WO2019091561A1

WO2019091561A1 - Method and apparatus for contactless alignment

Info

Publication number: WO2019091561A1
Application number: PCT/EP2017/078789
Authority: WO
Inventors: Timo ADLER; Christian Wolfgang Ehmann
Original assignee: Applied Materials, Inc.
Priority date: 2017-11-09
Filing date: 2017-11-09
Publication date: 2019-05-16
Also published as: KR20190054033A; KR102253563B1; CN110023528A; JP2020504229A; CN110023528B

Abstract

A method includes contactlessly levitating a substrate arrangement (210). The substrate arrangement (210) includes a substrate (10). The method includes contactlessly levitating a mask arrangement (220). The mask arrangement (220) includes a masking device (20) for masking the substrate (10). The method includes contactlessly aligning the substrate arrangement (210) and the mask arrangement (220) relative to each other.

Description

METHOD AND APPARATUS FOR CONTACTLESS ALIGNMENT

FIELD

[0001] Embodiments of the present disclosure relate to apparatuses and methods for alignment of arrangements including substrates and masks, more specifically large area substrates. More specifically, embodiments described herein relate to the alignment of vertically oriented large area substrates and masking devices for masking thereof.

BACKGROUND

[0002] Several methods are known for depositing a material on a substrate. For example, substrates may be coated by using an evaporation process, a physical vapor deposition (PVD) process, such as a sputtering process, a spraying process, etc., or a chemical vapor deposition (CVD) process. The process can be performed in a processing chamber of a deposition apparatus in which the substrate to be coated is located. A deposition material is provided in the processing chamber. A plurality of materials, such as small molecules, metals, oxides, nitrides, and carbides may be used for deposition on a substrate. Further, other processes like etching, structuring, annealing, or the like can be conducted in processing chambers.

[0003] For example, coating processes may be considered for large area substrates, e.g. in display manufacturing technology. Coated substrates can be used in several applications and in several technical fields. For instance, an application can be organic light emitting diode (OLED) panels. Further applications include insulating panels, microelectronics, such as semiconductor devices, substrates with thin film transistors (TFTs), color filters or the like. OLEDs are solid-state devices composed of thin films of (organic) molecules that create light with the application of electricity. As an example, OLED displays can provide bright displays on electronic devices and use reduced power compared to, for example, liquid crystal displays (LCDs). In the processing chamber, the organic molecules are generated (e.g., evaporated, sputtered, or sprayed etc.) and deposited as a layer on the substrates. The particles can for example pass through a mask having a boundary or a specific pattern to deposit material at target positions on the substrate, e.g. to form an OLED pattern on the substrate.

[0004] An alignment of the substrate with respect to the mask and a quality of the processed substrate, in particular of the deposited layer, can be provided. For example, the alignment should be accurate and steady in order to achieve good process results. Systems used for alignment of substrates and masks can be susceptible to external interferences, such as vibrations. Further, systems for alignment may increase the cost of ownership.

[0005] In view of the above, there is a need for apparatuses and methods that can provide for an improved alignment of substrates or masks during the layer deposition process.

SUMMARY

[0006] According to an embodiment, a method is provided. The method includes contactlessly levitating a substrate arrangement. The substrate arrangement includes a substrate. The method includes contactlessly levitating a mask arrangement. The mask arrangement includes a masking device for masking the substrate. The method includes contactlessly aligning the substrate arrangement and the mask arrangement relative to each other.

[0007] According to another embodiment, a method is provided. The method includes contactlessly levitating a first arrangement. The first arrangement is one of a substrate arrangement including a substrate and a mask arrangement including a masking device. The method includes contactlessly aligning the first arrangement with an alignment precision of 500 μιη or below.

[0008] According to another embodiment, an apparatus is provided. The apparatus includes comprising a magnetic levitation system including a plurality of magnetic units. The plurality of magnetic units are configured for contactlessly levitating a substrate arrangement including a substrate and a mask arrangement including a masking device. The apparatus is configured for contactlessly aligning the substrate arrangement and the mask arrangement relative to each other. [0009] According to another embodiment, an apparatus is provided. The apparatus includes a magnetic levitation system including a plurality of magnetic units configured for contactlessly levitating at least one of a substrate arrangement including a substrate and a mask arrangement including a masking device. The apparatus includes a first position sensor connected to a first magnetic unit of the plurality of magnetic units. The first position sensor is configured for measuring a position with a precision of 1 μιη or below.

[0010] According to another embodiment, an apparatus is provided. The apparatus includes a plurality of magnetic units including at least a first magnetic unit and a second magnetic unit. The plurality of magnetic units are configured for contactlessly levitating at least one of a substrate arrangement including a substrate and a mask arrangement including a masking device. The apparatus includes a first position sensor connected to the first magnetic unit. The first position sensor is configured for measuring a position with a first precision. The apparatus includes a second position sensor connected to the second magnetic unit, the second position sensor being configured for measuring a position with a second precision. The second precision is different from the first precision.

BRIEF DESCRIPTION OF THE DRAWINGS

[0011] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described in the following:

FIG. 1 illustrates a deposition process for manufacturing OLEDs on a substrate;

FIG. 2 illustrates a deposition process in which a substrate is masked by a masking device;

FIG. 3 shows an example of a mask arrangement, as described herein, in a side view;

FIG. 4 shows an example of a substrate arrangement, as described herein, in a side view; FIG. 5 shows an example of a mask arrangement, as described herein, in a front view;

FIG. 6 shows an example of a substrate arrangement, as described herein, in a front view;

FIGS. 7a-7b illustate a method according to embodiments described herein;

FIG. 8 shows a substrate arrangement and a mask arrangement which are connected to each other;

FIG. 9 shows an example of a plurality of magnetic units as described herein;

FIGS. lOa-b illustrate a contactless vertical alignment of an arrangement as described herein;

FIGS, l la-b illustrate a contactless angular alignment of an arrangement as described herein;

FIGS. 12a-b illustrate a contactless horizontal alignment of an arrangement as described herein;

FIGS. 13a-c illustate a method according to embodiments described herein involving a support structure;

FIG. 14 shows an example of a control unit as described herein;

FIG. 15 shows an apparatus including a first position sensor according to embodiments described herein;

FIGS. 16a-b show an apparatus including a first position sensor and a second position sensor according to embodiments described herein; and

FIGS. 17a-b show an apparatus according to embodiments described herein. DETAILED DESCRIPTION OF EMBODIMENTS

[0012] Reference will now be made in detail to the various embodiments of the disclosure, one or more examples of which are illustrated in the figures. Within the following description of the drawings, the same reference numbers refer to same components. Only the differences with respect to individual embodiments are described. Each example is provided by way of explanation of the disclosure and is not meant as a limitation of the disclosure. Further, features illustrated or described as part of one embodiment can be used on, or in conjunction with, other embodiments to yield yet a further embodiment. It is intended that the description includes such modifications and variations.

[0001] In the present disclosure, the terminology of substantially parallel directions may include directions which form a small angle of up to 10 degrees with each other, or even up to 15 degrees. The terminology of substantially perpendicular directions may include directions which form an angle of less than 90 degrees with each other, e.g. at least 80 degrees or at least 75 degrees. Similar considerations apply to the notions of substantially parallel or perpendicular axes, planes, areas, orientations or the like.

[0002] Some embodiments described herein involve the notion of a substantially vertical direction, plane, orientation and the like. A substantially vertical direction is considered a direction substantially parallel to the direction along which the force of gravity extends. A substantially vertical direction may deviate from exact verticality (the latter being defined by the gravitational force) by an angle of, e.g., up to 15 degrees. For example, the y- direction described herein (indicated with "Y" in the figures) is a substantially vertical direction.

[0013] Embodiments described herein may further involve the notion of a substantially horizontal direction, plane, orientation, and the like. A substantially horizontal direction is to be understood to distinguish over a substantially vertical direction. A substantially horizontal direction may be substantially perpendicular to the exact vertical direction defined by gravity. For example, the x-direction and the z-direction described herein (indicated with "X" and "Z" in the figures) are substantially horizontal directions. [0014] Embodiments described herein relate to contactless levitation, transportation and/or alignment of an arrangement, such as a substrate arrangement and/or mask arrangement. The term "contactless" as used throughout the present disclosure can be understood in the sense that a weight of the arrangement is not held by a mechanical contact or mechanical forces, but is held by a magnetic force. Specifically, the arrangement is held in a levitating or floating state using magnetic forces instead of mechanical forces. For example, the apparatus described herein may have no mechanical means, such as a mechanical rail, supporting the weight of the arrangement. In some implementations, there may be no mechanical contact between the arrangement and the rest of the apparatus at all during levitation, and for example movement, of the arrangement in the system.

[0015] The contactless levitation, transportation and/or alignment according to embodiments described herein is beneficial in that no particles are generated due to a mechanical contact between the arrangement, e.g. substrate arrangement or mask arrangement, and sections of the apparatus, such as mechanical rails, during the transport or alignment of the arrangement. Accordingly, embodiments described herein provide for an improved purity and uniformity of the layers deposited on the substrate, in particular since particle generation is minimized when using the contactless levitation, transportation and/or alignment.

[0016] A further advantage, as compared to mechanical means for guiding an arrangement such as e.g. a substrate arrangement or mask arrangement, is that embodiments described herein do not suffer from friction affecting the linearity and/or precision of the movement of the arrangement. The contactless levitation, transportation and alignment of a substrate arrangement and a mask arrangement according to embodiments described herein allows for a frictionless movement, wherein an alignment of a substrate relative to a mask can be controlled and maintained with high precision. Yet further, the levitation allows for fast acceleration or deceleration of the arrangement's speed and/or fine adjustment of the speed of the arrangement.

[0017] Further, the material of mechanical rails typically suffers from deformations, which may be caused by the evacuation of a chamber, by temperature, usage, wear, or the like. Such deformations affect the position of the carrier assembly, and hence affect the quality of the deposited layers. In contrast, embodiments described herein allow for a compensation of potential deformations present in e.g. the guiding structure described herein. In view of the contactless manner in which the arrangements are levitated and transported, embodiments described herein allow for a contactless alignment. Accordingly, an improved and/or more efficient alignment of the substrate relative to the mask can be provided.

[0018] According to embodiments, which can be combined with other embodiments described herein, an apparatus as described herein is configured for a contactless translation of a substrate arrangement and/or a mask arrangement along a substantially vertical direction, e.g. the y-direction, and/or along one or more substantially horizontal directions, e.g. the x-direction.

[0019] The embodiments described herein can be utilized for processing, e.g. coating, large area substrates, e.g., for display manufacturing. The substrates or substrate receiving areas for which the apparatuses and methods described herein are provided can be large area substrates. For example, a large area substrate or carrier can be GEN 4.5, which corresponds to about 0.67 m² substrates (0.73x0.92m), GEN 5, which corresponds to about 1.4 m² substrates (1.1 m x 1.3 m), GEN 7.5, which corresponds to about 4.29 m² substrates (1.95 m x 2.2 m), GEN 8.5, which corresponds to about 5.7m² substrates (2.2 m x 2.5 m), or even GEN 10, which corresponds to about 8.7 m² substrates (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can similarly be implemented.

[0020] A substrate 10 as described herein may be a large area substrate. A masking device 20 as described herein may be configured for masking a large area substrate.

[0021] The term "substrate" as used herein may particularly embrace substantially inflexible substrates, e.g., a wafer, slices of transparent crystal such as sapphire or the like, or a glass plate. However, the present disclosure is not limited thereto and the term "substrate" may embrace flexible substrates such as a web or a foil. The term "substantially inflexible" is understood as distinguishing over "flexible". Specifically, a substantially inflexible substrate can have a certain degree of flexibility, e.g. a glass plate having a thickness of 0.5 mm or below, wherein the flexibility of the substantially inflexible substrate is small in comparison to the flexible substrates. [0022] A substrate may be made of any material suitable for material deposition. For instance, the substrate may be made of a material selected from the group consisting of glass (for instance soda-lime glass, borosilicate glass etc.), metal, polymer, ceramic, compound materials, carbon fiber materials, metal or any other material or combination of materials which can be coated by a deposition process.

[0023] Fig. 1 shows a schematic view of a deposition process for manufacturing OLEDs on a substrate 10.

[0024] For manufacturing OLEDs, organic molecules are generated by a deposition source 30 (e.g., evaporated, sputtered, sprayed etc.) and deposited on the substrate 10. A masking device 20, e.g. a shadow mask, is positioned between the substrate 10 and the deposition source 30. The masking device 20 may have a specific pattern, e.g., provided by a plurality of openings or holes 23, so that organic molecules pass through the openings or holes 23 (e.g., along a path 32) to deposit a layer or film of an organic compound on the substrate 10. A plurality of layers or films can be deposited on the substrate 10 using different masking devices or different positions of the masking device 20 with respect to the substrate 10, e.g., to generate pixels with different color characteristics. For example, a first layer or film can be deposited to generate red pixels 34, a second layer or film can be deposited to generate green pixels 36, and a third layer or film can be deposited to generate blue pixels 38. The layer(s) or film(s), e.g., an organic semiconductor, can be arranged between two electrodes, such as an anode and a cathode (not shown). At least one electrode of the two electrodes can be transparent.

[0025] The substrate 10 and the masking device 20 can be arranged in a substantially vertical orientation during the deposition process. In Fig. 1, arrows indicate a vertical Y- direction, a horizontal X-direction and a horizontal Z-direction. [0026] Fig. 2 illustrates a deposition process. Material is emitted by a deposition source 250 towards a substrate 10 for coating the substrate 10. During the deposition process, the substrate 10 is masked by a masking device 20, e.g. a shadow mask, to form a pattern on the substrate 10. [0027] Fig. 2 shows a substrate arrangement 210 and a mask arrangement 220 in a side view. The substrate arrangement 210 includes the substrate 10. The mask arrangement 220 includes the masking device 20. As shown in Fig. 2, a substrate arrangement 210 may include a substrate carrier 215. The substrate 10 is supported by the substrate carrier 215. As shown in Fig. 2, a mask arrangement 220 may include a mask carrier 225. The masking device 20 is supported by the mask carrier 225.

[0028] The substrate arrangement 210 and the mask arrangement 220 shown in Fig. 2 are connected to each other. For example, the substrate carrier 215 and the mask carrier 225 can be attached to each other by a clamping device (not shown) or other attachment devices. Having a substrate arrangement 210 and a mask arrangement 220 which are attached to each other ensures that the masking device 20 is maintained in a fixed position relative to the substrate 10 during the deposition process. A fixed position of the masking device 20 relative to the substrate 10 can provide a patterned layer of high quality and high precision.

[0029] Fig. 3 shows a mask arrangement 220 in a side view. [0030] Fig. 4 shows a substrate arrangement 210 in a side view. [0031] Fig. 5 shows a mask arrangement 220 in a front view. [0032] Fig. 6 shows a substrate arrangement 210 in a front view.

[0033] Before the substrate arrangement 210 and the mask arrangement 220 are connected to each other for the deposition process, an alignment of the masking arrangement 220 and the substrate arrangement 210 relative to each other may be performed to ensure that the masking device 20 is in a well aligned position with respect to the substrate 10.

[0034] Figs. 7a-b illustrate a method according to embodiments described herein. Fig. 7a shows an apparatus 701 including a plurality of magnetic units 700. As shown, the plurality of magnetic units 700 may include one or more first magnetic units 710 and/or one or more second magnetic units 720. The apparatus 701 shown in Figs. 7a-b includes a substrate arrangement 210 and a mask arrangement 220. The substrate arrangement 210 may be contactlessly levitated by the plurality of magnetic units, particularly by the one or more first magnetic units 710. The one or more first magnetic units 710 may provide a magnetic levitation force acting on the substrate arrangement 210. The mask arrangement 220 is contactlessly levitated by the plurality of magnetic units 700, particularly by the one or more second magnetic units 720. The one or more second magnetic units 720 may provide a magnetic levitation force acting on the mask arrangement 220.

[0035] Fig. 7a shows a configuration in which a misalignment exists between the mask arrangement 220 and the substrate arrangement 210. For example, a misalignment may be present in a vertical direction, as indicated in Fig. 7a by the vertical offsets 752 and 754 between the mask arrangement 220 and the substrate arrangement 210.

[0036] By controlling a magnetic levitation force or forces provided by the plurality of magnetic units 700, a position of the substrate arrangement 210, e.g. a vertical or angular position, can be controlled and/or adjusted in a contactless manner. For example, by controlling the one or more first magnetic units 710, the substrate arrangement 210 can be provided in a target position during contactless levitation. Fig. 7b shows a substrate arrangement 210 provided in a target position. As compared to the substrate arrangement 210 shown in Fig. 7a, the substrate arrangement 210 shown in Fig. 7b has been moved, e.g. in a vertical direction, for aligning the substrate arrangement 210.

[0037] Additionally or alternatively, by controlling a magnetic levitation force or forces provided by the plurality of magnetic units 700, a position of the mask arrangement 220, e.g. a vertical or angular position, can be controlled and/or adjusted in a contactless manner. For example, by controlling the one or more second magnetic units 720, the mask arrangement 220 can be provided in a target position during contactless levitation. Fig. 7b shows a mask arrangement 220 provided in a target position. As compared to the mask arrangement 220 shown in Fig. 7a, the mask arrangement 220 shown in Fig. 7b has been moved, e.g. in a vertical direction, for aligning the mask arrangement 220.

[0038] As shown in Fig. 7b, by controlling the plurality of magnetic units 700, the substrate arrangement 210 and the mask arrangement 220 can be aligned with respect to each other. The alignment is a contactless alignment. For example, as shown in Fig. 7b, an upper portion of the substrate carrier 215 and an upper portion of the mask carrier 225 can each be contactlessly aligned with a reference axis 762 by controlling the magnetic levitation forces acting on the mask arrangement 220 and the substrate arrangement 210. Similarly, a lower portion of the substrate carrier 215 and a lower portion of the mask carrier 225 can each be aligned with a reference axis 764. The substrate arrangement 210 and the mask arrangement 220 shown in Fig. 7b are well aligned with respect to each other. In light thereof, the substrate 10 and the masking device 20 are well aligned with respect to each other. The alignment can be provided exclusively in a contactless manner.

[0039] As shown in Figs. 7a-b, prior to and/or during the contactless alignment, the substrate arrangement 210 is separated from the mask arrangement 220. There may be no mechanical contact between the mask arrangement 220 and the substrate arrangement 210 during the contactless alignment.

[0040] In the embodiment illustrated in Figs. 7a-b, both the substrate arrangement 210 and the mask arrangement 220 are displaced for aligning the substrate arrangement 210 and the mask arrangement 220 relative to each other. Alternatively, a contactless alignment may be provided by contactlessly adjusting the position of the mask arrangement 220 only, while keeping the position of the substrate arrangement 210 constant, or vice versa.

[0041] After contactlessly aligning the substrate arrangement 210 and the mask arrangement 220 relative to each other, the substrate arrangement 210, the mask arrangement 220, or both the substrate arrangement 210 and the mask arrangement 220, may be moved for connecting both arrangements to each other.

[0042] Fig. 8 shows a configuration of the substrate arrangement 210 and the mask arrangement 220 after said arrangements have been contactlessly aligned according to e.g. the procedure illustrated in Figs. 7a-b. Fig. 8 shows a substrate arrangement 210 which is connected to the mask arrangement 220, e.g. by a clamping device (not shown). The substrate arrangement 210 and the mask arrangement 220 may be connected to each other to fix the relative position of the masking device 20 relative to the substrate 10 for the deposition process.

[0043] As compared to Fig. 7b, the alignment of the substrate arrangement 210 and the mask arrangement 220 shown in Fig. 8 relative to each other has remained substantially unchanged. As shown, the substrate arrangement 210 and the mask arrangement 220 shown in Fig. 8 are well aligned with respect to each other.

[0044] A movement of the substrate arrangement 210, the mask arrangement 220, or both the substrate arrangement 210 and the mask arrangement 220, wherein the substrate arrangement 210 and the mask arrangement 220 are provided in an adjacent position with respect to each other for allowing both arrangements to be connected to each other, is denoted herein as a connection movement for short. A connection movement may be a movement of the substrate arrangement 210 and/or the mask arrangement 220 in a substantially horizontal direction, e.g. the z-direction shown in the figures. A connection movement may be provided by a mechanical device, e.g. a support structure according to embodiments described herein.

[0045] A connection movement for connecting the mask arrangement 220 to the substrate arrangement 210 may not form part of the alignment of the substrate arrangement 210 and the mask arrangement 220 relative to each other. During the connection movement, the alignment of the masking device 20 relative to the substrate 10 may not change. For example, a vertical position and/or angular position of the substrate arrangement 210 and/or the mask arrangement 220 may remain substantially constant during a connection movement. During a connection movement, the substrate arrangement 210 and the mask arrangement 220 may continue to be well-aligned with respect to each other. Only the horizontal position of the substrate arrangement 210 and/or of the mask arrangement 220 along the z-direction may change during a connection movement.

[0046] Fig. 9 shows an example of a plurality of magnetic units 700 in a top view. As shown in Fig. 9, a plurality of magnetic units 700 may include one or more first magnetic units 710. Individual magnetic units of the one or more first magnetic units 710 are indicated with reference numeral 915. The one or more first magnetic units 710 may be a linear array of magnetic units extending in a substantially horizontal direction, e.g. the x- direction.

[0047] As shown in Fig. 9, the plurality of magnetic units 700 may include one or more second magnetic units 720. Individual magnetic units of the one or more second magnetic units 720 are indicated with reference numeral 925. The one or more second magnetic units 720 may be a linear array of magnetic units, which may be parallel to the one or more first magnetic units 710. The one or more second magnetic units 720 may face the one more first magnetic units 710.

[0048] For example, one or more first magnetic units 710 as described herein may be configured for contactlessly levitating the substrate arrangement 210 and one or more second magnetic units 720 as described herein may be configured for contactlessly levitating the mask arrangement 220, or vice versa. During contactless levitation, the substrate arrangement 210 may face the mask arrangement 220.

[0049] Fig. 9 shows a plurality of position sensors 1450 connected to the plurality of magnetic units 700. The plurality of position sensors 1450 may include one or more first position sensors 950 and/or one or more second position sensors 960. Individual position sensors of the one or more first position sensors 950 are indicated in Fig. 9 with reference numeral 955. Individual position sensors of the one or more second position sensors 960 are indicated in Fig. 9 with reference numeral 965. [0050] As shown in Fig. 9, the one or more first position sensors 950 may be connected to the one or more first magnetic units 710. The one or more first position sensors 950 may be configured for measuring a position of the substrate arrangement during contactless levitation. Based on the position data measured by the one or more first position sensors 950, a contactless levitation, alignment and/or transportation of the substrate arrangement may be controlled.

[0051] As shown in Fig. 9, the one or more second position sensors 960 may be connected to the one or more second magnetic units 720. The one or more second position sensors 960 may be configured for measuring a position of the mask arrangement during contactless levitation. Based on the position data measured by the one or more second position sensors 960, a contactless levitation, alignment and/or transportation of the mask arrangement may be controlled.

[0052] According to an embodiment, a method is provided. The method includes contactlessly levitating a substrate arrangement 210. The substrate arrangement 210 includes a substrate 10. The method includes contactlessly levitating a mask arrangement 220. The mask arrangement 220 includes a masking device 20 for masking the substrate 10. The method includes contactlessly aligning the substrate arrangement 210 and the mask arrangement 220 relative to each other.

[0053] An alignment which is contactless, as described herein, can be understood as an alignment that is provided without contacting the substrate arrangement 210 or the mask arrangement 220. A contactless alignment can be understood in the sense that no mechanical alignment devices contacting the substrate arrangement 210 or the mask arrangement 220 are used for providing an alignment thereof. A contactless alignment may be provided by acting on the substrate arrangement 210 and/or on the mask arrangement by contactless forces, more particularly magnetic forces, still more particularly magnetic levitation forces.

[0054] A contactless alignment of the substrate arrangement 210 and the mask arrangement 220 relative to each other, as described herein, is a relative alignment. For example, a contactless alignment as described herein may be provided by displacing only the substrate arrangement 210 in the processing chamber while keeping the mask arrangement stationary, or vice versa. In other situations, providing a contactless alignment may include displacing both the substrate arrangement 210 and the mask arrangement 220 in the processing chamber into a respective target position.

[0055] Providing a contactless alignment of the substrate arrangement 210 and the mask arrangement 220 relative to each other may include at least one of: controlling or adjusting a position of the substrate arrangement 210; controlling or adjusting a position of the mask arrangement 220; or a combination thereof.

[0056] For example, as illustrated in Figs. 13a-c, providing a contactless alignment of the substrate arrangement 210 and the mask arrangement 220 relative to each other may include at least one of the following: Aligning the substrate arrangement 210 relative to a support structure 1300, e.g. displacing the substrate arrangement 210 to position the substrate arrangement 210 in a target position relative to the support structure 1300; aligning the mask arrangement 220 relative to the support structure 1300, e.g. displacing the mask arrangement 220 to position the mask arrangement 220 in a target position relative to the support structure 1300; and a combination thereof. For example, the substrate arrangement 210 may be aligned with respect to one or more first engaging elements 1310 of the support structure 1300. The mask arrangement 220 may be aligned with respect to one or more second engaging elements 1320 of the support structure 1300. The support structure 1300 may be in a fixed position in the processing chamber. [0057] A contactless alignment of the substrate arrangement 210 and the mask arrangement 220, as described herein, ensures that the masking device 20 is aligned with respect to the substrate 10.

[0058] The methods and apparatuses described herein may provide a contactless alignment of a mask arrangement and/or a substrate arrangement with a high precision. According to embodiments, which can be combined with other embodiments described herein, an alignment precision of 500 μιη or lower, more particularly 100 μιη or lower, or even 20 μιη or lower, can be provided.

[0059] For example, in some implementations, the repeatability of the position of a single carrier in standstill can be 100 μιη or lower or even 20 μιη or lower. [0060] An alignment precision of 500 μιη can be sufficient for a successful clamping of the substrate arrangement and the mask arrangement. For example, an alignment precision of 500 μιη can be sufficient for correctly positioning the one or more first engagement elements and the one or more second engagement elements of the support structure with respect to the one or more first receiving portions and the one or more second receiving portions, as described herein.

[0061] According to some embodiments described herein, the effects of temperature drift can be reduced. For example, by utilizing a central controller as described herein and/or by including several high-precision sensors as described herein, the effects of temperature drift can be reduced or even annihilated, so that the alignment precision can be improved even further. Accordingly, a contactless alignment precision which is even higher than 20μιη can be provided, such as an alignment precision of 5 μιη or lower, more particularly 1 μιη or lower, or even 0.1 μιη or lower.

[0062] The high contactless alignment precision provided according to embodiments described herein may be obtained by performing high-precision position measurements of the substrate arrangement and/or the mask arrangement during contactless levitation. High-precision position measurements may be performed by position sensors as described herein having a position sensor precision of 1 μιη or below, particularly 0.5 μιη or below, more particularly 0.1 μιη or below. Based on such high-precision position measurements, the position of the substrate arrangement and/or the mask arrangement can be controlled with high accuracy during contactless levitation, so that a high-precision contactless alignment thereof can be provided.

[0063] In light of the high-precision contactless alignment provided according to embodiments described herein, the masking device 20, e.g. a shadow mask for providing a pattern having a plurality of very small features on a substrate 10, can be precisely aligned with respect to the substrate 10 solely by way of contactless forces. Apart from the contactless alignment of the substrate arrangement 210 and the mask arrangement 220 provided according to embodiments described herein, no additional mechanical alignment may be required for aligning the substrate arrangement 210 and the mask arrangement 220. An alignment of the substrate arrangement 210 and the mask arrangement 220 provided by embodiments described herein may be provided exclusively in a contactless manner.

[0064] Since no mechanical alignment devices are needed in addition to the contactless alignment, embodiments described herein provide the advantage that the entire alignment procedure can be provided in a simplified, time-saving and cost-saving manner. [0065] Additionally, an alignment method which involves an additional mechanical fine alignment by a mechanical alignment device is more prone to errors and failure. After an initial contactless alignment, the contactlessly levitated substrate arrangement and mask arrangement can be transferred to a mechanical alignment device for performing a fine alignment thereof. Such a transfer procedure can be complicated, time-consuming and sensitive to errors and failure. In the worst case, a transfer of the contactlessly levitated substrate arrangement and mask arrangement to the mechanical alignment device may fail, such that the substrate arrangement or the mask arrangement may fall down and be damaged. A complex monitoring system may be necessary for avoiding such errors. In contrast, embodiments described herein provide a contactless alignment with high precision which allows for performing the entire alignment procedure in a contactless manner, providing the advantage that a complex and risky transfer to a mechanical alignment device can be eliminated.

[0066] A substrate arrangement 210 as described herein may be contactlessly levitated and/or aligned in a vertical or substantially vertical orientation. The substrate arrangement 210 may define a plane. During contactless levitation and/or alignment, the plane may be provided in a vertical or substantially vertical orientation.

[0067] A mask arrangement 220 as described herein may be contactlessly levitated and/or aligned in a vertical or substantially vertical orientation. The mask arrangement 220 may define a plane. During contactless levitation and/or alignment, the plane may be provided in a vertical or substantially vertical orientation.

[0068] A method as described herein may include measuring a position of the substrate arrangement 210 using one or more first position sensors 950 as described herein. Each position sensor of the one or more first position sensors 950 may be a high-precision position sensor as described herein. Each position sensor of the one or more first position sensors 950 may have a position sensor precision of 1 μιη or below, particularly 0.5 μιη or below, more particularly 0.1 μιη or below.

[0069] A method as described herein may include measuring a position of the mask arrangement 220 using one or more second position sensors 960 as described herein. Each position sensor of the one or more second position sensors 960 may be a high-precision position sensor as described herein. Each position sensor of the one or more second position sensors 960 may have a position sensor precision of 1 μιη or below, particularly 0.5 μιη or below, more particularly 0.1 μιη or below.

[0070] Measuring a position of the substrate arrangement 210 and/or of the mask arrangement 220 may include measuring a vertical position of the substrate arrangement 210 and/or the mask arrangement 220. Measuring a position may include measuring a distance, particularly a vertical distance, such as a distance from a position sensor to the substrate arrangement 210 and/or the mask arrangement 220.

[0071] Measuring a position of the substrate arrangement 210 may include measuring a plurality of distances, e.g. vertical distances, such as e.g. 2, 3, 4, 5, 6 or even more distances. A plurality of distances for the substrate arrangement 210 can be measured by a plurality of position sensors 1450 as described herein, particularly one or more first position sensors 950 as described herein.

[0072] Measuring a position of the mask arrangement 220 may include measuring a plurality of distances, e.g. vertical distances, such as e.g. 2, 3, 4, 5, 6 or even more distances. A plurality of distances for the mask arrangement 220 can be measured by a plurality of position sensors 1450 as described herein, particularly the one or more second position sensors 960 as described herein.

[0073] A position of the substrate arrangement 210 may be measured while the substrate arrangement 210 and/or the mask arrangement 220 are contactlessly levitated. A position of the mask arrangement 220 may be measured while the substrate arrangement 210 and/or the mask arrangement are contactlessly levitated. Providing a contactless alignment of the substrate arrangement 210 and/or of the mask arrangement 220 may be based at least on a measured position of the substrate arrangement 210 and/or of the mask arrangement 220. [0074] A method as described herein may include controlling and/or adjusting at least one magnetic levitation force acting on the substrate arrangement 210 to provide a contactless alignment as described herein. The method may include controlling and/or adjusting a plurality of magnetic levitation forces acting on the substrate arrangement 210 to provide the contactless alignment. For example, two, three or even more magnetic levitation forces acting jointly on the substrate arrangement 210 may be controlled and/or adjusted for providing a contactless alignment.

[0075] Additionally or alternatively, a method as described herein may include controlling and/or adjusting at least one magnetic levitation force acting on the mask arrangement 220 to provide a contactless alignment as described herein. The method may include controlling and/or adjusting a plurality of magnetic levitation forces acting on the mask arrangement 220 to provide the contactless alignment. For example, two, three or even more magnetic levitation forces acting jointly on the mask arrangement 220 may be controlled and/or adjusted for providing a contactless alignment. [0076] A substrate arrangement 210 as described herein may include a carrier, e.g. substrate carrier 215 shown in the figures. The substrate 10 may be supported by the carrier. The carrier may define a plane. The carrier may include a substrate receiving surface. The carrier may be a substrate carrier. The carrier may include one or more first receiving portions 1312 of the substrate arrangement 210 as described herein. A substrate arrangement 210 may be a substrate carrier assembly including a substrate 10 and a carrier supporting the substrate 10.

[0003] A substrate arrangement 210 as described herein may include one or more passive magnetic units, e.g. one or more bars made of ferromagnetic material. For example, the one or more passive magnetic units may be connected or attached to the substrate carrier. A magnetic levitation force acting on the substrate arrangement 210 may be provided by an interaction of a magnetic field provided by the plurality of magnetic units 700 with the magnetic properties of the one or more passive magnetic units included in the substrate arrangement 210. The interaction may provide for a magnetic attraction between the plurality of magnetic units 700 and the one or more passive magnetic units. The magnetic attraction provides for an upward force, i.e. a magnetic levitation force, acting on the substrate arrangement 210.

[0077] A mask arrangement 220 as described herein may include a carrier, e.g. mask carrier 225 shown in the figures. The masking device 20 may be supported by the carrier. The carrier may define a plane. The carrier may provide a mask receiving area. The carrier may be a mask carrier. The carrier may include one or more second receiving portions 1322 of the mask arrangement 220 as described herein. A mask arrangement 220 may be a mask carrier assembly including a masking device 20 and a carrier supporting the masking device 20. A mask arrangement may include a mask support, e.g. a mask frame. The masking device 20 may be supported by the mask support. The mask support may be supported by the carrier.

[0078] Similar to the substrate arrangement 210, the mask arrangement 220 may include one or more passive magnetic units, e.g. one or more bars made of ferromagnetic material. For example, the one or more passive magnetic units may be connected or attached to the mask carrier. A magnetic levitation force acting on the mask arrangement 220 may be provided by an interaction of a magnetic field provided by the plurality of magnetic units 700 with the magnetic properties of the one or more passive magnetic units included in the mask arrangement 220.

[0079] A masking device 20 as described herein may include a plurality of openings. A masking device 20 may be configured for providing a pattern on the substrate 10. The pattern may include a plurality of features. A masking device 20 may be configured for providing a plurality of pixels on a substrate 10. A masking device 20 may be a shadow mask. A masking device 20 may be a fine metal mask having a pattern.

[0080] Figs. lOa-b illustrate a vertical contactless alignment according to embodiments described herein. Figs. lOa-b show an arrangement 1000 being contactlessly levitated by the plurality of magnetic units 700.

[0081] An arrangement 1000, as described herein, can be a substrate arrangement or a mask arrangement as described herein.

[0082] Figs. lOa-b show a reference axis 1012 indicating a target vertical position for the arrangement 1000. The reference axis 1012 is a substantially horizontal reference axis. The arrangement 1000 shown in Fig. 10a is not in the target vertical position, as indicated by the vertical offset 1022. The arrangement 1000 shown in Fig. 10a is in a position below the target position. By adjusting a magnetic levitation force provided by the plurality of magnetic units 700, the vertical position of the arrangement 1000 may be adjusted in a contactless manner to align the arrangement 1000 with the target vertical position indicated by the reference axis 1012. For bringing the arrangement 1000 shown in Fig. 10a into the target vertical position, a magnitude of at least one magnetic levitation force acting on the arrangement 1000 may be changed, e.g. increased. By increasing the magnetic levitation force, an upward movement of the arrangement 1000 can be provided for vertically aligning the arrangement 1000 without contacting the arrangement 1000. Fig. 10b shows the arrangement 1000 after the upward movement. The arrangement 1000 shown in Fig. 10b has been vertically aligned with the reference axis 1012 and is in the target vertical position.

[0083] Figs. lOa-b illustrate an example of a contactless vertical alignment of the arrangement 1000, wherein an upward movement of the arrangement 1000 is provided for vertically aligning the arrangement 1000. Similarly, a contactless vertical alignment may involve any other vertical movement, e.g. a downward movement of the arrangement 1000, for vertically aligning the arrangement 1000.

[0084] Figs, l la-b illustrate an angular contactless alignment as described herein. The arrangement 1000 shown in Figs, l la-b is contactlessly levitated by the plurality of magnetic units 700. Figs, l la-b show a reference axis 1130 indicating a target angular position for the arrangement 1000. The reference axis 1130 is a substantially horizontal reference axis. The reference axis 1130 may define a target direction for, e.g., an upper edge of the arrangement 1000. The arrangement 1000 shown in Fig. 1 la is not in the target angular position, as indicated by the angle 1132. By adjusting one or more magnetic levitation forces provided by the plurality of magnetic units 700, the angular position of the arrangement 1000 may be adjusted in a contactless manner to align the arrangement 1000 with the target angular position defined by the reference axis 1130. For example, by decreasing the magnitude of the magnetic levitation force 1112 provided by magnetic unit 1110 and/or by increasing the magnitude of the magnetic levitation force 1 122 provided by magnetic unit 1120, the arrangement 1000 may be contactlessly rotated with respect to a rotation axis perpendicular to the plane of the page, as indicated by the arrow 1150. The rotation axis may be substantially perpendicular to a plane defined by the arrangement 1000. Fig. 1 lb shows the arrangement 1000 after the contactless rotation. The arrangement 1000 shown in Fig. 1 lb has been angularly aligned with the reference axis 1130 and is in the target angular position.

[0085] Figs. 12a-b illustrate a horizontal contactless alignment as described herein. The arrangement 1000 shown in Figs. 12a-b is contactlessly levitated by a plurality of magnetic units 700. Figs. 12a-b show a magnetic driving system 1210 as described herein. The magnetic driving system 1210 can include a further plurality of magnetic units. The magnetic driving system is configured for contactlessly transporting the arrangement 1000 in a horizontal direction, e.g. in a direction substantially parallel to the plurality of magnetic units 700.

[0086] Figs. 12a-b show a reference axis 1230 indicating a target horizontal position for the arrangement 1000. The reference axis 1230 is a substantially vertical reference axis. The arrangement 1000 shown in Fig. 12a is not in the target vertical position, as indicated by the horizontal offset 1232. By adjusting a magnetic force, particularly a substantially horizontal magnetic force, provided by the magnetic driving system 1210, the horizontal position of the arrangement 1000 may be adjusted in a contactless manner to align the arrangement 1000 with the target horizontal position indicated by the reference axis 1230. A horizontal movement parallel to the plurality of magnetic units 700 may be provided. Fig. 12b shows the arrangement 1000 after the horizontal movement. The arrangement 1000 shown in Fig. 12b has been horizontally aligned with the reference axis 1230 and is in the target horizontal position.

[0087] A contactless alignment of the substrate arrangement 210 and/or the mask arrangement 220, as described herein, may include at least one of a vertical alignment, an angular alignment, a horizontal alignment, or any combination thereof.

[0088] Providing a vertical alignment may include controlling and/or adjusting a vertical position of the substrate arrangement 210 and/or the mask arrangement 220. A vertical alignment may be provided by controlling a magnetic levitation force or forces acting on the substrate arrangement 210 and/or the mask arrangement 220. The magnetic levitation force or forces may be provided by the plurality of magnetic units 700.

[0089] Providing an angular alignment may include controlling and/or adjusting an angular position of the substrate arrangement 210 and/or the mask arrangement 220 with respect to a substantially horizontal rotation axis, e.g. a rotation axis substantially perpendicular to a plane defined by the substrate arrangement 210 and/or a rotation axis substantially perpendicular to a plane defined by the mask arrangement 220. An angular alignment may be provided by controlling a plurality of magnetic levitation forces acting on the substrate arrangement 210 and/or the mask arrangement 220. By controlling the magnitudes of several levitation forces acting jointly on, e.g., the substrate arrangement 210, an angular position of the substrate arrangement 210 can be adjusted. Similarly, an angular position of the mask arrangement 220 can be adjusted.

[0090] Providing a horizontal alignment may include controlling and/or adjusting a horizontal position of the substrate arrangement 210 and/or the mask arrangement 220, e.g. a position along the x-direction. A horizontal alignment may be provided by controlling a magnetic force or forces acting on the substrate arrangement 210 and/or the mask arrangement 220 in a substantially horizontal direction. For example, a horizontal alignment may be provided by controlling a magnetic force in the x-direction provided by a magnetic driving system 1210 as described herein.

[0091] Figs. 13a-c illustrate a method and apparatus according to embodiments described herein. Figs. 13a-c show a support structure 1300. As shown, a support structure 1300 may include one or more first engaging elements 1310, e.g. one or more pins which may be conically shaped, for engaging the substrate arrangement 210. A support structure 1300 may include one or more second engaging elements 1320, e.g. one or more further pins which may be conically shaped, for engaging the mask arrangement 220. [0092] As shown in Figs. 13a-c, the substrate arrangement 210 may include one or more first receiving portions 1312 for receiving the one or more first engaging elements 1310 of the support structure 1300. The one or more first receiving portions 1312 may include one or more holes provided in the substrate carrier 215. Each hole may be configured for receiving a corresponding pin of the one or more first engaging elements 1310. The mask arrangement 220 may include one or more second receiving portions 1322 for receiving the one or more second engaging elements 1320 of the support structure 1300. The one or more second receiving portions 1322 may include one or more holes provided in the mask carrier 225. Each hole may be configured for receiving a corresponding pin of the one or more second engaging elements 1320. [0093] The substrate arrangement 210 and the mask arrangement 220 shown in Fig. 13a are not well-aligned with respect to each other. As described herein, by controlling the magnetic levitation forces acting on the substrate arrangement 210 and/or on the mask arrangement 220, a contactless alignment of the substrate arrangement 210 and the mask arrangement 220 may be provided. [0094] For example, by controlling the plurality of magnetic units 700, the substrate arrangement 210 may be provided in a position such that the one or more first receiving portions 1312 of the substrate arrangement 210 are aligned with the one or more first engaging elements 1310 of the support structure 1300, as illustrated in Fig. 13b. Alternatively or additionally, by controlling the plurality of magnetic units 700, the mask arrangement 220 may be provided in a position such that the one or second more receiving portions 1322 of the mask arrangement 220 are aligned with the one or more second engaging elements 1320 of the support structure 1300, as illustrated in Fig. 13b.

[0095] The substrate arrangement 210 and the mask arrangement 220 shown in Fig. 13b are each well aligned with respect to the support structure 1300. The one or more first receiving portions 1312 are in alignment with horizontal axes 1314 defined by the one or more first engaging elements 1310. The one or more second receiving portions 1322 shown in Fig. 13b are in alignment with horizontal axes 1324 defined by the one or more second engaging elements 1320. The substrate arrangement 210 and the mask arrangement 220, being each well aligned with respect to the support structure 1300, are well aligned relative to each other.

[0096] After providing the contactless alignment as e.g. described with respect to Figs. 13a-b, the one or more first engaging elements 1310 may be moved, e.g. in a substantially horizontal direction, to engage the one or more first receiving portions 1312 of the substrate arrangement 210. Likewise, the one or more second engaging elements 1320 may be moved, e.g. in a substantially horizontal direction, to engage the one or more second receiving portions 1322 of the mask arrangement 220.

[0097] After the one or more first engaging elements 1310 and the one or more second engaging elements 1320 have engaged the one or more first receiving portions 1312 and the one or more second receiving portions 1322, respectively, the support structure 1300 may be configured for horizontally moving the substrate arrangement 210 and the mask arrangement 220 towards each other. The horizontal movement provided by the support structure 1300 may not substantially change the relative alignment of the substrate arrangement 210 and the mask arrangement 220. The horizontal movement provided by the support structure 1300 may be a connection movement as described herein. [0098] Fig. 13c shows the substrate arrangement 210 and the mask arrangement 220 after said arrangements have been horizontally moved towards each other. The relative alignment of the substrate arrangement 210 and the mask arrangement 220 shown in Fig. 13c is substantially the same as the relative alignment of the substrate arrangement 210 and the mask arrangement 220 shown in Fig. 13b. As compared to Fig. 13b, showing a substrate arrangement 210 and a mask arrangement 220 separated from each other, the substrate arrangement 210 and the mask arrangement 220 shown in Fig. 13c are adjacent to each other.

[0099] The substrate arrangement 210 shown in Fig. 13c is supported by the support structure 1300. The one or more first engaging elements 1310 engage the one or more first receiving portions 1312. The mask arrangement 220 shown in Fig. 13c is supported by the support structure 1300. The one or more second engaging elements 1320 engage the one or more second receiving portions. As shown in Fig. 13c, the support structure 1300 can be configured for providing the substrate arrangement 210 in a position adjacent to the mask arrangement 220, particularly in a position such that the substrate arrangement 210 contacts the mask arrangement 220.

[00100] The substrate arrangement 210 and the mask arrangement 220 in the configuration shown in Fig. 13c may be attached to each other. After attaching both arrangements to each other, the resulting assembly including the substrate arrangement 210 attached to the mask arrangement 220 may be removed from the support structure 1300 for further processing, e.g. for a deposition process.

[00101] A method as described herein may include connecting the substrate arrangement 210 to the mask arrangement 220, particularly after a contactless alignment of the substrate 10 arrangement and the mask arrangement 220 relative to each other is provided. The contactlessly aligned substrate arrangement 210 may be connected to the contactlessly aligned mask arrangement 220. Connecting the substrate arrangement 210 to the mask arrangement 220 may be or include attaching the substrate arrangement 210 to the mask arrangement 220. The substrate arrangement 210 may be connected to the mask arrangement 220 by one or more connection devices, e.g. one or more attachment devices, such as one or more clamping devices. [00102] The substrate arrangement 210 may be connected to the mask arrangement 220 to fix the relative position of the masking device 20 with respect to the substrate 10. By connecting the substrate arrangement 210 to the mask arrangement 220, the substrate 10 and the masking device 20 can be secured in a well aligned configuration. After providing the connection, the combined assembly including the substrate arrangement 210 connected to the mask arrangement can be further processed, e.g. in a deposition process. [00103] A method as described herein may include engaging the substrate arrangement 210 with a support structure 1300 and/or engaging the mask arrangement 220 with a support structure 1300. Said engaging may be provided after the contactless alignment. The support structure 1300 may include one or more first engaging elements 1310 and/or one or more second engaging elements 1320. The method may include engaging the substrate arrangement 210 with the one or more first engaging elements 1310 and/or engaging the mask arrangement 220 with the one or more second engaging elements 1320. The method may include receiving the one or more first engaging elements 1310 in one or more first receiving portions 1312, e.g. openings, of the substrate arrangement 210. The method may include receiving the one or more second engaging elements 1320 in one or more second receiving portions 1322, e.g. openings, of the mask arrangement 220.

[00104] The method may include supporting the substrate arrangement 210 and/or supporting the mask arrangement 220 by the support structure 1300. Said supporting may be provided after the contactless alignment. The method may include connecting the mask arrangement 220 to the substrate arrangement 210 while the substrate arrangement 210 and/or the mask arrangement 220 are supported by the support structure 1300.

[00105] Fig. 14 shows an apparatus 701 according to embodiments described herein. The apparatus 701 includes a control unit 1400. The control unit 1400 is connected to the plurality of magnetic units 700. The exemplary plurality of magnetic units 700 shown in Fig. 14 includes three magnetic units 1432, 1434 and 1436. More than three, or less than three, magnetic units may also be provided.

[00106] As shown in Fig. 14, a control unit 1400 can include a plurality of local controllers 1420. Fig. 14 shows three local controllers 1422, 1424 and 1426. More than three, or less than three, local controllers may also be provided. Each local controller can be connected to a respective magnetic unit of the plurality of magnetic units 700. In Fig. 14, local controllers 1422, 1424 and 1426 are connected to magnetic units 1432, 1434 and 1436, respectively. Each local controller may be configured for controlling the respective magnetic unit. For example, a local controller may be configured for controlling a magnetic levitation force provided by the magnetic unit connected to the local controller. [00107] As shown in Fig. 14, the apparatus 701 may include a plurality of position sensors 1450. The exemplary plurality of position sensors 1450 shown in Fig. 14 includes three position sensors 1452, 1454 and 1456. More than three, or less than three, position sensors may be provided. One or more of the position sensors may be high-precision position sensors as described herein.

[00108] As shown in Fig. 14, each position sensor of the plurality of position sensors 1450 can be connected to a respective magnetic unit of the plurality of magnetic units 700 and/or to a respective local controller of the plurality of local controllers 1420. Position sensors 1452, 1454 and 1456 shown in Fig. 14 are connected to magnetic units 1432, 1434 and 1436, respectively. Position sensors 1452, 1454 and 1456 shown in Fig. 14 are connected to local controllers 1422, 1424 and 1426, respectively.

[00109] A position sensor can be configured for measuring a respective local coordinate of the contactlessly levitated arrangement 1000. For example, each position sensor may be configured for measuring a respective vertical distance, e.g. a distance from the contactlessly levitated arrangement 1000 to the plurality of magnetic units 700. Position sensors 1452, 1454 and 1456 shown in Fig. 14 are configured for measuring vertical distances 1472, 1474 and 1476, respectively.

[00110] A local coordinate measured by a position sensor may be provided to a local controller connected to the position sensor. Based on the measured position data, the local controller may control a magnetic unit connected to the local controller. For example, based on the position data, the local controller may control or adjust a magnetic levitation force acting on the arrangement 1000 for contactlessly aligning the arrangement 1000.

[00111] As shown in Fig. 14, the control unit 1400 may include a central controller 1410. Each local controller can be connected to the central controller 1410. The exemplary apparatus 701 shown in Fig. 14 includes both a central controller 1410 and a plurality of local controllers 1420. Alternatively, a control unit 1400 as described herein may include at least one of a central controller 1410 and a plurality of local controllers 1420.

[00112] The central controller 1410 may be configured for receiving a plurality of local coordinates measured by the plurality of position sensors 1450. For example, the plurality of local coordinates may include vertical distances 1472, 1474 and 1476 measured by the position sensors 1452, 1454 and 1456, respectively. The central controller 1410 can be configured for performing a coordinate transformation on the plurality of local coordinates. The coordinate transformation may include mapping the plurality of local coordinates to a central coordinate system. For example, the central coordinate system may provide central coordinates for representing the position of the arrangement 1000 in terms of the six degrees of freedom of the arrangement 1000. The central controller 1410 may treat the substrate arrangement 210 and/or the mask arrangement as a rigid body.

[00113] After performing the coordinate transformation, the contactless alignment of the arrangement 1000 can be controlled in the central coordinate system. For example, a user may set a target position for the arrangement 1000 in terms of target central coordinates of the arrangement 1000. The central controller 1410 may receive the target central coordinates and perform a backward coordinate transformation from the central coordinate system to the local coordinate system. The central controller 1410 can map the target central coordinates to target local coordinates. The target local coordinates may be provided to the respective local controllers. Based on the target local coordinates, each local controller may control and/or adjust a respective magnetic unit for providing the arrangement 1000 in the target position initially set by the user. In light thereof, a contactless alignment of the arrangement 1000 can be provided. [00114] A method as described herein may include measuring a plurality of local coordinates of the substrate arrangement 210 while the substrate arrangement 210 is contactlessly levitated. Additionally or alternatively, the method may include measuring a plurality of local coordinates of the mask arrangement 220 while the mask arrangement 220 is contactlessly levitated. [00115] A plurality of local coordinates of an arrangement, such as e.g. the substrate arrangement 210 or the mask arrangement 220, may include a plurality of positions and/or distances, e.g. vertical distances. A plurality of local coordinates may be measured by a plurality of position sensors 1450 as described herein. For example, a plurality of local coordinates of the substrate arrangement 210 may be measured by one or more first position sensors 950 as described herein. For example, a plurality of local coordinates of the mask arrangement 220 may be measured by one or more second position sensors 960 as described herein.

[00116] A local coordinate is a spatial coordinate. The notion of a local coordinate, as described herein, is used to distinguish with respect to the notion of a central coordinate. A plurality of local coordinates of an arrangement, such as e.g. the substrate arrangement 210 or mask arrangement 220, may be provided according to embodiments described herein. A local coordinate may be associated with a respective magnetic unit of the plurality of magnetic units 700. For example, the local coordinate may be measured by a respective position sensor connected to the magnetic unit. The local coordinate may be controlled by a respective local controller connected to the magnetic unit.

[00117] A plurality of local coordinates of an arrangement, such as e.g. the substrate arrangement 210 or the mask arrangement 220, may at least in part determine a position and/or orientation of the arrangement, e.g. at a given moment in time. For example, a plurality of local coordinates, such as a plurality of vertical distances, may be sufficient to fully determine the vertical position of the arrangement and/or the angular position of the arrangement with respect to a substantially horizontal rotation axis.

[00118] A plurality of local coordinates of the substrate arrangement 210 and/or a plurality of local coordinates of the mask arrangement 220 may be controlled by a plurality of local controllers 1420 as described herein. [00119] A method as described herein may include mapping the measured plurality of local coordinates of the substrate arrangement 210 and/or of the mask arrangement 220 to a central coordinate system. A central coordinate system may be controlled by a central controller 1410 as described herein.

[00120] A central coordinate system may refer to central coordinates for representing a position of an arrangement, such as the substrate arrangement 210 or the mask arrangement 220. Central coordinates may represent the position of an arrangement in a manner alternative to local coordinates. Local coordinates of an arrangement and central coordinates of the arrangement may be linked to each other by way of a coordinate transformation. The coordinate transformation can transform local coordinates into central coordinates and/or vice versa.

[00121] Mapping the measured plurality of local coordinates of the substrate arrangement 210 and/or of the mask arrangement 220 to the central coordinate system may include performing a coordinate transformation.

[00122] Central coordinates of an arrangement may provide a manner of representing the position of the arrangement in terms of six degrees of freedom of the arrangement. Central coordinates of an arrangement may include: a vertical position with respect to a vertical direction; a first horizontal position with respect to a first horizontal direction; a second horizontal position with respect to a second horizontal direction perpendicular to the first horizontal direction; a first angular position with respect to a vertical rotation axis; a second angular position with respect to a first horizontal rotation axis; a third angular position with respect to a second horizontal rotation axis perpendicular to the first horizontal rotation axis; or any combination thereof. [00123] A central coordinate system may provide central coordinates for the substrate arrangement 210 in terms of six degrees of freedom of the substrate arrangement 210. Additionally or alternatively, a central coordinate system may provide central coordinates for the mask arrangement 220 in terms of six degrees of freedom of the mask arrangement 220. [00124] A method as described herein may include controlling the alignment of the substrate arrangement 210 and the mask arrangement 220 relative to each other in the central coordinate system. The method may include controlling a position of the substrate arrangement 210 in the central coordinate system for providing a contactless alignment. Alternatively or additionally, providing a contactless alignment may include controlling a position of the mask arrangement 220 in the central coordinate system for providing a contactless alignment.

[00125] A method as described herein may include at least one of the following: Measuring a plurality of local coordinates of the substrate arrangement 210 while the substrate arrangement 210 is contactlessly levitated; measuring a plurality of local coordinates of the mask arrangement 220 while the mask arrangement 220 is contactlessly levitated; mapping the measured plurality of local coordinates of the substrate arrangement 210 and/or of the mask arrangement 220 to a central coordinate system; controlling a position of the substrate arrangement 210 and/or a position of the mask arrangement 220 in the central coordinate system; or any combination thereof.

[00126] Controlling a position of the substrate arrangement 210 and/or a position of the mask arrangement 220 in the central coordinate system, as described herein, provides the advantage that a competition of the local controllers can be avoided.

[00127] A further advantage is that an operator may interact with the central controller directly. It may not be necessary for the operator to interact with the plurality of local controllers. In light thereof, the control procedure can be simplified.

[00128] A further advantage is that the coordinate transformation to the central coordinate system allows determining whether the components of the apparatus, such as e.g. the plurality of magnetic units, the magnetic driving system, the safety bearings, and the like, are well aligned with respect to each other. Any misalignment of these components can be detected and corrected, so that errors in the magnetic levitation can be prevented.

[00129] A further advantage is that the central controller may be used to calculate whether a given position of the substrate arrangement or mask arrangement is feasible during contactless levitation or whether such a position would lead to a contact or even a collision with the magnetic driving system or the safety bearings. In light thereof, it may be ensured that the contactless levitation, alignment and transportation process can be performed without errors.

[00130] According to a further embodiment, a method is provided. The method includes contactlessly levitating a first arrangement. The first arrangement is one of a substrate arrangement 210 including a substrate 10 and a mask arrangement 220 including a masking device 20. The method includes contactlessly aligning the first arrangement with an alignment precision of 500 μιη or lower, more particularly 100 μιη or lower, or even 20 μιη or lower. In some implementations, an even higher contactless alignment precision can be provided, such as an alignment precision of 5 μιη or lower, more particularly 1 μιη or lower, or even 0.1 μιη or lower.

[00131] A first arrangement as described herein may be one of the substrate arrangement 210 and the mask arrangement 220 as described herein. The features and aspects described herein in relation to the substrate arrangement 210 can also be applied to the first arrangement. The features and aspects described herein in relation to the mask arrangement 220 can also be applied to the first arrangement.

[00132] A first arrangement as described herein may be provided in a substantially vertical orientation during the contactlessly levitating the first arrangement. [00133] A method as described herein may include measuring a position of the first arrangement using a first position sensor 1552 as described herein, e.g. first position sensor 1552 as shown in Fig. 15.

[00134] Measuring a position of the first arrangement may include measuring a vertical position of the first arrangement. Measuring a position may include measuring a distance, particularly a vertical distance, such as a distance from the first position sensor 1552 to the first arrangement.

[00135] Measuring a position of the first arrangement may include measuring a plurality of distances, e.g. vertical distances, such as e.g. 2, 3, 4, 5, 6 or even more distances. A plurality of distances for the first arrangement can be measured by a plurality of position sensors 1450 as described herein.

[00136] A position of the first arrangement may be measured while the first arrangement is contactlessly levitated. A contactless alignment of the first arrangement may be provided based at least on a measured position of the first arrangement.

[00137] Contactlessly aligning the first arrangement may include controlling and/or adjusting a position of the first arrangement without contacting the first arrangement.

[00138] Contactlessly aligning the first arrangement may include at least one of: vertically aligning the first arrangement; horizontally aligning the first arrangement; angularly aligning the first arrangement; or any combination thereof. [00139] Contactlessly aligning the first arrangement may include controlling and/or adjusting at least one magnetic levitation force acting on the first arrangement. The at least one magnetic levitation force may be provided by the plurality of magnetic units 700 as described herein. Providing a contactless alignment may include controlling and/or adjusting a plurality of magnetic levitation forces acting on the first arrangement. For example, two, three or even more magnetic levitation forces acting jointly on the first arrangement may be controlled and/or adjusted for providing a contactless alignment.

[00140] An alignment of the first arrangement may be provided exclusively in a contactless manner.

[00141] A method as described herein may include measuring a plurality of local coordinates of the first arrangement while the first arrangement is contactlessly levitated. The plurality of local coordinates of the first arrangement may be controlled by a plurality of local controllers 1420 as described herein.

[00142] The method may include mapping the measured plurality of local coordinates to a central coordinate system. Mapping the measured plurality of local coordinates of the first arrangement to the central coordinate system may include performing a coordinate transformation. The central coordinate system may provide coordinates for the first arrangement in terms of six degrees of freedom of the first arrangement.

[00143] Providing a contactless alignment may include aligning the first arrangement in the central coordinate system. The method may include controlling a position of the first arrangement in the central coordinate system.

[00144] A method as described herein may include contactlessly levitating a second arrangement. The second arrangement may be the other one of the substrate arrangement 210 and the mask arrangement 220. For example, the first arrangement may be the substrate arrangement 210 and the second arrangement may be the mask arrangement 220, or vice versa.

[00145] The method may include contactlessly aligning the second arrangement. The method may include controlling and/or adjusting a position of the second arrangement without contacting the second arrangement. [00146] The second arrangement may be contactlessly aligned with an alignment precision in the numerical ranges according to embodiments described herein.

[00147] The second arrangement may be the substrate arrangement 210 or the mask arrangement 220. The features and aspects described herein in relation to the substrate arrangement 210 can also be applied to the second arrangement. The features and aspects described herein in relation to the mask arrangement 220 can also be applied to the second arrangement.

[00148] According to a further embodiment, as illustrated in e.g. Figs. 7a-b, an apparatus 701 is provided. The apparatus 701 includes a magnetic levitation system including a plurality of magnetic units 700. The plurality of magnetic units 700 are adapted for contactlessly levitating a substrate arrangement 210 comprising a substrate 10 and a mask arrangement 220 comprising a masking device 20. The apparatus is configured for contactlessly aligning the substrate arrangement 210 and the mask arrangement 220 relative to each other. [00149] An apparatus 701 as described herein may be configured for aligning the substrate arrangement 210 and the mask arrangement 220 relative to each other, wherein the aligning is performed exclusively in a contactless manner.

[00150] An apparatus 701 as described herein may be configured for contactlessly levitating the substrate arrangement 210 and/or the mask arrangement 220 in a substantially vertical orientation.

[00151] An apparatus 701 as described herein may be configured for providing a contactless alignment with an alignment precision of 500 μιη or lower, more particularly 100 μιη or lower, or even 20 μιη or lower. In some implementations, an even higher contactless alignment precision can be provided, such as an alignment precision of 5 μιη or lower, more particularly 1 μιη or lower, or even 0.1 μιη or lower.

[00152] An apparatus 701 as described herein may include the substrate arrangement 210 and/or the mask arrangement 220. [00153] A plurality of magnetic units 700 as described herein may be configured for providing at least one magnetic levitation force, particularly a plurality of magnetic levitation forces, acting on the substrate arrangement 210. Additionally or alternatively, a plurality of magnetic units 700 may be configured for providing at least one magnetic levitation force, particularly a plurality of magnetic levitation forces, acting on the mask arrangement 220.

[00154] Each magnetic unit of the plurality of magnetic units 700 may be an active magnetic unit. The plurality of magnetic units 700 may be a plurality of active magnetic units. An active magnetic unit may be configured for generating a magnetic field for providing a magnetic levitation force extending in a vertical direction, e.g. the y-direction shown in the figures. An active magnetic unit can be controlled to provide an adjustable magnetic field. The adjustable magnetic field may be a static or a dynamic magnetic field. An active magnetic unit may be or include an element selected from the group consisting of: an electromagnetic device; a solenoid; a coil; a superconducting magnet; or any combination thereof.

[00155] The terminology of an "active" magnetic unit is used herein to distinguish from the notion of a "passive" magnetic unit. A passive magnetic unit may refer to an element with magnetic properties, which are not subject to active control or adjustment, at least not during operation of the apparatus. For example, the magnetic properties of a passive magnetic unit may not be subject to active control during contactless levitation of the mask assembly. A passive magnetic unit may be a magnetic material, such as a ferromagnetic material, a permanent magnet or may have permanent magnetic properties.

[00156] As compared to a passive magnetic unit, an active magnetic unit offers more flexibility and precision in light of the adjustability and controllability of the magnetic field generated by the active magnetic unit.

[00157] The plurality of magnetic units 700 may be arranged such that, during contactless levitation of the substrate arrangement 210, the plurality of magnetic units 700 are above the substrate arrangement 210. Additionally or alternatively, the plurality of magnetic units 700 may be arranged such that, during contactless levitation of the mask arrangement 220, the plurality of magnetic units 700 are above the mask arrangement 220. [00158] The plurality of magnetic units 700 may include one or more first magnetic units 710 and/or one or more second magnetic units 720 as described herein. The one or more first magnetic units 710 may be configured for contactlessly levitating the substrate arrangement 210. The one or more second magnetic units 720 may be configured for contactlessly levitating the mask arrangement 220.

[00159] The plurality of magnetic units 700 may extend in a first direction, e.g. the x- direction. The one or more first magnetic units 710 may extend in the first direction. The one or more second magnetic units 720 may extend in the first direction. The one or more first magnetic units 710 and the one or more second magnetic units 720 may be two linear arrays of magnetic units arranged side by side.

[00160] The plurality of magnetic units 700 may include 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, up to 24 or even more magnetic units. The one or more first magnetic units 710 may include 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12 or even more magnetic units. The one or more second magnetic units 720 may include 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12 or even more magnetic units.

[00161] An apparatus 701 as described herein may include one or more position sensors. The one or more position sensors may be configured for measuring a position of the substrate arrangement 210 and/or for measuring a position of the mask arrangement 220.

[00162] A position sensor, as described herein, may be configured for measuring a position of an arrangement, e.g. the substrate arrangement 210 or the mask arrangement 220. The position may be measured during contactless levitation of the arrangement. A position sensor may be configured for measuring a distance, e.g. a vertical distance. A position sensor can be a distance sensor.

[00163] A position sensor as described herein may be configured for measuring a position and/or a distance with a high precision. According to embodiments, which can be combined with other embodiments described herein, a position sensor precision of 1 μιη or below, particularly 0.5 μιη or below, more particularly 0.1 μιη or below, may be provided. For example, in some implementations, a position sensor precision of 305 nm or even 153 nm can be provided. [00164] The term "high-precision position sensor", as described herein, may refer to a position sensor having a position sensor precision of 1 μιη or below, particularly 0.5 μιη or below, more particularly 0.1 μιη or below.

[00165] A position sensor precision, as described herein, may be a position sensor resolution. A position sensor precision or resolution may be measured in length units (e.g. μιη) per Digital Signal Processor Unit (DSPU). Therein, DSPU may relate to steps in the position signal as seen by the control algorithm. For example, according to embodiments described herein, a position sensor may have a position sensor precision or position sensor resolution of 1 μητ/DSPU or below, particularly 0.5 μητ/DSPU or below, more particularly 0.1 μητ/DSPU or below. Depending on the implementation, a position sensor precision may be different from an alignment precision.

[00166] A position sensor, as described herein, may be provided with an analog to digital converter. The analog to digital converter may be connected to the position sensor. The analog to digital converter may be integrated with the position sensor or separated from the position sensor. A position sensor, particularly a high-precision position sensor, may be provided with e.g. a 16-bit analog to digital converter.

[00167] A position sensor, as described herein, may have a measurement range. The measurement range of a position sensor, particularly a high-precision position sensor, may be 10 mm or below. [00168] The one or more position sensors, as described herein, may be arranged such that, during contactless levitation of the substrate arrangement 210, the one or more position sensors are above the substrate arrangement 210. The one or more position sensors may be arranged such that, during contactless levitation of the mask arrangement 220, the one or more position sensors are above the mask arrangement 220. [00169] During contactless levitation of the substrate arrangement 210, one, two, or more position sensors of the one or more position sensors may face the substrate arrangement 210. During contactless levitation of the mask arrangement 220, one, two, or more position sensors of the one or more position sensors may face the mask arrangement 220. [00170] The one or more position sensors as described herein may be or include a plurality of position sensors 1450. A plurality of position sensors 1450 may include 2, 3, 4, 5, 6, 7, 8, 9, 10, or even more position sensors. The plurality of position sensors 1450 may be configured for measuring a plurality of distances, e.g. vertical distances. Each position sensor of the plurality of position sensors may be configured for measuring a vertical distance from a magnetic unit of the plurality of magnetic units 700 to the contactlessly levitated substrate arrangement 210 and/or to the contactlessly levitated mask arrangement 220.

[00171] The plurality of position sensors 1450 may be connected to the plurality of magnetic units 700. Each position sensor of the plurality of position sensors 1450 may be connected to a respective magnetic unit of the plurality of magnetic units 700.

[00172] The plurality of position sensors 1450 may include one or more first position sensors 950 as described herein and/or one or more second position sensors 960 as described herein. The one or more first position sensors may include 2, 3, 4, 5, 6, 7, 8, 9, 10, or even more position sensors. The one or more second position sensors 960 may include 2, 3, 4, 5, 6, 7, 8, 9, 10, or even more position sensors.

[00173] The one or more first position sensors 950 may be configured for measuring a position of the substrate arrangement 210. For example, each position sensor of the one or more first position sensors 950 may be configured for measuring a vertical distance from a magnetic unit of the plurality of magnetic units 700 to the contactlessly levitated substrate arrangement 210. The one or more second position sensors 960 may be configured for measuring a position of the mask arrangement 220. For example, each position sensor of the one or more second position sensors 960 may be configured for measuring a vertical distance from a magnetic unit of the plurality of magnetic units 700 to the contactlessly levitated mask arrangement 220.

[00174] Each position sensor of the plurality of position sensors 1450 may be connected to a respective magnetic unit of the plurality of magnetic units 700.

[00175] At least one, two, three or four position sensors, or even each position sensor, of the plurality of position sensors 1450 may have a position sensor precision in the numerical ranges according to embodiments described herein, e.g. a position sensor precision of 1 μιη or below, particularly 0.5 μιη or below, more particularly 0.1 μιη or below. By measuring a position of the substrate arrangement 210 and/or the mask arrangement 220 with a high precision, a contactless alignment with high precision can be provided, such that no additional mechanical alignment devices are needed.

[00176] An apparatus 701 as described herein may include a control unit 1400. The control unit 1400 may be connected to the plurality of magnetic units 700. The control unit 1400 may be configured for controlling the plurality of magnetic units 700 to provide a contactless alignment as described herein. The control unit 1400 may be configured for controlling the position of the substrate arrangement 210 and/or of the mask arrangement 220.

[00177] The control unit 1400 may be configured for receiving measured data regarding a position of the contactlessly levitated substrate arrangement 210 and/or a position of the contactlessly levitated mask arrangement 220. The position may be measured by one or more position sensors as described herein.

[00178] The control unit 1400 may be configured for controlling one or more, e.g. two, three, four or more, magnetic levitation forces acting on the substrate arrangement 210. The control unit 1400 may be configured for controlling one or more, e.g. two, three, four or more, magnetic levitation forces acting on the mask arrangement 220. By controlling the magnetic levitation forces, a contactless alignment according to embodiments described herein can be provided.

[00179] The control unit 1400 may include a plurality of local controllers 1420 as described herein. The plurality of local controllers 1420 may be connected to the plurality of magnetic units 700. Each local controller of the plurality of local controllers 1420 may be connected to a respective magnetic unit of the plurality of magnetic units 700. The plurality of local controllers 1420 may be connected to the plurality of position sensors 1450. Each local controller of the plurality of local controllers 1420 may be connected to a respective position sensor of the plurality of position sensors 1450. [00180] The plurality of local controllers 1420 may be configured for receiving a plurality of local coordinates measured by the plurality of position sensors 1450. The plurality of local controllers 1420 may be configured for receiving a plurality of local coordinates of the mask arrangement 220 and/or a plurality of local coordinates of the substrate arrangement 210 during contactless levitation. Each local controller may be configured for receiving a local coordinate, e.g. a measured position or distance, measured by a respective position sensor connected to the local controller. Based on at least the measured local coordinate, the local controller may control and/or adjust a magnetic levitation force provided by a magnetic unit connected to the local controller. In light thereof, the position of the substrate arrangement 210 and/or the mask arrangement 220 may be controlled by the control unit 1400 to provide a contactless alignment according to embodiments described herein.

[00181] The control unit 1400 may include a central controller 1410. The central controller 1410 may be connected to the plurality of local controllers 1420. The central controller 1410 may control the plurality of local controllers 1420 by a control cascade. The central controller 1410 may be configured for receiving a plurality of local coordinates of the substrate arrangement 210 and/or a plurality of local coordinates of the mask arrangement 220. The central controller 1410 may be configured for mapping the plurality of local coordinates to a central coordinate system as described herein. The central controller 1410 may be configured for controlling the contactless alignment of the substrate arrangement 210 relative to the mask arrangement 220 in the central coordinate system.

[00182] An apparatus 701 as described herein may include a support structure 1300. The support structure 1300 may be configured for at least one of the following: Supporting the substrate arrangement 210; supporting the mask arrangement 220; providing the substrate arrangement 210 in a position adjacent to the mask arrangement 220, particularly while the substrate arrangement 210 and/or the mask arrangement 220 are supported by the support structure 1300; or any combination thereof. The support provided by the support structure 1300 is a mechanical support. [00183] The support structure 1300 may not be configured for performing an alignment operation of the substrate arrangement 210 relative to the mask arrangement 220. [00184] The support structure 1300 may be arranged in a fixed position in a processing chamber. For example, the support structure may be fixed to a chamber wall of the processing chamber.

[00185] The support structure 1300 may include one or more first engaging elements 1310, e.g. one or more conically shaped pins extending in a substantially horizontal direction. The one or more first engaging elements 1310 may be configured for engaging the substrate arrangement 210. The one or more first engaging elements 1310 may be configured for engaging one or more first receiving portions 1312 of the substrate arrangement 210, e.g. openings provided in the substrate carrier. [00186] The support structure 1300 may include one or more second engaging elements 1320, e.g. one or more conically shaped pins extending in a substantially horizontal direction. The one or more second engaging elements 1320 may be configured for engaging the mask arrangement 220. The one or more second engaging elements 1320 may be configured for engaging one or more second receiving portions 1322 of the mask arrangement 220, e.g. openings provided in the mask carrier.

[00187] An apparatus 701 as described herein may include a processing chamber 1790. The processing chamber 1790 may be a vacuum chamber. Any of the following, and any combination of the following, may be arranged in the processing chamber: the plurality of magnetic units 700; any position sensor described herein; the substrate arrangement 210; the mask arrangement 220; the support structure 1300; and the magnetic driving system 1210.

[00188] An apparatus 701 as described herein may include a magnetic driving system 1210. The magnetic driving system 1210 may be arranged below the plurality of magnetic units 700. The magnetic driving system 1210 may extend in a direction substantially parallel to the plurality of magnetic units 700. The magnetic driving system 1210 may be configured for magnetically driving at least one of the substrate arrangement 210 and the mask arrangement 220, particularly in a substantially horizontal direction, e.g. in the x- direction as described herein. The magnetic driving system 1210 may be connected to the control unit 1400. [00189] Fig. 15 shows an apparatus 701 according to embodiments described herein. The apparatus 701 shown in Fig. 15 includes a magnetic levitation system including a plurality of magnetic units 700. The exemplary plurality of magnetic units 700 shown in Fig. 15 includes magnetic units 1532, 1534 and 1536. The plurality of magnetic units 700 are adapted for contactlessly levitating an arrangement 1000. The arrangement 1000 may be a substrate arrangement 210 as described herein or a mask arrangement 220 as described herein. The plurality of magnetic units 700 may be adapted for contactlessly levitating both the substrate arrangement 210 and the mask arrangement 220 jointly.

[00190] As shown in Fig. 15, the apparatus 701 may include a first position sensor 1552. The first position sensor 1552 may be connected to a first magnetic unit 1532 of the plurality of magnetic units 700. The first position sensor 1552 may be a high-precision position sensor. The first position sensor may have a position sensor precision of 1 μιη or below, particularly 0.5 μιη or below, more particularly 0.1 μιη or below. The first position sensor 1552 may be configured for measuring a vertical position, e.g. a height, of the arrangement 1000 while the arrangement 1000 is contactlessly levitated.

[00191] Based on the high-precision position data provided by the first position sensor 1552, a high-precision alignment of the arrangement 1000 can be provided by controlling the plurality of magnetic units 700 in response to the position measurement performed by the first position sensor 1552. The control may be provided by a control unit 1400 (not shown in Fig. 15) as described herein. The precision of the contactless alignment obtained in this manner can be an alignment precision in the numerical ranges according to embodiments described herein. The high precision of the contactless alignment eliminates the need for an additional mechanical alignment.

[00192] According to a further embodiment, an apparatus 701 is provided. The apparatus 701 includes a magnetic levitation system including a plurality of magnetic units 700 configured for contactlessly levitating at least one of a substrate arrangement including a substrate and a mask arrangement including a masking device. The apparatus 701 includes a first position sensor 1552 connected to a first magnetic unit 1532 of the plurality of magnetic units 700. The first position sensor 1552 is configured for measuring a position with a precision of 1 μιη or below, particularly 0.5 μιη or below, more particularly 0.1 μιη or below. [00193] A magnetic levitation system as described herein may be configured for contactlessly levitating the substrate arrangement 210 and the mask arrangement 220.

[00194] A first position sensor 1552 as described herein may be configured for measuring a position of a substrate arrangement 210 and/or for measuring a position of a mask arrangement 220.

[00195] The first position sensor 1552 may be connected to a plurality of magnetic units 700 as described herein.

[00196] The first position sensor 1552 may be arranged such that, during contactless levitation of the substrate arrangement 210, the first position sensor 1552 is above the substrate arrangement 210. The first position sensor 1552 may be arranged such that, during contactless levitation of the mask arrangement 220, the first position sensor 1552 is above the mask arrangement 220.

[00197] The first position sensor 1552 may be a position sensor of a plurality of position sensors 1450 as described herein. The first position sensor 1552 may be a position sensor of one or more first position sensors 950 as described herein. The first position sensor 1552 may be a position sensor of one or more second position sensors 960 as described herein.

[00198] The first position sensor 1552 may be configured for measuring a position of the substrate arrangement 210. An apparatus 701 as described herein may include a further position sensor. The further position sensor may be configured for measuring a position of the mask arrangement 220. The further position sensor may have a position sensor precision of 1 μιη or below, particularly 0.5 μιη or below, more particularly 0.1 μιη or below. The further position sensor may be a high-precision position sensor as described herein.

[00199] The first position sensor 1552 may be connected to a control unit 1400 as described herein. The control unit 1400 may be configured for controlling the contactless alignment of the substrate arrangement 210 and the mask arrangement 220 relative to each other based on measured data provided by the first position sensor 1552. [00200] The control unit 1400 may be configured for receiving measured data regarding a position of the contactlessly levitated substrate arrangement 210 and/or a position of the contactlessly levitated mask arrangement 220. At least part of the measured data may be measured by the first position sensor 1552. The measured data may be provided to the control unit 1400 by the first position sensor 1552. Based on the measured data, the control unit 1400 can provide a contactless alignment of the substrate arrangement 210 and/or the mask arrangement 220.

[00201] In light of the high-precision position data provided by the first position sensor 1552, a high-precision contactless alignment can be provided. No additional mechanical alignment may be needed.

[00202] The first position sensor 1552 may be connected to a local controller of a plurality of local controllers 1420 as described herein. The local controller may be connected to the first magnetic unit 1532 connected to the first position sensor 1552. The local controller may be configured for receiving a local coordinate, e.g. a position or distance, measured by the first position sensor 1552. The local coordinate may be a local coordinate of the substrate arrangement 210 and/or of the mask arrangement 220. Based on at least the measured local coordinate, the local controller may control and/or adjust a magnetic levitation force provided by the first magnetic unit 1532 connected to the first position sensor 1552. In light thereof, the position of the substrate arrangement 210 and/or the mask arrangement 220 may be controlled by the control unit 1400 to provide a contactless alignment as described herein. The local controller connected to the first position sensor 1552 may be connected to a central controller 1410 as described herein.

[00203] Figs. 16a-b show an apparatus 701 according to embodiments described herein. The apparatus 701 includes a plurality of magnetic units 700. The exemplary plurality of magnetic units 700 includes a first magnetic unit 1532 and a second magnetic unit 1636. As shown, the plurality of magnetic units 700 may include further magnetic units 1630, 1634, 1638. As shown, the second magnetic unit 1636 may be at a distance from the first magnetic unit 1532 in a substantially horizontal direction, e.g. the x-direction. [00204] As shown in Figs. 16a-b, the apparatus 701 may include an arrangement 1000 as described herein. The plurality of magnetic units 700 are configured for contactlessly levitating the arrangement 1000.

[00205] As shown in Figs. 16a-b, the apparatus 701 may include a first position sensor 1552. The first position sensor 1552 may be configured for measuring a position, e.g. a vertical position of the contactlessly levitated arrangement 1000, with a first precision. The first precision may be 1 μιη or below, particularly 0.5 μιη or below, more particularly 0.1 μιη or below. The first position sensor 1552 may be a high-precision position sensor as described herein. As shown in Figs. 16a-b, the first position sensor 1552 may be connected to the first magnetic unit 1532.

[00206] As shown in Figs. 16a-b, the apparatus 701 may include a second position sensor 1656. The second position sensor 1656 may be configured for measuring a position, e.g. a vertical position of the contactlessly levitated arrangement 1000, with a second precision. The second precision may be different from the first precision. The second precision may be lower than the first precision. The second position sensor 1656 may not be a high-precision position sensor as described herein. The second precision may be at least 1.2 μιη, particularly at least 1.4 μιη, such as e.g. 1.456 μιη. Alternatively and/or additionally, the second precision may be 2 μιη or below. As shown in Figs. 16a-b, the second position sensor 1656 may be connected to the second magnetic unit 1636. As shown, the second position sensor 1656 may be at a distance from the first position sensor 1552 in a substantially horizontal direction, e.g. the X-direction.

[00207] The second position sensor, having a precision which is lower than the first precision, may have the advantage that it is less expensive and saves costs as compared to a high-precision sensor. [00208] The second position sensor 1656 may have a measurement range of 4 mm or below. The second position sensor 1656 may be provided with an analog to digital convertor having e.g. a 12 bit resolution.

[00209] The first position sensor 1552 and/or the second position sensor 1656 may be connected to a control unit 1400 (not shown in Figs. 16a-b) as described herein. [00210] Fig. 16a shows the arrangement 1000 in a state of contactless levitation. In the exemplary configuration shown in Fig. 16a, the arrangement 1000 is contactlessly levitated by the magnetic units 1630, 1532, 1634. The first position sensor 1552 faces the contactlessly levitated arrangement 1000. The first position sensor 1552 may be used for measuring the position of the contactlessly levitated arrangement 1000 with high precision. The high-precision position data may be used for providing a high-precision contactless alignment of the arrangement 1000 according to embodiments described herein. Based on the high-precision position data, a high-precision alignment can be provided without using any mechanical alignment devices. [00211] Fig. 16b shows the arrangement 1000 in a state of contactless levitation. In the exemplary configuration shown in Fig. 16b, the arrangement 1000 is contactlessly levitated by the magnetic units 1634, 1636, 1638. As compared to the configuration shown in Fig. 16a, the arrangement 1000 shown in Fig. 16b has been moved in a transport direction defined by the plurality of magnetic units 700, e.g. the x-direction. The arrangement 1000 can be moved in the transport direction in a contactless manner by a magnetic driving system (not shown in Figs. 16a-b) as described herein.

[00212] The contactlessly levitated arrangement 1000 shown in Fig. 16b faces the second position sensor 1656. The second position sensor 1656 may be used for measuring the position of the contactlessly levitated arrangement 1000. The measured position may be used for controlling the contactless levitation and/or transportation of the arrangement 1000 at the location of the second position sensor 1656. At the location of the second position sensor 1656, the apparatus 701 may not be configured for providing a high- precision contactless alignment of the arrangement 1000.

[00213] In light of the above, the apparatus shown in Figs. 16a-b has a designated region including one or more high-precision sensors, e.g. the first precision sensor 1552, for providing the high-precision contactless alignment as described herein. In other regions of the apparatus, the apparatus is solely configured for providing contactless levitation and transportation, not for providing a high-precision contactless alignment. In the latter regions, one or more position sensors of lower precision can be used, such as the second position sensor 1656, which has the advantage that costs can be saved. Accordingly, by having regions including high-precision sensors and other regions having position sensors of lower precision, embodiments described herein provide a combination of both a high- precision contactless alignment and the saving of costs.

[00214] According to a further embodiment, an apparatus 701 is provided. The apparatus 701 includes a plurality of magnetic units 700 including at least a first magnetic unit 1532 and a second magnetic unit 1636. The plurality of magnetic units 700 are configured for contactlessly levitating at least one of a substrate arrangement 210 including a substrate 10 and a mask arrangement 220 including a masking device 20. The apparatus 701 includes a first position sensor 1552 connected to the first magnetic unit 1532. The first position sensor 1552 is configured for measuring a position with a first precision. The apparatus 701 includes a second position sensor 1656 connected to the second magnetic unit 1636, the second position sensor 1656 being configured for measuring a position with a second precision. The second precision is different from the first precision.

[00215] An apparatus 701 as described herein may be configured for contactless transportation of the substrate arrangement 210 and/or the mask arrangement 220. The contactless transportation may be provided in a transport direction, e.g. the x-direction shown in the figures. The transport direction may be a substantially horizontal direction. [00216] The plurality of magnetic units 700 may be arranged in the transport direction. The first magnetic unit 1532 and the second magnetic unit 1636 may be spaced apart from each other in the transport direction. The first position sensor 1552 and the second position sensor 1656 may be spaced apart from each other in the transport direction. [00217] The first position sensor 1552 may be a high-precision position sensor. The first precision of the first position sensor 1552 may be higher than the second precision of the second position sensor 1656.

[00218] At the location of first magnetic unit 1532, an apparatus 701 as described herein may be configured for providing a contactless alignment of the substrate arrangement 210 and the mask arrangement relative to each other. The apparatus 701 may be configured for providing a contactless alignment of the substrate arrangement 210 and the mask arrangement relative to each other based on measurement data provided by the first position sensor 1552. [00219] At the location of the second magnetic unit 1636, the apparatus 701 may be configured for providing a contactless levitation and/or transportation of the substrate arrangement 210 and/or of the mask arrangement. At the second magnetic unit, the apparatus 701 may not be configured for providing a high-precision contactless alignment. The apparatus 701 may be configured for providing a contactless levitation and/or transportation of the substrate arrangement 210 and/or of the mask arrangement based on measurement data provided by the second position sensor 1656.

[00220] An apparatus 701 as described herein may include 2, 3, 4, 5, 6 or more high- precision position sensors.

[00221] An apparatus 701 as described herein may include 2, 3, 4, 5, 6 or more position sensors having a position sensor precision of at least 1.2 μιη, particularly at least 1.4 μιη, such as e.g. 1.456 μιη, e.g. position sensors for providing a contactless levitation and/or transportation of the substrate arrangement 210 and the mask arrangement 220.

[00222] An apparatus 701 as described herein may be configured for performing any of the method features described herein. [00223] Figs. 17a-b show an apparatus 701 according to embodiments described herein. Fig. 17a shows a front view of the apparatus 701. Fig. 17b shows a top view of the apparatus 701. The apparatus 701 is configured for providing a high-precision contactless alignment of the substrate arrangement 210 and the mask arrangement 220 relative to each other. [00224] The apparatus 701 shown in Figs. 17a-b includes a plurality of magnetic units 700. As shown in Fig. 17b, the plurality of magnetic units 700 may include one or more first magnetic units 710. The one or more first magnetic units 710 are not visible in Fig. 17a. The one or more first magnetic units 710 may be adapted for contactlessly levitating the substrate arrangement 210. The exemplary one or more first magnetic units 710 shown in Fig. 17b include magnetic units 1742, 1744, 1746, 1748.

[00225] As shown in Figs. 17a-b, the plurality of magnetic units 700 may include one or more second magnetic units 720. The one or more second magnetic units 720 may be adapted for contactlessly levitating the mask arrangement 220. The exemplary one or more second magnetic units 720 shown in Figs. 17a-b include magnetic units 1732, 1734, 1736, 1738.

[00226] The apparatus 701 may include a plurality of position sensors. As shown in Fig. 17b, the plurality of position sensors may include one or more first position sensors 950 connected to the one or more first magnetic units 710. The exemplary one or more first position sensors 950 shown in Fig. 17b include position sensors 1762, 1764, 1766 and 1768 connected to magnetic units 1742, 1744, 1746 and 1748, respectively. The one or more first position sensors 950 may be configured for measuring a position of the substrate arrangement 210 while the substrate arrangement 210 is contactlessly levitated by the one or more first magnetic units 710. [00227] As shown in Fig. 17b, the plurality of position sensors may include one or more second position sensors 960 connected to the one or more second magnetic units 720. The one or more second position sensors 960 shown in Fig. 17b include position sensors 1752, 1754, 1756 and 1758 connected to magnetic units 1732, 1734, 1736 and 1738, respectively. The one or more second position sensors 960 may be configured for measuring a position of the mask arrangement 220 while the mask arrangement 220 is contactlessly levitated by the one or more second magnetic units 720.

[00228] The plurality of position sensors may include one or more high-precision sensors. The apparatus shown in Figs. 17a-b includes position sensors 1762 and 1764, which are configured for measuring a position of the contactlessly levitated substrate arrangement 210 with high precision. The apparatus shown in Figs. 17a-b includes position sensors 1752 and 1754, which are configured for measuring a position of the contactlessly levitated mask arrangement 220 with high precision. Based on measured position data provided by the position sensors 1762, 1764, 1752 and 1754, a contactless alignment of the substrate arrangement 210 and the mask arrangement 220 relative to each other can be provided with a high alignment precision. The contactless alignment can be controlled by a control unit 1400 (not shown in Fig. 17a-b), which may include a plurality of local controllers and/or a central controller, as described herein.

[00229] Based on measured position data provided by the position sensors 1766, 1768, 1756 and 1758, a contactless levitation and/or transportation of the substrate arrangement 210 and the mask arrangement 220 can be provided. The position sensors 1766, 1768, 1756 and 1758 may not be high-precision position sensors for providing a high-precision contactless alignment.

[00230] As shown in Fig 17a, the apparatus 701 may include a magnetic driving system 1210 as described herein. During contactless levitation, the substrate arrangement 210 and/or the mask arrangement 220 are above the magnetic driving system 1210.

[00231] As shown in Figs. 17a-b, the apparatus 701 may include a processing chamber 1790, which may be a vacuum chamber. As shown, the plurality of magnetic units 700 may be arranged in the processing chamber 1790. The plurality of position sensors may be arranged in the processing chamber 1790. The magnetic driving system 1210 may be arranged in the processing chamber 1790. During contactless levitation, transportation and/or alignment, the substrate arrangement 210 and/or the mask arrangement 220 may be in the processing chamber 1790.

[00232] While the foregoing is directed to embodiments of the disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

1. A method, comprising: contactlessly levitating a substrate arrangement (210) comprising a substrate (10); contactlessly levitating a mask arrangement (220) comprising a masking device

(20) configured for masking the substrate; and contactlessly aligning the substrate arrangement and the mask arrangement relative to each other.

2. The method of claim 1, wherein the substrate arrangement and/or the mask arrangement are contactlessly levitated in a substantially vertical orientation.

3. The method of any of claims 1 or 2, wherein an alignment of the substrate arrangement and the mask arrangement relative to each other is provided exclusively in a contactless manner.

4. The method of any of claims 1 to 3, wherein the contactlessly aligning comprises at least one of the following:

controlling at least one magnetic levitation force acting on the substrate arrangement to provide a contactless alignment; and

controlling at least one magnetic levitation force acting on the mask arrangement to provide a contactless alignment.

5. The method of any of claims 1 to 4, the method further comprising at least one of the following:

measuring a plurality of local coordinates (1472, 1474, 1476) of the substrate arrangement while the substrate arrangement is contactlessly levitated; and

measuring a plurality of local coordinates (1472, 1474, 1476) of the mask arrangement while the mask arrangement is contactlessly levitated.

6. The method of claim 5, the method further comprising: mapping the measured plurality of local coordinates of the substrate arrangement and/or the measured plurality of local coordinates of the mask arrangement to a central coordinate system; and

controlling the alignment of the substrate arrangement and the mask arrangement relative to each other in the central coordinate system.

7. The method of any of claims 1 to 6, the method further comprising:

connecting the substrate arrangement to the mask arrangement.

8. A method, comprising:

contactlessly levitating a first arrangement, the first arrangement being one of a substrate arrangement (210) comprising a substrate (10) and a mask arrangement (220) comprising a masking device (20); and contactlessly aligning the first arrangement with an alignment precision of 500 μιη or below.

9. The method of claim 8, wherein the first arrangement is contactlessly levitated in a substantially vertical orientation.

10. The method of any of claims 8 or 9, wherein the contactlessly aligning the first arrangement comprises controlling at least one magnetic levitation force acting on the first arrangement to provide a contactless alignment.

11. The method of any of claims 8 to 10, the method further comprising at least one of the following: measuring a plurality of local coordinates (1472, 1474, 1476) of the first arrangement while the first arrangement is contactlessly levitated; mapping the measured plurality of local coordinates to a central coordinate system; and controlling the alignment of the first arrangement in the central coordinate system.

12. An apparatus (701), comprising: a magnetic levitation system comprising a plurality of magnetic units (700), the plurality of magnetic units being configured for contactlessly levitating a substrate arrangement (210 comprising a substrate (10) and a mask arrangement (220) comprising a masking device (20), the apparatus being configured for contactlessly aligning the substrate arrangement and the mask arrangement relative to each other.

13. An apparatus (701), comprising: a magnetic levitation system comprising a plurality of magnetic units (700) configured for contactlessly levitating at least one of a substrate arrangement (210) comprising a substrate (10) and a mask arrangement (220) comprising a masking device (20); and a first position sensor (1552) connected to a first magnetic unit (1532) of the plurality of magnetic units, the first position sensor being configured for measuring a position with a precision of 1 μιη or below.

14. An apparatus (701), comprising:

a plurality of magnetic units (700) comprising at least a first magnetic unit (1532) and a second magnetic unit (1636), the plurality of magnetic units being configured for contactlessly levitating at least one of a substrate arrangement (210) comprising a substrate (10) and a mask arrangement (220) comprising a masking device (20);

a first position sensor (1552) connected to the first magnetic unit (1532), the first position sensor being configured for measuring a position with a first precision;

a second position sensor (1656) connected to the second magnetic unit, the second position sensor being configured for measuring a position with a second precision, the second precision being different from the first precision.

15. The apparatus of claim 13 or 14, the apparatus being configured for contactlessly aligning the substrate arrangement and the mask arrangement relative to each other, based at least on position data provided by the first position sensor.

16. The apparatus of claim 12, the apparatus further comprising: a control unit (1400) connected to the plurality of magnetic units, the control unit being configured for controlling the plurality of magnetic units to provide a contactless alignment of the substrate arrangement and the mask arrangement relative to each other.

17. The apparatus of any of claims 13, 14 or 15, the apparatus further comprising: a control unit (1400) connected to the plurality of magnetic units and to the first position sensor, the control unit being configured for controlling the plurality of magnetic units to provide a contactless alignment of the substrate arrangement and the mask arrangement relative to each other.

18. The apparatus of any of claims 16 or 17, wherein the control unit comprises at least one of: a plurality of local controllers (1420) connected to the plurality of magnetic units; and a central controller (1410), the central controller being connected to the plurality of local controllers, the central controller being configured for mapping a plurality of local coordinates (1472, 1474, 1476) to a central coordinate system and particularly for controlling the alignment of the substrate arrangement relative to the mask arrangement in the central coordinate system.

19. The apparatus of any of claims 12 to 18, wherein the plurality of magnetic units comprises one or more first magnetic units (710) configured for contactlessly levitating the substrate arrangement and one or more second magnetic units (720) configured for contactlessly levitating the mask arrangement.

20. The method of any of claims 1 to 11 or the apparatus of any of claims 12 to 19, wherein the masking device is a shadow mask.