WO2019105033A1 - 埋置元件电路板的制作方法及埋置元件电路板 - Google Patents

埋置元件电路板的制作方法及埋置元件电路板 Download PDF

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WO2019105033A1
WO2019105033A1 PCT/CN2018/093632 CN2018093632W WO2019105033A1 WO 2019105033 A1 WO2019105033 A1 WO 2019105033A1 CN 2018093632 W CN2018093632 W CN 2018093632W WO 2019105033 A1 WO2019105033 A1 WO 2019105033A1
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hole
circuit board
sub
insulating layer
layer
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PCT/CN2018/093632
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English (en)
French (fr)
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李娟�
陈丽琴
李艳国
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广州兴森快捷电路科技有限公司
深圳市兴森快捷电路科技股份有限公司
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Publication of WO2019105033A1 publication Critical patent/WO2019105033A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive

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  • the present invention relates to the field of circuit board processing technology, and in particular, to a method for fabricating a buried component circuit board and a buried component circuit board.
  • the present invention overcomes the deficiencies of the prior art, and provides a method for fabricating a buried component circuit board and a buried component circuit board with better reliability.
  • a method for fabricating a buried component circuit board comprising a first sub-board and a second sub-board, the first sub-board comprising a pre-fabricated layer, the pre-formed layer being disposed on the first sub-board
  • the outermost layer, the second sub-board includes a first insulating layer, and the first insulating layer is disposed at an outermost layer of the second sub-board, and includes the following steps:
  • a second insulating layer is disposed on the processed prefabricated layer, and a first through hole is formed at a position corresponding to the pad on the second insulating layer, and the conductive material is filled in the first through hole;
  • the component is mounted on the first sub-board, and the pin of the component protrudes into the first through hole;
  • the first daughterboard is pressed against the second daughterboard.
  • a second insulating layer is disposed on the prefabricated layer, a first through hole is opened and a conductive adhesive material is filled, and the component is mounted on the first sub-board, so that the component leads are inserted into the first In a through hole, a groove matching the component is further formed on the first insulating layer, and the first sub-board is pressed with the second sub-board.
  • the pin of the component protrudes into the first through hole, and the component can be fully adhered to the second insulating layer, and the pin can be electrically connected to the pad through the conductive adhesive material, and the component is connected.
  • the cooperation between the component and the second sub-board is also relatively tight.
  • the circuit board made of the first sub-board, the component and the second sub-board is closely matched, there is no void, and the inside of the circuit board is not easy to retain liquid, which does not affect the operation of the circuit board, so that the manufactured circuit board is Good reliability.
  • a second insulating layer is disposed on the processed prefabricated layer, a first through hole is opened at a position corresponding to the pad on the second insulating layer, and the first through hole is filled with a conductive adhesive material, specifically Includes the following steps:
  • the second insulating layer and the insulating film are sequentially disposed on the processed pre-formed layer by heating and pressing.
  • the temperature ranges from 80 ° C to 155 ° C and the pressure ranges from 15 kg/cm 2 to 23 kg/cm 2 .
  • the duration of the above heating and pressurization is 2 minutes to 6 minutes.
  • the second insulating layer is a prepreg
  • the insulating film is a PET film.
  • the conductive adhesive material is a conductive resin.
  • the apertures of the first through hole and the second through hole gradually increase in a direction away from the first sub-board.
  • a buried component circuit board produced by the method of fabricating a buried component circuit board according to any of the above.
  • FIG. 1 is a schematic flow chart 1 of a method for fabricating a buried component circuit board according to an embodiment of the present invention
  • Figure 2 is a schematic view showing the manufacturing steps of Figure 1;
  • FIG. 3 is a schematic flow chart 2 of a method for fabricating a buried component circuit board according to an embodiment of the present invention
  • FIG. 4 is a schematic view showing the manufacturing steps of FIG. 3.
  • first daughter board, 110 prefabricated layer, 111, pad, 120, second insulating layer, 121, first through hole, 130, conductive adhesive material, 140, isolation film, 141, second through hole, 200, second sub-board, 210, first insulating layer, 300, components.
  • first and second in the present invention do not represent a specific number and order, but are merely used for distinguishing names.
  • the embedded component circuit board includes a first sub-board 100 and a second sub-board 200.
  • the first sub-board 100 includes a pre-fabricated layer 110, and the pre-fabricated layer 110 is provided.
  • the second sub-board 200 includes a first insulating layer 210, and the first insulating layer 210 is disposed on the outermost layer of the second sub-board 200, and is embedded.
  • the manufacturing method of the component circuit board includes the following steps:
  • a second insulating layer 120 is disposed on the processed pre-formed layer 110, and a first via hole 121 is formed at a position corresponding to the pad 111 on the second insulating layer 120, and the first via hole 121 is filled with a conductive adhesive.
  • the component 300 is mounted on the first sub-board 100, and the pin of the component 300 extends into the first through hole 121;
  • a groove matching the component 300 is formed on the first insulating layer 210, and the first sub-board 100 and the second sub-board 200 are pressed together.
  • the method for fabricating the embedded component circuit board includes disposing a second insulating layer 120 on the pre-formed layer 110, opening a first via hole 121 and filling the conductive adhesive material 130, and mounting the component 300 and the first sub-board 100 to make the component
  • the pin of the 300 is inserted into the first through hole 121, and a groove matching the component 300 is formed on the first insulating layer 210, and is pressed by the first sub-board 100 and the second sub-board 200.
  • the pin of the component 300 extends into the first through hole 121, and the component 300 can be fully adhered to the second insulating layer 120, and the lead can pass through the conductive adhesive material 130 and the pad 111.
  • the component 300 is tightly coupled with the first sub-board 100, and when the second sub-board 200 is pressed against the first sub-board 100, since the second sub-board 200 is provided with a groove matching the component 300, the component The cooperation between the 300 and the second sub-board 200 is also relatively tight.
  • the circuit board made by the first sub-board 100, the component 300, and the second sub-board 200 has a tight internal structure, and there is no void, and the inside of the circuit board is not easy to retain liquid. It will not affect the operation of the board, and the reliability of the board produced is better.
  • the first sub-board 100 includes at least two prefabricated layers 110, wherein the two prefabricated layers 110 are a first circuit layer and a second circuit layer, respectively, a first circuit layer and a second circuit layer.
  • the first layer and the bottom layer of the first sub-board 100 are respectively disposed, and the pre-fabricated layer 110 is processed to form the pads 111 corresponding to the pins of the component 300, and specifically includes the following steps:
  • a conductive via is formed in the first sub-board 100 at a position corresponding to the pin of the component 300, and the first circuit layer and the second circuit layer are processed to form a pad 111 corresponding to the conductive via.
  • the first sub-board 100 further includes at least one prepreg, wherein one prepreg is disposed between the first circuit layer and the second circuit layer.
  • a conductive blind hole or a conductive buried hole or the like may be formed on the first sub-board 100, and the opening of the conductive blind hole or the conductive buried hole is disposed on the first circuit layer, and the first circuit layer is processed to form and The conductive blind hole or the conductive buried hole is matched with the pad 111.
  • the prefabricated layer 110 is a conductive layer
  • the conductive layer may be a conductive material such as copper or tin.
  • the second insulating layer 120 may be disposed on both the first circuit layer and the second circuit layer and the same process may be performed.
  • the embedded component circuit board further includes a third sub-board, the third sub-board includes a third insulating layer, and the third insulating layer is disposed at an outermost layer of the third sub-board, and the first sub-board 100 and the first The two sub-boards 200 are pressed together, and specifically include the following steps:
  • the first sub-board 100, the second sub-board 200 and the third sub-board are pressed together, wherein the first insulating layer 210 is adhered to the second insulating layer 120, and the other side of the first sub-board 100 is attached to the third insulating layer. Hehe.
  • the first insulating layer 210 is a prepreg.
  • the second insulating layer 120 is disposed on the processed pre-formed layer 110, and the first via hole 121 is opened at a position corresponding to the pad 111 on the second insulating layer 120.
  • Filling the first through hole 121 with the conductive adhesive material 130 includes the following steps:
  • the second insulating layer 120 can be prevented from being contaminated by liquid or processing waste during the operation such as opening, and the conductive adhesive can be prevented when filling the conductive adhesive material 130.
  • the material 130 contaminates the surface of the second insulating layer 120, which can improve the reliability of the fabricated circuit board, and at the same time ensure that the subsequent bonding between the first sub-board 100 and the second sub-board 200 is more tight, and further, the conductive is filled.
  • the conductive adhesive material 130 can also be prevented from entering between the second insulating layer 120 and the isolation film 140.
  • the aperture of the first through hole 121 is smaller than or equal to the aperture of the second through hole 141.
  • the conductive adhesive material 130 can be further prevented from contaminating the surface of the second insulating layer 120.
  • a hole is formed in the second insulating layer 120 and the isolation film 140 at a position corresponding to the pad 111 by laser opening. High processing accuracy and short processing time. In addition, according to the actual situation, it is also possible to open holes by means of machining.
  • the conductive adhesive material 130 is a conductive resin.
  • the conductive resin can conduct electricity while sufficiently filling the first through holes 121 to ensure that there are no bubbles or voids around the pins of the element 300.
  • the conductive resin plug hole may be used.
  • the second insulating layer 120 and the insulating film 140 are sequentially disposed on the processed pre-formed layer 110 by heating and pressurizing.
  • the second insulating layer 120 and the isolation film 140 can be attached to the first sub-board 100 by heating and pressing, and the first sub-board 100, the second insulating layer 120, and the isolation film 140 are fixed.
  • the adhesion is convenient for subsequent processing, and the position between the layers is relatively stable, which can improve the processing precision.
  • the temperature ranges from 80 ° C to 155 ° C and the pressure ranges from 15 kg/cm 2 to 23 kg/cm 2 .
  • the temperature range a certain adhesive force exists between the first sub-board 100, the second insulating layer 120, and the isolation film 140, and the adhesive force is not excessively large, so that the isolation film 140 can be removed later.
  • the temperature ranges from 100 ° C to 135 ° C, and the pressure ranges from 17 kg/cm 2 to 21 kg/cm 2 .
  • the duration of the above heating and pressurization is 2 minutes to 6 minutes. By further limiting the time of warming and pressurization, it is also ensured that adhesion is present while facilitating subsequent removal of the insulating film 140.
  • the duration of the above heating and pressurization is from 3 minutes to 5 minutes.
  • the method further includes the following steps:
  • the barrier film 140 is preheated.
  • the adhesion between the insulating film 140 and the second insulating layer 120 is increased, which may cause the insulating film 140 to be removed.
  • the second insulating layer 120 preheats the insulating film 140 to reduce the adhesion between the insulating film 140 and the second insulating layer 120, and the effect is better when the insulating film 140 is removed. Further, the insulating film 140 is provided.
  • the conductive adhesive material 130 in the first through hole 121 and the second through hole 141 may be heated at the same time to volatilize the volatile substances in the conductive adhesive material 130 to prevent the volatile substances from affecting the reliability of the circuit board. .
  • the first sub-board 100 and the second sub-board 200 are pressed together by sintering.
  • the first sub-board 100 and the second sub-board 200 can be better combined by sintering, and the conductive adhesive material 130 can be turned on better, and the performance of the fabricated circuit board can be improved.
  • the second insulating layer 120 is a prepreg, and the insulating film 140 is a PET film.
  • the second insulating layer 120 is consistent with the material of the insulating layer of the second sub-board 200, so that the bonding of the first sub-board 100 and the second sub-board 200 is facilitated, and the second insulating layer 120 of the PET film is better.
  • the protection is carried out, and the surface of the PET film is relatively smooth, which is advantageous for removing the PET film by tearing.
  • the apertures of the first through hole 121 and the second through hole 141 gradually increase in a direction away from the first sub-board 100 . At this time, it is ensured that the conductive adhesive material 130 sufficiently fills the first through hole 121 and the second through hole 141.
  • the depth of the first through hole 121 is greater than or equal to the length of the pin of the component 300. At this time, when the component 300 is mounted, since the pin of the component 300 can completely protrude into the first through hole 121, it can be ensured. The component 300 is sufficiently bonded to the second insulating layer 120.
  • the buried component circuit board is fabricated using the method of fabricating the embedded component circuit board as described above.
  • the embedded component circuit board since the component 300 is tightly integrated with the first sub-board 100 and the second sub-board 200, there is no void, and the working state of the embedded component circuit board is not affected, so that the embedded component circuit board is reliable. Good sex.

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  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
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Abstract

一种埋置元件电路板的制作方法及埋置元件电路板，埋置元件电路板的制作方法包括以下步骤：对预制层进行处理，形成与元件的引脚对应设置的焊盘；在处理后的预制层上设置第二绝缘层，在第二绝缘层上与焊盘对应的位置处开设第一通孔，在第一通孔内填充导电胶黏材料；将元件与第一子板进行贴装，元件的引脚伸入第一通孔内；在第一绝缘层上开设与元件匹配的凹槽；将第一子板与第二子板压合。

Description

埋置元件电路板的制作方法及埋置元件电路板 技术领域
本发明涉及电路板加工技术领域，特别是涉及一种埋置元件电路板的制作方法及埋置元件电路板。
背景技术
随着电子产品的小型化及多功能化，对电子元件及电路板的要求也越来越高，在电路板上安装元件已不能满足要求。
为解决上述问题，出现了将电子元件埋入电路板内部的工艺，可有效控制制成的电路板的尺寸，但传统的埋置电子元件的电路板的内部存在空洞，空洞内会残留其他物质，影响电路板工作时的可靠性。
发明内容
基于此，本发明在于克服现有技术的缺陷，提供一种可靠性较好的埋置元件电路板的制作方法及埋置元件电路板。
其技术方案如下：
一种埋置元件电路板的制作方法，所述埋置元件电路板包括第一子板与第二子板，第一子板包括预制层，所述预制层设于所述第一子板的最外层，所述第二子板包括第一绝缘层，所述第一绝缘层设于所述第二子板的最外层，包括以下步骤：
对预制层进行处理，形成与元件的引脚对应设置的焊盘；
在处理后的预制层上设置第二绝缘层，在第二绝缘层上与焊盘对应的位置处开设第一通孔，在第一通孔内填充导电胶黏材料；
将元件与第一子板进行贴装，元件的引脚伸入第一通孔内；
在第一绝缘层上开设与元件匹配的凹槽；
将第一子板与第二子板压合。
上述埋置元件电路板的制作方法，在预制层上设置第二绝缘层，开设第一 通孔并填充导电胶黏材料，将元件与第一子板贴装，使元件的引脚伸入第一通孔内，再在第一绝缘层上开设与元件匹配的凹槽，利用第一子板与第二子板压合。通过上述方法制作的电路板，元件的引脚伸入第一通孔内，则元件可与上述第二绝缘层充分贴合，引脚可通过导电胶黏材料与焊盘电性连接，元件与第一子板的配合紧密，同时第二子板与第一子板压合时，由于第二子板上设有与元件匹配的凹槽，元件与第二子板的配合也较为紧密，此时由上述第一子板、元件及第二子板制作的电路板，内部配合紧密，不存在空洞，电路板内部不易存留液体，不会对电路板的工作造成影响，使制作的电路板的可靠性较好。
进一步地，所述在处理后的预制层上设置第二绝缘层，在第二绝缘层上与焊盘对应的位置处开设第一通孔，在第一通孔内填充导电胶黏材料，具体包括以下步骤：
在处理后的预制层上依次设置第二绝缘层及一层隔绝膜；
在第二绝缘层及隔绝膜上与焊盘对应的位置处开孔，形成第二绝缘层上的所述第一通孔及隔绝膜上的第二通孔，第一通孔与第二通孔连通；
在第一通孔与第二通孔内填充导电胶黏材料；
去除隔绝膜。
进一步地，上述步骤中，通过加温加压的方式在处理后的预制层上依次设置第二绝缘层及一层隔绝膜。
进一步地，上述加温加压的方式中，其温度范围为80℃～155℃，其压力范围为15Kg/cm 2～23Kg/cm 2。
进一步地，上述加温加压的持续时间为2分钟～6分钟。
进一步地，所述去除隔绝膜之前，还包括以下步骤：
对隔绝膜进行预热。
进一步地，所述第二绝缘层为半固化片，所述隔绝膜为PET薄膜。
进一步地，所述导电胶黏材料为导电树脂。
进一步地，所述第一通孔与所述第二通孔的孔径沿远离所述第一子板的方向逐渐增大。
一种埋置元件电路板，采用如上述任一项所述的埋置元件电路板的制作方 法制作而成。
上述埋置元件电路板，由于元件与第一子板、第二子板结合紧密，不存在空洞，不会影响上述埋置元件电路板的工作状态，使埋置元件电路板的可靠性较好。
附图说明
图1为本发明实施例所述的埋置元件电路板的制作方法的流程示意图一；
图2为图1的制作步骤示意图；
图3为本发明实施例所述的埋置元件电路板的制作方法的流程示意图二；
图4为图3的制作步骤示意图。
附图标记说明：
100、第一子板，110、预制层，111、焊盘，120、第二绝缘层，121、第一通孔，130、导电胶黏材料，140、隔绝膜，141、第二通孔，200、第二子板，210、第一绝缘层，300、元件。
具体实施方式
为了便于理解本发明，下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的较佳实施方式。但是，本发明可以以许多不同的形式来实现，并不限于本文所描述的实施方式。相反地，提供这些实施方式的目的是使对本发明的公开内容理解的更加透彻全面。
需要说明的是，当元件被称为“固定于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的，并不表示是唯一的实施方式。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施方式的目的，不是旨在于限制本发明。本文所使用 的术语“和/或”包括一个或多个相关的所列项目的任意的和所有的组合。
本发明中所述“第一”、“第二”不代表具体的数量及顺序，仅仅是用于名称的区分。
一实施例中，如图1及图2所示，所述埋置元件电路板包括第一子板100与第二子板200，第一子板100包括预制层110，所述预制层110设于所述第一子板100的最外层，所述第二子板200包括第一绝缘层210，所述第一绝缘层210设于所述第二子板200的最外层，埋置元件电路板的制作方法包括以下步骤：
S10、对预制层110进行处理，形成与元件300的引脚对应设置的焊盘111；
S20、在处理后的预制层110上设置第二绝缘层120，在第二绝缘层120上与焊盘111对应的位置处开设第一通孔121，在第一通孔121内填充导电胶黏材料130；
S30、将元件300与第一子板100进行贴装，元件300的引脚伸入第一通孔121内；
S40、在第一绝缘层210上开设与元件300匹配的凹槽，将第一子板100与第二子板200压合。
上述埋置元件电路板的制作方法，在预制层110上设置第二绝缘层120，开设第一通孔121并填充导电胶黏材料130，将元件300与第一子板100贴装，使元件300的引脚伸入第一通孔121内，再在第一绝缘层210上开设与元件300匹配的凹槽，利用第一子板100与第二子板200压合。通过上述方法制作的电路板，元件300的引脚伸入第一通孔121内，则元件300可与上述第二绝缘层120充分贴合，引脚可通过导电胶黏材料130与焊盘111电性连接，元件300与第一子板100的配合紧密，同时第二子板200与第一子板100压合时，由于第二子板200上设有与元件300匹配的凹槽，元件300与第二子板200的配合也较为紧密，此时由上述第一子板100、元件300及第二子板200制作的电路板，内部配合紧密，不存在空洞，电路板内部不易存留液体，不会对电路板的工作造成影响，使制作的电路板的可靠性较好。
可选地，如图2所示，第一子板100包括至少两层预制层110，其中两个预制层110分别为第一电路层与第二电路层，第一电路层与第二电路层分别设于 第一子板100的顶层与底层，上述对预制层110进行处理，形成与元件300的引脚对应设置的焊盘111，具体包括以下步骤：
在第一子板100上与元件300的引脚对应的位置处开设导电通孔，对第一电路层、第二电路层进行处理，形成与导电通孔对应设置的焊盘111。
可选地，第一子板100还包括至少一层半固化片，其中一层半固化片设于第一电路层与第二电路层之间。
此外，也可在第一子板100上开设导电盲孔或导电埋孔等，且上述导电盲孔或导电埋孔的开口设于第一电路层上，对第一电路层进行处理，形成与上述导电盲孔或导电埋孔配合的焊盘111。
具体地，预制层110为导电层，导电层可为铜、锡等导电材料。
具体地，可在第一电路层与第二电路层上均设置第二绝缘层120并进行相同的处理。
具体地，上述埋置元件电路板还包括第三子板，第三子板包括第三绝缘层，第三绝缘层设于第三子板的最外层，上述将第一子板100与第二子板200压合，具体包括以下步骤：
将第一子板100、第二子板200及第三子板压合，其中第一绝缘层210与第二绝缘层120贴合，第一子板100的另一侧与第三绝缘层贴合。
具体地，第一绝缘层210为半固化片。
进一步地，如图3及图4所示，所述在处理后的预制层110上设置第二绝缘层120，在第二绝缘层120上与焊盘111对应的位置处开设第一通孔121，在第一通孔121内填充导电胶黏材料130，具体包括以下步骤：
S21、在处理后的预制层110上依次设置第二绝缘层120及一层隔绝膜140；
S22、在第二绝缘层120及隔绝膜140上与焊盘111对应的位置处开孔，形成第二绝缘层120上的所述第一通孔121及隔绝膜140上的第二通孔141，第一通孔121与第二通孔141连通；
S23、在第一通孔121与第二通孔141内填充导电胶黏材料130；
S24、去除隔绝膜140。
通过上述步骤，通过设置一层隔绝膜140，可在进行开孔等操作时，防止第 二绝缘层120受到液体或加工废料的污染，同时在填充导电胶黏材料130时，可防止导电胶黏材料130污染上述第二绝缘层120的表面，可提高制作出的电路板的可靠性，同时也可保证后续第一子板100与第二子板200的贴合更加紧密，此外，在填充导电胶黏材料130时，也可防止导电胶黏材料130进入第二绝缘层120与隔绝膜140之间。
可选地，在上述第二绝缘层120与隔绝膜140的接合处，第一通孔121的孔径小于或等于第二通孔141的孔径。此时可进一步防止导电胶黏材料130污染上述第二绝缘层120的表面。
可选地，通过激光开孔的方式在第二绝缘层120及隔绝膜140上与焊盘111对应的位置处开孔。加工精度高，同时加工时间短。此外，根据实际情况也可采用机械加工的方式开孔。
进一步地，所述导电胶黏材料130为导电树脂。导电树脂既可导电，同时可充分填充第一通孔121，保证元件300的引脚周围不存在气泡或空隙。
具体地，在第一通孔121与第二通孔141内填充导电树脂时，可采用导电树脂塞孔的方式进行操作。
进一步地，上述步骤中，通过加温加压的方式在处理后的预制层110上依次设置第二绝缘层120及一层隔绝膜140。通过加温加压的方式，使第二绝缘层120及隔绝膜140可贴合在第一子板100上，且使第一子板100、第二绝缘层120及隔绝膜140之间存在一定的粘接力，便于后续加工时，各层之间的位置相对稳定，可提高加工的精度。
进一步地，上述加温加压的方式中，其温度范围为80℃～155℃，其压力范围为15Kg/cm 2～23Kg/cm 2。通过限定温度范围，可保证第一子板100、第二绝缘层120及隔绝膜140之间存在一定的粘接力，同时上述粘接力不会过大，便于后续去除隔绝膜140。
具体地，上述加温加压的方式中，其温度范围为100℃～135℃，其压力范围为17Kg/cm 2～21Kg/cm 2。
进一步地，上述加温加压的持续时间为2分钟～6分钟。通过进一步限定加温加压的时间，也既保证存在粘接力，同时便于后续去除隔绝膜140。
具体地，上述加温加压的持续时间为3分钟～5分钟。
进一步地，所述去除隔绝膜140之前，还包括以下步骤：
对隔绝膜140进行预热。
由于在隔绝膜140及第二绝缘层120上开孔时，隔绝膜140冷却，造成隔绝膜140与第二绝缘层120之间的粘接力增大，会导致撕去隔绝膜140的时候带动第二绝缘层120，为此对隔绝膜140进行预热，减小隔绝膜140与第二绝缘层120之间的粘接力，在去除隔绝膜140时效果更好，此外，对隔绝膜140进行预热时，可同时对第一通孔121及第二通孔141内的导电胶黏材料130进行加热，使导电胶黏材料130内的挥发物质挥发，防止挥发物质影响电路板的可靠性。
进一步地，上述步骤中，通过烧结的方式将第一子板100与第二子板200压合。通过烧结的方式可使第一子板100与第二子板200结合的更好，同时使导电胶黏材料130导通的效果更好，可提高制作出的电路板的性能。
进一步地，所述第二绝缘层120为半固化片，所述隔绝膜140为PET薄膜。此时第二绝缘层120与第二子板200的绝缘层的材料一致，便于第一子板100与第二子板200的贴合，同时PET薄膜的可较好的对第二绝缘层120进行防护，且PET薄膜的表面较为光滑，有利于通过撕去的方式去除PET薄膜。
进一步地，如图3所示，所述第一通孔121与所述第二通孔141的孔径沿远离所述第一子板100的方向逐渐增大。此时可保证导电胶黏材料130充分填充第一通孔121及第二通孔141。
可选地，第一通孔121的深度大于或等于元件300的引脚的长度，此时在元件300贴装时，由于元件300的引脚可完全伸入第一通孔121内，可保证元件300与第二绝缘层120的充分贴合。
一实施例中，埋置元件电路板采用如上述的埋置元件电路板的制作方法制作而成。
上述埋置元件电路板，由于元件300与第一子板100、第二子板200结合紧密，不存在空洞，不会影响上述埋置元件电路板的工作状态，使埋置元件电路板的可靠性较好。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (10)

  1. 一种埋置元件电路板的制作方法，其特征在于，所述埋置元件电路板包括第一子板与第二子板，第一子板包括预制层，所述预制层设于所述第一子板的最外层，所述第二子板包括第一绝缘层，所述第一绝缘层设于所述第二子板的最外层，包括以下步骤：
    对预制层进行处理，形成与元件的引脚对应设置的焊盘；
    在处理后的预制层上设置第二绝缘层，在第二绝缘层上与焊盘对应的位置处开设第一通孔，在第一通孔内填充导电胶黏材料；
    将元件与第一子板进行贴装，元件的引脚伸入第一通孔内；
    在第一绝缘层上开设与元件匹配的凹槽，将第一子板与第二子板压合。
  2. 根据权利要求1所述的埋置元件电路板的制作方法，其特征在于，所述在处理后的预制层上设置第二绝缘层，在第二绝缘层上与焊盘对应的位置处开设第一通孔，在第一通孔内填充导电胶黏材料，具体包括以下步骤：
    在处理后的预制层上依次设置第二绝缘层及一层隔绝膜；
    在第二绝缘层及隔绝膜上与焊盘对应的位置处开孔，形成第二绝缘层上的所述第一通孔及隔绝膜上的第二通孔，第一通孔与第二通孔连通；
    在第一通孔与第二通孔内填充导电胶黏材料；
    去除隔绝膜。
  3. 根据权利要求2所述的埋置元件电路板的制作方法，其特征在于，上述步骤中，通过加温加压的方式在处理后的预制层上依次设置第二绝缘层及一层隔绝膜。
  4. 根据权利要求3所述的埋置元件电路板的制作方法，其特征在于，上述加温加压的方式中，其温度范围为80℃～155℃，其压力范围为15Kg/cm 2～23Kg/cm 2。
  5. 根据权利要求3所述的埋置元件电路板的制作方法，其特征在于，上述加温加压的持续时间为2分钟～6分钟。
  6. 根据权利要求2所述的埋置元件电路板的制作方法，其特征在于，所述去除隔绝膜之前，还包括以下步骤：
    对隔绝膜进行预热。
  7. 根据权利要求2-6任一项所述的埋置元件电路板的制作方法，其特征在于，所述第二绝缘层为半固化片，所述隔绝膜为PET薄膜。
  8. 根据权利要求1-6任一项所述的埋置元件电路板的制作方法，其特征在于，所述导电胶黏材料为导电树脂。
  9. 根据权利要求2-6任一项所述的埋置元件电路板的制作方法，其特征在于，所述第一通孔与所述第二通孔的孔径沿远离所述第一子板的方向逐渐增大。
  10. 一种埋置元件电路板，其特征在于，采用如权利要求1-9任一项所述的埋置元件电路板的制作方法制作而成。
PCT/CN2018/093632 2017-11-30 2018-06-29 埋置元件电路板的制作方法及埋置元件电路板 WO2019105033A1 (zh)

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