WO2019057450A1 - Method for producing a finishing coating and circuit board - Google Patents
Method for producing a finishing coating and circuit board Download PDFInfo
- Publication number
- WO2019057450A1 WO2019057450A1 PCT/EP2018/073117 EP2018073117W WO2019057450A1 WO 2019057450 A1 WO2019057450 A1 WO 2019057450A1 EP 2018073117 W EP2018073117 W EP 2018073117W WO 2019057450 A1 WO2019057450 A1 WO 2019057450A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- copper
- metallic
- end surface
- electrically conductive
- Prior art date
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 41
- 239000011248 coating agent Substances 0.000 title claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 230000003647 oxidation Effects 0.000 claims abstract description 12
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 25
- 239000010410 layer Substances 0.000 claims description 25
- 229910052802 copper Inorganic materials 0.000 claims description 24
- 239000010949 copper Substances 0.000 claims description 24
- 239000011241 protective layer Substances 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 239000002318 adhesion promoter Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 239000000470 constituent Substances 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 239000005871 repellent Substances 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical class [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910002804 graphite Inorganic materials 0.000 claims description 2
- 239000010439 graphite Substances 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 230000002940 repellent Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 11
- 239000007767 bonding agent Substances 0.000 abstract description 6
- 210000002381 plasma Anatomy 0.000 description 33
- 229910000679 solder Inorganic materials 0.000 description 29
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 8
- 239000002923 metal particle Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 239000007789 gas Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 4
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 4
- 230000005284 excitation Effects 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000012071 phase Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- ODIGIKRIUKFKHP-UHFFFAOYSA-N (n-propan-2-yloxycarbonylanilino) acetate Chemical compound CC(C)OC(=O)N(OC(C)=O)C1=CC=CC=C1 ODIGIKRIUKFKHP-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- GVFOJDIFWSDNOY-UHFFFAOYSA-N antimony tin Chemical compound [Sn].[Sb] GVFOJDIFWSDNOY-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- WUBBRNOQWQTFEX-UHFFFAOYSA-N 4-aminosalicylic acid Chemical compound NC1=CC=C(C(O)=O)C(O)=C1 WUBBRNOQWQTFEX-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 1
- 241000364051 Pima Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 230000000711 cancerogenic effect Effects 0.000 description 1
- 231100000315 carcinogenic Toxicity 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011151 fibre-reinforced plastic Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
- C23C24/103—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
- C23C24/106—Coating with metal alloys or metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
- C23C4/06—Metallic material
- C23C4/08—Metallic material containing only metal elements
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/134—Plasma spraying
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/18—After-treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/26—Plasma torches
- H05H1/32—Plasma torches using an arc
- H05H1/42—Plasma torches using an arc with provisions for introducing materials into the plasma, e.g. powder, liquid
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/1344—Spraying small metal particles or droplets of molten metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
Definitions
- the invention relates to a method for producing an end surface on at least one exposed metallic surface of a printed circuit board and to a printed circuit board having an end surface which can be produced by the method.
- a “circuit board” is a rigid or flexible support for electronic components. It serves the mechanical
- the carrier comprises electrically insulating material with electrically conductive surfaces adhering thereto, such as, in particular, solderable connection surfaces, contact surfaces and conductor tracks.
- electrically conductive surfaces adhering thereto such as, in particular, solderable connection surfaces, contact surfaces and conductor tracks.
- insulating material fiber-reinforced plastic or polyimide is common in flexible printed circuit boards.
- electrically conductive surfaces are usually made of a thin layer of copper, usually 35 ym, etched.
- Wired components are conventionally soldered in pads.
- Surface-mounted components English: Surface
- SMD Mounted Devices, SMD for short) are soldered directly onto solderable pads. SMD components increase the packing density and allow two-sided assembly.
- Circuit board depending on the material, more or less tend to react with the surrounding atmospheric oxygen
- Oxidation is applied to an end surface.
- the copper is coated by a layer of tin-lead, which also the conventional
- Solder corresponds.
- HAL is the most widely used method of producing an end surface because of its low cost performance, but has a disadvantage of unequal distribution of the tin-lead coating on the surface relatively large bumps and can lead to short circuits in very fine structures.
- Chemical tin is the very flat surface and avoidance of problematic substances like lead in the
- Tin surface whisker can form.
- OSP English Organic Solderability
- Preservative is a surface treatment based on organic substances such as benzotriazole, imidazole or benzimidazole, which form a 100 nm thick organometallic coordinate bond with the uppermost layer of copper, thereby protecting the copper from oxidation.
- organic substances such as benzotriazole, imidazole or benzimidazole, which form a 100 nm thick organometallic coordinate bond with the uppermost layer of copper, thereby protecting the copper from oxidation.
- Immersion gold is first an approximately 3 ym to 6 ym layer of chemical nickel on the copper surface
- the nickel layer provides a barrier to gold to the copper layer, otherwise the gold would diffuse into the copper.
- An approximately 50 nm to 100 nm thick layer of chemical gold is applied to the nickel layer, whereby the uppermost nickel layer is chemically exchanged by gold.
- the advantage of this method is the comparatively long shelf life in addition to the flat surface.
- the disadvantage is the comparatively high process complexity and the associated costs.
- the invention is based on the object, a method for producing an end surface on at least one
- the inventive method comprises two coating steps, namely
- Surface protection layer are preferably inorganic-organic hybrid polymers with
- the electrically conductive adhesion promoter applied to the at least one exposed metallic surface.
- The preferably as an adhesive or paste
- the present adhesion promoter compensates for the unevenness of the metallic surfaces caused by the oxidation.
- the paste and the adhesive include metal particles and an organic or
- inorganic binder various additives, and depending on the Aushärtungsmechanismusggf. additionally a solvent or a crosslinking agent.
- the electrical conductivity is ensured by contact points of the metal particles with each other and the appropriate embedding of the metal particles in the binder of the detention.
- the order is preferably carried out in a printing process or by dispenser.
- Coating on a substrate is known from EP 1 230 414 Bl known in itself.
- a plasma jet of a substrate By passing a working gas through an excitation zone, a plasma jet of a substrate
- the gas plasma is generated by a gas discharge. In the plasma jet is separated from the
- the plasma coating process allows deposition of the metallic coating materials from the cold-active atmospheric pressure plasma directly onto the surface of the cured primer.
- Plasma coating processes can be used to automatically generate homogeneous metallic surface protective layers with reproducible layer thicknesses.
- the plasma coating process is therefore particularly suitable for the inexpensive and mass production of end surfaces on printed circuit boards.
- Suitable adhesion promoters are electrically conductive pastes based on silver, carbon or tin-antimony: ⁇
- An electrically conductive silver-based paste is characterized by very high conductivity and good adhesion to the exposed metallic surfaces.
- Hardening of the bonding agent takes place at 50 ° C to 175 ° C depending on the printed circuit board material.
- Electrically conductive paste based on carbon is characterized by a very good adhesion and a high Abrasion resistance. The curing of the bonding agent takes place at 50 ° C to 175 ° C depending on
- Electrically conductive paste based on tin-antimony is characterized by a good mechanical resistance and low required layer thicknesses.
- Hardening remains a high flexibility and flexibility, so that this adhesive is particularly suitable for flexible circuit boards.
- Adhesion promoters also come into consideration as electrically conductive adhesives, also referred to as conductive adhesives.
- Conductive adhesives are filled with metal (about 60-80 wt%
- Epoxy resin base which are cured in a temperature range between 120 ° C and 180 ° C.
- Conductivity is based on the fact that conductive paths are formed by the statistical distribution of the metallic constituents in the organic matrix.
- the conductive adhesives are insensitive to temperature changes.
- the conductive adhesive can be printed by printing, dispensing and direct
- a conductive adhesive particularly preferred because of its good electrical conductivity is a silver conductive adhesive with silver particles embedded in the organic matrix.
- atmospheric plasma coating process particles Copper are applied to the cured layer of the primer layer.
- the oxidation of the surface protective layer can be further reduced by applying copper coated particles coated with a protective layer by the atmospheric plasma coating method.
- the protective layer also causes the copper particles do not stick in the plasma jet yet. At the same time, wettability with the solder can be further improved with the coating.
- the protective layer consists in particular of an inorganic-organic hybrid polymer
- Such inorganic-organic hybrid polymers are also known under the brand name ORMOCER® the Fraunhofer Society for the Promotion of Applied Research e.V. Kunststoff.
- the protective layer consists of an acylate.
- the end surface is preferably made selectively only on individual ones of the exposed metal surfaces, and more specifically only on the pads of the
- the insulating regions of the printed circuit board and possibly existing contact surfaces are preferably coated with an adhesion-resistant material prior to the production of the end surface in order to avoid adhesion of the adhesion promoter and / or the metallic coating material.
- the adhesion-repellent material is for example a
- solder mask it protects the metallic areas of the conductor track not provided with the end surface, in particular the conductor tracks, from oxidation at the same time.
- the trace structure including the exposed
- Pads is preferably made of aluminum or copper.
- the interconnect structure including the
- pads can also consist of a Silberleit laminate, graphite or steel. Also electrically conductive organic and / or transparent materials are as
- Flex circuit boards, z. Based on polyimide films, PET films or composite films e.g. Aluminum / PET used.
- the circuit boards thus constructed are indeed more expensive, but can save space by folding in tightest structures z. B. in cameras, video cameras or smartphones
- the end surface can with the
- Printed circuit board can be produced.
- Figure 1 is a schematic representation of a
- FIGS. 2A-E a schematic representation of the method for producing an end surface on a printed circuit board
- Figure 3 is a schematic representation of the preparation of a solder joint between an SMD component and a circuit board of Figure 2 and
- Figure 4 is a schematic representation of a
- FIG. 1 shows schematically a printed circuit board (1) with a printed conductor structure comprising connecting surfaces (2) to which contact surfaces (13) of SMD components (12) are soldered.
- End surface (10) produced.
- the end surface (10) comprises two layers, namely a layer comprising an electrically conductive adhesion promoter (4) and a
- the production takes place in the following process steps:
- Figure 2A shows the coating of the surface of
- solder mask (3) serves as an adhesion-resistant material, so that the solder mask (3)
- the solder resist (3) can be applied by screen printing, by roller application or spraying on the remaining surface of the circuit board (1).
- FIG. 2B shows the coating of the connection surfaces (2) with the electrically conductive adhesion promoter (4) by means of a printing process (not shown).
- the bonding agent in the illustrated embodiment is a 70-80 conductive silver adhesive
- the curing of the electrically conductive silver adhesive is carried out with targeted supply of heat in a temperature range between 150 and 180 ° C.
- Atmospheric plasma coating process becomes relatively movable to the surface of the printed circuit board (1)
- the coating material is copper in the illustrated embodiment.
- the plasma coating apparatus (6) shown in Fig. 4 serves to generate an atmospheric plasma in an atmospheric plasma head (16). In the plasma head (16) by passing a working gas through an excitation zone, not shown, a plasma jet under
- the metallic coating material is introduced into the plasma jet via a separate feed (17)
- solder paste (11) is a paste-like mixture of solder metal powder and flux and serves to solder the SMD component (12) by means of reflow soldering.
- the printed circuit board (1) is equipped with the SMD component (12).
- the contact surfaces (13) of the SMD component (12) are placed on the terminal surfaces (2) provided with the end surface (10) and the solder paste (11). Now the assembled printed circuit board (1) is sufficiently heated so that the solder contained in the solder paste melts.
- the elevated temperature activates the flux in the solder paste.
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Abstract
In order to create a method for producing a finishing coating (10) on at least one exposed metal surface (2) of a circuit board (1), which effectively protects the metal surface (2) on the circuit board (1) against oxidation and ensures a reliable soldering of the components, according to the invention, a two-stage coating method is proposed, comprising the following steps: coating the at least one exposed metal surface with an electrically conductive bonding agent (4); and applying a conductive metal surface-protection layer (5) to the bonding agent (4) by means of an atmospheric plasma coating method (6).
Description
Verfahren zur Herstellung einer Endoberfläche und Leiterplatte Method for producing an end surface and printed circuit board
Die Erfindung betrifft ein Verfahren zur Herstellung einer Endoberfläche auf mindestens einer freiliegenden metallischen Fläche einer Leiterplatte sowie eine Leiterplatte mit einer nach dem Verfahren herstellbaren Endoberfläche. The invention relates to a method for producing an end surface on at least one exposed metallic surface of a printed circuit board and to a printed circuit board having an end surface which can be produced by the method.
Eine "Leiterplatte" ist ein rigider oder flexibler Träger für elektronische Bauteile. Sie dient der mechanischen A "circuit board" is a rigid or flexible support for electronic components. It serves the mechanical
Befestigung und elektrischen Verbindung der Bauteile. Der Träger umfasst elektrisch isolierendes Material mit daran haftenden, elektrisch leitenden Flächen, wie insbesondere lötfähigen Anschlussflächen, Kontaktflächen und Leiterbahnen. Als isolierendes Material ist faserverstärkter Kunststoff oder bei flexiblen Leiterplatten Polyimid üblich. Die Fixing and electrical connection of the components. The carrier comprises electrically insulating material with electrically conductive surfaces adhering thereto, such as, in particular, solderable connection surfaces, contact surfaces and conductor tracks. As insulating material, fiber-reinforced plastic or polyimide is common in flexible printed circuit boards. The
elektrisch leitenden Flächen werden zumeist aus einer dünnen Schicht Kupfer, üblich sind 35 ym, geätzt. electrically conductive surfaces are usually made of a thin layer of copper, usually 35 ym, etched.
Bedrahtete Bauelemente werden konventionell in Lötaugen gelötet. Oberflächenmontierten Bauelemente (engl. SurfaceWired components are conventionally soldered in pads. Surface-mounted components (English: Surface
Mounted Devices, kurz SMD) werden indes direkt auf lötfähige Anschlussflächen (pads) gelötet. SMD-Bauteile erhöhen die Packungsdichte und erlauben eine beidseitige Bestückung. Mounted Devices, SMD for short) are soldered directly onto solderable pads. SMD components increase the packing density and allow two-sided assembly.
Außerdem ist die Handhabung in automatischen Besides, the handling is automatic
Bestückungssystemen wesentlich einfacher. Bei bedrahteten Bauteilen besteht ein Problem darin, mit allen Anschlüssen die Lötaugen zu treffen und die zulässigen Biegeradien der Anschlussdrähte einzuhalten.
Beim Löten der Bauteile wird eine Stoffschlüssige Verbindung zwischen den Anschlüssen der Bauteile und den metallischen Anschlussflächen auf der Leiterplatte hergestellt, wobei eine flüssige Phase durch Schmelzen eines Lotes (Schmelzlöten) entsteht . Die metallischen Anschlussflächen auf der Assembly systems much easier. In the case of wired components, there is a problem with all terminals to meet the pads and comply with the allowable bending radii of the connecting wires. When soldering the components a cohesive connection between the terminals of the components and the metallic pads on the circuit board is produced, wherein a liquid phase by melting a solder (soldering) is formed. The metallic pads on the
Leiterplatte neigen, abhängig vom Material mehr oder weniger zur Reaktion mit dem umgebenden Luftsauerstoff zu einem Circuit board, depending on the material, more or less tend to react with the surrounding atmospheric oxygen
Metalloxid . Dadurch werden die Benetzungsfähigkeit mit dem Lot selber und die Ausbildung einer intermetallischen Phase zwischen den beiden zu verbindenden Oberflächen erschwert .Metal oxide. As a result, the wettability with the solder itself and the formation of an intermetallic phase between the two surfaces to be joined are made more difficult.
Voraussetzung für eine hohe Qualität einer in der SMD-Technik hergestellten Schaltung ist jedoch eine einwandfreie The prerequisite for a high quality of a circuit produced in the SMD technology, however, is a flawless
Verlötung der SMD-Bauteile . Soldering the SMD components.
Es ist daher erforderlich nach dem Ätzen der It is therefore necessary after etching the
Leiterbahnstruktur sowie der Anschluss- und ggf. Track structure and the connection and possibly
Kontaktflächen die freiliegenden metallischen Flächen, insbesondere die lötfähigen Anschlussflächen, vor einer Contact surfaces, the exposed metallic surfaces, in particular the solderable pads, in front of a
Oxidation zu schützen, da andernfalls der Lötvorgang Oxidation to protect, otherwise the soldering process
beeinträchtigt ist. is impaired.
Zum Schutz der freilegenden metallischen Flächen vor To protect the exposed metallic surfaces
Oxidation wird eine Endoberfläche aufgebracht. Oxidation is applied to an end surface.
Zum Aufbringen dieser Endoberfläche (n) finden folgende For applying this end surface (s), the following are found
Verfahren bei Leiterplatten Anwendung (vgl. Method for printed circuit board application (cf.
http : //www . leiterplattenakademie . de/Publikationen/cad- bg/cad_lp_bg_012.pdf vom 18.09.2017):
Bei der Methode HAL, auch HASL (englisch Hot Air Solder Leveling) wird die fertige produzierte Leiterplatte in ein Bad aus flüssigen Zinn-Blei getaucht und nachfolgend mit heißer Luft das überschüssige Zinn-Blei auf der Oberfläche weggeblasen, um eine möglichst glatte http: // www. pcb academy. de / Publications / cad-bg / cad_lp_bg_012.pdf from 18.09.2017): In the method HAL, also HASL (English Hot Air Solder Leveling), the finished printed circuit board is immersed in a bath of liquid tin-lead and then blown away with hot air, the excess tin-lead on the surface to a smooth as possible
Oberfläche an den lötfähigen Anschlussflächen zu Surface on the solderable pads too
erhalten. Damit wird das Kupfer durch eine Schicht aus Zinn-Blei überzogen, welche auch dem herkömmlichen receive. Thus, the copper is coated by a layer of tin-lead, which also the conventional
Lötzinn entspricht. HAL ist wegen der kostengünstigen Durchführung die am weitesten verbreitete Methode zur Herstellung einer Endoberfläche, weist aber als Nachteil durch ungleiche Verteilung der Zinn-Blei-Beschichtung an der Oberfläche relativ große Unebenheiten auf und kann bei sehr feinen Strukturen zu Kurzschlüssen führen. Solder corresponds. HAL is the most widely used method of producing an end surface because of its low cost performance, but has a disadvantage of unequal distribution of the tin-lead coating on the surface relatively large bumps and can lead to short circuits in very fine structures.
Bei der Methode Chemisch-Zinn (englisch Immersion Tin) wird die oberste Schicht des Kupfers mit Hilfe von In the method of chemical tin (English Immersion Tin), the top layer of copper using
Thioharnstoff durch Zinn chemisch ausgetauscht. Der chemische Austausch von Kupferatomen durch Zinnatome endet von selbst, wenn die Kupferoberflächen auf der Leitplatte vollständig durch Zinn in einer Dicke von ca. 0,7 ym bis 1,2 ym abgedeckt sind. Der Vorteil von Thiourea chemically exchanged with tin. The chemical exchange of copper atoms by tin atoms ends automatically when the copper surfaces on the baffle are completely covered by tin in a thickness of about 0.7 ym to 1.2 ym. The advantage of
Chemisch-Zinn ist die sehr ebene Oberfläche und das Vermeiden von problematischen Stoffen wie Blei im Chemical tin is the very flat surface and avoidance of problematic substances like lead in the
Endprodukt. Die Nachteile sind der Aufwand und Kosten in der Fertigung, der Einsatz von krebserregendem Final product. The disadvantages are the effort and costs in the production, the use of carcinogenic
Thioharnstoff und die Problematik, dass die reine Thiourea and the problem that the pure
Zinnoberfläche Whisker ausbilden kann.
Die Methode OSP (englisch Organic Solderability Tin surface whisker can form. The method OSP (English Organic Solderability
Preservative) ist eine Oberflächenbehandlung basierend auf organischen Substanzen wie Benzotriazol , Imidazol oder Benzimidazol , welche mit der obersten Kupferschicht eine 100 nm dicke metallorganische koordinative Bindung eingehen und so das Kupfer vor Oxidation schützen. Von Vorteil ist neben der ebenen Oberfläche die günstige Herstellung, nachteilig ist aber die begrenzte Lagerzeit OSP sollte nicht bei Leiterplatten mit Preservative) is a surface treatment based on organic substances such as benzotriazole, imidazole or benzimidazole, which form a 100 nm thick organometallic coordinate bond with the uppermost layer of copper, thereby protecting the copper from oxidation. The advantage is in addition to the flat surface, the cheap production, but disadvantageous is the limited storage time OSP should not with printed circuit boards
Durchsteckbauelementen eingesetzt werden, da die Through-hole components are used, as the
Oberflächenpassivierung in den Lötaugen nicht Surface passivation in the pads not
gewährleistet ist. is guaranteed.
Bei der Methode ENIG (englisch Electroless Nickel In the method ENIG (English Electroless Nickel
Immersion Gold) wird zunächst eine ca. 3 ym bis 6 ym Schicht chemisch Nickel auf die Kupferoberfläche Immersion gold) is first an approximately 3 ym to 6 ym layer of chemical nickel on the copper surface
aufgebracht. Die Nickelschicht stellt eine Barriere für Gold zur Kupferschicht dar, da sonst das Gold in das Kupfer diffundieren würde. Auf die Nickelschicht wird eine ca. 50 nm bis 100 nm dicke Schicht chemisch Gold aufgebracht, dabei wird die oberste Nickelschicht durch Gold chemisch ausgetauscht. Der Vorteil dieser Methode ist neben der ebenen Oberfläche die vergleichsweise lange Lagerfähigkeit. Nachteilig ist der vergleichsweise hohe Prozessaufwand und die damit verbundenen Kosten. applied. The nickel layer provides a barrier to gold to the copper layer, otherwise the gold would diffuse into the copper. An approximately 50 nm to 100 nm thick layer of chemical gold is applied to the nickel layer, whereby the uppermost nickel layer is chemically exchanged by gold. The advantage of this method is the comparatively long shelf life in addition to the flat surface. The disadvantage is the comparatively high process complexity and the associated costs.
Der Erfindung liegt die Aufgabe zu Grunde, ein Verfahren zur Herstellung einer Endoberfläche auf mindestens einer The invention is based on the object, a method for producing an end surface on at least one
freiliegenden metallischen Fläche einer Leiterplatte zu schaffen, welche die metallische Fläche auf der Leiterplatte, insbesondere aus Kupfer oder Aluminium, wirksam vor Oxidation
schützt und ein zuverlässiges Löten der Bauteile sicherstellt . to provide exposed metallic surface of a circuit board, which is the metallic surface on the circuit board, in particular of copper or aluminum, effective against oxidation protects and ensures reliable soldering of the components.
Diese Aufgabe wird durch ein Verfahren mit den Merkmalen des Anspruchs 1 gelöst. Das erfindungsgemäße Verfahren umfasst zwei Beschichtungsschritte, nämlich This object is achieved by a method having the features of claim 1. The inventive method comprises two coating steps, namely
1. Beschichten der mindestens einen freiliegenden 1. coating the at least one exposed
metallischen Fläche mit einem elektrisch leitfähigen Haftvermittler und metallic surface with an electrically conductive bonding agent and
2. Aufbringen einer elektrisch leitfähigen 2. Applying an electrically conductive
Oberflächenschutzschicht umfassend metallische Surface protective layer comprising metallic
Bestandteile auf dem Haftvermittler mittels eines Ingredients on the primer by means of a
atmosphärischen Plasmabeschichtungsverfahrens Mindestens atmospheric plasma coating process At least
90 Gew. %, vorzugsweise mindestens 95 Gew.% der 90% by weight, preferably at least 95% by weight of the
Oberflächenschutzschicht sind die metallischen Surface protection layer are the metallic ones
Bestandteile. Die übrigen Bestandteile der Ingredients. The remaining components of
Oberflächenschutzschicht sind vorzugsweise anorganisch- organische Hybridpolymere mit Surface protection layer are preferably inorganic-organic hybrid polymers with
Korrosionsschutzeigenschaften oder ein Acyrlat. Corrosion protection properties or an acylate.
Da die freiliegenden metallischen Flächen meist schon mit einer Oxidschicht versehen sind und schlechte Since the exposed metallic surfaces are usually already provided with an oxide layer and bad
Hafteigenschaften zu Loten zeigen, wird in dem ersten In the first
Beschichtungsschritt der elektrisch leitfähige Haftvermittler auf die mindestens eine freiliegende metallische Fläche aufgebracht . Der vorzugsweise als Kleber oder Paste Coating step, the electrically conductive adhesion promoter applied to the at least one exposed metallic surface. The preferably as an adhesive or paste
vorliegende Haftvermittler gleicht die durch die Oxidation verursachten Unebenheiten der metallischen Flächen aus . The present adhesion promoter compensates for the unevenness of the metallic surfaces caused by the oxidation.
Zugleich sorgt er für ein gute Anbindung der nach dem At the same time he ensures a good connection to the after
Aushärten des HaftVermittlers aufgebrachten
Oberflächenschutzschicht. Die Paste und der Kleber umfassen Metallpartikel und ein organisches oder Curing the Haftvermittlers applied Surface protective layer. The paste and the adhesive include metal particles and an organic or
anorganischesBindemittel , unterschiedliche Additive sowie je nach Aushärtungsmechanismusggf . zusätzlich ein Lösungsmittel oder ein Vernetzungsmittel. Die elektrische Leitfähigkeit wird durch Kontaktstellen der Metallpartikel untereinander sowie die geeignete Einbettung der Metallpartikel in das Bindemittel des Haft ermittlers gewährleistet . Der Auftrag erfolgt vorzugsweise in einem Druckverfahren oder mittels Dispenser . inorganic binder, various additives, and depending on the Aushärtungsmechanismusggf. additionally a solvent or a crosslinking agent. The electrical conductivity is ensured by contact points of the metal particles with each other and the appropriate embedding of the metal particles in the binder of the detention. The order is preferably carried out in a printing process or by dispenser.
Die am Markt verfügbaren leitfähigen Farben und Fasten als Haftvermittler sind j edoch nicht für Lötprozesse ausgelegt . Sie zeigen daher eine schlechte Benetzbarkeit für das Lot (Zinn) . However, the conductive colors and fasting available on the market as adhesion promoters are not designed for soldering processes. They therefore show poor wettability for the solder (tin).
Dieser Nachteil der Haftvermittler wird im zweiten This disadvantage of the adhesion promoter is in the second
Verfahrensschritt durch das Aufbringen einer gut lötfähigen metallischen Oberflächenschutzschicht auf dem gehärteten Haftvermittler mittels eines atmosphärischen Process step by applying a good solderable metallic surface protective layer on the cured primer by means of an atmospheric
PIasmabeschichtungsVerfahrens ausgeräumt . Überraschend hat sich in Versuchen gezeigt, dass die sich durch den Pasa coating process eliminated. Surprisingly, it has been shown in experiments that the through the
PIasmabeschichtungsprozess ergebende metallische Pima coating process resulting metallic
Oberflächenschutzschicht sehr wenig Oxidation zeigt sowie langzeitstabil eine gute Benetzbarkeit und Haftfestigkeit für Lot aufweist . Gleichzeitig bildet sich beim Lötprozess stets eine intermetallische Phase zwischen dem Lot und der derart hergestellten Oberflächenschutzschicht aus . Die Erzeugung eines atmosphärischen Plasmas, auch als Surface protection layer shows very little oxidation and long-term stable has a good wettability and adhesion to solder. At the same time, during the soldering process, an intermetallic phase always forms between the solder and the surface protective layer produced in this way. The generation of an atmospheric plasma, also called
Niedertemperaturplasma bezeichnet, zum Aufbringen einer Low-temperature plasma, for applying a
Beschichtung auf einem Substrat ist aus der EP 1 230 414 Bl
an sich bekannt. Durch Hindurchleiten eines Arbeitsgases durch eine Anregungszone wird ein Plasmastrahl eines Coating on a substrate is known from EP 1 230 414 Bl known in itself. By passing a working gas through an excitation zone, a plasma jet of a
Niedertemperaturplasmas unter atmosphärischen Bedingungen erzeugt. Die Erzeugung des Gasplasmas erfolgt durch eine Gasentladung. In den Plasmastrahl wird getrennt von dem Low temperature plasma generated under atmospheric conditions. The gas plasma is generated by a gas discharge. In the plasma jet is separated from the
Arbeitsgas das metallische Beschichtungsmaterial eingespeist. Abweichend von den thermischen Plasmen erreicht die Working gas fed the metallic coating material. Unlike the thermal plasmas reached the
Temperatur eines Niedertemperaturplasmas im Kern des Temperature of a low temperature plasma in the core of the
Plasmastrahls bei Umgebungsdruck weniger als 900 Grad Plasma jet at ambient pressure less than 900 degrees
Celsius. Celsius.
Das Plasmabeschichtungsverfahren ermöglicht eine Abscheidung der metallischen Beschichtungsmaterialien aus dem kaltaktiven Atmosphärendruck-Plasma direkt auf die Oberfläche des gehärteten Haftvermittlers. Mit dem The plasma coating process allows deposition of the metallic coating materials from the cold-active atmospheric pressure plasma directly onto the surface of the cured primer. With the
Plasmabeschichtungsverfahren lassen sich homogene metallische Oberflächenschutzschichten mit reproduzierbaren Schichtdicken automatisiert erzeugen. Das Plasmabeschichtungsverfahren ist daher für die preiswerte und massenhafte Herstellung von Endoberflächen auf Leiterplatten besonders geeignet. Plasma coating processes can be used to automatically generate homogeneous metallic surface protective layers with reproducible layer thicknesses. The plasma coating process is therefore particularly suitable for the inexpensive and mass production of end surfaces on printed circuit boards.
Als Haftvermittler kommen elektrisch leitfähige Pasten auf Silber-, Carbon- oder Zinn-Antimon-basis in Betracht: · Elektrisch leitende Paste auf Silberbasis zeichnet sich durch eine sehr hohe Leitfähigkeit und eine gute Haftung auf den freiliegenden metallische Flächen aus. Die Suitable adhesion promoters are electrically conductive pastes based on silver, carbon or tin-antimony: · An electrically conductive silver-based paste is characterized by very high conductivity and good adhesion to the exposed metallic surfaces. The
Härtung des Haftvermittlers erfolgt bei 50°C bis 175°C abhängig vom Leiterplattenmaterial. Hardening of the bonding agent takes place at 50 ° C to 175 ° C depending on the printed circuit board material.
• Elektrisch leitende Paste auf Carbonbasis zeichnet sich durch eine sehr gute Haftung aus und eine hohe
Abriebfestigkeit aus. Die Härtung des Haftvermittlers erfolgt bei 50°C bis 175°C abhängig vom • Electrically conductive paste based on carbon is characterized by a very good adhesion and a high Abrasion resistance. The curing of the bonding agent takes place at 50 ° C to 175 ° C depending on
Leiterplattenmaterial PCB material
Elektrisch leitfähige Paste auf Zinn-Antimon-Basis zeichnet sich durch ein gute mechanische Beständigkeit und geringe erforderliche Schichtdicken aus. Nach demElectrically conductive paste based on tin-antimony is characterized by a good mechanical resistance and low required layer thicknesses. After this
Härten bleibt eine hohe Flexibilität und Biegefähigkeit erhalten, so dass sich dieser Haftvermittler insbesondere für flexible Leiterplatten eignet. Hardening remains a high flexibility and flexibility, so that this adhesive is particularly suitable for flexible circuit boards.
Als Haftvermittler kommen außerdem elektrisch leitfähige Klebstoffe, auch als Leitkleber bezeichnet, in Betracht. Adhesion promoters also come into consideration as electrically conductive adhesives, also referred to as conductive adhesives.
Leitkleber sind metallisch gefüllte (ca. 60-80 Gew. % Conductive adhesives are filled with metal (about 60-80 wt%
Metallbestandteile) Klebstoffe, insbesondere auf Metal components) adhesives, in particular on
Epoxidharzbasis, die in einem Temperaturbereich zwischen 120 °C und 180 °C ausgehärtet werden. Die elektrische Epoxy resin base, which are cured in a temperature range between 120 ° C and 180 ° C. The electric
Leitfähigkeit beruht darauf, dass sich durch die statistische Verteilung der metallischen Bestandteile in der organischen Matrix leitfähige Pfade ausbilden. Die Leitkleber sind unempfindlich gegenüber Temperaturwechseln. Der Leitkleber kann durch Druckverfahren, Dispensen und direkte Conductivity is based on the fact that conductive paths are formed by the statistical distribution of the metallic constituents in the organic matrix. The conductive adhesives are insensitive to temperature changes. The conductive adhesive can be printed by printing, dispensing and direct
Strahlsysteme aufgebracht werden. Ein wegen seiner guten elektrischen Leifähigkeit besonders bevorzugter Leitkleber ist ein Silberleitkleber mit in der organischen Matrix eingebetteten Silber-Partikeln. Blasting systems are applied. A conductive adhesive particularly preferred because of its good electrical conductivity is a silver conductive adhesive with silver particles embedded in the organic matrix.
Im zweiten Verfahrensschritt wird eine gut lötfähige und mit dem Lot benetzbare Oberflächenschutzschicht mit geringer Oxidationsneigung dadurch erzeugt, dass mittels des In the second method step, a surface layer that is readily solderable and wettable with the solder is produced with a low tendency to oxidation by means of the
atmosphärischen Plasmabeschichtungsverfahrens Partikel aus
Kupfer auf die ausgehärtete Schicht des Haftvermittler- Schicht aufgebracht werden. atmospheric plasma coating process particles Copper are applied to the cured layer of the primer layer.
Die Oxidation der Oberflächenschutzschicht kann weiter dadurch reduziert werden, dass mittels des atmosphärischen Plasmabeschichtungsverfahrens mit einer Schutzschicht überzogene Partikel aus Kupfer aufgebracht werden. Die The oxidation of the surface protective layer can be further reduced by applying copper coated particles coated with a protective layer by the atmospheric plasma coating method. The
Schutzschicht bewirkt außerdem, dass die Kupferpartikel im Plasmastrahl noch nicht verkleben. Zugleich lässt sich mit der Beschichtung die Benetzbarkeit mit dem Lot weiter verbessern. Die Schutzschicht besteht insbesondere aus einem anorganisch-organischen Hybridpolymer mit Protective layer also causes the copper particles do not stick in the plasma jet yet. At the same time, wettability with the solder can be further improved with the coating. The protective layer consists in particular of an inorganic-organic hybrid polymer
Korrosionsschutzeigenschaften. Derartige anorganischorganischen Hybridpolymere sind auch unter dem Markennamen ORMOCER® der Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. München bekannt. Corrosion protection properties. Such inorganic-organic hybrid polymers are also known under the brand name ORMOCER® the Fraunhofer Society for the Promotion of Applied Research e.V. Munich.
Alternativ besteht die Schutzschicht aus einem Acyrlat. Alternatively, the protective layer consists of an acylate.
Wenn mittels des atmosphärischen If by means of the atmospheric
Plasmabeschichtungsverfahrens Partikel einer Plasma coating process Particle one
oxidationsbeständigen Kupfer-Legierung, insbesondere einer Kupfer-Zinn Legierung, aufgebracht werden, bleibt die oxidation-resistant copper alloy, in particular a copper-tin alloy, are applied, the remains
Oberflächenschutzschicht sogar nach einem Salzsprühtest langzeitstabil lötfähig. Gleichzeitig bildet sich beim Löten stets eine intermetallische Phase zwischen dem Lot und der Oberflächenschutzschicht . Surface protection layer even after a salt spray test long-term stability solderable. At the same time, an intermetallic phase always forms between the solder and the surface protective layer during soldering.
Die Endoberfläche wird vorzugsweise selektiv lediglich auf einzelnen der freiliegenden metallischen Flächen hergestellt und zwar insbesondere nur auf den Anschlussflächen der The end surface is preferably made selectively only on individual ones of the exposed metal surfaces, and more specifically only on the pads of the
Leiterplatte, an denen Bauteile angelötet werden.
Die verbleibende Oberfläche der Leiterplatte, d.h. die Printed circuit board to which components are soldered. The remaining surface of the circuit board, ie the
Leiterbahnen, die isolierenden Bereiche der Leiterplatte und ggf. vorhandene Kontaktflächen, wird vorzugsweise mit einem haftabweisenden Material vor dem Herstellen der Endoberfläche beschichtet, um eine Anhaftung des Haftvermittlers und/oder des metallischen Beschichtungsmaterials zu vermeiden. Printed conductors, the insulating regions of the printed circuit board and possibly existing contact surfaces are preferably coated with an adhesion-resistant material prior to the production of the end surface in order to avoid adhesion of the adhesion promoter and / or the metallic coating material.
Das haftabweisende Material ist beispielweise ein The adhesion-repellent material is for example a
Lötstopplack; er schützt die nicht mit der Endoberfläche versehenen metallischen Bereiche der Leiterbahn, insbesondere die Leiterbahnen zugleich vor Oxidation. solder mask; it protects the metallic areas of the conductor track not provided with the end surface, in particular the conductor tracks, from oxidation at the same time.
Die Leiterbahnstruktur einschließlich der freiliegenden The trace structure including the exposed
Anschlussflächen besteht vorzugsweise aus Aluminium oder Kupfer. Die Leiterbahnstruktur einschließlich der Pads is preferably made of aluminum or copper. The interconnect structure including the
Anschlussflächen kann jedoch auch aus einer Silberleitfarbe, Graphit oder Stahl bestehen. Auch elektrisch leitfähige organische und/oder transparente Materialien sind als But pads can also consist of a Silberleitfarbe, graphite or steel. Also electrically conductive organic and / or transparent materials are as
Leiterbahnstruktur möglich. Track structure possible.
Alternativ zu festen Leiterplatten kommen auch dünne As an alternative to fixed printed circuit boards, thin ones are also available
Flexleiterplatten, z. B. auf Basis von Polyimid-Folien, PET- Folien oder Verbundfolien z.B. Aluminium/PET zum Einsatz. Die damit aufgebauten Leiterplatten sind zwar teurer, können jedoch platzsparend durch Falten in engsten Strukturen z. B. in Fotoapparaten, Videokameras oder auch Smartphones Flex circuit boards, z. Based on polyimide films, PET films or composite films e.g. Aluminum / PET used. The circuit boards thus constructed are indeed more expensive, but can save space by folding in tightest structures z. B. in cameras, video cameras or smartphones
eingesetzt werden. Die Endoberfläche kann mit dem be used. The end surface can with the
erfindungsgemäßen Verfahren auch auf einer flexiblen inventive method also on a flexible
Leiterplatte hergestellt werden. Printed circuit board can be produced.
Nachfolgend wird die Erfindung anhand der Figuren näher erläutert. Es zeigen:
Figur 1 eine schematische Darstellung einer The invention will be explained in more detail with reference to the figures. Show it: Figure 1 is a schematic representation of a
Leiterplatte, Figuren 2A) -E) eine schematische Darstellung des Verfahrens zur Herstellung einer Endoberfläche auf einer Leiterplatte, Printed circuit board, FIGS. 2A-E) a schematic representation of the method for producing an end surface on a printed circuit board,
Figur 3 eine schematische Darstellung der Herstellung einer Lötverbindung zwischen einem SMD- Bauteil und einer Leiterplatte nach Figur 2 sowie Figure 3 is a schematic representation of the preparation of a solder joint between an SMD component and a circuit board of Figure 2 and
Figur 4 eine schematische Darstellung einer Figure 4 is a schematic representation of a
Vorrichtung zur Durchführung eines Device for carrying out a
atmosphärischen atmospheric
Plasmabeschichtungsverfahrens . Plasma coating process.
Figur 1 zeigt schematisch eine Leiterplatte (1) mit einer Leiterbahnstruktur umfassend Anschlussflächen (2), an denen Kontaktflächen (13) von SMD-Bauteilen (12) angelötet werden. FIG. 1 shows schematically a printed circuit board (1) with a printed conductor structure comprising connecting surfaces (2) to which contact surfaces (13) of SMD components (12) are soldered.
Auf den freiliegenden Anschlussflächen (2) der Leiterplatte (1) wird mittels des erfindungsgemäßen Verfahrens eine On the exposed pads (2) of the circuit board (1) by means of the method according to the invention a
Endoberfläche (10) hergestellt. Die Endoberfläche (10) umfasst zwei Schichten, nämlich eine Schicht umfassend einen elektrisch leitfähigen Haftvermittler (4) sowie eine End surface (10) produced. The end surface (10) comprises two layers, namely a layer comprising an electrically conductive adhesion promoter (4) and a
metallische Oberflächenschutzschicht (5) (vgl. Figuren 2B) 2C) ) . metallic surface protective layer (5) (see Fig. 2B) 2C)).
Die Herstellung erfolgt in folgenden Verfahrensschritten: The production takes place in the following process steps:
Figur 2A) zeigt die Beschichtung der Oberfläche der Figure 2A) shows the coating of the surface of
Leiterplatte (1) mit einem Lötstopplack (3), wobei Printed circuit board (1) with a Lötstopplack (3), wherein
ausschließlich auf den Anschlussflächen (2) aus Kupfer kein Lötstopplack (3) aufgebracht wird. Die verbleibende
Oberfläche der Leiterplatte (1), das heißt die Leiterbahnen zwischen den Anschlussflächen (2) und die isolierenden only on the pads (2) made of copper, no solder resist (3) is applied. The remaining one Surface of the circuit board (1), that is, the tracks between the pads (2) and the insulating
Bereiche zwischen den Leiterbahnen und Anschlussflächen werden mit dem Lötstopplack (3) überzogen. Der Lötstopplack (3) dient als haftabweisendes Material, damit die Areas between the tracks and pads are covered with the solder resist (3). The solder mask (3) serves as an adhesion-resistant material, so that the
Endoberfläche (10) in einem automatisierten Prozess selektiv lediglich auf den freiliegenden Anschlussflächen (2) End surface (10) in an automated process selectively only on the exposed pads (2)
hergestellt werden kann. Der Lötstopplack (3) kann im Wege des Siebdrucks, durch Walzenauftrag oder Sprühen auf der verbleibenden Oberfläche der Leiterplatte (1) aufgebracht werden . can be produced. The solder resist (3) can be applied by screen printing, by roller application or spraying on the remaining surface of the circuit board (1).
Figur 2B) zeigt das Beschichten der Anschlussflächen (2) mit dem elektrisch leitfähigen Haftvermittler (4) im Wege eines nicht dargestellten Druckprozesses. Bei dem Haftvermittler handelt es sich in dem dargestellten Ausführungsbeispiel um einen leitfähigen Silber-Klebstoff mit 70 - 80 FIG. 2B) shows the coating of the connection surfaces (2) with the electrically conductive adhesion promoter (4) by means of a printing process (not shown). The bonding agent in the illustrated embodiment is a 70-80 conductive silver adhesive
Gewichtsprozent Silberbestandteilen, die in einer Matrix aus Epoxidharz eingebettet sind. Das Aushärten des elektrisch leitfähigen Silber-Klebstoffs erfolgt unter gezielter Zufuhr von Wärme in einem Temperaturbereich zwischen 150 und 180° C. Percent by weight of silver constituents embedded in a matrix of epoxy resin. The curing of the electrically conductive silver adhesive is carried out with targeted supply of heat in a temperature range between 150 and 180 ° C.
Figur 2C) zeigt das Aufbringen einer metallischen Figure 2C) shows the application of a metallic
Oberflächenschutzschicht (5) aus Kupfer auf dem ausgehärteten Haftvermittler (4) mittels eines atmosphärischen Surface protection layer (5) of copper on the cured primer (4) by means of an atmospheric
Plasmabeschichtungsverfahrens . Zur Durchführung des Plasma coating process. To carry out the
atmosphärischen Plasmabeschichtungsverfahrens wird ein zur Oberfläche der Leiterplatte (1) relativ beweglich Atmospheric plasma coating process becomes relatively movable to the surface of the printed circuit board (1)
angeordnetes Plasmabeschichtungsgerät (6) verwendet, dessen Aufbau- und Funktionsweise anhand von Figur 4 näher erläutert wird. Das Plasmabeschichtungsverfahren ermöglicht eine arranged plasma coating apparatus (6) used, the structure and operation is explained in more detail with reference to Figure 4. The plasma coating process enables a
Abscheidung von metallischem Beschichtungsmaterial direkt auf der Oberfläche des gehärteten Haftvermittlers (4) . Bei dem Beschichtungsmaterial handelt es sich in dem dargestellten Ausführungsbeispiel um Kupfer.
Das in Figur 4 dargestellte Plasmabeschichtungsgerät (6) dient zur Erzeugung eines atmosphärischen Plasmas in einem atmosphärischem Plasmakopf (16) . In dem Plasmakopf (16) wird durch Hindurchleiten eines Arbeitsgases durch eine nicht dargestellte Anregungszone ein Plasmastrahl unter Deposition of metallic coating material directly on the surface of the cured adhesion promoter (4). The coating material is copper in the illustrated embodiment. The plasma coating apparatus (6) shown in Fig. 4 serves to generate an atmospheric plasma in an atmospheric plasma head (16). In the plasma head (16) by passing a working gas through an excitation zone, not shown, a plasma jet under
atmosphärischen Bedingungen erzeugt. Die Erzeugung des generated atmospheric conditions. The generation of the
Plasmas erfolgt innerhalb der Anregungszone durch eine Plasmas takes place within the excitation zone by a
Gasentladung. In den Plasmastrahl wird über eine separate Einspeisung (17) das metallische Beschichtungsmaterial Gas discharge. The metallic coating material is introduced into the plasma jet via a separate feed (17)
(Kupfer) eingespeist. Durch eine Relativbewegung (19) des Plasmabeschichtungsgerätes (6) in Pfeilrichtung zur (Copper) fed. By a relative movement (19) of the plasma coating apparatus (6) in the arrow direction to
Oberfläche der Leiterplatte (1) werden mit dem Plasmastrahl (18) die Metallpartikel (8) aus Kupfer sowohl auf die mit Lötstopplack (3) beschichteten Oberflächen als auch die freiliegenden Anschlussflächen (2) aufgebracht. Die im Wege des Plasmabeschichtungsverfahrens auf den Anschlussflächen (2) abgeschiedenen Metallpartikel (8) bilden die Surface of the circuit board (1) are applied with the plasma jet (18) the metal particles (8) of copper on both the solder resist (3) coated surfaces and the exposed pads (2). The deposited by means of the plasma coating process on the pads (2) metal particles (8) form the
Oberflächenschutzschicht (5) aus Kupfer aus. Aufgrund der haftabweisenden Eigenschaften des Lötstopplacks (3) können die Metallpartikel (8) auf den übrigen Oberflächenbereichen der Leiterplatte, wie dies insbesondere in Figuren 2D) , 2E) erkennbar ist, problemlos abgereinigt werden, so dass lediglich die Oberflächenschutzschicht (5) aus Kupfer auf den Anschlussflächen (2) verbleibt. Das Abreinigen erfolgt beispielsweise durch Abbürsten der Oberfläche. Figur 2 E) zeigt die gereinigte Oberfläche (9) des Lötstopplacks nach dem Abbürsten der Metallpartikel (8) . Das Verfahren zur Herstellung der Endoberfläche auf den Anschlussflächen (2) der Leiterplatte (1) ist damit abgeschlossen. Surface protection layer (5) made of copper. Due to the adhesion-repellent properties of the solder resist (3), the metal particles (8) on the other surface areas of the circuit board, as can be seen in particular in Figures 2D), 2E), can be easily cleaned, so that only the surface protection layer (5) made of copper the connection surfaces (2) remains. The cleaning is done for example by brushing the surface. Figure 2 E) shows the cleaned surface (9) of the solder resist after brushing the metal particles (8). The process for producing the end surface on the pads (2) of the printed circuit board (1) is completed.
Anhand von Figur 3 wird nachfolgend erläutert, wie auf die Leiterplatte (1) ein SMD-Bauteil (12) mit seinen On the basis of Figure 3 is explained below, as on the circuit board (1) an SMD component (12) with his
Kontaktflächen (13) angelötet wird: Auf die mit der Endoberfläche (10) versehenen Contact surfaces (13) is soldered: On those with the end surface (10) provided
Anschlussflächen (2) wird, wie in Figur 3B) dargestellt, eine
Lötpaste (11) aufgebracht. Die Lötpaste (11) ist eine pastöse Mischung aus Lot-Metallpulver und Flussmittel und dient zum Löten des SMD-Bauteils (12) im Wege des WideraufSchmelzlötens (Reflow-Löten) . Connecting surfaces (2), as shown in Figure 3B), a Solder paste (11) applied. The solder paste (11) is a paste-like mixture of solder metal powder and flux and serves to solder the SMD component (12) by means of reflow soldering.
Nach dem Aufbringen der Lötpaste (11) wird in dem in Figur 3C) dargestellten Schritt die Leiterplatte (1) mit den SMD- Bauteil (12) bestückt. Hierzu werden die Kontaktflächen (13) des SMD-Bauteils (12) auf den mit der Endoberfläche (10) und der Lötpaste (11) versehenen Anschlussflächen (2) aufgesetzt. Nun wird die bestückte Leiterplatte (1) ausreichend erhitzt, so dass das in der Lötpaste enthaltene Lot schmilzt. After the application of the solder paste (11), in the step shown in FIG. 3C), the printed circuit board (1) is equipped with the SMD component (12). For this purpose, the contact surfaces (13) of the SMD component (12) are placed on the terminal surfaces (2) provided with the end surface (10) and the solder paste (11). Now the assembled printed circuit board (1) is sufficiently heated so that the solder contained in the solder paste melts.
Gleichzeitig aktiviert die erhöhte Temperatur das Flussmittel in der Lötpaste. At the same time, the elevated temperature activates the flux in the solder paste.
Nach dem Abkühlen des Lots ist das Verlöten des SMD-Bauteils (12) mit der Leiterplatte (1) abgeschlossen, wie dies in Figur 3D) angedeutet ist.
After cooling of the solder soldering of the SMD component (12) to the circuit board (1) is completed, as indicated in Figure 3D).
Bezugszeichenliste LIST OF REFERENCE NUMBERS
Claims
Patentansprüche claims
1. Verfahren zur Herstellung einer Endoberfläche (10) auf mindestens einer freiliegenden metallischen Fläche (2) einer Leiterplatte (1) umfassend die Schritte A method of making an end surface (10) on at least one exposed metal surface (2) of a circuit board (1) comprising the steps
Beschichten der mindestens einen freiliegenden metallischen Fläche (2) mit einem elektrisch leitfähigen Haftvermittler (4), Coating the at least one exposed metallic surface (2) with an electrically conductive adhesion promoter (4),
Aufbringen einer elektrisch leitfähigen Applying an electrically conductive
Oberflächenschutzschicht (5) umfassend metallische Bestandteile auf dem Haftvermittler (4) mittels eines atmosphärischen Plasmabeschichtungsverfahrens . Surface protective layer (5) comprising metallic constituents on the primer (4) by means of an atmospheric plasma coating process.
2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass der Haftvermittler (4) eine elektrisch leitfähige Paste oder ein elektrisch leitfähiger Klebstoff ist. 3. Verfahren nach Anspruch 2, dadurch gekennzeichnet, dass der Haftvermittler (4) ein Silberleitkleber oder eine Silberpaste ist. 2. The method according to claim 1, characterized in that the adhesion promoter (4) is an electrically conductive paste or an electrically conductive adhesive. 3. The method according to claim 2, characterized in that the adhesion promoter (4) is a Silberleitkleber or a silver paste.
4. Verfahren nach einem der Ansprüche 1 bis 3, dadurch 4. The method according to any one of claims 1 to 3, characterized
gekennzeichnet, dass mittels des atmosphärischen characterized in that by means of the atmospheric
Plasmabeschichtungsverfahrens Partikel (8) aus Kupfer aufgebracht werden.
Verfahren nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass mittels des atmosphärischen Plasma coating process particles (8) are applied from copper. Method according to one of claims 1 to 3, characterized in that by means of the atmospheric
Plasmabeschichtungsverfahrens mit einer Schutzschicht versehene Partikel (8) aus Metall, insbesondere Kupfer oder Kupferlegierungen aufgebracht werden. Plasma coating process with a protective layer provided particles (8) of metal, in particular copper or copper alloys are applied.
Verfahren nach Anspruch 5, dadurch gekennzeichnet, dass die Schutzschicht aus einem anorganisch-organischen A method according to claim 5, characterized in that the protective layer of an inorganic-organic
Hybridpolymer mit Korrosionsschutzeigenschaften oder einem Acyrlat besteht. Hybrid polymer with anti-corrosion properties or Acyrlat exists.
Verfahren nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass mittels des atmosphärischen Method according to one of claims 1 to 3, characterized in that by means of the atmospheric
Plasmabeschichtungsverfahrens Partikel (8) einer Plasma coating process Particles (8) of a
oxidationsbeständigen Kupfer-Legierung, insbesondere einer Kupfer-Zinn Legierung, aufgebracht werden. oxidation-resistant copper alloy, in particular a copper-tin alloy, are applied.
Verfahren nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, dass die Endoberfläche (10) lediglich auf einzelnen der freiliegenden metallischen Flächen (2) hergestellt wird. Method according to one of claims 1 to 7, characterized in that the end surface (10) is produced only on individual of the exposed metallic surfaces (2).
Verfahren nach Anspruch 8, dadurch gekennzeichnet, dass die freiliegenden metallischen Flächen (2) lötfähige Anschlussflächen (2) umfassen und die Endoberfläche (10) ausschließlich auf den Anschlussflächen (2) hergestellt wird . A method according to claim 8, characterized in that the exposed metallic surfaces (2) solderable pads (2) and the end surface (10) is made exclusively on the pads (2).
Verfahren nach Anspruch 8 oder 9, dadurch gekennzeichnet, dass die verbleibende Oberfläche der Leiterplatte (1) mit einem für die metallische Oberflächenschutzschicht
haftabweisenden Material (3) vor dem Herstellen der A method according to claim 8 or 9, characterized in that the remaining surface of the printed circuit board (1) with a for the metallic surface protective layer Adhesive repellent material (3) before making the
Endoberfläche beschichtet werden. Final surface to be coated.
11. Verfahren nach einem der Ansprüche 1 bis 10, dadurch 11. The method according to any one of claims 1 to 10, characterized
gekennzeichnet, dass die freiliegenden metallischen characterized in that the exposed metallic
Flächen (2) der Leiterplatte aus Aluminium, Kupfer, einer Silberleitfarbe, Graphit oder Stahl bestehen. Surfaces (2) of the printed circuit board made of aluminum, copper, a Silberleitfarbe, graphite or steel.
12. Verfahren nach einem der Ansprüche 1 bis 11, dadurch 12. The method according to any one of claims 1 to 11, characterized
gekennzeichnet, dass die Endoberfläche (10) auf einer flexiblen Leiterplatte hergestellt wird. characterized in that the end surface (10) is made on a flexible circuit board.
13. Verfahren nach einem der Ansprüche 1 bis 12, dadurch 13. The method according to any one of claims 1 to 12, characterized
gekennzeichnet, dass vor dem Aufbringen der characterized in that before applying the
Oberflächenschutzschicht der Haftvermittler gehärtet, getrocknet oder venetzt wird. Surface protection layer of the adhesion promoter is cured, dried or crosslinked.
14. Leiterplatte (1) mit mindestens einer freiliegenden 14. Printed circuit board (1) with at least one exposed
metallischen Fläche und einer Endoberfläche auf der mindestens einen metallischen Fläche herstellbar mit einem Verfahren nach einem der Ansprüche 1 bis 13.
metallic surface and an end surface on the at least one metallic surface produced by a method according to any one of claims 1 to 13.
Priority Applications (1)
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EP18778802.1A EP3685639A1 (en) | 2017-09-22 | 2018-08-28 | Method for producing a finishing coating and circuit board |
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DE102017122059.3 | 2017-09-22 | ||
DE102017122059.3A DE102017122059A1 (en) | 2017-09-22 | 2017-09-22 | Method for producing an end surface and printed circuit board |
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PCT/EP2018/073117 WO2019057450A1 (en) | 2017-09-22 | 2018-08-28 | Method for producing a finishing coating and circuit board |
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DE (1) | DE102017122059A1 (en) |
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Cited By (1)
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CN111424256A (en) * | 2020-04-30 | 2020-07-17 | 江苏菲沃泰纳米科技有限公司 | Coating method and protective layer thereof |
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DE10153482A1 (en) * | 2001-10-30 | 2003-05-22 | Leoni Ag | Method for treating an electrical strip conductor on a foil wire applies a coating with thermal gun/flame spraying to a locally defined surface area on a conductor surface |
EP1230414B1 (en) | 1999-10-30 | 2004-10-06 | PlasmaTreat GmbH | Method and device for plasma coating surfaces |
WO2012123530A1 (en) * | 2011-03-16 | 2012-09-20 | Reinhausen Plasma Gmbh | Coating, and method and device for coating |
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DE59602394D1 (en) * | 1995-03-17 | 1999-08-12 | Hoechst Ag | THERMAL APPLICATION METHOD FOR THIN CERAMIC LAYERS AND DEVICE FOR APPLYING |
AU2014202320B2 (en) * | 2008-08-18 | 2015-09-17 | Semblant Limited | Halo-hydrocarbon polymer coating |
DE102009048397A1 (en) * | 2009-10-06 | 2011-04-07 | Plasmatreat Gmbh | Atmospheric pressure plasma process for producing surface modified particles and coatings |
DE102013103805A1 (en) * | 2013-04-16 | 2014-10-16 | Billion SAS | Structured surface component and method of making the same |
DE102015214628A1 (en) * | 2015-07-31 | 2017-02-02 | BSH Hausgeräte GmbH | Heating device for a household appliance |
-
2017
- 2017-09-22 DE DE102017122059.3A patent/DE102017122059A1/en active Pending
-
2018
- 2018-08-28 EP EP18778802.1A patent/EP3685639A1/en not_active Withdrawn
- 2018-08-28 WO PCT/EP2018/073117 patent/WO2019057450A1/en unknown
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US5964395A (en) * | 1997-06-09 | 1999-10-12 | Ford Motor Company | Predeposited transient phase electronic interconnect media |
EP1230414B1 (en) | 1999-10-30 | 2004-10-06 | PlasmaTreat GmbH | Method and device for plasma coating surfaces |
DE10153482A1 (en) * | 2001-10-30 | 2003-05-22 | Leoni Ag | Method for treating an electrical strip conductor on a foil wire applies a coating with thermal gun/flame spraying to a locally defined surface area on a conductor surface |
WO2012123530A1 (en) * | 2011-03-16 | 2012-09-20 | Reinhausen Plasma Gmbh | Coating, and method and device for coating |
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CN111424256A (en) * | 2020-04-30 | 2020-07-17 | 江苏菲沃泰纳米科技有限公司 | Coating method and protective layer thereof |
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