WO2018229817A1 - Power module - Google Patents

Power module Download PDF

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Publication number
WO2018229817A1
WO2018229817A1 PCT/JP2017/021611 JP2017021611W WO2018229817A1 WO 2018229817 A1 WO2018229817 A1 WO 2018229817A1 JP 2017021611 W JP2017021611 W JP 2017021611W WO 2018229817 A1 WO2018229817 A1 WO 2018229817A1
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WO
WIPO (PCT)
Prior art keywords
leads
electronic element
detection
power module
connection
Prior art date
Application number
PCT/JP2017/021611
Other languages
French (fr)
Japanese (ja)
Inventor
貴大 及川
Original Assignee
新電元工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新電元工業株式会社 filed Critical 新電元工業株式会社
Priority to PCT/JP2017/021611 priority Critical patent/WO2018229817A1/en
Publication of WO2018229817A1 publication Critical patent/WO2018229817A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C13/00—Resistors not provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N

Definitions

  • the present invention relates to a power module.
  • Patent Document 1 discloses a semiconductor device in which a resistance wire (resistance component) as a shunt resistor for detecting a current flowing in a circuit (semiconductor element) is joined to two strip-shaped inner leads (leads) by welding. It is disclosed.
  • the resistance component one electronic component
  • another electronic component such as a semiconductor element
  • a wire detection wire
  • a detection wiring is divided into two leads. Join each one. In this case, it is necessary to separately perform the process of bonding the resistance component to the two leads and the process of bonding the detection wire to each lead, and there is a problem that the manufacturing efficiency of the power module is low.
  • the present invention has been made in view of the above-described circumstances, and an object of the present invention is to provide a power module that can be miniaturized and can improve manufacturing efficiency.
  • One aspect of the present invention is a power module configured by mounting electronic components on a lead frame having a plurality of leads and performing power control, and an electronic element having a predetermined electrical function includes a plurality of the leads. Are joined to side portions between connecting leads arranged at intervals in a first orthogonal direction orthogonal to the plate thickness direction, and the plate thickness direction with respect to the connection lead among the plurality of leads And for detecting a current flowing in the electronic device by being arranged adjacent to each other in a second orthogonal direction orthogonal to the first orthogonal direction and spaced from each other in the first orthogonal direction. It is a power module joined to the side part of one detection lead.
  • the power module can be reduced in size.
  • the electronic element can be connected to both the connection lead and the detection lead simply by joining the electronic element to the connection lead and the detection lead. Therefore, it is possible to improve the manufacturing efficiency of the power module.
  • the power module 100 performs various types of power control.
  • the power module 100 includes a lead frame 5 having a plurality of leads 1, 2, 3, 4, various electronic components 6 (see FIG. 6) mounted on the lead frame 5, And an electronic element 7 having an electrical function.
  • FIG. 1 shows only the electronic element 7 and leads 1, 2, 3, and 4 joined to the electronic element 7 of the lead frame 5, and the electronic component 6 and the lead frame on which the electronic component 6 is mounted. The part 5 is omitted.
  • the lead frame 5 is obtained, for example, by subjecting a conductive plate material having conductivity, such as a copper plate, to press processing.
  • Each lead 1, 2, 3, 4 of the lead frame 5 is formed in a plate shape.
  • the plurality of leads 1, 2, 3, 4 are arranged at intervals from each other in a direction orthogonal to the plate thickness direction (Z-axis direction) of the lead frame 5.
  • the plurality of leads 1, 2, 3, and 4 constitute a circuit of the power module 100 together with the electronic component 6 and the electronic element 7 by being electrically connected to the electronic component 6 and the electronic element 7.
  • the electronic element 7 is electrically connected to the leads 1, 2, 3, 4 by being joined to the leads 1, 2, 3, 4.
  • Parts of the electronic element 7 that are joined to leads 1, 2, 3, 4 are electrodes of the electronic element 7.
  • the electrodes of the electronic element 7 are provided at both ends in a predetermined linear direction (X-axis direction).
  • the number of electrodes at each end may be plural, for example, but is one in this embodiment.
  • the electronic element 7 may be a switching element (semiconductor element) such as a thyristor, or may be a chip capacitor.
  • the electronic element 7 of this embodiment is a shunt resistor (resistive element).
  • the electronic element 7 that is a shunt resistor is formed of, for example, a different type of conductive member from the lead frame 5.
  • the electronic element 7 may be formed in an arbitrary shape such as a block shape, but the electronic element 7 of the present embodiment is formed in a plate shape having a rectangular shape in plan view.
  • the electronic component 6 includes a plurality of main surfaces 11 and 21 of the leads 1 and 2 (main surfaces of the lead frame 5; surfaces orthogonal to the plate thickness direction of the leads 1 and 2 and the lead frame 5). As a result, the lead frame 5 is mounted.
  • the specific configuration of the electronic component 6 may be arbitrary.
  • the electronic component 6 illustrated in FIG. 6 includes a built-in electronic element 61 having a predetermined electrical function, and a terminal 62 connected to the electrode of the built-in electronic element 61.
  • the built-in electronic element 61 may be the same as the electronic element 7 described above, for example, but is not limited thereto.
  • the built-in electronic element 61 and the terminal 62 may be directly connected, for example, or may be connected via a connector such as a wire.
  • the electronic component 6 may include a resin 63 that seals the built-in electronic element 61 and the terminal 62.
  • the built-in electronic element 61 may be buried in the resin 63 and the terminal 62 may be exposed to the outside of the resin 63.
  • the terminal 62 may protrude from the resin 63 as shown in FIG. 6, for example, but may not protrude, for example.
  • the electronic component 6 is mounted on the lead frame 5 by, for example, joining the terminal 62 to the main surfaces 11 and 21 of the leads 1 and 2.
  • the plurality of leads 1, 2, 3, 4 joined to the electronic element 7 include a plurality of connection leads 1, 2 and two detection leads 3, 4.
  • the plurality of connection leads 1 and 2 are spaced from each other in a first orthogonal direction (X-axis direction) orthogonal to the plate thickness direction (Z-axis direction) of the connection leads 1 and 2 so as to sandwich the electronic element 7. It is arranged.
  • one connection lead 1, 2 is arranged on each side of the electronic element 7 in the first orthogonal direction.
  • the two detection leads 3 and 4 are spaced apart from each other in the first orthogonal direction.
  • the two detection leads 3 and 4 are arranged adjacent to the connection leads 1 and 2 in the second orthogonal direction (Y-axis direction) orthogonal to the plate thickness direction and the first orthogonal direction.
  • the detection leads 3 and 4 are arranged with a space from the connection leads 1 and 2.
  • the connection lead 1 (2) and the detection lead 3 (4) arranged in the second orthogonal direction are positioned at a distance from each other in the second orthogonal direction.
  • the electronic element 7 is joined to the side portions 10 and 20 between the connection leads 1 and 2 that are spaced apart from each other in the first orthogonal direction.
  • the electronic element 7 of the present embodiment is a shunt resistor and detects a current (for example, a power supply current) flowing through the circuit of the power module 100. For this reason, the electronic element 7 is joined to the two connection leads 1 and 2 so as to electrically connect the two connection leads 1 and 2. That is, the electronic element 7 of this embodiment is joined to the side portions 10 and 20 of the two connection leads 1 and 2 that face each other.
  • the electronic element 7 is bonded to the side portions 30 and 40 of the two detection leads 3 and 4.
  • the side portions 30 and 40 of the detection leads 3 and 4 are portions of the detection lead that face in a direction orthogonal to the plate thickness direction.
  • the electronic element 7 is disposed between the two detection leads 3 and 4. For this reason, the electronic element 7 is joined to the side portions 30 and 40 between the two detection leads 3 and 4 facing each other in the first orthogonal direction, as in the case of the connection leads 1 and 2.
  • the side portions 10 and 20 of the connection leads 1 and 2 and the side portions 30 and 40 of the detection leads 3 and 4 to be joined to the electronic element 7 in a plan view as viewed from the thickness direction, It extends in parallel to each other in the second orthogonal direction.
  • the connection lead 1 (2) and the detection lead 3 (4) arranged in the second orthogonal direction the side portion 10 (20) of the connection lead 1 (2) and the detection lead 3 (4) in the first orthogonal direction.
  • the positions of the side portions 30 (40) of () coincide with each other.
  • the two detection leads 3 and 4 are joined to the electronic element 7 as described above in order to detect a current flowing through the electronic element 7.
  • the two detection leads 3 and 4 are connected to a current detector (not shown) for detecting a current flowing through the electronic element 7.
  • a current detector not shown
  • the connection area between the detection leads 3 and 4 and the electronic element 7 is set so that an excessive current (large current) does not flow through the current detector. It is good that it is smaller than the bonding area.
  • the two connection leads 1 and 2 are each formed in a strip shape extending in a direction orthogonal to the thickness direction of the lead frame 5.
  • the two connection leads 1 and 2 may extend in different directions, for example, but in this embodiment, extend in the same direction.
  • the two connection leads 1 and 2 may extend in a direction coinciding with the arrangement direction (first orthogonal direction) of the two connection leads 1 and 2.
  • the electronic element 7 is joined to a side portion of the two connection leads 1 and 2 extending in the short direction (X-axis direction in FIG. 1).
  • the two connection leads 1 and 2 extend in a direction (second orthogonal direction) orthogonal to the arrangement direction of the two connection leads 1 and 2.
  • the electronic element 7 is joined to the side portions 10 and 20 extending in the longitudinal direction (Y-axis direction in FIG. 1) of the two connection leads 1 and 2. More specifically, the electronic element 7 is joined to the longitudinal ends of the connection leads 1 and 2 of the side portions 10 and 20 of the connection leads 1 and 2.
  • the side portions 10 and 20 of the connection leads 1 and 2 to which the electronic element 7 is joined are perpendicular to the plate thickness direction of the lead frame 5 (the main surfaces 11, 12, 21 and 22 of the connection leads 1 and 2).
  • the side faces 13 and 23 of the connecting leads 1 and 2 extending in the direction of
  • the side surfaces 73 and 74 of the electronic element 7 extending in the plate thickness direction of the electronic element 7 are in surface contact with the side surfaces 13 and 23 of the connection leads 1 and 2.
  • the side surfaces 73 and 74 of the electronic element 7 bonded to the connection leads 1 and 2 are surfaces facing each other in the first orthogonal direction.
  • the two detection leads 3 and 4 are formed in a strip shape similar to the connection leads 1 and 2.
  • the two detection leads 3 and 4 may each extend in an arbitrary direction.
  • the two detection leads 3 and 4 extend in a direction (second orthogonal direction) perpendicular to the arrangement direction of the two detection leads 3 and 4, similarly to the connection leads 1 and 2.
  • the electronic element 7 is bonded to the end of the detection leads 3 and 4 in the longitudinal direction (Y-axis direction in FIG. 1) of the side portions 30 and 40 of the detection leads 3 and 4.
  • the side portions 30 and 40 of the detection leads 3 and 4 to which the electronic element 7 is bonded are in the thickness direction of the lead frame 5 (the direction orthogonal to the main surfaces 31, 32, 41 and 42 of the detection leads 3 and 4). These are side surfaces 33 and 43 of the detection leads 3 and 4 extending in the direction.
  • the side surfaces 73 and 74 of the electronic element 7 are joined to the side surfaces 33 and 43 of the detection leads 3 and 4 in surface contact.
  • the side surfaces 73 and 74 of the electronic element 7 bonded to the detection leads 3 and 4 are surfaces facing each other in the first orthogonal direction.
  • connection leads 1 and 2 and the detection leads 3 and 4 and the electronic element 7 may be joined by, for example, solder or the like, but are joined by welding in this embodiment.
  • the electronic element 7 protrudes in the plate thickness direction from the main surfaces 11, 12, 21, 22 of the connection leads 1, 2 and the main surfaces 31, 32, 41, 42 of the detection leads 3, 4.
  • the connection leads 1 and 2 and the detection leads 3 and 4 may be joined.
  • the electronic element 7 is the same as one main surfaces 11 and 21 (12, 22) of the connection leads 1 and 2 and one main surfaces 31 and 41 (32 and 42) of the detection leads 3 and 4, for example.
  • the connecting leads 1 and 2 and the detection leads 3 and 4 may be joined so as to form a flat surface.
  • the thickness of the electronic element 7 is equal to the thickness of the connection leads 1 and 2 and the detection leads 3 and 4.
  • the electronic element 7 has the same flat surface as the main surfaces 11, 12, 21, 22 of both the connection leads 1, 2 and the main surfaces 31, 32, 41, 42 of the detection leads 3, 4.
  • the connecting leads 1 and 2 and the detection leads 3 and 4 are joined so as to form a surface.
  • the electronic element 7 is joined to the side portions 10 and 20 of the connection leads 1 and 2 and the side portions 30 and 40 of the detection leads 3 and 4. Yes.
  • the main surfaces 11, 12, 21, 22 of the connection leads 1, 2 and the main surfaces 31, 32, 41, 42 of the detection leads 3, 4 are mounted on other electronic components 6 (see FIG. 7). It can be effectively used for joining connecting parts such as wires. Therefore, the power module 100 can be reduced in size.
  • the electronic element 7 can be connected to both the connection leads 1 and 2 and the detection leads 3 and 4 simply by joining the electronic element 7 to the connection leads 1 and 2 and the detection leads 3 and 4. Therefore, it is possible to improve the manufacturing efficiency of the power module.
  • the electronic device 7 When the electronic device 7 is joined to the side portions 10 and 20 of the connection leads 1 and 2 and the side portions 30 and 40 of the detection leads 3 and 4, the electronic device 7 is connected to the main surface 11 of the connection leads 1 and 2. , 12, 21, 22 and the main surfaces 31, 32, 41, 42 of the detection leads 3, 4, the power module 100 can be made thinner (low profile).
  • the electronic element 7 is disposed between the connection leads 1 and 2 and the detection leads 3 and 4 that are arranged at intervals in the first orthogonal direction. . Therefore, when the electronic element 7 is joined to the connection leads 1 and 2 and the detection leads 3 and 4, the electronic element 7 can be positioned in the first orthogonal direction without using a separate member such as a jig. It can be done easily. Further, when the electronic element 7 is joined to the connection leads 1 and 2 and the detection leads 3 and 4, the electronic element 7 is connected to the connection leads 1 and 2 and the detection leads 3 and 4 without using a separate member such as a jig. By positioning with respect to the electronic element 7, the electronic element 7 can be easily joined to the leads 1, 2, 3, and 4.
  • the detection leads 3 and 4 are arranged with a distance from the connection leads 1 and 2. For this reason, it is possible to prevent current from flowing from the connection leads 1 and 2 to the detection leads 3 and 4 if a current (particularly a large current) does not flow to the electronic element 7 due to a malfunction. Thereby, it is possible to prevent a large current from flowing through the current detector connected to the detection leads 3 and 4, that is, it is possible to protect the current detector.
  • the side portions 10 and 20 of the connection leads 1 and 2 and the side portions 30 and 40 of the detection leads 3 and 4 joined to the electronic element 7 are in the second orthogonal direction. Extending parallel to each other. Therefore, before joining the electronic element 7 to the connection leads 1 and 2 and the detection leads 3 and 4, the electronic element 7 is moved in the second orthogonal direction with respect to the connection leads 1 and 2 and the detection leads 3 and 4. By doing so, it is possible to adjust the bonding area of the electrical component to the side portions 10 and 20 of the connection leads 1 and 2 and the bonding area of the detection leads 3 and 4 to the side portions 30 and 40.
  • the bonding area between the electronic element 7 and the connection leads 1 and 2 is reduced, and the electronic element 7
  • the bonding area between the detection leads 3 and 4 can be increased.
  • connection leads 1 and 2 and the detection leads 3 and 4 and the electronic element 7 are joined by welding. Therefore, the connection leads 1 and 2 and the detection lead 3 are extended over a long period of time compared to the case where the connection leads 1 and 2 and the detection leads 3 and 4 and the electronic element 7 are joined by another joining method such as soldering. , 4 and the electronic element 7 can be maintained in a bonded state. That is, the reliability of the power module 100 can be improved.
  • the electronic element 7 includes the main surfaces 11, 12, 21, 22 of the connection leads 1, 2 and the main surfaces 31, 32, 41, of the detection leads 3, 4. 42 are joined to the side portions 10 and 20 of the connection leads 1 and 2 and the side portions 30 and 40 of the detection leads 3 and 4 so as to form the same flat surface. For this reason, the electronic element 7 and the connection leads 1 and 2 and the detection leads 3 and 4 joined thereto can be brought into contact with the flat surface of the same heat radiating member. That is, the connection leads 1 and 2, the detection leads 3 and 4, and the electronic element 7 can be easily brought into contact with a heat dissipation member having a simple shape.
  • the heat generated in the electronic element 7 by energization can be efficiently released to the outside of the power module 100.
  • the power module 100B of this embodiment illustrated in FIG. 2 includes a lead frame 5B having a plurality of leads 1, 2, 3B, 4B and various electronic components mounted on the lead frame 5B. 6 (see FIG. 6) and an electronic element 7 having a predetermined electrical function.
  • FIG. 2 shows only the electronic element 7 and the two connection leads 1 and 2 and the two detection leads 3B and 4B joined to the electronic element 7 of the lead frame 5B. A portion of the lead frame 5B on which the electronic component 6 is mounted is omitted.
  • the electronic element 7 is formed in a rectangular plate shape in plan view, as in the first embodiment, and is welded to the side portions 10 and 20 of the two connection leads 1 and 2 facing each other. It is joined. Moreover, the electronic element 7 is joined to the side portions 30B and 40B of the two detection leads 3B and 4B by welding similarly to the first embodiment. However, in the power module 100B of the present embodiment, the side portions 30B and 40B of the detection leads 3B and 4B are in contact with the electronic element 7 in the second orthogonal direction (Y-axis direction) 34B and 44B.
  • Y-axis direction second orthogonal direction
  • the contact side portions 34B and 44B of the detection leads 3B and 4B may be arbitrary portions of the side portions 30B and 40B of the detection leads 3B and 4B.
  • the two detection leads 3B and 4B extend in parallel to each other in the second orthogonal direction as in the first embodiment.
  • the distance between the two detection leads 3B and 4B in the first orthogonal direction is smaller than the dimension of the electronic element 7 in the first orthogonal direction.
  • the contact side portions 34B and 44B of the detection leads 3B and 4B in the present embodiment are the detection leads 3B and 4B formed in a band plate shape among the side portions 30B and 40B of the detection leads 3B and 4B. It is the site
  • the contact side portions 34B and 44B of the detection leads 3B and 4B are joined in surface contact with the side surface 75 of the electronic element 7 facing the second orthogonal direction.
  • the same effects as those of the first embodiment can be obtained.
  • the side portions 30B and 40B of the detection leads 3B and 4B have contact side portions 34B and 44B that contact the electronic element 7 in the second orthogonal direction. Therefore, when the electronic element 7 is joined to the connection leads 1 and 2 and the detection leads 3B and 4B, the electronic element 7 can be easily positioned in the second orthogonal direction without using a separate member such as a jig. Can be done.
  • an error occurs in the electrical characteristics (for example, resistance value) of the circuit of the power module including the connection leads 1 and 2 and the electronic element 7 based on the positional deviation of the electronic element 7 with respect to the connection leads 1 and 2. Can be suppressed.
  • the power module 100C of this embodiment illustrated in FIG. 3 includes a lead frame 5C having a plurality of leads 1C, 2C, 3C, and 4C and various electronic components mounted on the lead frame 5C. 6 (see FIG. 6) and an electronic element 7 having a predetermined electrical function.
  • FIG. 3 shows only the electronic element 7 and the two connection leads 1C, 2C and the two detection leads 3C, 4C to be joined to the electronic element 7 of the lead frame 5C. A portion of the lead frame 5C on which the electronic component 6 is mounted is omitted.
  • the electronic element 7 is formed in a rectangular plate shape in plan view as in the first embodiment, and the side portions 10C and 20C of the two connection leads 1C and 2C facing each other and for detection.
  • the leads 3C and 4C are joined to the side portions 30C and 40C by welding.
  • the detection leads 3C and 4C are integrally formed with the connection leads 1C and 2C.
  • the connection lead 1C (2C) and the detection lead 3C (4C) arranged in the second orthogonal direction are integrally formed.
  • the side portions 30C and 40C extend in parallel to each other in the second orthogonal direction. Further, regarding the connection lead 1C (2C) and the detection lead 3C (4C) arranged in the second orthogonal direction, the side portion 10C (20C) of the connection lead 1C (2C) and the detection lead 3C (4C) in the first orthogonal direction. ) Side portions 30C (40C) are aligned with each other.
  • the same effects as those of the first embodiment can be obtained.
  • the detection leads 3C and 4C are integrally formed with the connection leads 1C and 2C.
  • the connection leads 1C and 2C and the detection leads 3C and 4C are compared with the case where the connection leads 1 and 2 and the detection leads 3 and 4 are spaced apart as in the first embodiment.
  • the number of joints with the electronic element 7 can be reduced. Specifically, the number of joints between the connection leads 1C and 2C and the detection leads 3C and 4C and the electronic element 7 can be reduced from four to two. Thereby, the manufacturing efficiency of the power module 100C can be further improved.
  • the configuration of the third embodiment described above can also be applied to the power module 100B of the second embodiment.
  • the side portions 30C and 40C of the detection leads 3C and 4C formed integrally with the connection leads 1C and 2C are the same as those of the electronic element 7 as in the second embodiment. You may have the contact
  • the side portions 10C and 20C of the connection leads 1C and 2C joined to the electronic element 7 are in contact with the electronic element 7 in the second orthogonal direction. You may have.
  • the side portions 10C and 20C of the connection leads 1C and 2C have contact side portions 14C and 24C, and the side portions 30C and 40C of the detection leads 3C and 4C are contact side portions.
  • the contact side portions 14C and 24C of the connection leads 1C and 2C and the contact side portions 34C and 44C of the detection leads 3C and 4C are preferably opposed to each other in the second orthogonal direction.
  • the electronic element 7 is brought into contact with both the contact side portions 14C and 24C of the connection leads 1C and 2C and the contact side portions 34C and 44C of the detection leads 3C and 4C, thereby connecting the connection lead 1C. , 2C and the detection leads 3C, 4C, the electronic element 7 is displaced in the second orthogonal direction with respect to the connection leads 1C, 2C and the detection leads 3C, 4C. Can be surely prevented.
  • connection leads 1C and 2C have the contact side portions 14C and 24C
  • connection leads 1C and 2C and the detection leads 3C and 4C are integrally formed.
  • the present invention can also be applied to a configuration in which the connection leads 1 and 2 and the detection leads 3 and 4 (3B and 4B) are spaced apart from each other.
  • the power module 100D of this embodiment illustrated in FIG. 6 is configured similarly to the power module 100 (see FIG. 1) of the first embodiment.
  • the power module 100D of this embodiment includes an electronic component 6 (parallel connection component) that is electrically connected in parallel with the electronic element 7 that is a shunt resistor.
  • the electronic component 6 according to the present embodiment is disposed with an interval in the thickness direction of the connection leads 1 and 2 with respect to the electronic element 7.
  • the electronic component 6 is electrically connected to two connection leads 1 and 2 joined to the electronic element 7. Specifically, each terminal 62 of the electronic component 6 is joined to one main surface 11, 21 of the two connection leads 1, 2 by solder or the like.
  • the same effects as those of the first embodiment can be obtained.
  • the electronic component 6 is arranged with a space in the plate thickness direction of the connection leads 1 and 2 with respect to the electronic element 7. For this reason, the mounting area of the electronic component 6 in the lead frame 5 as viewed from the thickness direction of the lead frame 5 can be suppressed small. Thereby, size reduction of power module 100D can further be achieved.
  • the configuration of the fourth embodiment described above can also be applied to the power modules 100B and 100C of the second and third embodiments.
  • connection leads 1E, 2E, 1F, and 2F of the lead frames 5E and 5F connect the electronic elements 7 and 7F from the plate thickness direction (Z-axis direction). It may be configured to support.
  • the electronic element 7 is supported by support protrusions 17E and 27E protruding from the side portions 10E and 20E of the connection leads 1E and 2E.
  • the support protrusions 17E and 27E in the illustrated example are formed in a flat plate shape smaller than the plate thickness of the connection leads 1E and 2E, but are not limited thereto.
  • the side portions 10F and 20F of the two connection leads 1F and 2F facing each other are connected to the other side (from the lower side in FIG. 8) in the plate thickness direction of the connection leads 1F and 2F.
  • Inclined surfaces 16F and 26F that are separated from each other toward the upper side in FIG. 8 are formed.
  • the electronic element 7F is formed in a tapered shape in cross section that is in surface contact with the inclined surfaces 16F and 26F of the two connection leads 1F and 2F in a state of being arranged between the two connection leads 1F and 2F.
  • the two side surfaces 73F and 74F of the electronic element 7F that are in surface contact with the inclined surfaces 16F and 26F of the two connection leads 1F and 2F, respectively, are on one side in the plate thickness direction of the electronic element 7F (in FIG.
  • the elements 7F are inclined so as to be separated from each other as they go from the one main surface 71F side) to the other side (the other main surface 72F side of the electronic element 7F in FIG. 8).
  • the support protrusions 17E and 27E in FIG. 7 and the inclined surfaces 16F and 26F in FIG. 8 may be applied to, for example, a detection lead.
  • the electronic elements 7 and 7F when the electronic elements 7 and 7F are joined to the connection leads 1E, 2E, 1F and 2F and the detection leads, a separate member such as a jig is used. Without using it, the electronic elements 7 and 7F can be easily positioned in the thickness direction. According to the power module 100F illustrated in FIG. 8, the electronic element 7F can be easily inserted between the two connection leads 1F and 2F from the other side (upper side in FIG. 8) of the connection leads 1F and 2F in the plate thickness direction.
  • the number of connection leads joined to the electronic element is not limited to two, and may be changed according to the type of the electronic element.
  • the electronic element has three electrodes such as a switching element
  • the two electrodes provided at one end of the electronic element are bonded to the side portions of the two leads.
  • Another side of one lead may be joined to one electrode provided at the other end.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

A power module that: is formed by mounting an electronic component on a lead frame that has a plurality of leads; and performs power control. The power module comprises an electronic element that has a prescribed electrical function, is bonded to facing side parts of connection leads that, of the plurality of leads, are arranged at an interval in a first orthogonal direction that is orthogonal to a plate-thickness direction, and is bonded to side parts of two detection leads that, of the plurality of leads, are adjacent to the connection leads in a second orthogonal direction that is orthogonal to the plate-thickness direction and the first orthogonal direction, that are arranged at an interval in the first orthogonal direction, and that detect current that flows through the electronic element.

Description

パワーモジュールPower module
この発明は、パワーモジュールに関する。 The present invention relates to a power module.
近年、パワーモジュールにおいては、リードフレームを利用して回路用の配線を構成することが考えられている。特許文献１には、回路（半導体素子）に流れる電流を検出するためのシャント抵抗としての抵抗線（抵抗部品）を、溶接によって帯板状の二つのインナーリード（リード）に接合した半導体装置が開示されている。 In recent years, in power modules, it has been considered to configure circuit wiring using a lead frame. Patent Document 1 discloses a semiconductor device in which a resistance wire (resistance component) as a shunt resistor for detecting a current flowing in a circuit (semiconductor element) is joined to two strip-shaped inner leads (leads) by welding. It is disclosed.
特開平６－１８１２７７号公報JP-A-6-181277
しかしながら、従来のパワーモジュールでは、抵抗部品（一の電子部品）をリードの主面に接合するため、リードの主面の別の領域に、半導体素子などの他の電子部品を搭載したり、ボンディングワイヤ等の接続部品を接合する必要がある。このため、リードを大きく形成する必要があり、パワーモジュールの小型化を図ることが難しい。
また、従来のパワーモジュールにおいて、抵抗部品に流れる電流を検出するためのリード（検出用リード）を抵抗部品に接続するためには、検出用配線としてのワイヤ（検出用ワイヤ）を二つのリードにそれぞれ接合する。この場合、抵抗部品を二つのリードに接合する工程と、検出用ワイヤを各リードに接合する工程とを、別個に実施する必要があり、パワーモジュールの製造効率が低い、という問題もある。 However, in the conventional power module, since the resistance component (one electronic component) is joined to the main surface of the lead, another electronic component such as a semiconductor element is mounted or bonded to another region of the main surface of the lead. It is necessary to join connecting parts such as wires. For this reason, it is necessary to form a large lead, and it is difficult to reduce the size of the power module.
In addition, in a conventional power module, in order to connect a lead (detection lead) for detecting a current flowing through a resistance component to the resistance component, a wire (detection wire) as a detection wiring is divided into two leads. Join each one. In this case, it is necessary to separately perform the process of bonding the resistance component to the two leads and the process of bonding the detection wire to each lead, and there is a problem that the manufacturing efficiency of the power module is low.
本発明は、上述した事情に鑑みたものであって、小型化を図ることができ、かつ、製造効率の向上を図ることが可能なパワーモジュールを提供することを目的とする。 The present invention has been made in view of the above-described circumstances, and an object of the present invention is to provide a power module that can be miniaturized and can improve manufacturing efficiency.
本発明の一態様は、複数のリードを有するリードフレームに電子部品を実装して構成され、電力制御を行うパワーモジュールであって、所定の電気的な機能を有する電子素子が、複数の前記リードのうち板厚方向に直交する第一直交方向に互いに間隔をあけて配された接続リード間の側部に接合され、かつ、複数の前記リードのうち前記接続リードに対して前記板厚方向及び前記第一直交方向に直交する第二直交方向に隣り合せて配されると共に、前記第一直交方向に互いに間隔をあけて配されて前記電子素子に流れる電流を検出するための二つの検出用リードの側部に接合されているパワーモジュールである。 One aspect of the present invention is a power module configured by mounting electronic components on a lead frame having a plurality of leads and performing power control, and an electronic element having a predetermined electrical function includes a plurality of the leads. Are joined to side portions between connecting leads arranged at intervals in a first orthogonal direction orthogonal to the plate thickness direction, and the plate thickness direction with respect to the connection lead among the plurality of leads And for detecting a current flowing in the electronic device by being arranged adjacent to each other in a second orthogonal direction orthogonal to the first orthogonal direction and spaced from each other in the first orthogonal direction. It is a power module joined to the side part of one detection lead.
本発明によれば、リードの主面を他の電子部品の搭載、接続部品の接合などに有効に活用できるため、パワーモジュールの小型化を図ることができる。
また、本発明によれば、電子素子を、接続リード及び検出用リードに接合するだけで、電子素子を接続リード及び検出用リードの両方に接続することができる。したがって、パワーモジュールの製造効率向上を図ることができる。 According to the present invention, since the main surface of the lead can be effectively used for mounting other electronic components, joining connection components, and the like, the power module can be reduced in size.
Further, according to the present invention, the electronic element can be connected to both the connection lead and the detection lead simply by joining the electronic element to the connection lead and the detection lead. Therefore, it is possible to improve the manufacturing efficiency of the power module.
本発明の第一実施形態に係るパワーモジュールの要部を示す斜視図である。It is a perspective view which shows the principal part of the power module which concerns on 1st embodiment of this invention. 本発明の第二実施形態に係るパワーモジュールの要部を示す平面図である。It is a top view which shows the principal part of the power module which concerns on 2nd embodiment of this invention. 本発明の第三実施形態に係るパワーモジュールの要部を示す平面図である。It is a top view which shows the principal part of the power module which concerns on 3rd embodiment of this invention. 本発明の第三実施形態に係るパワーモジュールの要部の第一変形例を示す平面図である。It is a top view which shows the 1st modification of the principal part of the power module which concerns on 3rd embodiment of this invention. 本発明の第三実施形態に係るパワーモジュールの要部の第二変形例を示す平面図である。It is a top view which shows the 2nd modification of the principal part of the power module which concerns on 3rd embodiment of this invention. 本発明の第四実施形態に係るパワーモジュールの要部を示す断面図である。It is sectional drawing which shows the principal part of the power module which concerns on 4th embodiment of this invention. 本発明の他の実施形態に係るパワーモジュールの要部を示す断面図である。It is sectional drawing which shows the principal part of the power module which concerns on other embodiment of this invention. 本発明の他の実施形態に係るパワーモジュールの要部を示す断面図である。It is sectional drawing which shows the principal part of the power module which concerns on other embodiment of this invention.
〔第一実施形態〕
以下、主に図１を参照して本発明の第一実施形態について説明する。
本実施形態に係るパワーモジュール１００は、各種の電力制御を行うものである。図１に示すように、パワーモジュール１００は、複数のリード１，２，３，４を有するリードフレーム５と、リードフレーム５に実装される各種の電子部品６（図６参照）と、所定の電気的な機能を有する電子素子７と、を備える。図１には、電子素子７、及び、リードフレーム５のうち電子素子７と接合されるリード１，２，３，４だけが図示され、電子部品６や、電子部品６が実装されるリードフレーム５の部位は省略されている。 [First embodiment]
Hereinafter, a first embodiment of the present invention will be described mainly with reference to FIG.
The power module 100 according to the present embodiment performs various types of power control. As shown in FIG. 1, the power module 100 includes a lead frame 5 having a plurality of leads 1, 2, 3, 4, various electronic components 6 (see FIG. 6) mounted on the lead frame 5, And an electronic element 7 having an electrical function. FIG. 1 shows only the electronic element 7 and leads 1, 2, 3, and 4 joined to the electronic element 7 of the lead frame 5, and the electronic component 6 and the lead frame on which the electronic component 6 is mounted. The part 5 is omitted.
リードフレーム５は、例えば、銅板等のように導電性を有する導電性板材に、プレス加工等を施すことで得られる。
リードフレーム５の各リード１，２，３，４は、板状に形成されている。複数のリード１，２，３，４は、リードフレーム５の板厚方向（Ｚ軸方向）に直交する方向に、互いに間隔をあけて配列されている。複数のリード１，２，３，４は、電子部品６や電子素子７と電気的に接続されることで、電子部品６や電子素子７と共にパワーモジュール１００の回路を構成する。 The lead frame 5 is obtained, for example, by subjecting a conductive plate material having conductivity, such as a copper plate, to press processing.
Each lead 1, 2, 3, 4 of the lead frame 5 is formed in a plate shape. The plurality of leads 1, 2, 3, 4 are arranged at intervals from each other in a direction orthogonal to the plate thickness direction (Z-axis direction) of the lead frame 5. The plurality of leads 1, 2, 3, and 4 constitute a circuit of the power module 100 together with the electronic component 6 and the electronic element 7 by being electrically connected to the electronic component 6 and the electronic element 7.
電子素子７は、リード１，２，３，４に接合されることでリード１，２，３，４と電気的に接続される。電子素子７のうちリード１，２，３，４（特に後述の接続リード１，２）に接合される部分は、電子素子７の電極である。本実施形態において、電子素子７の電極は、所定の直線方向（Ｘ軸方向）の両端部に設けられている。各端部における電極の数は、例えば複数であってもよいが、本実施形態では一つである。
電子素子７は、例えばサイリスタ等のスイッチング素子（半導体素子）であってもよいし、チップコンデンサであってもよい。本実施形態の電子素子７は、シャント抵抗（抵抗素子）である。シャント抵抗である電子素子７は、例えばリードフレーム５と異なる種類の導電性部材によって構成されている。
電子素子７は、ブロック状など任意の形状に形成されてよいが、本実施形態の電子素子７は、平面視矩形の板状に形成されている。 The electronic element 7 is electrically connected to the leads 1, 2, 3, 4 by being joined to the leads 1, 2, 3, 4. Parts of the electronic element 7 that are joined to leads 1, 2, 3, 4 (particularly connection leads 1, 2 to be described later) are electrodes of the electronic element 7. In the present embodiment, the electrodes of the electronic element 7 are provided at both ends in a predetermined linear direction (X-axis direction). The number of electrodes at each end may be plural, for example, but is one in this embodiment.
The electronic element 7 may be a switching element (semiconductor element) such as a thyristor, or may be a chip capacitor. The electronic element 7 of this embodiment is a shunt resistor (resistive element). The electronic element 7 that is a shunt resistor is formed of, for example, a different type of conductive member from the lead frame 5.
The electronic element 7 may be formed in an arbitrary shape such as a block shape, but the electronic element 7 of the present embodiment is formed in a plate shape having a rectangular shape in plan view.
図６に例示するように、電子部品６は、複数のリード１，２の主面１１，２１（リードフレーム５の主面；リード１，２やリードフレーム５の板厚方向に直交する面）に重ねて配されることで、リードフレーム５に実装される。
電子部品６の具体的な構成は任意であってよい。図６に例示する電子部品６は、所定の電気的な機能を有する内蔵電子素子６１と、内蔵電子素子６１の電極に接続された端子６２と、を備える。内蔵電子素子６１は、例えば前述した電子素子７と同じであってもよいが、これに限ることはない。内蔵電子素子６１と端子６２とは、例えば直接接続されてもよいし、例えばワイヤ等の接続子を介して接続されてもよい。 As illustrated in FIG. 6, the electronic component 6 includes a plurality of main surfaces 11 and 21 of the leads 1 and 2 (main surfaces of the lead frame 5; surfaces orthogonal to the plate thickness direction of the leads 1 and 2 and the lead frame 5). As a result, the lead frame 5 is mounted.
The specific configuration of the electronic component 6 may be arbitrary. The electronic component 6 illustrated in FIG. 6 includes a built-in electronic element 61 having a predetermined electrical function, and a terminal 62 connected to the electrode of the built-in electronic element 61. The built-in electronic element 61 may be the same as the electronic element 7 described above, for example, but is not limited thereto. The built-in electronic element 61 and the terminal 62 may be directly connected, for example, or may be connected via a connector such as a wire.
電子部品６は、これら内蔵電子素子６１及び端子６２を封止する樹脂６３を備えてもよい。この場合、内蔵電子素子６１は樹脂６３の内部に埋められ、端子６２は樹脂６３の外部に露出していればよい。端子６２は、例えば図６のように樹脂６３から突出してもよいが、例えば突出しなくてもよい。
電子部品６は、例えば端子６２をリード１，２の主面１１，２１に接合することで、リードフレーム５に実装される。 The electronic component 6 may include a resin 63 that seals the built-in electronic element 61 and the terminal 62. In this case, the built-in electronic element 61 may be buried in the resin 63 and the terminal 62 may be exposed to the outside of the resin 63. The terminal 62 may protrude from the resin 63 as shown in FIG. 6, for example, but may not protrude, for example.
The electronic component 6 is mounted on the lead frame 5 by, for example, joining the terminal 62 to the main surfaces 11 and 21 of the leads 1 and 2.
図１に示すように、電子素子７に接合される複数のリード１，２，３，４には、複数の接続リード１，２と、二つの検出用リード３，４と、がある。
複数の接続リード１，２は、電子素子７を挟み込むように、接続リード１，２の板厚方向（Ｚ軸方向）に直交する第一直交方向（Ｘ軸方向）に互いに間隔をあけて配されている。本実施形態では、第一直交方向において電子素子７の両側に、接続リード１，２が一つずつ配されている。 As shown in FIG. 1, the plurality of leads 1, 2, 3, 4 joined to the electronic element 7 include a plurality of connection leads 1, 2 and two detection leads 3, 4.
The plurality of connection leads 1 and 2 are spaced from each other in a first orthogonal direction (X-axis direction) orthogonal to the plate thickness direction (Z-axis direction) of the connection leads 1 and 2 so as to sandwich the electronic element 7. It is arranged. In the present embodiment, one connection lead 1, 2 is arranged on each side of the electronic element 7 in the first orthogonal direction.
二つの検出用リード３，４は、第一直交方向に互いに間隔をあけて配されている。また、二つの検出用リード３，４は、接続リード１，２に対して板厚方向及び第一直交方向に直交する第二直交方向（Ｙ軸方向）に隣り合せて配されている。
本実施形態では、検出用リード３，４が接続リード１，２に対して間隔をあけて配されている。具体的には、第二直交方向に並ぶ接続リード１（２）と検出用リード３（４）とが、第二直交方向に互いに間隔をあけて位置している。 The two detection leads 3 and 4 are spaced apart from each other in the first orthogonal direction. The two detection leads 3 and 4 are arranged adjacent to the connection leads 1 and 2 in the second orthogonal direction (Y-axis direction) orthogonal to the plate thickness direction and the first orthogonal direction.
In the present embodiment, the detection leads 3 and 4 are arranged with a space from the connection leads 1 and 2. Specifically, the connection lead 1 (2) and the detection lead 3 (4) arranged in the second orthogonal direction are positioned at a distance from each other in the second orthogonal direction.
電子素子７は、第一直交方向に互いに間隔をあけて配された接続リード１，２間の側部１０，２０に接合されている。本実施形態の電子素子７は、シャント抵抗であり、パワーモジュール１００の回路に流れる電流（例えば電源電流）を検出する。このため、電子素子７は、二つの接続リード１，２を電気的に接続するように二つの接続リード１，２に接合されている。すなわち、本実施形態の電子素子７は、互いに向かい合う二つの接続リード１，２の側部１０，２０に接合されている。 The electronic element 7 is joined to the side portions 10 and 20 between the connection leads 1 and 2 that are spaced apart from each other in the first orthogonal direction. The electronic element 7 of the present embodiment is a shunt resistor and detects a current (for example, a power supply current) flowing through the circuit of the power module 100. For this reason, the electronic element 7 is joined to the two connection leads 1 and 2 so as to electrically connect the two connection leads 1 and 2. That is, the electronic element 7 of this embodiment is joined to the side portions 10 and 20 of the two connection leads 1 and 2 that face each other.
また、電子素子７は、二つの検出用リード３，４の側部３０，４０に接合されている。検出用リード３，４の側部３０，４０は、板厚方向に直交する方向に向く検出用リードの部位である。 The electronic element 7 is bonded to the side portions 30 and 40 of the two detection leads 3 and 4. The side portions 30 and 40 of the detection leads 3 and 4 are portions of the detection lead that face in a direction orthogonal to the plate thickness direction.
本実施形態において、電子素子７は、二つの検出用リード３，４の間に配されている。このため、電子素子７は、接続リード１，２の場合と同様に、第一直交方向に互いに向かい合う二つの検出用リード３，４間の側部３０，４０に接合されている。
また、本実施形態では、板厚方向から見た平面視で、電子素子７に接合される接続リード１，２の側部１０，２０及び検出用リード３，４の側部３０，４０が、第二直交方向に互いに平行して延びている。また、第二直交方向に並ぶ接続リード１（２）及び検出用リード３（４）に関し、第一直交方向における接続リード１（２）の側部１０（２０）及び検出用リード３（４）の側部３０（４０）の位置は、互いに一致している。 In the present embodiment, the electronic element 7 is disposed between the two detection leads 3 and 4. For this reason, the electronic element 7 is joined to the side portions 30 and 40 between the two detection leads 3 and 4 facing each other in the first orthogonal direction, as in the case of the connection leads 1 and 2.
In the present embodiment, the side portions 10 and 20 of the connection leads 1 and 2 and the side portions 30 and 40 of the detection leads 3 and 4 to be joined to the electronic element 7 in a plan view as viewed from the thickness direction, It extends in parallel to each other in the second orthogonal direction. Further, regarding the connection lead 1 (2) and the detection lead 3 (4) arranged in the second orthogonal direction, the side portion 10 (20) of the connection lead 1 (2) and the detection lead 3 (4) in the first orthogonal direction. The positions of the side portions 30 (40) of () coincide with each other.
二つの検出用リード３，４は、電子素子７に流れる電流を検出するために、上記のように電子素子７に接合されている。具体的に、二つの検出用リード３，４には、電子素子７に流れる電流を検出するための電流検出器（不図示）に接続される。
検出用リード３，４と電子素子７との接合面積は、電流検出器に過度の電流（大電流）が流れないように、例えば図１に示すように、接続リード１，２と電子素子７との接合面積よりも小さいとよい。 The two detection leads 3 and 4 are joined to the electronic element 7 as described above in order to detect a current flowing through the electronic element 7. Specifically, the two detection leads 3 and 4 are connected to a current detector (not shown) for detecting a current flowing through the electronic element 7.
For example, as shown in FIG. 1, the connection area between the detection leads 3 and 4 and the electronic element 7 is set so that an excessive current (large current) does not flow through the current detector. It is good that it is smaller than the bonding area.
以下、本実施形態のパワーモジュール１００について、さらに説明する。
本実施形態において、二つの接続リード１，２は、それぞれリードフレーム５の板厚方向に直交する方向に延びる帯板状に形成されている。二つの接続リード１，２は、例えば互いに異なる方向に延びていてもよいが、本実施形態では互いに同じ方向に延びている。
二つの接続リード１，２は、例えば二つの接続リード１，２の配列方向（第一直交方向）に一致する方向に延びてもよい。この場合、電子素子７は、二つの接続リード１，２のうち短手方向（図１においてＸ軸方向）に延びる側部に接合される。 Hereinafter, the power module 100 of the present embodiment will be further described.
In the present embodiment, the two connection leads 1 and 2 are each formed in a strip shape extending in a direction orthogonal to the thickness direction of the lead frame 5. The two connection leads 1 and 2 may extend in different directions, for example, but in this embodiment, extend in the same direction.
For example, the two connection leads 1 and 2 may extend in a direction coinciding with the arrangement direction (first orthogonal direction) of the two connection leads 1 and 2. In this case, the electronic element 7 is joined to a side portion of the two connection leads 1 and 2 extending in the short direction (X-axis direction in FIG. 1).
本実施形態において、二つの接続リード１，２は、二つの接続リード１，２の配列方向に直交する方向（第二直交方向）に延びている。このため、電子素子７は、二つの接続リード１，２のうち長手方向（図１においてＹ軸方向）に延びる側部１０，２０に接合される。より具体的に、電子素子７は、接続リード１，２の側部１０，２０のうち接続リード１，２の長手方向の端部に接合されている。 In the present embodiment, the two connection leads 1 and 2 extend in a direction (second orthogonal direction) orthogonal to the arrangement direction of the two connection leads 1 and 2. For this reason, the electronic element 7 is joined to the side portions 10 and 20 extending in the longitudinal direction (Y-axis direction in FIG. 1) of the two connection leads 1 and 2. More specifically, the electronic element 7 is joined to the longitudinal ends of the connection leads 1 and 2 of the side portions 10 and 20 of the connection leads 1 and 2.
本実施形態において、電子素子７が接合される接続リード１，２の側部１０，２０は、リードフレーム５の板厚方向（接続リード１，２の主面１１，１２，２１，２２に直交する方向）に延びる接続リード１，２の側面１３，２３である。接続リード１，２の側面１３，２３には、電子素子７の板厚方向（電子素子７の主面７１，７２に直交する方向）に延びる電子素子７の側面７３，７４が面接触して接合される。接続リード１，２に接合する電子素子７の側面７３，７４は、第一直交方向において互いに反対に向く面である。 In this embodiment, the side portions 10 and 20 of the connection leads 1 and 2 to which the electronic element 7 is joined are perpendicular to the plate thickness direction of the lead frame 5 (the main surfaces 11, 12, 21 and 22 of the connection leads 1 and 2). The side faces 13 and 23 of the connecting leads 1 and 2 extending in the direction of The side surfaces 73 and 74 of the electronic element 7 extending in the plate thickness direction of the electronic element 7 (direction orthogonal to the main surfaces 71 and 72 of the electronic element 7) are in surface contact with the side surfaces 13 and 23 of the connection leads 1 and 2. Be joined. The side surfaces 73 and 74 of the electronic element 7 bonded to the connection leads 1 and 2 are surfaces facing each other in the first orthogonal direction.
二つの検出用リード３，４は、接続リード１，２と同様の帯板状に形成されている。二つの検出用リード３，４は、各々任意の方向に延びていてよい。本実施形態において、二つの検出用リード３，４は、接続リード１，２と同様に、二つの検出用リード３，４の配列方向に直交する方向（第二直交方向）に延びている。
電子素子７は、検出用リード３，４の側部３０，４０のうち検出用リード３，４の長手方向（図１においてＹ軸方向）の端部に接合されている。 The two detection leads 3 and 4 are formed in a strip shape similar to the connection leads 1 and 2. The two detection leads 3 and 4 may each extend in an arbitrary direction. In the present embodiment, the two detection leads 3 and 4 extend in a direction (second orthogonal direction) perpendicular to the arrangement direction of the two detection leads 3 and 4, similarly to the connection leads 1 and 2.
The electronic element 7 is bonded to the end of the detection leads 3 and 4 in the longitudinal direction (Y-axis direction in FIG. 1) of the side portions 30 and 40 of the detection leads 3 and 4.
電子素子７が接合される検出用リード３，４の側部３０，４０は、リードフレーム５の板厚方向（検出用リード３，４の主面３１，３２，４１，４２に直交する方向）に延びる検出用リード３，４の側面３３，４３である。検出用リード３，４の側面３３，４３には、電子素子７の側面７３，７４が面接触して接合される。本実施形態において検出用リード３，４に接合する電子素子７の側面７３，７４は、第一直交方向において互いに反対に向く面である。 The side portions 30 and 40 of the detection leads 3 and 4 to which the electronic element 7 is bonded are in the thickness direction of the lead frame 5 (the direction orthogonal to the main surfaces 31, 32, 41 and 42 of the detection leads 3 and 4). These are side surfaces 33 and 43 of the detection leads 3 and 4 extending in the direction. The side surfaces 73 and 74 of the electronic element 7 are joined to the side surfaces 33 and 43 of the detection leads 3 and 4 in surface contact. In the present embodiment, the side surfaces 73 and 74 of the electronic element 7 bonded to the detection leads 3 and 4 are surfaces facing each other in the first orthogonal direction.
接続リード１，２及び検出用リード３，４と電子素子７とは、例えばはんだ等によって接合されてもよいが、本実施形態では溶接によって接合されている。 The connection leads 1 and 2 and the detection leads 3 and 4 and the electronic element 7 may be joined by, for example, solder or the like, but are joined by welding in this embodiment.
電子素子７は、例えば接続リード１，２の主面１１，１２，２１，２２や、検出用リード３，４の主面３１，３２，４１，４２から、板厚方向に突出するように、接続リード１，２及び検出用リード３，４に接合されてもよい。また、電子素子７は、例えば接続リード１，２の一方の主面１１，２１（１２，２２）や、検出用リード３，４の一方の主面３１，４１（３２，４２）と共に同一の平坦面をなすように、接続リード１，２及び検出用リード３，４に接合されてもよい。
本実施形態では、電子素子７の板厚が接続リード１，２、検出用リード３，４の板厚と同等とされている。そして、電子素子７は、接続リード１，２の両方の主面１１，１２，２１，２２、及び、検出用リード３，４の両方の主面３１，３２，４１，４２とそれぞれ同一の平坦面をなすように接続リード１，２及び検出用リード３，４に接合されている。 For example, the electronic element 7 protrudes in the plate thickness direction from the main surfaces 11, 12, 21, 22 of the connection leads 1, 2 and the main surfaces 31, 32, 41, 42 of the detection leads 3, 4. The connection leads 1 and 2 and the detection leads 3 and 4 may be joined. Further, the electronic element 7 is the same as one main surfaces 11 and 21 (12, 22) of the connection leads 1 and 2 and one main surfaces 31 and 41 (32 and 42) of the detection leads 3 and 4, for example. The connecting leads 1 and 2 and the detection leads 3 and 4 may be joined so as to form a flat surface.
In the present embodiment, the thickness of the electronic element 7 is equal to the thickness of the connection leads 1 and 2 and the detection leads 3 and 4. The electronic element 7 has the same flat surface as the main surfaces 11, 12, 21, 22 of both the connection leads 1, 2 and the main surfaces 31, 32, 41, 42 of the detection leads 3, 4. The connecting leads 1 and 2 and the detection leads 3 and 4 are joined so as to form a surface.
以上説明したように、本実施形態のパワーモジュール１００によれば、電子素子７が、接続リード１，２の側部１０，２０及び検出用リード３，４の側部３０，４０に接合されている。このため、接続リード１，２の主面１１，１２，２１，２２や、検出用リード３，４の主面３１，３２，４１，４２を他の電子部品６（図７参照）の搭載、ワイヤ等の接続部品の接合などに有効に活用できる。したがって、パワーモジュール１００の小型化を図ることができる。
また、電子素子７を、接続リード１，２及び検出用リード３，４に接合するだけで、電子素子７を接続リード１，２及び検出用リード３，４の両方に接続することができる。したがって、パワーモジュールの製造効率向上を図ることができる。 As described above, according to the power module 100 of the present embodiment, the electronic element 7 is joined to the side portions 10 and 20 of the connection leads 1 and 2 and the side portions 30 and 40 of the detection leads 3 and 4. Yes. For this reason, the main surfaces 11, 12, 21, 22 of the connection leads 1, 2 and the main surfaces 31, 32, 41, 42 of the detection leads 3, 4 are mounted on other electronic components 6 (see FIG. 7). It can be effectively used for joining connecting parts such as wires. Therefore, the power module 100 can be reduced in size.
Further, the electronic element 7 can be connected to both the connection leads 1 and 2 and the detection leads 3 and 4 simply by joining the electronic element 7 to the connection leads 1 and 2 and the detection leads 3 and 4. Therefore, it is possible to improve the manufacturing efficiency of the power module.
また、電子素子７を接続リード１，２の側部１０，２０及び検出用リード３，４の側部３０，４０に接合する場合には、電子素子７を接続リード１，２の主面１１，１２，２１，２２及び検出用リード３，４の主面３１，３２，４１，４２に接合する場合と比較して、パワーモジュール１００の薄型化（低背化）を図ることもできる。 When the electronic device 7 is joined to the side portions 10 and 20 of the connection leads 1 and 2 and the side portions 30 and 40 of the detection leads 3 and 4, the electronic device 7 is connected to the main surface 11 of the connection leads 1 and 2. , 12, 21, 22 and the main surfaces 31, 32, 41, 42 of the detection leads 3, 4, the power module 100 can be made thinner (low profile).
また、本実施形態のパワーモジュール１００によれば、電子素子７が第一直交方向に間隔をあけて配列された接続リード１，２の間や検出用リード３，４の間に配される。このため、接続リード１，２及び検出用リード３，４に対して電子素子７を接合する際に、治具等の別途部材を用いることなく、第一直交方向における電子素子７の位置決めを簡単に行うことができる。
また、接続リード１，２及び検出用リード３，４に対する電子素子７の接合に際し、治具等の別途部材を用いることなく、電子素子７が接続リード１，２や検出用リード３，４に対して位置決めされることで、電子素子７を各リード１，２，３，４に簡単に接合することができる。 Further, according to the power module 100 of the present embodiment, the electronic element 7 is disposed between the connection leads 1 and 2 and the detection leads 3 and 4 that are arranged at intervals in the first orthogonal direction. . Therefore, when the electronic element 7 is joined to the connection leads 1 and 2 and the detection leads 3 and 4, the electronic element 7 can be positioned in the first orthogonal direction without using a separate member such as a jig. It can be done easily.
Further, when the electronic element 7 is joined to the connection leads 1 and 2 and the detection leads 3 and 4, the electronic element 7 is connected to the connection leads 1 and 2 and the detection leads 3 and 4 without using a separate member such as a jig. By positioning with respect to the electronic element 7, the electronic element 7 can be easily joined to the leads 1, 2, 3, and 4.
また、本実施形態のパワーモジュール１００によれば、検出用リード３，４が接続リード１，２に対して間隔をあけて配されている。このため、仮に不具合によって電子素子７に電流（特に大電流）が流れなくなった場合に、接続リード１，２から検出用リード３，４に電流が流れることを防止できる。これにより、検出用リード３，４に接続される電流検出器に大電流が流れることを防ぐことができる、すなわち、電流検出器の保護を図ることができる。 Further, according to the power module 100 of the present embodiment, the detection leads 3 and 4 are arranged with a distance from the connection leads 1 and 2. For this reason, it is possible to prevent current from flowing from the connection leads 1 and 2 to the detection leads 3 and 4 if a current (particularly a large current) does not flow to the electronic element 7 due to a malfunction. Thereby, it is possible to prevent a large current from flowing through the current detector connected to the detection leads 3 and 4, that is, it is possible to protect the current detector.
また、本実施形態のパワーモジュール１００によれば、電子素子７に接合される接続リード１，２の側部１０，２０及び検出用リード３，４の側部３０，４０が、第二直交方向に互いに平行して延びている。このため、電子素子７を接続リード１，２及び検出用リード３，４に接合する前に、電子素子７を接続リード１，２及び検出用リード３，４に対して第二直交方向に移動させることで、接続リード１，２の側部１０，２０に対する電気部品の接合面積、及び、検出用リード３，４の側部３０，４０に対する接合面積を調整できる。例えば、電子素子７を第二直交方向において接続リード１，２側から検出用リード３，４側に移動させた場合、電子素子７と接続リード１，２との接合面積を減らし、電子素子７と検出用リード３，４との接合面積を増やすことができる。これにより、電子素子７と接続リード１，２との間で流れる電流の大きさ、検出用リード３，４と電子素子７との間で流れる電流の大きさを適宜設定することができる。 Further, according to the power module 100 of the present embodiment, the side portions 10 and 20 of the connection leads 1 and 2 and the side portions 30 and 40 of the detection leads 3 and 4 joined to the electronic element 7 are in the second orthogonal direction. Extending parallel to each other. Therefore, before joining the electronic element 7 to the connection leads 1 and 2 and the detection leads 3 and 4, the electronic element 7 is moved in the second orthogonal direction with respect to the connection leads 1 and 2 and the detection leads 3 and 4. By doing so, it is possible to adjust the bonding area of the electrical component to the side portions 10 and 20 of the connection leads 1 and 2 and the bonding area of the detection leads 3 and 4 to the side portions 30 and 40. For example, when the electronic element 7 is moved from the connection leads 1 and 2 to the detection leads 3 and 4 in the second orthogonal direction, the bonding area between the electronic element 7 and the connection leads 1 and 2 is reduced, and the electronic element 7 In addition, the bonding area between the detection leads 3 and 4 can be increased. Thereby, the magnitude of the current flowing between the electronic element 7 and the connection leads 1 and 2 and the magnitude of the current flowing between the detection leads 3 and 4 and the electronic element 7 can be appropriately set.
また、本実施形態のパワーモジュール１００によれば、接続リード１，２及び検出用リード３，４と電子素子７とが、溶接によって接合されている。このため、接続リード１，２及び検出用リード３，４と電子素子７とをはんだ付け等の別の接合手法で接合する場合と比較して、長期にわたって接続リード１，２、検出用リード３，４と電子素子７との接合状態を維持することができる。すなわち、パワーモジュール１００の信頼性向上を図ることができる。 Further, according to the power module 100 of the present embodiment, the connection leads 1 and 2 and the detection leads 3 and 4 and the electronic element 7 are joined by welding. Therefore, the connection leads 1 and 2 and the detection lead 3 are extended over a long period of time compared to the case where the connection leads 1 and 2 and the detection leads 3 and 4 and the electronic element 7 are joined by another joining method such as soldering. , 4 and the electronic element 7 can be maintained in a bonded state. That is, the reliability of the power module 100 can be improved.
また、本実施形態のパワーモジュール１００によれば、電子素子７が、接続リード１，２の主面１１，１２，２１，２２や、検出用リード３，４の主面３１，３２，４１，４２と共に同一の平坦面をなすように、接続リード１，２の側部１０，２０、検出用リード３，４の側部３０，４０に接合されている。このため、電子素子７及びこれに接合された接続リード１，２や検出用リード３，４を同一の放熱部材の平坦面に接触させることができる。すなわち、接続リード１，２、検出用リード３，４及び電子素子７を単純な形状の放熱部材に簡単に接触させることができる。
また、電子素子７を放熱部材に接触させることで、通電により電子素子７において生じた熱を効率よくパワーモジュール１００の外部に逃がすことができる。特に、本実施形態では、シャント抵抗である電子素子７の温度変化を抑えて、電子素子７の抵抗値が変化することを好適に抑制できる。 Further, according to the power module 100 of the present embodiment, the electronic element 7 includes the main surfaces 11, 12, 21, 22 of the connection leads 1, 2 and the main surfaces 31, 32, 41, of the detection leads 3, 4. 42 are joined to the side portions 10 and 20 of the connection leads 1 and 2 and the side portions 30 and 40 of the detection leads 3 and 4 so as to form the same flat surface. For this reason, the electronic element 7 and the connection leads 1 and 2 and the detection leads 3 and 4 joined thereto can be brought into contact with the flat surface of the same heat radiating member. That is, the connection leads 1 and 2, the detection leads 3 and 4, and the electronic element 7 can be easily brought into contact with a heat dissipation member having a simple shape.
Further, by bringing the electronic element 7 into contact with the heat radiating member, the heat generated in the electronic element 7 by energization can be efficiently released to the outside of the power module 100. In particular, in the present embodiment, it is possible to suppress a change in the resistance value of the electronic element 7 by suppressing the temperature change of the electronic element 7 that is a shunt resistor.
〔第二実施形態〕
次に、図２を参照して本発明の第二実施形態について説明する。本実施形態のパワーモジュールのうち第一実施形態のパワーモジュール１００と同じ構成については、同一符号を付す等して、その説明を省略する。 [Second Embodiment]
Next, a second embodiment of the present invention will be described with reference to FIG. Among the power modules of this embodiment, the same components as those of the power module 100 of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.
図２に例示する本実施形態のパワーモジュール１００Ｂは、第一実施形態と同様に、複数のリード１，２，３Ｂ，４Ｂを有するリードフレーム５Ｂと、リードフレーム５Ｂに実装される各種の電子部品６（図６参照）と、所定の電気的な機能を有する電子素子７と、を備える。図２には、電子素子７、及び、リードフレーム５Ｂのうち電子素子７と接合される二つの接続リード１，２及び二つの検出用リード３Ｂ，４Ｂのだけが図示され、電子部品６や、電子部品６が実装されるリードフレーム５Ｂの部位は省略されている。 As in the first embodiment, the power module 100B of this embodiment illustrated in FIG. 2 includes a lead frame 5B having a plurality of leads 1, 2, 3B, 4B and various electronic components mounted on the lead frame 5B. 6 (see FIG. 6) and an electronic element 7 having a predetermined electrical function. FIG. 2 shows only the electronic element 7 and the two connection leads 1 and 2 and the two detection leads 3B and 4B joined to the electronic element 7 of the lead frame 5B. A portion of the lead frame 5B on which the electronic component 6 is mounted is omitted.
本実施形態のパワーモジュール１００Ｂにおいて、電子素子７は、第一実施形態と同様に、平面視矩形の板状に形成され、互いに向かい合う二つの接続リード１，２の側部１０，２０に溶接によって接合されている。また、電子素子７は、第一実施形態と同様に、二つの検出用リード３Ｂ，４Ｂの側部３０Ｂ，４０Ｂに溶接によって接合されている。
ただし、本実施形態のパワーモジュール１００Ｂでは、検出用リード３Ｂ，４Ｂの側部３０Ｂ，４０Ｂが、電子素子７に対して第二直交方向（Ｙ軸方向）に当接する当接側部３４Ｂ，４４Ｂを有する。 In the power module 100B of the present embodiment, the electronic element 7 is formed in a rectangular plate shape in plan view, as in the first embodiment, and is welded to the side portions 10 and 20 of the two connection leads 1 and 2 facing each other. It is joined. Moreover, the electronic element 7 is joined to the side portions 30B and 40B of the two detection leads 3B and 4B by welding similarly to the first embodiment.
However, in the power module 100B of the present embodiment, the side portions 30B and 40B of the detection leads 3B and 4B are in contact with the electronic element 7 in the second orthogonal direction (Y-axis direction) 34B and 44B. Have
検出用リード３Ｂ，４Ｂの当接側部３４Ｂ，４４Ｂは、検出用リード３Ｂ，４Ｂの側部３０Ｂ，４０Ｂの任意の部位であってよい。本実施形態において、二つの検出用リード３Ｂ，４Ｂは、第一実施形態と同様に、第二直交方向に互いに平行して延びている。ただし、第一直交方向における二つの検出用リード３Ｂ，４Ｂの間隔は、第一直交方向における電子素子７の寸法よりも小さくなっている。このため、本実施形態における検出用リード３Ｂ，４Ｂの当接側部３４Ｂ，４４Ｂは、検出用リード３Ｂ，４Ｂの側部３０Ｂ，４０Ｂのうち帯板状に形成された検出用リード３Ｂ，４Ｂの長手方向の端部に位置する部位となっている。
検出用リード３Ｂ，４Ｂの当接側部３４Ｂ，４４Ｂは、第二直交方向に向く電子素子７の側面７５に面接触して接合される。 The contact side portions 34B and 44B of the detection leads 3B and 4B may be arbitrary portions of the side portions 30B and 40B of the detection leads 3B and 4B. In the present embodiment, the two detection leads 3B and 4B extend in parallel to each other in the second orthogonal direction as in the first embodiment. However, the distance between the two detection leads 3B and 4B in the first orthogonal direction is smaller than the dimension of the electronic element 7 in the first orthogonal direction. For this reason, the contact side portions 34B and 44B of the detection leads 3B and 4B in the present embodiment are the detection leads 3B and 4B formed in a band plate shape among the side portions 30B and 40B of the detection leads 3B and 4B. It is the site | part located in the edge part of the longitudinal direction.
The contact side portions 34B and 44B of the detection leads 3B and 4B are joined in surface contact with the side surface 75 of the electronic element 7 facing the second orthogonal direction.
本実施形態のパワーモジュール１００Ｂによれば、第一実施形態と同様の効果を奏する。
また、本実施形態のパワーモジュール１００Ｂによれば、検出用リード３Ｂ，４Ｂの側部３０Ｂ，４０Ｂが、電子素子７に対して第二直交方向に当接する当接側部３４Ｂ，４４Ｂを有する。このため、接続リード１，２及び検出用リード３Ｂ，４Ｂに対して電子素子７を接合する際に、治具等の別途部材を用いることなく、第二直交方向における電子素子７の位置決めを簡単に行うことができる。これにより、接続リード１，２に対する電子素子７の位置ずれに基づいて、接続リード１，２及び電子素子７を含むパワーモジュールの回路の電気的特性（例えば抵抗値）に誤差が生じることを好適に抑制できる。 According to the power module 100B of the present embodiment, the same effects as those of the first embodiment can be obtained.
Further, according to the power module 100B of the present embodiment, the side portions 30B and 40B of the detection leads 3B and 4B have contact side portions 34B and 44B that contact the electronic element 7 in the second orthogonal direction. Therefore, when the electronic element 7 is joined to the connection leads 1 and 2 and the detection leads 3B and 4B, the electronic element 7 can be easily positioned in the second orthogonal direction without using a separate member such as a jig. Can be done. Accordingly, it is preferable that an error occurs in the electrical characteristics (for example, resistance value) of the circuit of the power module including the connection leads 1 and 2 and the electronic element 7 based on the positional deviation of the electronic element 7 with respect to the connection leads 1 and 2. Can be suppressed.
〔第三実施形態〕
次に、図３－５を参照して本発明の第三実施形態について説明する。本実施形態のパワーモジュールのうち第一実施形態のパワーモジュール１００と同じ構成については、同一符号を付す等して、その説明を省略する。 [Third embodiment]
Next, a third embodiment of the present invention will be described with reference to FIGS. 3-5. Among the power modules of this embodiment, the same components as those of the power module 100 of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.
図３に例示する本実施形態のパワーモジュール１００Ｃは、第一実施形態と同様に、複数のリード１Ｃ，２Ｃ，３Ｃ，４Ｃを有するリードフレーム５Ｃと、リードフレーム５Ｃに実装される各種の電子部品６（図６参照）と、所定の電気的な機能を有する電子素子７と、を備える。図３には、電子素子７、及び、リードフレーム５Ｃのうち電子素子７と接合される二つの接続リード１Ｃ，２Ｃ及び二つの検出用リード３Ｃ，４Ｃのだけが図示され、電子部品６や、電子部品６が実装されるリードフレーム５Ｃの部位は省略されている。 As in the first embodiment, the power module 100C of this embodiment illustrated in FIG. 3 includes a lead frame 5C having a plurality of leads 1C, 2C, 3C, and 4C and various electronic components mounted on the lead frame 5C. 6 (see FIG. 6) and an electronic element 7 having a predetermined electrical function. FIG. 3 shows only the electronic element 7 and the two connection leads 1C, 2C and the two detection leads 3C, 4C to be joined to the electronic element 7 of the lead frame 5C. A portion of the lead frame 5C on which the electronic component 6 is mounted is omitted.
本実施形態のパワーモジュール１００Ｂにおいて、電子素子７は、第一実施形態と同様に、平面視矩形の板状に形成され、互いに向かい合う二つの接続リード１Ｃ，２Ｃの側部１０Ｃ，２０Ｃ及び検出用リード３Ｃ，４Ｃの側部３０Ｃ，４０Ｃに溶接によって接合されている。
ただし、本実施形態のパワーモジュール１００Ｃでは、各検出用リード３Ｃ，４Ｃが、各接続リード１Ｃ，２Ｃに一体に形成されている。具体的には、第二直交方向に並ぶ接続リード１Ｃ（２Ｃ）と検出用リード３Ｃ（４Ｃ）とが一体に形成されている。 In the power module 100B of the present embodiment, the electronic element 7 is formed in a rectangular plate shape in plan view as in the first embodiment, and the side portions 10C and 20C of the two connection leads 1C and 2C facing each other and for detection. The leads 3C and 4C are joined to the side portions 30C and 40C by welding.
However, in the power module 100C of this embodiment, the detection leads 3C and 4C are integrally formed with the connection leads 1C and 2C. Specifically, the connection lead 1C (2C) and the detection lead 3C (4C) arranged in the second orthogonal direction are integrally formed.
また、本実施形態では、第一実施形態と同様に、板厚方向から見た平面視で、電子素子７に接合される接続リード１Ｃ，２Ｃの側部１０Ｃ，２０Ｃ及び検出用リード３Ｃ，４Ｃの側部３０Ｃ，４０Ｃが、第二直交方向に互いに平行して延びている。また、第二直交方向に並ぶ接続リード１Ｃ（２Ｃ）及び検出用リード３Ｃ（４Ｃ）に関し、第一直交方向における接続リード１Ｃ（２Ｃ）の側部１０Ｃ（２０Ｃ）及び検出用リード３Ｃ（４Ｃ）の側部３０Ｃ（４０Ｃ）の位置が、互いに一致している。 In the present embodiment, similarly to the first embodiment, the side portions 10C and 20C of the connection leads 1C and 2C and the detection leads 3C and 4C to be joined to the electronic element 7 in a plan view as viewed from the thickness direction. The side portions 30C and 40C extend in parallel to each other in the second orthogonal direction. Further, regarding the connection lead 1C (2C) and the detection lead 3C (4C) arranged in the second orthogonal direction, the side portion 10C (20C) of the connection lead 1C (2C) and the detection lead 3C (4C) in the first orthogonal direction. ) Side portions 30C (40C) are aligned with each other.
本実施形態のパワーモジュール１００Ｃによれば、第一実施形態と同様の効果を奏する。
また、本実施形態のパワーモジュール１００Ｃによれば、各検出用リード３Ｃ，４Ｃが、各接続リード１Ｃ，２Ｃに一体に形成されている。このため、第一実施形態のように接続リード１，２と検出用リード３，４とが間隔をあけて配される場合と比較して、接続リード１Ｃ，２Ｃ及び検出用リード３Ｃ，４Ｃと電子素子７との接合箇所を減らすことができる。具体的には、接続リード１Ｃ，２Ｃ及び検出用リード３Ｃ，４Ｃと電子素子７との接合箇所を四箇所から二箇所に減らすことができる。これにより、パワーモジュール１００Ｃの製造効率向上をさらに図ることができる。 According to the power module 100C of the present embodiment, the same effects as those of the first embodiment can be obtained.
Further, according to the power module 100C of the present embodiment, the detection leads 3C and 4C are integrally formed with the connection leads 1C and 2C. For this reason, the connection leads 1C and 2C and the detection leads 3C and 4C are compared with the case where the connection leads 1 and 2 and the detection leads 3 and 4 are spaced apart as in the first embodiment. The number of joints with the electronic element 7 can be reduced. Specifically, the number of joints between the connection leads 1C and 2C and the detection leads 3C and 4C and the electronic element 7 can be reduced from four to two. Thereby, the manufacturing efficiency of the power module 100C can be further improved.
上記した第三実施形態の構成は、第二実施形態のパワーモジュール１００Ｂにも適用可能である。
例えば図４，５に示すように、接続リード１Ｃ，２Ｃと一体に形成された検出用リード３Ｃ，４Ｃの側部３０Ｃ，４０Ｃは、第二実施形態と同様に、電子素子７に対して第二直交方向に当接する当接側部３４Ｃ，４４Ｃを有してもよい。 The configuration of the third embodiment described above can also be applied to the power module 100B of the second embodiment.
For example, as shown in FIGS. 4 and 5, the side portions 30C and 40C of the detection leads 3C and 4C formed integrally with the connection leads 1C and 2C are the same as those of the electronic element 7 as in the second embodiment. You may have the contact | abutting side part 34C and 44C which contact | abuts in two orthogonal directions.
また、例えば図５に示すように、電子素子７に接合される接続リード１Ｃ，２Ｃの側部１０Ｃ，２０Ｃは、電子素子７に対して第二直交方向に当接する当接側部１４Ｃ，２４Ｃを有してもよい。図５に例示するように、接続リード１Ｃ，２Ｃの側部１０Ｃ，２０Ｃが当接側部１４Ｃ，２４Ｃを有し、かつ、検出用リード３Ｃ，４Ｃの側部３０Ｃ，４０Ｃが当接側部３４Ｃ，４４Ｃを有する場合、接続リード１Ｃ，２Ｃの当接側部１４Ｃ，２４Ｃと検出用リード３Ｃ，４Ｃの当接側部３４Ｃ，４４Ｃとは、第二直交方向において対向するとよい。 For example, as shown in FIG. 5, the side portions 10C and 20C of the connection leads 1C and 2C joined to the electronic element 7 are in contact with the electronic element 7 in the second orthogonal direction. You may have. As illustrated in FIG. 5, the side portions 10C and 20C of the connection leads 1C and 2C have contact side portions 14C and 24C, and the side portions 30C and 40C of the detection leads 3C and 4C are contact side portions. When 34C and 44C are provided, the contact side portions 14C and 24C of the connection leads 1C and 2C and the contact side portions 34C and 44C of the detection leads 3C and 4C are preferably opposed to each other in the second orthogonal direction.
このような構成では、電子素子７を接続リード１Ｃ，２Ｃの当接側部１４Ｃ，２４Ｃ及び検出用リード３Ｃ，４Ｃの当接側部３４Ｃ，４４Ｃの両方に当接させることで、接続リード１Ｃ，２Ｃ及び検出用リード３Ｃ，４Ｃに対して電子素子７を接合する際に、電子素子７が、接続リード１Ｃ，２Ｃ及び検出用リード３Ｃ，４Ｃに対して第二直交方向に位置ずれすることを確実に防ぐことができる。 In such a configuration, the electronic element 7 is brought into contact with both the contact side portions 14C and 24C of the connection leads 1C and 2C and the contact side portions 34C and 44C of the detection leads 3C and 4C, thereby connecting the connection lead 1C. , 2C and the detection leads 3C, 4C, the electronic element 7 is displaced in the second orthogonal direction with respect to the connection leads 1C, 2C and the detection leads 3C, 4C. Can be surely prevented.
図５に例示した構成（接続リード１Ｃ，２Ｃが当接側部１４Ｃ，２４Ｃを有する構成）は、接続リード１Ｃ，２Ｃと検出用リード３Ｃ，４Ｃとを一体に形成した構成に限らず、第一、第二実施形態のように、接続リード１，２と検出用リード３，４（３Ｂ，４Ｂ）とが互いに間隔をあけて配された構成にも適用可能である。 The configuration illustrated in FIG. 5 (the configuration in which the connection leads 1C and 2C have the contact side portions 14C and 24C) is not limited to the configuration in which the connection leads 1C and 2C and the detection leads 3C and 4C are integrally formed. As in the first and second embodiments, the present invention can also be applied to a configuration in which the connection leads 1 and 2 and the detection leads 3 and 4 (3B and 4B) are spaced apart from each other.
〔第四実施形態〕
次に、図６を参照して本発明の第四実施形態について説明する。本実施形態のパワーモジュールのうち第一実施形態のパワーモジュール１００と同じ構成については、同一符号を付す等して、その説明を省略する。 [Fourth embodiment]
Next, a fourth embodiment of the present invention will be described with reference to FIG. Among the power modules of this embodiment, the same components as those of the power module 100 of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.
図６に例示する本実施形態のパワーモジュール１００Ｄは、第一実施形態のパワーモジュール１００（図１参照）と同様に構成されている。
その上で、本実施形態のパワーモジュール１００Ｄは、シャント抵抗である電子素子７と電気的に並列接続された電子部品６（並列接続部品）を備える。本実施形態の電子部品６は、電子素子７に対して接続リード１，２の板厚方向に間隔をあけて配されている。電子部品６は、電子素子７に接合された二つの接続リード１，２に電気的に接続されている。具体的には、電子部品６の各端子６２が、二つの接続リード１，２の一方の主面１１，２１にそれぞれはんだ等によって接合されている。 The power module 100D of this embodiment illustrated in FIG. 6 is configured similarly to the power module 100 (see FIG. 1) of the first embodiment.
In addition, the power module 100D of this embodiment includes an electronic component 6 (parallel connection component) that is electrically connected in parallel with the electronic element 7 that is a shunt resistor. The electronic component 6 according to the present embodiment is disposed with an interval in the thickness direction of the connection leads 1 and 2 with respect to the electronic element 7. The electronic component 6 is electrically connected to two connection leads 1 and 2 joined to the electronic element 7. Specifically, each terminal 62 of the electronic component 6 is joined to one main surface 11, 21 of the two connection leads 1, 2 by solder or the like.
本実施形態のパワーモジュール１００Ｄによれば、第一実施形態と同様の効果を奏する。
また、本実施形態のパワーモジュール１００Ｄによれば、電子部品６が電子素子７に対して接続リード１，２の板厚方向に間隔をあけて配されている。このため、リードフレーム５の板厚方向から見たリードフレーム５における電子部品６の実装領域を小さく抑えることができる。これにより、パワーモジュール１００Ｄの小型化をさらに図ることができる。 According to the power module 100D of the present embodiment, the same effects as those of the first embodiment can be obtained.
Further, according to the power module 100 </ b> D of the present embodiment, the electronic component 6 is arranged with a space in the plate thickness direction of the connection leads 1 and 2 with respect to the electronic element 7. For this reason, the mounting area of the electronic component 6 in the lead frame 5 as viewed from the thickness direction of the lead frame 5 can be suppressed small. Thereby, size reduction of power module 100D can further be achieved.
上記した第四実施形態の構成は、第二、第三実施形態のパワーモジュール１００Ｂ，１００Ｃにも適用可能である。 The configuration of the fourth embodiment described above can also be applied to the power modules 100B and 100C of the second and third embodiments.
以上、本発明の詳細について説明したが、本発明は上述した実施形態に限定されるものではなく、本発明の主旨を逸脱しない範囲において種々の変更を加えることができる。 Although the details of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.
本発明のパワーモジュールにおいては、例えば図７，８に示すように、リードフレーム５Ｅ，５Ｆの接続リード１Ｅ，２Ｅ，１Ｆ，２Ｆが、電子素子７，７Ｆを板厚方向（Ｚ軸方向）から支持するように構成されてもよい。 In the power module of the present invention, for example, as shown in FIGS. 7 and 8, the connection leads 1E, 2E, 1F, and 2F of the lead frames 5E and 5F connect the electronic elements 7 and 7F from the plate thickness direction (Z-axis direction). It may be configured to support.
図７に例示するパワーモジュール１００Ｅでは、電子素子７が、接続リード１Ｅ，２Ｅの側部１０Ｅ，２０Ｅから突出する支持突起１７Ｅ，２７Ｅによって支持されている。図示例の支持突起１７Ｅ，２７Ｅは、接続リード１Ｅ，２Ｅの板厚よりも小さい平板状に形成されているが、これに限ることはない。 In the power module 100E illustrated in FIG. 7, the electronic element 7 is supported by support protrusions 17E and 27E protruding from the side portions 10E and 20E of the connection leads 1E and 2E. The support protrusions 17E and 27E in the illustrated example are formed in a flat plate shape smaller than the plate thickness of the connection leads 1E and 2E, but are not limited thereto.
図８に例示するパワーモジュール１００Ｆでは、互いに向かい合う二つの接続リード１Ｆ，２Ｆの側部１０Ｆ，２０Ｆに、接続リード１Ｆ，２Ｆの板厚方向の一方側（図８において下側）から他方側（図８において上側）に向かうにしたがって互いに離れる傾斜面１６Ｆ，２６Ｆが形成されている。
電子素子７Ｆは、二つの接続リード１Ｆ，２Ｆの間に配された状態で、二つの接続リード１Ｆ，２Ｆの傾斜面１６Ｆ，２６Ｆに面接触する断面テーパー形状に形成されている。具体的には、二つの接続リード１Ｆ，２Ｆの傾斜面１６Ｆ，２６Ｆにそれぞれ面接触する電子素子７Ｆの二つの側面７３Ｆ，７４Ｆが、電子素子７Ｆの板厚方向の一方側（図８において電子素子７Ｆの一方の主面７１Ｆ側）から他方側（図８において電子素子７Ｆの他方の主面７２Ｆ側）に向かうにしたがって互いに離れるように傾斜している。 In the power module 100F illustrated in FIG. 8, the side portions 10F and 20F of the two connection leads 1F and 2F facing each other are connected to the other side (from the lower side in FIG. 8) in the plate thickness direction of the connection leads 1F and 2F. Inclined surfaces 16F and 26F that are separated from each other toward the upper side in FIG. 8 are formed.
The electronic element 7F is formed in a tapered shape in cross section that is in surface contact with the inclined surfaces 16F and 26F of the two connection leads 1F and 2F in a state of being arranged between the two connection leads 1F and 2F. Specifically, the two side surfaces 73F and 74F of the electronic element 7F that are in surface contact with the inclined surfaces 16F and 26F of the two connection leads 1F and 2F, respectively, are on one side in the plate thickness direction of the electronic element 7F (in FIG. The elements 7F are inclined so as to be separated from each other as they go from the one main surface 71F side) to the other side (the other main surface 72F side of the electronic element 7F in FIG. 8).
図７の支持突起１７Ｅ，２７Ｅや図８の傾斜面１６Ｆ，２６Ｆは、例えば検出用リードにも適用されてよい。 The support protrusions 17E and 27E in FIG. 7 and the inclined surfaces 16F and 26F in FIG. 8 may be applied to, for example, a detection lead.
図７，８に例示したパワーモジュール１００Ｅ，１００Ｆによれば、接続リード１Ｅ，２Ｅ，１Ｆ，２Ｆや検出用リードに対して電子素子７，７Ｆを接合する際に、治具等の別途部材を用いることなく、板厚方向における電子素子７，７Ｆの位置決めを簡単に行うことができる。
図８に例示したパワーモジュール１００Ｆによれば、電子素子７Ｆを板厚方向における接続リード１Ｆ，２Ｆの他方側（図８において上側）から簡単に二つの接続リード１Ｆ，２Ｆの間に挿入できる。 According to the power modules 100E and 100F illustrated in FIGS. 7 and 8, when the electronic elements 7 and 7F are joined to the connection leads 1E, 2E, 1F and 2F and the detection leads, a separate member such as a jig is used. Without using it, the electronic elements 7 and 7F can be easily positioned in the thickness direction.
According to the power module 100F illustrated in FIG. 8, the electronic element 7F can be easily inserted between the two connection leads 1F and 2F from the other side (upper side in FIG. 8) of the connection leads 1F and 2F in the plate thickness direction.
本発明において、電子素子に接合される接続リードの数は、二つに限らず、電子素子の種類に応じて変えてよい。例えば、電子素子がスイッチング素子等のように三つの電極を有する場合には、電子素子の一方の端部に設けられた二つの電極のそれぞれに二つのリードの側部に接合し、電子素子の他方の端部に設けられた一つの電極に別の一つのリードの側部を接合してもよい。 In the present invention, the number of connection leads joined to the electronic element is not limited to two, and may be changed according to the type of the electronic element. For example, when the electronic element has three electrodes such as a switching element, the two electrodes provided at one end of the electronic element are bonded to the side portions of the two leads. Another side of one lead may be joined to one electrode provided at the other end.
１，１Ｃ，１Ｅ，１Ｆ　接続リード（リード）
１０，１０Ｃ，１０Ｅ，１０Ｆ　側部
１１，１２　主面
１３　側面
１４Ｂ　当接側部
２，２Ｃ，２Ｅ，２Ｆ　接続リード（リード）
２０，２０Ｃ，２０Ｅ，２０Ｆ　側部
２１，２２　主面
２３　側面
２４Ｂ　当接側部
３，３Ｂ，３Ｃ　検出用リード（リード）
３０，３０Ｂ，３０Ｃ　側部
３１，３２　主面
３３　側面
３４Ｂ，３４Ｃ　当接側部
４，４Ｂ，４Ｃ　検出用リード（リード）
４０，４０Ｂ，４０Ｃ　側部
４１，４２　主面
４３　側面
４４Ｂ，４４Ｃ　当接側部
５，５Ｂ，５Ｃ，５Ｅ，５Ｆ　リードフレーム
６　電子部品（並列接続部品）
７　電子素子
１００，１００Ｂ，１００Ｃ，１００Ｄ，１００Ｅ，１００Ｆ　パワーモジュール 1,1C, 1E, 1F Connection lead (lead)
10, 10C, 10E, 10F Side portions 11, 12 Main surface 13 Side surface 14B Abutting side portions 2, 2C, 2E, 2F Connection lead (lead)
20, 20C, 20E, 20F Side portions 21, 22 Main surface 23 Side surface 24B Abutting side portions 3, 3B, 3C Detection lead (lead)
30, 30B, 30C Side portion 31, 32 Main surface 33 Side surface 34B, 34C Abutting side portion 4, 4B, 4C Detection lead (lead)
40, 40B, 40C Side portions 41, 42 Main surface 43 Side surfaces 44B, 44C Abutting side portions 5, 5B, 5C, 5E, 5F Lead frame 6 Electronic component (parallel connection component)
7 Electronic device 100, 100B, 100C, 100D, 100E, 100F Power module

Claims (8)

  1. 複数のリードを有するリードフレームに電子部品を実装して構成され、電力制御を行うパワーモジュールであって、
    所定の電気的な機能を有する電子素子が、複数の前記リードのうち板厚方向に直交する第一直交方向に互いに間隔をあけて配された接続リード間の側部に接合され、かつ、複数の前記リードのうち前記接続リードに対して前記板厚方向及び前記第一直交方向に直交する第二直交方向に隣り合せて配されると共に、前記第一直交方向に互いに間隔をあけて配されて前記電子素子に流れる電流を検出するための二つの検出用リードの側部に接合されているパワーモジュール。     A power module configured by mounting electronic components on a lead frame having a plurality of leads and performing power control,
    An electronic element having a predetermined electrical function is bonded to a side portion between connecting leads arranged at a distance from each other in a first orthogonal direction orthogonal to the plate thickness direction among the plurality of leads; and Among the plurality of leads, the lead is disposed adjacent to the connection lead in the plate thickness direction and the second orthogonal direction orthogonal to the first orthogonal direction, and spaced from each other in the first orthogonal direction. And a power module that is joined to the sides of two detection leads for detecting a current flowing through the electronic element.
  2. 前記検出用リードが、前記接続リードに対して間隔をあけて配されている請求項１に記載のパワーモジュール。 The power module according to claim 1, wherein the detection leads are arranged at an interval from the connection leads.
  3. 各検出用リードが、各接続リードに一体に形成されている請求項１に記載のパワーモジュール。 The power module according to claim 1, wherein each detection lead is formed integrally with each connection lead.
  4. 前記電子素子が、二つの前記検出用リードの間に配され、
    前記板厚方向から見た平面視で、前記電子素子に接合される前記接続リードの側部、及び、前記検出用リードの側部の少なくとも一部が、前記第二直交方向に互いに平行して延びている請求項１から請求項３のいずれか一項に記載のパワーモジュール。     The electronic element is disposed between the two detection leads;
    In a plan view as viewed from the plate thickness direction, at least a part of the side portion of the connection lead joined to the electronic element and the side portion of the detection lead are parallel to the second orthogonal direction. The power module according to any one of claims 1 to 3, wherein the power module extends.
  5. 前記検出用リードの側部が、前記電子素子に対して前記第二直交方向に当接する当接側部を有する請求項１から請求項４のいずれか一項に記載のパワーモジュール。 The power module according to any one of claims 1 to 4, wherein a side portion of the detection lead has a contact side portion that contacts the electronic element in the second orthogonal direction.
  6. 前記接続リード及び前記検出用リードと前記電子素子とが、溶接によって接合されている請求項１から請求項５のいずれか一項に記載のパワーモジュール。 The power module according to any one of claims 1 to 5, wherein the connection lead, the detection lead, and the electronic element are joined by welding.
  7. 前記電子素子がシャント抵抗であり、
    さらに、前記シャント抵抗に対して前記板厚方向に間隔をあけて配され、前記第一直交方向に並ぶ二つの前記接続リードに接続されることで、前記シャント抵抗と並列接続された並列接続部品を備える請求項１から請求項６のいずれか一項に記載のパワーモジュール。     The electronic element is a shunt resistor;
    Furthermore, the parallel connection is arranged in parallel with the shunt resistor by being connected to the two connection leads arranged in the plate thickness direction with an interval with respect to the shunt resistor and arranged in the first orthogonal direction. The power module according to any one of claims 1 to 6, comprising a component.
  8. 前記電子素子が、前記接続リードの少なくとも一方の主面と共に同一の平坦面をなすように、前記接続リードの側部に接合された請求項１から請求項７のいずれか一項に記載のパワーモジュール The power according to any one of claims 1 to 7, wherein the electronic element is bonded to a side portion of the connection lead so as to form the same flat surface with at least one main surface of the connection lead. module
PCT/JP2017/021611 2017-06-12 2017-06-12 Power module WO2018229817A1 (en)

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