WO2019235496A1 - 複合粒子及びその製造方法 - Google Patents
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- WO2019235496A1 WO2019235496A1 PCT/JP2019/022234 JP2019022234W WO2019235496A1 WO 2019235496 A1 WO2019235496 A1 WO 2019235496A1 JP 2019022234 W JP2019022234 W JP 2019022234W WO 2019235496 A1 WO2019235496 A1 WO 2019235496A1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/12—Powdering or granulating
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/08—Ingredients agglomerated by treatment with a binding agent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/26—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
- C08G65/2618—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing nitrogen
- C08G65/2633—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing nitrogen the other compounds containing amide groups
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/08—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from amino-carboxylic acids
- C08G69/14—Lactams
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/10—Compounds of cadmium
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
- C09C3/10—Treatment with macromolecular organic compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/40—Electric properties
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
Definitions
- the present disclosure relates to composite particles obtained by coating an inorganic filler with a thermoplastic resin, and a method for producing the same.
- heat sinks for heat dissipation are required for stable operation. It is indispensable to use heat radiation fins.
- a material having both insulating properties and thermal conductivity is required.
- a printed circuit board on which a semiconductor is mounted is an insulating material, and an organic material is widely used for this. Although these organic materials have high insulating properties, their thermal conductivity is low and their contribution to the heat dissipation of the semiconductor is not large.
- inorganic materials such as inorganic ceramics may be used for semiconductor heat dissipation. Although these inorganic materials have high thermal conductivity, it is difficult to say that their insulating properties are sufficient compared to organic materials. For this reason, as a material for a printed circuit board, a material that can achieve both high insulation and thermal conductivity is required.
- Patent Documents 1 to 3 As a method for improving the thermal conductivity of a thermally conductive material, a method in which a filler of an insulating ceramic such as aluminum oxide powder or aluminum nitride powder is contained in a matrix resin is known (Patent Documents 1 to 3).
- Patent Document 4 discloses a method in which a fluidity modifier is mixed to improve the fluidity of the filler.
- Patent Document 5 discloses a thermally conductive resin composition having polyamide fibers, boron nitride, and aramid fibers at specific ratios.
- JP 2002-280498 A Japanese Patent Laid-Open No. 2003-342021 JP 2005-209765 A JP-A-10-204300 JP 2010-116518 A
- the problem of the present disclosure is to provide composite particles having sufficient insulation and high thermal conductivity, and in addition to these, provide composite particles having excellent handleability and moldability. There is to do.
- a method for producing composite particles having an irregular shape formed by agglomerating primary particles of an inorganic filler, wherein the primary particles are coated with a thermoplastic resin comprising: (1) Providing a mixture containing the inorganic filler and a monomer and / or oligomer of the thermoplastic resin, wherein the monomer and / or oligomer is liquid and covers primary particles of the inorganic filler And (2) non-uniform composite particles in which the primary particles of the inorganic filler are aggregated by polymerizing the monomers and / or oligomers, and the primary particles are coated with a thermoplastic resin. Forming.
- ⁇ Aspect 2> The manufacturing method of aspect 1 whose monomer and / or oligomer of the said thermoplastic resin are cyclic compounds which can be ring-opening-polymerized.
- ⁇ Aspect 3> Production of composite particles according to aspect 2, characterized in that the thermoplastic resin is produced by ring-opening polymerization of the cyclic compound in a state of a mixture of a ring-openable polymerizable cyclic compound and an inorganic filler.
- Method. ⁇ Aspect 4> The method for producing composite particles according to any one of embodiments 1 to 3, wherein the thermoplastic resin is polyamide.
- ⁇ Aspect 5> The production method according to any one of Embodiments 2 to 4, wherein the cyclic compound is ⁇ -caprolactam and / or ⁇ -laurolactam.
- ⁇ Aspect 6> The composite particle according to any one of embodiments 1 to 5, wherein the inorganic filler is boron nitride particles or silicon particles provided with a coating of an insulating layer.
- ⁇ Aspect 7> A composite particle having an irregular shape formed by agglomerating primary particles of an inorganic filler, wherein the primary particle is coated with a thermoplastic resin.
- thermoplastic resin is a thermoplastic resin produced by ring-opening polymerization of a cyclic compound in the state of a mixture of the inorganic filler and a cyclic compound capable of ring-opening polymerization.
- the invention according to the present disclosure can provide composite particles having sufficient insulation and high thermal conductivity. Furthermore, according to this invention, the composite particle excellent in the handleability and the moldability can be provided.
- FIG. 1 is a conceptual diagram of a method for producing composite particles according to the present disclosure.
- FIG. 2 is a conceptual diagram of a conventional method for producing a thermoplastic resin composition containing a filler.
- FIG. 3 is a schematic cross-sectional view of a composite particle according to the present disclosure.
- FIG. 4 is a schematic cross-sectional view of one embodiment of a thermoplastic resin composition having a filler according to the prior art.
- FIG. 5 is a cross-sectional schematic diagram of another aspect of the thermoplastic resin composition which has a filler based on a prior art.
- FIG. 6 is a conceptual diagram of a manufacturing process of a molded body using the composite particles according to the present disclosure.
- FIG. 7 shows a cross section of a composite particle according to the present disclosure, as observed by SEM.
- the method according to the present disclosure is a method for producing composite particles having an irregular shape formed by agglomerating primary particles of an inorganic filler, and the primary particles are coated with a thermoplastic resin.
- the monomer and / or oligomer is in a liquid state, and the inorganic filler is primary It covers the particles.
- FIG. 2 is a conceptual diagram of a method for producing a thermoplastic resin composition containing a filler according to the prior art.
- the thermoplastic resin composition 20 is produced by mixing the thermoplastic resin 24 and the inorganic filler 21 (M in FIG. 2).
- the thermoplastic resin since the thermoplastic resin has a relatively high viscosity, the thermoplastic resin cannot be sufficiently impregnated between the primary particles of the inorganic filler 21 by this method.
- the liquid monomer and / or oligomer that is the raw material of the thermoplastic resin has a low viscosity.
- FIG. 1 is a conceptual diagram of a method for producing composite particles according to the present disclosure.
- the monomer and / or oligomer 13 of the liquid thermoplastic resin and the primary particles 11 of the inorganic filler are stirred and mixed (M in FIG. 1).
- a mixture 15 coated with primary particles 11 is obtained.
- this mixture is heat-treated, for example, under an inert atmosphere, and the monomer and / or oligomer is polymerized (P in FIG. 1), whereby the composite particle 10 having the primary particles 11 of the thermoplastic resin 14 and the inorganic filler is obtained.
- the primary particles 11 of the inorganic filler are coated with the thermoplastic resin 14, and the primary particles 11 of the inorganic filler are aggregated by being bonded to each other via the thermoplastic resin 14. .
- the inorganic filler can be sufficiently impregnated with the monomer and / or oligomer by impregnating the inorganic filler with the liquid low-viscosity monomer and / or oligomer.
- the monomer and / or oligomer is polymerized to be polymerized, thereby obtaining composite particles in which the inorganic filler that maintains the aggregated state is tightly coated with the thermoplastic resin.
- the aggregated state of the primary particles of the inorganic filler is maintained, resulting in high thermal conductivity of the composite particles. Conceivable. That is, the composite particles according to the present disclosure can effectively exhibit high thermal conductivity by using the aggregated inorganic filler.
- the primary particles of the inorganic filler are covered with the thermoplastic resin, so the inorganic filler and the thermoplastic resin are highly mixed. It is thought that it was in the state that was done. Therefore, for example, in the molded body formed by the composite particles according to the present disclosure, it is considered that the inorganic filler can be uniformly dispersed in the thermoplastic resin. That is, according to the method of the present disclosure, composite particles having excellent moldability are provided.
- the composite particles obtained by the manufacturing method according to the present disclosure have high insulating properties because the inorganic filler is covered with the thermoplastic resin.
- the composite particles obtained by the production method according to the present disclosure are in the form of particles, they are excellent in handleability in a molding process or the like.
- the manufacturing method according to the present disclosure it is possible to provide composite particles having sufficient insulation and high thermal conductivity. Furthermore, according to this invention, the composite particle excellent in the handleability and the moldability can be provided.
- ⁇ Composite particle> According to the production method according to the present disclosure, it is possible to produce a composite particle that is an amorphous composite particle formed by agglomerating primary particles of an inorganic filler and the primary particle is coated with a thermoplastic resin.
- ⁇ Provision process> In the providing step of the production method according to the present disclosure, a mixture containing an inorganic filler and a monomer and / or oligomer of a thermoplastic resin is provided.
- inorganic filler for example, aluminum nitride, silica, alumina, magnesium oxide, silicon nitride, boron nitride, or zinc oxide particles, or silicon particles provided with a coating of an insulating layer can be used.
- preferable inorganic fillers are boron nitride particles or silicon particles provided with a coating of an insulating layer.
- the boron nitride either hexagonal crystal or cubic crystal can be used. From the viewpoint of obtaining excellent thermal conductivity, hexagonal boron nitride is preferable.
- ⁇ Inorganic fillers may be used alone or in combination.
- the shape of the primary particles of the inorganic filler is not limited, and may be, for example, spherical, scaly, or fibrous primary particles.
- the particle size of the primary particles of the inorganic filler is 0.1 to 200 ⁇ m, 1 to 100 ⁇ m, preferably 10 to 50 ⁇ m as an average particle size.
- the particle size of the aggregated particles of the inorganic filler is 1 to 1000 ⁇ m, preferably 10 to 500 ⁇ m, as an average particle size.
- the average particle diameter of the composite particles can be measured by dispersing the composite particles in water and using a laser diffraction / scattering type particle size distribution analyzer (for example, Microtrack Bell Co., Ltd. Mt3000) as a measuring device.
- a laser diffraction / scattering type particle size distribution analyzer for example, Microtrack Bell Co., Ltd. Mt3000
- thermoplastic resin examples include polyamide, polyester, polycarbonate, polyether, polysulfide, and polyarylene ether ketone (PAEK), and polyamide is preferably used. Particularly preferred polyamides are polyamide 6, polyamide 12, and polyamide 612.
- PAEK polyarylene ether ketone
- PEEK polyether ketone
- PEEKK polyether ketone ketone
- the inorganic filler occupies 51.0% by volume to 99.9% by volume and the thermoplastic resin occupies 49.0% by volume to 0.1% by volume. . If there are too few inorganic fillers or too much thermoplastic resin, the particles will aggregate and become coarse, which makes it difficult to form a particle shape, which is not preferable, and there are too many inorganic fillers or thermoplasticity. If the resin is too small, the thermoplastic resin cannot coat the inorganic filler, which is not preferable.
- the inorganic filler is 51.0% by volume or more, 55.0% by volume or more, 60.0% by volume. Or more, 65.0% by volume or more, or 70.0% by volume or more and / or 99.9% by volume or less, 99.0% by volume or less, 95.0% by volume or less, 90.0% by volume or less, 85. 9.
- thermoplastic resin is 0.1% by volume or more, 1.0% by volume or more, 5.0% by volume or more; 0% by volume or more, 15.0% by volume or more, 20.0% by volume or more, or 25.0% by volume or more, and / or 49.0% by volume or less, 45.0% by volume or less, 40.0% by volume or less 35.0% by volume or less, or 30.0% by volume or less.
- the ratio of the inorganic filler and the monomer and / or oligomer of the thermoplastic resin in the providing step may be determined so that the ratio of the inorganic filler and the thermoplastic resin is in the above range.
- the monomer and / or oligomer of the thermoplastic resin is one that produces a thermoplastic resin by a polymerization reaction.
- the monomer and / or oligomer of the thermoplastic resin may be, for example, one that produces a polyamide, polyester, polycarbonate, polyether, polysulfide, or polyarylene ether ketone (PAEK) by a polymerization reaction.
- PAEK polyarylene ether ketone
- PAEK polyether ketone
- PEEK polyether ketone
- PEKK polyether ether ketone
- PEEKK polyether ketone ketone
- the monomer and / or oligomer of the thermoplastic resin is not limited to one type, and may be a mixture of one or more monomers and / or oligomers.
- the oligomer of the thermoplastic resin has a structure obtained by polymerizing one or plural kinds of monomers of 100 or less, 50 or less, 30 or less, 10 or less, or 5 or less, and constitutes the thermoplastic resin. Having a repeating unit.
- the thermoplastic resin consists of a polymer obtained by a ring-opening polymerization reaction. That is, a cyclic compound that can be polymerized by a ring-opening polymerization reaction is used as a raw material for the thermoplastic resin.
- the monomer and / or oligomer of the thermoplastic resin is a cyclic compound capable of ring-opening polymerization.
- cyclic compound that can be polymerized by such a ring-opening polymerization reaction for example, a cyclic amide, a cyclic ester, a cyclic carbonate, a cyclic ether, or a cyclic sulfide can be used.
- Particularly preferred cyclic compounds are ⁇ -caprolactam and / or ⁇ -laurolactam.
- examples of the cyclic compound include cyclic oligomers composed of repeating units constituting polymers such as polyester, polycarbonate, polysulfide, and polyarylene ether ketone (PAEK).
- examples of the polyarylene ether ketone (PAEK) include polyether ketone (PEK), polyether ether ketone (PEEK), polyether ketone ketone (PEKK), and polyether ether ketone ketone (PEEKK). Can do.
- polyamide 6 When producing polyamide 6 as the thermoplastic resin, ⁇ -caprolactam is used as the cyclic compound. When producing polyamide 12 as a thermoplastic resin, ⁇ -laurolactam is used. When producing polyamide 612 as a thermoplastic resin, ⁇ -caprolactam and ⁇ -laurolactam are used in combination.
- thermoplastic resin is generated by ring-opening polymerization of a cyclic compound in a state of a mixture of a ring-openable polymerizable cyclic compound and an inorganic filler.
- a mixture containing an inorganic filler and a monomer and / or oligomer of a thermoplastic resin is provided, for example, by adding an inorganic filler to the monomer and / or oligomer of a thermoplastic resin and then mixing and / or kneading. be able to.
- a general kneading apparatus such as a paint shaker or bead mill, a planetary mixer, a stirring-type disperser, a self-revolving stirring mixer, a three-roll kneader, or a single-screw or twin-screw kneader is used.
- a general kneading apparatus such as a paint shaker or bead mill, a planetary mixer, a stirring-type disperser, a self-revolving stirring mixer, a three-roll kneader, or a single-screw or twin-screw kneader is used.
- the average particle size of the composite particles obtained can be controlled by the mixing and / or kneading conditions.
- the monomer and / or oligomer of the thermoplastic resin, in particular, the cyclic compound and the inorganic filler are uniformly mixed.
- Mixing may be performed in advance or during polymerization. It is preferable to mix in advance and to mix and / or knead during polymerization.
- the monomer and / or oligomer is liquid and covers the primary particles of the inorganic filler.
- the primary particles of the inorganic filler in the composite particles according to the present disclosure are relatively good because the primary particles of the inorganic filler are covered with the monomer and / or oligomer in the providing step. It is thought that it is covered with a thermoplastic resin.
- the monomer and / or oligomer is, for example, heated and melted at a temperature higher than the melting point of the monomer and / or oligomer. By making it, it can be made liquid.
- the primary particles of the inorganic filler can be covered with the monomer and / or oligomer by adding the inorganic filler to the monomer and / or oligomer thus melted and appropriately stirring.
- the wettability of the monomer and / or oligomer to the inorganic filler is preferably relatively high.
- the mixture provided in the providing step may include a catalyst.
- a catalyst In order to promote the polymerization reaction of the monomer and / or oligomer, particularly the ring-opening polymerization reaction of the cyclic compound, it is preferable to use a catalyst.
- a catalyst a known catalyst corresponding to the monomer and / or oligomer may be used.
- the optimum catalyst may vary depending on the type of cyclic compound used as a monomer and / or oligomer, for example.
- a known catalyst can be used as a catalyst for the ring-opening polymerization reaction of each cyclic compound.
- sodium, potassium, lithium and / or magnesium bromide can be used as the ring-opening polymerization reaction catalyst.
- the catalyst may be used in combination with a ring-opening polymerization reaction accelerator.
- a ring-opening polymerization reaction accelerator for example, an isocyanate compound or a carbodiimide compound can be used.
- the mixture provided in the providing step may contain an additive.
- an additive When a cyclic compound is used as the monomer and / or oligomer of the thermoplastic resin, it is preferable to add an additive as long as the ring-opening polymerizability of the cyclic compound is not inhibited.
- additives examples include curing accelerators, discoloration inhibitors, surfactants, coupling agents, colorants, and viscosity modifiers.
- a monomer and / or oligomer is polymerized to form a composite particle having an amorphous shape in which primary particles of an inorganic filler are aggregated, and the primary particle is coated with a thermoplastic resin. Form particles.
- the polymerization reaction of the monomer and / or oligomer can be performed, for example, by subjecting the mixture provided in the providing step to heat treatment in an inert atmosphere while mixing and stirring.
- Examples of the inert atmosphere include a nitrogen atmosphere and an argon atmosphere.
- the heating temperature in the heat treatment is not particularly limited, but may be appropriately set according to the monomer and / or oligomer used.
- the heating temperature is lower than the melting point of the thermoplastic resin obtained by polymerization of the monomer and / or oligomer.
- the heating temperature may be in the range of 150 ° C. to 200 ° C., for example, when ⁇ -caprolactam is used as the monomer.
- the present disclosure also relates to an amorphous composite particle obtained by agglomerating primary particles of an inorganic filler, and the primary particle is coated with a thermoplastic resin.
- FIG. 4 is a schematic cross-sectional view of one embodiment of a thermoplastic resin composition having a filler according to the prior art.
- this thermoplastic resin composition 40 the thermoplastic resin 44 and the inorganic filler 41 are not well mixed. That is, the inorganic filler 41 is not well dispersed in the thermoplastic resin 44.
- Such a resin composition occurs, for example, when the inorganic filler is excessive with respect to the thermoplastic resin.
- Such a resin composition has a problem in that voids are generated in the resin molded product, and the impact resistance is lowered due to the voids, and high thermal conductivity is hindered. Moreover, when the dispersibility of the inorganic filler in a thermoplastic resin is low, there exists a possibility that the moldability of a thermoplastic resin composition may be inferior.
- FIG. 5 is a schematic cross-sectional view of another embodiment of a thermoplastic resin composition having a filler according to the prior art.
- the inorganic filler 51 is relatively well dispersed in the thermoplastic resin 54, but the agglomeration property of the inorganic filler 51 is low.
- Such a resin composition can be produced, for example, when the fluidity of the inorganic filler in the thermoplastic resin is high. In such a resin composition, the high thermal conductivity inherent in the inorganic filler cannot be fully utilized.
- the inorganic filler that maintains the aggregated state is tightly coated with the thermoplastic resin.
- FIG. 3 is a schematic cross-sectional view of the composite particle 10 according to the present disclosure.
- the primary particles 11 of the inorganic filler are coated with the thermoplastic resin 14, and the primary particles 11 of the inorganic filler are aggregated by being bonded to each other via the thermoplastic resin 14. .
- the composite particles according to the present disclosure primary particles of the inorganic filler are bonded to each other via a thermoplastic resin. Therefore, the aggregation state of the primary particles of the inorganic filler is maintained, and as a result, the high thermal conductivity of the composite particles is considered to be brought about. That is, the composite particles according to the present disclosure can effectively exhibit high thermal conductivity by using the aggregated inorganic filler.
- the composite particles according to the present disclosure since the primary particles of the inorganic filler are covered with the thermoplastic resin, the mixing property of the inorganic filler and the thermoplastic resin is relatively high. Conceivable. Therefore, according to the composite particles according to the present disclosure, it is considered that the inorganic filler can be uniformly dispersed in the thermoplastic resin of the molded body. Therefore, according to the present disclosure, composite particles having excellent moldability are provided.
- the composite particles according to the present disclosure have high insulating properties because the inorganic filler is covered with the thermoplastic resin.
- the composite particles according to the present disclosure are in the form of particles, they are excellent in handleability in a molding process and the like.
- composite particles according to the present disclosure composite particles having sufficient insulation and high thermal conductivity can be provided. Furthermore, according to this invention, the composite particle excellent in the handleability and the moldability can be provided.
- the composite particles according to the present disclosure can be manufactured by the manufacturing method according to the present disclosure.
- the composite particle of the present disclosure is polymerized by subjecting the cyclic compound to a ring-opening polymerization reaction in the state of a mixture of the cyclic compound capable of ring-opening polymerization reaction and an aggregated inorganic filler in accordance with the production method according to the present disclosure. It can manufacture by setting it as the binder of a plastic resin.
- the composite particles according to the present disclosure are amorphous composite particles, and the shape thereof is not particularly limited.
- the shape of the composite particles may be, for example, spherical, scaly, or fibrous.
- indefinite shape means that the composite particles are not formed by a mold or the like.
- Inorganic filler for example, aluminum nitride, silica, alumina, magnesium oxide, silicon nitride, boron nitride, or zinc oxide particles, or silicon particles provided with a coating of an insulating layer can be used.
- preferable inorganic fillers are boron nitride particles or silicon particles provided with a coating of an insulating layer.
- the boron nitride either hexagonal crystal or cubic crystal can be used. From the viewpoint of obtaining excellent thermal conductivity, hexagonal boron nitride is preferable.
- the inorganic filler is boron nitride particles or silicon particles provided with a coating of an insulating layer.
- ⁇ Inorganic fillers may be used alone or in combination.
- the shape of the primary particles of the inorganic filler is not limited, and may be, for example, spherical, scaly, or fibrous primary particles.
- the particle diameter of the primary particles of the inorganic filler is, for example, 0.1 to 200 ⁇ m, 1 to 100 ⁇ m, preferably 10 to 50 ⁇ m as an average particle diameter.
- the particle diameter of the aggregated particles of the inorganic filler is, for example, 1 ⁇ m to 1000 ⁇ m, preferably 10 ⁇ m to 500 ⁇ m, particularly preferably 20 ⁇ m to 300 ⁇ m, as an average particle diameter.
- the average particle diameter of the composite particles is within this range, good moldability can be provided.
- thermoplastic resin examples include polyamide, polyester, polycarbonate, polyether, polysulfide, and polyarylene ether ketone (PAEK), and polyamide is preferably used. Particularly preferred polyamides are polyamide 6, polyamide 12, and polyamide 612.
- PAEK polyarylene ether ketone
- PEEK polyether ketone
- PEEK polyether ketone ketone
- PEEKK polyether ketone ketone
- the thermoplastic resin is a thermoplastic resin produced by ring-opening polymerization of a cyclic compound in a state of a mixture of the inorganic filler and a ring-openable polymerizable cyclic compound. .
- the inorganic filler occupies 51.0% to 99.9% by volume and the thermoplastic resin occupies 49.0% to 0.1% by volume. If there are too few inorganic fillers or too much thermoplastic resin, the particles will aggregate and become coarse, which makes it difficult to form a particle shape, which is not preferable, and there are too many inorganic fillers or thermoplasticity. If the resin is too small, the thermoplastic resin cannot coat the inorganic filler, which is not preferable.
- the inorganic filler is preferably 51.0% by volume or more, 55.0% by volume or more, 60.0% by volume or more, 65.0%. Volume% or more, or 70.0 volume% or more, and / or 99.9 volume% or less, 99.0 volume% or less, 95.0 volume% or less, 90.0 volume% or less, 85.0 volume% or less, 80.0% by volume or less, or 75.0% by volume or less, and the thermoplastic resin is 0.1% by volume or more, 1.0% by volume or more, 5.0% by volume or more, 10.0% by volume or more, 15.0 vol% or more, 20.0 vol% or more, or 25.0 vol% or more, and / or 49.0 vol% or less, 45.0 vol% or less, 40.0 vol% or less, 35.0 vol% % Or less, or 30.0% by volume or less.
- the present disclosure also relates to a method for manufacturing a molded body including pressing the composite particles according to the present disclosure.
- FIG. 6 is a conceptual diagram of a manufacturing process of a molded body using composite particles according to the present disclosure.
- a compact 6 can be produced by optionally placing a plurality of composite particles 10 according to the present disclosure in, for example, a mold and performing a pressing process A.
- the primary particles of the inorganic filler are covered with the thermoplastic resin, and the primary particles are aggregated.
- the miscibility of the thermoplastic resin and the inorganic filler is relatively high. Therefore, it is considered that a situation where the thermoplastic resin and the inorganic filler are separated in the molding process is avoided. As a result, it is considered that by using the composite particles according to the present disclosure, it is possible to obtain a molded body having high thermal conductivity and high dispersibility of the inorganic filler.
- the manner of pressing the composite particles is not particularly limited.
- the composite particles may be pressed by using a known press machine.
- the molded body manufactured by the method according to the present disclosure may be in the form of a sheet.
- the molded body produced by the method according to the present disclosure may be a sheet, and in particular, an insulating heat conductive sheet.
- the present disclosure includes a molded body obtained by pressing the composite particles according to the present disclosure.
- the inorganic filler and the thermoplastic resin are in a highly mixed state, and the inorganic filler is the thermoplastic resin in the molded body formed by the composite particle according to the present disclosure. Since it can disperse
- a molded body having high conductivity and high insulation can be provided.
- the molded body has a sheet shape.
- the molded body is a sheet, and in particular, an insulating heat conductive sheet.
- the molded body has a thermal conductivity of 1 W / m ⁇ K to 20 W / m ⁇ K, and 1.0 ⁇ 10 14 ⁇ ⁇ cm to 20.0. It has a specific resistance of ⁇ 10 15 ⁇ ⁇ cm.
- the thermal conductivity of the molded body may be 1.0 W / m ⁇ K or more, or 2.0 W / m ⁇ K or more, and / or 20 W / m ⁇ K or less, 15 W / m ⁇ K or less, 10 W / M ⁇ K or less, or 8 W / m ⁇ K or less.
- the specific resistance of the molded body may be 1.0 ⁇ 14 ⁇ ⁇ cm or more, or 2.0 ⁇ 14 ⁇ ⁇ cm or more, and / or 20 ⁇ 10 15 ⁇ ⁇ cm or less, 15 ⁇ 10 15 ⁇ . It may be cm or less, or 10 ⁇ 10 15 ⁇ ⁇ cm or less.
- the composite particles of the present disclosure can be used as an insulating heat conductive sheet, for example, by forming into a sheet shape.
- This insulating heat conductive sheet can be used as a heat dissipation sheet for electronic members such as semiconductors, and can also be used as a printed circuit board. Forming into a sheet-like shape can be performed, for example, by press molding.
- the composite particles according to Examples 1 and 2 and the resin composition according to Comparative Example 1 were prepared and evaluated for physical properties. Furthermore, the moldability and the physical properties of the molded body were evaluated for these composite particles and the resin composition.
- Thermal conductivity (thermal diffusivity) x (specific heat) x (specific gravity)
- the thermal diffusivity in the thickness direction was determined by a laser flash method for a sample processed to a size of width 10 mm ⁇ 10 mm ⁇ thickness 0.1 to 1 mm.
- a xenon flash analyzer (LFA467 HyperFlash manufactured by NETZSCH) was used as the measuring device.
- the specific gravity was determined from the volume and weight of the sample.
- the specific heat was determined using a differential scanning calorimeter (DSC8000 manufactured by PerkinElmer).
- the particle size was measured by dispersing the inorganic filler in water.
- a particle size distribution meter (Mt3000 manufactured by Microtrac Bell) was used.
- Example 1 Composite particles according to Example 1 were produced as follows. Further, the physical properties of the obtained composite particles were measured. Furthermore, a molded body was produced using the obtained composite particles.
- ⁇ -Caprolactam as a monomer of the thermoplastic resin was prepared, and ⁇ -caprolactam sodium salt as an anionic polymerization catalyst was added so as to be 1.7 mol% with respect to ⁇ -caprolactam to prepare a mixed solution. .
- dicyclohexylcarbodiimide as a reaction accelerator was added so as to be 1.7 mol% and completely dissolved to obtain a reaction solution.
- hexagonal boron nitride (organic modified boron nitride (average particle diameter of primary particles: 41.2 ⁇ m) made by ITEC Co., Ltd.) was used as the inorganic filler, and the weight ratio of the inorganic filler to the reaction solution was 4.8: 1.0. And the mixture was stirred to obtain a mixture.
- the obtained composite particles were heated to extract unreacted ⁇ -caprolactam and measured by gas chromatography. The reaction rate was 98%.
- the cross section of the particles was observed with a SEM (JEOL JCM-6000) (magnification 1000 times).
- Results are shown in FIG. As seen in FIG. 7, it was confirmed that the composite particles were formed by impregnating polyamide 6 with impregnated hexagonal boron nitride particles in the composite particles. Therefore, it can be seen that the above-described manufacturing method according to Example 1 can yield composite particles having irregular shapes formed by agglomerating primary particles of inorganic filler, and the primary particles are coated with a thermoplastic resin. It was.
- the obtained insulating thermal conductive sheet had a thermal conductivity of 6.8 W / m ⁇ K and a specific resistance of 9.0 ⁇ 10 15 ⁇ ⁇ cm.
- Example 2 Composite particles were obtained in the same manner as in Example 1 except that silicon particles coated with an insulating layer were used as the inorganic filler, and the mixture was stirred so that the weight ratio of the inorganic filler to the reaction solution was 4.2: 1.0. Manufactured. In the composite particles, the silicon particles as the inorganic filler accounted for 65% by volume, and the thermoplastic resin accounted for 35% by volume.
- the obtained composite particles were heated to extract unreacted ⁇ -caprolactam and measured by gas chromatography. The reaction rate was 98%.
- Example 2 When the particle cross section was observed by SEM (magnification 1000 times with the same apparatus as in Example 1), it was confirmed that the aggregated silicon particles were impregnated with polyamide 6 to form composite particles. Therefore, the above manufacturing method according to Example 2 can provide an amorphous composite particle in which primary particles of the inorganic filler are aggregated, and the composite particle in which the primary particle is coated with a thermoplastic resin. all right.
- An insulating thermally conductive sheet having a thickness of 1 mm was obtained by press molding the composite particles.
- the obtained insulating thermal conductive sheet had a thermal conductivity of 2.6 W / m ⁇ K and a specific resistance of 3.1 ⁇ 10 14 ⁇ ⁇ cm.
- the obtained resin composition could not take the form of composite particles.
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Abstract
Description
〈態様1〉
無機フィラーの一次粒子が凝集して成る不定形の複合粒子であって前記一次粒子が熱可塑性樹脂で被覆されている複合粒子を製造するための、下記を含む、方法:
(1)前記無機フィラーと前記熱可塑性樹脂のモノマー及び/又はオリゴマーとを含む混合物を提供すること、ここで、前記モノマー及び/又はオリゴマーが液状であり、かつ前記無機フィラーの一次粒子を覆っている、並びに
(2)前記モノマー及び/又はオリゴマーを重合反応させて、前記無機フィラーの一次粒子が凝集した不定形の複合粒子であって前記一次粒子が熱可塑性樹脂で被覆されている複合粒子を形成すること。
〈態様2〉
前記熱可塑性樹脂のモノマー及び/又はオリゴマーが、開環重合可能な環状化合物である、態様1に記載の製造方法。
〈態様3〉
開環重合可能な環状化合物と無機フィラーとの混合物の状態で、前記環状化合物を開環重合することによって、前記熱可塑性樹脂を生成することを特徴とする、態様2に記載の複合粒子の製造方法。
〈態様4〉
前記熱可塑性樹脂が、ポリアミドである、態様1~3のいずれか一項に記載の複合粒子の製造方法。
〈態様5〉
前記環状化合物が、ε-カプロラクタム及び/又はω-ラウロラクタムである、態様2~4のいずれか一項に記載の製造方法。
〈態様6〉
前記無機フィラーが、窒化ホウ素粒子、又は絶縁層の被膜を設けたシリコン粒子である、態様1~5のいずれか一項に記載の複合粒子。
〈態様7〉
無機フィラーの一次粒子が凝集して成る不定形の複合粒子であって、前記一次粒子が熱可塑性樹脂で被覆されている、複合粒子。
〈態様8〉
前記複合粒子において、前記無機フィラーが51.0~99.9体積%を占めており、かつ前記熱可塑性樹脂が49.0~0.1体積%を占めている、態様7に記載の複合粒子。
〈態様9〉
前記複合粒子の平均粒子径が、1μm~1000μmである、態様7又は8に記載の複合粒子。
〈態様10〉
前記熱可塑性樹脂が、ポリアミドである、態様7~9のいずれか一項に記載の複合粒子。
〈態様11〉
前記ポリアミドが、ポリアミド6、ポリアミド12又はポリアミド612である、態様10に記載の複合粒子。
〈態様12〉
前記無機フィラーが、窒化ホウ素粒子、又は絶縁層の被膜を設けたシリコン粒子である、態様7~11のいずれか一項に記載の複合粒子。
〈態様13〉
前記熱可塑性樹脂は、前記無機フィラーと開環重合可能な環状化合物との混合物の状態で、環状化合物を開環重合することにより生成された熱可塑性樹脂である、態様7~12のいずれか一項に記載の複合粒子。
〈態様14〉
態様7~13のいずれか一項に記載の複合粒子を押圧することを含む、成形体の製造方法。
〈態様15〉
態様7~13のいずれか一項に記載の複合粒子を押圧することによって得られる、成形体。
〈態様16〉
シート状である、態様15に記載の成形体。
本開示に係る方法は、無機フィラーの一次粒子が凝集して成る不定形の複合粒子であって一次粒子が熱可塑性樹脂で被覆されている複合粒子を製造するための方法であり、この方法が、下記の工程を含んでいる:
(1)無機フィラーと熱可塑性樹脂のモノマー及び/又はオリゴマーとを含む混合物を提供する、提供工程、及び
(2)モノマー及び/又はオリゴマーを重合反応させて、無機フィラーの一次粒子が凝集した不定形の複合粒子であって一次粒子が熱可塑性樹脂で被覆されている複合粒子を形成する、反応工程
ここで、上記の提供工程において、モノマー及び/又はオリゴマーが液状であり、かつ無機フィラーの一次粒子を覆っている。
本開示に係る製造方法によれば、無機フィラーの一次粒子が凝集して成る不定形の複合粒子であって一次粒子が熱可塑性樹脂で被覆されている複合粒子を製造することができる。
本開示に係る製造方法の提供工程では、無機フィラーと熱可塑性樹脂のモノマー及び/又はオリゴマーとを含む混合物を提供する。
無機フィラーとしては、例えば、窒化アルミ、シリカ、アルミナ、酸化マグネシウム、窒化ケイ素、窒化ホウ素若しくは酸化亜鉛の粒子、又は絶縁層の被膜を設けたシリコン粒子を用いることができる。なかでも、好ましい無機フィラーは、窒化ホウ素の粒子又は絶縁層の被膜を設けたシリコン粒子である。窒化ホウ素としては、六方晶及び立方晶のいずれも用いることができる。優れた熱伝導性を得る観点から、六方晶窒化ホウ素が好ましい。
熱可塑性樹脂として、例えば、ポリアミド、ポリエステル、ポリカーボネート、ポリエーテル、ポリスルフィド、及びポリアリーレンエーテルケトン(PAEK)を挙げることができ、好ましくはポリアミドを用いる。ポリアミドとして特に好ましいものは、ポリアミド6、ポリアミド12、及びポリアミド612である。ポリアリーレンエーテルケトン(PAEK)としては、例えば、ポリエーテルケトン(PEK)、ポリエーテルエーテルケトン(PEEK)、ポリエーテルケトンケトン(PEKK)、及びポリエーテルエーテルケトンケトン(PEEKK)を挙げることができる。
熱可塑性樹脂のモノマー及び/又はオリゴマーは、重合反応によって熱可塑性樹脂を生ずるものである。熱可塑性樹脂のモノマー及び/又はオリゴマーは、例えば、重合反応によってポリアミド、ポリエステル、ポリカーボネート、ポリエーテル、ポリスルフィド、又はポリアリーレンエーテルケトン(PAEK)を生ずるものであってよい。ポリアリーレンエーテルケトン(PAEK)としては、例えば、ポリエーテルケトン(PEK)、ポリエーテルエーテルケトン(PEEK)、ポリエーテルケトンケトン(PEKK)、及びポリエーテルエーテルケトンケトン(PEEKK)を挙げることができる。
本開示に係る1つの実施態様では、熱可塑性樹脂が、開環重合反応より得られたポリマーからなる。すなわち、熱可塑性樹脂の原料として、開環重合反応により高分子化することのできる環状化合物を用いる。換言すると、本開示に係る1つの実施態様では、熱可塑性樹脂のモノマー及び/又はオリゴマーが、開環重合可能な環状化合物である。
無機フィラーと熱可塑性樹脂のモノマー及び/又はオリゴマーとを含む混合物は、例えば、熱可塑性樹脂のモノマー及び/又はオリゴマーに無機フィラーを加え、その後に混合及び/又は混錬を行うことによって、提供することができる。
提供工程においては、モノマー及び/又はオリゴマーが液状であり、かつ無機フィラーの一次粒子を覆っている。
本開示に係る1つの実施態様では、提供工程において提供される混合物が、触媒を含んでいてよい。
本開示に係る複合粒子の製造方法の1つの実施態様では、提供工程において提供される混合物が、添加剤を含有していてもよい。熱可塑性樹脂のモノマー及び/又はオリゴマーとして環状化合物を用いる場合には、環状化合物の開環重合性を阻害しない範囲で、添加剤を添加することが好ましい。
本開示に係る製造方法の反応工程では、モノマー及び/又はオリゴマーを重合反応させて、無機フィラーの一次粒子が凝集した不定形の複合粒子であって一次粒子が熱可塑性樹脂で被覆されている複合粒子を形成する。
モノマー及び/又はオリゴマーの重合反応は、例えば、提供工程において提供された混合物を、混合攪拌しつつ、不活性雰囲気下で加熱処理することによって、行うことができる。
本開示は、無機フィラーの一次粒子が凝集して成る不定形の複合粒子であって、一次粒子が熱可塑性樹脂で被覆されている複合粒子にも関する。
本開示に係る複合粒子は、不定形の複合粒子であり、その形状は特に限定されない。複合粒子の形状は、例えば、球状、鱗片状、又は繊維状であってよい。なお、本願に関して、「不定形」は、複合粒子が型などによって成形されていないことを意味している。
無機フィラーとしては、例えば、窒化アルミ、シリカ、アルミナ、酸化マグネシウム、窒化ケイ素、窒化ホウ素若しくは酸化亜鉛の粒子、又は絶縁層の被膜を設けたシリコン粒子を用いることができる。なかでも、好ましい無機フィラーは、窒化ホウ素の粒子又は絶縁層の被膜を設けたシリコン粒子である。窒化ホウ素としては、六方晶及び立方晶のいずれも用いることができる。優れた熱伝導性を得る観点から、六方晶窒化ホウ素が好ましい。
熱可塑性樹脂として、例えば、ポリアミド、ポリエステル、ポリカーボネート、ポリエーテル、ポリスルフィド、及びポリアリーレンエーテルケトン(PAEK)を挙げることができ、好ましくはポリアミドを用いる。ポリアミドとして特に好ましいものは、ポリアミド6、ポリアミド12、及びポリアミド612である。ポリアリーレンエーテルケトン(PAEK)としては、例えば、ポリエーテルケトン(PEK)、ポリエーテルエーテルケトン(PEEK)、ポリエーテルケトンケトン(PEKK)、及びポリエーテルエーテルケトンケトン(PEEKK)を挙げることができる。
本開示は、本開示に係る複合粒子を押圧することを含む、成形体の製造方法にも関する。
本開示は、本開示に係る複合粒子を押圧することによって得られる成形体を含む。
熱伝導率は、下記式に従い、試料の厚さ方向の熱拡散率、比熱及び比重を乗じて算出した。
(熱伝導率)=(熱拡散率)×(比熱)×(比重)
幅10mm×10mm×厚み0.1~1mmの大きさに加工した試料において、試料の一方の面(10mm×10mmの面)とその反対側の面にそれぞれ銀ペーストで電極を形成し、印加電圧1000Vにおける2電極間の抵抗値を測定した。測定装置には、抵抗率測定装置(株式会社西山製作所製)を用いた。以下の式により、比抵抗を算出した。
(比抵抗)=(抵抗値)×(電極面積)/(試料の厚さ)
複合粒子を水中に分散させて複合粒子の平均粒子径を測定した。測定装置には、粒度分布計(マイクロトラック・ベル製 Mt3000)を用いた。
溶剤中で加熱抽出し、ガスクロマトグラフィーを用いて抽出液中の環状化合物濃度を測定し、反応率を算出した。溶剤は、環状化合物を溶解し、かつ開環重合により得られる樹脂が溶解しないものであれば良い。加熱温度は、環状化合物が十分に抽出される温度であれば良い。環状化合物としてε-カプロラクタムを使用した場合は、溶剤として水を使用し、加圧下105℃にて抽出を行った。
無機フィラーを水中に分散させて粒子径を測定した。測定装置には、粒度分布計(マイクロトラック・ベル製 Mt3000)を用いた。
下記のようにして、実施例1に係る複合粒子を作製した。また、得られた複合粒子の物性を測定した。さらに、得られた複合粒子を用いて、成形体を作製した。
熱可塑性樹脂のモノマーとしてのε-カプロラクタムを準備し、かつアニオン重合触媒としてのε-カプロラクタムナトリウム塩を、ε-カプロラクタムに対して1.7mol%となるように添加して、混合溶液を作製した。この混合溶液に、反応促進剤としてのジシクロヘキシルカルボジイミドを1.7mol%となるように添加し、かつ完全に溶解させて、反応液を得た。続いて、無機フィラーとして六方晶窒化ホウ素(株式会社アイテック製有機修飾窒化ホウ素(一次粒子の平均粒子径41.2μm))を用い、無機フィラーと反応液の重量比が4.8:1.0となるように混合し、かつ撹拌することによって、混合物を得た。
得られた複合粒子の平均粒子径は、94.5μmであった。
次に、得られた複合粒子をプレス成型することによって、成形体として、厚さ1mmの絶縁熱伝導性シートを得た。
無機フィラーとして絶縁層で被膜したシリコン粒子を用い、かつ無機フィラーと反応液の重量比が4.2:1.0となるように混合撹拌したこと以外は実施例1と同様にして、複合粒子を製造した。複合粒子において、無機フィラーとしての上記シリコン粒子は65体積%を占めており、熱可塑性樹脂は35体積%を占めていた。
熱可塑性樹脂としてのパウダー状のポリアミド6樹脂27体積%と、無機フィラーとしての六方晶窒化ホウ素73体積%とを、250℃に加熱し、かつラボプラストミルにおいて溶融混合させた。
11 無機フィラーの一次粒子
13 液状の熱可塑性樹脂のモノマー及び/又はオリゴマー
14、24、44、54 熱可塑性樹脂
15 混合物
20、40、50 熱可塑性樹脂組成物
21、41、51 無機フィラー
6 成形体
A 押圧処理
M 混合処理
P 重合反応
Claims (16)
- 無機フィラーの一次粒子が凝集して成る不定形の複合粒子であって前記一次粒子が熱可塑性樹脂で被覆されている複合粒子を製造するための、下記を含む、方法:
(1)前記無機フィラーと前記熱可塑性樹脂のモノマー及び/又はオリゴマーとを含む混合物を提供すること、ここで、前記モノマー及び/又はオリゴマーが液状であり、かつ前記無機フィラーの一次粒子を覆っている、並びに
(2)前記モノマー及び/又はオリゴマーを重合反応させて、前記無機フィラーの一次粒子が凝集した不定形の複合粒子であって前記一次粒子が熱可塑性樹脂で被覆されている複合粒子を形成すること。 - 前記熱可塑性樹脂のモノマー及び/又はオリゴマーが、開環重合可能な環状化合物である、請求項1に記載の製造方法。
- 開環重合可能な環状化合物と無機フィラーとの混合物の状態で、前記環状化合物を開環重合することによって、前記熱可塑性樹脂を生成することを特徴とする、請求項2に記載の複合粒子の製造方法。
- 前記熱可塑性樹脂が、ポリアミドである、請求項1~3のいずれか一項に記載の複合粒子の製造方法。
- 前記環状化合物が、ε-カプロラクタム及び/又はω-ラウロラクタムである、請求項2~4のいずれか一項に記載の製造方法。
- 前記無機フィラーが、窒化ホウ素粒子、又は絶縁層の被膜を設けたシリコン粒子である、請求項1~5のいずれか一項に記載の製造方法。
- 無機フィラーの一次粒子が凝集して成る不定形の複合粒子であって、前記一次粒子が熱可塑性樹脂で被覆されている、複合粒子。
- 前記複合粒子において、前記無機フィラーが51.0~99.9体積%を占めており、かつ前記熱可塑性樹脂が49.0~0.1体積%を占めている、請求項7に記載の複合粒子。
- 前記複合粒子の平均粒子径が、1μm~1000μmである、請求項7又は8に記載の複合粒子。
- 前記熱可塑性樹脂が、ポリアミドである、請求項7~9のいずれか一項に記載の複合粒子。
- 前記ポリアミドが、ポリアミド6、ポリアミド12又はポリアミド612である、請求項10に記載の複合粒子。
- 前記無機フィラーが、窒化ホウ素粒子、又は絶縁層の被膜を設けたシリコン粒子である、請求項7~11のいずれか一項に記載の複合粒子。
- 前記熱可塑性樹脂は、前記無機フィラーと開環重合可能な環状化合物との混合物の状態で、環状化合物を開環重合することにより生成された熱可塑性樹脂である、請求項7~12のいずれか一項に記載の複合粒子。
- 請求項7~13のいずれか一項に記載の複合粒子を押圧することを含む、成形体の製造方法。
- 請求項7~13のいずれか一項に記載の複合粒子を押圧することによって得られる、成形体。
- シート状である、請求項15に記載の成形体。
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