WO2019233236A1 - 图像处理模块、摄像头和电子设备 - Google Patents

图像处理模块、摄像头和电子设备 Download PDF

Info

Publication number
WO2019233236A1
WO2019233236A1 PCT/CN2019/086044 CN2019086044W WO2019233236A1 WO 2019233236 A1 WO2019233236 A1 WO 2019233236A1 CN 2019086044 W CN2019086044 W CN 2019086044W WO 2019233236 A1 WO2019233236 A1 WO 2019233236A1
Authority
WO
WIPO (PCT)
Prior art keywords
image
projection
imaging
display
light
Prior art date
Application number
PCT/CN2019/086044
Other languages
English (en)
French (fr)
Inventor
张磊
孙景阳
杨乐
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201810564140.XA external-priority patent/CN110557529A/zh
Priority claimed from CN201820858009.XU external-priority patent/CN208386728U/zh
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2019233236A1 publication Critical patent/WO2019233236A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets

Definitions

  • the present application relates to the technical field of mobile terminals, and in particular, to an image processing module, a camera, and an electronic device.
  • mobile terminals are equipped with a front camera.
  • the front camera is generally set under the display of the mobile terminal, and as people's demand for screen size increases, mobile terminals are not increased.
  • the size of the screen, the proportion of the screen is getting higher and higher, and has now gradually entered the era of full screen of mobile terminals.
  • the camera only includes an imaging component for capturing images, and for a mobile terminal that uses a full-screen display, the camera is blocked by the full-screen and image acquisition cannot be performed. If a transparent area corresponding to the camera is set on the full-screen , The transparent area cannot be displayed normally. Therefore, the mobile terminal adopting the full screen solution cannot coexist with its full screen display function and image acquisition function.
  • This application is intended to solve at least one of the technical problems in the related technology.
  • this application proposes an image processing module to realize that by providing a projection component and an imaging component in the image processing module, an electronic device adopting a full-screen solution is implemented.
  • the display and image acquisition functions of the corresponding area of the image processing module coexist. , Conducive to the development of full screen.
  • This application proposes a camera.
  • This application proposes an electronic device.
  • An embodiment of one aspect of the present application provides an image processing module, including:
  • Substrate, projection module and imaging module are Substrate, projection module and imaging module;
  • the projection component and the imaging component are both disposed on a surface of the substrate;
  • the projection component is used for projection display, and includes a color film layer, a metal wiring layer, a light emitting element, and a driving element which are sequentially stacked and arranged;
  • the imaging component is used for collecting imaging images, and includes a color film layer, a metal wiring layer, and a photosensitive element that are sequentially stacked and arranged;
  • the metal wiring layer and the color film layer shared by the imaging component and the projection component.
  • An embodiment of the second aspect of the present application provides a camera, including: the image processing module according to the embodiment of the first aspect, and further including a lens group corresponding to the imaging component.
  • An embodiment of the third aspect of the present application provides an electronic device.
  • the electronic device includes a display screen, the camera according to the embodiment of the second aspect, and a processing unit electrically connected to the display screen and the camera, respectively.
  • the display screen has a light-transmitting area and a non-light-transmitting area, and is configured to display through the non-light-transmitting area under the control of the processing unit;
  • the camera is disposed below the display screen and corresponds to the light-transmitting area, and is configured to use the projection component to project to the display screen under the control of the processing unit so as to project the light-transmitting area on the display screen. Displaying; and using an imaging component to acquire an imaging image through a light-transmitting area of the display screen under the control of the processing unit;
  • the processing unit is configured to control the display screen to perform display, and to control the camera to project and display in a display state, and acquire an imaging image in an imaging state.
  • the image processing module includes a substrate, a projection component, and an imaging component.
  • the projection component is used for projection display, and includes a color film layer, a metal wiring layer, a light emitting element, and a driving element that are sequentially stacked.
  • the imaging component is used to collect an imaging image. , Including a color film layer, a metal wiring layer, and a photosensitive element that are sequentially stacked and arranged, in which the imaging component and the projection component share the metal wiring layer and the color film layer, and an electronic device adopting a full-screen solution is implemented. Its image processing module The coexistence of the display and image acquisition functions of the corresponding area is conducive to the development of the full screen.
  • FIG. 1 is a schematic structural diagram of an image processing module according to an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of another image processing module according to an embodiment of the present application.
  • FIG. 3 is a schematic diagram of a mechanism of a camera provided in an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of another electronic device according to an embodiment of the present application.
  • FIG. 6 is a schematic diagram of a data flow direction in an image buffer area according to an embodiment of the present application.
  • FIG. 7 is one of the schematic diagrams of sub-image division provided by an embodiment of the present application.
  • FIG. 8 is a second schematic diagram of sub-image division provided by an embodiment of the present application.
  • Full-screen technology is increasingly applied to electronic devices.
  • the full-screen solution is:
  • Solution 1 Set the transparent area corresponding to the camera on the full screen. This solution prevents the camera from displaying the area on the full screen.
  • Solution 2 Make the full screen into a special shape and leave the corresponding position of the camera. This solution has poor aesthetics, the screen utilization around the camera is low, the screen size is wasted, and the full screen does not reflect the high occupation ratio and high display area. the goal of.
  • this application proposes an image processing module, so as to realize that by setting a projection component and an imaging component in the image processing module, an electronic device adopting a full-screen solution is implemented.
  • the image processing module corresponding to the area display and image
  • the acquisition functions coexist, and the appearance is high, which is conducive to the development of the full screen.
  • FIG. 1 is a schematic structural diagram of an image processing module according to an embodiment of the present application.
  • the image processing module 100 includes a substrate 10, a projection module 20 and an imaging module 30.
  • the projection module 20 and the imaging module 30 are both disposed on the surface of the substrate 10.
  • the projection module 20 includes a color film layer 201, a metal wiring layer 202, a light emitting element 203, and a driving element 204 that are sequentially stacked and arranged for projection display.
  • the driving element 204 is disposed on the surface of the substrate 10 for driving the light emitting element 203.
  • the metal wiring layer 202 is disposed on the surface of the driving element 204 and is electrically connected to the driving element 204 and the light emitting element 203.
  • the light emitting element 203 is disposed on the metal substrate.
  • the surface of the line layer 202 is used to emit light under the driving of the driving element 204, and the color filter layer is disposed on the surface of the light emitting element 203 for filtering.
  • driving element 204 there may be multiple driving elements 204, and two are schematically shown in the figure, but in reality, it is not limited to two, and more or fewer driving elements 204 may be used.
  • the driving element 204 may be 7 Each.
  • the imaging module 30 includes a color film layer 201, a metal wiring layer 202, and a photosensitive element 301, which are sequentially stacked and arranged, for collecting imaging images.
  • the photosensitive element 301 is disposed on the surface of the substrate 10, and is configured to detect light obtained by filtering the color filter layer 201.
  • the metal wiring layer 202 is also electrically connected to the photosensitive element 301.
  • the metal wiring layer 202 includes multiple signal lines, and the hollow area formed by the intersection of multiple signal lines corresponds to the position of the photosensitive element 301, so that the light obtained by the color filter layer 201 can pass through the The hollow area reaches the photosensitive element 301.
  • the imaging component 30 and the projection component 20 share the metal wiring layer 202 and the color film layer 201, which reduces the volume of the image processing module and saves manufacturing costs.
  • the electrical connection between the metal wiring layer 202 and the photosensitive element 301, the driving element 204, and the light-emitting element 203 in the figure is only a schematic connection. Those skilled in the art can arrange and arbitrarily arrange and electrically connect the elements according to actual needs. Sexual connection.
  • the projection component is used for projection display, and includes a color film layer, a metal wiring layer, a light emitting element, and a driving element that are sequentially stacked and arranged, and the imaging component is used to collect the imaging image, including the sequentially stacked and arranged The color film layer, metal wiring layer, and photosensitive element of the cloth.
  • the imaging component and the projection component share the metal wiring layer and the color film layer, which realizes the display of the corresponding area of the image processing module of the electronic device using the full-screen display scheme. Coexisting with the image acquisition function is conducive to the development of full screen.
  • FIG. 2 is a schematic structural diagram of another image processing module provided by the embodiment of the present application, based on the previous implementation.
  • the light-emitting element 203 may further include a metal anode 2031, an organic polymer light-emitting layer 2032, and a transparent cathode 2033.
  • the metal anode 2031 is provided on the surface of the metal wiring layer 202 and is used to output holes that are combined with electrons when a voltage is applied to the light-emitting element 203.
  • the organic polymer light emitting layer 2032 is disposed on the surface of the metal anode 2031 and is used for emitting light.
  • the transparent cathode 2033 is provided on the surface of the organic polymer light-emitting layer 2032 and is used to output electrons when a voltage is applied to the light-emitting element 203.
  • the projection component 20 is started for projection display.
  • the projection pixel point is based on The image displayed by the projection is determined.
  • the image processing module 100 includes a projection component as an example for description.
  • the driving element 204 Under the driving signal, a voltage is applied to the light-emitting element 203.
  • the light-emitting element 203 may be an organic light-emitting diode (OLED).
  • the transparent cathode 2033 outputs electrons to the organic polymer light-emitting layer 2032
  • the metal anode 2031 outputs holes to the organic polymer light-emitting layer 2032
  • the electrons reach the organic polymer light-emitting layer 2032, they emit light with the organic polymer
  • the holes of layer 2032 are combined, and the electrons and holes are negatively and positively charged, respectively. They attract each other and excite organic high.
  • the organic material in the sub-light emitting layer 2032 emits light, thereby realizing the light emission of the light emitting element 203, and further, the light is filtered through the color film layer 201, and three primary colors of red, green, and blue (Red, Green, Blue) can be generated. Setting the color of the filter of the color filter layer 201 realizes different filtering requirements, thereby realizing the display of images to be projected and displayed.
  • the imaging component 30 is started to acquire the imaging image.
  • the imaging component 30 corresponds to an imaging pixel point.
  • the image processing module 100 includes an imaging component 30. Specifically, as shown in FIG. 2, light is filtered through the color filter layer 201.
  • the photosensitive element 301 is configured to detect the light obtained by filtering through the color filter layer 201, so that the photosensitive element 301 converts the detected light from optical information into a digital signal, so as to determine the R, G, and The B value, that is, the imaging image corresponding to the pixel point is determined, and then the corresponding imaging image is generated according to the imaging pixel points corresponding to the imaging components 30.
  • a plurality of imaging components 30 and a plurality of projection components 20 are alternately arranged on the surface of the substrate 10, and this arrangement can make the color film layer 201 use the same raw materials for the same color Manufacturing reduces the manufacturing process of the color film layer 201 and reduces the manufacturing cost.
  • a plurality of imaging components 30 and a plurality of projection components 20 are arranged on the surface of the substrate 10 in a partitioned manner. This arrangement is convenient for simple manufacturing processes.
  • the projection component is used for projection display, and includes a color film layer, a metal wiring layer, a light emitting element, and a driving element that are sequentially stacked and arranged, and the imaging component is used to collect the imaging image, including the sequentially stacked and arranged The color film layer, metal wiring layer, and photosensitive element of the cloth, wherein the imaging component and the projection component share the metal wiring layer and the color film layer.
  • the projection component is set for projection display, and the imaging component is set for image The acquisition and realization of the electronic device using the full-screen solution, the image processing module corresponding area display and image acquisition functions coexist, which is conducive to the development of the full-screen.
  • FIG. 3 is a schematic diagram of a camera provided by an embodiment of the present application.
  • the camera 1000 includes the image processing described in the foregoing embodiment.
  • an embodiment of the present application further proposes an electronic device including a mobile terminal and a desktop terminal, such as a mobile phone, an iPad, a palmtop computer, a desktop computer, and the like.
  • FIG. 4 is provided in the embodiment of the present application. Schematic structure of an electronic device.
  • the electronic device includes a processing unit 1010, a camera 1000, and a display screen 1020 covering the camera 1000.
  • the display screen 1020 is electrically connected to the processing unit 1010.
  • the display screen has a light-transmitting area 1021 and a non-light-transmitting area 1022, and is used for displaying through the non-light-transmitting area 1022 under the control of the processing unit 1010.
  • the shape of the light transmitting region 1021 may be rectangular, circular, or other shapes, which is not limited in this embodiment.
  • those skilled in the art can flexibly set the position of the light-transmitting region 1021 in the display screen 1020 according to the requirements of the product, which is not limited in this embodiment.
  • the camera 1000 is disposed below the corresponding light-transmitting area 1021 and includes a projection component 20 and an imaging component 30 electrically connected to the processing unit 1010, respectively.
  • the camera 1000 is configured to use the projection component 20 to project onto the display screen 1020 under the control of the processing unit 1010.
  • the display area 1021 of the display screen 1020 performs display, and the imaging unit 30 uses the imaging component 30 to collect the imaging image through the light transmission area 1021 of the display screen 1020 under the control of the processing unit 1010.
  • the processing unit 1010 is configured to control the display screen 1020 to perform display, and is used to control the camera 1000 to perform projection display in a display state and acquire an imaging image in an imaging state.
  • the display screen is electrically connected to the processing unit, and has a light-transmitting area and a non-light-transmitting area.
  • the camera is disposed below the corresponding light-transmitting area, and includes a projection component and an imaging device that are electrically connected to the processing unit.
  • a component for projecting a projection component to a display screen under the control of a processing unit to display in a light-transmitting area of the display screen, and using an imaging component to acquire an imaging image through the light-transmitting area of the display screen under the control of the processing unit, and process A unit for controlling a display screen for displaying, and for controlling a camera to project and display in a display state, and acquire an imaging image in an imaging state.
  • the processing unit controls the projection component to project to the display screen, so that the light-transmitting area of the display screen can also be displayed correspondingly, and a full-screen display is realized.
  • the imaging component is acquired by the processor controlling the imaging component to realize the image acquisition function, so that the full-screen display and image acquisition functions in the electronic device can coexist.
  • FIG. 5 is a schematic structural diagram of another electronic device according to an embodiment of the present application.
  • the processing unit 1010 may include: an image buffer 1011, a processor 1012, a first communication interface 1013 electrically connected to the camera 1000, and a second communication interface 1014 electrically connected to the display screen 1020.
  • the image buffer 1011 is configured to buffer the display sub-image and the projection sub-image into which the image to be displayed is divided.
  • the processor 1012 is electrically connected to the image buffer 1011, and is configured to read the image buffer 1011 to obtain a display sub-image and a projection sub-image, and send the projection sub-image to the first communication interface 1013 and the display to the second communication interface 1014. Child image.
  • the first communication interface 1013 is electrically connected to the processor 1012 and is configured to send the projection sub-image to the camera 1000.
  • the second communication interface 1014 is electrically connected to the processor 1012 and is configured to send the display sub-image to the display screen 1020.
  • the first communication interface 1013 and the second communication interface 1014 are a display serial interface DSI (Display Serial Interface) transmitted synchronously.
  • DSI Display Serial Interface
  • the display serial interface DSI transmitted through synchronization is realized, so that the projection sub-image transmitted to the camera 1000 through the first communication interface 1013 and the display sub-image transmitted to the display screen 1020 through the second communication interface 1014 can be Send synchronously, so that the projected sub-image and the displayed sub-image displayed on the display screen 1020 are displayed synchronously.
  • the image buffer 1011 may include a first buffer area 10111 and a second buffer area 10112.
  • the first buffer area 10111 is used to store the projection sub-image
  • the second buffer area 10112 is used to store the display. Child image.
  • FIG. 6 is a schematic diagram of data flow in an image buffer area provided by an embodiment of the present application. As shown in FIG. 6, by dividing different buffer areas, the first buffer area 10111 stores a correspondence to the non-transparent area 1022 of the display screen 1020 The image information corresponding to the image pixel points of the display sub-image is stored in the second buffer area 10112.
  • the image information corresponding to the image pixel points corresponding to the light-transmitting area 1021 of the display screen 1020 is stored in the second buffer area 10112, thereby establishing storage.
  • FIG. 7 is one of the schematic diagrams of the sub-image division provided by the embodiment of the present application, as shown in FIG. 7.
  • the image corresponding to the image pixel point corresponding to the transparent region 1021 in the display screen 1020 is a square, and the image to be displayed 40 is based on the image shape corresponding to the image pixel point of the transparent region 1021 and the non-transparent region 1022 in the display screen 1020.
  • the division is performed to obtain a projection sub-image 410 and a display sub-image 420 on the right in FIG. 7.
  • FIG. 8 is the second schematic diagram of the sub-image division provided by the embodiment of the present application. As shown in FIG. 8, the image corresponding to the image pixel point of the transparent area 1021 in the display screen 1020 is circular.
  • the to-be-displayed image 40 is divided according to the image shape corresponding to the image pixel points of the transparent region 1021 and the non-transparent region 1022 in the display screen 1020 to obtain the projection sub-image 430 and the display sub-image 440 on the right in FIG. 8.
  • FIG. 7 and FIG. 8 show only two forms of dividing the display sub-image and the projection sub-image according to the images corresponding to the image pixels of the transparent region 1021 and the non-transparent region 1022 of the display screen 1020.
  • those skilled in the art may divide the images to be displayed according to the image shape of the image pixel points corresponding to the light-transmitting area 1021 and the non-light-transmitting area 1022 in the display screen 1020.
  • the division principle is similar, and this embodiment is not one by one. List.
  • the processing unit controls the projection component to project onto a display screen, so that the light-transmitting area of the display screen can also be displayed correspondingly.
  • the full-screen display of the electronic device is realized.
  • the imaging component is captured by the processor to control the imaging component, and the image acquisition function is realized, so that the full-screen display and image acquisition function in the electronic device can coexist.
  • the synchronous transmission of the display serial interface DSI enables the projection sub-images sent to the camera through the first communication interface and the display sub-images sent to the display screen through the second communication interface to be sent simultaneously, thereby The projection sub-image and the display sub-image displayed on the display screen in the display state are displayed synchronously.
  • first and second are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "plurality” is at least two, for example, two, three, etc., unless it is specifically and specifically defined otherwise.
  • any process or method description in a flowchart or otherwise described herein can be understood as representing a module, fragment, or portion of code that includes one or more executable instructions for implementing steps of a custom logic function or process
  • the scope of the preferred embodiments of the present application includes additional implementations, in which the functions may be performed out of the order shown or discussed, including performing functions in a substantially simultaneous manner or in the reverse order according to the functions involved, which should It is understood by those skilled in the art to which the embodiments of the present application pertain.
  • a sequenced list of executable instructions that can be considered to implement a logical function can be embodied in any computer-readable medium,
  • the instruction execution system, device, or device such as a computer-based system, a system including a processor, or other system that can fetch and execute instructions from the instruction execution system, device, or device), or combine these instruction execution systems, devices, or devices Or equipment.
  • a "computer-readable medium” may be any device that can contain, store, communicate, propagate, or transmit a program for use by or in connection with an instruction execution system, apparatus, or device.
  • computer readable media include the following: electrical connections (electronic devices) with one or more wirings, portable computer disk cartridges (magnetic devices), random access memory (RAM), Read-only memory (ROM), erasable and editable read-only memory (EPROM or flash memory), fiber optic devices, and portable optical disk read-only memory (CDROM).
  • the computer-readable medium may even be paper or other suitable medium on which the program can be printed, because, for example, by optically scanning the paper or other medium, followed by editing, interpretation, or other suitable Processing to obtain the program electronically and then store it in computer memory.
  • each part of the application may be implemented by hardware, software, firmware, or a combination thereof.
  • multiple steps or methods may be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system.
  • Discrete logic circuits with logic gates for implementing logic functions on data signals Logic circuits, ASICs with suitable combinational logic gate circuits, programmable gate arrays (PGA), field programmable gate arrays (FPGAs), etc.
  • a person of ordinary skill in the art can understand that all or part of the steps carried by the methods in the foregoing embodiments may be implemented by a program instructing related hardware.
  • the program may be stored in a computer-readable storage medium.
  • the program is When executed, one or a combination of the steps of the method embodiment is included.
  • each functional unit in each embodiment of the present application may be integrated into one processing module, or each unit may exist separately physically, or two or more units may be integrated into one module.
  • the above integrated modules can be implemented in the form of hardware or software functional modules. If the integrated module is implemented in the form of a software functional module and sold or used as an independent product, it may also be stored in a computer-readable storage medium.
  • the aforementioned storage medium may be a read-only memory, a magnetic disk, or an optical disk.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Signal Processing (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Studio Devices (AREA)
  • Projection Apparatus (AREA)

Abstract

本申请提出一种图像处理模块、摄像头和电子设备，其中，图像处理模块包括：基板、投影组件和成像组件，其中，投影组件用于投影显示，包括顺序层叠排布的彩膜层、金属走线层、发光元件和驱动元件，成像组件用于采集成像图像，包括顺序层叠排布的彩膜层、金属走线层和感光元件，其中，成像组件与投影组件共用金属走线层和彩膜层，实现了采用全面屏方案的电子设备，其图像处理模块对应区域的显示和图像采集功能并存，有利于全面屏的发展，解决了相关技术中，包含有前置图像处理模块的电子设备，在采用全面屏进行显示时，图像处理模块对应区域的显示和图像采集功能无法并存的问题。

Description

图像处理模块、摄像头和电子设备
相关申请的交叉引用
本申请要求OPPO广东移动通信有限公司于2018年6月4日提交的、发明名称为“图像处理模块、摄像头和电子设备”的、中国专利申请号“201810564140.X”的优先权，以及2018年6月4日提交的、发明名称为“图像处理模块、摄像头和电子设备”的、中国专利申请号“201820858009.X”的优先权。
技术领域
本申请涉及移动终端技术领域，尤其涉及一种图像处理模块、摄像头和电子设备。
背景技术
随着移动终端技术的发展，移动终端中都配置有前置摄像头，前置摄像头一般设置在移动终端的显示屏下方，而随着人们对屏幕尺寸的需求越来越大，在不增加移动终端尺寸的情况下，屏幕占比越来越高，目前已逐步进入移动终端全面屏时代。
相关技术中，摄像头只包含成像组件，用于对图像进行采集，而对于使用全面屏进行显示的移动终端，摄像头被全面屏挡住，无法进行图像采集，若在全面屏上设置对应摄像头的透明区域，则透明区域无法进行正常显示，因此，使得采用全面屏方案的移动终端其全面屏显示功能和图像采集功能无法并存。
发明内容
本申请旨在至少在一定程度上解决相关技术中的技术问题之一。
为此，本申请提出一种图像处理模块，以实现通过在图像处理模块中设置投影组件和成像组件，实现了采用全面屏方案的电子设备，其图像处理模块对应区域的显示和图像采集功能并存，有利于全面屏的发展。
本申请提出一种摄像头。
本申请提出一种电子设备。
本申请一方面实施例提出了一种图像处理模块，包括：
基板、投影组件和成像组件；
其中，所述投影组件和所述成像组件均设置于所述基板表面；
所述投影组件，用于投影显示，包括顺序层叠排布的彩膜层、金属走线层、发光元件和 驱动元件；
所述成像组件，用于采集成像图像，包括顺序层叠排布的彩膜层、金属走线层和感光元件；
其中，所述成像组件与所述投影组件共用的金属走线层和彩膜层。
本申请第二方面实施例提出了一种摄像头，包括：第一方面实施例所述的图像处理模块，还包括对应所述成像组件的透镜组。
本申请第三方面实施例提出了一种电子设备，所述电子设备包括：显示屏、如第二方面实施例所述的摄像头以及分别与所述显示屏和摄像头电性连接的处理单元；
所述显示屏，具有透光区域和非透光区域，用于在所述处理单元控制下通过所述非透光区域进行显示；
所述摄像头，设置于所述显示屏下方，对应所述透光区域，用于在所述处理单元控制下利用所述投影组件向所述显示屏投影，以在所述显示屏的透光区域进行显示；以及在所述处理单元控制下利用成像组件透过所述显示屏的透光区域采集成像图像；
所述处理单元，用于控制所述显示屏进行显示，以及用于控制所述摄像头在显示状态下投影显示，在成像状态下采集成像图像。
本申请实施例提供的技术方案可以包括如下的有益效果：
图像处理模块包括：基板、投影组件和成像组件，其中，投影组件用于投影显示，包括顺序层叠排布的彩膜层、金属走线层、发光元件和驱动元件，成像组件用于采集成像图像，包括顺序层叠排布的彩膜层、金属走线层和感光元件，其中，成像组件与投影组件共用金属走线层和彩膜层，实现了采用全面屏方案的电子设备，其图像处理模块对应区域的显示和图像采集功能并存，有利于全面屏的发展。
附图说明
本申请上述的和/或附加的方面和优点从下面结合附图对实施例的描述中将变得明显和容易理解，其中：
图1为本申请实施例所提供的一种图像处理模块的结构示意图；
图2为本申请实施例所提供的另一种图像处理模块的结构示意图；
图3为本申请实施例所提供的摄像头的机构示意图；
图4为本申请实施例所提供的一种电子设备的结构示意图；
图5为本申请实施例提供的另一种电子设备的结构示意图；
图6为本申请实施例提供的图像缓存区中数据流向的示意图；
图7为本申请实施例提供的子图像划分的示意图之一；以及
图8为本申请实施例提供的子图像划分的示意图之二。
具体实施方式
下面详细描述本申请的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，旨在用于解释本申请，而不能理解为对本申请的限制。
全面屏技术越来越多的应用于电子设备上，目前对于搭载有前置摄像头的电子设备，其全面屏的解决方案为：
方案一：在全面屏上设置对应摄像头的透明区域，这种方案造成摄像头对应全面屏上的区域无法进行显示；
方案二：将全面屏做成异型，留出摄像头的对应位置，这种方案美观度差，摄像头周围的屏幕利用率较低，浪费了屏幕的尺寸，没有体现全面屏的高占比率高显示面积的目的。
为了解决上述问题，本申请提出了一种图像处理模块，以实现通过在图像处理模块中设置投影组件和成像组件，实现了采用全面屏方案的电子设备，其图像处理模块对应区域的显示和图像采集功能并存，美观度高，有利于全面屏的发展。
下面参考附图描述本申请实施例的图像处理模块、摄像头和电子设备。
图1为本申请实施例所提供的一种图像处理模块的结构示意图。
如图1所示，该图像处理模块100包括：基板10、投影组件20和成像组件30。
其中，投影组件20和成像组件30均设置于基板10表面。
投影组件20，包括顺序层叠排布的彩膜层201、金属走线层202、发光元件203和驱动元件204，用于投影显示。
具体地，驱动元件204设置于基板10表面，用于驱动发光元件203，金属走线层202设置于驱动元件204表面，与驱动元件204和发光元件203电性连接，发光元件203设置于金属走线层202表面，用于在驱动元件204驱动下发光，彩膜层设置于发光元件203表面，用于滤光。
需要说明的是，驱动元件204可为多个，图中示意性画出了两个，但实际上，不限于两个，可以采用更多或更少驱动元件204，例如驱动元件204可为7个。
成像组件30，包括顺序层叠排布的彩膜层201、金属走线层202和感光元件301，用于采集成像图像。
具体地，感光元件301，设置于基板10表面，用于对彩膜层201滤光得到的光线进行探测，金属走线层202还与感光元件301电性连接。
作为一种可能的实现方式，金属走线层202，包括多条信号线，多条信号线交叉形成的中空区域对应感光元件301所在位置，以使得彩膜层201滤光得到的光线可以通过该中空区 域到达感光元件301。
其中，成像组件30与投影组件20共用金属走线层202和彩膜层201，减小了图像处理模块的体积，同时节约了制造成本。
需要说明的是，图中金属走线层202与感光元件301，驱动元件204以及发光元件203的电性连接仅为示意性连接，本领域技术人员可根据实际需求进行任意方式的排布和电性连接。
本申请实施例的图像处理模块中，投影组件用于投影显示，包括顺序层叠排布的彩膜层、金属走线层、发光元件和驱动元件，成像组件用于采集成像图像，包括顺序层叠排布的彩膜层、金属走线层和感光元件，其中，成像组件与投影组件共用金属走线层和彩膜层，实现了采用全面屏显示方案的电子设备，其图像处理模块对应区域的显示和图像采集功能并存，有利于全面屏的发展。
基于上述实施例，本申请实施例还提出了另一种图像处理模块的结构的可能的实现方式，图2为本申请实施例所提供的另一种图像处理模块的结构示意图，基于上一实施例，如图2所示，发光元件203，还可以包括：金属阳极2031、有机高分子发光层2032和透明阴极2033。
金属阳极2031，设置于金属走线层202表面，用于在发光元件203施加电压时，输出和电子结合的空穴。
有机高分子发光层2032，设置于金属阳极2031表面，用于发光。
透明阴极2033，设置于有机高分子发光层2032表面，用于在发光元件203施加电压时，输出电子。
在一种可能的场景下，图像处理模块100需要进行投影显示时，启动投影组件20进行投影显示，投影组件20可为多个，每一个投影组件20对应一个投影像素点，投影像素点是根据投影显示的图像确定的，为了便于说明，本实施例中以图像处理模块100中包含一个投影组件为例，进行说明，具体地，如图2所示，投影组件20中，在驱动元件204的驱动信号下，给发光元件203施加电压，例如，发光元件203可为有机发光二极管(Organic Light-Emitting Diode，OLED)，电流会从透明阴极2033流向金属阳极2031，并经过有机高分子发光层2032，也就是说，透明阴极2033向有机高分子发光层2032输出电子，金属阳极2031向有机高分子发光层2032输出空穴，而在电子到达有机高分子发光层2032时，会和有机高分子发光层2032的空穴结合，电子和空穴分别带负电和正电，它们相互吸引，激发有机高分子发光层2032中的有机材料发光，从而实现了发光元件203的发光，进而，光经过彩膜层201进行滤光，可产生红、绿、蓝(Red、Green、Blue)三基色，并根据彩膜层201的滤光片颜色的设置，实现不同的滤光需求，从而实现需投影显示的图像的显示。
在另一种可能的场景下，图像处理模块100需要进行采集成像图像时，启动成像组件30进行采集成像图像，成像组件30为多个，每一个成像组件30对应一个成像像素点，成像像素点用于生成成像图像，为了便于说明，本实施例中以图像处理模块100中包含一个成像组件30为例，进行说明，具体地，如图2所示，光线经过彩膜层201进行滤光，感光元件301用于对彩膜层201滤光得到的光线进行探测，使得感光元件301将探测到的光线从光信息转化为数字信号，从而确定该成像组件30对应成像像素点的R、G、B值，即确定了该像素点对应的成像图像，进而根据多个成像组件30对应的多个成像像素点，生成对应的成像图像。
在本实施例的一种可能的实现方式中，多个成像组件30与多个投影组件20，在基板10表面交替排布，这种排布方式可以使得彩膜层201相同颜色采用相同原料进行制造，减少了彩膜层201的制造工序，降低了制造成本。
在本实施例的另一种可能的实现方式中，多个成像组件30与多个投影组件20，在基板10表面分区排布，这种排布方式便于制作工艺简单
本申请实施例的图像处理模块中，投影组件用于投影显示，包括顺序层叠排布的彩膜层、金属走线层、发光元件和驱动元件，成像组件用于采集成像图像，包括顺序层叠排布的彩膜层、金属走线层和感光元件，其中，成像组件与投影组件共用金属走线层和彩膜层，通过在图像处理模块中，设置投影组件进行投影显示，设置成像组件进行图像采集，实现了采用全面屏方案的电子设备，其图像处理模块对应区域的显示和图像采集功能并存，有利于全面屏的发展。
基于上述实施例，本申请实施例还提出了一种摄像头，图3为本申请实施例所提供的摄像头的机构示意图，如图3所示，该摄像头1000包括上述实施例中所述的图像处理模块100和对应成像组件30的透镜组200。
基于上述实施例，本申请实施例还提出了一种电子设备，该电子设备包含移动终端和台式终端等，例如手机、ipad、掌上电脑、台式电脑等等，图4为本申请实施例所提供的一种电子设备的结构示意图。
如图4所示，该电子设备包括：处理单元1010、摄像头1000、以及覆盖摄像头1000的显示屏1020。
显示屏1020，与处理单元1010电性连接，显示屏具有透光区域1021和非透光区域1022，用于在处理单元1010控制下通过非透光区域1022进行显示。其中，透光区域1021的形状可以为矩形，也可以为圆形，也可以为其它形状，本实施例中对此不做限定。另外，透光区域1021的位置本领域技术人员可根据产品的需求灵活设置其在显示屏1020中的位置，本实施例中也不作限定。
摄像头1000，设置于对应透光区域1021下方，包括分别与处理单元1010电性连接的投影组件20和成像组件30，用于在处理单元1010控制下利用投影组件20向显示屏1020投影，以在显示屏1020的透光区域1021进行显示，以及在处理单元1010控制下利用成像组件30透过显示屏1020的透光区域1021采集成像图像。
处理单元1010，用于控制显示屏1020进行显示，以及用于控制摄像头1000在显示状态下投影显示，在成像状态下采集成像图像。
本申请实施例的电子装置中，显示屏与处理单元电性连接，具有透光区域和非透光区域，摄像头设置于对应透光区域下方，包括分别与处理单元电性连接的投影组件和成像组件，用于在处理单元控制下利用投影组件向显示屏投影，以在显示屏的透光区域进行显示，以及在处理单元控制下利用成像组件透过显示屏的透光区域采集成像图像，处理单元，用于控制显示屏进行显示，以及用于控制摄像头在显示状态下投影显示，在成像状态下采集成像图像。通过在摄像头中设置投影组件和成像组件，使得在显示状态下，通过处理单元控制投影组件向显示屏投影，使得显示屏的透光区域也可以对应进行显示，实现了全面屏显示，在成像状态下，通过处理器控制成像组件采集成像图像，实现了图像采集功能，使得电子设备中全面屏显示和图像采集功能可以并存。
基于上述实施例，本申请实施例提供了另一种电子设备的结构的可能的实现方式，图5为本申请实施例提供的另一种电子设备的结构示意图。
如图5所示，处理单元1010，可以包括：图像缓存器1011，处理器1012，与摄像头1000电性连接的第一通信接口1013和与显示屏1020电性连接的第二通信接口1014。
图像缓存器1011，用于对待显示的图像划分为的显示子图像和投影子图像分别进行缓存。
处理器1012，与图像缓存器1011电性连接，用于读取图像缓存器1011得到显示子图像和投影子图像，并向第一通信接口1013发送投影子图像和向第二通信接口1014发送显示子图像。
第一通信接口1013，与处理器1012电性连接，用于将投影子图像发送至摄像头1000。第二通信接口1014，与处理器1012电性连接，用于将显示子图像发送至显示屏1020。作为一种可能的实现方式，第一通信接口1013和第二通信接口1014为同步传输的显示串行接口DSI(Display Serial Interface，DSI)。实现了在显示状态下，通过同步传输的显示串行接口DSI，使得通过第一通信接口1013发送至摄像头1000的投影子图像和通过第二通信接口1014发送至显示屏1020的显示子图像，可以同步发送，从而使得显示屏1020显示的投影子图像和显示子图像同步显示。
作为一种可能的实现方式，图像缓存器1011，可以包括第一缓存区10111和第二缓存区 10112，其中，第一缓存区10111用于存储投影子图像，第二缓存区10112用于存储显示子图像。图6为本申请实施例提供的图像缓存区中数据流向的示意图，如图6所示，通过划分不同的缓存区域，第一缓存区10111中存储了和显示屏1020的非透光区1022对应的图像像素点对应的图像信息，即显示子图像，第二缓存区10112中存储了和显示屏1020的透光区域1021对应的图像像素点对应的图像信息，即投影子图像，从而建立了存储位置和显示屏1020显示区域需要显示的图像的对应关系，以使得当摄像头1000处于显示状态时，处理器1012可以直接从图像缓存器1011的第一缓存区10111中读取投影子图像，通过第一通信接口1013发送给摄像头1000进行投影显示，以及从第二缓存区10112中读取显示子图像，通过第二通信接口1014发送给显示屏1020进行显示，提高了显示屏全屏显示的效率。
对于图像缓存区1011中存储的投影子图像和显示子图像，是根据待显示图像进行子图像划分得到的，而待显示图像进行子图像划分是根据显示屏1020中非透光区域1022的图像像素点对应的图像形状和透光区域1021的图像像素点对应的图像形状进行划分的，作为一种可能的划分方式，图7为本申请实施例提供的子图像划分的示意图之一，如图7所示，显示屏1020中透光区域1021对应的图像像素点对应的图像为正方形，则将待显示图像40根据显示屏1020中透光区域1021和非透光区域1022图像像素点对应的图像形状进行划分，得到图7中右边的投影子图像410和显示子图像420。作为另一种可能的划分方式，图8为本申请实施例提供的子图像划分的示意图之二，如图8所示，显示屏1020中透光区域1021的图像像素点对应的图像为圆形，则将待显示图像40，根据显示屏1020中透光区域1021和非透光区域1022的图像像素点对应的图像形状进行划分，得到图8中右边的投影子图像430和显示子图像440。
需要说明的是，图7和图8中仅示出了根据显示屏1020的透光区域1021和非透光区域1022的图像像素点对应的图像进行显示子图像和投影子图像划分的2种形式，实际应用中，本领域技术人员可根据显示屏1020中透光区域1021和非透光区域1022对应的图像像素点的图像形状，对待显示图像进行划分，划分原理相似，本实施例不一一列举。
本申请实施例的电子设备中，通过在摄像头中设置投影组件和成像组件，使得在显示状态下，通过处理单元控制投影组件向显示屏投影，使得显示屏的透光区域也可以对应进行显示，实现了电子设备的全面屏显示，在成像状态下，通过处理器控制成像组件采集成像图像，实现了图像采集功能，使得电子设备中全面屏显示和图像采集功能可以并存。同时，在显示状态下，通过同步传输的显示串行接口DSI，使得通过第一通信接口发送至摄像头的投影子图像和通过第二通信接口发送至显示屏的显示子图像，可以同步发送，从而使得显示屏在显示状态下显示的投影子图像和显示子图像同步显示。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具 体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本申请的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。
流程图中或在此以其他方式描述的任何过程或方法描述可以被理解为，表示包括一个或更多个用于实现定制逻辑功能或过程的步骤的可执行指令的代码的模块、片段或部分，并且本申请的优选实施方式的范围包括另外的实现，其中可以不按所示出或讨论的顺序，包括根据所涉及的功能按基本同时的方式或按相反的顺序，来执行功能，这应被本申请的实施例所属技术领域的技术人员所理解。
在流程图中表示或在此以其他方式描述的逻辑和/或步骤，例如，可以被认为是用于实现逻辑功能的可执行指令的定序列表，可以具体实现在任何计算机可读介质中，以供指令执行***、装置或设备(如基于计算机的***、包括处理器的***或其他可以从指令执行***、装置或设备取指令并执行指令的***)使用，或结合这些指令执行***、装置或设备而使用。就本说明书而言，"计算机可读介质"可以是任何可以包含、存储、通信、传播或传输程序以供指令执行***、装置或设备或结合这些指令执行***、装置或设备而使用的装置。计算机可读介质的更具体的示例(非穷尽性列表)包括以下：具有一个或多个布线的电连接部(电子装置)，便携式计算机盘盒(磁装置)，随机存取存储器(RAM)，只读存储器(ROM)，可擦除可编辑只读存储器(EPROM或闪速存储器)，光纤装置，以及便携式光盘只读存储器(CDROM)。另外，计算机可读介质甚至可以是可在其上打印所述程序的纸或其他合适的介质，因为可以例如通过对纸或其他介质进行光学扫描，接着进行编辑、解译或必要时以其他合适方式进行处理来以电子方式获得所述程序，然后将其存储在计算机存储器中。
应当理解，本申请的各部分可以用硬件、软件、固件或它们的组合来实现。在上述实施方式中，多个步骤或方法可以用存储在存储器中且由合适的指令执行***执行的软件或固件来实现。如，如果用硬件来实现和在另一实施方式中一样，可用本领域公知的下列技术中的任一项或他们的组合来实现：具有用于对数据信号实现逻辑功能的逻辑门电路的离散逻辑电路，具有合适的组合逻辑门电路的专用集成电路，可编程门阵列(PGA)，现场可编程门阵 列(FPGA)等。
本技术领域的普通技术人员可以理解实现上述实施例方法携带的全部或部分步骤是可以通过程序来指令相关的硬件完成，所述的程序可以存储于一种计算机可读存储介质中，该程序在执行时，包括方法实施例的步骤之一或其组合。
此外，在本申请各个实施例中的各功能单元可以集成在一个处理模块中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个模块中。上述集成的模块既可以采用硬件的形式实现，也可以采用软件功能模块的形式实现。所述集成的模块如果以软件功能模块的形式实现并作为独立的产品销售或使用时，也可以存储在一个计算机可读取存储介质中。
上述提到的存储介质可以是只读存储器，磁盘或光盘等。尽管上面已经示出和描述了本申请的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本申请的限制，本领域的普通技术人员在本申请的范围内可以对上述实施例进行变化、修改、替换和变型。

Claims (20)

  1. 一种图像处理模块，其特征在于，包括：基板、投影组件和成像组件；
    其中，所述投影组件和所述成像组件均设置于所述基板表面；
    所述投影组件，用于投影显示，包括顺序层叠排布的彩膜层、金属走线层、发光元件和驱动元件；
    所述成像组件，用于采集成像图像，包括顺序层叠排布的彩膜层、金属走线层和感光元件；
    其中，所述成像组件与所述投影组件共用金属走线层和彩膜层。
  2. 根据权利要求1所述的图像处理模块，其特征在于，
    所述驱动元件，设置于所述基板表面，用于驱动所述发光元件；
    所述金属走线层，设置于所述驱动元件表面，与所述驱动元件和发光元件电性连接；
    所述发光元件，设置于所述金属走线层表面，用于在所述驱动元件驱动下发光；
    所述彩膜层，设置于所述发光元件和感光元件表面，用于滤光。
  3. 根据权利要求2所述的图像处理模块，其特征在于，
    所述感光元件，设置于所述基板表面，用于对所述彩膜层滤光得到的光线进行探测；
    所述金属走线层，还与所述感光元件电性连接。
  4. 根据权利要求2所述的图像处理模块，其特征在于，所述发光元件包括：
    金属阳极，设置于所述金属走线层表面；
    有机高分子发光层，设置于所述金属阳极表面；
    透明阴极，设置于所述有机高分子发光层表面。
  5. 根据权利要求3所述的图像处理模块，其特征在于，
    所述金属走线层，包括多条信号线，所述多条信号线交叉形成的中空区域对应所述感光元件所在位置。
  6. 根据权利要求1-5任一项所述的图像处理模块，其特征在于，
    所述成像组件为多个，每一个成像组件对应一个成像像素点；所述成像像素点，用于生成所述成像图像；
    所述投影组件为多个，每一个投影组件对应一个投影像素点；所述投影像素点，是根据投影显示的图像确定的。
  7. 根据权利要求6所述的图像处理模块，其特征在于，
    多个所述成像组件与多个所述投影组件，在所述基板表面交替排布。
  8. 根据权利要求6所述的图像处理模块，其特征在于，
    多个所述成像组件与多个所述投影组件，在所述基板表面分区域排布。
  9. 一种摄像头，其特征在于，包括：图像处理模块，
    所述图像处理模块包括：基板、投影组件和成像组件；
    其中，所述投影组件和所述成像组件均设置于所述基板表面；
    所述投影组件，用于投影显示，包括顺序层叠排布的彩膜层、金属走线层、发光元件和驱动元件；
    所述成像组件，用于采集成像图像，包括顺序层叠排布的彩膜层、金属走线层和感光元件；
    其中，所述成像组件与所述投影组件共用金属走线层和彩膜层。
  10. 根据权利要求9所述的摄像头，其特征在于，
    所述驱动元件，设置于所述基板表面，用于驱动所述发光元件；
    所述金属走线层，设置于所述驱动元件表面，与所述驱动元件和发光元件电性连接；
    所述发光元件，设置于所述金属走线层表面，用于在所述驱动元件驱动下发光；
    所述彩膜层，设置于所述发光元件和感光元件表面，用于滤光。
  11. 根据权利要求10所述的摄像头，其特征在于，
    所述感光元件，设置于所述基板表面，用于对所述彩膜层滤光得到的光线进行探测；
    所述金属走线层，还与所述感光元件电性连接。
  12. 根据权利要求10所述的摄像头，其特征在于，所述发光元件包括：
    金属阳极，设置于所述金属走线层表面；
    有机高分子发光层，设置于所述金属阳极表面；
    透明阴极，设置于所述有机高分子发光层表面。
  13. 根据权利要求11所述的摄像头，其特征在于，
    所述金属走线层，包括多条信号线，所述多条信号线交叉形成的中空区域对应所述感光元件所在位置。
  14. 根据权利要求9-13任一项所述的摄像头，其特征在于，
    所述成像组件为多个，每一个成像组件对应一个成像像素点；所述成像像素点，用于生成所述成像图像；
    所述投影组件为多个，每一个投影组件对应一个投影像素点；所述投影像素点，是根据投影显示的图像确定的。
  15. 根据权利要求14所述的摄像头，其特征在于，
    多个所述成像组件与多个所述投影组件，在所述基板表面交替排布。
  16. 根据权利要求14所述的摄像头，其特征在于，
    多个所述成像组件与多个所述投影组件，在所述基板表面分区域排布。
  17. 根据权利要求1-14任一项所述的摄像头，其特征在于，还包括对应所述成像组件的透镜组。
  18. 一种电子设备，其特征在于，所述电子设备包括：显示屏、如权利要求9所述的摄像头以及分别与所述显示屏和摄像头电性连接的处理单元；
    所述显示屏，具有透光区域和非透光区域，用于在所述处理单元控制下通过所述非透光区域进行显示；
    所述摄像头，设置于所述显示屏下方，对应所述透光区域，用于在所述处理单元控制下利用所述投影组件向所述显示屏投影，以在所述显示屏的透光区域进行显示；以及在所述处理单元控制下利用成像组件透过所述显示屏的透光区域采集成像图像；
    所述处理单元，用于控制所述显示屏进行显示，以及用于控制所述摄像头在显示状态下投影显示，在成像状态下采集成像图像。
  19. 根据权利要求18所述的电子设备，其特征在于，所述处理单元，包括图像缓存器、处理器、与所述摄像头电性连接的第一通信接口和与所述显示屏电性连接的第二通信接口；
    所述图像缓存器，用于对待显示的图像划分为显示子图像和投影子图像分别进行缓存；
    所述处理器，与所述图像缓存电性连接，用于读取所述图像缓存器得到所述显示子图像和所述投影子图像，向所述第一通信接口发送所述投影子图像和向所述第二通信接口发送所述显示子图像；
    所述第一通信接口，与所述处理器电性连接，用于将所述投影子图像发送至所述摄像头；
    所述第二通信接口，与所述处理器电性连接，用于将所述显示子图像发送至所述显示屏。
  20. 根据权利要求19所述的电子设备，其特征在于，所述图像缓存器包括第一缓存区和第二缓存区；
    其中，所述第一缓存区，用于存储所述投影子图像；
    所述第二缓存区，用于存储所述显示子图像。
PCT/CN2019/086044 2018-06-04 2019-05-08 图像处理模块、摄像头和电子设备 WO2019233236A1 (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN201810564140.XA CN110557529A (zh) 2018-06-04 2018-06-04 图像处理模块、摄像头和电子设备
CN201820858009.XU CN208386728U (zh) 2018-06-04 2018-06-04 图像处理模块、摄像头和电子设备
CN201810564140.X 2018-06-04
CN201820858009.X 2018-06-04

Publications (1)

Publication Number Publication Date
WO2019233236A1 true WO2019233236A1 (zh) 2019-12-12

Family

ID=68770055

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/086044 WO2019233236A1 (zh) 2018-06-04 2019-05-08 图像处理模块、摄像头和电子设备

Country Status (1)

Country Link
WO (1) WO2019233236A1 (zh)

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101728379A (zh) * 2008-10-22 2010-06-09 胜华科技股份有限公司 有机发光二极管显示装置及其制造方法
CN104752445A (zh) * 2013-12-25 2015-07-01 昆山工研院新型平板显示技术中心有限公司 交互式电子装置及其像素单元
US20150295001A1 (en) * 2014-04-14 2015-10-15 SK Hynix Inc. Image sensor and method for fabricating the same
CN106850897A (zh) * 2017-03-07 2017-06-13 广东欧珀移动通信有限公司 终端
CN106878564A (zh) * 2017-03-07 2017-06-20 广东欧珀移动通信有限公司 一种显示屏的控制方法及装置、显示屏和移动终端
CN106920470A (zh) * 2017-04-27 2017-07-04 武汉华星光电技术有限公司 一种纯屏幕无边框显示装置及显示方法
US20170235398A1 (en) * 2016-02-16 2017-08-17 Samsung Electronics Co., Ltd. Electronic device
CN107682489A (zh) * 2017-11-20 2018-02-09 珠海市魅族科技有限公司 一种移动终端和移动终端的显示屏控制方法
CN108551505A (zh) * 2018-06-04 2018-09-18 Oppo广东移动通信有限公司 电子设备、图像处理方法和装置
CN108566506A (zh) * 2018-06-04 2018-09-21 Oppo广东移动通信有限公司 图像处理模组、控制方法、电子设备及可读存储介质
CN108632417A (zh) * 2018-06-04 2018-10-09 Oppo广东移动通信有限公司 驱动芯片、图像传感器、摄像头，以及电子设备
CN208386728U (zh) * 2018-06-04 2019-01-15 Oppo广东移动通信有限公司 图像处理模块、摄像头和电子设备

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101728379A (zh) * 2008-10-22 2010-06-09 胜华科技股份有限公司 有机发光二极管显示装置及其制造方法
CN104752445A (zh) * 2013-12-25 2015-07-01 昆山工研院新型平板显示技术中心有限公司 交互式电子装置及其像素单元
US20150295001A1 (en) * 2014-04-14 2015-10-15 SK Hynix Inc. Image sensor and method for fabricating the same
US20170235398A1 (en) * 2016-02-16 2017-08-17 Samsung Electronics Co., Ltd. Electronic device
CN106850897A (zh) * 2017-03-07 2017-06-13 广东欧珀移动通信有限公司 终端
CN106878564A (zh) * 2017-03-07 2017-06-20 广东欧珀移动通信有限公司 一种显示屏的控制方法及装置、显示屏和移动终端
CN106920470A (zh) * 2017-04-27 2017-07-04 武汉华星光电技术有限公司 一种纯屏幕无边框显示装置及显示方法
CN107682489A (zh) * 2017-11-20 2018-02-09 珠海市魅族科技有限公司 一种移动终端和移动终端的显示屏控制方法
CN108551505A (zh) * 2018-06-04 2018-09-18 Oppo广东移动通信有限公司 电子设备、图像处理方法和装置
CN108566506A (zh) * 2018-06-04 2018-09-21 Oppo广东移动通信有限公司 图像处理模组、控制方法、电子设备及可读存储介质
CN108632417A (zh) * 2018-06-04 2018-10-09 Oppo广东移动通信有限公司 驱动芯片、图像传感器、摄像头，以及电子设备
CN208386728U (zh) * 2018-06-04 2019-01-15 Oppo广东移动通信有限公司 图像处理模块、摄像头和电子设备

Similar Documents

Publication Publication Date Title
CN108551505B (zh) 电子设备、图像处理方法和装置
US10965921B2 (en) Storage medium, electronic device and image processing method
JP6219017B2 (ja) 光検出機能を備えるｏｌｅｄディスプレイ装置
WO2019219063A1 (zh) 显示面板的驱动方法及装置、显示设备
WO2017101451A1 (zh) 成像方法、成像装置及电子装置
US20080100805A1 (en) Apparatus and method for self-calibrating multi-projector displays via plug and play projectors
US20080284675A1 (en) Configurable imaging system
CN208386728U (zh) 图像处理模块、摄像头和电子设备
JP2018523323A (ja) 撮影方法、撮影装置、及び端末
US10679543B2 (en) Image processing method, image processing device and display panel
RU2730394C1 (ru) Дисплей на органических светодиодах, способ управления дисплеем и электронное устройство
CN105430359A (zh) 成像方法、图像传感器、成像装置及电子装置
CN110557529A (zh) 图像处理模块、摄像头和电子设备
CN105430361A (zh) 成像方法、图像传感器、成像装置及电子装置
CN105611123A (zh) 成像方法、图像传感器、成像装置及电子装置
CN108566506B (zh) 图像处理模组、控制方法、电子设备及可读存储介质
CN105578080A (zh) 成像方法、图像传感器、成像装置及电子装置
CN105430362A (zh) 成像方法、成像装置及电子装置
CN105578066A (zh) 成像方法、成像装置及电子装置
CN105611257A (zh) 成像方法、图像传感器、成像装置及电子装置
US10136089B2 (en) Display panel, display device and method for making the same
CN105578081A (zh) 成像方法、图像传感器、成像装置及电子装置
US20080112607A1 (en) System and method for testing leds on a motherboard
US10055065B2 (en) Display system, projector, and control method for display system
CN108632417A (zh) 驱动芯片、图像传感器、摄像头，以及电子设备

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19814968

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19814968

Country of ref document: EP

Kind code of ref document: A1