CN204289439U - 一种全周发光的led灯丝 - Google Patents
一种全周发光的led灯丝 Download PDFInfo
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- CN204289439U CN204289439U CN201420699840.7U CN201420699840U CN204289439U CN 204289439 U CN204289439 U CN 204289439U CN 201420699840 U CN201420699840 U CN 201420699840U CN 204289439 U CN204289439 U CN 204289439U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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Abstract
本实用新型公开一种全周发光的LED灯丝，包括混有荧光粉的基板，设置于所述基板上的电极，安装在所述基板上的至少一个LED芯片，以及覆盖于所述LED芯片上的封装胶。通过含有荧光粉的硅树脂形成的基板，免除了玻璃或蓝宝石作为基板的成本。混有荧光粉的硅树脂形成的基板代替了玻璃以及蓝宝石基板，使用所述基板制作的灯丝避免了玻璃或蓝宝石对芯片出光的影响，实现了360度出光，出光均匀性和光效大大提高。
Description
技术领域
本实用新型涉及LED光源技术领域，尤其涉及一种全周发光的LED灯丝。
背景技术
随着社会的进步，人类生活的提高，LED产品以其高亮化、全彩化、标准化，规范化及产品结构多样化的特点， 越来越受到人们的青睐， LED灯丝由于能实现360°发光，且不需加透镜，实现立体光源，带来前所未有的照明体验，被广泛应用。
目前市面上做LED灯丝的企业非常多，而主要LED灯丝是玻璃或者蓝宝石基板，但都存在一些问题，首先是蓝宝石灯丝基板和玻璃基板的成本较高；在整个灯丝的成本当中占的比重不低。另外一方面，不管是玻璃还是蓝宝石的灯丝，目前市面上大部分都是采用上下点胶的工艺，侧面由于没有胶体包裹，会漏蓝光，导致发光不均匀，从而也导致光效不高，而采用molding进行封装的灯丝虽然侧面也有胶体包裹，但molding工艺目前技术难度大，要大批量生产比较困难，且由于里面存在玻璃或者蓝宝石，出光还是会有所影响，出光均匀性还是不强。
本实用新型的目的是提供一种全周发光的LED灯丝，解决目前灯丝制作成本高且发光不均匀的问题。
发明内容
本实用新型的目的在于，提供一种不需要玻璃或者蓝宝石基板的低成本高光效且发光均匀的LED灯丝。
为解决上述技术问题，本实用新型的技术方案是：
一种全周发光的LED灯丝，其特征在于：包括混有荧光粉的基板， 设置于所述基板上的电极，安装在所述基板上的至少一个LED芯片，以及覆盖于所述LED芯片上的封装胶。
优选的，所述基板为混有荧光粉的树脂或混有荧光粉的硅胶。
优选的，所述基板的形状为长方体结构的柱状体，其横截面为长方形，所述基板的长度范围是10mm-30mm， 所述基板的宽比高的比例大于1且小于等于2，所述基板的高的范围是0.5mm-1.0mm之间。
优选的，所述基板的形状为长方体结构的柱状体，其横截面为正方形，所述基板的长度范围是10mm-30mm， 所述基板的宽和高的范围均在0.5mm-1.0mm之间。
优选的，所述基板的形状为半圆柱体，其横截面为半圆形，所述基板的长度范围在10mm-30mm之间， 所述半圆形的半径范围在0.5mm-1.0mm之间。
优选的，所述LED芯片在所述基板上排成一列或多列。
优选的,所述LED芯片在所述基板上排成一列的数量为5-35个。
优选的,所述基板为同时混有荧光粉和散射颗粒的树脂或同时混有荧光粉和散射颗粒的硅胶。
优选的,所述LED芯片为蓝光芯片或蓝光芯片与红光芯片的组合。
优选的,所述封装胶的荧光粉浓度比所述基板的荧光粉浓度高，所述封装胶的荧光粉浓度与所述基板的荧光粉浓度比例在1.1-2.0之间。
与现有技术相比，本实用新型具有如下优点：
1、混有荧光粉的硅树脂形成的基板，其弯曲模量高，完全不会因为受到弯曲或扭曲造成破坏，芯片直接安放在硅树脂上面，免除了玻璃或者蓝宝石的成本，降低了LED灯丝的制作成本。
2、混有荧光粉的硅树脂形成的基板代替玻璃及蓝宝石基板，使用所述基板制作的灯丝避免了玻璃或蓝宝石对芯片出光的影响，实现了360度出光，出光均匀性和光效大大提高。
附图说明
图1为本实用新型实施例一一种全周发光的LED灯丝的结构示意图；
图2为本实用新型实施例一一种全周发光的LED灯丝的基板长方形截面示意图；
图3为本实用新型实施例二一种全周发光的LED灯丝的基板正方形截面示意图；
图4为本实用新型实施例三一种全周发光的LED灯丝的基板半圆形截面示意图。
具体实施方式
为详细说明本实用新型的技术内容、构造特征、所实现目的及效果，以下结合实施方式并配合附图详予说明。
实施例1
本实用新型提供的一种全周发光的LED灯丝，如图1 所示，包括混有荧光粉的基板1，设置于所述基板1上的电极2，安装在所述基板1上的至少一个LED芯片3以及覆盖于所述LED芯片3上的封装胶4。
如图1、2所示，所述基板1为混有荧光粉的树脂固化所形成，在本实施例中，优选为混有荧光粉的硅树脂。在其他实施例中，基板还可以为混有荧光粉或同时混有荧光粉和散射颗粒的硅胶，或者同时混有荧光粉和散射颗粒的树脂。所述基板形状为长方体结构的柱状体，其横截面为长方形，所述基板的长度范围是10mm-30mm，所述基板的宽比高的比例大于1且小于等于2，所述基板的高的范围是0.5mm-1.0mm之间。
所述电极2粘贴在所述基板1的两端或一端，在本实施例中所述电极2安装在所述基板1的两端。所述LED芯片3通过固晶胶固定在所述基板1上，所述LED芯片3为蓝光芯片，在其他实施例中，LED芯片也可以为蓝光芯片和红光芯片的组合，在本实施例中，LED芯片优选为蓝光芯片。
所述LED芯片3中的各个芯片通过金线进行电连接。所述LED芯片3可以在所述基板1上排列成一列或多列，本实施中，LED芯片在基板上排列成一列。所述LED芯片排成一列的数量为5-35个，所述LED芯片3的两端通过金线分别与所述电极2相连接。
所述封装胶4覆盖在所述LED芯片3上，对LED芯片3进行封装。所述封装胶4中混有散射颗粒、红色荧光粉、黄色荧光粉、绿色荧光粉中的一种或几种，本实施例中，优选为混有黄色荧光粉和红色荧光粉的有机硅胶。
所述封装胶4的荧光粉浓度比所述基板1的荧光粉浓度高，所述封装胶的荧光粉浓度与所述基板的荧光粉浓度比例在1.1-2.0之间。
本实用新型为混有荧光粉的硅树脂形成的基板，所述基板的弯曲模量高，完全不会因为受到弯曲或扭曲造成破坏；所述基板免除了玻璃或蓝宝石的成本，降低了LED灯丝的制作成本；混有荧光粉的硅树脂形成的基板代替了玻璃及蓝宝石基板，使用所述基板制作的灯丝避免了玻璃或蓝宝石对芯片出光的影响，实现了360度出光，出光均匀性和光效大大提高。
实施例2
如图3所示，本实施例的一种全周发光的LED灯丝，与实施例一的全周发光的LED灯丝的主要区别点在于：实施例一中的基板为横截面是长方形的柱状体，而本实施例中的基板1为横截面是正方形的柱状体。
所述基板1的长度范围在10mm-30mm之间, 所述基板1的横截面为正方形，所述基板的宽和高的范围均在0.5mm-1.0mm之间
实施例3
如图4所示，本实施例的一种全周发光的LED灯丝，与实施例一的全周发光的LED灯丝的主要区别点在于：实施例一中的基板为横截面是长方形的柱状体，而本实施例中的基板1是横截面是半圆形的半圆柱体。
所述基板1的长度范围在10mm-30mm之间, 所述基板1的横截面为半圆形，所述半圆形的半径范围在0.5mm-1.0mm之间。
以上对本实用新型进行了详细的介绍，文中应用具体个例对本实用新型的原理及实施方法进行了阐述，以上实施例的说明只是用于帮助理解本实用新型的方法及其核心思想。应当指出，对于本技术领域的普通技术人员来说，在不脱离本实用新型的前提下，还可以对本实用新型进行若干改进和修饰，这些改进和修饰也落入本实用新型权利要求的保护范围。
Claims (10)
1.一种全周发光的LED灯丝，其特征在于：包括混有荧光粉的基板， 设置于所述基板上的电极，安装在所述基板上的至少一个LED芯片，以及覆盖于所述LED芯片上的封装胶。
2.根据权利要求1所述的一种全周发光的LED灯丝，其特征在于：所述基板为混有荧光粉的树脂或混有荧光粉的硅胶。
3.根据权利要求1所述的一种全周发光的LED灯丝，其特征在于：所述基板的形状为长方体结构的柱状体，其横截面为长方形，所述基板的长度范围是10mm-30mm， 所述基板的宽比高的比例大于1且小于等于2，所述基板的高的范围是0.5mm-1.0mm之间。
4.根据权利要求1所述的一种全周发光的LED灯丝，其特征在于：所述基板的形状为长方体结构的柱状体，其横截面为正方形，所述基板的长度范围是10mm-30mm， 所述基板的宽和高的范围均在0.5mm-1.0mm之间。
5.根据权利要求1所述的一种全周发光的LED灯丝，其特征在于：所述基板的形状为半圆柱体，其横截面为半圆形，所述基板的长度范围在10mm-30mm之间， 所述半圆形的半径范围在0.5mm-1.0mm之间。
6.根据权利要求1所述的一种全周发光的LED灯丝，其特征在于：所述LED芯片在所述基板上排成一列或多列。
7.根据权利要求6所述一种全周发光的LED灯丝，其特征在于：所述LED芯片在所述基板上排成一列的数量为5-35个。
8.根据权利要求1所述的一种全周发光的LED灯丝，其特征在于：所述基板为同时混有荧光粉和散射颗粒的树脂或同时混有荧光粉和散射颗粒的硅胶。
9.根据权利要求1所述的一种全周发光的LED灯丝，其特征在于：所述LED芯片为蓝光芯片或蓝光芯片与红光芯片的组合。
10.根据权利要求1所述的一种全周发光的LED灯丝，其特征在于：所述封装胶的荧光粉浓度比所述基板的荧光粉浓度高，所述封装胶的荧光粉浓度与所述基板的荧光粉浓度比例在1.1-2.0之间。
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