WO2020093664A1 - Led灯丝、灯具及led灯丝的生产工艺 - Google Patents

Led灯丝、灯具及led灯丝的生产工艺 Download PDF

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Publication number
WO2020093664A1
WO2020093664A1 PCT/CN2019/084724 CN2019084724W WO2020093664A1 WO 2020093664 A1 WO2020093664 A1 WO 2020093664A1 CN 2019084724 W CN2019084724 W CN 2019084724W WO 2020093664 A1 WO2020093664 A1 WO 2020093664A1
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WO
WIPO (PCT)
Prior art keywords
pcb substrate
led filament
led
lamp
pin
Prior art date
Application number
PCT/CN2019/084724
Other languages
English (en)
French (fr)
Inventor
张高乐
周康
Original Assignee
杭州明煜光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 杭州明煜光电科技有限公司 filed Critical 杭州明煜光电科技有限公司
Priority to US16/474,780 priority Critical patent/US11028971B2/en
Priority to EP19731866.0A priority patent/EP3677827B1/en
Publication of WO2020093664A1 publication Critical patent/WO2020093664A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/235—Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/02—Wall, ceiling, or floor bases; Fixing pendants or arms to the bases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/50—Light sources with three-dimensionally disposed light-generating elements on planar substrates or supports, but arranged in different planes or with differing orientation, e.g. on plate-shaped supports with steps on which light-generating elements are mounted
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09027—Non-rectangular flat PCB, e.g. circular
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09163—Slotted edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H05K2201/10318—Surface mounted metallic pins

Definitions

  • This application relates to the field of LED lighting, in particular, to the production process of LED filaments, lamps and LED filaments.
  • LED filaments mostly use ceramics, glass, and sapphire as substrates. LED chips are mounted on the substrates, and then the LED chips are turned on with precious metal wires.
  • the existing LED filament has the following defects:
  • the LED filament is easy to cause defects in the production and welding process.
  • Ceramic, glass, sapphire and other substrates are brittle and easy to break, with high transportation and storage costs and low service life.
  • the present application provides a production process of LED filaments, lamps and LED filaments to solve the problems of high production defect rate, high cost, low production efficiency and easy breakage of LED filaments in the prior art.
  • the LED filament includes a PCB substrate and a plurality of LED chips.
  • a connection circuit is provided on the PCB substrate.
  • a positive pin and a negative pin are provided at both ends of the connection circuit.
  • Each LED chip is formed with the connection circuit Electrical connection
  • a fluorescent adhesive layer is provided outside the PCB substrate and the LED chip, and the positive electrode pin and the negative electrode pin are exposed from the fluorescent adhesive layer.
  • the PCB substrate has an arbitrary two-dimensional shape.
  • the PCB substrate has a bar shape.
  • the positive lead and the negative lead can be provided at any position on the PCB substrate.
  • the positive lead and the negative lead are provided at the same end of the PCB substrate.
  • the PCB substrate includes an electrode arm and a connecting arm, one end of the two electrode arms is connected through the connecting arm, and the other ends of the two electrode arms are respectively provided The positive pin and the negative pin.
  • the PCB substrate is integrally cut, or the PCB substrate is formed by splicing the electrode arm and the connecting arm.
  • a socket is provided on the connecting arm, and the socket is exposed from the fluorescent adhesive layer, and a plurality of the LED filaments are inserted and fixed through the socket to form a three-dimensional LED filament.
  • the three-dimensional LED filament can have any size and any shape in a three-dimensional space.
  • the PCB substrate is thermally conductive.
  • the PCB substrate can guide light so that light on one side of the PCB substrate can be transmitted to the other side.
  • the LED chip is connected to at least one side of the PCB substrate, and at least one side of the PCB substrate is provided with a fluorescent adhesive layer to adjust the fluorescent agent in the fluorescent adhesive layer
  • the content of the LED filament is consistent so that the two sides of the LED filament emit light uniformly.
  • the LED chip is connected to one side of the PCB substrate, and a fluorescent adhesive layer is provided on both sides of the PCB substrate, and the content of the fluorescent agent in the fluorescent adhesive layers on both sides is different. Therefore, the two sides of the LED filament emit light uniformly, and preferably the two sides of the LED filament emit light uniformly and uniformly.
  • connection circuit is made by etching.
  • connection circuit is provided on both sides of the PCB substrate, and an LED chip is provided on both sides.
  • the positive lead and the negative lead are soldered on the PCB substrate and extend from the end of the PCB substrate.
  • the positive lead and the negative lead are formed by plating electrodes.
  • the LED chip is connected to the PCB substrate by flip-chip mounting, and the flip-chip chip has no electrical connection pin.
  • a protection circuit or a control circuit is further integrated on the PCB substrate.
  • the PCB substrate is a glass fiber PCB substrate, made of epoxy resin as an adhesive, and simultaneously made of glass fiber cloth as a reinforcing material.
  • This application also provides:
  • the LED lamp includes a lamp holder and the above-mentioned LED filament.
  • the lamp holder is provided with a socket.
  • the LED filament is inserted into the socket to form a detachable electrical connection with the lamp holder.
  • the LED lamps provided by the present application including the above-mentioned LED filaments include but are not limited to the following lamp forms: bulb lamps, ceiling lamps, ceiling lamps, downlights, flat lamps, kitchen lamps, spotlights, and so on.
  • the LED lamps can be installed in but not limited to the following ways: wire hanging type, chain hanging type, pipe hanging type, wall-mounted type, built-in type, ceiling-mounted type or direct attachment type.
  • the installation environment of the LED lamp includes but is not limited to: installation in the ceiling, installation in the wall, installation on the table or installation on the column, etc.
  • This application also provides:
  • LED filament production process including steps:
  • connection circuit is processed on the PCB substrate, and the positive pin and the negative pin are connected at both ends of the connection circuit;
  • the LED chip is electrically connected to the connection circuit and fixed on the surface of the PCB substrate;
  • the LED chip is connected to a single side of the PCB substrate, and the two sides of the PCB substrate emit light uniformly by adjusting the content of the fluorescent agent in the fluorescent glue , It is preferable to make the two-sided light emitting color of the LED filament uniform and uniform.
  • a plurality of connecting circuits are processed on a substrate of a PCB substrate with an area larger than the LED filament, and LED chips are connected to the connecting circuits, and fluorescent light is coated on both sides of the substrate Glue, after the fluorescent glue is shaped, the substrate is cut to separate the LED filament.
  • the LED filament is connected to an LED chip on a PCB substrate as a wick.
  • the PCB substrate has good toughness, no stress concentration, and the wick of the LED filament is not easily damaged under the action of vibration and external force.
  • the LED chip is connected to the connection circuit to form an electrical connection, and also forms a heat conduction with the PCB substrate, and the LED filament has a good heat dissipation effect.
  • the PCB substrate is suitable for various circuit layouts, and different connection circuits can be drawn according to requirements. There is no need to conduct wires between the LED chips and between the LED chips and the positive and negative pins, eliminating the use of metal wires, LED The connection process of the chip is simpler and the production cost is higher. At the same time, the mechanical strength and stability of the connection circuit etched on the PCB substrate are good, so that the quality of the LED filament is more stable, and the defect of the LED filament is reduced.
  • the lamp includes an LED filament, which has better durability.
  • the LED filament of the lamp can be simplified by reasonably setting the electrical connection pin on the LED filament.
  • the production process of the LED filament uses the PCB substrate as the base material, and the connection circuit is processed on it, which is directly used to connect the LED chips without soldering through the wire, which reduces the processing cost, improves the processing efficiency and processing yield, and adopts The electrical connection structure of the LED filament processed by this method is more stable and suitable for mass production.
  • FIG. 1 shows a front view of an LED filament provided by this application
  • FIG. 2 is a schematic diagram of the internal structure of the LED filament of FIG. 1;
  • FIG. 5 is a schematic diagram of the internal structure of the LED filament of FIG. 4;
  • FIG. 6 shows a schematic view of the axonometric structure of the PCB substrate of the LED filament provided by the present application
  • FIG. 7 shows a schematic view of the axial side structure of the LED filament provided by the present application and assembled into a solid filament
  • FIG. 8 is a schematic diagram of an exploded structure of an LED lamp provided by this application.
  • FIG. 10 shows a schematic structural view of processing a plurality of LED filaments on a large substrate in the production process of the LED filaments provided by this application;
  • FIG. 11 shows a schematic structural diagram of an LED lamp provided with an LED filament provided by the present application
  • FIG. 12 shows a schematic structural diagram of another LED lamp provided with the LED filament provided by the present application.
  • Icons 1-lamp; 10-LED filament; 11-PCB substrate; 110-connecting circuit; 111-electrode arm; 112-connecting arm; 1121-socket; 12-LED chip; 13-fluorescent adhesive layer; 14-positive lead Foot; 15-negative pin; 20-lamp holder; 201-jack.
  • this embodiment provides an LED filament 10 that includes a PCB substrate 11 and a plurality of LED chips 12.
  • the PCB substrate 11 is provided with a positive pin 14 and a negative pin 15 and a connection circuit 110 electrically connecting the positive pin 14 and the negative pin 15.
  • Each LED chip 12 is electrically connected to the connection circuit 110.
  • a fluorescent adhesive layer 13 is provided outside the PCB substrate 11 and the LED chip 12, and the positive electrode pin 14 and the negative electrode pin 15 are exposed from the fluorescent adhesive layer 13.
  • the LED filament 10 is provided with the connection circuit 110 on the PCB substrate 11.
  • the connection circuit 110 may be formed by etching, and the LED chip 12 is electrically connected to the connection circuit 110.
  • the PCB substrate 11 and the LED chip 12 are covered by the fluorescent adhesive layer 13 to protect the connection circuit 110 and the LED chip 12 on the PCB substrate 11 while uniformly leading out the light emitted by the LED chip 12.
  • the positive electrode pin 14 and the negative electrode pin 15 are respectively exposed from the fluorescent glue layer 13 and are used to connect to a power source, so that the LED chip 12 on the connection circuit 110 emits light.
  • the PCB substrate 11 is a glass fiber PCB substrate, which can also be called epoxy board, glass fiber board, FR4, fiber board, etc. It uses epoxy resin as an adhesive and uses glass at the same time Fiber cloth is used as a reinforcing material.
  • This circuit board has a high operating temperature and is little affected by the environment.
  • the glass fiber board can manufacture the double-sided PCB substrate 11 and the circuit can be etched on both sides, so that the light emitting angle of the LED filament 10 is more comprehensive. For example, by thinning the glass fiber PCB substrate to a certain thickness, the PCB substrate can have light guiding properties, so that the light on one side of the PCB substrate can be transmitted to the other side.
  • the PCB substrate 11 may also contain a small amount of inorganic powder with high thermal conductivity, such as oxide powder (such as aluminum oxide, silicon oxide, etc.), nitride powder (aluminum nitride, silicon nitride, etc.), so that the PCB substrate 11 can conduct heat, so that the LED filament 10 made of the PCB substrate 11 has better heat dissipation effect.
  • the PCB substrate 11 is a glass fiber PCB substrate, epoxy resin is used as an adhesive, and glass fiber cloth is used as a reinforcing material, and a small amount of boron nitride and silicon nitride are added as additives to the In the PCB substrate, the PCB substrate 11 has thermal conductivity.
  • the toughness of the PCB substrate 11 is good, there is no stress concentration, and the wick of the LED filament 10 is not easily damaged under the action of vibration and external force.
  • the LED chip 12 is connected to the connection circuit 110 to form an electrical connection, and also forms thermal conduction with the PCB substrate 11.
  • the LED filament 10 has a good heat dissipation effect.
  • the PCB substrate 11 is suitable for various circuit layouts, and different connection circuits 110 can be drawn according to the requirements. There is no need to conduct wires between the LED chips 12 and between the LED chips 12 and the positive pin 14 and the negative pin 15 to save With the use of metal bonding wires, the connection process of the LED chip 12 is simpler and the production cost is lower. At the same time, the connecting circuit 110 etched on the PCB substrate 11 has good mechanical strength and good stability, thereby making the quality of the LED filament 10 more stable and reducing the defects of the LED filament 10.
  • the PCB substrate 11 has a strip shape, and the PCB substrate 11 may also have any two-dimensional shape such as a circle, an ellipse, a triangle, and a polygon.
  • the LED filament 10 matches the shape of the PCB substrate 11, so the LED filament 10 has a strip shape or a column shape after the fluorescent adhesive layer 13 is applied.
  • the positive lead 14 and the negative lead 15 can be provided at any position on the PCB substrate.
  • the positive electrode pin 14 and the negative electrode pin 15 are provided at the same end of the PCB substrate 11, so that the connection electrode of the LED filament 10 is at the same end.
  • the socket with which the filament 10 is matched can realize a plug-in electrical connection between the LED filament 10 and the lamp holder 20 without the need for welding connection, the assembly and disassembly structure is simpler, assembly and maintenance costs are reduced, and assembly efficiency is improved.
  • the positive pin 14 and the negative pin 15 may be provided on both ends of the PCB substrate 11, that is, the LED filament 10, which is welded on the bracket and connected to the lamp holder in the same manner as the traditional filament 20 on.
  • connection circuit 110 the positive pin 14 and the negative pin 15 are connected through the connection circuit 110 and can be provided at both ends of the connection circuit 110.
  • the positive pin 14 and the negative pin 15 can be soldered on the PCB substrate 11 and
  • the copper pins extending from the end of the PCB substrate 11 may also be electrical connection points plated on the surface of the PCB substrate 11.
  • the PCB substrate 11 can guide light, and the PCB substrate 11 is a substrate that can guide light or have a certain degree of light transmittance, so that the light on one side of the PCB substrate can be transmitted to the other side, so that regardless of whether the LED chip 12 is provided on the PCB substrate On either side of 11, the LED filament 10 can emit light on both sides.
  • the PCB substrate can be capable of guiding light.
  • directly preparing a PCB substrate with a certain thickness enables the PCB substrate to guide light.
  • the LED chip 12 is connected to one side of the PCB substrate 11, the connection circuit 110 is etched on one side of the PCB substrate 11, and the fluorescent adhesive layers 13 are provided on both sides of the PCB substrate 11. Since the PCB substrate 11 is in the form of a thin plate, the surface of the PCB substrate 11 mentioned above is the plane with the largest surface area of the PCB substrate 11, and the remaining surfaces become the vertical surface of the PCB substrate 11. The fluorescent adhesive layer 13 is not provided on the vertical surface of the PCB substrate 11. Directly exposed, so that the PCB substrate 11 can form a direct exchange with the outside world, and the LED filament 10 has better heat dissipation effect.
  • the content of the fluorescent agent in the fluorescent adhesive layers 13 on both sides is different, so that the two sides of the LED filament 10 emit light uniformly, for example, the two sides of the LED filament 10 emit light uniformly and uniformly.
  • the LED filament 10 emits light directly from the LED chip 12 on one side, and the LED chip 12 emits light through the PCB substrate 11 on the other side. Therefore, the brightness of the side emitting through the LED chip 12 is lower than the brightness of the side emitting directly from the LED chip 12, which will cause The brightness of the two sides of the LED filament 10 is not uniform.
  • the content of the fluorescent agent in the fluorescent adhesive layer 13 the light emission on both sides of the LED filament 10 is uniform or tends to be uniform.
  • the fluorescent adhesive layer 13 is the same material as the fluorescent adhesive layer 13 of the conventional LED filament 10, and is applied to the surface of the LED filament 10 to protect the inner wick, that is, the PCB substrate 11 and the LED chip 12, and transmits the light emitted by the LED chip 12 Out.
  • the higher the content of the fluorescent agent in the fluorescent adhesive layer 13, the higher the brightness of the fluorescent adhesive layer 13, and the content of the fluorescent agent in the fluorescent adhesive layer 13 on the surface of the PCB substrate 11 on which the LED chip 12 is provided is lower than
  • the content of the fluorescent agent in the fluorescent adhesive layer 13 on the other side makes the light emission on both sides of the LED filament 10 uniform, for example, makes the light emission color on both sides of the LED filament 10 uniform and uniform.
  • the content of the fluorescent agent in the fluorescent adhesive layer 13 is related to the luminous brightness requirements, the luminous power of the LED chip 12 and other factors.
  • the difference in the content of the fluorescent agent in the double-sided fluorescent adhesive layer 13 is related to the light guide of the PCB substrate 11, in actual In use, the content of the fluorescent agent in the fluorescent adhesive layer 13 on both sides of the LED filament 10 can be obtained through experiments, so as to meet the uniformity requirements of the LED filament 10 on both sides and the requirements of the brightness of the light.
  • the connecting circuit 110 is etched on both sides of the PCB substrate 11, and the LED chips 12 are provided on both sides.
  • the LED chip 12 may be the smallest light-emitting unit among the LED light-emitting bodies, which is in the form of particles and is arranged along the connection circuit 110.
  • the LED chip 12 is a flip chip, which is connected to the PCB substrate 11 by flip chip, and the flip chip has no electrical connection pin, which can reduce the space occupied by the electrical connection pin when the LED chip 12 is connected, and increase the light emission
  • the LED chips 12 can be closely distributed to meet the light-emitting requirements of the LED filament 10 with a small volume and high brightness.
  • the PCB substrate 11 is a thin plate substrate with good toughness, high strength, high temperature resistance and light guide.
  • connection circuit 110 a protection circuit or a control circuit can be integrated on the PCB substrate 11 to optimize the assembly process of the LED filament 10 on the lamp, so that the structure of the lamp is more concise, and The reliability of the LED filament 10 is increased.
  • Embodiment 1 includes that the shape of the LED filament 10 is non-strip or non-column, that is, the PCB substrate 11 is not strip-shaped.
  • the PCB substrate 11 includes an electrode arm 111 and a connecting arm 112. One end of the two electrode arms 111 is connected through the connecting arm 112, and the other end of the two electrode arms 111 is provided with a positive pin 14 and a negative pin 15, respectively.
  • the PCB substrate 11 is A special-shaped substrate, the LED filament 10 is a special-shaped filament.
  • the PCB substrate 11 is in a shape of a zigzag
  • the electrode arm 111 and the connecting arm 112 are in a strip shape
  • the positive electrode pin 14 and the negative electrode pin 15 are provided on both sides of the opening of the PCB substrate 11, that is, the electrode arm 111 Overhang.
  • the connection circuit 110 extends from the positive electrode pin 14 to the negative electrode pin 15, that is, the connection circuit 110 is arranged along the PCB substrate 11, and the LED chips 12 are connected along the PCB substrate 11, so that the LED filament 10 is a light-emitting filament.
  • the electrode arm 111 has a bar shape
  • the connecting arm 112 has a bent or angular shape, so that the PCB substrate 11 has an "M” shape; or the connecting arm 112 is connected to the middle of the electrode arm 111, so that The PCB substrate 11 has an "H” shape; or the connecting arm 112 is connected to the opposite end of the electrode arm 111, so that the PCB substrate 11 has an "N" shape, and the positive electrode pin 14 and the negative electrode pin 15 are provided on the electrode arm 111
  • the overhanging ends of the, that is, the electrical connection pins are provided at both ends of the PCB substrate 11.
  • the PCB substrate 11 may be cut out in one piece, and the electrode arm 111 and the connection arm 112 may be cut out in one piece, or may be formed by a strip body, that is, a strip-shaped electrode arm 111 and a connection arm 112 spliced, that is, by a unit board Stitched together.
  • the PCB substrate 11 is cut in one piece, and the distance between the two electrode arms 111 is half of the width of the electrode arm 111, thereby cutting out the zigzag shape by n, u cross distribution on a large substrate
  • the PCB substrate 11 minimizes the waste of materials.
  • the positive pin 14 and the negative pin 15 are also at the same end, so the LED filament 10 can also be connected to the lamp holder through plug connection to achieve electrical connection with the lamp holder Without welding.
  • a socket 1121 is provided on the connecting arm 112, and the socket 1121 is exposed from the fluorescent adhesive layer 13, and a plurality of LED filaments 10 are inserted and fixed through the socket 1121 to form a three-dimensional LED filament 10.
  • the LED filament 10 can have any size and any shape in the three-dimensional space, so that the LED filament can emit light in any direction in the three-dimensional space.
  • the LED-shaped filament 10 can be regarded as a planar light-emitting filament.
  • the LED filament 10 is fixed in a plug-in manner.
  • the plug-in connection is similar to a children's educational toy.
  • the sheet-shaped LED filaments 10 are inserted by being staggered at a certain angle to form a three-dimensional rack-shaped LED filament 10.
  • the two lug-shaped LED filaments 10 form a cross-shaped connection, that is, the connecting arms 112 of the LED filaments 10 are vertically distributed across the cross, and are connected through the socket 1121, and the socket 1121 on one LED filament 10 faces upward
  • the socket 1121 on the other LED filament 10 faces downward, the four electrode arms 111 of the two LED filaments 10 are parallel, and the pins are provided at the same end of the three-dimensional LED filament 10.
  • the three-dimensional LED filament 10 has four pins, and four sockets can be provided on the lamp holder, so that the three-dimensional LED filament 10 can be directly plugged on the lamp holder.
  • this embodiment provides a lamp 1, which includes a lamp holder 20 and the LED filament 10 in Embodiment 1, a socket 201 is provided on the lamp holder 20, and the LED filament 10 is inserted in The socket 201 forms a detachable electrical connection with the lamp holder 20.
  • the positive electrode pin 14 and the negative electrode pin 15 on the LED filament 10 are end electrodes plated on the same end.
  • the lamp holder 20 is provided with a socket 201 matching the LED filament 10, and the LED filament 10 is inserted in the whole In the jack 201, the jack 201 is provided with an electrical connection contact capable of making electrical contact with the positive lead 14 and the negative lead 15.
  • the lamp 1 includes a lamp holder 20 and the LED filament 10 in Embodiment 2, and the lamp holder 20 is provided with four sockets 201 arranged in a cross shape, or oppositely inserted.
  • the holes 201 are connected crosswise in pairs.
  • Corresponding jacks 201 are provided with positive and negative electric shocks, or positive and negative electrical shrapnel.
  • a two-sided LED filament 10 can be inserted into two opposite jacks 201, or two of the four jacks 201 can be inserted.
  • the LED filaments 10 form a three-dimensional filament.
  • the present application provides a schematic structural diagram of an LED lamp with the LED filament provided by the present application.
  • the LED lamps provided in this application include but are not limited to the following lamp forms: bulb lamps, ceiling lamps, ceiling lamps, downlights, flat lamps, kitchen lamps or spotlights, etc.
  • the LED lamps can be installed in but not limited to the following ways: wire hanging type, chain hanging type, pipe hanging type, wall-mounted type, built-in type, ceiling-mounted type or direct attachment type.
  • the installation environment of the LED lamp includes but is not limited to: installation in the ceiling, installation in the wall, installation on the table or installation on the column, etc.
  • this embodiment provides a production process of the LED filament 10, including the steps of:
  • connection circuit 110 is fabricated on the PCB substrate 11, and both ends of the connection circuit 110 are connected to a positive lead 14 and a negative lead 15, respectively.
  • connection circuit 110 on the PCB substrate 11 can be formed by etching to form a corresponding circuit, and the LED chip 12 connected to the connection circuit 110 can be electrically connected to the connection circuit 110.
  • connection circuit 110 The two ends of the connection circuit 110 are connected to the positive pin 14 and the negative pin 15 respectively, and the electric terminal of the connection circuit 110 can be led out by soldering a conductor such as copper wire on the PCB.
  • the positive electrode pins 14 and the negative electrode pins 15 connected to both ends of the circuit 110 are formed by plating electrodes, and the positive electrode pins 14 and the negative electrode pins 15 do not extend from the PCB substrate 11 but on the PCB Electrical contacts are formed on the substrate 11.
  • the LED chip 12 may be a flip chip, which is connected to the PCB substrate 11 by flip chip. Specifically, the tin alloy on the electrode contact surface plating layer of the LED chip 12 is soldered to the connection circuit 110 by eutectic / reflow soldering technology so that The LED chip 12 is electrically connected to the connection circuit 110.
  • the LED chip 12 is connected to a single side of the PCB substrate 11, and the two sides of the PCB substrate 11 emit light uniformly by adjusting the content of the fluorescent agent in the fluorescent glue, for example, to make the two sides of the LED filament emit the same color Uniform, this method has been described in Embodiment 1, and will not be repeated here.
  • the LED filament 10 produced in this embodiment is a strip-shaped LED filament 10, which is fabricated on a large substrate with an area larger than that of the PCB substrate 11, which may specifically be the same width as the length of the PCB substrate 11 It is on the order of tens or hundreds of times the width of the PCB substrate 11.
  • steps 1 to 3 are performed on the large substrate. That is, a plurality of connecting circuits 110 are etched on the large substrate, and the positive pin 14 and the negative pin 15 are connected to the two ends of each connecting circuit 110, the LED chip 12 is flipped on each connecting circuit 110, and then on the large substrate
  • the fluorescent glue is coated on both sides of the LED, and the fluorescent agent coated on one side of the LED chip 12 has a lower fluorescent agent content than the fluorescent agent coated on the other side.
  • the cutting can be performed by laser cutting, such as ultraviolet laser, and the method of drying can be used to speed up the formation of the fluorescent glue.
  • the spacing between the adjacent connection circuits 110 or the spacing between the LED chips 12 on the adjacent connection circuits 110 should be slightly larger for cutting consumption, so as to satisfy the cutting and prevent the LED chips 12 from being damaged when the LED filament 10 is divided.
  • connection circuit 110 The method of forming the connection circuit 110, the connection of the positive lead 14, the negative lead 15, and the LED chip 12 on a large substrate, the same application of fluorescent glue and the division of the strip-shaped LED filament 10, on the one hand, the clamping and fixing of the substrate Easy (large size clamping and positioning is easier), on the other hand, increase the efficiency of coating fluorescent glue.
  • the LED filament provided in this application is connected to an LED chip as a wick on a PCB substrate.
  • the PCB substrate has good toughness, no stress concentration, and the wick of the LED filament is not easily damaged under the action of vibration and external force.
  • the LED chip is connected to the connection circuit to form an electrical connection, and also forms a heat conduction with the PCB substrate, and the LED filament has a good heat dissipation effect.
  • the PCB substrate is suitable for various circuit layouts, and different connection circuits can be drawn according to needs.
  • the connection circuit etched on the PCB substrate has good mechanical strength and good stability, thereby making the quality of the LED filament more stable and reducing the LED filament. bad.
  • the lamp provided by the present application includes the LED filament, which has better durability, and the LED filament of the lamp can be simplified by reasonably setting the electrical connection pin on the LED filament.
  • This application provides a production process of LED filaments, which uses a PCB substrate as a base material, and a connection circuit is processed on it, which is directly used to connect LED chips without soldering through wires, which reduces processing costs and improves processing efficiency With the processing yield, the electrical connection structure of the LED filament processed by this method is more stable and suitable for mass production.

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Abstract

本申请提供LED灯丝、灯具及LED灯丝的生产工艺，LED灯丝包括PCB基板和多个LED芯片，PCB基板上设有连接电路，连接电路的两端分别设有正极引脚和负极引脚，每一LED芯片与连接电路形成电性连接；PCB基板以及LED芯片外设有荧光胶层，正极引脚和负极引脚自荧光胶层中露出。LED灯具包括LED灯丝。LED灯丝的生产工艺可生产出LED灯丝。LED灯丝、灯具及LED灯丝的生产工艺以PCB基板即为基材，在其上加工出连接电路，直接用于连接LED芯片，无需通过导线进行焊接，降低了加工成本，提升了加工效率与加工良率，本LED灯丝、采用本方法加工出的LED灯丝的电性连接结构更为稳定，适合大批量生产。

Description

LED灯丝、灯具及LED灯丝的生产工艺
相关申请的交叉引用
本申请要求于2018年11月06日提交中国专利局的申请号为2018113118531、名称为“LED灯丝、灯具及LED灯丝的生产工艺”的中国申请的优先权，它的全部内容通过引用结合在本申请中。
技术领域
本申请涉及LED照明领域，具体而言，涉及LED灯丝、灯具及LED灯丝的生产工艺。
背景技术
目前常规LED灯丝多用陶瓷、玻璃、蓝宝石为基板，在基板上贴装LED芯片，而后将LED芯片用贵金属线导通。
现有的LED灯丝存在如下缺陷：
1.LED灯丝在制作，多次焊接过程中容易造成不良。
2.焊接金属线，增加了用料成本，加工工序多，加工效率低，且电性连接不稳定，导电性较差。
3.陶瓷、玻璃、蓝宝石等基板质脆，易折断，运输储存成本高，使用寿命低。
发明内容
针对现有技术中的不足，本申请提供一种LED灯丝、灯具及LED灯丝的生产工艺，以解决现有技术中LED灯丝生产不良率高、成本高、生产效率低、易折断的问题。
为了解决现有技术中的至少一个问题，本申请提供如下：
LED灯丝，包括PCB基板和多个LED芯片，所述PCB基板上设有连接电路，连接电路的两端分别设有正极引脚和负极引脚，每一所述LED芯片与所述连接电路形成电性连接；
所述PCB基板以及所述LED芯片外设有荧光胶层，所述正极引脚和所述负极引脚自所述荧光胶层中露出。
作为对上述的LED灯丝的可选的方案，所述PCB基板呈任意二维形状。
作为对上述的LED灯丝的可选的方案，所述PCB基板呈条形。
作为对上述的LED灯丝的可选的方案，所述正极引脚和所述负极引脚能够设于所述PCB基板的任意位置。
作为对上述的LED灯丝的可选的方案，所述正极引脚和所述负极引脚设于所述PCB基板的同一端。
作为对上述的LED灯丝的可选的方案，所述PCB基板包括电极臂和连接臂，两个所述电极臂的一端通过所述连接臂连接，两个所述电极臂的另一端分别设有所述正极引脚和所述负极引脚。
作为对上述的LED灯丝的可选的方案，所述PCB基板一体切割而成，或所述PCB基板由所述电极臂和所述连接臂拼接而成。
作为对上述的LED灯丝的可选的方案，所述连接臂上设有插口，且所述插口自所述荧光胶层中露出，多个所述LED灯丝通过所述插口插接固定形成立体LED灯丝。
作为对上述的LED灯丝的可选的方案，所述立体LED灯丝能够在三维空间中具有任意尺寸和任意形状。
作为对上述的LED灯丝的可选的方案，所述PCB基板是可导热的。
作为对上述的LED灯丝的可选的方案，所述PCB基板可导光，使得所述PCB基板一面上的光能够透射到另一面。
作为对上述的LED灯丝的可选的方案，所述LED芯片连接在所述PCB基板的至少一面上，所述PCB基板的至少一面设有荧光胶层，调节所述荧光胶层中的荧光剂的含量，从而使得LED灯丝的双面发光一致，优选地使得所述LED灯丝的双面发光颜色一致均匀。
作为对上述的LED灯丝的可选的方案，所述LED芯片连接在所述PCB基板的一面，所述PCB基板的两面设有荧光胶层，两面的荧光胶层中的荧光剂的含量不同，从而使得LED灯丝的双面发光一致，优选地使得所述LED灯丝的双面发光颜色一致均匀。
作为对上述的LED灯丝的可选的方案，所述连接电路是由蚀刻而制成的。
作为对上述的LED灯丝的可选的方案，所述PCB基板的双面设有连接电路，且双面设有LED芯片。
作为对上述的LED灯丝的可选的方案，所述正极引脚和所述负极引脚是焊接在所述PCB基板上并自所述PCB基板的端部延伸而出的引脚。
作为对上述的LED灯丝的可选的方案，所述正极引脚和所述负极引脚是通过电镀电极形成的。
作为对上述的LED灯丝的可选的方案，所述LED芯片通过倒装连接在所述PCB基板上，倒装的芯片没有接电引脚。
作为对上述的LED灯丝的可选的方案，所述PCB基板上还集成有保护电路或控制电路。
作为对上述的LED灯丝的可选的方案，所述PCB基板是玻纤PCB基板，以环氧树脂 作粘合剂，同时用玻璃纤维布作增强材料制成的。
本申请还提供：
LED灯具，包括灯座和上述的LED灯丝，所述灯座上设有插口，所述LED灯丝插接在所述插口上，与所述灯座形成可拆卸式电性连接。
本申请所提供的包括上述的LED灯丝的LED灯具包括但不限于以下灯具形式：球泡灯、天花灯、吸顶灯、筒灯、平板灯、厨卫灯以及射灯等等。所述LED灯具可以采用的安装方式包括但不限于以下方式：线吊式、链吊式、管吊式、壁装式、嵌入式、吸顶式或直附式等。所述LED灯具的安装环境包括但不限于：顶棚内安装、墙壁内安装、台上安装或柱上安装等。
本申请还提供：
LED灯丝的生产工艺，包括步骤：
在PCB基板上加工出连接电路，在连接电路的两端分别连接正极引脚和负极引脚；
将LED芯片电性连接至所述连接电路上并固定在所述PCB基板表面；
在所述PCB基板的两面涂覆荧光胶将所述PCB基板及LED芯片包裹并将所述正极引脚和所述负极引脚露出。
作为对上述的LED灯丝的生产工艺的可选的方案，所述LED芯片连接在所述PCB基板的单面上，通过调节荧光胶中荧光剂的含量从而使得所述PCB基板的双面发光一致，优选地使得所述LED灯丝的双面发光颜色一致均匀。
作为对上述的LED灯丝的生产工艺的可选的方案，在一块面积大于LED灯丝的PCB基板的基板上加工多个连接电路，并在连接电路上连接LED芯片，在基板的双面涂覆荧光胶，待荧光胶定型后将基板切割分离出LED灯丝。
本申请至少具有如下优点：
本LED灯丝在PCB基板上连接LED芯片作为灯芯，不同于传统的陶瓷、玻璃等脆性灯芯基板，PCB基板的韧性较好，无应力集中，在震动、外力的作用下LED灯丝的灯芯不易破坏。LED芯片在连接在与连接电路形成电性连接的同时，还与PCB基板之间形成热传导，LED灯丝具有较好的散热效果。PCB基板适合各种电路布置，可依据需求画出不同的连接电路，LED芯片之间以及LED芯片与正极引脚、负极引脚之间无需通过导线导通，省去了金属导线的使用，LED芯片的连接工艺更简单，生产成本更高。同时PCB基板上蚀刻出的连接电路的机械强度好，稳定性较好，从而使得LED灯丝的质量更加稳定，降低LED灯丝的不良。
灯具包括LED灯丝，具有更好的耐用性，可以通过合理设置LED灯丝上的接电引脚能够地简化灯具的LED灯丝的装配。
LED灯丝的生产工艺，以PCB基板即为基材，在其上加工出连接电路，直接用于连接LED芯片，无需通过导线进行焊接，降低了加工成本，提升了加工效率与加工良率，采用本方法加工出的LED灯丝的电性连接结构更为稳定，适合大批量生产。
为使本申请的上述目的、特征和优点能更明显和易懂，下文特举较佳实施例，并配合所附附图，做详细说明如下。
附图说明
为了更清楚地说明本申请实施例的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，应当理解，以下附图仅示出了本申请的某些实施例，因此不应被看作是对范围的限定，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他相关的附图。
图1示出了本申请提供的一种LED灯丝的主视图；
图2为图1的LED灯丝的内部结构示意图；
图3示出了本申请提供的另一种LED灯丝的主视图；
图4示出了本申请提供的LED灯丝的主视图；
图5为图4的LED灯丝的内部结构示意图；
图6示出了本申请提供的LED灯丝的PCB基板的轴测结构示意图；
图7示出了本申请提供的LED灯丝拼插成立体灯丝的轴侧结构示意图；
图8示出了本申请提供的一种LED灯具的分解结构示意图；
图9示出了本申请提供的另一种LED灯具的分解结构示意图；
图10示出了本申请提供的LED灯丝的生产工艺中多个LED灯丝在一块大基板上加工的结构示意图；
图11示出了本申请提供的一种具有本申请提供的LED灯丝的LED灯具的结构示意图；
图12示出了本申请提供的一种具有本申请提供的LED灯丝的另一种LED灯具的结构示意图。
图标：1-灯具；10-LED灯丝；11-PCB基板；110-连接电路；111-电极臂；112-连接臂；1121-插口；12-LED芯片；13-荧光胶层；14-正极引脚；15-负极引脚；20-灯座；201-插孔。
具体实施方式
为了便于理解本申请，下面将参照相关附图对LED灯丝、灯具及LED灯丝的生产工艺进行更全面的描述。附图中给出了LED灯丝、灯具及LED灯丝的生产工艺的优选实施例。但是，LED灯丝、灯具及LED灯丝的生产工艺可以通过许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对LED灯丝、灯具及LED灯丝的生产工艺的公开内容更加透彻全面。
需要说明的是，当元件被称为“固定于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。相反，当元件被称作“直接在”另一元件“上”时，不存在中间元件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的。
除非另有定义，本文所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。本文中在LED灯丝、灯具及LED灯丝的生产工艺的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在限制本申请。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
请一并参阅图1和图2，本实施例提供一种LED灯丝10，它包括PCB基板11和多个LED芯片12。PCB基板11上设有正极引脚14和负极引脚15以及将正极引脚14和负极引脚15电性连接的连接电路110，每一LED芯片12与连接电路110形成电性连接。PCB基板11以及LED芯片12外设有荧光胶层13，正极引脚14和负极引脚15自荧光胶层13中露出。
上述，LED灯丝10以PCB基板11上设有连接电路110，该连接电路110可以由蚀刻而成，LED芯片12电性连接在连接电路110上。通过荧光胶层13将PCB基板11和LED芯片12的包覆，对PCB基板11上的连接电路110和LED芯片12进行保护的同时，将LED芯片12所发出的光均匀的导出。正极引脚14和负极引脚15分别自荧光胶层13中露出，用于接入电源，使得连接电路110上的LED芯片12发光。
不同于传统的陶瓷、玻璃等脆性灯芯基板，PCB基板11为玻纤PCB基板，也可称为环氧板、玻纤板、FR4、纤维板等，以环氧树脂作粘合剂，同时用玻璃纤维布作增强材料，这种电路板工作温度较高，受环境影响很小。同时玻纤板能够制造双面PCB基板11，能够在双面蚀刻电路，使得LED灯丝10的发光角度更为全面。将玻纤PCB基板例如通过减薄到一定厚度可以使该PCB基板具有导光性，使得所述PCB基板一面上的光能够透射到另一面。
此外，PCB基板11还可以含有少量的具有高导热性的无机粉末，诸如氧化物粉末(例 如氧化铝、氧化硅等)、氮化物粉末(氮化铝、氮化硅等)，使得该PCB基板11能够导热，使得由所述PCB基板11制成的LED灯丝10具有较好的散热效果。在一个实施例中，PCB基板11为玻纤PCB基板，以环氧树脂作粘合剂，同时用玻璃纤维布作增强材料，并将少量的氮化硼、氮化硅作为添加剂加入到所述PCB基板中，从而使PCB基板11具有导热性。
同时PCB基板11的韧性较好，无应力集中，在震动、外力的作用下LED灯丝10的灯芯不易破坏。LED芯片12在连接在与连接电路110形成电性连接的同时，还与PCB基板11之间形成热传导，LED灯丝10具有较好的散热效果。
PCB基板11适合各种电路布置，可依据需求画出不同的连接电路110，LED芯片12之间以及LED芯片12与正极引脚14、负极引脚15之间无需通过导线导通，省去了金属键合导线的使用，LED芯片12的连接工艺更简单，生产成本更低。同时PCB基板11上蚀刻出的连接电路110的机械强度好，稳定性较好，从而使得LED灯丝10的质量更加稳定，降低LED灯丝10的不良。
本实施例中，PCB基板11呈条形，而且所述PCB基板11还可以呈圆形、椭圆形、三角形、多边形等任意二维形状。LED灯丝10与PCB基板11的形状相匹配，因而LED灯丝10呈条状或在涂覆荧光胶层13后呈柱状。
正极引脚14和负极引脚15能够设于PCB基板的任意位置。在一个实施例中，如图3所示，正极引脚14和负极引脚15设于PCB基板11的同一端，从而使得LED灯丝10的接电极在同一端，通过在灯座上设置与LED灯丝10相配合的插孔，即可以实现LED灯丝10与灯座20之间形成插接式的电性连接，无需通过焊接连接，装拆结构更简单，降低装配和维护成本，提高装配效率。
当然，在其他的实施例中，正极引脚14和负极引脚15可以设置在PCB基板11，也就是LED灯丝10的两端，与传统的灯丝采用同样的方式焊接在支架上连接在灯座20上。
需要说明的是，正极引脚14和负极引脚15通过连接电路110导通，可以设置在连接电路110的两端，正极引脚14和负极引脚15可以为焊接在PCB基板11上并自PCB基板11的端部延伸而出的铜引脚，还可以为电镀在PCB基板11表面的电性连接点。
PCB基板11可导光，PCB基板11是一种可导光或具有一定的透光度的基板，使得所述PCB基板一面上的光能够透射到另一面，从而无论LED芯片12设于PCB基板11的哪个面，LED灯丝10双面均能够发光。在一个实施例中，根据需要，例如通过将PCB基板减薄到一定厚度可以使该PCB基板能够导光。在另一个实施例中，直接制备一定厚度的PCB基板使得该PCB基板能够导光。
本实施例中，LED芯片12连接在PCB基板11的一面，PCB基板11单面蚀刻有连接电路110，PCB基板11的两面设有荧光胶层13。由于PCB基板11呈薄板状，上述提到的 PCB基板11的面为PCB基板11表面积最大的平面，其余的面成为PCB基板11的立面，PCB基板11的立面不设置荧光胶层13，直接外露，因而PCB基板11能够与外界形成直接的交换，LED灯丝10的散热效果更好。
两面的荧光胶层13中的荧光剂的含量不同，从而使得LED灯丝10的双面发光一致，例如使得所述LED灯丝10的双面发光颜色一致均匀。LED灯丝10一面为LED芯片12直接发光，另一面为LED芯片12透过PCB基板11发光，因而透过LED芯片12发光的一面的亮度较LED芯片12直接发光的一面的亮度低，这将造成LED灯丝10的两面发光亮度不均匀，通过调节荧光胶层13中的荧光剂的含量，从而使得LED灯丝10双面的发光一致或趋于一致。
荧光胶层13与传统的LED灯丝10的荧光胶层13材料相同，应用于LED灯丝10表面对内部的灯芯也就是PCB基板11和LED芯片12形成保护，并将LED芯片12所发出的光透出。
可以理解，荧光胶层13中荧光剂的含量越高，荧光胶层13的发光亮度就越高，设有LED芯片12的PCB基板11的面的荧光胶层13中的荧光剂的含量低于另一面荧光胶层13中荧光剂的含量，从而使得LED灯丝10双面的发光一致，例如使得所述LED灯丝10的双面发光颜色一致均匀。荧光胶层13中荧光剂的含量与发光亮度需求、LED芯片12的发光功率等因素有关，双面荧光胶层13中荧光剂的含量的差异，与PCB基板11的导光性有关，在实际使用中，可以通过实验的方式获知LED灯丝10双面的荧光胶层13中荧光剂的含量，从而满足LED灯丝10双面发光的一致性要求以及发光亮度的要求。
当然，在其他实施例中，PCB基板11的双面蚀刻有连接电路110，双面设有LED芯片12。
上述，LED芯片12可以为LED发光体中最小的发光单元，呈颗粒状，沿连接电路110设置。LED芯片12是一种倒装芯片，通过倒装连接在PCB基板11上，倒装芯片无接电引脚，可以减小LED芯片12在连接时由接电引脚所占用的空间，增加发光的通透性，LED芯片12可以紧密分布，能够满足小体积、高亮度的LED灯丝10的发光需求。
PCB基板11是一种韧性较好，强度较高，耐高温可导光的薄板型基板。
上述，PCB基板11上除了可以设置连接电路110以外，还可以集成保护电路或控制电路到PCB基板11上，从而优化了LED灯丝10在灯具上的装配工艺，使得灯具的结构更为简洁，并且增加了LED灯丝10的可靠性。
可选地，请一并参阅图4和图5，本实施例与实施例1的区别包括，LED灯丝10的形状为非条状或非柱状，也就是PCB基板11不是条状的。PCB基板11包括电极臂111和连接臂112，两个电极臂111的一端通过连接臂112连接，两个电极臂111的另一端分别设有 正极引脚14和负极引脚15，PCB基板11是一种异形基板，LED灯丝10是一种异形灯丝。
进一步地，PCB基板11呈匚形，电极臂111、连接臂112呈条状，正极引脚14和负极引脚15设于PCB基板11的开口的两侧，也就是分别设于电极臂111的悬端。连接电路110自正极引脚14延伸至负极引脚15，即连接电路110沿PCB基板11布置，LED芯片12沿PCB基板11连接，从而使得LED灯丝10为匚形发光的灯丝。
在其他实施例中，电极臂111呈条状，连接臂112呈折弯状或角状，从而使得PCB基板11呈“M”状；或将连接臂112连接在电极臂111的中部，从而使得PCB基板11呈“H”状；或将连接臂112连接在电极臂111相反的一端，从而使得PCB基板11呈“N”状，此时正极引脚14和负极引脚15设于电极臂111的悬端，也就是接电引脚设于PCB基板11的两端。
PCB基板11可以为一体切割而出，电极臂111和连接臂112之间一体切割，也可以通过条状体，也就是条状的电极臂111、连接臂112拼接而成，也就是通过单元板拼接而成。
本实施例中，PCB基板11为一体切割而成，两个电极臂111之间的间距为电极臂111宽度的一半，从而通过在一大块基板上通过n、u交叉式分布切割出匚形的PCB基板11，对于材料的浪费做到最少。
本实施例的LED灯丝10在灯座连接时，正极引脚14和负极引脚15也在同一端，因而本LED灯丝10也可以通过插接连接在灯座上实现与灯座的电性连接，无需焊接。
请一并参阅图6和图7，连接臂112上设有插口1121，且插口1121自荧光胶层13中露出，多个LED灯丝10通过插口1121插接固定形成立体LED灯丝10。其中，LED灯丝10能够在三维空间中具有任意尺寸和任意形状，使得LED灯丝能够在三维空间中的任意方向上发光。匚形LED灯丝10可以看为一种平面发光的灯丝，通过在连接臂112上设置插口1121，使得LED灯丝10插接固定起来，该拼插连接类似于儿童的益智玩具拼插卡片，将片状的LED灯丝10通过交错一定的角度插接，从而形成立体的架状的LED灯丝10。
本实施例中，两个匚形的LED灯丝10形成十字形插接，也即是LED灯丝10的连接臂112呈十字垂直分布，并通过插口1121连接，一个LED灯丝10上的插口1121朝上，另一个LED灯丝10上的插口1121朝下，两个LED灯丝10的四个电极臂111平行，且引脚设于立体LED灯丝10的同一端。立体LED灯丝10具有四个引脚，可以在灯座上设置四个插孔，使得立体的LED灯丝10可以直接插接在灯座上。
可选的，如图8所示，本实施例提供一种灯具1，它包括灯座20和实施例1中的LED灯丝10，灯座20上设有插孔201，LED灯丝10插接在插孔201上，与灯座20形成可拆卸式电性连接。
LED灯丝10上的正极引脚14和负极引脚15为电镀在同一个端部的端电极，灯座20 上设有一个与LED灯丝10相匹配的插孔201，LED灯丝10整个插接在插孔201中，插孔201中设有能够与正极引脚14和负极引脚15形成电性接触的电性连接触点。
如图9所示，在另一实施例中，灯具1包括灯座20和实施例2中的LED灯丝10，灯座20上设有呈十字分布的四个插孔201，或者说相对的插孔201两两连线呈十字。插孔201中对应的设有正负极触电，或正负极电性弹片，可以两个相对的插孔201中***一个匚形的LED灯丝10，也可以在四个插孔201中***两个LED灯丝10形成立体灯丝。
可选的，如图11和图12所示，本申请提供了具有本申请所提供的LED灯丝的LED灯具的结构示意图。本申请所提供的LED灯具包括但不限于以下灯具形式：球泡灯、天花灯、吸顶灯、筒灯、平板灯、厨卫灯或射灯等等。所述LED灯具可以采用的安装方式包括但不限于以下方式：线吊式、链吊式、管吊式、壁装式、嵌入式、吸顶式或直附式等。所述LED灯具的安装环境包括但不限于：顶棚内安装、墙壁内安装、台上安装或柱上安装等。
可选地，本实施例提供一种LED灯丝10的生产工艺，包括步骤：
一、在PCB基板11上加工出连接电路110，连接电路110的两端分别连接正极引脚14和负极引脚15。
其中，PCB基板11上的连接电路110的加工，可以通过蚀刻形成对应的电路，连接在连接电路110上的LED芯片12可以与连接电路110形成电性连接。
连接电路110的两端分别连接正极引脚14和负极引脚15，可以通过在PCB板上焊接铜丝等导体，将连接电路110的接电端引出。
在另一实施例中，连接电路110的两端的正极引脚14和负极引脚15通过电镀电极形成，正极引脚14和负极引脚15没有自PCB基板11上延伸而出，而是在PCB基板11上形成电性触点。
二、将LED芯片12连接至电性连接口上并固定在PCB基板11表面。
LED芯片12可以为倒装芯片，通过倒装的方式连接到PCB基板11上，具体为，通过共晶/回流焊接技术将LED芯片12的电极接触面镀层上的锡合金焊接到连接电路110使得LED芯片12与连接电路110形成电性连接。
三、在PCB基板11的两面涂覆荧光胶将PCB基板11及LED芯片12包裹并将正极引脚14和负极引脚15露出。
通过涂覆荧光胶对PCB基板11和LED芯片12形成保护，对LED灯丝10整体结构强度进行保护，使得LED灯丝10除了正极引脚14和负极引脚15以外的电性结构内置，同时还将LED芯片12所发出的光导出，通过荧光效果，增强优化发光特性。
本实施例中，LED芯片12连接在PCB基板11的单面上，通过调节荧光胶中荧光剂的含量从而使得PCB基板11的双面发光一致，例如使得所述LED灯丝的双面发光颜色一致 均匀，该方法在实施例1中已有叙述，在此不赘述。
本实施例生产的LED灯丝10为条状的LED灯丝10，其在一整块大的基板上制作，该块基板的面积大于PCB基板11，具体可以为宽度与PCB基板11的长度相同，长度为PCB基板11宽度的数十倍或百倍量级。
如图10所示，步骤一至步骤三在大基板上进行。即在大基板上蚀刻出多个连接电路110，并在每一连接电路110的两端的连接正极引脚14和负极引脚15，在每一连接电路110倒装LED芯片12，而后在大基板的两面涂覆荧光胶，设有LED芯片12一面涂覆的荧光胶的荧光剂含量低于另一面涂覆的荧光胶的荧光剂的含量。
还包括步骤：
四、切割大基板分离出LED灯丝10。
具体的，待荧光胶成型后进行切割，切割可以采用激光切割，如紫外激光，可以采用烘干的方法加快荧光胶的成型。
相邻的连接电路110之间的间距，或是相邻连接电路110上的LED芯片12之间的间距应稍大切割消耗，从而满足切割，防止分割LED灯丝10时将LED芯片12损坏。
在大基板上成型连接电路110、连接正极引脚14、负极引脚15、LED芯片12，同一涂覆荧光胶而后分割呈条状的LED灯丝10的方法，一方面对基板的装夹固定更加容易(尺寸大装夹定位较为容易)，另一方面增加的涂覆荧光胶的效率。
在这里示出和描述的所有示例中，任何具体值应被解释为仅仅是示例性的，而不是作为限制，因此，示例性实施例的其他示例可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步定义和解释。
以上所述实施例仅表达了本申请的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对本申请范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干变形和改进，这些都属于本申请的保护范围。
工业实用性
本申请提供的LED灯丝在PCB基板上连接LED芯片作为灯芯，不同于传统的脆性灯芯基板，PCB基板的韧性较好，无应力集中，在震动、外力的作用下LED灯丝的灯芯不易破坏。LED芯片在连接在与连接电路形成电性连接的同时，还与PCB基板之间形成热传导，LED灯丝具有较好的散热效果。PCB基板适合各种电路布置，可依据需求画出不同的连接电路，且PCB基板上蚀刻出的连接电路的机械强度好，稳定性较好，从而使得LED灯丝的质量更加稳定，降低LED灯丝的不良。
本申请提供的灯具包括该LED灯丝，具有更好的耐用性，可以通过合理设置LED灯丝上的接电引脚能够地简化灯具的LED灯丝的装配。
本申请提供了一种LED灯丝的生产工艺，以PCB基板即为基材，在其上加工出连接电路，直接用于连接LED芯片，无需通过导线进行焊接，降低了加工成本，提升了加工效率与加工良率，采用本方法加工出的LED灯丝的电性连接结构更为稳定，适合大批量生产。

Claims (25)

  1. LED灯丝，其特征在于，包括PCB基板和多个LED芯片，所述PCB基板为玻纤基板，所述PCB基板上设有连接电路，连接电路的两端分别设有正极引脚和负极引脚，每一所述LED芯片与所述连接电路形成电性连接；
    所述PCB基板以及所述LED芯片外设有荧光胶层，所述正极引脚和所述负极引脚自所述荧光胶层中露出。
  2. 根据权利要求1所述的LED灯丝，其特征在于，所述PCB基板能够呈任意二维形状。
  3. 根据权利要求1所述的LED灯丝，其特征在于，所述PCB基板呈条形。
  4. 根据权利要求1至3中的任一项所述的LED灯丝，其特征在于，所述正极引脚和所述负极引脚能够设于所述PCB基板的任意位置。
  5. 根据权利要求1至3中的任一项所述的LED灯丝，其特征在于，所述正极引脚和所述负极引脚设于所述PCB基板的同一端。
  6. 根据权利要求1所述的LED灯丝，其特征在于，所述PCB基板包括电极臂和连接臂，两个所述电极臂的一端通过所述连接臂连接，两个所述电极臂的另一端分别设有所述正极引脚和所述负极引脚。
  7. 根据权利要求6所述的LED灯丝，其特征在于，所述PCB基板一体切割而成，或所述PCB基板由所述电极臂和所述连接臂拼接而成。
  8. 根据权利要求6或7所述的LED灯丝，其特征在于，所述连接臂上设有插口，且所述插口自所述荧光胶层中露出，多个所述LED灯丝通过所述插口插接固定形成立体LED灯丝。
  9. 根据权利要求8所述的LED灯丝，其特征在于，所述立体LED灯丝能够在三维空间中具有任意尺寸和任意形状。
  10. 根据权利要求1至9中任一项所述的LED灯丝，其特征在于，所述连接电路是由蚀刻而制成的。
  11. 根据权利要求1至10中任一项所述的LED灯丝，其特征在于，所述PCB基板是可导光的。
  12. 根据权利要求1至11中任一项所述的LED灯丝，其特征在于，所述PCB基板是可导热的。
  13. 根据权利要求1至12中任一项所述的LED灯丝，其特征在于，所述LED芯片连接在所述PCB基板的至少一面上，所述PCB基板的至少一面设有荧光胶层，调节所述荧光胶层中的荧光剂的含量，从而使得LED灯丝的双面发光一致，优选地使得所述LED灯丝的双面发光颜色一致均匀。
  14. 根据权利要求13所述的LED灯丝，其特征在于，所述LED芯片连接在所述 PCB基板的一面，所述PCB基板的两面设有荧光胶层，两面的荧光胶层中的荧光剂的含量不同，从而使得LED灯丝的双面发光一致，优选地使得所述LED灯丝的双面发光颜色一致均匀。
  15. 根据权利要求1至14中任一项所述的LED灯丝，其特征在于，所述PCB基板的双面设有连接电路，且双面设有LED芯片。
  16. 根据权利要求1至15中任一项所述的LED灯丝，其特征在于，所述正极引脚和所述负极引脚是焊接在所述PCB基板上并自所述PCB基板的端部延伸而出的引脚。
  17. 根据权利要求1至16中任一项所述的LED灯丝，其特征在于，所述正极引脚和所述负极引脚是通过电镀电极形成的。
  18. 根据权利要求1所述的LED灯丝，其特征在于，所述LED芯片通过倒装连接在所述PCB基板上，倒装的芯片没有接电引脚。
  19. 根据权利要求1至18中任一项所述的LED灯丝，其特征在于，所述PCB基板上还集成有保护电路或控制电路。
  20. 根据权利要求1至19中任一项所述的LED灯丝，其特征在于，所述PCB基板是玻纤PCB基板，以环氧树脂作粘合剂，同时用玻璃纤维布作增强材料制成的。
  21. LED灯具，其特征在于，包括灯座和权利要求1至20中任一项所述的LED灯丝，所述灯座上设有插口，所述LED灯丝插接在所述插口上，与所述灯座形成可拆卸式电性连接。
  22. 根据权利要求21所述的LED灯具，其特征在于，所述LED灯具包括球泡灯、天花灯、吸顶灯、筒灯、平板灯、厨卫灯或射灯。
  23. LED灯丝的生产工艺，其特征在于，包括步骤：
    在PCB基板上加工出连接电路，在连接电路的两端分别连接正极引脚和负极引脚；
    将LED芯片电性连接至所述连接电路上并固定在所述PCB基板表面；
    在所述PCB基板的两面涂覆荧光胶将所述PCB基板及LED芯片包裹并将所述正极引脚和所述负极引脚露出。
  24. 根据权利要求23所述的LED灯丝的生产工艺，其特征在于，所述LED芯片连接在所述PCB基板的单面上，通过调节荧光胶中荧光剂的含量从而使得所述PCB基板的双面发光一致，优选地使得所述LED灯丝的双面发光颜色一致均匀。
  25. 根据权利要求23或24所述的LED灯丝的生产工艺，其特征在于，在一块面积大于LED灯丝的加工多个连接电路，并在连接电路上连接LED芯片，在基板的双面涂覆荧光胶，待荧光胶定型后将基板切割分离出LED灯丝。
PCT/CN2019/084724 2018-11-06 2019-04-28 Led灯丝、灯具及led灯丝的生产工艺 WO2020093664A1 (zh)

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