WO2019080597A1 - 一种瓷砖多排布置抛光磨头的抛光装置及工艺 - Google Patents

一种瓷砖多排布置抛光磨头的抛光装置及工艺

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Publication number
WO2019080597A1
WO2019080597A1 PCT/CN2018/100127 CN2018100127W WO2019080597A1 WO 2019080597 A1 WO2019080597 A1 WO 2019080597A1 CN 2018100127 W CN2018100127 W CN 2018100127W WO 2019080597 A1 WO2019080597 A1 WO 2019080597A1
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WO
WIPO (PCT)
Prior art keywords
polishing
grinding head
tile
grinding
head
Prior art date
Application number
PCT/CN2018/100127
Other languages
English (en)
French (fr)
Inventor
徐斌
周祖兵
丘兆才
Original Assignee
广东科达洁能股份有限公司
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Publication date
Application filed by 广东科达洁能股份有限公司 filed Critical 广东科达洁能股份有限公司
Publication of WO2019080597A1 publication Critical patent/WO2019080597A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0092—Grinding attachments for lathes or the like

Definitions

  • the invention relates to the field of ceramic tiles, in particular to a polishing device and a process for arranging polishing heads in multiple rows of ceramic tiles.
  • the tile can be cut a variety of sizes when it is actually laid, the application is flexible and adaptable, and the scope of application is wider; at the same time, the large size means less seams, and the paving effect is complete, highlighting the high-end atmosphere of the room and reducing the gap. It is also more convenient to clean and take care of.
  • the existing polishing process and equipment for processing ceramic slabs is simply to widen the tile polishing equipment to cope with the fierce slab era.
  • the existing polishing process is still using a conventional polishing machine. While the brick is conveyed on the transmission belt, the grinding head 21 rotates at a high speed and oscillates with the beam, and the grinding block mounted on the grinding head swings around the swing rod seat on the one hand, so that It is in line contact with the surface of the brick, and it revolves with the grinding disc and swings with the beam.
  • the superposition of multiple motions creates a continuous grinding process on the surface of the slab, ultimately resulting in a smooth, smooth surface of the slab.
  • the machining path of a single grinding head on the surface of the tile is shown in Figure 1.
  • the ceramic tile 13 is transported to the right, and the grinding head 21 reciprocates on the surface of the ceramic tile 13.
  • the conventional ceramic tile polishing process and equipment will highlight its defects, and the single grinding head 21 cannot effectively cover the brick surface, and the throwing is omitted.
  • the area is getting larger and larger, and more grinding heads 21 need to be provided to increase the coverage, but at the same time, the intermediate part of the brick blank is excessively polished, the length of the production line and the installed power are continuously increased.
  • the existing tile polishing method is a beam oscillating polishing method, which causes the unevenness of the surface polishing of the tile 13 .
  • the number of times the tile 13 is polished in the middle of the width direction of the tile 13 is larger than the edge, and a polishing uniform band is surely formed in the middle portion of the tile 13 during the oscillating process.
  • the amount of polishing in the middle portion of the tile 13 is large, and the amount of polishing of the tiles 13 on both sides is small. And from the edge to the middle is a process of increasing.
  • the polishing in the middle of the tile 13 is relatively uniform.
  • the polished tile 13 is divided into three regions in the width direction: a first uneven region 22, an intermediate uniform region 23, and a second uneven region 24, and the first uneven region 22 and the second uneven region 24 are ceramic tiles. In the uneven area of the edges, the tiles in these two areas are less polished, and the more the edges, the fewer the number of polishing. Uneven polishing.
  • the intermediate uniform region 23 is located in the intermediate portion of the tile 13, which has a high number of polishing times and a relatively uniform polishing. The intermediate uniform region 23 is the best polished area of the entire tile.
  • the polished tile surface exhibits the appearance of a pan with a low middle and high sides.
  • the swing frequency is forced to decrease due to the longer swing amplitude, and the phenomenon of leakage throwing and over-grinding is more prominent.
  • the grinding block of the same mesh number needs to be equipped with more than four grinding heads to ensure one coverage, and the surface of the large plate It is also impossible to eliminate the appearance of the pan caused by uneven polishing.
  • one of the objects of the present invention is to provide a polishing apparatus for arranging a polishing head in a plurality of rows of ceramic tiles, which can improve the productivity and product quality and effectively reduce the scientifically designed porcelain polished brick surface processing equipment. Energy consumption.
  • the technical solution adopted by the present invention is as follows:
  • a polishing apparatus for arranging a polishing head in a plurality of rows of ceramic tiles comprising a tile feeding system mounted on a frame, the tile feeding system driving the ceramic tile to feed along a length of the tile, and the polishing device further Including a beam system and a grinding head system, the beam system is mounted on a frame, the beam system comprising at least two beams disposed in parallel along a tile feed direction, the grinding head system being at least two groups, each set of A grinding head system is mounted on one of the beams, and the grinding head system is provided with a plurality of grinding heads for polishing the tiles.
  • the number of the beams is greater than the number of sets of the grinding head system, and the grinding head system is disposed on the adjacent beams.
  • the number of sets of the grinding head system can be increased or reduced to achieve a full polished tile surface.
  • the beam system further comprises a measuring support seat, a beam supporting plate and a beam driving system
  • the beam supporting seat comprises a first beam supporting seat and a second beam supporting seat
  • the first beam supporting seat and the second beam Supporting seats are respectively installed on two sides of the frame along the feeding direction of the tile
  • the beam supporting plate is mounted on the beam supporting seat
  • the beam is installed between the two beam supporting plates
  • the beam driving A system is coupled to the beam to drive the beam to oscillate.
  • the bottom surface of the beam supporting seat is provided with a sliding mechanism that cooperates with the sliding slot on the frame, and the sliding mechanism is one or more of a sliding rail, a pulley or a crawler.
  • the grinding head system comprises a grinding head driving motor and a grinding head, and the grinding head is provided with a plurality of grinding blocks; the grinding heads in each set of the grinding head system are divided along the feeding direction of the ceramic tiles.
  • the left grinding head group and the right grinding head group, the left grinding head group and the right grinding head group are symmetrically distributed along the circumferential center line of the beam, so that the design is to reduce the deflection deformation of the beam and make the beam bearing load more uniform.
  • each of the grinding heads is coupled to one of the grinding head drive motors.
  • the grinding head and the grinding head driving motor are all mounted on the beam, and the direction in which the grinding head driving motor is installed is parallel to the direction in which the tile is fed, that is, the grinding head driving motor and the grinding head are connected.
  • the direction of the tile and the feeding direction of the tile are such that the grinding head driving motor can reduce the width of the beam, facilitate the installation of the grinding head grinding block, facilitate the maintenance and repair of the device, facilitate the operation of the worker, and has a simple structure and a compact structure.
  • the grinding head and the grinding head driving motor are all mounted on the beam, and the direction of the grinding head driving motor is perpendicular to the direction in which the tile is fed, that is, the grinding head driving motor and the grinding head are connected.
  • the direction is perpendicular to the feed direction of the tile, and the grinding head drive motor is mounted outside the beam so that the grinding head drive motor can reduce the length of the beam.
  • Another object of the present invention is to provide a polishing process for arranging a polishing head in a plurality of rows of ceramic tiles.
  • the tile surface is divided into a plurality of polishing regions along the width direction of the tile, and each row of polishing heads polishes a polished region of the tile.
  • the intermediate uniform region is moved outward, the edge of the tile is effectively processed, and the second uneven region of the adjacent two polishing regions is superposed. Finally, the entire surface of the synthetic tile is processed uniformly.
  • the effective coverage of the grinding head can be greatly improved, the leakage throwing can be effectively reduced and the processing uniformity of the tile surface can be effectively improved, and the prior art process flow can be effectively solved, the use of equipment is large, and the abrasive tool is expensive.
  • Technical defects and problems such as high production cost, leaking throwing, and poor processing uniformity.
  • a polishing process for arranging a polishing head in a plurality of rows of ceramic tiles comprising the following steps:
  • the grinding head mounted on the beam system is arranged in a rectangular or triangular shape
  • the number of the polishing regions is the same as the number of rows of the grinding heads, and each of the rows of the polishing heads respectively polishes one of the polishing regions, and each row of the polishing heads is adjacent to the polishing region during polishing.
  • the edge area extends to polish.
  • the polished polishing region is divided into an intermediate uniform region and an edge uneven region on both sides of the intermediate uniform region along the width direction of the tile, and the edge uneven regions of the adjacent two polishing regions are superimposed on each other. .
  • the invention adopts a polishing method and a device for arranging a polishing head in a plurality of rows of ceramic tiles to carry out the most economical and effective processing on the surface of bricks of different specifications, thereby greatly improving the effective coverage of the grinding head and effectively reducing leakage and throwing. And the phenomenon of poor uniformity. Effectively solve the problems of the prior art process flow, large use of equipment, high consumption of abrasive tools, high production cost, leakage and uniformity, and poor processing uniformity. Ultimately, it achieves the goal of low energy consumption and abrasive wear, improving production efficiency and product quality, and reducing production costs.
  • Figure 1 is a conventional ceramic polishing machine single-head processing tile track
  • FIG. 2 is a schematic view showing the uniformity of full-width oscillating polishing of a conventional tile polishing machine
  • Figure 3 is a polishing rule of the surface area of the entire tile after polishing of the existing tile polishing machine
  • Figure 4 is a small amplitude swing polishing uniformity of the left side of the ceramic tile
  • Figure 5 is a small amplitude swing polishing uniformity of the right side of the ceramic tile
  • Figure 6 is a schematic view showing the superposition of the second uneven region on the two sides of the tile in the middle of the tile;
  • Figure 7 is a schematic view showing the principle of polishing the polishing head in a multi-row arrangement of ceramic tiles
  • Figure 8 is a plan view showing a polishing apparatus for a polishing head in which a plurality of ceramic tiles are arranged in a row;
  • Figure 9 is a front elevational view of a polishing apparatus for a polishing head in a plurality of rows of ceramic tiles according to Embodiment 1;
  • Figure 10 is a plan view showing a polishing apparatus for a polishing head in which a plurality of ceramic tiles are arranged in a row;
  • Figure 11 is a front elevational view of a polishing apparatus for a multi-row tile polishing head according to Embodiment 2.
  • An object of the present invention is to provide a polishing apparatus for arranging a polishing head in a plurality of rows of ceramic tiles.
  • the scientifically designed porcelain polished brick surface processing equipment not only improves productivity and product quality, but also effectively reduces energy consumption.
  • the technical solution adopted by the present invention is as follows:
  • a polishing apparatus for arranging a polishing head in a plurality of rows of tiles comprising a tile feeding system, the tile feeding system is mounted on the frame 3, and the tile feeding system drives the tile 13 to feed along the length of the tile 13,
  • the polishing device further comprises The beam system and the grinding head system, the beam system is mounted on the frame 13, and the beam system comprises at least two beams 10 (11) arranged in parallel along the direction in which the tiles are fed.
  • the grinding head system is at least two groups, and each group of grinding head systems is installed. On a beam 10 (11), a number of grinding heads 21 are provided on the grinding head system for polishing the tiles 13.
  • the number of beams 10 (11) is greater than the number of sets of the grinding head system, and the grinding head system is disposed on adjacent beams 10 (11). Depending on the size of the tile, the number of sets of the grinding head system can be increased or reduced to achieve a full polished tile surface.
  • the tile feed system is shown in Figures 12 and 13.
  • the tile feeding system is composed of a driven pulley 1, a conveyor belt 2, a frame 3, a tile feed gearbox 14, a tile feed drive motor 15, a coupling 16, and a drive pulley 17.
  • the driven pulley 1 and the driving pulley 17 are mounted on the frame 3, and the tile feeding gearbox 14 is coupled and fixed to the tile feed drive motor 15, and the driving pulley 17 is coupled to the tile feed through the coupling 16.
  • Box 14 The conveyor belt 2 is placed over the driven pulley 1 and the driving pulley 17, and the tile 13 is placed on the conveyor belt 2.
  • the customer determines the feed rate of the tile according to the production quantity, starts the tile feed drive motor 15, and after the tile feed drive motor 15 shifts through the tile feed gearbox 14, the motion and power are transmitted to the active belt through the coupling 16. Round 17.
  • the driving pulley 17 in turn transmits the motion and power to the driven pulley 1 through the conveyor belt 2, thereby driving the driven pulley 1 and the driving pulley 17 to rotate.
  • the conveyor belt 2 is then driven to move in parallel with the tile 13 placed thereon.
  • the beam system further includes a measurement support seat, a beam support plate 5 and a beam drive system.
  • the beam support base includes a first beam support base 4 and a second beam support base 12, and the first beam support base 4 and the second beam support base 12 are respectively installed.
  • the beam support plate is mounted on the beam support seat, the beam 10 (11) is installed between the two beam support plates 5, and the beam drive system is connected to the beam 10 (11). And drive the beam 10 (11) to swing.
  • the bottom surface of the beam support seat is provided with a sliding mechanism to cooperate with the sliding slot on the frame 3, and the sliding mechanism is one or more of a sliding rail, a pulley or a crawler belt.
  • the grinding head system comprises a grinding head driving motor and a grinding head 21, and a plurality of grinding blocks are mounted on the grinding head 21; the grinding heads 21 in each group of grinding head systems are divided into a left grinding head group 18 and a right grinding head group along the feeding direction of the ceramic tiles. 19.
  • the left grinding head group 18 and the right grinding head group 19 are symmetrically distributed along the circumferential center line of the beam 10 (11). The design is to reduce the deflection of the beam 10 (11) and to make the beam 10 (11) load more. Evenly.
  • the grinding head system of the present invention further includes a grinding head driving motor 25, both of which are mounted on the beam 10 (11), and the direction in which the grinding head driving motor 25 is mounted is parallel to the direction in which the tile 13 is fed. That is, the direction in which the grinding head driving motor 25 and the grinding head 21 are connected is horizontal to the feeding direction of the tile 13, so that the setting of the grinding head driving motor 25 can reduce the width of the beam 10 (11), facilitate the installation of the grinding block, and facilitate the maintenance of the device. Maintenance, convenient for workers to operate, simple structure and compact structure.
  • the preferred beam 10 (11) of this embodiment is two, including the rear cross member 10 and the front cross member 11, and the rear cross member 10 and the front cross member 11 are spaced apart from each other by the size of the processed tile.
  • the rear cross member 10 and the front cross member 11 are mounted and fixed to the beam support plate 5, and the beam support plate 5 is supported and mounted on the first beam support base 4 and the second beam support base 12.
  • the beam drive system includes a beam swing drive motor 20 that drives the sliding of the rear beam 10 and the front beam 11 mounted on the beam support plate 5 along the first beam support 4 and the second beam support 12 The mechanism swings.
  • a grinding head system is mounted on both the rear cross member 10 and the front cross member 11, and the grinding head system on the front cross member 11 includes a left grinding head set 18 and a right grinding head set 19.
  • the left grinding head group 18 and the right grinding head group 19 are symmetrical along the center line of the front cross member 11 in the circumferential direction.
  • the left grinding head group 18 and the right grinding head group 19 are driven by a grinding head driving motor, and the left grinding head group 18 and the right grinding head group 19 on the front cross member 11 process the left side region of the tile, and the grinding head system on the rear beam 10 is processed.
  • the grinding head system on the front cross member 11 and the grinding head system on the rear cross member 10 are superimposed on the polished surface of the intermediate portion of the tile 13 during polishing.
  • both the grinding head 21 and the grinding head drive motor 25 are mounted on the beam 10 (11), and the direction in which the grinding head driving motor 25 is mounted is perpendicular to the direction in which the tile 13 is fed, that is, the grinding head driving motor 25 and the grinding head 21 are connected.
  • the direction is perpendicular to the feeding direction of the tile 13, and the grinding head drive motor 25 is mounted beyond the beam 10 (11) so that the setting of the grinding head drive motor 25 can reduce the length of the beam 10 (11).
  • Another object of the present invention is to provide a polishing process for arranging a polishing head in a plurality of rows of ceramic tiles, comprising the following steps:
  • the grinding head mounted on the beam system is arranged in a rectangular or triangular shape
  • the number of the polishing regions is the same as the number of rows of the grinding heads 21, and each of the rows of the grinding heads 21 respectively polishes one of the polishing regions, and each row of the polishing heads 21 is adjacent to each other during polishing.
  • the edge region of the polishing region is stretched and polished.
  • the polished polishing region is divided into an intermediate uniform region 23 and an edge uneven region on both sides of the intermediate uniform region 23 along the width direction of the ceramic tile 13, and the edge uneven regions of the adjacent two polishing regions are superimposed on each other. .
  • the polishing process scheme includes the following steps:
  • the processing area of the surface of the ceramic tile 13 is evenly divided into two along the width direction of the ceramic tile 13;
  • the grinding heads 21 mounted on the beam system are arranged in a rectangular or triangular shape
  • the grinding head 21 polishes the two polishing regions in the step (1), and the grinding head 21 is polished to the edge region of the right region when polishing the left side region of the tile 13; the customer adjusts according to the specification of the tile 13
  • the swinging amplitude of the grinding head 21 is to ensure that the grinding head 21 is in the area of one half of the ceramic tile 13, and the processing range of the grinding head 21 is half of the ceramic tile 13 and covers the edge area of the other half, so that each row of the grinding heads 21 respectively processes the ceramic tile.
  • the half area and the edge area of the other half area is to ensure that the grinding head 21 is in the area of one half of the ceramic tile 13, and the processing range of the grinding head 21 is half of the ceramic tile 13 and covers the edge area of the other half, so that each row of the grinding heads 21 respectively processes the ceramic tile.
  • the half area and the edge area of the other half area is to ensure that the grinding head 21 is in the area of one half of the ceramic tile 13, and the processing range of the grinding head 21 is half of the ceramic tile
  • the polished polishing regions are sequentially divided inwardly from the edge of the surface of the ceramic tile 13 into the first uneven region 22, the intermediate uniform region 23, and the second uneven region 24, the first uneven region 22 and The second uneven region 24 is an edge uneven region.
  • step (4) specifically includes:
  • Step (41) A group of grinding heads are machined in a left side region along the width direction of the tile 13.
  • the present invention is realized by a tile halving polishing method.
  • the principle is as follows: the whole tile 13 is most uniformly polished in the middle uniform region 23, in order to achieve the uniformity of the tile polishing of the entire tile 13, the middle uniform region 23 in Fig. 2 is moved to the first one in the original single row grinding head processing. The position of the uneven region 22 and the second uneven region 24 is up.
  • the specific step is that the grinding head 21 does not oscillate the surface of the ceramic tile 13 by a full amplitude, but oscillates the surface of the polished ceramic tile 13 with a small amplitude. Since the swinging amplitude of the grinding head 21 is small, only the left side region of the tile 13 can be polished, and therefore, the three regions formed by the grinding head swinging and polishing the tile surface are moved to the left side of the tile 13.
  • a set of grinding heads 21 are slightly polished on the left side of the tile 13.
  • the intermediate uniform region 23 moves toward the edge portion of the left region of the tile 13, covering the first uneven region 22 during the processing of the single row of the grinding head, improving the polishing times and coverage of the edge portion of the tile 13, and the edge portion of the tile 13 Polishing is more uniform.
  • Step (42) another set of grinding heads are processed in the right side region along the width direction of the tile 13,
  • the polishing method of the other set of grinding heads in the right region of the ceramic tile 13 is the same as that in the left side region, and the grinding head 21 achieves the same small amplitude swing as the left side region in the right region of the ceramic tile 13 to realize the middle.
  • the intermediate uniform region 23 moves toward the edge portion of the right region of the tile 13, covering the first uneven region 22 during the processing of the single row of the grinding head, improving the polishing times and coverage of the edge portion of the tile 13, and the edge portion of the tile 13 Polishing is more uniform.
  • Step (43) the second uneven region 24 of the left region is superimposed with the second uneven region 24 of the right region:
  • the edge of the tile 12 achieves uniform polishing, since the grinding head 21 is on the left side of the polished tile 12.
  • the edge uneven region is moved to the middle of the tile, that is, the left uneven region of the tile and the second uneven region 24 of the right region are moved to the middle of the tile 12 to realize The superposition of two second uneven regions 24 in the middle of the tile 12 is achieved.
  • the unevenness of the edge unevenness is performed when the sharpening head 21 performs edge polishing.
  • the polished ceramic tile 13 in the middle of the ceramic tile 13 is similar to the polishing degree of the edge polishing region of the ceramic tile 13.
  • the uniformity polishing area of the tile surface covers almost the entire surface.
  • the polishing times of the edge area of the tile are improved, the gloss is high, the leakage throw is reduced, and the uniformity of polishing of the tile surface is improved.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

一种瓷砖多排布置抛光磨头的抛光装置及工艺，抛光装置包括横梁***和磨头***，横梁***包括至少两个沿瓷砖（13）进给方向平行设置的横梁（10，11），磨头***至少为两组，每组磨头***安装在一个横梁上，磨头***上设置若干磨头（21）用于抛光瓷砖。在瓷砖的抛光过程中，将瓷砖表面沿瓷砖的宽度方向均分为若干个抛光区域，每排磨头抛光瓷砖的一个抛光区域，从而使得瓷砖的边缘得到有效加工，相邻两个抛光区域的不均匀区域叠加，有效减少漏抛及提高瓷砖表面加工均匀性。

Description

一种瓷砖多排布置抛光磨头的抛光装置及工艺 技术领域
本发明涉及瓷砖领域，具体涉及一种瓷砖多排布置抛光磨头的抛光装置及工艺。
背景技术
现有的瓷砖行业中大多以小规格尺寸的瓷砖为主，但是由于小规格的瓷砖造成的污染较大，对环境造成的影响很大，所以研发生产大尺寸的瓷砖产品非常重要，而且规格上的突破，瓷砖实际铺贴时可以随意切割多种尺寸，应用灵活多变，适用范围更广；同时大尺寸意味着更少的接缝，铺贴效果完整气派，凸显居室大气高端，缝隙的减少也更方便清洁打理。
现有加工陶瓷大板的抛光工艺和装备，就是简单的将瓷砖抛光设备加宽，以应对来势凶猛的大板时代。现有抛光工艺还是在采用传统的抛光机，砖坯在传动皮带上输送的同时，磨头21高速旋转并随横梁一起摆动，安装于磨头上的磨块一方面绕摆杆座摆动，使其与砖坯表面呈线接触，同时随磨盘公转，随横梁摆动。多个运动的叠加对砖坯表面形成连续的研磨加工，最终使砖坯获得平整光滑的表面。
单个磨头在瓷砖表面的加工轨迹如图1所示。瓷砖13向右传输，磨头21在瓷砖13表面往复摆动，在加工陶瓷大板时，传统瓷砖抛光工艺和装备就会凸显其缺陷，单个磨头21对砖面不能进行有效覆盖，漏抛的区域越来越大，需要配置更多的磨头21来增加覆盖，但同时也导致砖坯中间部分过度抛光、生产线的长度及装机功率不断增加。
砖面加宽后，由于横梁摆动行程加长，摆动的频次及线速度不可能无限提高，从而导致单线产量降低、砖坯漏抛和过磨的矛盾也更加突出。除了会产生漏抛之外，还会产生瓷砖13表面抛光不均匀的的缺陷。现有的瓷砖抛光方式是横梁摆动式抛光方式，这种抛光方式，造成瓷砖13表面抛光的不均匀性。沿瓷砖13的宽度方向瓷砖13中间被抛光的次数大于边缘处，而且在磨头21在摆动过程中，一定会在瓷砖13中间区域形成一个抛光均匀带。
如图2所示，瓷砖13中间区域的抛光量多，两边的瓷砖13抛光量少。而且从边缘到中间是一个逐渐增加的过程。瓷砖13中间的抛光相对均匀一些。将抛光后的瓷砖13沿宽度方向划分为三个区域：第一不均匀区域22、中间均匀区域23和第二不均匀区域24，第一不均匀区域22、第二不均匀区域24是瓷砖的边缘不均匀区域，这两个区域瓷砖抛光量少， 越往边缘，抛光次数越少。抛光不均匀。中间均匀区域23位于瓷砖13的中间区域，该区域抛光次数多，抛光相对均匀。中间均匀区域23是整个瓷砖中抛光最好的区域。
从图3看出，抛光后的瓷砖表面呈现一个平底锅的形貌，中间低，两边高。在抛光大板时，由于摆动幅度加长，摆动频次被迫降低，漏抛和过磨现象更加突出，同一目数的磨块有时需配置四个以上的磨头才能保证一次覆盖，大板表面的也无法消除不均匀性抛光造成的平底锅的形貌。
发明内容
为了解决上述技术问题，本发明目的之一是提供一种瓷砖多排布置抛光磨头的抛光装置，通过科学设计的瓷质抛光砖砖面加工设备，既提高了生产率和产品质量，又有效降低了能耗。为实现上述发明目的，本发明采取的技术方案如下：
一种瓷砖多排布置抛光磨头的抛光装置，包括瓷砖进给***，所述瓷砖进给***安装在机架上，所述瓷砖进给***驱动瓷砖沿瓷砖的长度方向进给，抛光装置还包括横梁***和磨头***，所述横梁***安装在机架上，所述横梁***包括至少两个沿瓷砖进给方向平行设置的横梁，所述磨头***至少为两组，每组所述磨头***安装在一个所述横梁上，所述磨头***上设置若干磨头用于抛光瓷砖。
优选的，所述横梁的数量大于所述磨头***的组数，所述磨头***设置在相邻的所述横梁上。根据不同规格尺寸的瓷砖，可以通过增加或减少磨头***的组数，实现磨头全面抛光瓷砖表面。
优选的，所述横梁***还包括衡量支撑座、横梁支撑板和横梁驱动***，所述横梁支撑座包括第一横梁支撑座和第二横梁支撑座，所述第一横梁支撑座和第二横梁支撑座分别安装在所述机架沿瓷砖进给方向的两侧，所述横梁支撑座上安装所述横梁支撑板，所述横梁安装在两个所述横梁支撑板之间，所述横梁驱动***与所述横梁连接驱动所述横梁摆动。
优选的，所述横梁支撑座的底面设置滑动机构与所述机架上的滑槽配合滑动，所述滑动机构为滑轨、滑轮或履带中的一种或多种。
优选的，所述磨头***包括磨头驱动电机和磨头，所述磨头上安装若干磨块；每组所述磨头***中的所述磨头沿所述瓷砖的进给方向分为左磨头组和右磨头组，所述左磨头组和右磨头组沿所述横梁周向的中心线对称分布，这样设计是为了减小横梁的挠度变形，使 横梁承重更加均匀。
优选的，每个所述磨头都连接一个所述磨头驱动电机。
优选的，所述磨头和所述磨头驱动电机都安装在所述横梁上，所述磨头驱动电机安装的方向与瓷砖进给的方向是平行的，即磨头驱动电机和磨头连接的方向与瓷砖的进给方向水平，这样设置磨头驱动电机可以减少横梁的宽度，方便安装磨头磨块，方便设备的维护维修，方便工人操作，结构简单，结构紧凑。
优选的，所述磨头和所述磨头驱动电机都安装在所述横梁上，所述磨头驱动电机安装的方向与瓷砖进给的方向是垂直的，即磨头驱动电机和磨头连接的方向与瓷砖的进给方向垂直，磨头驱动电机是突出于横梁之外安装的，这样设置磨头驱动电机可以减少横梁的长度。
本发明的另一目的是提供一种瓷砖多排布置抛光磨头的抛光工艺，将瓷砖表面沿瓷砖的宽度方向均分为若干个抛光区域，每排磨头抛光瓷砖的一个抛光区域。相对于现有技术，中间均匀区域外移，瓷砖边缘得到有效的加工，相邻两个抛光区域的所述第二不均匀区域叠加。最后，合成瓷砖整个表面均匀性性加工。经上述方法抛光之后，能大幅度提高磨头的有效覆盖率，能有效减少漏抛及提高瓷砖表面加工均匀性，有效解决现有技术工艺流程占地面积大，使用设备多、磨具消耗大、生产成本高、漏抛、加工均匀性差等技术缺陷和难题。为实现上述发明目的，本发明采取的技术方案如下：
一种瓷砖多排布置抛光磨头的抛光工艺，包括如下步骤：
(1).将瓷砖表面的加工区域沿瓷砖的宽度方向均分为若干个抛光区域，所述抛光区域至少为两个；
(2).沿瓷砖的进给方向在抛光装置的横梁***上采用双排或多排的排列方式布置磨头；
(3).安装在所述横梁***上的磨头按照矩形或者三角形布置；
(4).所述抛光区域的数量与所述磨头的排数相同，每排所述磨头分别抛光一个所述抛光区域，每排所述磨头在抛光时向相邻所述抛光区域的边缘区域延伸抛光。
优选的，抛光后的所述抛光区域沿瓷砖的宽度方向分为中间均匀区域和位于中间均匀区域两侧的边缘不均匀区域，相邻两个所述抛光区域的所述边缘不均匀区域相互叠加。
相对于现有技术，本发明取得了有益的技术效果：
本发明通过采用一种瓷砖多排布置抛光磨头的抛光方法及其装置对不同规格的砖坯表面进行最经济、最有效的加工处理，大幅度提高磨头的有效覆盖率，能有效减少漏抛及均匀性差现象。有效解决现有技术工艺流程占地面积大，使用设备多、磨具消耗大、生产成本高、漏抛、加工均匀性差等难题。最终达到低能耗和磨具损耗，提高生产效率和产品质量，降低生产成本的目的。
附图说明
图1为现有抛光机单磨头加工瓷砖轨迹；
图2为现有瓷砖抛光机全幅摆动抛光均匀性示意图；
图3为现有瓷砖抛光机抛光后整个瓷砖表面区域抛光规律；
图4为瓷砖左侧磨头小幅度摆动抛光均匀性；
图5为瓷砖右侧磨头小幅度摆动抛光均匀性；
图6为瓷砖两侧区域的第二不均匀区域在瓷砖中部的叠加示意图；
图7为瓷砖多排布置抛光磨头抛光加工原理示意图；
图8为实施例1一种瓷砖多排布置抛光磨头的抛光装置俯视图；
图9为实施例1一种瓷砖多排布置抛光磨头的抛光装置正视图；
图10为实施例2一种瓷砖多排布置抛光磨头的抛光装置俯视图；
图11为实施例2一种瓷砖多排布置抛光磨头的抛光装置正视图。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合实施例对本发明进行进一步详细说明，但本发明要求保护的范围并不局限于下述具体实施例。
本发明一个目的是提供一种瓷砖多排布置抛光磨头的抛光装置，通过科学设计的瓷质抛光砖砖面加工设备，既提高了生产率和产品质量，又有效降低了能耗。为实现上述发明目的，本发明采取的技术方案如下：
实施例1：
一种瓷砖多排布置抛光磨头的抛光装置，包括瓷砖进给***，瓷砖进给***安装在机架3上，瓷砖进给***驱动瓷砖13沿瓷砖13的长度方向进给，抛光装置还包括横梁***和磨头***，横梁***安装在机架13上，横梁***包括至少两个沿瓷砖进给方向平行设置 的横梁10(11)，磨头***至少为两组，每组磨头***安装在一个横梁上10(11)，磨头***上设置若干磨头21用于抛光瓷砖13。横梁10(11)的数量大于磨头***的组数，磨头***设置在相邻的横梁10(11)上。根据不同规格尺寸的瓷砖，可以通过增加或减少磨头***的组数，实现磨头全面抛光瓷砖表面。
瓷砖进给***如图12、13所示。瓷砖进给***由从动带轮1、传送皮带2、机架3、瓷砖进给变速箱14、瓷砖进给驱动电机15、联轴器16、主动带轮17组成。从动带轮1和主动带轮17安装在机架3上，瓷砖进给变速箱14与瓷砖进给驱动电机15联接并固定在一起，主动带轮17通过联轴器16联接瓷砖进给变速箱14。传送皮带2套在从动带轮1和主动带轮17上，瓷砖13置于传送皮带2之上。
客户根据生产量的需要确定瓷砖的进给速度，启动瓷砖进给驱动电机15，瓷砖进给驱动电机15经过瓷砖进给变速箱14变速之后，将运动和动力通过联轴器16传递给主动带轮17。主动带轮17又通过传送皮带2将运动和动力传给从动带轮1，从而驱动从动带轮1、主动带轮17旋转。进而驱动传送皮带2和放置在其上的瓷砖13平行移动。
横梁***还包括衡量支撑座、横梁支撑板5和横梁驱动***，横梁支撑座包括第一横梁支撑座4和第二横梁支撑座12，第一横梁支撑座4和第二横梁支撑座12分别安装在机架3沿瓷砖13进给方向的两侧，横梁支撑座上安装横梁支撑板5，横梁10(11)安装在两个横梁支撑板5之间，横梁驱动***与横梁10(11)连接并驱动横梁10(11)摆动。横梁支撑座的底面设置滑动机构与机架3上的滑槽配合滑动，滑动机构为滑轨、滑轮或履带中的一种或多种。
磨头***包括磨头驱动电机和磨头21，磨头21上安装若干磨块；每组磨头***中的磨头21沿瓷砖的进给方向分为左磨头组18和右磨头组19，左磨头组18和右磨头组19沿横梁10(11)周向的中心线对称分布，这样设计是为了减小横梁10(11)的挠度变形，使横梁10(11)承重更加均匀。
本发明的磨头***还包括磨头驱动电机25，磨头21和磨头驱动电机25都安装在横梁10(11)上，磨头驱动电机25安装的方向与瓷砖13进给的方向是平行的，即磨头驱动电机25和磨头21连接的方向与瓷砖13的进给方向水平，这样设置磨头驱动电机25可以减少横梁10(11)的宽度，方便安装磨块，方便设备的维护维修，方便工人操作，结构简单，结构紧凑。
本实施例优选的横梁10(11)为两个，包括后横梁10和前横梁11，后横梁10和前横梁11安装之间有间距，这个间距由加工瓷砖的规格决定。后横梁10和前横梁11安装并固定在横梁支撑板5上，横梁支撑板5支撑安装在第一横梁支撑座4和第二横梁支撑座12上。横梁驱动***包括横梁摆动驱动电机20，横梁摆动驱动电机20驱动着安装在横梁支撑板5上的后横梁10和前横梁11沿着第一横梁支撑座4和第二横梁支撑座12上的滑动机构摆动。
后横梁10和前横梁11上均安装着磨头***，前横梁11上的磨头***包括左磨头组18和右磨头组19。左磨头组18、右磨头组19沿着前横梁11周向的中心线对称。左磨头组18、右磨头组19通过磨头驱动电机驱动，前横梁11上的左磨头组18和右磨头组19加工瓷砖的左侧区域，后横梁10上的磨头***加工瓷砖13的右侧区域，在抛光过程中前横梁11上的磨头***与后横梁10上的磨头***在瓷砖13的中间区域的抛光面进行叠加。
实施例2：
如图10和11所示，该实施例仅描述与上述实施例的不同之处，其余技术特征与上述实施例相同。磨头21和磨头驱动电机25都安装在横梁10(11)上，磨头驱动电机25安装的方向与瓷砖13进给的方向是垂直的，即磨头驱动电机25和磨头21连接的方向与瓷砖13的进给方向垂直，磨头驱动电机25是突出于横梁10(11)之外安装的，这样设置磨头驱动电机25可以减少横梁10(11)的长度。
本发明的另一目的是提供一种瓷砖多排布置抛光磨头的抛光工艺，包括如下步骤：
(1).将瓷砖13表面的加工区域沿瓷砖的宽度方向均分为若干个抛光区域，所述抛光区域至少为两个；
(2).沿瓷砖13的进给方向在抛光装置的横梁***上采用双排或多排的排列方式布置磨头21；
(3).安装在所述横梁***上的磨头按照矩形或者三角形布置；
(4).所述抛光区域的数量与所述磨头21的排数相同，每排所述磨头21分别抛光一个所述抛光区域，每排所述磨头21在抛光时向相邻所述抛光区域的边缘区域延伸抛光。
抛光后的所述抛光区域沿瓷砖13的宽度方向分为中间均匀区域23和位于中间均匀区域23两侧的边缘不均匀区域，相邻两个所述抛光区域的所述边缘不均匀区域相互叠加。
如图4-7所示，优选的，抛光工艺方案包括如下步骤：
(1).将瓷砖13表面的加工区域沿瓷砖13的宽度方向均匀分为两个；
(2).沿瓷砖13的进给方向在抛光装置的横梁***上采用双排方式布置磨头；
(3).安装在所述横梁***上的磨头21按照矩形或者三角形布置；
(4).磨头21抛光步骤(1)中的两个所述抛光区域，磨头21在抛光瓷砖13的左侧区域时向右侧区域的边缘区域延伸抛光；客户根据瓷砖13的规格调整磨头21的摆动幅度，以保证磨头21是在瓷砖13一半的区域内，磨头21加工的覆盖范围是瓷砖13的一半且覆盖另一半的边缘区域，使每排磨头21分别加工瓷砖的一半区域和另一半区域的边缘区域。
抛光后的所述抛光区域沿瓷砖13的宽度方向从瓷砖13表面的边缘向内依次分为第一不均匀区域22、中间均匀区域23和第二不均匀区域24，第一不均匀区域22和第二不均匀区域24为边缘不均匀区域。
其中，所述步骤(4)具体包括：
步骤(41).其中一组磨头在沿瓷砖13宽度方向的左侧区域内加工。
由技术背景的分析可知，磨头21加工瓷砖13过程中，磨头21在瓷砖13表面不同区域的抛光次数是不一样，表明磨头21在瓷砖13上的抛光是不均匀的。为了实现瓷砖13表面加工的均匀性、不出现漏抛现象，本发明的采用瓷砖平分抛光方法实现。其原理如下：整个瓷砖13抛光最为均匀的是中间均匀区域23，为了实现整个瓷砖13砖面抛光的均匀性，将图2中，中间均匀区域23移动到原来单排磨头加工时的第一不均匀区域22、第二不均匀区域24的位置上去。
如图4所示，具体步骤为：磨头21不再全幅度的摆动抛光瓷砖13表面，而是小幅度摆动抛光瓷砖13表面。由于磨头21的摆动幅度小，只能抛光瓷砖13的左侧区域，因此，磨头摆动抛光瓷砖表面形成的三个区域就往瓷砖13的左侧移动。
一组磨头21在瓷砖13的左侧小幅度抛光。中间均匀区域23就往瓷砖13左侧区域的边缘部位移动，覆盖了单排磨头加工时的第一不均匀区域22，提高了瓷砖13边缘部位的抛光次数和覆盖率，瓷砖13边缘部位的抛光就较为均匀。
步骤(42)、另一组磨头在在沿瓷砖13宽度方向的右侧区域内加工，
如图5所示，另一组磨头在瓷砖13右侧区域内的抛光方法与在左侧区域相同，磨头21在瓷砖13右侧区域实现与左侧区域同等的小幅度摆动，实现中间均匀区域23的移动。由于磨头21的摆动幅度小，只能抛光瓷砖13的右侧区域，因此，磨头21摆动抛光瓷砖13表面形成的三个区域就往瓷砖13的右侧移动。中间均匀区域23就往瓷砖13右侧区域的边 缘部位移动，覆盖了单排磨头加工时的第一不均匀区域22，提高了瓷砖13边缘部位的抛光次数和覆盖率，瓷砖13边缘部位的抛光就较为均匀。
步骤(43)、左侧区域的第二不均匀区域24与右侧区域的第二不均匀区域24叠加：
如图6、7所示，由于瓷砖左侧区域和右侧区域的中间均匀区域23均往瓷砖12的边缘移动，瓷砖12的边缘实现了均匀性抛光，由于磨头21在抛光瓷砖12的左侧区域时向右侧区域的边缘区域延伸抛光，使边缘不均匀区域都移动到了瓷砖的中部，即瓷砖左侧区域和右侧区域的第二不均匀区域24都移动到了瓷砖12的中部，实现了两个第二不均匀区域24在瓷砖12中部的叠加。
如图6所示，在瓷砖13中部是磨头21进行边缘抛光时边缘不均匀区域的叠加，叠加之后，瓷砖13中部的抛光瓷砖13与瓷砖13边缘抛光区域的抛光次数差不多。
采用本发明的瓷砖平分抛光加工方法，瓷砖表面的均匀性抛光区域几乎覆盖了整个表面。提高了瓷砖边缘区域的抛光次数，光泽度高，还减少了漏抛，提高了瓷砖表面抛光的均匀性。
根据上述说明书的揭示和教导，本发明所属领域的技术人员还可以对上述实施方式进行变更和修改。因此，本发明并不局限于上面揭示和描述的具体实施方式，对发明的一些修改和变更也应当落入本发明的权利要求的保护范围内。此外，尽管本说明书中使用了一些特定的术语，但这些术语只是为了方便说明，并不对发明构成任何限制。

Claims (10)

  1. 一种瓷砖多排布置抛光磨头的抛光装置，包括瓷砖进给***，所述瓷砖进给***安装在机架上，所述瓷砖进给***驱动瓷砖沿瓷砖的长度方向进给，其特征在于，还包括横梁***和磨头***，所述横梁***安装在机架上，所述横梁***包括至少两个沿瓷砖进给方向平行设置的横梁，所述磨头***至少为两组，每组所述磨头***安装在一个所述横梁上，所述磨头***上设置若干磨头用于抛光瓷砖。
  2. 根据权利要求1所述的一种瓷砖多排布置抛光磨头的抛光装置，其特征在于，所述横梁的数量大于所述磨头***的组数，所述磨头***设置在相邻的所述横梁上。
  3. 根据权利要求1所述的一种瓷砖多排布置抛光磨头的抛光装置，其特征在于，所述横梁***还包括衡量支撑座、横梁支撑板和横梁驱动***，所述横梁支撑座包括第一横梁支撑座和第二横梁支撑座，所述第一横梁支撑座和第二横梁支撑座分别安装在所述机架沿瓷砖进给方向的两侧，所述横梁支撑座上安装所述横梁支撑板，所述横梁安装在两个所述横梁支撑板之间，所述横梁驱动***与所述横梁连接驱动所述横梁摆动。
  4. 根据权利要求3所述的一种瓷砖多排布置抛光磨头的抛光装置，其特征在于，所述横梁支撑座的底面设置滑动机构与所述机架上的滑槽配合滑动，所述滑动机构为滑轨、滑轮或履带中的一种或多种。
  5. 根据权利要求1所述的一种瓷砖多排布置抛光磨头的抛光装置，其特征在于，所述磨头***包括磨头驱动电机和磨头，所述磨头上安装若干磨块；每组所述磨头***中的所述磨头沿所述瓷砖的进给方向分为左磨头组和右磨头组，所述左磨头组和右磨头组沿所述横梁周向的中心线对称分布。
  6. 根据权利要求5所述的一种瓷砖多排布置抛光磨头的抛光装置，其特征在于，每个所述磨头都连接一个所述磨头驱动电机。
  7. 根据权利要求5或6所述的一种瓷砖多排布置抛光磨头的抛光装置，其特征在于，所述磨头和所述磨头驱动电机都安装在所述横梁上，所述磨头驱动电机安装的方向与瓷砖进给的方向是平行的。
  8. 根据权利要求5或6所述的一种瓷砖多排布置抛光磨头的抛光装置，其特征在于，所述磨头和所述磨头驱动电机都安装在所述横梁上，所述磨头驱动电机安装的方向与瓷砖进给的方向是垂直的。
  9. 一种瓷砖多排布置抛光磨头的抛光工艺，其特征在于，包括如下步骤：
    (1).将瓷砖表面的加工区域沿瓷砖的宽度方向均分为若干个抛光区域，所述抛光区域至少为两个；
    (2).沿瓷砖的进给方向在抛光装置的横梁***上采用双排或多排的排列方式布置磨头；
    (3).安装在所述横梁***上的磨头按照矩形或者三角形布置；
    (4).所述抛光区域的数量与所述磨头的排数相同，每排所述磨头分别抛光一个所述抛光区域，每排所述磨头在抛光时向相邻所述抛光区域的边缘区域延伸抛光。
  10. 根据权利要求9所述的一种瓷砖多排布置抛光磨头的抛光工艺，其特征在于，抛光后的所述抛光区域沿瓷砖的宽度方向分为中间均匀区域和位于中间均匀区域两侧的边缘不均匀区域，相邻两个所述抛光区域的所述边缘不均匀区域相互叠加。
PCT/CN2018/100127 2017-10-26 2018-08-11 一种瓷砖多排布置抛光磨头的抛光装置及工艺 WO2019080597A1 (zh)

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