WO2018210168A1 - 彩膜基板及其制备方法、显示装置 - Google Patents
彩膜基板及其制备方法、显示装置 Download PDFInfo
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- WO2018210168A1 WO2018210168A1 PCT/CN2018/086133 CN2018086133W WO2018210168A1 WO 2018210168 A1 WO2018210168 A1 WO 2018210168A1 CN 2018086133 W CN2018086133 W CN 2018086133W WO 2018210168 A1 WO2018210168 A1 WO 2018210168A1
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/003—Light absorbing elements
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/201—Filters in the form of arrays
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133512—Light shielding layers, e.g. black matrix
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
- G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
- G02F1/133519—Overcoatings
Definitions
- the present disclosure relates to the field of display technologies, and in particular, to a color film substrate, a method for fabricating the same, and a display device.
- a color filter (CF) substrate is one of the important components in a display panel.
- the backlight transmitted from the liquid crystal layer or the white light emitted from the organic electroluminescent device passes through the color resistance of red, green, blue and the like arranged in an array on the color filter substrate, thereby emitting various colors such as red, green and blue.
- a black matrix (abbreviated as BM) is usually disposed on the color filter substrate.
- the black matrix is formed with a plurality of spaced apart hollow regions arranged in an array, and the color resistance of the adjacent colors is coated in the hollow region of the black matrix to achieve the purpose of preventing crosstalk.
- the adhesion between the BM material and the substrate of the color filter substrate is weak, the peeling problem easily occurs, which affects the normal display of the display panel. For example, in the liquid crystal display panel, bubble defects in the liquid crystal cell may occur after the BM material is peeled off.
- Embodiments of the present disclosure provide a method of fabricating a color filter substrate, the method comprising: providing a substrate, the surface of the substrate comprising a plurality of independent color resist regions and a plurality of spacer regions, each interval a region is located between adjacent two color resisting regions; a color resist pattern is formed in the color resisting region, a light transmissive filling pattern is formed in the spacer region; and the filling pattern is blackened to make The filling pattern is converted into an opaque pattern.
- the step of blackening the filling pattern to convert the filling pattern into an opaque pattern comprises: using a mask, using laser burning, ultraviolet exposure, carbonization, and ion doping Any one of the methods of treating the filling pattern to make the filling pattern opaque; wherein the transparent region of the mask exposes the filling pattern, and the mask is impervious The light region blocks the color resist pattern.
- a color resist pattern is formed in the color resist region, a light transmissive fill pattern is formed in the spacer region, and a blackening process is performed on the fill pattern such that the fill pattern is changed to no
- the step of transmitting a light-transmissive pattern includes: forming a color resist pattern in the color resistive region, forming a light-transmissive filling pattern having a predetermined thickness in the spacer region; the filling pattern being a material of the color resist pattern Or a transparent filling material; and blackening the filling pattern such that the filling pattern is converted into an opaque pattern.
- the fill pattern includes a first fill pattern and a second fill pattern disposed in a stack; a color resist pattern is formed in the color resist region, and a light transmissive fill pattern is formed in the spacer region;
- the step of performing a blackening process on the filling pattern to convert the filling pattern into an opaque pattern includes: forming a color resist pattern in the color resist region, and forming a predetermined thickness in the spacer region a first filling pattern; the first filling pattern is composed of a material of the color resist pattern or a transparent filling material; forming a protective layer covering the color resist pattern and the first filling pattern; wherein the protective layer covers The portion of the first filling pattern is a second filling pattern; the protective layer is composed of a transparent filling material; and the second filling pattern is blackened so that the filling pattern is converted into an opaque pattern.
- the fill pattern includes a first fill pattern, a second fill pattern, and a spacer pattern disposed in a stack; a color resist pattern is formed in the color resist region, and light is formed in the spacer region a filling pattern; and a step of blackening the filling pattern to convert the filling pattern into an opaque pattern, comprising: forming a color resist pattern in the color resist region, forming in the spacer region a first filling pattern having a predetermined thickness; the first filling pattern being composed of a material of the color resist pattern or a transparent filling material; forming a protective layer covering the color resist pattern and the first filling pattern; The portion of the protective layer covering the first filling pattern is a second filling pattern; the protective layer is composed of a transparent filling material; a spacer pattern is formed on the second filling pattern; Forming a transparent filling material; blackening the pattern of the spacers to convert the filling pattern into an opaque pattern.
- a color resist pattern is formed in the color resist region, a light transmissive fill pattern is formed in the spacer region, and a blackening process is performed on the fill pattern such that the fill pattern is changed to no a step of forming a light-transmitting pattern, comprising: forming a color resist pattern in the color resistive region; forming a protective layer covering the color resist pattern and the spacer region; wherein a portion of the protective layer covering the spacer region is a filling pattern; the protective layer is composed of a transparent filling material; the filling pattern is blackened so that the filling pattern is converted into an opaque pattern.
- the fill pattern includes a first fill pattern and a spacer pattern disposed in a stack; a color resist pattern is formed in the color resist region, and a light transmissive fill pattern is formed in the spacer region;
- the step of performing a blackening process on the filling pattern to convert the filling pattern into an opaque pattern includes: forming a color resist pattern in the color resist region; forming a color resist pattern and the spacer region a protective layer; the portion of the protective layer covering the spacer region is a first filling pattern; a spacer pattern is formed on the first filling pattern; wherein the spacer pattern is composed of a transparent filling material;
- the spacer pattern is subjected to a blackening treatment such that the filling pattern is converted into an opaque pattern.
- Embodiments of the present disclosure provide a color film substrate.
- the color filter substrate includes: a substrate, the surface of the substrate includes a plurality of independent color resist regions and a plurality of spacer regions, each of the spacer regions being located between two adjacent color resist regions; a color resist pattern in the color resisting region; and a filling pattern formed in the spacer region; the filling pattern being composed of a material of the color resist pattern and/or a transparent filling material; wherein the filling pattern passes through black
- the processing is such that the filling pattern is converted into an opaque pattern.
- the filling pattern includes a first filling pattern and a spacer pattern disposed in a stack; the first filling pattern is formed between adjacent two color resist regions, and the spacer pattern covers the a first filling pattern; wherein at least the spacer pattern is subjected to a blackening treatment such that the filling pattern is converted into an opaque pattern.
- Embodiments of the present disclosure provide a display device including the color filter substrate described in the above embodiments.
- FIG. 1 is a schematic flow chart of a method for preparing a color filter substrate according to an embodiment of the present disclosure
- FIG. 2 is a schematic structural diagram of a substrate in a color film substrate according to an embodiment of the present disclosure
- FIG. 3 is a schematic structural diagram of a color filter substrate according to an embodiment of the present disclosure.
- FIG. 4 is a schematic structural diagram of a color filter substrate according to another embodiment of the present disclosure.
- FIG. 5 is a schematic structural diagram of a color filter substrate according to another embodiment of the present disclosure.
- FIG. 6 is a schematic structural diagram of a color filter substrate according to another embodiment of the present disclosure.
- FIG. 7 is a schematic structural diagram of a color filter substrate according to another embodiment of the present disclosure.
- FIG. 8 is a schematic structural diagram of a color filter substrate according to another embodiment of the present disclosure.
- FIG. 9 is a schematic structural diagram of a color filter substrate according to another embodiment of the present disclosure.
- FIG. 10 is a schematic structural diagram of a color filter substrate according to another embodiment of the present disclosure.
- FIG. 11 is a schematic structural diagram of a color filter substrate according to another embodiment of the present disclosure.
- FIG. 12 is a schematic structural diagram of a color filter substrate according to another embodiment of the present disclosure.
- FIG. 13 is a schematic structural diagram of a color filter substrate according to another embodiment of the present disclosure.
- FIG. 14 is a schematic structural diagram of a color filter substrate according to another embodiment of the present disclosure.
- FIG. 15 is a schematic structural diagram of a color filter substrate according to another embodiment of the present disclosure.
- FIG. 16 is a schematic structural diagram of a color filter substrate according to another embodiment of the present disclosure.
- FIG. 17 is a schematic structural diagram of a color filter substrate according to another embodiment of the present disclosure.
- FIG. 18 is a schematic structural diagram of a color filter substrate according to another embodiment of the present disclosure.
- FIG. 19 is a schematic structural diagram of a color filter substrate according to another embodiment of the present disclosure.
- FIG. 20 is a schematic structural diagram of a color filter substrate according to another embodiment of the present disclosure.
- the terms "first,” “second,” and similar terms used in the specification and claims of the disclosure are not intended to mean any order, quantity, or importance, and are merely used to distinguish different components.
- the word “comprising” or “comprises” or the like means that the element or item preceding the word is intended to be in the
- the terminology or positional relationship of the "one side", “the other side” and the like is based on the orientation or positional relationship shown in the drawings, and is merely for the convenience of explaining a simplified description of the technical solution of the present disclosure, rather than indicating or implying
- the device or component referred to must have a particular orientation, is constructed and operated in a particular orientation, and thus is not to be construed as limiting the disclosure.
- Embodiments of the present disclosure provide a method of preparing a color film substrate. As shown in FIG. 1, the preparation method includes the following steps.
- Step S01 providing a substrate, the surface of the substrate comprising a plurality of independent color resist regions and a plurality of spacer regions, each of the spacer regions being located between adjacent two color resist regions.
- Step S02 forming a color resist pattern in the color resist region, and forming a light transmissive filling pattern in the spacer region.
- Step S03 performing a blackening process on the filling pattern to convert the filling pattern into an opaque pattern.
- the color and the arrangement manner of the color resist pattern are not limited, and the corresponding design of the color filter substrate in the related art may be specifically used.
- the color resist pattern (Red Resin, red color resist; Green Resin, green color resist; Blue Resin, blue color resist) may be arranged in a strip shape, a mosaic shape, a font shape (Delta shape), etc., and the implementation of the present disclosure This will not be repeated here.
- the spacer area 1B on the substrate 1 is a vacant area in the related art that originally forms a BM.
- opaque pattern means that the pattern is capable of blocking light rays traveling in a direction perpendicular to the surface of the substrate substrate.
- the "opaque pattern” is indicated by a black pattern.
- the BM material is usually composed of an opaque metal Cr, chromium oxide (CrO x ), black graphite, or the like, to which a pigment and/or a dye is added; in the embodiment of the present disclosure, color
- the material of the resist pattern is usually a light transmissive material such as red, green, blue, etc., which is obviously different from the BM material in the related art. By blackening the material of the color resist pattern and/or the transparent filling material, these light-transmitting materials can be converted into a light-shielding material, thereby functioning as the same color resistance as the BM material.
- blackening treatment means changing the material of the color resist pattern and/or the transparent filling material by a corresponding chemical means to convert it into a light-shielding material.
- the embodiment of the present disclosure does not limit the sequence of the step of blackening the filling material located in the spacing region and the step of forming the color resist pattern in the color resisting region, and the filling material located in the spacing region is not limited.
- the step of performing the blackening treatment may be performed before or after the step of forming the color resist pattern.
- the filling pattern includes a material having a color resist pattern
- the material of the color resist pattern is processed by one patterning process.
- the step of blackening the filling material in the region is after the step of forming the color resist pattern and the filling pattern.
- the transparent filling material may be a material that forms a protective layer and/or forms a spacer. That is, the above preparation method may further include a step of forming a protective layer or a step of sequentially forming a protective layer and a spacer after the specific step of forming the color resist pattern. Therefore, the transparent filler material may specifically be a portion of the protective layer located in the spacer region, or a portion of the protective layer located in the spacer region and a spacer disposed in the region. Thereby, the production cost can be saved, and the CF manufacturing process can be further simplified.
- the material of the color resist pattern formed in the spacer region and/or the transparent filler material is blackened to become an opaque material, thereby realizing The effect of preventing the crosstalk caused by the adjacent color resistance; since the BM process is removed in the original process of the color film substrate, the problem of the product due to the BM peeling in the color film substrate can be effectively solved, and the product yield rate is improved. .
- the step of the blackening process specifically includes: performing masking of an appropriate size by using a mask, and processing the filling pattern by any one of laser burning, ultraviolet exposure, carbonization, and ion doping. In order to make the filling pattern opaque; wherein the light-transmitting region of the mask exposes the filling pattern, and the opaque region of the mask blocks the color resist pattern.
- laser burning refers to the use of high energy of the laser to heat the color resist pattern material and/or the transparent filling material to cause cauterization, and the color becomes opaque shading material.
- Ultraviolet exposure refers to a series of chemical reactions between the material of the color resist pattern and/or the photoinitiator in the transparent filler material and the material of the color resist pattern or the host material of the transparent filler material by ultraviolet light irradiation.
- the material of the resist pattern or the transparent filling material as a whole exhibits an opaque effect.
- a photoinitiator is also included in the material of the color resist pattern and/or the transparent filler material.
- Carbonization refers to the high temperature treatment of organic materials containing carbon chains to make their color opaque. Since the material of the color resist pattern is usually an organic material, the treatment method can be applied to the treatment of the material of the color resist pattern, and/or the treatment when the above transparent filler material is specifically an organic transparent filler.
- the ion doping treatment refers to doping a material of a color resist pattern and/or a transparent filling material, and changing it into a light shielding material by changing the composition of the material.
- the material of the color resist pattern and/or the transparent fill material may be subjected to hydrogen plasma treatment by plasma chemical vapor deposition or plasma source to make it a light-shielding material.
- the embodiment of the present disclosure provides a substrate 1 as shown in FIG. 2, the surface of the substrate 1 includes a plurality of independent color resist regions 1A and a plurality of spacer regions 1B, each of which is located adjacent to two Between the color resistive regions 1A; this embodiment provides a specific method for preparing a color filter substrate, which includes, but is not limited to, the following steps.
- Step S11 as shown in FIG. 3 or FIG. 4, a color resist pattern (indicated by R, G, and B marks in the figure) is formed in the color resistive region 1A, and light transmittance having a predetermined thickness is formed in the spacer region 1B.
- Step S12 as shown in FIG. 5 or FIG. 6, the filling pattern 2 is subjected to a blackening process so that the filling pattern is converted into an opaque pattern.
- the first filling pattern 2 has a predetermined thickness, which is specifically the thickness of the BM in the color film substrate having the same size in the related art, so that the thickness of the color filter substrate formed in the embodiment is The thickness of the color film substrate including the BM is related to the related art, and meets the specific application requirements of the product.
- the filling pattern 2 is composed of a material of a color resist pattern
- a step of forming a color resist pattern in the color resisting region 1A and a filling pattern 2 having a predetermined thickness in the spacer region 1B are formed.
- the steps can be formed under the same patterning process.
- the color resist material for forming the filling pattern 2 may be any one of color resist materials (R/G/B Resin) of a color such as red/green/blue.
- the color resist material of the color is also retained in the spacer region 1B to form the fill pattern 2.
- a material having an R color resist may be applied to the spacer region 1B at the time of coating the R color resist, and then coating of the G/B color resist may be performed.
- the filling pattern 2 can be blackened by the occlusion of the mask to be converted into an opaque pattern, which functions as a BM in the related art.
- the filling pattern 2 when the filling pattern 2 is formed of another transparent filling material, the filling pattern 2 may be formed first. Thereafter, the filling pattern 2 is blackened by the occlusion of the mask to convert it into an opaque pattern, which functions as a BM in the related art.
- the color resist pattern of R/G/B can be reformed. Also, in order to prevent light leakage, both ends of the R/G/B color resist pattern may overlap the filling pattern 2.
- FIG. 2 Another embodiment of the present disclosure provides a substrate 1 as shown in FIG. 2, the surface of which includes a plurality of independent color resist regions 1A and a plurality of spacer regions 1B, each of which is adjacent to each other Between the two color resistive regions 1A; this embodiment provides a specific method for preparing a color filter substrate, which includes, but is not limited to, the following steps.
- Step S21 as shown in FIG. 7 or FIG. 8, a color resist pattern (indicated by R, G, and B marks in the figure) is formed in the color resistive region 1A, and a first pad having a predetermined thickness is formed in the spacer region 1B.
- the pattern 21; the first filling pattern 21 is composed of a material of a color resist pattern or a transparent filling material.
- Step S22 as shown in FIG. 9 or FIG. 10, forming a protective layer (Over Coat, abbreviated as OC) 3 covering the color resist pattern and the first filling pattern 21; wherein the protective layer 3 covers the portion of the first filling pattern 21. It is a second filling pattern 22; the protective layer 3 is composed of a transparent filling material.
- OC Over Coat, abbreviated as OC
- Step S23 as shown in FIG. 11 or FIG. 12, the second filling pattern is subjected to a blackening process so that the filling pattern is converted into an opaque pattern.
- first and the above-described filling patterns 2 include the first filling patterns 21 and the second filling patterns 22 which are stacked.
- step S21 the structure in which the first filling pattern 21 is composed of the material of the color resist pattern or the transparent filling material can be referred to the foregoing embodiment, which is not described in this embodiment.
- the embodiment may further include a step of blackening the previously formed first filling pattern 21 to form a structure as shown in FIG. 13, thereby further enhancing the shading effect.
- a step of blackening the previously formed first filling pattern 21 to form a structure as shown in FIG. 13, thereby further enhancing the shading effect.
- a further embodiment of the present disclosure provides a substrate 1 as shown in FIG. 2, the surface of which includes a plurality of independent color resist regions 1A and a plurality of spacer regions 1B, each of which is adjacent to each other Between the two color resistive regions 1A; this embodiment provides a specific method for preparing a color filter substrate, which includes, but is not limited to, the following steps.
- Step S31 referring to FIG. 7 or FIG. 8, forming a color resist pattern (indicated by R, G, and B marks in the figure) in the color resisting region, and forming a first filling pattern having a predetermined thickness in the spacing region;
- the first filling pattern is composed of a material of a color resist pattern or a transparent filling material.
- Step S32 referring to FIG. 9 or FIG. 10, forming a protective layer 3 covering the color resist pattern and the first filling pattern 21; wherein the portion of the protective layer 3 covering the first filling pattern 21 is the second filling pattern 22;
- the protective layer 3 is composed of a transparent filling material.
- Step S33 as shown in FIG. 14 or FIG. 15, a spacer pattern 4 is formed on the second filling pattern 22; the spacer pattern 4 is composed of a transparent filling material.
- Step S34 as shown in FIG. 16 or FIG. 17, the above-described spacer pattern 4 is subjected to a blackening process so that the filling pattern is converted into an opaque pattern.
- first and the above-described filling patterns 2 include the first filling patterns 21, the second filling patterns 22, and the spacer patterns 4 which are stacked.
- the cross-sectional shape of the spacer pattern 4 may be a long column shape covering the R/G/B color resist pattern.
- the spacer pattern 4 can increase the support strength between the color filter substrate and the array substrate while exhibiting the occlusion effect of the BM in the related art.
- the specific preparation process can follow the related art, and the details are not described in this embodiment.
- the embodiment may further include a step of blackening the second filling pattern 22 and/or the first filling pattern 21 under the spacer pattern 4 to further enhance the shading effect.
- FIG. 2 Another embodiment of the present disclosure provides a substrate 1 as shown in FIG. 2, the surface of which includes a plurality of independent color resist regions 1A and a plurality of spacer regions 1B, each of which is adjacent to each other Between the two color resistive regions 1A; this embodiment provides a specific method for preparing a color filter substrate, which includes, but is not limited to, the following steps.
- step S41 as shown in FIG. 18, an R/G/B color resist pattern is formed in the color resistive region 1A.
- Step S42 as shown in FIG. 18, forming a protective layer 3 covering the R/G/B color resist pattern and the spacer region 1B; wherein, the portion of the protective layer 3 covering the spacer region 1B is a filling pattern; and the protective layer 3 is made of a transparent filling material Composition.
- step S43 as shown in FIG. 19, the filling pattern is blackened so that the filling pattern is converted into an opaque pattern.
- the filling pattern is a part of the protective layer covering the spacer area 1B.
- the specific structure refer to the foregoing embodiment, which is not described in this embodiment.
- this embodiment directly adopts a part of the protective layer as a filling pattern, and the structure is simpler and easier to implement.
- FIG. 2 Another embodiment of the present disclosure provides a substrate 1 as shown in FIG. 2, the surface of which includes a plurality of independent color resist regions 1A and a plurality of spacer regions 1B, each of which is adjacent to each other Between the two color resistive regions 1A; this embodiment provides a specific method for preparing a color filter substrate, which includes, but is not limited to, the following steps.
- step S51 as shown in FIG. 20, an R/G/B color resist pattern is formed in the color resist region.
- Step S52 as shown in FIG. 20, a protective layer 3 covering the R/G/B color resist pattern and the spacer region 1B is formed; a portion of the protective layer 3 covering the spacer region 1B is a first fill pattern.
- Step S53 as shown in FIG. 20, a spacer pattern 4 is formed on the first filling pattern; wherein the spacer pattern 4 is composed of a transparent filling material.
- step S54 as shown in FIG. 20, the spacer pattern 4 is subjected to a blackening process so that the filling pattern is converted into an opaque pattern.
- the above-mentioned filling pattern 2 includes a first filling pattern and a spacer pattern which are arranged in a stacked manner.
- a first filling pattern and a spacer pattern which are arranged in a stacked manner.
- the filling pattern in this embodiment includes a part of the protective layer and a spacer pattern disposed on the original BM area, and the structure is relatively simple and easy to implement.
- the embodiment of the present disclosure further provides a color film substrate, comprising: a substrate, the surface of the substrate includes a plurality of independent color resist regions and a plurality of spacer regions, each of the spacer regions being located a color resist pattern formed between the adjacent two color resisting regions; a color resist pattern formed in the color resisting region; and a filling pattern formed in the spacer region; the filling pattern being made of the material of the color resisting pattern and/or The transparent filling material is configured; wherein the filling pattern is subjected to a blackening treatment such that the filling pattern is converted into an opaque pattern.
- the filling pattern includes a first filling pattern and a spacer pattern disposed in a stack; the first filling pattern is formed between adjacent two color resist regions, and the spacer pattern covers the a first filling pattern; wherein at least the spacer pattern is subjected to a blackening treatment such that the filling pattern is converted into an opaque pattern.
- the material of the protective layer OC may specifically include a host substrate such as an epoxy resin, a PI-type polymer (alicyclic polyimide), or the like; a (carboxyl) curing agent added to the host substrate, Additives such as surfactants.
- a host substrate such as an epoxy resin, a PI-type polymer (alicyclic polyimide), or the like
- a (carboxyl) curing agent added to the host substrate
- Additives such as surfactants.
- the material of the spacer pattern may specifically be propylene glycol monomethyl ether acetate (PGMEA) or Bis (2-methoxy ethyl ether) (abbreviated as DG).
- PGMEA propylene glycol monomethyl ether acetate
- DG Bis (2-methoxy ethyl ether
- the embodiment of the present disclosure further provides a display device including the above color film substrate.
- the display device may be specifically a product or a component having any display function, such as a liquid crystal display, a liquid crystal television, an organic electroluminescence display, an organic electroluminescence television, a digital photo frame, a mobile phone, a tablet computer, a digital photo frame, and a navigator.
- the material of the color resist pattern formed in the spacer region and/or the transparent filler material is blackened to become an opaque material, thereby realizing The effect of preventing the crosstalk caused by the adjacent color resistance; since the BM process is removed in the original process of the color film substrate, the problem of the product due to the BM peeling in the color film substrate can be effectively solved, and the product yield rate is improved. .
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Abstract
Description
Claims (10)
- 一种彩膜基板的制备方法,包括:提供衬底基板,所述衬底基板的表面包括多个独立的色阻区域和多个间隔区域,每个间隔区域位于相邻两个色阻区域之间;在所述色阻区域内形成色阻图案,在所述间隔区域内形成透光的填充图案;以及对所述填充图案进行黑化处理,使得所述填充图案转变为不透光图案。
- 根据权利要求1所述的制备方法,其中,对所述填充图案进行黑化处理,使得所述填充图案转变为不透光图案的步骤,包括:利用掩膜板,采用激光灼烧、紫外曝光、碳化处理和离子掺杂中的任一种方法对所述填充图案进行处理,以使所述填充图案不透光;其中,所述掩膜板的透光区域暴露所述填充图案,所述掩膜板的不透光区域遮挡所述色阻图案。
- 根据权利要求1所述的制备方法,其中,在所述色阻区域内形成色阻图案,在所述间隔区域内形成透光的填充图案;以及对所述填充图案进行黑化处理,使得所述填充图案转变为不透光图案的步骤,包括:在所述色阻区域内形成色阻图案,在所述间隔区域内形成具有预设厚度的透光的填充图案;所述填充图案由所述色阻图案的材料或透明填充材料构成;以及对所述填充图案进行黑化处理,使得所述填充图案转变为不透光图案。
- 根据权利要求1所述的制备方法,其中,所述填充图案包括层叠设置的第一填充图案和第二填充图案;在所述色阻区域内形成色阻图案,在所述间隔区域内形成透光的填充图案;以及对所述填充图案进行黑化处理,使得所述填充图案转变为不透光图案的步骤,包括:在所述色阻区域内形成色阻图案,在所述间隔区域内形成具有预设厚度的第一填充图案;所述第一填充图案由所述色阻图案的材料或透明填充材料构成;形成覆盖所述色阻图案和所述第一填充图案的保护层;其中,所述保护层覆盖所述第一填充图案的部分为第二填充图案;所述保护层由透明填充材料构成;对所述第二填充图案进行黑化处理,使得所述填充图案转变为不透光图案。
- 根据权利要求1所述的制备方法,其中,所述填充图案包括层叠设置的第一填充图案、第二填充图案和隔垫物图案;在所述色阻区域内形成色阻图案,在所述间隔区域内形成透光的填充图案;以及对所述填充图案进行黑化处理,使得所述填充图案转变为不透光图案的步骤,包括:在所述色阻区域内形成色阻图案,在所述间隔区域内形成具有预设厚度的第一填充图案;所述第一填充图案由所述色阻图案的材料或透明填充材料构成;形成覆盖所述色阻图案和所述第一填充图案的保护层;其中,所述保护层覆盖所述第一填充图案的部分为第二填充图案;所述保护层由透明填充材料构成;在所述第二填充图案上形成隔垫物图案;所述隔垫物图案由透明填充材料构成;对所述隔垫物图案进行黑化处理,使得所述填充图案转变为不透光图案。
- 根据权利要求1所述的制备方法,其中,在所述色阻区域内形成色阻图案,在所述间隔区域内形成透光的填充图案;以及对所述填充图案进行黑化处理,使得所述填充图案转变为不透光图案的步骤,包括:在所述色阻区域内形成色阻图案;形成覆盖所述色阻图案和所述间隔区域的保护层;其中,所述保护层覆盖所述间隔区域的部分为填充图案;所述保护层由透明填充材料构成;对所述填充图案进行黑化处理,使得所述填充图案转变为不透光图案。
- 根据权利要求1所述的制备方法,其中,所述填充图案包括层叠设置的第一填充图案和隔垫物图案;在所述色阻区域内形成色阻图案,在所述间隔区域内形成透光的填充图案;以及对所述填充图案进行黑化处理,使得所述填充图案转变为不透光图案的步骤,包括:在所述色阻区域内形成色阻图案;形成覆盖所述色阻图案和所述间隔区域的保护层;所述保护层覆盖所述间隔区域的部分为第一填充图案;在所述第一填充图案上形成隔垫物图案;其中,所述隔垫物图案由透明填充材料构成;对所述隔垫物图案进行黑化处理,使得所述填充图案转变为不透光图案。
- 一种彩膜基板,包括:衬底基板,所述衬底基板的表面包括多个独立的色阻区域和多个间隔区域,每个间隔区域位于相邻两个色阻区域之间;形成在所述色阻区域内的色阻图案;以及形成在所述间隔区域内的填充图案;所述填充图案由所述色阻图案的材料和/或透明填充材料构成;其中,所述填充图案经过黑化处理,使得所述填充图案转变为不透光图案。
- 根据权利要求8所述的彩膜基板,其中,所述填充图案包括层叠设置的第一填充图案和隔垫物图案;所述第一填充图案形成在相邻两个色阻区域之间,所述隔垫物图案覆盖所述第一填充图案;其中,至少所述隔垫物图案经过黑化处理,使得所述填充图案转变为不透光图案。
- 一种显示装置,包括如权利要求8或9所述的彩膜基板。
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CN106940490B (zh) * | 2017-05-17 | 2021-01-26 | 京东方科技集团股份有限公司 | 一种彩膜基板及其制备方法、显示装置 |
CN107450221B (zh) * | 2017-08-11 | 2020-06-05 | 京东方科技集团股份有限公司 | 彩膜基板、显示面板、显示装置及其制作方法 |
CN108227283A (zh) * | 2018-01-22 | 2018-06-29 | 深圳市华星光电技术有限公司 | 彩色滤光片基板的制作方法及彩色滤光片基板 |
CN109799640A (zh) * | 2019-03-13 | 2019-05-24 | 信利(惠州)智能显示有限公司 | 彩膜基板制作方法 |
CN110224076B (zh) | 2019-05-15 | 2020-08-11 | 武汉华星光电半导体显示技术有限公司 | Oled面板及其制造方法 |
CN111897037B (zh) * | 2020-08-10 | 2022-06-10 | 深圳市宝明科技股份有限公司 | 一种增光膜及其制作方法、背光模组 |
CN113140577B (zh) * | 2021-04-21 | 2024-01-26 | 滁州惠科光电科技有限公司 | 一种阵列基板制备方法、阵列基板及显示面板 |
CN113437181B (zh) * | 2021-06-23 | 2022-05-13 | Oppo广东移动通信有限公司 | 光学盖板的制作方法、光学盖板和穿戴设备 |
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