WO2019184901A1 - 显示面板及其制造方法、显示装置 - Google Patents
显示面板及其制造方法、显示装置 Download PDFInfo
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- WO2019184901A1 WO2019184901A1 PCT/CN2019/079639 CN2019079639W WO2019184901A1 WO 2019184901 A1 WO2019184901 A1 WO 2019184901A1 CN 2019079639 W CN2019079639 W CN 2019079639W WO 2019184901 A1 WO2019184901 A1 WO 2019184901A1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/351—Thickness
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
Definitions
- the present application relates to the field of display technologies, and in particular, to a display panel, a method of manufacturing the same, and a display device.
- OLED Organic Light-Emitting Diode
- the flexible OLED display panel realizes image display through a plurality of OLED light-emitting therein.
- the area where the OLED is located is a light-emitting area, and the area other than the light-emitting area is a non-light-emitting area.
- the flexible OLED display panel is formed by stacking a plurality of functional layers, and a part of the functional layers is used to form an OLED.
- the embodiment of the present application provides a display panel, a manufacturing method thereof, and a display device.
- the technical solution is as follows:
- a display panel is provided, the display panel being divided into a first panel area and a second panel area, wherein the first panel area is used for illumination, and the illumination function of the second panel area is The light-emitting function of a panel area is different, and a target area exists in the second panel area, and the thickness of the target area is smaller than the thickness of the first panel area.
- the display panel includes at least one target functional layer, and a surface of a portion of the target functional layer located at the target area has at least one groove.
- the groove has an elongated shape, and the first cross section of the groove is rectangular or trapezoidal, the first cross section is parallel to a thickness direction of the target functional layer, and perpendicular to the groove Longitudinal direction.
- the depth of the groove ranges from 500 nanometers to 50 micrometers
- the width of the open surface of the groove is less than or equal to 10 micrometers
- the depth direction of the groove is parallel to the target functional layer. The thickness direction.
- the display panel includes a plurality of functional layers stacked and distributed, and the target functional layer is a functional layer near the outer side of the plurality of functional layers.
- the plurality of functional layers include a base layer, a display film layer, an encapsulation layer and a polarizing layer which are sequentially superposed, and the base layer and the encapsulation layer are both the target functional layers.
- the display film layer includes a first insulating layer, a semiconductor layer, a gate insulating layer, a gate, and a second insulating layer between the base layer and the encapsulation layer in a direction away from the base layer a source drain layer, a planarization layer, a first electrode, a pixel defining layer, a light emitting functional layer, and a second electrode.
- the display panel includes a light emitting unit and a pixel circuit, and the light emitting unit and the pixel circuit are both located in the first panel region.
- the display panel is an electroluminescent display panel
- the light emitting unit is an electroluminescent unit
- the display panel is an OLED display panel, and the light emitting unit is an OLED; or the display panel is a QLED display panel, and the light emitting unit is a QLED.
- the first panel area is a light emitting area
- the second panel area is a non-light emitting area
- the display panel is a flexible display panel.
- a method of manufacturing a display panel comprising:
- a display panel being divided into a first panel area for emitting light, a light emitting function of the second panel area being different from a light emitting function of the first panel area There is a target area in the second panel area, and the thickness of the target area is smaller than the thickness of the first panel area.
- the manufacturing the display panel comprises:
- a plurality of functional layers of a stacked distribution are formed, the plurality of functional layers including at least one target functional layer, wherein a surface of a portion of the target functional layer located at the target region has at least one groove.
- the forming a plurality of functional layers of the layered distribution includes:
- the substrate substrate being divided into a first substrate region and a second substrate region, the second substrate region protruding from the first substrate region, the second substrate region Having at least one protrusion;
- a base layer on a surface of the base substrate having the protrusion Forming a base layer on a surface of the base substrate having the protrusion, a portion of the base layer located at the second substrate region having a thickness smaller than a thickness of a portion of the first substrate region,
- the surface away from the base substrate is a plane, and the surface adjacent to the base substrate has at least one groove, and the at least one groove is in one-to-one correspondence with the at least one protrusion;
- an orthographic projection is located in the second substrate region;
- the base substrate is peeled off.
- an encapsulation layer is formed on a side of the display film layer away from the base layer, and the encapsulation layer has at least one groove away from a surface of the display film layer, including:
- a display device comprising a display panel, the display panel being divided into a first panel area and a second panel area, the first panel area for emitting light, the second panel
- the light emitting function of the area is different from the light emitting function of the first panel area, and the target area is present in the second panel area, and the thickness of the target area is smaller than the thickness of the first panel area.
- the display panel includes a light emitting unit and a pixel circuit, and the light emitting unit and the pixel circuit are both located in the first panel region.
- the display device is an electroluminescent display device
- the light emitting unit is an electroluminescent unit
- the display device is an OLED display device, and the light emitting unit is an OLED; or the display device is a QLED display device, and the light emitting unit is a QLED.
- the first panel area is a light emitting area
- the second panel area is a non-light emitting area
- the display device is a flexible display device.
- the display panel is divided into a first panel area and a second panel area, the first panel area is used for emitting light, and the lighting function of the second panel area is combined with the first panel area.
- the light emitting function is different, and the target area is present in the second panel area, and the thickness of the target area is smaller than the thickness of the first panel area, so that when the display panel is bent, the stress of the display panel is concentrated toward the second panel area, thereby Reducing the stress of the first panel region (that is, the light-emitting region) helps to reduce the probability of cracking of the film layer in the first panel region, and avoids the influence of the crack of the film layer in the first panel region on the display effect of the display panel. .
- FIG. 1 is a schematic structural diagram of a display panel according to an embodiment of the present application.
- FIG. 2 is a schematic view showing a bending of a display panel according to an embodiment of the present application
- FIG. 3 is a schematic structural diagram of another display panel according to an embodiment of the present disclosure.
- FIG. 4 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present application.
- FIG. 5 to FIG. 9 are schematic diagrams showing a manufacturing process of a display panel according to an embodiment of the present application.
- a flexible OLED display panel is a display panel that is not only capable of displaying an image but also capable of being bent.
- the flexible OLED display panel generates a large stress during the bending process, which causes the film separation of the flexible OLED display panel, and further causes cracks or breakage of the film layer of the flexible OLED display panel.
- the film layer in the light-emitting region Cracks or breakages can affect the display of flexible OLED display panels.
- the embodiment of the present application provides a display panel, a manufacturing method thereof, and a display device, which can reduce the probability of occurrence of cracks in a film layer in a light-emitting region of the display panel, thereby reducing the probability of film breakage in the light-emitting region.
- a display panel a manufacturing method thereof, and a display device, which can reduce the probability of occurrence of cracks in a film layer in a light-emitting region of the display panel, thereby reducing the probability of film breakage in the light-emitting region.
- FIG. 1 is a schematic structural diagram of a display panel 0 according to an embodiment of the present application.
- the display panel 0 can be divided into a first panel area A1 and a second panel area A2, and a first panel area.
- A1 is used for illumination
- the illumination function of the second panel area A2 is different from that of the first panel area A1
- the target area (not shown in FIG. 1) exists in the second panel area A2, and the thickness of the target area is smaller than the first panel.
- the thickness of the area A1 As shown in FIG.
- the second panel area A2 is taken as a target area as an example, and the thickness of the target area is smaller than the thickness of the first panel area A1, that is, the thickness of the second panel area A2 is smaller than the first panel.
- the thickness d1 of the first panel area A1 is a dimension of the first panel area A1 in a direction perpendicular to the board surface (not shown in FIG. 1) of the display panel 0, and the thickness d2 of the second panel area A2 is the second panel area.
- the display panel provided by the embodiment of the present application is divided into a first panel area and a second panel area, the first panel area is used for illumination, and the illumination function of the second panel area is compared with the first panel area.
- the light-emitting function is different, and the target area is present in the second panel area, and the thickness of the target area is smaller than the thickness of the first panel area, so that when the display panel is bent, the stress of the display panel is concentrated toward the second panel area, thereby reducing
- the stress of the first panel region helps to reduce the probability of cracking of the film layer of the first panel region (that is, the light-emitting region), and avoids the influence of the crack of the film layer in the first panel region on the display effect of the display panel.
- the display panel 0 can be a flexible display panel
- the first panel area A1 can be a light-emitting area
- the second panel area A2 can be a non-light-emitting area. Since the first panel area A1 is a light-emitting area, the second panel area A2 is The non-light-emitting area is such that the light-emitting function of the first panel area A1 is different from the light-emitting function of the second panel area A2.
- FIG. 2 is a schematic diagram of a bending of the display panel 0 according to an embodiment of the present application.
- the second panel area A2 is a target area (that is, the thickness of any part of the second panel area A2 is smaller than that of the second panel area A2.
- the thickness of one panel area A1 will be described as an example.
- FIG. 2 since the thickness of the second panel area A2 (not shown in FIG. 2) is smaller than the thickness of the first panel area A1 (not shown in FIG. 2), when the display panel 0 is bent, the display panel 0 is displayed. The stress is concentrated toward the second panel area A2, so that the stress of the first panel area A1 is reduced, so that in the display panel 0 shown in FIG. 2, the stress in the first panel area A1 is small.
- the display panel 0 may include a light emitting unit (neither shown in FIG. 1 and FIG. 2) and a pixel circuit (neither shown in FIG. 1 and FIG. 2), and the pixel circuit is configured to drive the light emitting unit to emit light, in the display.
- the pixel circuit is configured to drive the light emitting unit to emit light, in the display.
- both the light emitting unit and the pixel circuit may be located in the first panel area A1.
- the main structure of the display panel 0 is a light emitting unit and a pixel circuit
- the light emitting unit and the pixel circuit are both located in the first panel area A1, that is, the main structure of the display panel 0 is located in the first panel area A1, so that When the display panel 0 is bent, it is possible to reduce the probability of occurrence of cracks or even breakage of the film layer constituting the main structure, thereby reducing the influence of cracking of the film layer on the display effect of the display panel 0.
- the display panel 0 can be an electroluminescent display panel.
- the light emitting unit can be an electroluminescent unit.
- the display panel is an OLED display panel, and the light emitting unit is an OLED; or the display panel is a quantum dot light emitting diode (English: Quantum Dot Light Emitting Diodes; referred to as QLED) display panel, and the light emitting unit is a QLED.
- the OLED display panel can be an active-matrix organic light emitting diode (AMOLED) display panel or a passive matrix organic light emitting diode (English: Passive matrix organic light emitting diode; PMOLED) display panel.
- AMOLED active-matrix organic light emitting diode
- PMOLED Passive matrix organic light emitting diode
- the display panel 0 may also be other light-emitting display panels, and the display panel 0 may also be other flexible display panels, or may not For the flexible display substrate, the embodiment of the present application does not limit this.
- the display panel 0 may include at least one target functional layer (neither shown in FIG. 1 and FIG. 2), and the surface of the portion of the target functional layer located in the target region has at least one groove.
- the groove can achieve the purpose of thinning the thickness of the target area.
- the groove can enhance the flexibility of the second panel area A2 on the one hand, and increase the applied load on the second panel area A2 when the display panel 0 is bent, so that the degree of deformation of the second panel area A2 is increased, thereby
- the applied load applied to the first panel area A1 is reduced to reduce the degree of deformation of the first panel area A1 (that is, the degree of deformation of the first panel area A1 is reduced by increasing the degree of deformation of the second panel area A2)
- the probability of the film layer of the first panel area A1 being broken is reduced; on the other hand, when the crack occurs in the second panel area A2, the groove can effectively suppress the crack from expanding to the first panel area A1, thereby improving the service life of the device.
- the groove may be in the shape of a strip, and the first section of the groove may be rectangular or trapezoidal, and the first section of the groove is parallel to the thickness direction of the target functional layer and perpendicular to the length of the groove, concave
- the depth of the groove may range from 500 nanometers to 50 micrometers.
- the depth of the groove may be 600 nanometers, 800 nanometers, 20 micrometers, or 30 micrometers, etc.
- the width of the open surface of the groove may be less than or equal to 10 micrometers.
- the opening face of the groove may have a width of 3 ⁇ m, 5 ⁇ m or 8 ⁇ m, etc., wherein the depth direction of the groove is parallel to the thickness direction of the target functional layer.
- the display panel 0 may include a plurality of functional layers distributed in a layer, and the target functional layer may be a functional layer near the outer side of the plurality of functional layers.
- the target functional layer is located at the outermost of the plurality of functional layers.
- Functional layer is a functional layer near the outer side of the plurality of functional layers to facilitate forming a groove on the target functional layer.
- FIG. 3 is a schematic structural diagram of another display panel 0 according to an embodiment of the present disclosure.
- the display panel 0 includes a plurality of functional layers stacked and distributed, and the multiple functional layers may include sequentially overlapping.
- the base layer 011, the display film layer (not shown in FIG. 3), the encapsulation layer 012, and the polarizing layer 013, the base layer 011 and the encapsulation layer 012 are all target functional layers, and the side of the base layer 011 away from the display film layer is located at the target a portion of the region (the region where the target region is a smaller thickness in the second panel region A2, not shown in FIG.
- the base layer 011 and the encapsulation layer 012 each have three grooves W as an example, and the first section of the groove W has a rectangular shape as an example.
- the polarizing layer 013 can be attached on the side of the encapsulation layer 012 away from the display film layer.
- the display film layer includes a first insulating layer 014, a semiconductor layer 015, a gate insulating layer 016, and a gate 017 located between the base layer 011 and the encapsulation layer 012 in a direction away from the base layer 011.
- the semiconductor layer 015, the gate insulating layer 016, the gate electrode 017, the second insulating layer 018, and the source and drain layers constitute a thin film transistor (English: Thin Film Transistor; abbreviated as: TFT), and the TFT may belong to a pixel circuit, the first electrode 020, and the light emitting
- TFT Thin Film Transistor
- the portion where the functional layer 022 and the second electrode 023 are in contact with each other and superimposed constitutes a light emitting unit
- the pixel defining layer 021 is for defining a pixel opening
- the light emitting unit is located in the pixel opening.
- one of the first electrode 020 and the second electrode 023 may be an anode, and the other electrode may be a cathode, and the planarization layer 019 is configured to absorb the unevenness of the surface of the base layer 011 on which the TFT is formed, so that the TFT is formed.
- the surface of the base layer 011 is planarized to facilitate the preparation of the light-emitting unit.
- the base layer 011 may be an organic polymer material such as polyimide or an organic polymer material mixed with glass fiber particles, by dip coating, inkjet method or spin coating method.
- the formed film layer, or the base layer 011 may be directly formed using a template (using the same shape as the base layer 011 to form the base layer 011).
- the first insulating layer 014 may be a single layer or a multilayer structure formed by chemical vapor deposition (English: Chemical Vapor Deposition; CVD) using an inorganic compound such as silicon nitride or silicon oxide.
- the semiconductor layer 015 may be a film layer structure formed by CVD using a silicon oxide semiconductor.
- the gate insulating layer 016 may be a single layer or a multilayer structure formed by CVD using an inorganic compound such as silicon nitride or silicon oxide.
- the gate electrode 017 may be a single layer or a multilayer structure formed by a sputtering method, CVD, or the like using a metal material such as copper, aluminum, molybdenum, or tungsten.
- the second insulating layer 018 may be a single layer or a multilayer structure formed by CVD using an inorganic compound such as silicon nitride or silicon oxide.
- the planarization layer 019 may be a film layer structure formed by a dip coating method, an inkjet method, a spin coating method, or the like using an organic polymer material such as polyimide or epoxy resin.
- the first electrode 020 may be a metal material such as silver or aluminum, or indium tin oxide (Indium tin oxide; ITO), indium zinc oxide (IZO), or aluminum oxide.
- ITO indium tin oxide
- IZO indium zinc oxide
- a metal oxide such as zinc (English: aluminum-doped zinc oxide; abbreviated as: ZnO: Al), which has a single layer or a multilayer structure formed by a sputtering method or the like.
- the pixel defining layer 021 may be a film layer formed by a dip coating method, an inkjet method, a spin coating method, or the like using an organic polymer material such as polyimide or epoxy resin.
- the light-emitting function layer 022 may be a multilayer structure formed by an inkjet method, a spin coating method, a vapor deposition method, or the like.
- the second electrode 023 may be a film layer structure formed by a sputtering method, a vapor deposition method, or the like using a metal material such as silver or aluminum.
- the encapsulating layer 012 may be a single layer or a multilayer structure formed by CVD, spin coating, sputtering, inkjet, or the like using an inorganic compound such as silicon nitride or silicon oxide.
- the description of the structure of the display panel in the embodiment of the present application is merely exemplary, and the display panel that is actually used may include more or less structures than the display panel provided by the embodiment of the present application, for example, actual
- the display panel used may also have no polarizing layer, as long as the target area is present in the second panel area of the display panel.
- the display panel provided by the embodiment of the present application is divided into a first panel area and a second panel area, the first panel area is used for illumination, and the illumination function of the second panel area is compared with the first panel area.
- the light emitting function is different, and the target area is present in the second panel area, and the thickness of the target area is smaller than the thickness of the first panel area, so that when the display panel is bent, the stress of the display panel is concentrated toward the second panel area, thereby Reducing the stress of the first panel region helps to reduce the probability of cracks in the film layer of the first panel region, avoiding the influence of cracks in the first panel region on the display effect of the display panel, and prolonging the use of the display panel life.
- the embodiment of the present application provides a method for manufacturing a display panel, which can be used to manufacture the display panel provided by the above embodiment.
- the manufacturing method of the display panel may include:
- the display panel is divided into a first panel area for emitting light, a second panel area having a different illumination function than the first panel area, and a second panel area having a target The thickness of the target area is smaller than the thickness of the first panel area.
- the display panel manufactured by the method is divided into a first panel area and a second panel area, the first panel area is used for illumination, and the second panel area is illuminated.
- the function is different from the light-emitting function of the first panel area, and the target area is present in the second panel area, and the thickness of the target area is smaller than the thickness of the first panel area, so that when the display panel is bent, the stress of the display panel is second
- the panel area is concentrated, thereby reducing the stress of the first panel area, helping to reduce the probability of cracking of the film layer in the first panel area, and avoiding the influence of the crack of the film layer in the first panel area on the display effect of the display panel.
- manufacturing the display panel may include:
- a plurality of functional layers of a stacked distribution are formed, the plurality of functional layers including at least one target functional layer, and a surface of a portion of the target functional layer located at the target region has at least one groove.
- forming a plurality of functional layers of the stacked distribution including:
- the substrate substrate is divided into a first substrate region and a second substrate region, the second substrate region protrudes from the first substrate region, and the second substrate region has at least one protrusion;
- a base layer on a surface of the base substrate having a protrusion Forming a base layer on a surface of the base substrate having a protrusion, a thickness of a portion of the base layer located at the second substrate region being smaller than a thickness of a portion of the first substrate region, a surface of the base layer away from the substrate substrate
- the surface is planar, and the surface adjacent to the substrate substrate has at least one groove, and at least one groove corresponds to the at least one protrusion in one-to-one correspondence;
- a polarizing layer on a side of the encapsulating layer away from the display film layer, the base layer, the display film layer, the encapsulating layer and the polarizing layer forming a plurality of functional layers, wherein the base layer and the encapsulating layer are both target functional layers;
- the base substrate is peeled off.
- an encapsulation layer is formed on a side of the display film layer away from the base layer, and the encapsulation layer has at least one groove away from the surface of the display film layer, including:
- At least one groove is formed on the surface of the encapsulating material layer away from the display film layer to obtain an encapsulation layer.
- FIG. 4 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure.
- the method can be used to manufacture the display panel provided by the above embodiment.
- This embodiment is used to manufacture the display panel shown in FIG. 3 .
- the manufacturing method of the display panel may include the following steps:
- a substrate is provided, the substrate substrate is divided into a first substrate region and a second substrate region, the second substrate region protrudes from the first substrate region, and the second substrate region has at least one Raised.
- FIG. 5 it is a schematic structural view of a substrate substrate 1 provided by an embodiment of the present application.
- the substrate substrate 1 is divided into a first substrate region B1 and a second substrate region B2, and a second substrate.
- the region B2 protrudes from the first substrate region B1, and the second substrate region B2 has at least one protrusion G.
- the second substrate region B2 has three protrusions G.
- the material of the base substrate 1 may be an inorganic material such as quartz, ceramic, or glass, or the material of the base substrate 1 is a metal material.
- the base substrate 1 shown in FIG. 5 can be formed by etching the plate substrate, or the base substrate 1 shown in FIG. 5 can be formed by providing protrusions on the plate substrate.
- a base layer is formed on a surface of the base substrate having a protrusion, a thickness of a portion of the base layer located at the second substrate region being smaller than a thickness of a portion of the first substrate region, in a surface of the base layer,
- the surface away from the substrate substrate is planar, and the surface adjacent to the substrate substrate has at least one groove, and at least one groove corresponds to at least one protrusion in one-to-one correspondence.
- FIG. 6 it is a schematic diagram of a substrate layer 011 formed on a surface of a substrate substrate 1 having a protrusion provided by an embodiment of the present application.
- the base layer 011 is located in FIG.
- the thickness of the portion of the two substrate regions B2 is smaller than the thickness of the portion of the first substrate region B1
- the surface of the substrate layer 011 is planar with respect to the surface of the substrate substrate 011
- the surface of the substrate substrate 1 has at least one concave surface.
- the grooves (not shown in FIG. 6) correspond to the at least one protrusion G of the base substrate 1 in one-to-one correspondence.
- the material of the base layer 011 may be an organic polymer material such as polyimide or an organic polymer material mixed with glass fiber particles, and the preparation process of the base layer 011 may be a dip coating method, an inkjet method or a spin coating method. Wait.
- a polyimide material may be formed as the base layer 011 on the surface of the base substrate 1 having projections by dip coating, inkjet method or spin coating.
- step 403 a display film layer is formed on a side of the base layer away from the base substrate.
- FIG. 7 it is a schematic diagram of a display film layer formed on the side of the substrate layer 011 away from the substrate 1 , which is provided in the direction away from the substrate layer 011 .
- the semiconductor layer 015, the gate insulating layer 016, the gate electrode 017, the second insulating layer 018, and the source and drain layers constitute a TFT, and the TFT belongs to a pixel circuit, and the first electrode 020, the light-emitting function layer 022, and the second electrode 023 are in contact with each other and superimposed.
- the portion constitutes a light emitting unit, the pixel defining layer 021 is for defining a pixel opening, and the light emitting unit is located in the pixel opening.
- one of the first electrode 020 and the second electrode 023 may be an anode, and the other electrode may be a cathode, and the planarization layer 019 is used for absorbing the unevenness of the surface of the substrate on which the TFT is formed, so that the substrate on which the TFT is formed The surface is flattened to facilitate the preparation of the light-emitting unit.
- the first insulating layer 014 may be a single layer or a multilayer structure formed by CVD using an inorganic compound such as silicon nitride or silicon oxide.
- the semiconductor layer 015 may be a film layer structure formed by CVD using a silicon oxide semiconductor.
- the gate insulating layer 016 may be a single layer or a multilayer structure formed by CVD using an inorganic compound such as silicon nitride or silicon oxide.
- the gate electrode 017 may be a single layer or a multilayer structure formed by a sputtering method, CVD, or the like using a metal material such as copper, aluminum, molybdenum, or tungsten.
- the second insulating layer 018 may be a single layer or a multilayer structure formed by CVD using an inorganic compound such as silicon nitride or silicon oxide.
- the planarization layer 019 may be a film layer structure formed by a dip coating method, an inkjet method, a spin coating method, or the like using an organic polymer material such as polyimide or epoxy resin.
- the first electrode 020 may be a single layer or a multilayer structure formed by a sputtering method or the like using a metal material such as silver or aluminum or a metal oxide such as ITO, IZO or ZnO:Al.
- the pixel defining layer 021 may be a film layer formed by a dip coating method, an inkjet method, a spin coating method, or the like using an organic polymer material such as polyimide or epoxy resin.
- the light-emitting function layer 022 may be a multilayer structure formed by an inkjet method, a spin coating method, a vapor deposition method, or the like.
- the second electrode 023 may be a film layer structure formed by a sputtering method, a vapor deposition method, or the like using a metal material such as silver or aluminum.
- the second electrode 023 may be a film layer structure formed by a sputtering method, a vapor deposition method, or the like using a metal material such as silver or aluminum.
- an encapsulation layer is formed on a side of the display film layer away from the substrate layer, the encapsulation layer having at least one groove away from the surface of the display film layer, and the orthographic projection of the at least one groove on the substrate substrate is located on the second liner In the bottom area.
- a schematic diagram of the encapsulation layer 012 is formed on the side of the display film layer away from the substrate layer 011 , and the encapsulation layer 012 is away from the display film layer (not shown in FIG. 8 ).
- the surface of the surface has at least one groove W, and in conjunction with FIGS. 5 and 8, the orthographic projection of at least one groove W on the substrate substrate 1 is located in the second substrate region B2.
- the surface of the encapsulation layer 012 away from the display film layer has three grooves W, and the orthographic projection of the three grooves W on the substrate substrate 1 is located in the second substrate region B2.
- the encapsulating layer 012 may be a single layer or a multilayer structure formed by CVD, spin coating, sputtering, inkjet, or the like using an inorganic compound such as silicon nitride or silicon oxide.
- the encapsulation material layer may be formed on a side of the display film layer away from the base layer 011, and then at least one groove is formed on the surface of the encapsulation material layer away from the display film layer to obtain the encapsulation layer 012.
- a layer of silicon nitride may be deposited as a package material layer on the side of the display film layer away from the substrate layer 011 by CVD, and then the package material layer is processed by a patterning process, so that the package material layer is away from the display film layer.
- the surface forms at least one groove W.
- one patterning process includes photoresist coating, exposure, development, etching, and photoresist stripping
- processing the package material layer by one patterning process may include: coating a layer of photoresist on the layer of the package material to form The photoresist layer is exposed to a photoresist layer by using a mask to form a fully exposed region and a non-exposed region, and then processed by a development process to completely remove the photoresist in the completely exposed region.
- the photoresist in the exposed area is completely retained, and an area corresponding to the completely exposed area on the package material layer is etched to obtain at least one groove W, and finally the photoresist in the non-exposed area is peeled off to obtain an encapsulation layer 012.
- a polarizing layer is formed on a side of the encapsulating layer away from the display film layer, and the base layer, the display film layer, the encapsulating layer and the polarizing layer constitute a plurality of functional layers, and the base layer and the encapsulating layer are both target functional layers.
- FIG. 9 it is a schematic diagram of a substrate layer 011, a display film layer, an encapsulation layer 012 and a polarized light after the polarizing layer 013 is formed on the side of the encapsulation layer 012 away from the display film layer.
- the layer 013 constitutes a plurality of functional layers, and the base layer 011 and the encapsulation layer 012 are both target functional layers.
- the polarizing layer 014 may be formed on the side of the encapsulation layer 012 away from the display film layer by using a lamination method or the like.
- the polarizing layer 014 may be attached to the side of the encapsulation layer 012 away from the display film layer by using an optical adhesive, or polarized light may be used.
- the polarizing layer 014 is prepared on the side of the encapsulating layer 012 away from the display film layer, which is not limited in the embodiment of the present application.
- step 406 the base substrate is peeled off to obtain a display panel.
- a display panel After the base substrate 1 is peeled off, a display panel can be obtained.
- the schematic view of the display panel can be as shown in FIG. 3, and the display panel is composed of a plurality of functional layers superposed and distributed.
- the base substrate 1 may be peeled off by mechanical separation or physical separation or the like.
- the base substrate 1 can be peeled off by a laser lift-off process.
- a laser can be used to illuminate the substrate 1 from the side of the base substrate 1 away from the base layer 011, and between the base layer 011 and the base substrate 1 The adhesion is removed, thereby peeling off the substrate 1 .
- the manufacturing method embodiments of the display panel provided by the embodiments of the present application can refer to the corresponding display panel embodiments.
- the sequence of the steps of the method for manufacturing the display panel provided by the embodiment of the present application can be appropriately adjusted, and the steps can be correspondingly increased or decreased according to the situation. Any person skilled in the art can be within the technical scope disclosed in the present application. The method of easily thinking about changes should be covered within the scope of protection of the present application, and therefore will not be described again.
- the display panel manufactured by the method is divided into a first panel area and a second panel area, the first panel area is used for illumination, and the second panel area is illuminated.
- the function is different from the light-emitting function of the first panel area, and the target area is present in the second panel area, and the thickness of the target area is smaller than the thickness of the first panel area, so that when the display panel is bent, the stress of the display panel is second
- the panel area is concentrated, thereby reducing the stress of the first panel area, helping to reduce the probability of cracking of the film layer in the first panel area, and avoiding the influence of the crack of the film layer in the first panel area on the display effect of the display panel.
- the embodiment of the present application further provides a display device, which may include the display panel provided by the above embodiment.
- the display panel is divided into a first panel area and a second panel area, the first panel area is used for illumination, the illumination function of the second panel area is different from the illumination function of the first panel area, and the target area exists in the second panel area.
- the thickness of the target area is less than the thickness of the first panel area.
- the display panel includes at least one target functional layer, and a surface of the portion of the target functional layer located at the target area has at least one groove.
- the groove is elongated, and the first section of the groove is rectangular or trapezoidal, and the first section is parallel to the thickness direction of the target functional layer and perpendicular to the length direction of the groove.
- the depth of the groove ranges from 500 nanometers to 50 micrometers, and the width of the opening surface of the groove is less than or equal to 10 micrometers, and the depth direction of the groove is parallel to the thickness direction of the target functional layer.
- the display panel comprises a plurality of functional layers stacked and distributed, and the target functional layer is a functional layer adjacent to the outer side of the plurality of functional layers.
- the plurality of functional layers include a base layer, a display film layer, an encapsulation layer and a polarizing layer which are sequentially superposed, and the base layer and the encapsulation layer are both target functional layers.
- the display film layer comprises a first insulating layer, a semiconductor layer, a gate insulating layer, a gate electrode, a second insulating layer, a source/drain layer, and a planarization layer located between the base layer and the encapsulation layer in a direction away from the substrate layer. a layer, a first electrode, a pixel defining layer, a light emitting functional layer, and a second electrode.
- the display panel comprises a light emitting unit and a pixel circuit, wherein the light emitting unit and the pixel circuit are both located in the first panel area.
- the display device is an electroluminescent display device, and correspondingly, the light emitting unit is an electroluminescent unit.
- the display device may be an OLED display device, and correspondingly, the light emitting unit may be an OLED; or the display device may be a QLED display device, and correspondingly, the light emitting unit is a QLED.
- the first panel area is a light emitting area
- the second panel area is a non-light emitting area
- the display device may be a flexible display device.
- the display device may be a wearable device such as a watch or a wristband, a mobile terminal such as a mobile phone or a tablet computer, or any product or component having a display function such as a television, a display, a notebook computer, a digital photo frame, and a navigation device. .
- a wearable device such as a watch or a wristband
- a mobile terminal such as a mobile phone or a tablet computer
- any product or component having a display function such as a television, a display, a notebook computer, a digital photo frame, and a navigation device.
- the display panel is divided into a first panel area and a second panel area, the first panel area is used for illumination, and the illumination function of the second panel area is The illumination function of the first panel area is different, and the target area is present in the second panel area, and the thickness of the target area is smaller than the thickness of the first panel area, so that when the display panel is bent, the stress of the display panel is directed to the second panel area. Concentration, thereby reducing the stress of the first panel region, helps to reduce the probability of cracking of the film layer of the first panel region (ie, the light-emitting region), and avoids cracking of the first panel region to display the display panel The effect of the effect.
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Abstract
Description
Claims (22)
- 一种显示面板,所述显示面板划分为第一面板区域和第二面板区域,所述第一面板区域用于发光,所述第二面板区域的发光功能与所述第一面板区域的发光功能不同,所述第二面板区域中存在目标区域,所述目标区域的厚度小于所述第一面板区域的厚度。
- 根据权利要求1所述的显示面板,其中,所述显示面板包括至少一个目标功能层,所述目标功能层中位于所述目标区域的部分的表面具有至少一个凹槽。
- 根据权利要求2所述的显示面板,其中,所述凹槽呈长条状,所述凹槽的第一截面呈矩形或梯形,所述第一截面平行于所述目标功能层的厚度方向,且垂直于所述凹槽的长度方向。
- 根据权利要求3所述的显示面板,其中,所述凹槽的深度的取值范围为500纳米~50微米,所述凹槽的开口面的宽度小于或等于10微米,所述凹槽的深度方向平行于所述目标功能层的厚度方向。
- 根据权利要求2至4任一项所述的显示面板,其中,所述显示面板包括层叠分布的多个功能层,所述目标功能层为所述多个功能层中靠近外侧的功能层。
- 根据权利要求5所述的显示面板,其中,所述多个功能层包括依次叠加的基底层、显示膜层、封装层以及偏光层,所述基底层和所述封装层均为所述目标功能层。
- 根据权利要求6所述的显示面板,其中,所述显示膜层包括沿远离所述基底层的方向位于所述基底层与所述封装层之间的第一绝缘层、半导体层、栅绝缘层、栅极、第二绝缘层、源漏极层、平坦化层、第一电极、像素界定层、发光功能层和第二电极。
- 根据权利要求1至7任一项所述的显示面板,其中,所述显示面板包括发光单元和像素电路,所述发光单元和所述像素电路均位于所述第一面板区域中。
- 根据权利要求8所述的显示面板,其中,所述显示面板为电致发光显示面板,所述发光单元为电致发光单元。
- 根据权利要求9所述的显示面板,其中,所述显示面板为OLED显示面板,所述发光单元为OLED;或者,所述显示面板为QLED显示面板,所述发光单元为QLED。
- 根据权利要求1至10任一项所述的显示面板,其中,所述第一面板区域为发光区域,所述第二面板区域为非发光区域。
- 根据权利要求1至10任一项所述的显示面板,其中,所述显示面板为柔性显示面板。
- 一种显示面板的制造方法,所述方法包括:制造显示面板,所述显示面板划分为第一面板区域和第二面板区域,所述第一面板区域用于发光,所述第二面板区域的发光功能与所述第一面板区域的发光功能不同,所述第二面板区域中存在目标区域,所述目标区域的厚度小于所述第一面板区域的厚度。
- 根据权利要求13所述的方法,其中,所述制造显示面板,包括:形成层叠分布的多个功能层,所述多个功能层包括至少一个目标功能层,所述目标功能层中位于所述目标区域的部分的表面具有至少一个凹槽。
- 根据权利要求14所述的方法,其中,所述形成层叠分布的多个功能层,包括:提供一衬底基板,所述衬底基板划分为第一衬底区域和第二衬底区域,所述第二衬底区域凸出于所述第一衬底区域,所述第二衬底区域具有至少一个凸起;在所述衬底基板具有所述凸起的表面上形成基底层,所述基底层中位于所述第二衬底区域的部分的厚度小于位于所述第一衬底区域的部分的厚度,所述基底层的表面中,远离所述衬底基板的表面为平面,靠近所述衬底基板的表面具有至少一个凹槽,所述至少一个凹槽与所述至少一个凸起一一对应;在所述基底层远离所述衬底基板的一侧形成显示膜层;在所述显示膜层远离所述基底层的一侧形成封装层,所述封装层远离所述显示膜层的表面具有至少一个凹槽,所述至少一个凹槽在所述衬底基板上的正投影位于所述第二衬底区域中;在所述封装层远离所述显示膜层的一侧形成偏光层,所述基底层、所述显示膜层、所述封装层和所述偏光层组成所述多个功能层,所述基底层和所述封装层均为所述目标功能层;剥离所述衬底基板。
- 根据权利要求15所述的方法,其中,在所述显示膜层远离所述基底层的一侧形成封装层,所述封装层远离所述显示膜层的表面具有至少一个凹槽,包括:在所述显示膜层远离所述基底层的一侧形成封装材质层;在所述封装材质层远离所述显示膜层的表面形成至少一个凹槽,得到所述封装层。
- 一种显示装置,所述显示装置包括显示面板,所述显示面板划分为第一面板区域和第二面板区域,所述第一面板区域用于发光,所述第二面板区域的发光功能与所述第一面板区域的发光功能不同,所述第二面板区域中存在目标区域,所述目标区域的厚度小于所述第一面板区域的厚度。
- 根据权利要求17所述的显示装置,其中,所述显示面板包括发光单元和像素电路,所述发光单元和所述像素电路均位于所述第一面板区域中。
- 根据权利要求18所述的显示装置,其中,所述显示装置为电致发光显示装置,所述发光单元为电致发光单元。
- 根据权利要求19所述的显示装置,其中,所述显示装置为OLED显示装置,所述发光单元为OLED;或者,所述显示装置为QLED显示装置,所述发光单元为QLED。
- 根据权利要求17至20任一项所述的显示装置,其中,所述第一面板区域为发光区域,所述第二面板区域为非发光区域。
- 根据权利要求17至21任一项所述的显示装置,其中,所述显示装置为柔性显示装置。
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CN108281475B (zh) * | 2018-03-28 | 2020-07-28 | 京东方科技集团股份有限公司 | 显示面板及其制造方法、显示装置 |
CN109407196B (zh) * | 2018-09-30 | 2021-11-30 | 广州国显科技有限公司 | 偏光片、柔性显示面板及柔性显示装置 |
CN111833753B (zh) * | 2020-08-07 | 2022-03-25 | 上海天马微电子有限公司 | 可拉伸显示面板及可拉伸显示装置 |
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KR102546713B1 (ko) * | 2018-04-26 | 2023-06-22 | 삼성디스플레이 주식회사 | 폴더블 표시 장치 |
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2018
- 2018-03-28 CN CN201810265553.8A patent/CN108281475B/zh active Active
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2019
- 2019-03-26 WO PCT/CN2019/079639 patent/WO2019184901A1/zh active Application Filing
- 2019-03-26 US US16/622,407 patent/US20200203443A1/en not_active Abandoned
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- 2022-05-25 US US17/753,000 patent/US20220285464A1/en active Pending
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CN108281475A (zh) * | 2018-03-28 | 2018-07-13 | 京东方科技集团股份有限公司 | 显示面板及其制造方法、显示装置 |
CN208256674U (zh) * | 2018-03-28 | 2018-12-18 | 京东方科技集团股份有限公司 | 显示面板、显示装置 |
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US20220285464A1 (en) | 2022-09-08 |
CN108281475B (zh) | 2020-07-28 |
US20200203443A1 (en) | 2020-06-25 |
CN108281475A (zh) | 2018-07-13 |
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