WO2019145925A1

WO2019145925A1 - Method of printing onto thread-like member, and wire saw

Info

Publication number: WO2019145925A1
Application number: PCT/IB2019/050685
Authority: WO
Inventors: Takehiro MITSUDA; Daniel M. Lentz; James N. Dobbs; Eisuke OCHI; Masaru Iwasawa; Minori KAWAGOE; Jun Kariya; Toshihiro Kasai
Original assignee: 3M Innovative Properties Company
Priority date: 2018-01-29
Filing date: 2019-01-28
Publication date: 2019-08-01
Also published as: CN111655500A; CN111655500B; TW201945212A; JP2021003806A

Abstract

The method of printing onto a thread-like member includes: providing a pinching part between a backup roller and a printing roller having an elastic surface with a pattern; applying and smoothing ink onto the printing roller; feeding a thread-like member through the pinching part; and curing the ink retained on the thread-like member.

Description

METHOD OF PRINTING ONTO THREAD-LIKE MEMBER, AND WIRE SAW

Technical Field

[0001] The present invention relates to a method of printing onto a thread-like member, and to a wire saw.

Background Art

[0002] In the related art, a configuration where abrasive grains are adhered to a surface of a thread-like member is known, as disclosed in Patent Document 1.

Patent Document 1 describes a configuration of a wire saw with abrasive grains adhered to a thread-like member.

Patent Document

[0003] Patent Document 1 : JP 2011-98407A

Summary of Invention

[0004] In the related art, there has been demand to further enhance the

performance of wire saws. Furthermore, there is also demand to manufacture these wire saws using a simple method. Therefore, there is demand to enhance the performance of wire saws using a simple method.

Solution to Problem

[0005] The method of printing onto a thread-like member according to one aspect of the present invention includes: providing a pinching part between a backup roller and a printing roller having an elastic surface with a pattern; applying and smoothing ink onto the printing roller; feeding a thread-like member through the pinching part; and curing the ink retained on the thread-like member.

Advantageous Effects of Invention

[0006] The present invention can provide a method of printing onto a thread-like member that can enhance the performance of a wire saw using a simple method, and a wire saw.

Brief Description of Drawings

[0007] FIG. 1 A is a schematic side view of a printing device, in which a gravure printing roller is used, and FIG. 1B is a schematic side view of a printing part, in which a flexo printing roller is used.

[0008] FIG. 2A is a schematic side view illustrating a detailed configuration of a printing part, in which the gravure printing roller is used, and FIG. 2B is a schematic side view illustrating a detailed configuration of the printing part, in which the flexo printing roller is used.

[0009] FIG. 3 is a diagram where the printing roller is viewed from an upper side.

[0010] FIG. 4A is an enlarged diagram of a printing region as viewed from an upper side, FIG. 4B is a cross-sectional view along line IVb-IVb of FIG. 4A of the gravure printing roller, and FIG. 4C is a cross-sectional view along line IVb-IVb of FIG. 4A of the flexo printing roller.

[0011] FIG. 5 is a process diagram illustrating a treatment process for a wire printing method. [0012] FIG. 6A is a diagram illustrating the condition of the wire as viewed from the side, and FIG. 6B is a cross-sectional view along line VIb-VIb shown in FIG. 6A.

[0013] FIG. 7A is a diagram illustrating the condition of the wire saw as viewed from the side, FIG. 7B is a cross-sectional view along line VIb-VIb illustrated in FIG. 7A, and FIG. 7C is a cross-sectional view along line VIIc-VIIc shown in FIG. 7A.

[0014] FIG. 8A is a photograph showing a wire saw according to an embodiment of Example 1, and FIG. 8B is a photograph showing a wire saw according to an embodiment of Example 2.

[0015] FIG. 9 is a photograph of a wire to which flexo printing and plating process were performed according to an embodiment of Example 3.

[0016] FIG. 10 is a Table showing the test results for Example 1 and Comparative Example 1.

[0017] FIG. 11 is a Table showing the test results for Example 2 and Comparative Example 2.

Description of Embodiments

[0018] Next, embodiments of the present invention will be described in detail with reference to the attached drawings. Note that in the following description, the same reference characters are used for components that are the same as or equivalent to one another, and redundant descriptions of these components will be omitted.

[0019] The method of printing onto a thread-like member according to an embodiment of the present invention and a device used for manufacturing the wire saw are described while referring to FIG. 1. FIG. 1 A is a schematic side view of a printing device, in which a gravure printing roller is used. The manufacturing device 1 for manufacturing the wire saw includes the printing device 100 illustrated in FIG. 1 A and a plating device 200. As illustrated in FIG. 1 A, the printing device 100 includes a wire feed part 10, a printing part 11, a curing part 12, and a winding part 13. FIG. 1B illustrates a printing part 11, in which a flexo printing roller is used.

[0020] The wire feed part 10 feeds a plurality of wires 20. The wires 20 are fed by the wire feed part 10 in a mutually independent condition or in a condition where each strand is aligned in a direction orthogonal to the feed direction (for example, refer to FIG. 3 and FIGS. 4 A and 4B). In the present embodiment, the wires 20 are fed, printed, cured, and wound in a condition aligned in the horizontal direction.

The wire feed part 10 has at least a feedout bobbin 21. The feedout bobbin 21 is a member where a plurality of wires 20 are wound in a roll. The feedout bobbin 21 feeds out the wire 20 that is in a wound condition by rotating. Note that the wire feed part 10 may have a dancer pulley that stabilizes the tension of the wire 20 by moving in the horizontal direction. The wire 20 that is fed from the wire feed part 10 is provided to the printing part 11.

[0021] The material of the wire 20 is selected from the group consisting of metal, resin, glass fiber, and rubber. The metal can be a material such as steel wire, copper wire, and the like. The resin is selected from a material such as nylon, PET, and the like. The glass fiber is a material such as quartz glass, alkali-free glass, and the like. The rubber is a material such as latex, silicone rubber, and the like. [0022] The printing part 11 performs printing onto the wire 20. The printing part 11 simultaneously performs printing onto a plurality of aligned wires 20. FIG. 2 is a schematic side surface view illustrating the detailed configuration of a printing part 11. As illustrated in FIG. 2A, the printing part 11, in which the gravure printing roller is used, includes a gravure printing roller 25, backup roller 26, ink supply part 27, and doctor blades 28, 29. As illustrated in FIG. 2B, the printing part 11, in which the flexo printing roller is used, includes a flexo printing roller 33, backup roller 26, ink supply part 27, and doctor blades 280, 29.

[0023] The printing rollers 25, 33 each perform printing by providing the ink 90 to the outer circumferential surface of the wire 20. The printing rollers 25, 33 each are placed such that the axis of rotation extends in the horizontal direction. The printing rollers 25, 33 each have an elastic layer 31, 310 made of an elastic member on the outer circumferential side. The surfaces 25a, 33a of the outer circumferential side of the printing rollers 25, 33 each have an outer circumferential surface that is the elastic layer 31. The elastic layers 31, 310 may be made of rubber, resin, or the like, for example. A description of the details of the gravure printing roller 25 and the flexo printing roller 33 are provided below.

[0024] The backup roller 26 pinches the wire 20 against the printing roller 25 or 33, and presses the wire 20 to the printing roller 25 or 33. The backup roller 26 is provided at a position where the backup roller 26 opposes with the printing roller 25 or 33 in the vertical direction. The backup roller 26 is placed such that the axis of rotation extends in the horizontal direction.

[0025] A pinching part 30 that pinches the wire 20 is formed between the surface 25a or 33a of the outer circumferential side of the printing roller 25 or 33 and the surface 26a of the outer circumferential side of the backup roller 26. The pinching part 30 is formed between the surface 25a or 33a of the upper end side of the printing roller 25 or 33 and the surface 26a of the lower end side of the backup roller 26. In the pinching part 30, the surface 25a of the printing roller 25 and the surface 26a of the backup roller 26 may be separated from each other or in contact with each other. The printing roller 25 or 33 and the backup roller 26 rotate so as to feed the wire 20 that is pinched by the pinching part 30 in the machine direction. The pinching part 30 simultaneously feeds at least two wires 20. In FIGS. 2A and 2B, the printing rollers 25, 33 rotate in the clockwise direction. The backup roller 26 rotates in the counterclockwise direction which is the opposite direction to the printing rollers 25, 33.

Gravure printing

[0026] An ink supply part 27 provides the ink 90 to the gravure printing roller 25. The ink supply part 27 includes an ink supply pan 27a, a pump 27b, and an ink tank 27c. The ink supply pan 27a holds the ink 90, and a portion of the gravure printing roller 25 on the lower end side is immersed in the ink 90. Therefore, the ink supply pan 27a can cause the ink 90 to adhere to the surface 25a of the gravure printing roller 25 in conjunction with rotation of the gravure printing roller 25. The ink tank 27c stores the ink 90. The pump 27b provides the ink 90 in the ink tank 27c to the ink supply pan 27a.

[0027] The doctor blade 28 removes the excess ink 90 that has adhered to the surface 25a of the gravure printing roller 25. The tip end part of the doctor blade 28 is provided at a position that contacts the surface 25a of the gravure printing roller 25 or that is proximal to the surface 25a. The doctor blade 29 removes the ink 90 that has adhered to the surface 26a of the backup roller 26. The tip end part of the doctor blade 29 is provided at a position that contacts the surface 26a of the backup roller 26 or that is proximal to the surface 26a.

Flexo printing

[0028] An ink supply part 27 provides the ink 90 to the flexo printing roller 33.

The ink supply part 27 includes an ink supply pan 27a, a pump 27b, and an ink tank 27c. The ink 90 is stored in the ink supply pan 27a, and a portion of an anilox roller 32 on the lower end side is immersed in the ink 90. Therefore, the ink supply pan 27a can cause the ink 90 to adhere to the surface 32a of the anilox roller in conjunction with rotation of the anilox roller 32. The ink tank 27c stores the ink 90. The pump 27b provides the ink 90 in the ink tank 27c to the ink supply pan 27a.

[0029] The doctor blade 280 removes the remaining ink 90 that has adhered to the surface 32a of the anilox roller 32. The tip end portion of the doctor blade 280 is provided so as to be in contact with the surface 32a of the anilox roller 32 or to be proximal to the surface 32a. The printing on a wire surface is performed by transferring the ink adhered to the anilox roller 32 to a protruding portion of the flexo printing roller 33, and transferring the ink on the protruding portion to the wire surface.

[0030] The doctor blade 29 removes the ink 90 that has adhered to the surface 26a of the backup roller 26. The tip end part of the doctor blade 29 is provided at a position that contacts the surface 26a of the backup roller 26 or that is proximal to the surface 26a. [0031] The ink 90 is a resist for plating. Furthermore, the ink 90 is a curable material. For example, the ink 90 may be a photocurable material. The ink 90 is a 100% solid composition. A 100% solid composition indicates that only solid components are contained, and solvent (organic solvent or water) is not included. The ink 90 can be, for example, an acrylic monomer. Furthermore, the ink 90 can be a heat curable material such as an epoxy resin or the like, for example.

[0032] Next, the detailed configurations of the printing rollers 25, 33 are described in reference to FIG. 3 and FIGS. 4A to 4C. FIG. 3 is a diagram where the printing roller 25 or 33 is viewed from an upper side. In FIG. 3, the backup roller 26 is omitted. FIGS. 4A to 4C are enlarged diagrams of a printing region El of the printing roller 25 or 33. FIG. 4A is an enlarged diagram of the printing region El as viewed from an upper side. FIG. 4B is a cross-sectional view along line IVb-IVb of FIG. 4A in a case where the printing roller is a gravure printing roller. FIG. 4C is a cross-sectional view along line IVb-IVb of FIG. 4A in a case where the printing roller is a flexo printing roller. As described above, the printing rollers 25 and 33 have elastic layers 31 and 310 on the outer circumferential side, respectively.

[0033] Therefore, the printing rollers 25 and 33 have elastic surfaces 25a and 33a, respectively. Note that the hardness of the surfaces 25a, 33a (namely, the hardness of the elastic layer 31 and 310) can be set within a range of 10 to 90 degrees based on Durometer Hardness A of the JIS standard (JIS K6253-1997 Type A Durometer). A printing region El where printing is performed on the wire 20 is formed on each of the surfaces 25a, 33a. The printing region El is formed at a center part in the axial direction of the surface 25a. The wire 20 is fed in a condition where two or more wires are aligned in the axial direction, and are in a condition that contacts the printing region El . A predetermined pattern for printing is formed on the printing region El . Therefore, the ink 90 adheres to the surface of the wire 20 in accordance with the pattern of the printing region El . Note that each of the surfaces 25a, 33a with elasticity can be formed at least in the printing region El, and the surface of regions other than the printing region El may not have elasticity.

[0034] As illustrated in FIG. 4A, a plurality of grooves 60 or a plurality of protruding portions 61 are formed on the surfaces 25a, 33a in the printing region El . The grooves 60 or the protruding portions 61 are formed with a constant pitch with gaps therebetween. The grooves 60 or the protruding portions 61 are inclined with respect to the axial direction. The inclination angle 01 of the groove 60 or the protruding portion 61 with respect to the axial direction may be 0° or greater and less than 90°, and more preferably greater than 0° and 80° or less. In the present embodiment, the inclination angle 01 is set to 45°.

[0035] As illustrated in FIG. 4B, the groove 60 has a shape with rectangular cross section in a case where the printing roller is a gravure printing roller. The width of the groove 60 can be set to from 0.01 to 10 mm. The depth of the groove 60 can be set to from 0.001 to 1 mm. The gaps between the grooves 60 can be set to from 0.01 to 10 mm. The pitch of the groove 60 may be approximately equal pitch, or might not have an equal pitch. The insides of the grooves 60 retain ink 90. Therefore, the wire 20 comes in contact with the surface 25a while being fed, and comes in contact with the ink 90 in the grooves 60. This causes the ink 90 to adhere to the surface of the wire 20. The ink 90 is held on the surface of the wire 20 at a position and a shape corresponding to the pattern of the grooves 60. Note that the ink 90 does not adhere to a portion of the surface of the wire 20 in the circumferential direction. That is, the ink 90 does not adhere to the region of the surface of the wire 20a opposite to the gravure printing roller 25 (see FIG. 6B).

[0036] As illustrated in FIG. 4C, the protruding portion 61 has a shape with rectangular cross section in a case where the printing roller is a flexo printing roller. The width of the protruding portion 61 can be set to from 0.01 to 10 mm.

The height of the protruding portion 61 can be set to from 0.001 to 1 mm. The gaps between the protruding portions 61 can be set to from 0.01 to 10 mm. The pitches of the protruding portions 61 may be approximately equal pitches, or might not be equal pitches. The ink 90 is retained on the protruding portions 61. Therefore, the wire 20 comes in contact with the surface 33a while being fed, and comes in contact with the ink 90 on the protruding portions 61. This causes the ink 90 to adhere to the surface of the wire 20. The ink 90 is retained on the surface of the wire 20 at a position and a shape corresponding to the pattern of the protruding portions 61. Note that the ink 90 does not adhere to a portion of the surface of the wire 20 in the circumferential direction. That is, the ink 90 does not adhere to the region of the surface of the wire 20 opposite to the flexo printing roller 33 (see FIG. 6B).

[0037] Returning to FIG. 1, the curing part 12 cures the ink 90 that is held by the wire 20. The curing part 12 hardens the ink 90 in the internal space while allowing the wire 20 to pass through the internal space. In a case where the ink 90 is a photocurable material, the curing part 12 has a light source in the internal space. The light source can be, for example, an LED that irradiates UV. The curing part 12 may have light sources at a plurality of positions in the circumferential direction with respect to the wire 20 that is fed. For example, the curing part 12 may have three light sources around the wire 20, and can irradiate light to the wire 20 from three directions. Therefore, the curing part 12 can irradiate light to the wire 20 along the entire circumference. As described above, the ink 90 adheres to a portion of the wire 20 in the circumferential direction. However, the position in the circumferential direction of the portion where ink 90 has adhered may change between the printing time and the curing time due to the effect of twisting or the like of the wire 20. In this case as well, the curing part 12 can irradiate light to the ink 90 regardless of the position in the circumferential direction of the ink 90. Note that in a case where the ink 90 is a heat curable material, the curing part 12 has a heater.

[0038] A winding part 13 winds the wire 20 on the downstream side of the printing part 11 and the curing part 12. The winding part 13 winds the plurality of wires 20 after printing. The winding part 13 has at least a winding bobbin 44. The winding bobbin 44 is a member that winds the wire 20 in a condition where the wires are aligned in a direction orthogonal to the machine direction. The winding bobbin 44 winds the wire 20 in a wound condition by rotating. The winding part 13 may have a dancer pulley and a capstan pulley that adjusts the feeding speed of the wire 20 by frictional force on the surface.

[0039] The plating device 200 performs plating on the surface of the wire 20. As described above, the ink 90 is a resist material towards plating. Therefore, the plating is performed on the surface of the wire 20 other than areas where the ink 90 is retained. The plating device 200 has a feed out part 51, winding part 52, and a plurality of tanks 53. [0040] The plating device 200 has a plurality of tanks 53 arranged in order in the machine direction of the wire 20 between the feed out part 51 and the winding part 52. The feed out part 51 feeds out the wire 20 in the lateral direction, and the winding part 52 winds the wire 20 that is fed in the lateral direction. The wire 20 that is fed in the lateral direction moves downward spanning across a relay roller 54A above the tanks 53. The wire 20 is immersed in the liquid in the tank 53, and moves upward spanning across the relay roller 54B in the tank 53. The wire 20 is removed from the liquid in the tank 53, and then is moved in the lateral direction spanning across the relay roller 54C above the tank 53.

[0041] The plating device 200 includes at least a tank 53 that functions as a plating tank. The plating tank forms plating on a portion of the wire 20 that is not covered by the resist (ink 90). The plating tank contains a slurry containing abrasive grains. In other words, a slurry containing abrasive grains is stored as the plating solution in the tank 53 corresponding to the plating tank. Therefore, the wire 20 can be polished in the portions that are not covered by the resist (ink 90). The abrasive grains are, for example, particles of silicon carbide, diamond, or the like.

Essentially all of the abrasive grains have a size of 10 pm or smaller, or 7 pm or smaller. Note that this dimension is the dimension of the portion of the abrasive grains with the largest width. Note that the phrase "essentially all of the abrasive grains" indicates that abrasive grains that are not within the numerical range are allowed to exist within the range of manufacturing error, but the other abrasive grains are all within the aforementioned numerical range. For example, "90% or greater of all of the abrasive grains" can be considered to be "essentially all of the abrasive grains". The plating solution may contain pH adjusting agent, smoothing agents, and the like, in addition to abrasive grains.

[0042] Furthermore, the plating device 200 has a tank 53 where chemicals for removing coatings on the surface of the wire 20 are stored, prior to performing the plating. Furthermore, the plating device 200 has a tank 53 for cleaning the chemicals and the plating solution.

[0043] Next, the printing method for the wire 20 is described while referencing FIG. 5. FIG. 5 is a process diagram illustrating a treatment process for the printing method of the wire 20.

[0044] First, a preparation process for preparing the printing roller 25 or 33 and the backup roller 26 is performed (step S 10). The preparation process S10 is a process that provides a pinching part 30 between the backup roller 26 and the printing roller 25 or 33 having an elastic surface 25a or 33a on which a pattern is formed (refer to FIG. 2A and 2B). In the preparation process S 10, the pressure or the like that pinches the wire 20 in the pinching part 30 is adjusted.

[0045] Next, an ink application process for applying the ink 90 to the printing roller 25 or 33 is performed (step S20). The ink application process S20 is a process that applies and smooths the ink 90 to the printing roller 25 or 33. In the ink application process S20, the ink supply part 27 applies the ink 90 to the surface 25a or 33a of the printing roller 25 or 33. When this occurs, in the gravure printing roller 25, the ink 90 enters the groove 60 of the printing region El . Furthermore, the doctor blade 28 smooths the ink 90 on the surface 25a of the gravure printing roller 25. Thereby, the ink 90 on the surface 25a is removed by the doctor blade 28, and the ink 90 within the groove 60 remains. The ink 90 is retained in the groove 60 of the printing area El . On the other hand, in the flexo printing roller 33, the ink 90 on the surface 32a of the anilox roller 32 is applied onto the protruding portion

61 of the flexo printing roller 33 and smoothed by wetting and spreading, and the ink 90 is retained on the protruding portion 61 of the flexo printing roller 33.

[0046] Next, a printing process that performs printing on a surface of the wire 20 is performed (step S30). The printing process S30 is a process in which the wire 20 is fed through the pinching part 30. Thereby, the ink 90 that is applied to the surface 25a or 33a of the printing roller 25 or 33 in the ink application process S20 adheres to the wire 20. The printing process S30 is a process in which at least two wires 20 are simultaneously fed through the pinching part 30.

[0047] FIGS. 6 A and 6B are diagrams illustrating the condition of the wire 20 after printing. FIG. 6A is a diagram that illustrates the condition of the wire 20 viewed from a side. FIG. 6B is a cross-sectional view along VIb-VIb illustrated in FIG. 6A. As illustrated in FIG. 6B, the ink 90 applies a partial spiral shaped pattern 70 to the wire 20 so that the area that can be polished has an inclined shape (refer to FIG. 7A which will be described later). In the partial spiral shaped pattern 70 of the ink 90, the ink 90 is formed only on one part of the wire 20 in the circumferential direction, and forms a portion with a pattern extending in the circumferential direction so as to be inclined with respect to the axial direction of the wire 20.

When describing in detail the "partially spiraled" pattern while referencing FIGS. 6A and 6B, a pattern formed by winding a band in a spiral shape on the surface of the wire 20 is presumed. In a case where the band for the area belonging to the first portion Pl is eliminated and the band belonging to the second portion P2 is left out of the spiral shaped pattern, a pattern similar to the pattern illustrated in FIGS. 6 A and 6B is formed. Patterns where a portion of a spiral shape remains correspond to patterns with a“partially spiral shape”.

[0048] As illustrated in FIG. 6B, one part of the surface 20a of the wire 20 is covered with the pattern 70 of the ink 90 in the circumferential direction, and another portion is exposed from the pattern 70. In a case where the whole circumference of the wire 20 is 360°, 02 can, for example, be set to from 10 to 300°. Note that, angle 02 of the pattern 70 of the ink 90 becomes larger than 180° since the surface 25a or 33a of the printing roller 25 or 33 has elasticity, and the wire 20 sinks in relation to the surface 25a or 33a.

[0049] The end part 70a in the circumferential direction of the pattern 70 of the ink 90 extends along an axial direction of the wire 20. In FIG. 6B, the end part 70a is formed in parallel to the axial direction, but can be any shape due to printing. The end part 70b in the axial direction of the pattern 70 is inclined with respect to the axial direction. Note, the inclination angle of the end part 70b with respect to the axial direction is determined according to the inclination angle 01 (refer to FIGS.

4A to 4C) of the groove 60 or the protruding portion 61 of the surface 25a or 33a of the printing roller 25 or 33. The pattern 70 is placed separate from the other patterns 70 in the axial direction of the wire 20. The space between one pattern 70 and another pattern 70 is the portion over the entire circumference that is exposed from the ink 90. The portion where the surface 20a is exposed over the entire circumference between the pair of patterns 70 and the portion of the surface 20a of the wire 20 exposed from the pattern 70 of the ink 90 as illustrated in FIG. 6B are mutually connected. [0050] Of the areas in the circumferential direction of the wire 20, the area where the pattern 70 is formed is referred to as the first portion Pl, and the area where the pattern 70 is not formed is referred to as the second portion P2. When this occurs, the surface 20a exposed from the ink 90 is connected in the axial direction in the first portion Pl . The pattern 70 of the ink 90 is intermittently formed in the second portion P2, and the surface 20a exposed from the ink 90 is intermittently formed.

[0051] Next, a curing process that cures the ink 90 stored in the wire 20 is performed (step S40). The pattern 70 of the ink 90 for the wire 20 is cured in the curing process S40.

[0052] Next, a plating process that plates the wire 20 is performed (step S50). The plating process S50 is a process that passes the wire 20 through a tank 53 which is a plating tank so that a portion of the wire 20 not covered by the pattern 70 which is a resist is plated.

[0053] The plating process S50 which is a process when piano wire is used as the wire 20 is described below in detail. First, a plating device 200 removes oil from the surface of the wire 20. When this occurs, the wire 20 passes through the tank 53 which stores a chemical liquid for deoiling. Note that, the wire 20 is then washed. Next, the plating device 200 removes brass plating formed on the surface of the wire 20. In this process, the brass plating is removed from an area of the wire 20 where the pattern 70 of the ink 90 is not formed. When this occurs, the wire 20 passes through the tank 53 which stores chemical that removes the brass plating. Note, the wire 20 is then washed. Next, the plating device 200 removes an oxidized layer from the surface of the wire 20. When this occurs, the wire 20 passes through the tank 53 which stores a chemical used for removing the oxidized layer. The plating device 200 then performs plating to an area of the wire 20 where the pattern 70 of the ink 90 has not been formed. When this occurs, the wire 20 passes through the tank 53 that stores the plating liquid.

[0054] FIGS. 7A to 7C are diagrams illustrating a plated wire 20, or in other words, a wire saw 80. FIG. 7A is a diagram illustrating the wire saw 80 viewed from the side. FIG. 7B is a cross-sectional view along the Vllb-VIIb lines illustrated in FIG. 7A. FIG. 7B is a cross-sectional view along the Vllc-Viic lines illustrated in FIG. 7A. As illustrated in FIG. 7A, the wire saw 80 has a thread-like body 82. The thread-like body 82 has a plated layer 81 including abrasive grains in a portion of the wire 20 not covered by the pattern 70 of the ink 90 that is the resist. The thread-like body 82 has resist material towards plating provided with the partially spiral shaped pattern 70. The thread-like body 82 has a polishing material (in other words, the plated layer 81) on the portion not covered by the resist material in the thread-like body 82. The plated layer 81 functions as a polishing part that can polish a subject using the aforementioned configuration. The pattern 70 functions as a discharge groove that discharges scraps.

[0055] As illustrated in FIG. 7B, the plated layer 81 is not formed on the portion of the wire 20 on which the pattern 70 of the ink 90 is formed, and the plated layer 81 is formed on the portion of the wire 20 where the pattern 70 is not formed. As illustrated in FIG. 7C, the plated layer 81 is formed on the entire circumference of the wire 20 in regard to the portion on which the pattern 70 is not formed around the entire circumference of the wire 20. The thread-like body 82 has the plated layer 81 that can be polished continuously along the axial direction in regard to the first portion Pl, and has the plated layer 81 that can be polished intermittently along the axial direction with the pattern 70 interposed therebetween in regard to the second portion P2.

[0056] Next, the function and effect of the printing method onto the thread-like member according to the present embodiment and the wire saw 80 will be described.

[0057] The printing method onto the wire (thread-like member) 20 includes providing a pinching part 30 between the backup roller 26 and the printing roller 25 or 33 having an elastic surface 25a or 33a with a pattern formed thereon, applying and smoothing the ink 90 on the printing roller 25 or 33, feeding the wire 20 through the pinching part 30, and curing the ink 90 retained on the wire 20.

[0058] In this printing method, the wire 20 is fed through the pinching part 30 between the printing roller 25 or 33 to which the ink 90 has been applied and the backup roller 26. Thereby, the ink 90 on the printing roller 25 or 33 is retained on the wire 20. When passing through the pinching part 30, the wire 20 is pressed against the printing roller 25 or 33 by the backup roller 26. The printing roller 25 or 33 has an elastic surface 25a or 33a and has a pattern formed. The wire 20 can come in contact with the surface 25a or 33a of the printing roller 25 or 33 across a wide range in the circumferential direction since the wire 20 sinks into the surface 25a or 33a of the printing roller 25 or 33. In other words, the ink 90 can be applied to the wire 20 under a condition that the pattern of the printing roller 25 or 33 can be sufficiently reflected. Printing that reflects sufficiently the pattern of the printing roller 25 or 33 can be performed on the wire 20 by curing the ink 90 retained on the wire 20 in this condition. Therefore, the printing roller 25 or 33 can apply a pattern that can improve performance of the wire saw to the wire 20. Furthermore, this kind of printing is performed by a simple process in which the wire 20 is passed through the pinching part 30. As mentioned above, performance of the wire saw can be improved using this simple method.

[0059] In the printing method, the ink 90 can be a resist in relation to the plating.

In this case, plating can be performed on the portion of the surface of the wire not printed with the ink 90.

[0060] In the printing method, the ink 90 can be a 100% solid composition. In this case, the drying process for vaporizing the solvent can be omitted. The thickness during printing can more easily be controlled.

[0061] In the printing method, at least 2 wires 20 can be fed simultaneously through the pinching part 30. Printing can be performed at the same time in relation to at least two wires 20. Thereby, printing efficiency can be improved.

[0062] In the printing method, the material of the wire 20 can be selected from the group consisting of metal, resin, glass fiber, and rubber.

[0063] The printing method can include an additional process that passes the wire 20 through the plating tank so that the portion of the wire 20 not covered by the resist is plated. Thereby, plating can be performed on the wire 20 on the portion not printed with the ink 90.

[0064] In the printing method, the plating tank can have a slurry containing abrasive grains such that the portion of the wire 20 not covered with resist is rendered into a condition that can be polished. In this case, a wire saw can be manufactured in which the portion not covered with resist, or in other words, the portion not printed with the ink 90 is made to be the polished part. Furthermore, the printing roller 25 or 33 can apply the resist pattern on the wire 20 so that a polished part with a shape that can improve performance of the wire saw can be provided.

[0065] In the printing method, the ink 90 can be applied with a partially spiral pattern so that the area that can be polished has an inclined shape. When this occurs, a wire saw with an alternating pattern of the polished part and the ink 90 can be provided. Thereby, the wire saw can easily cut objects. The area between the inclined polished parts (area not printed with the ink 90) functions as a channel for flushing polished scraps generated while cutting. Thereby, performance of the wire saw can be improved.

[0066] The dimension of the maximum width part of the abrasive grain relative to the diameter of the thread-like member is 0.50 or less, and preferably 0.30 or less. The dimension of greater than 0.50 causes frequent shedding of the abrasive grains from the thread-like member and results in poor durability. Furthermore, the abrasive grains tend to agglomerate during plating, and poor processability is exhibited.

[0067] The roughness of the cutting surface can be made fine by making the abrasive grains smaller. However, when making the abrasive grains smaller, cutting performance is reduced. Therefore, reduction in cutting performance can be controlled by making the density of the abrasive grains higher density. However, when making the abrasive grains have high density, performance reduction caused by clogging of the polishing scraps may more easily occur. In contrast, the wire saw provided by the printing method according to the present embodiment has a channel for flushing polished scraps due to the pattern of the ink 90. Therefore, the wire saw can make the abrasive grains smaller and make the abrasive grains have high density while controlling clogging. Since the wire saw is scattering the abrasive grains across multiple layers in the plated layer, new abrasive grains can be exposed (autogenesis) even in a case where the polished surface is worn down by repeatedly polishing.

[0068] The wire saw is a wire saw having a thread-like body, the thread-like body has a resist material to plating applied with a partially spiral pattern, the portion of the thread-like body not covered with the resist material has polished material (namely, plated layer 81), the polished material contains abrasive grains in the binder, and, for purposes of making the cutting surface extremely fine, e.g. for semiconductor substrate or the like, essentially the dimensions of the maximum width parts of all of the abrasive grains are 10 pm or smaller. As these abrasive grains, for example, materials such as diamond and alumina, can be used.

[0069] The wire saw can reduce roughness of the opening during cutting since abrasive grains that are 10 pm or smaller are used. The thread-like body are applied with a partially spiral pattern by the resist material. The patterned portion does not have polishing material. The patterned portion can discharge scraps when cutting. Thereby, clogging of polishing material at the cutting portion can be controlled. As mentioned above, the cutting speed of the wire saw can be improved, and roughness of the opening can be reduced.

[0070] Essentially all of the abrasive grains can be practically 7 pm or less in regard to the wire saw. In this case, cutting performance can be improved.

[0071] Meanwhile, in a case where a material having high hardness, such as sapphire, is polished, essentially, the abrasive grains of 15 pm or greater can be used. This is because, in a case where a material having high hardness is polished, if the abrasive grains are small, the abrasive grains are abraded and become unusable in a short period of time. Use of abrasive grains having large particle diameters reduces processing stress since discharging efficiency of chips is enhanced by the pattern due to printing, permeation of a processing liquid is promoted, and processing heat is discharged.

[0072] The thread-like member can be selected from the group consisting of metal, resin, glass fiber, and rubber.

[0073] The present invention is not limited to the embodiment described above.

[0074] For example, the patterns of the printing rollers 25, 33 are not restricted to an array of inclined grooves. For example, patterns such as dots and checks can be used. In other words, the pattern by the polished material and the resist material of the wire saw is also not limited to the aforementioned embodiment. For example, the pattern can be a regular pattern.

[0075] The device structure for performing the printing method is also not limited to the aforementioned embodiment, and any device structure can be applied as long as the device is in a range that does deviate from the purpose.

[0076] For example, the ink 90 applied to the printing rollers 25, 33 can include abrasive grains. When doing so, the printing rollers 25, 33 can directly print the pattern of the polished portion on the wire 20.

Examples

Example 1

[0077] Piano wire was prepared as the wire. The wire had Cu-Zn plating on a surface, and the diameter was 100 pm. A printing device with the configuration illustrated in FIG. 1 was prepared. A photocuring ink 90 was prepared as the ink 90 that is applied to the gravure printing roller. The ink 90 contained a material that has an acrylic monomer as a main component. A pitch of a groove of the gravure printing roller was 300 pm, the groove width was 100 pm, and the groove depth was 50 pm. The inclination angle of the groove was 45°. The diameter of the gravure printing roller was 102 mm. The hardness of the rubber that comprised the surface of the gravure printing roller was 81. 3 UV-LED (l = 365 nm) with an interval of 120° were provided around the wire in the curing part. The curing part was maintained at room temperature by water cooling. N2 gas was purged in the curing part. The line speed in the printing device was 6 mpm. The ETV input was 130.4 V/ 0.36 A. The N2 gas was purged at 15 L/min. Note, printing was performed in a condition in which 130 wires were arrayed. Printing was performed on the wires using this kind of printing device. The dimension of the ink 90 pattern in the axial direction was 130 pm. The dimension of the interval between the patterns (portion on which the plated layer that can polish was formed) was 150 pm.

[0078] A plating device having the configuration illustrated in FIG. 1 was prepared. The plating device performed oil removal, washing, brass removal, washing, oxidized layer removal, and Ni plating. Metal cleaner 373 (NaOHaq + Na₂Si03aq, pH 12.35, 40°C) available from Atotech Japan was used for oil removal. Washing was performed at room temperature. Melstrip Cu 3940 (Ammonia & Cupper complex, pH9, 40°C) was used for brass removal. 2% HC1 (25°C) was used for removing the oxidized layer. The line speed for the plating device was 0.15 mpm. The slurry in the plating tank contained cp9 pm diamond particles as the abrasive grains (dimension of maximum width part of abrasive grain/wire diameter = 0.09). The thickness of the Ni plating layer was 15 pm. The wire saw illustrated in FIG. 8A was provided in this manner. This wire saw was Example 1.

Example 2

[0079] Production was performed in the same manner as in Example 1 except for changing the diameter of the wire to 180 pm, using diamonds having the

dimensions of maximum width parts of abrasive grains of 20 pm as the abrasive grains, and changing the line speed for the plating device to 9 mpm (dimension of maximum width part of abrasive grain/wire diameter = 0.11). The wire saw illustrated in FIG. 8B was provided in this manner.

Example 3

[0080] Piano wire was prepared as the wire. The wire had Cu-Zn plating on the surface, and the diameter was 180 pm. A flexo printing device with the

configuration illustrated in FIG. 1B was prepared. A photocuring ink 90 was prepared as the ink 90 that is applied to the printing roller. The ink 90 contained a material that has acrylic monomers as a main component. A pitch of a groove of the flexo printing roller was 800 pm, the groove width was 600 pm, and the groove depth was 500 pm. The inclination angle of the groove was 45°. The diameter of the flexo printing roller was 102 mm. The groove volume of the anilox roller that supplies the ink to the flexo printing roller was 18 cc/m2. The hardness of the rubber that constituted the surface of the flexo printing roller was 81. 3 UV-LED (l = 365 nm) with an interval of 120° were provided around the wire in the curing part. The curing part was maintained at room temperature by water cooling. N2 gas was purged in the curing part. The line speed in the printing device was 8 mpm.

The UV input was 130.4 V/0.36 A. The N2 gas was purged at 15 L/min. Note, printing was performed in a condition in which 130 wires were arrayed. Printing was performed on the wires using this kind of printing device. The dimension of the pattern of the ink 90 in the axial direction was 500 pm. The dimension of the interval between the patterns (portion on which the plated layer that can polish was formed) was 800 pm. Then, plating process was performed in the same manner as in Example 1 except for performing the plating without charging abrasive grains, and a wire, to which flexo printing and plating process were performed, was obtained as illustrated in FIG. 9.

Comparative Example 1

[0081] A Ni plated wire saw was prepared in order to apply diamond abrasive grains of approximately 30 pm onto the wire surface as a comparative example relative to Example 1. The wire saw for Comparative Example 1 did not have a pattern, and had abrasive grains formed throughout the entire surface of the wire. Comparative Example 2

[0082] A wire saw was prepared as a comparative example relative to Example 2 by applying diamond abrasive grains of approximately 30 pm onto a surface of a wire having a diameter of 180 pm by subjecting the surface to Ni plating with a thickness of approximately 10 pm. The wire saw for Comparative Example 2 did not have a pattern, and had abrasive grains formed throughout the entire surface of the wire.

Cutting Test 1

[0083] A cutting test was performed on the aforementioned Example 1 and

Comparative Example 1. In the cutting test, the wire saw was cut by sending the wire saw between the feedout roller and the winding roller, and placing a test piece between each roller. Tension of the wire saw was 12 N, the line speed was 4.7 mpm, and the line length was 5.3 m. Sapphire was used as the test piece. Cutting was repeatedly performed 50 times on the test body using Example 1 and

Comparative Example 1. The cutting depth in relation to the number of times cut was determined, and the average cutting depth from 1 time to 20 times was used as the first average value. The first average value is the cutting capacity of the wire saw at beginning of use. The average of the cutting depth from 30 times to 50 times was the second average value. The second average value is the cutting capacity of the wire saw in a condition of used many times. As illustrated in FIG. 9,“(second average value/first average value) x 100” was calculated as the cutting capacity maintenance rate which is a ratio of the second average value in relation to the first average ratio, which is a value showing to what extent the cutting capacity decreased when the wire saw changed from a condition of new to a condition of used many times. As illustrated in FIG. 9, Example 1 had higher cutting capacity maintenance rate than Comparative Example 1, in other words, reduction in capacity was controlled.

Visual Inspection

[0084] The conditions when performing cutting using Example 1 and Comparative Example 1 and the cut surface immediately after the cutting was observed. The appearance of the cutting tool while cutting using Comparative Example 1 was observed. Adhesion of refrigerant was hardly observed on the flat plate placed on a lower side of the cut surface in Comparative Example 1. Many polishing scraps and fallen abrasive grains were observed on the cut surface of Comparative Example 1. On the other hand, adhesion of refrigerant that fell from the wire saw was observed on the flat plate placed under the cut surface for the Example 1. Furthermore, polishing scraps and abrasive grains remaining on the cut surface were less than with Comparative Example 1. Polishing scraps and abrasive grains in addition to refrigerant were flushed from the groove part of the wire saw.

Cutting Test 2

[0085] A cutting test was performed on the aforementioned Example 2 and Comparative Example 2. The cutting test was performed by cutting sapphire (cp 2 inches, 60 mm length, plane direction C) used as a test piece with the wire saw of each of Example 2 and Comparative Example 2 by using a multi-wire saw

MWS612-DD, available from Takatori Corporation. The average value of the surface roughness and the average value of the wafer thickness are shown in a Table of FIG. 11. The surface roughness was measured by a contact-type scanning measurement device in accordance with JIS B 0601. The maximum diameters including abrasive grains before processing of Example 2 and Comparative Example 2 were approximately 240 pm and 245 pm respectively, the wire saw was arranged at a pitch of 840 pm, and thus test piece processing was performed. In Example 2, discharging efficiency of chips was enhanced by the partially spiral grooves formed on the surface, permeation of the processing liquid was promoted, discharging efficiency of processing heat was enhanced, and the processing stability was enhanced. Thus, Example 2 provided a wafer having an even smaller surface roughness and a larger thickness.

Reference Signs List

[0086] 20 Wire (thread-like member)

25 Gravure printing roller

26 Backup roller

30 Pinching part

70 Pattern

80 Wire saw

82 Thread-like body

Claims

1. A method of printing onto a thread-like member, comprising:

providing a pinching part between a backup roller and a printing roller having an elastic surface with a pattern;

applying and smoothing ink onto the printing roller;

feeding a thread-like member through the pinching part; and

curing the ink retained on the thread-like member.

2. The method of printing onto a thread-like member according to claim 1, wherein the printing roller is a gravure printing roller.

3. The method of printing onto a thread-like member according to claim 1, wherein the printing roller is a flexo printing roller.

4. The method of printing onto a thread-like member according to any one of claims 1 to 3, wherein the ink is a resist for plating.

5. The method of printing onto a thread-like member according to any one of claims 1 to 4, wherein the ink is a 100% solid composition.

6. The method of printing onto a thread-like member according to any one of claims 1 to 5, wherein at least two thread-like members are simultaneously fed through the pinching part.

7. The method of printing onto a thread-like member according to any one of claims 1 to 6, wherein a material of the thread-like member is selected from the group consisting of metal, resin, glass fiber, and rubber.

8. The method of printing onto a thread-like member according to any one of claims 1 to 7, further comprising feeding the thread-like member through a plating tank such that a portion of the thread-like member not covered by the resist is plated.

9. The method of printing onto a thread-like member according to claim 8, wherein the plating tank contains a slurry containing abrasive grains, such that the portion of the thread-like member not covered by the resist is rendered into a condition that the portion can be polished.

10. The method of printing onto a thread-like member according to claim 9, wherein the ink is provided in a partial spiral pattern such that a region that can be polished has an inclined shape.

11. A wire saw comprising a thread-like body,

the thread-like body

including a thread-like member,

a resist material to plating that is provided in a partially spiral pattern, and a polishing material on a portion of the thread-like body not covered by the resist material; wherein the polishing material includes abrasive grains in a binder; and dimensions of maximum width parts of the abrasive grains relative to the diameter of the thread-like member are 0.50 or less.

12. The wire saw according to claim 11, wherein essentially the dimensions of the maximum width parts of all of the abrasive grains are 10 pm or less.

13. The wire saw according to claim 11 or 12, wherein the thread-like member is selected from the group consisting of metal, resin, glass fiber, and rubber.