WO2020063608A1 - 显示面板、显示装置及利用其确定外部物***置的方法 - Google Patents
显示面板、显示装置及利用其确定外部物***置的方法 Download PDFInfo
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- WO2020063608A1 WO2020063608A1 PCT/CN2019/107647 CN2019107647W WO2020063608A1 WO 2020063608 A1 WO2020063608 A1 WO 2020063608A1 CN 2019107647 W CN2019107647 W CN 2019107647W WO 2020063608 A1 WO2020063608 A1 WO 2020063608A1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/042—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means
- G06F3/0421—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means by interrupting or reflecting a light beam, e.g. optical touch-screen
Definitions
- the present invention relates to the field of display technology, and in particular, to a display panel, a display device including the display panel, and a method for determining a position of an external object by using the display device.
- the existing sensor-control interaction methods mainly include sound control and light sensing, while the sensor-control interaction methods using near-infrared transmission and near-infrared reception are mainly applied to distance sensors.
- distance sensors that use near-infrared transmission and near-infrared reception for distance detection in display devices currently require a certain space as a separate module, and can only implement the single function of distance detection.
- a display panel including at least one pixel region located in a display area, each pixel region including: at least one first pixel, the first pixel including at least one display light-emitting sub-pixel and At least one near-infrared emitting sub-pixel, wherein the near-infrared emitting sub-pixel is configured to emit near-infrared light; and at least one second pixel, the second pixel including at least one display emitting sub-pixel and at least one near-infrared receiving A sub-pixel, wherein the near-infrared receiving sub-pixel is configured to receive near-infrared light reflected from an external object and generate a measurement signal accordingly.
- the display light-emitting sub-pixel includes an organic light-emitting diode
- the near-infrared light-emitting sub-pixel includes a near-infrared organic light-emitting diode
- the near-infrared organic light emitting diode includes an anode, a hole transporting layer, an electron blocking layer, a near-infrared emitting layer, a hole blocking layer, an electron transporting layer, and a cathode, which are sequentially stacked.
- the near-infrared receiving sub-pixel includes a PN junction semiconductor, a voltage supply signal line, a sensing signal line, and a filter film; the N-type semiconductor in the PN junction semiconductor and the supply Voltage signal line connection, the P-type semiconductor in the PN junction semiconductor is connected to the sensing signal line; and the filter film is disposed on one side of the light receiving surface of the PN junction semiconductor, and the filter film is only Allows near-infrared light to pass through.
- the near-infrared receiving sub-pixel further includes a buffer layer, a gate insulation layer, an interlayer dielectric layer, a flat layer, and a pixel defining layer formed on the substrate in order; the PN junction semiconductor It is formed on the buffer layer, the voltage supply signal line is formed on the interlayer dielectric layer, and the sensing signal line is formed on the flat layer.
- the filter film is disposed on a light-receiving surface of the PN junction semiconductor, and at a position corresponding to the filter film, a through-pixel defining layer, the A via of the planar layer, the interlayer dielectric layer, and the gate insulating layer.
- the filter film is disposed on the pixel defining layer, and an orthographic projection of the filter film on the PN junction semiconductor covers the PN junction semiconductor.
- the display light-emitting sub-pixel and the near-infrared light-emitting sub-pixel each include a sub-pixel driving circuit, and the sub-pixel driving circuit includes a voltage signal terminal configured to receive a voltage signal;
- the gate line signal terminal is configured to receive the gate line control signal;
- the light emission control signal terminal is configured to receive the light emission control signal;
- the data signal terminal is configured to receive the data signal;
- the reset signal terminal is configured to receive the reset signal; initialization A signal terminal configured to receive an initialization signal; an output terminal configured to output an output signal; a first transistor having a control electrode connected to the reset signal terminal, a first electrode thereof connected to the initialization signal terminal, and a second electrode thereof An electrode is connected to the first node; a second transistor whose control electrode is connected to the gate line signal end; a first electrode thereof is connected to the first node; a second electrode thereof is connected to the second node; a third transistor which is A control electrode is connected to the first node, a first
- the first pixel includes: a reset signal line configured to transmit the reset signal; a gate line configured to transmit the gate line control signal; an initialization signal line whose configuration Transmitting the initialization signal; a light-emitting control line configured to transmit the light-emitting control signal; a first voltage signal line configured to transmit a first voltage signal; a second voltage signal line configured to transmit a second voltage signal A display data signal line configured to transmit a display data signal for the display light-emitting sub-pixel; a near-infrared data signal line configured to transmit a near-infrared data signal for the near-infrared light-emitting sub-pixel; wherein, The reset signal terminal is connected to the reset signal line, the gate line signal terminal is connected to the gate line, the light emission control signal terminal is connected to the light emission control line, and the initialization signal terminal is connected to the initialization A signal line, the voltage signal terminal being connected to the first voltage signal line, wherein the number of sub-pixel driving
- the second pixel includes: a reset signal line configured to transmit the reset signal; a gate line configured to transmit the gate line control signal; an initialization signal line whose configuration Transmitting the initialization signal; a light-emitting control line configured to transmit the light-emitting control signal; a first voltage signal line configured to transmit a first voltage signal; a second voltage signal line configured to transmit a second voltage signal A display data signal line configured to transmit a display data signal for the display light-emitting sub-pixel; wherein the reset signal terminal is connected to the reset signal line, and the gate line signal terminal is connected to the gate line
- the light emitting control signal terminal is connected to the light emitting control line, the initialization signal terminal is connected to the initialization signal line, the voltage signal terminal is connected to the first voltage signal line, wherein the display light emitting element
- the data signal terminal and the output terminal of the pixel's sub-pixel driving circuit are connected to the display data signal line and the anode of the organic light emitting diode, respectively
- the voltage supply signal line is connected to a voltage signal terminal of a sub-pixel driving circuit of any one of the second pixels displaying light-emitting sub-pixels, or is connected to the first voltage signal line.
- the number of the first pixels is 1, the number of the second pixels is 8, and wherein the first pixel and the second pixel are The pixels are arranged in a 3 ⁇ 3 array, and the first pixel is located at a position where the second row and the second column intersect in the 3 ⁇ 3 array.
- each pixel region further includes a third pixel, the third pixel including at least one display light-emitting sub-pixel, but not including a near-infrared light-emitting sub-pixel or a near-infrared receiving sub-pixel.
- the first pixel, the second pixel, and the third pixel are the same size, and the first pixel, the second pixel, and the third pixel are Each have the same number of display light-emitting sub-pixels, so that the interval between adjacent sub-pixels in the first pixel and the interval between adjacent sub-pixels in the second pixel is smaller than the adjacent sub-pixels in the third pixel The spacing between pixels.
- a display device including the display panel as described above, wherein the display device further includes a sensory recognition module, and the sensory recognition module and the near-infrared receiver
- the sensing signal line of the sub-pixel is connected to receive the measurement signal, and is configured to determine the position of the external object according to the intensity of the measurement signal.
- the display device further includes an amplifier, which is respectively connected to a sensing signal line of the near-infrared receiving sub-pixel and the sensing control recognition module, and is configured to be connected to a slave The intensity of the measurement signal received by the sensing signal line is amplified.
- the display device further includes a driving chip, and the sensing identification module is integrated on the driving chip.
- the display device further includes a circuit board, and the sensing identification module is disposed on the circuit board.
- the display device further includes a pressure-sensitive signal supply, which is connected to a pressure-supply signal line of the near-infrared receiving sub-pixel and is configured to provide The voltage supply signal line provides a voltage signal.
- a method for determining a position of an external object using the display device as described above includes: using the near-infrared emitting sub-pixel to emit near-infrared light; using the near-infrared The receiving sub-pixel receives the near-infrared light reflected from the external object and generates a measurement signal accordingly; and uses the sensing control recognition module to receive the measurement signal of the near-infrared receiving sub-pixel, and according to the measurement signal, Intensity to determine the position of the external object.
- FIG. 1 is a schematic structural diagram of a display panel according to an exemplary embodiment of the present disclosure
- FIG. 2 is a schematic structural diagram of a first pixel in the display panel shown in FIG. 1;
- FIG. 3 is a schematic structural diagram of a second pixel in the display panel shown in FIG. 1;
- FIG. 4 is a schematic structural diagram of a near-infrared organic light emitting diode in a near-infrared light-emitting sub-pixel according to an exemplary embodiment of the present disclosure
- FIG. 5 is a schematic circuit diagram of a sub-pixel driving circuit according to an exemplary embodiment of the present disclosure
- FIG. 6 is an operation timing diagram of the sub-pixel driving circuit shown in FIG. 5;
- FIG. 7 is a schematic diagram of a line connection of a first pixel according to an exemplary embodiment of the present disclosure.
- FIG. 8 is a schematic cross-sectional view of a structure of a near-infrared light emitting sub-pixel according to an exemplary embodiment of the present disclosure
- FIG. 9 is a schematic structural diagram of a near-infrared receiving sub-pixel according to an exemplary embodiment of the present disclosure.
- FIG. 10 is a schematic cross-sectional view of a structure of a first near-infrared receiving sub-pixel according to an exemplary embodiment of the present disclosure
- FIG. 11 is a schematic cross-sectional view of a structure of a second near-infrared receiving sub-pixel according to an exemplary embodiment of the present disclosure
- FIG. 12 is a schematic structural diagram after photoresist coating when forming an N-type semiconductor in a PN junction semiconductor according to an exemplary embodiment of the present disclosure
- FIG. 13 is a schematic structural view after exposure and development when forming an N-type semiconductor in a PN junction semiconductor according to an exemplary embodiment of the present disclosure
- FIG. 14 is a schematic structural view after etching when forming an N-type semiconductor in a PN junction semiconductor according to an exemplary embodiment of the present disclosure
- FIG. 15 is a schematic diagram of a structure in which holes are doped when forming an N-type semiconductor in a PN junction semiconductor according to an exemplary embodiment of the present disclosure
- 16 is a schematic structural diagram of a photoresist stripper when an N-type semiconductor in a PN junction semiconductor is formed according to an exemplary embodiment of the present disclosure
- FIG. 17 is a schematic structural diagram after photoresist coating when forming a P-type semiconductor in a PN junction semiconductor according to an exemplary embodiment of the present disclosure
- FIG. 18 is a schematic structural view after exposure and development when a P-type semiconductor in a PN junction semiconductor is formed according to an exemplary embodiment of the present disclosure
- FIG. 19 is a schematic structural view after etching when a P-type semiconductor in a PN junction semiconductor is formed according to an exemplary embodiment of the present disclosure
- 20 is a schematic structural diagram of doping electrons when forming a P-type semiconductor in a PN junction semiconductor according to an exemplary embodiment of the present disclosure
- 21 is a schematic structural diagram of a photoresist stripper when a P-type semiconductor in a PN junction semiconductor is formed according to an exemplary embodiment of the present disclosure
- FIG. 22 is a schematic diagram of a line connection of a second pixel according to an exemplary embodiment of the present disclosure
- FIG. 23 is a schematic diagram of an arrangement structure of first pixels and third pixels according to an exemplary embodiment of the present disclosure
- FIG. 24 is a schematic diagram of an arrangement structure of a second pixel and a third pixel according to an exemplary embodiment of the present disclosure
- FIG. 25 is a schematic structural diagram of a display device according to an exemplary embodiment of the present disclosure.
- FIG. 26 is a flowchart of a method of determining a position of an external object using a display device according to an exemplary embodiment of the present disclosure.
- the steps included in the methods described in this disclosure are all exemplary, and they do not necessarily have to be performed in the listed order, but one or more of these steps may be performed in a different order or simultaneously according to the actual situation .
- the described method may include other additional steps.
- the steps shown in the flowchart of the drawings can be performed in a computer system in the form of a set of computer-executable instructions, for example.
- FIG. 1 schematically illustrates a structure of a display panel according to an exemplary embodiment of the present disclosure
- FIG. 2 schematically illustrates a first pixel in the display panel illustrated in FIG.
- FIG. 3 schematically shows the structure of the second pixel in the display panel shown in FIG.
- a display panel provided according to an exemplary embodiment of the present disclosure includes a plurality of pixel regions 10 located in a display area, and each pixel region 10 includes a first pixel 11 and a second pixel 12.
- 11 includes at least one display light-emitting sub-pixel and a near-infrared light-emitting sub-pixel 114
- the second pixel 12 includes at least one display light-emitting sub-pixel and a near-infrared receiving sub-pixel 124.
- the near-infrared emitting sub-pixel 114 is configured to emit near-infrared light; the near-infrared receiving sub-pixel 124 is configured to receive near-infrared light reflected from an external object and generate a measurement signal accordingly.
- the number of display light-emitting sub-pixels included in the first pixel 11 is three, which are the first sub-pixel 111, the second sub-pixel 112, and the third sub-pixel 113, respectively.
- the number of display light-emitting sub-pixels included in the two pixels 12 is also three, which are the first sub-pixel 121, the second sub-pixel 122, and the third sub-pixel 123, respectively.
- the number of display light-emitting sub-pixels included in each of the first pixel and the second pixel is not limited to three, but may be any suitable number. As long as it is greater than or equal to one, for example, it may be four.
- the first pixel may also include any suitable number of near-infrared emitting sub-pixels
- the second pixel may also include any suitable number of near-infrared receiving sub-pixels.
- the disclosure does not specifically limit the number of display light-emitting sub-pixels, near-infrared light-emitting sub-pixels, and near-infrared receiving sub-pixels included in the first and second pixels.
- the first sub-pixel 111 in the first pixel 11 may be a red sub-pixel
- the second sub-pixel 112 in the first pixel 11 may be a green sub-pixel
- the third sub-pixel 113 in the first pixel 11 may be a blue sub-pixel
- the first sub-pixel 121 in the second pixel 12 may be red
- the second sub-pixel 122 in the second pixel 12 may be a green sub-pixel
- the third sub-pixel 123 in the second pixel 12 may be a blue sub-pixel.
- the first sub-pixel 111 in the first pixel 11 may be a red sub-pixel
- the second in the first pixel 11 may be a second sub-pixel.
- the sub-pixel 112 may be a green sub-pixel
- the third sub-pixel 113 of the first pixel 11 may be a blue sub-pixel
- the first pixel 11 may further include a fourth sub-pixel
- the fourth sub-pixel may be a white sub-pixel.
- the first sub-pixel 121 of the two pixels 12 may be a red sub-pixel
- the second sub-pixel 122 of the second pixel 12 may be a green sub-pixel
- the third sub-pixel 123 of the second pixel 12 may be a blue sub-pixel.
- the second pixel 12 may further include a fourth sub-pixel, and the fourth sub-pixel may be a white sub-pixel.
- a near-infrared emitting sub-pixel 114 is provided in the first pixel 11 to emit near-infrared light
- a near-infrared receiving sub-pixel 124 is provided in the second pixel 12 to receive near-infrared light.
- measurement signals of different intensities can be generated.
- the measurement signal can be sent to a corresponding sensing control recognition module or device to detect the position of an external object.
- the near-infrared light emitted by the near-infrared emitting sub-pixel 114 will not be received by the near-infrared receiving sub-pixel 124.
- FIG. 1 only shows an exemplary structure of a display panel according to an exemplary embodiment of the present disclosure.
- Each pixel region includes one first pixel 11 and eight pixels surrounding the first pixel 11.
- the second pixel 12, that is, the first pixel 11 and the second pixel 12 are arranged together in a 3 ⁇ 3 array, and the first pixel 11 is located at the intersection of the second row and the second column in the 3 ⁇ 3 array Office.
- the number and arrangement of the first pixels 11 and the second pixels 12 can also be in other ways, and the number and size of the pixel regions 10 in the display panel can also be changed according to the size and resolution of the display panel. Divided.
- the present disclosure does not specifically limit the number of pixel regions, the first pixels, and the second pixels.
- multiple pixel regions 10 may be arranged in an array.
- the number of the first pixels 11 may be 1, the number of the second pixels 12 may be greater than 2, and the first pixels 11
- the second pixels 12 may be arranged in an array.
- the number of the first pixels 11 may be 1, the number of the second pixels 12 may be 3, and a plurality of the pixel regions 10 may be arranged in an array, and the first pixels 11 may be located
- the lower right corner of each pixel region 10, and the second pixel 12 may be distributed in the upper left corner, the lower left corner, and the upper right corner of each pixel region 10.
- the number of second pixels 12 in each pixel region 10 is set to be greater than two, and the first pixels 11 and the second pixels 12 are arranged in an array Cloth, so that the near-light emitting sub-pixel 114 and the infrared receiving sub-pixel 124 can accurately detect the movement trajectory of an external object.
- FIG. 4 a structure of a near-infrared organic light emitting diode in a near-infrared light emitting sub-pixel 114 according to an exemplary embodiment of the present disclosure is schematically illustrated.
- the near-infrared emitting sub-pixel 114 may include a near-infrared organic light-emitting diode, and the near-infrared organic light-emitting diode may include an anode 1141, a hole transport layer 1142, an electron blocking layer 1143, and The near-infrared emitting layer 1144, the hole blocking layer 1145, the electron transporting layer 1146, and the cathode 1147.
- the near-infrared light-emitting layer 1144 is formed by adding a near-infrared organic light-emitting material to a light-emitting layer of an organic light-emitting diode.
- holes are provided by the anode 1141, enter the near-infrared emitting layer 1144 through the hole transport layer 1142 and the electron blocking layer 1143, and electrons are provided by the cathode 1147, and the electrons
- the hole blocking layer 1145 enters the near-infrared light-emitting layer 1144, and electrons and holes form excitons in the near-infrared light-emitting layer 1144, and the exciton deexcitation radiation emits near-infrared light of a specific wavelength.
- the display light-emitting sub-pixels in the first and second pixels according to the exemplary embodiment of the present disclosure may include organic light-emitting diodes having similar structures, except that the light-emitting layer thereof does not include a near-infrared organic light-emitting material. Therefore, a near-infrared emitting layer is not formed.
- the light-emitting principle of the organic light-emitting diode included in the display light-emitting sub-pixel is similar to the light-emitting principle described with reference to the above-mentioned near-infrared organic light-emitting diode.
- a sub-pixel driving circuit needs to be provided in the infrared light-emitting sub-pixel 114 and the display light-emitting sub-pixel.
- the sub-pixel driving circuit 100 may be used to display organic light emitting diodes and near-infrared light emitting sub pixels in a display light emitting sub pixel. Of near-infrared organic light emitting diodes.
- the sub-pixel driving circuit 100 includes a voltage signal terminal vdd, a gate line signal terminal gate, a light emission control signal terminal em, a data signal terminal data, a reset signal terminal reset, an initialization signal terminal init, and an output terminal output, and also It includes a first transistor T1, a second transistor T2, a third transistor T3, a fourth transistor T4, a fifth transistor T5, a sixth transistor T6, a seventh transistor T7, and a capacitor C1.
- the voltage signal terminal vdd is configured to receive a voltage signal
- the gate line signal terminal gate is configured to receive a gate line control signal
- the light emission control signal terminal em is configured to receive a light emission control signal
- the data signal data is configured to receive a data signal (based on actual needs, the The data signal may be a display data signal or a near-infrared data signal)
- the reset signal terminal reset is configured to receive a reset signal
- the initialization signal terminal init is configured to receive an initialization signal
- the output terminal output is configured to output an output signal.
- the transistors used in the exemplary embodiments of the present disclosure may be thin film transistors, field effect transistors, or other devices having the same characteristics.
- each transistor is typically made so that their source and drain can be used interchangeably, so there is no substantial difference in the description of the connection relationship between their source and drain .
- one of the electrodes is referred to as a first electrode, the other is referred to as a second electrode, and the gate is referred to as a control electrode.
- the effective voltage at which the gate is turned on has a high potential, and the effective voltage at which the gate is closed has a low potential; in the case of a P-type transistor, the effective voltage at which the gate is turned on has a low potential, and the gate The closed inactive voltage has a high potential.
- the effective potential or the invalid potential is not intended to refer to a specific potential, but may include a range of potentials.
- the terms "level” and “voltage level” herein may be used interchangeably with “potential”.
- the first transistor T1, the second transistor T2, the third transistor T3, the fourth transistor T4, the fifth transistor T5, the sixth transistor T6, and the seventh transistor T7 are all N-type transistors, and the first electrode is a drain Electrode, the second electrode is a source electrode, and the voltage signal terminal vdd is at a high potential.
- the control electrode of the first transistor T1 is connected to the reset signal terminal reset, its first electrode is connected to the initialization signal terminal init, and its second electrode is connected to the first node N1.
- the control electrode of the second transistor T2 is connected to the gate line signal terminal gate, its first electrode is connected to the first node N1, and its second electrode is connected to the second node N2.
- the control electrode of the third transistor T3 is connected to the first node N1, its first electrode is connected to the third node N3, and its second electrode is connected to the second node N2.
- the control electrode of the fourth transistor T4 is connected to the gate line signal terminal gate, its first electrode is connected to the data signal terminal data, and its second electrode is connected to the third node N3.
- the control electrode of the fifth transistor T5 is connected to the light emitting control signal terminal em, its first electrode is connected to the voltage signal terminal vdd, and its second electrode is connected to the third node N3.
- the control electrode of the sixth transistor T6 is connected to the light-emitting control signal terminal em, its first electrode is connected to the second node N2, and its second electrode is connected to the output terminal output.
- the control electrode of the seventh transistor T7 is connected to the reset signal terminal reset, its first electrode is connected to the initialization signal terminal init, and its second electrode is connected to the output terminal output.
- a first electrode of the capacitor C1 is connected to the first voltage signal terminal VDD, and a second electrode thereof is connected to the first node N1.
- N-I Near Infrared
- OLED Organic Light-Emitting Diode
- the reference numeral OLED / OLED (NI) in FIG. 5 indicates that the element may be an organic light emitting diode in a display light-emitting sub-pixel or a near-infrared organic light-emitting diode in a near-infrared light-emitting sub-pixel 114 according to actual needs. (The specific structure can refer to FIG. 4).
- the sub-pixel driving circuit 100 When the sub-pixel driving circuit 100 is used to drive an organic light-emitting diode in a display light-emitting sub-pixel, its output terminal output can be connected to the anode of the organic light-emitting diode; when the sub-pixel driving circuit 100 is used to drive a near-infrared light-emitting sub-pixel, When an infrared organic light emitting diode is used, its output terminal output can be connected to the anode of a near-infrared organic light emitting diode.
- FIG. 6 it schematically illustrates an operation timing for the sub-pixel driving circuit 100 shown in FIG. 5.
- the reset signal input from the reset signal terminal reset is high level
- the control signal input from the gate line signal terminal gate is low level
- the light emission control signal input from the light emission control signal terminal em is also low level, so that the first The two crystals T2, the fourth transistor T4, the fifth transistor T5, and the sixth transistor T6 are turned off, and the first transistor T1 and the seventh transistor T7 are turned on.
- the turning on of the first transistor T1 causes the initialization signal terminal init and the first node N1 to be turned on.
- the potential at the second electrode of the capacitor C1 (that is, at the first node N1) can be initialized according to the initialization signal input from the initialization signal terminal init, and the third transistor T3 is turned on to write data for subsequent data.
- the turning on of the seventh transistor T7 turns on the initialization signal terminal init and the output terminal output, so that the organic light emitting diode OLED or the near-infrared organic light emitting diode OLED (NI) can be turned on according to the initialization signal input from the initialization signal terminal Init.
- the anode is initialized to neutralize the carriers stored on its anode to improve the near organic light emitting diode OLED or near infrared organic light emitting diode OLED (N -I) contrast.
- the reset signal input from the reset signal terminal reset is low level
- the control signal input from the gate line signal terminal gate is high level
- the light emission control signal input from the light emission control signal terminal em is low level, so that
- the first transistor T1, the seventh transistor T7, the fifth transistor T5, and the sixth transistor T6 are turned off, and the second transistor T2 and the fourth transistor T4 are turned on. Since the third transistor T3 is in an on state, the data signal terminal can be turned off.
- the data input data signal is written into the second electrode of the capacitor C1 (ie, at the first node N1).
- the reset signal inputted by the reset signal terminal reset is low level
- the control signal inputted by the gate line signal terminal gate is low-level
- the light-emitting control signal inputted by the light-emitting control signal terminal em is high-level.
- the first transistor T1, the seventh transistor T7, the second transistor T2, and the fourth transistor T4 are turned off, and the fifth transistor T5 and the sixth transistor T6 are turned on, and the third transistor T3 is turned on, thereby converting the voltage signal
- the voltage signal at the terminal vdd is provided to the anode of the organic light emitting diode or the near-infrared organic light emitting diode, so that the organic light emitting diode emits light or the near infrared organic light emitting diode emits near infrared light.
- FIG. 7 it schematically illustrates a line connection of a first pixel according to an embodiment of the present disclosure.
- the number of display light-emitting sub-pixels included in the first pixel 11 may be three, namely the first sub-pixel 111, the second sub-pixel 112, and the third sub-pixel 113, and
- the first sub-pixel 111 is an R (red) sub-pixel
- the second sub-pixel 112 is a G (green) sub-pixel
- the third sub-pixel 113 is a B (blue) sub-pixel.
- the first pixel 11 further includes: a reset signal line Reset configured to transmit a reset signal; a gate line Gate configured to transmit a gate line control signal; an initialization signal line Init configured to transmit an initialization signal; a light emission control line EM, which A first voltage signal line VDD configured to transmit a first voltage signal; a second voltage signal line VSS configured to transmit a second voltage signal; a display data signal line Data (R / G / B), which is configured to transmit a display data signal for displaying a light-emitting sub-pixel; and a near-infrared data signal line Data (NI), which is configured to transmit a near-infrared data signal for a near-infrared light-emitting sub-pixel.
- a reset signal line Reset configured to transmit a reset signal
- a gate line Gate configured to transmit a gate line control signal
- an initialization signal line Init configured to transmit an initialization signal
- a light emission control line EM which A first voltage signal line VDD configured to transmit
- the reset signal terminal reset is connected to the reset signal line Reset, and the gate line signal terminal gate is connected to the gate line Gate for light emission control.
- the signal terminal em is connected to the light-emitting control line EM, the initialization signal terminal init is connected to the initialization signal line Init, and the voltage signal terminal vdd is connected to the first voltage signal line VDD.
- the data signal terminal data of the sub-pixel driving circuit 100 of the near-infrared light-emitting sub-pixel is connected to the near-infrared data signal line Data (N-I), and its output terminal ouput is connected to the anode of the near-infrared organic light-emitting diode OLED (N-I).
- the data signal terminal data of the subpixel driving circuit 100 for displaying light emitting subpixels is connected to a display data signal line Data (R / G / B), and the output terminal output thereof is connected to the anode of the organic light emitting diode OLED.
- the cathodes of the organic light emitting diode OLED and the near-infrared organic light emitting diode OLED (N-I) are both connected to the second voltage signal line VSS.
- the reset signal terminal reset, the gate signal terminal gate, the initialization signal terminal init, the voltage signal terminal vdd, and the light emission control in the sub-pixel driving circuit of the near-infrared emitting sub-pixel 114 The signal terminal em and the cathode of the near-infrared organic light-emitting diode in the near-infrared light-emitting sub-pixel 114 can be connected to the sub-pixel driving circuit of any one of the R, G, and B sub-pixels in the first pixel 11
- the reset signal terminal reset, the gate line signal terminal gate, the initialization signal terminal init, the voltage signal terminal vdd, the light emission control signal terminal em, and the cathode of the organic light emitting diode of any one of the sub-pixels are shared respectively.
- a reset signal terminal reset a gate line signal terminal gate, an initialization signal terminal init, a reset signal terminal in a subpixel driving circuit of any one of the R subpixel, the G subpixel, and the B subpixel in the first pixel 11.
- the voltage signal terminal vdd, the light emission control signal terminal em, and the cathode of the organic light emitting diode of any one of the sub-pixels can be respectively reset with the reset signal terminal, the gate line signal gate, and initialization in the sub-pixel driving circuit of the near-infrared light-emitting sub-pixel 114.
- the signal terminal init, the voltage signal terminal vdd, the light emission control signal terminal em, and the cathode of the near infrared organic light emitting diode of the near infrared light emitting sub-pixel 114 are connected.
- the reset signal terminal reset in the sub-pixel driving circuit of the B sub-pixel may be related to the near infrared
- the reset signal terminal in the sub-pixel driving circuit of the light-emitting sub-pixel 114 is reset and the gate line signal terminal in the sub-pixel driving circuit of the B sub-pixel can be connected to the gate line signal in the sub-pixel driving circuit of the near-infrared light-emitting sub-pixel 114.
- the initialization signal terminal init in the subpixel driving circuit of the B subpixel can be connected to the initial signal terminal init in the subpixel driving circuit of the near-infrared light emitting subpixel 114, and the voltage in the subpixel driving circuit of the B subpixel
- the signal terminal vdd may be connected to the voltage signal terminal vdd in the sub-pixel driving circuit of the near-infrared light emitting sub-pixel 114
- the light emission control signal terminal em in the sub-pixel driving circuit of the B sub-pixel may be connected to the sub-pixel of the near-infrared light emitting sub-pixel 114
- the light-emitting control signal terminal em in the driving circuit is connected, and the cathode of the organic light emitting diode of the B sub-pixel can be connected with the near-infrared organic of the near-infrared emitting sub-pixel 114.
- the cathode of the light emitting diode is connected.
- the near-infrared data signal line Data (NI) of the sub-pixel 114 cannot be shared with the R, G, and B sub-pixels in the first pixel 11, but a separate near-infrared data signal line Data (NI) is required. In order to provide a stable data signal for the near-infrared emitting sub-pixel 114.
- the near-infrared data signal line Data (NI) connected to the near-infrared emitting sub-pixel 114 may be connected to the R, G, and B sub-pixels of the first pixel 11 respectively.
- the display data signal lines Data (R / G / B) are arranged on the same layer, so that the production of the data signal lines of the near-infrared emitting sub-pixel 114, R sub-pixel, G sub-pixel, and B sub-pixel can be completed in one manufacturing process.
- FIG. 8 it is a schematic cross-sectional view of a near-infrared light emitting sub-pixel 114 according to an exemplary embodiment of the present disclosure.
- a flexible layer 1149 may be formed on the substrate 1148, and a buffer layer may be formed on the flexible layer 1149.
- a buffer layer can be formed directly on the substrate 1148.
- the buffer layer may include a first buffer layer 1150 and a second buffer layer 1151.
- the material of the first buffer layer 1150 may be silicon nitride SiNx, and the material of the second buffer layer 1151 may be silicon oxide SiOx.
- polysilicon 1152 can be formed on the buffer layer through a patterning process.
- a first gate insulating layer 1153 may be deposited, a first gate electrode 1154 may be formed on the first gate insulating layer 1153 using a patterning process, and then a second gate insulating layer 1155, a second gate electrode 1156, and an interlayer may be sequentially deposited.
- the dielectric layer 1157 wherein the material of the first gate insulating layer 1153 may be silicon oxide, the material of the second gate insulating layer 1155 may be silicon nitride, and the material of the interlayer dielectric layer 1157 may be silicon nitride or silicon oxide.
- a via hole penetrating through the interlayer dielectric layer 1157, the second gate electrode 1156, and the second gate insulating layer 1155 may be formed.
- a source and drain electrode 1158 may be formed on the interlayer dielectric layer 1157 by a patterning process.
- the source-drain electrode 1158 is connected to the first gate electrode 1154 through a via hole.
- the flat layer 1159 can be continuously deposited, and the pixel defining layer 1160 can be formed by using a patterning process.
- a near-infrared organic light-emitting diode of the near-infrared light emitting sub-pixel 114 may be formed in the opening area of the pixel defining layer 1160.
- the near-infrared organic light-emitting diode 114 may include an anode 1141, a hole transport layer 1142, an electron blocking layer 1143, and a near-infrared layer.
- the material of the source / drain electrode 1158 may be Ti / Al / Ti, and a specific patterning process may include: sputtering film formation, PR (Photo Resist) coating, exposure, development, etching, and peeling.
- the material of the near-infrared light-emitting layer 1144 is a near-infrared organic light-emitting material. In the manufacturing process, the near-infrared light-emitting layer 1144 needs to be manufactured separately, so a Mask (mask) process is added.
- the specific process and R / G / B The process of the light emitting layer in the sub-pixel is similar.
- the structure other than the organic light emitting diode in FIG. 8 is for forming the driving circuit in FIG. 5.
- the first gate 1154 and the second gate 1156 constitute the capacitor C1 in FIG. 5. Since the second end of the capacitor C1 is also connected to the control electrode of the third transistor T3, the first gate electrode 1154 also serves as the control electrode of the third transistor T3, and the source-drain electrode 1158 connected to the first gate electrode 1154 is simultaneously As the source of the third transistor T3 and the drain of the second transistor T2, the source-drain electrodes 1158 formed at other positions on the interlayer dielectric layer 1157 can be used as the data signal terminal Data, the voltage signal terminal vdd, etc. line. It should be noted that the first transistor T1, the fourth transistor T4, the fifth transistor T5, the sixth transistor T6, and the seventh transistor T7 in FIG. 5 are not shown in FIG. 8.
- FIG. 9 a structure of a near-infrared receiving sub-pixel according to an exemplary embodiment of the present disclosure is schematically illustrated.
- the near-infrared receiving sub-pixel 124 includes a PN junction semiconductor 1241, a voltage supply signal line 1242, a sensing signal line 1243, and a filter film 1244.
- the N-type semiconductor in the PN junction semiconductor 1241 is connected to the voltage supply signal line 1242
- the P-type semiconductor in the PN junction semiconductor 1241 is connected to the sensing signal line 1243
- the filter film 1244 is provided on one side of the light-receiving surface of the PN junction semiconductor 1241.
- the voltage supply signal line 1242 When the voltage supply signal line 1242 provides a stable voltage, it can apply a certain reverse voltage to the PN junction semiconductor 1241, so the PN junction semiconductor 1241 will have a small reverse current, which can be called a dark current.
- the near-infrared light emitting sub-pixel 114 emits near-infrared light and is reflected by an external object, it is irradiated onto the PN junction semiconductor 1241 after filtering through the light filter film 1244. Due to the action of photo-generated carriers, the reverse current will increase sharply and the reverse current
- the sensor control signal line 1243 is sent to the sensor control identification module 21, and the position of the external object can be analyzed by the sensor control identification module 21 according to the intensity of the received reverse current.
- the filter film 1244 can only transmit near-infrared light, and filter out other light than the near-infrared light, so as to prevent other light from irradiating the PN junction semiconductor 1241, thereby affecting the recognition accuracy of external objects.
- FIG. 10 is a schematic structural cross-sectional view of a first type of near-infrared receiving sub-pixel according to an exemplary embodiment of the present disclosure
- FIG. 11 is a second type of near-infrared receiving sub-pixel according to an exemplary embodiment of the present disclosure.
- the near-infrared receiving sub-pixel 124 further includes a buffer layer, a gate insulating layer, an interlayer dielectric layer 1251, a flat layer 1252, and a pixel defining layer 1253 formed on the substrate 1245 in this order; a PN junction semiconductor 1241 may be formed on the buffer layer, the voltage supply signal line 1242 may be formed on the interlayer dielectric layer 1251, and the sensing signal line 1243 may be formed on the flat layer 1252.
- reference numeral 1246 indicates a flexible layer, that is, a flexible layer 1246 may be provided on the flexible substrate, but for a rigid substrate, this layer may be removed.
- the buffer layer in the near-infrared receiving sub-pixel 124 may include a first buffer layer 1247 and a second buffer layer 1248, and a PN junction semiconductor 1241 may be formed on the second buffer layer 1248.
- the material of the first buffer layer 1247 may be silicon nitride
- the material of the second buffer layer 1248 may be silicon oxide.
- the gate insulating layer in the near-infrared receiving sub-pixel 124 may include a first gate insulating layer 1249 and a second gate insulating layer 1250.
- the material of the first gate insulating layer 1249 may be silicon oxide
- the material of the second gate insulating layer 1250 may be The material of the silicon nitride and the interlayer dielectric layer 1251 may be silicon nitride or silicon oxide.
- a voltage supply signal line 1242 may be formed on the interlayer dielectric layer 1251, and a sensing signal line 1243 may be formed on the flat layer 1252.
- the voltage supply signal line 1242 may be disposed on the same layer as the data line, and the material of the sensor control signal line 1243 It can be Ti / Al / Ti.
- the sensing signal line 1243 may be disposed on the flat layer 1252, so as to be disposed on a different layer from the data line.
- the filter film 1244 may be disposed on the light-receiving surface of the PN junction semiconductor 1241, and a through-pixel defining layer is formed at a position corresponding to the filter film 1244. 1253, a planar layer 1252, an interlayer dielectric layer 1251, and a via of the gate insulating layer.
- the specific manufacturing process of the structure of the near-infrared receiving sub-pixel 124 shown in FIG. 10 may be: a flexible layer 1246 may be formed on the substrate 1245, and a first buffer layer 1247 and a second buffer layer 1248 may be sequentially deposited on the flexible layer 1246.
- a PN junction semiconductor 1241 can be formed on the second buffer layer 1248, a filter film 1244 can be formed on the light receiving surface of the PN junction semiconductor 1241, and then a first gate insulating layer 1249, a second gate insulating layer 1250, and The interlayer dielectric layer 1251 may be formed through the interlayer dielectric layer 1251, the second gate insulation layer 1250, the first gate insulation layer 1249, and the filter film 1244 at a position corresponding to the N-type semiconductor in the PN junction semiconductor 1241. After a via, a voltage supply signal line 1242 may be formed in the interlayer dielectric layer 1251.
- the voltage supply signal line 1242 may be connected to the N-type semiconductor in the PN junction semiconductor 1241 through the first via; then, a flat layer may be formed. 1252, at a position corresponding to the P-type semiconductor in the PN junction semiconductor 1241, a first layer penetrating the planar layer 1252, the interlayer dielectric layer 1251, the second gate insulating layer 1250, the first gate insulating layer 1249, and the filter film 1244 may be formed.
- a sensing signal line 1243 may be formed on the flat layer 1252, and the sensing signal line 1243 may be connected to the P-type semiconductor in the PN junction semiconductor 1241 through a second via; finally, a pixel may be formed on the flat layer 1252 Defining layer 1253, and all other layers on the PN junction semiconductor 1241 and the filter film 1244 can be hollowed out.
- a through-pixel defining layer 1253, a flat layer 1252, and an interlayer can be formed. Vias of the dielectric layer 1251, the second gate insulating layer 1250, and the first gate insulating layer 1249.
- the near-infrared receiving sub-pixel 124 In the structure of the near-infrared receiving sub-pixel 124 shown in FIG. 10, since the light is directly irradiated on the filter film 1244, the attenuation of the light between the film layers is reduced, and the sensitivity of the near-infrared receiving sub-pixel 124 is improved. .
- the filter film 1244 is disposed on the pixel defining layer 1253, and the orthographic projection of the filter film 1244 on the PN junction semiconductor 1241 covers the PN junction semiconductor 1241.
- the specific manufacturing process of the structure of the near-infrared receiving sub-pixel 124 shown in FIG. 11 may be: a flexible layer 1246 may be formed on the substrate 1245, and a first buffer layer 1247 and a second buffer layer may be sequentially deposited on the flexible layer 1246.
- a PN junction semiconductor 1241 can be formed on the second buffer layer 1248.
- a first gate insulation layer 1249, a second gate insulation layer 1250, and an interlayer dielectric layer 1251 can be sequentially deposited, which are N-type in the PN junction semiconductor 1241.
- a first via hole penetrating the interlayer dielectric layer 1251, the second gate insulating layer 1250, and the first gate insulating layer 1249 can be formed at the corresponding position of the semiconductor, and then a voltage supply signal line 1242 can be formed in the interlayer dielectric layer 1251.
- the voltage supply signal line 1242 may be connected to the N-type semiconductor in the PN junction semiconductor 1241 through a first via; then, a flat layer 1252 may be formed, and a penetration may be formed at a position corresponding to the P-type semiconductor in the PN junction semiconductor 1241.
- a sensing signal line 1243 which is a sensing signal line 1243, can be formed on the planar layer 1252.
- the pixel define layer 1253 may be formed on the planarization layer 1252, and the filter film 1244 is formed on the pixel defining layer 1253.
- the filter film 1244 is directly formed on the pixel defining layer 1253, the process complexity is low, the cost is low, and the production efficiency is high.
- the arrows in the PN junction semiconductor 1241 of FIG. 10 and FIG. 11 indicate the direction of the reverse current transmission.
- the reverse current increases sharply, from the PN junction semiconductor 1241. Flow to the sensing control signal line 1243.
- the main formation process of the PN junction semiconductor 1241 is described in detail below:
- FIGS. 17 to 21 illustrate a process according to an exemplary embodiment of the present disclosure.
- the process of forming a P-type semiconductor in a PN junction semiconductor is illustrated.
- a buffer layer 1260 may be formed on the substrate 1245.
- the buffer layer 1260 may include a first buffer layer 1247 and a second buffer layer 1248.
- Polysilicon 1261 may be formed on the buffer layer 1260, and then a gate insulating layer 1262 may be deposited.
- the gate insulating layer 1262 may include a first gate insulating layer 1249 and a second gate insulating layer 1250, and a gate 1263 may be formed on the gate insulating layer 1262.
- the buffer layer 1260 and the gate insulating layer 1262 may be simplified into one layer. It is understood that the buffer layer 1260 may include the first buffer layer 1247 and the second buffer layer in FIG. 10 or FIG. 11. The layer 1248 and the gate insulating layer 1262 may include the first gate insulating layer 1249 and the second gate insulating layer 1250 in FIG. 10 or FIG. 11.
- a photoresist 1264 may be coated on the gate 1263; as shown in FIG. 13, a part of the photoresist 1264 on the gate 1263 may be removed by exposure, development, and other processes to form hole doping.
- the gate 1263 of the hole-doped region can be etched; as shown in FIG. 15, holes can be injected in the hole-doped region, such as doped phosphorus; as shown in FIG. 16, The photoresist 1264 remaining on the gate 1263 can be removed, so that an N-type semiconductor can be formed.
- a photoresist 1264 may be continuously coated on the gate 1263, and the photoresist 1264 covers the hole-doped region and the gate 1263.
- processes such as exposure and development may be used.
- the photoresist 1264 on the gate 1263 is removed to form an electron-doped region; as shown in FIG. 19, the gate 1263 of the electron-doped region can be etched; as shown in FIG. 20, electrons can be injected into the electron-doped region.
- the remaining photoresist 1264 on the gate insulating layer 1262 can be removed, so that a P-type semiconductor can be formed, and finally polysilicon 1261 is converted into a PN junction semiconductor 1241.
- FIG. 22 a line connection of a second pixel according to an exemplary embodiment of the present disclosure is schematically illustrated.
- the number of display light-emitting sub-pixels included in the second pixel 12 may be three, when the first sub-pixel 121, the second sub-pixel 122, and the third sub-pixel 123 are respectively,
- the first sub-pixel 121 in the second pixel 12 may be an R sub-pixel
- the second sub-pixel 122 in the second pixel 12 may be a G sub-pixel
- the third sub-pixel 123 in the second pixel 12 may be a B sub-pixel.
- the second pixel 12 further includes: a reset signal line Reset configured to transmit a reset signal; a gate line Gate configured to transmit a gate line control signal; an initialization signal line Init configured to transmit an initialization signal; a light emission control line EM, which A first voltage signal line VDD configured to transmit a first voltage signal; a second voltage signal line VSS configured to transmit a second voltage signal; a display data signal line Data (R / G / B), which is configured to transmit a display data signal for displaying a light-emitting sub-pixel.
- a reset signal line Reset configured to transmit a reset signal
- a gate line Gate configured to transmit a gate line control signal
- an initialization signal line Init configured to transmit an initialization signal
- a light emission control line EM which A first voltage signal line VDD configured to transmit a first voltage signal
- a second voltage signal line VSS configured to transmit a second voltage signal
- a display data signal line Data R / G / B
- Each of the R pixel, G pixel, and B pixel driving circuit 100 includes a reset signal terminal reset, a gate line signal terminal gate, an initialization signal terminal init, a voltage signal terminal vdd, and a light emission control signal terminal em.
- a reset signal terminal reset For the near-infrared receiving sub-pixel 124, it does not have a reset signal terminal reset, a gate line signal terminal gate, an initialization signal terminal init, and a light emission control signal terminal em, but only a voltage supply signal line 1242 and a sensing control signal line 1243 are required.
- the reset signal terminal reset is connected to the reset signal line Reset
- the gate line signal terminal gate is connected to the gate line Gate
- the light emission control signal terminal Em is connected to the light-emitting control line EM
- the initialization signal terminal init is connected to the initialization signal line Init
- the voltage signal terminal vdd is connected to the first voltage signal line VDD.
- a data signal terminal data of the sub-pixel driving circuit 100 for displaying light-emitting sub-pixels is connected to a display data signal line Data (R / G / B), and an output terminal output thereof is connected to an anode of the organic light-emitting diode OLED.
- the cathode of the organic light emitting diode OLED is connected to the second voltage signal line VSS.
- the voltage supply signal line 1242 of the near-infrared receiving sub-pixel 124 may be directly connected to the first voltage signal line VDD, or may be connected to the sub-pixel driving circuit 100 of any one of the R sub-pixel, G sub-pixel, and B sub-pixel.
- the voltage signal terminal vdd is connected, so that a reverse voltage can be provided to the PN junction semiconductor 1241 through the first voltage signal line VDD; or, a voltage signal line can be separately provided, and a DC voltage signal is provided by the separately set voltage signal line to A reverse voltage is supplied to the PN junction semiconductor 1241.
- the voltage supply signal line 1242 is a separate voltage signal line, as shown in FIG. 9, the voltage supply signal line 1242 needs to be connected to the sensor-controlled signal supply 22 in order to supply the voltage through the sensor-controlled signal supply 22 22 provides a required DC voltage signal for the voltage supply signal line 1242.
- the pixel region 10 of the display panel may further include a third pixel.
- the third pixel may include only a display light-emitting sub-pixel, and does not include a near-infrared light-emitting sub-pixel or a near-infrared receiving sub-pixel.
- FIG. 24 schematically illustrates a first pixel according to an exemplary embodiment of the present disclosure.
- each pixel region 10 further includes a third pixel 13, and the third pixel 13 includes at least one display light-emitting sub-pixel.
- the first pixel 11, the second pixel 12, and the third pixel 13 have the same size and each include the same number of display light-emitting sub-pixels, so that the interval between adjacent sub-pixels in the first pixel 11 and the second pixel can be made.
- the interval between adjacent sub-pixels in 12 is smaller than the interval between adjacent sub-pixels in the third pixel 13.
- the number of display light-emitting sub-pixels included in the third pixel 13 may be three, which are the first sub-pixel, the second sub-pixel, and the third sub-pixel, respectively.
- the sub-pixel, the second sub-pixel in the third pixel 13 may be a G sub-pixel, and the third sub-pixel in the third pixel 13 may be a B sub-pixel.
- the third pixel 13 in FIG. 23 is located in the n-1th line and the n + 1th line, the first pixel 11 is located in the nth line, and the third pixel 13 in FIG. 24 is also divided into the n-1th line and the nth line. n + 1 rows, and the second pixel 12 is located in the n-th row. n is an integer of 2 or more.
- Each pixel includes a corresponding reset signal line Reset, a gate line Gate, an initialization signal line Init, a light emission control line EM, a first voltage signal line VDD, and a second voltage signal line VSS.
- the sub-pixels N-I in the first pixel 11 represent near-infrared emitting sub-pixels. It can be seen from FIG. 23 that the near-infrared data signal line Data of the sub-pixel NI is not the same as the data signal line of the R sub-pixel in the first pixel 11, and the data signal lines of the R and G sub-pixels.
- the data signal line Data B is shared.
- the sub-pixel Receiver in the second pixel 12 represents a near-infrared receiving sub-pixel. It can be seen from FIG. 24 that the voltage supply signal line of the sub-pixel Receiver can be the first voltage signal line VDD in the second pixel 12, and the sensing control signal line of the near-infrared receiving sub-pixel needs to be designed separately.
- the size of the first pixel 11, the second pixel 12, and the third pixel 13 may be set to the same. Since the near-infrared light emitting sub-pixel (that is, the sub-pixel NI) is added to the first pixel 11, ), A near-infrared receiving sub-pixel (ie, a sub-pixel Receiver) is added to the second pixel 12, so the distance between adjacent sub-pixels in the first pixel 11 and the second pixel 12 needs to be set smaller than the third The distance between adjacent sub-pixels in the pixel 13; at the same time, the size of a TFT (Thin Film Transistor) in the near-infrared light-emitting sub-pixel 114 can be appropriately reduced.
- TFT Thin Film Transistor
- FIG. 25 a structure of a display device according to an exemplary embodiment of the present disclosure is schematically illustrated.
- the display device shown in FIG. 25 may include a display panel described with reference to the foregoing exemplary embodiment.
- the display device shown in FIG. 25 further includes a sensory identification module 21.
- the sensing control recognition module 21 is connected to the sensing signal line 1243 of the near-infrared receiving sub-pixel, and is configured to determine the position of an external object according to the strength of the measurement signal sent by the sensing control signal line 1243.
- the following uses the pixel arrangement shown in FIG. 25 as an example to explain the principle of the display device detecting the position and movement trajectory of an external object according to an exemplary embodiment of the present disclosure:
- the display panel of the display device shown may include at least one pixel region 10, and each pixel region 10 may include one first pixel 11 and eight second pixels 12.
- each pixel region 10 may include one first pixel 11 and eight second pixels 12.
- the near-infrared emitting sub-pixel 114 in the first pixel 11 and the near-infrared receiving sub-pixel 124 in the second pixel 12 are shown.
- the near-infrared emitting sub-pixel 114 emits near-infrared light outward.
- the eight near-infrared receiving sub-pixels 124 will not receive the near-infrared light emitted by the near-infrared emitting sub-pixel 114, but when an external object approaches the display
- the near-infrared light emitted by the near-infrared light emitting sub-pixel 114 is reflected by an external object to the near-infrared receiving sub-pixel 124.
- the near-infrared receiving sub-pixel 124 generates reverse currents of different intensities according to the intensity of the received near-infrared light.
- the reverse current generated by the near-infrared receiving sub-pixel 124 is larger, and as an external object is further away from the display device, the reverse current generated by the near-infrared receiving sub-pixel 124 is smaller.
- the near-infrared receiving sub-pixels 124 at each vertex angle and the two adjacent near-infrared receiving sub-pixels 124 may be regarded as a group.
- the second pixels 12 numbered 1, 2, and 4 may be regarded as a group.
- the second pixels 12 numbered 3, 2 and 5 are regarded as a group, the second pixels 12 numbered 6, 4, and 7 are regarded as a group, and the second pixels 12 numbered 8, 5, and 7 are regarded as a group .
- the sensing control recognition module 21 can determine the movement track of the external object according to the change relationship of the reverse current sent by the near-infrared receiving sub-pixel 124 of the three second pixels 12; when the external object moves from the position Ponit 1 At position Ponit 3, the group consisting of the second pixels 12 numbered 1, 2 and 4 receives near-infrared light, and the group consisting of the second pixels 12 numbered 3, 2 and 5 receives near-infrared light, The near-infrared receiving sub-pixels 124 of the second pixels 12 with the numbers 3, 2 and 5 generate different reverse currents according to the intensity of the received near-infrared light, and send them to the sensing control recognition module 21 for sensing recognition
- the module 21 may determine the movement trajectory of the external object according to the magnitude of the reverse current sent by
- the display device may further include an amplifier, which is respectively connected to the sensing control signal line 1243 and the sensing control recognition module 21 of the near-infrared receiving sub-pixel 124 and may be configured to control the sensing control
- the strength of the measurement signal transmitted by the signal line 1243 is amplified.
- a current amplifier may be provided between the sensory control signal line 1243 and the sensory identification module 21 to transmit the signal to the sensory signal line 1243. The reverse current is amplified.
- the display device may further include a driving chip 20, and the sensing identification module 21 may be integrated on the driving chip 20.
- the driving chip 20 is mainly used for driving and displaying the display device.
- the driving chip 20 can display all the sub-pixels of the first pixel 11 and the third pixel 13 and the first sub-pixel 121 and the second sub-pixel 122 of the second pixel 12.
- the third sub-pixel 123 provide driving signals, including providing signals to the reset signal line Reset, the gate line Gate, the initial signal line Init, the first voltage signal line VDD, the second voltage signal line VSS, and the light emission control line EM of each pixel, etc. .
- the display device may further include a sensed signal voltage supply 22.
- the sensed signal voltage supply 22 may be connected to the voltage supply signal line 1242 of the near-infrared receiving sub-pixel 124 and is configured to provide a reverse voltage to the voltage supply signal line 1242.
- the voltage supply signal line 1242 may be a voltage signal line provided separately and connected to the sensed signal supply 22 so that the sensed signal supply 22 is a voltage supply signal.
- Line 1242 provides the required DC voltage signal. Therefore, it is also possible to provide the sensing-control voltage supply 22 on the driving chip 20.
- the display device may further include a circuit board, and the sensing control identification module 21 and / or the sensing signal supply 22 may be disposed on the circuit board.
- the display device may further include an original driving chip for driving and displaying the display device. This manufacturing method is relatively simple.
- a method 200 for determining a position of an external object using a display device is schematically illustrated in the form of a flowchart.
- the method 200 may include the following steps:
- S201 Use the near-infrared emitting sub-pixel 114 to emit near-infrared light
- S202 Use the near-infrared receiving sub-pixel 124 to receive near-infrared light reflected from an external object and generate a measurement signal accordingly;
- S203 Use the sensing control recognition module 21 to receive a measurement signal of the near-infrared receiving sub-pixel 124, and determine the position of the external object according to the intensity of the measurement signal.
- each pixel area includes at least one first pixel and at least one second pixel by setting at least one pixel area in the display area, and the first pixel includes at least one One near-infrared emitting sub-pixel, the second pixel includes at least one near-infrared receiving sub-pixel, and by causing the near-infrared emitting sub-pixel to emit near-infrared light, when an external object approaches the display panel, the near-infrared emitting sub-pixel emits near-infrared light It will be reflected by the external object to the near-infrared receiving sub-pixel.
- the near-infrared receiving sub-pixel receives the near-infrared light reflected by the external object and generates a reverse current, and sends it to the sensing control recognition module.
- the position of the external object can be detected through the sensing control recognition module And moving tracks.
- the near-infrared emitter into the first pixel of the display panel as a near-infrared emitting sub-pixel
- integrating the near-infrared receiver into the second pixel of the display panel as a near-infrared receiving sub-pixel based on the near-infrared emitting sub-pixel and near
- the infrared receiving sub-pixel can detect the position and movement trajectory of an external object, so that it can realize sensory interactive functions such as gesture sensing and eyeball control, without occupying additional space.
- each exemplary embodiment in the description of the present disclosure is described in a progressive manner, and each exemplary embodiment focuses on the differences from other exemplary embodiments, so each exemplary embodiment The same or similar parts between the embodiments may refer to each other.
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Abstract
Description
Claims (20)
- 一种显示面板,其包括位于显示区的至少一个像素区域,每个像素区域包括:至少一个第一像素,所述第一像素包括至少一个显示发光子像素和至少一个近红外发光子像素,其中,所述近红外发光子像素被配置为发射近红外光;以及至少一个第二像素,所述第二像素包括至少一个显示发光子像素和至少一个近红外接收子像素,其中,所述近红外接收子像素被配置为接收从外部物体反射回来的近红外光,并相应地生成测量信号。
- 根据权利要求1所述的显示面板,其中,所述显示发光子像素包括有机发光二极管,所述近红外发光子像素包括近红外有机发光二极管。
- 根据权利要求2所述的显示面板,其中,所述近红外有机发光二极管包括依次层叠设置的阳极、空穴传输层、电子阻挡层、近红外发光层、空穴阻挡层、电子传输层和阴极。
- 根据权利要求3所述的显示面板,其中,所述近红外接收子像素包括PN结半导体、供压信号线、感控信号线和滤光膜;所述PN结半导体中的N型半导体与所述供压信号线连接,所述PN结半导体中的P型半导体与所述感控信号线连接;以及所述滤光膜设置在所述PN结半导体的受光面的一侧,所述滤光膜仅允许近红外光透过。
- 根据权利要求4所述的显示面板,其中,所述近红外接收子像素还包括依次形成在衬底上的缓冲层、栅绝缘层、层间介质层、平坦层和像素界定层;所述PN结半导体形成在所述缓冲层上,所述供压信号线形成在所述层间介质层上,所述感控信号线形成在所述平坦层上。
- 根据权利要求5所述的显示面板,其中,所述滤光膜设置在所述PN结半导体的受光面上,且在所述滤光膜对应的位置处,形成有贯穿所述像素界定层、所述平坦层、所述层间介质层和所述栅绝缘层的过孔。
- 根据权利要求5所述的显示面板,其中,所述滤光膜设置在所 述像素界定层上,且所述滤光膜在所述PN结半导体上的正投影覆盖所述PN结半导体。
- 根据权利要求4所述的显示面板,其中,所述显示发光子像素和所述近红外发光子像素均包括子像素驱动电路,所述子像素驱动电路包括:电压信号端,其配置成接收电压信号;栅线信号端,其配置成接收栅线控制信号;发光控制信号端,其配置成接收发光控制信号;数据信号端,其配置成接收数据信号;复位信号端,其配置成接收复位信号;初始化信号端,其配置成接收初始化信号;输出端,其配置成输出输出信号;第一晶体管,其控制极与所述复位信号端连接,其第一电极与所述初始化信号端连接,其第二电极与第一节点连接;第二晶体管,其控制极与所述栅线信号端连接,其第一电极与所述第一节点连接,其第二电极与第二节点连接;第三晶体管,其控制极与所述第一节点连接,其第一电极与第三节点连接,其第二电极与所述第二节点连接;第四晶体管,其控制极与所述栅线信号端连接,其第一电极与所述数据信号端连接,其第二电极与所述第三节点连接;第五晶体管,其控制极与所述发光控制信号端连接,其第一电极与所述电压信号端连接,其第二电极与所述第三节点连接;第六晶体管,其控制极与所述发光控制信号端连接,其第一电极与所述第二节点连接,其第二电极与所述输出端连接;第七晶体管,其控制极与所述复位信号端连接,其第一电极与所述初始化信号端连接,其第二电极与所述输出端连接;以及电容器,其第一电极与所述电压信号端连接,其第二电极与所述第一节点连接。
- 根据权利要求8所述的显示面板,其中,所述第一像素包括:复位信号线,其配置成传输所述复位信号;栅线,其配置成传输所述栅线控制信号;初始化信号线,其配置成传输所述初始化信号;发光控制线,其配置成传输所述发光控制信号;第一电压信号线,其配置成传输第一电压信号;第二电压信号线,其配置成传输第二电压信号;显示数据信号线,其配置成传输用于所述显示发光子像素的显示数据信号;近红外数据信号线,其配置成传输用于所述近红外发光子像素的近红外数据信号;其中,所述复位信号端连接到所述复位信号线,所述栅线信号端连接到所述栅线,所述发光控制信号端连接到所述发光控制线,所述初始化信号端连接到所述初始化信号线,所述电压信号端连接到所述第一电压信号线;其中,所述近红外发光子像素的子像素驱动电路的数据信号端和输出端分别连接到所述近红外数据信号线和所述近红外有机发光二极管的阳极;其中,所述显示发光子像素的子像素驱动电路的数据信号端和输出端分别连接到所述显示数据信号线和所述有机发光二极管的阳极;其中,所述有机发光二极管和所述近红外有机发光二极管的阴极都连接到所述第二电压信号线。
- 根据权利要求8所述的显示面板,其中,所述第二像素包括:复位信号线,其配置成传输所述复位信号;栅线,其配置成传输所述栅线控制信号;初始化信号线,其配置成传输所述初始化信号;发光控制线,其配置成传输所述发光控制信号,第一电压信号线,其配置成传输第一电压信号;第二电压信号线,其配置成传输第二电压信号;显示数据信号线,其配置成传输用于所述显示发光子像素的显示数据信号;其中,所述复位信号端连接到所述复位信号线,所述栅线信号端连接到所述栅线,所述发光控制信号端连接到所述发光控制线,所述初始化信号端连接到所述初始化信号线,所述电压信号端连接到所述第一电压信号线;其中,所述显示发光子像素的子像素驱动电路的数据信号端和输 出端分别连接到所述显示数据信号线和所述有机发光二极管的阳极,所述有机发光二极管的阴极连接到所述第二电压信号线。
- 根据权利要求10所述的感控显示面板,其中,所述供压信号线与所述第二像素中任意一个显示发光子像素的子像素驱动电路的电压信号端连接,或者与所述第一电压信号线连接。
- 根据权利要求4所述的显示面板,其中,在每个像素区域中,所述第一像素的数量为1,所述第二像素的数量为8,并且其中,所述第一像素和所述第二像素呈3×3的阵列排布,所述第一像素位于所述3×3的阵列中第2行和第2列交叉的位置处。
- 根据权利要求4所述的显示面板,其中,每个像素区域还包括第三像素,所述第三像素包括至少一个显示发光子像素,但不包括近红外发光子像素或近红外接收子像素。
- 根据权利要求13所述的显示面板,其中,所述第一像素、所述第二像素和所述第三像素的尺寸相同,且所述第一像素、所述第二像素和所述第三像素中各自具有相同数量的显示发光子像素,使得所述第一像素中相邻子像素之间的间距和所述第二像素中相邻子像素之间的间距小于所述第三像素中相邻子像素之间的间距。
- 一种显示装置,其包括根据权利要求4至14中任一项所述的显示面板,其中,所述显示装置还包括感控识别模块,所述感控识别模块与所述近红外接收子像素的感控信号线连接,以接收所述测量信号,并且被配置为根据所述测量信号的强度确定所述外部物体的位置。
- 根据权利要求15所述的显示装置,其中,所述显示装置还包括放大器,所述放大器分别与所述近红外接收子像素的感控信号线以及所述感控识别模块连接,并且被配置为对从所述感控信号线接收的测量信号的强度进行放大。
- 根据权利要求15所述的显示装置,其中,所述显示装置还包括驱动芯片,且所述感控识别模块集成在所述驱动芯片上。
- 根据权利要求15所述的显示装置,其中,所述显示装置还包括电路板,且所述感控识别模块设置在所述电路板上。
- 根据权利要求15所述的显示装置,其中,所述显示装置还包括感控信号供压器,所述感控信号供压器与所述近红外接收子像素的供压信号线连接,被配置为向所述供压信号线提供电压信号。
- 一种利用根据权利要求15至19所述的显示装置确定外部物***置的方法,所述方法包括:利用所述近红外发光子像素发射近红外光;利用所述近红外接收子像素接收从所述外部物体反射回来的近红外光,并相应地生成测量信号;以及利用所述感控识别模块接收所述近红外接收子像素的测量信号,并且根据所述测量信号的强度来确定所述外部物体的位置。
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