WO2020027047A1 - Heater - Google Patents

Heater Download PDF

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Publication number
WO2020027047A1
WO2020027047A1 PCT/JP2019/029643 JP2019029643W WO2020027047A1 WO 2020027047 A1 WO2020027047 A1 WO 2020027047A1 JP 2019029643 W JP2019029643 W JP 2019029643W WO 2020027047 A1 WO2020027047 A1 WO 2020027047A1
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WIPO (PCT)
Prior art keywords
conductive layer
heater
lead
lead portion
ceramic
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PCT/JP2019/029643
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French (fr)
Japanese (ja)
Inventor
祥二 井筒
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京セラ株式会社
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Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Priority to JP2020533535A priority Critical patent/JP6987995B2/en
Publication of WO2020027047A1 publication Critical patent/WO2020027047A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
    • F23Q—IGNITION; EXTINGUISHING-DEVICES
    • F23Q7/00—Incandescent ignition; Igniters using electrically-produced heat, e.g. lighters for cigarettes; Electrically-heated glowing plugs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details

Definitions

  • the present disclosure relates to a heater used for various sensors or measuring devices such as a combustion-type in-vehicle heating device, an oil fan heater, a glow plug of an automobile engine, and an oxygen sensor.
  • a heater described in JP-A-2005-052587 (hereinafter, also referred to as Patent Document 1) is known.
  • the heater described in Patent Literature 1 has a ceramic base and a heating resistor disposed on the ceramic base.
  • the heat generating resistor has a pair of lead portions and a heat generating portion having both ends connected to the pair of lead portions.
  • a heater includes a plate-shaped ceramic body having a main surface and a side surface, on which a plurality of ceramic layers are stacked, a strip-shaped first conductive layer provided between layers of the ceramic layers, and a first conductive layer.
  • a second conductive layer provided on the surface of the layer, wherein the first conductive layer has a heat-generating portion having a folded shape, and a lead portion whose end is drawn out to the side surface of the ceramic layer,
  • a connecting portion that connects the heat generating portion and the lead portion, and has a connection portion that increases in width from the heat generating portion toward the lead portion, wherein the second conductive layer overlaps a surface of the lead portion. And is not located on the surface of the connecting portion.
  • FIG. 1 is a perspective view illustrating an example of a heater according to the present disclosure. It is sectional drawing which shows the heater of FIG. It is sectional drawing which shows the heater of FIG. It is sectional drawing which shows another example of a heater. It is a perspective view which shows another example of a heater.
  • FIG. 1 is a cross-sectional view illustrating a heater 10 according to an example of the present disclosure.
  • the heater 10 includes a plate-shaped ceramic body 1, and a first conductive layer 2 and a second conductive layer 3 located inside the ceramic body 1.
  • FIG. 1 is a perspective view, the ceramic body 1 is shown through the ceramic body 1 for ease of understanding.
  • the ceramic body 1 is formed by laminating a plurality of ceramic layers.
  • the ceramic body 1 is a plate-shaped member having a main surface 11 and a side surface 12.
  • the ceramic body 1 has, for example, a square plate shape or a round plate shape.
  • the shape of the ceramic body 1 is, for example, a shape having a longitudinal direction.
  • the material of the ceramic body 1 includes alumina or silicon nitride.
  • the shape of the ceramic body 1 is a square plate having a longitudinal direction, the length is set to 20 to 100 mm, the width is set to 3 to 15 mm, and the thickness is set to 0.4 to 3 mm. be able to.
  • the first conductive layer 2 is a member that generates heat when energized.
  • the first conductive layer 2 is provided between a plurality of ceramic layers.
  • the first conductive layer 2 is a band-shaped member.
  • the first conductive layer 2 is a member having a length, a width, and a thickness.
  • the first conductive layer 2 has a member such as platinum, tungsten or tungsten carbide.
  • the first conductive layer 2 can have, for example, a length of 10 to 150 mm, a width of 0.8 to 5 mm, and a thickness of 0.02 to 1 mm.
  • the first conductive layer 2 may have a constant thickness.
  • the first conductive layer 2 has a heat generating part 21, a lead part 22, and a connecting part 23.
  • the heat generating part 21 has a folded shape.
  • the heat generating portion 21 can have a length of 5 to 30 mm, a width of 0.8 to 5 mm, and a thickness of 0.02 to 0.2 mm, for example.
  • the lead portion 22 has an end drawn out to the side surface 12 of the ceramic body 1.
  • the lead portion 22 is connected to a terminal on the side surface 12 of the ceramic body 1 and may be supplied with electricity.
  • the lead portion 22 can have, for example, a length of 5 to 30 mm, a width of 0.8 to 5 mm, and a thickness of 0.02 to 0.2 mm.
  • the width of the lead portion 22 may be larger than the width of the heat generating portion 21. As a result, the amount of current per unit area in the heating section 21 can be reduced. As a result, the calorific value of the lead portion 22 can be reduced.
  • the connection part 23 is a part that connects the heating part 21 and the lead part 22.
  • one end of the connection part 23 is continuous with the heat generating part 21, and the other end of the connection part 23 is continuous with the lead part 22.
  • the connecting portion 23 can have, for example, a length of 1 to 5 mm, a width of 0.8 to 5 mm, and a thickness of 0.02 to 0.2 mm.
  • the width of the connecting portion 23 increases from the heat generating portion 21 to the lead portion 22.
  • the width of one end of the connecting portion 23 continuous with the heat generating portion 21 is set to 0.08 to 5 mm
  • the width of the other end of the connecting portion 23 continuous to the lead portion 22 is set to 2 to 5 mm. it can.
  • FIG. 2 is a cross-sectional view including the first conductive layer 2 of the heater 10 and perpendicular to the direction in which the ceramic layers are stacked.
  • two connecting portions 23 and two lead portions 22 may be provided.
  • the second conductive layer 3 is a member that generates heat when energized.
  • Second conductive layer 3 is located on the surface of first conductive layer 2.
  • the second conductive layer 3 is located so as to overlap the surface of the lead portion 22 of the first conductive layer 2. Thereby, the amount of current per unit area in the lead portion 22 can be reduced. Therefore, the amount of heat generated by the lead portion 22 can be reduced.
  • the second conductive layer 3 is a band-shaped member. In other words, the second conductive layer 3 is an elongated member having a length, a width, and a thickness.
  • the second conductive layer 3 has a member such as platinum, tungsten, or tungsten carbide.
  • the second conductive layer 3 may be the same member as the first conductive layer 2, or may be a member having a smaller resistance value than the first conductive layer 2.
  • the second conductive layer 3 can have, for example, a length of 10 to 140 mm, a width of 2 to 5 mm, and a thickness of 0.2 to 1 mm.
  • the first conductive layer 2 and the second conductive layer 3 may have a constant thickness.
  • the thickness of the conductive layer may be increased at a boundary between a portion where the second conductive layer 3 is provided and a portion where the second conductive layer 3 is not provided.
  • the “conductive layer” means a portion where the first conductive layer 2 and the second conductive layer 3 are combined.
  • the second conductive layer 3 is located so as to overlap the surface of the lead portion 22 and is not located on the surface of the connection portion 23. Thereby, it is possible to displace the connecting portion 23 of the conductive layer where the width changes, and the portion where the second conductive layer 3 is provided. In other words, the connection portion 23 of the conductive layer whose width changes and the portion where the thickness changes can be shifted. Therefore, when a strong current flows through the conductive layer, the possibility that stress concentrates on the connection portion 23 can be reduced. Thereby, the possibility that the connection part 23 is damaged and the electrical connection is interrupted can be reduced. As a result, the durability of the heater 10 can be improved.
  • FIG. 3 is a cross-sectional view passing through the first conductive layer 2 and perpendicular to the main surface 11.
  • the second conductive layer 3 may cover the side surface of the lead 22 as shown in FIG. Thereby, when an external force is applied to the side surface 12 of the ceramic body 1, the possibility that the lead portion 22 is damaged can be reduced. As a result, the durability of the heater 10 can be improved.
  • FIG. 4 shows a cross section perpendicular to the longitudinal direction of the ceramic body 1.
  • the second conductive layer 3 covers the side surface of the lead 22, and the resistance of the second conductive layer 3 may be smaller than the resistance of the first conductive layer 2.
  • the amount of heat generated on the side surface of the lead portion 22 can be reduced.
  • the amount of heat transmitted from the conductive layer to the tubular member can be reduced.
  • the durability of the heater 10 can be improved.
  • the “side surface side of the lead portion 22” here means a surface of the side surface of the lead portion 22 that is far from the center of the ceramic body 1 when the cross section shown in FIG. 4 is viewed.
  • the second conductive layer 3 may cover the side surfaces of the lead portions 22 in both of the two lead portions 22. Further, the second conductive layer 3 may cover the side surface of the lead portion 22 in one of the two lead portions 22, and may cover the center side of the lead portion 22 in the other.
  • the shape of the lead portion 22 is a shape having a main surface and side surfaces, and the second conductive layer 3 is It may be provided so as to cover the side surface.
  • the shape of the boundary between the first conductive layer 2 and the second conductive layer 3 may be wavy.
  • stress generated at the boundary between the first conductive layer 2 and the second conductive layer 3 can be dispersed. Therefore, the possibility that separation occurs from the boundary between the first conductive layer 2 and the second conductive layer 3 can be reduced.
  • the wavy shape here may be, for example, a shape in which a convex portion on one side and a convex portion on the other side are alternately repeated.
  • the wavy shape may be a shape in which a portion that curves convexly to one side and a portion that curves convexly to the other are alternately repeated.
  • the wave shape may be a sine wave shape.
  • the shape of the boundary between the first conductive layer 2 and the second conductive layer 3 may be such that a portion that is continuous with the connection portion 23 has a wavy shape.
  • a particularly strong current may flow, so that the stress can be reduced more effectively. Therefore, the possibility that separation occurs from the boundary between the first conductive layer 2 and the second conductive layer 3 can be reduced. As a result, the durability of the heater 10 can be improved.
  • the first conductive layer 2 and the second conductive layer 3 of the heater 10 are shown for the sake of easy understanding.
  • Ceramic body 11 Main surface 12: Side surface 2: First conductive layer 21: Heat generating part 22: Lead part 23: Connection part 3: Second conductive layer 10: Heater

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Resistance Heating (AREA)

Abstract

A heater 10 according to the present disclosure includes: a plate-shaped ceramic body 1 in which a plurality of ceramic layers are stacked; a strip-shaped first conductive layer 2 provided between the ceramic layers; and a second conductive layer 3 provided on the surface of the first conductive layer 2. The first conductive layer 2 has: a heat generator 21 having a folded shape; a lead portion 22 having an end portion pulled out to a side surface 12 of the ceramic layer; and a connection portion 23 which connects the heat generator 21 and the lead portion 22 and of which the width increases from the heat generator 21 toward the lead portion 22. The second conductive layer 3 is located to overlap the surface of the lead portion 22 and is not located on the surface of the connection portion 23.

Description

ヒータheater
　本開示は、例えば、燃焼式車載暖房装置、石油ファンヒータ、自動車エンジンのグロープラグ、酸素センサ等の各種センサまたは測定機器に利用されるヒータに関するものである。 The present disclosure relates to a heater used for various sensors or measuring devices such as a combustion-type in-vehicle heating device, an oil fan heater, a glow plug of an automobile engine, and an oxygen sensor.
　ヒータとして、例えば特開２０１５－０５２５８７号公報（以下、特許文献１ともいう）に記載のヒータが知られている。特許文献１に記載のヒータは、セラミック基体と、セラミック基体に配設された発熱抵抗体とを有している。発熱抵抗体は、一対のリード部と、両端が該一対のリード部に接続された発熱部とを有している。 ヒ ー タ As a heater, for example, a heater described in JP-A-2005-052587 (hereinafter, also referred to as Patent Document 1) is known. The heater described in Patent Literature 1 has a ceramic base and a heating resistor disposed on the ceramic base. The heat generating resistor has a pair of lead portions and a heat generating portion having both ends connected to the pair of lead portions.
　本開示のヒータは、主面および側面を有し、複数のセラミック層が積層された板状のセラミック体と、前記セラミック層の層間に設けられた帯状の第１導電層と、該第１導電層の表面に設けられた第２導電層と、を備えており、前記第１導電層は、折り返し形状を有する発熱部と、端部が前記セラミック層の前記側面に引き出されたリード部と、前記発熱部と前記リード部とを繋ぎ、前記発熱部から前記リード部に向かうにつれて幅が大きくなる接続部と、を有しており、前記第２導電層は、前記リード部の表面に重なって位置しており、前記接続部の表面には位置していないことを特徴とする。 A heater according to an embodiment of the present disclosure includes a plate-shaped ceramic body having a main surface and a side surface, on which a plurality of ceramic layers are stacked, a strip-shaped first conductive layer provided between layers of the ceramic layers, and a first conductive layer. A second conductive layer provided on the surface of the layer, wherein the first conductive layer has a heat-generating portion having a folded shape, and a lead portion whose end is drawn out to the side surface of the ceramic layer, A connecting portion that connects the heat generating portion and the lead portion, and has a connection portion that increases in width from the heat generating portion toward the lead portion, wherein the second conductive layer overlaps a surface of the lead portion. And is not located on the surface of the connecting portion.
本開示のヒータの例を示す斜視図である。1 is a perspective view illustrating an example of a heater according to the present disclosure. 図１のヒータを示す断面図である。It is sectional drawing which shows the heater of FIG. 図１のヒータを示す断面図である。It is sectional drawing which shows the heater of FIG. ヒータの別の例を示す断面図である。It is sectional drawing which shows another example of a heater. ヒータの別の例を示す斜視図である。It is a perspective view which shows another example of a heater.
　本開示のヒータ１０の一例について、図面を用いて詳細に説明する。 の 一 One example of the heater 10 of the present disclosure will be described in detail with reference to the drawings.
　図１は、本開示の一例であるヒータ１０を示す断面図である。図１に示すように、ヒータ１０は、板状のセラミック体１と、セラミック体１の内部に位置する第１導電層２および第２導電層３とを備えている。なお、図１は斜視図であるが、理解しやすさを優先してセラミック体１を透過して示している。 FIG. 1 is a cross-sectional view illustrating a heater 10 according to an example of the present disclosure. As shown in FIG. 1, the heater 10 includes a plate-shaped ceramic body 1, and a first conductive layer 2 and a second conductive layer 3 located inside the ceramic body 1. Although FIG. 1 is a perspective view, the ceramic body 1 is shown through the ceramic body 1 for ease of understanding.
　セラミック体１は、複数のセラミック層が積層されて形成される。セラミック体１は、主面１１と側面１２とを有する板状の部材である。セラミック体１は、例えば角板状または丸板状である。また、セラミック体１の形状は、例えば長手方向を有する形状である。セラミック体１の材質は、アルミナまたは窒化ケイ素を有する。セラミック体１の寸法は、例えばセラミック体１の形状が長手方向を有する角板状のときは、長さを２０～１００ｍｍに、幅を３～１５ｍｍに、厚さを０．４～３ｍｍにすることができる。 The ceramic body 1 is formed by laminating a plurality of ceramic layers. The ceramic body 1 is a plate-shaped member having a main surface 11 and a side surface 12. The ceramic body 1 has, for example, a square plate shape or a round plate shape. The shape of the ceramic body 1 is, for example, a shape having a longitudinal direction. The material of the ceramic body 1 includes alumina or silicon nitride. For example, when the shape of the ceramic body 1 is a square plate having a longitudinal direction, the length is set to 20 to 100 mm, the width is set to 3 to 15 mm, and the thickness is set to 0.4 to 3 mm. be able to.
　第１導電層２は、通電により発熱する部材である。第１導電層２は、複数のセラミック層の層間に設けられている。第１導電層２は、帯状の部材である。言い換えると、第１導電層２は、長さと幅と厚みを有する部材である。第１導電層２は、例えば白金、タングステンまたはタングステンカーバイド等の部材を有する。第１導電層２は、例えば長さを１０～１５０ｍｍ、幅を０．８～５ｍｍ、厚さを０．０２～１ｍｍにすることができる。第１導電層２は、厚さが一定であってもよい。 The first conductive layer 2 is a member that generates heat when energized. The first conductive layer 2 is provided between a plurality of ceramic layers. The first conductive layer 2 is a band-shaped member. In other words, the first conductive layer 2 is a member having a length, a width, and a thickness. The first conductive layer 2 has a member such as platinum, tungsten or tungsten carbide. The first conductive layer 2 can have, for example, a length of 10 to 150 mm, a width of 0.8 to 5 mm, and a thickness of 0.02 to 1 mm. The first conductive layer 2 may have a constant thickness.
　第１導電層２は、発熱部２１と、リード部２２と、接続部２３とを有している。発熱部２１は、折り返し形状を有する。発熱部２１は、例えば長さを５～３０ｍｍ、幅を０．８～５ｍｍ、厚さを０．０２～０．２ｍｍにすることができる。 The first conductive layer 2 has a heat generating part 21, a lead part 22, and a connecting part 23. The heat generating part 21 has a folded shape. The heat generating portion 21 can have a length of 5 to 30 mm, a width of 0.8 to 5 mm, and a thickness of 0.02 to 0.2 mm, for example.
　リード部２２は、端部がセラミック体１の側面１２に引き出されている。リード部２２は、セラミック体１の側面１２において、端子に接続されており、これにより電気が供給されていてもよい。リード部２２は、例えば長さを５～３０ｍｍ、幅を０．８～５ｍｍ、厚さを０．０２～０．２ｍｍにすることができる。リード部２２は、発熱部２１よりも幅が大きくてもよい。これにより、発熱部２１における単位面積当あたりの電流量を減らすことができる。その結果、リード部２２の発熱量を減らすことができる。 The lead portion 22 has an end drawn out to the side surface 12 of the ceramic body 1. The lead portion 22 is connected to a terminal on the side surface 12 of the ceramic body 1 and may be supplied with electricity. The lead portion 22 can have, for example, a length of 5 to 30 mm, a width of 0.8 to 5 mm, and a thickness of 0.02 to 0.2 mm. The width of the lead portion 22 may be larger than the width of the heat generating portion 21. As a result, the amount of current per unit area in the heating section 21 can be reduced. As a result, the calorific value of the lead portion 22 can be reduced.
　接続部２３は、発熱部２１とリード部２２とを繋ぐ部位である。言い換えると、接続部２３の一端が発熱部２１に連続しており、接続部２３の他端がリード部２２に連続している。接続部２３は、例えば長さを１～５ｍｍ、幅を０．８～５ｍｍ、厚さを０．０２～０．２ｍｍにすることができる。図２に示すように、接続部２３は、発熱部２１からリード部２２に向かうにつれて幅が大きくなる。具体的には、接続部２３のうち発熱部２１に連続する一端の幅を０．０８～５ｍｍに、接続部２３のうちリード部２２に連続する他端の幅を２～５ｍｍにすることができる。図２は、ヒータ１０のうち第１導電層２を含み、セラミック層が積層される方向に垂直な断面図である。図２に示すように、接続部２３およびリード部２２は、２つ設けられていてもよい。 The connection part 23 is a part that connects the heating part 21 and the lead part 22. In other words, one end of the connection part 23 is continuous with the heat generating part 21, and the other end of the connection part 23 is continuous with the lead part 22. The connecting portion 23 can have, for example, a length of 1 to 5 mm, a width of 0.8 to 5 mm, and a thickness of 0.02 to 0.2 mm. As shown in FIG. 2, the width of the connecting portion 23 increases from the heat generating portion 21 to the lead portion 22. Specifically, the width of one end of the connecting portion 23 continuous with the heat generating portion 21 is set to 0.08 to 5 mm, and the width of the other end of the connecting portion 23 continuous to the lead portion 22 is set to 2 to 5 mm. it can. FIG. 2 is a cross-sectional view including the first conductive layer 2 of the heater 10 and perpendicular to the direction in which the ceramic layers are stacked. As shown in FIG. 2, two connecting portions 23 and two lead portions 22 may be provided.
　第２導電層３は、通電により発熱する部材である。第２導電層３は、第１導電層２の表面に位置している。第２導電層３は、第１導電層２のうちリード部２２の表面に重なって位置している。これにより、リード部２２における単位面積当たりの電流量を減らすことができる。そのため、リード部２２の発熱量を低減できる。第２導電層３は、帯状の部材である。言い換えると、第２導電層３は、長さと幅と厚みを有する細長い部材である。 The second conductive layer 3 is a member that generates heat when energized. Second conductive layer 3 is located on the surface of first conductive layer 2. The second conductive layer 3 is located so as to overlap the surface of the lead portion 22 of the first conductive layer 2. Thereby, the amount of current per unit area in the lead portion 22 can be reduced. Therefore, the amount of heat generated by the lead portion 22 can be reduced. The second conductive layer 3 is a band-shaped member. In other words, the second conductive layer 3 is an elongated member having a length, a width, and a thickness.
　第２導電層３は、例えば白金、タングステンまたはタングステンカーバイド等の部材を有する。第２導電層３は、第１導電層２と同じ部材であってもよいし、第１導電層２よりも抵抗値が小さい部材であってもよい。これにより、第２導電層３が重ねて設けられた部位の発熱量を低減できる。第２導電層３は、例えば長さを１０～１４０ｍｍ、幅を２～５ｍｍ、厚さを０．２～１ｍｍにすることができる。第１導電層２および第２導電層３は、厚さが一定であってもよい。また、導電層としては、第２導電層３が設けられた部位と第２導電層３が設けられていない部位との境界において、厚さが大きくなっていてもよい。ここで、「導電層」とは、第１導電層２と第２導電層３とを合わせた部分を意味している。 The second conductive layer 3 has a member such as platinum, tungsten, or tungsten carbide. The second conductive layer 3 may be the same member as the first conductive layer 2, or may be a member having a smaller resistance value than the first conductive layer 2. Thus, the amount of heat generated at the portion where the second conductive layer 3 is provided in an overlapping manner can be reduced. The second conductive layer 3 can have, for example, a length of 10 to 140 mm, a width of 2 to 5 mm, and a thickness of 0.2 to 1 mm. The first conductive layer 2 and the second conductive layer 3 may have a constant thickness. In addition, the thickness of the conductive layer may be increased at a boundary between a portion where the second conductive layer 3 is provided and a portion where the second conductive layer 3 is not provided. Here, the “conductive layer” means a portion where the first conductive layer 2 and the second conductive layer 3 are combined.
　本開示のヒータ１０によれば、第２導電層３は、リード部２２の表面に重なって位置しており、接続部２３の表面には位置していない。これにより、導電層のうち幅が変化する接続部２３と、第２導電層３が設けられた部位とをずらすことができる。言い換えると、導電層のうち幅が変化する接続部２３と、厚さが変化する部位とをずらすことができる。そのため、導電層に強い電流を流す場合においては、接続部２３に応力が集中するおそれを低減できる。これにより、接続部２３が破損し、電気的接続が途切れるおそれを低減できる。その結果、ヒータ１０の耐久性を高めることができる。 According to the heater 10 of the present disclosure, the second conductive layer 3 is located so as to overlap the surface of the lead portion 22 and is not located on the surface of the connection portion 23. Thereby, it is possible to displace the connecting portion 23 of the conductive layer where the width changes, and the portion where the second conductive layer 3 is provided. In other words, the connection portion 23 of the conductive layer whose width changes and the portion where the thickness changes can be shifted. Therefore, when a strong current flows through the conductive layer, the possibility that stress concentrates on the connection portion 23 can be reduced. Thereby, the possibility that the connection part 23 is damaged and the electrical connection is interrupted can be reduced. As a result, the durability of the heater 10 can be improved.
　具体的には、図３に示すように、第２導電層３の一端が、接続部２３とリード部２２の境界に位置していてもよい。図３は、第１導電層２を通り主面１１に垂直な断面図である。 Specifically, as shown in FIG. 3, one end of the second conductive layer 3 may be located at a boundary between the connection part 23 and the lead part 22. FIG. 3 is a cross-sectional view passing through the first conductive layer 2 and perpendicular to the main surface 11.
　また、図４に示すように第２導電層３は、リード部２２のうち側面側を覆っていてもよい。これにより、セラミック体１の側面１２に外力が加わったときに、リード部２２が破損するおそれを低減することができる。その結果、ヒータ１０の耐久性を高めることができる。ここで、図４は、セラミック体１の長手方向に垂直な断面を示している。 (4) The second conductive layer 3 may cover the side surface of the lead 22 as shown in FIG. Thereby, when an external force is applied to the side surface 12 of the ceramic body 1, the possibility that the lead portion 22 is damaged can be reduced. As a result, the durability of the heater 10 can be improved. Here, FIG. 4 shows a cross section perpendicular to the longitudinal direction of the ceramic body 1.
　また、第２導電層３は、リード部２２のうち側面側を覆っていており、第２導電層３の抵抗値は、第１導電層２の抵抗値よりも小さくてもよい。これにより、リード部２２の側面側の発熱量を低減することができる。その結果、セラミック体１のうちリード部２２が設けられている近傍を筒状部材によって保持する場合において、導電層から筒状部材に伝わる熱量を低減することができる。その結果、ヒータ１０の耐久性を高めることができる。 {Circle around (2)} The second conductive layer 3 covers the side surface of the lead 22, and the resistance of the second conductive layer 3 may be smaller than the resistance of the first conductive layer 2. Thus, the amount of heat generated on the side surface of the lead portion 22 can be reduced. As a result, when the vicinity of the ceramic body 1 where the lead portions 22 are provided is held by the tubular member, the amount of heat transmitted from the conductive layer to the tubular member can be reduced. As a result, the durability of the heater 10 can be improved.
　なお、ここでいう「リード部２２のうち側面側」とは、図４に示す断面をみたときの、リード部２２の側面のうちセラミック体１の中心から遠い面を意味している。第２導電層３は、図４に示すように２つのリード部２２のうち両方において、リード部２２のうち側面側を覆っていていてもよい。また、第２導電層３は、２つのリード部２２のうち一方において、リード部２２のうち側面側を覆っており、他方において、リード部２２のうち中心側を覆っていてもよい。また、図４に示すように、図４の断面を見たときのリード部２２の形状が主面と側面とを有する形状であって、第２導電層３が、リード部２２の主面と側面とを覆うように設けられていてもよい。 Note that the “side surface side of the lead portion 22” here means a surface of the side surface of the lead portion 22 that is far from the center of the ceramic body 1 when the cross section shown in FIG. 4 is viewed. As shown in FIG. 4, the second conductive layer 3 may cover the side surfaces of the lead portions 22 in both of the two lead portions 22. Further, the second conductive layer 3 may cover the side surface of the lead portion 22 in one of the two lead portions 22, and may cover the center side of the lead portion 22 in the other. As shown in FIG. 4, when the cross section of FIG. 4 is viewed, the shape of the lead portion 22 is a shape having a main surface and side surfaces, and the second conductive layer 3 is It may be provided so as to cover the side surface.
　また、図５に示すように、第１導電層２と第２導電層３との境界の形状は、波状であってもよい。これにより、第１導電層２と第２導電層３との境界において生じる応力を分散させることができる。そのため、第１導電層２と第２導電層３との境界からはがれが生じるおそれを低減することができる。その結果、ヒータ１０の耐久性を高めることができる。ここでいう波状とは、例えば一方に凸の部位と他方に凸の部位とが交互に繰り返される形状であってもよい。また、波状とは、一方に凸に湾曲する部位と他方に凸に湾曲する部位とが交互に繰り返される形状であってもよい。また、波状とは、正弦波状であってもよい。 As shown in FIG. 5, the shape of the boundary between the first conductive layer 2 and the second conductive layer 3 may be wavy. Thereby, stress generated at the boundary between the first conductive layer 2 and the second conductive layer 3 can be dispersed. Therefore, the possibility that separation occurs from the boundary between the first conductive layer 2 and the second conductive layer 3 can be reduced. As a result, the durability of the heater 10 can be improved. The wavy shape here may be, for example, a shape in which a convex portion on one side and a convex portion on the other side are alternately repeated. In addition, the wavy shape may be a shape in which a portion that curves convexly to one side and a portion that curves convexly to the other are alternately repeated. The wave shape may be a sine wave shape.
　また、図５に示すように、第１導電層２と第２導電層３との境界の形状は、接続部２３に連続する部位が波状になっているとよい。第１導電層２と第２導電層３との境界のうち、接続部２３に連続する部位は、特に強い電流が流れるおそれがあるため、より効果的に応力を低減することができる。そのため、第１導電層２と第２導電層３との境界からはがれが生じるおそれを低減することができる。その結果、ヒータ１０の耐久性を高めることができる。なお、図５においては、理解しやすさを優先して、ヒータ１０のうち第１導電層２および第２導電層３を示している。 (5) As shown in FIG. 5, the shape of the boundary between the first conductive layer 2 and the second conductive layer 3 may be such that a portion that is continuous with the connection portion 23 has a wavy shape. In the part of the boundary between the first conductive layer 2 and the second conductive layer 3 which is continuous with the connection part 23, a particularly strong current may flow, so that the stress can be reduced more effectively. Therefore, the possibility that separation occurs from the boundary between the first conductive layer 2 and the second conductive layer 3 can be reduced. As a result, the durability of the heater 10 can be improved. In FIG. 5, the first conductive layer 2 and the second conductive layer 3 of the heater 10 are shown for the sake of easy understanding.
１：セラミック体
１１：主面
１２：側面
２：第１導電層
２１：発熱部
２２：リード部
２３：接続部
３：第２導電層
１０：ヒータ 1: Ceramic body 11: Main surface 12: Side surface 2: First conductive layer 21: Heat generating part 22: Lead part 23: Connection part 3: Second conductive layer 10: Heater

Claims (3)

  1. 　主面および側面を有し、複数のセラミック層が積層された板状のセラミック体と、
    前記セラミック層の層間に設けられた帯状の第１導電層と、
    該第１導電層の表面に設けられた第２導電層と、を備えており、
    前記第１導電層は、折り返し形状を有する発熱部と、端部が前記セラミック層の前記側面に引き出されたリード部と、前記発熱部と前記リード部とを繋ぎ、前記発熱部から前記リード部に向かうにつれて幅が大きくなる接続部と、を有しており、
    前記第２導電層は、前記リード部の表面に重なって位置しており、前記接続部の表面には位置していないヒータ。     A plate-shaped ceramic body having a main surface and side surfaces, and a plurality of ceramic layers laminated,
    A strip-shaped first conductive layer provided between layers of the ceramic layer;
    A second conductive layer provided on the surface of the first conductive layer,
    The first conductive layer includes a heating portion having a folded shape, a lead portion having an end drawn out to the side surface of the ceramic layer, and a connection between the heating portion and the lead portion. And a connection portion whose width increases toward
    The heater, wherein the second conductive layer is located on the surface of the lead portion and not on the surface of the connection portion.
  2. 　前記第２導電層は、前記リード部のうち前記側面側を覆う請求項１に記載のヒータ。 The heater according to claim 1, wherein the second conductive layer covers the side surface of the lead.
  3. 　前記第１導電層と前記第２導電層との境界の形状は、波状である請求項１または請求項２のいずれかに記載のヒータ。 3. The heater according to claim 1, wherein the shape of the boundary between the first conductive layer and the second conductive layer is wavy. 4.
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JPS62188085U (en) * 1986-05-21 1987-11-30
JPS63213284A (en) * 1987-02-27 1988-09-06 エヌオーケー株式会社 Thin film heater and its temperature control
JPH0234097U (en) * 1988-08-27 1990-03-05
JPH0269494U (en) * 1988-11-12 1990-05-25
JPH0340796U (en) * 1989-08-30 1991-04-18
JPH04359710A (en) * 1991-06-06 1992-12-14 Kyocera Corp Ceramic heater
JP2006024394A (en) * 2004-07-06 2006-01-26 Ngk Spark Plug Co Ltd Ceramic heater and glow plug
JP2006222008A (en) * 2005-02-14 2006-08-24 Kyocera Corp Ceramic heater and heater-built-in electronic component
JP2015052587A (en) * 2013-08-05 2015-03-19 日本特殊陶業株式会社 Heater, gas sensor element, and gas sensor
WO2015163483A1 (en) * 2014-04-25 2015-10-29 京セラ株式会社 Heater and ignition device

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62188085U (en) * 1986-05-21 1987-11-30
JPS63213284A (en) * 1987-02-27 1988-09-06 エヌオーケー株式会社 Thin film heater and its temperature control
JPH0234097U (en) * 1988-08-27 1990-03-05
JPH0269494U (en) * 1988-11-12 1990-05-25
JPH0340796U (en) * 1989-08-30 1991-04-18
JPH04359710A (en) * 1991-06-06 1992-12-14 Kyocera Corp Ceramic heater
JP2006024394A (en) * 2004-07-06 2006-01-26 Ngk Spark Plug Co Ltd Ceramic heater and glow plug
JP2006222008A (en) * 2005-02-14 2006-08-24 Kyocera Corp Ceramic heater and heater-built-in electronic component
JP2015052587A (en) * 2013-08-05 2015-03-19 日本特殊陶業株式会社 Heater, gas sensor element, and gas sensor
WO2015163483A1 (en) * 2014-04-25 2015-10-29 京セラ株式会社 Heater and ignition device

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