WO2018232792A1 - 显示面板 - Google Patents
显示面板 Download PDFInfo
- Publication number
- WO2018232792A1 WO2018232792A1 PCT/CN2017/092356 CN2017092356W WO2018232792A1 WO 2018232792 A1 WO2018232792 A1 WO 2018232792A1 CN 2017092356 W CN2017092356 W CN 2017092356W WO 2018232792 A1 WO2018232792 A1 WO 2018232792A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- flexible substrate
- substrate
- array
- display panel
- package
- Prior art date
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- 239000000758 substrate Substances 0.000 claims abstract description 192
- 238000005452 bending Methods 0.000 claims abstract description 63
- 239000002184 metal Substances 0.000 claims abstract description 60
- 239000011521 glass Substances 0.000 claims abstract description 45
- 238000003698 laser cutting Methods 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 abstract 2
- 238000012856 packing Methods 0.000 abstract 2
- 229920001621 AMOLED Polymers 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
Definitions
- the present invention relates to an organic light emitting device technology, and more particularly to a display panel for an active matrix organic light emitting diode.
- AMOLED Active-matrix organic light emitting diode
- Light-emitting diode display panel technology is more suitable for ultra-narrow bezel design. How to minimize the frame of the display panel has become the research direction in the industry.
- the present invention provides a display panel that enables the display panel to achieve an ultra-narrow bezel architecture.
- the present invention provides a display panel having a display area and a package area disposed outside the display area, the display panel including an array substrate, the array substrate including a glass substrate, and a flexible substrate disposed on the glass substrate a scan line and a data line disposed on the flexible substrate, wherein the outer side of the at least one package area of the flexible substrate is provided with a bending area extending outside the package area, and the flexible substrate is disposed in the bending area for the array A scan line of the substrate and a metal line array connected to the row drive and the column drive chip, the bend region being bent toward a side of the flexible substrate facing away from the scan line.
- the metal line array includes a row metal line and a column metal line, and the row metal line connects the scan line of the array substrate with the row driving chip, and the column metal line connects the data line of the array substrate with the column driving chip.
- the array substrate further includes a flexible buffer layer disposed on the flexible substrate, the flexible buffer layer covering the metal lines, and the scan lines and the data lines are disposed on the flexible buffer layer.
- the row metal lines and the column metal lines are disposed on the same layer.
- the portion of the glass substrate on the glass substrate at the bending region is laser cut After the cutting, it is peeled off from the flexible substrate, and the bending region is bent toward the side of the flexible substrate facing away from the scanning line and is bonded to the corresponding side of the glass substrate.
- the glass substrate is completely peeled off from the flexible substrate by laser stripping, and the bending region is bent toward a side surface of the flexible substrate facing away from the scanning line and adhered to a surface of the flexible substrate facing away from the scanning line.
- the outer side of the lower package area of the flexible substrate is provided with a bending area extending outside the package area.
- the left and right sides of the flexible substrate and the lower package are provided with a bending region extending outside the package region, and the metal wire array on the left and right bending regions of the flexible substrate is used for the array substrate
- the scan lines are connected to the row driver chip, and the metal line array on the lower side bend region of the flexible substrate is used to connect the data lines of the array substrate to the column driver chips.
- the display panel further includes a color filter substrate, and the color filter substrate is disposed opposite to the array substrate.
- the present invention provides a flexible substrate on a glass substrate, and a bending region having a metal wire array is disposed on the flexible substrate, so that the metal wire array is bent and hidden on the side of the glass substrate or
- the flexible substrate faces away from one side of the scan line, thereby reducing the width of the package area and minimizing the size of the frame.
- 1-1 is a schematic structural view of the first embodiment of the present invention after bending
- 1-2 is a schematic view of a glass substrate in a bending zone before cutting according to Embodiment 1 of the present invention
- 1-3 is a schematic view showing the glass substrate in the bending zone after cutting in the first embodiment of the present invention
- Embodiment 1 of the present invention are schematic views showing the development of Embodiment 1 of the present invention.
- FIG. 1-5 are schematic structural views of a bending zone in the array plate of the present invention.
- 2-2 is a schematic view of the second embodiment of the present invention before the glass substrate is peeled off;
- 2-3 is a schematic view showing the peeling of the glass substrate in the second embodiment of the present invention.
- Embodiment 2 of the present invention is a schematic exploded view of Embodiment 2 of the present invention.
- 3-1 is a schematic structural view of a third embodiment of the present invention after bending
- 3-3 is a schematic view showing the glass substrate after cutting according to Embodiment 3 of the present invention.
- Embodiment 3-4 is a schematic exploded view of Embodiment 3 of the present invention.
- 4-1 is a schematic structural view of the fourth embodiment of the present invention after bending
- 4-2 is a schematic view of the fourth embodiment of the present invention before the glass substrate is peeled off;
- 4-3 is a schematic view showing the peeling of the glass substrate in the fourth embodiment of the present invention.
- Embodiment 4-4 is a schematic exploded view of Embodiment 4 of the present invention.
- the improvement of the array substrate in the display panel of the present invention is only that the flexible substrate, the metal line array and the flexible buffer layer are added, and the structure such as the scan line, the data line, the active layer, the source and the drain are not changed.
- the unmodified portions are not described herein, and the present invention is applicable to AMOLED display panels, especially AMOLED top emission architectures.
- a display panel of the present invention has a display area AA and a package area NA disposed outside the display area, and the display panel includes an array substrate 1, and the array substrate 1 is at least
- the display device layer includes a glass substrate 6, a flexible substrate 4 disposed on the glass substrate 6, a scan line 8 disposed on the flexible substrate 4, and a data line 9. The outer side of at least one side of the flexible substrate 4 is extended to the package.
- the bending region 3 outside the region is provided on the flexible substrate 4 in the bending region 3, and is provided with a wire array 5 for connecting the scanning line 8 of the array substrate 1 and the data line 9 with the row driving and column driving chips, and bending
- the region 3 is bent toward the side of the flexible substrate 4 facing away from the scanning line 8, thereby achieving a reduction in the width of the package, such that the metal wire array 5 is transferred to the side of the glass substrate 6 or the side of the flexible substrate 4 facing away from the scanning line 8. surface.
- the color filter substrate 2 disposed oppositely is disposed on the array substrate 1, and the color filter substrate 2 may be a filter structure having RGB color resistance.
- a flexible buffer layer 7 is provided on the flexible substrate 4 for filling the flexible substrate. 4, the flexible buffer layer 7 covers the metal line 5, the scan line 8 and the data line 9 are disposed on the flexible buffer layer 7, here, it should be noted that the scan line 8, the data line 9, the gate insulating layer 12, Active layer 13, source drain (not shown), semiconductor layer (not shown), anode (not shown), organic light-emitting layer (not shown), cathode (in the figure)
- the display device layer 14 is implemented according to the prior art fabrication method and structure, and is not specifically limited herein. Only the metal wire array 5 and the scan line 8 and the data line 9 need to be connected by overlapping or the like. Just fine.
- the metal wire array 5 includes a row metal wire 10 and a column metal wire 11, and the row metal wire 10 connects the scan line 8 of the array substrate 1 with the row driving chip, and the column metal wire 11 connects the array substrate.
- the data line 9 of 1 is connected to the column driver chip; the row metal line 10 and the column metal line 11 are disposed on the same layer.
- the area of the glass substrate 6 is equal to the area of the flexible substrate 4 in the preparation stage, and the flexibility is flexible.
- the substrate 4 includes a display area, a package area, and a bending area 3.
- the bending area 3 is disposed outside the lower package area of the flexible substrate 4 and extends outward to the outside of the package area, and the row metal lines 10 and the column metal lines 11 are disposed.
- the row metal line 10 connects the scanning line 8 of the array substrate 1 with the row driving chip
- the column metal line 11 connects the data line 9 of the array substrate 1 with the column driving chip
- display on the display panel A cover plate or film 15 is disposed on the display surface of the display panel on the display area and the package area for protection; after the display panel is completely prepared, the glass substrate of the glass substrate 6 located in the bending area 3 is laser-cut ( As shown in FIG. 1-2, after the excess glass substrate (shown in FIGS. 1-3) of the bending zone 3 is cut off, the bending zone 3 is bent, and the bending zone 3 faces away from the scanning line 8 toward the flexible substrate 4. One side surface is bent, and finally the side edges corresponding to the glass substrate 6 are bonded.
- the area of the glass substrate 6 is equal to the area of the flexible substrate 4 in the preparation stage, and the flexibility is flexible.
- the substrate 4 includes a display area, a package area, and a bending area 3.
- the bending area 3 is disposed outside the lower package area of the flexible substrate 4 and extends outward to the outside of the package area, and the row metal lines 10 and the column metal lines 11 are disposed.
- the row metal lines 10 connect the scanning lines 8 of the array substrate 1 to the row driving chips, and the column metal lines 11 will be arrayed.
- the data line 9 of the substrate 1 is connected to the column driver chip; a cover plate or film 15 is disposed on the display surface of the display panel on the display area of the display panel and the package area for protection; when the display panel is completely prepared, The glass substrate 6 is completely peeled off from the flexible substrate 4 by laser peeling (shown in FIG. 2-2), and after the glass substrate 6 (shown in FIG. 2-3) is peeled off, the bending region 3 is bent and bent. The region 3 is bent toward the side surface of the flexible substrate 4 facing away from the scanning line 8, and finally conforms to the side surface of the flexible substrate 4 facing away from the scanning line 8.
- the area of the glass substrate 6 is equal to the area of the flexible substrate 4 in the preparation stage, and the flexibility is flexible.
- the substrate 4 includes a display area and a package area. The left and right sides of the flexible substrate 4 and the lower side package are provided with a bending area 3 extending outside the package area.
- the row metal wires 10 are bent on the left and right sides of the flexible substrate 4.
- the scan line 8 of the array substrate 1 is connected to the row driving chip, and the column metal line 11 is disposed on the lower side bending area 3 of the flexible substrate 4 for driving the data line 9 and the column of the array substrate 1.
- a cover plate or film 15 is disposed on the display surface of the display panel on the display area of the display panel and the package area for protection; when the display panel is completely prepared, the glass substrate 6 is located in the bending zone 3 and The glass substrate at the two corners of the package area is laser-cut (shown in Figure 3-2), and then the glass substrate located at the bending zone 3 is laser-cut (shown in Figure 3-3).
- the folding area 3 is bent, and the bending area 3 is bent toward the side of the flexible substrate 4 facing away from the scanning line 8, and finally The side edges corresponding to the glass substrate 6 are bonded together.
- the area of the glass substrate 6 is equal to the area of the flexible substrate 4 in the preparation stage, and the flexibility is as follows.
- the substrate 4 includes a display area and a package area.
- the left and right sides of the flexible substrate 4 and the lower side package are provided with a bending area 3 extending outside the package area.
- the row metal wires 10 are bent on the left and right sides of the flexible substrate 4.
- the scan line 8 of the array substrate 1 is connected to the row driving chip, and the column metal line 11 is disposed on the lower side bending area 3 of the flexible substrate 4 for driving the data line 9 and the column of the array substrate 1.
- a cover plate or film 15 is disposed on the display surface of the display panel on the display surface of the display panel and the package area for protection; after the display panel is completely prepared, the glass substrate 6 is stripped by laser
- the flexible substrate 4 is peeled off (shown in FIG. 4-2), and after the glass substrate 6 and the flexible substrate 4 are completely peeled off (shown in FIG. 4-3), the bending region 3 is bent, and the bending region 3 is directed toward the flexible substrate 4.
- the surface facing away from the scanning line 8 is bent and finally conforms to the surface of the flexible substrate 4 facing away from the scanning line 8. .
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
一种显示面板,具有显示区以及设于显示区外侧的封装区,还包括阵列基板(1),阵列基板(1)包括玻璃基板(6)、设置在玻璃基板(6)上的柔性基底(4)、设于柔性基底(4)上的扫描线(8)、数据线(9),柔性基底(4)的至少一侧封装区外侧设有延伸至封装区外的弯折区(3),在柔性基底(4)上位于弯折区(3)中设有用于将阵列基板(1)的扫描线(8)以及数据线(9)与行驱动和列驱动芯片连接的金属线阵列(5),弯折区(3)朝柔性基底(4)背离扫描线(8)的一侧表面弯折。与现有技术相比,通过在玻璃基板(6)上设置柔性基底(4),在柔性基底(4)上设置具有金属线阵列(5)的弯折区(3),实现将金属线阵列(5)通过弯折使其藏于玻璃基板(6)的侧边或柔性基底(4)背离扫描线的一侧表面上,从而减少封装区的宽度,最大限度的降低边框的尺寸。
Description
本发明涉及一种有机发光器件技术,特别是一种用于有源矩阵有机发光二极管的显示面板。
随着显示技术的不断发展,人们对超窄边框显示屏的需求越来越强烈,相比于LCD(Liquid Crystal Display,液晶显示)面板,AMOLED(Active-matrix organic light emitting diode,有源矩阵有机发光二极管)显示面板技术对于超窄边框设计更加适合,如何能够最大限度的减小显示面板的边框,成为目前行业中努力研究的方向。
发明内容
为克服现有技术的不足,本发明提供一种显示面板,使显示面板实现超窄边框架构。
本发明提供了一种显示面板,所述显示面板具有显示区以及设于显示区外侧的封装区,所述显示面板包括阵列基板,所述阵列基板包括玻璃基板、设置在玻璃基板上的柔性基底、设于柔性基底上的扫描线、数据线,所述柔性基底的至少一侧封装区外侧设有延伸至封装区外的弯折区,在柔性基底上位于弯折区中设有用于将阵列基板的扫描线以及数据线与行驱动和列驱动芯片连接的金属线阵列,弯折区朝柔性基底背离扫描线的一侧表面弯折。
进一步地,所述金属线阵列包括行金属线、列金属线,所述行金属线将阵列基板的扫描线与行驱动芯片连接,列金属线将阵列基板的数据线与列驱动芯片连接。
进一步地,所述阵列基板还包括设置在柔性基底上的柔性缓冲层,所述柔性缓冲层覆盖金属线,扫描线和数据线设于柔性缓冲层上。
进一步地,所述行金属线和列金属线设置在同一层上。
进一步地,所述玻璃基板上位于弯折区处的这部分玻璃基板通过激光切割
的方式切割后,将其与柔性基底剥离,使弯折区朝柔性基底背离扫描线的一侧表面弯折并且与玻璃基板的对应侧边贴合。
进一步地,所述玻璃基板通过激光剥离的方式与柔性基底完全剥离,使弯折区朝柔性基底背离扫描线的一侧表面弯折并且与柔性基底背离扫描线的一侧表面贴合。
进一步地,所述柔性基底的下侧封装区外侧设有延伸至封装区外的弯折区。
进一步地,所述柔性基底的左右两侧以及下侧封装去外设有延伸至封装区外的弯折区,所述柔性基底左右两侧弯折区上的金属线阵列用于将阵列基板的扫描线与行驱动芯片连接,所述柔性基底下侧弯折区上的金属线阵列用于将阵列基板的数据线与列驱动芯片连接。
进一步地,所述显示面板还包括彩色滤光片基板,所述彩色滤光片基板与阵列基板对置设置。
本发明与现有技术相比,通过在玻璃基板上设置柔性基底,在柔性基底上设置具有金属线阵列的弯折区,实现将金属线阵列通过弯折使其藏于玻璃基板的侧边或柔性基底背离扫描线的一侧表面上,从而减少封装区的宽度,最大限度的降低边框的尺寸。
图1-1是本发明实施例1弯折后的结构示意图;
图1-2是本发明实施例1对弯折区的玻璃基板进行切割前的示意图;
图1-3是本发明实施例1对弯折区的玻璃基板进行切割后的示意图;
图1-4是本发明实施例1展开示意图;
图1-5是本发明阵列极板中弯折区的结构示意图;
图2-1是本发明实施例2弯折后的结构示意图;
图2-2是本发明实施例2对玻璃基板进行剥离前的示意图;
图2-3是本发明实施例2对玻璃基板进行剥离后的示意图;
图2-4是本发明实施例2展开示意图;
图3-1是本发明实施例3弯折后的结构示意图;
图3-2是本发明实施例3对玻璃基板进行切割前的示意图;
图3-3是本发明实施例3对玻璃基板进行切割后的示意图;
图3-4是本发明实施例3展开示意图;
图4-1是本发明实施例4弯折后的结构示意图;
图4-2是本发明实施例4对玻璃基板进行剥离前的示意图;
图4-3是本发明实施例4对玻璃基板进行剥离后的示意图;
图4-4是本发明实施例4展开示意图。
下面结合附图和实施例对本发明作进一步详细说明。
本发明的显示面板中对阵列基板的改进仅在于增加了柔性基底、金属线阵列以及柔性缓冲层,对于其余如扫描线、数据线、有源层、源极、漏极等结构均未发生改变,在此对未作改变的部分不在赘述,本发明适用于AMOLED显示面板,尤其是AMOLED顶发射架构。
如图1-1和1-5所示,本发明的一种显示面板,具有显示区AA以及设于显示区外侧的封装区NA,所述显示面板包括阵列基板1,所述阵列基板1至少包括玻璃基板6、设置在玻璃基板6上的柔性基底4、设于柔性基底4上的扫描线8、数据线9等显示器件层,柔性基底4的至少一侧封装区外侧设有延伸至封装区外的弯折区3,在柔性基底4上位于弯折区3中设有用于将阵列基板1的扫描线8以及数据线9与行驱动和列驱动芯片连接的金属线阵列5,弯折区3朝柔性基底4背离扫描线8的一侧表面弯折,从而实现减小封装去的宽度,使金属线阵列5转移至玻璃基板6的侧边或柔性基底4背离扫描线8的一侧表面。
在阵列基板1上设有对置设置的色彩滤光片基板2,彩色滤光片基板2可以为具有RGB色阻的滤光片结构。
附图1-5中仅列出了实现本发明的主要部件,从图1-5中可以看出,在柔性基底4上设置有柔性缓冲层7,该柔性缓冲层7用于填平柔性基底4的表面,所述柔性缓冲层7覆盖金属线5,扫描线8和数据线9设于柔性缓冲层7上,这里需要注意的是,扫描线8、数据线9、栅极绝缘层12、有源层13、源漏极(图中未示出)、半导体层(图中未示出)、阳极(图中未示出)、有机发光层(图中未示出)、阴极(图中未示出)等显示器件层14均按照现有技术的制作方法以及结构实现,在此不做具体限定,仅需要将金属线阵列5与扫描线8和数据线9通过搭接等方式进行连接即可。
如图1-5所示,金属线阵列5包括行金属线10、列金属线11,所述行金属线10将阵列基板1的扫描线8与行驱动芯片连接,列金属线11将阵列基板1的数据线9与列驱动芯片连接;行金属线10和列金属线11设置在同一层。
如图1-1、图1-2、图1-3和图1-4所示,本发明实施例1的显示面板,在制备阶段,玻璃基板6的面积与柔性基底4的面积相等,柔性基底4包括了显示区、封装区以及弯折区3,弯折区3设于柔性基底4的下侧封装区外侧并向外延伸至封装区外,行金属线10和列金属线11均设置在下侧的弯折区3上,行金属线10将阵列基板1的扫描线8与行驱动芯片连接,列金属线11将阵列基板1的数据线9与列驱动芯片连接;在显示面板的显示区以及封装区上位于显示面板的显示面上设置有盖板或膜15,用于保护;当显示面板完全制备完成后,对玻璃基板6位于弯折区3的这部分玻璃基板进行激光切割(图1-2所示),在切除掉弯折区3多余的玻璃基板(图1-3所示)后,对弯折区3进行弯折,弯折区3朝柔性基底4背离扫描线8的一侧表面弯折,最终与玻璃基板6对应的侧边贴合。
如图2-1、图2-2、图2-3和图2-4所示,本发明实施例2的显示面板,在制备阶段,玻璃基板6的面积与柔性基底4的面积相等,柔性基底4包括了显示区、封装区以及弯折区3,弯折区3设于柔性基底4的下侧封装区外侧并向外延伸至封装区外,行金属线10和列金属线11均设置在下侧的弯折区3上,行金属线10将阵列基板1的扫描线8与行驱动芯片连接,列金属线11将阵列
基板1的数据线9与列驱动芯片连接;在显示面板的显示区以及封装区上位于显示面板的显示面上设置有盖板或膜15,用于保护;当显示面板完全制备完成后,对玻璃基板6通过激光剥离的方式与柔性基底4完全剥离(图2-2所示),在剥离掉玻璃基板6(图2-3所示)后,对弯折区3进行弯折,弯折区3朝柔性基底4背离扫描线8的一侧表面弯折,最终与柔性基底4背离扫描线8的一侧表面贴合。
如图3-1、图3-2、图3-3和图3-4所示,本发明实施例3的显示面板,在制备阶段,玻璃基板6的面积与柔性基底4的面积相等,柔性基底4包括了显示区、封装区,柔性基底4的左右两侧以及下侧封装去外设有延伸至封装区外的弯折区3,行金属线10设置在柔性基底4左右两侧弯折区3上,用于将阵列基板1的扫描线8与行驱动芯片连接,列金属线11设置在柔性基底4下侧弯折区3上,用于将阵列基板1的数据线9与列驱动芯片连接;在显示面板的显示区以及封装区上位于显示面板的显示面上设置有盖板或膜15,用于保护;当显示面板完全制备完成后,对玻璃基板6位于弯折区3与封装区的两个角的这部分玻璃基板进行激光切割(图3-2所示),然后再对位于弯折区3处的玻璃基板进行激光切割(图3-3所示)后,对弯折区3进行弯折,弯折区3朝柔性基底4背离扫描线8的一侧表面弯折,最终与玻璃基板6对应的侧边贴合。
如图4-1、图4-2、图4-3和图4-4所示,本发明实施例4的显示面板,在制备阶段,玻璃基板6的面积与柔性基底4的面积相等,柔性基底4包括了显示区、封装区,柔性基底4的左右两侧以及下侧封装去外设有延伸至封装区外的弯折区3,行金属线10设置在柔性基底4左右两侧弯折区3上,用于将阵列基板1的扫描线8与行驱动芯片连接,列金属线11设置在柔性基底4下侧弯折区3上,用于将阵列基板1的数据线9与列驱动芯片连接;在显示面板的显示区以及封装区上位于显示面板的显示面上设置有盖板或膜15,用于保护;当显示面板完全制备完成后,对玻璃基板6通过激光剥离的方式与柔性基底4剥离(图4-2所示),将玻璃基板6与柔性基底4完全剥离(图4-3所示)后,对弯折区3进行弯折,弯折区3朝柔性基底4背离扫描线8的一侧表面弯折,最终与柔性基底4背离扫描线8的一侧表面贴合。
虽然已经参照特定实施例示出并描述了本发明,但是本领域的技术人员将理解:在不脱离由权利要求及其等同物限定的本发明的精神和范围的情况下,
可在此进行形式和细节上的各种变化。
Claims (19)
- 一种显示面板,其中:所述显示面板具有显示区以及设于显示区外侧的封装区,所述显示面板包括阵列基板,所述阵列基板包括玻璃基板、设置在玻璃基板上的柔性基底、设于柔性基底上的扫描线、数据线,所述柔性基底的至少一侧封装区外侧设有延伸至封装区外的弯折区,在柔性基底上位于弯折区中设有用于将阵列基板的扫描线以及数据线与行驱动和列驱动芯片连接的金属线阵列,弯折区朝柔性基底背离扫描线的一侧表面弯折。
- 根据权利要求1所述的显示面板,其中:所述金属线阵列包括行金属线、列金属线,所述行金属线将阵列基板的扫描线与行驱动芯片连接,列金属线将阵列基板的数据线与列驱动芯片连接。
- 根据权利要求1所述的显示面板,其中:所述阵列基板还包括设置在柔性基底上的柔性缓冲层,所述柔性缓冲层覆盖金属线,扫描线和数据线设于柔性缓冲层上。
- 根据权利要求3所述的显示面板,其中:所述行金属线和列金属线设置在同一层上。
- 根据权利要求1所述的显示面板,其中:所述玻璃基板上位于弯折区处的这部分玻璃基板通过激光切割的方式切割后,将其与柔性基底剥离,使弯折区朝柔性基底背离扫描线的一侧表面弯折并且与玻璃基板的对应侧边贴合。
- 根据权利要求1所述的显示面板,其中:所述玻璃基板通过激光剥离的方式与柔性基底完全剥离,使弯折区朝柔性基底背离扫描线的一侧表面弯折并且与柔性基底背离扫描线的一侧表面贴合。
- 根据权利要求1所述的显示面板,其中:所述柔性基底的下侧封装区外侧设有延伸至封装区外的弯折区。
- 根据权利要求2所述的显示面板,其中:所述柔性基底的下侧封装区外侧设有延伸至封装区外的弯折区。
- 根据权利要求3所述的显示面板,其中:所述柔性基底的下侧封装区 外侧设有延伸至封装区外的弯折区。
- 根据权利要求4所述的显示面板,其中:所述柔性基底的下侧封装区外侧设有延伸至封装区外的弯折区。
- 根据权利要求5所述的显示面板,其中:所述柔性基底的下侧封装区外侧设有延伸至封装区外的弯折区。
- 根据权利要求6所述的显示面板,其中:所述柔性基底的下侧封装区外侧设有延伸至封装区外的弯折区。
- 根据权利要求1所述的显示面板,其中:所述柔性基底的左右两侧以及下侧封装去外设有延伸至封装区外的弯折区,所述柔性基底左右两侧弯折区上的金属线阵列用于将阵列基板的扫描线与行驱动芯片连接,所述柔性基底下侧弯折区上的金属线阵列用于将阵列基板的数据线与列驱动芯片连接。
- 根据权利要求2所述的显示面板,其中:所述柔性基底的左右两侧以及下侧封装去外设有延伸至封装区外的弯折区,所述柔性基底左右两侧弯折区上的金属线阵列用于将阵列基板的扫描线与行驱动芯片连接,所述柔性基底下侧弯折区上的金属线阵列用于将阵列基板的数据线与列驱动芯片连接。
- 根据权利要求3所述的显示面板,其中:所述柔性基底的左右两侧以及下侧封装去外设有延伸至封装区外的弯折区,所述柔性基底左右两侧弯折区上的金属线阵列用于将阵列基板的扫描线与行驱动芯片连接,所述柔性基底下侧弯折区上的金属线阵列用于将阵列基板的数据线与列驱动芯片连接。
- 根据权利要求4所述的显示面板,其中:所述柔性基底的左右两侧以及下侧封装去外设有延伸至封装区外的弯折区,所述柔性基底左右两侧弯折区上的金属线阵列用于将阵列基板的扫描线与行驱动芯片连接,所述柔性基底下侧弯折区上的金属线阵列用于将阵列基板的数据线与列驱动芯片连接。
- 根据权利要求5所述的显示面板,其中:所述柔性基底的左右两侧以及下侧封装去外设有延伸至封装区外的弯折区,所述柔性基底左右两侧弯折区上的金属线阵列用于将阵列基板的扫描线与行驱动芯片连接,所述柔性基底下侧弯折区上的金属线阵列用于将阵列基板的数据线与列驱动芯片连接。
- 根据权利要求6所述的显示面板,其中:所述柔性基底的左右两侧以及下侧封装去外设有延伸至封装区外的弯折区,所述柔性基底左右两侧弯折区上的金属线阵列用于将阵列基板的扫描线与行驱动芯片连接,所述柔性基底下侧弯折区上的金属线阵列用于将阵列基板的数据线与列驱动芯片连接。
- 根据权利要求1所述的显示面板,其中:所述显示面板还包括彩色滤光片基板,所述彩色滤光片基板与阵列基板对置设置。
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102568377A (zh) * | 2010-12-13 | 2012-07-11 | 索尼公司 | 显示装置和电子装置 |
CN103646611A (zh) * | 2013-09-04 | 2014-03-19 | 京东方科技集团股份有限公司 | 一种阵列基板、柔性显示器件及阵列基板的制作方法 |
KR20140064156A (ko) * | 2012-11-19 | 2014-05-28 | 엘지디스플레이 주식회사 | 플렉서블 유기발광 디스플레이 장치 |
CN104103669A (zh) * | 2013-04-11 | 2014-10-15 | 乐金显示有限公司 | 柔性显示面板 |
CN104885140A (zh) * | 2012-12-28 | 2015-09-02 | 乐金显示有限公司 | 柔性显示装置及其制造方法 |
CN105977400A (zh) * | 2016-07-21 | 2016-09-28 | 京东方科技集团股份有限公司 | 一种显示面板及其制备方法、显示装置 |
Family Cites Families (2)
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CN103985371B (zh) * | 2014-05-31 | 2017-03-15 | 深圳市华星光电技术有限公司 | 柔性拼接显示装置 |
-
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102568377A (zh) * | 2010-12-13 | 2012-07-11 | 索尼公司 | 显示装置和电子装置 |
KR20140064156A (ko) * | 2012-11-19 | 2014-05-28 | 엘지디스플레이 주식회사 | 플렉서블 유기발광 디스플레이 장치 |
CN104885140A (zh) * | 2012-12-28 | 2015-09-02 | 乐金显示有限公司 | 柔性显示装置及其制造方法 |
CN104103669A (zh) * | 2013-04-11 | 2014-10-15 | 乐金显示有限公司 | 柔性显示面板 |
CN103646611A (zh) * | 2013-09-04 | 2014-03-19 | 京东方科技集团股份有限公司 | 一种阵列基板、柔性显示器件及阵列基板的制作方法 |
CN105977400A (zh) * | 2016-07-21 | 2016-09-28 | 京东方科技集团股份有限公司 | 一种显示面板及其制备方法、显示装置 |
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