WO2019026904A1 - Protection element - Google Patents

Protection element Download PDF

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Publication number
WO2019026904A1
WO2019026904A1 PCT/JP2018/028659 JP2018028659W WO2019026904A1 WO 2019026904 A1 WO2019026904 A1 WO 2019026904A1 JP 2018028659 W JP2018028659 W JP 2018028659W WO 2019026904 A1 WO2019026904 A1 WO 2019026904A1
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WO
WIPO (PCT)
Prior art keywords
tin
electrode
alloys
electrodes
fuse element
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PCT/JP2018/028659
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French (fr)
Japanese (ja)
Inventor
慎太郎 中島
Original Assignee
ショット日本株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by ショット日本株式会社 filed Critical ショット日本株式会社
Priority to KR1020197034414A priority Critical patent/KR102373602B1/en
Priority to CN201880039037.1A priority patent/CN110741457B/en
Publication of WO2019026904A1 publication Critical patent/WO2019026904A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/055—Fusible members
    • H01H85/12—Two or more separate fusible members in parallel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/143—Electrical contacts; Fastening fusible members to such contacts
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H5/00—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection
    • H02H5/04—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection responsive to abnormal temperature

Definitions

  • the present invention relates to a protective element used for an electric device, an electronic device, and the like.
  • a protective circuit of a secondary battery pack for example, a protective element of a surface mount component (SMD) as described in Patent Document 1 (Japanese Patent Laid-Open No. 2015-079608) is suitably used.
  • SMD surface mount component
  • these protective elements detect abnormal states such as excessive heat generation and overvoltage caused by excessive current of the equipment to be protected, or react to abnormal overheating of the ambient temperature, and operate the fuse under predetermined conditions to cut off the electric circuit.
  • the protection element in order to ensure the safety of the device, when the protection circuit detects an abnormality occurring in the device, the resistance element generates heat by the signal current from the protection circuit.
  • the fuse element made of the heat-generating fusible alloy material is fused to shut off the circuit, or the fuse element is fused to cut off the circuit due to an overcurrent.
  • a fuse element material composed of a low melting point metal material melting at soldering temperature and a soluble metal structural material laminated on the low melting point metal material as described in Patent Document 1 etc. is used.
  • a protection element In the fuse element material of this protective element, the low melting point metal material is made to adhere to the solid-phase metal structure material at the temperature by the interfacial tension at the temperature so that the low melting point metal is not melted for a fixed time Support and hold. This maintains the shape of the fuse element at least during the soldering operation to prevent the fuse element material from malfunctioning due to reflow soldering.
  • the metal structure material of the fuse element material is diffused or dissolved in the low melting point metal material which is the medium by the heat of soldering and becomes thin. .
  • the thinned metal structural material easily disappears due to abnormal overheating of the installation environment or heater heating of the built-in resistance heating element, and thereafter operates without interfering with melting.
  • the fuse element used in the protective element it is preferable to use a material with a low electric resistance as much as possible, from the viewpoint of, for example, responding to high current and reducing standby energy loss of the rechargeable battery.
  • the types of fusible metals applicable to the fuse element of the protective element are limited, and it is not always possible to select one having a low electrical resistance value. In practice, in order to ensure practicality such as operation performance, it is often necessary to use a fuse element having a relatively large electric resistance value.
  • the present invention has been proposed to solve the above problems and to improve it, and to provide a protective element capable of reducing the internal resistance value regardless of the specific resistance value of the fuse element material. To aim.
  • an insulating substrate a plurality of electrodes provided on the insulating substrate, and an electrode filling material of low melting point metal filled between at least a pair of electrodes of the electrodes;
  • a fuse element is provided that bridges between the at least one pair of electrodes and covers the top of the electrode filler.
  • the electrode filler is made of a metal material whose melting temperature is equal to or lower than the liquidus temperature of the fuse element.
  • a heating element may be provided on one side of the insulating substrate.
  • the electrode filler is composed of any alloy selected from the group of tin base alloys, tin-lead alloys, tin-copper alloys, tin-silver alloys, and tin-silver-copper alloys. You may
  • the electrode filler is selected from the group consisting of a metal material filled with solder paste, a metal material filled with solder balls, and a metal material filled and formed by partial plating. You may comprise with the metal material of.
  • the fuse element is made of any alloy selected from the group of tin base alloys, tin-lead alloys, tin-copper alloys, tin-silver alloys, and tin-silver-copper alloys. May be
  • the fuse element may be formed of a composite material in which a plurality of metal materials having different compositions are combined.
  • the electrode filling material is provided to fill the gap between the electrodes where the fuse element crosslinks, thereby reducing the internal resistance of the protection element.
  • the gap between the electrodes is a groove-like portion formed of the end surfaces of the pair of opposing electrodes and the insulating substrate surface between them.
  • any metal material may be used if its melting temperature is the same or lower than that of the fuse element.
  • the electrode filler is preferably made of a material having a lower electrical resistance than the fuse element. An example is tin or tin based solder material.
  • the electrode filler fills the gap (hollow space) between the electrodes where the fuse element is bridged.
  • the electrode filler is made of a metal material that is lower than the melting temperature of the fuse element, and therefore does not interfere with the melting operation of the fuse element.
  • fusible metals such as solder can be used as they are, and noble metals such as pure silver and silver alloys (high silver content alloys) may not be used, which is economical.
  • FIG. 1 It is an exploded perspective view of a protection element concerning one embodiment of the present invention.
  • the protection element which concerns on one Embodiment of this invention is shown, (a) is the top view which cut
  • the protective element 10 with the electrode filler includes at least one of an insulating substrate 11, a plurality of electrodes 12 a to 12 g provided on the insulating substrate 11, and the electrodes 12 a to 12 g. Bridging between the at least one pair of electrodes and the electrode filling material 13 of low melting point metal filled between the pair of electrodes, for example between the electrodes 12a and 12b and between the electrodes 12b and 12c;
  • the fuse element 14 covers the top of the electrode filler 13, the operation flux (not shown) applied to the surface of the fuse element 14, and the cover 15 covering the operation flux and the top of the fuse element 14.
  • the electrode filler 13 is made of a metal material whose melting temperature is equal to or lower than the liquidus temperature of the fuse element 14.
  • the insulating substrate 11 may be made of any material and composition as long as it is an insulating material.
  • a material of the insulating substrate 11 for example, plastic, glass, glass ceramic, ceramic and the like are preferable.
  • the electrode 12 provided on the insulating substrate 11 may be of any material or composition as long as it is a conductive material.
  • a material of the electrode 12 for example, copper, silver, a copper alloy, and a silver alloy are suitable.
  • the electrode filler 13 can be formed so as to be filled in the gap between the electrode 12a and the electrode 12b and the gap between the electrode 12b and the electrode 12c, and any metal material whose melting temperature is equal to or lower than that of the fuse element 14 It may be of materials and compositions.
  • the electrode filler 13 is, for example, a metal material in which a solder paste consisting of tin-based alloy, tin-lead alloy, tin-copper alloy, tin-silver alloy, tin-silver-copper alloy is formed, tin-based alloy, Metal material filled with solder balls consisting of tin-lead alloy, tin-copper alloy, tin-silver alloy, tin-silver-copper alloy, tin base alloy, tin-lead alloy, tin-copper alloy, tin-silver A metal material filled and formed by partial plating of an alloy or tin-silver-copper alloy may be used.
  • the electrode filler 13 can be integrated with the fuse element 14 along with the surface mounting of the protective element 10. When the fuse element 14 is fused, the electrode filling material 13 does not interfere with the fusing operation since it is spheroidized together with the liquid phased fuse element 14.
  • the fuse element 14 may be of any material and composition as long as it is a fusible metal material.
  • a tin-based alloy, a tin-lead alloy, a tin-copper alloy, a tin-silver alloy, a tin-silver-copper alloy, etc. can be suitably used.
  • the fuse element 14 may use a metal material of a single composition, or may be used as a composite material by combining a plurality of metal materials having different compositions.
  • a heating element may be provided on one side of the insulating substrate 11 as necessary.
  • the heating element is provided with an insulating coating as required.
  • the central electrode 12b connected to the fuse element 14 among the electrodes 12a, 12b and 12c may be omitted.
  • the lid 15 only needs to cover the upper portions of the insulating substrate 11 and the fuse element 14 to secure a desired space, and the shape and the material of the lid 15 are not limited.
  • a dome-shaped resin film cover, a plastic lid, a ceramic lid or the like can be suitably used as the lid 15.
  • the protective element 20 with an electrode filler of Example 1 has an insulating substrate 21 made of alumina ceramic.
  • the insulating substrate 21 is provided with a plurality of silver alloy electrodes 22a to 22g.
  • a resistive heating element 26 electrically connected to the electrode 22 f and the electrode 22 h is provided on the lower surface of the insulating substrate 21.
  • the electrodes 22a to 22g among the three electrodes 22a, 22b and 22c, that is, between the electrodes 22a and 22b and between the electrodes 22b and 22c, the electrodes are filled with 96.5 Sn-3Ag-0.5Cu alloy.
  • the material 23 is filled.
  • the fuse element 24 is made of a clad material of 92Pb-Sn alloy 24a and 99.3Sn-0.7Cu alloy 24b so as to bridge between the three electrodes 22a, 22b, 22c and cover the upper part of the electrode filling material 23. It is provided.
  • a lid 25 made of liquid crystal polymer is provided to cover the operating flux (not shown) applied to the surface of the fuse element 24 and the upper portion of the operating flux and the fuse element 24.
  • the electrode filler 23 is made of a metal material whose melting temperature is equal to or lower than the liquidus temperature of the fuse element 24. Between the electrode 22a and the electrode 22e, between the electrode 22b and the electrode 22f, between the electrode 22c and the electrode 22g, and between the electrode 22d and the electrode 22h, electrically connected by half through holes of silver alloy There is.
  • Overglaze of insulating glass is applied to the surface of the resistance heating element 26 of the first embodiment.
  • parts and members common to those of Example 1 are used to prepare a protective element of a comparative example in which the electrode filler is not provided.
  • the internal resistance value was measured. While the internal resistance value of the protective element 20 with the electrode filler of Example 1 was 0.45 m ⁇ (corresponding to the rated current 25 A), the internal resistance value of the protective element of the comparative example without the electrode filler was 0.60 m ⁇ (corresponding to a rated current of 20 A). It can be seen that the internal resistance of the protection element is reduced by the structure of the present embodiment, whereby the rated current value is also improved.
  • the conductive path may be maintained.
  • the protective element with an electrode filler according to the present invention can be mounted on a circuit board to be protected together with other surface mounted components, and is collectively soldered and mounted by a reflow method or the like to be used as a protective device for secondary batteries such as battery packs. it can.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Fuses (AREA)

Abstract

This protection element (10, 20) is provided with: an insulating substrate (11, 21); a plurality of electrodes (12, 22) which are arranged on the insulating substrate (11, 21); an electrode filler (13, 23) which is composed of a low-melting-point metal and is filled at least between a pair of electrodes among the plurality of electrodes (12, 22); and a fuse element (14, 24) which bridges at least the pair of electrodes and covers the upper part of the electrode filler (13, 23). The electrode filler (13, 23) is configured from a metal material which has a melting point that is equal to or less than the liquidus temperature of the fuse element (14, 24).

Description

保護素子Protection element
　本発明は、電気機器および電子機器などに用いられる保護素子に関する。 TECHNICAL FIELD The present invention relates to a protective element used for an electric device, an electronic device, and the like.
　近年、モバイル機器などの小型電子機器の急速な普及に伴い、搭載する電源の保護回路に実装される保護素子も小型薄型のものが使用されている。二次電池パックの保護回路として、例えば特許文献１（特開２０１５－０７９６０８号公報）に記載されるような表面実装部品（ＳＭＤ）の保護素子が好適に利用される。 2. Description of the Related Art In recent years, with the rapid spread of small electronic devices such as mobile devices, small and thin protective elements mounted on protective circuits of power sources to be mounted are also used. As a protective circuit of a secondary battery pack, for example, a protective element of a surface mount component (SMD) as described in Patent Document 1 (Japanese Patent Laid-Open No. 2015-079608) is suitably used.
　これらの保護素子として、被保護機器の過電流により生ずる過大発熱や過電圧などの異常状態を検知し、または周囲温度の異常過熱に感応して、所定条件でヒューズを作動させ電気回路を遮断する非復帰型保護素子がある。保護素子においては、機器の安全を図るために、保護回路が機器に生ずる異常を検知すると、保護回路からの信号電流により抵抗素子を発熱させる。保護素子においては、その発熱で可融性の合金材からなるヒューズエレメントを溶断させて回路を遮断するか、あるいは過電流によってヒューズエレメントを溶断させて回路を遮断する。 As these protective elements, they detect abnormal states such as excessive heat generation and overvoltage caused by excessive current of the equipment to be protected, or react to abnormal overheating of the ambient temperature, and operate the fuse under predetermined conditions to cut off the electric circuit. There is a resettable protection element. In the protection element, in order to ensure the safety of the device, when the protection circuit detects an abnormality occurring in the device, the resistance element generates heat by the signal current from the protection circuit. In the protective element, the fuse element made of the heat-generating fusible alloy material is fused to shut off the circuit, or the fuse element is fused to cut off the circuit due to an overcurrent.
　例えば、特許文献１などに記載されるような、はんだ付け温度で溶融する低融点金属材と、低融点金属材に積層された溶解性の金属構造材とで構成されたヒューズエレメント材を用いた保護素子がある。この保護素子のヒューズエレメント材においては、はんだ付け作業で液相化した低融点金属材をその温度で固相の金属構造材に界面張力で付着させることで、低融点金属を一定時間溶断しないように支えて保持する。これにより、少なくともはんだ付け作業の間、ヒューズエレメントの形状を維持して、ヒューズエレメント材がリフローはんだ付けで誤動作するのを防止する。 For example, a fuse element material composed of a low melting point metal material melting at soldering temperature and a soluble metal structural material laminated on the low melting point metal material as described in Patent Document 1 etc. is used. There is a protection element. In the fuse element material of this protective element, the low melting point metal material is made to adhere to the solid-phase metal structure material at the temperature by the interfacial tension at the temperature so that the low melting point metal is not melted for a fixed time Support and hold. This maintains the shape of the fuse element at least during the soldering operation to prevent the fuse element material from malfunctioning due to reflow soldering.
　はんだ付けが完了し回路保護素子が被保護回路に実装されると、ヒューズエレメント材の金属構造材は、はんだ付けの熱で媒質である低融点金属材中に拡散または溶解されて薄層化する。薄層化された金属構造材は、設置環境の異常過熱や内蔵する抵抗発熱素子のヒータ加熱により容易に消失し、以後溶断を妨げることなく動作する。 When the soldering is completed and the circuit protection element is mounted on the protected circuit, the metal structure material of the fuse element material is diffused or dissolved in the low melting point metal material which is the medium by the heat of soldering and becomes thin. . The thinned metal structural material easily disappears due to abnormal overheating of the installation environment or heater heating of the built-in resistance heating element, and thereafter operates without interfering with melting.
特開２０１５－０７９６０８号公報JP, 2015-079608, A
　上記保護素子に用いられるヒューズエレメントには、高電流化への対応や充電池の待機エネルギーロスを低減する等の観点から、なるべく電気抵抗値の低い材料を用いることが好ましい。しかしながら保護素子のヒューズエレメントに適用できる易融合金の種類は限られており、必ずしも低電気抵抗値のものを選択できる訳ではない。実際には動作性能などの実用性を確保するため、比較的電気抵抗値の大きいヒューズエレメントを使用せざるを得ないことも多い。 For the fuse element used in the protective element, it is preferable to use a material with a low electric resistance as much as possible, from the viewpoint of, for example, responding to high current and reducing standby energy loss of the rechargeable battery. However, the types of fusible metals applicable to the fuse element of the protective element are limited, and it is not always possible to select one having a low electrical resistance value. In practice, in order to ensure practicality such as operation performance, it is often necessary to use a fuse element having a relatively large electric resistance value.
　本発明は、上述の問題点を解消し更に改良するために提案されたものであり、ヒューズエレメント材の固有抵抗値に左右されることなく、内部抵抗値を低減できる保護素子を提供することを目的とする。 The present invention has been proposed to solve the above problems and to improve it, and to provide a protective element capable of reducing the internal resistance value regardless of the specific resistance value of the fuse element material. To aim.
　この発明に基づいた保護素子に従えば、絶縁基板と、上記絶縁基板に設けられた複数の電極と、上記電極のうち少なくとも一対の電極の間に充填された低融点金属の電極充填材と、上記少なくとも一対の電極の間を架橋しかつ上記電極充填材の上部を覆うヒューズエレメントとを備えている。上記電極充填材は、その溶融温度が上記ヒューズエレメントの液相線温度以下の金属材で構成されている。 According to the protection element based on the present invention, an insulating substrate, a plurality of electrodes provided on the insulating substrate, and an electrode filling material of low melting point metal filled between at least a pair of electrodes of the electrodes; A fuse element is provided that bridges between the at least one pair of electrodes and covers the top of the electrode filler. The electrode filler is made of a metal material whose melting temperature is equal to or lower than the liquidus temperature of the fuse element.
　上記保護素子において、上記絶縁基板の片面に発熱素子を設けてもよい。
　上記保護素子において、上記電極充填材は、錫基合金、錫－鉛合金、錫－銅合金、錫－銀合金、および、錫－銀－銅合金の群から選択されたいずれかの合金で構成してもよい。 In the above protective element, a heating element may be provided on one side of the insulating substrate.
In the above protective element, the electrode filler is composed of any alloy selected from the group of tin base alloys, tin-lead alloys, tin-copper alloys, tin-silver alloys, and tin-silver-copper alloys. You may
　上記保護素子において、上記電極充填材は、はんだペーストが充填形成された金属材、はんだボールが充填形成された金属材、および、部分メッキにより充填形成された金属材の群から選択されたいずれかの金属材で構成してもよい。 In the above protective element, the electrode filler is selected from the group consisting of a metal material filled with solder paste, a metal material filled with solder balls, and a metal material filled and formed by partial plating. You may comprise with the metal material of.
　上記保護素子において、上記ヒューズエレメントは、錫基合金、錫－鉛合金、錫－銅合金、錫－銀合金、および、錫－銀－銅合金の群から選択されたいずれかの合金で構成してもよい。 In the above protective element, the fuse element is made of any alloy selected from the group of tin base alloys, tin-lead alloys, tin-copper alloys, tin-silver alloys, and tin-silver-copper alloys. May be
　上記保護素子において、上記ヒューズエレメントは、組成の異なる複数の金属材を組み合わせた複合材で構成してもよい。 In the protective element, the fuse element may be formed of a composite material in which a plurality of metal materials having different compositions are combined.
　本発明の保護素子においては、電極充填材が、ヒューズエレメントが架橋する電極間の隙間を埋めるように設けられることにより、保護素子の内部抵抗が低減する。電極間の隙間は、対向する一対の電極の端面とその間の絶縁基板面から構成された溝状の部分である。電極充填材は、その溶融温度がヒューズエレメントと同等またはより低い金属ならばいずれの金属材を用いてもよい。電極充填材は、ヒューズエレメントよりも電気抵抗が小さい材料で構成することが好ましい。一例として錫または錫系はんだ材がある。 In the protection element of the present invention, the electrode filling material is provided to fill the gap between the electrodes where the fuse element crosslinks, thereby reducing the internal resistance of the protection element. The gap between the electrodes is a groove-like portion formed of the end surfaces of the pair of opposing electrodes and the insulating substrate surface between them. As the electrode filling material, any metal material may be used if its melting temperature is the same or lower than that of the fuse element. The electrode filler is preferably made of a material having a lower electrical resistance than the fuse element. An example is tin or tin based solder material.
　本発明に係る保護素子においては、電極充填材は、ヒューズエレメントが架橋された電極間の隙間（中空空間）を埋める。これによりヒューズエレメントの通電路の断面積を拡大させて、保護素子の内部抵抗を低減させることができる。電極充填材は、ヒューズエレメントの溶融温度以下の金属材で構成されるため、ヒューズエレメントの溶断動作を妨げることが無い。しかも電極充填材は、はんだ材など易融合金をそのまま使用でき、純銀や銀系合金（高銀含有率合金）などの貴金属材を用いなくてもよく経済的である。 In the protection element according to the present invention, the electrode filler fills the gap (hollow space) between the electrodes where the fuse element is bridged. Thereby, the cross-sectional area of the current path of the fuse element can be expanded, and the internal resistance of the protection element can be reduced. The electrode filler is made of a metal material that is lower than the melting temperature of the fuse element, and therefore does not interfere with the melting operation of the fuse element. In addition, as the electrode filler, fusible metals such as solder can be used as they are, and noble metals such as pure silver and silver alloys (high silver content alloys) may not be used, which is economical.
本発明の一実施形態に係る保護素子の分解斜視図である。It is an exploded perspective view of a protection element concerning one embodiment of the present invention. 本発明の一実施形態に係る保護素子を示し、（ａ）は（ｂ）のＩＩａ－ＩＩａ線に沿って蓋体を切断した平面図であり、（ｂ）は（ａ）のＩＩｂ－ＩＩｂ矢視断面図であり、（ｃ）は下面図である。The protection element which concerns on one Embodiment of this invention is shown, (a) is the top view which cut | disconnected the lid along the IIa-IIa line of (b), (b) is the IIb-IIb arrow of (a) It is a visual cross-sectional view, and (c) is a bottom view. 本発明の一実施形態に係る保護素子の、蓋体、絶縁基板裏面の電極および発熱素子を省略した、要部断面図である。It is principal part sectional drawing which abbreviate | omitted the lid, the electrode of a back surface of an insulated substrate, and a heating element of the protection element which concerns on one Embodiment of this invention.
　本実施形態に係る電極充填材付きの保護素子１０は、図１に示すように、絶縁基板１１と、この絶縁基板１１に設けた複数の電極１２ａ～１２ｇと、この電極１２ａ～１２ｇのうち少なくとも一対の電極の間、一例として電極１２ａと電極１２ｂとの間および電極１２ｂと電極１２ｃとの間、に充填した低融点金属の電極充填材１３と、上記少なくとも一対の電極の間を架橋しかつ電極充填材１３の上部を覆うヒューズエレメント１４と、ヒューズエレメント１４の表面に塗布した動作フラックス（図示せず）と、この動作フラックスおよびヒューズエレメント１４の上部を覆う蓋体１５とを備えている。電極充填材１３は、その溶融温度がヒューズエレメント１４の液相線温度以下の金属材で構成されている。 As shown in FIG. 1, the protective element 10 with the electrode filler according to the present embodiment includes at least one of an insulating substrate 11, a plurality of electrodes 12 a to 12 g provided on the insulating substrate 11, and the electrodes 12 a to 12 g. Bridging between the at least one pair of electrodes and the electrode filling material 13 of low melting point metal filled between the pair of electrodes, for example between the electrodes 12a and 12b and between the electrodes 12b and 12c; The fuse element 14 covers the top of the electrode filler 13, the operation flux (not shown) applied to the surface of the fuse element 14, and the cover 15 covering the operation flux and the top of the fuse element 14. The electrode filler 13 is made of a metal material whose melting temperature is equal to or lower than the liquidus temperature of the fuse element 14.
　絶縁基板１１は絶縁材であればいずれの材料、組成のものでもよい。絶縁基板１１の材料としては、例えば、プラスチック、ガラス、ガラスセラミック、セラミックなどが好適である。 The insulating substrate 11 may be made of any material and composition as long as it is an insulating material. As a material of the insulating substrate 11, for example, plastic, glass, glass ceramic, ceramic and the like are preferable.
　絶縁基板１１に設けた電極１２は、導電材であればいずれの材料、組成のものでもよい。電極１２の材料としては、例えば、銅、銀、銅合金、銀合金が好適である。 The electrode 12 provided on the insulating substrate 11 may be of any material or composition as long as it is a conductive material. As a material of the electrode 12, for example, copper, silver, a copper alloy, and a silver alloy are suitable.
　電極充填材１３は、電極１２ａと電極１２ｂの間の隙間および電極１２ｂと電極１２ｃとの間の間隙に充填形成でき、かつ溶融温度がヒューズエレメント１４と同等またはより低い金属材であればいずれの材料、組成のものでもよい。電極充填材１３としては、例えば、錫基合金、錫－鉛合金、錫－銅合金、錫－銀合金、錫－銀－銅合金からなるはんだペーストが充填形成された金属材、錫基合金、錫－鉛合金、錫－銅合金、錫－銀合金、錫－銀－銅合金からなるはんだボールが充填形成された金属材、錫基合金、錫－鉛合金、錫－銅合金、錫－銀合金、錫－銀－銅合金からなる部分メッキにより充填形成された金属材などが利用できる。 The electrode filler 13 can be formed so as to be filled in the gap between the electrode 12a and the electrode 12b and the gap between the electrode 12b and the electrode 12c, and any metal material whose melting temperature is equal to or lower than that of the fuse element 14 It may be of materials and compositions. The electrode filler 13 is, for example, a metal material in which a solder paste consisting of tin-based alloy, tin-lead alloy, tin-copper alloy, tin-silver alloy, tin-silver-copper alloy is formed, tin-based alloy, Metal material filled with solder balls consisting of tin-lead alloy, tin-copper alloy, tin-silver alloy, tin-silver-copper alloy, tin base alloy, tin-lead alloy, tin-copper alloy, tin-silver A metal material filled and formed by partial plating of an alloy or tin-silver-copper alloy may be used.
　この電極充填材１３は、保護素子１０の表面実装に伴いヒューズエレメント１４と一体化することができる。ヒューズエレメント１４が溶断するときは、液相化したヒューズエレメント１４と共に球状化するので、電極充填材１３が溶断動作を妨げることはない。 The electrode filler 13 can be integrated with the fuse element 14 along with the surface mounting of the protective element 10. When the fuse element 14 is fused, the electrode filling material 13 does not interfere with the fusing operation since it is spheroidized together with the liquid phased fuse element 14.
　ヒューズエレメント１４は、易融性の金属材であれば何れの材料、組成のものでもよい。ヒューズエレメント１４としては、例えば、錫基合金、錫－鉛合金、錫－銅合金、錫－銀合金、錫－銀－銅合金などが好適に利用できる。ヒューズエレメント１４は、単一組成の金属材を用いても、組成の異なる複数の金属材を組み合わせて複合材にして用いてもよい。 The fuse element 14 may be of any material and composition as long as it is a fusible metal material. As the fuse element 14, for example, a tin-based alloy, a tin-lead alloy, a tin-copper alloy, a tin-silver alloy, a tin-silver-copper alloy, etc. can be suitably used. The fuse element 14 may use a metal material of a single composition, or may be used as a composite material by combining a plurality of metal materials having different compositions.
　本実施の形態の保護素子１０においては、絶縁基板１１の片面に必要に応じて発熱素子を設けてもよい。発熱素子には必要に応じて絶縁コーティングを施す。発熱素子を設けない場合は、電極１２ａ，１２ｂ，１２ｃのうち、ヒューズエレメント１４に接続される中央の電極１２ｂを省略してもよい。 In the protection element 10 of the present embodiment, a heating element may be provided on one side of the insulating substrate 11 as necessary. The heating element is provided with an insulating coating as required. When no heating element is provided, the central electrode 12b connected to the fuse element 14 among the electrodes 12a, 12b and 12c may be omitted.
　蓋体１５は、絶縁基板１１およびヒューズエレメント１４の上部を覆って所望の空間を確保できればよく、形状、材質を制限するものではない。例えば、蓋体１５には、ドーム状樹脂フイルムカバー、プラスチック蓋、セラミック蓋などが好適に利用できる。 The lid 15 only needs to cover the upper portions of the insulating substrate 11 and the fuse element 14 to secure a desired space, and the shape and the material of the lid 15 are not limited. For example, a dome-shaped resin film cover, a plastic lid, a ceramic lid or the like can be suitably used as the lid 15.
　実施例１の電極充填材付きの保護素子２０は、図２および図３に示すように、アルミナセラミックの絶縁基板２１を有する。この絶縁基板２１には複数の銀合金製の電極２２ａ～２２ｇが設けられている。絶縁基板２１の下面には、電極２２ｆおよび電極２２ｈと電気的に接続された抵抗発熱素子２６が設けられている。 As shown in FIGS. 2 and 3, the protective element 20 with an electrode filler of Example 1 has an insulating substrate 21 made of alumina ceramic. The insulating substrate 21 is provided with a plurality of silver alloy electrodes 22a to 22g. A resistive heating element 26 electrically connected to the electrode 22 f and the electrode 22 h is provided on the lower surface of the insulating substrate 21.
　この電極２２ａ～２２ｇのうち３つの電極２２ａ，２２ｂ，２２ｃの間、すなわち電極２２ａと電極２２ｂの間および電極２２ｂと電極２２ｃの間には、９６．５Ｓｎ－３Ａｇ－０．５Ｃｕ合金の電極充填材２３が充填されている。３つの電極２２ａ，２２ｂ，２２ｃの間を架橋しかつ電極充填材２３の上部を覆うように、９２Ｐｂ－Ｓｎ合金２４ａと９９．３Ｓｎ－０．７Ｃｕ合金２４ｂとのクラッド材からなるヒューズエレメント２４が設けられている。 Among the electrodes 22a to 22g, among the three electrodes 22a, 22b and 22c, that is, between the electrodes 22a and 22b and between the electrodes 22b and 22c, the electrodes are filled with 96.5 Sn-3Ag-0.5Cu alloy. The material 23 is filled. The fuse element 24 is made of a clad material of 92Pb-Sn alloy 24a and 99.3Sn-0.7Cu alloy 24b so as to bridge between the three electrodes 22a, 22b, 22c and cover the upper part of the electrode filling material 23. It is provided.
　ヒューズエレメント２４の表面に塗布した動作フラックス（図示せず）と、この動作フラックスおよびヒューズエレメント２４の上部とを覆うように、液晶ポリマー製の蓋体２５が設けられている。 A lid 25 made of liquid crystal polymer is provided to cover the operating flux (not shown) applied to the surface of the fuse element 24 and the upper portion of the operating flux and the fuse element 24.
　電極充填材２３は、その溶融温度がヒューズエレメント２４の液相線温度以下の金属材から構成されている。電極２２ａと電極２２ｅの間、電極２２ｂと電極２２ｆの間、電極２２ｃと電極２２ｇの間、および、電極２２ｄと電極２２ｈの間は、それぞれ、銀合金のハーフスルーホールで電気的に接続されている。 The electrode filler 23 is made of a metal material whose melting temperature is equal to or lower than the liquidus temperature of the fuse element 24. Between the electrode 22a and the electrode 22e, between the electrode 22b and the electrode 22f, between the electrode 22c and the electrode 22g, and between the electrode 22d and the electrode 22h, electrically connected by half through holes of silver alloy There is.
　実施例１の抵抗発熱素子２６の表面には絶縁ガラスのオーバーグレーズを施している。ここで、実施例１の電極充填材付きの保護素子２０と比較する目的で、実施例１と共通の部品、部材を用いて電極充填材を設けない比較例の保護素子を用意し、両者の内部抵抗値を測定した。実施例１の電極充填材付きの保護素子２０の内部抵抗値が０．４５ｍΩ（定格電流２５Ａに相当）であったのに対して、電極充填材を持たない比較例の保護素子の内部抵抗値は０．６０ｍΩ（定格電流２０Ａに相当）であった。本実施例の構造により保護素子の内部抵抗が低減し、もって定格電流値も向上したことが分かる。 Overglaze of insulating glass is applied to the surface of the resistance heating element 26 of the first embodiment. Here, for the purpose of comparison with the protective element 20 with an electrode filler of Example 1, parts and members common to those of Example 1 are used to prepare a protective element of a comparative example in which the electrode filler is not provided. The internal resistance value was measured. While the internal resistance value of the protective element 20 with the electrode filler of Example 1 was 0.45 mΩ (corresponding to the rated current 25 A), the internal resistance value of the protective element of the comparative example without the electrode filler Was 0.60 mΩ (corresponding to a rated current of 20 A). It can be seen that the internal resistance of the protection element is reduced by the structure of the present embodiment, whereby the rated current value is also improved.
　本実施形態の電極充填材付き保護素子においては、加熱によって電極充填材と絶縁基板との界面にボイドが生じることがあるが、導通経路は保持されるため差し支えない。 In the protective element with electrode filling material of the present embodiment, although a void may be generated at the interface between the electrode filling material and the insulating substrate by heating, the conductive path may be maintained.
　今回開示された実施の形態はすべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は上記した説明ではなくて請求の範囲によって示され、請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。 It should be understood that the embodiments disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is shown not by the above description but by the scope of claims, and is intended to include all modifications within the scope and meaning equivalent to the scope of claims.
　本発明の電極充填材付き保護素子は、他の表面実装部品と共に被保護回路板にマウントでき、リフロー工法などで一括はんだ付け実装されて、電池パックなど２次電池の保護装置として利用することができる。 The protective element with an electrode filler according to the present invention can be mounted on a circuit board to be protected together with other surface mounted components, and is collectively soldered and mounted by a reflow method or the like to be used as a protective device for secondary batteries such as battery packs. it can.
　１０，２０　保護素子、１１，２１　絶縁基板、１２，２２　電極、１３，２３　電極充填材、１４，２４　ヒューズエレメント、１５，２５　蓋体、２６　発熱素子。 10, 20 protection elements, 11, 21 insulating substrates, 12, 22 electrodes, 13, 23 electrode filling materials, 14, 24 fuse elements, 15, 25 lids, 26 heating elements.

Claims (6)

  1. 　絶縁基板と、前記絶縁基板に設けられた複数の電極と、前記電極のうち少なくとも一対の電極の間に充填された低融点金属の電極充填材と、前記少なくとも一対の電極の間を架橋しかつ前記電極充填材の上部を覆うヒューズエレメントとを備え、
    　前記電極充填材は、その溶融温度が前記ヒューズエレメントの液相線温度以下の金属材で構成された、保護素子。     An insulating substrate, a plurality of electrodes provided on the insulating substrate, an electrode filler of a low melting point metal filled between at least a pair of the electrodes, and a bridge between the at least a pair of electrodes; A fuse element covering the top of the electrode filling material;
    The electrode filler is a protective element whose melting temperature is made of a metal material equal to or lower than the liquidus temperature of the fuse element.
  2. 　前記絶縁基板の片面に発熱素子を設けた、請求項１に記載の保護素子。 The protection element according to claim 1, wherein a heating element is provided on one side of the insulating substrate.
  3. 　前記電極充填材は、錫基合金、錫－鉛合金、錫－銅合金、錫－銀合金、および、錫－銀－銅合金の群から選択されたいずれかの合金で構成されている、請求項１または請求項２に記載の保護素子。 The electrode filler is made of any of the alloys selected from the group consisting of tin base alloys, tin-lead alloys, tin-copper alloys, tin-silver alloys, and tin-silver-copper alloys. The protection element of Claim 1 or Claim 2.
  4. 　前記電極充填材は、はんだペーストが充填形成された金属材、はんだボールが充填形成された金属材、および、部分メッキにより充填形成された金属材の群から選択されたいずれかの金属材で構成されている、請求項１から請求項３のいずれか１項に記載の保護素子。 The electrode filling material is made of any metal material selected from the group consisting of a metal material filled with solder paste, a metal material filled with solder balls, and a metal material filled and formed by partial plating. The protection element according to any one of claims 1 to 3, wherein
  5. 　前記ヒューズエレメントは、錫基合金、錫－鉛合金、錫－銅合金、錫－銀合金、および、錫－銀－銅合金の群から選択されたいずれかの合金で構成されている、請求項１から請求項４のいずれか１項に記載の保護素子。 The fuse element is made of any alloy selected from the group of tin base alloys, tin-lead alloys, tin-copper alloys, tin-silver alloys, and tin-silver-copper alloys. The protection element according to any one of claims 1 to 4.
  6. 　前記ヒューズエレメントは、組成の異なる複数の金属材を組み合わせた複合材からなる、請求項５に記載の保護素子。 The protection element according to claim 5, wherein the fuse element is made of a composite material in which a plurality of metal materials having different compositions are combined.
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