WO2019098195A1 - Article et son procédé de fabrication - Google Patents

Article et son procédé de fabrication Download PDF

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Publication number
WO2019098195A1
WO2019098195A1 PCT/JP2018/041999 JP2018041999W WO2019098195A1 WO 2019098195 A1 WO2019098195 A1 WO 2019098195A1 JP 2018041999 W JP2018041999 W JP 2018041999W WO 2019098195 A1 WO2019098195 A1 WO 2019098195A1
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WIPO (PCT)
Prior art keywords
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article
resin
sintered body
composition
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PCT/JP2018/041999
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English (en)
Japanese (ja)
Inventor
航介 浦島
芳則 江尻
納堂　高明
元気 米倉
龍史 明比
Original Assignee
日立化成株式会社
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Application filed by 日立化成株式会社 filed Critical 日立化成株式会社
Priority to JP2019554229A priority Critical patent/JPWO2019098195A1/ja
Publication of WO2019098195A1 publication Critical patent/WO2019098195A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Definitions

  • the present invention relates to an article and a method of manufacturing the same.
  • a step of forming a layer containing a metal on a substrate by ink jet printing, screen printing or the like with a conductive material such as ink containing metal particles or paste, heating the conductive material to burn the metal particles A so-called printed electronics method is known which includes a conductorization step of bonding and expressing conductivity (see, for example, Patent Documents 1 and 2).
  • the MID is a member in which a wiring is directly formed on a molded body (hereinafter sometimes referred to as “three-dimensional molded body”) having a three-dimensional surface such as an uneven surface or a curved surface.
  • MIDs are used in various fields, for example, by mounting electronic components using solder on wiring.
  • LDS method Laser Direct Structuring method
  • the MID wiring is required to have a sufficient thickness (for example, 1 ⁇ m or more) when a thin line (for example, a line width of 500 ⁇ m or less) is formed.
  • a sufficient thickness for example, 1 ⁇ m or more
  • a thin line for example, a line width of 500 ⁇ m or less
  • the LDS method it is usual to secure the thickness of the wiring by plating, but the plating has a problem that the load on the environment is large as the number of manufacturing processes is increased. Therefore, it is desirable to be able to form a wire of sufficient thickness directly on the molded body without using plating.
  • the main object of the present invention is to provide a method capable of forming a wiring which can be mounted by solder with a sufficient thickness even on a three-dimensional molded body without using plating.
  • printing a composition containing copper particles on a substrate by a noncontact printing method and sintering the printed composition to a thickness of 1.0 ⁇ m or more And B. forming a sintered body layer of copper.
  • Another aspect of the present invention is an article comprising a substrate, and a sintered copper layer provided on the substrate and having a thickness of 1.0 ⁇ m or more.
  • the substrate may be formed of a resin.
  • the glass transition temperature of the resin may be 150 ° C. or less.
  • the 5% thermal weight loss temperature of the resin may be 600 ° C. or less.
  • the resin may be at least one selected from the group consisting of polycarbonate, polyethylene terephthalate and liquid crystal polymer.
  • the printing surface of the substrate on which the composition is printed may have a three-dimensional shape, and the sintered body layer is linear with a line width of 1 mm or less,
  • the composition may be printed on a printing surface having the three-dimensional shape.
  • the sintered body layer may be provided on the surface of the base having a three-dimensional shape, and the sintered body layer may be linear having a line width of 1 mm or less.
  • process includes, in addition to a process independent of other processes, the process of the process if the purpose of the process is achieved even if it can not be clearly distinguished from the other processes. included.
  • the upper limit or the lower limit described in one numerical range may be replaced with the upper limit or the lower limit of the numerical range described in the other stepwise Good.
  • the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the example.
  • each component in the composition is, unless a plurality of substances corresponding to each component are present in the composition, the plurality of types present in the composition unless otherwise specified.
  • FIG. 1 is a perspective view showing an article according to an embodiment. As shown in FIG. 1, the article 1 includes a base 2 and a sintered body layer 3 provided on the base 2.
  • the shape of the substrate 2 is appropriately selected according to the application and the like.
  • the base material 2 may be, for example, a three-dimensional object having a three-dimensional shape such as a concavo-convex shape.
  • the base material 2 is, for example, a metal such as Cu, Au, Pt, Pd, Ag, Zn, Ni, Co, Fe, Al, Sn, an alloy of these metals, a semiconductor such as ITO, ZnO, SnO, Si, graphite, It may be formed of a carbon material such as graphite, glass, resin, paper, a combination thereof, or the like.
  • the sintered body layer 3 can be suitably formed even on the base material 2 having low heat resistance, so the article 1 may be formed of resin.
  • the resin may be a resin having low heat resistance (for example, a resin having a glass transition temperature and / or a 5% thermal weight reduction temperature described later), and may be, for example, a thermoplastic resin.
  • the thermoplastic resin may be polyolefin such as polyethylene, polypropylene, polymethylpentene, polycarbonate, polyethylene terephthalate, liquid crystal polymer, etc., preferably at least one selected from the group consisting of polycarbonate, polyethylene terephthalate and liquid crystal polymer .
  • the glass transition temperature of the resin may be 150 ° C. or less, 120 ° C. or less, or 80 ° C. or less, and may be 30 ° C. or more.
  • the glass transition temperature of the resin is measured by dynamic viscoelasticity measurement. Specifically, using a dynamic viscoelasticity measuring apparatus, under the conditions of a frequency of 10 Hz, a heating rate of 5 ° C./min, and a temperature range of 20 to 260 ° C. , Is measured as the temperature at which tan ⁇ exhibits a maximum value.
  • the 5% thermal weight loss temperature of the resin may be 600 ° C. or less, 550 ° C. or less, 500 ° C. or less, 450 ° C. or less, 400 ° C. or less, 300 ° C. or less, 250 ° C. or less, or 200 ° C. or less.
  • the 5% thermal weight loss temperature of the resin is determined by raising the weight of the resin from 25 ° C. at a heating rate of 5 ° C./min under a nitrogen atmosphere using a thermogravimetric analyzer (TGA). It is defined as the temperature at which a 5 wt% decrease with respect to the weight of resin (before temperature increase) at 25 ° C.
  • TGA thermogravimetric analyzer
  • the sintered body layer 3 is provided, for example, on the surface on one surface 2 a side (upper surface side in FIG. 1) of the base material 2.
  • One surface 2a of the base material 2 may be a surface having a three-dimensional shape such as an uneven surface or a curved surface.
  • the sintered body layer 3 is a layer having conductivity, and may be, for example, a wiring forming an electric circuit (may be linear when viewed from the top).
  • the sintered body layer 3 is a layer containing a sintered body of copper.
  • the sintered body layer 3 is obtained by sintering a composition containing copper particles (details will be described later).
  • the sintered body layer 3 may be, for example, a porous layer.
  • the porosity of the sintered body layer 3 may be 10% or more, 13% or more, or 15% or more, and may be 70% or less, 55% or less, or 40% or less.
  • the porosity of the sintered body layer 3 can be obtained by analyzing the cross-sectional image of the sintered body layer 3 observed by a scanning electron microscope, scanning ion microscope or the like using image analysis software. It means the ratio of the area of the nonconductive portion where the sintered body does not exist to the total area of the three cross sections.
  • the sintered body layer 3 can be a thin wire-like wiring having a sufficient thickness.
  • the thickness of the sintered body layer 3 is 1.0 ⁇ m or more, and is 2.0 ⁇ m or more, 3.0 ⁇ m or more, 4.0 ⁇ m or more, 5.0 ⁇ m or more, 7.0 ⁇ m or more, or 10.0 ⁇ m or more. It is also good.
  • the line width of the sintered body layer 3 (the length of the short side direction of the sintered body layer (wiring) 3 when viewed from the top (direction perpendicular to the direction in which the wiring extends) is 1 mm or less, 0.7 mm or less, It may be 0.5 mm or less, 0.4 mm or less, 0.3 mm or less, or 0.2 mm or less.
  • the volume resistivity of the sintered body layer 3 may be 75 ⁇ ⁇ cm or less, 50 ⁇ ⁇ cm or less, 30 ⁇ ⁇ cm or less, or 20 ⁇ ⁇ cm or less.
  • the above-described base material 2 is prepared (preparation step).
  • a resin molding can be obtained by shape
  • a composition containing copper particles is printed by a non-contact printing method on the surface on the one surface 2 a side of the substrate 2 so as to have a pattern corresponding to the pattern of the sintered body layer 3. Yes (printing process).
  • the non-contact type printing method may be a method of printing in a state where the discharge part which discharges the composition is separated from the base material 2 (not in contact with the base material 2).
  • the non-contact type printing method may be, for example, a method using a jet dispenser, a method using an aerosol jet, a method using a piezo jet dispenser, or the like, with respect to the surface of the substrate 2 having a three-dimensional shape. It is preferably a method using an aerosol jet from the viewpoint of being able to print suitably.
  • the printing step can be performed using, for example, a spraying device provided with an atomizer and a discharge nozzle connected to the atomizer.
  • a spray apparatus can use the apparatus to which a well-known injection method is applied as it is. Examples of known injection methods include an aerosol deposition method, a cold spray method, a thermal spray method and the like.
  • the printing step may include a step of atomizing the composition (atomizing step) and a step of discharging the atomized composition (discharging step).
  • the conditions of the atomization step and the discharge step can be appropriately set in consideration of the type and content of copper particles, the type and content of the organic solvent described later, and the like.
  • the composition used in the printing step contains at least copper particles, and further contains, for example, a dispersion medium in which the copper particles are dispersed.
  • the copper particles contain copper as a main component from the viewpoint of thermal conductivity and sinterability.
  • the proportion of the copper element in the copper particles may be 80 atomic% or more, 90 atomic% or more, or 95 atomic% or more based on all elements except hydrogen, carbon and oxygen. When the element ratio is 80 atomic% or more, the thermal conductivity and the sinterability derived from copper tend to be easily expressed.
  • the shape of the copper particles is not particularly limited, and examples thereof include spheres, substantially spheres, polyhedrons, needles, flakes, rods and the like.
  • the copper particles may contain two or more types of copper particles having different shapes.
  • the reason for this is not necessarily clear, but is considered to be because two or more different types of copper particles complement each other's gaps, and omnidirectional generation of volume reduction due to fusion between copper particles and the like is suppressed. It is inferred that cracking is thereby suppressed even in a wire having a sufficient thickness.
  • the combination of those having different shapes is not particularly limited, but, for example, a combination of spherical copper particles (A1) and flaky copper particles (A2) is preferable.
  • the median diameter of the spherical copper particles (A1) may be 0.1 ⁇ m or more, and may be 2.0 ⁇ m or less, 1.2 ⁇ m or less, 0.9 ⁇ m or less, or 0.6 ⁇ m or less, 0.1 to 2 0.1 ⁇ m, 0.1 to 1.2 ⁇ m, 0.1 to 0.9 ⁇ m, or 0.1 to 0.6 ⁇ m.
  • the median diameter of the flake-like copper particles (A2) may be 0.03 ⁇ m or more and may be 9.0 ⁇ m or less, 7.0 ⁇ m or less, 4.0 ⁇ m or less, or 2.5 ⁇ m or less, 0.03 to It may be 9.0 ⁇ m, 0.03 to 7.0 ⁇ m, 0.03 to 4.0 ⁇ m, or 0.03 to 2.5 ⁇ m.
  • the combination of the spherical copper particles (A1) and the flake-like copper particles (A2) having such a median diameter tends to be more excellent in fusion property at a low temperature.
  • the median diameter of copper particles is the value of D50 (cumulative median value of volume distribution) measured by a laser diffraction particle size distribution analyzer (for example, submicron particle analyzer N5 PLUS (Beckman Coulter Co.) etc.) means.
  • D50 cumulative median value of volume distribution
  • a laser diffraction particle size distribution analyzer for example, submicron particle analyzer N5 PLUS (Beckman Coulter Co.) etc.
  • Ratio of content of spherical copper particles (A1) to content of flaky copper particles (A2) in composition (content of spherical copper particles (A1) (mass) / content of flaky copper particles (A2)
  • the amount (mass) may be 0.25 or more, 0.3 or more, or 0.4 or more, and may be 4.0 or less, 3.0 or less, or 2.5 or less, 0.25 It may be up to 4.0, 0.3 to 3.0, or 0.4 to 2.5.
  • the content of the copper particles may be 20 parts by mass or more, 30 parts by mass or more, 40 parts by mass or more, or 50 parts by mass or more with respect to 100 parts by mass of the total mass of the composition. If the content of the copper particles is 20 parts by mass or more based on 100 parts by mass of the total mass of the composition, it tends to be possible to form a wiring having a more sufficient thickness.
  • the content of the copper particles may be 80 parts by mass, 75 parts by mass, 70 parts by mass, or 65 parts by mass or less with respect to 100 parts by mass of the total mass of the composition. If the content of the copper particles is 80 parts by mass or less based on 100 parts by mass of the total mass of the composition, the dischargeability from the printing machine tends to be excellent.
  • the copper particles may be copper-containing particles having a core particle containing copper and an organic substance covering at least a part of the surface of the core particle.
  • the copper-containing particles may have, for example, a core particle containing copper and an organic substance containing a substance derived from an alkylamine present on at least a part of the surface of the core particle.
  • the alkylamine may be an alkylamine having a hydrocarbon group having 7 or less carbon atoms.
  • the copper-containing particles are thermally decomposed even at relatively low temperatures (eg, 150 ° C. or less) because the chain length of the hydrocarbon group of the alkylamine constituting the organic substance is relatively short, and the core particles are easily fused.
  • copper-containing particles for example, copper-containing particles described in JP-A-2016-037627 can be suitably used.
  • the organic matter may contain an alkylamine in which the carbon number of the hydrocarbon group is 7 or less.
  • the alkylamine having 7 or less carbon atoms in the hydrocarbon group may be, for example, a primary amine, a secondary amine, an alkylene diamine or the like.
  • primary amines include ethylamine, 2-ethoxyethylamine, propylamine, 3-ethoxypropylamine, butylamine, 4-methoxybutylamine, isobutylamine, pentylamine, isopentylamine, hexylamine, cyclohexylamine, heptylamine and the like. be able to.
  • Examples of secondary amines include diethylamine, dipropylamine, dibutylamine, ethylpropylamine and ethylpentylamine.
  • Examples of the alkylenediamine include ethylenediamine, N, N-dimethylethylenediamine, N, N'-dimethylethylenediamine, N, N-diethylethylenediamine, N, N'-diethylethylenediamine, 1,3-propanediamine, 2,2-dimethyl- 1,3-propanediamine, N, N-dimethyl-1,3-diaminopropane, N, N'-dimethyl-1,3-diaminopropane, N, N-diethyl-1,3-diaminopropane, 1,4 -Diaminobutane, 1,5-diamino-2-methylpentane, 1,6-diaminohexane, N, N'-dimethyl-1,6-dia
  • covers at least one part of the surface of core particle may contain organic substance other than the alkylamine whose carbon number of a hydrocarbon group is seven or less.
  • the ratio of the alkylamine having a carbon number of hydrocarbon group of 7 or less to the whole organic substance is preferably 50% by mass or more, more preferably 60% by mass or more, and further preferably 70% by mass or more preferable.
  • the proportion of the organic substance coating at least a part of the surface of the core particle may be preferably 0.1% by mass or more and 20% by mass or less based on the total of the core particle and the organic substance. It may be 1 to 20% by mass. When the proportion of the organic substance is 0.1% by mass or more, sufficient oxidation resistance tends to be obtained. If the proportion of the organic matter is 20% by mass or less, conductorization at a low temperature tends to be easily achieved. More preferably, the ratio of the organic substance to the total of the core particle and the organic substance may be 0.3% by mass or more, 10% by mass or less, 0.3 to 10% by mass, and more preferably May be 0.5% by mass or more, may be 5% by mass or less, and may be 0.5 to 5% by mass.
  • the copper-containing particles contain at least copper, and may contain other substances as needed.
  • other substances include metals such as gold, silver, platinum, tin and nickel or compounds containing these metal elements, reducing compounds or organic substances, oxides, and chlorides.
  • the content of copper in the copper-containing particles is preferably 50% by mass or more, more preferably 60% by mass or more, and 70% by mass or more. Is more preferred.
  • the method for producing the copper-containing particles is not particularly limited.
  • grains disclosed by Unexamined-Japanese-Patent No. 2016-037626 is mentioned, for example.
  • the dispersion medium is not particularly limited, and can be appropriately selected from organic solvents generally used for producing a conductive ink, a conductive paste and the like according to the application.
  • the dispersion medium may be used alone or in combination of two or more.
  • the dispersion medium may be terpineol, isobornyl cyclohexanol, dihydroterpineol, dihydroterpineol acetate or the like.
  • the content of the dispersion medium may be 1 part by mass or more, 3 parts by mass or more, or 5 parts by mass or more, and 300 parts by mass or less, 200 parts by mass or less, or 150 parts by mass with respect to 100 parts by mass of copper particles. It may be the following.
  • the composition may further contain other components other than the copper particles and the dispersion medium, as needed.
  • a silane coupling agent a high molecular compound (resin), a radical initiator, a reducing agent etc. are mentioned, for example.
  • the viscosity at 25 ° C. of the composition can be appropriately set according to the method of use of the composition, and may be, for example, 50 mPa ⁇ s or more, 100 mPa ⁇ s or more, or 200 mPa ⁇ s or more, and 3000 mPa ⁇ s or less
  • the viscosity may be 1500 mPa ⁇ s or less, or 1000 mPa ⁇ s or less, and may be 50 to 3000 mPa ⁇ s, 100 to 1500 mPa ⁇ s, or 200 to 1000 mPa ⁇ s.
  • composition is measured at 25 ° C., which is measured using an E-type viscometer (manufactured by Toki Sangyo Co., Ltd., product name: VISCOMETER-TV 22, applicable cone-plate type rotor: 3 ° ⁇ R17.65). It means viscosity.
  • the method for producing the composition is not particularly limited, and any method commonly used in the art can be used.
  • it can be prepared by dispersing copper particles and a dispersion medium, and, if necessary, other components.
  • Dispersion treatment includes Ishikawa-type agitators, rotation-revolution-type agitators, ultra-thin-film high-speed rotary dispersers, roll mills, ultrasonic dispersers, media dispersers such as beads mills, cavitation stirrers such as homomixers, Silverson agitators, An opposing collision method such as an artemizer can be used. Moreover, you may use combining these methods suitably.
  • the printed composition is sintered to form a sintered body layer 3 (sintering step).
  • the copper particles contained in the composition may have a structure in which the copper particles are fused to each other after the sintering step.
  • the composition may be sintered, for example, by heating.
  • the heating temperature in this case may be 300 ° C. or less, 250 ° C. or less, or 230 ° C. or less.
  • the heating method is not particularly limited, but may be heating with a hot plate, heating with an infrared heater, or the like. Heating may be performed at a constant temperature or may be performed irregularly.
  • the composition in the sintering step, may be sintered by irradiation with a laser such as a pulse laser.
  • the atmosphere in which the sintering step is carried out is not particularly limited, but may be an inert gas atmosphere such as nitrogen, argon or the like used in a general conductor production step, and the reduction of hydrogen, formic acid, etc. to the inert gas atmosphere. It may be a reducing gas atmosphere to which a sexing substance is added.
  • the pressure in the sintering step is not particularly limited, but may be atmospheric pressure or reduced pressure.
  • the sintering time (heating time or laser irradiation time) in the sintering step is not particularly limited, but may be appropriately set in consideration of heating temperature or laser energy, atmosphere, content of copper particles, etc. it can.
  • the non-contact printing method since the non-contact printing method is used in the printing step, one surface (printing surface) 2 a of the substrate 2 on which the composition is printed has a three-dimensional shape In any case, the composition can be printed in a predetermined pattern and having a sufficient thickness. Therefore, according to this manufacturing method, a sintered body layer (wiring) 3 having a predetermined pattern (in particular, with a narrow line width) and a sufficient thickness without using plating can be obtained. That is, the method of manufacturing the article 1 may not include the step of forming the conductive layer (wiring) on the base 2 by plating.
  • FIG. 2 is a perspective view showing an article according to another embodiment.
  • the article 11 includes a base 2, a sintered body layer 3 provided on the base 2, and an electronic component 4 provided on the sintered body 3.
  • the substrate 2 and the sintered body layer 3 may be the same as the substrate 2 and the sintered body layer 3 in the article 1 shown in FIG.
  • the electronic component 4 is mounted, for example, via a solder (not shown) so as to be electrically connected to the sintered body layer 3.
  • the electronic component 4 may be, for example, an LED chip, an IC chip or the like.
  • the article 11 provided with the electronic component 4 is obtained, for example, by mounting it on a predetermined portion of the sintered body layer 3 using a solder (mounting process) following the sintering process in the method of manufacturing the article 1 described above.
  • the mounting method using the solder may be a known method.
  • the sintered body layer 3 is a layer containing copper, mounting by solder becomes possible.
  • the articles 1 and 11 described above can be suitably used as MID (also referred to as molded circuit parts, three-dimensional molded circuit parts, three-dimensional molded circuit parts, etc.).
  • the articles 1 and 11 are suitably used as a smartphone antenna, a laminate, a solar cell panel, a display, a transistor, a semiconductor package, a laminated ceramic capacitor, and the like.
  • the sintered body layer 3 in the articles 1 and 11 can also be used as a vehicle wiring, an electrical wiring, a heat dissipation film, a surface coating film, or the like.
  • Example 1 Copper particles (Mitsui Metal Mining Co., Ltd., product name: CH0200) and terpineol are mixed, and the viscosity of the composition at 25 ° C .: 1000 mPa ⁇ s, the content of copper particles: 70 mass%, copper particles
  • the composition containing was prepared. Next, using a jet dispenser (SUPER JET 350PC, manufactured by Musashi Engineering Co., Ltd.), the composition is discharged under the conditions of a liquid transfer pressure of 50 kPa and a stroke condition of 30%, and a liquid crystal polymer (LCP) substrate having a height of 5 mm.
  • the composition was printed (glass transition temperature:-, 5% thermal weight loss temperature: 540 ° C).
  • the composition was sintered under conditions of 225 ° C. for 60 minutes in a reducing atmosphere to obtain an article provided with a substrate and a sintered body layer having a thickness shown in Table 1.
  • the thickness of the sintered compact layer was measured by non-contact surface and layer cross-sectional shape measurement system (VertScan, Ryoka system Inc.).
  • Example 2 A composition containing copper particles is prepared so that the viscosity of the composition at 25 ° C. is 200 mPa ⁇ s and the content of copper particles is 65% by mass, and the composition is used as an aerosol jet system (manufactured by OPTOMEC, Aerosol) An article was obtained in the same manner as in Example 1 except that printing was performed using Jet 5x System), to obtain an article provided with a substrate and a sintered body layer having a thickness shown in Table 1.
  • Examples 3 and 4 A substrate and a table were prepared in the same manner as in Examples 1 and 2 except that the substrate was changed to a polyethylene terephthalate (PET) substrate (glass transition temperature: 70 ° C., 5% thermal weight loss temperature: 420 ° C.). An article was obtained comprising a sintered body layer having a thickness shown in 1.
  • PET polyethylene terephthalate
  • PC polycarbonate
  • Comparative Example 1 An article was obtained in the same manner as in Example 1 except that the printing method was changed to screen printing (contact printing method).
  • Comparative Examples 2 to 4 An article was obtained in the same manner as in Examples 1 and 2 and Comparative Example 1 except that the copper particles were changed to silver particles produced in the following procedure.
  • Comparative Examples 5 to 8 An article was obtained in the same manner as in Comparative Examples 1 to 4 except that the substrate was changed to a polyethylene terephthalate (PET) substrate (glass transition temperature: 70 ° C., 5% thermal weight loss temperature: 420 ° C.).
  • PET polyethylene terephthalate
  • Comparative Examples 9 to 12 An article was obtained in the same manner as in Comparative Examples 1 to 4, respectively, except that a polycarbonate (PC) substrate (glass transition temperature: 150 ° C., 5% thermal weight loss temperature: 550 ° C.) was used as the substrate.
  • PC polycarbonate
  • the wiring formability in each Example and Comparative Example is a digital multimeter resistance meter for the wiring obtained by forming a wiring having a line width of 500 ⁇ m on the liquid crystal polymer substrate having the above-mentioned unevenness of 5 mm in height.
  • the resistance value between two points 3 cm apart was measured using (CD800a manufactured by Sanwa Electric Instrument Co., Ltd.), the case where the resistance value was 100 ⁇ or less was evaluated as A, and the case where it was larger than 100 ⁇ was evaluated as B.
  • Table 1 The results are shown in Table 1.
  • solder mountability is confirmed by SEM observation of the cross section of the formed sintered body layer (wiring) subjected to electroless Ni plating treatment by SEM, and the Ni film is formed on the sintered body layer without peeling or swelling from the wiring.
  • A the case where there was peeling or swelling of the Ni film from the wiring or the case where the Ni film was not formed was evaluated as B.
  • the results are shown in Table 1.

Abstract

La présente invention concerne un procédé de production d'un article, comprenant : une étape dans laquelle une composition contenant des particules de cuivre est imprimée sur un matériau de base au moyen d'un procédé d'impression sans contact ; et une étape dans laquelle la composition imprimée est frittée et une couche de corps fritté en cuivre ayant une épaisseur d'au moins 1,0 µm est formée.
PCT/JP2018/041999 2017-11-14 2018-11-13 Article et son procédé de fabrication WO2019098195A1 (fr)

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JP2020198394A (ja) * 2019-06-04 2020-12-10 昭和電工マテリアルズ株式会社 電子部品の製造方法及び電子部品
JP2021015907A (ja) * 2019-07-12 2021-02-12 昭和電工マテリアルズ株式会社 導体層を有する物品の製造方法

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JP2004349366A (ja) * 2003-05-21 2004-12-09 Mitsubishi Plastics Ind Ltd 多層配線基板及びその製造方法
JP2009051978A (ja) * 2007-08-28 2009-03-12 Panasonic Electric Works Co Ltd プリント配線板用エポキシ樹脂組成物、プリプレグ、金属箔張積層板、多層プリント配線板
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JP2004349366A (ja) * 2003-05-21 2004-12-09 Mitsubishi Plastics Ind Ltd 多層配線基板及びその製造方法
JP2009051978A (ja) * 2007-08-28 2009-03-12 Panasonic Electric Works Co Ltd プリント配線板用エポキシ樹脂組成物、プリプレグ、金属箔張積層板、多層プリント配線板
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JP2020198394A (ja) * 2019-06-04 2020-12-10 昭和電工マテリアルズ株式会社 電子部品の製造方法及び電子部品
JP7419676B2 (ja) 2019-06-04 2024-01-23 株式会社レゾナック 電子部品の製造方法及び電子部品
JP2021015907A (ja) * 2019-07-12 2021-02-12 昭和電工マテリアルズ株式会社 導体層を有する物品の製造方法

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