WO2019010638A1 - Manufacturing method for display - Google Patents

Manufacturing method for display Download PDF

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Publication number
WO2019010638A1
WO2019010638A1 PCT/CN2017/092564 CN2017092564W WO2019010638A1 WO 2019010638 A1 WO2019010638 A1 WO 2019010638A1 CN 2017092564 W CN2017092564 W CN 2017092564W WO 2019010638 A1 WO2019010638 A1 WO 2019010638A1
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WIPO (PCT)
Prior art keywords
pixel
substrate
luminescent material
interposer
region
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PCT/CN2017/092564
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French (fr)
Chinese (zh)
Inventor
欧建兵
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深圳市柔宇科技有限公司
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Application filed by 深圳市柔宇科技有限公司 filed Critical 深圳市柔宇科技有限公司
Priority to CN201780053941.3A priority Critical patent/CN109690782A/en
Priority to PCT/CN2017/092564 priority patent/WO2019010638A1/en
Publication of WO2019010638A1 publication Critical patent/WO2019010638A1/en

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels

Definitions

  • the present invention relates to the field of displays, and in particular to a method of manufacturing a display.
  • a full-color organic light-emitting display is generally composed of sub-pixels of a plurality of colors, and a light-emitting layer material of each color sub-pixel (such as a red, green, and blue light-emitting layer material) is generally formed by evaporation, in order to prevent
  • the light-emitting layer materials of different colors are cross-mixed during the formation process, and the fine masks are used to block the sub-pixels that are not vapor-deposited.
  • the fine mask is expensive and is a consumable item, the cost of the evaporation process is too high.
  • Embodiments of the present invention provide a method of fabricating a display.
  • the present invention provides a method of manufacturing a display for manufacturing a pixel light-emitting layer on a pixel substrate using an interposer substrate, the manufacturing method comprising:
  • the interposer substrate includes a first substrate and a first light shielding layer, and the first substrate is formed with a transfer region defined by the first light shielding layer;
  • the pixel substrate includes a second substrate and a second light shielding layer, and the second substrate is formed with a pixel region defined by the second light shielding layer;
  • One side of the interposer substrate on which the luminescent material is formed is attached to one side of the pixel substrate having the pixel region, the transfer region being opposite to the pixel region;
  • the luminescent material in the transfer zone is transferred into the pixel region to form the pixel luminescent layer.
  • the method for manufacturing a display according to an embodiment of the present invention forms a pixel light-emitting layer on a pixel substrate by using an interposer substrate, thereby eliminating the need for a fine mask, thereby reducing the cost of the vapor deposition process.
  • FIG. 1 is a schematic flow chart of a method of manufacturing a display according to an embodiment of the present invention
  • FIG. 2 is a schematic structural view of a pixel substrate and an interposer according to an embodiment of the present invention
  • FIG. 3 is another schematic flow chart of a method of manufacturing a display according to an embodiment of the present invention.
  • FIG. 4 is a schematic flow chart of still another method of manufacturing a display according to an embodiment of the present invention.
  • FIG. 5 is still another schematic flowchart of a method of manufacturing a display according to an embodiment of the present invention.
  • FIG. 6 is a schematic flow chart showing another method of manufacturing a display according to an embodiment of the present invention.
  • FIG. 7 is still another schematic flowchart of a method of manufacturing a display according to an embodiment of the present invention.
  • FIG. 8 is a schematic structural view of an interposer substrate according to an embodiment of the present invention.
  • FIG. 9 is a schematic flow chart showing another method of manufacturing a display according to an embodiment of the present invention.
  • FIG. 10 is still another schematic flowchart of a method of manufacturing a display according to an embodiment of the present invention.
  • FIG. 11 is a schematic view showing the formation of a pixel light emitting layer according to an embodiment of the present invention.
  • FIG. 12 is still another flow chart of a method of manufacturing a display according to an embodiment of the present invention.
  • the pixel substrate 10, the pixel light emitting layer 12, the second substrate 14, the second light shielding layer 16, the pixel region 18, the first pixel region 182, the second pixel region 184, the interposer substrate 200, the first substrate 220, and the first light shielding layer 240 The transfer region 260, the first interposer substrate 270, the second interposer substrate 280, and the third interposer substrate 290.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” or “second” may include one or more of the described features either explicitly or implicitly.
  • the meaning of "a plurality” is two or more unless specifically and specifically defined otherwise.
  • connection In the description of the present invention, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or connected in one piece. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium, which can be the internal communication of two elements or the interaction of two elements. For those of ordinary skill in the art, The specific meanings of the above terms in the present invention are understood on a case-by-case basis.
  • a method of manufacturing a display according to an embodiment of the present invention is for manufacturing a pixel light-emitting layer 12 on a pixel substrate 10 by using an interposer substrate 200.
  • Manufacturing methods include:
  • Step S1 providing an interposer substrate 200, the interposer substrate 200 includes a first substrate 220 and a first light shielding layer 240, the first substrate 220 is formed with a transfer region 260 defined by the first light shielding layer 240;
  • Step S2 vaporizing the luminescent material on the interposer substrate 200 to fill the transfer region 260 with the luminescent material;
  • Step S3 providing a pixel substrate 10, the pixel substrate 10 includes a second substrate 14 and a second light shielding layer 16, the second substrate 14 is formed with a pixel region 18 defined by the second light shielding layer 16;
  • Step S4 attaching one side of the interposer substrate 200 on which the luminescent material is formed to one side of the pixel substrate 10 having the pixel region 18, and the transfer region 260 is opposite to the pixel region 18;
  • Step S5 Transfer the luminescent material in the transfer region 260 into the pixel region 18 to form the pixel luminescent layer 12.
  • the method of manufacturing the display according to the embodiment of the present invention forms the pixel light-emitting layer 12 on the pixel substrate 10 by using the interposer substrate 200, eliminating the need for a fine mask, thereby reducing the cost of the vapor deposition process.
  • the interposer substrate 200 is formed by the first substrate 220 and the first light shielding layer 240. Since the related process technology is relatively mature, the interposer substrate 200 has low cost and high precision, and thus is fabricated on the pixel substrate 10 by using the interposer substrate 200.
  • the pixel light-emitting layer 12 can avoid the cross-color mixing of the light-emitting materials on the pixel substrate 10, and can save the cost of manufacturing the pixel light-emitting layer 12 on the pixel substrate 10.
  • the first substrate 14 and the second substrate 220 can be a glass substrate.
  • the pixel substrate 10 of the embodiment of the present invention may be used on a display, or the display may include the pixel substrate 10.
  • step S2 includes:
  • Step S22 fluorinating the luminescent material on the first substrate 220 and the first light shielding layer 240 to fill the transfer region 260 with the luminescent material.
  • the transfer material 260 can be quickly filled with the luminescent material.
  • the luminescent material may be directly evaporated on the interposer substrate 200 to form a luminescent material on the first substrate 220 and the first light shielding layer 240, that is, on the first light shielding layer 240 and the transfer region 260 of the first substrate 220.
  • the luminescent material is simultaneously formed thereon, which can reduce unnecessary process flow, such as occluding the first light shielding layer 240, thereby rapidly filling the transfer region 260 with the luminescent material.
  • step S1 includes:
  • Step S12 forming a light shielding material layer on the first substrate 220.
  • Step S14 processing the light shielding material layer by a photolithography technique to form the first light shielding layer 240.
  • the interposer substrate 200 can be quickly obtained by photolithography.
  • a light shielding material layer may be formed on the first substrate 220, for example, a light shielding material is coated on the first substrate 220 by using a coating technique, and a specific portion of the light shielding material is removed by using a photolithography technique to retain the corresponding graphic.
  • the light shielding material forms a first light shielding layer 240.
  • step S3 includes:
  • Step S32 forming a light shielding material layer on the second substrate 14;
  • Step S34 processing the light shielding material layer by a photolithography technique to form the second light shielding layer 16.
  • the pixel substrate 10 can be quickly obtained by photolithography.
  • a light shielding material layer may be formed on the second substrate 14 first, for example, a light shielding material is coated on the second substrate 14 by a coating technique, and a specific portion of the light shielding material is removed by photolithography to retain the corresponding graphic.
  • the light shielding material is formed to form the second light shielding layer 16.
  • the material of the light shielding material layer is a photoresist.
  • the light shielding material layer can be formed by fully utilizing the characteristics of the photoresist.
  • the photoresist refers to a light-sensitive mixed liquid composed of three main components of a photosensitive resin, a sensitizer and a solvent. After the photosensitive resin is irradiated, the photocuring reaction can be quickly performed, that is, the photoresist is from the photoresist. The liquid form becomes a solid form, thereby forming a layer of light shielding material.
  • the first light shielding layer 240 and the second light shielding layer 16 can be obtained by removing specific portions by photolithography techniques (such as treatment with a suitable solvent) using physical properties of the photoresist, such as solubility and affinity.
  • the manufacturing method includes:
  • Step S6 removing the luminescent material on the second light shielding layer 16.
  • the luminescent material remaining on the second light shielding layer 16 can be removed, and the overall thickness of the pixel substrate 10 can be reduced.
  • the luminescent material in the formation process of the pixel substrate 10, only the luminescent material needs to be formed in the pixel region 18 to obtain the pixel luminescent layer 12, and the luminescent material is not required to be formed on the second opaque layer 16, but the luminescent material is transferred from the transfer region 260 to In the pixel region 18, part of the luminescent material may be transferred to the second light shielding layer 16, so that the luminescent material of the transfer region 260 may be removed after the luminescent material is transferred to the pixel region 18 and the luminescent material remains in the second light shielding layer 16.
  • the luminescent material on the second light shielding layer 16 facilitates the subsequent process flow and reduces the overall thickness of the pixel substrate 10.
  • the area of transfer region 260 is greater than or equal to the area of pixel region 18.
  • the luminescent material in the transfer region 260 is capable of forming a uniform pixel luminescent layer 12 in the pixel region 18.
  • the transfer region 260 and the pixel region 18 are opposed, and when the area of the transfer region 260 is smaller than the pixel region 18, the light in the transfer region 260 The material may be transferred more concentratedly to the corresponding portion of the pixel region 18, and other portions of the pixel region 18 may be free of luminescent material or formed thinner.
  • the luminescent material in the transfer region 260 can cover the entire pixel region 18, thereby ensuring that the luminescent material can A more uniform pixel luminescent layer 12 is formed in the pixel region 18.
  • the luminescent material comprises a red luminescent material, a green luminescent material, or a blue luminescent material.
  • the pixel substrate 10 formed of a plurality of luminescent materials can be utilized to obtain a full color display.
  • the display can obtain a full-color image, and the display can display different colors by adjusting different ratios of red light, green light, and blue light, such as an equal amount of red.
  • White light is obtained after mixing light, green light and blue light. Therefore, a plurality of luminescent materials can be formed on the pixel substrate 10, thereby forming a full-color display using the pixel substrate 10.
  • step S1 includes:
  • Step S16 providing a first interposer substrate 270, a second interposer substrate 280, and a third interposer substrate 290.
  • the first interposer substrate 270, the second interposer substrate 280, and the third interposer substrate 290 each include a first substrate 220 and a first light shielding layer. 240 and transfer zone 260.
  • Step S2 includes:
  • Step S24 filling the red luminescent material in the transfer region 260 of the first interposer substrate 270, filling the green luminescent material in the transfer region 260 of the second interposer substrate 280, and filling the blue illuminating region in the transfer region 260 of the third interposer substrate 290 material;
  • Step S4 includes:
  • Step S42 pressing one side of the first interposer substrate 270 on which the red luminescent material is formed, one side of the second interposer substrate 280 on which the green luminescent material is formed, and the side on the third interposer substrate 290 on which the blue luminescent material is formed are pressed.
  • the preset order is respectively attached to one side of the pixel substrate 10 having the pixel area 18, and the transfer area 260 and the pixel area 18 are opposite;
  • Step S5 includes:
  • Step S52 Transfer the red luminescent material, the green luminescent material and the blue luminescent material to different pixel regions 18, respectively.
  • a plurality of luminescent materials can be formed in different pixel regions 18 on the pixel substrate 10.
  • the first interposer substrate 270, the second interposer substrate 280, and the third interposer substrate 290 may be provided, wherein the red luminescent material may be filled in the transfer region 260 of the first interposer substrate 270, and the second interposer substrate 280 may be rotated.
  • the printing area 260 is filled with a green luminescent material
  • the blue luminescent material is filled in the transfer area 260 of the third interposer 290
  • the three interposer substrates 200 are respectively attached to the pixel substrate 10 having the pixel area 18 in a predetermined order.
  • the preset order may be any order of red, green, and blue.
  • one side of the first interposer substrate 270 on which the red luminescent material is formed is first attached to one side of the pixel substrate 10 having the pixel region 18, and The red luminescent material is transferred from the transfer region 260 of the first interposer substrate 270 to the opposite pixel region 18; one side of the second interposer substrate 280 on which the green luminescent material is formed is attached to the pixel substrate 10 having the pixel region 18 One side and transfer of the green luminescent material from the second interposer substrate 280 The region 260 is transferred to the opposite pixel region 18; finally, one side of the third interposer substrate 290 on which the blue luminescent material is formed is attached to one side of the pixel substrate 10 having the pixel region 18, and the blue luminescent material is removed from The transfer region 260 of the third interposer substrate 290 is transferred into the opposite pixel region 18.
  • the preset order may also be other orders such as blue, green, red, etc., and is not specifically limited herein.
  • step S5 includes:
  • Step S54 The other side of the interposer substrate 200 is processed by laser to transfer the luminescent material in the transfer region 260 to the pixel region 18, and the other side of the interposer substrate 200 is on the side of the interposer substrate 200 having the transfer region 260. Back.
  • the luminescent material in the transfer region 260 of the interposer substrate 200 can be transferred into the pixel region 18 by means of a laser.
  • one side of the interposer substrate 200 having the transfer region 260 is first attached to one side of the pixel substrate 10 having the pixel region 18, and the other side of the interposer substrate 200 is processed by laser processing, wherein the interposer substrate 200 is further One side is opposite the side of the interposer substrate 200 having the transfer region 260, and the laser light can peel off the luminescent material in the transfer region 260 so that the luminescent material can enter the pixel region 18 opposite to the transfer region 260.
  • the luminescent material (if any) on the first light shielding layer 240 can be prevented from being peeled off, thereby avoiding other than the pixel region 18 opposite to the transfer region 260.
  • the pixel region 18 enters the luminescent material.
  • the pixel area 18 includes a first pixel area 182 that is currently to be filled, and step S4 includes:
  • Step S44 the transfer region 260 is attached to the first pixel region 182.
  • the luminescent material may be filled in the first pixel region 182 that is currently to be filled to form the pixel luminescent layer 12.
  • the pixel region 18 may require different luminescent materials, such as a red luminescent material, a green luminescent material, and a blue luminescent material, in the formation process of the pixel luminescent layer 12, only the first pixel currently required to be filled is needed. Filling the luminescent material in region 182, bonding transfer region 260 to first pixel region 182 can transfer luminescent material in transfer region 260 into first pixel region 182.
  • the pixel area 18 includes a second pixel area 184 to be filled, and step S4 includes:
  • Step S46 bonding the first light shielding layer 240 to the second pixel region 184.
  • the luminescent material can be prevented from entering the second pixel region 184 to be filled.
  • the second pixel region 184 to be filled refers to other pixel regions 18 other than the first pixel region 182 currently to be filled, since the pixel region 18 may require different luminescent materials, such as red luminescent materials, green luminescent materials, and The blue luminescent material or the like, so in the formation process of the pixel luminescent layer 12, only the luminescent material needs to be filled in the first pixel region 182 currently filled, in order to avoid cross color mixing, that is, to avoid luminescent materials of different colors entering the same pixel region.
  • the first light shielding layer 240 may be utilized to block the second pixel region 184 to be filled, thereby preventing the luminescent material in the transfer region 260 from entering the second pixel region 184 to be filled.
  • the second pixel region 184 of the embodiment of the present invention is attached to the first light shielding layer 240. It can be understood that in order to avoid cross color mixing, it is only necessary to prevent the second pixel region 184 from being disposed relative to the transfer region 260. In other embodiments, the second pixel region 184 can be left floating.
  • the first feature "on” or “under” the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them.
  • the first feature "above”, “above” and “above” the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature includes the first feature directly below and below the second feature, or merely the first feature level being less than the second feature.

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Abstract

Provided is a manufacturing method for a display, same being used for manufacturing a pixel light-emitting layer (12) on a pixel substrate (10) by means of an interposer substrate (200). The manufacturing method comprises the steps of: (S1) providing the interposer substrate (200); (S2) evaporating a light-emitting material on the interposer substrate (200), so that the light-emitting material fills a transfer area (260); (S3) providing the pixel substrate (10); (S4) attaching one side of the interposer substrate (200) where the light-emitting material is formed to one side of the pixel substrate (10) having a pixel area (18); and (S5) transferring the light-emitting material in the transfer area (260) to the pixel area (18) so as to form the pixel light-emitting layer (12).

Description

显示器的制造方法Display manufacturing method 技术领域Technical field
本发明涉及显示器领域，特别涉及一种显示器的制造方法。The present invention relates to the field of displays, and in particular to a method of manufacturing a display.
背景技术Background technique
在相关技术中，全彩有机发光显示器一般由多种颜色的子像素构成，每种颜色的子像素的发光层材料(如红、绿、蓝发光层材料)一般通过蒸镀方式形成，为了防止不同颜色的发光层材料在形成过程中交叉混色，采用精细掩膜版遮挡没进行蒸镀的子像素。但是由于精细掩膜版造价昂贵，而且属于消耗品，因此导致蒸镀制程成本过高。In the related art, a full-color organic light-emitting display is generally composed of sub-pixels of a plurality of colors, and a light-emitting layer material of each color sub-pixel (such as a red, green, and blue light-emitting layer material) is generally formed by evaporation, in order to prevent The light-emitting layer materials of different colors are cross-mixed during the formation process, and the fine masks are used to block the sub-pixels that are not vapor-deposited. However, since the fine mask is expensive and is a consumable item, the cost of the evaporation process is too high.
发明内容Summary of the invention
本发明的实施例提供一种显示器的制造方法。Embodiments of the present invention provide a method of fabricating a display.
本发明提供一种显示器的制造方法，用于利用中介基板在像素基板上制造像素发光层，所述制造方法包括：The present invention provides a method of manufacturing a display for manufacturing a pixel light-emitting layer on a pixel substrate using an interposer substrate, the manufacturing method comprising:
提供所述中介基板，所述中介基板包括第一基板和第一遮光层，所述第一基板形成有由所述第一遮光层限定的转印区；Providing the interposer substrate, the interposer substrate includes a first substrate and a first light shielding layer, and the first substrate is formed with a transfer region defined by the first light shielding layer;
在所述中介基板上蒸镀发光材料以使所述发光材料填充所述转印区；Depositing a luminescent material on the interposer substrate to fill the transfer region with the luminescent material;
提供所述像素基板，所述像素基板包括第二基板和第二遮光层，所述第二基板形成有由所述第二遮光层限定的像素区；Providing the pixel substrate, the pixel substrate includes a second substrate and a second light shielding layer, and the second substrate is formed with a pixel region defined by the second light shielding layer;
将形成有所述发光材料的所述中介基板的一侧贴合至具有所述像素区的所述像素基板的一侧，所述转印区与所述像素区相对；和One side of the interposer substrate on which the luminescent material is formed is attached to one side of the pixel substrate having the pixel region, the transfer region being opposite to the pixel region;
将所述转印区中的所述发光材料转移至所述像素区中以形成所述像素发光层。The luminescent material in the transfer zone is transferred into the pixel region to form the pixel luminescent layer.
本发明实施方式的显示器的制造方法利用中介基板在像素基板上形成像素发光层，无需使用精细掩膜版，从而可降低蒸镀制程的成本。The method for manufacturing a display according to an embodiment of the present invention forms a pixel light-emitting layer on a pixel substrate by using an interposer substrate, thereby eliminating the need for a fine mask, thereby reducing the cost of the vapor deposition process.
本发明的实施方式的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本发明的实施方式的实践了解到。The additional aspects and advantages of the embodiments of the present invention will be set forth in part in the description which follows.
附图说明DRAWINGS
本发明的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解，其中：The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from
图1是本发明实施方式的显示器的制造方法的流程示意图； 1 is a schematic flow chart of a method of manufacturing a display according to an embodiment of the present invention;
图2是本发明实施方式的像素基板和中介基板的结构示意图；2 is a schematic structural view of a pixel substrate and an interposer according to an embodiment of the present invention;
图3是本发明实施方式的显示器的制造方法的另一个流程示意图；3 is another schematic flow chart of a method of manufacturing a display according to an embodiment of the present invention;
图4是本发明实施方式的显示器的制造方法的再一个流程示意图；4 is a schematic flow chart of still another method of manufacturing a display according to an embodiment of the present invention;
图5是本发明实施方式的显示器的制造方法的又一个流程示意图；FIG. 5 is still another schematic flowchart of a method of manufacturing a display according to an embodiment of the present invention; FIG.
图6是本发明实施方式的显示器的制造方法的又一个流程示意图；6 is a schematic flow chart showing another method of manufacturing a display according to an embodiment of the present invention;
图7是本发明实施方式的显示器的制造方法的又一个流程示意图；FIG. 7 is still another schematic flowchart of a method of manufacturing a display according to an embodiment of the present invention; FIG.
图8是本发明实施方式的中介基板的结构示意图；8 is a schematic structural view of an interposer substrate according to an embodiment of the present invention;
图9是本发明实施方式的显示器的制造方法的又一个流程示意图；9 is a schematic flow chart showing another method of manufacturing a display according to an embodiment of the present invention;
图10是本发明实施方式的显示器的制造方法的又一个流程示意图；FIG. 10 is still another schematic flowchart of a method of manufacturing a display according to an embodiment of the present invention; FIG.
图11是本发明实施方式的像素发光层的形成示意图；11 is a schematic view showing the formation of a pixel light emitting layer according to an embodiment of the present invention;
图12是本发明实施方式的显示器的制造方法的又一个流程示意图。FIG. 12 is still another flow chart of a method of manufacturing a display according to an embodiment of the present invention.
主要元件符号附图说明：The main component symbol drawing description:
像素基板10、像素发光层12、第二基板14、第二遮光层16、像素区18、第一像素区182、第二像素区184、中介基板200、第一基板220、第一遮光层240、转印区260、第一中介基板270、第二中介基板280、第三中介基板290。The pixel substrate 10, the pixel light emitting layer 12, the second substrate 14, the second light shielding layer 16, the pixel region 18, the first pixel region 182, the second pixel region 184, the interposer substrate 200, the first substrate 220, and the first light shielding layer 240 The transfer region 260, the first interposer substrate 270, the second interposer substrate 280, and the third interposer substrate 290.
具体实施方式Detailed ways
下面详细描述本发明的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。The embodiments of the present invention are described in detail below, and the examples of the embodiments are illustrated in the drawings, wherein the same or similar reference numerals indicate the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the drawings are intended to be illustrative of the invention and are not to be construed as limiting.
在本发明的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本发明的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientations of "post", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, and is merely for the convenience of the description of the present invention and the simplified description, and is not intended to indicate or imply that the device or component referred to has a specific orientation, and is constructed and operated in a specific orientation. Therefore, it should not be construed as limiting the invention. Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" or "second" may include one or more of the described features either explicitly or implicitly. In the description of the present invention, the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接。可以是机械连接，也可以是电连接。可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可 以根据具体情况理解上述术语在本发明中的具体含义。In the description of the present invention, it should be noted that the terms "installation", "connected", and "connected" are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or connected in one piece. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium, which can be the internal communication of two elements or the interaction of two elements. For those of ordinary skill in the art, The specific meanings of the above terms in the present invention are understood on a case-by-case basis.
请一并参阅图1和图2，本发明实施方式的显示器的制造方法用于利用中介基板200在像素基板10上制造像素发光层12。制造方法包括：Referring to FIG. 1 and FIG. 2 together, a method of manufacturing a display according to an embodiment of the present invention is for manufacturing a pixel light-emitting layer 12 on a pixel substrate 10 by using an interposer substrate 200. Manufacturing methods include:
步骤S1：提供中介基板200，中介基板200包括第一基板220和第一遮光层240，第一基板220形成有由第一遮光层240限定的转印区260；Step S1: providing an interposer substrate 200, the interposer substrate 200 includes a first substrate 220 and a first light shielding layer 240, the first substrate 220 is formed with a transfer region 260 defined by the first light shielding layer 240;
步骤S2：在中介基板200上蒸镀发光材料以使发光材料填充转印区260；Step S2: vaporizing the luminescent material on the interposer substrate 200 to fill the transfer region 260 with the luminescent material;
步骤S3：提供像素基板10，像素基板10包括第二基板14和第二遮光层16，第二基板14形成有由第二遮光层16限定的像素区18；Step S3: providing a pixel substrate 10, the pixel substrate 10 includes a second substrate 14 and a second light shielding layer 16, the second substrate 14 is formed with a pixel region 18 defined by the second light shielding layer 16;
步骤S4：将形成有发光材料的中介基板200的一侧贴合至具有像素区18的像素基板10的一侧，转印区260与像素区18相对；和Step S4: attaching one side of the interposer substrate 200 on which the luminescent material is formed to one side of the pixel substrate 10 having the pixel region 18, and the transfer region 260 is opposite to the pixel region 18;
步骤S5：将转印区260中的发光材料转移至像素区18中以形成像素发光层12。Step S5: Transfer the luminescent material in the transfer region 260 into the pixel region 18 to form the pixel luminescent layer 12.
本发明实施方式的显示器的制造方法利用中介基板200在像素基板10上形成像素发光层12，无需使用精细掩膜版，从而可降低蒸镀制程的成本。The method of manufacturing the display according to the embodiment of the present invention forms the pixel light-emitting layer 12 on the pixel substrate 10 by using the interposer substrate 200, eliminating the need for a fine mask, thereby reducing the cost of the vapor deposition process.
可以理解，中介基板200由第一基板220和第一遮光层240形成，由于相关工艺技术比较成熟，中介基板200的成本较低且精准度较高，因此利用中介基板200在像素基板10上制造像素发光层12既能够避免像素基板10上的发光材料的交叉混色，又能够节约在像素基板10上制造像素发光层12的成本。It can be understood that the interposer substrate 200 is formed by the first substrate 220 and the first light shielding layer 240. Since the related process technology is relatively mature, the interposer substrate 200 has low cost and high precision, and thus is fabricated on the pixel substrate 10 by using the interposer substrate 200. The pixel light-emitting layer 12 can avoid the cross-color mixing of the light-emitting materials on the pixel substrate 10, and can save the cost of manufacturing the pixel light-emitting layer 12 on the pixel substrate 10.
在某些实施方式中，第一基板14和第二基板220可以是玻璃基板。In some embodiments, the first substrate 14 and the second substrate 220 can be a glass substrate.
本发明实施方式的像素基板10可以用于显示器上，或者说，显示器可以包括像素基板10。The pixel substrate 10 of the embodiment of the present invention may be used on a display, or the display may include the pixel substrate 10.
请参阅图3，在某些实施方式中，步骤S2包括：Referring to FIG. 3, in some embodiments, step S2 includes:
步骤S22：在第一基板220上和第一遮光层240上蒸镀发光材料以使发光材料填充转印区260。Step S22: fluorinating the luminescent material on the first substrate 220 and the first light shielding layer 240 to fill the transfer region 260 with the luminescent material.
如此，可以快速地在转印区260中填充发光材料。As such, the transfer material 260 can be quickly filled with the luminescent material.
具体地，可以在中介基板200上直接蒸镀发光材料，从而在第一基板220和第一遮光层240上形成发光材料，即在第一遮光层240上和第一基板220的转印区260上同时形成发光材料，这样能够减少不必要的工艺流程，如遮挡第一遮光层240，从而快速地在转印区260中填充发光材料。Specifically, the luminescent material may be directly evaporated on the interposer substrate 200 to form a luminescent material on the first substrate 220 and the first light shielding layer 240, that is, on the first light shielding layer 240 and the transfer region 260 of the first substrate 220. The luminescent material is simultaneously formed thereon, which can reduce unnecessary process flow, such as occluding the first light shielding layer 240, thereby rapidly filling the transfer region 260 with the luminescent material.
请参阅图4，在某些实施方式中，步骤S1包括：Referring to FIG. 4, in some embodiments, step S1 includes:
步骤S12：在第一基板220上形成遮光材料层；和Step S12: forming a light shielding material layer on the first substrate 220; and
步骤S14：利用光刻技术处理遮光材料层以形成第一遮光层240。Step S14: processing the light shielding material layer by a photolithography technique to form the first light shielding layer 240.
如此，可以通过光刻技术快速地获得中介基板200。 As such, the interposer substrate 200 can be quickly obtained by photolithography.
具体地，可以先在第一基板220上形成遮光材料层，比如利用涂布技术在第一基板220上涂上一层遮光材料，再利用光刻技术去除特定部分的遮光材料，保留对应图形的遮光材料以形成第一遮光层240。Specifically, a light shielding material layer may be formed on the first substrate 220, for example, a light shielding material is coated on the first substrate 220 by using a coating technique, and a specific portion of the light shielding material is removed by using a photolithography technique to retain the corresponding graphic. The light shielding material forms a first light shielding layer 240.
请参阅图5，在某些实施方式中，步骤S3包括：Referring to FIG. 5, in some embodiments, step S3 includes:
步骤S32：在第二基板14上形成遮光材料层；和Step S32: forming a light shielding material layer on the second substrate 14; and
步骤S34：利用光刻技术处理遮光材料层以形成第二遮光层16。Step S34: processing the light shielding material layer by a photolithography technique to form the second light shielding layer 16.
如此，可以通过光刻技术快速地获得像素基板10。As such, the pixel substrate 10 can be quickly obtained by photolithography.
具体地，可以先在第二基板14上形成遮光材料层，比如利用涂布技术在第二基板14上涂上一层遮光材料，再利用光刻技术去除特定部分的遮光材料，保留对应图形的遮光材料以形成第二遮光层16。Specifically, a light shielding material layer may be formed on the second substrate 14 first, for example, a light shielding material is coated on the second substrate 14 by a coating technique, and a specific portion of the light shielding material is removed by photolithography to retain the corresponding graphic. The light shielding material is formed to form the second light shielding layer 16.
在某些实施方式中，遮光材料层的材料为光刻胶。In some embodiments, the material of the light shielding material layer is a photoresist.
如此，可以充分利用光刻胶的特点形成遮光材料层。In this way, the light shielding material layer can be formed by fully utilizing the characteristics of the photoresist.
具体地，光刻胶是指由感光树脂、增感剂和溶剂三种主要成分组成的对光敏感的混合液体，感光树脂经光照后，能够很快地发生光固化反应，即光刻胶从液体形态变成固体形态，从而形成遮光材料层。此外，利用光刻胶的物理性能，比如溶解性和亲和性等，经光刻技术(如采用适当的溶剂进行处理)去除特定部分可得到第一遮光层240和第二遮光层16。Specifically, the photoresist refers to a light-sensitive mixed liquid composed of three main components of a photosensitive resin, a sensitizer and a solvent. After the photosensitive resin is irradiated, the photocuring reaction can be quickly performed, that is, the photoresist is from the photoresist. The liquid form becomes a solid form, thereby forming a layer of light shielding material. In addition, the first light shielding layer 240 and the second light shielding layer 16 can be obtained by removing specific portions by photolithography techniques (such as treatment with a suitable solvent) using physical properties of the photoresist, such as solubility and affinity.
请参阅图6，在某些实施方式中，在将转印区260的发光材料转移至像素区18后且第二遮光层16残留有发光材料时，制造方法包括：Referring to FIG. 6 , in some embodiments, after transferring the luminescent material of the transfer region 260 to the pixel region 18 and the second light shielding layer 16 remains with the luminescent material, the manufacturing method includes:
步骤S6：去除第二遮光层16上的发光材料。Step S6: removing the luminescent material on the second light shielding layer 16.
如此，可以去除第二遮光层16上残留的发光材料，进而可减少像素基板10的整体厚度。In this way, the luminescent material remaining on the second light shielding layer 16 can be removed, and the overall thickness of the pixel substrate 10 can be reduced.
可以理解，像素基板10在形成过程中，只需要在像素区18中形成发光材料以获得像素发光层12，在第二遮光层16上无需形成发光材料，但是发光材料由转印区260转移至像素区18时，可能会将部分发光材料转移到第二遮光层16上，因此可以在将转印区260的发光材料转移至像素区18后且第二遮光层16残留有发光材料时，去除第二遮光层16上的发光材料以方便后续的工艺流程并且降低像素基板10的整体厚度。It can be understood that, in the formation process of the pixel substrate 10, only the luminescent material needs to be formed in the pixel region 18 to obtain the pixel luminescent layer 12, and the luminescent material is not required to be formed on the second opaque layer 16, but the luminescent material is transferred from the transfer region 260 to In the pixel region 18, part of the luminescent material may be transferred to the second light shielding layer 16, so that the luminescent material of the transfer region 260 may be removed after the luminescent material is transferred to the pixel region 18 and the luminescent material remains in the second light shielding layer 16. The luminescent material on the second light shielding layer 16 facilitates the subsequent process flow and reduces the overall thickness of the pixel substrate 10.
在某些实施方式中，转印区260的面积大于或等于像素区18的面积。In some embodiments, the area of transfer region 260 is greater than or equal to the area of pixel region 18.
如此，保证了转印区260中的发光材料能够在像素区18中形成均匀的像素发光层12。As such, it is ensured that the luminescent material in the transfer region 260 is capable of forming a uniform pixel luminescent layer 12 in the pixel region 18.
具体地，在将转印区260中的发光材料转移到像素区18时，转印区260和像素区18相对，在转印区260的面积小于像素区18时，转印区260中的发光材料会较为集中地转移到像素区18中的对应区部分，像素区18中的其他区部分可能没有发光材料或形成较薄的 一层发光材料，从而影响像素发光层12的正常工作；在转印区260的面积大于或等于像素区18时，转印区260中的发光材料能够覆盖整个像素区18，从而确保发光材料能够在像素区18中形成较均匀的像素发光层12。Specifically, when the luminescent material in the transfer region 260 is transferred to the pixel region 18, the transfer region 260 and the pixel region 18 are opposed, and when the area of the transfer region 260 is smaller than the pixel region 18, the light in the transfer region 260 The material may be transferred more concentratedly to the corresponding portion of the pixel region 18, and other portions of the pixel region 18 may be free of luminescent material or formed thinner. a layer of luminescent material to affect the normal operation of the pixel luminescent layer 12; when the area of the transfer region 260 is greater than or equal to the pixel region 18, the luminescent material in the transfer region 260 can cover the entire pixel region 18, thereby ensuring that the luminescent material can A more uniform pixel luminescent layer 12 is formed in the pixel region 18.
在某些实施方式中，发光材料包括红色发光材料、绿色发光材料或蓝色发光材料。In certain embodiments, the luminescent material comprises a red luminescent material, a green luminescent material, or a blue luminescent material.
如此，可以利用多种发光材料形成的像素基板10来获得全彩的显示器。As such, the pixel substrate 10 formed of a plurality of luminescent materials can be utilized to obtain a full color display.
具体地，利用色光三原色：红色、绿色、蓝色，可以使得显示器获得全彩的图像，显示器通过调节不同的红色光、绿色光和蓝色光的配比可以显示不同的颜色，比如等量的红色光、绿色光和蓝色光混合之后获得白色光。因此，可以在像素基板10上形成多种发光材料，从而利用像素基板10形成全彩的显示器。Specifically, using the three primary colors of color light: red, green, and blue, the display can obtain a full-color image, and the display can display different colors by adjusting different ratios of red light, green light, and blue light, such as an equal amount of red. White light is obtained after mixing light, green light and blue light. Therefore, a plurality of luminescent materials can be formed on the pixel substrate 10, thereby forming a full-color display using the pixel substrate 10.
请一并参阅图7和图8，在某些实施方式中，步骤S1包括：Referring to FIG. 7 and FIG. 8 together, in some embodiments, step S1 includes:
步骤S16：提供第一中介基板270、第二中介基板280和第三中介基板290，第一中介基板270、第二中介基板280和第三中介基板290均包括第一基板220、第一遮光层240和转印区260。Step S16: providing a first interposer substrate 270, a second interposer substrate 280, and a third interposer substrate 290. The first interposer substrate 270, the second interposer substrate 280, and the third interposer substrate 290 each include a first substrate 220 and a first light shielding layer. 240 and transfer zone 260.
步骤S2包括：Step S2 includes:
步骤S24：在第一中介基板270的转印区260填充红色发光材料，在第二中介基板280的转印区260填充绿色发光材料，在第三中介基板290的转印区260填充蓝色发光材料；Step S24: filling the red luminescent material in the transfer region 260 of the first interposer substrate 270, filling the green luminescent material in the transfer region 260 of the second interposer substrate 280, and filling the blue illuminating region in the transfer region 260 of the third interposer substrate 290 material;
步骤S4包括：Step S4 includes:
步骤S42：将形成有红色发光材料的第一中介基板270的一侧、形成有绿色发光材料的第二中介基板280的一侧和形成有蓝色发光材料的第三中介基板290的一侧按预设顺序分别贴合至具有像素区18的像素基板10的一侧，转印区260和像素区18相对；Step S42: pressing one side of the first interposer substrate 270 on which the red luminescent material is formed, one side of the second interposer substrate 280 on which the green luminescent material is formed, and the side on the third interposer substrate 290 on which the blue luminescent material is formed are pressed. The preset order is respectively attached to one side of the pixel substrate 10 having the pixel area 18, and the transfer area 260 and the pixel area 18 are opposite;
步骤S5包括：Step S5 includes:
步骤S52：将红色发光材料、绿色发光材料和蓝色发光材料分别转移至不同的像素区18。Step S52: Transfer the red luminescent material, the green luminescent material and the blue luminescent material to different pixel regions 18, respectively.
如此，可以在像素基板10上的不同像素区18中形成多种发光材料。As such, a plurality of luminescent materials can be formed in different pixel regions 18 on the pixel substrate 10.
具体地，首先可以提供第一中介基板270、第二中介基板280和第三中介基板290，其中可以在第一中介基板270的转印区260填充红色发光材料，在第二中介基板280的转印区260填充绿色发光材料，在第三中介基板290的转印区260填充蓝色发光材料，再将三个中介基板200按预设顺序分别贴合至具有像素区18的像素基板10的一侧，预设顺序可以是红、绿、蓝的任意排序，比如先将形成有红色发光材料的第一中介基板270的一侧贴合至具有像素区18的像素基板10的一侧，并将红色发光材料从第一中介基板270的转印区260转移至相对的像素区18中；再将形成有绿色发光材料的第二中介基板280的一侧贴合至具有像素区18的像素基板10的一侧，并将绿色发光材料从第二中介基板280的转印 区260转移至相对的像素区18中；最后将形成有蓝色发光材料的第三中介基板290的一侧贴合至具有像素区18的像素基板10的一侧，并将蓝色发光材料从第三中介基板290的转印区260转移至相对的像素区18中。可以理解，在其他实施方式中，预设顺序也可以是蓝色、绿色、红色等其他顺序，在此不做具体限定。Specifically, first, the first interposer substrate 270, the second interposer substrate 280, and the third interposer substrate 290 may be provided, wherein the red luminescent material may be filled in the transfer region 260 of the first interposer substrate 270, and the second interposer substrate 280 may be rotated. The printing area 260 is filled with a green luminescent material, the blue luminescent material is filled in the transfer area 260 of the third interposer 290, and the three interposer substrates 200 are respectively attached to the pixel substrate 10 having the pixel area 18 in a predetermined order. On the side, the preset order may be any order of red, green, and blue. For example, one side of the first interposer substrate 270 on which the red luminescent material is formed is first attached to one side of the pixel substrate 10 having the pixel region 18, and The red luminescent material is transferred from the transfer region 260 of the first interposer substrate 270 to the opposite pixel region 18; one side of the second interposer substrate 280 on which the green luminescent material is formed is attached to the pixel substrate 10 having the pixel region 18 One side and transfer of the green luminescent material from the second interposer substrate 280 The region 260 is transferred to the opposite pixel region 18; finally, one side of the third interposer substrate 290 on which the blue luminescent material is formed is attached to one side of the pixel substrate 10 having the pixel region 18, and the blue luminescent material is removed from The transfer region 260 of the third interposer substrate 290 is transferred into the opposite pixel region 18. It can be understood that in other embodiments, the preset order may also be other orders such as blue, green, red, etc., and is not specifically limited herein.
请参阅图9，在某些实施方式中，步骤S5包括：Referring to FIG. 9, in some embodiments, step S5 includes:
步骤S54：利用激光处理中介基板200的另一侧以将转印区260中的发光材料转移至像素区18，中介基板200的另一侧与具有转印区260的中介基板200的一侧相背。Step S54: The other side of the interposer substrate 200 is processed by laser to transfer the luminescent material in the transfer region 260 to the pixel region 18, and the other side of the interposer substrate 200 is on the side of the interposer substrate 200 having the transfer region 260. Back.
如此，可以利用激光将中介基板200的转印区260中的发光材料转移至像素区18中。As such, the luminescent material in the transfer region 260 of the interposer substrate 200 can be transferred into the pixel region 18 by means of a laser.
具体地，先将具有转印区260的中介基板200的一侧贴合至具有像素区18的像素基板10的一侧，再利用激光处理中介基板200的另一侧，其中中介基板200的另一侧与具有转印区260的中介基板200的一侧相背，激光可将转印区260中的发光材料剥离出来，使发光材料可以进入与转印区260相对的像素区18中。此外，由于中介基板200的第一遮光层240的遮光作用，能够避免第一遮光层240上的发光材料(若有)剥离出来，从而避免除了与转印区260相对的像素区18外的其他像素区18进入发光材料。Specifically, one side of the interposer substrate 200 having the transfer region 260 is first attached to one side of the pixel substrate 10 having the pixel region 18, and the other side of the interposer substrate 200 is processed by laser processing, wherein the interposer substrate 200 is further One side is opposite the side of the interposer substrate 200 having the transfer region 260, and the laser light can peel off the luminescent material in the transfer region 260 so that the luminescent material can enter the pixel region 18 opposite to the transfer region 260. In addition, due to the light shielding effect of the first light shielding layer 240 of the interposer substrate 200, the luminescent material (if any) on the first light shielding layer 240 can be prevented from being peeled off, thereby avoiding other than the pixel region 18 opposite to the transfer region 260. The pixel region 18 enters the luminescent material.
请一并参阅图10和图11，在某些实施方式中，像素区18包括当前需填充的第一像素区182，步骤S4包括：Referring to FIG. 10 and FIG. 11 together, in some embodiments, the pixel area 18 includes a first pixel area 182 that is currently to be filled, and step S4 includes:
步骤S44：将转印区260相对第一像素区182贴合。Step S44: the transfer region 260 is attached to the first pixel region 182.
如此，可以在当前需填充的第一像素区182中填充发光材料以形成像素发光层12。As such, the luminescent material may be filled in the first pixel region 182 that is currently to be filled to form the pixel luminescent layer 12.
具体地，由于像素区18可能需要不同的发光材料，如红色发光材料、绿色发光材料和蓝色发光材料等，因此在像素发光层12的形成过程中，只需要在当前需填充的第一像素区182中填充发光材料，将转印区260相对第一像素区182贴合能够将转印区260中的发光材料转移到第一像素区182中。In particular, since the pixel region 18 may require different luminescent materials, such as a red luminescent material, a green luminescent material, and a blue luminescent material, in the formation process of the pixel luminescent layer 12, only the first pixel currently required to be filled is needed. Filling the luminescent material in region 182, bonding transfer region 260 to first pixel region 182 can transfer luminescent material in transfer region 260 into first pixel region 182.
请一并参阅图11和图12，在某些实施方式中，像素区18包括待填充的第二像素区184，步骤S4包括：Referring to FIG. 11 and FIG. 12 together, in some embodiments, the pixel area 18 includes a second pixel area 184 to be filled, and step S4 includes:
步骤S46：将第一遮光层240相对第二像素区184贴合。Step S46: bonding the first light shielding layer 240 to the second pixel region 184.
如此，可以避免发光材料进入待填充的第二像素区184。In this way, the luminescent material can be prevented from entering the second pixel region 184 to be filled.
具体地，待填充的第二像素区184是指除了当前需填充的第一像素区182外的其他像素区18，由于像素区18可能需要不同的发光材料，如红色发光材料、绿色发光材料和蓝色发光材料等，因此在像素发光层12的形成过程中，只需要在当前需填充的第一像素区182中填充发光材料，为了避免交叉混色，即避免不同色彩的发光材料进入同一像素区18中，可以利用第一遮光层240来遮挡待填充的第二像素区184，从而避免转印区260中的发光材料进入待填充的第二像素区184中。 Specifically, the second pixel region 184 to be filled refers to other pixel regions 18 other than the first pixel region 182 currently to be filled, since the pixel region 18 may require different luminescent materials, such as red luminescent materials, green luminescent materials, and The blue luminescent material or the like, so in the formation process of the pixel luminescent layer 12, only the luminescent material needs to be filled in the first pixel region 182 currently filled, in order to avoid cross color mixing, that is, to avoid luminescent materials of different colors entering the same pixel region. In the 18th, the first light shielding layer 240 may be utilized to block the second pixel region 184 to be filled, thereby preventing the luminescent material in the transfer region 260 from entering the second pixel region 184 to be filled.
本发明实施方式的第二像素区184相对第一遮光层240贴合，可以理解，为了避免交叉混色，只要避免第二像素区184相对转印区260设置即可。在其他实施方式中，第二像素区184可以悬空。The second pixel region 184 of the embodiment of the present invention is attached to the first light shielding layer 240. It can be understood that in order to avoid cross color mixing, it is only necessary to prevent the second pixel region 184 from being disposed relative to the transfer region 260. In other embodiments, the second pixel region 184 can be left floating.
在本发明中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。In the present invention, the first feature "on" or "under" the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them. Moreover, the first feature "above", "above" and "above" the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature includes the first feature directly below and below the second feature, or merely the first feature level being less than the second feature.
下文的公开提供了许多不同的实施方式或例子用来实现本发明的不同结构。为了简化本发明的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本发明。此外，本发明可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本发明提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and arrangements of the specific examples are described below. Of course, they are merely examples and are not intended to limit the invention. In addition, the present invention may be repeated with reference to the numerals and/or reference numerals in the various examples, which are for the purpose of simplicity and clarity, and do not indicate the relationship between the various embodiments and/or arrangements discussed. Moreover, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the use of other processes and/or the use of other materials.
在本说明书的描述中，参考术语“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”等的描述意指结合实施方式或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。In the description of the present specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example", or "some examples", etc. Particular features, structures, materials or features described in the examples are included in at least one embodiment or example of the invention. In the present specification, the schematic representation of the above terms does not necessarily mean the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.
尽管已经示出和描述了本发明的实施方式，本领域的普通技术人员可以理解：在不脱离本发明的原理和宗旨的情况下可以对这些实施方式进行多种变化、修改、替换和变型，本发明的范围由权利要求及其等同物限定。 While the embodiments of the present invention have been shown and described, the embodiments of the invention may The scope of the invention is defined by the claims and their equivalents.

Claims (12)

  1. 一种显示器的制造方法，用于利用中介基板在像素基板上制造像素发光层，其特征在于，所述制造方法包括：A manufacturing method of a display for manufacturing a pixel light-emitting layer on a pixel substrate by using an interposer substrate, wherein the manufacturing method comprises:
    提供所述中介基板，所述中介基板包括第一基板和第一遮光层，所述第一基板形成有由所述第一遮光层限定的转印区；Providing the interposer substrate, the interposer substrate includes a first substrate and a first light shielding layer, and the first substrate is formed with a transfer region defined by the first light shielding layer;
    在所述中介基板上蒸镀发光材料以使所述发光材料填充所述转印区；Depositing a luminescent material on the interposer substrate to fill the transfer region with the luminescent material;
    提供所述像素基板，所述像素基板包括第二基板和第二遮光层，所述第二基板形成有由所述第二遮光层限定的像素区；Providing the pixel substrate, the pixel substrate includes a second substrate and a second light shielding layer, and the second substrate is formed with a pixel region defined by the second light shielding layer;
    将形成有所述发光材料的所述中介基板的一侧贴合至具有所述像素区的所述像素基板的一侧，所述转印区与所述像素区相对；和One side of the interposer substrate on which the luminescent material is formed is attached to one side of the pixel substrate having the pixel region, the transfer region being opposite to the pixel region;
    将所述转印区中的所述发光材料转移至所述像素区中以形成所述像素发光层。The luminescent material in the transfer zone is transferred into the pixel region to form the pixel luminescent layer.
  2. 如权利要求1所述的制造方法，其特征在于，所述在所述中介基板上蒸镀发光材料以使所述发光材料填充所述转印区包括：The manufacturing method according to claim 1, wherein the depositing the luminescent material on the interposer substrate to fill the transfer region with the luminescent material comprises:
    在所述第一基板上和所述第一遮光层上蒸镀所述发光材料以使所述发光材料填充所述转印区。Depositing the luminescent material on the first substrate and the first light shielding layer to fill the transfer region with the luminescent material.
  3. 如权利要求1所述的制造方法，其特征在于，所述提供所述中介基板包括：The manufacturing method according to claim 1, wherein the providing the interposer comprises:
    在所述第一基板上形成遮光材料层；和Forming a light shielding material layer on the first substrate; and
    利用光刻技术处理所述遮光材料层以形成所述第一遮光层。The light shielding material layer is processed using a photolithography technique to form the first light shielding layer.
  4. 如权利要求1所述的制造方法，其特征在于，所述提供所述像素基板包括：The method of claim 1 , wherein the providing the pixel substrate comprises:
    在所述第二基板上形成遮光材料层；和Forming a light shielding material layer on the second substrate; and
    利用光刻技术处理所述遮光材料层以形成所述第二遮光层。The light shielding material layer is processed using a photolithography technique to form the second light shielding layer.
  5. 如权利要求3或4所述的制造方法，其特征在于，所述遮光材料层的材料为光刻胶。The method according to claim 3 or 4, wherein the material of the light shielding material layer is a photoresist.
  6. 如权利要求1所述的制造方法，其特征在于，在将所述转印区的所述发光材料转移至所述像素区后且所述第二遮光层残留有所述发光材料时，所述制造方法包括：The manufacturing method according to claim 1, wherein after said luminescent material of said transfer region is transferred to said pixel region and said second opaque layer remains said luminescent material, said Manufacturing methods include:
    去除所述第二遮光层上的所述发光材料。Removing the luminescent material on the second light shielding layer.
  7. 如权利要求1所述的制造方法，其特征在于，所述转印区的面积大于或等于所述像素区的面积。The manufacturing method according to claim 1, wherein an area of said transfer area is greater than or equal to an area of said pixel area.
  8. 如权利要求1所述的制造方法，其特征在于，所述发光材料包括红色发光材料、绿色发光材料或蓝色发光材料。The manufacturing method according to claim 1, wherein the luminescent material comprises a red luminescent material, a green luminescent material, or a blue luminescent material.
  9. 如权利要求8所述的制造方法，其特征在于，所述提供所述中介基板包括：The manufacturing method according to claim 8, wherein the providing the interposer comprises:
    提供第一中介基板、第二中介基板和第三中介基板，所述第一中介基板、所述第二中介基板和所述第三中介基板均包括所述第一基板、所述第一遮光层和所述转印区。 Providing a first interposer, a second interposer, and a third interposer, wherein the first interposer, the second interposer, and the third interposer each include the first substrate and the first light shielding layer And the transfer zone.
    所述在所述中介基板上蒸镀发光材料以使所述发光材料填充所述转印区包括：The vaporizing the luminescent material on the interposer substrate to fill the transfer region with the luminescent material comprises:
    在所述第一中介基板的转印区填充所述红色发光材料，在所述第二中介基板的转印区填充所述绿色发光材料，在所述第三中介基板的转印区填充所述蓝色发光材料；Filling the red luminescent material in a transfer region of the first interposer, filling the green luminescent material in a transfer region of the second interposer, filling the transfer region in the third interposer Blue luminescent material;
    所述将形成有所述发光材料的所述中介基板的一侧贴合至具有所述像素区的所述像素基板的一侧包括：Attaching one side of the interposer substrate on which the luminescent material is formed to one side of the pixel substrate having the pixel region includes:
    将形成有所述红色发光材料的所述第一中介基板的一侧、形成有所述绿色发光材料的所述第二中介基板的一侧和形成有所述蓝色发光材料的所述第三中介基板的一侧按预设顺序分别贴合至具有所述像素区的所述像素基板的一侧，所述转印区和所述像素区相对；One side of the first interposer on which the red luminescent material is formed, one side of the second interposer on which the green luminescent material is formed, and the third side on which the blue luminescent material is formed One side of the interposer substrate is respectively attached to one side of the pixel substrate having the pixel area in a predetermined order, and the transfer area is opposite to the pixel area;
    所述将所述转印区中的所述发光材料转移至所述像素区中以形成所述像素发光层包括：Transferring the luminescent material in the transfer region into the pixel region to form the pixel luminescent layer comprises:
    将所述红色发光材料、所述绿色发光材料和所述蓝色发光材料分别转移至不同的所述像素区。The red luminescent material, the green luminescent material, and the blue luminescent material are respectively transferred to different pixel regions.
  10. 如权利要求1所述的制造方法，其特征在于，所述将所述转印区中的所述发光材料转移至所述像素区中以形成所述像素发光层包括：The method according to claim 1, wherein the transferring the luminescent material in the transfer region into the pixel region to form the pixel luminescent layer comprises:
    利用激光处理所述中介基板的另一侧以将所述转印区中的所述发光材料转移至所述像素区，所述中介基板的另一侧与具有所述转印区的所述中介基板的一侧相背。Processing the other side of the interposer substrate with a laser to transfer the luminescent material in the transfer region to the pixel region, the other side of the interposer substrate and the interposer having the transfer region One side of the substrate is opposite.
  11. 如权利要求1所述的制造方法，其特征在于，所述像素区包括当前需填充的第一像素区，所述将形成有所述发光材料的所述中介基板的一侧贴合至具有所述像素区的所述像素基板的一侧，所述转印区与所述像素区相对包括：The manufacturing method according to claim 1, wherein the pixel region includes a first pixel region to be filled currently, and one side of the interposer substrate on which the luminescent material is formed is attached to have a a side of the pixel substrate of the pixel region, the transfer region and the pixel region are opposite to each other:
    将所述转印区相对所述第一像素区贴合。The transfer area is attached to the first pixel area.
  12. 如权利要求1所述的制造方法，其特征在于，所述像素区包括待填充的第二像素区，所述将形成有所述发光材料的所述中介基板的一侧贴合至具有所述像素区的所述像素基板的一侧，所述转印区与所述像素区相对包括：The manufacturing method according to claim 1, wherein the pixel region includes a second pixel region to be filled, and one side of the interposer substrate on which the luminescent material is formed is attached to have the a side of the pixel substrate of the pixel region, the transfer region and the pixel region are opposite to each other:
    将所述第一遮光层相对所述第二像素区贴合。 The first light shielding layer is attached to the second pixel region.
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