WO2019228277A1 - 线路板和电连接组件 - Google Patents

线路板和电连接组件 Download PDF

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Publication number
WO2019228277A1
WO2019228277A1 PCT/CN2019/088391 CN2019088391W WO2019228277A1 WO 2019228277 A1 WO2019228277 A1 WO 2019228277A1 CN 2019088391 W CN2019088391 W CN 2019088391W WO 2019228277 A1 WO2019228277 A1 WO 2019228277A1
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WO
WIPO (PCT)
Prior art keywords
pads
wiring
pad
circuit board
signal
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Application number
PCT/CN2019/088391
Other languages
English (en)
French (fr)
Inventor
倪敏迪
Original Assignee
凡甲电子(苏州)有限公司
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Publication of WO2019228277A1 publication Critical patent/WO2019228277A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
    • H01B7/29—Protection against damage caused by extremes of temperature or by flame
    • H01B7/295—Protection against damage caused by extremes of temperature or by flame using material resistant to flame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B11/00—Communication cables or conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B11/00—Communication cables or conductors
    • H01B11/18—Coaxial cables; Analogous cables having more than one inner conductor within a common outer conductor
    • H01B11/20—Cables having a multiplicity of coaxial lines
    • H01B11/203—Cables having a multiplicity of coaxial lines forming a flat arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/0054—Cables with incorporated electric resistances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • H01B7/0208—Cables with several layers of insulating material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • H01B7/0208—Cables with several layers of insulating material
    • H01B7/0225—Three or more layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • H01B7/0241—Disposition of insulation comprising one or more helical wrapped layers of insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/04—Flexible cables, conductors, or cords, e.g. trailing cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/08—Flat or ribbon cables
    • H01B7/0823—Parallel wires, incorporated in a flat insulating profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/08—Flat or ribbon cables
    • H01B7/0853—Juxtaposed parallel wires, fixed to each other without a support layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/08—Flat or ribbon cables
    • H01B7/0861—Flat or ribbon cables comprising one or more screens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
    • H01B7/18—Protection against damage caused by wear, mechanical force or pressure; Sheaths; Armouring
    • H01B7/20—Metal tubes, e.g. lead sheaths
    • H01B7/205—Metal tubes, e.g. lead sheaths composed of aluminium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
    • H01B7/18—Protection against damage caused by wear, mechanical force or pressure; Sheaths; Armouring
    • H01B7/22—Metal wires or tapes, e.g. made of steel
    • H01B7/226—Helicoidally wound metal wires or tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
    • H01B7/18—Protection against damage caused by wear, mechanical force or pressure; Sheaths; Armouring
    • H01B7/22—Metal wires or tapes, e.g. made of steel
    • H01B7/228—Metal braid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/53—Fixed connections for rigid printed circuits or like structures connecting to cables except for flat or ribbon cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09027—Non-rectangular flat PCB, e.g. circular
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10356—Cables

Definitions

  • the present invention relates to the technical field of electrical connections, and in particular, to a circuit board and an electrical connection assembly that can improve signal transmission or processing efficiency.
  • the circuit board is usually disposed in an electronic device to perform soldering and electrical connection of electronic components.
  • there are several gold fingers or pads on the circuit board and there is a wiring design that is electrically connected to the gold fingers or pads inside the circuit board.
  • the gold fingers or pads are soldered to the electrical connectors or wires.
  • signal transmission or processing is easily interfered and the processing efficiency is low.
  • An object of the present invention is to provide a circuit board and an electrical connection assembly that can improve signal transmission or processing efficiency.
  • the present invention provides a circuit board, the circuit board includes: a substrate having a soldering area and a wiring area connected to the soldering area; a circuit structure provided on the substrate, the circuit structure having A bonding pad provided on a soldering area of a substrate to connect a wire, and a conductive line provided on the bonding pad and a wiring area and electrically connecting the bonding pads; wherein the bonding pads are arranged side by side, In the cloth direction, the wiring pad has at least two ground pads for connecting a ground line and a signal pad provided between the two ground pads.
  • only two of the signal pads are provided between two adjacent ground pads, and two of the signal pads provided between two adjacent ground pads are provided.
  • the signal pads constitute a signal pad group for transmitting differential signals.
  • the wiring pad has only a ground pad and a signal pad group, and the number of the ground pads is one more than the number of the signal pad group.
  • the wiring pads located at the two edges are ground pads, and there is a group of the signal bonding pads between each adjacent two ground pads. Plate group.
  • the number of the signal pads is twice the number of the ground pads.
  • the signal pads are also disposed outside the ground pads, and in the arrangement direction of the wiring pads, the wiring pads located on both edges are signal pads.
  • the number of the ground pads is one more than the number of the signal pads.
  • the wiring pad has a width extending in an arrangement direction thereof and a length extending in a direction perpendicular to the arrangement direction, and the length of the wiring pad is less than 1.5 mm.
  • a width of each of the wiring pads in an arrangement direction thereof is less than 0.28 mm; a distance between two adjacent wiring pads is not less than 0.13 mm.
  • the wiring pads are arranged at equal intervals in the arrangement direction thereof, and the center distance between adjacent wiring pads is between 0.30 mm and 0.42 mm.
  • the soldering area and the wiring area are disposed adjacent to each other in the length direction of the wiring pad; in the length direction of the wiring pad, the wiring pad has a first edge close to the wiring area. And a second edge far from the wiring area, the distance between the second edge and the substrate edge of the soldering area far from the wiring area is less than 1 mm.
  • the length from the first edge of the connection pad to the edge of the substrate away from the wiring area of the soldering region is not greater than 2 mm.
  • the present invention further provides an electrical connection assembly having the above-mentioned circuit board.
  • the electrical connection assembly further includes: a data transmission cable, which is welded to the circuit board, and the data transmission cable has several Wires arranged side by side, a plastic layer integrally covering several of the wires, and a metal layer formed by spirally winding a metal material tape outside the plastic layer; each of the wires has a conductor, and the metal layer is at least It has an aluminum foil layer and an adhesive layer provided on the side of the aluminum foil layer facing the plastic layer.
  • the metal layer is fixed to the outside of the plastic layer after being hot-melted through the adhesive layer; wherein the wires and the connection pads are one by one. Correspondingly connected, and the center-to-center distance between adjacent wires is the same as the center-to-center distance between corresponding adjacent wiring pads.
  • the wiring pad in the length direction of the wiring pad, has a first edge close to the wiring area and a second edge far from the wiring area, and the data transmission cable has an exposed conductor and
  • the length of the abutting portion where the conductor is soldered to the connection pad matches the length of the first edge of the connection pad to the edge of the soldering area away from the wiring area, and is set to not more than 2 mm.
  • the outer diameter of the conductor adopts 31 to 34 American wire gauge, the wiring pads and wires are arranged at equal intervals in the arrangement direction thereof, and the adjacent wiring pads and wires are adjacent to each other.
  • the center distance is set between 0.30mm and 0.42mm.
  • the beneficial effect of the present invention is that the present invention sets the wiring pad to have a ground pad and a signal pad disposed between the ground pad, so that the noise around the signal pad can be eliminated through the ground pad to ensure that Signal transmission from the signal pads, thereby improving signal transmission and processing efficiency.
  • FIG. 1 is a plan view of a first preferred embodiment of a circuit board according to the present invention.
  • FIG. 2 is a top view of a second preferred embodiment of a circuit board of the present invention.
  • FIG. 3 is a top view of a third preferred embodiment of the circuit board of the present invention.
  • FIG. 4 is a perspective view of a data transmission cable connected to a circuit board of the present invention.
  • FIG. 5 is a front view of the data transmission cable shown in FIG. 4.
  • the invention mainly relates to a circuit board, which can be applied to various types of electronic equipment such as computers, switches, and charging devices, and is mainly used for transmitting electric signals.
  • the circuit board 100 in this embodiment has a substrate 1 and a circuit structure provided on the substrate 1.
  • the thickness of the substrate 1 is 0.5 mm to 1.7 mm.
  • the substrate 1 has at least a bonding pad 11 and a wiring region 12 connected to the bonding pad 11.
  • the bonding region 11 and the wiring region 12 are disposed adjacent to each other in the length direction of the substrate 1.
  • the substrate 1 in the length direction of the basic 1, the substrate 1 further has a connection region 13 disposed on a side of the wiring region 12 away from the solder region 11.
  • a plurality of positioning grooves 121 are respectively provided on two sides of the wiring area 12 to limit the circuit board 100 or other electronic components (not shown) of the present invention.
  • the wiring structure includes at least a wiring pad 21 disposed in the soldering region 11 to connect the lead 801, and a conductive pad disposed in the soldering region 11 and the wiring region 12 and electrically connected to the wiring pad 21.
  • the wiring structure further includes a gold finger 22 disposed on the connection area 13.
  • the connection area 13 provided with the gold finger 22 can be directly formed as a tongue of a connector (not shown), that is, the connection area 13 is directly mated with a pair of connectors to achieve connection with Signal transmission between docking connectors.
  • the golden finger 22 may also be soldered to a conductive terminal (not shown) of a connector, so as to further realize the electrical connection and signal transmission and processing of the aforementioned wire 801 and the connector.
  • the data transmission cable 800 soldered to the above-mentioned circuit board 100 of the present invention includes a plurality of conductive wires 801 arranged side by side, a plastic layer 802 integrally covering a plurality of the conductive wires 801, and a metal strip.
  • the metal layer 803 is spirally wound and disposed on the outside of the plastic layer 802.
  • the metal layer 803 has at least an aluminum foil layer 8031 and an adhesive layer provided on the side of the aluminum foil layer 8031 facing the plastic layer 802, and the metal layer 803 is fixed to the outside of the plastic layer 802 by being hot-melted through the adhesive layer; On the one hand, tight winding and bonding between the metal layer 803 and the plastic layer 802 can be achieved; on the other hand, an adhesive layer is provided on the side of the metal layer 803 facing the plastic layer 802, and the metal can not only be directly bonded by means of bonding.
  • the layer 803 is fixed on the outer side of the plastic layer 802, so that the entire cable can be made thinner and softer; moreover, the air can be discharged during bonding, and because the bonding is fixed, the discharged air cannot enter, achieving a dense effect , And then achieve tight coverage, high frequency transmission performance and soft and thin effect.
  • a plurality of the conductive wires 801 are arranged at equal intervals, and an outer diameter of the conductive wires 801 is equal to a center distance of adjacent conductive wires 801.
  • Each wire 801 has a conductor 8011 and an insulating coating 8012 covering the conductor 8011; of course, the wire 801 may be provided with the plastic layer 802 without the coating layer 8012. Can achieve the same purpose.
  • the covering layer 8012 and the plastic layer 802 are made of the same or similar materials, preferably high-density polyethylene, to ensure the bonding strength and overall flexibility of adjacent layers of the data transmission cable 800; In addition, it is preferable to use a plastic material with a dielectric constant close to that of air.
  • the outer diameter of the conductor 8011 adopts a 31-34 American wire gauge, and the ratio between the center distance of adjacent wires 801 and the outer diameter of the conductor 8011 is between 1.4 and 2.8.
  • connection pads 21 are arranged side by side.
  • the connection pads 21 have at least two ground pads G for connecting a ground line and a set The signal pad S between the two ground pads G; thereby, the noise around the signal pad S can be eliminated by the ground pad G, and the signal transmission of the signal pad S is ensured, thereby improving the signal transmission and Processing efficiency.
  • connection pad 21 and the gold finger 22 are also arranged side by side parallel to the arrangement direction of the connection pads 21.
  • Each of the connection pad 21 and the gold finger 22 has a width extending in a direction in which it is arranged and a length extending in a direction in which it is vertically arranged.
  • the soldering area 11, the wiring area 12, and the connection area 13 are sequentially arranged along the length direction of the wiring pad 21 and the gold finger 22.
  • the number of the signal pads S between two adjacent ground pads G is only two, and the number of the signal pads S is provided between two adjacent ground pads.
  • the two signal pads S between G constitute a signal pad group for transmitting differential signals.
  • the wiring pads 21 have only the ground pad G and the signal pad group, and the number of the ground pad G is one more than the number of the signal pad group.
  • the wiring pads 21 located on both sides of the wiring pads are ground pads G, and between every two adjacent ground pads G There is a set of said signal pad group.
  • the wiring pad 21 in this embodiment has 7 ground pads G and 6 signal pad groups.
  • the signal arrangement design of the golden finger 22 is matched with the wiring pad 21. Therefore, the circuit board 100 described in this embodiment can be applied to the standard specification of Slimline and SAS, and further suitable for transmitting corresponding signals.
  • the length of the conventional wiring pad is usually set to be 2 mm or more; and in the present invention, each of the wiring pads 21 is set so that the length of the wiring pad 21 in a direction perpendicular to its arrangement direction is not greater than 1.5 mm, It is preferably less than 1.3 mm, and further preferably set to less than 1.1 mm, that is, the length of the wiring pad 21 is shortened as much as possible, thereby reducing the corresponding wire 801 peeling length and the welding length of the wire 801 and the wiring pad 21 after peeling, Furthermore, when transmitting high-frequency signals, the impedance discontinuities can be further shortened, and the high-frequency characteristics are more stable.
  • an area of each of the connection pads 21 occupying the soldering area 11 is less than 0.39 mm 2 ;
  • the connection pads 21 have a width in an arrangement direction of each of the connection pads.
  • the ratio of the length and width of the pad 21 is less than 5.8, that is, under the same area, the ratio of the length and width of the wiring pad 21 is minimized, so that the wiring pad 21 is arranged close to a square, thereby reducing the length and further reducing the impedance. Discontinuous distance and proper width can ensure the stability of welding with the wire.
  • a width of each of the connection pads 21 is less than 0.28 mm to ensure a space for setting a distance between adjacent connection pads 21; preferably, the width is larger than an outer diameter of the conductor 8011.
  • the distance between two adjacent connection pads 21 is not less than 0.13 mm; this facilitates the welding of adjacent wires and avoids problems such as mutual bonding or short circuit due to the small distance.
  • connection pads 21 are arranged at equal intervals in the arrangement direction, and the center distance between adjacent connection pads 21 is between 0.30mm and 0.42mm; this setting matches the data transmission
  • the distance between the cables 800 is set, so that there is no need to stretch or bend the wires 801 in the data transmission cable 800, and one-to-one welding can be performed directly to facilitate the connection between the two and further reduce the wires 801.
  • the required peeling length further shortens the impedance discontinuities and makes the high-frequency characteristics more stable.
  • the wiring pad 21 has a first edge close to the wiring area 12 and a second edge far from the wiring area 12, and the second edge and the soldering area 11 are far from the wiring.
  • the distance between the edges of the substrate 1 of the region 12 is less than 1 mm; further, in the length direction of the wiring pad, it is preferable to make the first edge of the wiring pad 21 to The length is not more than 2mm; it can further limit the distance that affects the impedance discontinuity and ensure the stability of high-frequency characteristics when transmitting high-frequency signals.
  • the above is the overall layout design of the first preferred embodiment of the circuit board 100 of the present invention. With this arrangement, not only the noise around the signal pad S can be effectively eliminated, the signal transmission of the signal pad S can be ensured, and the signal transmission and processing can be improved. And the size setting of the above-mentioned connection pad 21 can facilitate the welding of the data transmission cable 800, and minimize the impedance discontinuity distance as much as possible to ensure the stability of the high-frequency characteristics for high-frequency signal transmission.
  • FIG. 2 shows a second preferred embodiment of a circuit board 100 ′ according to the present invention.
  • the overall arrangement of the circuit board 100 ′ is similar to the first preferred embodiment described above, with only the following differences.
  • the number of the connection pads 21 ′ and the gold fingers 22 ′ is different from that of the first preferred embodiment.
  • the number of the signal pads S is two times the number of the ground pads G. Times.
  • the signal pad S also has other single-ends provided outside the ground pad G. The signal pads, and in the arrangement direction of the wiring pads 21 ′, the wiring pads 21 ′ located on both edges are the signal pads S.
  • FIG. 3 shows a third preferred embodiment of the circuit board 300 according to the present invention.
  • the overall arrangement of the circuit board 300 is similar to the first preferred embodiment described above, with only the following differences.
  • the number of the wiring pads 41 and the gold fingers 42 is different from that of the first preferred embodiment. Specifically, the number of the ground pads G in this embodiment is smaller than that of the signal pads S. One more. Further, the signal pad S only includes a single-ended signal pad, and the signal pad S and the ground pad G are staggered. Further, in a direction in which the wiring pads 41 are arranged, the wiring pads 41 located on both side edges are ground pads G.
  • the present invention also relates to an electrical connection assembly including the circuit boards 100, 100 ', 300 and a data transmission cable 800 soldered to the circuit boards 100, 100', 300.
  • the data The signal arrangement design of the wires 801 in the transmission cable 800 corresponds to each of the wiring pads 21, 21 ', and 41 on the circuit boards 100, 100', and 300, and the data transmission cable 800
  • the butt joints are obtained by removing the metal layer 803, the plastic layer 802, and the cladding layer 8012, and exposing the conductor 8011 portion, thereby connecting the wiring pad 21 through the conductor 8011 , 21 ', 41 for welding.
  • the length of the abutting portion of the data transmission cable 800 in the present invention excluding the metal layer 803, the plastic layer 802, and the covering layer 8012 is not greater than 2 mm.
  • the center distance between adjacent wires 801 is set to match the center distance between the wiring pads 21, 21 ', 41, that is, between 0.30 and 0.42 mm, thereby making the data transmission cable 800
  • the lead wires 801 and the connection pads 21, 21 ', 41 can be directly butt-welded.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Conductors (AREA)
  • Structure Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Communication Cables (AREA)

Abstract

一种线路板（100）和电连接组件。电连接组件包括线路板（100）和与线路板（100）相焊接的数据传输线缆（800）；线路板（100）包括基板（1）和设置于基板（1）上的线路结构；基板（1）具有焊接区（11）和连接于焊接区（11）的布线区（12）；线路结构具有设置于焊接区（11）以连接导线（801）的接线焊盘（21）；接线焊盘（21）呈并排设置，在接线焊盘（21）的排布方向上，接线焊盘（21）具有至少两个用以连接地线的地线焊盘（G）和设置于两个地线焊盘（G）之间的信号焊盘（S）。

Description

线路板和电连接组件
本申请要求了申请日为2018年06月01日、申请号为2018105569820、发明名称均为“数据传输线缆”，申请日为2018年10月24日、申请号为2018217305091、发明名称为“扁平数据传输线缆”,申请日为2018年10月24日、申请号为2018217324995，发明名称为“扁平数据传输线缆”等中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及一种电连接技术领域，尤其涉及一种可提高信号传输或处理效率的线路板和电连接组件。
背景技术
线路板通常设置于电子设备中，以进行电子组件的焊接和电性连接。一般情形下，电路板上会设置若干金手指或焊盘、并且与电路板内部具有与金手指或焊盘电性连接的布线设计，通过金手指或焊盘与电连接器或导线进行焊接，进而达成电连接器或导线端输入或输出信号的传输或处理工作。但是，随着电子产品多样化和更加复杂化的设计，导致信号传输或处理容易受到干扰，处理效率较低。
因此，有必要对现有的技术进行改进，以克服以上技术问题。
发明内容
本发明的目的在于提供一种可提高信号传输或处理效率的线路板和电连接组件。
为实现上述目的，本发明提供了一种线路板，所述线路板包括：基板，所述基板具有焊接区和连接于焊接区的布线区；线路结构，设置于基板上，所述线路结构具有设置于基板的焊接区以连接导线的接线焊盘、设置于焊接区和布线区内并电性连接接线焊盘的导电线路；其中，所述接线焊盘呈并排设置，在接线焊盘的排布方向上，所述接线焊盘具有至少两个用以连接地线的地线焊盘和设置于两个地线焊盘之间的信号焊盘。
作为本发明的进一步改进，所述信号焊盘在相邻两个地线焊盘之间的数量仅设置有两个，并且，设置于相邻两个地线焊盘之间的两个所述信号焊盘构成用于传输差分信号的信号焊盘组。
作为本发明的进一步改进，所述接线焊盘仅具有地线焊盘和信号焊盘组，并且所述地线焊盘的数量比信号焊盘组的数量多一。
作为本发明的进一步改进，在接线焊盘的排布方向上，位于两侧缘的接线焊盘为地线焊盘，并且每相邻两个地线焊盘之间具有一组所述信号焊盘组。
作为本发明的进一步改进，所述信号焊盘的数量是地线焊盘数量的两倍。
作为本发明的进一步改进，所述信号焊盘还设置于所述地线焊盘外侧，并且在接线焊盘的排布方向上，位于两侧缘的接线焊盘为信号焊盘。
作为本发明的进一步改进，所述地线焊盘的数量比信号焊盘的数量多一。
作为本发明的进一步改进，所述接线焊盘具有沿其排布方向延伸的宽度和沿与垂直排布方向的方向延伸的长度，所述接线焊盘的长度小于1.5mm。
作为本发明的进一步改进，每一所述接线焊盘在其排布方向上的宽度小于0.28mm；相邻两个所述接线焊盘之间的距离不小于0.13mm。
作为本发明的进一步改进，所述接线焊盘在其排布方向上为等间距设置，且相邻接线焊盘的中心间距在0.30mm至0.42mm之间。
作为本发明的进一步改进，所述焊接区与布线区在接线焊盘的长度方向上相邻设置；在所述接线焊盘的长度方向上，所述接线焊盘具有靠近布线区的第一边缘和远离布线区的第二边缘，所述第二边缘与焊接区远离布线区的基板边缘的距离小于1mm。
作为本发明的进一步改进，在所述接线焊盘的长度方向上，所述接线焊盘的第一边缘至焊接区远离布线区的基板边缘的长度不大于2mm。
为实现上述目的，本发明还提供了一种具有上述线路板的电连接组件，所述电连接组件还包括：数据传输线缆，与所述线路板相焊接，所述数据传输线缆具有若干并排设置的导线、一体包覆若干所述导线的塑料层和采用金属料带呈螺旋缠绕设置于所述塑料层外侧而形成的金属层；每一所述导线具有一导体，所述金属层至少具有铝箔层和设置于铝箔层朝向塑料层一侧的粘结层，所述金属层通过所述粘结层热熔后粘结固定于塑料层外侧；其中，所述导线与接线焊盘一一对应连接，并且相邻导线的中心间距与对应的相邻接线焊盘的中心间距相同。
作为本发明的进一步改进，在所述接线焊盘的长度方向上，所述接线焊盘具有靠近布线区的第一边缘和远离布线区的第二边缘，所述数据传输线缆具有露出导体而使导体与接线焊盘相焊接的对接部分，所述对接部分的长度与所述接线焊盘的第一边缘至焊接区远离布线区的边缘的长度相匹配，均设置为不大于2mm。
作为本发明的进一步改进，所述导体外径采用31至34美国线规，所述接线焊盘和导线在其排布方向上均为等间距设置，并且相邻接线焊盘和相邻导线的中心间距均设置在0.30mm至0.42mm之间。
本发明的有益效果是：本发明将接线焊盘设置为具有地线焊盘和设置于地线焊盘之间的信号焊盘，使得可通过地线焊盘排除信号焊盘周围的噪声，保证信号焊盘之信号传输，进而提高信号传输和处理效率。
附图说明
后文将参照附图以示例性而非限制性的方式详细描述本发明的一些具体实施例。附图中相同的附图标记标示了相同或类似的部件或部分。本领域技术人员应该理解，这些附图未必是按比例绘制的。附图中：
图1是本发明线路板第一较佳实施例的俯视图；
图2是本发明线路板第二较佳实施例的俯视图；
图3是本发明线路板第三较佳实施例的俯视图；
图4是与本发明线路板连接的数据传输线缆的立体图；
图5是图4所示数据传输线缆的前视图。
具体实施方式
为了使本发明的目的、技术方案和优点更加清楚，下面结合附图和具体实施例对本发明进行详细描述。
本发明主要涉及一种线路板，该线路板可应用于计算机、交换机、充电装置等各类电子设备上，主要用于进行电信号的传输。
如图1所示，本实施例中线路板100具有基板1和设置于基板1上的线路结构。
其中，所述基板1厚度为0.5mm至1.7mm。所述基板1至少具有焊接区11和连接于焊接区11的布线区12。所述焊接区11和布线区12于基板1的长度方向上相邻设置。在本实施例中，在所述基本1的长度方向上，所述基板1还具有设置于布线区12远离焊接区11一侧的连接区13。所述布线区12两侧分别设置有若干定位凹槽121，以对本发明线路板100或其他电子组件(未图标)进行限位。
结合图4所示，所述布线结构至少包括有设置于所述焊接区11以连接导线801的接线焊盘21、设置于焊接区11和布线区12内并电性连接接线焊盘21的导电线路(未图示)。在本实施例中，所述布线结构还包括设置于所述连接区13的金手指22。本实施例中，设置有金手指22的连接区13可以直接形成为一连接器(未图示)的舌片，即直接通过该连接区13与一对接连接器进行插接配合，来实现与对接连接器之间的信号传输。当然，也可将所述金手指22与一连接器的导电端子(未图示)进行焊接，进而实现前述导线801与连接器的电性连接和信号传输与处理。
如图4和图5所示，与本发明上述线路板100相焊接的数据传输线缆800包括若干并排设置的导线801，一体包覆若干所述导线801的塑料层802、采用金属料带呈螺旋缠绕设置于所述塑料层802外侧而形成的金属层803。所述金属层803至少具有铝箔层8031和设置于铝箔层8031朝向塑料层802一侧的粘结层，所述金属层803通过所述粘结层热熔后粘结固定于塑料层802外侧；一方面，可实现金属层803与塑料层802之间的紧密缠绕贴合；另一方面，在金属层803朝向塑料层802的一侧设置粘结层，不仅可直接通过粘结的方式将金属层803固定于塑料层802外侧，使得整个线缆可以做得更薄，更柔软；而且在粘结时还可 将空气排出，又因为粘结固定，使得排出的空气无法进入，达到密实的效果，进而达到紧密包覆，高频传输性能佳且柔软轻薄的效果。
若干所述导线801等间距排列设置，并且所述导线801的外径等于相邻导线801的中心间距。每一导线801分别具有一导体8011和包覆导体8011的绝缘包覆层8012；当然，所述导线801也可不设置所述包覆层8012，直接由所述塑料层802进行绝缘包覆，也可实现相同的目的。所述包覆层8012和塑料层802采用相同或相近的材料制成，优选采用高密度聚乙烯制成，以保证所述数据传输线缆800的相邻层间的结合强度和整体柔韧性；另外，优选采用介电系数接近空气的塑料材料制成，藉此可使得包覆层8012和塑料层802的阻抗较小，从而可提供导体8011较好的信号传输环境，减少信号的传播延迟，降低信号之间的串扰，保证信号的高速有效传输，减小信号衰减。所述导体8011外径采用31至34美国线规，相邻导线801的中心间距与所述导体8011外径的比值在1.4至2.8之间。
进一步地，本发明中所述接线焊盘21呈并排设置，在接线焊盘21的排布方向上，所述接线焊盘21具有至少两个用以连接地线的地线焊盘G和设置于两个地线焊盘G之间的信号焊盘S；藉此，使得可通过地线焊盘G排除信号焊盘S周围的噪声，保证信号焊盘S的信号传输，进而提高信号传输和处理效率。
另外，所述金手指22也呈与所述接线焊盘21排布方向平行的并排设置。所述接线焊盘21和金手指22均具有沿其排布方向延伸的宽度和沿垂直排布方向的方向延伸的长度。所述焊接区11、布线区12和连接区13是沿所述接线焊盘21和金手指22的长度方向依次排列设置。
如图1所示，在本实施例中，所述信号焊盘S在相邻两个地线焊盘G之间的数量仅设置有两个，并且，设置在相邻两个地线焊盘G之间的两个所述信号焊盘S构成用于传输差分信号的信号焊盘组。进一步地，所述接线焊盘21仅具有地线焊盘G和信号焊盘组，并且所述地线焊盘G的数量比信号焊盘组的数量多一。更进一步地，在本实施例中，在接线焊盘21的排布方向上，位于两侧缘的接线焊盘21为地线焊盘G，并且每相邻两个地线焊盘G之间具有一组所述信号焊盘组。结合图1所示，本实施例所述接线焊盘21具有7个地线焊盘G和6组信号焊盘组，所述金手指22端的信号排布设计与所述接线焊盘21相匹配，从而可使本实施例中所述线路板100适用于Slimline SAS的标准规格，进而适用于进行相应信号的传输。
进一步地，常规接线焊盘的长度设置通常为2mm以上；而在本发明中，每一所述接线焊盘21设置为使其在垂直于其排布方向的方向上的长度不大于1.5mm，优选为小于1.3mm， 进一步优选设置为小于1.1mm，即使得所述接线焊盘21的长度尽可能缩短，从而减小相应导线801剥离长度和导线801剥离后与接线焊盘21的焊接长度，进而在进行高频信号传输时，可进一步使得阻抗不连续处缩短，高频特性更加稳定。
优选地，本发明中，每一所述接线焊盘21占据焊接区11的面积小于0.39mm 2；优选地，所述接线焊盘21具有在其排布方向上的宽度，每一所述接线焊盘21的长度与宽度的比值小于5.8，即在同等面积下，尽量减小接线焊盘21的长度与宽度的比值，使得接线焊盘21接近正方形设置，从而长度减小，进一步减小阻抗不连续的距离，而宽度适当，可保证与导线焊接的稳定性。
在本发明中，每一所述接线焊盘21的宽度小于0.28mm，以保证相邻接线焊盘21的间距设置空间；优选地，该宽度大于上述导体8011的外径。本发明中相邻两个所述接线焊盘21之间的距离不小于0.13mm；藉此方便相邻导线的焊接，避免因间距较小而发生相互粘结或焊接短路等问题。
在本实施例中，所述接线焊盘21在其排布方向上为等间距设置，且相邻接线焊盘21的中心间距在0.30mm至0.42mm之间；该种设置匹配所述数据传输线缆800的间距设置，从而无需对导线所述数据传输线缆800内的导线801进行拉伸或折弯处理，即可直接进行一一对接焊接，方便两者的连接，进一步减小导线801所需的剥离长度，进一步使得阻抗不连续处缩短，高频特性更加稳定。
另外，在所述接线焊盘21的长度方向上，所述接线焊盘21具有靠近布线区12的第一边缘和远离布线区12的第二边缘，所述第二边缘与焊接区11远离布线区12的基板1边缘的距离小于1mm；进一步地，在所述接线焊盘的长度方向上，优选使所述接线焊盘21的第一边缘至焊接区11远离布线区12的基板11边缘的长度不大于2mm；可进一步限制影响阻抗不连续的距离，保证高频信号传输时的高频特性的稳定性。
如上为本发明线路板100的第一较佳实施例的整体布局设计，通过该种设置不仅可有效排除信号焊盘S周围的噪声，保证信号焊盘S的信号传输，进而提高信号传输和处理效率；而且上述接线焊盘21的尺寸设置，可方便数据传输线缆800的焊接，且尽可能缩短阻抗不连续的距离，保证进行高频信号传输的高频特性的稳定性。
请参阅图2所示为本发明线路板100’的第二较佳实施例，该线路板100’的整体设置方式与上述第一较佳实施例较为相近，仅有如下不同之处。
在该实施例中，所述接线焊盘21’和金手指22’的数量设置与第一较佳实施例不同，具体地，所述信号焊盘S的数量是地线焊盘G数量的两倍。进一步地，所述信号焊盘S除 包括设置于相邻地线焊盘G之间以传输差分信号的信号焊盘组之外，还具有设置于所述地线焊盘G外侧的其他单端信号焊盘，并且在接线焊盘21’的排布方向上，位于两侧缘的接线焊盘21’为信号焊盘S。
请参阅图3所示为本发明线路板300的第三较佳实施例，该线路板300的整体设置方式与上述第一较佳实施例较为相近，仅有如下不同之处。
在该实施例中，所述接线焊盘41和金手指42的数量设置与第一较佳实施例不同，具体地，本实施例中所述地线焊盘G的数量比信号焊盘S的数量多一。进一步地，所述信号焊盘S仅包括单端信号焊盘，并且信号焊盘S和地线焊盘G交错排布。进一步地，在接线焊盘41的排布方向上，位于两侧缘的接线焊盘41为地线焊盘G。
综合上述说明可知，本发明还涉及一种电连接组件，其包括所述线路板100、100’、300和与该线路板100、100’、300相焊接的数据传输线缆800，所述数据传输线缆800中的导线801的信号排布设计与所述线路板100、100’、300上各接线焊盘21、21’、41分别对应匹配，并且所述数据传输线缆800具有与接线焊盘21、21’、41相焊接的对接部分，所述对接部分是将所述金属层803、塑料层802和包覆层8012去除，露出导体8011部分，从而通过导体8011与接线焊盘21、21’、41进行焊接。
结合上述接线焊盘21、21’、41的设置，本发明中所述数据传输线缆800去除所述金属层803、塑料层802和包覆层8012的对接部分的长度不大于2mm。进一步地，相邻导线801的中心间距设置为与所述接线焊盘21、21’、41的中心间距相匹配，即设置为在0.30至0.42mm之间，藉此使得数据传输线缆800的导线801与接线焊盘21、21’、41可进行直接对位焊接。
以上实施例仅用以说明本发明的技术方案而非限制，尽管参照较佳实施例对本发明进行了详细说明，例如，不同的实施例中的技术若可叠加使用以同时达到对应的效果，其方案也在本发明的保护范围内。本领域的普通技术人员应当理解，可以对本发明的技术方案进行修改或者等同替换，而不脱离本发明技术方案的精神和范围。

Claims (15)

  1. 一种线路板，其特征在于，所述线路板包括：
    基板，所述基板具有焊接区和连接于焊接区的布线区；
    线路结构，设置于基板上，所述线路结构具有设置于基板的焊接区以连接导线的接线焊盘、设置于焊接区和布线区内并电性连接接线焊盘的导电线路；
    其中，所述接线焊盘呈并排设置，在接线焊盘的排布方向上，所述接线焊盘具有至少两个用以连接地线的地线焊盘和设置于两个地线焊盘之间的信号焊盘。
  2. 如权利要求1所述的线路板，其特征在于：所述信号焊盘在相邻两个地线焊盘之间的数量仅设置有两个，并且，设置于相邻两个地线焊盘之间的两个所述信号焊盘构成用于传输差分信号的信号焊盘组。
  3. 如权利要求2所述的线路板，其特征在于：所述接线焊盘仅具有地线焊盘和信号焊盘组，并且所述地线焊盘的数量比信号焊盘组的数量多一。
  4. 如权利要求3所述的线路板，其特征在于：在接线焊盘的排布方向上，位于两侧缘的接线焊盘为地线焊盘，并且每相邻两个地线焊盘之间具有一组所述信号焊盘组。
  5. 如权利要求2所述的线路板，其特征在于：所述信号焊盘的数量是地线焊盘数量的两倍。
  6. 如权利要求5所述的线路板，其特征在于：所述信号焊盘还设置于所述地线焊盘外侧，并且在接线焊盘的排布方向上，位于两侧缘的接线焊盘为信号焊盘。
  7. 如权利要求1所述的线路板，其特征在于：所述地线焊盘的数量比信号焊盘的数量多一。
  8. 如权利要求1所述的线路板，其特征在于：所述接线焊盘具有沿其排布方向延伸的宽度和沿与垂直排布方向的方向延伸的长度，所述接线焊盘的长度小于1.5mm。
  9. 如权利要求8所述的线路板，其特征在于：每一所述接线焊盘在其排布方向上的宽度小于0.28mm；相邻两个所述接线焊盘之间的距离不小于0.13mm。
  10. 如权利要求9所述的线路板，其特征在于：所述接线焊盘在其排布方向上为等间距设置，且相邻接线焊盘的中心间距在0.30mm至0.42mm之间。
  11. 如权利要求1所述的线路板，其特征在于：所述焊接区与布线区在接线焊盘的长度方向上相邻设置；在所述接线焊盘的长度方向上，所述接线焊盘具有靠近布线区的第一边缘和远离布线区的第二边缘，所述第二边缘与焊接区远离布线区的基板边缘的距离小于1mm。
  12. 如权利要求8或11所述的线路板，其特征在于：在所述接线焊盘的长度方向上，所述接线焊盘的第一边缘至焊接区远离布线区的基板边缘的长度不大于2mm。
  13. 一种具有如权利要求1至12中任意一项所述线路板的电连接组件，其特征在于，所述电连接组件还包括：
    数据传输线缆，与所述线路板相焊接，所述数据传输线缆具有若干并排设置的导线、一体包覆若干所述导线的塑料层和采用金属料带呈螺旋缠绕设置于所述塑料层外侧而形成的金属层；每一所述导线具有一导体，所述金属层至少具有铝箔层和设置于铝箔层朝向塑料层一侧的粘结层，所述金属层通过所述粘结层热熔后粘结固定于塑料层外侧；
    其中，所述导线与接线焊盘一一对应连接，并且相邻导线的中心间距与对应的相邻接线焊盘的中心间距相同。
  14. 如权利要求13所述的电连接组件，其特征在于：在所述接线焊盘的长度方向上，所述接线焊盘具有靠近布线区的第一边缘和远离布线区的第二边缘，所述数据传输线缆具有露出导体而使导体与接线焊盘相焊接的对接部分，所述对接部分的长度与所述接线焊盘的第一边缘至焊接区远离布线区的边缘的长度相匹配，均设置为不大于2mm。
  15. 如权利要求13所述的电连接组件，其特征在于：所述导体外径采用31至34美国线规，所述接线焊盘和导线在其排布方向上均为等间距设置，并且相邻接线焊盘和相邻导线的中心间距均设置在0.30mm至0.42mm之间。
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