WO2019026786A1 - Vapor chamber - Google Patents

Vapor chamber Download PDF

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Publication number
WO2019026786A1
WO2019026786A1 PCT/JP2018/028230 JP2018028230W WO2019026786A1 WO 2019026786 A1 WO2019026786 A1 WO 2019026786A1 JP 2018028230 W JP2018028230 W JP 2018028230W WO 2019026786 A1 WO2019026786 A1 WO 2019026786A1
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WO
WIPO (PCT)
Prior art keywords
sheet
vapor chamber
housing
support
outer edge
Prior art date
Application number
PCT/JP2018/028230
Other languages
French (fr)
Japanese (ja)
Inventor
溝井　明
善夫 織田
孟明 玉山
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN201890000752.XU priority Critical patent/CN211261893U/en
Publication of WO2019026786A1 publication Critical patent/WO2019026786A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs

Definitions

  • the present invention relates to a vapor chamber.
  • the vapor chamber is one in which a suitable amount of easily volatile working fluid is enclosed in a flat-plate-like closed container.
  • the working fluid is vaporized by the heat from the heat source, moves in the internal space, and then releases the heat to the outside to return to the liquid.
  • the working fluid returned to the liquid is again carried to the vicinity of the heat source by a capillary structure called a wick and vaporized again.
  • the vapor chamber can operate independently without external power, and heat can be diffused at high speed in two dimensions using the latent heat of evaporation and latent heat of condensation of the working fluid.
  • the vapor chamber which has a sheet-like container comprised from a 1st metal sheet and a 2nd metal sheet as an airtight container is proposed.
  • the thickness of the sheet-like container is preferably 0.5 mm or less.
  • a mobile terminal such as a smartphone or a tablet.
  • Patent Document 1 When the vapor chamber of Patent Document 1 is directly mounted on an electronic component, it is necessary to process the vapor chamber into a shape according to the installation location.
  • the vapor chamber of Patent Document 1 has a structure in which two metal sheets are bonded to each other, and the thickness thereof is as thin as 0.5 mm or less, so there is a problem that processing into a complicated shape is difficult .
  • Patent Document 1 describes that a vapor chamber is inserted into a recess of a metal plate and used as a heat dissipation plate.
  • the present invention has been made in view of the above problems, and it is an object of the present invention to provide a vapor chamber which can be easily processed into an arbitrary shape and can be easily incorporated into an electronic device.
  • a vapor chamber includes a first sheet and a second sheet, and one of the first main surface of the first sheet and one of the second sheet A casing having an internal space between the one major surface of the first sheet and the one major surface of the second sheet, and sealed in the interior space of the casing; A hydraulic fluid, a wick disposed in the internal space of the housing, and a support fixed to the first sheet at the outer edge of the other main surface of the first sheet, In plan view of the main surface of the first sheet, a part of the outer edge of the support is located outside the outer edge of the other main surface of the first sheet as viewed from the center of the housing.
  • the height position of the other main surface of the first sheet is the same as the height position of the other main surface of the first sheet, viewed in cross section from the direction orthogonal to the opposing direction of the first sheet and the second sheet Lower than the height position of the top of the support.
  • the support in the area fixed to the first sheet has rigidity higher than the rigidity of the housing in the area to which the support is fixed.
  • the housing is formed by joining an outer edge portion of the first sheet and an outer edge portion of the second sheet.
  • the support is provided all around the outer edge of the first sheet.
  • a pillar is formed on the other main surface of the first sheet or the second sheet, and a protrusion is formed on the other main surface of the other sheet, and the wick is formed. , And are held by the column and the convex portion.
  • the support is fixed to the first sheet via a bonding layer.
  • a heat dissipation device comprising the vapor chamber of the present invention is provided.
  • an electronic device comprising the vapor chamber of the present invention or the heat dissipation device of the present invention.
  • a vapor chamber which can be easily processed into any shape and can be easily incorporated into an electronic device.
  • FIG. 7 is a cross-sectional view of the electronic device of FIG. 6 taken along the line XX.
  • FIG. 1 is a perspective view of the vapor chamber 1a of the first embodiment of the present invention as viewed from above.
  • FIG. 2 is a cross-sectional view of the vapor chamber 1a of FIG.
  • the vapor chamber 1a includes a first sheet 6 and a second sheet 7, as shown in FIGS. 1 and 2, and one main surface of the first sheet 6 and the second sheet
  • the housing 2 has an internal space between the one main surface of the first sheet 6 and the one main surface of the second sheet 7, and the inside of the housing 2.
  • the main surface of the first sheet 6 has the wick 4 disposed in the space and the support 10 a fixed to the first sheet 6 at the outer edge 9 of the other main surface of the first sheet 6.
  • the outer edge 11 of the support 10 a is located outside the outer edge of the other main surface of the first sheet 6 as viewed from the center of the housing 2. That is, a part of the support 10 a is located outside the outer edge 9 of the housing 2.
  • the vapor chamber 1 a of the present embodiment further includes a hydraulic fluid sealed in the internal space of the housing 2.
  • the outer edge 11 of the support 10a is closer to the central portion of the housing 2 than the outer edge of the other main surface of the first sheet 6.
  • the outer periphery of the vapor chamber 1a is defined by the outer edge 11 of the support 10a because it is located on the outside as viewed. Therefore, by changing the shape of the support 10a in a portion located outside the housing 2 without changing the dimensions and shapes of the housing 2 and the wick 4 and the like disposed in the internal space The shape of the chamber 1a can be changed to a shape suitable for incorporation into an electronic device.
  • the vapor chamber of the present invention it is possible to easily and inexpensively incorporate the vapor chamber into the electronic device. Moreover, since the vapor chamber of the present invention can be fixed to the electronic device by fixing the support 10 a instead of the housing 2, sufficient strength can be maintained even after fixing to the electronic device.
  • the vapor chamber 1a of this embodiment can use the support 10a having a shape corresponding to the shape of the installation location of the vapor chamber in the electronic device or the heat dissipation device, the shape of the housing 2 having the operation area is set
  • the shape can be a simple shape such as a rectangle regardless of the shape of the portion. Therefore, the housing 2a in the vapor chamber 1a of the present embodiment can be manufactured very easily.
  • the vapor chamber 1a of the present embodiment can be used for various electronic devices or heat dissipation devices having different shapes of the installation site by changing the shape of the support 10a, and thus it can be said that it has high versatility. .
  • the casing of the vapor chamber of the present invention comprises an operating area corresponding to the area where the internal space in which the hydraulic fluid is enclosed is present, and a semi-operating area formed around the operating area.
  • the housing 2 having an internal space is formed by bonding the outer edges 9 of two opposing sheets.
  • the outer edge 9 of the housing 2, the first sheet 6 and the second sheet 7 corresponds to the inner edge from the outer edge of the housing 2, the first sheet 6 and the second sheet 7, respectively.
  • the region of a predetermined distance is Typically, the outer edge 9 is a joint between the first sheet 6 and the second sheet 7.
  • the semi-working area comprises an outer edge joined by two sheets It corresponds to the part 9.
  • the working region has a very high heat transport capability because it is a region that performs its original function as a vapor chamber. Therefore, it is preferable to set the working area as wide as possible.
  • the semi-operation area is not an area that exhibits the original function as a vapor chamber, it is made of metal, so it has high thermal conductivity and has a certain degree of heat transport capacity.
  • the semi-operation area is a metal sheet, it is excellent in durability, flexibility, and processability.
  • the first sheet 6 is the main inner surface of the upper side of the drawing of the internal space of the housing 2 and the second sheet 7 is the lower side of the drawing of the internal space of the housing 2 It forms the main inner surface.
  • the main inner surface refers to the surface having the largest area among the surfaces defining the internal space of the housing 2 and the surface facing the surface.
  • the first sheet 6 and the second sheet 7 are joined to each other at their respective outer edge portions 9.
  • the outer edge 9 of the first sheet 6 and the outer edge 9 of the second sheet 7 can be joined by laser welding, but the outer edge 9
  • the method of joining is not limited to this, and may be sealed by, for example, resistance welding, diffusion bonding, brazing, TIG welding, resin sealing or the like.
  • the bonding between the outer edge 9 of the first sheet 6 and the outer edge 9 of the second sheet 7 may be performed using a bonding material.
  • a bonding material any material capable of bonding housing sheets formed of the materials described later can be used, and examples thereof include Ni, Sn, Ag, Al, Pd, and the like.
  • An alloy as a component can be used.
  • the thermal conductivity of the material used for the bonding material is preferably lower than the thermal conductivity of the materials forming the first sheet 6 and the second sheet 7.
  • first sheet 6 and the first sheet 7 are joined by a bonding material made of a material having a lower thermal conductivity than the materials forming the first sheet 6 and the second sheet 7,
  • the efficiency of the welding process can be improved because a part of the heat given to the outer edge 9 when welding two sheets can be effectively retained in the bonding material of the outer edge 9 without diffusion.
  • first sheet 6 and the second sheet 7 are formed of Cu, Ni or the like having a thermal conductivity lower than that of Cu can be used as a bonding material.
  • the melting point of the material used for the bonding material be lower than the melting point of the materials forming the first sheet 6 and the second sheet 7.
  • a bonding material having a melting point lower than that of the materials forming the first and second sheets places the outer edge 9 at a lower temperature.
  • the efficiency of the welding process can be improved.
  • the first sheet 6 and the second sheet 7 are formed of Cu, a bulk Sn alloy or the like having a melting point lower than that of Cu can be used as a bonding material.
  • the material for forming the first sheet 6 and the second sheet 7 is not particularly limited, and, for example, copper, nickel, aluminum, magnesium, titanium, iron, an alloy containing them as a main component, and the like can be used. Preferably copper is used.
  • the first sheet 6 and the second sheet 7 may be formed of the same material, or may be formed of two different materials.
  • the thickness of the first sheet 6 and the second sheet 7 may be, for example, 10 ⁇ m or more and 200 ⁇ m or less, preferably in the range of 30 ⁇ m or more and 150 ⁇ m or less, and more preferably in the range of 30 ⁇ m or more and 100 ⁇ m or less Preferably, it is in the range of 40 ⁇ m to 60 ⁇ m.
  • the above-mentioned thickness may be the same or different at any place of the housing 2.
  • the thickness of the first sheet 6 may be different from the thickness of the second sheet 7, and a plurality of portions with different thicknesses may exist in the first sheet 6.
  • the second main surface of the second sheet 7 is preferably formed in a planar shape. Furthermore, it is preferable that the second sheet 7 be formed in a flat shape, and the first sheet 6 be formed in a shape having a bulge toward the upper side in the drawing so as to provide an internal space.
  • the vapor chamber 1a is arranged such that the second sheet 7 is in contact with the heat generating portion by forming the housing 2 from the first sheet 6 and the second sheet 7 as described above, the outer edge portion 9 is formed. It becomes possible to arrange so that the whole surface of the 2nd sheet 7 including it may contact with a exothermic part.
  • both the working area and the semi-working area can be disposed in contact with the heat generating portion, and the heat of the heat generating portion can be absorbed more efficiently.
  • the entire other main surface of the second sheet 7 can be brought into contact with the heat generating portion, bending and breaking of the housing 2 at the outer edge portion 9 can be effectively suppressed.
  • the wick 4 is disposed in the internal space of the casing 2 of the vapor chamber 1a of the present invention.
  • the wick 4 is disposed in the internal space of the housing 2 and serves to transport the hydraulic fluid from the condensation portion to the evaporation portion.
  • the mode of arrangement of the wick 4 is not particularly limited.
  • the pillar 3 formed on one main surface of the first sheet 6 and the one main surface of the second sheet 7 It may be disposed so as to be sandwiched between the formed convex portions 5.
  • the vapor chamber 1 a By forming the vapor chamber 1 a so that the wick 4 is sandwiched between the pillars 3 of the first sheet 6 and the convex portion 5 of the second sheet, the vapor chamber 1 a can be formed without collapsing the wick 4. The displacement of the wick 4 in the internal space of
  • the thickness of the wick 4 may be, for example, in the range of 5 ⁇ m to 200 ⁇ m, preferably 10 ⁇ m to 80 ⁇ m, and more preferably 30 ⁇ m to 50 ⁇ m.
  • the thickness of the wick 4 may be uniform or different anywhere in the wick 4. Further, the wick 4 does not necessarily have to be installed over the entire main inner surface of the casing 2 of the vapor chamber, and may be partially installed.
  • the material of the wick 4 is not particularly limited.
  • a porous body, a mesh, a sintered body, a non-woven fabric, a wire or the like can be used, and preferably a mesh or non-woven fabric is used.
  • the pillar 3 is formed on one main surface of the first sheet 6 so as to support the housing 2 from the inside.
  • the column 3 can be formed in a columnar shape having two bottom surfaces.
  • shape of pillar 3 arbitrary shapes, such as cylindrical shape, prismatic shape, and frustum shape, can be used, for example.
  • the thickness of the column 3 is not particularly limited as long as it gives the strength capable of suppressing the deformation of the casing of the vapor chamber.
  • the circle equivalent diameter of the cross section perpendicular to the height direction of the column is 100 ⁇ m or more and 2000 ⁇ m or less It is preferably in the range of 300 ⁇ m to 1000 ⁇ m, and more preferably in the range of 500 ⁇ m to 800 ⁇ m.
  • the column 3 preferably has a height of 0.08 times to 0.9 times the thickness H1 of the portion where the internal space of the housing 2 exists, for example, 50 ⁇ m to 500 ⁇ m, preferably 100 ⁇ m to 400 ⁇ m. It may have a height in the range, more preferably in the range of 100 ⁇ m to 200 ⁇ m.
  • the material for forming the columns 3 is not particularly limited.
  • metal members such as Cu, Ni, Al, Mg, Ti, Fe, etc., alloy metal members containing them as main components, and the like can be used.
  • Cu alloy is used.
  • the material forming the columns is the same material as either or both of the first sheet 6 and the second sheet 7.
  • the number of columns 3 disposed in the internal space of the housing 2, for example, 1mm may be 0.5 present less than 0.125 present per 2, preferably at least 0.15 present per 1mm 2 0.35 It is in the range below this book.
  • the housing can be supported more effectively, and the crushing resistance of the housing can be improved.
  • the pillars 3 may be arranged at regular intervals as shown in FIG. 2, for example, in lattice points so that the distance between the columns is constant, or may be arranged at non-uniform intervals. By evenly arranging the pillars 3, uniform strength can be ensured throughout the vapor chamber.
  • the column 3 may be integrally formed with the housing 2, or may be manufactured separately from the housing 2 and then fixed at a predetermined position of the housing 2.
  • the convex portion 5 may be hollow or solid. Further, the convex portion 5 may be formed over the entire second sheet 7 or may be partially formed on the second sheet 7. For the convex portion 5, a columnar shape having two bottom surfaces can be used. As a shape of convex part 5, arbitrary shapes, such as cylindrical shape, prismatic shape, and frustum shape, can be used, for example.
  • the equivalent circle diameter of the upper surface of the convex portion 5 may be 1 ⁇ m to 500 ⁇ m, preferably in the range of 5 ⁇ m to 300 ⁇ m, and more preferably in the range of 15 ⁇ m to 150 ⁇ m.
  • the wick can be supported more reliably by the convex portion 5.
  • the height of the convex portion 5 may be 1 ⁇ m to 100 ⁇ m, preferably in the range of 5 ⁇ m to 50 ⁇ m, and preferably in the range of 15 ⁇ m to 30 ⁇ m. With such a height of the convex portion 5, the capillary force is increased, so that the auxiliary effect of the function of the wick for refluxing the working fluid can be enhanced.
  • the distance between adjacent ones of the convex portions 5 formed on the second sheet 7 may be 1 ⁇ m to 500 ⁇ m, preferably in the range of 5 ⁇ m to 300 ⁇ m, and preferably in the range of 15 ⁇ m to 150 ⁇ m. It is in.
  • the capillary force is increased, so that the auxiliary effect of the function of the wick for refluxing the working fluid can be enhanced.
  • that the convex portions 5 are adjacent to each other means that they are adjacent to each other without the other convex portions 5 interposed therebetween.
  • a working fluid is further enclosed in the casing 2 of the vapor chamber of the present invention.
  • the hydraulic fluid is vaporized by the heat from the heating element to become a vapor.
  • the working fluid which has become vapor moves in the housing 2 and releases heat to return to liquid.
  • the hydraulic fluid returned to the liquid is again carried to the heat source by capillary action by the wick 4. And it is vaporized again by the heat from a heat source, and turns into steam.
  • the type of the hydraulic fluid is not particularly limited, and, for example, water, alcohols, chlorofluorocarbons and the like can be used, and preferably water is used.
  • the thickness H1 of the portion of the vapor chamber 1a where the internal space of the housing 2 exists may be, for example, 100 ⁇ m to 600 ⁇ m, preferably 200 ⁇ m to 500 ⁇ m. In the range.
  • the distance between the top of the support 10a and the other main surface of the second sheet 7 of the housing 2 at the outer edge portion 9 shown by H2 in FIG. 2 may be, for example, 100 ⁇ m to 600 ⁇ m. Preferably, it is in the range of 200 ⁇ m to 500 ⁇ m.
  • the distance H2 between the top of the support 10a and the other main surface of the second sheet 7 of the housing 2 is greater than the thickness H1 at the portion where the internal space of the housing 2 exists. It is preferable to be large.
  • the height position of the other main surface of the first sheet of the housing 2 corresponds to the uppermost portion of the support 10 a when viewed in cross section from the direction orthogonal to the opposing direction of the first sheet 6 and the second sheet 7. It is preferable to be lower than the height position of.
  • the device for example, a display mounted on the first sheet 6 side of the vapor chamber 1a contacts the support 10a.
  • the above effect is obtained by making H2 larger than H1, but the present invention is not limited to this aspect.
  • H2 is equal to or less than H1
  • the height of the other main surface of the first sheet of housing 2 can be viewed in cross section from the direction orthogonal to the opposing direction of first sheet 6 and second sheet 7 If the height position is lower than the height position of the top of the support 10a, the above-mentioned gap can be secured, and the above-mentioned effect can be obtained.
  • the width of the vapor chamber 1a indicated by W1 in FIGS. 1 and 2 may be, for example, 5 mm or more and 500 mm or less, preferably in the range of 20 mm or more and 300 mm or less.
  • the length of the vapor chamber 1a indicated by L in FIG. 1 may be, for example, 5 mm or more and 500 mm or less, and preferably in the range of 20 mm or more and 300 mm or less.
  • the thicknesses H1 and H2, the width W1 and the depth L described above may be uniform or may be different anywhere in the vapor chamber 1a.
  • the support 10a is formed in a frame shape and provided over the entire periphery of the outer edge portion of the first sheet.
  • the inner edge of the support 10 a is referred to as the inner edge 12
  • the outer edge of the support 10 a is referred to as the outer edge 11.
  • the material forming the support 10 a is not particularly limited, and, for example, copper, nickel, aluminum, magnesium, titanium, iron, an alloy containing any of these as a main component, and the like can be used.
  • Examples of the alloy forming the support 10 a include SUS444 (26.0 W / (m ⁇ k)) which is an alloy containing titanium, SUS304 (16.7 W / (m ⁇ k)) which is an alloy containing nickel, and And SUS316 (16.7 W / (m ⁇ k)) which is an alloy containing nickel can be used.
  • the outer edge of the support 10a has a shape having irregularities and notches in plan view. This shape may be a shape according to the shape of the place where the vapor chamber 1a is installed. By making the shape of the support 10a correspond to the shape of the place where the vapor chamber 1a is installed, the support 10a can be firmly fixed by the electronic device. Also, the outer edge of the support 10 a may be formed to have one or more through holes 13. In particular, the convex portion of the outer edge of the support 10 a may be formed to have the through hole 13. Since the support 10a has the through hole 13, the support 10a can be firmly fixed to the electronic device by using a fixing tool such as a bolt.
  • the rigidity of the support 10 a in the area fixed to the first sheet 6 is preferably larger than the rigidity of the housing 2 in the area to which the support 10 a is fixed. In one aspect, the rigidity of the support 10a in the area fixed to the first sheet 6 is greater than the rigidity of the first sheet 6 and the second sheet 7 in the area to which the support 10a is fixed preferable. The rigidity of the support 10a in the area fixed to the first sheet 6 is larger than the rigidity of the housing 2 in the area to which the support 10a is fixed, thereby effectively suppressing the deformation that may occur in the housing 2 can do.
  • stiffness refers to the difficulty of deformation due to a force such as bending
  • stiffness means that the Young's modulus is high.
  • the thickness of the support 10a may be, for example, 100 ⁇ m to 600 ⁇ m, and preferably in the range of 200 ⁇ m to 500 ⁇ m.
  • the thickness of the support 10 a is preferably larger than the thickness H 1 of the portion where the internal space of the housing 2 exists.
  • the thickness of the support 10 a is preferably greater than the thickness H 1, the uppermost surface of the support 10 a is located above the other main surface of the first sheet 6.
  • a device for example, a display mounted on the second sheet 6 side of the vapor chamber 1a contacts the support 10a. Even if it does, the contact with the 1st sheet 6 and a device can be prevented. Thereby, the efficiency of heat radiation from the first sheet 6 side can be maintained, and the influence of heat from the vapor chamber on the first sheet 6 side can be effectively suppressed.
  • the width of the support 10a shown by W2 and W3 in FIG. 2 is not particularly limited, but may be, for example, 2 mm or more and 10 mm or less, preferably 3 mm or more and 7 mm or less, more preferably 5 mm or more and 7 mm or less In the range of The width of the support 10a may be uniform or different in any part of the support 10a. That is, the width W2 and the width W3 may be the same or different.
  • the outer shape of the vapor chamber can be changed without affecting the housing by changing the shape of the support.
  • narrow portions and wide portions can be optionally formed, and fixing holes, protrusions, and the like can be formed.
  • the width W4 of the portion of the support 10a overlapping the outer edge portion 9 of the housing 2 is 1 mm or more and 10 mm or less, preferably in the range of 2 mm or more and 5 mm or less, more preferably in the range of 3 mm or more and 5 mm or less is there.
  • the width W4 of the portion of the support 10a overlapping the outer edge portion 9 of the housing 2 is 1 mm or more, the support 10a and the housing 2 can be joined with sufficient strength.
  • the width W4 of the portion of the support 10a overlapping the outer edge 9 of the housing 2 is 10 mm or less, deformation or the like of the outer edge 9 in processing the outer peripheral edge 11 of the support 10a is effective. Can be reduced to
  • the support 10a is fixed to the first sheet 6 via the bonding layer 8.
  • the fixing is performed at the outer edge 9 of the housing 2.
  • the bonding layer 8 any material capable of bonding the first sheet 6 formed of the above-described materials and the support 10 a can be used, for example, Ni, Sn, Ag, Al, Pd, and alloys containing these as main components can be used.
  • the bonding layer 8 may be formed using an adhesive that can bond the first sheet 6 formed of the above-described material and the support 10 a.
  • the thermal conductivity of the material used for the bonding layer 8 is lower than the thermal conductivity of the material forming the first sheet 6 and the thermal conductivity of the material forming the support 10 a.
  • the material used for the bonding layer 8 has such a thermal conductivity, part of the heat given to the outer edge portion 9 when bonding the first sheet 6 and the support 10 a is diffused. Since it can be effectively fixed to the bonding layer 8 of the outer edge portion 9, the efficiency of the welding process can be improved.
  • the first sheet 6 is formed of Cu and the support 10 a is formed of Fe
  • Ni or the like having a thermal conductivity lower than that of Cu and Fe can be used as a material for forming the bonding layer 8.
  • the material used for the bonding layer 8 is a material with high thermal conductivity.
  • the material used for the bonding layer 8 has a thermal conductivity of, for example, 50 W / (m ⁇ k) or more, preferably 100 W / (m ⁇ k) or more.
  • the melting point of the material used for the bonding layer 8 be lower than the melting point of the material forming the first sheet 6 and the melting point of the material forming the support 10a.
  • the support 10 a can also be fixed to the outer edge portion 9 by welding or the like without using the bonding layer 8.
  • the outer edge 9 of the first sheet 6 and the support 10a can be sealed by laser welding.
  • the method of sealing the outer edge portion 9 of the first sheet 6 and the support 10 a is not limited to this, and sealing can be performed by, for example, resistance welding, diffusion bonding, brazing, TIG welding, resin sealing, etc. .
  • FIGS. 3-5 illustrate another embodiment of the present invention.
  • the parts assigned the same reference numerals as the parts of the first embodiment have the same features as the parts of the first embodiment.
  • FIG. 3 is a perspective view of the vapor chamber 1b of the second embodiment of the present invention as viewed from above.
  • the support 10b is formed in a substantially U-shape.
  • plan view of the main surface of the first sheet 6 a part of the outer edge of the support 10b is located outside the outer edge of the other main surface of the first sheet 6 as viewed from the center of the housing. ing.
  • the dimensions of the support 10 b are determined such that the inner edge 12 of the support 10 b is located on the outer edge 9 of the housing 2. As shown in FIG. 3, the other portion of the inner edge 12 of the support 10 b of the vapor chamber 1 b may not be located on the outer edge 9 of the housing 2.
  • both ends of the inner edge 12 of the support 10 b of the vapor chamber 1 b are not located on the outer edge 9 of the housing 2.
  • FIG. 4 is a perspective view of the vapor chamber 1c of the third embodiment of the present invention as viewed from above.
  • the vapor chamber 1c of FIG. 4 has two supports 10c, and both of the two supports 10c are formed in a rectangular parallelepiped shape (flat plate shape).
  • the two supports 10 c are provided on two opposing sides of the housing 2 so that a part of the inner edge 12 of the support 10 c is located on the outer edge 9 of the housing 2.
  • both ends of the inner edge 12 of the support 10 c of the vapor chamber 1 c are not located on the outer edge 9 of the housing 2. As shown in FIG.
  • the other portion of the inner edge 12 of the support 10 c of the vapor chamber 1 c may not be located on the outer edge 9 of the housing 2.
  • the vapor chamber 1 c is installed by providing the support 10 c on the two opposing sides of the casing 2, the outer edges of the two sides of the casing 2 on which the support 10 c is not provided. The space adjacent to 9 can be used more effectively.
  • FIG. 5 is a perspective view of the vapor chamber 1d of the fourth embodiment of the present invention as viewed from above.
  • the support 10d is formed in a frame shape like the vapor chamber 1d.
  • the dimensions of the support 10 d are determined such that a portion of the inner edge 12 of the support 10 a is located on the outer edge 9 of the housing 2.
  • the other part of the inner edge 12 of the support 10 d of the vapor chamber 1 d is not located on the outer edge 9 of the housing 2 and located outside the outer edge of the housing 2 There is.
  • the housing 2 In the area surrounded by the support 10d, there is a space in which the housing 2 is not provided.
  • any device can be arranged in the space, or the wiring can be effectively used. become able to.
  • the vapor chamber of the present invention may be mounted to the heat dissipation device in close proximity to the heat source. Accordingly, the present invention also provides a heat dissipation device comprising the vapor chamber of the present invention.
  • the heat dissipation device of the present invention can effectively suppress the temperature rise of the electronic component that generates heat and the periphery of the electronic component.
  • the heat dissipating device comprising the vapor chamber of the present invention or the vapor chamber of the present invention can be incorporated in various electronic devices and used for heat management of the internal space.
  • the vapor chamber of the present invention operates independently without the need for external power, and can dissipate heat at a high speed in two dimensions using the evaporation and condensation latent heat of the hydraulic fluid. Therefore, the vapor chamber or the heat dissipation device of the present invention can be installed even in a limited space inside the electronic device, and effective heat management can be realized.
  • an electronic device of the present invention a smart phone, a tablet, a notebook PC etc. are mentioned, for example.
  • it can be incorporated in the information communication terminal 100 as shown in FIG.
  • FIG. 7 is a cross-sectional view of the information communication terminal 100 shown in FIG.
  • the vapor chamber 1a of the present invention is a second sheet 7 on the top of the semiconductor element 160 and the battery 140 for dissipation of heat generated from the semiconductor element 160 and the battery 140 provided on the substrate 150.
  • the support 10 a of the vapor chamber 1 a according to the present invention is fixed to the housing 120 of the information communication terminal 100 by a fixing tool 130 such as a bolt.
  • the support 10a may have a through hole 13 through which the bolt passes.
  • the through hole 13 can be provided not in the housing portion but in the support. Therefore, the vapor chamber 1a of the present invention can be mounted on an electronic device without impairing the function and strength of the housing 2.
  • the thickness of the portion to which the support 10a is fixed is larger than the thickness of the portion to which the support 10a is not fixed. Therefore, a space can be secured between the display 110 and the housing 2 of the information communication terminal 100. The presence of such a gap suppresses the contact between the display 110 and the housing 2. Further, by the presence of a gap between the housing 2 and the display 110, the efficiency of heat radiation from the first sheet 6 side can be maintained, and for the device mounted on the first sheet 6 side The influence of heat from the vapor chamber can be effectively suppressed.
  • the vapor chamber, heat dissipation device and electronic device of the present invention can be used in a wide range of applications in the field of portable information terminals and the like.
  • the temperature of a heat source such as a CPU can be lowered to extend the use time of an electronic device
  • the electronic device can be used for a smartphone, a tablet, a notebook PC, or the like.

Abstract

The present invention provides a vapor chamber that has: a housing wherein a first sheet and a second sheet are provided, and one main surface of the first sheet and one main surface of the second sheet are bonded to each other by facing each other, said housing having an internal space between the one main surface of the first sheet and the one main surface of the second sheet; an operating liquid sealed in the internal space of the housing; a wick that is disposed in the internal space of the housing; and a supporting body fixed to the first sheet at the outer end portion of the other main surface of the first sheet. In a plan view of the main surface of the first sheet, a part of the outer end of the supporting body is positioned outside of the outer end of the other main surface of the first sheet when viewed from a center portion of the housing.

Description

ベーパーチャンバーVapor chamber
　本発明は、ベーパーチャンバーに関する。 The present invention relates to a vapor chamber.
　近年、素子の高集積化、高性能化により発熱量が増加している。また、製品の小型化が進むことで、発熱密度が増加するため、放熱対策が重要となってきた。この状況はスマートフォンやタブレットなどのモバイル端末の分野において特に顕著である。近年、熱対策部材としては、グラファイトシートなどが用いられることが多いが、その熱輸送量は十分ではないため、様々な熱対策部材の使用が検討されている。なかでも、非常に効果的に熱を拡散させることが可能であるとして、面状のヒートパイプであるベーパーチャンバーの使用の検討が進んでいる。 In recent years, the calorific value has been increased due to high integration and high performance of elements. In addition, as the miniaturization of products advances, the heat generation density increases, so the heat dissipation measures have become important. This situation is particularly noticeable in the field of mobile terminals such as smartphones and tablets. In recent years, although a graphite sheet etc. are often used as a heat countermeasure member, since the heat transport amount is not enough, use of various heat countermeasure members is examined. In particular, the use of a vapor chamber, which is a planar heat pipe, has been studied as it is possible to diffuse heat very effectively.
　ベーパーチャンバーとは、平板状の密閉容器内に揮発しやすい適量の作動流体を封入したものである。作動流体は熱源からの熱で気化し、内部空間内を移動した後、外部に熱を放出して液体に戻る。液体に戻った作動流体はウィックと呼ばれる毛細管構造により再び熱源付近へ運ばれて、再び気化する。これを繰り返すことにより、ベーパーチャンバーは外部動力を有することなく自立的に作動し、作動流体の蒸発潜熱および凝縮潜熱を利用して、二次元的に高速で熱を拡散することができる。 The vapor chamber is one in which a suitable amount of easily volatile working fluid is enclosed in a flat-plate-like closed container. The working fluid is vaporized by the heat from the heat source, moves in the internal space, and then releases the heat to the outside to return to the liquid. The working fluid returned to the liquid is again carried to the vicinity of the heat source by a capillary structure called a wick and vaporized again. By repeating this, the vapor chamber can operate independently without external power, and heat can be diffused at high speed in two dimensions using the latent heat of evaporation and latent heat of condensation of the working fluid.
　特許文献１では、第１金属シートと第２金属シートとから構成されるシート状コンテナを密閉容器として有するベーパーチャンバーが提案されている。このシート状コンテナの厚みは０．５ｍｍ以下であることが好ましいとされている。このように、ベーパーチャンバーの厚みを小さくすることにより、小型化、特に薄型化が要求される電子機器、例えばスマートフォンやタブレットなどのモバイル端末におけるベーパーチャンバーの好適な利用を実現している。 In patent document 1, the vapor chamber which has a sheet-like container comprised from a 1st metal sheet and a 2nd metal sheet as an airtight container is proposed. The thickness of the sheet-like container is preferably 0.5 mm or less. As described above, by reducing the thickness of the vapor chamber, it is possible to preferably use the vapor chamber in an electronic device that is required to be reduced in size, particularly, to be thin, for example, a mobile terminal such as a smartphone or a tablet.
国際公開第２０１６／１５１９１６号International Publication No. 2016/151916
　特許文献１のベーパーチャンバーを直接電子部品に搭載する場合には、ベーパーチャンバーを設置場所に応じた形状に加工する必要がある。しかしながら、特許文献１のベーパーチャンバーは、２枚の金属シートを貼り合わせた構造を有し、その厚みは０．５ｍｍ以下と非常に薄いことから、複雑な形状への加工が難しいという問題がある。また、特許文献１には、図７～１７に示されるように、ベーパーチャンバーを金属板の凹部にはめ込んで放熱板として使用することが記載されている。しかしながら、ベーパーチャンバーを金属板にはめ込むには、ベーパーチャンバーの筐体を予め金属板の凹部に合わせた形状に形成する必要がある。この場合も、上記と同様にベーパーチャンバーの形状の加工の困難性に関する問題が生じる。また、金属板の凹部をベーパーチャンバーの形状に合わせて形成することも考えられるが、金属板に凹部を形成する加工も容易ではなく、同様の問題が生じる。さらに、特許文献１の放熱板は、厚み方向にベーパーチャンバーと金属板の両方が存在するので、厚みが大きくなり、小型化の観点から不利である。 When the vapor chamber of Patent Document 1 is directly mounted on an electronic component, it is necessary to process the vapor chamber into a shape according to the installation location. However, the vapor chamber of Patent Document 1 has a structure in which two metal sheets are bonded to each other, and the thickness thereof is as thin as 0.5 mm or less, so there is a problem that processing into a complicated shape is difficult . In addition, as shown in FIGS. 7 to 17, Patent Document 1 describes that a vapor chamber is inserted into a recess of a metal plate and used as a heat dissipation plate. However, in order to fit the vapor chamber into the metal plate, it is necessary to form the casing of the vapor chamber in a shape that matches the recess of the metal plate in advance. Also in this case, the problem regarding the difficulty of processing of the shape of a vapor chamber arises similarly to the above. In addition, although it is conceivable to form the recess of the metal plate in accordance with the shape of the vapor chamber, the process of forming the recess in the metal plate is not easy, and the same problem occurs. Furthermore, since the heat sink of Patent Document 1 has both the vapor chamber and the metal plate in the thickness direction, the thickness becomes large, which is disadvantageous from the viewpoint of downsizing.
　本発明は上記課題に鑑みてなされたものであり、任意の形状への加工が容易で、電子機器への組み込みを容易に行うことが可能なベーパーチャンバーを提供することを目的とする。 The present invention has been made in view of the above problems, and it is an object of the present invention to provide a vapor chamber which can be easily processed into an arbitrary shape and can be easily incorporated into an electronic device.
　上記課題を解決するため、本発明のある局面に係るベーパーチャンバーは、第１のシートと、第２のシートと、を備え、前記第１のシートの一方主面と前記第２のシートの一方主面とが対向して接合され、前記第１のシートの一方主面と前記第２のシートの一方主面との間に内部空間を有する筐体と、前記筐体の内部空間に封入された作動液と、前記筐体の内部空間に配置されたウィックと、前記第１のシートの他方主面の外縁部において、前記第１のシートに固定された支持体とを有し、前記第１のシートの主面を平面視して、前記支持体の外縁の一部は前記第１のシートの他方主面の外縁よりも前記筐体の中央部からみて外側に位置している。 In order to solve the above problems, a vapor chamber according to an aspect of the present invention includes a first sheet and a second sheet, and one of the first main surface of the first sheet and one of the second sheet A casing having an internal space between the one major surface of the first sheet and the one major surface of the second sheet, and sealed in the interior space of the casing; A hydraulic fluid, a wick disposed in the internal space of the housing, and a support fixed to the first sheet at the outer edge of the other main surface of the first sheet, In plan view of the main surface of the first sheet, a part of the outer edge of the support is located outside the outer edge of the other main surface of the first sheet as viewed from the center of the housing.
　また、一実施形態のベーパーチャンバーにおいて、前記第１のシートと前記第２のシートの対向方向に直行する方向から断面視して、前記第１のシートの他方主面の高さ位置は、前記支持体の最上部の高さ位置より低い。 In the vapor chamber according to one embodiment, the height position of the other main surface of the first sheet is the same as the height position of the other main surface of the first sheet, viewed in cross section from the direction orthogonal to the opposing direction of the first sheet and the second sheet Lower than the height position of the top of the support.
　また、一実施形態のベーパーチャンバーにおいて、前記第１のシートに固定された領域における支持体が、前記支持体が固定される領域における前記筐体の剛性よりも高い剛性を有する。 In one embodiment of the vapor chamber, the support in the area fixed to the first sheet has rigidity higher than the rigidity of the housing in the area to which the support is fixed.
　また、一実施形態のベーパーチャンバーにおいて、前記筐体が、前記第１のシートの外縁部と前記第２のシートの外縁部が接合されて成る。 Further, in the vapor chamber of one embodiment, the housing is formed by joining an outer edge portion of the first sheet and an outer edge portion of the second sheet.
　また、一実施形態のベーパーチャンバーにおいて、前記支持体が、前記第１のシートの外縁部の全周にわたって設けられる。 In one embodiment of the vapor chamber, the support is provided all around the outer edge of the first sheet.
　また、一実施形態のベーパーチャンバーは、前記第１のシートまたは前記第２のシートの他方主面に柱が形成され、他方のシートの他方主面に凸部が形成されており、前記ウィックが、前記柱と前記凸部によって挟持されている。 In the vapor chamber according to one embodiment, a pillar is formed on the other main surface of the first sheet or the second sheet, and a protrusion is formed on the other main surface of the other sheet, and the wick is formed. , And are held by the column and the convex portion.
　また、一実施形態のベーパーチャンバーは、前記支持体が接合層を介して前記第１のシートに固定される。 In one embodiment, the support is fixed to the first sheet via a bonding layer.
　さらに、本発明の他の局面によれば、本発明のベーパーチャンバーを有して成る放熱デバイスが提供される。 Furthermore, according to another aspect of the present invention, a heat dissipation device comprising the vapor chamber of the present invention is provided.
　さらに、本発明の他の局面によれば、本発明のベーパーチャンバーまたは本発明の放熱デバイスを有して成る電子機器が提供される。 Furthermore, according to another aspect of the present invention, there is provided an electronic device comprising the vapor chamber of the present invention or the heat dissipation device of the present invention.
　本発明によれば、任意の形状への加工が容易で、電子機器への組み込みを容易に行うことが可能なベーパーチャンバーが提供される。 According to the present invention, there is provided a vapor chamber which can be easily processed into any shape and can be easily incorporated into an electronic device.
本発明の第一実施形態のベーパーチャンバー１ａの上方から見た斜視図である。It is the perspective view seen from the upper direction of the vapor chamber 1a of 1st embodiment of this invention. 図１のベーパーチャンバー１ａのＡ－Ａ断面図である。It is AA sectional drawing of the vapor chamber 1a of FIG. 本発明の第二実施形態のベーパーチャンバー１ｂの上方から見た斜視図である。It is the perspective view seen from the upper direction of the vapor chamber 1b of 2nd embodiment of this invention. 本発明の第三実施形態のベーパーチャンバー１ｃの上方から見た斜視図である。It is the perspective view seen from the upper direction of the vapor chamber 1c of 3rd embodiment of this invention. 本発明の第四実施形態のベーパーチャンバー１ｄの上方から見た斜視図である。It is the perspective view seen from the upper direction of the vapor chamber 1d of 4th embodiment of this invention. 本発明の第一実施形態のベーパーチャンバー１ａが内蔵された電子機器の上方から見た斜視図である。It is the perspective view seen from the upper direction of the electronic device in which the vapor chamber 1a of 1st embodiment of this invention was incorporated. 図６の電子機器のＸ－Ｘ断面図である。FIG. 7 is a cross-sectional view of the electronic device of FIG. 6 taken along the line XX.
　以下、本発明について図面を参照してより詳細に説明する。 Hereinafter, the present invention will be described in more detail with reference to the drawings.
　図１は、本発明の第一実施形態のベーパーチャンバー１ａの上方から見た斜視図である。図２は、図１のベーパーチャンバー１ａのＡ－Ａ断面図である。 FIG. 1 is a perspective view of the vapor chamber 1a of the first embodiment of the present invention as viewed from above. FIG. 2 is a cross-sectional view of the vapor chamber 1a of FIG.
　本実施形態のベーパーチャンバー１ａは、図１および図２に示されるように、第１のシート６と、第２のシート７とを備え、第１のシート６の一方主面と第２のシート７の一方主面とが対向して接合され、第１のシート６の一方主面と第２のシート７の一方主面との間に内部空間を有する筐体２と、筐体２の内部空間に配置されたウィック４と、第１のシート６の他方主面の外縁部９において、第１のシート６に固定された支持体１０ａとを有し、第１のシート６の主面を平面視して、支持体１０ａの外縁１１は第１のシート６の他方主面の外縁よりも筐体２の中央部からみて外側に位置している。即ち、支持体１０ａの一部が筐体２の外縁部９よりも外側に位置している。さらに筐体２の内部空間が存在する領域において、筐体の両主面は露出している。即ち、筐体２の内部空間が存在する領域において、筐体２の両主面上に支持体１０ａは存在しない。また、図示されていないが、本実施形態のベーパーチャンバー１ａはさらに、筐体２の内部空間に封入された作動液を有する。 The vapor chamber 1a according to the present embodiment includes a first sheet 6 and a second sheet 7, as shown in FIGS. 1 and 2, and one main surface of the first sheet 6 and the second sheet The housing 2 has an internal space between the one main surface of the first sheet 6 and the one main surface of the second sheet 7, and the inside of the housing 2. The main surface of the first sheet 6 has the wick 4 disposed in the space and the support 10 a fixed to the first sheet 6 at the outer edge 9 of the other main surface of the first sheet 6. In a plan view, the outer edge 11 of the support 10 a is located outside the outer edge of the other main surface of the first sheet 6 as viewed from the center of the housing 2. That is, a part of the support 10 a is located outside the outer edge 9 of the housing 2. Furthermore, in the region where the internal space of the housing 2 exists, both main surfaces of the housing are exposed. That is, in the region where the internal space of the housing 2 exists, the support 10 a does not exist on both main surfaces of the housing 2. Further, although not shown, the vapor chamber 1 a of the present embodiment further includes a hydraulic fluid sealed in the internal space of the housing 2.
　本実施形態のベーパーチャンバー１ａにおいて、第１のシート６の主面を平面視して、支持体１０ａの外縁１１は第１のシート６の他方主面の外縁よりも筐体２の中央部からみて外側に位置しているため、ベーパーチャンバー１ａの外周が支持体１０ａの外縁１１により規定される。そのため、支持体１０ａの形状を、筐体２よりも外側に位置する部分において変更することにより、筐体２および内部空間内に配置されるウィック４等の寸法および形状を変更することなく、ベーパーチャンバー１ａの形状を電子機器への組み込みに適した形状に変更することができる。これにより、本発明のベーパーチャンバーによれば、ベーパーチャンバーの電子機器への組み込みを容易かつ低コストで行うことが可能となる。また、本発明のベーパーチャンバーは、筐体２ではなく、支持体１０ａを固定することにより電子機器に固定することができるため、電子機器へ固定した後も十分な強度を維持することができる。 In the vapor chamber 1a of the present embodiment, when the main surface of the first sheet 6 is viewed in plan, the outer edge 11 of the support 10a is closer to the central portion of the housing 2 than the outer edge of the other main surface of the first sheet 6. The outer periphery of the vapor chamber 1a is defined by the outer edge 11 of the support 10a because it is located on the outside as viewed. Therefore, by changing the shape of the support 10a in a portion located outside the housing 2 without changing the dimensions and shapes of the housing 2 and the wick 4 and the like disposed in the internal space The shape of the chamber 1a can be changed to a shape suitable for incorporation into an electronic device. Thus, according to the vapor chamber of the present invention, it is possible to easily and inexpensively incorporate the vapor chamber into the electronic device. Moreover, since the vapor chamber of the present invention can be fixed to the electronic device by fixing the support 10 a instead of the housing 2, sufficient strength can be maintained even after fixing to the electronic device.
　本実施形態のベーパーチャンバー１ａは、電子機器または放熱デバイスにおけるベーパーチャンバーの設置箇所の形状に応じた形状を有する支持体１０ａを用いることができるため、作動領域を有する筐体２の形状を、設置箇所の形状によらず、長方形など単純な形状とすることができる。そのため、本実施形態のベーパーチャンバー１ａにおける筐体２ａは非常に容易に製造することができる。本実施形態のベーパーチャンバー１ａは、支持体１０ａの形状を変えることで、設置箇所の形状が異なる様々な電子機器または放熱デバイスにも用いることができるため、高い汎用性を有しているといえる。 Since the vapor chamber 1a of this embodiment can use the support 10a having a shape corresponding to the shape of the installation location of the vapor chamber in the electronic device or the heat dissipation device, the shape of the housing 2 having the operation area is set The shape can be a simple shape such as a rectangle regardless of the shape of the portion. Therefore, the housing 2a in the vapor chamber 1a of the present embodiment can be manufactured very easily. The vapor chamber 1a of the present embodiment can be used for various electronic devices or heat dissipation devices having different shapes of the installation site by changing the shape of the support 10a, and thus it can be said that it has high versatility. .
　以下において、本発明のベーパーチャンバーの各構成について詳細に説明する。 Hereinafter, each configuration of the vapor chamber of the present invention will be described in detail.
　本発明のベーパーチャンバーの筐体は、作動液が封入された内部空間が存在する領域に対応する作動領域と、該作動領域の周囲に形成された準作動領域とを有して成る。本発明のベーパーチャンバーにおいて、内部空間を有する筐体２は、対向する２つのシートの外縁部９を接合することにより形成される。本明細書において、筐体２、第１のシート６、および第２のシート７における外縁部９とは、それぞれ、筐体２、第１のシート６、および第２のシート７の外縁から内側に所定距離の領域をいう。典型的には、当該外縁部９は、第１のシート６と第２のシート７との接合部である。 The casing of the vapor chamber of the present invention comprises an operating area corresponding to the area where the internal space in which the hydraulic fluid is enclosed is present, and a semi-operating area formed around the operating area. In the vapor chamber of the present invention, the housing 2 having an internal space is formed by bonding the outer edges 9 of two opposing sheets. In the present specification, the outer edge 9 of the housing 2, the first sheet 6 and the second sheet 7 corresponds to the inner edge from the outer edge of the housing 2, the first sheet 6 and the second sheet 7, respectively. The region of a predetermined distance is Typically, the outer edge 9 is a joint between the first sheet 6 and the second sheet 7.
　本発明のベーパーチャンバーの筐体２が、図１および図２に示されるように外縁部９が接合された対向する２つのシートから成るとき、準作動領域は、２つのシートが接合された外縁部９に相当する。本発明のベーパーチャンバーにおいて、作動領域は、ベーパーチャンバーとしての本来の機能を発揮する領域であるので、非常に高い熱輸送能を有する。従って、作動領域は、可能な限り広範囲に設置することが好ましい。一方、準作動領域は、ベーパーチャンバーとして本来の機能を発揮する領域ではないが、金属により形成されているので熱伝導性が高く、ある程度の熱輸送能を有する。また、準作動領域は、金属製シートであるので、耐久性、可撓性、加工性に優れる。 When the casing 2 of the vapor chamber according to the invention consists of two opposing sheets joined by an outer edge 9 as shown in FIGS. 1 and 2, the semi-working area comprises an outer edge joined by two sheets It corresponds to the part 9. In the vapor chamber of the present invention, the working region has a very high heat transport capability because it is a region that performs its original function as a vapor chamber. Therefore, it is preferable to set the working area as wide as possible. On the other hand, although the semi-operation area is not an area that exhibits the original function as a vapor chamber, it is made of metal, so it has high thermal conductivity and has a certain degree of heat transport capacity. Moreover, since the semi-operation area is a metal sheet, it is excellent in durability, flexibility, and processability.
　図１および図２に示されるベーパーチャンバー１ａにおいて、第１のシート６は筐体２の内部空間の図面上側の主内面を、第２のシート７は筐体２の内部空間の図面下側の主内面を形成している。本明細書において主内面とは、筐体２の内部空間を規定する面のうち、最も面積の大きい面と、その面に対向する面とをいう。筐体２において、第１のシート６と第２のシート７とは、それぞれの外縁部９で互いに接合されている。 In the vapor chamber 1a shown in FIGS. 1 and 2, the first sheet 6 is the main inner surface of the upper side of the drawing of the internal space of the housing 2 and the second sheet 7 is the lower side of the drawing of the internal space of the housing 2 It forms the main inner surface. In the present specification, the main inner surface refers to the surface having the largest area among the surfaces defining the internal space of the housing 2 and the surface facing the surface. In the housing 2, the first sheet 6 and the second sheet 7 are joined to each other at their respective outer edge portions 9.
　図１および図２に示されるベーパーチャンバー１ａにおいて、第１のシート６の外縁部９と第２のシート７の外縁部９とは、レーザー溶接することにより接合することができるが、外縁部９を接合する方法はこれに限定されず、例えば抵抗溶接、拡散接合、ロウ接、ＴＩＧ溶接、樹脂封止等により封止することもできる。 In the vapor chamber 1a shown in FIGS. 1 and 2, the outer edge 9 of the first sheet 6 and the outer edge 9 of the second sheet 7 can be joined by laser welding, but the outer edge 9 The method of joining is not limited to this, and may be sealed by, for example, resistance welding, diffusion bonding, brazing, TIG welding, resin sealing or the like.
　第１のシート６の外縁部９と第２のシート７の外縁部９との接合は、接合材を用いて行われてもよい。接合材には、後述するような材料から形成される筐体シート同士を接合することが可能な任意の材料を使用することができ、例えばＮｉ、Ｓｎ、Ａｇ、Ａｌ、Ｐｄ、およびこれらを主成分とする合金等を使用することができる。ここで、接合材に使用される材料の熱伝導率が、第１シート６および第２のシート７を形成する材料の熱伝導率よりも低いことが好ましい。第１のシート６と第１のシート７との外縁部間が、第１シート６および第２のシート７を形成する材料よりも熱伝導率の低い材料から成る接合材によって接合される場合、２つのシートを溶接する際に外縁部９に与えられる熱の一部を、拡散させることなく外縁部９の接合材に効果的に留めることができるため、溶接工程の効率を向上させることができる。例えば、第１のシート６と第２のシート７とがＣｕから形成される場合、Ｃｕより熱伝導率の低いＮｉ等を、接合材として使用し得る。 The bonding between the outer edge 9 of the first sheet 6 and the outer edge 9 of the second sheet 7 may be performed using a bonding material. As the bonding material, any material capable of bonding housing sheets formed of the materials described later can be used, and examples thereof include Ni, Sn, Ag, Al, Pd, and the like. An alloy as a component can be used. Here, the thermal conductivity of the material used for the bonding material is preferably lower than the thermal conductivity of the materials forming the first sheet 6 and the second sheet 7. When the outer edges of the first sheet 6 and the first sheet 7 are joined by a bonding material made of a material having a lower thermal conductivity than the materials forming the first sheet 6 and the second sheet 7, The efficiency of the welding process can be improved because a part of the heat given to the outer edge 9 when welding two sheets can be effectively retained in the bonding material of the outer edge 9 without diffusion. . For example, when the first sheet 6 and the second sheet 7 are formed of Cu, Ni or the like having a thermal conductivity lower than that of Cu can be used as a bonding material.
　さらに、接合材に使用される材料の融点が、第１シート６および第２のシート７を形成する材料の融点よりも低いことが好ましい。第１のシート６と第２のシート７との外縁部間に、第１および第２のシートを形成する材料よりも融点の低い接合材が位置することにより、より低い温度で外縁部９を溶接することができるようになるため、溶接工程の効率を向上させることができる。例えば、第１のシート６と第２のシート７とがＣｕから形成される場合、Ｃｕより融点の低いバルク状のＳｎ合金等を、接合材として使用し得る。 Furthermore, it is preferable that the melting point of the material used for the bonding material be lower than the melting point of the materials forming the first sheet 6 and the second sheet 7. Between the outer edges of the first sheet 6 and the second sheet 7, a bonding material having a melting point lower than that of the materials forming the first and second sheets places the outer edge 9 at a lower temperature. As welding can be performed, the efficiency of the welding process can be improved. For example, when the first sheet 6 and the second sheet 7 are formed of Cu, a bulk Sn alloy or the like having a melting point lower than that of Cu can be used as a bonding material.
　第１のシート６および第２のシート７を形成する材料は、特に限定されず、例えば銅、ニッケル、アルミ、マグネシウム、チタン、鉄、およびそれらを主成分とする合金等を用いることができ、好ましくは銅が用いられる。第１のシート６と第２のシート７とは、同一の材料から形成されてもよく、異なる二つの材料からそれぞれ形成されてもよい。 The material for forming the first sheet 6 and the second sheet 7 is not particularly limited, and, for example, copper, nickel, aluminum, magnesium, titanium, iron, an alloy containing them as a main component, and the like can be used. Preferably copper is used. The first sheet 6 and the second sheet 7 may be formed of the same material, or may be formed of two different materials.
　第１のシート６および第２のシート７の厚さは、例えば１０μｍ以上２００μｍ以下であってよく、好ましくは３０μｍ以上１５０μｍ以下の範囲にあり、より好ましくは３０μｍ以上１００μｍ以下の範囲にあり、さらに好ましくは４０μｍ以上６０μｍ以下の範囲にある。上述した厚さは筐体２のいかなる箇所においても同一であってよく、異なっていてもよい。例えば、第１のシート６の厚さと、第２のシート７の厚さとが異なっていてもよく、第１のシート６において、厚さが異なる部分が複数存在していてもよい。第１のシートの厚さに対する第２のシートの厚さの比を適切に設定することにより、より厚い筐体シート側から筐体２に圧力が掛かった場合の、より薄い筐体シートの変形を効果的に低減することができる。 The thickness of the first sheet 6 and the second sheet 7 may be, for example, 10 μm or more and 200 μm or less, preferably in the range of 30 μm or more and 150 μm or less, and more preferably in the range of 30 μm or more and 100 μm or less Preferably, it is in the range of 40 μm to 60 μm. The above-mentioned thickness may be the same or different at any place of the housing 2. For example, the thickness of the first sheet 6 may be different from the thickness of the second sheet 7, and a plurality of portions with different thicknesses may exist in the first sheet 6. By appropriately setting the ratio of the thickness of the second sheet to the thickness of the first sheet, deformation of the thinner housing sheet when pressure is applied to the housing 2 from the thicker housing sheet side Can be effectively reduced.
　図２に示されるように、第２のシート７は、他方主面が平面状に形成されることが好ましい。さらに、第２のシート７は平面状に形成され、第１のシート６は、内部空間が設けられるように、図面上側に向かって膨らみを有する形状に形成されることが好ましい。筐体２が、このような第１のシート６および第２のシート７から構成されることにより、第２のシート７が発熱部に接するようにベーパーチャンバー１ａを配置した場合に、外縁部９も含めた第２のシート７の全面を発熱部に接するように配置することが可能になる。即ち、作動領域および準作動領域の両方を、発熱部に接するように配置することが可能になり、より効率的に発熱部の熱を吸収することができる。また、第２シート７の他方主面全体を、発熱部と接触させることができるので、外縁部９における筐体２の曲がれおよび折れを効果的に抑制することができる。 As shown in FIG. 2, the second main surface of the second sheet 7 is preferably formed in a planar shape. Furthermore, it is preferable that the second sheet 7 be formed in a flat shape, and the first sheet 6 be formed in a shape having a bulge toward the upper side in the drawing so as to provide an internal space. When the vapor chamber 1a is arranged such that the second sheet 7 is in contact with the heat generating portion by forming the housing 2 from the first sheet 6 and the second sheet 7 as described above, the outer edge portion 9 is formed. It becomes possible to arrange so that the whole surface of the 2nd sheet 7 including it may contact with a exothermic part. That is, both the working area and the semi-working area can be disposed in contact with the heat generating portion, and the heat of the heat generating portion can be absorbed more efficiently. In addition, since the entire other main surface of the second sheet 7 can be brought into contact with the heat generating portion, bending and breaking of the housing 2 at the outer edge portion 9 can be effectively suppressed.
　図２に示されるように、本発明のベーパーチャンバー１ａの筐体２の内部空間にはウィック４が配置されている。ウィック４は、筐体２の内部空間に配置され、作動液を凝縮部から蒸発部に輸送する役割を果たす。ウィック４の配置の態様は、特に限定されず、例えば、図２に示されるように、第１のシート６の一方主面に形成された柱３と、第２のシート７の一方主面に形成された凸部５との間に挟持されるように配置されてもよい。ウィック４が、第１のシート６の柱３と、第２のシートの凸部５との間に挟持されるようにベーパーチャンバー１ａを構成することにより、ウィック４をつぶさずに、ベーパーチャンバー１ａの内部空間におけるウィック４のずれを抑制することができる。 As shown in FIG. 2, the wick 4 is disposed in the internal space of the casing 2 of the vapor chamber 1a of the present invention. The wick 4 is disposed in the internal space of the housing 2 and serves to transport the hydraulic fluid from the condensation portion to the evaporation portion. The mode of arrangement of the wick 4 is not particularly limited. For example, as shown in FIG. 2, the pillar 3 formed on one main surface of the first sheet 6 and the one main surface of the second sheet 7 It may be disposed so as to be sandwiched between the formed convex portions 5. By forming the vapor chamber 1 a so that the wick 4 is sandwiched between the pillars 3 of the first sheet 6 and the convex portion 5 of the second sheet, the vapor chamber 1 a can be formed without collapsing the wick 4. The displacement of the wick 4 in the internal space of
　ウィック４の厚さは、例えば５μｍ以上２００μｍ以下の範囲にあってよく、好ましくは１０μｍ以上８０μｍ以下であり、より好ましくは３０μｍ以上５０μｍ以下である。ウィック４の厚さは、ウィック４のいかなる箇所においても一様であってよく、異なっていてもよい。また、ウィック４は必ずしも、ベーパーチャンバーの筐体２の主内面全体に亘って設置される必要はなく、部分的に設置されていてもよい。 The thickness of the wick 4 may be, for example, in the range of 5 μm to 200 μm, preferably 10 μm to 80 μm, and more preferably 30 μm to 50 μm. The thickness of the wick 4 may be uniform or different anywhere in the wick 4. Further, the wick 4 does not necessarily have to be installed over the entire main inner surface of the casing 2 of the vapor chamber, and may be partially installed.
　ウィック４の材料は特に限定されず、例えば、多孔体、メッシュ、焼結体、不織布、ワイヤー等を用いることができ、好ましくはメッシュ、不織布が用いられる。 The material of the wick 4 is not particularly limited. For example, a porous body, a mesh, a sintered body, a non-woven fabric, a wire or the like can be used, and preferably a mesh or non-woven fabric is used.
　図２において柱３は、筐体２を内側から支持するように第１のシート６の一方主面に形成されている。柱３は、２つの底面を有する柱状の形状に形成することができる。柱３の形状として、例えば円柱形状、角柱形状、錐台形状等の任意の形状を用いることができる。 In FIG. 2, the pillar 3 is formed on one main surface of the first sheet 6 so as to support the housing 2 from the inside. The column 3 can be formed in a columnar shape having two bottom surfaces. As shape of pillar 3, arbitrary shapes, such as cylindrical shape, prismatic shape, and frustum shape, can be used, for example.
　柱３の太さは、ベーパーチャンバーの筐体の変形を抑制できる強度を与えるものであれば特に限定されないが、例えば柱の高さ方向に垂直な断面の円相当径は、１００μｍ以上２０００μｍ以下であってよく、好ましくは３００μｍ以上１０００μｍ以下の範囲にあり、より好ましくは５００μｍ以上８００μｍ以下の範囲にある。上記柱の円相当径を大きくすることにより、ベーパーチャンバーの筐体の変形をより効果的に抑制することができる。また、上記柱の円相当径を小さくすることにより、作動液の蒸気が移動するための空間をより広く確保することができる。 The thickness of the column 3 is not particularly limited as long as it gives the strength capable of suppressing the deformation of the casing of the vapor chamber. For example, the circle equivalent diameter of the cross section perpendicular to the height direction of the column is 100 μm or more and 2000 μm or less It is preferably in the range of 300 μm to 1000 μm, and more preferably in the range of 500 μm to 800 μm. By enlarging the circle equivalent diameter of the above-mentioned pillar, modification of a case of a vapor chamber can be controlled more effectively. In addition, by reducing the circle equivalent diameter of the pillars, it is possible to secure a wider space for moving the working fluid vapor.
　柱３は、筐体２の内部空間が存在する部分の厚みＨ１の０．０８倍以上０．９倍以下の高さを有することが好ましく、例えば５０μｍ以上５００μｍ以下、好ましくは１００μｍ以上４００μｍ以下の範囲にあり、より好ましくは１００μｍ以上２００μｍ以下の範囲にある高さを有し得る。 The column 3 preferably has a height of 0.08 times to 0.9 times the thickness H1 of the portion where the internal space of the housing 2 exists, for example, 50 μm to 500 μm, preferably 100 μm to 400 μm. It may have a height in the range, more preferably in the range of 100 μm to 200 μm.
　柱３を形成する材料は、特に限定されず、例えばＣｕ、Ｎｉ、Ａｌ、Ｍｇ、Ｔｉ、Ｆｅなどの金属部材、およびそれらを主成分とした合金金属部材等を用いることができ、好ましくはＣｕ、Ｃｕ合金が用いられる。好ましい態様において、柱を形成する材料は、第１のシート６および第２のシート７のいずれかまたは両方と同じ材料である。 The material for forming the columns 3 is not particularly limited. For example, metal members such as Cu, Ni, Al, Mg, Ti, Fe, etc., alloy metal members containing them as main components, and the like can be used. , Cu alloy is used. In a preferred embodiment, the material forming the columns is the same material as either or both of the first sheet 6 and the second sheet 7.
　筐体２の内部空間に配置された柱３の本数は、例えば１ｍｍ２あたりに０．１２５本以上０．５本以下であってよく、好ましくは１ｍｍ２あたりに０．１５本以上０．３５本以下の範囲にある。柱３の本数がこのような範囲にあることにより、筐体をより効果的に支持することができ、筐体のつぶれにくさを向上させることができる。 The number of columns 3 disposed in the internal space of the housing 2, for example, 1mm may be 0.5 present less than 0.125 present per 2, preferably at least 0.15 present per 1mm 2 0.35 It is in the range below this book. When the number of columns 3 is in such a range, the housing can be supported more effectively, and the crushing resistance of the housing can be improved.
　柱３は、図２に示されるように等間隔で、例えば柱間の距離が一定となるように格子点状に配置されていてもよく、非等間隔で配置されていてもよい。柱３を均等に配置することにより、ベーパーチャンバー全体にわたって均一な強度を確保することができる。柱３は、筐体２と一体に形成されていてもよく、また、筐体２と別個に製造し、その後、筐体２の所定の箇所に固定してもよい。 The pillars 3 may be arranged at regular intervals as shown in FIG. 2, for example, in lattice points so that the distance between the columns is constant, or may be arranged at non-uniform intervals. By evenly arranging the pillars 3, uniform strength can be ensured throughout the vapor chamber. The column 3 may be integrally formed with the housing 2, or may be manufactured separately from the housing 2 and then fixed at a predetermined position of the housing 2.
　第２のシート７の一方主面に複数の凸部５が形成されていることにより、凸部５と凸部５との間の空間により毛細管力が生じ、作動液の移動が促進される。このため、図２において、作動液の移動がウィック４と、凸部５間の空間の両方によって促進され、凸部５を有しないベーパーチャンバーと比較して効率的な熱拡散が生じ得る。 By forming the plurality of projections 5 on the one main surface of the second sheet 7, a capillary force is generated by the space between the projections 5 and the projections 5 to promote the movement of the hydraulic fluid. For this reason, in FIG. 2, the movement of the hydraulic fluid is promoted by both the wick 4 and the space between the protrusions 5, and efficient heat diffusion may occur as compared with a vapor chamber without the protrusions 5.
　凸部５は、中空であってもよく、中実であってもよい。また、凸部５は、第２のシート７全体に亘って形成されていてもよく、第２のシート７に部分的に形成されていてもよい。凸部５には、２つの底面を有する柱状の形状を用いることができる。凸部５の形状として、例えば円柱形状、角柱形状、錐台形状等の任意の形状を用いることができる。 The convex portion 5 may be hollow or solid. Further, the convex portion 5 may be formed over the entire second sheet 7 or may be partially formed on the second sheet 7. For the convex portion 5, a columnar shape having two bottom surfaces can be used. As a shape of convex part 5, arbitrary shapes, such as cylindrical shape, prismatic shape, and frustum shape, can be used, for example.
　凸部５の上面の円相当直径は、１μｍ以上５００μｍ以下であってよく、好ましくは５μｍ以上３００μｍ以下の範囲にあり、より好ましくは１５μｍ以上１５０μｍ以下の範囲にある。凸部５の上面がこのような円相当直径を有することにより、ウィックを凸部５により確実に支持することができる。 The equivalent circle diameter of the upper surface of the convex portion 5 may be 1 μm to 500 μm, preferably in the range of 5 μm to 300 μm, and more preferably in the range of 15 μm to 150 μm. When the upper surface of the convex portion 5 has such a circle equivalent diameter, the wick can be supported more reliably by the convex portion 5.
　凸部５の高さは、１μｍ以上１００μｍ以下であってよく、好ましくは５μｍ以上５０μｍ以下の範囲にあり、好ましくは１５μｍ以上３０μｍ以下の範囲にある。凸部５がこのような高さを有することにより、毛細管力が高くなるため、作動流体を還流させるウィックの機能の補助効果を高めることができる。 The height of the convex portion 5 may be 1 μm to 100 μm, preferably in the range of 5 μm to 50 μm, and preferably in the range of 15 μm to 30 μm. With such a height of the convex portion 5, the capillary force is increased, so that the auxiliary effect of the function of the wick for refluxing the working fluid can be enhanced.
　第２のシート７に形成された凸部５のうち隣接するもの同士の距離は、１μｍ以上５００μｍ以下であってよく、好ましくは５μｍ以上３００μｍ以下の範囲にあり、好ましくは１５μｍ以上１５０μｍ以下の範囲にある。凸部５のうち隣接するもの同士の距離が上記範囲にあることにより、毛細管力が高くなるため、作動流体を還流させるウィックの機能の補助効果を高めることができる。本発明において、凸部５同士が隣接しているとは、間に他の凸部５を介さずに隣り合っていることをいう。 The distance between adjacent ones of the convex portions 5 formed on the second sheet 7 may be 1 μm to 500 μm, preferably in the range of 5 μm to 300 μm, and preferably in the range of 15 μm to 150 μm. It is in. When the distance between adjacent ones of the convex portions 5 is in the above-mentioned range, the capillary force is increased, so that the auxiliary effect of the function of the wick for refluxing the working fluid can be enhanced. In the present invention, that the convex portions 5 are adjacent to each other means that they are adjacent to each other without the other convex portions 5 interposed therebetween.
　図１および図２には示されていないが、本発明のベーパーチャンバーの筐体２内にはさらに作動液が封入されている。作動液は、発熱体からの熱により気化し、蒸気となる。その後、蒸気となった作動液は筐体２内を移動し、熱を放出して液体に戻る。液体に戻った作動液は、ウィック４による毛細管現象により再び熱源へ運ばれる。そして再び熱源からの熱により気化し、蒸気となる。これを繰り返すことにより、本発明のベーパーチャンバーは、外部動力を要することなく自立的に作動し、作動液の蒸発および凝縮潜熱を利用して、二次元的に迅速に熱を拡散させることができる。 Although not shown in FIGS. 1 and 2, a working fluid is further enclosed in the casing 2 of the vapor chamber of the present invention. The hydraulic fluid is vaporized by the heat from the heating element to become a vapor. Thereafter, the working fluid which has become vapor moves in the housing 2 and releases heat to return to liquid. The hydraulic fluid returned to the liquid is again carried to the heat source by capillary action by the wick 4. And it is vaporized again by the heat from a heat source, and turns into steam. By repeating this, the vapor chamber of the present invention can operate independently without requiring external power, and heat can be rapidly diffused two-dimensionally by utilizing the latent heat of evaporation and condensation of the hydraulic fluid. .
　作動液の種類は特に限定されず、例えば、水、アルコール類、代替フロン類等を用いることができ、好ましくは水が用いられる。 The type of the hydraulic fluid is not particularly limited, and, for example, water, alcohols, chlorofluorocarbons and the like can be used, and preferably water is used.
　図２において、ベーパーチャンバー１ａの、筐体２の内部空間が存在する部分の厚みＨ１（すなわち筐体２の高さ）は、例えば１００μｍ以上６００μｍ以下であってよく、好ましくは２００μｍ以上５００μｍ以下の範囲にある。また、図２においてＨ２で示される、外縁部９における、支持体１０ａの最上部と、筐体２の第２のシート７の他方主面間の距離は、例えば１００μｍ以上６００μｍ以下であってよく、好ましくは２００μｍ以上５００μｍ以下の範囲にある。 In FIG. 2, the thickness H1 of the portion of the vapor chamber 1a where the internal space of the housing 2 exists (ie, the height of the housing 2) may be, for example, 100 μm to 600 μm, preferably 200 μm to 500 μm. In the range. Further, the distance between the top of the support 10a and the other main surface of the second sheet 7 of the housing 2 at the outer edge portion 9 shown by H2 in FIG. 2 may be, for example, 100 μm to 600 μm. Preferably, it is in the range of 200 μm to 500 μm.
　図２に示されるように、支持体１０ａの最上部と、筐体２の第２のシート７の他方主面間の距離Ｈ２は、筐体２の内部空間が存在する部分における厚みＨ１よりも大きいことが好ましい。特に、第１のシート６と第２のシート７の対向方向に直行する方向から断面視して、筐体２の第１のシートの他方主面の高さ位置が、支持体１０ａの最上部の高さ位置より低いことが好ましい。これにより、第２のシート７が放熱部に接するようにベーパーチャンバー１ａを設置する際に、ベーパーチャンバー１ａの第１のシート６側に搭載されるデバイス（例えばディスプレイ）と支持体１０ａとが接触したとしても、第１のシート６とデバイスとは接触しない。このとき、第１のシート６とデバイスとの間には、Ｈ１とＨ２との差に相当する高さの間隙が生じる。この間隙により、第１のシート６側からの放熱の効率を維持することができ、また第１のシート６側に搭載されるデバイスに対するベーパーチャンバーからの熱の影響を抑制することができる。 As shown in FIG. 2, the distance H2 between the top of the support 10a and the other main surface of the second sheet 7 of the housing 2 is greater than the thickness H1 at the portion where the internal space of the housing 2 exists. It is preferable to be large. In particular, the height position of the other main surface of the first sheet of the housing 2 corresponds to the uppermost portion of the support 10 a when viewed in cross section from the direction orthogonal to the opposing direction of the first sheet 6 and the second sheet 7. It is preferable to be lower than the height position of. Thus, when the vapor chamber 1a is installed such that the second sheet 7 contacts the heat dissipation portion, the device (for example, a display) mounted on the first sheet 6 side of the vapor chamber 1a contacts the support 10a. Even if it does, the first sheet 6 and the device do not contact. At this time, a gap corresponding to the difference between H1 and H2 is generated between the first sheet 6 and the device. By this gap, the efficiency of heat radiation from the first sheet 6 side can be maintained, and the influence of the heat from the vapor chamber on the device mounted on the first sheet 6 side can be suppressed.
　尚、本実施形態では、Ｈ２をＨ１よりも大きくすることにより、上記の効果を得ているが、本発明はこの態様に限定されない。例えば、Ｈ２がＨ１以下であったとしても、第１のシート６と第２のシート７の対向方向に直行する方向から断面視して、筐体２の第１のシートの他方主面の高さ位置が、支持体１０ａの最上部の高さ位置より低ければ、上記の間隙を確保することができ、上記の効果を得ることができる。 In the present embodiment, the above effect is obtained by making H2 larger than H1, but the present invention is not limited to this aspect. For example, even if H2 is equal to or less than H1, the height of the other main surface of the first sheet of housing 2 can be viewed in cross section from the direction orthogonal to the opposing direction of first sheet 6 and second sheet 7 If the height position is lower than the height position of the top of the support 10a, the above-mentioned gap can be secured, and the above-mentioned effect can be obtained.
　図１および図２においてＷ１で示されるベーパーチャンバー１ａの幅は、例えば５ｍｍ以上５００ｍｍ以下であってよく、好ましくは２０ｍｍ以上３００ｍｍ以下の範囲にある。また、図１においてＬで示されるベーパーチャンバー１ａの長さは、例えば５ｍｍ以上５００ｍｍ以下であってよく、好ましくは２０ｍｍ以上３００ｍｍ以下の範囲にある。上述した厚みＨ１、Ｈ２、幅Ｗ１および奥行きＬはベーパーチャンバー１ａのいかなる箇所においても一様であってもよく、異なっていてもよい。 The width of the vapor chamber 1a indicated by W1 in FIGS. 1 and 2 may be, for example, 5 mm or more and 500 mm or less, preferably in the range of 20 mm or more and 300 mm or less. The length of the vapor chamber 1a indicated by L in FIG. 1 may be, for example, 5 mm or more and 500 mm or less, and preferably in the range of 20 mm or more and 300 mm or less. The thicknesses H1 and H2, the width W1 and the depth L described above may be uniform or may be different anywhere in the vapor chamber 1a.
　図１のベーパーチャンバー１ａにおいて、支持体１０ａは枠型に形成され、第１のシートの外縁部の全周にわたって設けられている。支持体を第１のシートの外縁部の全周にわたって設けることにより、筺体にほぼ等しく応力がかかるため、より筐体の反りなどの変形を抑制することができる。本明細書において、支持体１０ａの内側の縁を内縁１２といい、支持体１０ａの外側の縁を外縁１１という。図１のベーパーチャンバー１ａの支持体１０ａの寸法は、支持体１０ａの内縁１２全体が筐体２の外縁部９上に位置し、かつ、支持体１０ａの外縁１１が筐体２の外縁部９よりも外側に位置するように決定されている。図１のベーパーチャンバー１ａの支持体１０ａの寸法がこのように決定されることにより、筐体２を、作動領域ではなく、準作動領域において支持体１０ａに固定することが可能となる。筐体２が、作動領域ではなく、準作動領域において支持体１０ａに固定されることにより、作動領域上に支持体１０ａが存在しなくなるため、筐体２を支持体１０ａに固定した後も、作動領域の高い熱輸送能を効果的に維持することができる。 In the vapor chamber 1a of FIG. 1, the support 10a is formed in a frame shape and provided over the entire periphery of the outer edge portion of the first sheet. By providing the support over the entire circumference of the outer edge portion of the first sheet, since the stress is applied substantially equally to the housing, it is possible to further suppress the deformation such as the warp of the housing. In the present specification, the inner edge of the support 10 a is referred to as the inner edge 12, and the outer edge of the support 10 a is referred to as the outer edge 11. The dimensions of the support 10 a of the vapor chamber 1 a in FIG. 1 are such that the entire inner edge 12 of the support 10 a is located on the outer edge 9 of the housing 2 and the outer edge 11 of the support 10 a is the outer edge 9 of the housing 2. It is determined to be located more outside. This determination of the dimensions of the support 10a of the vapor chamber 1a of FIG. 1 makes it possible to fix the housing 2 to the support 10a not in the working area but in the quasi-working area. By fixing the housing 2 to the support 10a in the semi-operation area, not in the operation area, the support 10a is not present on the operation area, so even after fixing the housing 2 to the support 10a, The high heat transport capacity of the working area can be effectively maintained.
　支持体１０ａを形成する材料は、特に限定されず、例えば銅、ニッケル、アルミ、マグネシウム、チタン、鉄、およびそれらを主成分とする合金等を用いることができる。支持体１０ａを形成する合金としては、例えば、チタンを含む合金であるＳＵＳ４４４（２６．０Ｗ／（ｍ・ｋ））、ニッケルを含む合金であるＳＵＳ３０４（１６．７Ｗ／（ｍ・ｋ））および、ニッケルを含む合金であるＳＵＳ３１６（１６．７Ｗ／（ｍ・ｋ））等を使用することができる。 The material forming the support 10 a is not particularly limited, and, for example, copper, nickel, aluminum, magnesium, titanium, iron, an alloy containing any of these as a main component, and the like can be used. Examples of the alloy forming the support 10 a include SUS444 (26.0 W / (m · k)) which is an alloy containing titanium, SUS304 (16.7 W / (m · k)) which is an alloy containing nickel, and And SUS316 (16.7 W / (m · k)) which is an alloy containing nickel can be used.
　支持体１０ａの外縁は平面視で凹凸、切欠き部を有する形状を有している。この形状は、ベーパーチャンバー１ａを設置する箇所の形状に応じた形状であり得る。支持体１０ａの形状を、ベーパーチャンバー１ａを設置する箇所の形状に対応させることにより、支持体１０ａを電子機器により強固に固定することができるようになる。また、支持体１０ａの外縁は１つ以上の貫通口１３を有するように形成され得る。特に支持体１０ａの外縁のうち凸部は、貫通口１３を有するように形成され得る。支持体１０ａが貫通口１３を有することにより、例えばボルト等の固定具を用いて、支持体１０ａを電子機器に強固に固定することができるようになる。 The outer edge of the support 10a has a shape having irregularities and notches in plan view. This shape may be a shape according to the shape of the place where the vapor chamber 1a is installed. By making the shape of the support 10a correspond to the shape of the place where the vapor chamber 1a is installed, the support 10a can be firmly fixed by the electronic device. Also, the outer edge of the support 10 a may be formed to have one or more through holes 13. In particular, the convex portion of the outer edge of the support 10 a may be formed to have the through hole 13. Since the support 10a has the through hole 13, the support 10a can be firmly fixed to the electronic device by using a fixing tool such as a bolt.
　第１のシート６に固定された領域における支持体１０ａの剛性は、支持体１０ａが固定される領域における筐体２の剛性よりも大きいことが好ましい。一の態様において、第１のシート６に固定された領域における支持体１０ａの剛性は、支持体１０ａが固定される領域における第１のシート６および第２のシート７の剛性よりも大きいことが好ましい。第１のシート６に固定された領域における支持体１０ａの剛性が、支持体１０ａが固定される領域における筐体２の剛性よりも大きいことにより、筐体２に生じ得る変形を効果的に抑制することができる。また、筐体２が、筐体２の剛性よりも大きい剛性を有する支持体１０ａに固定されることにより、筐体２における反りの発生や平坦度の低下を効果的に低減することができる。ここに、「剛性」とは、曲げなどの力に対する変形のしにくさをいい、「剛性が大きい」とは、ヤング率が高いことを意味する。 The rigidity of the support 10 a in the area fixed to the first sheet 6 is preferably larger than the rigidity of the housing 2 in the area to which the support 10 a is fixed. In one aspect, the rigidity of the support 10a in the area fixed to the first sheet 6 is greater than the rigidity of the first sheet 6 and the second sheet 7 in the area to which the support 10a is fixed preferable. The rigidity of the support 10a in the area fixed to the first sheet 6 is larger than the rigidity of the housing 2 in the area to which the support 10a is fixed, thereby effectively suppressing the deformation that may occur in the housing 2 can do. Further, by fixing the housing 2 to the support 10 a having a rigidity larger than the rigidity of the housing 2, it is possible to effectively reduce the occurrence of warpage in the housing 2 and the reduction in flatness. Here, “stiffness” refers to the difficulty of deformation due to a force such as bending, and “high stiffness” means that the Young's modulus is high.
　支持体１０ａの厚さは例えば１００μｍ以上６００μｍ以下であってよく、好ましくは２００μｍ以上５００μｍ以下の範囲にある。支持体１０ａの厚さは、筐体２の内部空間が存在する部分の厚みＨ１よりも大きいことが好ましい。支持体１０ａの厚さを厚みＨ１よりも大きくすることにより、支持体１０ａの最上面が、第１のシート６の他方主面よりも上方に存在するようになる。これにより、第２のシート７が放熱部に接するようにベーパーチャンバー１ａを設置する際に、ベーパーチャンバー１ａの第２のシート６側に搭載されるデバイス（例えばディスプレイ）と支持体１０ａとが接触したとしても、第１のシート６とデバイスとの接触を防止することができる。これにより、第１のシート６側からの放熱の効率を維持することができ、また第１のシート６側に対するベーパーチャンバーからの熱の影響を効果的に抑制することができる。 The thickness of the support 10a may be, for example, 100 μm to 600 μm, and preferably in the range of 200 μm to 500 μm. The thickness of the support 10 a is preferably larger than the thickness H 1 of the portion where the internal space of the housing 2 exists. By making the thickness of the support 10 a greater than the thickness H 1, the uppermost surface of the support 10 a is located above the other main surface of the first sheet 6. Thus, when the vapor chamber 1a is installed such that the second sheet 7 contacts the heat dissipation portion, a device (for example, a display) mounted on the second sheet 6 side of the vapor chamber 1a contacts the support 10a. Even if it does, the contact with the 1st sheet 6 and a device can be prevented. Thereby, the efficiency of heat radiation from the first sheet 6 side can be maintained, and the influence of heat from the vapor chamber on the first sheet 6 side can be effectively suppressed.
　図２においてＷ２およびＷ３で示される支持体１０ａの幅は、特に限定されないが、例えば、２ｍｍ以上１０ｍｍ以下であってよく、好ましくは３ｍｍ以上７ｍｍ以下の範囲にあり、より好ましくは５ｍｍ以上７ｍｍ以下の範囲にある。支持体１０ａの幅は支持体１０ａのどの部分においても一様であってもよく、異なっていてもよい。すなわち幅Ｗ２と幅Ｗ３とが同じであってもよく、異なっていてもよい。 The width of the support 10a shown by W2 and W3 in FIG. 2 is not particularly limited, but may be, for example, 2 mm or more and 10 mm or less, preferably 3 mm or more and 7 mm or less, more preferably 5 mm or more and 7 mm or less In the range of The width of the support 10a may be uniform or different in any part of the support 10a. That is, the width W2 and the width W3 may be the same or different.
　一の態様において、本発明のベーパーチャンバーは、筐体２の外側に支持体１０ａが存在することから、支持体の形状を変更することにより、筐体に影響を与えることなく、ベーパーチャンバーの外形を任意の形状とすることができる。例えば、本発明のベーパーチャンバーを搭載する電子機器の形状に合わせて、幅が狭い部分および広い部分を任意に形成することができ、また、固定用の穴、突起等を形成することができる。 In one aspect, since the vapor chamber of the present invention has the support 10 a on the outside of the housing 2, the outer shape of the vapor chamber can be changed without affecting the housing by changing the shape of the support. Can be of any shape. For example, in accordance with the shape of the electronic device on which the vapor chamber of the present invention is mounted, narrow portions and wide portions can be optionally formed, and fixing holes, protrusions, and the like can be formed.
　支持体１０ａの、筐体２の外縁部９と重なっている部分の幅Ｗ４は、１ｍｍ以上１０ｍｍ以下であり、好ましくは２ｍｍ以上５ｍｍ以下の範囲にあり、より好ましくは３ｍｍ以上５ｍｍ以下の範囲にある。支持体１０ａの、筐体２の外縁部９と重なっている部分の幅Ｗ４が１ｍｍ以上であることにより、支持体１０ａと筐体２とを十分な強度で接合することができる。支持体１０ａの、筐体２の外縁部９と重なっている部分の幅Ｗ４が１０ｍｍ以下であることにより、支持体１０ａの外周縁１１の加工の際の、外縁部９の変形等を効果的に低減することができる。 The width W4 of the portion of the support 10a overlapping the outer edge portion 9 of the housing 2 is 1 mm or more and 10 mm or less, preferably in the range of 2 mm or more and 5 mm or less, more preferably in the range of 3 mm or more and 5 mm or less is there. When the width W4 of the portion of the support 10a overlapping the outer edge portion 9 of the housing 2 is 1 mm or more, the support 10a and the housing 2 can be joined with sufficient strength. When the width W4 of the portion of the support 10a overlapping the outer edge 9 of the housing 2 is 10 mm or less, deformation or the like of the outer edge 9 in processing the outer peripheral edge 11 of the support 10a is effective. Can be reduced to
　ベーパーチャンバー１ａにおいて、図２に示されるように、支持体１０ａは、接合層８を介して、第１のシート６に固定されている。好ましくは、該固定は、筐体２の外縁部９にて行われる。接合層８が設けられることにより、支持体１０ａを筐体２の外縁部９に、より強固に固定することができるようになる。接合層８には、上述したような材料から形成される第１のシート６と支持体１０ａとを接合することが可能な任意の材料を使用することができ、例えば、Ｎｉ、Ｓｎ、Ａｇ、Ａｌ、Ｐｄおよびこれらを主成分とする合金等を使用することができる。また、上述したような材料から形成される第１のシート６と支持体１０ａとを接着可能な接着剤を用いて、接合層８を形成してもよい。 In the vapor chamber 1a, as shown in FIG. 2, the support 10a is fixed to the first sheet 6 via the bonding layer 8. Preferably, the fixing is performed at the outer edge 9 of the housing 2. By providing the bonding layer 8, the support 10 a can be more firmly fixed to the outer edge portion 9 of the housing 2. For the bonding layer 8, any material capable of bonding the first sheet 6 formed of the above-described materials and the support 10 a can be used, for example, Ni, Sn, Ag, Al, Pd, and alloys containing these as main components can be used. In addition, the bonding layer 8 may be formed using an adhesive that can bond the first sheet 6 formed of the above-described material and the support 10 a.
　一の態様において、接合層８に使用される材料の熱伝導率は、第１のシート６を形成する材料の熱伝導率および支持体１０ａを形成する材料の熱伝導率よりも低い。接合層８に使用される材料がこのような熱伝導率を有することにより、第１のシート６と支持体１０ａとを接合する際に外縁部９に与えられる熱の一部を、拡散させることなく外縁部９の接合層８に効果的に留めることができるため、溶接工程の効率を向上させることができる。例えば、第１のシート６がＣｕから形成され、支持体１０ａがＦｅから形成される場合、ＣｕおよびＦｅよりも熱伝導率の低いＮｉ等を、接合層８を形成する材料として使用し得る。 In one aspect, the thermal conductivity of the material used for the bonding layer 8 is lower than the thermal conductivity of the material forming the first sheet 6 and the thermal conductivity of the material forming the support 10 a. When the material used for the bonding layer 8 has such a thermal conductivity, part of the heat given to the outer edge portion 9 when bonding the first sheet 6 and the support 10 a is diffused. Since it can be effectively fixed to the bonding layer 8 of the outer edge portion 9, the efficiency of the welding process can be improved. For example, when the first sheet 6 is formed of Cu and the support 10 a is formed of Fe, Ni or the like having a thermal conductivity lower than that of Cu and Fe can be used as a material for forming the bonding layer 8.
　別の態様において、接合層８に使用される材料は、高熱伝導率の材料である。接合層８に使用される材料は、例えば、５０Ｗ／（ｍ・ｋ）以上、好ましくは１００Ｗ／（ｍ・ｋ）以上の熱伝導率を有する。接合層８に使用される材料として高熱伝導率の材料を用いることにより、筐体の熱を接合層８を介して効率的に支持体１０ａに拡散させることができる。 In another aspect, the material used for the bonding layer 8 is a material with high thermal conductivity. The material used for the bonding layer 8 has a thermal conductivity of, for example, 50 W / (m · k) or more, preferably 100 W / (m · k) or more. By using a material with high thermal conductivity as the material used for the bonding layer 8, the heat of the housing can be efficiently diffused to the support 10 a through the bonding layer 8.
　さらに、接合層８に使用される材料の融点が、第１のシート６を形成する材料の融点および支持体１０ａを形成する材料の融点よりも低いことが好ましい。このような融点を有する接合層８が、第１のシート６と支持体１０ａとの間に位置することにより、第１のシート６と支持体１０ａとをより低い温度で接合することができるようになるため、溶接工程の効率を向上させることができる。例えば、第１のシート６がＣｕから形成され、支持体１０ａがＦｅから形成される場合、ＣｕおよびＦｅより融点の低いバルク状のＳｎ合金等を、接合層８を形成する材料として使用し得る。 Furthermore, it is preferable that the melting point of the material used for the bonding layer 8 be lower than the melting point of the material forming the first sheet 6 and the melting point of the material forming the support 10a. By positioning the bonding layer 8 having such a melting point between the first sheet 6 and the support 10a, the first sheet 6 and the support 10a can be bonded at a lower temperature. Therefore, the efficiency of the welding process can be improved. For example, when the first sheet 6 is formed of Cu and the support 10a is formed of Fe, a bulk Sn alloy or the like having a melting point lower than that of Cu and Fe can be used as a material for forming the bonding layer 8 .
　支持体１０ａを、接合層８を用いずに、溶接等により外縁部９に固定することもできる。例えば、第１のシート６の外縁部９と支持体１０ａとを、レーザー溶接することにより封止することができる。第１のシート６の外縁部９と支持体１０ａとを封止する方法はこれに限定されず、例えば抵抗溶接、拡散接合、ロウ接、ＴＩＧ溶接、樹脂封止等により封止することもできる。 The support 10 a can also be fixed to the outer edge portion 9 by welding or the like without using the bonding layer 8. For example, the outer edge 9 of the first sheet 6 and the support 10a can be sealed by laser welding. The method of sealing the outer edge portion 9 of the first sheet 6 and the support 10 a is not limited to this, and sealing can be performed by, for example, resistance welding, diffusion bonding, brazing, TIG welding, resin sealing, etc. .
　以下、本発明の別の実施形態を示した図３～５について説明する。図３～５に示された各部分のうち、第一実施形態の部分と同一の符号が付された部分は、第一実施形態の部分の特徴と同一の特徴を有する。 Reference is now made to FIGS. 3-5, which illustrate another embodiment of the present invention. Among the parts shown in FIGS. 3 to 5, the parts assigned the same reference numerals as the parts of the first embodiment have the same features as the parts of the first embodiment.
　図３は、本発明の第二実施形態のベーパーチャンバー１ｂの上方からみた斜視図である。図３のベーパーチャンバー１ｂにおいて、支持体１０ｂは、略コの字型に形成されている。第１のシート６の主面を平面視して、該支持体１０ｂの外縁の一部は、第１のシート６の他方主面の外縁よりも前記筐体の中央部からみて外側に位置している。支持体１０ｂの寸法は、支持体１０ｂの内縁１２が筐体２の外縁部９上に位置するように決定されている。尚、図３に示されるように、ベーパーチャンバー１ｂの支持体１０ｂの内縁１２の他の部分は筐体２の外縁部９上に位置していなくてもよい。例えば、本実施形態においては、ベーパーチャンバー１ｂの支持体１０ｂの内縁１２の両端部は、筐体２の外縁部９上に位置していない。支持体１０ｂがこのように、略コの字型に形成されていることにより、ベーパーチャンバー１ｂを設置した際に、支持体１０ｂが設けられていない筐体２の外縁部９に隣接する空間を、より効果的に利用することができる。 FIG. 3 is a perspective view of the vapor chamber 1b of the second embodiment of the present invention as viewed from above. In the vapor chamber 1b of FIG. 3, the support 10b is formed in a substantially U-shape. In plan view of the main surface of the first sheet 6, a part of the outer edge of the support 10b is located outside the outer edge of the other main surface of the first sheet 6 as viewed from the center of the housing. ing. The dimensions of the support 10 b are determined such that the inner edge 12 of the support 10 b is located on the outer edge 9 of the housing 2. As shown in FIG. 3, the other portion of the inner edge 12 of the support 10 b of the vapor chamber 1 b may not be located on the outer edge 9 of the housing 2. For example, in the present embodiment, both ends of the inner edge 12 of the support 10 b of the vapor chamber 1 b are not located on the outer edge 9 of the housing 2. By forming the support 10b in a substantially U shape in this manner, when the vapor chamber 1b is installed, the space adjacent to the outer edge portion 9 of the housing 2 in which the support 10b is not provided is It can be used more effectively.
　図４は、本発明の第三実施形態のベーパーチャンバー１ｃの上方から見た斜視図である。図４のベーパーチャンバー１ｃは、２つの支持体１０ｃを有しており、２つの支持体１０ｃはいずれも直方体形状（平板状）に形成されている。２つの支持体１０ｃは筐体２の対向する２辺に、支持体１０ｃの内縁１２の一部が筐体２の外縁部９上に位置するように設けられている。例えば、本実施形態においては、ベーパーチャンバー１ｃの支持体１０ｃの内縁１２の両端部は、筐体２の外縁部９上に位置していない。尚、図４に示されるように、ベーパーチャンバー１ｃの支持体１０ｃの内縁１２の他の部分は筐体２の外縁部９上に位置していなくてもよい。支持体１０ｃがこのように、筐体２の対向する２辺に設けられていることにより、ベーパーチャンバー１ｃを設置した際に、支持体１０ｃが設けられていない筐体２の２辺の外縁部９に隣接する空間をより効果的に利用することができる。 FIG. 4 is a perspective view of the vapor chamber 1c of the third embodiment of the present invention as viewed from above. The vapor chamber 1c of FIG. 4 has two supports 10c, and both of the two supports 10c are formed in a rectangular parallelepiped shape (flat plate shape). The two supports 10 c are provided on two opposing sides of the housing 2 so that a part of the inner edge 12 of the support 10 c is located on the outer edge 9 of the housing 2. For example, in the present embodiment, both ends of the inner edge 12 of the support 10 c of the vapor chamber 1 c are not located on the outer edge 9 of the housing 2. As shown in FIG. 4, the other portion of the inner edge 12 of the support 10 c of the vapor chamber 1 c may not be located on the outer edge 9 of the housing 2. Thus, when the vapor chamber 1 c is installed by providing the support 10 c on the two opposing sides of the casing 2, the outer edges of the two sides of the casing 2 on which the support 10 c is not provided. The space adjacent to 9 can be used more effectively.
　図５は、本発明の第四実施形態のベーパーチャンバー１ｄの上方からみた斜視図である。図５のベーパーチャンバー１ｄにおいて、支持体１０ｄは、ベーパーチャンバー１ｄと同様に枠型に形成されている。支持体１０ｄの寸法は、支持体１０ａの内縁１２の一部が筐体２の外縁部９上に位置するように決定されている。図３に示されるように、ベーパーチャンバー１ｄの支持体１０ｄの内縁１２の他の部分は筐体２の外縁部９上に位置しておらず、筐体２の外縁よりも外側に位置している。支持体１０ｄで囲まれた領域には、筐体２が設けられていない空間が存在している。支持体１０ｄで囲まれた領域内に筐体２が設けられていない空間が存在することにより、当該空間に任意のデバイスを配置する、配線を通すなど、当該空間を効果的に利用することができるようになる。 FIG. 5 is a perspective view of the vapor chamber 1d of the fourth embodiment of the present invention as viewed from above. In the vapor chamber 1d of FIG. 5, the support 10d is formed in a frame shape like the vapor chamber 1d. The dimensions of the support 10 d are determined such that a portion of the inner edge 12 of the support 10 a is located on the outer edge 9 of the housing 2. As shown in FIG. 3, the other part of the inner edge 12 of the support 10 d of the vapor chamber 1 d is not located on the outer edge 9 of the housing 2 and located outside the outer edge of the housing 2 There is. In the area surrounded by the support 10d, there is a space in which the housing 2 is not provided. When there is a space where the housing 2 is not provided in the area surrounded by the support 10d, any device can be arranged in the space, or the wiring can be effectively used. become able to.
　本発明のベーパーチャンバーは、熱源に近接させるように、放熱デバイスに搭載され得る。従って、本発明は、本発明のベーパーチャンバーを有して成る放熱デバイスも提供する。本発明の放熱デバイスが本発明のベーパーチャンバーを備えることにより、発熱している電子部品およびかかる電子部品の周辺の温度上昇を効果的に抑制することができる。 The vapor chamber of the present invention may be mounted to the heat dissipation device in close proximity to the heat source. Accordingly, the present invention also provides a heat dissipation device comprising the vapor chamber of the present invention. By including the vapor chamber of the present invention, the heat dissipation device of the present invention can effectively suppress the temperature rise of the electronic component that generates heat and the periphery of the electronic component.
　本発明のベーパーチャンバーまたは本発明のベーパーチャンバーを有して成る放熱デバイスは、様々な電子機器に内蔵し、内部空間の熱マネジメントのために用いることができる。本発明のベーパーチャンバーは上記のとおり、外部動力を必要とせず自立的に作動し、作動液の蒸発および凝縮潜熱を利用して、二次元的に高速で熱を拡散することができる。そのため、本発明のベーパーチャンバーまたは放熱デバイスは、電子機器内部の限られたスペースであっても設置することができ、効果的な熱マネジメント実現することができる。本発明の電子機器としては、例えばスマートフォン、タブレット、ノートＰＣ等が挙げられる。例えば、図６に示されるような、情報通信端末１００に内蔵することができる。 The heat dissipating device comprising the vapor chamber of the present invention or the vapor chamber of the present invention can be incorporated in various electronic devices and used for heat management of the internal space. As described above, the vapor chamber of the present invention operates independently without the need for external power, and can dissipate heat at a high speed in two dimensions using the evaporation and condensation latent heat of the hydraulic fluid. Therefore, the vapor chamber or the heat dissipation device of the present invention can be installed even in a limited space inside the electronic device, and effective heat management can be realized. As an electronic device of the present invention, a smart phone, a tablet, a notebook PC etc. are mentioned, for example. For example, it can be incorporated in the information communication terminal 100 as shown in FIG.
　図７は図６に示される情報通信端末１００のＸ－Ｘ断面図である。情報通信端末１００において、本発明のベーパーチャンバー１ａは、基板１５０に設けられた半導体素子１６０およびバッテリー１４０から発生する熱の放散のために、半導体素子１６０およびバッテリー１４０の上部に第２のシート７が位置するように配置されている。本発明のベーパーチャンバー１ａの支持体１０ａは、ボルト等の固定具１３０により、情報通信端末１００の筐体１２０に固定されている。 FIG. 7 is a cross-sectional view of the information communication terminal 100 shown in FIG. In the information communication terminal 100, the vapor chamber 1a of the present invention is a second sheet 7 on the top of the semiconductor element 160 and the battery 140 for dissipation of heat generated from the semiconductor element 160 and the battery 140 provided on the substrate 150. Are arranged to be located. The support 10 a of the vapor chamber 1 a according to the present invention is fixed to the housing 120 of the information communication terminal 100 by a fixing tool 130 such as a bolt.
　例えば、固定具１３０がボルトである場合には、支持体１０ａはボルトが通る貫通口１３を有し得る。本発明のベーパーチャンバー１ａにおいては、上記貫通口１３を筐体部分ではなく支持体に設けることができる。そのため、本発明のベーパーチャンバー１ａは、筐体２の機能および強度を損なうことなく、電子機器に搭載することができる。 For example, if the fixture 130 is a bolt, the support 10a may have a through hole 13 through which the bolt passes. In the vapor chamber 1a of the present invention, the through hole 13 can be provided not in the housing portion but in the support. Therefore, the vapor chamber 1a of the present invention can be mounted on an electronic device without impairing the function and strength of the housing 2.
　また、情報通信端末１００に内蔵されたベーパーチャンバー１ａでは、支持体１０ａが固定されている部分の厚みが、前記支持体１０ａが固定されていない部分の厚みよりも大きい。このため、情報通信端末１００のディスプレイ１１０と筐体２の間に間隙を確保することができる。このような間隙が存在することにより、ディスプレイ１１０と筐体２との接触が抑制される。また、筐体２とディスプレイ１１０との間に間隙が存在することにより、第１のシート６側からの放熱の効率を維持することができ、また第１のシート６側に搭載されるデバイスに対するベーパーチャンバーからの熱の影響を効果的に抑制することができる。 In the vapor chamber 1a incorporated in the information communication terminal 100, the thickness of the portion to which the support 10a is fixed is larger than the thickness of the portion to which the support 10a is not fixed. Therefore, a space can be secured between the display 110 and the housing 2 of the information communication terminal 100. The presence of such a gap suppresses the contact between the display 110 and the housing 2. Further, by the presence of a gap between the housing 2 and the display 110, the efficiency of heat radiation from the first sheet 6 side can be maintained, and for the device mounted on the first sheet 6 side The influence of heat from the vapor chamber can be effectively suppressed.
　本発明のベーパーチャンバー、放熱デバイスおよび電子機器は携帯情報端末等の分野において、広範な用途に使用できる。例えば、ＣＰＵ等の熱源の温度を下げ、電子機器の使用時間を延ばすために使用することができ、スマートフォン、タブレット、ノートＰＣ等に使用することができる。 The vapor chamber, heat dissipation device and electronic device of the present invention can be used in a wide range of applications in the field of portable information terminals and the like. For example, the temperature of a heat source such as a CPU can be lowered to extend the use time of an electronic device, and the electronic device can be used for a smartphone, a tablet, a notebook PC, or the like.
　　１ａ　ベーパーチャンバー
　　１ｂ　ベーパーチャンバー
　　１ｃ　ベーパーチャンバー
　　１ｄ　ベーパーチャンバー
　　２　　筐体
　　３　　柱
　　４　　ウィック
　　５　　凸部
　　６　　第１のシート
　　７　　第２のシート
　　８　　接合層
　　９　　外縁部
　１０ａ　支持体
　１０ｂ　支持体
　１０ｃ　支持体
　１１　　外縁
　１２　　内縁
　１３　　貫通口
１００　　情報通信端末
１１０　　ディスプレイ
１２０　　筐体
１３０　　固定具
１４０　　バッテリー
１５０　　基板
１６０　　半導体素子 DESCRIPTION OF SYMBOLS 1 a vapor chamber 1 b vapor chamber 1 c vapor chamber 1 d vapor chamber 2 housing 3 pillar 4 wick 5 convex portion 6 first sheet 7 second sheet 8 bonding layer 9 outer edge portion 10 a support 10 b support 10 c support 11 outer edge 12 Inner edge 13 Through hole 100 Information communication terminal 110 Display 120 Case 130 Fixing tool 140 Battery 150 Substrate 160 Semiconductor element

Claims (9)

  1. 　第１のシートと、第２のシートと、を備え、前記第１のシートの一方主面と前記第２のシートの一方主面とが対向して接合され、前記第１のシートの一方主面と前記第２のシートの一方主面との間に内部空間を有する筐体と、
    　前記筐体の内部空間に封入された作動液と、
    　前記筐体の内部空間に配置されたウィックと、
    　前記第１のシートの他方主面の外縁部において、前記第１のシートに固定された支持体とを有し、
    　前記第１のシートの主面を平面視して、前記支持体の外縁の一部は前記第１のシートの他方主面の外縁よりも前記筐体の中央部からみて外側に位置している、
    　ベーパーチャンバー。     A first sheet and a second sheet, wherein one main surface of the first sheet and one main surface of the second sheet are opposed to each other and joined, and one main of the first sheet is A housing having an internal space between the surface and one of the main surfaces of the second sheet;
    Hydraulic fluid sealed in the internal space of the housing;
    A wick disposed in the internal space of the housing;
    A support fixed to the first sheet at an outer edge portion of the other main surface of the first sheet;
    In plan view of the main surface of the first sheet, a part of the outer edge of the support is located outside the outer edge of the other main surface of the first sheet as viewed from the center of the housing. ,
    Vapor chamber.
  2. 　前記第１のシートと前記第２のシートの対向方向に直行する方向から断面視して、前記第１のシートの他方主面の高さ位置は前記支持体の最上部の高さ位置より低い、
    　請求項１に記載のベーパーチャンバー。     The height position of the other main surface of the first sheet is lower than the height position of the uppermost portion of the support when viewed in cross section from the direction orthogonal to the opposing direction of the first sheet and the second sheet. ,
    The vapor chamber according to claim 1.
  3. 　前記第１のシートに固定された領域における支持体の剛性が、前記支持体が固定される領域における前記筐体の剛性よりも高い剛性を有する、請求項１または２に記載のベーパーチャンバー。 The vapor chamber according to claim 1, wherein the rigidity of the support in the area fixed to the first sheet is higher than the rigidity of the housing in the area to which the support is fixed.
  4. 　前記筐体が、前記第１のシートの外縁部と前記第２のシートの外縁部が接合されて成る、請求項１～３のいずれか一項に記載のベーパーチャンバー。 The vapor chamber according to any one of claims 1 to 3, wherein the housing is formed by joining an outer edge of the first sheet and an outer edge of the second sheet.
  5. 　前記支持体が、前記第１のシートの外縁部の全周にわたって設けられる、請求項１～４のいずれか一項に記載のベーパーチャンバー。 The vapor chamber according to any one of claims 1 to 4, wherein the support is provided all around the outer edge of the first sheet.
  6. 　前記第１のシートまたは前記第２のシートの一方のシートの他方主面に柱が形成され、他方のシートの他方主面に凸部が形成されており、前記ウィックが、前記柱と前記凸部によって挟持されている、請求項１～５のいずれか一項に記載のベーパーチャンバー。 A pillar is formed on the other main surface of one sheet of the first sheet or the second sheet, and a convex portion is formed on the other main surface of the other sheet, and the wick includes the pillar and the convex The vapor chamber according to any one of claims 1 to 5, which is held by a part.
  7. 　前記支持体が接合層を介して前記第１のシートに固定される、請求項１～６のいずれか一項に記載のベーパーチャンバー。 The vapor chamber according to any one of claims 1 to 6, wherein the support is fixed to the first sheet via a bonding layer.
  8. 　請求項１～７のいずれか一項に記載のベーパーチャンバーを有して成る放熱デバイス。 A heat dissipation device comprising the vapor chamber according to any one of claims 1 to 7.
  9. 　請求項１～７のいずれか一項に記載のベーパーチャンバーまたは請求項８に記載の放熱デバイスを有して成る電子機器。 An electronic device comprising the vapor chamber according to any one of claims 1 to 7 or the heat dissipation device according to claim 8.
PCT/JP2018/028230 2017-08-04 2018-07-27 Vapor chamber WO2019026786A1 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6928860B1 (en) * 2020-11-20 2021-09-01 古河電気工業株式会社 Vapor chamber
WO2021186686A1 (en) * 2020-03-19 2021-09-23 Ｆｃｎｔ株式会社 Mobile terminal
WO2022071483A1 (en) * 2020-09-30 2022-04-07 日本電産株式会社 Thermal conductive unit and cooling device

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022181631A1 (en) * 2021-02-25 2022-09-01 日本電産株式会社 Thermally conductive member and heat exchange device
WO2022181629A1 (en) * 2021-02-25 2022-09-01 日本電産株式会社 Thermally conductive member and heat exchange device
CN116568984A (en) * 2021-02-25 2023-08-08 尼得科株式会社 Heat conduction member and heat exchange device
CN114599203A (en) * 2022-01-29 2022-06-07 联想(北京)有限公司 Heat dissipation device and electronic equipment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3164695U (en) * 2010-09-30 2010-12-09 超▲シュウ▼科技股▲分▼有限公司 Heat sink structure with locking tool
US20120145357A1 (en) * 2010-12-13 2012-06-14 Electronics And Telecommunications Research Institute Thin plate heat pipe
JP2017106672A (en) * 2015-12-10 2017-06-15 Ｌｅａｄｉｎｇ Ｅｄｇｅ Ａｓｓｏｃｉａｔｅｓ株式会社 Heat radiator and manufacturing method of heat radiator

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3164695U (en) * 2010-09-30 2010-12-09 超▲シュウ▼科技股▲分▼有限公司 Heat sink structure with locking tool
US20120145357A1 (en) * 2010-12-13 2012-06-14 Electronics And Telecommunications Research Institute Thin plate heat pipe
JP2017106672A (en) * 2015-12-10 2017-06-15 Ｌｅａｄｉｎｇ Ｅｄｇｅ Ａｓｓｏｃｉａｔｅｓ株式会社 Heat radiator and manufacturing method of heat radiator

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021186686A1 (en) * 2020-03-19 2021-09-23 Ｆｃｎｔ株式会社 Mobile terminal
WO2022071483A1 (en) * 2020-09-30 2022-04-07 日本電産株式会社 Thermal conductive unit and cooling device
JP6928860B1 (en) * 2020-11-20 2021-09-01 古河電気工業株式会社 Vapor chamber
WO2022107630A1 (en) * 2020-11-20 2022-05-27 古河電気工業株式会社 Vapor chamber
JP2022082030A (en) * 2020-11-20 2022-06-01 古河電気工業株式会社 Vapor chamber
US11874068B2 (en) 2020-11-20 2024-01-16 Furukawa Electric Co., Ltd. Vapor chamber

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