WO2019229603A1 - Manufacturing of circuit board having electrostatic printed conductive pattern - Google Patents

Manufacturing of circuit board having electrostatic printed conductive pattern Download PDF

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Publication number
WO2019229603A1
WO2019229603A1 PCT/IB2019/054321 IB2019054321W WO2019229603A1 WO 2019229603 A1 WO2019229603 A1 WO 2019229603A1 IB 2019054321 W IB2019054321 W IB 2019054321W WO 2019229603 A1 WO2019229603 A1 WO 2019229603A1
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WO
WIPO (PCT)
Prior art keywords
conductive
composite powder
powder
laser
embryo
Prior art date
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PCT/IB2019/054321
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French (fr)
Chinese (zh)
Inventor
林世智
Original Assignee
Lin Shih Jue
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Publication date
Application filed by Lin Shih Jue filed Critical Lin Shih Jue
Publication of WO2019229603A1 publication Critical patent/WO2019229603A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing

Definitions

  • the present invention relates generally to the manufacture of circuit boards for electronic devices, and more particularly to the manufacture of circuit boards with electrostatic printing or conductor patterning of xerographic printing. Background technique
  • PCBs printed circuit boards
  • Rigid PCBs rigid PCBs
  • flexible PCBs that are suitable for giving mechanical burnability to circuit boards systems of flexible electronics may have only one side (single layer). Conductive line.
  • the mainstream manufacturing method of PCB is to use a subtractive process, and use a complete copper box to form a conductive circuit. In the complete full area of the original raw material copper box, all copper materials except conductive lines must be removed. At present, chemical etching is the main method for removing copper.
  • the present invention provides a method for manufacturing a circuit board with electrostatic printed conductive circuits.
  • the essence of the simple and easy addition process can substantially avoid the generation of chemical waste liquid.
  • the present invention provides a method for manufacturing a circuit board with an electrostatic printed conductive circuit, which includes a two-step phase.
  • a material containing a resin and a conductive powder is electrostatically printed on an electrically insulating substrate.
  • the present invention further provides a method for manufacturing a circuit board having an electrostatic printed conductive circuit, wherein the energy applied to heat the composite powder embryo of the conductive circuit that has a molded protrusion structure is a laser, and wherein ( i) The wavelength is 700 ⁇ 2000nm or 450 ⁇ 700nm or 250 ⁇ 450nm, and the best is 700 ⁇ 2000nm; (ii)
  • the laser form is (a) It can be continuous wave (CW) or pulse laser ; (B) the beam profile of the laser can be Gaussian or Tophat; (c) the moving speed of the center point of the laser is greater than 10mm / sec ; (d) used for shaped protrusions
  • the laser power of the constructed composite powder embryo is greater than 0.1 watts (W); (e) if it is a pulsed laser: then (el) pulse duration (pulse width): less than 1 millisecond (ms); (e2) the maximum pulse energy : More than 0.01 millijou
  • FIG. 1 is a schematic diagram illustrating a stage I and II process of fabricating a circuit board with an electrostatic printed conductive circuit according to an embodiment of the present invention.
  • FIG. 2 is a schematic diagram of a Carlson Cycle of a conductive circuit of a printed circuit board by electrostatic printing using a photosensitive conductor according to an embodiment of the present invention.
  • Figures 3 and 4 show the comparison of sintered and unsintered surfaces of composite powder embryos.
  • FIG. 1 is a schematic diagram illustrating a stage I and II process of fabricating a circuit board with an electrostatic printed conductive circuit according to an embodiment of the present invention.
  • the process exemplified in this embodiment can be divided into two main process stages, that is, process stage I for performing electrostatic printing, and process stage II for sintering of powder embryos.
  • the electrostatic printing device 102 is used in the electrostatic printing stage I
  • the sintering device 104 is used in the powder sintering stage II.
  • electrostatic printing refers to modern automated photocopying, which is similar to generally used in photocopying and laser printing, and is disclosed by Chester Carlson in US 2,297,691 and subsequent related technologies. technology. Compared to existing electrostatic printing.
  • the technology of manufacturing circuit boards with electrostatic printed conductive circuits of the present invention is different in that the raw materials and powders used in the two are different, and the methods of printing the fixing, setting are different.
  • the electrostatic printing device 102 uses the raw material powder source 122 to print a target circuit on a blank substrate 110 having electrical insulation properties by electrostatic printing. Conductive circuit required by the board. The result of this printing process is the stage circuit board 112 of the composite powder embryo 124 printed with conductive lines.
  • the raw material powder or the original powder refers to a mixed powder containing two or more kinds of powders such as conductive materials such as metal materials and resins. According to the present invention, it can be used for electrostatic printing to A composite powder embryo forming a conductive circuit.
  • the composite powder embryo in the present invention refers to the raw powder material of the present invention, which is printed on the substrate of a circuit board using electrostatic printing, and has not been completely shaped and solidified with a conductive circuit shape structure of the circuit board.
  • Conductive circuit embryo Before using the sintering procedure to shape and solidify the composite embryo body, the embryo body is a flexible but stable phase structure due to the resin contained therein.
  • the composite powder embryo 124 of the conductive circuit printed on the circuit board 112 at this process stage in FIG. 1 does not yet have the good conductive properties that the conductive circuit of the target circuit board should have. This is because although the structure of the composite powder embryo 124 has a powder of a conductive material, such as a metal powder, there is not only a gap between the particles, but also resin particles.
  • the circuit board substrate 112 of the composite powder embryo 124 has been printed, and then it can be sent to the sintering device 104 to perform the powder embryo sintering process of the process phase II to transfer the conductive powder in the composite powder embryo 124,
  • the metallic copper powder particles are sintered and metalized to form a continuous electrical conductor.
  • a circuit board 130 having a complete conductive circuit 125 can be obtained, and the conductive circuit 125 on its insulating substrate has good electrical conductivity.
  • the energy source for sintering may be a laser, and its wavelength may be 700 to 2000 nm or 450 to 700 nm or 250 to 450 nm, with 700 to 2000 nm being the best.
  • which stimulate The light form can be a continuous wave or pulsed laser, while the beam profile of the laser can be Gaussian or cymbal top hat, and the moving speed of the laser center point is greater than 10mm / sec.
  • the laser power of the composite powder embryo used in conductive circuits is greater than 0.1W.
  • the pulse width should be less than lms, the maximum pulse energy should be greater than O.Olmj, and its frequency should be greater than 10Hz. If several laser beams are hit on the composite powder embryo, the line formed by the center points of the light spots formed by it and another parallel line of the same nature shall have a line spacing of not less than 0.03
  • the powder sintering procedure of this process stage II can also be performed by induction heating, which can induce eddy current in the composite powder sintered metal conductive material to generate heat and sinter.
  • the energy source for sintering can also be plasma (Plasma beam).
  • the energy source for sintering in the powder sintering procedure of the process stage II, can also be an ion beam.
  • FIG. 2 shows a schematic diagram of a Carlson cycle when a composite powder embryo of a conductive circuit of a circuit board is printed by electrostatic printing using a photoconductor according to an embodiment of the present invention.
  • the conductive pattern of the target circuit board (the final sintered conductive wire 125 in FIG. 1) is routed to the photosensitive conductor 200 via the optical system of the electrostatic printing device 102 so The first region 201 of this cycle forms a power distribution region.
  • the electrical distribution region 201 of the photoconductor 200 then rotates clockwise in the direction shown in the figure, and is illuminated by the light beam 202 that can form a latent image of the circuit.
  • Generated at 203 can correspond to the area of charge forming a composite powder embryo circuit.
  • the photosensitive conductor 200 is continuously rotated, so that the powder supplied by the raw material powder material 122 is adsorbed on the photosensitive conductor due to static electricity, and the surface of the photosensitive material layer generates a charge region corresponding to the shape of the conductive line.
  • the composite powder embryo adsorbed on the photoconductor advances to the position of the transfer region of 204, because the transfer region provides a voltage opposite to the photoconductor, the powder adsorbed on the photoconductor is transferred and attached to the non-conductive substrate 110
  • On the circuit board substrate 112 is formed a composite powder embryo 124 printed with conductive lines.
  • the substrate 112 of the circuit board continues to advance toward the substrate as shown in FIG. 2, and the conductive circuit composite powder embryo 124 printed thereon is fixed at the position 211. It can use the rollers of the fixing system to appropriately heat and apply pressure to make the composite powder embryo 124 firmly adhere to the surface of the substrate 112.
  • circuit board substrate 112 of the composite powder embryo 124 printed with the conductive circuit is subjected to additional energy or heat treatment to vaporize or burn the resin contained in the composite powder embryo.
  • the underlying conductive material is metallized to form a conductive line (125) due to sintering, and a circuit board 130 with a complete conductive line is completed.
  • the manufacturing procedure may be used for manufacturing, for example, a flexible circuit board.
  • the circuit board produced in this example only has single-sided conductive circuits, those skilled in the art can understand that by repeating substantially the same procedure, this embodiment is also suitable for making circuit boards with double-sided conductive circuits. .
  • the original powders of conductive materials with different electrical conductivity are placed in different toner cartridges, and after printing and sintering / metallization procedures, Can be the same
  • a piece of film substrate is used to make a circuit board with local circuits of different conductive properties.
  • the structure of the photoconductor (Fig. 2, 200) has the following characteristics:
  • the substrate of the photoconductor used may be a rigid pillar type or a non-rigid soft film type.
  • the photoconductor used can be an inorganic or organic series.
  • an inorganic series photoconductor may be an amorphous silicon photoconductor, and if it is an organic series photoconductor, it may be a single-layer or more than one-layer organic photoconductor.
  • the base material used for the photoconductor may be made of a metal or a polymer.
  • the surface roughness Rz of the photoconductor is not more than 10
  • the charge generation agent (CGM) used is a charge generator for organic or organic metal pigments or dyes, such as phthalocyanine pigments.
  • the transportable positive carrier material (HTM) used may be a fluorene compound, a styrene compound, a diamine compound, a butadiene compound, an indole compound, etc. alone or after an appropriate combination Mixed use.
  • the transportable negative carrier (ETM) used may be a benzoquinone derivative, a phenanthrenequinone derivative, a stilbenequinone derivative, or a diazaquinone derivative, and these may be used alone or in two types Use in combination.
  • the binder used may be a styrene polymer or a copolymer of styrene and other monomers.
  • Thermoplastic resins such as propyl resin, polyketide resin, polyvinyl butyral resin, acrylonitrile resin and polyether resin; or silicone resin, epoxy resin, phenolic resin, urea resin, melamine Resins and other crosslinkable thermosetting resins; or photocurable resins such as epoxy acrylates and polyurethane-acrylates.
  • the operation of the photoconductor (Fig. 2, 200) can have the following characteristics:
  • the minimum line speed of operation is not less than 0.05mm / sec.
  • (viii-2) follow the six steps of Chester Carlson cycle shown in Figure 2.
  • the range is preferably ⁇ 150 ⁇ 990V, more preferably ⁇ 200 ⁇ 750V; most preferably ⁇ 200 ⁇ 650V.
  • the photoconductor is electrically charged and then exposed to the light source.
  • the photoconductor surface voltage before the photoconductor is developed is greater than + 2V or less than -2V.
  • the printer's electrical distribution system for the photoconductor can be a charging roller or a corona charging wire system.
  • the light source of the printer's exposure system to the photoconductor can be a laser or a light emitting diode (LED).
  • LED light emitting diode
  • the resin of the composite powder embryo is heated to a molten state, and the molten resin is pressed against the substrate at the same time. At this time, the composite powder embryo and the non-conductive blank substrate Materials will attract each other due to van der Waals and form lines.
  • the raw material powder ( Figure 1, 122) used with the photosensitive conductor ( Figure 2, 200) can have the following characteristics:
  • the particle size is 0.05 to 100
  • the conductive powder component in the raw material powder can have the following characteristics:
  • the binder component in the raw material powder can have the following characteristics:
  • thermoplastic resin such as a polyester resin, an acrylic resin or a copolymer of acrylic and styrene.
  • thermosetting resin such as a phenolic resin.
  • the ratio of the conductive powder to the binder in the raw material powder is:
  • the weight of the conductive powder accounts for 10% -90% of the weight of the entire powder material.
  • Process Phase I Electrostatic Printing 1. Making non-conductive powdered toner for imaging:
  • the solid after cooling (iv) is pulverized by a pulverizer, and the obtained fine powder is a non-conductive raw material powder for imaging.
  • the raw material powder is poured into the toner cartridge of AM30 printer (manufactured by Avision), and the printing voltage of the photoconductor (organic photoconductor drum manufactured by Green Rich Technology Co.) during printing is + 600 ⁇ + 650V.
  • the surface voltage of the photoconductor after exposure to laser light is + 70 ⁇ + 150V.
  • the PI film obtained from the foregoing process stage I has a composite powder embryo printed on the surface with a raw powder material and not yet conductive, and a high-temperature sintering treatment of the composite powder embryo by laser.
  • the high temperature of the laser is used to instantaneously vaporize or burn the resin in the powder embryo, and at the same time, sinter and metalize the conductive copper powder into a structure with overall conductivity.
  • the moving speed and energy of the laser are changed, so that the vertical sintering depth can be controlled:
  • the laser power used is greater than 0.5W
  • the pulse width is less than 0.5ms, and the maximum pulse energy is greater than 0.05mj;
  • the frequency is greater than 10Hz.
  • Figures 3 and 4 show the comparison of the properties of the composite powder embryos on the sintered and unsintered surfaces. It can be found that after sintering on the right side of the figure, the conductive powder has obviously formed a block. In the unsintered part on the left, the conductive powder is still in a dispersed state.
  • a simple test method is to use a trimeter to measure the success of sintering. Measure the resistance value on the left and find that it is insulated, while the sintered part on the right can be turned on, and its resistance value is 6-35 Q. Therefore, it can be judged that after high-temperature sintering, the conductive powder has been sintered into agglomerates and metalized to become a conductive body conductor.

Abstract

A method for manufacturing a circuit board having an electrostatic printed conductive pattern, comprising two stages. First, on an electrically insulating substrate, using electrostatic printing to print a composite powder material containing electrically conductive powder and a resin to form a composite blank powder for the electrically conductive pattern of the circuit board. Then, applying energy to heat the composite blank powder for the electrically conductive pattern so as to burn away/gasify the resin, sintering the electrically conductive powder in the composite blank powder for the electrically conductive pattern, metallizing the sintered electrically conductive powder so as to form the electrically conductive pattern, wherein the resin attaches the metallized electrically conductive pattern to the electrically insulating substrate, and the energy applied does not cause substantial "damaging" heating on the electrically insulating substrate.

Description

具有静电印制导电线路的电路板的制作 技术领域  Manufacturing of circuit board with electrostatic printed conductive circuit
本发明大致涉及电子设备的电路板 (circuit board) 的制作， 特别涉及具有静电印刷 (electrostatic printing或 xerographic printing)导电线路 ( conductor patterning )的电路板的 制作。 背景技术  The present invention relates generally to the manufacture of circuit boards for electronic devices, and more particularly to the manufacture of circuit boards with electrostatic printing or conductor patterning of xerographic printing. Background technique
现今绝大多数的电子设备皆须使用印刷电路板 (printed circuit board, PCB ) 硬质 PCB (rigid PCB ) 利用多层堆叠的构造以便支援复杂的电路***。 相较之下， 相对较不 利应用于复杂电路， 但适于赋予烧性电子设备 (flexible electronics) 的电路板***机械烧 性的柔性 PCB (flexible PCB ) , 则可能只有单面 (单层) 的导电线路。  Most of today's electronic devices must use printed circuit boards (PCBs). Rigid PCBs (rigid PCBs) utilize multi-layer stacking structures to support complex circuit systems. In contrast, it is relatively unfavorable to apply to complex circuits, but flexible PCBs that are suitable for giving mechanical burnability to circuit boards systems of flexible electronics may have only one side (single layer). Conductive line.
不论是硬质或挠性， 两者皆是使用铜箱 (copper foil) 来制作电路板上所需要的导电 线路。 目前 PCB的主流制作方法是使用减法工艺 ( subtractive process ) , 利用全张完整的 铜箱来形成导电线路。在原始原料铜箱的完整全张面积之中， 除了导电线路以外的所有铜 物质全须移除。 目前， 化学蚀刻 (chemical etching) 是这些移除铜物质的主要手段。  Regardless of whether it is rigid or flexible, both use copper foil to make conductive circuits required on circuit boards. At present, the mainstream manufacturing method of PCB is to use a subtractive process, and use a complete copper box to form a conductive circuit. In the complete full area of the original raw material copper box, all copper materials except conductive lines must be removed. At present, chemical etching is the main method for removing copper.
然而， 当环境保护以及产品制造碳足迹等因素被列入考量时， 目前以化学蚀刻为基础 的主流 PCB减法工艺便难以永续经营。 首先， 蚀刻工艺留下的酸性或碱性化学蚀刻废液 必须利用化学物料进行处理，才能回收其中的高价值铜或其他贵重金属。但是，为了回收， 也会因而产生更多的废液。  However, when factors such as environmental protection and the carbon footprint of product manufacturing are taken into consideration, the current mainstream PCB subtractive process based on chemical etching is difficult to sustainably operate. First, the acidic or alkaline chemical etching waste liquid left by the etching process must be treated with chemical materials in order to recover the high-value copper or other precious metals therein. However, for recycling, more waste liquid is generated as a result.
其次， 这些因处理蚀刻液所产生的化学废液必须再次利用化学方法予以中和， 并经由 复杂的废液处理流程， 才能将废液中的水以及水中的杂质 (化学污泥) 分离。 最后， 这些 分离出来的水， 如果是要回收再利用， 又必须经过另一次耗费成本的处理。 如果是要排放 的话， 亦需要符合法定的排放标准， 也是耗费成本。 另外化学污泥的处理也是耗费成本。  Secondly, these chemical waste liquids generated by the treatment of the etching solution must be neutralized again by chemical methods, and the water in the waste liquid and impurities (chemical sludge) in the water must be separated through a complicated waste liquid treatment process. Finally, if the separated water is to be recycled, it must undergo another costly treatment. If it is to be discharged, it also needs to meet the statutory emission standards, which is also a cost. In addition, the disposal of chemical sludge is also costly.
总言之， 若要符合永续原则， 此些与 PCB 的制造没有直接关联的“次级程序”便必 须计入 PCB 的制作成本。 然而， 许多制造商却将之直接由成本结构中踢除， 其结果， 不 幸的， 便是环境污染。  In short, in order to comply with the principle of sustainability, these “sub-procedures” that are not directly related to the manufacture of the PCB must be included in the manufacturing cost of the PCB. However, many manufacturers have eliminated it directly from the cost structure, and as a result, unfortunately, environmental pollution.
基于上述问题， 本技术领域需要有一种制作具有静电印制导电线路的电路板的方法， 其可实质上完全避免化学废液的产生。 发明内容  Based on the above problems, there is a need in the art for a method for making a circuit board with an electrostatically printed conductive circuit, which can substantially completely avoid the generation of chemical waste liquid. Summary of the invention
因此， 本发明提供一种制作具有静电印制导电线路的电路板的方法， 其简单容易的加 法工艺的本质，可实质上完全避免化学废液的产生。  Therefore, the present invention provides a method for manufacturing a circuit board with electrostatic printed conductive circuits. The essence of the simple and easy addition process can substantially avoid the generation of chemical waste liquid.
为实现上述目的， 本发明提供一种制作具有静电印制导电线路的电路板的方法， 其包 含二步骤阶段。 首先， 于一电性绝缘基材上， 以静电印刷术将含有树酯及导电粉末的原料 粉材 (Toner) 印制形成电路板的该导电线路的复合粉胚 (composite compact) 。 其次， 对 该导电线路的复合粉胚施加能量进行加温， 以烧掉 (Burning) /气化 ( Gasification) 该树 酯， 并烧结 (Sintering) 该导电线路的复合粉胚内的导电粉末， 并将此烧结的导电粉末金 属化 (Metallization) 而形成该导电线路， 其中该树酯将已金属化的该导电线路粘附在该 电性绝缘基材上， 且其中该施加能量未对该电性绝缘基材产生“破坏性”实质加温。 To achieve the above object, the present invention provides a method for manufacturing a circuit board with an electrostatic printed conductive circuit, which includes a two-step phase. First, a material containing a resin and a conductive powder is electrostatically printed on an electrically insulating substrate. Toner Prints a composite compact of the conductive circuit forming the circuit board. Second, apply energy to the composite powder embryo of the conductive circuit to heat it to burn / gasify the resin, and sinter the conductive powder in the composite powder embryo of the conductive circuit, and Metalizing the sintered conductive powder to form the conductive circuit, wherein the resin adheres the metalized conductive circuit to the electrically insulating substrate, and wherein the applied energy does not affect the electrical property. Insulating substrates cause "destructive" substantial heating.
为实现上述目的， 本发明更提供一种制作具有静电印制导电线路的电路板的方法， 其 中对导电线路已塑型突起构造的复合粉胚进行加温所施加的能量为激光， 且其中 (i) 波 长为 700〜 2000nm或 450〜 700nm或 250〜 450nm， 以 700〜 2000nm最佳； (ii) 激光形 式为 (a) 可以为连续波式 (Continue Wave, CW) 或脉冲式 (Pulse) 激光； (b) 激光 的光束轮廓 (beam profile) 可以为高斯 (Gaussian) 或髙顶礼帽 (Tophat) 型； (c) 激 光中心点的移动速度大于 10mm/sec; (d) 用在已塑型突起构造的复合粉胚的激光功率 大于 0.1瓦 (W) ; (e) 如果为脉冲激光：则 (el ) 脉冲宽度 (pulse duration， Pulse width) : 小于 1毫秒 (ms) ; (e2) 最大脉冲能量： 大于 0.01毫焦耳 (mj ) ; (e3 ) 频率： 大 于 10Hz; (f) 由数个激光光束打在复合粉胚上，所形成的光点的中心点所连成的线， 与另 一条同性质的平行线， 其线距不小于 0.03|am。 In order to achieve the above object, the present invention further provides a method for manufacturing a circuit board having an electrostatic printed conductive circuit, wherein the energy applied to heat the composite powder embryo of the conductive circuit that has a molded protrusion structure is a laser, and wherein ( i) The wavelength is 700 ~ 2000nm or 450 ~ 700nm or 250 ~ 450nm, and the best is 700 ~ 2000nm; (ii) The laser form is (a) It can be continuous wave (CW) or pulse laser ; (B) the beam profile of the laser can be Gaussian or Tophat; (c) the moving speed of the center point of the laser is greater than 10mm / sec ; (d) used for shaped protrusions The laser power of the constructed composite powder embryo is greater than 0.1 watts (W); (e) if it is a pulsed laser: then (el) pulse duration (pulse width): less than 1 millisecond (ms); (e2) the maximum pulse energy : More than 0.01 millijoule (mj); (e3) frequency: more than 10Hz; (f) a line formed by the center point of the light spot formed by several laser beams hitting the composite powder embryo, the same as the other The nature of parallel lines, the line spacing is not less than 0.03 | am.
附图说明 BRIEF DESCRIPTION OF THE DRAWINGS
参照附图依据以下说明， 可以更容易于清楚理解本发明上述及其他特征及优点。 附图 之中：  The above and other features and advantages of the present invention can be more clearly understood from the following description with reference to the accompanying drawings. Among the drawings:
图 1的示意图显示依据本发明一实施例， 制作具有静电印制导电线路的电路板的 I与 II阶段程序。  FIG. 1 is a schematic diagram illustrating a stage I and II process of fabricating a circuit board with an electrostatic printed conductive circuit according to an embodiment of the present invention.
图 2显示依据本发明一实施例，使用感光导体以静电印刷术印制电路板的导电线路的 卡尔森循环 ( Carlson Cycle ) 的示意图。  FIG. 2 is a schematic diagram of a Carlson Cycle of a conductive circuit of a printed circuit board by electrostatic printing using a photosensitive conductor according to an embodiment of the present invention.
图 3与图 4分别为复合粉胚经烧结与未烧结的表面呈现性质比较。  Figures 3 and 4 show the comparison of sintered and unsintered surfaces of composite powder embryos.
附图标记说明：  Reference sign description:
102 静电印制装置  102 Electrostatic printing device
104 烧结装置  104 sintering device
110 电路板的不导电空白基材  110 non-conductive blank substrate for circuit board
112 印有导电线路的复合粉胚的电路板基材  112 Circuit board substrate with composite powder embryo printed with conductive lines
122 原料粉材供静电印制导电线路的复合粉胚  122 Raw powder for composite printed embryos for electrostatically printed conductive lines
125 烧结后的导电线路  125 sintered conductive circuit
124 导电线路的复合粉胚  124 composite powder embryo of conductive circuit
130 具完整导电线路的电路板  130 circuit boards with complete conductive lines
201 布电  201 Distribution
202 曝光  202 exposures
203 显影
Figure imgf000005_0001
203 Development
Figure imgf000005_0001
205 刮除残留粉材  205 scraping off residual powder
206 清除残留静电  206 Remove residual static electricity
211 定影 具体实施方式  211 fixing method
图 1的示意图显示依据本发明一实施例， 制作具有静电印制导电线路的电路板的 I与 II阶段程序。 此实施例所例举说明的工艺可分为二主要工艺阶段， S卩， 进行静电印制的工 艺阶段 I， 以及进行粉胚烧结的工艺阶段 II。 依据图 1的示意图， 静电印制阶段 I使用静 电印制装置 102, 而粉胚烧结阶段 II则使用烧结装置 104。  FIG. 1 is a schematic diagram illustrating a stage I and II process of fabricating a circuit board with an electrostatic printed conductive circuit according to an embodiment of the present invention. The process exemplified in this embodiment can be divided into two main process stages, that is, process stage I for performing electrostatic printing, and process stage II for sintering of powder embryos. According to the schematic diagram of FIG. 1, the electrostatic printing device 102 is used in the electrostatic printing stage I, and the sintering device 104 is used in the powder sintering stage II.
应注意的是，于本发明中，静电印刷是指类同于一般广泛应用于影印，激光打印用途， 由卡尔森 (Chester Carlson) 于 US 2,297,691所公开以及后续相关技术所启始的现代自动 化影印技术。相较于现有的静电印刷术。本发明制作具有静电印制导电线路的电路板的技 术所不同者， 在于两者所使用的原料粉材不同， 印制标的定形 (fixing, setting) 的方式不 同。 本发明此些不同特点于图 2中将予说明。  It should be noted that, in the present invention, electrostatic printing refers to modern automated photocopying, which is similar to generally used in photocopying and laser printing, and is disclosed by Chester Carlson in US 2,297,691 and subsequent related technologies. technology. Compared to existing electrostatic printing. The technology of manufacturing circuit boards with electrostatic printed conductive circuits of the present invention is different in that the raw materials and powders used in the two are different, and the methods of printing the fixing, setting are different. These different features of the invention are illustrated in FIG.
依据本发明， 首先， 于静电印制阶段 I中， 静电印制装置 102利用原料粉材供应来源 122, 而在一片具电气绝缘性质的空白基材 110上， 利用静电印刷术， 印制目标电路板所 需要的导电线路。此印制程序所得结果， 即为印有导电线路的复合粉胚 124的阶段电路板 112。  According to the present invention, first, in the electrostatic printing stage I, the electrostatic printing device 102 uses the raw material powder source 122 to print a target circuit on a blank substrate 110 having electrical insulation properties by electrostatic printing. Conductive circuit required by the board. The result of this printing process is the stage circuit board 112 of the composite powder embryo 124 printed with conductive lines.
依据本发明， 原料粉材， 或原始粉材， 是指包含具导电性材料， 如金属材料， 以及树 酯等二种或二种以上粉末的混合粉料，依据本发明可供进行静电印刷以形成导电线路的复 合粉胚。  According to the present invention, the raw material powder or the original powder refers to a mixed powder containing two or more kinds of powders such as conductive materials such as metal materials and resins. According to the present invention, it can be used for electrostatic printing to A composite powder embryo forming a conductive circuit.
此外， 本发明中的复合粉胚是指使用上述本发明的原料粉材， 利用静电印刷术， 而于 电路板的基材上所印制，具有电路板导电线路形状结构的尚未完全定形固化的导电线路胚 体。在利用烧结程序而将此复合胚体定形固化之前， 此胚体由于其内含的树酯而为柔性但 稳固的阶段性结构体。  In addition, the composite powder embryo in the present invention refers to the raw powder material of the present invention, which is printed on the substrate of a circuit board using electrostatic printing, and has not been completely shaped and solidified with a conductive circuit shape structure of the circuit board. Conductive circuit embryo. Before using the sintering procedure to shape and solidify the composite embryo body, the embryo body is a flexible but stable phase structure due to the resin contained therein.
注意到图 1中此工艺阶段电路板 112上所印制的导电线路的复合粉胚 124， 尚未具有 目标电路板的导电线路所应具有的良好导电性质。此是因复合粉胚 124的结构中虽有导电 性材料的粉末， 诸如金属粉末， 但其颗粒之间不但有间隙， 并且混有树酯颗粒。  It is noted that the composite powder embryo 124 of the conductive circuit printed on the circuit board 112 at this process stage in FIG. 1 does not yet have the good conductive properties that the conductive circuit of the target circuit board should have. This is because although the structure of the composite powder embryo 124 has a powder of a conductive material, such as a metal powder, there is not only a gap between the particles, but also resin particles.
因此， 接续阶段 I， 已印好复合粉胚 124的电路板基材 112, 即可送交烧结装置 104, 进行工艺阶段 II的粉胚烧结程序， 以将复合粉胚 124中的导电粉末， 如金属铜粉末颗粒烧 结并金属化形成连续的导电体。完成此烧结程序后， 即可获得具有完整导电线路 125的电 路板 130, 其绝缘基材上的导电线路 125具有良好的导电性。  Therefore, in the subsequent stage I, the circuit board substrate 112 of the composite powder embryo 124 has been printed, and then it can be sent to the sintering device 104 to perform the powder embryo sintering process of the process phase II to transfer the conductive powder in the composite powder embryo 124, The metallic copper powder particles are sintered and metalized to form a continuous electrical conductor. After the sintering process is completed, a circuit board 130 having a complete conductive circuit 125 can be obtained, and the conductive circuit 125 on its insulating substrate has good electrical conductivity.
依据本发明， 此工艺阶段 II的粉胚烧结程序， 其进行烧结的能量来源可以为激光， 其 波长可为 700〜 2000nm或 450〜 700nm或 250〜 450nm， 以 700〜 2000nm为最佳。 其中激 光形式可以为连续波式或脉冲式激光， 而激光的光束轮廓可以为高斯或髙顶礼帽型， 激光 中心点的移动速度则大于 10mm/sec。 此用在导电线路的复合粉胚的激光功率大于 0.1W。 According to the present invention, in the powder sintering procedure of the process stage II, the energy source for sintering may be a laser, and its wavelength may be 700 to 2000 nm or 450 to 700 nm or 250 to 450 nm, with 700 to 2000 nm being the best. Which stimulate The light form can be a continuous wave or pulsed laser, while the beam profile of the laser can be Gaussian or cymbal top hat, and the moving speed of the laser center point is greater than 10mm / sec. The laser power of the composite powder embryo used in conductive circuits is greater than 0.1W.
若激光为脉冲激光， 则脉冲宽度应小于 lms， 最大脉冲能量应大于 O.Olmj， 其频率则 大于 10Hz。 若由数个激光光束打在复合粉胚上， 其所形成的光点的中心点所连成的线， 与另一条同性质的平行线， 其线距应不小于于 0.03|am。  If the laser is a pulsed laser, the pulse width should be less than lms, the maximum pulse energy should be greater than O.Olmj, and its frequency should be greater than 10Hz. If several laser beams are hit on the composite powder embryo, the line formed by the center points of the light spots formed by it and another parallel line of the same nature shall have a line spacing of not less than 0.03 | am.
依据本发明，此工艺阶段 II的粉胚烧结程序， 其进行烧结的能量来源亦可为感应加热 (induction heating) ， 其可在复合粉胚金属性质导电材料中激发渦电， 发热而进行烧结。  According to the present invention, the powder sintering procedure of this process stage II can also be performed by induction heating, which can induce eddy current in the composite powder sintered metal conductive material to generate heat and sinter.
依据本发明，此工艺阶段 II的粉胚烧结程序， 其进行烧结的能量来源亦可为等离子体 (Plasma beam) 。  According to the present invention, in the powder sintering procedure of the process stage II, the energy source for sintering can also be plasma (Plasma beam).
依据本发明， 此工艺阶段 II 的粉胚烧结程序， 其进行烧结的能量来源亦可为离子束 According to the present invention, in the powder sintering procedure of the process stage II, the energy source for sintering can also be an ion beam.
(Ion beam) 。 (Ion beam).
图 2 显示依据本发明一实施例， 使用感光导体 (photoconductor) 以静电印刷术印制 电路板的导电线路的复合粉胚时的卡尔森循环的示意图。  FIG. 2 shows a schematic diagram of a Carlson cycle when a composite powder embryo of a conductive circuit of a circuit board is printed by electrostatic printing using a photoconductor according to an embodiment of the present invention.
同时参考图 1，依据此实施例，目标电路板的导电线路 (图 1中的最终烧结导电线 125 ) 的线路图形， 经由静电印制装置 102的光学***对感光导体 200进行布电,以便在此循环 的第一区 201形成布电区。 如同习于静电印刷术者所可理解， 感光导体 200的布电区 201 接着便顺着图示顺时钟方向旋转前进， 并经过可以形成线路潜像的光束 202照射后， 其光 敏物质层表面便产生于 203处可对应形成复合粉胚线路的电荷区。  Referring to FIG. 1 at the same time, according to this embodiment, the conductive pattern of the target circuit board (the final sintered conductive wire 125 in FIG. 1) is routed to the photosensitive conductor 200 via the optical system of the electrostatic printing device 102 so The first region 201 of this cycle forms a power distribution region. As can be understood by those skilled in electrostatic printing, the electrical distribution region 201 of the photoconductor 200 then rotates clockwise in the direction shown in the figure, and is illuminated by the light beam 202 that can form a latent image of the circuit. Generated at 203 can correspond to the area of charge forming a composite powder embryo circuit.
接着， 感光导体 200持续旋转， 以使原料粉材 122所供应的粉末， 因静电而吸附在感 光导体上， 光敏物质层表面所产生的对应于导电线路形状的电荷区。 当感光导体上所吸附 的复合粉胚前进到 204的转写区位置时， 由于转写区提供相反于感光导体的电压， 使得感 光导体上所吸附的粉末被移转附着在不导电基材 110 上， 形成印有导电线路的复合粉胚 124的电路板基材 112。  Then, the photosensitive conductor 200 is continuously rotated, so that the powder supplied by the raw material powder material 122 is adsorbed on the photosensitive conductor due to static electricity, and the surface of the photosensitive material layer generates a charge region corresponding to the shape of the conductive line. When the composite powder embryo adsorbed on the photoconductor advances to the position of the transfer region of 204, because the transfer region provides a voltage opposite to the photoconductor, the powder adsorbed on the photoconductor is transferred and attached to the non-conductive substrate 110 On the circuit board substrate 112 is formed a composite powder embryo 124 printed with conductive lines.
其后， 电路板基材 112依图 2所示基材行进相向持续前进， 其上所印的导电线路复合 粉胚 124便在 211位置之处进行定影。其可利用定影***的滚轮，适当地加温及施加压力， 使复合粉胚 124稳固地附着在基材 112表面。  Thereafter, the substrate 112 of the circuit board continues to advance toward the substrate as shown in FIG. 2, and the conductive circuit composite powder embryo 124 printed thereon is fixed at the position 211. It can use the rollers of the fixing system to appropriately heat and apply pressure to make the composite powder embryo 124 firmly adhere to the surface of the substrate 112.
接着， 印有导电线路的复合粉胚 124的电路板基材 112, 其复合粉胚经过外加的能量 或热量处理， 以将复合粉胚中所内含的树酯气化或烧掉， 所留下的导电材料因烧结而金属 化形成导电线路 ( 125 ) ， 并完成制作具完整导电线路的电路板 130。  Next, the circuit board substrate 112 of the composite powder embryo 124 printed with the conductive circuit is subjected to additional energy or heat treatment to vaporize or burn the resin contained in the composite powder embryo. The underlying conductive material is metallized to form a conductive line (125) due to sintering, and a circuit board 130 with a complete conductive line is completed.
注意到在前述说明性质的实施例中， 其制作程序可用于制作， 例如， 柔性电路板 (flexible circuit board) 。 虽然此例中所制作的电路板只有单面导电线路， 然本领域技术 人员皆可理解， 只需重复实质上相同的程序， 此实施例同样亦可适于制作具有双面导电线 路的电路板。  It is noted that in the foregoing illustrative embodiment, the manufacturing procedure may be used for manufacturing, for example, a flexible circuit board. Although the circuit board produced in this example only has single-sided conductive circuits, those skilled in the art can understand that by repeating substantially the same procedure, this embodiment is also suitable for making circuit boards with double-sided conductive circuits. .
并且， 类同于现有彩色印表机里面四个碳粉匣原理， 在不同粉匣内放置具有不同电导 率 ( electrical conductivity )的导电材料的原始粉材， 经过打印与烧结 /金属化程序， 即可同 一片薄膜基材上制作具有不同导电性能局部线路的电路板。 In addition, similar to the principle of the four toner cartridges in existing color printers, the original powders of conductive materials with different electrical conductivity are placed in different toner cartridges, and after printing and sintering / metallization procedures, Can be the same A piece of film substrate is used to make a circuit board with local circuits of different conductive properties.
依据本发明， 感光导体 (图 2, 200) 其结构具有以下特性：  According to the present invention, the structure of the photoconductor (Fig. 2, 200) has the following characteristics:
(i) 所使用的感光导体， 其基材可以为刚性柱型或非刚性软式薄膜型。  (i) The substrate of the photoconductor used may be a rigid pillar type or a non-rigid soft film type.
(ii) 所使用的感光导体， 可以为无机或有机系列的感光导体。  (ii) The photoconductor used can be an inorganic or organic series.
(iii) 若使用的为无机系列感光导体， 其可为非晶硅感光导体， 若为有机系列感光导 体， 则可为单层或单层以上的有机感光导体。  (iii) If an inorganic series photoconductor is used, it may be an amorphous silicon photoconductor, and if it is an organic series photoconductor, it may be a single-layer or more than one-layer organic photoconductor.
(iv) 感光导体使用的基材， 其原料可以为金属或高分子类聚合物。  (iv) The base material used for the photoconductor may be made of a metal or a polymer.
(v) 感光导体的表面粗糙度 Rz值不大于 10|am。 (v) The surface roughness Rz of the photoconductor is not more than 10 | am.
(vi) 使用的刚性柱型感光导体， 如果是为圆柱型感光导体， 则  (vi) the rigid cylindrical photoconductor used, if it is a cylindrical photoconductor, then
(vi-1) 测量其包含粘合在基材的齿轮的偏摆时， 其值不大于 400|am。  (vi-1) When the deflection of the gear including the substrate is measured, the value is not more than 400 | am.
(vi-2) 测量其不包含粘合在基材的齿轮的偏摆时， 其值不大于 200|am。  (vi-2) When measuring the deflection of the gear which is not bonded to the substrate, the value is not more than 200 | am.
(vi-3) 不包含粘合在基材的齿轮， 直立的圆柱型感光导体， 其上下二端在感光层 内距离感光层边缘 1.5-3mm的任意两个点的感光层膜厚， 二者差异不大于 15|am。  (vi-3) The upright cylindrical photosensitive conductors, which do not include gears bonded to the substrate, whose upper and lower ends are within the photosensitive layer at any two points 1.5 to 3 mm away from the edges of the photosensitive layer. The difference is not more than 15 | am.
(vi-4) 非定型薄膜型感光导体其上下或左右二端在感光层内距离感光层边缘 1.5-3mm的任意两个点的感光层膜厚， 二者差异不大于 15|am。 (vi-4) The thickness of the photosensitive layer of the non-shaped thin-film photosensitive conductor at any two points 1.5 to 3 mm from the edge of the photosensitive layer in the photosensitive layer between the upper and lower or left and right ends, the difference between the two is not more than 15 |
(vii) 若使用有机系列感光导体， 则  (vii) If organic series photoconductors are used, then
(vii-1) 其使用的电荷产生剂 (Charge generation material， CGM) 为有机或有机金 属颜料或染料的电荷产生剂， 例如酞氰颜料。  (vii-1) The charge generation agent (CGM) used is a charge generator for organic or organic metal pigments or dyes, such as phthalocyanine pigments.
(vii-2) 其使用的可传输正型载子物质 (Hole transport material， HTM)可以为腙化 合物、 苯乙烯化合物、 二胺化合物、 丁二烯化合物、 吲哚化合物等单独或经适当组合后混 合使用。  (vii-2) The transportable positive carrier material (HTM) used may be a fluorene compound, a styrene compound, a diamine compound, a butadiene compound, an indole compound, etc. alone or after an appropriate combination Mixed use.
(vii- 3) 其使用的可传输负型载子 (Electron transport material, ETM) 可以为苯醌衍 生物、 菲醌衍生物、 芪醌衍生物、 二氮醌衍生物， 这些可单独或 2种以上组合使用。  (vii- 3) The transportable negative carrier (ETM) used may be a benzoquinone derivative, a phenanthrenequinone derivative, a stilbenequinone derivative, or a diazaquinone derivative, and these may be used alone or in two types Use in combination.
(vii-4) 其使用的粘结剂 (Binder) 可以为苯乙烯系聚合物或苯乙烯与其他系列单体 的共聚物。 丙烯酸系聚合物、 聚乙烯或乙烯与其他系列单体的共聚物、 聚氯乙烯、 氯化乙 稀与其他系列单体的共聚物， 聚丙烯或丙烯与其他系列单体的共聚物， 聚酯或聚酯与其他 系列单体的共聚物， 聚醇酸树脂、 聚酰胺、 聚氨酯、 聚碳酸树酯或碳酸与其他系列单体的 共聚物， 聚芳酯、 聚砜、 邻苯二甲酸二烯丙基树酯、 聚酮树酯、 聚乙烯醇缩丁醛树酯、 含 丙烯腈树酯和聚醚树酯等热塑性树酯； 或者硅酮树脂、 环氧树脂、 酚醛树脂、 脲树脂、 三 聚氰胺树脂和其他交联性热固性树脂； 或者环氧丙烯酸酯和聚氨酯-丙烯酸酯等光固化性 树脂等。 这些粘结剂可以单独使用， 或合并二种或二种以上使用。  (vii-4) The binder used may be a styrene polymer or a copolymer of styrene and other monomers. Acrylic polymers, copolymers of polyethylene or ethylene with other monomers, polyvinyl chloride, copolymers of vinyl chloride with other monomers, copolymers of polypropylene or propylene with other monomers, polyester Or copolymers of polyester and other series of monomers, polyalkyd resins, polyamides, polyurethanes, polycarbonates or copolymers of carbonic acid and other series of monomers, polyarylates, polysulfones, phthalates Thermoplastic resins such as propyl resin, polyketide resin, polyvinyl butyral resin, acrylonitrile resin and polyether resin; or silicone resin, epoxy resin, phenolic resin, urea resin, melamine Resins and other crosslinkable thermosetting resins; or photocurable resins such as epoxy acrylates and polyurethane-acrylates. These binders can be used alone or in combination of two or more.
依据本发明， 感光导体 (图 2, 200) 其操作可具有以下特性：  According to the present invention, the operation of the photoconductor (Fig. 2, 200) can have the following characteristics:
(viii) 感光导体在印表机里， 其运转过程  (viii) The operation of the photoconductor in the printer
(viii-1) 运转的最小线速度 (line speed) ， 不小于 0.05mm/sec。  (viii-1) The minimum line speed of operation is not less than 0.05mm / sec.
(viii-2) 依循图 2的 Chester Carlson循环六步骤，其感光导体表面布电电压 (charge) 范围较佳是 ± 150〜 990V， 更佳为 ±200〜 750V; 最佳为 ±200〜 650V。 (viii-2) Follow the six steps of Chester Carlson cycle shown in Figure 2. The range is preferably ± 150 ~ 990V, more preferably ± 200 ~ 750V; most preferably ± 200 ~ 650V.
(viii-3) 感光导体布电再经过光源曝光 (exposure)，感光导体在显影 (Developing) 前的感光导体表面电压大于 +2V或小于 -2V。  (viii-3) The photoconductor is electrically charged and then exposed to the light source. The photoconductor surface voltage before the photoconductor is developed is greater than + 2V or less than -2V.
(viii-4) 印表机对感光导体的布电***可以是布电滚轮 (charging roller)或者布电 丝 (corona charging wire) ***。  (viii-4) The printer's electrical distribution system for the photoconductor can be a charging roller or a corona charging wire system.
(viii-5) 印表机对感光导体的曝光***的光源可以是激光或发光二极管 (LED) 。 (viii-6) 如果必须对原料粉材布电， 其布电电压为 -500〜 -100V或 +500〜 +100V。 (viii-7) 印表机在定影阶段， 将复合粉胚的树酯加热至融熔状态， 同时将融熔的树 酯压着在基材上面,此时的复合粉胚与不导电空白基材会因凡得瓦力而彼此吸附并形成线 路。  (viii-5) The light source of the printer's exposure system to the photoconductor can be a laser or a light emitting diode (LED). (viii-6) If it is necessary to distribute the raw material powder, its distribution voltage is -500 ~ -100V or + 500 ~ + 100V. (viii-7) In the fixing stage of the printer, the resin of the composite powder embryo is heated to a molten state, and the molten resin is pressed against the substrate at the same time. At this time, the composite powder embryo and the non-conductive blank substrate Materials will attract each other due to van der Waals and form lines.
依据本发明， 搭配感光导体 (图 2, 200)所使用的原料粉材 (图 1， 122) 可具有以 下特性：  According to the present invention, the raw material powder (Figure 1, 122) used with the photosensitive conductor (Figure 2, 200) can have the following characteristics:
(i) 粒径为 0.05〜 100|am， 更佳为 l~50|am， 最佳为 10~35|am (i) The particle size is 0.05 to 100 | am, more preferably l to 50 | am, and most preferably 10 to 35 | am
(ii) 电阻率 (Resistivity) 大于 1.0X 10-4 Q m (ii) Resistivity greater than 1.0X 10-4 Q m
(iii) 外观为不规则状，片状或球形皆可。  (iii) Appearance is irregular, flake or spherical.
(iv) 至少含有一种或一种以上的粘合剂。  (iv) contain at least one or more binders.
依据本发明， 原料粉材中的导电粉末成分可有以下特性：  According to the present invention, the conductive powder component in the raw material powder can have the following characteristics:
(i) 粒径： 0.05~30|am, 以 5~15|am最佳。 (i) Particle size: 0.05 ~ 30 | am, preferably 5 ~ 15 | am.
(ii) 电阻率： 小于 l_0X 10-4 Q m (ii) Resistivity: less than l_0X 10-4 Q m
(iii) 外观为不规则状，片状或球形皆可。  (iii) Appearance is irregular, flake or spherical.
依据本发明， 原料粉材中的粘合剂 (Binder) 成分可有以下特性：  According to the present invention, the binder component in the raw material powder can have the following characteristics:
(i) 软化点 ( softening point) : 大于 70°C , (i) Softening point: more than 70 ° C,
(ii) 玻璃转移温度 (Glass Transition Temperature, Tg) 大于 40°C (ii) Glass Transition Temperature (Tg) is greater than 40 ° C
(iii) 可以为热塑型树酯，例如聚酯树酯,亚克力树酯或亚克力与苯乙烯的共聚物。 (iii) It may be a thermoplastic resin such as a polyester resin, an acrylic resin or a copolymer of acrylic and styrene.
(iv) 可以为热固形树酯，例如酚醛树酯。 (iv) It may be a thermosetting resin, such as a phenolic resin.
(v) 可以为光固化型树酯，例如环氧丙烯酸酯。  (v) It may be a photocurable resin, such as an epoxy acrylate.
依据本发明， 原料粉材中导电粉末与粘合剂比例为：  According to the present invention, the ratio of the conductive powder to the binder in the raw material powder is:
导电粉末 /粘合剂 = 1/9〜 9/1，  Conductive powder / adhesive = 1/9 ~ 9/1,
较佳： 1/4〜 4/1。  Better: 1/4 ~ 4/1.
最佳： 1/2〜 2/1。  Best: 1/2 ~ 2/1.
亦即， 导电粉末重量占整体粉材重量的 10%-90%。  That is, the weight of the conductive powder accounts for 10% -90% of the weight of the entire powder material.
较佳： 20~80%。  Better: 20 ~ 80%.
最佳： 35~65%。  Best: 35 ~ 65%.
[实验 I]  [Experiment I]
I. 工艺阶段 I: 静电印制 1. 制做成像用的非导电性原料粉材 (non-conductive powdered toner) : I. Process Phase I: Electrostatic Printing 1. Making non-conductive powdered toner for imaging:
(i) 用甲乙酮 ( Methyl Ethyl Ketone, MEK) 溶解树酯 (此处使用的是聚酯树酯， Polyester resin DIACRONL FC- 1565 ) , 所得到的树酯溶液， 其固含量为 25%。  (i) Methyl Ethyl Ketone (MEK) was used to dissolve the resin (polyester resin, DIACRONL FC-1565 was used here). The obtained resin solution had a solid content of 25%.
(ii) 将具导电性的粉材 (此处使用的是铜粉) 倒入装有上述 MEK溶液的 500ml烧 杯之中。 铜粉使用的重量是 MEK溶液里的树酯含量的二倍。 铜粉倒入 MEK溶液之后， 利用均质机强力分散， 此时烧杯外部必须用 4-10°C低温的水降温。 (ii) Pour the conductive powder (copper powder used here) into a 500ml beaker containing the above MEK solution. Copper powder uses twice as much resin as the MEK solution. After the copper powder is poured into the MEK solution, it is strongly dispersed using a homogenizer. At this time, the outside of the beaker must be cooled with 4-10 ° C low-temperature water.
(iii) 均质机分散 30分钟之后，将此分散过的含铜粉溶液，利用搅拌机持续搅拌分散， 并且让 MEK挥发， 直到整个溶液的固含量大于 60%之后， 停止搅拌。  (iii) After the homogenizer is dispersed for 30 minutes, the dispersed copper-containing powder solution is continuously stirred and dispersed with a stirrer, and the MEK is volatilized until the solid content of the entire solution is greater than 60%, and the stirring is stopped.
(iv) 将 (iii)的溶液倒入一个面积约 20cmx30cm， 高度约 3-5cm的不锈钢盘中， 并放 入 45-50 °C的烘箱之内干燥 6小时。之后，再用 70-75 °C连续干燥 20小时以上后，取出冷却。 (iv) Pour the solution of (iii) into a stainless steel dish with an area of about 20 cm x 30 cm and a height of about 3-5 cm, and put it in an oven at 45-50 ° C to dry for 6 hours. After that, it is continuously dried at 70-75 ° C for more than 20 hours, and then taken out and cooled.
(v) 将 (iv)冷却后的固体， 利用粉碎机粉碎， 所得的细粉即为成像用的非导电性原料 粉材。  (v) The solid after cooling (iv) is pulverized by a pulverizer, and the obtained fine powder is a non-conductive raw material powder for imaging.
2. 利用静电成像方法印制导电线路的复合粉胚：  2. Composite powder embryo with conductive circuit printed by electrostatic imaging method:
(i) 将原料粉材倒入 AM30印表机 (Avision生产) 的碳粉匣内， 打印时， 感光导 体 (由 Green Rich Technology Co. 生产的有机感光鼓) 的布电电压为 +600〜 +650V。  (i) The raw material powder is poured into the toner cartridge of AM30 printer (manufactured by Avision), and the printing voltage of the photoconductor (organic photoconductor drum manufactured by Green Rich Technology Co.) during printing is + 600 ~ + 650V.
(ii) 印表机布电后的感光导体，经过激光照射曝光之后，其表面电压为 +70〜 +150V。 (ii) After the printer is powered, the surface voltage of the photoconductor after exposure to laser light is + 70 ~ + 150V.
(iii) 使用厚度为 50|am的聚酰亚胺薄膜 (Polyimide Film, PI 薄膜) 做为印制用的 不导电空白基材， 将上述的非导电性原料粉材成像在此薄膜上， 而形成具有用复合粉胚印 制的导电线路的电路板基材。 (iii) using a polyimide film (PI film) with a thickness of 50 | am as a non-conductive blank substrate for printing, and imaging the above non-conductive raw material powder on this film, and A circuit board substrate having a conductive circuit printed with a composite powder embryo is formed.
II. 工艺阶段 II: 粉胚烧结  II. Process Phase II: Sintering of powder embryos
将前述工艺阶段 I所得， 其表面上具有利用原料粉材印制成形， 尚未具导电性的复合 粉胚的 PI薄膜， 利用激光进行复合粉胚的高温烧结处理。 本实验是利用激光的高温， 瞬 间将粉胚中的树酯气化或燃烧掉，并且同时将导电铜粉烧结并金属化成具通体导电性的结 构体。 程序中利用改变激光的移动速度及能量等， 使得垂直的烧结深度， 得以被控制： The PI film obtained from the foregoing process stage I has a composite powder embryo printed on the surface with a raw powder material and not yet conductive, and a high-temperature sintering treatment of the composite powder embryo by laser. In this experiment, the high temperature of the laser is used to instantaneously vaporize or burn the resin in the powder embryo, and at the same time, sinter and metalize the conductive copper powder into a structure with overall conductivity. In the program, the moving speed and energy of the laser are changed, so that the vertical sintering depth can be controlled:
(i) 使用光源为波长 1064nm的脉冲激光； (i) Use a pulsed laser source with a wavelength of 1064 nm;
(ii) 激光中心点的移动速度大于 50mm/sec;  (ii) the moving speed of the laser center point is greater than 50mm / sec;
(iii) 使用的激光功率大于 0.5W；  (iii) the laser power used is greater than 0.5W;
(iv) 脉冲宽度小于 0.5ms， 最大脉冲能量大于 0.05mj ;  (iv) The pulse width is less than 0.5ms, and the maximum pulse energy is greater than 0.05mj;
(v) 由数个激光光束打在复合粉胚目标物上，因脉冲激光烧结所形成的光点的中心点 所连成的线， 与另一条同性质的平行线， 其线距不小于于 0.03|am。  (v) The line connected by the center point of the light spot formed by the pulsed laser sintering by several laser beams on the composite powder embryo target, and another parallel line of the same nature, the line spacing is not less than 0.03 | am.
(vi) 频率大于 10Hz.  (vi) The frequency is greater than 10Hz.
III. 实验结果  III. Experimental results
(i) 图 3与图 4分别为复合粉胚经烧结与未烧结的表面呈现性质比较。可以发现图右 边经过烧结之后的表面， 导电粉末明显的已经结成块状。 而左边未烧结部分， 其导电粉末 仍然处于分散状态。 (ii) 简单的测试方法是利用三用电表测量烧结是否成功。 测量左边的电阻值， 发现 其为绝缘状态， 而右边已烧结的部分则可以导通， 其电阻值为 6-35 Q。 因此可以判断经过 高温的烧结， 导电粉已经烧结成块并且金属化成为通体导电性的导体。 (i) Figures 3 and 4 show the comparison of the properties of the composite powder embryos on the sintered and unsintered surfaces. It can be found that after sintering on the right side of the figure, the conductive powder has obviously formed a block. In the unsintered part on the left, the conductive powder is still in a dispersed state. (ii) A simple test method is to use a trimeter to measure the success of sintering. Measure the resistance value on the left and find that it is insulated, while the sintered part on the right can be turned on, and its resistance value is 6-35 Q. Therefore, it can be judged that after high-temperature sintering, the conductive powder has been sintered into agglomerates and metalized to become a conductive body conductor.
本发明配合附图以优选实施例公开说明如上， 然其并非用以限定本发明。 任何本领 域技术人员， 在不脱离本发明精神范围的情况下， 当可进行各类变动与变化， 因此本发明 的保护范围当以权利要求所界定者为准。  The present invention has been disclosed and described in the preferred embodiments with reference to the accompanying drawings, but it is not intended to limit the present invention. Any person skilled in the art can make various changes and changes without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be defined by the claims.

Claims

权利要求 Rights request
1. 一种制作具有静电印制导电线路的电路板的方法， 其包含  1. A method for making a circuit board with electrostatic printed conductive lines, comprising:
(i) 于一电性绝缘基材上，以静电印刷术将含有树酯及导电粉末的原料粉材印制形 成电路板的该导电线路的复合粉胚； 与  (i) printing a composite powder embryo of the conductive circuit of a circuit board by electrostatic printing on a electrically insulating substrate to form a raw material powder containing a resin and a conductive powder; and
(ii) 对该导电线路的复合粉胚施加能量进行加温， 以便气化 /燃烧该树酯， 并烧结 该导电线路的复合粉胚内的导电粉末，而经烧结金属化形成该导电线路，其中该已金属化 的该导电线路将粘附在其底下未烧结的复合粉胚的树酯上，并且树酯粘附在该电性绝缘基 材上， 且其中该施加能量未对该电性绝缘基材产生破坏性实质加温。  (ii) applying energy to the composite powder embryo of the conductive circuit for heating to vaporize / burn the resin, and sintering the conductive powder in the composite powder embryo of the conductive circuit, and sintering metallization to form the conductive circuit, Wherein, the metalized conductive line will adhere to the resin of the unsintered composite powder embryo underneath, and the resin adheres to the electrically insulating substrate, and wherein the applied energy does not Insulating substrates cause destructive substantial heating.
2. 如权利要求 1所述的方法， 其中的对导电线路的复合粉胚进行加温所施加的能量 方式为激光， 且其中  2. The method according to claim 1, wherein the energy mode for heating the composite powder embryo of the conductive circuit is a laser, and wherein
(i) 波长为 700〜 2000nm或 450〜 700nm或 250〜 450nm， 以 700〜 2000nm最佳； (i) The wavelength is 700 ~ 2000nm or 450 ~ 700nm or 250 ~ 450nm, preferably 700 ~ 2000nm;
(ii) 激光形式为 (ii) the laser form is
(a) 可以为连续波式或脉冲式激光； 或  (a) may be a continuous wave or pulsed laser; or
(b) 激光的光束轮廓可以为高斯或髙顶礼帽型； 或  (b) the beam profile of the laser can be Gaussian or cypress top hat; or
(c) 激光中心点的移动速度大于 10mm/sec; 或  (c) the moving speed of the laser center point is greater than 10mm / sec; or
(d) 用在导电线路的复合粉胚的激光功率大于 0.1W; 或  (d) the laser power of the composite powder embryo used in conductive lines is greater than 0.1W; or
(e) 若激光为脉冲激光：  (e) If the laser is a pulsed laser:
(el) 脉冲宽度小于 1ms; 或  (el) pulse width is less than 1ms; or
(e2) 最大脉冲能量大于 O.Olmj ; 或  (e2) the maximum pulse energy is greater than O.Olmj; or
(e3) 频率： 大于 10Hz；  (e3) frequency: greater than 10Hz;
(f) 由数个激光光束打在复合粉胚上，所形成的光点的中心点所连成的线，与另一 条同性质的平行线， 其线距不小于 0.03|am。  (f) The line formed by the center points of the light spots formed by several laser beams hitting the composite powder embryo is parallel to another parallel line of the same nature, and the line spacing is not less than 0.03 | am.
3. 如权利要求 1所述的方法， 其中的对导电线路的复合粉胚进行加温所施加的能量 方式为感应加热。  3. The method according to claim 1, wherein the energy applied to the composite powder embryo of the conductive circuit is induction heating.
4. 如权利要求 1所述的方法， 其中的对导电线路的复合粉胚进行加温所施加的能量 方式为等离子体。  4. The method according to claim 1, wherein the energy applied to the composite powder embryo of the conductive circuit is plasma.
5. 如权利要求 1所述的方法， 其中的对导电线路的复合粉胚进行加温所施加的能量 方式为离子束。  5. The method according to claim 1, wherein an energy method for heating the composite powder embryo of the conductive circuit is an ion beam.
6. 如权利要求 1所述的方法， 其中感光导体的表面粗糙度 Rz值不大于 l(Vm。 6. The method according to claim 1, wherein the surface roughness Rz value of the photoconductor is not greater than l (Vm.
7. 如权利要求 1所述的方法， 其中使用的圆柱型感光导体， 测量其包含粘合在基材 的齿轮的偏摆时， 其值不大于 400|am。 7. The method according to claim 1, wherein when the cylindrical type photoconductor is used and its deflection including a gear adhered to the substrate is measured, its value is not greater than 400 | am.
8. 如权利要求 1所述的方法， 其中使用的圆柱型感光导体， 测量其不包含粘合在基 材的齿轮的偏摆时， 其值不大于 200|am。  8. The method according to claim 1, wherein when the cylindrical photosensitive conductor is used, the value does not exceed 200 | am when the deflection of the gear which is adhered to the base material is measured.
9. 如权利要求 1所述的方法， 其中不包含粘合在基材的齿轮， 直立的圆柱型感光导 体， 其上下二端在感光层内距离感光层边缘 1.5-3mm的任意两个点的感光层膜厚， 二者 差异不大于 15|am。 9. The method according to claim 1, which does not include a gear adhered to the substrate, an upright cylindrical photoconductor, and the upper and lower ends of the photoconductor are 1.5 to 3 mm from any two points of the edge of the photoconductor layer. Film thickness of photosensitive layer, both The difference is not more than 15 | am.
10. 如权利要求 1所述的方法，其中非定型薄膜型感光导体其上下或左右二端在感光 层内距离感光层边缘 1.5-3mm的任意两个点的感光层膜厚， 二者差异不大于 15|am。  10. The method according to claim 1, wherein the film thickness of the photosensitive layer of the non-shaped thin film type photoconductor is 1.5 to 3 mm from the edge of the photosensitive layer at any two points in the photosensitive layer, and the difference is not different Greater than 15 | am.
11. 如权利要求 1所述的方法， 其中感光导体在印表机里， 其运转过程的最小线速度 不小于 0.05mm/seco 11. The method as claimed in claim 1, wherein a photoconductor in the printer, the minimum line speed during operation which is not less than 0.05mm / sec o
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