WO2019031379A1 - Connected wiring board and display device - Google Patents

Connected wiring board and display device Download PDF

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Publication number
WO2019031379A1
WO2019031379A1 PCT/JP2018/029020 JP2018029020W WO2019031379A1 WO 2019031379 A1 WO2019031379 A1 WO 2019031379A1 JP 2018029020 W JP2018029020 W JP 2018029020W WO 2019031379 A1 WO2019031379 A1 WO 2019031379A1
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WO
WIPO (PCT)
Prior art keywords
wiring board
connection
engagement
solder
end edge
Prior art date
Application number
PCT/JP2018/029020
Other languages
French (fr)
Japanese (ja)
Inventor
菊地　勝敏
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Publication of WO2019031379A1 publication Critical patent/WO2019031379A1/en

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits

Definitions

  • connection wiring board and a display device.
  • the display device in addition to a display panel having a display surface for displaying an image, is provided with a plurality of functional units such as a backlight unit and a touch panel unit attached to the display panel.
  • a plurality of functional units such as a backlight unit and a touch panel unit attached to the display panel.
  • the plurality of wiring boards connected to the respective functional units are mutually connected to form a connection wiring board.
  • solder is applied after stacking a plurality of wiring substrates, and there is a limit in achieving thinning.
  • the terminals of the wiring extending substantially on a straight line are conductively connected by solder in a state in which the main flexible substrate and the light driving flexible substrate abut on the end faces without overlapping.
  • a solder connection structure is disclosed.
  • the thickness of the substrate connection portion becomes substantially equal to the thickness of the thicker one of the two wiring substrates, and can be reduced by the thickness of one of the wiring substrates, thereby achieving a reduction in thickness.
  • solder connection is a light also in which structure. It is formed along the extending direction of the drive flexible substrate.
  • tensile stress hereinafter referred to as In consideration of the case where separation stress is applied, such stress mainly acts along the extending direction of the light drive flexible substrate, and the solder is formed to extend in the same direction. At the connection portion, the solder acts easily along the connection direction since it works.
  • the present technology is completed based on the above circumstances, and it is an object of the present invention to provide a connection wiring board having excellent connection reliability while achieving thinning of a substrate connection portion. Further, the present technology provides a display device provided with such a connection wiring board.
  • connection wiring board is disposed at a connection portion between a first wiring board, a second wiring board connected to the first wiring board, the first wiring board, and the second wiring board. And a solder for electrically connecting the two wiring substrates, wherein the first wiring substrate includes a first substrate body portion and a first engaging portion extending from the first substrate body portion. And the second wiring board has a second engaging portion that engages with the first engaging portion of the first wiring board to form the connecting portion together with the first engaging portion.
  • the first engagement portion and the second engagement portion are disposed with their end faces facing each other without overlapping in a plan view, and the solder is a portion of the first engagement portion. It extends in a cross direction intersecting with the extension direction of the joint portion to connect between the end edge of the first engagement portion and the end edge of the second engagement portion.
  • the connecting portion can be thinned.
  • the separation stress that tends to separate the two wiring boards acts mainly along the extending direction of the first engaging portion.
  • the solder connection is provided so as to extend in the cross direction intersecting with the extending direction, thereby increasing resistance to the separation stress which tends to separate the two substrates 30 and 50 and breaking the connection portion. It can be made hard to happen. As a result, the connection reliability of the electrical connection in the connection portion 75 can be improved.
  • the separation stress can be dispersed to further improve the connection reliability.
  • at least one of the first wiring substrate and the second wiring substrate can be a flexible printed circuit (FPC) having flexibility.
  • FPC flexible printed circuit
  • the crossing direction in which the solder extends be a direction orthogonal to the extending direction.
  • a connection wiring board according to the present technology is a display device provided with the connection wiring board of the above configuration. According to such a configuration, by using a thin connection wiring board with high connection reliability, it is possible to secure the operation reliability of the device while achieving the thinning of the entire display device.
  • FIG. 3 An exploded perspective view of a liquid crystal display device according to an embodiment Plan view of a connection wiring board connected to a liquid crystal panel or the like A partial enlarged view of the connecting portion of FIG. 3 Enlarged view of the connection portion in the first modification (circle) Enlarged view of the connection part in the second modification (whip shape) Enlarged view of the connection part in the third modification (whip shape)
  • Embodiment Embodiments are described by means of FIGS. 1 to 3.
  • the liquid crystal display device (display device) 1 is illustrated.
  • X-axis, Y-axis, and Z-axis are shown in part of each drawing, and the directions of the respective axes are drawn in the same direction in each drawing.
  • the upper side in FIG. 1 is the front (lower side is the back)
  • the left side in FIGS. 2 and 3 is the left (right side is the right)
  • the upper side is the upper side (lower side is the lower).
  • the liquid crystal display device 1 is generally in the form of a vertically elongated rectangular shallow box, and roughly, as shown in FIG. 1, a liquid crystal panel (display panel) 10 for displaying an image; And a backlight unit 20, which is an external light source disposed on the back side of the liquid crystal panel to irradiate the liquid crystal panel 10 with light for display.
  • the liquid crystal display device is not limited to such a configuration.
  • a frame member (bezel) not shown
  • a touch panel unit, or the like may be disposed on the front side of the liquid crystal panel 10.
  • the liquid crystal display device 1 includes a mobile phone terminal (including a smartphone and the like), a notebook computer (including a tablet notebook computer and the like), a wearable terminal (including a smart watch and the like), a portable information terminal (electronic book And PDAs), portable game machines, digital photo frames, and other various electronic devices (not shown).
  • a mobile phone terminal including a smartphone and the like
  • a notebook computer including a tablet notebook computer and the like
  • a wearable terminal including a smart watch and the like
  • portable information terminal electronic book And PDAs
  • portable game machines digital photo frames, and other various electronic devices (not shown).
  • the screen size of the liquid crystal panel 10 is about several inches to several tens of inches, and is generally classified into small or medium size.
  • liquid crystal display device to which the present technology can be applied is not limited to such a configuration, and a display device including a liquid crystal panel of a screen size classified into medium size or large size (super large size) of several tens of inches or more Also, the present technology is applicable.
  • the liquid crystal panel 10 will be described.
  • the liquid crystal panel 10 may have a known configuration.
  • the liquid crystal panel 10 according to the present embodiment has a generally rectangular shape in a plan view as a whole, and the short side direction coincides with the X axis direction, and the long side direction corresponds to the Y axis direction. It is assumed that they coincide with each other and that the thickness direction coincides with the Z-axis direction.
  • the surface on the front side of the liquid crystal panel 10 is a display surface, and a display area (active area) in which an image is displayed is defined at the central portion thereof.
  • a frame-like (frame-like, annular) outer peripheral portion surrounding the display area is a non-display area (non-active area) in which an image is not displayed.
  • the liquid crystal panel 10 is formed by bonding a pair of substrates 11 and 12 made of a glass substrate or the like with a liquid crystal layer (not shown) interposed therebetween.
  • the liquid crystal layer contains liquid crystal molecules, which are substances whose optical characteristics change with voltage application, and changes the alignment of the liquid crystal molecules by controlling the voltage applied to the liquid crystal layer to display an image in the display region.
  • the polarizing plate 13 is affixed on the outer surface side of both the substrates 11 and 12, respectively.
  • the substrates 11 and 12 are provided with electrodes for applying a voltage to the liquid crystal layer.
  • the one disposed on the back side is the array substrate (active matrix substrate, element substrate) 12 and the one disposed on the front side is the CF substrate (color filter substrate, counter substrate) 11).
  • the array substrate 12 is provided with switching elements (for example, TFTs) connected to source wiring and gate wiring which are orthogonal to each other, and pixel electrodes and the like connected to the switching elements.
  • the CF substrate 11 is provided with a color filter or the like in which colored portions such as R (red), G (green), B (blue), etc. are arranged in a predetermined array.
  • the liquid crystal panel 10 is not limited to such a configuration.
  • the array substrate 12 may have a configuration in which a pixel electrode and a common electrode are provided.
  • the CF substrate 11 has a length dimension in the short side direction (X-axis direction) substantially equal to that of the array substrate 12, the length dimension in the long side direction (Y-axis direction) is the array substrate
  • the substrates 11 and 12 are formed to be smaller than 12, and both substrates 11 and 12 have the same upper edge, and the CF substrate 11 does not overlap over a predetermined range at the lower edge of the array substrate 12 Are placed opposite each other so that
  • the display area described above is defined by the overlapping portion of the CF substrate 11 and the array substrate 12, and the entire area of the CF substrate non-overlapping portion 12A is a non-display area.
  • a driver (drive component) 41 and a flexible substrate (second wiring substrate) 30 for an LCD (Liquid Crystal Display: liquid crystal display panel) 30 are connected to the CF substrate non-overlapping portion 12A.
  • the driver 41 is formed of an LSI chip having a drive circuit inside, processes an input signal supplied from an external signal supply source (not shown) through the LCD flexible substrate 30, generates an output signal, and outputs the output signal. Is output to the display region of the liquid crystal panel 10 to apply a voltage to drive liquid crystal molecules which are display elements.
  • the driver 41 according to the present embodiment has a long rectangular shape, with the longitudinal direction thereof aligned with the short side direction (X axis direction) of the array substrate 12, and the CF along the lower edge of the array substrate 12. It is attached to the board
  • the flexible substrate 30 for LCD will be described later.
  • the backlight unit 20 can have a known configuration.
  • the backlight unit 20 according to the present embodiment is, as shown in FIG. 1, a rectangular shallow box-shaped metal chassis (supporting member: casing, housing) 21 opened toward the liquid crystal panel 10 (front side) 21.
  • a reflection sheet 22 made of a synthetic resin sheet material exhibiting silver color or white excellent in light reflectivity and light emitted from a light source are introduced and propagated inside
  • a plurality of LED substrate holders 24A are formed on the lower edge side of the frame 24, and a plurality of LED substrates are mounted on the LED mounting portion (first substrate body portion) 51 of the LED flexible substrate (first wiring substrate) 50 thereon.
  • the rectangular frame-shaped (frame-like, annular) fixing member 27 following the frame 24 has a plate surface on the back side of the liquid crystal panel 10 and the LED flexible substrate of the backlight unit 20.
  • the liquid crystal panel 10 and the backlight unit 20 are fixed by being fixedly held between the surface 50 and the front surface of the optical sheet 26.
  • the fixation between the liquid crystal panel 10 and the backlight unit 20 is not limited to this.
  • the outer peripheral portion of the liquid crystal panel 10 is sandwiched between the backlight unit 20 and the bezel disposed on the holding surface of the liquid crystal panel 10 It is good also as composition held by.
  • connection wiring board 70 will be described mainly with reference to FIG.
  • the LCD flexible substrate 30 connected to the liquid crystal panel 10 and the LED flexible substrate 50 connected to the backlight unit 20 are mutually connected and electrically connected by the solder 60. 6 show a plan configuration of the connection wiring board 70.
  • Each of the flexible substrate 30 for LCD and the flexible substrate 50 for LED is provided with a base 39, 59 in which a synthetic resin material such as polyimide or PET having an insulating property and flexibility is formed in a sheet shape.
  • a large number of wiring (conductive path) patterns are formed on the surface 59.
  • the substrates 30 and 50 are not limited to such a configuration.
  • the wiring patterns may be formed while forming an insulating layer appropriately on a thin film made of metal.
  • the wiring pattern can be formed by a known method using various conductive materials. For example, a wiring pattern formed by photolithography using copper can be used.
  • the flexible substrate 30 for LCD and the flexible substrate 50 for LED are both single-sided flexible substrates in which the wiring pattern is formed on one main surface of the base materials 39 and 59, the wiring patterns are on both main surfaces. It may be a double-sided flexible substrate formed.
  • the LCD flexible substrate 30 is a wiring substrate for transmitting various input signals for controlling the driving of the liquid crystal panel 10 emitted from an external signal supply source (not shown) to the driver 41 described above.
  • the LCD flexible substrate 30 according to the present embodiment is formed to have a substantially L-shaped outer shape in a plan view, and the short side direction along the lower edge of the liquid crystal panel 10
  • One of the LCD connection portion 31 which extends in the X-axis direction and is connected to a position closer to the lower edge than the driver 41 in the CF substrate non-overlapping portion 12A, and one of the LCD connection portions 31 (right side in FIG. 2)
  • an extending portion 32 extending from the end of the head along the Y axis to the opposite side to the liquid crystal panel 10.
  • connection of the flexible substrate 30 for LCD to the array substrate 12 can be performed by a known method, and for example, electrically and mechanically connected using an anisotropic conductive film (ACF) or the like. can do. Further, as also shown in FIG. 2, various circuit elements are mounted on the base material 39.
  • ACF anisotropic conductive film
  • the LED flexible substrate 50 is a wiring substrate that transmits various input signals emitted from an external signal supply source (not shown) to control the driving of the LED 25.
  • the LED flexible substrate 50 extends in the short side direction (X-axis direction) of the backlight unit 20 to mount the LED 25 (LED mounting portion (first substrate main body)
  • An extension engaging portion (a second portion) extending from the position closer to one end of the LED mounting portion 51 (rightward) to the opposite side (the lower side) to the light guide plate 23 and the like along the Y axis direction; 1 engaging portion) 55.
  • the extension end of the extension engagement portion 55 of the LED flexible substrate 50 is an engagement head 56.
  • the extension end portion of the extension engagement portion 55 extending in the Y-axis direction protrudes to both sides in the X-axis direction and becomes wider than the other portions of the extension engagement portion 55, and the short side direction Are formed in a rectangular shape in which the long side direction coincides with the Y axis direction.
  • the outer corner between the LCD connection portion 31 and the extension portion 32 of the LCD flexible substrate 30 overlaps the base end portion of the extension engagement portion 55 of the LED flexible substrate 50.
  • An engagement receiving portion (second engagement portion) 35 for receiving the extension end portion of the extension engagement portion 55 is formed on the lower side of the cut-out portion. ing.
  • an engagement hole portion 36 and a pair of projecting portions (regulating portions) 37, 37 are formed in the engagement receiving portion 35.
  • the engagement hole portion 36 is formed in a rectangular shape that is a large circle that follows the engagement head 56, and does not overlap with the engagement head 56 in plan view. It is accepted internally.
  • the protrusions 37 and 37 are formed so as to protrude from the left and right edges of the opening provided on the upper side of the engagement hole 36 in the direction opposite to each other.
  • the distance between the protrusions 37 and 37 is formed to be slightly larger than the width of the proximal end of the extension engagement portion 55, and the extension engagement portion 55 is formed between the pair of protrusions 37 and 37.
  • the engagement head 56 is fitted and held in an engagement hole 36 formed on the back side (lower side) than this.
  • the outer peripheral end face of the engagement head 56 and the inner peripheral end face of the engagement hole 36 face each other without overlapping the extension engagement portion 55 and the engagement receiving portion 35 in a plan view. It is distributed in the state.
  • the solder 60 is applied between the end edge of the engagement hole 36 and the end edge of the engagement head 56
  • the LCD flexible substrate 30 and the LED flexible substrate 50 are electrically connected.
  • a first solder connection portion 61 extending in the X-axis direction is formed to connect with the left edge 36 (first edge of the second engagement portion) 36A of 36.
  • solder connection portion 62 extending in the X-axis direction is formed to connect the two.
  • a third solder connection 63 extending in the Y-axis direction is formed to connect the lower end edge 56C of the engagement head 56 and the lower edge 36C of the engagement hole 36.
  • solder connection parts 61, 62, 63 can also be formed according to a known method.
  • the space is formed by applying the solder 60 in a flowable state. It is possible to embed and connect the flexible substrate 30 for LCD and the flexible substrate 50 for LED electrically.
  • the application amount of the solder 60 can be appropriately adjusted. For example, it is preferable that the interface between the engagement head 56 and the engagement hole 36 be closed without any gap and be slightly raised.
  • connection wiring board 70 includes the LED flexible board (first wiring board) 50 and the LCD flexible board (second wiring) connected to the LED flexible board 50.
  • a solder 60 disposed at the connecting portion between the flexible substrate 50 for LED and the flexible substrate 30 for LCD to electrically connect the two wiring substrates, and the flexible substrate 50 for LED is mounted on the LED Portion (first substrate body portion) 51, and an extension engagement portion (first engagement portion) 55 extending in the Y-axis direction from the LED mounting portion 51, and the flexible substrate 50 for LED is extended.
  • the receiving part 35 is a plane
  • the solder 60 is disposed with the end faces facing each other without overlapping, and in the first solder connection portion 61 and the second solder connection portion 62, the extending direction of the extension engaging portion 55 (Y axis Extending in a cross direction (X-axis direction) intersecting with the direction) to connect the end edge of the extension engaging portion 55 and the end edge of the engagement receiving portion 35.
  • connection wiring board 70 configured as described above, the extending engaging portion 55 of the LED flexible substrate 50 and the engagement receiving portion 35 of the LCD flexible substrate 30 are disposed so as not to overlap with each other.
  • the connecting portion 75 can be made thinner.
  • a separation stress that tends to separate the extension engagement portion 55 from the engagement receiving portion 35 acts along the extension direction of the extension engagement portion 55, that is, the Y-axis direction.
  • solder connection is formed along the extending direction of one substrate Compared with the conventional structure, the resistance to the separation stress that tends to separate the extended engagement portion 55 from the engagement receiving portion 35 is increased, and the breakage of the solder connection portion is less likely to occur. As a result, the connection reliability of the electrical connection in the connection portion 75 can be improved. Furthermore, if solder connections are provided at a plurality of locations and extended in a plurality of directions, the separation stress can be dispersed to further improve the connection reliability.
  • connection wiring substrate 70 the LED flexible substrate 50 and the LCD flexible substrate 30 are both flexible substrates having a sheet-like thin film having flexibility.
  • the present technology is useful in further reducing the thickness of such a connection wiring board 70.
  • the extending direction (X-axis direction) of the first solder connection portion 61 and the second solder connection portion 62 is orthogonal to the extending direction (Y-axis direction) of the extending engagement portion 55, It is possible to effectively increase the resistance to pull-off stress.
  • connection wiring board 70 the first solder connection portion 61 and the second solder connection portion 62 are formed on the left and right sides of the extending engagement portion 55.
  • the separation stress of both substrates 30 and 50 is effectively dispersed to the left and right.
  • the connection portion since the separation stress is dispersed in opposite directions on the same straight line extending in the direction (X-axis direction) orthogonal to the extending direction of the extending engaging portion 55, the connection portion The power transmitted to is reduced, making it particularly difficult for the solder to break.
  • connection portions by the solder 60 are provided at a total of three places of the first solder connection portion 61, the second solder connection portion 62, and the third solder connection portion 63.
  • connection wiring board 70 the engagement head 56 is held in the engagement hole portion 36 by the engagement head 56 of the extension engagement portion 55 in the engagement receiving portion 35.
  • a pair of protrusions 37, 37 are formed on the upper side of. Even when the separation stress between the two substrates 30, 50 is generated, the upward movement of the engagement head 56 by the pair of projections 37, 37, that is, the flexible substrate 50 for LED from the flexible substrate 30 for LCD The movement in the separation direction is restricted, and the separation between the extension engaging portion 55 and the engagement receiving portion 35 is suppressed. As a result, solder breakage in the connection portion is less likely to occur.
  • the engagement head 56 is structured to be substantially fitted into the engagement hole portion 36, relative movement in other directions is also less likely to occur. Furthermore, prior to the connection by the solder 60, since the extension engaging portion 55 can be positioned in the engagement receiving portion 35 without requiring any other positioning structure, the positioning by the pin-hole engagement usually provided Since the structure is unnecessary, it is possible to miniaturize the two substrates 30 and 50.
  • the liquid crystal display device 1 includes the thin connection wiring board 70 having the above-described configuration and high connection reliability, so that high operation reliability can be realized while achieving thinning of the entire device. It is done.
  • connection wiring board 170 according to the present modification 1 the connecting wiring board 70 according to the embodiment is different from the connection wiring board 70 according to the embodiment in that the engaging head 56 which is formed in a rectangular shape in the embodiment is formed in a circular shape. It is different.
  • symbol is attached
  • the engagement head 156 provided at the tip of the extension engagement portion (first engagement portion) 155 that constitutes the connection portion 175 has a circular shape, and
  • the joint receiving portion (second engaging portion) 135 protrudes in the direction opposite to each other from the left and right edges of the opening of the circular engaging hole portion 136 which can receive the same and the extending engaging portion 155 upper side.
  • the solder 60 extends to the left and right along the diameter parallel to the X-axis. It is arranged to form a solder connection 162.
  • the separation stress for relatively moving the extension engagement portion 155 upward (opposite to the extension direction of the extension engagement portion 155) relative to the engagement receiving portion 135 are distributed to the upper curved end surface of the circular engagement head 156 and received by the lower curved end surface of the protrusion 137 (the upper end surface of the engagement hole 136).
  • separation stress can be dispersed in a wide range while avoiding stress concentration, and the separation between both substrates 30 and 50 can be regulated.
  • the first solder connection portion 161 and the second solder connection portion 162 are provided on the diameter along the X-axis direction orthogonal to the Y-axis direction which is the extension direction of the extension engagement portion 155. The resistance to the separation stress can be increased to suppress the breakage of the solder connection portion.
  • connection wiring board 270 A second modification will be described with reference to FIG.
  • the extended engaging portion 55 having the rectangular engaging head 56 in the embodiment and formed in a hammer shape as a whole is formed in an L shape as a whole. This point is different from the connection wiring board 70 described in the embodiment in the points etc.
  • the extended engagement portion (first engagement portion) 255 constituting the connecting portion 275 has an L shape as a whole, and the extended end portion is at right angles An engagement head 256 bent in the left direction is formed.
  • the engagement receiving portion (second engagement portion) 235 is formed with an L-shaped engagement hole portion 236 capable of receiving an end of the extension engagement portion 255 including the engagement head 256,
  • a protrusion (regulating portion) 237 disposed on the upper side of the engaging head 256 is formed.
  • the first solder connection portion 261 is formed to extend in the X-axis direction at the side edge of the extension engagement portion 255 on the opposite side (right side) from the engagement head 256.
  • the first solder connection portion 261 is provided so as to extend in the X axis direction orthogonal to the Y axis direction which is the extension direction of the extension engagement portion 155,
  • the resistance to pull-off stress can be relatively large.
  • a separation stress for moving the extension engagement portion 255 relative to the engagement receiving portion 235 upward causes the engagement head 256 to move. It can be received by the protruding portion 237 located on the upper side, and breakage of the solder connection portion can be suppressed.
  • connection wiring board 370 is the same as the connection wiring board 70 according to the embodiment in that the engagement head 56 which is formed in a rectangular shape in the embodiment is trapezoidal. It is different.
  • the engagement head 356 of the extension engagement portion (first engagement portion) 355 forming the connection portion 375 is formed in a trapezoidal shape, and the long side thereof is It is disposed so as to be located on the upper side on the base end side of the extension engagement portion 355.
  • the engagement receiving portion (second engagement portion) 335 is formed with a trapezoidal engagement hole 336 capable of receiving the engagement head 356, and an opening provided on the upper side of the engagement hole 336.
  • a pair of projecting portions (regulating portions) 337 and 337 protruding in the direction opposite to each other are formed.
  • a first solder connection portion 361 and a second solder connection portion 362 are formed to extend in the X-axis direction in the middle of the left and right oblique sides.
  • the first solder connection portion 361 and the second solder connection portion 362 are provided to extend in the X-axis direction orthogonal to the Y-axis direction which is the extension direction of the extension engagement portion 155. By this, it is possible to increase the resistance to the separation stress and to suppress the breakage of the solder connection portion.
  • the present technology is not limited to the embodiments described above with reference to the drawings, and, for example, the following embodiments are also included in the technical scope.
  • the shapes of the first engagement portion and the second engagement portion are not limited to those described in the above-described embodiment, and various modifications are possible. Of course, the external shapes of the first wiring board and the second wiring board can be changed variously.
  • the first wiring substrate and the second wiring substrate are not limited to the flexible substrate, and either one or both may be a rigid substrate provided with a glass substrate or the like.
  • the driver is COG (Chip on Glass) mounted on the glass substrate of the display panel.
  • TCP Tepe career Package
  • connection wiring substrate in which the wiring substrate for the LCD and the wiring substrate for the LED are electrically connected by solder is exemplified, but the present invention is not limited to this.
  • the present invention may be applied to a connection wiring board in which a touch panel substrate for controlling the touch panel unit and a main substrate are soldered.
  • the present invention may be applied to a connection wiring substrate to which a separate wiring substrate for controlling a navigation unit is soldered.
  • connection wiring board in which two wiring boards are connected is illustrated.
  • the present invention is not limited to this, and three or more wiring boards may be connected.
  • the present technology can be applied to each connecting portion in a connection wiring board in which a wiring board for LED and a wiring board for touch panel are connected to a wiring board for LCD.
  • the liquid crystal display device including a liquid crystal panel as a display panel is exemplified, but other types of display panels, such as organic EL panels, PDPs (plasma display panels), EPDs (electrophoretic display panels)
  • the present technology is also applicable to various connection wiring substrates used in a display device provided with a MEMS (Micro Electro Mechanical Systems) display panel.
  • MEMS Micro Electro Mechanical Systems

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  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
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  • Theoretical Computer Science (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

This connected wiring board 70 is provided with: a first wiring board 50 which has a first engagement part 55 that extends in the Y-axis direction toward a second wiring board 30; an FPC 30 for LCD, which has a second engagement part 35 that engages with the extending engagement part 55 so as to constitute a connection part 75 together with the extending engagement part 55; and a solder 60 which electrically connects the first wiring board 50 and the FPC 30 for LCD with each other. In the connection part 75 of the both FPCs 30, 50, the extending engagement part 55 and the engagement receiving part 35 are arranged such that respective end faces thereof face each other without overlapping with each other when viewed in plan; and the solder 60 is arranged in a first solder connection part 61 and a second solder connection part 62 or the like so as to extend in the X-axis direction, which intersects with the Y-axis direction, thereby connecting the edge of the extending engagement part 55 and the edge of the engagement receiving part 35, which is arranged to face the edge of the extending engagement part 55, with each other.

Description

連結配線基板及び表示装置Connecting wiring board and display device
　本明細書により開示される技術は、連結配線基板及び表示装置に関する。 The technology disclosed by the present specification relates to a connection wiring board and a display device.
　従来、表示装置は、画像を表示する表示面を備えた表示パネルに加え、これに付設されるバックライトユニットやタッチパネルユニット等、複数の機能ユニットを備えてなる。これら複数の機能ユニットを電気的に接続するため、各機能ユニットに接続された複数の配線基板が相互に連結され、連結配線基板が形成される。 Conventionally, in addition to a display panel having a display surface for displaying an image, the display device is provided with a plurality of functional units such as a backlight unit and a touch panel unit attached to the display panel. In order to electrically connect the plurality of functional units, the plurality of wiring boards connected to the respective functional units are mutually connected to form a connection wiring board.
　近年、表示装置の薄型化が進められる中、連結配線基板の連結部分にも薄型化が求められている。複数の配線基板を電気的に接続する方法としては、主としてコネクタによる接続と、半田による接続がある。このうち、コネクタ接続は、製造できるコネクタの外形に制約があり、追加部品としてコネクタが必要となる等のデメリットがあることから、半田接続が主流となっている。半田接続による連結部分では、半田塗布量を減らすことで半田の高さを抑えられるが、塗布量の微調整が難しく、適正量から外れると接続強度不足に陥る虞がある。また、従来は、複数の配線基板を重ねた上に半田を塗布しており、薄型化を図る上で限界があった。 In recent years, while thinning of display devices has been promoted, thinning of connecting portions of connecting wiring boards is also required. As a method of electrically connecting a plurality of wiring boards, there are mainly a connection by a connector and a connection by solder. Among them, the connector connection has a disadvantage in that the external shape of the connector which can be manufactured is limited, and the connector is required as an additional part, so that the solder connection is mainly used. Although the height of the solder can be suppressed by reducing the amount of applied solder at the connection portion by solder connection, fine adjustment of the amount of applied solder is difficult, and there is a possibility that the connection strength will be insufficient if it deviates from an appropriate amount. In addition, conventionally, solder is applied after stacking a plurality of wiring substrates, and there is a limit in achieving thinning.
　そこで、下記特許文献１には、メインフレキシブル基板とライト駆動用フレキシブル基板とを、重ねることなく端面同士を当接させた状態で、略一直線上に延在する配線の端子を半田によって導通接続した半田接続構造が開示されている。これにより、基板連結部分の厚みが、両配線基板のうち厚い方の配線基板の厚みに略等しくなり、一方の配線基板の厚み分だけ削減できて、薄型化が図られる。 Therefore, in Patent Document 1 below, the terminals of the wiring extending substantially on a straight line are conductively connected by solder in a state in which the main flexible substrate and the light driving flexible substrate abut on the end faces without overlapping. A solder connection structure is disclosed. As a result, the thickness of the substrate connection portion becomes substantially equal to the thickness of the thicker one of the two wiring substrates, and can be reduced by the thickness of one of the wiring substrates, thereby achieving a reduction in thickness.
特開２００８－７８５２０号公報JP, 2008-78520, A
（発明が解決しようとする課題）
　特許文献１には、両配線基板の接合面を、屈曲面で嵌合させたり、対向する凹部で空隙を形成させたりした構造が示されているが、何れの構造でも、半田接続は、ライト駆動用フレキブル基板の延出方向に沿って形成されている。特許文献１では、一方もしくは双方の配線基板に外力等が作用した際に、連結部分に折り曲げ応力が加わることが想定されているが、連結部分に両配線基板を引き離そうとする引張応力（以下、引き離し応力と称することがある）が加わった場合を考慮すると、このような応力は、主としてライト駆動用フレキブル基板の延出方向に沿って作用し、同方向に延在するように形成された半田接続部分では、その接続方向に沿って働くこととなるため、半田が容易に破断する虞があった。 (Problems to be solved by the invention)
Although the structure which made the joint surface of both wiring boards fit in a bending surface, or made the space | gap form with the recessed part which opposes in patent document 1 is shown, a solder connection is a light also in which structure. It is formed along the extending direction of the drive flexible substrate. In Patent Document 1, when external force or the like acts on one or both of the wiring boards, bending stress is assumed to be applied to the connecting portion, but tensile stress (hereinafter referred to as In consideration of the case where separation stress is applied, such stress mainly acts along the extending direction of the light drive flexible substrate, and the solder is formed to extend in the same direction. At the connection portion, the solder acts easily along the connection direction since it works.
　本技術は上記のような事情に基づいて完成されたものであって、基板連結部分の薄型化を図りつつ接続信頼性に優れた連結配線基板を提供することを目的とする。また、本技術は、このような連結配線基板を備える表示装置を提供する。 The present technology is completed based on the above circumstances, and it is an object of the present invention to provide a connection wiring board having excellent connection reliability while achieving thinning of a substrate connection portion. Further, the present technology provides a display device provided with such a connection wiring board.
（課題を解決するための手段）
　本技術に係る連結配線基板は、第１配線基板と、前記第１配線基板に連結された第２配線基板と、前記第１配線基板と前記第２配線基板との連結部に配されて、両配線基板を電気的に接続する半田と、を備える連結配線基板であって、前記第１配線基板は、第１基板本体部と、前記第１基板本体部から延出する第１係合部と、を有し、前記第２配線基板は、前記第１配線基板の前記第１係合部と係合して前記第１係合部と共に前記連結部を構成する第２係合部を有し、前記連結部において、前記第１係合部と前記第２係合部とは、平面に視て重畳することなく端面同士を対向させて配されており、前記半田は、前記第１係合部の延出方向と交差する交差方向に延在して前記第１係合部の端縁と前記第２係合部の端縁との間を接続している。 (Means to solve the problem)
The connection wiring board according to the present technology is disposed at a connection portion between a first wiring board, a second wiring board connected to the first wiring board, the first wiring board, and the second wiring board. And a solder for electrically connecting the two wiring substrates, wherein the first wiring substrate includes a first substrate body portion and a first engaging portion extending from the first substrate body portion. And the second wiring board has a second engaging portion that engages with the first engaging portion of the first wiring board to form the connecting portion together with the first engaging portion. In the connection portion, the first engagement portion and the second engagement portion are disposed with their end faces facing each other without overlapping in a plan view, and the solder is a portion of the first engagement portion. It extends in a cross direction intersecting with the extension direction of the joint portion to connect between the end edge of the first engagement portion and the end edge of the second engagement portion.
　上記構成では、第１配線基板の第１係合部と、第２配線基板の第２係合部とを重畳しないように配することで、連結部の薄型化が図られる。このような構成の連結配線基板において、両配線基板を引き離そうとする引き離し応力は、主として第１係合部の延出方向に沿って働く。上記構成では、この延出方向に交差する交差方向に延在するように半田接続を設けたことで、両基板３０，５０を引き離そうとする引き離し応力に対する抗力を増大させて、接続部分の破断を起こりにくくすることができる。この結果、連結部７５における電気的接続の接続信頼性を向上させることができる。さらに、半田接続を複数箇所に設け、複数方向に延在するようにすれば、引き離し応力を分散させて、接続信頼性を一層高めることができる。
　なお、上記構成において、第１配線基板と第２配線基板の少なくとも一方を、可撓性を有するフレキシブル基板（Flexible printed circuits：ＦＰＣ）とすることができる。また、引き離し応力に対する抗力を考慮すれば、半田が延在する交差方向は、延出方向と直交する方向とすることが好ましい。 In the above configuration, by arranging the first engagement portion of the first wiring board and the second engagement portion of the second wiring board so as not to overlap with each other, the connecting portion can be thinned. In the connection wiring board of such a configuration, the separation stress that tends to separate the two wiring boards acts mainly along the extending direction of the first engaging portion. In the above configuration, the solder connection is provided so as to extend in the cross direction intersecting with the extending direction, thereby increasing resistance to the separation stress which tends to separate the two substrates 30 and 50 and breaking the connection portion. It can be made hard to happen. As a result, the connection reliability of the electrical connection in the connection portion 75 can be improved. Furthermore, if solder connections are provided at a plurality of locations and extended in a plurality of directions, the separation stress can be dispersed to further improve the connection reliability.
Note that in the above configuration, at least one of the first wiring substrate and the second wiring substrate can be a flexible printed circuit (FPC) having flexibility. Further, in consideration of the resistance to the separation stress, it is preferable that the crossing direction in which the solder extends be a direction orthogonal to the extending direction.
　また、本技術に係る連結配線基板は、上記構成の連結配線基板を備えた表示装置である。
　このような構成によれば、薄型でかつ接続信頼性の高い連結配線基板を用いることで、表示装置全体の薄型化を図りつつ、装置の動作信頼性を担保することができる。 A connection wiring board according to the present technology is a display device provided with the connection wiring board of the above configuration.
According to such a configuration, by using a thin connection wiring board with high connection reliability, it is possible to secure the operation reliability of the device while achieving the thinning of the entire display device.
（発明の効果）
　本技術によれば、薄型で且つ動作信頼性の高い表示装置を得ることができる。 (Effect of the invention)
According to the present technology, it is possible to obtain a thin display device with high operation reliability.
実施形態に係る液晶表示装置の分解斜視図An exploded perspective view of a liquid crystal display device according to an embodiment 液晶パネル等に接続された連結配線基板の平面図Plan view of a connection wiring board connected to a liquid crystal panel or the like 図３の連結部における部分拡大図A partial enlarged view of the connecting portion of FIG. 3 変形例１における連結部分の拡大図（円形）Enlarged view of the connection portion in the first modification (circle) 変形例２における連結部分の拡大図（鉤形）Enlarged view of the connection part in the second modification (whip shape) 変形例３における連結部分の拡大図（楔形）Enlarged view of the connection part in the third modification (whip shape)
　＜実施形態＞
　実施形態を、図１から図３によって説明する。本実施形態では、液晶表示装置（表示装置）１について例示する。なお、各図面の一部にはＸ軸、Ｙ軸、及びＺ軸を示しており、各軸方向が各図において同一方向となるように描かれている。以下では、図１における上側を表（下側を裏）とし、図２及び図３における左側を左（右側を右）、上側を上（下側を下）とする。 Embodiment
Embodiments are described by means of FIGS. 1 to 3. In the present embodiment, the liquid crystal display device (display device) 1 is illustrated. Note that X-axis, Y-axis, and Z-axis are shown in part of each drawing, and the directions of the respective axes are drawn in the same direction in each drawing. In the following, the upper side in FIG. 1 is the front (lower side is the back), the left side in FIGS. 2 and 3 is the left (right side is the right), and the upper side is the upper side (lower side is the lower).
　本実施形態に係る液晶表示装置１は、全体として縦長な矩形浅箱状をなしており、大まかには、図１に示すように、画像を表示するための液晶パネル（表示パネル）１０と、液晶パネルの裏側に配されて液晶パネル１０に表示のための光を照射する外部光源であるバックライトユニット２０と、を備えている。なお、液晶表示装置はこのような構成に限定されるものではなく、例えば液晶パネル１０の表側に、図示しない枠状部材（ベゼル）やタッチパネルユニット等が配されていてもよい。
　本実施形態に係る液晶表示装置１は、携帯電話端末（スマートフォン等を含む）、ノートパソコン（タブレット型ノートパソコン等を含む）、ウェアラブル端末（スマートウォッチ等を含む）、携帯型情報端末（電子ブックやＰＤＡ等を含む）、携帯型ゲーム機、デジタルフォトフレーム等の各種電子機器（図示せず）に用いられるものである。このため、液晶パネル１０の画面サイズは、数インチ～十数インチ程度とされ、一般的には小型または中小型に分類される大きさとされている。なお、本技術を適用可能な液晶表示装置はこのような構成に限定されるものではなく、数十インチ以上の中型または大型（超大型）に分類される画面サイズの液晶パネルを備える表示装置にも、本技術は適用可能である。 The liquid crystal display device 1 according to the present embodiment is generally in the form of a vertically elongated rectangular shallow box, and roughly, as shown in FIG. 1, a liquid crystal panel (display panel) 10 for displaying an image; And a backlight unit 20, which is an external light source disposed on the back side of the liquid crystal panel to irradiate the liquid crystal panel 10 with light for display. The liquid crystal display device is not limited to such a configuration. For example, on the front side of the liquid crystal panel 10, a frame member (bezel) (not shown), a touch panel unit, or the like may be disposed.
The liquid crystal display device 1 according to the present embodiment includes a mobile phone terminal (including a smartphone and the like), a notebook computer (including a tablet notebook computer and the like), a wearable terminal (including a smart watch and the like), a portable information terminal (electronic book And PDAs), portable game machines, digital photo frames, and other various electronic devices (not shown). For this reason, the screen size of the liquid crystal panel 10 is about several inches to several tens of inches, and is generally classified into small or medium size. Note that the liquid crystal display device to which the present technology can be applied is not limited to such a configuration, and a display device including a liquid crystal panel of a screen size classified into medium size or large size (super large size) of several tens of inches or more Also, the present technology is applicable.
　液晶パネル１０について説明する。液晶パネル１０には、既知の構成のものを用いることができる。
　図１に示すように、本実施形態に係る液晶パネル１０は、全体として平面に視て縦長な矩形状をなし、その短辺方向がＸ軸方向と一致し、長辺方向がＹ軸方向と一致し、さらに厚さ方向がＺ軸方向と一致するように配されるものとする。液晶パネル１０の表側の面が表示面とされ、その中央部に、画像が表示される表示領域（アクティブエリア）が画成される。表示領域を取り囲む額縁状（枠状、環状）の外周部は、画像が表示されない非表示領域（ノンアクティブエリア）とされる。 The liquid crystal panel 10 will be described. The liquid crystal panel 10 may have a known configuration.
As shown in FIG. 1, the liquid crystal panel 10 according to the present embodiment has a generally rectangular shape in a plan view as a whole, and the short side direction coincides with the X axis direction, and the long side direction corresponds to the Y axis direction. It is assumed that they coincide with each other and that the thickness direction coincides with the Z-axis direction. The surface on the front side of the liquid crystal panel 10 is a display surface, and a display area (active area) in which an image is displayed is defined at the central portion thereof. A frame-like (frame-like, annular) outer peripheral portion surrounding the display area is a non-display area (non-active area) in which an image is not displayed.
　液晶パネル１０は、ガラス基板等からなる一対の基板１１，１２が、図示しない液晶層を間に挟んだ状態で貼り合わされてなる。液晶層は、電圧印加に伴って光学特性が変化する物質である液晶分子を含んでおり、液晶層に印加する電圧を制御することにより、液晶分子の配向を変化させて表示領域に画像を表示させるようになっている。なお、両基板１１，１２の外面側には、それぞれ偏光板１３が貼り付けられている。 The liquid crystal panel 10 is formed by bonding a pair of substrates 11 and 12 made of a glass substrate or the like with a liquid crystal layer (not shown) interposed therebetween. The liquid crystal layer contains liquid crystal molecules, which are substances whose optical characteristics change with voltage application, and changes the alignment of the liquid crystal molecules by controlling the voltage applied to the liquid crystal layer to display an image in the display region. It is supposed to In addition, the polarizing plate 13 is affixed on the outer surface side of both the substrates 11 and 12, respectively.
　基板１１，１２には、液晶層に電圧を印加するための電極が設けられている。本実施形態では、両基板１１，１２のうち、裏側に配されるものがアレイ基板（アクティブマトリクス基板、素子基板）１２とされ、表側に配されるものがＣＦ基板（カラーフィルタ基板、対向基板）１１とされる。詳細については割愛するが、アレイ基板１２には、互いに直交するソース配線とゲート配線に接続されたスイッチング素子（例えばＴＦＴ）と、そのスイッチング素子に接続された画素電極等が設けられる。また、ＣＦ基板１１には、対向電極に加え、Ｒ（赤色），Ｇ（緑色），Ｂ（青色）等の各着色部が所定配列で配置されたカラーフィルタ等が設けられる。なお、液晶パネル１０はこのような構成に限定されるものではなく、例えばアレイ基板１２に、画素電極と共通電極が設けられる構成としてもよい。 The substrates 11 and 12 are provided with electrodes for applying a voltage to the liquid crystal layer. In the present embodiment, of the two substrates 11 and 12, the one disposed on the back side is the array substrate (active matrix substrate, element substrate) 12 and the one disposed on the front side is the CF substrate (color filter substrate, counter substrate) 11). Although not described in detail, the array substrate 12 is provided with switching elements (for example, TFTs) connected to source wiring and gate wiring which are orthogonal to each other, and pixel electrodes and the like connected to the switching elements. In addition to the counter electrode, the CF substrate 11 is provided with a color filter or the like in which colored portions such as R (red), G (green), B (blue), etc. are arranged in a predetermined array. The liquid crystal panel 10 is not limited to such a configuration. For example, the array substrate 12 may have a configuration in which a pixel electrode and a common electrode are provided.
　図１に示すように、ＣＦ基板１１は、短辺方向（Ｘ軸方向）の長さ寸法がアレイ基板１２と概ね同等であるものの、長辺方向（Ｙ軸方向）の長さ寸法がアレイ基板１２よりも小さくなるように形成されており、両基板１１，１２は、上縁を揃えて、アレイ基板１２の下縁部に所定範囲にわたってＣＦ基板１１が重なり合うことがないＣＦ基板非重畳部１２Ａが存在するように、対向配置される。前述の表示領域は、ＣＦ基板１１とアレイ基板１２との重畳部分に画成され、ＣＦ基板非重畳部１２Ａの全域が、非表示領域とされる。 As shown in FIG. 1, although the CF substrate 11 has a length dimension in the short side direction (X-axis direction) substantially equal to that of the array substrate 12, the length dimension in the long side direction (Y-axis direction) is the array substrate The substrates 11 and 12 are formed to be smaller than 12, and both substrates 11 and 12 have the same upper edge, and the CF substrate 11 does not overlap over a predetermined range at the lower edge of the array substrate 12 Are placed opposite each other so that The display area described above is defined by the overlapping portion of the CF substrate 11 and the array substrate 12, and the entire area of the CF substrate non-overlapping portion 12A is a non-display area.
　ＣＦ基板非重畳部１２Ａには、ドライバ（駆動部品）４１及びＬＣＤ（Liquid Crystal Display：液晶表示パネル）用フレキシブル基板（第２配線基板）３０が接続される。
　ドライバ４１は、内部に駆動回路を有するＬＳＩチップからなり、図示しない外部の信号供給源から、ＬＣＤ用フレキシブル基板３０を介して供給される入力信号を処理して出力信号を生成し、その出力信号を液晶パネル１０の表示領域に出力して電圧を印加せしめ、表示素子である液晶分子を駆動させる。本実施形態に係るドライバ４１は、長尺な方形状をなし、その長手方向をアレイ基板１２の短辺方向（Ｘ軸方向）に一致させるようにして、アレイ基板１２の下縁に沿ってＣＦ基板非重畳部１２Ａに取り付けられている。ＬＣＤ用フレキシブル基板３０については、後記する。 A driver (drive component) 41 and a flexible substrate (second wiring substrate) 30 for an LCD (Liquid Crystal Display: liquid crystal display panel) 30 are connected to the CF substrate non-overlapping portion 12A.
The driver 41 is formed of an LSI chip having a drive circuit inside, processes an input signal supplied from an external signal supply source (not shown) through the LCD flexible substrate 30, generates an output signal, and outputs the output signal. Is output to the display region of the liquid crystal panel 10 to apply a voltage to drive liquid crystal molecules which are display elements. The driver 41 according to the present embodiment has a long rectangular shape, with the longitudinal direction thereof aligned with the short side direction (X axis direction) of the array substrate 12, and the CF along the lower edge of the array substrate 12. It is attached to the board | substrate non-overlapping part 12A. The flexible substrate 30 for LCD will be described later.
　次に、バックライトユニット２０について説明する。バックライトユニット２０には、既知の構成のものを用いることができる。
　本実施形態に係るバックライトユニット２０は、図１に示すように、液晶パネル１０側（表側）に向けて開口した矩形浅箱状をなす金属製のシャーシ（支持部材。ケーシング、筐体）２１を備える。シャーシ２１内には、裏側の底面付近から順に、光反射性に優れた銀色または白色を呈する合成樹脂製のシート材からなる反射シート２２と、光源から発せられた光を導入して内部を伝播させつつ表側に向けて立ち上げ出射させる導光板２３と、合成樹脂製で矩形枠状をなすフレーム２４と、拡散シート、レンズシート、反射型偏光シート等が複数枚積層された光学シート２６と、が重ねて配置されている。フレーム２４の下縁側にはＬＥＤ基板保持部２４Ａが形成されており、この上に、ＬＥＤ用フレキシブル基板（第１配線基板）５０のＬＥＤ実装部（第１基板本体部）５１に搭載された複数のＬＥＤ（Light Emitting Diode：発光ダイオード）２５が光源として偏在する形で配されて、導光板２３に対して片側からのみ入光される片側入光タイプのエッジライト型（サイドライト型）のものとされる。 Next, the backlight unit 20 will be described. The backlight unit 20 can have a known configuration.
The backlight unit 20 according to the present embodiment is, as shown in FIG. 1, a rectangular shallow box-shaped metal chassis (supporting member: casing, housing) 21 opened toward the liquid crystal panel 10 (front side) 21. Equipped with In the chassis 21, from inside the bottom of the back side, a reflection sheet 22 made of a synthetic resin sheet material exhibiting silver color or white excellent in light reflectivity and light emitted from a light source are introduced and propagated inside A light guide plate 23 for raising and emitting toward the front side, a frame 24 made of a synthetic resin in a rectangular frame shape, an optical sheet 26 in which a plurality of diffusion sheets, lens sheets, reflective polarizing sheets and the like are laminated; Are arranged in layers. A plurality of LED substrate holders 24A are formed on the lower edge side of the frame 24, and a plurality of LED substrates are mounted on the LED mounting portion (first substrate body portion) 51 of the LED flexible substrate (first wiring substrate) 50 thereon. Edge light type (side light type) of single-sided light input type in which the LEDs (Light Emitting Diodes) 25 of this type are distributed as light sources and enter the light guide plate 23 only from one side It is assumed.
　本実施形態に係る液晶表示装置１では、フレーム２４に倣った矩形額縁状（枠状、環状）の固定部材２７が、液晶パネル１０の裏側の板面と、バックライトユニット２０のＬＥＤ用フレキシブル基板５０及び光学シート２６の表側の面との間に固着挟持されて、液晶パネル１０とバックライトユニット２０との固定が図られている。液晶パネル１０とバックライトユニット２０との固定はこのようなものに限定されず、例えば液晶パネル１０の持て面に配したベゼルにより、液晶パネル１０の外周部分をバックライトユニット２０との間に挟み込んで保持する構成としてもよい。 In the liquid crystal display device 1 according to the present embodiment, the rectangular frame-shaped (frame-like, annular) fixing member 27 following the frame 24 has a plate surface on the back side of the liquid crystal panel 10 and the LED flexible substrate of the backlight unit 20. The liquid crystal panel 10 and the backlight unit 20 are fixed by being fixedly held between the surface 50 and the front surface of the optical sheet 26. The fixation between the liquid crystal panel 10 and the backlight unit 20 is not limited to this. For example, the outer peripheral portion of the liquid crystal panel 10 is sandwiched between the backlight unit 20 and the bezel disposed on the holding surface of the liquid crystal panel 10 It is good also as composition held by.
　続いて、連結配線基板７０について、主として図２を参照しつつ説明する。図２の平面図は、液晶パネル１０に接続されたＬＣＤ用フレキシブル基板３０と、バックライトユニット２０に接続されたＬＥＤ用フレキシブル基板５０と、が互いに連結され、半田６０によって電気的に接続された、連結配線基板７０の平面構成を示している。 Subsequently, the connection wiring board 70 will be described mainly with reference to FIG. In the plan view of FIG. 2, the LCD flexible substrate 30 connected to the liquid crystal panel 10 and the LED flexible substrate 50 connected to the backlight unit 20 are mutually connected and electrically connected by the solder 60. 6 show a plan configuration of the connection wiring board 70. FIG.
　ＬＣＤ用フレキシブル基板３０及びＬＥＤ用フレキシブル基板５０は何れも、絶縁性及び可撓性を有するポリイミドやＰＥＴ等の合成樹脂材料をシート状に形成した基材３９，５９を備え、この基材３９，５９上に、図示しない多数本の配線（導電路）パターンが配策形成されてなる。なお、基板３０，５０は、このような構成に限定されるものではなく、例えば金属製の薄膜上に適宜絶縁層を形成しつつ配線パターンを配索形成したものとしてもよい。
　配線パターンは、各種導電性素材を用いた既知の方法で形成可能であり、例えば銅を用いたフォトリソグラフィ法等によって形成したものを用いることができる。ＬＣＤ用フレキシブル基板３０及びＬＥＤ用フレキシブル基板５０は何れも、基材３９，５９の一方の主面上に配線パターンが形成された片面フレキシブル基板であっても、両方の主面上に配線パターンが形成された両面フレキシブル基板であってもよい。 Each of the flexible substrate 30 for LCD and the flexible substrate 50 for LED is provided with a base 39, 59 in which a synthetic resin material such as polyimide or PET having an insulating property and flexibility is formed in a sheet shape. A large number of wiring (conductive path) patterns (not shown) are formed on the surface 59. The substrates 30 and 50 are not limited to such a configuration. For example, the wiring patterns may be formed while forming an insulating layer appropriately on a thin film made of metal.
The wiring pattern can be formed by a known method using various conductive materials. For example, a wiring pattern formed by photolithography using copper can be used. Even if the flexible substrate 30 for LCD and the flexible substrate 50 for LED are both single-sided flexible substrates in which the wiring pattern is formed on one main surface of the base materials 39 and 59, the wiring patterns are on both main surfaces. It may be a double-sided flexible substrate formed.
　ＬＣＤ用フレキシブル基板３０は、図示しない外部の信号供給源から発せられる液晶パネル１０の駆動を制御するための各種入力信号を、上記したドライバ４１に伝送する配線基板である。図２に示すように、本実施形態に係るＬＣＤ用フレキシブル基板３０は、平面に視て略Ｌ字型の外形をなすように形成されており、液晶パネル１０の下縁に沿って短辺方向（Ｘ軸方向）に延在し、ＣＦ基板非重畳部１２Ａにおいて上記したドライバ４１よりも下縁寄りの位置に接続されるＬＣＤ接続部３１と、ＬＣＤ接続部３１の一方（図２における右側）の端部からＹ軸に沿って液晶パネル１０とは反対側に延びる延出部３２と、を有する。なお、アレイ基板１２に対するＬＣＤ用フレキシブル基板３０の接続は、既知の方法で行うことができ、例えばＡＣＦ（Anisotropic Conductive Film：異方性導電フィルム）等を利用して電気的にかつ機械的に接続することができる。また、図２にも表されているように、基材３９上には種々の回路素子が搭載されている。 The LCD flexible substrate 30 is a wiring substrate for transmitting various input signals for controlling the driving of the liquid crystal panel 10 emitted from an external signal supply source (not shown) to the driver 41 described above. As shown in FIG. 2, the LCD flexible substrate 30 according to the present embodiment is formed to have a substantially L-shaped outer shape in a plan view, and the short side direction along the lower edge of the liquid crystal panel 10 One of the LCD connection portion 31 which extends in the X-axis direction and is connected to a position closer to the lower edge than the driver 41 in the CF substrate non-overlapping portion 12A, and one of the LCD connection portions 31 (right side in FIG. 2) And an extending portion 32 extending from the end of the head along the Y axis to the opposite side to the liquid crystal panel 10. The connection of the flexible substrate 30 for LCD to the array substrate 12 can be performed by a known method, and for example, electrically and mechanically connected using an anisotropic conductive film (ACF) or the like. can do. Further, as also shown in FIG. 2, various circuit elements are mounted on the base material 39.
　ＬＥＤ用フレキシブル基板５０は、図示しない外部の信号供給源から発せられる各種入力信号を伝送してＬＥＤ２５の駆動を制御する配線基板である。図１に示すように、本実施形態では、ＬＥＤ用フレキシブル基板５０は、バックライトユニット２０の短辺方向（Ｘ軸方向）に延在してＬＥＤ２５が実装されるＬＥＤ実装部（第１基板本体部）５１と、ＬＥＤ実装部５１の一方の端部寄り（右寄り）の位置からＹ軸方向に沿って導光板２３等とは反対側（下側）に延出する延出係合部（第１係合部）５５と、を備える。 The LED flexible substrate 50 is a wiring substrate that transmits various input signals emitted from an external signal supply source (not shown) to control the driving of the LED 25. As shown in FIG. 1, in the present embodiment, the LED flexible substrate 50 extends in the short side direction (X-axis direction) of the backlight unit 20 to mount the LED 25 (LED mounting portion (first substrate main body) An extension engaging portion (a second portion) extending from the position closer to one end of the LED mounting portion 51 (rightward) to the opposite side (the lower side) to the light guide plate 23 and the like along the Y axis direction; 1 engaging portion) 55.
　連結配線基板７０における両基板３０，５０の連結部７５について、主として図３を参照しつつ説明する。
　図３に拡大して示すように、ＬＥＤ用フレキシブル基板５０の延出係合部５５の延出端部は、係合頭部５６とされている。係合頭部５６は、Ｙ軸方向に延びる延出係合部５５の延出端部分がＸ軸方向について両側に突出して延出係合部５５のその他の部分よりも幅広となり、短辺方向がＸ軸方向と一致し長辺方向がＹ軸方向と一致する矩形状をなすように形成されている。 The connecting portion 75 of the two substrates 30 and 50 in the connecting wiring substrate 70 will be described mainly with reference to FIG.
As shown in an enlarged manner in FIG. 3, the extension end of the extension engagement portion 55 of the LED flexible substrate 50 is an engagement head 56. In the engagement head 56, the extension end portion of the extension engagement portion 55 extending in the Y-axis direction protrudes to both sides in the X-axis direction and becomes wider than the other portions of the extension engagement portion 55, and the short side direction Are formed in a rectangular shape in which the long side direction coincides with the Y axis direction.
　一方、図２等に示すように、ＬＣＤ用フレキシブル基板３０のＬＣＤ接続部３１と延出部３２の間の外角部は、ＬＥＤ用フレキシブル基板５０の延出係合部５５の基端部分と重畳しないように切除された形状とされており、この切除部分の下側に、延出係合部５５の延出端部分を受け入れる係合受け部（第２係合部）３５が切り欠き形成されている。係合受け部３５には、係合穴部３６と、一対の突出部（規制部）３７，３７と、が形成されている。図３に示すように、係合穴部３６は、係合頭部５６に倣った一回り大きな矩形状に形成されており、係合頭部５６と平面に視て重畳することなく、これを内部に受け入れ可能とされている。突出部３７，３７は、係合穴部３６の上側に設けられた開口の左右両縁から互いに対向する方向に突出形成されている。突出部３７，３７の間隔は、延出係合部５５の基端部分の幅よりも若干大きくなるように形成されており、一対の突出部３７，３７の間に延出係合部５５が挿通挟持された状態で、これよりも奥側（下側）に形成された係合穴部３６内に係合頭部５６が嵌合保持される。換言すれば、延出係合部５５と係合受け部３５とは、平面に視て重畳することなく、係合頭部５６の外周端面と係合穴部３６の内周端面とが対向した状態で配される。 On the other hand, as shown in FIG. 2 and the like, the outer corner between the LCD connection portion 31 and the extension portion 32 of the LCD flexible substrate 30 overlaps the base end portion of the extension engagement portion 55 of the LED flexible substrate 50. An engagement receiving portion (second engagement portion) 35 for receiving the extension end portion of the extension engagement portion 55 is formed on the lower side of the cut-out portion. ing. In the engagement receiving portion 35, an engagement hole portion 36 and a pair of projecting portions (regulating portions) 37, 37 are formed. As shown in FIG. 3, the engagement hole portion 36 is formed in a rectangular shape that is a large circle that follows the engagement head 56, and does not overlap with the engagement head 56 in plan view. It is accepted internally. The protrusions 37 and 37 are formed so as to protrude from the left and right edges of the opening provided on the upper side of the engagement hole 36 in the direction opposite to each other. The distance between the protrusions 37 and 37 is formed to be slightly larger than the width of the proximal end of the extension engagement portion 55, and the extension engagement portion 55 is formed between the pair of protrusions 37 and 37. In the inserted and held state, the engagement head 56 is fitted and held in an engagement hole 36 formed on the back side (lower side) than this. In other words, the outer peripheral end face of the engagement head 56 and the inner peripheral end face of the engagement hole 36 face each other without overlapping the extension engagement portion 55 and the engagement receiving portion 35 in a plan view. It is distributed in the state.
　上記のように係合頭部５６が係合穴部３６内に嵌合保持された状態で、係合穴部３６の端縁と係合頭部５６の端縁との間に半田６０が塗布されて、ＬＣＤ用フレキシブル基板３０とＬＥＤ用フレキシブル基板５０が電気的に接続される。
　詳しくは、図３に示すように、係合頭部５６の左側には、この左端縁（第１係合部の第１端縁）５６Ａと、左端縁５６Ａに対向配置された係合穴部３６の左側の端縁（第２係合部の第１端縁）３６Ａとの間を接続するように、Ｘ軸方向に延在する第１半田接続部６１が形成される。同じく、係合頭部５６の右端縁（第１係合部の第２端縁）５６Ｂと、係合穴部３６の右側の端縁（第２係合部の第２端縁）３６Ｂとの間を接続するように、Ｘ軸方向に延在する第２半田接続部６２が形成される。さらに、係合頭部５６の下端縁５６Ｃと、係合穴部３６の下側の端縁３６Ｃとを接続するように、Ｙ軸方向に延在する第３半田接続部６３が、形成される。
　なお、半田６０には、特に制約なく既知の材料を用いることができ、半田接続部６１，６２，６３も、既知の方法に従って形成することができる。また、係合頭部５６の外周端面と、係合穴部３６の内周端面の間に若干の隙間が形成されていても、流動可能な状態で半田６０を塗布することで、この隙間を埋設してＬＣＤ用フレキシブル基板３０とＬＥＤ用フレキシブル基板５０とを電気的に接続することが可能である。半田６０の塗布量は適宜調整可能であり、例えば係合頭部５６と係合穴部３６との界面を隙間なく閉塞して、ごく僅かに盛り上がる程度とすることが好ましい。 With the engagement head 56 fitted and held in the engagement hole 36 as described above, the solder 60 is applied between the end edge of the engagement hole 36 and the end edge of the engagement head 56 Thus, the LCD flexible substrate 30 and the LED flexible substrate 50 are electrically connected.
Specifically, as shown in FIG. 3, on the left side of the engagement head 56, the left end edge (first end edge of the first engagement portion) 56A and an engagement hole portion disposed opposite to the left end edge 56A. A first solder connection portion 61 extending in the X-axis direction is formed to connect with the left edge 36 (first edge of the second engagement portion) 36A of 36. Similarly, the right end edge (second end edge of the first engagement portion) 56B of the engagement head 56 and the right end edge (second end edge of the second engagement portion) 36B of the engagement hole 36 A second solder connection portion 62 extending in the X-axis direction is formed to connect the two. Furthermore, a third solder connection 63 extending in the Y-axis direction is formed to connect the lower end edge 56C of the engagement head 56 and the lower edge 36C of the engagement hole 36. .
Note that known materials can be used for the solder 60 without particular limitation, and the solder connection parts 61, 62, 63 can also be formed according to a known method. In addition, even if a slight gap is formed between the outer peripheral end face of the engagement head 56 and the inner peripheral end face of the engagement hole 36, the space is formed by applying the solder 60 in a flowable state. It is possible to embed and connect the flexible substrate 30 for LCD and the flexible substrate 50 for LED electrically. The application amount of the solder 60 can be appropriately adjusted. For example, it is preferable that the interface between the engagement head 56 and the engagement hole 36 be closed without any gap and be slightly raised.
　以上のように、本実施形態に係る本技術に係る連結配線基板７０は、ＬＥＤ用フレキシブル基板（第１配線基板）５０と、ＬＥＤ用フレキシブル基板５０に連結されたＬＣＤ用フレキシブル基板（第２配線基板）３０と、ＬＥＤ用フレキシブル基板５０とＬＣＤ用フレキシブル基板３０との連結部に配されて、両配線基板を電気的に接続する半田６０と、を備え、ＬＥＤ用フレキシブル基板５０は、ＬＥＤ実装部（第１基板本体部）５１と、ＬＥＤ実装部５１からＹ軸方向に延出する延出係合部（第１係合部）５５と、を有し、ＬＥＤ用フレキシブル基板５０は、延出係合部５５と係合してこれと共に連結部７５を構成する係合受け部（第２係合部）３５を有し、前記連結部７５において、前記延出係合部５５と係合受け部３５とは、平面に視て重畳することなく端面同士を対向させて配されており、前記半田６０は、第１半田接続部６１及び第２半田接続部６２において、延出係合部５５の延出方向（Ｙ軸方向）と交差する交差方向（Ｘ軸方向）に延在して延出係合部５５の端縁と係合受け部３５の端縁との間を接続している。 As described above, the connection wiring board 70 according to the present technology according to the present embodiment includes the LED flexible board (first wiring board) 50 and the LCD flexible board (second wiring) connected to the LED flexible board 50. And a solder 60 disposed at the connecting portion between the flexible substrate 50 for LED and the flexible substrate 30 for LCD to electrically connect the two wiring substrates, and the flexible substrate 50 for LED is mounted on the LED Portion (first substrate body portion) 51, and an extension engagement portion (first engagement portion) 55 extending in the Y-axis direction from the LED mounting portion 51, and the flexible substrate 50 for LED is extended. It has an engagement receiving portion (second engaging portion) 35 which engages with the disengaging portion 55 and constitutes a connecting portion 75 together with the disengaging portion 55, and in the connecting portion 75, the engaging portion 55 engages with the extending engaging portion 55. The receiving part 35 is a plane The solder 60 is disposed with the end faces facing each other without overlapping, and in the first solder connection portion 61 and the second solder connection portion 62, the extending direction of the extension engaging portion 55 (Y axis Extending in a cross direction (X-axis direction) intersecting with the direction) to connect the end edge of the extension engaging portion 55 and the end edge of the engagement receiving portion 35.
　上記構成の本実施形態に係る連結配線基板７０では、ＬＥＤ用フレキシブル基板５０の延出係合部５５と、ＬＣＤ用フレキシブル基板３０の係合受け部３５とを重畳しないように配することで、連結部７５の薄型化が図られる。ここで、連結配線基板７０において、延出係合部５５を係合受け部３５から引き離そうとする引き離し応力は、延出係合部５５の延出方向すなわちＹ軸方向に沿って働く。これと交差する交差方向（Ｘ軸方向）に延在するように第１半田接続部６１及び第２半田接続部６２を形成したことで、一方の基板の延出方向に沿って半田接続が形成されていた従来の構造と比較して、延出係合部５５を係合受け部３５から引き離そうとする引き離し応力に対する抗力が大きくなり、半田接続部分の破断が起こりにくくなる。この結果、連結部７５における電気的接続の接続信頼性を向上させることができる。さらに、半田接続を複数箇所に設け、複数方向に延在するようにすれば、引き離し応力を分散させて、接続信頼性を一層高めることができる。 In the connection wiring board 70 according to the present embodiment configured as described above, the extending engaging portion 55 of the LED flexible substrate 50 and the engagement receiving portion 35 of the LCD flexible substrate 30 are disposed so as not to overlap with each other. The connecting portion 75 can be made thinner. Here, in the connection wiring board 70, a separation stress that tends to separate the extension engagement portion 55 from the engagement receiving portion 35 acts along the extension direction of the extension engagement portion 55, that is, the Y-axis direction. By forming the first solder connection portion 61 and the second solder connection portion 62 so as to extend in the crossing direction (X-axis direction) intersecting with this, solder connection is formed along the extending direction of one substrate Compared with the conventional structure, the resistance to the separation stress that tends to separate the extended engagement portion 55 from the engagement receiving portion 35 is increased, and the breakage of the solder connection portion is less likely to occur. As a result, the connection reliability of the electrical connection in the connection portion 75 can be improved. Furthermore, if solder connections are provided at a plurality of locations and extended in a plurality of directions, the separation stress can be dispersed to further improve the connection reliability.
　本実施形態に係る連結配線基板７０において、ＬＥＤ用フレキシブル基板５０及びＬＣＤ用フレキシブル基板３０は、何れも可撓性を有するシート状の薄膜を基材とするフレキシブル基板である。本技術は、このような連結配線基板７０について一層の薄型化を進める際に有用である。また、第１半田接続部６１及び第２半田接続部６２の延在方向（Ｘ軸方向）が、延出係合部５５の延出方向（Ｙ軸方向）に対して直交しているため、引き離し応力に対する抗力を効果的に増大させることが可能である。 In the connection wiring substrate 70 according to the present embodiment, the LED flexible substrate 50 and the LCD flexible substrate 30 are both flexible substrates having a sheet-like thin film having flexibility. The present technology is useful in further reducing the thickness of such a connection wiring board 70. Further, since the extending direction (X-axis direction) of the first solder connection portion 61 and the second solder connection portion 62 is orthogonal to the extending direction (Y-axis direction) of the extending engagement portion 55, It is possible to effectively increase the resistance to pull-off stress.
　また、本実施形態に係る連結配線基板７０では、第１半田接続部６１及び第２半田接続部６２が、延出係合部５５の左右両側に形成されている。これにより、両基板３０，５０の引き離し応力が効果的に左右に分散される。ここで、本実施形態によれば、引き離し応力が、延出係合部５５の延出方向に直交する方向（Ｘ軸方向）に延びる同一直線上において相反する方向に分散されるため、接続部分に伝わる力が小さくなり、半田が特に破断しにくくなっている。 Further, in the connection wiring board 70 according to the present embodiment, the first solder connection portion 61 and the second solder connection portion 62 are formed on the left and right sides of the extending engagement portion 55. As a result, the separation stress of both substrates 30 and 50 is effectively dispersed to the left and right. Here, according to the present embodiment, since the separation stress is dispersed in opposite directions on the same straight line extending in the direction (X-axis direction) orthogonal to the extending direction of the extending engaging portion 55, the connection portion The power transmitted to is reduced, making it particularly difficult for the solder to break.
　本実施形態に係る連結配線基板７０では、半田６０による接続部分が、第１半田接続部６１、第２半田接続部６２、及び第３半田接続部６３の計３箇所に設けられている。このように半田６０による接続箇所が増えることで、両基板３０，５０の引き離し応力がさらに分散され、接続部分の破断が一層起こりにくくなっている。 In the connection wiring board 70 according to the present embodiment, the connection portions by the solder 60 are provided at a total of three places of the first solder connection portion 61, the second solder connection portion 62, and the third solder connection portion 63. By thus increasing the number of connection points by the solder 60, the separation stress between the two substrates 30, 50 is further dispersed, and breakage of the connection parts is further less likely to occur.
　さらに、本実施形態に係る連結配線基板７０では、係合受け部３５に、延出係合部５５の係合頭部５６が係合穴部３６内に保持された状態で係合頭部５６の上側に位置する一対の突出部３７，３７が形成されている。両基板３０，５０の引き離し応力が生じた場合であっても、一対の突出部３７，３７によって、係合頭部５６の上方への移動、すなわちＬＥＤ用フレキシブル基板５０がＬＣＤ用フレキシブル基板３０から離隔する方向への移動が規制され、延出係合部５５と係合受け部３５の離隔が抑制される。この結果、接続部分における半田破断が起こりにくくなる。また、本実施形態によれば、係合頭部５６が係合穴部３６内にほぼぴったり嵌合する構造となっているため、その他の方向への相対移動も起こりにくい。さらに、半田６０による接続を行うに先立ち、他の位置決め構造を要することなく係合受け部３５内に延出係合部５５を位置決めすることができるため、通常設けられるピン－孔係合による位置決め構造が不要となって、両基板３０，５０の小型化を図ることが可能とされている。 Furthermore, in the connection wiring board 70 according to the present embodiment, the engagement head 56 is held in the engagement hole portion 36 by the engagement head 56 of the extension engagement portion 55 in the engagement receiving portion 35. A pair of protrusions 37, 37 are formed on the upper side of. Even when the separation stress between the two substrates 30, 50 is generated, the upward movement of the engagement head 56 by the pair of projections 37, 37, that is, the flexible substrate 50 for LED from the flexible substrate 30 for LCD The movement in the separation direction is restricted, and the separation between the extension engaging portion 55 and the engagement receiving portion 35 is suppressed. As a result, solder breakage in the connection portion is less likely to occur. Further, according to the present embodiment, since the engagement head 56 is structured to be substantially fitted into the engagement hole portion 36, relative movement in other directions is also less likely to occur. Furthermore, prior to the connection by the solder 60, since the extension engaging portion 55 can be positioned in the engagement receiving portion 35 without requiring any other positioning structure, the positioning by the pin-hole engagement usually provided Since the structure is unnecessary, it is possible to miniaturize the two substrates 30 and 50.
　本実施形態に係る液晶表示装置１は、上記構成の薄型でかつ接続信頼性の高い連結配線基板７０を備えていることにより、装置全体の薄型化を図りつつ、高い動作信頼性を発現可能とされている。 The liquid crystal display device 1 according to the present embodiment includes the thin connection wiring board 70 having the above-described configuration and high connection reliability, so that high operation reliability can be realized while achieving thinning of the entire device. It is done.
＜変形例１＞
　変形例１を、図４によって説明する。本変形例１に係る連結配線基板１７０では、実施形態では矩形状に形成されていた係合頭部５６が、円形状に形成されている点等において、実施形態に記載の連結配線基板７０と相違している。なお、上記した実施形態と同様の構造には同じ符号を付し、作用及び効果について重複する説明は省略する（変形例２以下でも同様とする）。 <Modification 1>
The first modification will be described with reference to FIG. In the connection wiring board 170 according to the present modification 1, the connecting wiring board 70 according to the embodiment is different from the connection wiring board 70 according to the embodiment in that the engaging head 56 which is formed in a rectangular shape in the embodiment is formed in a circular shape. It is different. In addition, the same code | symbol is attached | subjected to the structure similar to above-described embodiment, and the description which overlaps about an effect | action and an effect is abbreviate | omitted.
　図４に示すように、本変形例１では、連結部１７５を構成する延出係合部（第１係合部）１５５の先端に設けられた係合頭部１５６が円形状をなし、係合受け部（第２係合部）１３５には、これを受け入れ可能な円形状の係合穴部１３６と、延出係合部１５５上側の開口の左右両縁から互いに対向する方向に突出する一対の突出部（規制部）１３７，１３７と、を有する。そして、半田６０は、係合穴部１３６内に係合頭部１５６が嵌合保持された状態で、Ｘ軸と平行な直径に沿って左右に延在する第１半田接続部１６１及び第２半田接続部１６２を形成するように配設される。 As shown in FIG. 4, in the first modification, the engagement head 156 provided at the tip of the extension engagement portion (first engagement portion) 155 that constitutes the connection portion 175 has a circular shape, and The joint receiving portion (second engaging portion) 135 protrudes in the direction opposite to each other from the left and right edges of the opening of the circular engaging hole portion 136 which can receive the same and the extending engaging portion 155 upper side. And a pair of projecting portions (regulating portions) 137, 137. And, in a state where the engagement head 156 is fitted and held in the engagement hole portion 136, the solder 60 extends to the left and right along the diameter parallel to the X-axis. It is arranged to form a solder connection 162.
　本変形例１の構成によれば、係合受け部１３５に対して延出係合部１５５を上側（延出係合部１５５の延出方向と逆側）に相対移動させようとする引き離し応力が、円形の係合頭部１５６の上側の湾曲する端面に分散され、突出部１３７，１３７の下側の湾曲する端面（係合穴部１３６の上側の端面）で受け止められる。これにより、応力集中を避けつつ引き離し応力を広い範囲に分散させて、両基板３０，５０の離隔を規制することができる。また、第１半田接続部１６１及び第２半田接続部１６２が、延出係合部１５５の延出方向であるＹ軸方向と直交するＸ軸方向に沿った直径上に設けられていることで、引き離し応力への抗力を高めて、半田接続部分の破断を抑制することができる。 According to the configuration of the first modification, the separation stress for relatively moving the extension engagement portion 155 upward (opposite to the extension direction of the extension engagement portion 155) relative to the engagement receiving portion 135 Are distributed to the upper curved end surface of the circular engagement head 156 and received by the lower curved end surface of the protrusion 137 (the upper end surface of the engagement hole 136). As a result, separation stress can be dispersed in a wide range while avoiding stress concentration, and the separation between both substrates 30 and 50 can be regulated. Further, the first solder connection portion 161 and the second solder connection portion 162 are provided on the diameter along the X-axis direction orthogonal to the Y-axis direction which is the extension direction of the extension engagement portion 155. The resistance to the separation stress can be increased to suppress the breakage of the solder connection portion.
＜変形例２＞
　変形例２を、図５によって説明する。本変形例２に係る連結配線基板２７０では、実施形態では矩形状の係合頭部５６を有し全体としてハンマー型に形成されていた延出係合部５５が、全体としてＬ字型に形成されている点等において、実施形態に記載の連結配線基板７０と相違している。 <Modification 2>
A second modification will be described with reference to FIG. In the connection wiring board 270 according to the second modification, the extended engaging portion 55 having the rectangular engaging head 56 in the embodiment and formed in a hammer shape as a whole is formed in an L shape as a whole. This point is different from the connection wiring board 70 described in the embodiment in the points etc.
　図５に示すように、本変形例２では、連結部２７５を構成する延出係合部（第１係合部）２５５が全体としてＬ字型をなし、延出端部が直角に一方（左方）に屈曲された係合頭部２５６が形成されている。係合受け部（第２係合部）２３５には、係合頭部２５６を含む延出係合部２５５の端部を受け入れ可能なＬ字形状の係合穴部２３６が形成されており、延出係合部２５５の基端側となる上側に設けられた開口の左縁には、係合頭部２５６の上側に配される突出部（規制部）２３７が形成されている。そして、延出係合部２５５について係合頭部２５６とは反対側（右側）の側縁においてＸ軸方向に延在するように、第１半田接続部２６１が形成されている。 As shown in FIG. 5, in the second modification, the extended engagement portion (first engagement portion) 255 constituting the connecting portion 275 has an L shape as a whole, and the extended end portion is at right angles An engagement head 256 bent in the left direction is formed. The engagement receiving portion (second engagement portion) 235 is formed with an L-shaped engagement hole portion 236 capable of receiving an end of the extension engagement portion 255 including the engagement head 256, At the left edge of the opening provided on the upper side on the base end side of the extension engaging portion 255, a protrusion (regulating portion) 237 disposed on the upper side of the engaging head 256 is formed. The first solder connection portion 261 is formed to extend in the X-axis direction at the side edge of the extension engagement portion 255 on the opposite side (right side) from the engagement head 256.
　本変形例２の構成によれば、第１半田接続部２６１を、延出係合部１５５の延出方向であるＹ軸方向と直交するＸ軸方向に延在するように設けたことで、引き離し応力への抗力を比較的大きくすることができる。また、係合受け部２３５に対して延出係合部２５５を上側（延出係合部１５５の延出方向と逆側）に相対移動させようとする引き離し応力が、係合頭部２５６の上側に位置する突出部２３７で受け止められ、半田接続部分の破断を抑制することができる。 According to the configuration of the second modification, the first solder connection portion 261 is provided so as to extend in the X axis direction orthogonal to the Y axis direction which is the extension direction of the extension engagement portion 155, The resistance to pull-off stress can be relatively large. Further, a separation stress for moving the extension engagement portion 255 relative to the engagement receiving portion 235 upward (opposite to the extension direction of the extension engagement portion 155) causes the engagement head 256 to move. It can be received by the protruding portion 237 located on the upper side, and breakage of the solder connection portion can be suppressed.
＜変形例３＞
　変形例３を、図６によって説明する。本変形例３に係る連結配線基板３７０では、実施形態では矩形状に形成されていた係合頭部５６が、台形状に形成されている点等において、実施形態に記載の連結配線基板７０と相違している。 <Modification 3>
A third modification will be described with reference to FIG. In the connection wiring board 370 according to the third modification, the connection wiring board 70 according to the embodiment is the same as the connection wiring board 70 according to the embodiment in that the engagement head 56 which is formed in a rectangular shape in the embodiment is trapezoidal. It is different.
　図６に示すように、本変形例３では、連結部３７５を形成する延出係合部（第１係合部）３５５の係合頭部３５６が、台形状に形成され、その長辺が延出係合部３５５の基端側となる上側に位置するように配されている。係合受け部（第２係合部）３３５には、係合頭部３５６を受け入れ可能な台形状の係合穴部３３６が形成されており、係合穴部３３６の上側に設けられた開口の左右両縁には、互いに対向する方向に突出する一対の突出部（規制部）３３７，３３７が形成されている。そして、左右の斜辺の中程においてＸ軸方向に延在するように、第１半田接続部３６１及び第２半田接続部３６２が形成されている。 As shown in FIG. 6, in the third modification, the engagement head 356 of the extension engagement portion (first engagement portion) 355 forming the connection portion 375 is formed in a trapezoidal shape, and the long side thereof is It is disposed so as to be located on the upper side on the base end side of the extension engagement portion 355. The engagement receiving portion (second engagement portion) 335 is formed with a trapezoidal engagement hole 336 capable of receiving the engagement head 356, and an opening provided on the upper side of the engagement hole 336. On both left and right edges, a pair of projecting portions (regulating portions) 337 and 337 protruding in the direction opposite to each other are formed. A first solder connection portion 361 and a second solder connection portion 362 are formed to extend in the X-axis direction in the middle of the left and right oblique sides.
　本変形例３の構成によれば、係合受け部３３５に対して延出係合部３５５を上側（延出係合部１５５の延出方向と逆側）に相対移動させようとする引き離し応力が、係合頭部３５６の上側に位置する比較的長く形成された端面で受け止められる。また、係合頭部３５６の左右側縁が、延出先端側を先細りとするような傾斜形状に形成されているために、場合によっては、突出部３３７，３３７間を押し広げつつ、係合受け部３３５上側の開口から係合頭部３５６を係合穴部３３６内に挿入して係止することができる。本変形例３でも、第１半田接続部３６１及び第２半田接続部３６２が、延出係合部１５５の延出方向であるＹ軸方向と直交するＸ軸方向に延在するように設けられていることで、引き離し応力への抗力を高めて、半田接続部分の破断を抑制することができる。 According to the configuration of the third modification, separation stress for relatively moving the extension engagement portion 355 to the upper side (opposite to the extension direction of the extension engagement portion 155) relative to the engagement receiving portion 335. Is received by the relatively long formed end face located on the upper side of the engagement head 356. In addition, since the left and right side edges of the engagement head 356 are formed in an inclined shape so as to make the extending tip end tapered, in some cases, the engagement between the protrusions 337 and 337 is performed while engaging The engagement head 356 can be inserted into the engagement hole 336 and locked from the opening above the receiving portion 335. Also in the third modification, the first solder connection portion 361 and the second solder connection portion 362 are provided to extend in the X-axis direction orthogonal to the Y-axis direction which is the extension direction of the extension engagement portion 155. By this, it is possible to increase the resistance to the separation stress and to suppress the breakage of the solder connection portion.
＜他の実施形態＞
　本技術は上記記述及び図面によって説明した実施形態に限定されるものではなく、例えば次のような実施形態もこの技術的範囲に含まれる。
　（１）第１係合部及び第２係合部の形状は、上記した実施形態に記載のものに限定されるものではなく、種々変更が可能である。勿論、第１配線基板及び第２配線基板の外形形状も、種々に変更が可能である。
　（２）第１配線基板及び第２配線基板は、フレキシブル基板に限定されるものではなく、何れか一方もしくは双方が、ガラス基板等を備えるリジッドな基板であってもよい。
　（３）上記実施形態では、ドライバが表示パネルのガラス基板上にＣＯＧ（Chip on Glass）実装されている例について示したが、例えばＬＣＤ用のフレキシブル配線基板上にドライバがＴＣＰ（Tape Career Package）実装された構成の連結配線基板でも、基板同士の連結部分の薄型化を図る上で本技術は有用である。
　（４）上記実施形態では、ＬＣＤ用の配線基板と、ＬＥＤ用の配線基板と、が半田によって電気的に接続された連結配線基板を例示したが、これに限定されるものではない。例えば、表示パネルの表側にタッチパネルユニットを備える構成の表示装置において、タッチパネルユニットを制御するためのタッチパネル用基板と、メイン基板と、が半田接続された連結配線基板に適用してもよい。或いは、ナビゲーションユニットを備える構成の表示装置において、ナビベーションユニットを制御するための個別の配線基板が半田接続された連結配線基板に適用してもよい。
　（５）上記実施形態では、２つの配線基板を接続した連結配線基板を例示したが、これに限定されるものではなく、３つ以上の配線基板を連結したものであってもよい。例えばＬＣＤ用の配線基板に、ＬＥＤ用の配線基板及びタッチパネル用配線基板が連結された、連結配線基板における各連結部に、本技術を適用することができる。
　（６）上記した各実施形態では、表示パネルとして液晶パネルを備える液晶表示装置について例示したが、他の種類の表示パネル、例えば有機ＥＬパネル、ＰＤＰ（プラズマディスプレイパネル）、ＥＰＤ（電気泳動ディスプレイパネル）、ＭＥＭＳ（Micro Electro Mechanical Systems）表示パネルを備える表示装置において用いられる種々の連結配線基板にも、本技術は適用可能である。 Other Embodiments
The present technology is not limited to the embodiments described above with reference to the drawings, and, for example, the following embodiments are also included in the technical scope.
(1) The shapes of the first engagement portion and the second engagement portion are not limited to those described in the above-described embodiment, and various modifications are possible. Of course, the external shapes of the first wiring board and the second wiring board can be changed variously.
(2) The first wiring substrate and the second wiring substrate are not limited to the flexible substrate, and either one or both may be a rigid substrate provided with a glass substrate or the like.
(3) In the above embodiment, the driver is COG (Chip on Glass) mounted on the glass substrate of the display panel. However, for example, the driver is TCP (Tape Career Package) on a flexible wiring substrate for LCD. The present technology is useful for reducing the thickness of the connection portion between the substrates, even with the connection wiring substrate having the mounted configuration.
(4) In the above embodiment, the connection wiring substrate in which the wiring substrate for the LCD and the wiring substrate for the LED are electrically connected by solder is exemplified, but the present invention is not limited to this. For example, in a display device having a touch panel unit on the front side of the display panel, the present invention may be applied to a connection wiring board in which a touch panel substrate for controlling the touch panel unit and a main substrate are soldered. Alternatively, in a display device having a configuration including a navigation unit, the present invention may be applied to a connection wiring substrate to which a separate wiring substrate for controlling a navigation unit is soldered.
(5) In the above-described embodiment, the connection wiring board in which two wiring boards are connected is illustrated. However, the present invention is not limited to this, and three or more wiring boards may be connected. For example, the present technology can be applied to each connecting portion in a connection wiring board in which a wiring board for LED and a wiring board for touch panel are connected to a wiring board for LCD.
(6) In each embodiment described above, the liquid crystal display device including a liquid crystal panel as a display panel is exemplified, but other types of display panels, such as organic EL panels, PDPs (plasma display panels), EPDs (electrophoretic display panels) The present technology is also applicable to various connection wiring substrates used in a display device provided with a MEMS (Micro Electro Mechanical Systems) display panel.
　１…液晶表示装置（表示装置）、１０…液晶パネル（表示パネル）、３０…ＬＣＤ用フレキシブル基板（第２配線基板）、３５，１３５，２３５，３３５…係合受け部（第２係合部）、３６，１３６，２３６，３３６…係合穴部、３７，１３７，２３７，３３７…突出部（規制部）、５０…ＬＥＤ用フレキシブル基板（第１配線基板）、５１…ＬＥＤ実装部（第１基板本体部）、５５，１５５，２５５，３５５…延出係合部（第１係合部）、５６，１５６，２５６，３５６…係合頭部、６０…半田、６１，１６１，２６１，３６１…第１半田接続部、６２，１６２，３６２…第２半田接続部、６３…第３半田接続部、７０，１７０，２７０，３７０…連結配線基板、７５，１７５，２７５，３７５…連結部 DESCRIPTION OF SYMBOLS 1 ... Liquid crystal display device (display device) 10 ... Liquid crystal panel (display panel) 30 ... Flexible substrate for LCD (2nd wiring board) 35, 135, 235, 335 ... Reception part (2nd engagement part) , 36, 136, 236, 336: engaging hole, 37, 137, 237, 337: projecting portion (regulating portion) 50: flexible substrate for LED (first wiring substrate) 51: LED mounting portion 1 board body portion), 55, 155, 255, 355 ... extended engagement portion (first engagement portion), 56, 156, 256, 356 ... engagement head, 60 ... solder, 61, 161, 261, 361 ... first solder connection portion, 62, 162, 362 ... second solder connection portion, 63 ... third solder connection portion, 70, 170, 270, 370 ... connection wiring board, 75, 175, 275, 375 ... connection portion

Claims (5)

  1. 　第１配線基板と、
    　前記第１配線基板に連結された第２配線基板と、
    　前記第１配線基板と前記第２配線基板との連結部に配されて、両配線基板を電気的に接続する半田と、を備える連結配線基板であって、
    　前記第１配線基板は、第１基板本体部と、前記第１基板本体部から延出する第１係合部と、を有し、
    　前記第２配線基板は、前記第１配線基板の前記第１係合部と係合して前記第１係合部と共に前記連結部を構成する第２係合部を有し、
    　前記連結部において、前記第１係合部と前記第２係合部とは、平面に視て重畳することなく端面同士を対向させて配されており、前記半田は、前記第１係合部の延出方向と交差する交差方向に延在して前記第１係合部の端縁と前記第２係合部の端縁との間を接続している連結配線基板。     A first wiring board,
    A second wiring board connected to the first wiring board;
    A connection wiring board comprising: a solder which is disposed at a connection portion between the first wiring board and the second wiring board and electrically connects the two wiring boards.
    The first wiring substrate includes a first substrate main body and a first engaging portion extending from the first substrate main body.
    The second wiring board has a second engaging portion that engages with the first engaging portion of the first wiring board to configure the connecting portion together with the first engaging portion.
    In the connecting portion, the first engaging portion and the second engaging portion are disposed with the end faces facing each other without overlapping in a plan view, and the solder is the first engaging portion. A connection wiring board extending in a cross direction intersecting with an extension direction of the second connection portion and connecting between an end edge of the first engagement portion and an end edge of the second engagement portion;
  2. 　前記半田は、
    　前記第１係合部の第１端縁と、前記第１係合部の前記第１端縁に対向配置された前記第２係合部の第１端縁と、の間を接続する第１半田接続部と、
    　前記第１係合部において前記交差方向について前記第１端縁とは反対側に位置する前記第１係合部の第２端縁と、前記第１係合部の前記第２端縁に対向配置された前記第２係合部の第２端縁との間を接続する第２半田接続部と、に配されている請求項１に記載の連結配線基板。     The solder is
    A first connection connecting a first end edge of the first engagement portion and a first end edge of the second engagement portion disposed opposite to the first end edge of the first engagement portion Solder connection,
    The second end edge of the first engagement portion positioned opposite to the first end edge in the cross direction in the first engagement portion and the second end edge of the first engagement portion 2. The connection wiring board according to claim 1, further comprising: a second solder connection portion connecting between the disposed second end portion and the second end edge of the second engagement portion.
  3. 　前記半田は、さらに、前記第１係合部の前記延出方向に延在して前記第１係合部の端縁と前記第２係合部の端縁との間を接続する第３半田接続部に配されている請求項１または請求項２に記載の連結配線基板。 The solder further extends in the extending direction of the first engagement portion, and connects the end edge of the first engagement portion and the end edge of the second engagement portion. The connection wiring board according to claim 1, wherein the connection wiring board is disposed at the connection portion.
  4. 　前記第１係合部と前記第２係合部の少なくとも一方には、前記第１係合部が前記第２係合部に対して前記延出方向とは逆側に相対移動するのを規制する規制部が設けられている請求項１から請求項３の何れか一項に記載の連結配線基板。 In at least one of the first engaging portion and the second engaging portion, the first engaging portion is restricted from moving relative to the second engaging portion in the direction opposite to the extending direction. The connection wiring board according to any one of claims 1 to 3, wherein a restriction portion is provided.
  5. 　請求項１から請求項４の何れか一項に記載の連結配線基板を備えた表示装置。 The display apparatus provided with the connection wiring board as described in any one of Claims 1-4.
PCT/JP2018/029020 2017-08-09 2018-08-02 Connected wiring board and display device WO2019031379A1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003017739A1 (en) * 2001-08-20 2003-02-27 Record Audio Co., Ltd. Printed board unit and linked printed board using it, led display unit
JP2007134419A (en) * 2005-11-09 2007-05-31 Nec Access Technica Ltd Board mounting device, its mounting method, board linking member and printed board
US7608919B1 (en) * 2003-09-04 2009-10-27 University Of Notre Dame Du Lac Interconnect packaging systems

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003017739A1 (en) * 2001-08-20 2003-02-27 Record Audio Co., Ltd. Printed board unit and linked printed board using it, led display unit
US7608919B1 (en) * 2003-09-04 2009-10-27 University Of Notre Dame Du Lac Interconnect packaging systems
JP2007134419A (en) * 2005-11-09 2007-05-31 Nec Access Technica Ltd Board mounting device, its mounting method, board linking member and printed board

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