WO2020026364A1 - Rfid tag - Google Patents

Rfid tag Download PDF

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Publication number
WO2020026364A1
WO2020026364A1 PCT/JP2018/028757 JP2018028757W WO2020026364A1 WO 2020026364 A1 WO2020026364 A1 WO 2020026364A1 JP 2018028757 W JP2018028757 W JP 2018028757W WO 2020026364 A1 WO2020026364 A1 WO 2020026364A1
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WO
WIPO (PCT)
Prior art keywords
heat
rfid tag
base material
sheet
welded
Prior art date
Application number
PCT/JP2018/028757
Other languages
French (fr)
Japanese (ja)
Inventor
孝太郎 竹井
正志 伊藤
Original Assignee
マイティキューブ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by マイティキューブ株式会社 filed Critical マイティキューブ株式会社
Priority to JP2020533958A priority Critical patent/JP7049457B2/en
Priority to PCT/JP2018/028757 priority patent/WO2020026364A1/en
Publication of WO2020026364A1 publication Critical patent/WO2020026364A1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier

Definitions

  • the present invention relates to an RFID tag, and more particularly, to an RFID tag that can be thermally welded to a textile (textile).
  • an RFID tag Radio Frequency Identification Tag
  • a textile product an RFID tag provided with a heat welding sheet or the like has been proposed in order to enhance user convenience.
  • the user can easily attach the RFID tag by thermocompression bonding with an iron or the like (for example, see Patent Documents 1 and 2).
  • the RFID tag described in Patent Literature 1 further includes an adhesive layer for bonding an RFID inlet, a boost antenna, and the like on a tag base material, and a bonding adhesive layer for bonding to a cloth product such as clothing. Configuration. With this configuration, the user can easily attach the RFID tag to the cloth product by heating with an iron or the like.
  • the RFID tag since cleaning operations such as washing, dehydration, drying, and ironing are repeatedly performed on textile products, the RFID tag has a high degree of waterproofness and chemical resistance with respect to the IC chip and the antenna. It has been required to have durability so that the tag is not bent and the antenna and the peripheral portion of the IC chip are not damaged by compression. Therefore, there has been a demand for an RFID tag having overall durability including waterproofness and chemical resistance and also having high reception sensitivity performance.
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide an RFID tag that can be thermally welded to a fiber product while suppressing manufacturing costs by a simple configuration. It is in. Another object of the present invention is to provide an RFID tag having a simple configuration and having both durability and high receiving sensitivity performance.
  • the object is to provide a base material, a boost antenna provided on the base material and made of a conductive material, and wireless communication attached to a predetermined position corresponding to the boost antenna on the base material.
  • Chip module, and a heat welding sheet attached on the base material so as to cover the boost antenna and the chip module, and having a heat welding property.
  • the heat-sealing sheet is provided in a state where the heat-sealing sheet is attached to the substrate at a portion where the chip module is attached and / or a peripheral portion of the surface of the substrate.
  • Mounting area which is a different part from the mounting area, provided in a state not attached to the base material Having a non-attachment region, which is solved by.
  • the heat welding sheet has an attachment area and a non-attachment area
  • the boost antenna and the chip module are attached to the base material together with the heat adhesion sheet (attachment area)
  • the heat-welded sheet (non-attached area) can be used as it is as a sheet for heat-welding the fiber product as it is. Therefore, an RFID tag with a heat welding sheet can be manufactured by a simple configuration and a simple manufacturing process.
  • the heat welding sheet may be attached to the base material by, for example, partially welding the heat welding sheet itself, or may be attached using an adhesive or the like.
  • the attachment area is a heat-welding area where a part of the heat-welding sheet is attached to the base material by heat-welding, and the non-attachment area is a part different from the heat-welding area.
  • the heat-welding sheet is preferably a non-heat-welded area where no heat-welding is performed. According to the above configuration, the attachment area of the heat welding sheet is used for heat welding the chip module to the base material, and the non-attachment area is used for the user to heat weld the fiber product. Therefore, the configuration becomes simpler and the manufacturing cost can be reduced.
  • the attachment region is provided at a central portion in the length direction of the base material, and the non-attachment region is provided at both side portions in the length direction of the base material.
  • the attachment region of the heat welding sheet is provided at the center portion (center portion side) of the base material, for example, when manufacturing the RFID tag using the heat welding die, Since the manufacturing process is simple and simple, the manufacturing cost can be further reduced.
  • the non-attachment area of the heat welding sheet is provided on both sides of the base material, the user can more easily heat weld the RFID tag to the textile using an iron or the like.
  • the base material is made of a stretchable insulating sheet
  • the boost antenna is made of a stretchable conductive ink, and is provided on the base material.
  • the base material is configured in a folded state
  • the heat welding sheet includes a first heat welding sheet provided together with the boost antenna and the chip module inside the folded base material; A second heat-welding sheet attached to a material and capable of being heat-welded to the fiber product, wherein the first heat-welding sheet and the second heat-welding sheet each include the mounting area and the non- And a mounting area.
  • the boost antenna and the chip module are stored inside the folded base material, the durability and the waterproofness and the chemical resistance are added while considering that the manufacturing cost does not increase relatively. Can be improved.
  • the boost antenna is arranged over the entire surface of the base material, the RFID tag can be folded to provide an RFID tag having higher reception sensitivity performance. When the base material is folded, it is good to consider that the boost antennas do not overlap each other as much as possible.
  • a base material a heat-sealing sheet attached to the base material and having heat-sealing properties, a boost antenna provided on the heat-sealing sheet and made of a conductive material, and A chip module for wireless communication attached to a predetermined position corresponding to the boost antenna in the heat-sealing sheet in a state where the heat-sealing sheet is sandwiched by the heat-sealing sheet.
  • An RFID tag wherein the heat-sealing sheet has a mounting area provided in a state where the heat-welding sheet is mounted on the substrate at a portion where the chip module is mounted and / or a peripheral portion of the surface of the substrate.
  • a non-attachment area provided in a state different from the attachment area and not attached to the base material. ID tag can also be realized.
  • the attachment area is a heat-welding area in which a part of the heat-welding sheet is heat-welded to the base material, and the non-attachment area is a part different from the heat-welding area, It is preferable that the heat-welding sheet is a non-heat-welded region in which heat welding is not performed.
  • the RFID tag of this invention becomes a tag which can be thermally welded with respect to textiles, suppressing manufacturing cost by a simple structure. Further, the tag has both durability and high receiving sensitivity performance with a simple configuration.
  • FIG. 2 is an external perspective view of the RFID tag according to the embodiment. It is a principal part enlarged view of an RFID tag, and is a figure which shows a chip module. It is the front sectional view showing typically the manufacturing method of the RFID tag. It is a front view of an RFID tag. It is a top view of an RFID tag. It is a top view showing a boost antenna before assembling in the RFID tag of a 2nd embodiment. It is a side sectional view showing typically the manufacturing method of the RFID tag of a 2nd embodiment. It is a bottom view of the RFID tag of a 2nd embodiment. It is a top view showing a boost antenna before assembling in a RFID tag of a 3rd embodiment.
  • This embodiment includes a base material, a boost antenna provided on the base material, made of a conductive material, a wireless communication chip module attached to a predetermined position corresponding to the boost antenna on the base material, and a booster on the base material.
  • An RFID tag that is attached so as to cover the antenna and the chip module and has a heat-welding property, and that can be heat-welded to textiles by the heat-welding sheet.
  • the RFID tag 1 of the present embodiment is a wireless authentication tag for managing textiles such as clothes, linens, laundry supplies, and the like. It can be directly attached to As shown in FIG. 1, the RFID tag 1 includes a sheet-shaped cloth base material 10, a boost antenna 20 provided on the cloth base material 10 and made of a conductive material, and a boost antenna 20 on the cloth base material 10. It mainly includes a wireless communication chip module 30 attached at a corresponding position, and a heat welding sheet 40 that is attached to cover the boost antenna 20 and the chip module 30 on the cloth base material 10 and has heat welding properties. Have been.
  • the cloth base material 10 is a tag base material of the RFID tag 1 and is made of an insulating sheet having elasticity. Specifically, natural cloth such as silk, hemp, wool, or polyester Woven or knitted fabrics formed using synthetic fibers such as, acetate, rayon, nylon and the like.
  • the cloth base material 10 is formed to have a length of about 7 cm and a width of about 1 cm.
  • the boost antenna 20 is an antenna for extending the wireless communication distance of the RFID tag 1, and is provided so as to be electromagnetically coupled to a core antenna 32 included in the chip module 30.
  • the boost antenna 20 is made of conductive ink having elasticity, and is screen-printed on the cloth substrate 10 so as to have a predetermined antenna pattern.
  • the “conductive ink having elasticity” has a property of expanding when a sheet pressure is applied, and the conductivity is reduced when the sheet is stretched, but the original conductivity is maintained when the sheet returns to the original state. It is a possible ink material.
  • the conductive ink it is desirable to use a silver powder having good conductivity, but there is no particular limitation, and a metal material such as copper or aluminum may be used.
  • the boost antenna 20 is formed as a wavy antenna pattern, extends along the length direction of the cloth substrate 10, and is disposed on the cloth substrate 10 over substantially the entirety. More specifically, the boost antenna 20 has a substantially U-shaped antenna central portion 21 at a central portion in the length direction, and is formed to be symmetrical with respect to the antenna central portion 21 as a center. A chip module 30 is attached to a portion of the cloth base material 10 where the antenna central portion 21 is arranged, along the outer peripheral edge of the antenna central portion 21.
  • the chip module 30 is a disk-shaped module that stores identification data such as an identification number and stores therein an IC chip 31 that controls wireless communication.
  • the chip module 30 includes an IC chip 31, a core antenna 32 electrically connected to the IC chip 31, for transmitting and receiving radio waves, and a sealing for sealing the IC chip 31 and the core antenna 32. And a stop member 33.
  • the chip module 30 is disposed between the wave-shaped patterns of the boost antenna 20. More specifically, the outer edge of the chip module 30 partially overlaps or is close to the boost antenna 20 in the thickness direction of the cloth base material 10. And are arranged to extend substantially in parallel.
  • the IC chip 31 is an integrated circuit having a function of storing identification data, modulating the identification data to an electromagnetic wave received via the core antenna 32, and returning the modulated electromagnetic wave.
  • the core antenna 32 has an annular antenna pattern, and is formed of a metal foil such as copper or aluminum.
  • the core antenna 32 is connected to the IC chip 31 via an impedance matching circuit (not shown).
  • the sealing member 33 is made of a resin material such as an epoxy resin or a silicone resin, and is formed so as to house the IC chip 31 and the core antenna 32 therein. With the above configuration, the IC chip 31 and the core antenna 32 can be protected from water, heat, impact, and the like.
  • the heat-welding sheet 40 is a thermoplastic resin sheet for heat-welding the RFID tag 1 to a fiber product, and is made of, for example, a thermoplastic polyurethane sheet and has a cloth base. It is attached so as to cover almost the entire surface of the material 10.
  • the heat-sealing sheet 40 includes a heat-sealing area 41 in which a part of the heat-sealing sheet 40 is heat-sealed and attached to a portion where the chip module 30 is mounted and a peripheral portion of the surface of the cloth base material 10. And a non-heat-welded area 42 which is different from the heat-welded area 41 and is not heat-welded to the heat-welded sheet 40.
  • the heat welding area 41 is a substantially rectangular mounting area which is thermocompression-bonded in advance to mount the chip module 30 to the cloth base material 10. More specifically, in the heat welding region 41 of the RFID tag 1, the cloth base 10, the boost antenna 20 printed on the cloth base 10, the chip module 30 disposed on the cloth base 10, It is configured in a state where the welding sheet 40 is integrated.
  • the non-heat-welded area 42 is an area for heat-welding the RFID tag 1 to the textile product, and is not heat-pressed in advance and is a non-attachable area where heat welding is possible. More specifically, as shown in FIGS. 1 and 4, the non-heat-welded region 42 is slightly separated from the cloth base 10 and the boost antenna 20 in the thickness direction of the cloth base 10.
  • the heat welding region 41 is arranged at a central portion in the length direction of the cloth base material 10. Therefore, as shown in FIG. 3, the RFID tag 1 can be easily manufactured using the heat welding mold M, and the manufacturing cost can be reduced.
  • the plurality of non-heat-welded regions 42 are provided so as to sandwich the heat-welded region 41 therebetween, and are arranged on both side portions in the length direction of the cloth base material 10. Therefore, the user can easily heat-bond the RFID tag 1 to the textile using an iron or the like. More specifically, a user can attach the textile product by thermocompression bonding with an iron or the like from the back surface of the RFID tag 1 in a state where the RFID tag 1 is turned upside down and the heat welding sheet 40 is in contact with the textile product.
  • the boost antenna 20 is screen-printed on the surface of the cloth base material 10 using conductive ink so as to form a wavy antenna pattern.
  • a mold M for heat welding and a tag holder T are prepared, and the cloth substrate 10, the chip module 30, and the thermal module on which the boost antennas 20 are printed in order from the bottom on the tag holder T.
  • the three components of the welding sheet 40 are arranged so as to overlap.
  • the heat welding mold M is a mold that has a concave portion on the bottom surface according to the shape of the chip module 30 and is heated for heat welding.
  • the tag holder T is a holder having a concave portion on the surface thereof in conformity with the shape of the chip module and for performing heat welding while aligning each component.
  • the three components are aligned so that the chip module 30 is vertically opposed to the concave portion on the tag holder T and the concave portion of the heat welding mold M.
  • the components corresponding to the heat welding area 41 of each component are sandwiched by applying predetermined heat and pressure by the heat welding mold M, thereby connecting the components together.
  • the thermal welding mold M only the portion on which the chip module 30 is mounted and the peripheral portion of the surface of the cloth substrate 10 are thermally welded by the thermal welding mold M. More specifically, the components are integrated by heat-welding only the heat-welded area 41 in the heat-welded sheet 40, and the areas other than the heat-welded area 41 are not integrated, and both sides of the heat-welded area 41 are not integrated.
  • the region (non-heat-welded region 42) is configured to be turned up in the thickness direction of the cloth base material 10.
  • the RFID tag 1 can be manufactured by the above simple manufacturing process.
  • an RFID tag 100 according to a second embodiment will be described with reference to FIGS. 5A to 5C.
  • the description of the same content as that of the RFID tag 1 will be omitted.
  • the RFID tag 100 is different from the RFID tag 1 in that the RFID tag 100 is mainly configured in a state in which the cloth substrate 110 is folded.
  • the cloth base material 110 has a folding boundary 111 at the center in the width direction, and is configured to be able to sandwich the chip module 30 by being folded at the folding boundary 111.
  • the boost antenna 120 is formed as a wavy antenna pattern, extends along the length direction of the cloth base material 10, and has an antenna center portion 121 at a center portion in the length direction. And is formed in a point-symmetrical shape with the antenna central portion 121 as the center. That is, when the cloth base 110 is folded, the boost antenna 120 is arranged over substantially the entire inner surface of the folded cloth base 110.
  • the antenna central portion 121 is composed of two substantially U-shaped antenna portions that are line-symmetric with respect to the center of a portion where the folding boundary line 111 and the boost antenna 120 overlap, and when the cloth base 110 is folded. They are formed so as to overlap each other. According to the above configuration, since the boost antenna 120 is arranged over the entire surface of the cloth base 110 by folding, the RFID tag having high reception sensitivity performance is obtained. Further, since the antenna portion extending substantially in parallel with the core antenna in the chip module 30 in the antenna central portion 121 is further lengthened, strong electromagnetic coupling can be obtained.
  • the heat welding sheet 140 is attached to the first heat welding sheet 140 a provided together with the boost antenna 120 and the chip module 30 inside the folded cloth base 110, and is mounted on the cloth base 110. And a second heat welding sheet 140b that can be heat welded to the fiber product.
  • Each of the first heat welding sheet 140a and the second heat welding sheet 140b has a heat welding area 141 and a non-heat welding area 142.
  • the boost antenna 120 is screen-printed on the surface of the cloth substrate 110 so as to form a wavy antenna pattern.
  • a heat welding mold M and a tag holder T are prepared, and the second heat welding sheet 140b and the folded cloth base 110 (the boost antenna) are sequentially arranged on the tag holder T from the bottom. 120), the chip module 30, the first heat-sealing sheet 140a, and the other side of the folded cloth substrate 110 are arranged so as to overlap each other.
  • each component is sandwiched by applying predetermined heat and pressure by the heat welding mold M, thereby connecting the components together. Specifically, only the portion where the chip module 30 overlaps and the peripheral portion of the surface of the cloth substrate 110 are thermally welded by the heat welding mold M. More specifically, in the first heat-sealing sheet 140a and the second heat-sealing sheet 140b, each component is integrated by heat-welding only the heat-welding area 141, and the areas on both sides of the heat-welding area 141 are not. A heat welding region 142 is formed. Through the above manufacturing steps, the RFID tag 100 can be manufactured.
  • the shape of the boost antenna 220 of the RFID tag 200 is different from that of the RFID tag 100.
  • the boost antenna 220 is formed as a wavy antenna pattern, extends along the length direction of the cloth substrate 110, and has an antenna center portion 221 at a center portion in the length direction.
  • the antenna central portion 221 is composed of two substantially semi-elliptical antenna portions that are line-symmetric with respect to the folding boundary line 111, and are formed so as to overlap each other when the cloth base material 110 is folded.
  • a hollow hole is formed in the central portion 221 of the antenna at a portion where the chip module 30 overlaps in order to suppress excessive interference with the chip module 30.
  • the method of manufacturing the RFID tag 200 is the same as that of the RFID tag 100.
  • the antenna portion extending substantially in parallel with the core antenna in the chip module 30 in the antenna central portion 221 is further lengthened, so that stronger electromagnetic coupling can be obtained. Further, since the area of the antenna central portion 221 is large, the possibility of disconnection due to bending can be suppressed.
  • an RFID tag 300 is different from the RFID tag 1 mainly in that the chip module 30 is attached to the cloth substrate 10 with an adhesive 350.
  • the adhesive 350 is applied only to a portion of the surface of the cloth base material 10 where the chip module 30 is attached and a peripheral portion.
  • the attachment region 341 where the heat welding sheet 340 is attached to the portion where the chip module 30 is attached and the peripheral portion of the surface of the cloth base material 10 with the adhesive 350 is provided.
  • a non-attachment area 342 that is different from the attachment area 341 and is not attached to (not opposed to) the cloth base material 10.
  • the attachment region 341 and the non-attachment region 342 are regions for heat-welding the RFID tag 300 to the textile product, and are not heat-compressed in advance but are heat-sealable regions.
  • the non-attachment area 342 is slightly separated from the cloth base 10 and the boost antenna 20 in the thickness direction of the cloth base 10. That is, a gap is formed between the non-attachment area 342 and the cloth base material 10 and the boost antenna 20.
  • the method of manufacturing the RFID tag 300 will be briefly described.
  • the chip module 30 is arranged on the cloth substrate 10 on which the boost antenna 20 is printed, and an adhesive 350 is applied to a peripheral portion of the chip module 30.
  • the heat welding sheet 340 is pressed against the surface of the cloth base material 10 so as to cover the chip module 30 and the adhesive 350, so that the cloth base material 10, the chip module 30 and the heat welding sheet 340 are integrated.
  • the RFID tag 300 can be manufactured by the above simple manufacturing process.
  • the RFID tag 400 is different from the RFID tag 1 mainly in that the boost antenna is screen-printed on the heat welding sheet 40.
  • the RFID tag 400 includes a cloth base material 10, a heat welding sheet 40 mounted on the cloth base material 10, a boost antenna 20 printed on the heat bonding sheet 40, And a chip module 30 that is attached to the cloth base material 10 while being sandwiched between the welding sheets 40.
  • the cloth base material 10 is formed so as to be shorter than the heat welding sheet 40 in the length direction of the heat welding sheet 40.
  • the RFID tag 400 is provided at a position opposed to 41, and is formed in substantially the same size as the heat welding region 41. Note that the method of manufacturing the RFID tag 400 is the same as that of the RFID tag 1. With the above configuration, it is possible to realize an RFID tag that can be thermally welded to a fiber product while further reducing the manufacturing cost with a simple configuration.
  • the cloth base material 10 is a woven cloth or a knitted cloth, but can be changed without any particular limitation, and may be made of a material other than a cloth material, such as a resin material. It may be formed.
  • the boost antenna 20 is formed as a wavy antenna pattern, but is not particularly limited, and may be, for example, rectangular, circular, linear, curved, or the like. May be formed.
  • the boost antenna 20 is formed by screen-printing a conductive ink on the cloth base material 10, but is not particularly limited. Alternatively, it may be formed by a known method such as sewing a conductive thread.
  • the heat welding sheet 40 covers the entire surface of the cloth substrate 10, but is not particularly limited, and partially covers the surface of the cloth substrate 10. It may be configured as follows.
  • the heat welding sheet 40 is attached to a portion of the surface of the cloth substrate 10 where the chip module 30 is attached and a peripheral portion.
  • the heat welding sheet 40 may be attached only to the peripheral portion of the surface of the cloth base material 10 where the chip module 30 is attached, or may be attached to the portion where the chip module 30 is attached. May be attached only.
  • the heat welding sheet 40 is attached to the cloth base material 10 by partially welding the heat welding sheet 40 itself.
  • it may be attached to the cloth base material 10 using an adhesive 350 or the like.
  • the RFID tag according to the present invention has been mainly described.
  • the above embodiment is merely an example for facilitating understanding of the present invention, and does not limit the present invention.
  • the present invention can be modified and improved without departing from the gist of the present invention, and the present invention naturally includes equivalents thereof.
  • the arrangement and configuration related to the heat-sealing sheet described in the above embodiment are merely examples, and do not limit the present invention.

Abstract

The present invention provides an RFID tag of which the manufacturing cost is suppressed due to a simple structure and which can be heat-welded to a textile product. An RFID tag 1 comprises: a substrate 10; a boost antenna 20 provided on the substrate 10 and composed of an electroconductive material; a chip module 30 for wireless communication, the chip module 30 being attached to a prescribed position on the substrate 10 that corresponds to the boost antenna; and a heat-welding sheet 40 attached so as to cover the boost antenna 20 and the chip module 30 on the substrate 10, the heat-welding sheet 40 having heat welding properties. The heat-welding sheet 40 includes, in a portion at a surface of the substrate 10 at which the chip module 30 is attached and a peripheral portion thereto, a heat-welded region 41 where a portion of the heat-welding sheet 40 is heat-welded and attached to the substrate 10, and a non-heat-welded region 42 that is different from the heat-welded region 41 and where the heat-welding sheet 40 is not heat-welded.

Description

ＲＦＩＤタグRFID tag
　本発明は、ＲＦＩＤタグに係り、特に、繊維品（繊維製品）に対し熱溶着することが可能なＲＦＩＤタグに関する。 {Circle over (1)} The present invention relates to an RFID tag, and more particularly, to an RFID tag that can be thermally welded to a textile (textile).
　従来、衣服やリネン、ランドリー用品等の各種の繊維製品を管理するために、繊維製品に対してＲＦＩＤタグ（Ｒａｄｉｏ Ｆｒｅｑｕｅｎｃｙ Ｉｄｅｎｔｉｆｉｃａｔｉｏｎ Ｔａｇ）が取り付けられることがある。
　繊維製品に対しＲＦＩＤタグを取り付ける方法として、ユーザーの利便性を高めるべく、熱溶着シート等を備えたＲＦＩＤタグが提案されている。
　当該ＲＦＩＤタグであれば、ユーザーがアイロン等で熱圧着する等してＲＦＩＤタグを簡易的に取り付けることが可能である（例えば、特許文献１、２参照）。 2. Description of the Related Art Conventionally, an RFID tag (Radio Frequency Identification Tag) is sometimes attached to a textile in order to manage various textiles such as clothes, linens, and laundry supplies.
As a method of attaching an RFID tag to a textile product, an RFID tag provided with a heat welding sheet or the like has been proposed in order to enhance user convenience.
With the RFID tag, the user can easily attach the RFID tag by thermocompression bonding with an iron or the like (for example, see Patent Documents 1 and 2).
　特許文献１に記載のＲＦＩＤタグでは、タグ基材上においてＲＦＩＤインレットやブーストアンテナ等を接着させるための接着剤層と、衣服等の布製品に接着させるための貼付け用接着剤層とがさらに設けられた構成となっている。
　当該構成により、ユーザーがアイロン等で加熱することで布製品に対しＲＦＩＤタグを簡易的に取り付けることができる。 The RFID tag described in Patent Literature 1 further includes an adhesive layer for bonding an RFID inlet, a boost antenna, and the like on a tag base material, and a bonding adhesive layer for bonding to a cloth product such as clothing. Configuration.
With this configuration, the user can easily attach the RFID tag to the cloth product by heating with an iron or the like.
　また特許文献２に記載のＲＦＩＤタグにおいても同様であって、プラスチック製の支持シート上においてＩＣチップ内蔵のチップモジュールやブーストアンテナ等がホットメルト接着剤で熱圧着されており、さらに繊維製品に貼り付けるためのホットメルト接着剤が積層された構成となっている。 The same applies to the RFID tag described in Patent Document 2, wherein a chip module with a built-in IC chip, a boost antenna, and the like are thermocompression-bonded with a hot-melt adhesive on a plastic support sheet, and further attached to textiles. It has a configuration in which hot melt adhesives for attachment are laminated.
特開２０１３－１７１４２９号公報JP 2013-171429 A 特開２０１５－１２９９８９号公報JP-A-2005-129989
　ところで、特許文献１、２のようなＲＦＩＤタグでは、タグ基材上にチップモジュールやブーストアンテナ等を接着剤とともに積層させた上で、さらに繊維製品に接着させるための接着剤層を積層させているため、製造工程が余計に増えてしまい、製造コスト増につながる虞があった。
　そのため、繊維製品に対し熱溶着することが可能なＲＦＩＤタグにおいて、そのタグの性能を損なわないようにしながら、より製造コストを抑えたものが望まれていた。 By the way, in an RFID tag as disclosed in Patent Documents 1 and 2, a chip module, a boost antenna, and the like are laminated on a tag base material together with an adhesive, and then an adhesive layer for bonding to a textile is further laminated. Therefore, the number of manufacturing steps is unnecessarily increased, which may lead to an increase in manufacturing cost.
For this reason, there has been a demand for an RFID tag that can be thermally welded to a fiber product while keeping the performance of the tag intact while further reducing the manufacturing cost.
　また、繊維製品に対しては洗濯、脱水、乾燥、アイロン掛け等のクリーニング作業が繰り返し行われるため、ＲＦＩＤタグにおいてＩＣチップ及びアンテナに対する高度の防水性と耐薬品性を備えていること、また、タグの折れ曲がり、圧縮によるアンテナやＩＣチップ周辺部の破損が発生しないような耐久性を備えていることが必要とされていた。
　そのため、防水性と耐薬品性を含む総合的な耐久性を備え、また高い受信感度性能を兼ね備えたＲＦＩＤタグが望まれていた。 In addition, since cleaning operations such as washing, dehydration, drying, and ironing are repeatedly performed on textile products, the RFID tag has a high degree of waterproofness and chemical resistance with respect to the IC chip and the antenna. It has been required to have durability so that the tag is not bent and the antenna and the peripheral portion of the IC chip are not damaged by compression.
Therefore, there has been a demand for an RFID tag having overall durability including waterproofness and chemical resistance and also having high reception sensitivity performance.
　本発明は、上記の課題に鑑みてなされたものであり、本発明の目的は、シンプルな構成によって製造コストを抑えた上で、繊維製品に対し熱溶着することが可能なＲＦＩＤタグを提供することにある。
　また、本発明の他の目的は、シンプルな構成で耐久性と高い受信感度性能を兼ね備えたＲＦＩＤタグを提供することにある。 The present invention has been made in view of the above problems, and an object of the present invention is to provide an RFID tag that can be thermally welded to a fiber product while suppressing manufacturing costs by a simple configuration. It is in.
Another object of the present invention is to provide an RFID tag having a simple configuration and having both durability and high receiving sensitivity performance.
　前記課題は、本発明のＲＦＩＤタグによれば、基材と、該基材に設けられ、導電性材料からなるブーストアンテナと、前記基材において前記ブーストアンテナに対応する所定位置に取り付けられる無線通信用のチップモジュールと、前記基材上において前記ブーストアンテナ及び前記チップモジュールを覆うように取り付けられ、熱溶着性を有する熱溶着シートと、を備え、該熱溶着シートによって繊維品に対し熱溶着することが可能なＲＦＩＤタグであって、前記熱溶着シートは、前記基材の面のうち、前記チップモジュールが取り付けられた部分及び／または周辺部分において、前記基材に対し取り付けられた状態で設けられる取り付け領域と、該取り付け領域とは異なる部分であって、前記基材に対し取り付けられていない状態で設けられる非取り付け領域と、を有すること、により解決される。
　上記構成により、シンプルな製造工程で製造コストを抑えることができ、繊維製品に対し熱溶着することが可能なＲＦＩＤタグを実現することができる。
　具体的には、熱溶着シートが取り付け領域と、非取り付け領域とを有しているため、基材に対してブーストアンテナ及びチップモジュールが熱溶着シート（取り付け領域）とともに取り付けられた上で、当該熱溶着シート（非取り付け領域）をそのまま繊維品に対し熱溶着させるためのシートとして利用することができる。そのため、シンプルな構成、シンプルな製造工程によって熱溶着シート付きのＲＦＩＤタグを製造することができる。
　なお、熱溶着シートは基材に対し、例えば熱溶着シート自身の一部が熱溶着されて取り付けられていても良いし、接着剤等を用いて取り付けられていても良い。 According to the RFID tag of the present invention, the object is to provide a base material, a boost antenna provided on the base material and made of a conductive material, and wireless communication attached to a predetermined position corresponding to the boost antenna on the base material. Chip module, and a heat welding sheet attached on the base material so as to cover the boost antenna and the chip module, and having a heat welding property. The heat-sealing sheet is provided in a state where the heat-sealing sheet is attached to the substrate at a portion where the chip module is attached and / or a peripheral portion of the surface of the substrate. Mounting area, which is a different part from the mounting area, provided in a state not attached to the base material Having a non-attachment region, which is solved by.
With the above configuration, it is possible to reduce the manufacturing cost by a simple manufacturing process and to realize an RFID tag that can be thermally welded to a textile product.
Specifically, since the heat welding sheet has an attachment area and a non-attachment area, the boost antenna and the chip module are attached to the base material together with the heat adhesion sheet (attachment area), The heat-welded sheet (non-attached area) can be used as it is as a sheet for heat-welding the fiber product as it is. Therefore, an RFID tag with a heat welding sheet can be manufactured by a simple configuration and a simple manufacturing process.
The heat welding sheet may be attached to the base material by, for example, partially welding the heat welding sheet itself, or may be attached using an adhesive or the like.
　このとき、前記取り付け領域は、前記基材に対し前記熱溶着シートの一部が熱溶着されて取り付けられている熱溶着領域であって、前記非取り付け領域は、前記熱溶着領域とは異なる部分であって、前記熱溶着シートが熱溶着されていない非熱溶着領域であると良い。
　上記構成により、熱溶着シートの取り付け領域は、基材に対しチップモジュールを熱溶着するために用いられ、その非取り付け領域はユーザーが繊維品に熱溶着させるために用いられることになる。そのため、一層シンプルな構成となり、製造コストを抑えることができる。 At this time, the attachment area is a heat-welding area where a part of the heat-welding sheet is attached to the base material by heat-welding, and the non-attachment area is a part different from the heat-welding area. In this case, the heat-welding sheet is preferably a non-heat-welded area where no heat-welding is performed.
According to the above configuration, the attachment area of the heat welding sheet is used for heat welding the chip module to the base material, and the non-attachment area is used for the user to heat weld the fiber product. Therefore, the configuration becomes simpler and the manufacturing cost can be reduced.
　このとき、前記非取り付け領域は、複数設けられ、前記取り付け領域を間に挟むように設けられていると良い。
　また、前記取り付け領域は、前記基材の長さ方向における中央部分に設けられ、前記非取り付け領域は、前記基材の長さ方向における両側部分に設けられていると良い。
　上記のように、熱溶着シートの取り付け領域が、基材の中央部分（中央部分側）に設けられているため、例えば、熱溶着用金型を用いてＲＦＩＤタグを製造するにあたって、取り付け領域の製造工程がシンプルで簡易的になるため、製造コストをより抑えることができる。
　また、熱溶着シートの非取り付け領域が、基材の両側部分に設けられているため、ユーザーがアイロン等で繊維品に対しＲＦＩＤタグを一層容易に熱溶着させることができる。 At this time, it is preferable that a plurality of the non-attachment areas are provided and provided so as to sandwich the attachment area therebetween.
Further, it is preferable that the attachment region is provided at a central portion in the length direction of the base material, and the non-attachment region is provided at both side portions in the length direction of the base material.
As described above, since the attachment region of the heat welding sheet is provided at the center portion (center portion side) of the base material, for example, when manufacturing the RFID tag using the heat welding die, Since the manufacturing process is simple and simple, the manufacturing cost can be further reduced.
In addition, since the non-attachment area of the heat welding sheet is provided on both sides of the base material, the user can more easily heat weld the RFID tag to the textile using an iron or the like.
　このとき、前記基材は、伸縮性を有する絶縁シートからなり、前記ブーストアンテナは、伸縮性を有する導電性インクからなり、前記基材上に設けられていると良い。
　上記構成により、洗濯、脱水等で一時的にタグに強い圧力がかかって変形した場合であっても、当該圧力が取り除かれれば、ブーストアンテナの形状が元に戻り、コアアンテナを含むチップモジュールの位置とブーストアンテナの相対的な位置関係が復元される。その結果、ＲＦＩＤタグとしての基本性能を復元することができる。
　そのため、高い耐久性と同時に高い受信感度性能を備えたＲＦＩＤタグを実現できる。 At this time, it is preferable that the base material is made of a stretchable insulating sheet, and the boost antenna is made of a stretchable conductive ink, and is provided on the base material.
With the above configuration, even when the tag is temporarily deformed by applying a strong pressure due to washing, dehydration, or the like, if the pressure is removed, the shape of the boost antenna returns to its original shape, and the chip module including the core antenna is deformed. The relative positional relationship between the position and the boost antenna is restored. As a result, the basic performance of the RFID tag can be restored.
Therefore, an RFID tag having high durability and high receiving sensitivity performance can be realized.
　このとき、前記基材は、折り畳まれた状態で構成され、前記熱溶着シートは、折り畳まれた前記基材の内部に前記ブーストアンテナ及び前記チップモジュールとともに設けられる第１熱溶着シートと、前記基材上に取り付けられ、繊維品に対し熱溶着することが可能な第２熱溶着シートと、を備え、前記第１熱溶着シート及び前記第２熱溶着シートは、それぞれ前記取り付け領域と、前記非取り付け領域と、を有すると良い。
　上記のように、折り畳まれた基材の内部にブーストアンテナ及びチップモジュールが格納される構成となるため、比較的製造コストが上がらないように配慮しながら防水性と耐薬品性に加えて耐久性を向上させることができる。
　また、仮に基材全面にわたってブーストアンテナが配置されていれば、折り畳むことでより高い受信感度性能を備えたＲＦＩＤタグとなる。なお、基材が折り畳まれる際にはブーストアンテナ同士が極力重ならないように配慮すると良い。 At this time, the base material is configured in a folded state, and the heat welding sheet includes a first heat welding sheet provided together with the boost antenna and the chip module inside the folded base material; A second heat-welding sheet attached to a material and capable of being heat-welded to the fiber product, wherein the first heat-welding sheet and the second heat-welding sheet each include the mounting area and the non- And a mounting area.
As described above, since the boost antenna and the chip module are stored inside the folded base material, the durability and the waterproofness and the chemical resistance are added while considering that the manufacturing cost does not increase relatively. Can be improved.
If the boost antenna is arranged over the entire surface of the base material, the RFID tag can be folded to provide an RFID tag having higher reception sensitivity performance. When the base material is folded, it is good to consider that the boost antennas do not overlap each other as much as possible.
　そのほか、基材と、該基材上に取り付けられ、熱溶着性を有する熱溶着シートと、該熱溶着シートに設けられ、導電性材料からなるブーストアンテナと、前記基材と熱溶着シートの間に挟まれた状態で、前記熱溶着シートにおいて前記ブーストアンテナに対応する所定位置に取り付けられる無線通信用のチップモジュールと、を備え、前記熱溶着シートによって繊維品に対し熱溶着することが可能なＲＦＩＤタグであって、前記熱溶着シートは、前記基材の面のうち、前記チップモジュールが取り付けられた部分及び／または周辺部分において、前記基材に対し取り付けられた状態で設けられる取り付け領域と、該取り付け領域とは異なる部分であって、前記基材に対し取り付けられていない状態で設けられる非取り付け領域と、を有するＲＦＩＤタグも実現することができる。
　このとき、前記取り付け領域は、前記基材に対し前記熱溶着シートの一部が熱溶着された熱溶着領域であって、前記非取り付け領域は、前記熱溶着領域とは異なる部分であって、前記熱溶着シートが熱溶着されていない非熱溶着領域であると良い。 In addition, a base material, a heat-sealing sheet attached to the base material and having heat-sealing properties, a boost antenna provided on the heat-sealing sheet and made of a conductive material, and A chip module for wireless communication attached to a predetermined position corresponding to the boost antenna in the heat-sealing sheet in a state where the heat-sealing sheet is sandwiched by the heat-sealing sheet. An RFID tag, wherein the heat-sealing sheet has a mounting area provided in a state where the heat-welding sheet is mounted on the substrate at a portion where the chip module is mounted and / or a peripheral portion of the surface of the substrate. A non-attachment area provided in a state different from the attachment area and not attached to the base material. ID tag can also be realized.
At this time, the attachment area is a heat-welding area in which a part of the heat-welding sheet is heat-welded to the base material, and the non-attachment area is a part different from the heat-welding area, It is preferable that the heat-welding sheet is a non-heat-welded region in which heat welding is not performed.
　本発明のＲＦＩＤタグによれば、シンプルな構成によって製造コストを抑えた上で、繊維製品に対し熱溶着することが可能なタグとなる。
　また、シンプルな構成で耐久性と高い受信感度性能を兼ね備えたタグとなる。 ADVANTAGE OF THE INVENTION According to the RFID tag of this invention, it becomes a tag which can be thermally welded with respect to textiles, suppressing manufacturing cost by a simple structure.
Further, the tag has both durability and high receiving sensitivity performance with a simple configuration.
本実施形態に係るＲＦＩＤタグの外観斜視図である。FIG. 2 is an external perspective view of the RFID tag according to the embodiment. ＲＦＩＤタグの要部拡大図であり、チップモジュールを示す図である。It is a principal part enlarged view of an RFID tag, and is a figure which shows a chip module. ＲＦＩＤタグの製造方法を模式的に示した正面断面図である。It is the front sectional view showing typically the manufacturing method of the RFID tag. ＲＦＩＤタグの正面図である。It is a front view of an RFID tag. ＲＦＩＤタグの平面図である。It is a top view of an RFID tag. 第２実施形態のＲＦＩＤタグにおいて組み立て前のブーストアンテナを示す平面図である。It is a top view showing a boost antenna before assembling in the RFID tag of a 2nd embodiment. 第２実施形態のＲＦＩＤタグの製造方法を模式的に示した側面断面図である。It is a side sectional view showing typically the manufacturing method of the RFID tag of a 2nd embodiment. 第２実施形態のＲＦＩＤタグの底面図である。It is a bottom view of the RFID tag of a 2nd embodiment. 第３実施形態のＲＦＩＤタグにおいて組み立て前のブーストアンテナを示す平面図である。It is a top view showing a boost antenna before assembling in a RFID tag of a 3rd embodiment. 第３実施形態のＲＦＩＤタグの底面図である。It is a bottom view of the RFID tag of a 3rd embodiment. 第４実施形態のＲＦＩＤタグの正面図である。It is a front view of the RFID tag of a 4th embodiment. 第４実施形態のＲＦＩＤタグの平面図であるIt is a top view of the RFID tag of a 4th embodiment. 第５実施形態のＲＦＩＤタグの正面図である。It is a front view of the RFID tag of a 5th embodiment. 第５実施形態のＲＦＩＤタグの平面図である。It is a top view of the RFID tag of a 5th embodiment.
　以下、本発明に係る実施形態について図１～図８Ａ，Ｂを参照して説明する。
　本実施形態は、基材と、基材に設けられ、導電性材料からなるブーストアンテナと、基材においてブーストアンテナに対応する所定位置に取り付けられる無線通信用のチップモジュールと、基材上においてブーストアンテナ及びチップモジュールを覆うように取り付けられ、熱溶着性を有する熱溶着シートとを備え、熱溶着シートによって繊維製品に対し熱溶着することが可能なＲＦＩＤタグであって、熱溶着シートが、基材の面のうち、チップモジュールが取り付けられた部分及び周辺部分において、基材に対し熱溶着シートの一部が熱溶着されて取り付けられている熱溶着領域と、熱溶着領域とは異なる部分であって、熱溶着シートが熱溶着されていない非熱溶着領域と、を有することを特徴とするＲＦＩＤタグの発明に関するものである。 Hereinafter, embodiments according to the present invention will be described with reference to FIGS. 1 to 8A and 8B.
This embodiment includes a base material, a boost antenna provided on the base material, made of a conductive material, a wireless communication chip module attached to a predetermined position corresponding to the boost antenna on the base material, and a booster on the base material. An RFID tag that is attached so as to cover the antenna and the chip module and has a heat-welding property, and that can be heat-welded to textiles by the heat-welding sheet. In the surface of the material, in a portion where the chip module is attached and in a peripheral portion, a heat-welded region where a part of the heat-welded sheet is heat-welded to the base material, and a portion different from the heat-welded region. And a non-heat-welded area in which the heat-welded sheet is not heat-welded. .
　本実施形態のＲＦＩＤタグ１は、図１に示すように、衣服やリネン、ランドリー用品等の繊維製品を管理するための無線認証タグであって、ユーザーがアイロン等で熱圧着することで繊維製品に対し直接取り付け可能な構成となっている。
　ＲＦＩＤタグ１は、図１に示すように、シート状の布基材１０と、布基材１０上に設けられ、導電性材料からなるブーストアンテナ２０と、布基材１０上においてブーストアンテナ２０に対応する位置に取り付けられる無線通信用のチップモジュール３０と、布基材１０上においてブーストアンテナ２０及びチップモジュール３０を覆うように取り付けられ、熱溶着性を有する熱溶着シート４０と、から主に構成されている。 As shown in FIG. 1, the RFID tag 1 of the present embodiment is a wireless authentication tag for managing textiles such as clothes, linens, laundry supplies, and the like. It can be directly attached to
As shown in FIG. 1, the RFID tag 1 includes a sheet-shaped cloth base material 10, a boost antenna 20 provided on the cloth base material 10 and made of a conductive material, and a boost antenna 20 on the cloth base material 10. It mainly includes a wireless communication chip module 30 attached at a corresponding position, and a heat welding sheet 40 that is attached to cover the boost antenna 20 and the chip module 30 on the cloth base material 10 and has heat welding properties. Have been.
　布基材１０は、図１に示すように、ＲＦＩＤタグ１のタグ基材であって、伸縮性を有する絶縁シートからなり、具体的には、絹、麻、毛等の天然繊維や、ポリエステル、アセテート、レーヨン、ナイロン等の合成繊維を用いて形成される織布または編布である。
　布基材１０は、その長さが約７ｃｍ、幅が約１ｃｍの大きさで形成されている。 As shown in FIG. 1, the cloth base material 10 is a tag base material of the RFID tag 1 and is made of an insulating sheet having elasticity. Specifically, natural cloth such as silk, hemp, wool, or polyester Woven or knitted fabrics formed using synthetic fibers such as, acetate, rayon, nylon and the like.
The cloth base material 10 is formed to have a length of about 7 cm and a width of about 1 cm.
　ブーストアンテナ２０は、図１に示すように、ＲＦＩＤタグ１の無線通信距離を拡張させるためのアンテナであって、チップモジュール３０に含まれるコアアンテナ３２と電磁結合するように設けられている。
　ブーストアンテナ２０は、伸縮性を有する導電性インクからなり、布基材１０上において所定のアンテナパターンとなるようにスクリーン印刷されている。
　「伸縮性を有する導電性インク」とは、シート圧力を加えられたときに伸びる性質を有し、伸びたときには導電性が低下するものの、元の状態に戻ったときには元の導電性を維持することが可能なインク材料である。導電性インクとして、良導電性の銀粉末を用いることが望ましいが、特に限定されることなく、銅やアルミニウム等の金属材料であっても良い。 As shown in FIG. 1, the boost antenna 20 is an antenna for extending the wireless communication distance of the RFID tag 1, and is provided so as to be electromagnetically coupled to a core antenna 32 included in the chip module 30.
The boost antenna 20 is made of conductive ink having elasticity, and is screen-printed on the cloth substrate 10 so as to have a predetermined antenna pattern.
The “conductive ink having elasticity” has a property of expanding when a sheet pressure is applied, and the conductivity is reduced when the sheet is stretched, but the original conductivity is maintained when the sheet returns to the original state. It is a possible ink material. As the conductive ink, it is desirable to use a silver powder having good conductivity, but there is no particular limitation, and a metal material such as copper or aluminum may be used.
　ブーストアンテナ２０は、波線形状のアンテナパターンとして形成され、布基材１０の長さ方向に沿って延びており、布基材１０上に略全体にわたって配置されている。
　詳しく言うと、ブーストアンテナ２０は、その長さ方向の中央部において略Ｕ字形状のアンテナ中央部２１を有し、アンテナ中央部２１を中心部として左右対称の形状として形成されている。
　布基材１０上においてアンテナ中央部２１が配置された部分には、アンテナ中央部２１の外周縁部に沿うようにしてチップモジュール３０が取り付けられている。 The boost antenna 20 is formed as a wavy antenna pattern, extends along the length direction of the cloth substrate 10, and is disposed on the cloth substrate 10 over substantially the entirety.
More specifically, the boost antenna 20 has a substantially U-shaped antenna central portion 21 at a central portion in the length direction, and is formed to be symmetrical with respect to the antenna central portion 21 as a center.
A chip module 30 is attached to a portion of the cloth base material 10 where the antenna central portion 21 is arranged, along the outer peripheral edge of the antenna central portion 21.
　チップモジュール３０は、図２に示すように、識別番号などの識別データを記憶し、無線通信を制御するＩＣチップ３１を内部に格納するための円板形状のモジュールである。
　具体的には、チップモジュール３０は、ＩＣチップ３１と、ＩＣチップ３１と電気的に接続され、電波を送受信するためのコアアンテナ３２と、ＩＣチップ３１及びコアアンテナ３２を封止するための封止部材３３と、から主に構成されている。
　チップモジュール３０は、ブーストアンテナ２０の波形状のパターンの間に配置されており、詳しく言うと、チップモジュール３０の外縁が、布基材１０の厚み方向においてブーストアンテナ２０と一部重なる、あるいは近接して略平行に延びるように配置されている。 As shown in FIG. 2, the chip module 30 is a disk-shaped module that stores identification data such as an identification number and stores therein an IC chip 31 that controls wireless communication.
Specifically, the chip module 30 includes an IC chip 31, a core antenna 32 electrically connected to the IC chip 31, for transmitting and receiving radio waves, and a sealing for sealing the IC chip 31 and the core antenna 32. And a stop member 33.
The chip module 30 is disposed between the wave-shaped patterns of the boost antenna 20. More specifically, the outer edge of the chip module 30 partially overlaps or is close to the boost antenna 20 in the thickness direction of the cloth base material 10. And are arranged to extend substantially in parallel.
　ＩＣチップ３１は、識別データを記憶し、コアアンテナ３２を介して受信される電磁波に、識別データを変調させて返信する機能を備える集積回路である。
　コアアンテナ３２は、環状のアンテナパターンを有し、例えば銅、アルミニウム等の金属箔から形成されている。
　コアアンテナ３２は、不図示のインピーダンス整合回路を介してＩＣチップ３１と接続されている。
　封止部材３３は、エポキシ樹脂やシリコーン樹脂等の樹脂材料からなり、ＩＣチップ３１及びコアアンテナ３２を内部に格納するように形成されている。
　上記構成により、ＩＣチップ３１及びコアアンテナ３２を水、熱、衝撃等から保護することができる。 The IC chip 31 is an integrated circuit having a function of storing identification data, modulating the identification data to an electromagnetic wave received via the core antenna 32, and returning the modulated electromagnetic wave.
The core antenna 32 has an annular antenna pattern, and is formed of a metal foil such as copper or aluminum.
The core antenna 32 is connected to the IC chip 31 via an impedance matching circuit (not shown).
The sealing member 33 is made of a resin material such as an epoxy resin or a silicone resin, and is formed so as to house the IC chip 31 and the core antenna 32 therein.
With the above configuration, the IC chip 31 and the core antenna 32 can be protected from water, heat, impact, and the like.
　熱溶着シート４０は、図１、図４Ａ，Ｂに示すように、繊維製品に対しＲＦＩＤタグ１を熱溶着するための熱可塑性樹脂シートであって、例えば、熱可塑性ポリウレタンシートからなり、布基材１０の表面を略全面にわたって覆うようにして取り付けられている。
　熱溶着シート４０は、布基材１０の表面のうち、チップモジュール３０が取り付けられた部分及び周辺部分に対し、熱溶着シート４０の一部が熱溶着されて取り付けられている熱溶着領域４１と、熱溶着領域４１とは異なる部分であって、熱溶着シート４０が熱溶着されていない非熱溶着領域４２と、を備えている。 As shown in FIGS. 1, 4A and 4B, the heat-welding sheet 40 is a thermoplastic resin sheet for heat-welding the RFID tag 1 to a fiber product, and is made of, for example, a thermoplastic polyurethane sheet and has a cloth base. It is attached so as to cover almost the entire surface of the material 10.
The heat-sealing sheet 40 includes a heat-sealing area 41 in which a part of the heat-sealing sheet 40 is heat-sealed and attached to a portion where the chip module 30 is mounted and a peripheral portion of the surface of the cloth base material 10. And a non-heat-welded area 42 which is different from the heat-welded area 41 and is not heat-welded to the heat-welded sheet 40.
　熱溶着領域４１は、布基材１０に対しチップモジュール３０を取り付けるために予め熱圧着されている略矩形状の取り付け領域となっている。
　詳しくいうと、ＲＦＩＤタグ１のうち熱溶着領域４１において、布基材１０と、布基材１０上に印刷されたブーストアンテナ２０と、布基材１０上に配置されたチップモジュール３０と、熱溶着シート４０とが一体化した状態で構成されている。
　非熱溶着領域４２は、繊維製品に対しＲＦＩＤタグ１を熱溶着するための領域であって、予め熱圧着されておらず、熱溶着可能な非取り付け領域となっている。
　詳しく言うと、非熱溶着領域４２は、図１、図４に示すように、布基材１０の厚み方向において布基材１０及びブーストアンテナ２０から若干離間している。つまり、非熱溶着領域４２と、布基材１０及びブーストアンテナ２０との間に隙間が形成されている。
　上記構成により、１枚の熱溶着シートを有効利用して、シンプルな構成で製造コストを抑えたＲＦＩＤタグを実現することができる。 The heat welding area 41 is a substantially rectangular mounting area which is thermocompression-bonded in advance to mount the chip module 30 to the cloth base material 10.
More specifically, in the heat welding region 41 of the RFID tag 1, the cloth base 10, the boost antenna 20 printed on the cloth base 10, the chip module 30 disposed on the cloth base 10, It is configured in a state where the welding sheet 40 is integrated.
The non-heat-welded area 42 is an area for heat-welding the RFID tag 1 to the textile product, and is not heat-pressed in advance and is a non-attachable area where heat welding is possible.
More specifically, as shown in FIGS. 1 and 4, the non-heat-welded region 42 is slightly separated from the cloth base 10 and the boost antenna 20 in the thickness direction of the cloth base 10. That is, a gap is formed between the non-heat-welded region 42 and the cloth base material 10 and the boost antenna 20.
According to the above configuration, an RFID tag with a simple configuration and a low manufacturing cost can be realized by effectively using one heat-sealing sheet.
　熱溶着領域４１は、布基材１０の長さ方向における中央部分に配置されている。
　そのため、図３に示すように、熱溶着用金型Ｍを用いてＲＦＩＤタグ１を簡易的に製造することができ、製造コストを抑えることができる。
　非熱溶着領域４２は、複数設けられ、熱溶着領域４１を間に挟むように設けられ、布基材１０の長さ方向における両側部分に配置されている。
　そのため、ユーザーが、アイロン等で繊維製品に対しＲＦＩＤタグ１を容易に熱溶着させることができる。詳しく言うと、ユーザーが、繊維製品に対し、ＲＦＩＤタグ１を裏返して熱溶着シート４０を当接させた状態とし、ＲＦＩＤタグ１の裏面からアイロン等で熱圧着させることで取り付けることできる。 The heat welding region 41 is arranged at a central portion in the length direction of the cloth base material 10.
Therefore, as shown in FIG. 3, the RFID tag 1 can be easily manufactured using the heat welding mold M, and the manufacturing cost can be reduced.
The plurality of non-heat-welded regions 42 are provided so as to sandwich the heat-welded region 41 therebetween, and are arranged on both side portions in the length direction of the cloth base material 10.
Therefore, the user can easily heat-bond the RFID tag 1 to the textile using an iron or the like. More specifically, a user can attach the textile product by thermocompression bonding with an iron or the like from the back surface of the RFID tag 1 in a state where the RFID tag 1 is turned upside down and the heat welding sheet 40 is in contact with the textile product.
　次に、ＲＦＩＤタグ１の製造方法について図３、図４Ａ，Ｂに基づいて説明する。
　まずは、布基材１０の表面上に、導電性インクを用いて波線形状のアンテナパターンとなるようにブーストアンテナ２０をスクリーン印刷する。
　そして、図３に示すように、熱溶着用金型Ｍ及びタグ置き台Ｔを準備し、タグ置き台Ｔ上において下から順にブーストアンテナ２０が印刷された布基材１０、チップモジュール３０、熱溶着シート４０の３つの構成部品を重ねるように配置する。
　ここで、熱溶着用金型Ｍとは、その底面においてチップモジュール３０の形状に合わせた凹部を有し、熱溶着のために加熱される金型である。
　また、タグ置き台Ｔとは、その表面上にチップモジュールの形状に合わせた凹部を有し、各構成部品を位置合わせしながら熱溶着するための置き台である。 Next, a method of manufacturing the RFID tag 1 will be described with reference to FIGS. 3, 4A and 4B.
First, the boost antenna 20 is screen-printed on the surface of the cloth base material 10 using conductive ink so as to form a wavy antenna pattern.
Then, as shown in FIG. 3, a mold M for heat welding and a tag holder T are prepared, and the cloth substrate 10, the chip module 30, and the thermal module on which the boost antennas 20 are printed in order from the bottom on the tag holder T. The three components of the welding sheet 40 are arranged so as to overlap.
Here, the heat welding mold M is a mold that has a concave portion on the bottom surface according to the shape of the chip module 30 and is heated for heat welding.
The tag holder T is a holder having a concave portion on the surface thereof in conformity with the shape of the chip module and for performing heat welding while aligning each component.
　そして、図３に示すように、タグ置き台Ｔ上の凹部と、熱溶着用金型Ｍの凹部とに対してチップモジュール３０が上下方向で対向するように３つの構成部品を位置合わせする。
　そして、熱溶着用金型Ｍによって各構成部品の熱溶着領域４１に相当する部分を所定の熱と圧力を加えて挟み込むことで、構成部品同士をつなぎ合わせる。
　具体的には、熱溶着用金型Ｍによって、布基材１０の面のうち、チップモジュール３０が載置された部分及び周辺部分のみを熱溶着する。
　詳しく言うと、熱溶着シート４０において熱溶着領域４１のみを熱溶着することで各構成部品を一体化させており、熱溶着領域４１以外の領域は一体化しておらず、熱溶着領域４１の両側の領域（非熱溶着領域４２）については、布基材１０の厚み方向にめくり上がるような構成となっている。
　上記シンプルな製造工程によって、ＲＦＩＤタグ１を製造することができる。 Then, as shown in FIG. 3, the three components are aligned so that the chip module 30 is vertically opposed to the concave portion on the tag holder T and the concave portion of the heat welding mold M.
Then, the components corresponding to the heat welding area 41 of each component are sandwiched by applying predetermined heat and pressure by the heat welding mold M, thereby connecting the components together.
Specifically, only the portion on which the chip module 30 is mounted and the peripheral portion of the surface of the cloth substrate 10 are thermally welded by the thermal welding mold M.
More specifically, the components are integrated by heat-welding only the heat-welded area 41 in the heat-welded sheet 40, and the areas other than the heat-welded area 41 are not integrated, and both sides of the heat-welded area 41 are not integrated. The region (non-heat-welded region 42) is configured to be turned up in the thickness direction of the cloth base material 10.
The RFID tag 1 can be manufactured by the above simple manufacturing process.
　　＜ＲＦＩＤタグの第２実施形態＞
　次に、第２実施形態となるＲＦＩＤタグ１００について、図５Ａ－Ｃに基づいて説明する。
　なお、以下の説明において、ＲＦＩＤタグ１と重複する内容は説明を省略する。
　ＲＦＩＤタグ１００では、ＲＦＩＤタグ１と比較して、主に布基材１１０が折り畳まれた状態で構成されている点が異なっている。 <Second Embodiment of RFID Tag>
Next, an RFID tag 100 according to a second embodiment will be described with reference to FIGS. 5A to 5C.
In the following description, the description of the same content as that of the RFID tag 1 will be omitted.
The RFID tag 100 is different from the RFID tag 1 in that the RFID tag 100 is mainly configured in a state in which the cloth substrate 110 is folded.
　布基材１１０は、その幅方向の中央部に折り畳み境界線１１１を有し、折り畳み境界線１１１を境として折り畳まれることで、チップモジュール３０を挟み込むことが可能な構成となっている。
　ブーストアンテナ１２０は、図５Ａ，Ｃに示すように、波線形状のアンテナパターンとして形成され、布基材１０の長さ方向に沿って延びており、その長さ方向の中央部においてアンテナ中央部１２１を有し、アンテナ中央部１２１を中心部として点対称の形状として形成されている。
　つまり、ブーストアンテナ１２０は、布基材１１０が折り畳まれたときに、折り畳まれた布基材１１０の内面上に略全体にわたって配置されるようになっている。
　また、アンテナ中央部１２１は、折り畳み境界線１１１とブーストアンテナ１２０が重なる部分の中央に対して線対称となる２つの略Ｕ字形状のアンテナ部分からなり、布基材１１０が折り畳まれたときに互いに重なり合うように形成されている。
　上記構成であれば、折り畳むことで布基材１１０全面にわたってブーストアンテナ１２０が配置されているため、高い受信感度性能を備えたＲＦＩＤタグとなる。
　また、アンテナ中央部１２１においてチップモジュール３０内のコアアンテナと略平行に延びているアンテナ部分が一層長くなるため、強い電磁結合を得ることができる。 The cloth base material 110 has a folding boundary 111 at the center in the width direction, and is configured to be able to sandwich the chip module 30 by being folded at the folding boundary 111.
As shown in FIGS. 5A and 5C, the boost antenna 120 is formed as a wavy antenna pattern, extends along the length direction of the cloth base material 10, and has an antenna center portion 121 at a center portion in the length direction. And is formed in a point-symmetrical shape with the antenna central portion 121 as the center.
That is, when the cloth base 110 is folded, the boost antenna 120 is arranged over substantially the entire inner surface of the folded cloth base 110.
The antenna central portion 121 is composed of two substantially U-shaped antenna portions that are line-symmetric with respect to the center of a portion where the folding boundary line 111 and the boost antenna 120 overlap, and when the cloth base 110 is folded. They are formed so as to overlap each other.
According to the above configuration, since the boost antenna 120 is arranged over the entire surface of the cloth base 110 by folding, the RFID tag having high reception sensitivity performance is obtained.
Further, since the antenna portion extending substantially in parallel with the core antenna in the chip module 30 in the antenna central portion 121 is further lengthened, strong electromagnetic coupling can be obtained.
　熱溶着シート１４０は、図５Ｂ，Ｃに示すように、折り畳まれた布基材１１０の内部でブーストアンテナ１２０及びチップモジュール３０とともに設けられる第１熱溶着シート１４０ａと、布基材１１０上に取り付けられ、繊維製品に対し熱溶着することが可能な第２熱溶着シート１４０ｂと、から構成されている。
　第１熱溶着シート１４０ａ及び第２熱溶着シート１４０ｂは、それぞれ熱溶着領域１４１と、非熱溶着領域１４２とを有している。
　上記構成であれば、比較的製造コストが上がらないように配慮しながらも、防水性と耐薬品性に加えて耐久性を向上させたＲＦＩＤタグとなる。
　また、ＲＦＩＤタグの一方の長辺の端面が閉じているため、タグ強度を向上させることができる。 As shown in FIGS. 5B and 5C, the heat welding sheet 140 is attached to the first heat welding sheet 140 a provided together with the boost antenna 120 and the chip module 30 inside the folded cloth base 110, and is mounted on the cloth base 110. And a second heat welding sheet 140b that can be heat welded to the fiber product.
Each of the first heat welding sheet 140a and the second heat welding sheet 140b has a heat welding area 141 and a non-heat welding area 142.
With the above configuration, the RFID tag has improved durability in addition to waterproofness and chemical resistance, while taking care not to increase the manufacturing cost relatively.
Further, since the end face of one long side of the RFID tag is closed, the tag strength can be improved.
　次に、ＲＦＩＤタグ１００の製造方法について図５Ｂ，Ｃに基づいて説明する。
　まずは、布基材１１０の表面上に、波線形状のアンテナパターンとなるようにブーストアンテナ１２０をスクリーン印刷する。
　そして、図５Ｂに示すように、熱溶着用金型Ｍ及びタグ置き台Ｔを準備し、タグ置き台Ｔ上において下から順に第２熱溶着シート１４０ｂ、折り畳まれた布基材１１０（ブーストアンテナ１２０を含む）の一方側部分、チップモジュール３０、第１熱溶着シート１４０ａ、折り畳まれた布基材１１０の他方側部分を重ねるように配置する。 Next, a method of manufacturing the RFID tag 100 will be described with reference to FIGS.
First, the boost antenna 120 is screen-printed on the surface of the cloth substrate 110 so as to form a wavy antenna pattern.
Then, as shown in FIG. 5B, a heat welding mold M and a tag holder T are prepared, and the second heat welding sheet 140b and the folded cloth base 110 (the boost antenna) are sequentially arranged on the tag holder T from the bottom. 120), the chip module 30, the first heat-sealing sheet 140a, and the other side of the folded cloth substrate 110 are arranged so as to overlap each other.
　そして、熱溶着用金型Ｍによって各構成部品の熱溶着領域１４１に相当する部分を所定の熱と圧力を加えて挟み込むことで、構成部品同士をつなぎ合わせる。
　具体的には、熱溶着用金型Ｍによって、布基材１１０の面のうち、チップモジュール３０が重なる部分及び周辺部分のみを熱溶着させる。
　詳しく言うと、第１熱溶着シート１４０ａ及び第２熱溶着シート１４０ｂにおいて熱溶着領域１４１のみを熱溶着することで各構成部品を一体化させており、熱溶着領域１４１の両側の領域については非熱溶着領域１４２となっている。
　上記の製造工程によって、ＲＦＩＤタグ１００を製造することができる。 Then, the components corresponding to the heat welding region 141 of each component are sandwiched by applying predetermined heat and pressure by the heat welding mold M, thereby connecting the components together.
Specifically, only the portion where the chip module 30 overlaps and the peripheral portion of the surface of the cloth substrate 110 are thermally welded by the heat welding mold M.
More specifically, in the first heat-sealing sheet 140a and the second heat-sealing sheet 140b, each component is integrated by heat-welding only the heat-welding area 141, and the areas on both sides of the heat-welding area 141 are not. A heat welding region 142 is formed.
Through the above manufacturing steps, the RFID tag 100 can be manufactured.
　　＜ＲＦＩＤタグの第３実施形態＞
　次に、第３施形態となるＲＦＩＤタグ２００について、図６Ａ，Ｂに基づいて説明する。
　ＲＦＩＤタグ２００では、ＲＦＩＤタグ１００と比較して、ブーストアンテナ２２０の形状が異なっている。
　ブーストアンテナ２２０は、波線形状のアンテナパターンとして形成され、布基材１１０の長さ方向に沿って延びており、その長さ方向の中央部においてアンテナ中央部２２１を有している。
　アンテナ中央部２２１は、折り畳み境界線１１１を境にして線対称となる２つの略半楕円形状のアンテナ部分からなり、布基材１１０が折り畳まれたときに互いに重なり合うように形成されている。
　なお、アンテナ中央部２２１には、チップモジュール３０との過度な干渉を抑制すべく、チップモジュール３０が重なる部分においてくり抜き穴が形成されている。
　ＲＦＩＤタグ２００の製造方法については、ＲＦＩＤタグ１００と同様である。 <Third Embodiment of RFID Tag>
Next, an RFID tag 200 according to a third embodiment will be described with reference to FIGS. 6A and 6B.
The shape of the boost antenna 220 of the RFID tag 200 is different from that of the RFID tag 100.
The boost antenna 220 is formed as a wavy antenna pattern, extends along the length direction of the cloth substrate 110, and has an antenna center portion 221 at a center portion in the length direction.
The antenna central portion 221 is composed of two substantially semi-elliptical antenna portions that are line-symmetric with respect to the folding boundary line 111, and are formed so as to overlap each other when the cloth base material 110 is folded.
In addition, a hollow hole is formed in the central portion 221 of the antenna at a portion where the chip module 30 overlaps in order to suppress excessive interference with the chip module 30.
The method of manufacturing the RFID tag 200 is the same as that of the RFID tag 100.
　上記構成であれば、アンテナ中央部２２１において、チップモジュール３０内のコアアンテナと略平行に延びているアンテナ部分がより一層長くなるため、より強い電磁結合を得ることができる。
　また、アンテナ中央部２２１の面積が広いため、折れ曲がりによる断線の虞を抑制することができる。 With the above configuration, the antenna portion extending substantially in parallel with the core antenna in the chip module 30 in the antenna central portion 221 is further lengthened, so that stronger electromagnetic coupling can be obtained.
Further, since the area of the antenna central portion 221 is large, the possibility of disconnection due to bending can be suppressed.
　　＜ＲＦＩＤタグの第４実施形態＞
　次に、第４施形態となるＲＦＩＤタグ３００について、図７Ａ，Ｂに基づいて説明する。
　ＲＦＩＤタグ３００では、ＲＦＩＤタグ１と比較して、布基材１０上にチップモジュール３０を接着剤３５０で取り付けている点が主に異なっている。
　接着剤３５０は、布基材１０の表面のうち、チップモジュール３０が取り付けられた部分及び周辺部分にのみ塗布されている。
　言い換えると、熱溶着シート３４０が、図７Ａに示すように、布基材１０の表面のうち、チップモジュール３０が取り付けられた部分及び周辺部分に対し、接着剤３５０で取り付けられている取り付け領域３４１と、取り付け領域３４１とは異なる部分であって、布基材１０に対し取り付けられていない（対向していない）非取り付け領域３４２と、を有している。 <Fourth Embodiment of RFID Tag>
Next, an RFID tag 300 according to a fourth embodiment will be described with reference to FIGS. 7A and 7B.
The RFID tag 300 is different from the RFID tag 1 mainly in that the chip module 30 is attached to the cloth substrate 10 with an adhesive 350.
The adhesive 350 is applied only to a portion of the surface of the cloth base material 10 where the chip module 30 is attached and a peripheral portion.
In other words, as shown in FIG. 7A, the attachment region 341 where the heat welding sheet 340 is attached to the portion where the chip module 30 is attached and the peripheral portion of the surface of the cloth base material 10 with the adhesive 350 is provided. And a non-attachment area 342 that is different from the attachment area 341 and is not attached to (not opposed to) the cloth base material 10.
　上記の場合、取り付け領域３４１及び非取り付け領域３４２は、繊維製品に対しＲＦＩＤタグ３００を熱溶着するための領域であって、予め熱圧着されておらず、熱溶着可能な領域となっている。
　また、非取り付け領域３４２は、布基材１０の厚み方向において布基材１０及びブーストアンテナ２０から若干離間している。つまり、非取り付け領域３４２と布基材１０及びブーストアンテナ２０の間に隙間が形成されている。
　上記構成であっても、１枚の熱溶着シートを有効利用して、シンプルな構成で製造コストを抑えたＲＦＩＤタグを実現できる。 In the above case, the attachment region 341 and the non-attachment region 342 are regions for heat-welding the RFID tag 300 to the textile product, and are not heat-compressed in advance but are heat-sealable regions.
The non-attachment area 342 is slightly separated from the cloth base 10 and the boost antenna 20 in the thickness direction of the cloth base 10. That is, a gap is formed between the non-attachment area 342 and the cloth base material 10 and the boost antenna 20.
Even with the above configuration, an RFID tag with a simple configuration and a low manufacturing cost can be realized by effectively utilizing one heat-sealing sheet.
　ＲＦＩＤタグ３００の製造方法について簡単に説明すると、ブーストアンテナ２０が印刷された布基材１０上にチップモジュール３０を配置し、チップモジュール３０の周辺部分に接着剤３５０を塗布する。
　そして、布基材１０の表面に対しチップモジュール３０及び接着剤３５０を覆うように熱溶着シート３４０を押し当てて、布基材１０、チップモジュール３０、熱溶着シート３４０を一体化させる。
　上記シンプルな製造工程によって、ＲＦＩＤタグ３００を製造することができる。 The method of manufacturing the RFID tag 300 will be briefly described. The chip module 30 is arranged on the cloth substrate 10 on which the boost antenna 20 is printed, and an adhesive 350 is applied to a peripheral portion of the chip module 30.
Then, the heat welding sheet 340 is pressed against the surface of the cloth base material 10 so as to cover the chip module 30 and the adhesive 350, so that the cloth base material 10, the chip module 30 and the heat welding sheet 340 are integrated.
The RFID tag 300 can be manufactured by the above simple manufacturing process.
　　＜ＲＦＩＤタグの第５実施形態＞
　次に、第５施形態となるＲＦＩＤタグ４００について、図８Ａ，Ｂに基づいて説明する。
　ＲＦＩＤタグ４００では、ＲＦＩＤタグ１と比較して、熱溶着シート４０上にブーストアンテナがスクリーン印刷されている点が主に異なっている。
　具体的には、ＲＦＩＤタグ４００は、布基材１０と、布基材１０上に取り付けられる熱溶着シート４０と、熱溶着シート４０上に印刷されるブーストアンテナ２０と、布基材１０と熱溶着シート４０の間に挟まれた状態で布基材１０に対して取り付けられるチップモジュール３０と、から主に構成されている。
　布基材１０は、図８Ａに示すように、熱溶着シート４０の長さ方向において熱溶着シート４０よりも短くなるように形成されており、詳しく言うと熱溶着シート４０のうち、熱溶着領域４１に対向する位置に設けられ、熱溶着領域４１と略同じ大きさで形成されている。
　なお、ＲＦＩＤタグ４００の製造方法については、ＲＦＩＤタグ１と同様である。
　上記構成であれば、シンプルな構成によって製造コストを一層抑えた上で、繊維製品に対し熱溶着することが可能なＲＦＩＤタグを実現することができる。 <Fifth Embodiment of RFID Tag>
Next, an RFID tag 400 according to a fifth embodiment will be described with reference to FIGS. 8A and 8B.
The RFID tag 400 is different from the RFID tag 1 mainly in that the boost antenna is screen-printed on the heat welding sheet 40.
Specifically, the RFID tag 400 includes a cloth base material 10, a heat welding sheet 40 mounted on the cloth base material 10, a boost antenna 20 printed on the heat bonding sheet 40, And a chip module 30 that is attached to the cloth base material 10 while being sandwiched between the welding sheets 40.
As shown in FIG. 8A, the cloth base material 10 is formed so as to be shorter than the heat welding sheet 40 in the length direction of the heat welding sheet 40. It is provided at a position opposed to 41, and is formed in substantially the same size as the heat welding region 41.
Note that the method of manufacturing the RFID tag 400 is the same as that of the RFID tag 1.
With the above configuration, it is possible to realize an RFID tag that can be thermally welded to a fiber product while further reducing the manufacturing cost with a simple configuration.
　　＜その他の実施形態＞
　上記実施形態において、図１に示すように、布基材１０は、織布または編布であるが、特に限定されることなく変更可能であって、布材料以外の材料、例えば樹脂材料等から形成されていても良い。 <Other embodiments>
In the above embodiment, as shown in FIG. 1, the cloth base material 10 is a woven cloth or a knitted cloth, but can be changed without any particular limitation, and may be made of a material other than a cloth material, such as a resin material. It may be formed.
　上記実施形態において、図１に示すように、ブーストアンテナ２０は、波線形状のアンテナパターンとして形成されているが、特に限定されることなく、例えば、矩形状、円形状、直線状、曲線状等の形状として形成されていても良い。 In the above embodiment, as shown in FIG. 1, the boost antenna 20 is formed as a wavy antenna pattern, but is not particularly limited, and may be, for example, rectangular, circular, linear, curved, or the like. May be formed.
　上記実施形態において、図１に示すように、ブーストアンテナ２０は、布基材１０上において導電性インクをスクリーン印刷することで形成されているが、特に限定されることなく、例えば布基材１０に対し導電性糸を縫製する等、公知な方法で形成されていても良い。 In the above embodiment, as shown in FIG. 1, the boost antenna 20 is formed by screen-printing a conductive ink on the cloth base material 10, but is not particularly limited. Alternatively, it may be formed by a known method such as sewing a conductive thread.
　上記実施形態において、図１に示すように、熱溶着シート４０は、布基材１０の表面を全体にわたって覆っているが、特に限定されることなく、布基材１０の表面を部分的に覆うように構成しても良い。 In the above embodiment, as shown in FIG. 1, the heat welding sheet 40 covers the entire surface of the cloth substrate 10, but is not particularly limited, and partially covers the surface of the cloth substrate 10. It may be configured as follows.
　上記実施形態において、図１、図４Ａ，Ｂに示すように、熱溶着シート４０は、布基材１０の表面のうち、チップモジュール３０が取り付けられた部分及び周辺部分に対して取り付けられているが、特に限定されることなく変更可能である。
　例えば、熱溶着シート４０が、布基材１０の表面のうち、チップモジュール３０が取り付けられた周辺部分に対してのみ取り付けられていても良いし、または、チップモジュール３０が取り付けられた部分に対してのみ取り付けられていても良い。 In the above embodiment, as shown in FIGS. 1, 4A and 4B, the heat welding sheet 40 is attached to a portion of the surface of the cloth substrate 10 where the chip module 30 is attached and a peripheral portion. Can be changed without particular limitation.
For example, the heat welding sheet 40 may be attached only to the peripheral portion of the surface of the cloth base material 10 where the chip module 30 is attached, or may be attached to the portion where the chip module 30 is attached. May be attached only.
　上記実施形態において、図１、図４Ａ，Ｂに示すように、熱溶着シート４０は、布基材１０に対して熱溶着シート４０自身の一部が熱溶着されて取り付けられているが、特に限定されることなく、図７Ａ，Ｂに示すように、布基材１０に対し接着剤３５０等を用いて取り付けられていても良い。 In the above embodiment, as shown in FIGS. 1, 4A and 4B, the heat welding sheet 40 is attached to the cloth base material 10 by partially welding the heat welding sheet 40 itself. Without being limited thereto, as shown in FIGS. 7A and 7B, it may be attached to the cloth base material 10 using an adhesive 350 or the like.
　上記実施形態では、主として本発明に係るＲＦＩＤタグに関して説明した。
　ただし、上記の実施形態は、本発明の理解を容易にするための一例に過ぎず、本発明を限定するものではない。本発明は、その趣旨を逸脱することなく、変更、改良され得ると共に、本発明にはその等価物が含まれることは勿論である。
　特に、熱溶着シートに関する配置、構成について、上記の実施形態にて説明したものは、あくまで一例に過ぎず本発明を限定するものではない。 In the above embodiment, the RFID tag according to the present invention has been mainly described.
However, the above embodiment is merely an example for facilitating understanding of the present invention, and does not limit the present invention. The present invention can be modified and improved without departing from the gist of the present invention, and the present invention naturally includes equivalents thereof.
In particular, the arrangement and configuration related to the heat-sealing sheet described in the above embodiment are merely examples, and do not limit the present invention.
１，１００，２００，３００，４００　ＲＦＩＤタグ
１０，１１０，４１０　布基材（基材）
　１１１　折り畳み境界線
２０，１２０，２２０　ブーストアンテナ
　２１，１２１，２２１　アンテナ中央部
３０　チップモジュール
　３１　ＩＣチップ
　３２　コアアンテナ
　３３　封止部
４０，１４０，３４０　熱溶着シート
　４１　熱溶着領域（取り付け領域）
　４２　非熱溶着領域（非取り付け領域）
　１４０ａ　第１熱溶着シート
　１４０ｂ　第２熱溶着シート
　１４１　熱溶着領域
　１４２　非熱溶着領域
　３４１　取り付け領域
　３４２　非取り付け領域
３５０　接着剤
Ｍ　熱溶着用金型
Ｔ　タグ置き台 1,100,200,300,400 RFID tag 10,110,410 Cloth base material (base material)
111 Folding boundary line 20, 120, 220 Boost antenna 21, 121, 221 Antenna central part 30 Chip module 31 IC chip 32 Core antenna 33 Sealing part 40, 140, 340 Heat welding sheet 41 Heat welding area (mounting area)
42 Non-thermal welding area (non-attachment area)
140a First heat welding sheet 140b Second heat welding sheet 141 Heat welding area 142 Non-heat welding area 341 Mounting area 342 Non-mounting area 350 Adhesive M Heat welding mold T Tag stand

Claims (8)

  1. 　基材と、
    　該基材に設けられ、導電性材料からなるブーストアンテナと、
    　前記基材において前記ブーストアンテナに対応する所定位置に取り付けられる無線通信用のチップモジュールと、
    　前記基材上において前記ブーストアンテナ及び前記チップモジュールを覆うように取り付けられ、熱溶着性を有する熱溶着シートと、を備え、
    　該熱溶着シートによって繊維品に対し熱溶着することが可能なＲＦＩＤタグであって、
    　前記熱溶着シートは、
    　前記基材の面のうち、前記チップモジュールが取り付けられた部分及び／または周辺部分において、前記基材に対し取り付けられた状態で設けられる取り付け領域と、
    　該取り付け領域とは異なる部分であって、前記基材に対し取り付けられていない状態で設けられる非取り付け領域と、を有することを特徴とするＲＦＩＤタグ。     A substrate,
    A boost antenna provided on the base material and made of a conductive material,
    A chip module for wireless communication attached to a predetermined position corresponding to the boost antenna in the base material,
    A heat welding sheet attached on the base material so as to cover the boost antenna and the chip module, and having a heat welding property;
    An RFID tag that can be thermally welded to a fiber product by the thermal welding sheet,
    The heat-welded sheet,
    A mounting area provided in a state where the chip module is mounted on a portion and / or a peripheral portion of the surface of the substrate, the portion being attached to the substrate, and / or
    An RFID tag, comprising: a non-attachment area that is different from the attachment area and that is not attached to the base material.
  2. 　前記取り付け領域は、前記基材に対し前記熱溶着シートの一部が熱溶着されて取り付けられている熱溶着領域であって、
    　前記非取り付け領域は、前記熱溶着領域とは異なる部分であって、前記熱溶着シートが熱溶着されていない非熱溶着領域であることを特徴とする請求項１に記載のＲＦＩＤタグ。     The attachment area is a heat-welding area in which a part of the heat-welding sheet is attached to the base material by heat-welding,
    2. The RFID tag according to claim 1, wherein the non-attached area is a part different from the heat-welded area and is a non-heat-welded area where the heat-welded sheet is not heat-welded. 3.
  3. 　前記非取り付け領域は、複数設けられ、前記取り付け領域を間に挟むように設けられていることを特徴とする請求項１又は２に記載のＲＦＩＤタグ。 The RFID tag according to claim 1 or 2, wherein a plurality of the non-attachment areas are provided, and the non-attachment areas are provided so as to sandwich the attachment area.
  4. 　前記取り付け領域は、前記基材の長さ方向における中央部分に設けられ、
    　前記非取り付け領域は、前記基材の長さ方向における両側部分に設けられていることを特徴とする請求項３に記載のＲＦＩＤタグ。     The mounting area is provided at a central portion in a length direction of the base material,
    The RFID tag according to claim 3, wherein the non-attachment area is provided on both side portions in a length direction of the base material.
  5. 　前記基材は、伸縮性を有する絶縁シートからなり、
    　前記ブーストアンテナは、伸縮性を有する導電性インクからなり、前記基材上に設けられていることを特徴とする請求項１乃至４のいずれか１項に記載のＲＦＩＤタグ。     The base material is made of an insulating sheet having elasticity,
    The RFID tag according to claim 1, wherein the boost antenna is made of a conductive ink having elasticity and is provided on the base material.
  6. 　前記基材は、折り畳まれた状態で構成され、
    　前記熱溶着シートは、
    　折り畳まれた前記基材の内部に前記ブーストアンテナ及び前記チップモジュールとともに設けられる第１熱溶着シートと、
    　前記基材上に取り付けられ、繊維品に対し熱溶着することが可能な第２熱溶着シートと、を備え、
    　前記第１熱溶着シート及び前記第２熱溶着シートは、それぞれ前記取り付け領域と、前記非取り付け領域と、を有することを特徴とする請求項１乃至５のいずれか１項に記載のＲＦＩＤタグ。     The substrate is configured in a folded state,
    The heat-welded sheet,
    A first heat-sealing sheet provided together with the boost antenna and the chip module inside the folded base material;
    A second heat welded sheet attached to the base material and capable of being heat welded to a fiber product,
    The RFID tag according to any one of claims 1 to 5, wherein the first heat-sealing sheet and the second heat-sealing sheet each include the attachment region and the non-attachment region.
  7. 　基材と、
    　該基材上に取り付けられ、熱溶着性を有する熱溶着シートと、
    　該熱溶着シートに設けられ、導電性材料からなるブーストアンテナと、
    　前記基材と前記熱溶着シートの間に挟まれた状態で、前記熱溶着シートにおいて前記ブーストアンテナに対応する所定位置に取り付けられる無線通信用のチップモジュールと、を備え、
    　前記熱溶着シートによって繊維品に対し熱溶着することが可能なＲＦＩＤタグであって、
    　前記熱溶着シートは、
    　前記基材の面のうち、前記チップモジュールが取り付けられた部分及び／または周辺部分において、前記基材に対し取り付けられた状態で設けられる取り付け領域と、
    　該取り付け領域とは異なる部分であって、前記基材に対し取り付けられていない状態で設けられる非取り付け領域と、を有することを特徴とするＲＦＩＤタグ。     A substrate,
    A heat-welding sheet attached to the base material and having heat-welding properties,
    A boost antenna provided on the heat welding sheet and made of a conductive material;
    In the state sandwiched between the base material and the heat welding sheet, a chip module for wireless communication attached to a predetermined position corresponding to the boost antenna in the heat welding sheet,
    An RFID tag that can be thermally welded to a fiber product by the thermal welding sheet,
    The heat-welded sheet,
    A mounting area provided in a state where the chip module is mounted on a portion and / or a peripheral portion of the surface of the substrate, the portion being attached to the substrate, and / or
    An RFID tag, comprising: a non-attachment area that is different from the attachment area and that is not attached to the base material.
  8. 　前記取り付け領域は、前記基材に対し前記熱溶着シートの一部が熱溶着された熱溶着領域であって、
    　前記非取り付け領域は、前記熱溶着領域とは異なる部分であって、前記熱溶着シートが熱溶着されていない非熱溶着領域であることを特徴とする請求項７に記載のＲＦＩＤタグ。
     
          The mounting area is a heat-welded area in which a part of the heat-welded sheet is heat-welded to the base material,
    The RFID tag according to claim 7, wherein the non-attachment area is a part different from the heat-welding area, and is a non-heat-welding area where the heat-welding sheet is not heat-welded.

PCT/JP2018/028757 2018-07-31 2018-07-31 Rfid tag WO2020026364A1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013089022A (en) * 2011-10-18 2013-05-13 Apic Yamada Corp Rfid tag, method for manufacturing rfid tag, and die
US20150278671A1 (en) * 2012-10-01 2015-10-01 Tagsys Sas Rfid tag assemblies and process
WO2017135331A1 (en) * 2016-02-02 2017-08-10 マイティキューブ株式会社 Rfid tag

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013089022A (en) * 2011-10-18 2013-05-13 Apic Yamada Corp Rfid tag, method for manufacturing rfid tag, and die
US20150278671A1 (en) * 2012-10-01 2015-10-01 Tagsys Sas Rfid tag assemblies and process
WO2017135331A1 (en) * 2016-02-02 2017-08-10 マイティキューブ株式会社 Rfid tag

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