WO2019150562A1 - Procédé de production de capteur de panneau tactile et ensemble de substrats de capteur de panneau tactile - Google Patents

Procédé de production de capteur de panneau tactile et ensemble de substrats de capteur de panneau tactile Download PDF

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Publication number
WO2019150562A1
WO2019150562A1 PCT/JP2018/003686 JP2018003686W WO2019150562A1 WO 2019150562 A1 WO2019150562 A1 WO 2019150562A1 JP 2018003686 W JP2018003686 W JP 2018003686W WO 2019150562 A1 WO2019150562 A1 WO 2019150562A1
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WO
WIPO (PCT)
Prior art keywords
sensor
wiring
substrate
base material
touch panel
Prior art date
Application number
PCT/JP2018/003686
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English (en)
Japanese (ja)
Inventor
直人 新妻
大屋　秀信
正好 山内
小俣　猛憲
星野　秀樹
牛久　正幸
亮 青山
一歩 浦山
Original Assignee
コニカミノルタ株式会社
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Application filed by コニカミノルタ株式会社 filed Critical コニカミノルタ株式会社
Priority to JP2019568529A priority Critical patent/JPWO2019150562A1/ja
Priority to PCT/JP2018/003686 priority patent/WO2019150562A1/fr
Publication of WO2019150562A1 publication Critical patent/WO2019150562A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means

Definitions

  • the present invention relates to a method for manufacturing a touch panel sensor and a touch panel sensor base material set, and more specifically, particularly in the case of manufacturing a large area touch panel sensor, the handling property when connecting external connection parts can be improved, and the yield is also increased. It is related with the manufacturing method of the touch panel sensor which can improve, and a touch panel sensor base material set.
  • the touch panel sensor is mounted on, for example, a portable terminal and is used to detect a position touched by a user.
  • Patent Documents 1 and 2 propose a technique for increasing the area of an image to be displayed with respect to an image display device.
  • the touch panel sensor is often mounted on a relatively small device such as a portable terminal, a technique for increasing the area has not been sufficiently established.
  • a base material provided with a sensor channel and a lead wire connected to the sensor channel is prepared, and then FFC (Flexible Flat Cable; flexible) is provided for the lead wire of the base material.
  • FFC Flexible Flat Cable; flexible
  • External connection parts such as flat cable and FPC (Flexible Printed Circuit) were connected.
  • Such a conventional technique improves the handling performance (eg, the accuracy of alignment using a jig) and the yield when connecting externally connected components, particularly when manufacturing a large area touch panel sensor. In view of this, room for further improvement was found.
  • an object of the present invention is to provide a touch panel sensor manufacturing method and a touch panel sensor base material set capable of improving the handling property when connecting external connection parts and improving the yield even when manufacturing a touch panel sensor having a large area. Is to provide.
  • a method for manufacturing a touch panel sensor for connecting a base material 2.
  • the sensor substrate further comprises a conductor extending from an end of the sensor channel to a connection site to which the wiring substrate is connected; The conductor has a different structure from the sensor channel; 2.
  • Two units are prepared by connecting the sensor substrate having the sensor pattern part on one side and the wiring substrate to which the external connection component is connected, 6.
  • the sensor substrates of the two units are stacked, they are stacked so that the surfaces not provided with the sensor channels face each other, or the sensor channels of one of the sensor substrates are provided.
  • a base material set for configuring a touch panel sensor At least one sensor substrate having a sensor pattern portion comprising a plurality of sensor channels; Consisting of at least one wiring substrate having a lead wiring pattern portion composed of a plurality of wirings, A touch panel sensor substrate set in which the wiring substrate is connected to an external connection component.
  • the sensor substrate further comprises a conductor extending from an end of the sensor channel to one end of the sensor substrate; 12.
  • a touch panel sensor manufacturing method and a touch panel sensor base material set capable of improving the handling property when connecting external connection parts and improving the yield even when manufacturing a touch panel sensor having a large area. Can be provided.
  • the figure explaining the sensor base material used in the manufacturing method of the touch panel sensor which concerns on 1st Embodiment, a wiring base material, and an external connection component The figure explaining the example of composition of a sensor channel Diagram explaining connection between wiring substrate and external connection parts Diagram explaining connection between sensor substrate and wiring substrate.
  • the figure explaining the manufacturing method of the touchscreen sensor which concerns on 3rd Embodiment.
  • the figure explaining the manufacturing method of the touchscreen sensor which concerns on 4th Embodiment.
  • the figure explaining an example of an electroconductive member The figure explaining the other example of an electroconductive member
  • the figure explaining the other example of an electroconductive member The figure explaining the other example of an electroconductive member
  • an external connection component is connected to at least one wiring substrate having a lead wiring pattern portion made of a plurality of wires, and then at least one having a sensor pattern portion made of a plurality of sensor channels.
  • the sensor base material and the wiring base material are connected so that the sensor channel of one sensor base material and the wiring of the wiring base material are electrically connected.
  • First Embodiment A method for manufacturing a touch panel sensor according to a first embodiment will be described with reference to FIGS.
  • a sensor base material 1, a wiring base material 2, and an external connection component 3 are prepared.
  • the sensor substrate 1 includes a substrate 11 and a plurality of sensor channels 12 provided on the substrate 11.
  • a sensor pattern portion S is constituted by the plurality of sensor channels 12.
  • the sensor pattern portion S forms an effective area for sensing in the touch panel sensor.
  • the base material 11 may be any material that can hold the plurality of sensor channels 12 on the surface in a state of being insulated from each other. Examples thereof include a resin base material (also referred to as a film), a glass base material, and a ceramic base material.
  • the material of the film is not particularly limited.
  • polyethylene terephthalate (PET) resin polyethylene naphthalate (PEN) resin, polybutylene terephthalate resin, cellulose resin (polyacetyl cellulose, cellulose diacetate, cellulose triacetate, etc.), polyethylene resin Polypropylene resin, methacrylic resin, cyclic polyolefin resin, polystyrene resin, acrylonitrile- (poly) styrene copolymer (AS resin), acrylonitrile-butadiene-styrene copolymer (ABS resin), polyvinyl chloride resin , Poly (meth) acrylic resin, polycarbonate resin, polyester resin, polyimide resin, polyamide resin, polyamideimide resin, cycloolefin polymer (COP) resin And the like. If these materials are used, good insulation and transparency can be imparted to the film. In particular, by using a synthetic resin material, good flexibility can be imparted to the
  • the thickness of the substrate 11 is not particularly limited, and can be, for example, about 1 ⁇ m to 10 cm, and further about 20 ⁇ m to 300 ⁇ m.
  • the substrate 11 may be subjected to a surface treatment that changes the surface energy.
  • the base material 11 may be a laminate, and may have a hard coat layer, an antireflection layer, or the like.
  • the base material 11 is rectangular, but the shape of the base material 11 is not limited to this, and an arbitrary shape can be given.
  • the sensor channel 12 is an electrode for detecting a touch in the touch panel sensor.
  • the detection method of the touch panel sensor is not particularly limited, and examples thereof include a resistance film method, a capacitance method, and an optical sensor method.
  • a plurality of sensor channels 12 are arranged at an equal pitch.
  • the sensor channel 12 is formed in a strip shape having a predetermined width (also referred to as channel width) with a conductive material.
  • the length and width of the sensor channel 12 are not particularly limited, and can be set as appropriate according to the purpose and application.
  • the conductive material constituting the sensor channel 12 is not particularly limited, and examples thereof include metal fine particles, metal oxide fine particles, carbon fine particles, and conductive polymers.
  • the metal constituting the metal fine particle include Au, Pt, Ag, Cu, Ni, Cr, Rh, Pd, Zn, Co, Mo, Ru, W, Os, Ir, Fe, Mn, Ge, Sn, Ga, In etc. are mentioned. Among these, Au, Ag, and Cu are preferable, and Ag is particularly preferable.
  • the average particle diameter of the metal fine particles can be, for example, 1 to 100 nm, further 3 to 50 nm.
  • the average particle diameter is a volume average particle diameter, and can be measured by “Zeta Sizer 1000HS” manufactured by Malvern.
  • Examples of the metal oxide fine particles include indium tin oxide (ITO) and tin oxide.
  • Examples of the carbon fine particles include graphite fine particles, carbon nanotubes, fullerenes and the like. Although it does not specifically limit as a conductive polymer, (pi) conjugated system conductive polymer can be mentioned preferably.
  • Examples of the ⁇ -conjugated conductive polymer include polythiophenes and polyanilines. The ⁇ -conjugated conductive polymer may be used together with a polyanion such as polystyrene sulfonic acid.
  • the sensor channel 12 may be made of a conductive material applied in a solid shape on the base material 11, but in this embodiment, the sensor channel 12 is formed on the base material 11 as shown in FIG. It is constituted by a plurality of conductive thin wires 13 arranged two-dimensionally.
  • the sensor channel 12 shown in FIG. 2A is configured by a mesh pattern composed of a plurality of conductive thin wires 13.
  • the pattern of the sensor channel 12 may be, for example, a stripe pattern, a random pattern, or the like.
  • the pattern of the sensor channel may be a pattern configured by combining a plurality of conductive thin wires forming a geometric figure.
  • FIG. 2 (b) shows an example of a sensor channel having a pattern formed by combining a plurality of conductive thin lines forming a geometric figure.
  • the sensor channel 12 is composed of a plurality of thin conductive wires 13 that form a quadrangle.
  • the pattern of the sensor channel 12 is configured by two-dimensionally arranging a plurality of conductive thin wires 13 forming a quadrangle in the direction of two diagonal lines of the quadrangle.
  • the line width of the conductive thin wire 13 constituting the sensor channel 12 is not particularly limited, but may be, for example, 50 ⁇ m or less, 20 ⁇ m or less, preferably 10 ⁇ m or less, 7 ⁇ m or less, and further 5 ⁇ m or less.
  • the line width of the conductive thin wire 13 10 ⁇ m or less it is possible to obtain an effect that the sensor channel 12 composed of the conductive thin wire 13 and a pattern (here, a mesh pattern) constituted by the conductive thin wire 13 is less visible.
  • the lower limit of the line width of the conductive thin wire 13 is not particularly limited, but can be set to, for example, 1 ⁇ m or more from the viewpoint of providing stable conductivity.
  • the sensor substrate 1 has sensor pattern portions S on both sides. That is, the sensor base material 1 includes a plurality of sensor channels 12 that constitute the sensor pattern portion S on both surfaces of the base material 11. The sensor channels 12 on both sides face each other with the base material 11 interposed therebetween.
  • the sensor pattern portions S are formed on both surfaces of one base material 11 as in the present embodiment, an effect of omitting the step of stacking the base materials is obtained.
  • the sensor pattern portion S can be made into two layers by laminating a substrate having a sensor pattern portion on one side.
  • the longitudinal direction of the sensor channel 12 on the surface of the base material 11 is parallel to the direction of the long side of the base material 11 (the side oriented in the lateral direction in FIG. 1).
  • a plurality of sensor channels 12 on the surface of the base material 11 are arranged in parallel in the direction of the short side (the side oriented in the vertical direction in FIG. 1) of the base material 11.
  • the longitudinal direction of the sensor channel 12 on the back surface of the base material 11 is parallel to the direction of the short side (the side oriented in the vertical direction in FIG. 1) of the base material 11.
  • a plurality of sensor channels 12 on the back surface of the base material 11 are arranged in parallel in the direction of the long side of the base material 11 (the side oriented in the lateral direction in FIG. 1).
  • the sensor channel 12 on the front surface and the sensor channel 12 on the back surface are oriented in a direction crossing each other, so that the sensor pattern portion S can be detected in the XY coordinate system.
  • sensor channels 12 are arranged in parallel on the surface of the base material 11 and 15 sensor channels 12 are arranged in parallel on the back surface of the base material 11 is shown, but the present invention is not limited to this.
  • Any number of sensor channels 12 can be arranged side by side in accordance with the application or the like.
  • the area of the sensor pattern portion S is increased, for example, 20 or more, 30 or more, and further 40 or more sensor channels 12 can be arranged in parallel on each surface.
  • the upper limit of the number of sensor channels 12 to be provided is not particularly limited, but may be 500 or less, for example.
  • the distance ⁇ between the adjacent sensor channels 12 is not particularly limited, but is preferably reduced to, for example, 150 ⁇ m or less, 100 ⁇ m or less, and further 50 ⁇ m or less. Thereby, the sensor channel 12 can be arranged in a dense state, and the sensor sensitivity can be improved. It is also preferable to reduce the interval ⁇ to, for example, 30 ⁇ m or less, and further to 25 ⁇ m or less. Thereby, the sensor sensitivity can be improved, and the gap (insulating part) between the sensor channels 12 can be prevented from being visually recognized.
  • the lower limit of the distance ⁇ is not particularly limited as long as it can insulate between the sensor channels 12. However, for example, if the distance ⁇ is 5 ⁇ m or more, 10 ⁇ m or more, and further 15 ⁇ m or more, dust or the like may adhere between the sensor channels 12. Good insulation can be maintained.
  • the sensor channel 12 may be provided up to one end of the base material 11 (a connection part to which the wiring base material 2 is connected later), but a gap ⁇ is provided between the end of the sensor channel 12 and one end of the base material 11. It is preferable to provide it. By providing the interval ⁇ , it is avoided that the sensor channel 12 is directly exposed to one end of the base material 11 which is a connection site to which the wiring base material 2 is connected, and an unintended short circuit is prevented.
  • the interval ⁇ is provided, the value is not particularly limited, and can be, for example, 0.5 mm to 10 mm, further 1 mm to 6 mm.
  • the sensor substrate 1 includes a conductor 14 extending from the end of the sensor channel 12 to one end of the substrate 11 outside the sensor pattern portion S.
  • One end of the substrate 11 is a connection part to which the wiring substrate 2 is connected later, and the plurality of conductors 14 are electrically connected to the plurality of wirings 22 of the wiring substrate 2 at this connection part.
  • the plurality of conductors 14 are provided in an area corresponding to the above-described interval ⁇ at an arrangement pitch equal to the arrangement pitch of the sensor channels 12.
  • the conductor 14 is made of a conductive material and has a structure different from that of the sensor channel 12.
  • the conductor 14 is different in structure from the sensor channel 12 in that the conductor 14 is provided narrower than the channel width of the sensor channel 12.
  • An example of the case where the conductor 14 has a structure different from that of the sensor channel 12 is not limited to a case where the shape such as the width is different.
  • the conductor 14 is formed of a conductive material different from that of the sensor channel 12, This includes the case where the conductor 14 has a resistance value (for example, a sheet resistance value) different from that of the sensor channel 12.
  • the conductor 14 is a single wiring
  • the conductor 14 may be a mesh pattern similar to the sensor channel 12, for example.
  • various patterns such as a pattern configured by combining a plurality of conductive thin lines forming a geometric figure, a stripe pattern, a random pattern, and the like may be used.
  • a conductor is not limited to what has a pattern, You may be comprised with the electroconductive material provided to the solid shape.
  • the conductor 14 is preferably provided narrower than the channel width of the sensor channel 12 in any form. In this way, the conductor 14 exposed at one end of the base material 11 that is a connection site to which the wiring base material 2 is connected is thinner than the width of the sensor channel 12, so that the sensor channel 12 is exposed at the one end. Thus, the occurrence of an unintended short circuit is prevented.
  • the wiring substrate 2 includes a substrate 21 and a plurality of wirings 22 formed on the substrate 21.
  • the plurality of wirings 22 are electrically connected to each of the plurality of sensor channels 12 included in the sensor substrate 1.
  • a lead wiring pattern portion W is formed on the base material 21 by the plurality of wirings 22.
  • two wiring substrates 2 are prepared.
  • One wiring substrate 2 has a wiring 22 that is electrically connected to the sensor channel 12 on the surface of the sensor substrate 1.
  • the other wiring substrate 2 has a wiring 22 that is electrically connected to the sensor channel 12 on the back surface of the sensor substrate 1.
  • one end of the wiring 22 extends to one end of the substrate 21, and the other end of the wiring 22 extends to a predetermined position on the substrate 21 (here, the other end of the substrate 21).
  • connection part One end of the base material 21 on which one end of the wiring 22 is disposed is a connection part to which the sensor base material 1 is connected later.
  • the plurality of wirings 22 are respectively a plurality of conductors 14 of the sensor base material 1.
  • the plurality of sensor channels 12 are electrically connected via the plurality of conductors 14.
  • the arrangement pitch of the plurality of conductors 14 of the sensor base 1 and the arrangement pitch of the plurality of wirings 22 of the wiring base 2 are equal.
  • the other end of the base material 21 on which the other end of the wiring 22 is disposed is a connection portion to which the external connection component 3 is connected later.
  • the other end of the wiring 22 is provided in the external connection component 3 at this connection portion. It is electrically connected to the external wiring 31.
  • the arrangement pitch of the plurality of wirings 22 of the wiring substrate 2 and the arrangement pitch of the plurality of external wirings 31 of the external connection component 3 are equal.
  • the arrangement pitch of the plurality of wires 22 at the connection site between the wiring substrate 2 and the external connection component 3 is set smaller than the arrangement pitch at the connection site between the sensor substrate 1 and the wiring substrate 2.
  • interval (it is also called Line &Space; L / S) of the some wiring 22 are also the sensor base material 1 and the wiring base material 2. It is aggregated narrower than L / S at the connection site.
  • the arrangement pitch and L / S of the plurality of wirings 22 are relatively large at the connection portion between the sensor base material 1 and the wiring base material 2. There is a relatively small relationship at the connection site with the external connection component 3.
  • the external connection component 3 has a plurality of external wirings 31.
  • the plurality of external wires 31 are connected to each of the plurality of wires 22 of the wiring substrate 2.
  • Examples of the external connection component 3 include components for electrically connecting the plurality of wirings 22 of the wiring substrate 2 to an external circuit (not shown) via the plurality of external wirings 33. Examples include FFC and FPC.
  • signals from the plurality of sensor channels 12 of the sensor substrate 1 are transferred to the external circuit via the plurality of wires 22 of the wiring substrate 2 and the plurality of external wires 31 of the external connection component 3.
  • Examples of the external circuit include an integrated circuit (IC) for controlling the touch panel sensor.
  • the method of electrically connecting the wiring 22 of the wiring substrate 2 and the external wiring 31 of the external connection component 3 is not particularly limited.
  • the wiring 22 is connected by a conductive adhesive, an anisotropic conductive film (ACF), or the like. Can do.
  • the conductive adhesive is not particularly limited, and for example, an adhesive containing conductive particles can be used.
  • the size (size and area) of the wiring substrate 2 in this step is smaller than the size after the sensor substrate 1 is connected. Therefore, the effect which can improve the handleability at the time of connecting the external connection component 3 is acquired. This effect will be described in detail below.
  • the accuracy of connection can be improved by aligning the substrate on a stage (for example, a bonding stage). For example, by aligning the portion of the base material to which the external connection component is to be connected to a predetermined position on the stage by applying a corner of the base material to the abutting portion provided on the stage, the external connection Parts can be connected.
  • a stage for example, a bonding stage
  • the conventional technology uses a base material on which both the sensor pattern portion and the wiring portion are provided, especially when the sensor pattern portion is increased in area, the entire base material becomes large and protrudes from the stage and curves. , Even if the corner is applied, there arises a problem that the accuracy of alignment is lowered. If the alignment accuracy is lowered, poor electrical connection between the base material and the external connection component is caused. Alternatively, even if a stage capable of placing such a large base material as a whole can be prepared, it is difficult to place a large base material on the stage even if a dedicated jig is used. There is a problem that decreases. In addition, when the external connection parts are connected to both surfaces of the base material, if the base material is large, a reversing operation or the like becomes difficult, and the manufacturing efficiency further decreases.
  • the wiring substrate 2 can be made smaller by the amount that the sensor substrate 1 is not connected, the entire wiring substrate 2 can be placed on a relatively small stage, and the wiring substrate It is possible to prevent 2 from protruding from the stage and bend, and to improve the alignment accuracy. By improving the alignment accuracy, the electrical connection between the wiring substrate 2 and the external connection component 3 can be reliably performed. Further, the wiring substrate 2 can be easily placed flat on the stage without using a dedicated jig, and the manufacturing efficiency is improved. Furthermore, also when connecting the external connection components 3 to both surfaces of the wiring substrate 2, the reversing operation and the like are facilitated, and the manufacturing efficiency is further improved.
  • the wiring substrate 2 connected to the sensor channel 12 on the front surface of the sensor substrate 1 and the wiring substrate 2 connected to the sensor channel 12 on the back surface are separately prepared. It is not always necessary to connect the external connection components 3 to both surfaces of the two wiring bases 2, and the reversing operation itself on the stage can be omitted, thereby further improving the manufacturing efficiency.
  • each wiring base material 2 is connected to the external connection component 3 described above before connection to the sensor base material 1. .
  • the sensor channel 12 of the sensor base 1 and the wiring base are connected in a state where one end of the sensor base 1 and one end of the wiring base 2 are abutted.
  • the wiring 22 of the material 2 can be electrically connected.
  • the sensor base material 1 and the wiring base material 2 are arranged so that the plurality of sensor channels 12 and the plurality of wirings 22 correspond one-to-one.
  • a plurality of conductors 14 extending from a plurality of sensor channels 12 and a plurality of wirings 22 having the same number as the conductors 14 are connected to the sensor base 1 and the wiring base 2 at equal pitches.
  • the sensor substrate 1 and the wiring substrate 2 are aligned with each other so as to face each other.
  • one or both of the sensor substrate 1 and the wiring substrate 2 may be provided with a marker (not shown) for aligning the two substrates with each other.
  • the conductive member 4 In order to ensure the electrical connection between the sensor channel 12 and the wiring 22, it is preferable to provide the conductive member 4 at the connection site.
  • the conductive member 4 is preferably applied so as to contact both the conductor 14 and the wiring 22.
  • the conductor 14 is omitted and the sensor channel 12 extends to one end of the sensor substrate 1, the conductive member 4 can be applied so as to contact both the sensor channel 12 and the wiring 22.
  • the conductive member 4 is not particularly limited, and examples thereof include conductive paste (for example, metal paste) and conductive ink. These application methods are not particularly limited, and can be applied by a printing method such as an inkjet method. The conductive paste and the conductive ink can be fixed in a state of being in contact with both the conductor 14 and the wiring 22 by drying and / or curing. Other examples of the conductive member 4 will be described in detail later.
  • the sensor base material is electrically connected to the sensor channels 12 on both surfaces and the wiring 22 of the wiring base material 2. 1 and the wiring substrate 2 are connected.
  • the wiring 22 of the wiring substrate 2 provided with the wiring 22 on the surface is electrically connected to the sensor channel 12 on the surface of the sensor substrate 1
  • the sensor channel 12 is electrically connected to the sensor channel 12 on both sides of the sensor substrate 1 by electrically connecting the wire 22 of the wiring substrate 2 having the wiring 22 provided on the back surface. Connected to.
  • the arrangement pitch and L / S of the plurality of wirings 22 are relatively large at the connection portion between the sensor base 1 and the wiring base 2, and the wiring base
  • the connection portion between the material 2 and the external connection component 3 is relatively small. This technical significance will be described below.
  • the wiring base material 2 can be reduced by the amount that the sensor base material 1 is not connected, the handling property of the wiring base material 2 is improved, and the wiring base material 2 is highly accurate when connecting the external connection component 3. Can be aligned. Therefore, even if the arrangement pitch or L / S of the plurality of wirings 22 is reduced for narrowing the frame, electrical connection to the plurality of external wirings 31 of the external connection component 3 can be reliably performed.
  • the sensor pattern portion and the lead wiring pattern portion are formed on one base material.
  • the lead wiring pattern portion is a defective product. If it exists, it will become inferior goods as the whole base material, and the sensor pattern part with a comparatively high formation cost will be wasted.
  • the sensor pattern portion has a large area, the cost loss is further increased.
  • a plurality of sensor base materials 1 and a plurality of wiring base materials 2 are prepared, and non-defective products can be selected and connected from these. Thereby, it is possible to prevent the generation of defective products and improve the yield.
  • the conductive state of one or both of the sensor base material 1 and the wiring base material 2 is inspected. Is preferred. As a result, a non-defective product having a good conduction state can be selected with certainty, and the yield can be further improved.
  • the inspection of the conduction state is not particularly limited, and a known method can be used, and examples thereof include a confirmation inspection that no disconnection has occurred and a confirmation inspection that a short circuit has not occurred.
  • These inspections can be performed by, for example, resistance value measurement using a tester.
  • resistance value measurement using a tester a known device that automatically measures disconnection or short-circuit by scanning a measurement terminal based on drawing data can be used. These inspections are preferably performed on both the sensor substrate 1 and the wiring substrate 2 from the viewpoint of further improving the yield.
  • the inspection of the conductive state of the wiring substrate 2 may be performed after the external connection component 3 is connected to the wiring substrate 2, but should be performed before the external connection component 3 is connected to the wiring substrate 2. Is preferred. By grasping the non-defective product / defective product of the wiring substrate 2 before connecting the external connection component 3, it is possible to avoid wasting the external connection component 3 by connecting it to the defective wiring substrate 2.
  • the cutting process can be carried out so that an unnecessary part is cut from the base material to obtain a predetermined external dimension suitable for the product. Since the sensor substrate 1 and the wiring substrate 2 are separate, the handling property in the cutting process is improved in comparison with the case where the sensor substrate 1 and the wiring substrate 2 are integrated, and high-precision cutting can be realized.
  • a single wiring substrate 2 is used for a plurality of sensor channels 12 provided on the surface of the sensor substrate 1, and a plurality of sensor channels 12 provided on the back surface of the sensor substrate 1 are used.
  • the case of using one wiring substrate 2 is mainly shown, but the present invention is not limited to this.
  • a plurality of wiring substrates 2 may be used for a plurality of sensor channels 12 provided on the front surface of the sensor substrate 1 or for a plurality of sensor channels 12 provided on the back surface of the sensor substrate 1.
  • two wiring bases 2 are used for a plurality of sensor channels 12 provided on the surface of the sensor base 1, and a plurality of bases are provided on the back surface of the sensor base 1.
  • Two wiring substrates 2 are also used for the sensor channel 12.
  • each wiring base material 2 is in a state of being divided in the direction in which the plurality of sensor channels 12 to be connected are juxtaposed, the wiring base material 2 is further reduced in comparison with the first embodiment, and is connected to the external connection component 3.
  • the handling properties and handling properties in the cutting process are further improved. Even if the sensor substrate 1 becomes large, the wiring substrate 2 can be kept small by increasing the number of divisions of the wiring substrate 2.
  • each wiring substrate 2 may be provided with a part of the wirings 22 corresponding to a part of the sensor channels 12 among the plurality of sensor channels 12 to be connected. That is, since the number of wirings 22 provided on the wiring substrate 2 can be reduced, the space required for arranging a plurality of wirings 22 in parallel is also reduced. Thereby, not only the wiring base material 2 can be reduced in the juxtaposition direction of the plurality of sensor channels 12 to which the wiring base material 2 is connected, but also the direction orthogonal to the juxtaposition direction (longitudinal direction of the sensor channel 12). Can also be small. Since the wiring base material 2 becomes smaller in the longitudinal direction of the sensor channel 12, not only the handling property is further improved, but also a narrower frame can be achieved.
  • the present invention is not limited to this.
  • the plurality of divided wiring base materials 2 are connected to the sensor base material 1 so as to be alternately arranged on one end side and the other end side of the sensor channel 12. Also good.
  • the division of the wiring substrate 2 improves the degree of freedom of the arrangement of the wiring substrate 2 (attachment position with respect to the sensor substrate 1).
  • the touch panel sensor can be designed with a higher degree of freedom so that the optimum incorporation is realized.
  • the plurality of sensor bases 1 are coupled so that the sensor channels 12 are electrically connected to each other. It is preferable.
  • a plurality of sensor channels 12 on one side (here, the back side) of the sensor channels 12 on the front and back sides of the sensor substrate 1 are arranged in the longitudinal direction of the sensor channel 12 (vertical direction in FIG. 7).
  • the plurality of sensor channels 12 of each sensor base material 1 are electrically connected to each other so as to extend. In this way, the effective area for sensing in the touch panel sensor can be expanded.
  • the wiring base material 3 to which the external connection component 3 is connected in advance can be connected to the sensor base material 1 before being connected, and then a plurality of sensor base materials 1 can be connected.
  • the sensor channels 12 of the plurality of sensor substrates 1 When the sensor channels 12 of the plurality of sensor substrates 1 are electrically connected to each other, the sensor channels 12 may be directly connected to each other, but the same as described for the connection between the sensor channel 12 and the wiring 22 It is preferable to connect via the conductor 14. By connecting through the conductor 14, a short circuit or the like can be prevented.
  • the conductor 14 When providing the conductor 14, as shown in FIG. 7, the conductor 14 can be provided in the sensor channel 12 of both sensor base materials 1 of the sensor base materials 1 connected to each other. In this case, the electrical connection can be reliably performed by providing the conductive member 4 so as to contact both the conductors 14.
  • the conductive member 4 As the conductive member 4, the same material as described for the connection between the sensor channel 12 and the wiring 22 can be used.
  • a conductor may be provided only in the sensor channel of one of the sensor substrates connected to each other. In this case, electrical connection can be reliably performed by providing the conductive member so as to contact the conductor of one sensor base and the sensor channel of the other sensor base.
  • the wiring 22 of the wiring base 2 that is electrically connected to the sensor channel 12 on the surface of the sensor base 1 is disposed on the surface of the wiring base 2, the wiring base 2 The external connection component 3 connected to the material 2 is disposed on the surface of the wiring substrate 2.
  • the wiring 22 of the wiring base 2 that is electrically connected to the sensor channel 12 on the back surface of the sensor base 1 is connected to the wiring via a through-hole 23 provided so as to penetrate the wiring base 2. It is pulled out from the back surface of the base material 22 to the front surface.
  • the external connection component 3 connected to the wiring substrate 2 is also arranged on the surface of the wiring substrate 2.
  • the external connection components 3 are arranged on the same surface side with respect to all of the plurality of wiring substrates 2 in a state where the plurality of wiring substrates 2 are connected to the sensor substrate 1.
  • the present invention in order to draw out wiring from one surface of the wiring substrate to the other surface, the case of using a through hole penetrating the substrate is shown, but the present invention is not limited to this, and a known method is used. Can do. For example, a half-shaped through hole provided so as to cut out the end face of the wiring substrate may be used instead of the through hole. Further, the wiring may be folded back from one surface of the wiring substrate to the other surface at the end surface of the wiring substrate.
  • the sensor substrates after connecting external connection components from the same surface side to a plurality of wiring substrates, the sensor substrates can be connected to each wiring substrate without performing a reversal operation or the like. Therefore, the manufacturing process can be simplified and the production efficiency can be improved.
  • a plurality of (four in this example) sheet-like bodies each including a sheet-like support body 41 and a conductive member 4 supported on the support body 41 are provided. Use.
  • the support 41 is not particularly limited, and for example, those exemplified as the base material of the sensor base material can be used. Similar to the sensor channel 12, the conductive member 4 is composed of a plurality of conductive thin wires arranged in a mesh shape.
  • connection is made so that the conductive member 4 comes into contact with the conductor 14 and the wiring 22 facing each other across the connection portion between the sensor base 1 and the wiring base 2.
  • the conductive member 4 is overlaid on the part.
  • the conductive member 4 can be fixed to the connection site by using, for example, a conductive adhesive.
  • a sheet-like body composed of one support body 41 and a plurality of (four in this example) conductive members 4 supported on the support body 41 is provided. Use.
  • connection is made so that the conductive member 4 comes into contact with the conductor 14 and the wiring 22 facing each other across the connection portion between the sensor base 1 and the wiring base 2.
  • the conductive member 4 is overlaid on the part.
  • the plurality of conductive members 4 are arranged on the support body 41 at the same pitch as the plurality of conductors 14 or the plurality of wirings 22 so as not to contact unintended wirings.
  • a conductive adhesive or the like can be used when the conductive members 4 are overlapped.
  • the conductive adhesive can be used by defining an application range for each conductive member 4 on the support 41.
  • the conductive member 4 may be superposed using an adhesive tape as the support 41.
  • a sheet-like body including one support body 41 and a plurality (four in this example) of conductive members 4 supported on the support body 41. Is used.
  • the support body 41 has an area capable of covering a part or all of the plurality of sensor channels 12.
  • the support 41 can be, for example, a cover layer for protecting the sensor channel 12.
  • the support 41 can be a white layer for forming an image projection surface (screen) on the sensor channel 12, for example.
  • As the white layer for example, a resin layer in which a white pigment is dispersed can be used.
  • an image from an image projection device (projector) (not shown) can be projected and displayed on the screen.
  • a sensor film for example, a touch screen having both a sensor function and a screen function can be configured.
  • connection is made so that the conductive member 4 comes into contact with the conductor 14 and the wiring 22 facing each other across the connection portion between the sensor base 1 and the wiring base 2.
  • the conductive member 4 is overlaid on the part.
  • the support body 41 can cover a part or all of the plurality of sensor channels 12.
  • the substrate 8 can cover and protect not only the sensor channel 12 but also the wiring 22.
  • the end of the wiring can be exposed from the support body 41 for connection with an external connection component or the like.
  • the conductive member supported on the support is constituted by a plurality of conductive thin wires, but the present invention is not limited to this.
  • the conductive member may be formed in a solid shape on the support.
  • the conductive member is supported on the support.
  • the conductive member is made of, for example, a metal foil and has sufficient strength
  • the support may be omitted. Good.
  • the conductive member described above can be preferably used for electrical connection between the sensor channel and the sensor channel as shown in FIG.
  • Touch panel sensor base material set The touch panel sensor base material set of the present invention can be used to constitute a touch panel sensor, and includes at least one sensor base material and at least one wiring base material described above. The base material is connected to the external connection component.
  • the sensor base material and the wiring base material are connected so that the sensor channel of the sensor base material and the wiring of the wiring base material are electrically connected. Can be manufactured.
  • the touch panel sensor base material set may further include the above-described conductive member. Thereby, a touch panel sensor with good electrical connection between the sensor channel and the wiring can be efficiently manufactured.
  • the present invention is not limited to this.
  • the sensor base material may be prepared after connecting the wiring base material and the external connection component.
  • a conductor may be provided at both of the two ends (one end and the other end) of the sensor channel. If conductors are provided at both of the two ends of the sensor channel, a wiring substrate can be connected to both sides of the sensor substrate. In this case, the conductors provided at both of the two ends of the sensor channel can be electrically connected to the wiring of each wiring substrate. Even when the conductor is omitted, the wiring substrate can be connected to both sides of the sensor substrate. In this case, the two ends of the sensor channel can be electrically connected to the wiring of each wiring substrate.
  • the sensor base material and the wiring base material may be separately manufactured, or manufactured by dividing one base material on which the sensor pattern portion and the lead wiring pattern portion are formed. It may be what was done.
  • each substrate is small in comparison with one substrate having the sensor pattern portion and the lead wiring pattern portion. Handling property when forming the wiring pattern portion is improved. By improving the handleability, the sensor pattern portion and the lead wiring pattern portion can be formed with high accuracy.
  • the one base material is cut with a blade or the like, and at least one sensor base having the sensor pattern portion is formed.
  • It can be divided into a material and at least one wiring substrate having a lead wiring pattern portion. According to this method, when the sensor substrate and the wiring substrate are connected, the cutting lines of each substrate can be reconnected. Even if the cutting line at the time of cutting may be bent, the cutting lines of the respective base materials are in meshing relationship with each other, so that dimensional deviation and positional deviation are unlikely to occur during reconnection, and disconnection and short circuit can be prevented.
  • the present invention is not limited to this.
  • the sensor substrate may have a sensor pattern part on one side.
  • the sensor pattern portion having the two-layer structure can suitably perform position detection in the XY coordinate system, similarly to the sensor pattern portions on both sides described above.
  • the method of making the sensor pattern part into a two-layer structure by lamination is not particularly limited as long as the insulation between the sensor pattern parts of each sensor base material to be laminated is maintained.
  • lamination first, two units are prepared by connecting a sensor base material having a sensor pattern part on one side and a wiring base material to which external connection components are connected. Then, the sensor pattern part can be made into a two-layer structure by laminating two units of the sensor substrate.
  • the sensor bases of the two units When stacking the sensor bases of the two units, they may be stacked so that the surfaces not provided with the sensor channels face each other, or the surface of the one sensor base not provided with the sensor channels You may laminate
  • the latter form is particularly preferable, and an effect that the external connection parts can be arranged on the same surface side with respect to the wiring base material of each unit is obtained.
  • the terms “front surface” and “back surface” of the base material are used for the purpose of distinguishing one surface of the base material from the other surface formed on the back side as viewed from the one surface. This is merely a description, and in a product including a touch panel sensor, it is not limited that the “front surface” is oriented to the front surface side and the “back surface” is oriented to the back surface side. In a product including a sensor film, the “front surface” may be oriented to the back surface side, and the “back surface” may be oriented to the front surface side.

Abstract

La présente invention a pour objet de fournir : un procédé de production d'un capteur de panneau tactile, qui est capable d'améliorer les propriétés de manipulation pendant le temps lorsqu'un composant de connexion externe est connecté, en particulier dans les cas où un capteur de panneau tactile de surface importante est produit, et qui est également capable d'améliorer le rendement ; et un ensemble de substrats de capteur de panneau tactile. À cet effet, l'invention porte sur un procédé de fabrication d'un capteur à écran tactile, dans lequel un composant de connexion externe (3) est connecté à au moins un substrat de câblage (2) qui a une partie de motif de câblage de sortie (W) qui est composée d'une pluralité de lignes de câblage (22), et ensuite, à au moins un substrat de capteur (1) qui a une partie de motif de capteur (S) qui est composée d'une pluralité de canaux de capteur (12); le substrat de capteur (1) et le substrat de câblage (2) sont connectés de telle sorte que les canaux de capteur (12) du ou des substrats de capteur (1) et les lignes de câblage (22) du substrat de câblage (2) sont électriquement connectées les uns aux autres.
PCT/JP2018/003686 2018-02-02 2018-02-02 Procédé de production de capteur de panneau tactile et ensemble de substrats de capteur de panneau tactile WO2019150562A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019568529A JPWO2019150562A1 (ja) 2018-02-02 2018-02-02 タッチパネルセンサーの製造方法及びタッチパネルセンサー基材セット
PCT/JP2018/003686 WO2019150562A1 (fr) 2018-02-02 2018-02-02 Procédé de production de capteur de panneau tactile et ensemble de substrats de capteur de panneau tactile

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/003686 WO2019150562A1 (fr) 2018-02-02 2018-02-02 Procédé de production de capteur de panneau tactile et ensemble de substrats de capteur de panneau tactile

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WO2019150562A1 true WO2019150562A1 (fr) 2019-08-08

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022033524A (ja) * 2020-08-17 2022-03-02 シャープ株式会社 タッチパネルおよび表示装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013045150A (ja) * 2011-08-22 2013-03-04 Dainippon Printing Co Ltd パネルおよび表示装置
WO2014171103A1 (fr) * 2013-04-18 2014-10-23 シャープ株式会社 Module de panneau tactile et dispositif d'information électronique
JP2014206936A (ja) * 2013-04-15 2014-10-30 富士フイルム株式会社 タッチパネル用導電シートの製造方法、および、タッチパネル用導電シート

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013045150A (ja) * 2011-08-22 2013-03-04 Dainippon Printing Co Ltd パネルおよび表示装置
JP2014206936A (ja) * 2013-04-15 2014-10-30 富士フイルム株式会社 タッチパネル用導電シートの製造方法、および、タッチパネル用導電シート
WO2014171103A1 (fr) * 2013-04-18 2014-10-23 シャープ株式会社 Module de panneau tactile et dispositif d'information électronique

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022033524A (ja) * 2020-08-17 2022-03-02 シャープ株式会社 タッチパネルおよび表示装置
JP7463636B2 (ja) 2020-08-17 2024-04-09 シャープ株式会社 タッチパネルおよび表示装置

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