line 32 will not affect the normal display function of the display panel. As shown in FIG.
- each group of signal lines 2 is insulated and overlapped with a plurality of second sub-repair lines 32, so that when there are many locations where the signal line 2 is disconnected, the plurality of second sub-repair lines 32 can be melted by laser while When multiple locations are repaired, or when one position of the signal line 2 is broken, a plurality of second sub-repair lines 32 can be used to repair a broken position of the signal line 2, which can improve the repair yield of the signal line 2.
- the array substrate provided in the embodiment of the present application may include 8 repair leads, each repair lead includes 15 second repair lines, and each second repair line overlaps 48 data lines, so that it can correspond to Data line repair guarantee for FHD1920 series products.
- the insulation overlap means that the signal line and the second sub-repair line are not electrically connected, but are overlapped by providing an insulation layer between the signal line and the second sub-repair line, that is, only overlap No contact; only when the signal line repair is required, the laser is used to melt the insulation lap part to achieve the electrical connection. When the signal line repair is not required, the insulation lap does not affect the normal display function.
- the second sub-repair line 32 and the first sub-repair line 31 of at least one other repair lead 3 are on the base substrate
- the orthographic projection on 1 has an overlapping area D, and'the other at least one repair lead' refers to the repair lead except the repair lead to which the second sub-repair line belongs.
- the second sub-repair line 32 only overlaps with the orthographic projection of the first sub-repair line 31 of one repair lead 3 on the base substrate 1, so that a disconnection occurs in the signal line 2
- the overlapping area D of the second sub-repair line 32 and the first sub-repair line 31 and the overlapping area C of the second sub-repair line 32 and the signal line are fused by laser to connect the signal line 2 where the disconnection occurs, to achieve The repair function of the signal line 2; as shown in FIG.
- the orthographic projections of the second sub-repair line 32 and the first sub-repair line 31 of the plurality of repair leads 3 on the base substrate 1 all have overlapping areas D, so that When the signal line 2 is broken, multiple first sub-repair lines 31 can be used to repair the broken signal line 2 at the same time, which can improve the repair yield of the signal line 2; of course, as shown in FIG. There may be an overlap region D between the second sub-repair line 32 and the first sub-repair line 31 of the plurality of repair leads 3 on the base substrate 1, and part of the second sub-repair line 32 only has one repair lead 3
- the orthographic projection of the first sub-repair line 31 on the base substrate 1 has an overlapping area D, which is not limited herein.
- an orthographic projection of the second sub-repair line 32 and the first sub-repair line 31 of all the repair leads 3 on the base substrate 1 There are overlapping regions D, so that when the signal line 2 is broken, all the first sub-repair lines 31 can be used to repair the broken signal line 2 at the same time, which can greatly improve the repair yield of the signal line 2.
- At least one group of signal lines 2 is insulated and overlapped with at least two second sub-repair lines 32.
- at least two second sub-repair lines 32 can be used to repair the signal lines of the same group, thereby further improving the repair yield of the signal line 2.
- the second sub-repair line 32 insulated and overlapped with the same group of signal lines 2 may belong to the same repair lead 3;
- the second sub-repair line 32 insulated and overlapped by the group signal line 2 may also belong to different repair leads 3.
- the second sub-repair lines 32 insulated and overlapped with the same set of signal lines 2 all belong to the same repair lead 3; in the right three sets of signal lines 2,
- the second sub-repair lines 32 insulated and overlapped with the same group of signal lines 2 belong to different repair leads 3.
- the top second sub-repair line 32 belongs to the same repair Lead 3, the following three second sub-repair lines 32 belong to different repair leads 3.
- the second sub-repair lines 32 insulated and overlapped with the same group of signal lines 2 at least part of the second sub-repair lines 32 may be There is an overlapping area D with the orthographic projection of the first sub-repair line 31 of the at least one other repair lead 3 on the base substrate 1, and the'at least one other repair lead' refers to the repair lead except the second sub-repair line Repair leads outside.
- all the second sub-repair lines 32 insulated from the same group of signal lines 2 and the first sub-repair lines 31 of at least one other repair lead 3 are present in the orthographic projection on the base substrate 1 Overlapping area D.
- the overlapping area D between the first sub-repair line 31 and the second sub-repair line 32 may be electrically connected or Use insulation lap.
- the first sub-repair line 31 and the second sub-repair line 32 when the overlapping area D between the first sub-repair line 31 and the second sub-repair line 32 is electrically connected , The first sub-repair line 31 and the second sub-repair line 32 can be located in the same film layer; in this way, the first sub-repair line 31 and the second sub-repair line 32 can be prepared by one patterning process; When the overlapping area D between the two sub-repair lines 32 is insulated and overlapped, the first sub-repair line 31 and the second sub-repair line 32 may be located in different layers.
- the solder terminal 4 and the first sub-repair line 31 are located in the same film layer, so that the solder terminal 4 can be prepared by a patterning process
- the first sub-repair line 31; the second sub-repair line 32 and the signal line 2 are located in different layers, specifically, an insulating layer is provided between the second sub-repair line 32 and the signal line 2.
- the number of signal lines 2 in each group is the same.
- the number of signal lines 2 in each group may also be different, which is not limited herein.
- the signal lines may include gate lines or data lines.
- the data line is used as an example for description.
- the gate line may also be used.
- the repair principle of the gate line is the same as that of the data line, and details are not described herein.
- embodiments of the present application further provide a display panel, including any of the above-mentioned array substrates provided by the embodiments of the present application.
- the principle of the display panel to solve the problem is similar to that of the aforementioned array substrate, so the implementation of the display panel can refer to the implementation of the aforementioned array substrate, and the repetitive points will not be repeated here.
- an embodiment of the present application further provides a display device, including the above-mentioned display panel provided by the embodiment of the present application.
- the principle of the display device to solve the problem is similar to that of the foregoing display panel, so the implementation of the display device can refer to the implementation of the foregoing display panel, and the repetitive points will not be repeated here.
- the array substrate includes a base substrate, the base substrate has a display area and a non-display area surrounding the display area, and the display area includes a plurality of signals extending in the first direction
- the non-display area includes at least three repair leads, and solder terminals connected to each repair lead in a one-to-one correspondence.
- Each signal line and at least one repair lead have an overlapped area on the front projection of the base substrate.
- the repair lead is provided with an overlapping area with the orthographic projection of the signal line on the base substrate.
- the repair lead When the signal line is broken, the repair lead is melted by the laser to connect the broken signal line without affecting the display panel Normal display, thereby realizing the repair function of the signal line; and by setting at least three repair leads in this application, the number of repaired signal lines can be increased, which is beneficial to improve the display yield.
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- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract
Description
Claims (14)
- 一种阵列基板,包括衬底基板,所述衬底基板具有显示区域和包围所述显示区域的非显示区域,所述显示区域包括沿第一方向延伸的多条信号线;所述非显示区域包括至少三条修复引线,以及与各所述修复引线一一对应相连的焊接端子,各所述信号线与至少一条所述修复引线在所述衬底基板上的正投影存在交叠区域。
- 如权利要求1所述的阵列基板,其中,各所述修复引线包括沿第二方向延伸的部分,所述第二方向和所述第一方向交叉设置;所述信号线与所述修复引线的沿第二方向延伸的部分在所述衬底基板上的正投影存在所述交叠区域。
- 如权利要求2所述的阵列基板,其中,每一所述修复引线包括一条第一子修复线和多条第二子修复线;每一所述修复引线中,所述第一子修复线与所述焊接端子相连,各所述第二子修复线与所述第一子修复线在所述衬底基板上的正投影存在交叠区域,且各所述第二子修复线包括沿第二方向延伸的部分;所述信号线分为多组;各组所述信号线与至少一条所述第二子修复线的沿第二方向延伸的部分绝缘搭接。
- 如权利要求3所述的阵列基板,其中,所述第二子修复线与其它至少一条所述修复引线的第一子修复线在所述衬底基板上的正投影存在交叠区域。
- 如权利要求4所述的阵列基板,其中,所述第二子修复线与全部所述修复引线的第一子修复线在所述衬底基板上的正投影均存在交叠区域。
- 如权利要求3所述的阵列基板,其中,至少一组所述信号线与至少两条所述第二子修复线绝缘搭接。
- 如权利要求6所述的阵列基板,其中,与同一组所述信号线绝缘搭接的所述第二子修复线属于同一所述修复引线;或者,与同一组所述信号线绝缘搭接的所述第二子修复线属于不同所述修复引线。
- 如权利要求3所述的阵列基板,其中,所述第一子修复线与所述第二子修复线之间的交叠区域采用电连接或采用绝缘搭接。
- 如权利要求8所述的阵列基板,其中,在所述第一子修复线与所述第二子修复线之间的交叠区域采用电连接时,所述第一子修复线与所述第二子修复线位于同一膜层;在所述第一子修复线与所述第二子修复线之间的交叠区域采用绝缘搭接时,所述第一子修复线与所述第二子修复线位于不同膜层。
- 如权利要求3所述的阵列基板,其中,所述焊接端子和所述第一子修复线位于同一膜层,所述第二子修复线和所述信号线位于不同膜层。
- 如权利要求3-10任一项所述的阵列基板,其中,每组所述信号线的数量相同。
- 如权利要求1-10任一项所述的阵列基板,其中,所述信号线包括栅线或数据线。
- 一种显示面板,包括如权利要求1-12任一项所述的阵列基板。
- 一种显示装置,包括如权利要求13所述的显示面板。
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