WO2020103075A1 - 一种图像处理方法及装置 - Google Patents
一种图像处理方法及装置Info
- Publication number
- WO2020103075A1 WO2020103075A1 PCT/CN2018/116904 CN2018116904W WO2020103075A1 WO 2020103075 A1 WO2020103075 A1 WO 2020103075A1 CN 2018116904 W CN2018116904 W CN 2018116904W WO 2020103075 A1 WO2020103075 A1 WO 2020103075A1
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- image
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- porous
- small hole
- spot
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/95—Computational photography systems, e.g. light-field imaging systems
- H04N23/955—Computational photography systems, e.g. light-field imaging systems for lensless imaging
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
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Definitions
- the invention relates to the field of image processing, in particular to a method and device for processing images acquired by a matrix-type small-hole imaging system.
- the Matrix Pinhole Imaging System is used to acquire images of the surface of objects at close range, such as fingerprint images. It includes an image collector, a light blocking layer is arranged above the image collector, and a plurality of imaging holes are arranged in a matrix on the light blocking layer.
- the object to be detected is placed above the light blocking layer, and the built-in light source or the external light source in the image collector illuminate the surface of the object to be detected.
- the principle of small hole imaging as shown in FIG. 19, the light from the surface of the object passes through the small hole, and a matrix-shaped image of small holes reflecting the surface of the object to be detected is formed on the image collector accordingly.
- the image collected by the matrix-type small-hole imaging system is shown in FIG. 3, and a plurality of small-circular small-hole image spots distributed in a matrix manner on the image.
- the small hole image spots on the image require further processing to obtain a uniform, distortion-free, continuous and complete target image, because the image collected by the matrix small hole imaging system includes multiple small hole image spots, Each small hole image spot only contains part of the information of the target object; each small hole image spot is an inverted image; because the light passes through a transparent medium layer of different refractive index during the imaging process, the object image in the small hole image spot exists geometrically Distortion: According to the optical principle, there is parallax between multiple images due to multi-eye vision, and there is brightness distortion that gradually decreases in brightness from the center to the outer periphery of the small hole image spot.
- the present application proposes an image processing method and device to further process the porous images obtained by the matrix small hole imaging system to obtain continuous and complete target images.
- the purpose of the present application is to provide a method for online processing such as inversion correction and stitching of a porous image obtained by a MAPIS image collector.
- This application uses the stitching parameters of the matrix small hole imaging system to first perform inversion correction on the target small hole image spot on the target image obtained by the system, and then from the target small hole image spot after the inverted image correction Select an image segment with a size greater than or equal to the maximum non-overlapping image field size, and then stitch the image segments to obtain the target image.
- correct Distortion correction, brightness correction and other corrections are performed on the target small hole image spot.
- the method of the present application performs reverse image correction, distortion correction, brightness correction and other processing on the small hole image spot before stitching, so that the stitched result is a complete and intact target image with less distortion and uniform brightness.
- the present application provides an image processing method, which includes: obtaining a target porous image corresponding to a target by using a matrix porous imaging system, the target porous image containing a plurality of target small hole image spots; based on a matrix porous imaging system Stitching parameters, performing inversion correction on the target small aperture image spot to obtain multiple target imagery small aperture image spots after correction; based on the stitching parameters of the matrix porous imaging system, correcting the inverted image target The small image spots are stitched together to generate the target image.
- the acquiring the splicing parameters includes: acquiring the calculation parameters; and calculating the splicing parameters using the calculation parameters.
- the calculation parameters are preset parameters when designing the matrix porous imaging system.
- the acquiring calculation parameters include: acquiring a standard porous image, the standard porous image including a preset pattern porous image or a surface light source porous image; and calculating the calculation parameter according to the standard porous image.
- obtaining the preset mode porous image includes: using a matrix-type porous imaging system to obtain a preset mode porous image corresponding to the preset mode, the preset mode porous image containing a plurality of preset mode pores Like spots.
- acquiring the porous image of the surface light source includes: using a matrix-type porous imaging system to form a porous image of the surface light source under a uniform surface light source luminous condition, the porous image of the surface light source includes a plurality of bright-field pore image .
- the preset pattern is composed of a single pattern containing lines in two directions or multiple directions, which are regularly and repeatedly arranged according to the cycle length.
- the period length is a positive integer multiple of the aperture period.
- using the matrix-type porous imaging system to obtain the preset mode porous image corresponding to the preset mode includes: placing a standard object having the preset mode on the image collector of the matrix-type porous imaging system On the surface, illuminate the standard object with the preset mode with an external light source to make a transmission imaging to obtain the preset mode porous image; or, place no object on the surface of the image collector of the matrix porous imaging system, use An external structure light source with a preset mode illuminates the upper surface of the image collector of the matrix porous imaging system, so that the external structure light source is imaged by the matrix porous imaging system to obtain the preset mode porous image;
- the standard object with the preset mode is placed on the upper surface of the image collector of the matrix porous imaging system, and the standard object with the preset mode is irradiated with a built-in light source to reflect the image to obtain the porous image with the preset mode
- no object is placed on the upper surface of the image collector of the matrix porous imaging system
- a display screen is used as the external light source, the external structure light source with a preset mode, the internal light source, or the internal light source with display function.
- using the calculation parameters to calculate the stitching parameters includes: using the calculation parameters to calculate the aperture position and the maximum non-overlapping image field of view size; using the maximum non-overlapping image field of view The size calculates the imaging resolution.
- the calculation of the position of the small hole using the calculation parameters includes: acquiring a porous image of a surface light source using a matrix porous imaging system; and using the porous surface light source on the porous image of the surface light source An arbitrary point on the image is used as the origin to establish a rectangular coordinate system; the position of the small hole is determined, and the position of the small hole is the corresponding coordinate of the geometric center of the bright field small hole image spot in the rectangular coordinate system.
- the calculating the maximum non-overlapping image field of view size using the calculation parameters includes: measuring the maximum non-overlapping image field size from a preset mode porous image; or, using the The object distance and the image distance in the calculation parameters are calculated to obtain the maximum non-overlapping image field size; or, the stitching effect of the small hole image spot in the preset mode is optimally estimated to obtain the maximum non-overlapping image side field size.
- inversion correction of the target small hole image spot includes: dividing the target porous image into several sub-pictures according to the position of the small hole, each sub-picture has only and only A complete target small hole image spot; obtaining the position coordinates of the pixel on the target small hole image spot in a rectangular coordinate system with the center of the target small hole image spot as the origin; The position coordinates are symmetrically flipped about the center of the origin to obtain the target small hole image spot after the inverted image correction.
- the stitching of the image hole of the target object after image correction includes: removing an image segment from the image hole of the target object, the center of the image segment and all The center of the image hole of the target object after image correction is the same, the size of the image segment is the largest non-overlapping image field of view size; according to the relative position of each target image hole in the target porous image Describe the image clip.
- the stitching of the image hole of the target object after image correction includes: removing an image segment from the image hole of the target object, the center of the image segment and all The center of the target small hole image spot after the image correction is the same, and the size of the image segment is larger than the maximum non-overlapping image field of view size; according to the relative position of each target small hole image spot in the target porous image Describe the image clip.
- combining the image segments according to the relative positions of the target small hole image spots in the target porous image includes: for information that does not overlap in adjacent image segments, retain the original information; for adjacent The weighted average of the overlapping information in the image fragments or the optimal preservation according to the stitching effect.
- the calculation of the stitching parameters using the calculation parameters of the matrix porous imaging system further includes: using the calculation parameters to calculate the brightness correction parameters and the distortion correction parameters.
- calculating the brightness correction parameters using the calculation parameters includes: calculating the brightness correction parameters based on the image distance and the pixel size of the image sensor in the calculation parameters; or, using matrix porous imaging
- the system acquires a standard porous image; obtains a preset pattern small hole image spot or bright field small hole image spot from the standard porous image; obtains a preset from the preset pattern small hole image spot or bright field small hole image spot Mode pixels; obtaining target pixels from the target small aperture image; measuring the preset mode pixels and the target pixels and performing comparative analysis to obtain brightness correction parameters.
- the method before merging the image segment according to the relative positions of each target small hole image spot in the target porous image, the method further includes: segmenting the target porous image according to the position of the small hole There are several sub-pictures, and there is only one complete target small hole image spot on each sub-picture; use the brightness correction parameter to adjust the gray value of pixels in the target small hole image spot to eliminate the target in the sub-picture
- the brightness of the object small hole image spot decreases from the center to the outer periphery, so that the brightness of the target object small hole image spot from the center to the outer periphery in the sub-image is uniform.
- the calculating the distortion correction parameters using the calculation parameters includes: calculating the distortion correction parameters using the object distance, image distance, and transparent medium refractive index in the calculation parameters; or, using a matrix Standard multi-hole imaging system to obtain standard multi-hole images; from the standard multi-hole images to obtain preset mode small hole image spots or bright field small hole image spots; from the preset mode small hole image spots or bright field small hole image spots Obtaining a preset pattern pixel; acquiring a target pixel from the target object aperture; performing geometric feature matching on the preset pattern pixel and the target pixel to obtain a matching point pair; obtaining a position of the matching point pair ; Analyze and measure the position difference of the pair of matching points to obtain distortion correction parameters for each pixel.
- the method before merging the image segment according to the relative position of each target small hole image spot in the target porous image, the method further includes: segmenting the target porous image according to the position of the small hole into Several sub-pictures, each of which has only one complete target small hole image spot; use distortion correction parameters to adjust the position of pixels in the target object small hole image spot in the sub-picture to eliminate the target in the sub-picture The geometrical distortion of the image hole of the object from the center to the periphery.
- a normalization process before stitching the image segments according to the relative positions of the target small hole image spots in the target porous image, a normalization process is further included, and the normalization process includes:
- the target image of is normalized by normalization of brightness, contrast and imaging resolution, so that the average brightness and contrast variance of the target image are within a preset range, so that the imaging resolution is a standard value.
- the method before stitching the target small hole image spot after the inverted image correction based on the stitching parameters of the matrix-type porous imaging system, the method further includes: a three-dimensional reconstruction process based on a multi-eye vision method.
- the 3D reconstruction process includes recovering the depth information of each point on the target according to the arrangement information of the small holes and the parallax.
- the present application also provides an image processing device including: a target porous image acquisition unit for acquiring a target porous image corresponding to a target using a matrix porous imaging system, the target porous image containing a plurality of target pores Image spot; the target image correction unit, which is used to perform inverted image correction on the target object small hole image spot in the porous image of the target based on the stitching parameters of the matrix porous imaging system, to obtain multiple inverted image corrected targets Small hole image spot; target image stitching unit, used to stitch the small hole image spot of the target object after the inverted image correction based on the stitching parameters of the matrix porous imaging system to generate the target image.
- a target porous image acquisition unit for acquiring a target porous image corresponding to a target using a matrix porous imaging system, the target porous image containing a plurality of target pores Image spot
- the target image correction unit which is used to perform inverted image correction on the target object small hole image spot in the porous image of the target based on the stitching parameters of the
- Figure 1 is a schematic diagram of the imaging principle of a matrix-type small-hole imaging system
- Figure 2 is the complete target image after stitching
- Figure 3 is the porous image of the target obtained by MAPIS
- FIG. 4 Schematic diagram of imaging principle using external light source and preset mode
- FIG. 1 Schematic diagram of imaging principle using external structure light source
- Figure 6 Schematic diagram of imaging principle using built-in light source and preset mode
- Figure 7 Schematic diagram of imaging principle using built-in light source with display function
- Figure 8 Example of display mode of built-in light source
- Figure 9 An example of a bright spot image for scaling the center position of a hole
- Figure 13 uses Figure 3 as the input image and the image obtained by stitching with incorrect Si parameters
- Figure 14 Schematic diagram of brightness attenuation caused by small hole imaging
- 15 is a schematic diagram of geometric distortion caused by imaging through a dielectric layer with different refractive indexes
- Figure 16 Schematic diagram of the principle of geometric distortion in the MAPIS optical path
- 18b is a flowchart of inversion correction of the target small hole image spot in the target porous image
- Fig. 18c is a flow chart of the small hole image spot of the target after the stitching inverted image is corrected
- FIG. 18d is a flowchart of another target porous image processing process provided in this embodiment (where the process in the dotted frame is an optional step);
- FIG. 19 Schematic diagram of the generation of inverted images in small-hole imaging
- Figure 20 Schematic diagram of the inverted image correction method of the small hole image
- Figure 21 Schematic diagram of the field of view and overlapping area on the object surface when imaging in multiple holes
- Figure 22 Porous image of the target after brightness correction (the original image is Figure 3);
- FIG 23 The porous image of the target after the geometric distortion correction (the original image is Figure 3);
- Figure 24 The porous image of the target after the inverted image correction (the original image is Figure 3);
- FIG 25 The stitched image after image enhancement (the original image is Figure 3);
- 26 is a schematic structural diagram of a porous image processing device provided in this embodiment.
- FIG. 27 is a schematic structural diagram of a reverse image correction module 200 according to this embodiment.
- FIG. 28 is a schematic structural diagram of a mosaic parameter acquisition module 400 according to this embodiment.
- FIG. 1 is an imaging principle diagram of the MAPIS porous image in this embodiment.
- the matrix porous imaging system includes a light blocking layer 3 in which a plurality of imaging holes 2 are arranged in a matrix.
- Figure 1 shows two adjacent imaging holes as an example.
- the light of the target object on the object plane 1 irradiates the light blocking layer 3, part of the light is blocked outside the light blocking layer 3, and the other part of the light irradiates the image plane 4 (Image Plane) through the imaging hole 2
- Image Plane image plane 4
- the matrix-type porous imaging system is used for image sampling, and a porous image with a plurality of small-hole image spots arranged in a matrix is obtained.
- This embodiment uses the image obtained by the matrix porous imaging system as an example to illustrate the technical solution of the present application.
- FIG. 3 is a porous image of a target acquired by the matrix porous imaging system shown in FIG. 1, which is a porous image of a fingerprint.
- a plurality of circular small-hole image spots are arranged in a matrix.
- Each small hole image spot can reflect a part of the object field of view, but not the entire object side field of view.
- the method before processing the porous image of the target object, the method further includes the step of acquiring the stitching parameters of the matrix porous imaging system.
- the method of acquiring the stitching parameters includes: acquiring the calculation parameters; using The calculation parameter calculates the splicing parameter.
- the calculation parameter is a preset parameter when designing the matrix porous imaging system, or the calculation parameter is acquired by a method including the following steps, and acquiring the calculation parameter includes: acquiring a standard porous image, the standard porous image includes Preset mode porous image or surface light source porous image; calculate the calculation parameters according to the standard porous image.
- the calculation parameters include the position of the small hole, the object distance, the image distance, the pixel size of the image sensor, the distance between adjacent small holes, and the refractive index of the transparent medium.
- obtaining a preset mode porous image includes: obtaining a preset mode porous image corresponding to the preset mode by using a matrix-type porous imaging system, the preset mode porous image containing a plurality of preset mode pore images.
- the preset pattern is composed of a single pattern including lines in two directions or multiple directions, which are regularly and repeatedly arranged according to a period length, and the period length is a positive integer multiple of the aperture period.
- using the matrix-type porous imaging system to obtain the preset mode porous image corresponding to the preset mode includes: placing a standard object having the preset mode on the image collector of the matrix-type porous imaging system On the surface, illuminate the standard object with the preset mode with an external light source to make a transmission imaging to obtain the preset mode porous image; or, place no object on the surface of the image collector of the matrix porous imaging system, use The external structure light source with a preset mode illuminates the upper surface of the image collector of the matrix porous imaging system, and the external structure light source with a preset mode is imaged by the matrix porous imaging system to obtain the pre Set the mode porous image; or, place the standard object with the preset mode on the upper surface of the image collector of the matrix porous imaging system, and use the built-in light source to illuminate the standard object with the preset mode for reflection imaging to obtain the Preset mode porous image; or, no object is placed on the upper surface of the image collector of the matrix porous imaging system, so that the external structure light source with
- a display screen is used as the external light source, the external structure light source with a preset mode, the internal light source, or the internal light source with display function.
- the use of a matrix porous imaging system to obtain a preset mode porous image corresponding to a preset mode includes: using an external light source and a preset mode imaging, using an external structure light source with a preset mode for imaging, using a built-in light source and a preset mode Imaging, or using the built-in light source with display function.
- the imaging using the external light source and the preset mode includes:
- the external standard light source 13 is used to irradiate the first standard object 12 having a preset pattern to make a transmission image to obtain an image including a transmission image spot, and the image including the transmission image spot is used as the preset pattern porous image.
- the preset mode refers to a specific figure.
- the standard object with the preset mode is a standard object that forms a specific pattern on the surface through a certain process, such as evaporation, etching, printing, etc., such as a film with a specific geometric pattern printed, and a specific geometric figure etched Glass sheet.
- the external light source is a general point light source or a surface light source.
- the imaging using an external structure light source with a preset mode includes:
- the external structure light source 14 with a preset mode is a point light source or a surface light source that can generate a preset mode.
- the external structure light source with a preset mode is imaged by the matrix-type porous imaging system to output the preset mode porous image.
- FIG. 6 is a schematic diagram of imaging using a built-in light source and a preset mode.
- the imaging using the built-in light source and the preset mode includes:
- the second standard 16 with a preset pattern is placed on the surface of the image collector 15 with a built-in light source in the matrix porous imaging system.
- the standard object with a preset mode is irradiated with a built-in light source to reflect and image, and a porous image of the preset mode is output.
- the built-in light source is a point light source or a surface light source provided inside an image collector of a matrix porous imaging system .
- the imaging using the built-in light source with display function includes:
- No objects are placed on the surface of the image collector 17 with a built-in light source of the matrix porous imaging system, so that the built-in light source with a display function emits light reflecting a preset pattern through the surface of the image collector of the matrix porous imaging system , Output the porous image in the preset mode.
- the built-in light source with display function refers to a light source that can be displayed in a preset mode and placed inside the MAPIS collector.
- the built-in light source with display function may be a mobile phone display screen.
- FIG. 8 is an example of a display mode of a built-in light source with a display function.
- the preset mode displayed by the built-in light source with display function is set to the regular "Tian" character.
- the true pinhole position of all imaging pinholes may have an overall translation or rotation error, so the pinhole position in the stitching parameters can be used to design the matrix porous imaging
- the parameters preset in the system can also be determined by calculation using calculation parameters.
- using the calculation parameters to calculate the stitching parameters includes: using the calculation parameters to calculate the aperture position and the maximum non-overlapping image field size; calculating the imaging resolution using the maximum non-overlapping image field size rate.
- FIG. 9 is an example of a multi-hole image of a surface light source containing a plurality of bright-field small-hole image spots.
- the calculation of the position of the small hole using the calculation parameters includes: obtaining a porous image of a surface light source using a matrix porous imaging system; and using the porous image of the surface light source on the porous image of the surface light source An arbitrary point is used to establish a rectangular coordinate system for the origin; the position of the small hole is determined, and the position of the small hole is the corresponding coordinate of the geometric center of the bright field small hole image spot in the rectangular coordinate system.
- a rectangular coordinate system is established by using the vertex at the upper left corner of the porous image of the surface light source as an origin, so as to visually represent the position of each imaging hole.
- a solid circle can be used to fit the image spot of each imaging aperture, and the center of the solid circle is used as the geometric center of the image aperture of the aperture to obtain the position of the aperture.
- acquiring the porous image of the surface light source includes: forming a porous image of the surface light source under a uniform surface light source lighting condition using a matrix-type porous imaging system, the porous image of the surface light source containing a plurality of bright field small hole image spots.
- each small hole image spot 10 on the image plane 4 is defined as a field of view on image plan (FOVI).
- FOVI field of view on image plan
- Each small hole image spot 10 corresponds to an area on the object plane, and is referred to as a field of view on object plane 6 (FOVO).
- FOVO field of view on object plane 6
- the object-side field of view 6 of adjacent imaging apertures overlaps, that is, the information on the image spots of adjacent apertures is redundant, as shown in FIG. 21.
- the entire object-side field of view is evenly divided according to the imaging aperture, so that each point in the object-side field of view is assigned to the closest imaging aperture, and the object-side field of view area of the imaging aperture obtained in this way is divided defined as the maximum object side non-overlapping fields of view 7 (maximum non-overlapping FOV on Object Plane, MNFOVO), which is referred to as a size S o.
- the image field of view corresponding to each maximum non-overlapping object field of view 7 is defined as the maximum non-overlapping image field of view 9 (Maximum Non-overlapping FOV on Image Plane, MNFOVI), and its size is denoted as S i .
- Figure 1 shows the relationship between them.
- MAPIS products calibrate the S i value when they leave the factory.
- the image distance ID does not change, but some user operations will change the object distance OD.
- the value of S i needs to be recalibrated.
- MAPIS is combined with a mobile phone screen to form an image acquisition device, or in the case of mounting a MAPIS image acquisition device under the mobile phone screen, if the user sticks a film on the surface of the mobile phone screen, the object distance will be changed, which will change the S i value of the system .
- the calculation of the maximum non-overlapping image field size using the calculation parameters includes: measuring the maximum non-overlapping image field size from a preset mode porous image; or, using the calculation parameters The object distance and the image distance are calculated to obtain the maximum non-overlapping image field size; or, the stitching effect of the small hole image spot in the preset mode is optimally estimated to obtain the maximum non-overlapping image field size.
- the maximum non-overlapping view fields image size S i includes a preset mode in a porous measurement image from:
- the preset pattern may be composed of a single pattern containing lines in two directions or multiple directions, which are regularly and repeatedly arranged according to the cycle length, as shown in FIG. 10, FIG. 11, and FIG. 12.
- the period length is a positive integer multiple of the aperture period 8, for example, in FIG. 10, the period length is the distance between the geometric centers of two adjacent squares, and the period length is positive of the aperture period 8 Integer multiple.
- the object distance OD and image distance ID are expressed by the following formula (2) and formula (3),
- ID ID 0 + ⁇ ID formula (2)
- ID 0 represents the preset image distance value
- OD 0 represents the preset object distance value
- ⁇ ID is the processing error of the image distance in the production process
- ⁇ OD is the processing error of the object distance in the production process
- ⁇ OD is the object The amount of change after leaving the factory.
- the object distance OD and image distance ID of MAPIS can be accurately known, or the design parameters of ID 0 and OD 0 and the change of object distance after delivery ⁇ OD are known , and the processing errors ⁇ ID and ⁇ OD can be ignored, then the calculating a first preset rule S i.
- the maximum non-overlapping image field size is calculated using the object distance and the image distance in the calculation parameters, specifically calculated according to the following formula (4):
- the value range of the object distance change ⁇ OD and processing error ⁇ ID and ⁇ OD after leaving the factory is can be more accurately known, it can be estimated by S i optimal splicing.
- S i optimal splicing I.e., the actual object (such as a fingerprint) imaging, the contrast will be obvious to try every possible value S i splicing, splicing evaluate the effects, the selection of the optimum value, i.e., the preset pattern image patch apertures
- the optimal stitching effect is estimated to obtain the largest non-overlapping image field size.
- the possible value of S i is determined according to the value range of the object distance change ⁇ OD and the processing error ⁇ ID and ⁇ OD .
- the imaging resolution of the MAPIS is obtained according to the following formula (5) using the maximum non-overlapping image-side field size.
- R is the imaging resolution of the MAPIS
- S p is the pixel size of the image sensor
- S p is a parameter preset during the design of the matrix porous imaging system.
- the calculation of the splicing parameters using the calculation parameters of the matrix-type porous imaging system further includes: calculating the brightness correction parameters and distortion correction parameters using the calculation parameters.
- the small hole imaging itself will cause the brightness of each small hole image spot to decay from the center to the periphery
- the brightness of each small hole image spot from the center to the periphery of the porous image collected by the MAPIS image acquisition device is inconsistent, as shown in the figure 14 shown. If the brightness of the porous image is not corrected, the target image obtained by stitching will have the problem of uneven brightness.
- the method before merging the image segment according to the relative position of each target small hole image spot in the target porous image, the method further includes: dividing the target porous image into several sub-pictures according to the position of the small hole, There is only one complete target small hole image spot on each sub-picture; use the brightness correction parameters to adjust the gray value of pixels in the target small hole image spot to eliminate the target small hole image spot in the sub-picture
- the brightness from the center to the periphery is attenuated, so that the brightness of the target small hole image spot in the sub-picture is uniform from the center to the periphery.
- the calculation of the brightness correction parameters using the calculation parameters includes:
- the brightness correction parameter is calculated according to the image distance in the calculation parameters and the pixel size of the image sensor, specifically,
- E x represents the illuminance at a point X on the small hole image spot with a distance of x from the center of the small hole
- E o represents the illuminance at the center of the small hole image spot
- ⁇ is the line connecting the X point to the center of the small hole and the small hole light
- the included angle of the axis that is, ⁇ 2 in FIG. 16, the ⁇ of each point on the small hole image can be different from the object point OD, the image distance ID, the refractive index n 1 , n 2 of the transparent medium, and the current point on the image plane.
- the distance y i of the hole center is calculated.
- 1 / cos 4 ⁇ be the brightness correction parameter. Therefore, the brightness after X point correction is calculated according to formula (7):
- I ′ x is the brightness after correction
- I x is the brightness before correction
- the calculation of the brightness correction parameters using the calculation parameters includes: acquiring a standard porous image using a matrix porous imaging system; acquiring a small hole image spot of a preset pattern or a bright field from the standard porous image; Obtaining the preset mode pixels from the preset mode small hole image spot or bright field small hole image spot; obtaining the target object pixel from the target object small hole image spot; measuring the preset mode pixel and the target Object pixels are compared and analyzed to obtain brightness correction parameters.
- I ′ x is the brightness after correction
- I x is the brightness before correction
- T o is the brightness value at the center of the brightness attenuation template
- T x is the brightness value at point X in the brightness attenuation template.
- the luminance correction parameter becomes T o / T x.
- FIG. 15 is a small hole image spot obtained by using a preset pattern without distortion correction.
- the MAPIS image acquisition device When the MAPIS image acquisition device is working, the light reaches the image sensor from the surface of the object through the small hole. Due to the penetration of the dielectric layer with different refractive index, there is a certain geometric distortion of the image, as shown in Figure 15, if the distortion is not corrected, The stitched image will have a certain degree of distortion and aliasing.
- the method before merging the image segment according to the relative position of each target small hole image spot in the target porous image, the method further includes: segmenting the target porous image into several sub-pictures according to the position of the small hole, each There is one and only one complete target hole image spot on each sub-picture; use distortion correction parameters to adjust the position of pixels in the target object hole image spot in the sub-picture to eliminate the target object hole image spot in the sub-picture Geometric distortion from center to periphery.
- the calculation of the distortion correction parameters using the calculation parameters includes: obtaining a standard porous image with a matrix porous imaging system; obtaining a small hole image spot of a preset pattern from the standard porous image or Bright field small hole image spots; obtaining preset mode pixels from the preset mode small hole image spots or bright field small hole image spots; obtaining target object pixels from the target object small hole image spots; It is assumed that the pattern pixels and the target object pixels are geometrically matched to obtain matching point pairs; the positions of the matching point pairs are obtained; the position differences of the matching point pairs are analyzed and measured to obtain distortion correction parameters for each pixel.
- FIG. 16 is a schematic diagram of small-hole image spot distortion.
- the transparent medium I from the object plane 1 to the light blocking layer 3 has a refractive index of n 1
- the transparent medium II and the refractive index is n 2
- y o is the distance from the object side point to the center of the small hole
- y i is the distance from the image side point to the center of the small hole
- OD and ID are the object distance and image distance of MAPIS
- ⁇ 1 represents the incident angle
- ⁇ 2 represents Exit angle.
- Formula (12) can be obtained from Formula (9), Formula (10) and Formula (11):
- y i does not change linearly with y o . Therefore, when the object square point is imaged through the small hole at different positions from the center of the small hole, the magnification is different and there is distortion.
- Fig. 17 shows the change curve of y i with y o . As shown in Fig. 17, when n 1 < n 2 , the correction parameters of each position on the small hole image can be estimated. which is
- (x i , y i ) is the coordinate before correction of a certain point on the small hole image spot
- (x ′ i , y ′ i ) is the corrected coordinate of that point
- C x, y is the correction parameter, which is related to the distance from the point (x i , y i ) to the center of the small hole.
- the calculating the distortion correction parameters using the calculation parameters includes: calculating the distortion correction parameters using the object distance, the image distance, and the refractive index of the transparent medium in the calculation parameters, specifically, calculating according to formula (14). If the structure of the MAPIS system does not conform to FIG. 16, the formula (14) needs to be adjusted according to the actual structure.
- the matrix porous imaging system is used to obtain a preset pattern porous image, and the pattern image contained in each target small hole image spot in the target porous image is compared with the preset pattern image, and the difference is analyzed and measured to obtain the value of each point.
- the distortion correction parameters it may be assumed that a target small hole image spot is obtained as shown in FIG. 15, and the preset mode small hole image spot is shown in FIG. 12.
- a point-by-point correspondence can be obtained; for regions lacking geometric features, the correspondence can be obtained by interpolation.
- FIG. 18a is a flowchart of a method for processing a porous image of a target obtained by MAPIS in this embodiment. The method of this embodiment will be described with reference to FIG. 18a.
- the porous image of the target refers to a porous image of the target obtained by using MAPIS
- the porous image of the preset mode refers to a porous image of a standard object having a preset mode obtained by using MAPIS.
- S100 uses a matrix-type porous imaging system to acquire a target porous image corresponding to the target, and the target porous image contains a plurality of target small hole image spots.
- the inverted image correction may be an inverted image correction of the target small hole image spot in the target porous image, or a part of the target small hole image spot in the target porous image Perform reverse image correction.
- S300 stitches the target small hole image spot after the inverted image correction to generate the target image.
- the stitching may be stitching of the target small hole image spots after the inverted image correction, or may be stitching on a part of the target small hole image spots after the inverted image correction.
- the target object hole image spot may have any shape.
- the small hole image spot is circular or square.
- One is to facilitate the manufacture of matrix-type porous imaging systems, and the other is that regular shaped spots are easier to perform operations such as image segmentation, inverted image correction, and stitching.
- FIG. 18b is a flowchart of image inversion correction on the target small hole image spot in the target porous image.
- image inversion correction on the small hole image spot in the porous image includes:
- S201 divides the porous image of the target into several sub-pictures according to the positions of the small holes, and each sub-picture has one and only one complete image spot of the small hole of the target.
- S202 Acquire position coordinates of pixels on the target small hole image spot in the rectangular coordinate system with the center of the target small hole image spot as the origin.
- a rectangular coordinate system is established with the center of the target small hole image spot as the origin, and the position of each pixel is represented by its corresponding position coordinate in the rectangular coordinate system.
- the position coordinates of the pixel are flipped symmetrically about the center of the origin to obtain the target small hole image spot after the inverted image correction.
- the pixels on the target small hole image spot are symmetrically reversed about the center of the origin to obtain the target small hole image spot after the inverted image correction.
- FIG. 20 is a schematic diagram of center-symmetrical flipping in this embodiment.
- a rectangular coordinate system is established with the center of the target small hole image spot as the origin, and each pixel corresponds to a position coordinate (x, y) and a gray value i;
- the position coordinates corresponding to the pixels are flipped symmetrically with respect to the center of the origin, that is, (x, y, i) becomes (-x, -y, i), and the target small hole image spot after the inverted image correction is obtained.
- the inverted porous image of the target obtained by using FIG. 3 as the original image is shown in FIG. 24.
- FIG. 18c is a flow of stitching the target small hole image spots after the inverted image correction in a achievable manner.
- stitching the target small hole image spots after the inverted image correction includes:
- S301 Take an image segment from the target small hole image spot, the center of the image segment is the same as the center of the target small hole image spot after the inverted image correction, and the size of the image segment is the largest without overlap Image field size; specifically, taking the geometric center of the target small hole image spot corrected for each inverted image as the center, taking the size from the target small hole image spot exactly equal to the matrix porous imaging
- the image segment of the system's largest non-overlapping image-side field size S i The image segment of the system's largest non-overlapping image-side field size S i .
- the image segments are combined according to the relative positions of the target small hole image spots in the target porous image to generate a complete target image.
- the stitching of the target small hole image spot corrected by the inverted image in S300 includes:
- An image segment is taken from the target small hole image spot, the center of the image segment is the same as the center of the target small hole image spot after the inverted image correction, and the size of the image segment is larger than the largest non-overlapping image
- the size of the square field of view specifically, taking the center of each small hole image spot corrected by the inverted image as the center, the size of the largest non-overlapping image square view of the matrix aperture imaging system is taken from the small hole image spot Field-sized image segments, so that there is information overlap in the peripheral part of adjacent image segments, the information refers to the image information on the image segments; according to the relative position of each target small hole image spot in the target porous image Image fragment.
- the stitching the image segment according to the relative position of each target small hole image spot in the target porous image includes: for information that does not overlap in adjacent image segments, retain the original information;
- the overlapping information in adjacent image segments is weighted average or optimally retained.
- the optimal information is retained according to a preset rule.
- the preset rule may be to preferentially select the point with the highest contrast with its neighborhood or to select the highest brightness. Point.
- FIG. 18d is a flowchart of another porous image processing method provided in this embodiment.
- the method includes: small-hole inverted image correction and image stitching, and the small-hole inverted image correction refers to the target small hole Invert image correction for speckles, so that the stitching of your double eyelid images refers to the image stitching of the target small hole image spots after the inverted image correction.
- the correction of the inverted image of the small hole further includes one or more steps of image segmentation at the small hole level, correction of the brightness distortion of the small hole, correction of the geometric distortion of the small hole, three-dimensional reconstruction of the small hole and depth calculation.
- stitching the target small hole image spot after the inverted image correction, after generating the target image may also include stitching image enhancement and segmentation and image normalization One or more steps.
- the present inventors have found that, if taken as the only spot size of each object in the hole exactly image segment S i, the target image mosaic obtained easily generated blockiness where image spots of adjacent target was contact holes. Therefore, if the acquisition range of each target small hole image spot is extended to make the size of the obtained image segment larger than S i , it will make the adjacent image segments have partial overlap information on the content, and then overlap
- the weighted average of information or the optimal retention according to preset rules can make the transition of the target image content more smooth and natural, and avoid the blockiness in the stitching process.
- the image processing method further includes a brightness correction process according to formula (7) or (8), so that each target object pore image spot in the target porous image is from the center to the periphery The brightness attenuation is corrected to the uniform brightness of each individual small hole image spot.
- the brightness correction is performed before dividing the target porous image into several sub-pictures.
- the image processing method further includes a distortion correction process according to formula (13), formula (14), or (15), thereby eliminating each target pore in the target porous image The geometric distortion of the image spot from the center to the periphery.
- the distortion correction is performed after brightness correction, before segmenting the porous image of the target into several sub-pictures.
- FIG. 1 As the original target porous image, the brightness of the target porous image is corrected first, and the result is shown in FIG. 22, and then the distortion correction is performed on the target porous image after brightness correction, and the result is shown in FIG.
- the target porous image processing method further includes image enhancement processing and image segmentation processing, so that the target image is easy to recognize.
- the image enhancement processing may use a histogram equalization method.
- FIG. 25 Exemplarily, the image obtained by image enhancement using FIG. 3 as the original image is shown in FIG. 25.
- the image segmentation process can eliminate the interference of the environment on the imaging of the target object.
- the image processing method further includes normalization processing.
- the normalization process is to normalize the brightness, contrast and imaging resolution of the target image respectively, so that the average brightness and contrast variance of the target image are within a preset range, and the imaging resolution is a preset standard value.
- the normalized target image can facilitate subsequent identification or other applications.
- the gray scale and the variance of the gray scale are normalized according to the following formula (16):
- I ′ (x, y) (I (x, y) - ⁇ ) * ⁇ ideal / ⁇ + ⁇ ideal formula (16)
- ⁇ and ⁇ are the grayscale mean and grayscale variance of the target image before normalization, and ⁇ ideal and ⁇ ideal are preset grayscale mean and grayscale variance.
- I (x, y) is the gray value of the (x, y) point on the target image before normalization
- I ′ (x, y) is the gray of the (x, y) point on the target image after normalization Degree value. Since gray scale corresponds to brightness, the variance of gray scale corresponds to contrast, so the above formula normalizes brightness and contrast.
- the imaging resolution is standardized according to the following formula (17):
- R is the imaging resolution of the target image before normalization
- R ideal is the standard value of the preset imaging resolution
- the image processing method further includes a three-dimensional reconstruction process based on a multi-eye vision method before segmenting the target multi-hole image into several sub-pictures according to the positions of small holes.
- a three-dimensional reconstruction process based on a multi-eye vision method includes recovering the depth information of each point on the target according to the arrangement information of the small holes and the parallax.
- a point on the target will form multiple images with parallax through multiple imaging holes, using the information of these multiple images and the object distance, image distance, hole spacing of the matrix porous imaging system, etc.
- the parameter recovers the depth information of the points on the target, and normalizes and outputs the depth information of all points on the target to obtain a complete target image.
- FIG. 26 is a schematic structural diagram of the porous image processing device provided in this embodiment.
- the device includes: a target porous image acquisition module 100 for acquiring a target porous image corresponding to a target using a matrix porous imaging system, the target porous image containing a plurality of target pore image spots
- Inverted image correction module 200 which is used to perform inverted image correction on the target small aperture image spot based on the stitching parameters of the matrix-type porous imaging system, to obtain multiple inverted image corrected target small aperture image spots; the target image
- the generating module 300 is used for stitching the target small hole image spot after the inverted image correction based on the stitching parameters of the matrix porous imaging system to generate the target image.
- FIG. 27 is a schematic structural diagram of an inverted image correction module 200.
- the inverted image correction module 200 includes: an image segmentation unit 201, which is used to divide the target object according to the position of the small hole The porous image is divided into several sub-pictures, and each sub-picture includes a complete small hole image spot; the pixel determining unit 202 is used to establish a rectangular coordinate system with the center of the small hole image spot as the origin on each sub-image, Obtain the position and gray value of each pixel, and the position of each pixel is represented by its corresponding position coordinate in the rectangular coordinate system; the inversion correction unit 203 is used to make the pixel on the small hole image spot The center of the origin is symmetrically reversed to obtain the target small hole image spot after the inverted image correction.
- the target image generation module 300 includes: an image segment interception unit for extracting an image segment from the target object aperture image spot, the center of the image segment and the inverted The center of the small hole image spot of the target after image correction is the same, and the size of the image segment is greater than or equal to the maximum non-overlapping image field size; The relative position of the image fragments is combined to generate a complete target image. If there is information overlap between adjacent image fragments, the original information is retained for the information that does not overlap in the adjacent image fragments, and for the information that overlaps in the adjacent image fragments, Do the weighted average or keep the best. In particular, keep the best according to a preset rule.
- the preset rule may be to preferentially select the point with the highest contrast with its neighborhood or preferentially select the point with the highest brightness.
- the device further includes a splicing parameter acquisition module 400 for acquiring splicing parameters.
- a splicing parameter acquisition module 400 for acquiring splicing parameters.
- FIG. 28 is a schematic structural diagram of the stitching parameter acquisition module 400.
- the stitching parameter acquisition module 400 includes a calculation parameter acquisition unit 401 for acquiring calculation parameters; stitching parameter measurement Unit 402 is configured to calculate the splicing parameters using the calculation parameters.
- the calculation parameter acquisition unit 401 includes a standard porous image acquisition subunit for acquiring a standard porous image, and the standard porous image includes a preset pattern porous image or a surface light source porous image; a calculation parameter measurement subunit is used for calculating Standard multi-hole images calculate the calculation parameters.
- the standard porous image acquisition sub-unit includes a preset mode porous image acquisition slave unit for acquiring a preset mode porous image corresponding to a preset mode using a matrix porous imaging system, the preset mode porous image contains multiple presets Mode small hole image spot; surface light source porous image acquisition slave unit for forming a surface light source porous image using a matrix type porous imaging system under uniform surface light source lighting conditions, the surface light source porous image containing a plurality of bright field small hole image spots .
- the preset mode porous image acquisition slave unit includes at least one of the following preset mode porous image acquirers:
- the first preset mode porous image acquirer is used to place the standard object with the preset mode on the upper surface of the image collector of the matrix porous imaging system, and irradiate the standard object with the preset mode with an external light source to make it Transmission imaging to obtain the porous image in the preset mode;
- the second preset mode porous image acquirer is used to irradiate the image acquisition of the matrix porous imaging system with an external structure light source having a preset mode without placing any object on the upper surface of the image collector of the matrix porous imaging system The upper surface of the device, so that the external structure light source with a preset mode is imaged by the matrix porous imaging system to obtain the preset mode porous image;
- the third preset mode porous image acquirer is used to place the standard object with the preset mode on the upper surface of the image collector of the matrix porous imaging system, and irradiate the standard object with the preset mode with a built-in light source to make it reflect Imaging to obtain the porous image in the preset mode;
- the fourth preset mode porous image acquirer is used to place no object on the upper surface of the image collector of the matrix porous imaging system, so that the built-in light source with a display function emits light with a preset mode to illuminate the matrix porous imaging
- the upper surface of the image collector of the system is reflected and imaged to obtain the porous image in the preset mode.
- the stitching parameter measurement unit 402 includes: a small hole position acquisition subunit, a maximum non-overlapping image side field size acquisition subunit, and an imaging resolution acquisition subunit.
- the small hole position acquisition subunit includes: a surface light source porous image acquisition slave unit for acquiring a surface light source porous image using a matrix-type porous imaging system; a rectangular coordinate system establishing a slave unit for use in the surface light source porous image, A rectangular coordinate system is established by taking any point on the porous image of the surface light source as the origin; the pinhole position determining slave unit is used to determine the pinhole position, and the pinhole position is the geometric center of the bright field pinhole image spot The corresponding coordinates in the rectangular coordinate system are described.
- the maximum non-overlapping image side field size acquisition subunit includes at least one of the following slave units: a maximum non-overlapping image side field size measurement slave unit for measuring the maximum non-overlapping image from a preset mode porous image Square field of view size; maximum non-overlapping image field field size calculation slave unit for calculating the maximum non-overlapping image field field size using the object distance and image distance in the calculation parameters; maximum non-overlapping image field field size
- the optimal estimation slave unit is used for optimally estimating the stitching effect of the small hole image spots in the preset mode to obtain the maximum non-overlapping image field size.
- the splicing parameter measurement unit 402 further includes a brightness correction parameter acquisition sub-unit, which is used to obtain brightness correction parameters and distortion correction parameter acquisition sub-units, which are used to obtain distortion correction parameters.
- the device further includes a normalization processing module 500, which is used to normalize the brightness, contrast and imaging resolution of the stitched target image, so that all The average brightness and contrast variance of the target image are within a preset range, so that the imaging resolution is a standard value.
- a normalization processing module 500 which is used to normalize the brightness, contrast and imaging resolution of the stitched target image, so that all The average brightness and contrast variance of the target image are within a preset range, so that the imaging resolution is a standard value.
- the device further includes a three-dimensional reconstruction module 600 based on a multi-eye vision method, which is used to recover the depth of each point on the target according to the arrangement information of the small holes and the parallax information.
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Abstract
Description
Claims (26)
- 一种图像处理方法,其特征在于,包括:利用矩阵式多孔成像***获取目标物对应的目标物多孔图像,所述目标物多孔图像含有多个目标物小孔像斑;基于矩阵式多孔成像***的拼接参数,对所述目标物小孔像斑进行倒像纠正,得到多个倒像纠正后的目标物小孔像斑;基于矩阵式多孔成像***的拼接参数,对倒像纠正后的目标物小孔像斑进行拼接,生成目标图像。
- 根据权利要求1所述的方法,其特征在于,在对所述目标物小孔像斑进行倒像纠正之前还包括获取拼接参数。
- 根据权利要求2所述的方法,其特征在于,所述获取拼接参数包括:获取计算参数;使用所述计算参数计算得到拼接参数。
- 根据权利要求3所述的方法,其特征在于,所述计算参数为在设计所述矩阵式多孔成像***时预设的参数。
- 根据权利要求3所述的方法,其特征在于,所述获取计算参数包括:获取标准多孔图像,所述标准多孔图像包括预设模式多孔图像或者面光源多孔图像;根据所述标准多孔图像测算所述计算参数。
- 根据权利要求5所述的方法,其特征在于,获取预设模式多孔图像包括:利用矩阵式多孔成像***获取预设模式对应的预设模式多孔图像,所述预设模式多孔图像含有多个预设模式小孔像斑。
- 根据权利要求5所述的方法,其特征在于,获取面光源多孔图像包括:利用矩阵式多孔成像***在均匀面光源发光条件下形成面光源多孔图像,所述面光源多孔图像含有多个亮场小孔像斑。
- 根据权利要求6所述的方法,其特征在于,所述预设模式由包含两个方向或者多个方向线条的单个模式按照周期长度重复排布构成。
- 根据权利要求8所述的方法,其特征在于,所述周期长度是小孔周期的正整数倍。
- 根据权利要求6所述的方法,其特征在于,所述利用矩阵式多孔成像***获取预设模式对应的预设模式多孔图像包括:将具有预设模式的标准物放置于矩阵式多孔成像***的图像采集器上表面,利用外置光源照射所述具有预设模式的标准物使之透射成像,获得所述预设模式多孔图像;或者,在矩阵式多孔成像***的图像采集器上表面不放置任何物体,利用具有预设模式的外置结构光源照射所述矩阵式多孔成像***的图像采集器上表面,使所述具有预设模式的外置结构光源通过所述矩阵式多孔成像***成像,获得所述预设 模式多孔图像;或者,将具有预设模式的标准物放置于矩阵式多孔成像***的图像采集器上表面,利用内置光源照射所述具有预设模式的标准物使之反射成像,获得所述预设模式多孔图像;或者,在矩阵式多孔成像***的图像采集器上表面不放置任何物体,使具有显示功能的内置光源发出具有预设模式的光线照射所述矩阵式多孔成像***的图像采集器上表面反射成像,获得所述预设模式多孔图像。
- 根据权利要求10所述的方法,其特征在于,使用显示屏作为所述外置光源、所述具有预设模式的外置结构光源、所述内置光源或所述具有显示功能的内置光源。
- 根据权利要求3所述的方法,其特征在于,使用所述计算参数计算得到拼接参数包括:使用所述计算参数计算得到小孔位置和最大无重叠像方视场尺寸;使用所述最大无重叠像方视场尺寸计算成像分辨率。
- 根据权利要求12所述的方法,其特征在于,所述使用所述计算参数计算得到小孔位置包括:利用矩阵式多孔成像***获取面光源多孔图像;在所述面光源多孔图像上,以所述面光源多孔图像上任意一点为原点建立直角坐标系;确定小孔位置,所述小孔位置为亮场小孔像斑的几何中心在所述直角坐标系中对应的坐标。
- 根据权利要求12所述的方法,其特征在于,所述使用所述计算参数的计算最大无重叠像方视场尺寸包括:从预设模式多孔图像中测量得到最大无重叠像方视场尺寸;或者,利用所述计算参数中的物距和像距计算得到最大无重叠像方视场尺寸;或者,对所述预设模式小孔像斑的拼接效果进行最优估计得到最大无重叠像方视场尺寸。
- 根据权利要求1所述的方法,其特征在于,对所述目标物小孔像斑进行倒像纠正包括:根据所述小孔位置将所述目标物多孔图像分割为若干子图,每个子图上有且只有一个完整的目标物小孔像斑;获取所述目标物小孔像斑上的像素在以所述目标物小孔像斑的中心为原点的直角坐标系中的位置坐标;将所述像素的位置坐标做关于所述原点的中心对称翻转,得到倒像纠正后的目标物小孔像斑。
- 根据权利要求1或15所述的方法,其特征在于,所述对倒像纠正后的 目标物小孔像斑进行拼接包括:从所述目标物小孔像斑中取出一个图像片段,所述图像片段的中心与所述倒像纠正后的目标物小孔像斑的中心相同,所述图像片段的尺寸为最大无重叠像方视场尺寸;根据目标物多孔图像中各目标物小孔像斑的相对位置拼合所述图像片段。
- 根据权利要求1或15所述的方法,其特征在于,所述对倒像纠正后的目标物小孔像斑进行拼接包括:从所述目标物小孔像斑中取出一个图像片段,所述图像片段的中心与所述倒像纠正后的目标物小孔像斑的中心相同,所述图像片段的尺寸大于最大无重叠像方视场尺寸;根据目标物多孔图像中各目标物小孔像斑的相对位置拼合所述图像片段。
- 根据权利要求17所述的方法,其特征在于,根据目标物多孔图像中各目标物小孔像斑的相对位置拼合所述图像片段包括:对于相邻图像片段中不重叠的信息,保留原信息;对于相邻图像片段中重叠的信息,做加权平均或根据拼接效果保留最优。
- 根据权利要求3所述的方法,其特征在于,所述使用所述计算参数计算得到拼接参数还包括:使用所述计算参数计算得到亮度矫正参数和畸变矫正参数。
- 根据权利要求19所述的方法,其特征在于,使用所述计算参数计算得到亮度矫正参数包括:根据所述计算参数中的像距和图像传感器的像元尺寸计算得到亮度矫正参数;或者,用矩阵式多孔成像***获取标准多孔图像;从所述标准多孔图像中获取预设模式小孔像斑或者亮场小孔像斑;从所述预设模式小孔像斑或者亮场小孔像斑中获取预设模式像素;从所述目标物小孔像斑中获取目标物像素;测量所述预设模式像素和所述目标物像素并对比分析,获得亮度矫正参数。
- 根据权利要求19所述的方法,其特征在于,在根据目标物多孔图像中各目标物小孔像斑的相对位置拼合所述图像片段之前,还包括:根据所述小孔位置将所述目标物多孔图像分割为若干子图,每个子图上有且只有一个完整的目标物小孔像斑;使用亮度矫正参数调整所述目标物小孔像斑中像素的灰度值,以消除所述子图中目标物小孔像斑由中心向外周的亮度衰减,使得所述子图中目标物小孔像斑由中心向外周的亮度均匀。
- 根据权利要求19所述的方法,其特征在于,所述使用所述计算参数计算得到畸变矫正参数包括:利用所述计算参数中的物距、像距、透明介质折射率计算获得畸变矫正参数;或者,用矩阵式多孔成像***获取标准多孔图像;从所述标准多孔图像中获取预设模式小孔像斑或者亮场小孔像斑;从所述预设模式小孔像斑或者亮场小孔像斑中获取预设模式像素;从所述目标物小孔像斑中获取目标物像素;对所述预设模式像素与所述目标物像素进行几何特征匹配,获得匹配点对;获得匹配点对的位置;对所述匹配点对的位置差异进行分析测量,获得每个像素的畸变矫正参数。
- 根据权利要求19所述的方法,其特征在于,在根据目标物多孔图像中各目标物小孔像斑的相对位置拼合所述图像片段之前还包括:根据所述小孔位置将所述目标物多孔图像分割为若干子图,每个子图上有且只有一个完整的目标物小孔像斑;使用畸变矫正参数调整所述子图中目标物小孔像斑中像素的位置,以消除所述子图中目标物小孔像斑由中心向外周的几何畸变。
- 根据权利要求18所述的方法,其特征在于,在根据目标物多孔图像中各目标物小孔像斑的相对位置拼合所述图像片段之前还包括归一化处理,所述归一化处理包括:将拼接后的目标图像进行亮度、对比度及成像分辨率标准化归一化,使得所述目标图像的平均亮度以及对比度方差在预设范围内,使得成像分辨率为标准值。
- 根据权利要求1所述的方法,其特征在于,在对倒像纠正后的目标物小孔像斑进行拼接之前还包括:基于多目视觉方法的三维重建过程,所述三维重建过程包括根据小孔排布信息及视差恢复出目标物上各点的深度信息。
- 一种图像处理装置,其特征在于,包括:目标物多孔图像获取单元,用于利用矩阵式多孔成像***获取目标物对应的目标物多孔图像,所述目标物多孔图像含有多个目标物小孔像斑;目标图像纠正单元,用于基于矩阵式多孔成像***的拼接参数,对所述目标物多孔图像中的目标物小孔像斑进行倒像纠正,得到多个倒像纠正后的目标物小孔像斑;目标图像拼接单元,用于基于矩阵式多孔成像***的拼接参数,对倒像纠正后的目标物小孔像斑进行拼接,生成目标图像。
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