WO2019170013A1 - 电子装置及其制造方法 - Google Patents

电子装置及其制造方法 Download PDF

Info

Publication number
WO2019170013A1
WO2019170013A1 PCT/CN2019/076121 CN2019076121W WO2019170013A1 WO 2019170013 A1 WO2019170013 A1 WO 2019170013A1 CN 2019076121 W CN2019076121 W CN 2019076121W WO 2019170013 A1 WO2019170013 A1 WO 2019170013A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
receiver
infrared light
coating layer
transparent
Prior art date
Application number
PCT/CN2019/076121
Other languages
English (en)
French (fr)
Inventor
李�杰
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2019170013A1 publication Critical patent/WO2019170013A1/zh

Links

Images

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/042Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means
    • G06F3/0421Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means by interrupting or reflecting a light beam, e.g. optical touch-screen
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1626Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0266Details of the structure or mounting of specific components for a display module assembly
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1643Details related to the display arrangement, including those related to the mounting of the display in the housing the display being associated to a digitizer, e.g. laptops that can be used as penpads
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M2250/00Details of telephonic subscriber devices
    • H04M2250/12Details of telephonic subscriber devices including a sensor for measuring a physical value, e.g. temperature or motion

Definitions

  • the present application relates to the field of electronic technologies, and in particular, to an electronic device and a method of fabricating the same.
  • the infrared proximity sensor emits infrared rays outward, and then measures the distance between the obstacle and the sensor by measuring the intensity of the infrared rays reflected by the obstacle, and the mobile phone presets according to the distance information measured by the infrared proximity sensor. operating.
  • comprehensive screens have become the development trend of mobile phones.
  • the high screen ratio of the full screen makes the position of the proximity sensor or other components in the screen limited.
  • Embodiments of the present application provide an electronic device and a method of fabricating the same.
  • the electronic device of the embodiment of the present application includes: a transparent display screen, the transparent display screen includes an upper surface and a lower surface opposite to the upper surface, wherein the transparent display screen is illuminated by the upper surface,
  • the lower surface includes a display area and a bezel area surrounding the display area; an infrared sensor including an emitter for emitting infrared light through the bezel area and receiving the infrared light through the display area receiver.
  • a light transmissive display screen comprising an upper surface and a lower surface opposite the upper surface, the transparent display screen being illuminated by the upper surface, the lower surface comprising a display area and surrounding The border area of the display area;
  • An infrared sensor comprising a transmitter and a receiver, the transmitter being located on a corresponding side of the bezel area, the transmitter for emitting infrared light, and the receiver for receiving the display area through the display area Said infrared light.
  • the transparent display screen comprising an upper surface and a lower surface opposite to the upper surface, the transparent display screen for displaying light through the upper surface, the lower surface comprising a display area and a border area surrounding the display area;
  • An infrared sensor including a transmitter for emitting infrared light through the bezel area and a receiver for receiving the infrared light through the display area.
  • FIG. 1 is a perspective view of an electronic device of the present invention
  • Figure 2 is a schematic cross-sectional view of some embodiments of the present invention.
  • FIG. 3 is a perspective view of a transparent display screen of the present invention.
  • Figure 4 is a schematic cross-sectional view of some embodiments of the present invention.
  • Figure 5 is a schematic cross-sectional view of certain embodiments of the present invention.
  • Figure 6 is a schematic cross-sectional view of some embodiments of the present invention.
  • FIGS. 7A-7C are schematic views of certain embodiments of the present invention.
  • Figure 8 is a schematic cross-sectional view of some embodiments of the present invention.
  • FIGS. 9A-9C are schematic views of certain embodiments of the present invention.
  • FIGS. 10A and 10B are schematic views of certain embodiments of the present invention.
  • FIG. 11A and 11B are schematic views of certain embodiments of the present invention.
  • FIGS. 12A and 12B are schematic cross-sectional views of an electronic device of the present invention.
  • Figure 13 is a schematic cross-sectional view of some embodiments of the present invention.
  • Figure 14 is a schematic flow chart of the manufacturing method of the present invention.
  • 15 is a schematic flow chart of a manufacturing method of some embodiments of the present invention.
  • 16 is a schematic flow chart of a manufacturing method of some embodiments of the present invention.
  • 17 is a schematic flow chart of a manufacturing method of some embodiments of the present invention.
  • Figure 19 is a further flow diagram of Figure 18 of the present invention.
  • the main component symbol description the transparent cover 11 , the transparent touch panel 12 , the transparent display 13 , the first coating layer 14 , the second coating layer 15 , the infrared sensor 16 , the buffer layer 17 , the metal sheet 18 ,
  • the housing 20 the electronic device 100, the upper surface 131, the lower surface 132, the display area 1311, the bezel area 1312, the transmitter 1611, and the receiver 1612.
  • connection In the description of the present application, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be fixed or detachable, for example, unless otherwise specifically defined and defined. Connected, or integrally connected; may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship.
  • Connected, or integrally connected may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship.
  • the specific meanings of the above terms in the present application can be understood on a case-by-case basis.
  • the first feature "on" the second feature may include direct contact of the first and second features, and may also include that the first and second features are not in direct contact but are contacted by additional features between them. .
  • Electronic devices such as mobile phones or tablets, generally detect the distance between the electronic device and the user by installing an infrared sensor.
  • an infrared sensor is provided in an upper area of the mobile phone.
  • the processor executes corresponding instructions, such as turning off the light of the display component.
  • setting an infrared sensor on an electronic device requires opening a corresponding hole in the casing for transmitting and receiving infrared light signals, but with the development of electronic devices, people are increasingly demanding the appearance and operation experience of the mobile phone. The higher.
  • the mobile phone has been developed in the direction of a full screen, and the full screen mobile phone forms an ultra-narrow bezel between the casing and the display assembly. Since the width of the ultra-narrow bezel is too small, there may not be enough space to open the hole, even if the opening will result in The overall strength of the frame is reduced, which in turn makes the reliability of the electronic device low.
  • the electronic device 100 of the embodiment of the present invention may be a mobile phone or a tablet computer or the like.
  • the electronic device 100 of the embodiment of the present invention is described by taking a mobile phone as an example.
  • the specific form of the electronic device 100 may be other, and is not limited herein.
  • the electronic device 100 includes a transparent display 13 , an infrared sensor 16 , and a housing 20 .
  • the transparent display screen 13 includes an upper surface 131 and a lower surface 132.
  • the upper surface 131 is disposed opposite to the lower surface 132.
  • the lower surface 132 includes a display area 1311 and a frame area 1312.
  • the frame area 1312 surrounds the display area 1311.
  • the transparent display screen 13 is used for illuminating display through the upper surface 131.
  • the infrared sensor 16 includes a transmitter 1611 for emitting infrared light through the bezel area 1312 and a receiver 1612 for receiving infrared light through the display area 1311.
  • the emitter 1611 is configured to emit infrared light.
  • the emitted infrared light encounters an obstacle in the detection direction, a part of the infrared light is reflected and received by the receiver 1612, and the time when the infrared light is emitted from the reflection to the reflection is calculated by the processor.
  • the distance between the electronic device 100 and the obstacle can be determined and adjusted accordingly.
  • the electronic device 100 approaches the head, the transmitter 1611 emits infrared light, and the receiver 1612 receives the infrared light reflected by the head, and the processor calculates the time when the infrared light is emitted from the reflection to the reflection.
  • the corresponding command is sent to control the screen to turn off the backlight.
  • the processor again performs calculation based on the feedback data and issues an instruction to reopen the backlight of the screen. In this way, not only the user's misoperation is prevented, but also the power of the mobile phone is saved.
  • the housing 20 is used to house components and components for protection. By arranging the housing 20 to enclose the components and components, external factors are prevented from causing direct damage to these components.
  • the housing 20 can be formed by machining an aluminum alloy by a CNC machine tool, or can be injection molded from a polycarbonate (PC) or a PC+ABS material.
  • the electronic device 100 of the embodiment of the present invention can use the transparent display 13 to set the infrared sensor 16 under the transparent display 13 in the case of a full screen, thereby avoiding the traditional opening operation and ensuring the electronic
  • the reliability of the overall strength of the bezel area 1312 of the device 100 further increases the screen ratio of the electronic device.
  • the emitter 1611 of the red light sensor 16 is disposed in the bezel area 1312 while avoiding the infrared light emitted by the emitter 1611 from affecting the operational stability of the TFT of the display area 1311.
  • the light transmissive display 13 includes an OLED display.
  • an Organic Light-Emitting Diode (OLED) display screen has good light transmittance and is capable of transmitting visible light and infrared light. Therefore, the OLED display does not affect the infrared sensor to emit and receive infrared light in the case of exhibiting the effect of the content.
  • the transparent display 13 can also adopt a Micro LED display, which also has good light transmittance for visible light and infrared light.
  • these displays are merely exemplary and embodiments of the invention are not limited thereto.
  • the electronic device 100 further includes a transparent touch panel 12 and a transparent cover 11 .
  • the transparent cover 11 is formed on the transparent touch panel 12
  • the transparent touch panel 12 is disposed on the transparent display 13 .
  • the upper surface 131 of the transparent display 13 faces the transparent touch panel 12 .
  • the light transmittance of the control panel 12 and the transparent cover plate 11 for visible light and the transmittance of infrared light are both greater than 90%.
  • the transparent touch panel 12 is mainly used to receive an input signal generated by the user when the transparent touch panel 12 is touched and transmitted to the circuit board for data processing, thereby obtaining a specific touch of the transparent touch panel 12 by the user. position.
  • the In-Cell or On-Cell bonding technology can be used to attach the transparent touch panel 12 to the transparent display panel 13, which can effectively reduce the weight of the display and reduce the overall thickness of the display.
  • the transparent cover 11 is disposed on the transparent touch panel 12, which can effectively protect the transparent touch panel 12 and its internal structure, and avoid external force on the transparent touch panel 12 and the transparent display. 13 damage.
  • the transmittances of the transparent cover 11 and the transparent touch panel 12 for visible light and infrared light are both greater than 90%, which not only facilitates the transparent display 13 to better display the content effect, but also facilitates setting in the transparent display.
  • the infrared sensor 16 under the screen 13 stably emits and receives infrared light, which ensures the normal operation of the infrared sensor 16.
  • the transparent display screen 13 is used to illuminate the display area 1311, and the ratio of the area of the display area 1311 to the transparent cover 11 is greater than 90%.
  • the display area 1311 can display the content effect in a larger size area, which is not only improved. A good user experience is also effective, and the screen ratio of the electronic device 100 is also effectively increased.
  • the bezel area 1312 can also be used to block other components and metal lines under the light transmissive display 13 to maintain a consistent appearance.
  • the frame area 1312 can enhance the optical density of the transparent display 13 by printing ink, and also provides a good visual effect while ensuring the shading effect.
  • the electronic device 100 further includes a first coating layer 14 , and the first coating layer 14 is coated on the lower surface 132 and covers the emitter 1611 .
  • the installation of the emitter 1611 during process assembly generally requires the assembly gap to be reserved, resulting in a gap between the emitter 1611 and other components, allowing visible light to enter from the gap, causing light leakage. Therefore, in the direction in which the emitter 1611 and the transmissive display 13 are stacked, the area of the orthographic projection of the first coating layer 14 at the lower surface 132 covers the area of the orthographic projection of the emitter 1611 at the lower surface 132, without affecting the emitter. In the case of normal operation of the 1611, the first coating layer 14 is sufficiently shielded from the emitter 1611, so that when the electronic device 100 is viewed from the outside, the effect that the emitter 1611 is invisible is achieved.
  • the first coating layer 14 is used to transmit infrared light and intercept visible light
  • the emitter 1611 is configured to emit infrared light through the first coating layer 14 and the bezel region 1312.
  • the first coating layer 14 transmits infrared light, so that when the emitter 1611 detects the outward emitting infrared light, the intensity of the infrared light passing through the first coating layer 14 is attenuated less, or attenuated. The degree does not affect the detection process, thus ensuring the normal operation of the transmitter 1611.
  • the first coating layer 14 intercepts visible light so that visible light cannot pass through the first coating layer 16 to visually block the emitter 1611, so that when the electronic device 100 is viewed from the outside, the effect of the emitter 1611 being invisible is achieved.
  • the infrared sensor 16 includes a proximity sensor that includes a signal transmitter 1 and a signal receiver for emitting infrared light through the first coating layer 1311 and the bezel region 1312, the signal receiver being used for Infrared light reflected by the object is received to detect the distance of the object from the electronic device 100.
  • the electronic device 100 when the user answers or makes a call, the electronic device 100 approaches the head, the signal transmitter emits infrared light, the signal receiver receives the reflected infrared light, and the processor calculates the time when the infrared light is emitted from the reflection to the reflection.
  • the corresponding command control screen turns off the backlight.
  • the processor again performs calculation based on the feedback data and issues an instruction to reopen the screen backlight. In this way, not only the user's misoperation is prevented, but also the power of the mobile phone is saved.
  • the first coating layer 14 comprises an IR ink having an IR transmittance of greater than 85% for infrared light, a transmittance of less than 6% for visible light, and a wavelength of infrared light transparent to the IR ink. It is 850 nm to 940 nm.
  • the IR ink has a characteristic of low light transmittance to visible light
  • the emitter 1611 disposed under the first coating layer 14 is not visually observed based on the human eye.
  • the IR ink has the characteristics of high transmittance to infrared light
  • the emitter 1611 can stably emit infrared light, and the normal operation of the emitter 1611 is ensured.
  • the transmitter 1611 and the receiver 1612 are of a split configuration.
  • the transmitter 1611 and the receiver 1612 are in a separate structure, a compact arrangement can be selected in the arrangement position, or a distributed arrangement can be selected, and the receiver 1612 can be flexibly set in an area such as a low frequency display. A location that has little effect on the display pixels.
  • a transmitter 1611 may be disposed in the bezel area 1312, and a receiver 1612 may be disposed in the display area 1311. It is also possible to provide a transmitter 1611 in the bezel area 1312 and a plurality of receivers 1612 in the display area 1311. A transmitter 1611 may be disposed on each side of the frame area 1312, and a receiver 1612 is disposed on each side of the display area 1311.
  • the transmitter 1611 and the receiver 1612 are of unitary construction.
  • the transmitter 1611 and the receiver 1612 are integrated structures, and the integrated structure makes the overall structure of the component compact, so that the layout of the components under the display screen is reasonable, the circuit process flow and the wiring space are reduced, the production efficiency of the product is improved, the production cost is reduced, and the component layout is reduced. Regularization is convenient for maintenance and maintenance.
  • the unitary structure may also include an ambient light sensor to further increase the integration of the components.
  • the electronic device 100 further includes a second coating layer 15 coated on the lower surface 132 and covering the receiver 1612 , and the second coating layer 15 is used to transmit infrared rays. The light is intercepted and the receiver 1612 is configured to receive infrared light through the display area 1311 and the second coating layer 15.
  • the installation of the receiver 1612 during process assembly generally requires the assembly gap to be reserved, resulting in a gap between the receiver 1612 and other components, allowing visible light to enter from the gap, causing light leakage. Therefore, in the direction in which the receiver 1612 and the transmissive display 13 are stacked, the area of the orthographic projection of the second coating layer 15 at the lower surface 132 covers the area of the orthographic projection of the receiver 1612 at the lower surface 132, without affecting the receiver.
  • the second coating layer 15 is sufficiently shielded from the receiver 1612, so that when the electronic device 100 is viewed from the outside, the effect of the receiver 1612 being invisible is achieved.
  • the second coating layer 15 may also employ an IR ink.
  • the IR ink Since the IR ink has a characteristic of low transmittance to visible light, when the electronic device 100 is viewed from the outside, the human eye-based vision cannot be perceived to be disposed on the second coating layer. Receiver 1612 under 15. At the same time, since the IR ink has the characteristics of high transmittance to infrared light, the receiver 1612 can stably receive infrared light, and the normal operation of the receiver 1612 is ensured.
  • the electronic device 100 further includes a buffer layer 17 covering the lower surface 132 and evading the receiver 1612 .
  • the buffer layer 17 is used to mitigate the impact force and shockproof to protect the transparent touch panel 12 and the transparent display screen 13 and the internal structure thereof, thereby preventing the display screen from being damaged by external impact.
  • the buffer layer 17 can be made of foam or foam or rubber or other soft material. Of course, these cushioning materials are merely exemplary and embodiments of the invention are not limited thereto.
  • the receiver 1612 is avoided during the setting of the buffer layer 17 in order to prevent the buffer layer 17 from blocking the receiver 1612 from receiving signals, so that the receiver 1612 is not affected in the process of receiving infrared light.
  • the electronic device 100 further includes a metal sheet 18 covering the buffer layer 17 and evading the receiver 1612 .
  • the metal piece 18 is used to shield electromagnetic interference and grounding, and has a function of diffusing temperature rise.
  • the metal piece 18 can be cut from a metal material such as copper foil or aluminum foil.
  • these metallic materials are merely exemplary and the embodiments of the present invention are not limited thereto.
  • the receiver 1612 is avoided during the placement of the metal sheet 18 in order to prevent the metal sheet 18 from intercepting the receiver 1612 from receiving signals to prevent the receiver 1612 from being affected during the reception of infrared light.
  • an embodiment of the present invention provides a method 30 for manufacturing an electronic device 100, including the following steps:
  • a transparent display 13 is provided.
  • the transparent display 13 includes an upper surface 131 and a lower surface 132.
  • the upper surface 131 is disposed opposite to the lower surface 132, and the transparent display 13 is configured to emit light through the upper surface 131.
  • the lower surface 132 includes a display area 1311 and a bezel area 1312 surrounding the display area 1311.
  • the infrared sensor 16 includes a transmitter 1611 for emitting infrared light through the bezel area 1312 and a receiver 1612 for receiving infrared light through the display area 1311.
  • the electronic device 100 adopts a transparent display screen 13 , and the infrared sensor 16 can be disposed under the transparent display screen 13 in the case of a full screen, and the emitter 1611 of the red light sensor 16 is disposed in the frame region 1312 to avoid
  • the infrared light emitted by the emitter 1611 affects the operational stability of the TFT of the display area 1311, so that the transparent display screen 13 and the infrared sensor 16 can achieve respective functions without mutual interference.
  • the transparent display screen 13 can be an Organic Light-Emitting Diode (OLED) display screen, and the OLED display screen has good light transmittance and can pass visible light and infrared light.
  • OLED Organic Light-Emitting Diode
  • the OLED display does not affect the infrared sensor to emit and receive infrared light in the case of exhibiting the effect of the content.
  • the transparent display 13 can also adopt a Micro LED display, which also has good light transmittance for visible light and infrared light.
  • these displays are merely exemplary and embodiments of the invention are not limited thereto.
  • the upper surface 131 of the transparent display screen 13 is used to display the content effect through visible light on the one hand, and the infrared sensor 16 to normally emit and receive infrared light through the infrared light on the other hand.
  • the manufacturing method 30 of the electronic device 100 further includes the following steps:
  • a transparent touch panel 12 is disposed on the transparent display screen 13.
  • a transparent cover 11 is disposed on the transparent touch panel 12.
  • the transparent touch panel 12 is mainly used to receive an input signal generated by the user when the transparent touch panel 12 is touched and transmitted to the circuit board for data processing, thereby obtaining a specific touch of the transparent touch panel 12 by the user. position.
  • the In-Cell or On-Cell bonding technology can be used to fit the transparent touch panel 12 and the transparent display 13 to effectively reduce the weight of the display and reduce the overall thickness of the display.
  • the transparent cover panel 11 is disposed on the transparent touch panel 12 to protect the transparent touch panel 12 and its internal structure, thereby avoiding direct damage to the transparent touch panel 12 caused by external forces.
  • the manufacturing method 10 of the electronic device 100 further includes the following steps:
  • a first coating layer 14 is coated on the lower surface 132, the first coating layer 14 covers the emitter 1611, and the emitter 1611 is used to emit infrared light through the first coating layer 14 and the bezel area 1312.
  • the first coating layer 14 may employ an IR ink. Since the IR ink has a low transmittance characteristic to visible light, when the electronic device 100 is viewed from the outside, the human eye-based vision cannot be perceived to be disposed in the first coating.
  • the manufacturing method 30 of the electronic device 100 further includes the following steps:
  • the second coating layer 15 can also adopt an IR ink. Since the IR ink has a characteristic of low transmittance to visible light, when the electronic device 100 is viewed from the outside, the human eye-based vision cannot be perceived to be set in the second. Receiver 1612 under coating layer 15. At the same time, since the IR ink has the characteristics of high transmittance to infrared light, the receiver 1612 can stably receive infrared light, and the normal operation of the receiver 1612 is ensured.
  • the manufacturing method 30 of the electronic device 100 further includes the steps of:
  • a buffer layer 17 is disposed on the lower surface 132, and the buffer layer 17 covers the lower surface 132 and evades the receiver 1612.
  • the buffer layer 17 is used for mitigating impact force and shockproof to protect the touch panel and the display screen and the internal structure thereof, thereby preventing the display screen from being damaged by external impact.
  • the buffer layer 17 can be made of foam or foam or rubber or other soft material. Of course, these cushioning materials are merely exemplary and embodiments of the invention are not limited thereto.
  • the receiver 1612 is avoided during the setting of the buffer layer 17 in order to prevent the buffer layer 17 from blocking the receiver 1612 from receiving signals to prevent the receiver 1612 from being affected in the process of receiving infrared light.
  • step S307 further includes the steps of:
  • a metal piece 18 is disposed under the buffer layer 17, and the metal piece 18 covers the buffer layer 17 and evades the receiver 1612.
  • the metal piece 18 is used for shielding electromagnetic interference and grounding, and has the function of diffusing temperature rise.
  • the metal piece 18 can be cut by using a metal material such as copper foil or aluminum foil.
  • these metallic materials are merely exemplary and the embodiments of the present invention are not limited thereto.
  • the receiver 1612 is avoided during the placement of the metal sheet 18 in order to prevent the metal sheet 18 from intercepting the receiver 1612 from receiving signals to prevent the receiver 1612 from being affected during the reception of infrared light.

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Position Input By Displaying (AREA)

Abstract

一种电子装置(100),其包括透光显示屏(13)和红外传感器(16)。其中,透光显示屏(13)包括上表面(131)和与上表面(131)相背的下表面(132),透光显示屏(13)用于透过上表面(131)发光显示,下表面(132)包括显示区(1311)和围绕显示区(1311)的边框区(1312)。红外传感器(16)包括用于透过边框区(1312)发射红外光的发射器(1611)和透过显示区(1311)接收红外光的接收器(1612)。

Description

电子装置及其制造方法
优先权信息
本申请请求2018年03月09日向中国国家知识产权局提交的、专利申请号为201810193184.6的专利申请的优先权和权益,并且通过参照将其全文并入此处。
技术领域
本申请涉及电子技术领域,特别涉及一种电子装置及其制造方法。
背景技术
在移动终端中,红外接近传感器向外发射红外线,然后通过测量遇到障碍物反射回来的红外线强度来判断障碍物与传感器之间的距离,手机根据红外接近传感器测量到的距离信息来进行预设操作。随着在移动终端的发展,全面屏已经成为手机的发展趋势。然而,全面屏的高屏占比的特点使得屏幕中留给接近传感器或者其他元件的位置有限。
发明内容
本申请的实施方式提供了一种电子装置及其制造方法。
本申请实施方式的电子装置包括:透光显示屏,所述透光显示屏包括上表面和与上表面相背的下表面,所述透光显示屏透过所述上表面发光显示,所述下表面包括显示区和围绕所述显示区的边框区;红外传感器,所述红外传感器包括用于透过所述边框区发射红外光的发射器和透过所述显示区接收所述红外光的接收器。
本申请实施方式的电子装置,包括:
透光显示屏,所述透光显示屏包括上表面和与上表面相背的下表面,所述透光显示屏透过所述上表面发光显示,所述下表面包括显示区和围绕所述显示区的边框区;
红外传感器,所述红外传感器包括发射器和接收器,所述发射器位于所述边框区对应的一侧,所述发射器用于发射红外光,所述接收器用于透过所述显示区接收所述红外光。
本申请实施方式的电子装置的制造方法包括步骤:
提供一透光显示屏,所述透光显示屏包括上表面和与所述上表面相背的下表面,所述透光显示屏用于透过所述上表面发光显示,所述下表面包括显示区和围绕所述显示区的边框区;和
提供一红外传感器,所述红外传感器包括用于透过所述边框区发射红外光的发射器和透过所述显示区接收所述红外光的接收器。
本申请的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本申请的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解, 其中:
图1是本发明电子装置的立体示意图;
图2是本发明的某些实施方式的截面示意图;
图3是本发明的透光显示屏的立体示意图;
图4是本发明的某些实施方式的截面示意图;
图5是本发明的某些实施方式的截面示意图;
图6是本发明的某些实施方式的截面示意图;
图7A至图7C是本发明的某些实施方式的示意图;
图8是本发明的某些实施方式的截面示意图;
图9A至图9C是本发明的某些实施方式的示意图;
图10A和图10B是本发明的某些实施方式的示意图;
图11A和图11B是本发明的某些实施方式的示意图;
图12A和图12B是本发明的电子装置的截面示意图;
图13是本发明的某些实施方式的截面示意图;
图14是本发明的制造方法的流程示意图;
图15是本发明的某些实施方式的制造方法的流程示意图;
图16是本发明的某些实施方式的制造方法的流程示意图;
图17是本发明的某些实施方式的制造方法的流程示意图;
图18是本发明的某些实施方式的制造方法的流程示意图;和
图19是本发明图18的进一步流程示意图。
主要元件符号说明:透光盖板11、透光触控面板12、透光显示屏13、第一涂布层14、第二涂布层15、红外传感器16、缓冲层17、金属片18、壳体20、电子装置100、上表面131、下表面132、显示区1311、边框区1312、发射器1611、接收器1612。
具体实施方式
下面详细描述本申请的实施方式,所述实施方式的示例在附图中示出,其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的,仅用于解释本申请,而不能理解为对本申请的限制。
在本申请的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接或可以相互通讯;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本申请中的具体含义。
在本申请中,第一特征在第二特征之“上”可以包括第一和第二特征直接接触,也可以包括第一和第二 特征不是直接接触而是通过它们之间的另外的特征接触。
电子设备,例如手机或者平板电脑等,一般通过安装红外传感器来检测电子设备与用户之间的距离。以手机为例,在手机的上部区域设置有红外传感器。当用户进行语音通话或相关操作时,手机靠近头部,红外传感器将距离信息反馈到处理器,处理器执行相应的指令,如关闭显示屏组件的灯光等。在相关技术中,电子设备上设置红外传感器需要在机壳上开设相应的孔洞以用于发射和接收红外光信号,但随着电子设备的发展,人们对手机的外观及操作体验的要求越来越高。手机已经向全面屏方向发展,而全面屏手机在机壳与显示屏组件之间形成超窄边框,由于超窄边框的宽度过小,可能不具有足够的空间开设孔洞,即便开孔也将导致边框整体的强度降低,进而使电子设备的可靠性较低。
请参阅图1,本发明的实施方式的电子装置100可以是手机或者平板电脑等。本发明实施方式的电子装置100以手机为例进行说明,当然,电子装置100的具体形式也可以是其它,在此不做限制。
请参阅图2和图3,电子装置100包括透光显示屏13、红外传感器16和壳体20。
其中,透光显示屏13包括上表面131和下表面132,上表面131与下表面132相背设置,下表面132包括显示区1311和边框区1312,边框区1312围绕显示区1311。透光显示屏13用于透过上表面131发光显示。红外传感器16包括发射器1611和接收器1612,发射器1611用于透过边框区1312发射红外光,接收器1612用于透过显示区1311接收红外光。
发射器1611用于发射红外光,当发射的红外光在检测方向遇上障碍物时,一部分的红外光就会反射回来被接收器1612接收,经过处理器计算红外光从发射到反射回来的时间,可确定电子装置100与障碍物之间的距离并做出相应的调整。当用户在接听或者拨打电话时,电子装置100靠近头部,发射器1611发出红外光,接收器1612接收经头部反射回来的红外光,经过处理器计算该红外光从发射到反射回来的时间,发出相应指令控制屏幕关闭背景灯,当电子装置100远离头部时,处理器再次根据反馈回来的数据进行计算并发出指令,重新打开屏幕背景灯。如此,不仅防止用户的误操作,而且节省手机的电量。
壳体20用于收纳元件和组件以起到保护的作用。通过设置壳体20将元件和组件包围起来,避免了外界因素对这些元件造成直接的损坏。壳体20可以通过CNC机床加工铝合金形成,也可以采用聚碳酸酯(Polycarbonate,PC)或者PC+ABS材料注塑成型。
综上所述,本发明实施方式的电子装置100,采用透光显示屏13可以在全面屏的情况下将红外传感器16设置在透光显示屏13下方,避免了传统的开孔操作,保证电子装置100边框区1312的整体强度的可靠性,还进一步地提高电子装置的屏占比。将红光传感器16的发射器1611设置在边框区1312同时又可以避免发射器1611发出的红外光影响显示区1311的TFT的工作稳定性。
在某些实施方式中,透光显示屏13包括OLED显示屏。
具体地,有机发光二极管(Organic Light-Emitting Diode,OLED)显示屏具有良好的透光性,能够透过可见光和红外光。因此,OLED显示屏在展现内容效果的情况下也不影响红外传感器发射和接收红外光。透光显示屏13也可以采用Micro LED显示屏,Micro LED显示屏同样具有对可见光和红外光良好的透光率。当然,这些显示屏仅作为示例性的而本发明的实施例并不限于此。
请参阅图4,在某些实施方式中,电子装置100还包括透光触控面板12和透光盖板11。透光盖板 11形成于透光触控面板12上,透光触控面板12设置在透光显示屏13上,透光显示屏13的上表面131朝向透光触控面板12,透光触控面板12和透光盖板11对可见光的透光率和红外光的透光率均大于90%。
具体地,透光触控面板12主要用于接收用户在触碰透光触控面板12时产生的输入信号并传送到电路板进行数据处理,从而获得用户触碰透光触控面板12的具***置。其中,可以采用In-Cell或者On-Cell贴合技术将透光触控面板12与透光显示屏13进行贴合,能够有效地减轻显示屏的重量和减少显示屏的整体厚度。另外,将透光盖板11设置在透光触控面板12上,能够有效地保护透光触控面板12及其内部结构,避免了外界作用力对透光触控面板12及透光显示屏13的损坏。透光盖板11和透光触控面板12对可见光和红外光的透光率均大于90%,不仅有利于透光显示屏13较好地展现内容效果,而且还有利于设置在透光显示屏13下的红外传感器16稳定地发射和接收红外光,保证了红外传感器16的正常工作。
请结合参阅图3,在某些实施方式中,透光显示屏13用于透过显示区1311发光显示,显示区1311与透光盖板11的面积之比大于90%。
具体地,通过设置显示区1311和透光盖板11的比例,使透光显示屏13经过透光盖板11贴合后,显示区1311能够以较大的尺寸面积来展现内容效果,不仅提升了良好的用户体验,而且还有效地增大了电子装置100的屏占比。边框区1312还能用于遮挡位于透光显示屏13下的其它元件和金属线路,使产品的外观保持一致性。边框区1312可以通过印刷油墨的方式来增强透光显示屏13的光学密度,在保证遮光作用的同时也营造了良好的视觉效果。
请参阅图5,在某些实施方式中,电子装置100还包括第一涂布层14,第一涂布层14涂布于下表面132并覆盖发射器1611。
具体地,在进行工艺装配的过程中发射器1611的安装通常需要预留装配间隙,导致发射器1611与其他元件之间出现缝隙,使可见光从缝隙里进入,出现漏光现象。因此,在发射器1611和透光显示屏13层叠的方向上,第一涂布层14在下表面132的正投影的面积覆盖发射器1611在下表面132的正投影的面积,能够在不影响发射器1611正常工作的情况下,使第一涂布层14充分遮挡发射器1611,实现从外部观看电子装置100时,达到发射器1611不可见的效果。
在某些实施方式中,第一涂布层14用于透过红外光和拦截可见光,发射器1611用于透过第一涂布层14和边框区1312发射红外光。
具体地,第一涂布层14透过红外光,能够使发射器1611在向外发射红外光进行检测时,红外光透过第一涂布层14的强度衰减得较小,或者说衰减的程度并不对检测过程造成影响,从而保证了发射器1611的正常工作。第一涂布层14拦截可见光,使可见光不能通过第一涂布层16,从视觉上遮挡发射器1611,实现从外部观看电子装置100时,达到发射器1611不可见的效果。
在某些实施方式中,红外传感器16包括接近传感器,接近传感器包括信号发射器1和信号接收器,信号发射器用于透过第一涂布层1311和边框区1312发射红外光,信号接收器用于接收经物体反射的红外光以检测所述物体与电子装置100的距离。
具体地,当用户在接听或者拨打电话时,电子装置100靠近头部,信号发射器发出红外光,信号接收器接收反射回来的红外光,处理器计算红外光从发射到反射回来的时间,发出相应指令控制屏幕关闭 背景灯,当电子装置100远离头部时,处理器再次根据反馈回来的数据进行计算并发出指令,重新打开屏幕背景灯。如此,不仅防止用户的误操作,而且节省手机的电量。
在某些实施方式中,第一涂布层14包括IR油墨,IR油墨对红外光的透光率大于85%,对可见光的透光率小于6%,IR油墨可透过的红外光的波长为850nm-940nm。
具体地,由于IR油墨具有对可见光低透光率的特性,所以从外部观看电子装置100时,基于人眼的视觉观察不到设置在第一涂布层14下的发射器1611。同时,由于IR油墨兼具对红外光高透光率的特性,能够使发射器1611稳定地发射红外光,保证了发射器1611的正常工作。
请参阅图6至图9C,在某些实施方式中,发射器1611和接收器1612为分体结构。
具体地,由于发射器1611和接收器1612为分体结构,所以在排布位置时可以选择紧凑排布,也可以选择分散排布,可以灵活地将接收器1612设置在诸如低频显示的区域等对显示像素影响不大的位置。如此,不仅有利于电子装置100充分分配各元件的空间位置和应用多种形状的发射器1611和接收器1612,而且还有利于发射器1611和接收器1612为电子装置100中的其他元件提供可能的位置并降低对电子装置100显示像素的影响。当发射器1611和接收器1612分散排布时,可以在边框区1312设置一个发射器1611,在显示区1311设置一个接收器1612。也可以在边框区1312设置一个发射器1611,在显示区1311设置多个接收器1612。也可以在边框区1312两侧各设置一个发射器1611,在显示区1311两侧对应各设置一个接收器1612。
请参阅图5,在某些实施方式中,发射器1611和接收器1612为一体结构。
具体地,发射器1611和接收器1612为一体结构,一体结构使得元件整体结构紧凑,使得显示屏下元件布局合理,减少线路工艺流程以及布线空间,提高产品的生产效率,降低生产成本,元件布局规整方便检修及维护。
在一些示例中,该一体结构还可包括有环境光传感器,更进一步提高元件的集成度。
请参阅图10A或者图10B,在某些实施方式中,电子装置100还包括涂布于下表面132且覆盖接收器1612的第二涂布层15,第二涂布层15用于透过红外光和拦截可见光,接收器1612用于透过显示区1311和第二涂布层15接收红外光。
具体地,在进行工艺装配的过程中接收器1612的安装通常需要预留装配间隙,导致接收器1612与其他元件之间出现缝隙,使可见光从缝隙里进入,出现漏光现象。因此,在接收器1612和透光显示屏13层叠的方向上,第二涂布层15在下表面132的正投影的面积覆盖接收器1612在下表面132的正投影的面积,能够在不影响接收器1612正常工作的情况下,使第二涂布层15充分遮挡接收器1612,实现从外部观看电子装置100时,达到接收器1612不可见的效果。第二涂布层15也可以采用IR油墨,由于IR油墨具有对可见光低透光率的特性,所以从外部观看电子装置100时,基于人眼的视觉不能够察觉到设置在第二涂布层15下的接收器1612。同时,由于IR油墨兼具对红外光高透光率的特性,能够使接收器1612稳定地接收红外光,保证了接收器1612的正常工作。
请参阅图11A或者图11B,在某些实施方式中,电子装置100还包括覆盖下表面132且避让接收器1612的缓冲层17。
具体地,缓冲层17用于减缓冲击力和防震以保护透光触控面板12和透光显示屏13及其内部结构,避免显示屏因受到外界的冲击作用而损坏。缓冲层17可以由泡棉或者泡沫塑料或者橡胶或者其他软质材料制成。当然,这些缓冲材料仅作为示例性的而本发明的实施例并不限于此。此外,在设置缓冲层17的过程中避让接收器1612是为了防止缓冲层17阻截接收器1612接收信号,以免接收器1612在接收红外光的过程中受到影响。
请参阅图12A或者图12B,进一步地,在这样的实施方式中,电子装置100还包括覆盖缓冲层17且避让接收器1612的金属片18。
具体地,金属片18用于屏蔽电磁干扰及接地,具有扩散温升的作用。金属片18可以采用铜箔、铝箔等金属材料裁剪而成。当然,这些金属材料仅作为示例性的而本发明的实施例并不限于此。此外,在设置金属片18的过程中避让接收器1612是为了防止金属片18阻截接收器1612接收信号,以免接收器1612在接收红外光的过程中受到影响。
请参阅图2、图3和图14或者图3、图13和图14,本发明实施方式提供了一种电子装置100的制造方法30,包括以下步骤:
S301,提供一透光显示屏13,透光显示屏13包括上表面131和下表面132,上表面131与下表面132相背设置,透光显示屏13用于透过上表面131发光显示,下表面132包括显示区1311和围绕显示区1311的边框区1312。和
S302,提供一红外传感器16,红外传感器16包括用于透过边框区1312发射红外光的发射器1611和透过显示区1311接收红外光的接收器1612。
具体地,电子装置100采用透光显示屏13,可以在全面屏的情况下将红外传感器16设置在透光显示屏13下方,并且将红光传感器16的发射器1611设置在边框区1312可以避免发射器1611发出的红外光影响显示区1311的TFT的工作稳定性,从而使得透光显示屏13和红外传感器16可以在互不干涉的情况下实现各自功能。透光显示屏13可以是有机发光二极管(Organic Light-Emitting Diode,OLED)显示屏,OLED显示屏具有良好的透光性,能够通过可见光和红外光。因此,OLED显示屏在展现内容效果的情况下也不影响红外传感器发射和接收红外光。透光显示屏13也可以采用Micro LED显示屏,Micro LED显示屏同样具有对可见光和红外光良好的透光率。当然,这些显示屏仅作为示例性的而本发明的实施例并不限于此。此外,透光显示屏13的上表面131一方面用于透过可见光展现内容效果,另一方面则用于透过红外光使红外传感器16正常发射和接收红外光。
请参阅图10A和图15或者图10B和图15,在某些实施方式中,电子装置100的制造方法30还包括步骤:
S303,在透光显示屏13上设置透光触控面板12。和
S304,在透光触控面板12上设置透光盖板11。
具体地,透光触控面板12主要用于接收用户在触碰透光触控面板12时产生的输入信号并传送到电路板进行数据处理,从而获得用户触碰透光触控面板12的具***置。其中,可以采用In-Cell或者On-Cell贴合技术,将透光触控面板12与透光显示屏13进行贴合,能够有效地减轻显示屏的重量和减少显示屏 的整体厚度。另外,将透光盖板11设置在透光触控面板12上,能够保护透光触控面板12及其内部结构,避免了外界作用力对透光触控面板12造成直接的损坏。
请参阅图10A和图16或者图10B和图16,在某些实施方式中,电子装置100的制造方法10还包括步骤:
S305,在下表面132涂布第一涂布层14,第一涂布层14覆盖发射器1611,发射器1611用于透过第一涂布层14和边框区1312发射红外光。
具体地,第一涂布层14可以采用IR油墨,由于IR油墨具有对可见光低透光率的特性,所以从外部观看电子装置100时,基于人眼的视觉不能够察觉到设置在第一涂布层14下的发射器1611。同时,由于IR油墨兼具对红外光高透光率的特性,能够使发射器1611稳定地发射红外光,保证了发射器1611的正常工作。
请参阅图10A和图17或者图10B和图17,在某些实施方式中,电子装置100的制造方法30还包括步骤:
S306,在下表面132涂布第二涂布层15,第二涂布层15覆盖接收器1612,接收器1612用于透过第二涂布层15和显示区1311接收红外光。
具体地,第二涂布层15也可以采用IR油墨,由于IR油墨具有对可见光低透光率的特性,所以从外部观看电子装置100时,基于人眼的视觉不能够察觉到设置在第二涂布层15下的接收器1612。同时,由于IR油墨兼具对红外光高透光率的特性,能够使接收器1612稳定地接收红外光,保证了接收器1612的正常工作。
请参阅图11A和图18或者图11B和图18,在某些实施方式中,电子装置100的制造方法30还包括步骤:
S307,在下表面132设置缓冲层17,缓冲层17覆盖下表面132并避让接收器1612。
具体地,缓冲层17用于减缓冲击力和防震以保护透过触控面板和透过显示屏及其内部结构,避免显示屏因受到外界的冲击作用而损坏。缓冲层17可以由泡棉或者泡沫塑料或者橡胶或者其他软质材料制成。当然,这些缓冲材料仅作为示例性的而本发明的实施例并不限于此。此外,在设置缓冲层17的过程中避让接收器1612,是为了防止缓冲层17阻截接收器1612接收信号,以免接收器1612在接收红外光的过程中受到影响。
请参阅图12A和图19或者图12B和图19,进一步地,在这样的实施方式中,步骤S307还包括步骤:
S3071,在缓冲层17下设置金属片18,金属片18覆盖缓冲层17且避让接收器1612。
具体地,金属片18用于屏蔽电磁干扰及接地,具有扩散温升的作用,金属片18可以采用铜箔、铝箔等金属材料裁剪而成。当然,这些金属材料仅作为示例性的而本发明的实施例并不限于此。此外,在设置金属片18的过程中避让接收器1612,是为了防止金属片18阻截接收器1612接收信号,以免接收器1612在接收红外光的过程中受到影响。
在本说明书的描述中,参考术语“一个实施方式”、“某些实施方式”、“示意性实施方式”、“示例”、“具 体示例”、或“一些示例”等的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施方式或示例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且,描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
尽管已经示出和描述了本申请的实施方式,本领域的普通技术人员可以理解:在不脱离本申请的原理和宗旨的情况下可以对这些实施方式进行多种变化、修改、替换和变型,本申请的范围由权利要求及其等同物限定。

Claims (20)

  1. 一种电子装置,其特征在于,包括:
    透光显示屏,所述透光显示屏包括上表面和与上表面相背的下表面,所述透光显示屏透过所述上表面发光显示,所述下表面包括显示区和围绕所述显示区的边框区;
    红外传感器,所述红外传感器包括用于透过所述边框区发射红外光的发射器和透过所述显示区接收所述红外光的接收器。
  2. 如权利要求1所述的电子装置,其特征在于,所述电子装置还包括:
    第一涂布层,所述第一涂布层涂布于所述下表面并覆盖所述发射器。
  3. 如权利要求2所述的电子装置,其特征在于,所述第一涂布层用于透过红外光和拦截可见光,所述发射器用于透过所述第一涂布层和所述边框区发射红外光。
  4. 如权利要求2所述的电子装置,其特征在于,所述红外传感器包括接近传感器,所述接近传感器包括信号发射器和信号接收器,所述信号发射器用于透过所述第一涂布层和所述边框区发射红外光,所述信号接收器用于接收经物体反射的所述红外光以检测所述物体与所述电子装置的距离。
  5. 如权利要求2所述的电子装置,其特征在于,所述第一涂布层包括IR油墨,所述IR油墨对红外光的透光率大于85%,所述IR油墨对可见光的透光率小于6%,所述IR油墨可透过的红外光的波长为850nm-940nm。
  6. 如权利要求1所述的电子装置,其特征在于,所述发射器和所述接收器为分体结构。
  7. 如权利要求1所述的电子装置,其特征在于,所述发射器和所述接收器为一体结构。
  8. 如权利要求1所述的电子装置,其特征在于,所述电子装置还包括涂布于所述下表面且覆盖所述接收器的第二涂布层,所述第二涂布层用于透过红外光和拦截可见光,所述接收器用于透过所述显示区和所述第二涂布层接收红外光。
  9. 如权利要求1所述电子装置,其特征在于,所述透光显示屏包括OLED显示屏。
  10. 如权利要求1所述的电子装置,其特征在于,所述电子装置还包括透光触控面板和形成于所述透光触控面板上的透光盖板,所述透光触控面板设置在所述透光显示屏上,所述上表面朝向所述透光触控面板,所述透光触控面板和所述透光盖板对可见光的透光率和红外光的透光率均大于90%。
  11. 如权利要求10所述的电子装置,其特征在于,所述透光显示屏用于透过所述显示区发光显示,所述显示区与所述透光盖板的面积之比大于90%。
  12. 如权利要求1所述的电子装置,其特征在于,所述电子装置还包括覆盖所述下表面且避让所述接收器的缓冲层。
  13. 如权利要求12所述的电子装置,其特征在于,所述电子装置还包括覆盖所述缓冲层且避让所述接收器的金属片。
  14. 一种电子装置,其特征在于,包括:
    透光显示屏,所述透光显示屏包括上表面和与上表面相背的下表面,所述透光显示屏透过所述上表面发光显示,所述下表面包括显示区和围绕所述显示区的边框区;
    红外传感器,所述红外传感器包括发射器和接收器,所述发射器位于所述边框区对应的一侧,所述发射器用于发射红外光,所述接收器用于透过所述显示区接收所述红外光。
  15. 一种电子装置的制造方法,其特征在于,包括步骤:
    提供一透光显示屏,所述透光显示屏包括上表面和与所述上表面相背的下表面,所述透光显示屏用于透过所述上表面发光显示,所述下表面包括显示区和围绕所述显示区的边框区;和
    提供一红外传感器,所述红外传感器包括用于透过所述边框区发射红外光的发射器和透过所述显示区接收所述红外光的接收器。
  16. 如权利要求15所述的制造方法,其特征在于,所述制造方法还包括步骤:
    在所述透光显示屏上设置透光触控面板;和
    在所述透光触控面板上设置透光盖板。
  17. 如权利要求15所述的制造方法,其特征在于,所述制造方法还包括步骤:
    在所述下表面涂布第一涂布层,所述第一涂布层覆盖所述发射器,所述发射器用于透过所述第一涂布层和所述边框区发射红外光。
  18. 如权利要求15所述的制造方法,其特征在于,所述制造方法还包括步骤:
    在所述下表面涂布第二涂布层,所述第二涂布层覆盖所述接收器,所述接收器用于透过所述第二涂布层和所述显示区接收红外光。
  19. 如权利要求15所述的制造方法,其特征在于,所述制造方法还包括步骤:
    在所述下表面设置缓冲层,所述缓冲层覆盖所述下表面并避让所述接收器。
  20. 如权利要求19所述的制造方法,其特征在于,所述制造方法还包括步骤:
    提供一金属片,所述金属片覆盖所述缓冲层且避让所述接收器。
PCT/CN2019/076121 2018-03-09 2019-02-26 电子装置及其制造方法 WO2019170013A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810193184.6 2018-03-09
CN201810193184.6A CN108509088B (zh) 2018-03-09 2018-03-09 电子装置及其制造方法

Publications (1)

Publication Number Publication Date
WO2019170013A1 true WO2019170013A1 (zh) 2019-09-12

Family

ID=63377291

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/076121 WO2019170013A1 (zh) 2018-03-09 2019-02-26 电子装置及其制造方法

Country Status (2)

Country Link
CN (2) CN108509088B (zh)
WO (1) WO2019170013A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3748940A1 (en) * 2018-03-09 2020-12-09 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Electronic device

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108509088B (zh) * 2018-03-09 2020-10-16 Oppo广东移动通信有限公司 电子装置及其制造方法
WO2020015202A1 (zh) * 2018-07-17 2020-01-23 华为技术有限公司 一种终端
CN109151119A (zh) * 2018-09-20 2019-01-04 深圳阜时科技有限公司 具有全面屏的移动装置
CN112055101A (zh) * 2019-06-05 2020-12-08 北京小米移动软件有限公司 电子设备
CN110753140B (zh) * 2019-09-30 2021-05-18 华为技术有限公司 终端、灯罩及环境光接近模组
CN113495378A (zh) * 2021-07-16 2021-10-12 武汉华星光电技术有限公司 显示面板和显示装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101762899A (zh) * 2008-12-25 2010-06-30 索尼株式会社 显示面板,模块和电子装置
CN203720810U (zh) * 2013-12-06 2014-07-16 深圳市天时通科技有限公司 窄边框红外触控屏及触控显示装置
CN105094467A (zh) * 2015-08-28 2015-11-25 京东方科技集团股份有限公司 一种触控装置
WO2017124664A1 (en) * 2016-01-21 2017-07-27 3M Innovative Properties Company Optical camouflage filters
CN107608454A (zh) * 2017-08-31 2018-01-19 广东欧珀移动通信有限公司 显示屏及电子设备
CN108509088A (zh) * 2018-03-09 2018-09-07 广东欧珀移动通信有限公司 电子装置及其制造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006134552A2 (en) * 2005-06-14 2006-12-21 Koninklijke Philips Electronics N.V. Flexible displays and user input means therefor
US9013613B2 (en) * 2010-09-21 2015-04-21 Sony Corporation Sensor-equipped display apparatus and electronic apparatus
JP2013061555A (ja) * 2011-09-14 2013-04-04 Fujitsu Mobile Communications Ltd 電子機器及び該電子機器に実装される赤外線遮断板の製造方法
JP5392641B1 (ja) * 2011-12-21 2014-01-22 大日本印刷株式会社 表示装置用前面保護板、及び表示装置
US20140085245A1 (en) * 2012-09-21 2014-03-27 Amazon Technologies, Inc. Display integrated camera array
US9459696B2 (en) * 2013-07-08 2016-10-04 Google Technology Holdings LLC Gesture-sensitive display
CN104635964B (zh) * 2013-11-07 2018-03-16 祥达光学(厦门)有限公司 触控面板
US9977543B2 (en) * 2014-02-27 2018-05-22 Samsung Display Co., Ltd. Apparatus and method for detecting surface shear force on a display device
CN105681557B (zh) * 2016-01-15 2020-01-31 Oppo广东移动通信有限公司 一种控制红外接近传感器的方法、装置及计算机可读存储介质
CN106055174B (zh) * 2016-05-23 2019-03-29 京东方科技集团股份有限公司 一种触控显示装置
CN106843398B (zh) * 2017-01-26 2020-08-07 Oppo广东移动通信有限公司 电子装置
CN206490707U (zh) * 2017-03-02 2017-09-12 广东欧珀移动通信有限公司 显示屏以及电子设备
CN107316885B (zh) * 2017-06-30 2020-09-25 联想(北京)有限公司 一种有机发光二极管oled显示屏及一种电子设备
CN107332948A (zh) * 2017-07-11 2017-11-07 广东欧珀移动通信有限公司 显示装置、终端设备及接近状态检测方法
CN107422876B (zh) * 2017-07-18 2019-06-28 Oppo广东移动通信有限公司 一种接近传感器的控制方法、装置、存储介质及移动终端
CN107767835B (zh) * 2017-11-22 2020-04-10 Oppo广东移动通信有限公司 显示屏组件及电子设备

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101762899A (zh) * 2008-12-25 2010-06-30 索尼株式会社 显示面板,模块和电子装置
CN203720810U (zh) * 2013-12-06 2014-07-16 深圳市天时通科技有限公司 窄边框红外触控屏及触控显示装置
CN105094467A (zh) * 2015-08-28 2015-11-25 京东方科技集团股份有限公司 一种触控装置
WO2017124664A1 (en) * 2016-01-21 2017-07-27 3M Innovative Properties Company Optical camouflage filters
CN107608454A (zh) * 2017-08-31 2018-01-19 广东欧珀移动通信有限公司 显示屏及电子设备
CN108509088A (zh) * 2018-03-09 2018-09-07 广东欧珀移动通信有限公司 电子装置及其制造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3748940A1 (en) * 2018-03-09 2020-12-09 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Electronic device
US10892303B2 (en) 2018-03-09 2021-01-12 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Electronic device and manufacturing method for same
US11387292B2 (en) 2018-03-09 2022-07-12 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Electronic device

Also Published As

Publication number Publication date
CN111984155A (zh) 2020-11-24
CN108509088A (zh) 2018-09-07
CN111984155B (zh) 2023-07-18
CN108509088B (zh) 2020-10-16

Similar Documents

Publication Publication Date Title
WO2019170013A1 (zh) 电子装置及其制造方法
WO2019170005A1 (zh) 电子装置及其制造方法
WO2019170122A1 (zh) 透光显示屏、电子装置及其制造方法
EP3748940B1 (en) Electronic device
CN108769296B (zh) 电子装置及电子装置的制造方法
US10827058B2 (en) Control method, control device, electronic device and storage medium
CN108494909B (zh) 电子装置和制造方法
CN108534891B (zh) 光传感器、电子装置及其制造方法
CN108810195B (zh) 电子装置及其制造方法
CN108540595B (zh) 电子装置及其制造方法
CN108512960B (zh) 电子装置及其制造方法
CN109510885B (zh) 电子装置
WO2019233232A1 (zh) 控制方法、控制装置、电子装置、计算机存储介质及设备
CN108833615B (zh) 电子装置
WO2019170125A1 (zh) 电子装置和制造方法
CN108924278B (zh) 电子装置及其制造方法
CN108803947B (zh) 控制方法、控制装置、电子装置、计算机存储介质及设备
CN108683750B (zh) 电子装置及其制造方法
CN108521481B (zh) 电子装置
CN108874483B (zh) 控制方法、控制装置、电子装置、存储介质和计算机设备

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19763247

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19763247

Country of ref document: EP

Kind code of ref document: A1