WO2020062013A1 - 一种led灯及其增加流明的方法 - Google Patents

一种led灯及其增加流明的方法 Download PDF

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Publication number
WO2020062013A1
WO2020062013A1 PCT/CN2018/108286 CN2018108286W WO2020062013A1 WO 2020062013 A1 WO2020062013 A1 WO 2020062013A1 CN 2018108286 W CN2018108286 W CN 2018108286W WO 2020062013 A1 WO2020062013 A1 WO 2020062013A1
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WO
WIPO (PCT)
Prior art keywords
substrate body
cup
led component
inclined surface
layer
Prior art date
Application number
PCT/CN2018/108286
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English (en)
French (fr)
Inventor
林立宸
Original Assignee
江苏新云汉光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 江苏新云汉光电科技有限公司 filed Critical 江苏新云汉光电科技有限公司
Priority to US17/278,459 priority Critical patent/US20210359177A1/en
Priority to CN201880097956.4A priority patent/CN113287207A/zh
Priority to PCT/CN2018/108286 priority patent/WO2020062013A1/zh
Publication of WO2020062013A1 publication Critical patent/WO2020062013A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Definitions

  • the invention relates to an LED lamp, in particular to a method for increasing lumen by using the LED lamp.
  • LED lamps which have a very low demand for electrical energy and can provide sufficient brightness, have grown fastest.
  • LED lights Compared with traditional light sources, LED lights have the advantages of small size, power saving, good luminous efficiency, long life, fast operation response, and no heat radiation and pollution of mercury and other toxic substances. Has been widely used.
  • the brightness of LED lamps could not replace traditional lighting sources, but with the continuous improvement of the technical field, high-power light-emitting diodes with high lighting brightness have been developed, which are sufficient to replace traditional lighting sources.
  • the traditional use of LED light fixtures still cannot effectively improve the overall light output efficiency.
  • the conventional LED lamp package structure generally includes a substrate, an electrode on the substrate, a light emitting diode chip carried on the substrate and electrically connected to the electrode, and a package covering the light emitting diode chip on the substrate.
  • fluorescent particles are usually provided in the light emitting diode package structure, as shown in FIG. 1 and FIG. 2, wherein each component in FIG. 1 is as follows: the substrate body 101, the LED component 102, and the surrounding reflection The frame 105, the encapsulant 110, the silica gel 120, the silica gel 130, and the fluorescent particles 131.
  • FIG. 1 each component in FIG. 1 is as follows: the substrate body 101, the LED component 102, and the surrounding reflection
  • Fluorescent particles are usually coated on the light-emitting surface of the package by dispensing or spraying. However, due to the randomness of spraying, the distribution of fluorescent particles is likely to be uneven; or they are mixed in the packaging material before the package is formed. When the material is solidified, the fluorescent particles suspended in the packaging material will be deposited, or too many fluorescent particles will cause the light generated by the fluorescent particles to be blocked by other fluorescent particles, resulting in a decrease in luminous efficiency, or the distribution of the fluorescent particles in the cured package. The unevenness affects the final light output effect of the LED package structure.
  • the purpose of the present invention is to provide an LED lamp to solve the problems faced by the industry at present, and at the same time improve the brightness of the LED lamp.
  • the LED lamp comprises: a substrate body; at least one reflection cup, the reflection cup is disposed on the substrate body and an included angle between the inclined surface of the reflection cup and the substrate body is between 15 degrees and 80 degrees; At least one LED component, the LED component is disposed on the substrate body and is electrically connected to the substrate body; and at least one fluorescent unit, the fluorescent unit is a mixed layer of fluorescent particles and an adhesive, wherein the fluorescent unit further comprises an LED The top layer of the module, the side layer of the LED module, the beveled surface layer of the reflector cup, and the surface layer of the substrate body; the top layer of the LED module is located on the side of the LED component away from the substrate body and has a thickness of 1 nm to 10 cm; the side layer of the LED component It is set on the side of the LED component that is perpendicular to the substrate body and has a thickness between 1 nm and 10 cm; the reflective cup bevel surface is set on the inclined surface of the reflection cup and has a thickness between 1 nm and 10 cm;
  • the LED lamp comprises: a substrate body; at least one reflection cup, the reflection cup is disposed on the substrate body and an included angle between the inclined surface of the reflection cup and the substrate body is between 15 degrees and 80 degrees; At least one LED component, the LED component is disposed on the substrate body and is electrically connected to the substrate body; at least one fluorescent unit, the fluorescent unit is a mixed layer of fluorescent particles and an adhesive, wherein the fluorescent unit further includes an LED component The top layer, the LED component side layer, the reflective cup bevel surface layer, the substrate body surface layer and the reflective cup top surface layer; the top layer of the LED component is disposed on the side of the LED component away from the substrate body and has a thickness of 1 nm to 10 cm; the The side layer of the LED component is disposed on the side of the LED component perpendicular to the substrate body, and the thickness is between 1 nm and 10 cm; the surface of the reflective cup slope is disposed on the inclined surface of the reflection cup, and the thickness is between 1 nm To 10 cm; the surface of
  • the LED lamp comprises: a reflection cup; at least one LED component, the LED component is arranged in the reflection cup, and an angle between the inclined surface of the reflection cup and the bottom end surface of the reflection cup is 15 degrees To 80 degrees; at least one fluorescent unit, the fluorescent unit is a mixed layer of fluorescent particles and an adhesive, wherein the fluorescent unit further includes a top layer of the LED component, a side layer of the LED component, a sloped surface layer of the reflective cup and a top surface of the reflective cup; the LED The top layer of the module is located on the side of the LED component far from the bottom end surface of the reflection cup, and the thickness is between 1 nanometer and 10 cm; the side layer of the LED component is provided on the side of the LED component perpendicular to the bottom end surface of the reflection cup.
  • the thickness is between 1 nm and 10 cm; the reflection cup inclined surface layer is disposed on the reflection cup inclined surface and the thickness is between 1 nm and 10 cm; the reflection cup top surface layer is disposed on the top surface of the reflection cup And the thickness is more than 1 nm; wherein the thickness of the side surface layer of the LED component and the inclined surface of the reflective cup is less than that of the LED component perpendicular to the bottom end surface of the reflective cup and the inclined surface of the reflective cup.
  • the reflective cup inclined surface layer covers the inclined surface of the reflective cup, wherein the fluorescent particles on the inclined surface of the reflective cup cover the inclined surface of the reflective cup with an area greater than 50%; and at least one packaging unit covers the LED component, The reflection cup and the encapsulating gel of the fluorescent unit.
  • a method for increasing lumen of an LED lamp comprising: providing at least one reflection cup, the reflection cup is arranged on a substrate body, and an angle between the inclined surface of the reflection cup and the substrate body is between 15 degrees and 80 degrees, and the LED component Provided and electrically connected to the substrate body; provided with at least one fluorescent unit, the fluorescent unit is a mixed layer of fluorescent particles and an adhesive, wherein the fluorescent unit further comprises a top layer of the LED component, a side layer of the LED component, and a sloped surface layer of the reflection cup And the surface layer of the substrate body; the top layer of the LED component is arranged on the side of the LED component away from the substrate body, and the thickness is between 1 nm and 10 cm; the side layer of the LED component is arranged perpendicular to the LED component and the substrate body One surface and a thickness of 1 nm to 10 cm; the reflective cup inclined surface layer is disposed on the inclined surface of the reflective cup and has a thickness of 1 nanometer to 10 cm; the substrate body surface layer is disposed on the surface of the
  • the thickness is between 1 nanometer and 10 cm; wherein the thickness of the side layer of the LED component and the inclined surface layer of the reflection cup is less than The distance between the side of the LED component perpendicular to the substrate body and the inclined surface of the reflection cup; wherein the surface layer of the substrate body is smaller than the distance between the surface of the LED component away from the substrate body and the surface of the substrate body; the surface of the reflection cup inclined surface covers the reflection cup
  • the inclined surface of the reflective cup is covered with fluorescent particles, and the area of the inclined surface of the reflective cup is greater than 50%; the LED component performs a self-emission process by electric driving to generate self-emission; and The fluorescent unit performs an excitation light program to generate excitation light.
  • the aforementioned LED lamp, wherein the adhesive includes epoxy resin, silica gel, wax, paraffin, ceramic powder, graphene, and glass powder.
  • the thickness of the top layer of the LED component is between 1 nm and 1 cm.
  • a thickness of a side layer of the LED component is between 1 nm and 1 cm.
  • the thickness of the surface layer of the inclined surface of the reflective cup is between 1 nm and 1 cm.
  • the thickness of the surface layer of the substrate body is between 1 nm and 1 cm.
  • an included angle between the inclined surface of the reflection cup and the substrate body is between 30 degrees and 60 degrees.
  • an area of the inclined surface of the reflective cup covering the inclined surface of the reflective cup with the fluorescent particles is greater than 65%.
  • the thickness of the surface layer of the substrate body is smaller than the thickness of the top layer of the LED component.
  • the thickness of the top surface layer of the reflection cup is more than 1 nm.
  • an LED lamp and a method for increasing lumen of the present invention have at least the following advantages and beneficial effects:
  • the LED lamp of the present invention has the advantages of improving the shortcomings of the old light-emitting diodes and increasing the brightness of the LED lamp at the same time, and has obvious market value.
  • FIG. 1 is a schematic diagram of an embodiment of the prior art
  • FIG. 2 is a schematic diagram of an embodiment of the prior art
  • FIG. 3 is a schematic diagram of a preferred embodiment of the present invention.
  • FIG. 4 is a schematic diagram of a preferred embodiment of the present invention.
  • FIG. 5 is a schematic diagram of a preferred embodiment of the present invention.
  • 6A is an enlarged view of a microscope of a preferred embodiment of the present invention.
  • 6B is an enlarged view of a microscope of a preferred embodiment of the present invention.
  • 6C is an enlarged view of a microscope of a preferred embodiment of the present invention.
  • FIG. 7A is an enlarged view of a microscope of a preferred embodiment of the present invention.
  • FIG. 7B is an enlarged view of a microscope of a preferred embodiment of the present invention.
  • FIG. 7C is an enlarged view of a microscope of a preferred embodiment of the present invention.
  • FIG. 8A is an enlarged view of a microscope according to a preferred embodiment of the present invention.
  • FIG. 8B is an enlarged view of a microscope of a preferred embodiment of the present invention.
  • FIG. 8C is an enlarged view of a microscope of a preferred embodiment of the present invention.
  • 9A is an enlarged view of a microscope according to a preferred embodiment of the present invention.
  • 9B is an enlarged view of a microscope according to a preferred embodiment of the present invention.
  • FIG. 9C is an enlarged view of a microscope according to a preferred embodiment of the present invention.
  • FIG. 10A is an enlarged view of a microscope according to a preferred embodiment of the present invention.
  • FIG. 10B is an enlarged view of a microscope according to a preferred embodiment of the present invention.
  • FIG. 10C is an enlarged view of a microscope according to a preferred embodiment of the present invention.
  • Substrate body 102 LED module
  • Fluorescent particles 201 Substrate body
  • LED component 205 Surrounding reflection frame
  • LED light 301 substrate body
  • LED component 320 fluorescent unit
  • W thickness of the top layer of the LED component
  • V thickness of the side layer of the LED component
  • LED component 420 Fluorescent unit
  • Packaging unit 500: LED light
  • R the angle between the inclined surface of the reflection cup 505 and the bottom end surface of the reflection cup 505
  • LED component 520 fluorescent unit
  • the top layer of the LED component 522 The side layer of the LED component
  • the present invention provides an LED lamp 300 including: a substrate body 301; at least one reflection cup 305, the reflection cup 305 is disposed on the substrate body 301 and the included angle R between the inclined surface of the reflection cup 305 and the substrate body 301 is between 15 degrees and 80 degrees; at least one LED component 310 is disposed on the substrate body 301 and is electrically connected to the substrate body 301 Substrate body 301; and a fluorescent unit 320, which is a mixed layer of fluorescent particles and an adhesive, wherein the fluorescent unit 320 further includes an LED component top layer 321, an LED component side layer 322, a reflective cup inclined surface layer 323, and a substrate body Surface layer 324; the top layer 321 of the LED component is provided on the side of the LED component 310 away from the substrate body 301, and the thickness W of the top layer of the LED component is between 1 nm and 10 cm; the side layer 322 of the LED component is provided on the LED The side of the module 310 that
  • the present invention provides an LED lamp 400 including: a substrate body 401; at least one reflection cup 405, the reflection cup 405 is disposed on the substrate body 401 and the included angle R between the inclined surface of the reflection cup 405 and the substrate body 401 is between 15 degrees and 80 degrees; at least one LED component 410 is disposed on the substrate body 401 and is electrically connected to the substrate body 401 Substrate body 401; at least one fluorescent unit 420, which is a mixed layer of fluorescent particles and an adhesive, wherein the fluorescent unit 420 further includes an LED component top layer 421, an LED component side layer 422, a reflective cup inclined surface layer 423, and a substrate The top surface layer 424 of the body and the top surface layer 425 of the reflective cup; the top layer 421 of the LED component is disposed on the side of the LED component 410 away from the substrate body 401, and the thickness W of the top layer of the LED component ranges from 1 nm to 10 cm; the side of the LED
  • top surface layer 425 of the reflection cup and the packaging unit 430 are used to increase the brightness of the LED lamp 400.
  • the present invention provides an LED lamp 500 including: a reflection cup 505; at least one LED component 510, the LED component 510 is disposed in the reflection cup 505, and the angle R between the inclined surface of the reflection cup 505 and the bottom end surface of the reflection cup 505 is between 15 degrees and 80 degrees; at least one fluorescent unit 520, which is a mixed layer of fluorescent particles and an adhesive Wherein, the fluorescent unit 520 further includes an LED component top layer 521, an LED component side layer 522, a reflective cup inclined surface layer 523, and a reflective cup top surface layer 525.
  • the LED component top layer 521 is disposed on the LED component 510 away from the reflective cup 505.
  • the thickness W is between 1 nm and 10 cm;
  • the side surface layer 522 of the LED component is disposed on the side of the LED component 510 perpendicular to the bottom end surface of the reflection cup 505, and the thickness V is between 1 nm To 10 cm;
  • the reflective cup inclined surface layer 523 is disposed on the inclined surface of the reflective cup 505 and has a thickness Y between 1 nm and 10 cm;
  • the reflective cup top surface layer 525 is a surface disposed on the top of the reflective cup 505, and Thickness Z is more than 1 nm; of which The thickness of the side surface 522 of the LED component and the sloped surface layer 523 of the reflector cup is less than the distance between the LED component 510 and the bottom surface of the reflector cup 505 perpendicular to the sloped surface of the reflector cup 505;
  • the reflector cup sloped surface layer 523 covers the The inclined surface of the reflector cup 505, wherein the area of the inclined surface of the reflector cup 505 is covered by fluorescent particles on
  • the inclined surface portion of the reflection cup 305 is not covered with fluorescent particles.
  • the fluorescent particles on the inclined surface of the reflective cup 323 cover about 60% of the area of the inclined surface of the reflective cup 305, and the thickness Y of the inclined surface of the reflective cup is about 50 microns.
  • the inclined surface portion of the reflection cup 305 is not covered with fluorescent particles.
  • the fluorescent particles of the reflective cup inclined surface layer 323 cover about 70% of the area of the inclined surface of the reflective cup 305, and the thickness Y of the reflective cup inclined surface layer is about 70 micrometers.
  • the inclined surface portion of the reflection cup 305 is not covered with fluorescent particles.
  • the fluorescent particles of the reflective cup inclined surface layer 323 cover about 80% of the area of the inclined surface of the reflective cup 305, and the thickness Y of the reflective cup inclined surface layer is about 80 micrometers.
  • the inclined surface portion of the reflection cup 305 is not covered by fluorescent particles.
  • the fluorescent particles of the reflective cup inclined surface layer 323 cover about 90% of the area of the inclined surface of the reflective cup 305, and the thickness Y of the reflective cup inclined surface layer is about 100 micrometers.
  • the inclined surface portion of the reflection cup 305 is not covered by fluorescent particles.
  • the reflective particles of the inclined surface of the reflective cup 323 cover about 100% of the area of the inclined surface of the reflective cup 305, and the thickness Y of the inclined surface of the reflective cup is about 200 microns.
  • the fluorescent particles on the inclined surface of the reflective cup 323 cover about 60% of the area of the inclined surface of the reflective cup 305, and the thickness Y of the inclined surface of the reflective cup is about 50 microns.
  • the test was performed at a spot power of 350 mA, and the color temperature was 20,000 to 30,000 K, and the brightness was 147.8 Lm.
  • the test was performed with a large integrating sphere at a spot measurement power of 1.08 W, and the color temperature was 15850 K and the brightness was 127 Lm.
  • the area of the inclined surface of the reflective cup 305 on the inclined surface of the reflective cup inclined surface 323 covers about 70% to 100%.
  • the color temperature and brightness measurement results are shown in the following table:
  • the area of the inclined surface of the reflective cup inclined surface layer 323 covering the inclined surface of the reflective cup 305 is less than 60%, and the color temperature is greater than 20,000 to 30,000 K obtained by testing with the test device DP76 at a spot power of 350 mA, which is not included in this implementation. Case discussion.
  • the thickness Y of the inclined surface of the reflective cup must be higher than the fluorescent reflection layer within 1 nanometer (nm) above the chip, that is, from the surface of the substrate body 301 to the surface of the LED component 310 by 1 nanometer. Infinite range distribution ratio.
  • the thickness Y of the bevel surface of the reflector cup is defined between 1 nm and infinity, because the thickness Y of the bevel surface of the reflector cup does not affect the excitation brightness of the reflector cup as long as the fluorescent particles cover the inclined surface distribution of the reflector cup 305 to 100%. Only the thickness W of the top layer of the LED component on the surface of the LED component 310 will affect the color temperature change and brightness.
  • a method for increasing lumen of an LED lamp 300 includes: providing at least one reflection cup 305, the reflection cup 305 is disposed on the substrate body 301 and the reflection cup 305 The included angle R between the inclined surface of the substrate and the substrate body 301 is between 15 degrees and 70 degrees.
  • the LED component 310 is disposed and electrically connected to the substrate body 301.
  • At least one fluorescent unit 320 is provided.
  • the fluorescent unit 320 is a fluorescent particle and A mixed layer of an adhesive, wherein the fluorescent unit 320 further includes an LED component top layer 321, an LED component side layer 322, a reflective cup beveled surface layer 323, and a substrate body surface layer 324; the LED component top layer 321 is disposed on the LED component away from the substrate.
  • the thickness W is between 1 nm and 10 cm; the LED component side layer 322 is disposed on the side of the LED component 310 perpendicular to the substrate body 301, and the thickness V is between 1 nm and 10 cm
  • the reflective cup inclined surface layer 323 is disposed on the inclined surface of the reflective cup 305 and has a thickness Y of more than 1 nm; the substrate body surface layer 324 is disposed on the surface of the substrate body 301 between the LED component and the Between the reflection cups 305, and the thickness U is between 1 nanometer and 10 cm; wherein the side surface layer 322 of the LED component is not in contact with the beveled surface layer 323 of the reflection cup; wherein the surface layer 324 of the substrate body is not higher than the LED component Top layer 321; the reflective cup beveled surface layer 323 covers the inclined surface of the reflective cup 305, wherein the fluorescent particles of the reflective cup beveled surface layer 323 cover an area of the inclined surface of the reflective cup 305 greater than 50%; the LED
  • the LED lamp of the present invention improves the shortcomings of the old light emitting diodes and has obvious market value.
  • the present invention may have many modifications and differences. Therefore, it needs to be understood within the scope of the appended claims.
  • the present invention can be widely implemented in other embodiments. The above are merely preferred embodiments of the present invention, and are not intended to limit the scope of patent application for the present invention; all other equivalent changes or modifications made without departing from the spirit disclosed by the present invention should be included in the following application patents Within range.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
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Abstract

一种LED灯(300)，LED灯(300)包含：基板本体(101)；至少一个反射杯(305)，反射杯(305)设置于基板本体(101)上；至少一个LED组件(202)，LED组件(202)设置于基板本体(101)上且电性连接于基板本体(101)；与至少一个荧光单元(320)，其中，荧光单元(320)更包含LED组件顶层(321)、LED组件侧面层(322)、反射杯斜面表层(323)及基板本体表层(324)。所形成的发光二极管结构增加的亮度，优于目前已知的发光二极管结构。

Description

一种LED灯及其增加流明的方法 技术领域
本发明涉及一种LED灯，特别是涉及一种借由LED灯增加流明的方法。
背景技术
近年来，为了地球环保及永续生存的期望，节能光源的使用，开始大量普及，其中尤以电能需求量甚低，而又能提供足够亮度需求的LED灯成长最为快速。
LED灯与传统光源比较，LED灯是具有体积小、省电、发光效率佳、寿命长、操作反应速度快、且无热辐射与水银等有毒物质的污染等优点，因此近几年来，LED灯的应用面已极为广泛。过去由于LED灯的亮度还无法取代传统的照明光源，但随着技术领域的不断提升，目前已研发出高照明辉度的高功率发光二极管，其足以取代传统的照明光源。然而，传统使用发光二极管灯具仍然无法有效提升整体的出光效率。
习知的LED灯封装结构通常包括基板、位于基板上的电极、承载于基板上并与电极电性连接的发光二极管芯片以及覆盖发光二极管芯片于基板上的封装体。为改善发光二极管芯片发光特性，通常会在发光二极管封装结构中设置荧光颗粒，参见图1与图2所示，其中，图1中各组件分别如下：基板本体101、LED组件102、围绕式反射框架105、封装胶体110、硅胶120、硅胶130、荧光颗粒131。其中，图2中各组件分别如下：基板本体201、LED组件202、围绕式反射框架205、硅胶230、荧光颗粒231。荧光颗粒通常是采用点胶或喷涂的方式涂覆在封装体的出光面上，然而由于喷涂的随机性容易导致荧光颗粒分布不均匀；或者在形成封装体之前混合在封装材料中，而由于封装材料凝固时悬浮在封装材料中的荧光颗粒会发生沉积，或荧光颗粒过多造成荧光颗粒产生的光被其它荧光颗粒阻挡，造成发光效率的降低，或是固化后的封装体中的荧光颗粒分布不均匀，从而影响发光二极管封装结构最终的出光效果。
因此，如何制造成本低廉的LED灯，及其所生产的色温过高问题，并且避免亮度不足现象，亦即提高单位的亮度，仍为当前业界亟思改善的产业上的需求。
有鉴于上述现有的LED灯存在的缺陷，本发明人基于从事此类产品设 计制造多年丰富的实务经验及专业知识，积极加以研究创新，以期创设一种新的一种LED灯及其增加流明的方法，使其更具有实用性。经过不断的研究、设计,并经反复试作样品及改进后，终于创设出确具实用价值的本发明。
发明内容
本发明的目的在于提供一种LED灯以解决目前产业上所面临的问题，同时提升LED灯的亮度。
本发明的目的及解决其技术问题是采用以下技术方案来实现的。
一种LED灯，其中该LED灯包含：基板本体；至少一个反射杯，该反射杯设置于该基板本体上且该反射杯的倾斜面与该基板本体的夹角介于15度到80度；至少一个LED组件，该LED组件设置于该基板本体上且电性连接于该基板本体；与至少一个荧光单元，该荧光单元是荧光颗粒与黏着剂的混合层，其中，该荧光单元更包含LED组件顶层、LED组件侧面层、反射杯斜面表层及基板本体表层；该LED组件顶层是设置于该LED组件远离该基板本体的一面，并且厚度介于1奈米到10厘米；该LED组件侧面层是设置于该LED组件与该基板本体垂直的一面，并且厚度介于1奈米到10厘米；该反射杯斜面表层是设置于该反射杯倾斜面，并且厚度介于1奈米到10厘米；该基板本体表层是设置于该基板本体表面介于该LED组件与该反射杯之间，并且厚度介于1奈米到10厘米；其中，该LED组件侧面层与该反射杯斜面表层相加厚度小于该LED组件与该基板本体垂直的一面与该反射杯倾斜面的距离；其中，该基板本体表层小于该LED组件远离该基板本体的一面与基板本体表面的距离；该反射杯斜面表层覆盖该反射杯的倾斜面，其中该反射杯斜面表层的荧光颗粒覆盖该反射杯的倾斜面的面积大于50％。
本发明的目的及解决其技术问题还可采用以下技术方案来实现的。
一种LED灯，其中该LED灯包含：基板本体；至少一个反射杯，该反射杯设置于该基板本体上且该反射杯的倾斜面与该基板本体的夹角介于15度到80度；至少一个LED组件，该LED组件设置于该基板本体上且电性连接于该基板本体；至少一个荧光单元，该荧光单元是荧光颗粒与黏着剂的混合层，其中，该荧光单元更包含LED组件顶层、LED组件侧面层、反射杯斜面表层、基板本体表层及反射杯顶表层；该LED组件顶层是设置于该LED组件远离该基板本体的一面，并且厚度介于1奈米到10厘米；该LED组件侧面层是设置于该LED组件与该基板本体垂直的一面，并且厚度介于1奈 米到10厘米；该反射杯斜面表层是设置于该反射杯倾斜面，并且厚度介于1奈米到10厘米；该基板本体表层是设置于该基板本体表面介于该LED组件与该反射杯之间，并且厚度介于1奈米到10厘米；该反射杯顶面层是设置于反射杯顶部表面，并且厚度介于1奈米以上；其中，该LED组件侧面层与该反射杯斜面表层相加厚度小于该LED组件与该基板本体垂直的一面与该反射杯倾斜面的距离；其中，该基板本体表层小于该LED组件远离该基板本体的一面与基板本体表面的距离；该反射杯斜面表层覆盖该反射杯的倾斜面，其中该反射杯斜面表层的荧光颗粒覆盖该反射杯的倾斜面的面积大于50％；与至少一个封装单元，其是覆盖上述LED组件、该反射杯、与该荧光单元的封装胶体。
本发明的目的及解决其技术问题还可采用以下技术方案来实现的。
一种LED灯，其中该LED灯包含：反射杯；至少一个LED组件，该LED组件设置于该反射杯内，且该反射杯的倾斜面与该反射杯的底端面的夹角介于15度到80度；至少一个荧光单元，该荧光单元是荧光颗粒与黏着剂的混合层，其中，该荧光单元更包含LED组件顶层、LED组件侧面层、反射杯斜面表层及反射杯顶表层；该LED组件顶层是设置于该LED组件远离该反射杯的底端面的一面，并且厚度介于1奈米到10厘米；该LED组件侧面层是设置于该LED组件与该反射杯的底端面垂直的一面，并且厚度介于1奈米到10厘米；该反射杯斜面表层是设置于该反射杯倾斜面，并且厚度介于1奈米到10厘米；该反射杯顶面层是设置于反射杯顶部表面，并且厚度介于1奈米以上；其中，该LED组件侧面层与该反射杯斜面表层相加厚度小于该LED组件与该反射杯的底端面垂直的一面与该反射杯倾斜面的距离；该反射杯斜面表层覆盖该反射杯的倾斜面，其中该反射杯斜面表层的荧光颗粒覆盖该反射杯的倾斜面的面积大于50％；与至少一个封装单元，其是覆盖上述LED组件、该反射杯、与该荧光单元的封装胶体。
本发明的目的及解决其技术问题还可采用以下技术方案来实现的。
一种LED灯增加流明的方法，其中包含：提供至少一个反射杯，该反射杯设置于基板本体上且该反射杯的倾斜面与该基板本体的夹角介于15度到80度，LED组件设置且电性连接于该基板本体上；提供至少一个荧光单元，该荧光单元是荧光颗粒与黏着剂的混合层，其中，该荧光单元更包含LED组件顶层、LED组件侧面层、反射杯斜面表层及基板本体表层；该LED组件顶层是设置于该LED组件远离该基板本体的一面，并且厚度介于1奈米到10厘米；该LED组件侧面层是设置于该LED组件与该基板本体垂直的 一面，并且厚度介于1奈米到10厘米；该反射杯斜面表层是设置于该反射杯倾斜面，并且厚度介于1奈米到10厘米；该基板本体表层是设置于该基板本体表面介于该LED组件与该反射杯之间，并且厚度介于1奈米到10厘米；其中，该LED组件侧面层与该反射杯斜面表层相加厚度小于该LED组件与该基板本体垂直的一面与该反射杯倾斜面的距离；其中，该基板本体表层小于该LED组件远离该基板本体的一面与基板本体表面的距离；该反射杯斜面表层覆盖该反射杯的倾斜面，其中该反射杯斜面表层的荧光颗粒覆盖该反射杯的倾斜面的面积大于50％；借由电性驱动使该LED组件进行自发光程序以产生自发光；与借由自发光与该荧光单元进行激发光程序以产生激发光。
本发明的目的及解决其技术问题还采用以下的技术措施来实现
前述的LED灯，其中上述的黏着剂包含环氧树脂、硅胶、腊、石蜡烃、陶瓷粉、石墨烯和玻璃粉。
前述的LED灯，其中该LED组件顶层的厚度介于1奈米到1厘米。
前述的LED灯，其中该LED组件侧面层的厚度介于1奈米到1厘米。
前述的LED灯，其中该反射杯斜面表层的厚度介于1奈米到1厘米。
前述的LED灯，其中该基板本体表层的厚度介于1奈米到1厘米。
前述的LED灯，其中该反射杯的倾斜面与该基板本体的夹角介于30度到60度。
前述的LED灯，其中该反射杯斜面表层的荧光颗粒覆盖该反射杯的倾斜面的面积大于65％。
前述的LED灯，其中该基板本体表层厚度小于该LED组件顶层厚度。
前述的LED灯，其中该反射杯顶面层的厚度介于1奈米以上。
本发明与现有技术相比具有明显的优点和有益效果。借由上述技术方案,本发明一种LED灯及其增加流明的方法至少具有下列优点及有益效果：
本发明的LED灯，本发明改善了旧有发光二极管的缺点，同时提升LED灯的亮度，具有明显的市场价值。
上述说明仅是本发明技术方案的概述，为了能够更清楚了解本发明的技术手段，而可依照说明书的内容予以实施，并且为了让本发明的上述和其他目的、特征和优点能够更明显易懂，以下特举较佳实施例，并配合附图,详细说明如下。
附图的简要说明
图1为现有技术的一实施例的示意图；
图2为现有技术的一实施例的示意图；
图3为本发明的一较佳实施例的示意图；
图4为本发明的一较佳实施例的示意图；
图5为本发明的一较佳实施例的示意图；
图6A为本发明的一较佳实施例显微镜放大图；
图6B为本发明的一较佳实施例显微镜放大图；
图6C为本发明的一较佳实施例显微镜放大图；
图7A为本发明的一较佳实施例显微镜放大图；
图7B为本发明的一较佳实施例显微镜放大图；
图7C为本发明的一较佳实施例显微镜放大图；
图8A为本发明的一较佳实施例显微镜放大图；
图8B为本发明的一较佳实施例显微镜放大图；
图8C为本发明的一较佳实施例显微镜放大图；
图9A为本发明的一较佳实施例显微镜放大图；
图9B为本发明的一较佳实施例显微镜放大图；
图9C为本发明的一较佳实施例显微镜放大图。
图10A为本发明的一较佳实施例显微镜放大图；
图10B为本发明的一较佳实施例显微镜放大图；与
图10C为本发明的一较佳实施例显微镜放大图。
附图标号
101：基板本体                 102：LED组件
105：围绕式反射框             110：封装胶体
120：硅胶                     130：硅胶
131：荧光颗粒                 201：基板本体
202：LED组件                  205：围绕式反射框架
230：硅胶                     231:荧光颗粒
300:LED灯                     301:基板本体
305:反射杯
R:反射杯305的倾斜面与该基板本体301的夹角
310:LED组件                   320:荧光单元
321:LED组件顶层               322:LED组件侧面层
323:反射杯斜面表层            324:基板本体表层
W：LED组件顶层的厚度          V：LED组件侧面层的厚度
Y：反射杯斜面表层的厚度       U：基板本体表层的厚度
400：LED灯                    401：基板本体
405：反射杯
R：反射杯405的倾斜面与该基板本体401的夹角
410：LED组件                  420：荧光单元
421：LED组件顶层              422：LED组件侧面层
423：反射杯斜面表层           424：基板本体表层
425：反射杯顶表层             Z：反射杯顶面层的厚度
430：封装单元                 500：LED灯
505：反射杯
R：反射杯505的倾斜面与该反射杯505的底端面的夹角
510：LED组件                  520：荧光单元
521：LED组件顶层              522：LED组件侧面层
523：反射杯斜面表层           525：反射杯顶表层
530：封装单元
实现发明的最佳方式
本发明在此所探讨的是一种LED灯。为了能彻底地了解本发明，将在下列的描述中提出详尽的原料、步骤和应用。显然地，本发明的施行并未限定于该领域的技艺者所熟习的特殊细节。另一方面，众所周知的原料或步骤并未描述于细节中，以避免造成本发明不必要的限制。本发明的范例会详细描述如下，然而除了这些详细描述之外，本发明还可以广泛地施行在其他的范例中，且本发明的范围不受限定，其以之后的专利范围为准。
根据本发明的一较佳实施范例，如图3所示，本发明提供一种LED灯300，该LED灯300包含：基板本体301；至少一个反射杯305，该反射杯305设置于该基板本体301上且该反射杯305的倾斜面与该基板本体301的夹角R介于15度到80度；至少一个LED组件310，该LED组件310设置于该基板本体301上且电性连接于该基板本体301；与荧光单元320，该荧光单元320是荧光颗粒与黏着剂的混合层，其中，该荧光单元320更包含LED组件顶层321、LED组件侧面层322、反射杯斜面表层323及基板本体表层324；该LED组件顶层321是设置于该LED组件310远离该基板本体301的 一面，并且LED组件顶层的厚度W介于1奈米到10厘米；该LED组件侧面层322是设置于该LED组件310与该基板本体301垂直的一面，并且LED组件侧面层的厚度V介于1奈米到10厘米；该反射杯斜面表层323是设置于该反射杯305的倾斜面，并且反射杯斜面表层的厚度Y介于1奈米以上；该基板本体表层324是设置于该基板本体301表面介于该LED组件310与该反射杯305之间，并且基板本体表层的厚度U介于1奈米到10厘米；其中，该LED组件侧面层322不与该反射杯斜面表层323相接；其中，该基板本体表层324不高于该LED组件顶层321；该反射杯斜面表层323覆盖该反射杯305的倾斜面，其中该反射杯斜面表层323的荧光颗粒覆盖该反射杯305的倾斜面的面积大于50％。
根据本发明的一较佳实施范例，如图4所示，本发明提供一种LED灯400，该LED灯400包含：基板本体401；至少一个反射杯405，该反射杯405设置于该基板本体401上且该反射杯405的倾斜面与该基板本体401的夹角R介于15度到80度；至少一个LED组件410，该LED组件410设置于该基板本体401上且电性连接于该基板本体401；至少一个荧光单元420，该荧光单元420是荧光颗粒与黏着剂的混合层，其中，该荧光单元420更包含LED组件顶层421、LED组件侧面层422、反射杯斜面表层423、基板本体表层424及反射杯顶表层425；该LED组件顶层421是设置于该LED组件410远离该基板本体401的一面，并且LED组件顶层的厚度W介于1奈米到10厘米；该LED组件侧面层422是设置于该LED组件410与该基板本体401垂直的一面，并且LED组件侧面层的厚度V介于1奈米到10厘米；该反射杯斜面表层423是设置于该反射杯405的倾斜面，并且反射杯斜面表层的厚度Y介于1奈米以上；该基板本体表层424是设置于该基板本体401表面介于该LED组件410与该反射杯405之间，并且基板本体表层的厚度U介于1奈米到10厘米；该反射杯顶面层425是设置于反射杯405顶部表面，并且反射杯顶面层的厚度Z介于1奈米以上；其中，该LED组件侧面层422不与该反射杯斜面表层423相接；其中，该基板本体表层424不高于该LED组件顶层421；该反射杯斜面表层423覆盖该反射杯405的倾斜面，其中该反射杯斜面表层423的荧光颗粒覆盖该反射杯405的倾斜面的面积大于50％；至少一个封装单元430，其是覆盖上述LED组件410、该反射杯405、与该荧光单元420的封装胶体。
再者，该反射杯顶面层425与该封装单元430是用以增加上述LED灯400的亮度。
根据本发明的一较佳实施范例，如图5所示，本发明提供一种LED灯500，该LED灯500包含：反射杯505；至少一个LED组件510，该LED组件510设置于该反射杯505内，且该反射杯505的倾斜面与该反射杯505的底端面的夹角R介于15度到80度；至少一个荧光单元520，该荧光单元520是荧光颗粒与黏着剂的混合层，其中，该荧光单元520更包含LED组件顶层521、LED组件侧面层522、反射杯斜面表层523及反射杯顶表层525；该LED组件顶层521是设置于该LED组件510远离该反射杯505的底端面的一面，并且厚度W介于1奈米到10厘米；该LED组件侧面层522是设置于该LED组件510与该反射杯505的底端面垂直的一面，并且厚度V介于1奈米到10厘米；该反射杯斜面表层523是设置于该反射杯505倾斜面，并且厚度Y介于1奈米到10厘米；该反射杯顶面层525是设置于反射杯505顶部的表面，并且厚度Z介于1奈米以上；其中，该LED组件侧面层522与该反射杯斜面表层523相加厚度小于该LED组件510与该反射杯505的底端面垂直的一面与该反射杯505倾斜面的距离；该反射杯斜面表层523覆盖该反射杯505的倾斜面，其中该反射杯斜面表层523的荧光颗粒覆盖该反射杯505的倾斜面的面积大于50％；与至少一封装单元530，其是覆盖上述LED组件510、该反射杯505、与该荧光单元520的封装胶体。
参考图6A至图6C所示，根据本实施范例，该反射杯305的倾斜面部分未有荧光颗粒覆盖。该反射杯斜面表层323的荧光颗粒覆盖该反射杯305的倾斜面的面积约60％，反射杯斜面表层的厚度Y约50微米。
参考图7A至图7C所示，根据本实施范例，该反射杯305的倾斜面部分未有荧光颗粒覆盖。该反射杯斜面表层323的荧光颗粒覆盖该反射杯305的倾斜面的面积约70％，反射杯斜面表层的厚度Y约70微米。
参考图8A至图8C所示，根据本实施范例，该反射杯305的倾斜面部分未有荧光颗粒覆盖。该反射杯斜面表层323的荧光颗粒覆盖该反射杯305的倾斜面的面积约80％，反射杯斜面表层的厚度Y约80微米。
参考图9A至图9C所示，根据本实施范例，该反射杯305的倾斜极少面部分未有荧光颗粒覆盖。该反射杯斜面表层323的荧光颗粒覆盖该反射杯305的倾斜面的面积约90％，反射杯斜面表层的厚度Y约100微米。
参考图10A至图10C所示，根据本实施范例，该反射杯305的倾斜极少面部分未有荧光颗粒覆盖。该反射杯斜面表层323的荧光颗粒覆盖该反射杯305的倾斜面的面积约100％，反射杯斜面表层的厚度Y约200微米。
根据上述实施范例，该反射杯斜面表层323的荧光颗粒覆盖该反射杯 305的倾斜面的面积约60％，反射杯斜面表层的厚度Y约50微米，此时借由测试设备LED光谱测试机DP76以点测功率350mA进行测试得到色温2万～3万K，亮度147.8Lm，此外，借由测试设备大积分球以点测功率1.08W进行测试得到色温15850K，亮度127Lm。反射杯斜面表层323的荧光颗粒覆盖该反射杯305的倾斜面的面积约70％～100％，测量色温及亮度结果如下列表所示：
Figure PCTCN2018108286-appb-000001
此外，该反射杯斜面表层323的荧光颗粒覆盖该反射杯305的倾斜面的面积小于60％，借由测试设备DP76以点测功率350mA进行测试得到色温大于2万～3万K，不在本实施例讨论。
再者，反射杯斜面表层的厚度Y须高于芯片以上1奈米(nm)～无限大以内的荧光反射层,也就是说从基板本体301的表面到LED组件310的表面以上1奈米～无限大范围分布比例。反射杯斜面表层的厚度Y界定在1奈米～无限大，因为只要荧光颗粒覆盖该反射杯305的倾斜面分布达到100％之后，反射杯斜面表层的厚度Y是不影响反射杯的激发亮度，只有LED组件310的表面上的LED组件顶层的厚度W会影响到色温变化跟亮度。
根据本发明的另一目的提供一种LED灯300增加流明的方法，该LED 灯300增加流明的方法包含：提供至少一个反射杯305，该反射杯305设置于基板本体301上且该反射杯305的倾斜面与该基板本体301的夹角R介于15度到70度，LED组件310设置且电性连接于该基板本体301上；提供至少一个荧光单元320，该荧光单元320是荧光颗粒与黏着剂的混合层，其中，该荧光单元320更包含LED组件顶层321、LED组件侧面层322、反射杯斜面表层323及基板本体表层324；该LED组件顶层321是设置于该LED组件远离该基板本体301的一面，并且厚度W介于1奈米到10厘米；该LED组件侧面层322是设置于该LED组件310与该基板本体301垂直的一面，并且厚度V介于1奈米到10厘米；该反射杯斜面表层323是设置于该反射杯305倾斜面，并且厚度Y介于1奈米以上；该基板本体表层324是设置于该基板本体301表面介于该LED组件与该反射杯305之间，并且厚度U介于1奈米到10厘米；其中，该LED组件侧面层322不与该反射杯斜面表层323相接；其中，该基板本体表层324不高于该LED组件顶层321；该反射杯斜面表层323覆盖该反射杯305的倾斜面，其中该反射杯斜面表层323的荧光颗粒覆盖该反射杯305的倾斜面的面积大于50％；借由电性驱动使该LED组件310进行自发光程序以产生自发光；与借由自发光与该荧光单元进行激发光程序以产生激发光。
综上所述，本发明的LED灯，本发明改善了旧有发光二极管的缺点，具有明显的市场价值。显然地，依照上面实施例中的描述，本发明可能有许多的修正与差异。因此需在其附加的权利请求项的范围内加以理解，除上述详细描述外，本发明还可以广泛地在其他的实施例中施行。上述仅为本发明的较佳实施例而已，并非用以限定本发明的申请专利范围；凡其它未脱离本发明所揭示的精神下所完成的等效改变或修饰，均应包含在下述申请专利范围内。
有关本发明的前述及其他技术内容、特点及功效，在以下配合参考图式的较佳实施例的详细说明中将可清楚呈现。通过具体实施方式的说明,当可对本发明为达成预定目的所采取的技术手段及功效得一更加深入且具体的了解，然而所附图式仅是提供参考与说明之用，并非用来对本发明加以限制。
有关本发明的前述及其他技术内容、特点及功效，在以下配合参考图式的较佳实施例的详细说明中将可清楚的呈现。为了方便说明,在以下的实施例中，相同的组件以相同的编号表示。
通过具体实施方式的说明，当可对本发明为达成预定目的所采取的技 术手段及功效得一更加深入且具体的了解，然而所附图式仅是提供参考与说明之用，并非用来对本发明加以限制。

Claims (13)

  1. 一种LED灯，其特征在于该LED灯包含：
    基板本体；
    至少一个反射杯，该反射杯设置于该基板本体上且该反射杯的倾斜面与该基板本体的夹角介于15度到80度；
    至少一个LED组件，该LED组件设置于该基板本体上且电性连接于该基板本体；与
    至少一个荧光单元，该荧光单元是荧光颗粒与黏着剂的混合层，其中，该荧光单元更包含LED组件顶层、LED组件侧面层、反射杯斜面表层及基板本体表层；该LED组件顶层是设置于该LED组件远离该基板本体的一面，并且厚度介于1奈米到10厘米；该LED组件侧面层是设置于该LED组件与该基板本体垂直的一面，并且厚度介于1奈米到10厘米；该反射杯斜面表层是设置于该反射杯倾斜面，并且厚度介于1奈米到10厘米；该基板本体表层是设置于该基板本体表面介于该LED组件与该反射杯之间，并且厚度介于1奈米到10厘米；其中，该LED组件侧面层与该反射杯斜面表层相加厚度小于该LED组件与该基板本体垂直的一面与该反射杯倾斜面的距离；其中，该基板本体表层小于该LED组件远离该基板本体的一面与基板本体表面的距离；该反射杯斜面表层覆盖该反射杯的倾斜面，其中该反射杯斜面表层的荧光颗粒覆盖该反射杯的倾斜面的面积大于50％。
  2. 一种LED灯，其特征在于该LED灯包含：
    基板本体；
    至少一个反射杯，该反射杯设置于该基板本体上且该反射杯的倾斜面与该基板本体的夹角介于15度到80度；
    至少一个LED组件，该LED组件设置于该基板本体上且电性连接于该基板本体；
    至少一个荧光单元，该荧光单元是荧光颗粒与黏着剂的混合层，其中，该荧光单元更包含LED组件顶层、LED组件侧面层、反射杯斜面表层、基板本体表层及反射杯顶表层；该LED组件顶层是设置于该LED组件远离该基板本体的一面，并且厚度介于1奈米到10厘米；该LED组件侧面层是设置于该LED组件与该基板本体垂直的一面，并且厚度介于1奈米到10厘米； 该反射杯斜面表层是设置于该反射杯倾斜面，并且厚度介于1奈米到10厘米；该基板本体表层是设置于该基板本体表面介于该LED组件与该反射杯之间，并且厚度介于1奈米到10厘米；该反射杯顶面层是设置于反射杯顶部表面，并且厚度介于1奈米以上；其中，该LED组件侧面层与该反射杯斜面表层相加厚度小于该LED组件与该基板本体垂直的一面与该反射杯倾斜面的距离；其中，该基板本体表层小于该LED组件远离该基板本体的一面与基板本体表面的距离；该反射杯斜面表层覆盖该反射杯的倾斜面，其中该反射杯斜面表层的荧光颗粒覆盖该反射杯的倾斜面的面积大于50％；与
    至少一个封装单元，其是覆盖上述LED组件、该反射杯、与该荧光单元的封装胶体。
  3. 一种LED灯，其特征在于该LED灯包含：
    反射杯；
    至少一个LED组件，该LED组件设置于该反射杯内，且该反射杯的倾斜面与该反射杯的底端面的夹角介于15度到80度；
    至少一个荧光单元，该荧光单元是荧光颗粒与黏着剂的混合层，其中，该荧光单元更包含LED组件顶层、LED组件侧面层、反射杯斜面表层及反射杯顶表层；该LED组件顶层是设置于该LED组件远离该反射杯的底端面的一面，并且厚度介于1奈米到10厘米；该LED组件侧面层是设置于该LED组件与该反射杯的底端面垂直的一面，并且厚度介于1奈米到10厘米；该反射杯斜面表层是设置于该反射杯倾斜面，并且厚度介于1奈米到10厘米；该反射杯顶面层是设置于反射杯顶部表面，并且厚度介于1奈米以上；其中，该LED组件侧面层与该反射杯斜面表层相加厚度小于该LED组件与该反射杯的底端面垂直的一面与该反射杯倾斜面的距离；该反射杯斜面表层覆盖该反射杯的倾斜面，其中该反射杯斜面表层的荧光颗粒覆盖该反射杯的倾斜面的面积大于50％；与
    至少一个封装单元，其是覆盖上述LED组件、该反射杯、与该荧光单元的封装胶体。
  4. 一种LED灯增加流明的方法，其特征在于包含：
    提供至少一个反射杯，该反射杯设置于基板本体上且该反射杯的倾斜面与该基板本体的夹角介于15度到80度，LED组件设置且电性连接于该基板本体上；
    提供至少一个荧光单元，该荧光单元是荧光颗粒与黏着剂的混合层，其中，该荧光单元更包含LED组件顶层、LED组件侧面层、反射杯斜面表层 及基板本体表层；该LED组件顶层是设置于该LED组件远离该基板本体的一面，并且厚度介于1奈米到10厘米；该LED组件侧面层是设置于该LED组件与该基板本体垂直的一面，并且厚度介于1奈米到10厘米；该反射杯斜面表层是设置于该反射杯倾斜面，并且厚度介于1奈米到10厘米；该基板本体表层是设置于该基板本体表面介于该LED组件与该反射杯之间，并且厚度介于1奈米到10厘米；其中，该LED组件侧面层与该反射杯斜面表层相加厚度小于该LED组件与该基板本体垂直的一面与该反射杯倾斜面的距离；其中，该基板本体表层小于该LED组件远离该基板本体的一面与基板本体表面的距离；该反射杯斜面表层覆盖该反射杯的倾斜面，其中该反射杯斜面表层的荧光颗粒覆盖该反射杯的倾斜面的面积大于50％；
    借由电性驱动使该LED组件进行自发光程序以产生自发光；与
    借由自发光与该荧光单元进行激发光程序以产生激发光。
  5. 根据权利要求1、2、3中的任意一项所述的LED灯，其特征在于上述的黏着剂包含环氧树脂、硅胶、腊、石蜡烃、陶瓷粉、石墨烯和玻璃粉。
  6. 根据权利要求1、2、3中任意一项所述的LED灯，其特征在于该LED组件顶层的厚度介于1奈米到1厘米。
  7. 根据权利要求1、2、3中任意一项所述的LED灯，其特征在于该LED组件侧面层的厚度介于1奈米到1厘米。
  8. 根据权利要求1、2、3中任意一项所述的LED灯，其特征在于该反射杯斜面表层的厚度介于1奈米到1厘米。
  9. 根据权利要求1或2中所述的LED灯，其特征在于该基板本体表层的厚度介于1奈米到1厘米。
  10. 根据权利要求1、2、3中任意一项所述的LED灯，其特征在于该反射杯的倾斜面与该基板本体的夹角介于30度到60度。
  11. 根据权利要求1、2、3中任意一项所述的LED灯，其特征在于该反射杯斜面表层的荧光颗粒覆盖该反射杯的倾斜面的面积大于65％。
  12. 根据权利要求1、2、3中任意一项所述的LED灯，其特征在于该基板本体表层厚度小于该LED组件顶层厚度。
  13. 根据权利要求2或3所述的LED灯，其特征在于该反射杯顶面层的厚度介于1奈米以上。
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