WO2020099947A1 - 一种电镀装置及电镀方法 - Google Patents

一种电镀装置及电镀方法 Download PDF

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Publication number
WO2020099947A1
WO2020099947A1 PCT/IB2019/057073 IB2019057073W WO2020099947A1 WO 2020099947 A1 WO2020099947 A1 WO 2020099947A1 IB 2019057073 W IB2019057073 W IB 2019057073W WO 2020099947 A1 WO2020099947 A1 WO 2020099947A1
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WO
WIPO (PCT)
Prior art keywords
anode
unit
electroplating
tank
plating solution
Prior art date
Application number
PCT/IB2019/057073
Other languages
English (en)
French (fr)
Inventor
李勤东
吕政修
王彦智
Original Assignee
盛青永致半导体设备(苏州)有限公司
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Publication of WO2020099947A1 publication Critical patent/WO2020099947A1/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/06—Filtering particles other than ions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating

Definitions

  • the invention belongs to the field of electroplating, and relates to an electroplating device and an electroplating method.
  • the existing circuit board plating methods used vertical continuous plating and gantry plating, all of which used the capillary nozzle as the agitation method, which was difficult to ensure that the nozzle flow rate of each nozzle was the same.
  • the jet flow is offset by the plating liquid in the tank, and the mixing efficiency is not good.
  • the nozzle mechanism and pipeline must occupy a large volume in the tank.
  • its pumps and filters also need to be comparable to the site.
  • the existing electroplating tanks are currently large, and the minimum amount of electroplating solution necessary to establish cyclic electroplating during copper plating is large, thereby increasing production costs.
  • an electroplating device including: a tank for storing an electroplating solution; a carrying unit for carrying an object to be plated, and the carrying unit 1 is movable Suspended in the tank; and at least one anode unit, which rotates into the tank; wherein, at least one anode unit is used to perform a swinging action in a controlled manner to disturb the electroplating Liquid, so that the plating solution continuously flows on the surface of the object to be plated.
  • At least one of the anode units includes a linking member located in the tank and at least one anode member rotatably connected to the linking member, the linking member is controlled to drive at least one anode The piece performs the swinging motion.
  • at least one of the anode units includes a plurality of the anode members, a plurality of the anode members Parallel to each other and rotatably connected to the linking member; wherein, the linking member is driven to drive a plurality of the pole pieces to perform a symmetrical swinging action to disturb the plating solution and cause the plating solution Continuously flows on the surface of the object to be plated.
  • At least one of the anode units includes a plurality of the anode pieces, and the plurality of the pole pieces are juxtaposed with each other and rotatably connected to the linking member; wherein; the linking # Driven to drive the plurality of anode members to perform an asymmetrical swinging action to disturb the plating solution, so that the plating solution continuously flows on the surface M of the object to be plated.
  • the anode member includes a supporting back plate, an anode bag or ion exchange membrane, a soluble or insoluble anode, and a spoiler.
  • the soluble or insoluble anode is disposed in the anode bag or ion exchange membrane, the anode A bag or an ion exchange membrane is fixed on the support back plate, the spoiler includes one or more blades, the spoiler is fixed on the support back plate, and the support back plate is rotatably connected to the support back plate Linking parts.
  • the electroplating device includes a plurality of anode units, and the carrying unit is located between two adjacent anode units.
  • the electroplating apparatus further includes a driving unit, which is suspended from the tank and movably connected to the carrying unit, and the driving unit is controlled to drive the carrying unit to perform a rotating action. More preferably, the turning motion is synchronized and the same as the swing motion.
  • the electroplating device further includes: a filtering unit that communicates with one end of the tank; a circulation unit that communicates with the filtering unit; and a temporary storage unit that respectively communicates with the electroplating tank Communicating with an electroplating circulation unit; wherein, the circulation unit obtains the electroplating solution in the tank through the temporary storage unit, and filters the electroplating solution through the filtering unit and the filtered electroplating solution It is supplied into the tank.
  • an electroplating method including the following steps: carrying a to-be-plated object through a carrying unit; by suspending the carrying unit in a tank; and By controlling at least one anode unit to perform a swinging action to disturb the electroplating solution in the tank, the electroplating solution continuously flows on the surface of the object to be plated.
  • the step of controlling at least one of the anode units to perform the swinging action to disturb the plating solution in the tank so that the plating solution continuously flows on the surface of the object to be plated
  • the method further includes the following steps: controlling the linking member to drive the plurality of anode members to perform a symmetrical swing or an asymmetrical swing to disturb the plating solution.
  • the electroplating method further includes the following steps: driving the carrying unit to perform a rotating action by controlling the driving unit.
  • the present invention adopts the above scheme, and has the following points compared with the prior art:
  • the electroplating device and the electroplating method provided by the present invention > It suspends the carrying unit movably in the tank body. It is rotatably located in the tank and the pole unit is controlled to swing to disturb the electroplating solution to continuously flow the surface of the object to be plated, so as to provide a novel electroplating device and method, and at the same time, it can also be improved The efficiency and quality of electroplating.
  • FIG. 1 is a schematic top view of the electroplating apparatus of Example 1;
  • FIG. 2 is a schematic cross-sectional view of the electroplating apparatus of Example 1;
  • FIGS. 3a, 3b, and 3c are a schematic top view, a front schematic view, and a cross-sectional view of the anode member of Embodiment 1, respectively.
  • 4 is a schematic top view of the electroplating apparatus of Example 2;
  • FIG. 5 is another schematic top view of the electroplating apparatus of Example 2;
  • FIG. 1 is a schematic top view of the electroplating apparatus of Example 1;
  • FIG. 2 is a schematic cross-sectional view of the electroplating apparatus of Example 1;
  • FIGS. 3a, 3b, and 3c are a schematic top view, a front schematic view, and a cross-sectional view of the anode member of Embodiment 1, respectively.
  • 4 is a schematic top view of the electroplating apparatus of Example 2;
  • FIG. 5 is another schematic top view
  • FIG. 6 is a schematic top view of the electroplating apparatus of Example 3;
  • FIG. 7 is an embodiment 4
  • Side view schematic diagram of the electroplating device 8 is a schematic top view of the electroplating device of Example 4;
  • FIG. 9 is a schematic structural view of the electroplating device of Example 5;
  • FIGS. 10a and 10b are schematic top views of the electroplating device of Example 6;
  • FIG. 11 is a plating method of the example
  • FIG. 12 is a second flowchart of the electroplating method of the embodiment. among them:
  • Electroplating device 0, tank; 11, bearing unit;] 2, anode unit;] 20, linkage; 12], pole piece; 121A, anode piece; 121B, anode piece; 121 1, support back Plate; 1212, soluble or insoluble anode; 1213, anode bag; 1214, spoiler paddle; 13, drive unit; 14, filter unit; 15, circulation unit; 16, temporary storage unit;
  • FIGS. 1 and 2 are a schematic plan view and a schematic cross-sectional view of an electroplating apparatus according to Embodiment 1, respectively.
  • an electroplating apparatus L provided in this embodiment includes a tank 10, a carrying unit 11 and at least one anode unit 12.
  • the tank 10 stores the plating solution 2.
  • the carrying unit n can be movably suspended in the tank 10, and the carrying unit n carries the object 3 to be plated.
  • At least one anode unit 12 is rotatably located in the tank body 10.
  • the electroplating apparatus 1 of the present invention includes a tank 10, a carrying unit 11 and at least one anode unit 12.
  • the tank body 10 ' is a liquid storage tank that stores the plating solution 2.
  • the carrying unit 11 may be an existing jig or jig, and the object to be plated 3 is clamped and fixed by dry, and the object to be plated 3 is a conductor, such as a silicon wafer, a printed circuit board and other metal plates.
  • the carrying unit 11 can be suspended in the tank 10 and immersed in the plating solution 2.
  • the anode unit 12 is detachably suspended or capable of rotatably disposed in the groove 10, and immersed in the plating solution 2; and the anode unit 12 as one exemplary embodiment of the present-embodiment is not limited thereto.
  • the anode unit 12 will be controlled to perform a continuous swinging action to continuously disturb the electroplating solution 2 in the tank 10 and increase the flow rate of the electroplating solution 2 , So that the electroplating solution 2 can continue to flow uniformly on the surface M of the object 3 to be plated, so that the electroplating substance in the electroplating solution 2 can completely fill the micro through holes on the surface of the object 3 without leaving air holes , Improve the polarization effect and the drop of concentration gradient in the electroplating process.
  • the electroplating apparatus 1 of this embodiment can provide a novel electroplating apparatus in the technical field through the above structural design; at the same time, it can also improve the efficiency and quality of electroplating.
  • at least one anode unit 12 includes a linking member located in the tank 10; 120 and a pole member 121 movably connected to the linking member 120, the linking # 120 is controlled to drive the anode The member 121 performs a swinging action.
  • the anode unit 12 of the present invention includes a linking member 120 and an anode member: L21, the anode member 121 may be like a shuttered linking structure, but not limited to this; the anode member 121 may include a soluble or insoluble anode And its anode bag, ion exchange membrane (ion-exchange membrane), and its structural support, but not limited to this.
  • the linking member 120 can be suspended on the tank body 10 or a supporting member suspended outside the tank body 10, and the anode member 121 is pivotally connected to the linking member 120 and positioned in the tank body 10.
  • the actuator 120 (such as a motor, but not limited to this) drives the linkage member 120 to drive the anode member 121 to swing, so as to continuously disturb the plating solution 2 in the tank 10, so that the plating solution 2 can continue And it flows evenly on the surface of the object 3 to be plated.
  • 3a to 3c show a specific structure of an anode member 121 using ffl in this embodiment.
  • the actuator 120 includes a pole member supporter 1211 m, the anode bag 1212> Division 'soluble or insoluble anode, and a spoiler paddle 1213] 214.
  • the anode bag 1212 is sleeved on the soluble or insoluble anode 1213 and fixed on the supporting back plate mi; the spoiler 1214 includes one or more blades arranged in parallel, the spoiler 1214 is fixed on the supporting back plate 1211 and is located at a distance On the side closer to the object 3 to be plated on the carrying unit 11; specifically, the support back plate 1211 is pivotally connected to the linking member 120.
  • the blades in this embodiment extend in the vertical direction. In other embodiments, the blades can extend in the horizontal direction.
  • the anode bag 1212 described above can be replaced with an ion exchange membrane.
  • At least one pole unit 12 includes a plurality of anodes # 121 A, 121B, and the plurality of anode members 121A, 121B are juxtaposed to each other and rotatably connected to the linking member 120.
  • the linking member 120 is driven and a plurality of anode members 121 A and 121 B perform a symmetrical swinging action to disturb the plating solution 2 so that the plating solution 2 continuously flows on the surface of the object 3 to be plated.
  • the at least one anode unit 12 of this embodiment may further include a plurality of anode members 121A, 121B, which can be connected to the interlocking member 120 in parallel with each other.
  • the electroplating apparatus 1 of this embodiment is performing an electroplating process, and the linking member 120 will be controlled to drive the multiple anode members 12iA, 121B to perform continuous swinging motions, and the swinging motions are symmetrical swinging, for example, together Rotate in the needle direction or counterclockwise to continuously disturb the plating solution 2 in the tank 10 and increase the flow rate of the plating solution 2 so that the plating solution 2 can flow continuously and uniformly on the surface of the object to be plated 3 .
  • at least one anode unit 12 includes a plurality of anode members 121A, 121B. The plurality of anode members 121A, 121B are juxtaposed to each other ii.
  • the stem linkage member 120 is rotatably connected. Wherein, the link member 20 is driven to carry a plurality of anode members 121A, 121B to perform an asymmetrical swinging action to disturb the plating solution 2 so that the plating solution 2 continuously flows on the surface of the object 3 to be plated.
  • the multiple anode members 121A, 121B of the at least one anode unit 12 of this embodiment can also be driven by the linkage member 120 to exhibit an asymmetrical swing action, for example, one of the anode members mA rotates clockwise , The other anode member 121B rotates counterclockwise to continuously disturb the plating solution 2 in the tank 10, increasing the flow rate of the plating solution 2, so that the plating solution 2 can be continuously and uniformly Surface flow.
  • FIGS. 6 and 7 are a schematic top view and a schematic side view of the electroplating apparatus of Embodiment 3, respectively.
  • the electroplating apparatus of this embodiment is similar to the operation of the same elements in the electroplating apparatus of Embodiment 2 and Embodiment 2 above, and will not be repeated here.
  • the difference is that, in this embodiment, at least one anode unit 12 includes a plurality of anode members 121, and the plurality of anode members 121 are juxtaposed with each other to connect the sub-linkage member 120.
  • the linking member 120 is driven to carry a plurality of anode members 121 to perform a reciprocating swinging action in the first direction or the second direction, so as to disturb the plating solution 2 so that the plating solution 2 is continuously on the surface of the object 3 to be plated ⁇ ⁇ Surface flow.
  • at least one anode unit 12 of this embodiment may further include a plurality of anode members 121.
  • each anode member 121 and the interlocking member can be formed at an angle 0 between 120 , wherein each anode member 121 and the interlocking member can be formed at an angle 0 between 120 ,
  • the included angle 0 is between 0 and 179 degrees
  • the included angle 0 1 formed by each pole piece 121 and the link member 120 may be the same as each other, partially the same or different from each other;
  • the link member 120 may be a movable element, Suspended on the trough body 10 or the support portion other than the trough body 10.
  • an actuating device such as a motor, but not limited to this
  • an actuating device can drive the linking member 120 to swing left and right, so that the linking member 120 can drive more
  • Each I® pole piece 121 performs a reciprocating swinging action in the first direction (for example, the left-right direction), thereby achieving the effect of disturbing the plating solution 2, so that the plating solution 2 can continuously flow on the surface of the object to be plated 3, in addition, As shown in FIG.
  • a plurality of anodes # 121 of this embodiment may also be arranged in an oblique arrangement on the linking member 120 in an up-and-down stacking manner; wherein, an angle e may be formed between each anode member 121 and the linking member 120, The included angle e is between 0 and 179 degrees, and the included angle e formed by each anode member 121 and the linking member 120 may be the same as each other, partially the same, or different from each other.
  • the linking member 120 when the electroplating process is performed, the linking member 120 can be driven to swing up and down by the actuating device, and the linking member 120 can drive the plurality of anode members m in the second direction (for example, up and down direction) A reciprocating swinging action is performed to further disturb the plating solution 2.
  • FIG. 8 is a schematic top view of the electroplating apparatus of Embodiment 4.
  • the electroplating device of the present embodiment is similar to the operation of the same elements in the electroplating devices of the foregoing embodiments, and will not be repeated here.
  • the electroplating apparatus 1 further includes a driving unit 3, which is suspended from the tank 10 and movably connected to the carrying unit: 1 1.
  • the driving unit 13 is controlled to drive the carrying unit 11 to proceed One turning action. Among them, the turning action is synchronized with the swinging fraud and the same.
  • the electroplating device 1 of this embodiment further includes a driving unit 13, which may be similar to the driving device of the louver; but it is not limited thereto.
  • the drive unit 3 can also be suspended from the tank body 10 and is rotatably connected to the bearing unit 1]. Therefore, in the electroplating apparatus i of this embodiment, during the electroplating process, the driving unit 13 can also be controlled while the linking member 120 drives the anode member m to swing and continuously disturb the electroplating solution 2 in the tank 10
  • the bearing unit 11 is driven to rotate; and i, the rotation direction of the bearing unit 1 1 may be the same as the swing direction of the pole piece 121. In this way, not only can the plating solution 2 be allowed to continuously and uniformly flow to the surface of the object to be plated 3, but also the effect of electric field balance can be achieved.
  • the electroplating apparatus 1 of this embodiment is not limited to the above-mentioned embodiment, that is, the rotation of the carrying unit 11 The direction can also be different from the swing direction of the anode piece 21
  • FIG. 9 is a schematic structural diagram of an electroplating apparatus of Embodiment 5.
  • the electroplating apparatus of this embodiment is similar to the operation of the same elements in the above-mentioned electroplating apparatuses, which will not be repeated here. The difference is that, in this embodiment, the electroplating apparatus 1 further includes a filtering unit 14, a circulation unit 15, and a temporary storage unit 16.
  • the filter unit M communicates with one end of the tank body 10.
  • the circulation unit 15 communicates with the filter unit 14.
  • the temporary storage unit 16 communicates with the tank body 10 and the circulation unit 15 respectively.
  • the circulation unit 15 obtains the plating solution 2 in the tank body 0 through the temporary storage unit 16, and filters the plating solution 2 through the filtering unit 14 and supplies the filtered plating solution 2 to the tank body 10.
  • the electroplating apparatus 1 of this embodiment may further include a filtering unit 14, a circulation unit 15, and a temporary storage unit 16.
  • the filter unit 14 may be a filter assembly
  • the circulation unit 15 is a circulation pump
  • the temporary storage unit 16 is a liquid temporary storage tank to store the plating solution 2, but not limited to this.
  • the filtering unit 14 may be located at the lower end of the tank body 10 and connected to the tank body 10 and communicate with the inside of the tank body 10.
  • the temporary storage unit 16 may be located at the lower end of the tank body 10 and connected to the tank body 10 and communicate with the inside of the tank body 10.
  • the circulation unit 15 is located between the filter unit 14 and the temporary storage unit 16, and is connected and communicated with the filter unit 14 and the temporary storage unit 16. Therefore, during the electroplating process of the electroplating apparatus 1, the temporary storage unit 16 can supply the electroplating solution 2 into the tank 10 from the upper end of the tank 10; and the filter unit 14 sucks or receives the tank 10 from the lower end of the tank 10 15. The electroplating solution 2 in the filter, and filter out foreign substances or impurities, and then send the filtered electroplating solution 2 to the circulation unit; 15.
  • the circulation unit 15 sends the filtered electroplating solution 2 to the temporary storage unit 16 for storage or supply to the tank 10 again.
  • the temporary storage unit] 6 weeks in the installation position and direction of the delivery port for supplying the plating solution 2 to the tank 10 can be adapted to the installation method of the anode unit 12 of the foregoing embodiments, and can be appropriately changed to make the plating The effect can be more significant.
  • FIGS. 10 a and 10 b are schematic top views of the electroplating apparatus of Embodiment 6.
  • FIG. 10a the electroplating apparatus of this embodiment is similar to the operation of the same elements in the electroplating apparatus of the foregoing embodiments, and will not be repeated here. The difference is that, in this embodiment, the electroplating apparatus includes a plurality of anode units 12, and each anode unit 12 includes at least one anode member 121, respectively.
  • the carrying unit n is located between two adjacent anode units 12.
  • both surfaces of the object to be plated 3 on the carrying unit n need to be electroformed for each object to be plated 3 or each surface to be plated of the object to be plated 3 is respectively arranged opposite to an anode unit 12.
  • the anode unit 12 is driven to reciprocate linear movement, and the movement direction of the anode unit 12 is perpendicular to the surface M to be plated 3 to disturb the electroplating solution 2 so that the electroplating solution 2 continues to The surface of the plating object 3 or the two surfaces of the object to be plated 3 flow.
  • Each anode unit 12 also includes a linking member 120, which can be a movable element, suspended on a support member other than the tank 10 or the tank] 0, the anode member 21 is pivotally connected to the corresponding ⁇ ⁇ ⁇ 121 ⁇ The linkage 121.
  • the linking member 120 is driven to reciprocate linearly (as shown by the arrow in FIG. 10a), and the process of the linking # 120 causes the anode # 121 to rotate to disturb the plating solution 2 so that the plating solution 2 continues to The surface of each object to be plated 3 or the two surfaces of the object to be plated 3 flow. Further, as shown in FIG.
  • the electroplating apparatus includes a plurality of anode units 12, each anode unit 12 includes a plurality of anode members 121, and the plurality of anode members 121 are juxtaposed with each other and pivotally connected to the linking member 120.
  • a plurality of anode members 121 can be arranged obliquely and arranged side by side on the linking member 120 in a side-by-side arrangement, wherein an angle e can be formed between each anode member 121 and the linking member 120, the angle e between 0-179 degrees, and the angle e formed by each anode # 12] and the linking member 120 may be the same as each other, partially the same, or different from each other; the linking member 120 may be a movable element, suspended from the tank 10 Or on the support member other than the tank 10.
  • One object 3 to be plated is provided on both sides of the carrier unit n, or both surfaces of the object 3 to be plated on the carrier unit n need to be plated, and each object 3 to be plated or each object 3 to be plated is to be plated Table M is respectively arranged opposite to one anode unit 12. Therefore, the linking members 120 of the two anode units 12 can be driven to reciprocate linearly move (as shown by the arrow in FIG.
  • the two linking members 120 respectively drive the plurality of anode members 121 along the first direction Or rotate in the second direction; thereby achieving the effect of disturbing the electroplating solution 2, so that the electroplating solution 2 can continue to flow on the surfaces of the two objects 3 to be plated [or the two surfaces M of the object 3 to be plated 3].
  • the electroplating method of the present invention may include the following steps: Step S40: carrying the object to be plated by the carrying unit; Step S4h by suspending the carrying unit in the tank; and Step S42: by controlling at least An I® pole unit swings to disturb the plating solution in the tank, and the plating solution continuously flows on the surface of the object to be plated.
  • the method further includes the following steps: step S420; control The linking member moves multiple pole units to perform symmetrical or asymmetrical oscillation to disturb the plating solution.
  • the electroplating method of the present invention further includes the following steps: Step S43: Drive the carrier unit to rotate by controlling the driving unit.
  • the electroplating device and the electroplating method provided by the present invention can be movably suspended in the tank body 10 through the “bearing unit 11, and the bearing unit 11 carries the object to be plated 3”, “the anode
  • a novel electroplating device and electroplating method are provided, and at the same time, the electroplating efficiency can also be improved.
  • the present invention provides a plating apparatus and a plating method of the "pole unit 2 can be rotated in position ⁇ dry socket member 10""at least one anode electrode unit 12 includes a linkage member 10 is located in groove 120 of And the anode member 121 that can be movably connected to the linking member 120, and the linking member 120 is controlled to drive the anode member 121 to swing ”and“ the anode unit 12 is controlled to swing to disturb the plating solution 2 so that "The plating solution 2 continues to flow on the surface of the object to be plated 3" and other novel technical solutions to provide users with a novel plating apparatus 1 and plating method.
  • the anode 121 can be connected by The driving of the moving member 120 continuously disturbs the electroplating solution 2, so that the electroplating solution 2 can continuously and uniformly flow on the surface of the object 3 to be plated.
  • the above-mentioned embodiment is only for explaining the technical concept and features of the present invention; it is a preferred embodiment, which is that people familiar with this technology can understand the content of the present invention and implement it accordingly, and cannot limit the present invention by this Scope of protection. All equivalent changes or modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

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  • Chemical Kinetics & Catalysis (AREA)
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Abstract

一种电镀装置（1）及电镀方法。所述电镀装置（1）包括槽体（10）、承载单元（11）与阳极单元（12）。槽体（10）储存电镀液（2）。承载单元（11）能活动地悬设于槽体（10）中，承载单元（11）承载待镀物（3）。阳极单元（12）能转动地位于槽体（10）。其中，阳极单元（12）受控制地进行摆动动作，以扰动电镀液（2），而使电镀液（2）持续地于待镀物（3）的表面流动，提升电镀的效率与质量。

Description

一种电镀装置及电镀方法 技术领域
本发明属于电镀领域， 涉及一种电镀装置及电镀方法。
背景技术
随着印刷电路板的体积微小化，印刷电路板面临了许多制程上的困难，需要克服通孔变小、 宽高比提高等 n槛才能确保电路板的效能与功用。 前， 现有的电路板电镀方式有采用垂直连续式电镀及龙门式电镀， 皆以采羯喷管以啧流 形式作为其搅拌方式， 此方式难以确保各喷管喷流流量一致， 喷流形式的扰动方式， 其喷流受 到槽内电镀液体抵消， 搅拌效率不佳。且喷管机构及管路必需占用槽内较大的体积。且其泵与 过滤机也需 ^羯相当的场地。 再者， 目前现有的电镀槽体较大， 镀铜时建立循环电镀所必需的最少电镀液量较大， 进而 增加生产成本。
发明内容
针对上述技术问题， 本发明提供了一种电镀装置及电镀方法。 为达到上述目的， 本发明采用的一种技术方案为： 一种电镀装置， 包括： 槽体， 其用于储存电镀液； 承载单元， 其用于承载待镀物， 所述承载单元 1可活动地悬设予所述槽体中； 以及 至少一个阳极单元， 其司转动地位子所述槽体中； 其中， 至少一个所述阳极单元用于受控制地进行一摆动动作， 以扰动所述电镀液， 而使 所述电镀液持续地子所述待镀物的表面流动。 优选地，至少一个所述阳极单元包括位于所述槽体的连动件以及能转动地连接于所述连 动件的至少一个阳极件， 所述连动件受控制而带动至少一个所述阳极件迸行该摆动动作。 在一更优选的实施例中， 至少一个所述阳极单元包括多个所述阳极件， 多个所述阳极件 彼此并列且能转动地连接于所述连动件； 其中， 所述连动件受驱动而带动多个所述 极件进 行对称摆动的动作， 以扰动所述电镀液， 而使所述电镀液持续地于所述待镀物的表面流动。 在另一更优选的实施例中， 至少一个所述阳极单元包括多个所述阳极件， 多个所述 极 件彼此并列且能转动地连接于该连动件； 其中； 所述连动#受驱动而带动多个所述阳极件进 行一非对称摆动的动作， 以扰动所述电镀液， 而使所述电镀液持续地于所述待镀物的表 M流 动。 更优选地， 所述阳极件包括支撑背板、 阳极袋或离子交换膜、 可溶或不溶性阳极以及扰 流桨， 可溶或不溶性阳极设置于所述阳极袋或离子交换膜中， 所述阳极袋或离子交换膜固定 在所述支撑背板上， 所述扰流桨包括一或多个叶片， 所述扰流桨固定在支撑背板上， 所述支 撑背板可转动地连接予所述连动件。 在一优选的实施例中， 所述电镀装置包括多个所述阳极单元， 所述承载单元位于相邻两 个所述阳极单元之间。 优选地， 所述电镀装置还包括一个驱动单元， 其悬设于所述槽体并活动地连接于所述承 载单元， 所述驱动单元受控制而驱使所述承载单元进行一转动动作。 更优选地， 所述转动动作与所述摆动动作同步且相同。 在一优选的实施例中， 所述电镀装置还包括： 过滤单元， 其与所述槽体的一端连通； 循环单元， 其与所述过滤单元连通； 以及 暂存单元， 其分别与电镀槽体及电镀循环单元连通； 其中， 所述循环单元通过所述暂存单元取得所述槽体中的所述电镀液， 并通过所述过滤 单元过滤所述电镀液且将过滤后的所述电镀液供给至所述槽体中。 本发明采用的另一种技术方案为： 一种电镀方法， 包括下列步骤： 通过承载单元承载待镀物； 通过将所述承载单元悬设于槽体中； 以及 通过控制至少一个阳极单元进行摆动动作， 以扰动所述槽体中的电镀液， 而使所述电镀 液持续地于所述待镀物的表面流动。 优选地， 在通过控制至少一个所述阳极单元进行所述摆动动作， 以扰动所述槽体中的所 述电镀液， 而使所述电镀液持续地于所述待镀物的表面流动的步骤中， 还进一步包括下列步 骤； 控制连动件带动多个阳极件进行一对称摆动或一非对称摆动的动作，以扰动所述电镀液。 优选地， 所述电镀方法还包括下列步骤： 通过控制驱动单元而驱使所述承载单元进行一转动动作。 本发明采用以上方案， 相比现有技术具有如下 «点： 本发明所提供的电镀装置及电镀方法: >其通过将承载单元活动地悬设于槽体中承载单元 承载待镀物、 阳极单元可转动地位于槽体以及 极单元受控制地进行摆动动作以扰动电镀液 而使电镀液持续地子待镀物的表面流动， 以提供一种新颖的电镀装置及电镀方法， 同时， 也 能提升电镀的效率与质量。
附图说明
为了更清楚地说明本发明的技术方案，下面将对实施例描述中所需要使用的附图作简单地 介绍， 显而易见地， 下面描述中的附图仅仅是本发明的一些实施例， 对于本领域普通技术人员 来讲， 在不付出创造性劳动的前提下， 还可以根据这些附图获得其他的附图。 图 1为实施例 1的电镀装置的俯视示意图； 图 2为实施例 1的电镀装置的剖视示意图； 图 3a、 3b、 3c分别为实施例 1的阳极件的俯视示意图、 正面示意图及剖视示意图； 图 4为实施例 2的电镀装置的其中一俯视示意图； 图 5为实施例 2的电镀装置的另一俯视示意图； 图 6为实施例 3的电镀装置的俯视示意图； 图 7为实施例 4的电镀装置的侧视示意图 图 8为实施例 4的电镀装置的俯视示意图； 图 9为实施例 5的电镀装置的结构示意图； 图 10a和 10b分别为实施例 6的电镀装置的俯视示意图； 图 11为实施例的电镀方法的第一种流程图； 图 12为实施例的电镀方法的第二种流程图。 其中：
1、 电镀装置； ］ 0、 槽体； 11、 承载单元； ］ 2、 阳极单元； ］20、 连动件； 12］、 极件; 121A、 阳极件； 121B、 阳极件； 121 1、 支撑背板； 1212、 可溶或不溶性阳极； 1213、 阳极袋; 1214、 扰流桨； 13、 驱动单元； 14、 过滤单元； 15、 循环单元； 16、 暂存单元；
2、 电镀液；
3、 待镀物。
具体实施方式
下面结合附图对本发明的较佳实施例进行详细阐述，以使本发明的优点和特征能更易于被 本领域的技术人员理解。 在此需要说明的是， 对于这些实施方式的说明用子帮助理解本发明， 但并不构成对本发明的限定。此夕卜， 下面所描述的本发明各个实施方式中所涉及到的技术特征 只要铍此之间未构成冲突就可以互相结合。 应当可以理解的是，虽然本文中使周到了“第一”、“第二”、“第:三”等术语来描述各种组件， 但这些组件不应受这些术语的限制。这些术语主要是用以区分一组#与另一组件。另外， 本文 中所使用的术语“或”， 应视实际情况可能包括相关联的列出项目中的任一个或者多个的组合。
实施例 1 图 1及图 2分别为实施例〗的电镀装置的俯视示意图及剖视示意图。 如图 1及图 2所示， 本实施例提供的一种电镀装置 L 其包括槽体 10、 承载单元 11与至少一个阳极单元 12。 槽体 10储存电镀液 2。 承载单元 n能活动地悬设于槽体 10中， 承载单元 n承载待镀物 3。 至少 一个阳极单元 12能转动地位于槽体 10。其中，至少一个阳极单元 12受控制地进行摆动动作， 以扰动电镀液 2， 而使电镀液 2持续地干待镀物 3的表面流动。 具体而言， 本发明的电镀装置 1包括了槽体 10、 承载单元 11与至少一个阳极单元 12。槽 体 10司 '为液体储存槽， 储存电镀液 2。 承载单元 11可为现有的治具或夹具， 用干夹持并固定 待镀物 3， 待镀物 3为导体， 例如硅晶圆、 印刷电路板等金属板材。 承载单元 11可悬吊于槽 体 10内， 并浸于电镀液 2中。 阳极单元 12可拆卸且能转动地悬吊或设置于槽体 10内， 并浸 于电镀液 2中； 上述阳极单元 12作为本实施例中的 ·个示例， 不以此为限。 因此， 本实施飼的电镀装置 1在进行电镀制程时， 阳极单元 12会受控制而迸行持续性的 摆动动作， 以不断地扰动槽体 10中的电镀液 2， 增加电镀液 2的流动率， 而使得电镀液 2能 持续地 i均匀地于待镀物 3 的表 M流动， 进而能将电镀液 2 中的电镀物质完全填满待镀物 3 表面上的微通孔而不留气洞， 改善电镀过程中的极化效应及药液浓度梯度的落差。 藉此，本实施例的电镀装置 1能通过上述的结构设计，在本技术领域中提供一种新颖的电 镀装置； 同时， 也能提丹电镀的效率与质量。 在其中一较佳的实施方式中，至少一个阳极单元 12包括位于槽体 10的连动件; 120以及能 活动地连接于连动件 120的 极件 121， 连动 # 120受控制而带动阳极件 121进行摆动动作。 也就是说， 本发明的阳极单元 12包括了连动件 120与阳极件 : L21 , 阳极件 121可如同百叶窗 的连动结构， 但不以此为限； 阳极件 121可包括可溶性或不溶性的阳极及其阳极袋、 离子交换 膜 (ion-exchange membrane)， 与其结构支撑件， 但不以此为限。 连动件 120能悬吊于槽体 10 或悬吊于槽体 10之外的支撑部件上， 而阳极件 121枢接于连动件 120且位予槽体 10内中。因 此， 通过一致动装置 (如马达， 但不以此为限) 驱使连动件 120带动阳极件 121进行摆动， 以 不断地扰动槽体 10中的电镀液 2,而使得电镀液 2能持续地且均匀地于待镀物 3的表面流动。 图 3a至图 3c示出了本实施例采 ffl的一种阳极件 121的具体结构。结合图 3a至图 3c所示， 极件 m包括支撑背板 121 1 , 阳极袋 1212> 司 '溶或不溶性阳极 1213 以及扰流桨］214。 阳 极袋 1212套于可溶或不溶性阳极 1213上并固定在支撑背板 mi上；扰流桨 1214包括一或多 个并列设置的叶片， 扰流桨 1214固定在支撑背板 1211上， 并位于距离承载单元 11上的待镀 物 3较近的一侧上； 具体为支撑背板 1211枢接于连动件 120。 如图 3b和图 3c所示， 本实施 例中的叶片沿竖直方向延伸。 而在另外一些实施例中， 叶片能够沿水平方向延伸。 上述的阳极 袋 1212可替换为离子交换膜。 实施例 2 图 4及图 5分别为实施例 2的电镀装置的其中一俯视示意图及另一俯视示意图。 如图 4 和图 5所示， 本实施例的电镀装置与上述实施例］ 的电镀装置中相同的元件的动作方式相似， 在此不再赘述。区别在于：在本实施例中，至少一个 极单元 12包括多个阳极# 121 A、 121B， 多个阳极件 121A、 121B彼此并列且能转动地连接于连动件 120。 其中， 连动件 120受驱动而 帯多个阳极件 121 A、 121 B进行一对称摆动的动作， 以扰动电镀液 2, 而使电镀液 2持续地于 待镀物 3的表面流动。 举倒而言， 本实施例的至少一个阳极单元 12进一步可包括多个阳极件 121A、 121B， 其 能以彼此并列的方式连接于连动件 120。 因此； 本实施例的电镀装置 1在进行电镀制程 ， 连 动件 120会受控制而带动多个阳极件 12iA、 121B进行持续性的摆动动作， 且摆动动作呈对称 的摆动， 例如， 一同朝顺 针方向转动或朝逆时针方向转动， 以不断地扰动槽体 10中的电镀 液 2, 增加电镀液 2的流动率， 而使得电镀液 2能持续地且均匀地于待镀物 3的表面流动。 在其中一较佳的实施方式中， 至少一个阳极单元 12包括多个阳极件 121A、 121B, 多个 阳极件 121A、 121B彼此并列 ii能转动地连接干连动件 120。 其中， 连动件］ 20受驱动而带多 个阳极件 121A、 121B进行一非对称摆动的动作， 以扰动电镀液 2, 而使电镀液 2持续地于待 镀物 3的表面流动。 也就是说； 本实施例的至少一阳极单元 12的多个阳极件 121A、 121B也能在连动件 120 带动下， 呈现非对称的摆动动作， 例如， 其中一阳极件 mA朝顺时针方向转动， 另一阳极件 121B朝逆时针方向转动， 以不断地扰动槽体 10中的电镀液 2， 增加电镀液 2的流动率， 而使 得电镀液 2能持续地且均匀地于待镀物 3的表面流动。
实施例 3 图 6及图 7分别为实施例 3的电镀装置的俯视示意图以及侧视示意图。如图 6及所示， 本 实施例的电镀装置与上述实施例〗和实施洌 2的电镀装置中相同的元件的动作方式相似，在此 不再赘述。 区别在于， 在本实施飼中， 至少一个阳极单元 12包括多个阳极件 121， 多个阳极 件 121彼此并列 Ji连接子连动件 120。 其中， 连动件 120受驱动而带多个阳极件 121朝第一方 向或第二方向进行往复式的摆动动作， 以扰动电镀液 2, 而使电镀液 2持续地于待镀物 3的表 面流动。 举例而言，本实施例的至少一个阳极单元 12进一步可包括多个阳极件 121。如图 6所示， 多个 极件 12〗司 '倾斜排列 ii以左右排列方式彼此并列设置于连动件 120, 其中， 每个阳极件 121与连动件 120之间可形成一夹角 0 ,夹角 0介于 0〜 179度, i每个 极件 121与连动件 120 所形成的夹角 0 1可彼此相同、 部分相同或彼此不同； 连动件 120可为活动式的元件， 悬设予槽 体 10或槽体 10之外的支撑部仲上。 因此， 本实施例的电镀装置 1在进行电镀制程时， 可通过 -一个致动装置 （如马达， 但不以此为限） 驱使连动件 120进行左右摆动， 而使连动件 120带动 多个 I®极件 121朝第一方向 （例如左右方向） 进行往复式的摆动动作， 进而达到扰动电镀液 2 的效果， 使电镀液 2可持续地于待镀物 3的表面流动， 另外， 如图 7所示， 本实施例的多个阳 极 # 121也可倾斜排列 以上下层叠方式设置于连动件 120; 其中， 每个阳极件 121与连动件 120之间可形成一夹角 e， 夹角 e介于 0〜 179度， 且每个阳极件 121与连动件 120所形成的夹 角 e可彼此相同、 部分相同或彼此不同。 因此， 在本实施例的电镀装置 1 在进行电镀制程 ％ 可通过致动装置驱使连动件 120进行上下摆动，而使连动件 120带动多个阳极件 m朝第二方 向 （例如上下方向） 进行往复式的摆动动作， 进而达到扰动电镀液 2的效果。
实施例 4 图 8为实施例 4的电镀装置的俯视示意图。如图 8所示， 本实施劍的电镀装置与上述各实 施例的电镀装置中相同的元件的动作方式相似， 在此不再赘述。 区别在于， 在本实施例中， 电 镀装置 1还进一步包括驱动单元〗 3 , 其悬设于槽体 10, 并活动地连接于承载单元： 1 1， 驱动单 元 13受控制而驱使承载单元 11进行一转动动作。 其中， 转动动作与摆动动诈同步且相同。 具体而言， 本实施例的电镀装置 1 还进一步包括驱动单元 13 , 其可类似于百叶窗的驱动 装置； 但不以此为限。 驱动单元〗 3 同样能悬挂于槽体 10, 并与承载单元 1］ 可转动地连接。 因此， 本实施例的电镀装置 i在进行电镀制程的过程中， 在连动件 120带动阳极件 m进行摆 动而不断地扰动槽体 10中的电镀液 2的同时， 驱动单元 13也能受控剌而带动承载单元 11进 行转动动作； 并 i, 承载单元 1 1 的转动方向可与 极件 121 的摆动方向相同。 藉此， 不仅能 使电镀液 2能持续地且均匀地予待镀物 3的表面流动， 也能达到电场平衡的功效。 此外， 本实施洌的电镀装置 1并不限于上述的实施方式， 也就是说， 承载单元 11 的转动 方向也能与阳极件〗 21的摆动方向不同
实施例 5 图 9为实施例 5的电镀装置的结构示意图。如图 9所示，本实施例的电镀装置与上述各实 施倒的电镀装置中相同的元件的动作方式相似， 在此不再赘述。 区别在于， 在本实施例中， 电 镀装置 1还进一步包括过滤单元 14、循环单元 15与暂存单元 16。过滤单元 M与槽体 10的一 端连通。 循环单元 15与过滤单元 14连通。 暂存单元 16分别与槽体 10及循环单元 15连通。 其中， 循环单元 15通过暂存单元 16取得槽体〗 0中的电镀液 2， 并通过过滤单元 14过滤电镀 液 2且将过滤后的电镀液 2供给至槽体 10中。 举例而言， 本实施例的电镀装置 1还进一步可包括过滤单元 14、 循环单元 15与暂存单元 16。 其中， 过滤单元 14可为过滤组件， 循环单元 15司为循环泵， 暂存单元 16司为液体暂存 槽， 储存电镀液 2, 但不以此为限。 过滤单元 14可位于槽体 10的下端， 并与槽体 10连接且 与槽体 10内部相通。 暂存单元 16可位于槽体 10的下端， 并与槽体 10连接且与槽体 10内部 相通。 而循环单元 15位于 滤单元 14与暂存单元 16之间， 并与过滤单元 14及暂存单元 16 相接且相通。 因此， 电镀装置 1在进行电镀制程的过程中， 暂存单元 16可由槽体 10的上端将电镀液 2 供给至槽体 10中； 而过滤单元 14由槽体 10的下端吸取或接收槽体 10中的电镀液 2， 并滤除 异物或杂质， 再将过滤后的电镀液 2输送至循环单元; 15。 最后， 循环单元 15将过滤后的电镀 液 2输送至暂存单元 16进行储存或再次供给至槽体 10中。 其中， 暂存单元］ 6周于将电镀液 2供给到槽体 10的输送口的设置位置、方向，可配合前述各实施例的阳极单元 12的设置方式， 作适当性的改变， 以使电镀的效果可更加显著。
实施例 6 图 10a和图 10b为实施例 6的电镀装置的俯视示意图。如图 10a所示， 本实施例的电镀装 置与上述各实施例的电镀装置中相同的元件的动作方式相似， 在此不再赘述。 区别在于， 在本 实施例中， 电镀装置包括多个阳极单元 12, 每个阳极单元 12分别包括至少一个阳极件 121。 承载单元 n位于相邻两个阳极单元 12之间。 承载单元 n的两侧上分别设有一个待镀物 3 , 或承载单元 n上的待镀物 3的两个表面均需电锻 每个待镀物 3或待镀物 3的每个待镀表面 分别与一个阳极单元 12相对设置。 其中， 阳极单元 12受驱动而进行往复式的直线移动， 阳极 单元 12的移动方向垂直于待镀物 3的待镀表 M， 以扰动电镀液 2， 而使电镀液 2持续地于两 个待镀物 3的表面或待镀物 3的两个待镀表面流动。 每个阳极单元 12还分别包括连动件 120, 连动件 120可为活动式的元件， 悬设于槽体 10 或槽体］ 0之外的支撑部件上， 阳极件〗 21枢接于相应的连动件 121。 具体为连动件 120受驱 动而往复直线移动 （如图 10a中箭头所示方向）， 连动 # 120带动阳极 # 121旋转的过程， 以 扰动电镀液 2， 而使电镀液 2持续地于两个待镀物 3的表面或待镀物 3的两个待镀表面流动。 进一步地， 如图 K）b所示， 电镀装置包括多个阳极单元 12, 个阳极单元 12分别包括多 个阳极件 121 , 多个阳极件 121彼此并列且枢接于连动件 120。 多个阳极件 121可倾斜排列且 以左右排列方式彼鹿并列设置于连动件 120, 其中， 每个阳极件 121与连动件 120之间可形成 -一夹角 e,夹角 e介于 0-179度，且每个阳极 # 12］与连动件 120所形成的夹角 e可彼此相同、 部分相同或彼此不同； 连动件 120可为活动式的元件， 悬设于槽体 10或槽体 10之外的支撑部 件上。 承载单元 n的两侧上分别设有一个待镀物 3 , 或承载单元 n上的待镀物 3的两个表面 均需电镀，每个待镀物 3或待镀物 3的每个待镀表 M分别与一个阳极单元 12相对设置。因此， 可驱使两个阳极单元 12的连动件 120进行往复式的直线移动（如图 10b中箭头所示方向）， 而 使两个连动件 120分别带动多个阳极件 121沿第一方向或第二方向旋转；进而达到扰动电镀液 2的效果， 使电镀液 2可持续地于两个待镀物 3的表面［或待镀物 3的两个待镀表 M流动。
上述各实施例在说明本发明的电镀装置 i的整体动作的同 ，虽然也同 ai说明了本发明的 电锻方法， 然而， 为使本发明的电镀方法的步骤能更明确清楚， 进一步说明如下。 图 11及图 12分别为本发明的电镀方法的第一种流程图与第二种流程图。 如图 和图 12 所示， 本发明的电镀方法可包括下列步骤： 步骤 S40: 通过承载单元承载待镀物； 步骤 S4h 通过将承载单元悬设于槽体中； 以及 步骤 S42: 通过控剌至少一个 I®极单元进行摆动动作， 以扰动槽体中的电镀液， 而使电镀 液持续地于待镀物的表面流动。 其中， 在通过控制至少一个阳极单元进行摆动动作， 以扰动槽体中的电镀液， 而使电镀液 持续地于待镀物的表面流动的步骤 S42中， 还进一步包括下列步骤： 步骤 S420； 控制连动件帯动多个 极单元进行对称摆动或非对称摆动的动作， 以扰动该 电镀液。 本发明的电镀方法还进一步包括下列步骤： 步骤 S43 : 通 控制驱动单元而驱使承载单元进行转动动作。
本发明的其中一有益效果在于， 本发明所提供的电镀装置及电镀方法， 其能通过“承载单 元 11能活动地悬设于槽体 10中， 承载单元 11承载待镀物 3”、 “阳极单元 12能转动地位予槽 体 10”以及“阳极单元 12受控剌地进行摆动动作， 以扰动电镀液 2， 而使电镀液 2持续地于待 镀物 3的表面流动”的技术方案， 以提供一种新颖的电镀装置及电镀方法， 同时， 也能提升电 镀的效率。 更进 ·步来说，本发明所提供的电镀装置 1及电镀方法通过“ 极单元〗 2能转动地位干槽 体 10中”、“至少一阳极单元 12包括位于槽体 10的连动件 120以及能活动地连接于连动件 120 的阳极件 121， 连动件 120受控制而带动阳极件 121进行摆动动作”以及“阳极单元 12受控制 地进行摆动动作， 以扰动电镀液 2, 而使电镀液 2持续地于待镀物 3的表面流动”等新颖的技 术方案， 以提供使用者一种新颖的电镀装置 1及电镀方法， 在迸行电镀制程的过程中， 阳极件 121可通过连动件 120的驱动而不断地扰动电镀液 2， 而使得电镀液 2能持续地且均匀地于待 镀物 3的表面流动。 藉此， 不仅能解决现有技术中所存在的缺失， 同时， 也能提丹电镀的效率 与质量。 上述实施例只为说明本发明的技术构思及特点； 是一种优选的实施例， 其 ^的在于熟悉 此项技术的人士能够了解本发明的内容并据以实施， 并不能以此限定本发明的保护范围。 凡 根据本发明的精神实质所作的等效变换或修饰， 都应涵盖在本发明的保护范围之内。

Claims

1、 ·种电镀装置， 其特征在于， 包括： 槽体， 其用于储存电镀液； 承载单元， 其用于承载待镀物， 所述承载单元司活动地悬设干所述槽体中； 以及 至少一个阳极单元， 其可转动地位于所述槽体中； 其中， 至少一个所述阳极单元用于受控制地进行一摆动动作， 以扰动所述电镀液， 而使 所述电镀液持续地于所述待镀物的表面流动。
2、 根据权利要求 1所述的电镀装置， 其特征在于： 至少一个所述阳极单元包括位 于所述槽体的连动件以及能转动地连接于所述连动件的至少一个阳极件，所述连动件受控制 而带动至少一个所述阳极件进行该摆动动作。
3、 根据权利要求 2所述的电镀装置； 其特征在于： 至少一个所述阳极单元包括多 个所述卩日极件， 多个所述阳极件彼此并列且能转动地连接于所述连动 其中， 所述连动件 受驱动而带动多个所述阳极件进行一对称摆动或非对称摆动的动作， 以扰动所述电镀液， 而 使所述电镀液持续地于所述待镀物的表面流动。
4、 根据权利要求 2所述的电镀装置， 其特征在于： 所述阳极件包括支撑背板、 阳 极袋或离子交换膜、 可溶或不溶性阳极以及扰流桨，可溶或不溶性阳极设置于所述阳极袋或 离子交换膜中，所述阳极袋或离子交换膜固定在所述支撑背板上， 所述扰流桨包括一或多个 叶片， 所述扰流桨固定在支撑背板上， 所述支撑背板可转动地连接于所述连动件。
5、 裉据权利要求 ］ 所述的电镀装置， 其特征在于： 所述电镀装置包括多个所述阳 极单元， 所述承载单元位于相邻两个所述阳极单元之间。
6、 根据权利要求 1 所述的电镀装置， 其特征在于： 所述电镀装置还包括一个驱动 单元， 其悬设于所述槽体并活动地连接于所述承载单元， 所述驱动单元受控制而驱使所述承 载单元迸行一转动动作。
7、 裉据权利要求］所述的电镀装置， 其特征在于： 所述电镀装置还包括： 过滤单元， 其与所述槽体的一端连通； 循环单元， 其与所述过滤单元连通； 以及 暂存单元， 其分别与电镀槽体及电镀循环单元连通； 其中，所述循环单元通过所述暂存单元取得所述槽体中的所述电镀液， 并通过所述过滤 单元 滤所述电镀液且将过滤后的所述电镀液供给至所述槽体中。
8、 一种电镀方法， 其特征在于， 包括下列步骤： 通过承载单元承载待镀物； 通过将所述承载单元悬设于槽体中； 以及 通过控制至少一个阳极单元进行摆动动作， 以扰动所述槽体中的电镀液， 而使所述电镀 液持续地于所述待镀物的表面流动。
9、 裉据权利要求 8所述的电镀方法， 其特征在于； 在通过控制至少 ·个所述阳极 单元进行所述摆动动作， 以扰动所述槽体中的所述电镀液，而使所述电镀液持续地于所述待 镀物的表面流动的步骤中， 还进一步包括下列步骤： 控制连动件带动多个阳极件进行一对称摆动或一非对称摆动的动作，以扰动所述电镀液。
10、 根据权利要求 8所述的电镀方法，其特征在于，所述电镀方法还包括下列步骤： 通过控制驱动单元而驱使所述承载单元进行一转动动作。
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