WO2018192389A1 - Transposing head for transferring micro-elements - Google Patents

Transposing head for transferring micro-elements Download PDF

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Publication number
WO2018192389A1
WO2018192389A1 PCT/CN2018/082436 CN2018082436W WO2018192389A1 WO 2018192389 A1 WO2018192389 A1 WO 2018192389A1 CN 2018082436 W CN2018082436 W CN 2018082436W WO 2018192389 A1 WO2018192389 A1 WO 2018192389A1
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WO
WIPO (PCT)
Prior art keywords
micro
adhesive layer
transposition head
flexible adhesive
substrate body
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PCT/CN2018/082436
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French (fr)
Chinese (zh)
Inventor
徐宸科
郑建森
邵小娟
林科闯
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厦门市三安光电科技有限公司
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Publication of WO2018192389A1 publication Critical patent/WO2018192389A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

  • the present invention relates to a transposition head, and more particularly to a transposition head for micro component transfer.
  • Micro-element technology refers to an array of minute-sized components that are integrated at a high density on a substrate.
  • micro-light-emitting diode (Micro LED) technology is becoming a hot research topic, and the industry expects high-quality micro-component products to enter the market.
  • High-quality micro-pitch LED products can have a profound impact on traditional display products such as LCD/OL ED that are already on the market.
  • a micro-element is first formed on a donor substrate, and then the micro-element is transferred onto a receiving substrate.
  • the receiving substrate is, for example, a display screen.
  • One difficulty in the fabrication of microcomponents is how to transfer the microcomponents from the donor substrate to the receiving substrate.
  • a conventional method of transferring micro-elements is to transfer micro-elements from a transfer substrate to a receiving substrate by wafer bonding.
  • One of the implementation methods of the transfer method is direct transfer, that is, directly bonding the micro-element array from the transfer substrate to the receiving substrate, and then removing the transfer substrate.
  • Another method of implementation is indirect transfer.
  • the method comprises two steps of joining/stripping. First, the transfer substrate extracts the array of microelements from the donor substrate, then transfers the substrate and then bonds the array of microelements to the receiving substrate, and finally removes the transferred substrate.
  • the extraction micro-element array is generally performed by means of electrostatic pickup.
  • An array of transfer heads is required during electrostatic pickup.
  • the structure of the transfer head array is relatively complex and needs to be considered for its reliability. Manufacturing transfer head arrays requires additional cost. A phase change needs to be generated before picking up the transfer head array. In addition, the transfer process is limited in efficiency and results in low yield and poor reliability.
  • the technical solution adopted by the present invention includes: a transposition head for micro component transfer, comprising: a substrate body; a convex structure protruding from the substrate body; and flexibility An adhesion layer covering the surface of the raised structure.
  • the convex structure utilizes a flexible adhesive layer to transfer the adsorption force of the micro component.
  • the convex structure includes a mesa formed by a side surface and a lower surface.
  • the protruding structure includes a through hole extending from the substrate body and penetrating the flexible adhesive layer.
  • the protruding structure excludes air by using a through hole, and transfers the micro component by vacuum pressure
  • the flexible adhesive layer covers a side surface of the convex structure and a portion of a lower surface of the substrate body.
  • the substrate body is selected from silicon or ceramic or metal or polymer or one of any combination of the foregoing.
  • the flexible adhesive layer is made of silicone resin or glass or polyimide (PI) or polydimethylsiloxane (PI)
  • PDMS polymethyl methacrylate
  • PMMA polymethyl methacrylate
  • the thickness of the flexible adhesive layer is on the order of micrometers.
  • the flexible adhesive layer has a thickness of 10 ⁇ m to 1000 ⁇ m.
  • the utility model at least includes the following advantages:
  • the transposition head provided by the utility model utilizes a convex structure protruding from the substrate body and flexible by covering the convex structure
  • the adhesion layer transfers the adsorption force of the micro-component, which is especially suitable for transferring micro-components with a certain surface roughness;
  • the convex structure uses the through-hole to remove air, and the micro-component is transferred by vacuum pressure to improve the high-quality rapid transfer micro Component reliability.
  • FIG. 1 is a schematic view of a transposition head for micro component transfer described in Embodiment 1.
  • FIG. 2 is a schematic view of a transposition head for micro component transfer described in Embodiment 2. [0019] FIG.
  • FIG. 3 is a schematic view of a transposition head for micro component transfer described in Embodiment 3. [0020] FIG.
  • FIG. 4 is a schematic view of a transposition head for micro component transfer described in Embodiment 4. [0021] FIG.
  • 100 substrate body; 101: raised structure; 200: flexible adhesive layer; 300: micro-component; 400: carrier substrate; 500: through-hole.
  • a carrier substrate 400 is provided, which may be made of glass, silicon, polycarbonate (PC), acrylonitrile butadiene styrene (ABS), or any combination thereof.
  • a plurality of micro-elements 300 are placed on the carrier substrate 400, and the micro-components may be a light-emitting element, a liquid crystal control element, a photoelectric conversion element, a piezoelectric element, a thin film transistor element, a thin film diode element, a resistance element, a gate element,
  • the micro element is preferably a thin film LED (Thin Light-emitting Diode) light emitting element, and has a thickness of about 0.5 ⁇ m to about 100 ⁇ m.
  • the shape of the micro-component 300 may be a cylinder, and the radius of the cylinder may be about 0.5 ⁇ m to about 500 ⁇ m.
  • the micro-element 300 may be formed into a triangular cylinder, a cube, a rectangular parallelepiped, a hexagonal cylinder, and an octagonal prism. Body or other polygonal cylinder.
  • the transposition head for micro component transfer of the present embodiment includes: a substrate body 100; a convex structure 101 including a mesa formed by a side surface and a lower surface, which is removed from the substrate body 100. And a flexible adhesive layer 200 covering the mesa of the raised structure, that is, the lower surface of the raised structure and the side surface.
  • the transposition head When the transposition head is used to transfer the micro-component ⁇ , the transposition head is directed toward the micro-element 300 located on the carrier substrate 400, and further, the protruding structure 101 of the transposition head is aligned with the micro-element 300 located on the carrier substrate, The protruding structure protrudes from the substrate body to provide an effective contact point for adsorbing the micro-component, and the adsorption force of the micro-component is adsorbed by the flexible adhesive layer to realize the transfer of the micro-component.
  • the substrate body 100 is made of silicon or ceramic or metal or polymer or any combination of the foregoing.
  • silicon is preferably used as the substrate body, which may be monocrystalline silicon or polycrystalline silicon.
  • the flexible adhesive layer 200 is made of silicone resin or glass or polyimide (PD) or polydimethylsiloxane (PDMS) or polymethyl methacrylate ( ⁇ ). MMA) or one of any combination of the foregoing, this embodiment preferably uses PDMS as a flexible adhesive layer having a thickness on the order of micrometers, preferably between 10 ⁇ m and 1000 ⁇ m, having a sufficiently thin and excellent flexibility.
  • the transposition head achieves an effective clamping force on a micro-component that does not have a flat surface of roughness for adsorption or grasping. In the case of adsorbing or grasping a micro-element having a certain surface roughness, it is difficult. In addition, if several micro-components are picked up in the same way, there may be a deviation in the height direction. With the flexible adhesive layer having excellent flexibility (used as a buffer) in this embodiment, the deviation can be overcome to some extent, thereby improving the reliability of the transfer of the micro-component.
  • the flexible adhesive layer 200 of the transposition head of the present embodiment covers the lower surface and the side surface of the convex structure 101, and covers the substrate body 100.
  • Part of the lower surface, that is, the flexible adhesive layer 200 covers between the gaps of the plurality of convex structures, that is, the coverage area of the flexible adhesive layer is increased, which is advantageous for enhancing the contact area between the flexible adhesive layer and the micro-component, thereby enhancing adsorption.
  • the clamping force of the micro-components on the uneven surface is suitable for adsorbing or grasping micro-components with irregular shapes, such as micro-components having a roughened or grooved structure on the surface. Based on the van der Waals force, the transposition head provided in this embodiment can provide a greater clamping force to the surface of the less irregular micro-component.
  • the flexible adhesive layer 200 of the transposition head of the present embodiment does not cover the side surface of the convex structure 101, and covers only the lower surface of the convex structure 101. Suitable for absorbing or grabbing micro-components with a regular shape (lower height difference).
  • the protruding structure 101 of the transposition head of the embodiment further includes a through hole 500 extending from the substrate body 100 and penetrating through the flexible adhesive layer 200.
  • This embodiment utilizes the through holes of the raised structure to remove air, and vacuum transfer is performed to effect transfer of the micro-elements. Since the transposition head of the present embodiment can provide the clamping force using the vacuum state, the reliability of the high-quality rapid transfer micro-element is further improved.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A transposing head for transferring micro-elements, comprising: a substrate body; a protruding structure, protruding from the substrate body; and a flexible adhesive layer covering the surface of the protruding structure. The transposing head provided in the present utility model uses a protruding structure protruding from the substrate body and the suction force of the flexible adhesive layer covering the protruding layer on the micro-elements to implement transfer, being particularly suited to transferring micro-elements having a certain degree of surface coarseness; the protruding structure uses through holes to expel air, and uses vacuum pressure to transfer the micro-elements, improving the reliability of high quality rapid transfer of micro-elements.

Description

一种用于微元件转移的转置头 技术领域  Transposition head for micro component transfer
[0001] 本实用新型涉及一种转置头， 尤其涉及一种用于微元件转移的转置头。  [0001] The present invention relates to a transposition head, and more particularly to a transposition head for micro component transfer.
背景技术  Background technique
[0002] 微元件技术是指在衬底上以高密度集成的微小尺寸的元件阵列。 目前， 微间距 发光二极管 （Micro LED) 技术逐渐成为研究热门， 工业界期待有高品质的微元 件产品进入市场。 高品质微间距发光二极管产品会对市场上已有的诸如 LCD/OL ED的传统显示产品产生深刻影响。  [0002] Micro-element technology refers to an array of minute-sized components that are integrated at a high density on a substrate. At present, micro-light-emitting diode (Micro LED) technology is becoming a hot research topic, and the industry expects high-quality micro-component products to enter the market. High-quality micro-pitch LED products can have a profound impact on traditional display products such as LCD/OL ED that are already on the market.
[0003] 在制造微元件的过程中， 首先在施体基板上形成微元件， 接着将微元件转移到 接收基板上。 接收基板例如是显示屏。 在制造微元件过程中的一个困难在于： 如何将微元件从施体基板上转移到接收基板上。  [0003] In the process of fabricating a micro-element, a micro-element is first formed on a donor substrate, and then the micro-element is transferred onto a receiving substrate. The receiving substrate is, for example, a display screen. One difficulty in the fabrication of microcomponents is how to transfer the microcomponents from the donor substrate to the receiving substrate.
[0004] 传统转移微元件的方法为借由基板接合 （Wafer Bonding) 将微元件自转移基板 转移至接收基板。 转移方法的其中一种实施方法为直接转移， 也就是直接将微 元件阵列自转移基板接合至接收基板， 之后再将转移基板移除。 另一种实施方 法为间接转移。 此方法包含两次接合 /剥离的步骤， 首先， 转移基板自施体基板 提取微元件阵列， 接着转移基板再将微元件阵列接合至接收基板， 最后再把转 移基板移除。 其中， 提取微元件阵列一般通过静电拾取的方式来执行。 在静电 拾取的过程中需要使用转移头阵列。 转移头阵列的结构相对复杂， 并需要考虑 它的可靠性。 制造转移头阵列需要额外的成本。 在利用转移头阵列的拾取之前 需要产生相位改变。 另外， 转移工艺效率有限， 且导致产量小和可靠性差。  [0004] A conventional method of transferring micro-elements is to transfer micro-elements from a transfer substrate to a receiving substrate by wafer bonding. One of the implementation methods of the transfer method is direct transfer, that is, directly bonding the micro-element array from the transfer substrate to the receiving substrate, and then removing the transfer substrate. Another method of implementation is indirect transfer. The method comprises two steps of joining/stripping. First, the transfer substrate extracts the array of microelements from the donor substrate, then transfers the substrate and then bonds the array of microelements to the receiving substrate, and finally removes the transferred substrate. Among them, the extraction micro-element array is generally performed by means of electrostatic pickup. An array of transfer heads is required during electrostatic pickup. The structure of the transfer head array is relatively complex and needs to be considered for its reliability. Manufacturing transfer head arrays requires additional cost. A phase change needs to be generated before picking up the transfer head array. In addition, the transfer process is limited in efficiency and results in low yield and poor reliability.
技术问题 technical problem
问题的解决方案  Problem solution
技术解决方案  Technical solution
[0005] 为了解决上述技术问题， 本实用新型采用的技术方案包括： 一种用于微元件转 移的转置头， 包括： 基板本体； 凸起结构， 其从所述基板本体凸出； 以及柔性 粘附层， 其覆盖于所述凸起结构的表面。 [0005] In order to solve the above technical problem, the technical solution adopted by the present invention includes: a transposition head for micro component transfer, comprising: a substrate body; a convex structure protruding from the substrate body; and flexibility An adhesion layer covering the surface of the raised structure.
[0006] 进一步地， 所述凸起结构利用柔性粘附层对微元件的吸附力进行转移。  [0006] Further, the convex structure utilizes a flexible adhesive layer to transfer the adsorption force of the micro component.
[0007] 进一步地， 所述凸起结构包括侧表面和下表面形成的台面。  [0007] Further, the convex structure includes a mesa formed by a side surface and a lower surface.
[0008] 进一步地， 所述凸起结构包括一通孔， 所述通孔从基板本体延伸， 并且贯穿柔 性粘附层。  Further, the protruding structure includes a through hole extending from the substrate body and penetrating the flexible adhesive layer.
[0009] 进一步地， 所述凸起结构利用通孔排除空气， 藉由真空压力对微元件进行转移  [0009] Further, the protruding structure excludes air by using a through hole, and transfers the micro component by vacuum pressure
[0010] 进一步地， 所述柔性粘附层覆盖于所述凸起结构的侧表面以及所述基板本体的 部分下表面。 [0010] Further, the flexible adhesive layer covers a side surface of the convex structure and a portion of a lower surface of the substrate body.
[0011] 进一步地， 所述基板本体选用硅或陶瓷或金属或聚合物或前述任意组合之一。  [0011] Further, the substrate body is selected from silicon or ceramic or metal or polymer or one of any combination of the foregoing.
[0012] 进一步地， 所述柔性粘附层选用硅树脂或玻璃或聚酰亚胺 (PI)或聚二甲硅氧烷([0012] Further, the flexible adhesive layer is made of silicone resin or glass or polyimide (PI) or polydimethylsiloxane (
PDMS)或聚甲基丙烯酸甲酯 (PMMA)或前述任意组合之一。 PDMS) or polymethyl methacrylate (PMMA) or one of any combination of the foregoing.
[0013] 进一步地， 所述柔性粘附层的厚度为微米量级。 [0013] Further, the thickness of the flexible adhesive layer is on the order of micrometers.
[0014] 进一步地， 所述柔性粘附层的厚度为 10μηι~1000μιη。 [0014] Further, the flexible adhesive layer has a thickness of 10 μm to 1000 μm.
发明的有益效果  Advantageous effects of the invention
有益效果  Beneficial effect
[0015] 与现有技术相比， 本实用新型至少包括如下优点： 本实用新型提供的转置头， 其利用从基板本体凸出一凸起结构， 并藉由覆盖于凸起结构上的柔性粘附层对 微元件的吸附力进行转移， 尤适用于转移具有一定表面粗糙度的微元件； 凸起 结构利用通孔排除空气， 藉由真空压力对微元件进行转移， 提升高质量快速转 移微元件的可靠性。  Compared with the prior art, the utility model at least includes the following advantages: The transposition head provided by the utility model utilizes a convex structure protruding from the substrate body and flexible by covering the convex structure The adhesion layer transfers the adsorption force of the micro-component, which is especially suitable for transferring micro-components with a certain surface roughness; the convex structure uses the through-hole to remove air, and the micro-component is transferred by vacuum pressure to improve the high-quality rapid transfer micro Component reliability.
[0016] 本实用新型的其它特征和优点将在随后的说明书中阐述， 并且， 部分地从说明 书中变得显而易见， 或者通过实施本实用新型而了解。 本实用新型的目的和其 他优点可通过在说明书、 权利要求书以及附图中所特别指出的结构来实现和获 得。  [0016] Other features and advantages of the invention will be set forth in part in the description in the description. The objectives and other advantages of the invention may be realized and obtained by the structure particularly pointed in the appended claims.
对附图的简要说明  Brief description of the drawing
附图说明  DRAWINGS
[0017] 下面参照附图结合实施例对本实用新型作进一步的说明。 [0018] 图 1是实施例 1所述的用于微元件转移的转置头的示意图。 [0017] The present invention will be further described below in conjunction with the embodiments with reference to the accompanying drawings. 1 is a schematic view of a transposition head for micro component transfer described in Embodiment 1.
[0019] 图 2是实施例 2所述的用于微元件转移的转置头的示意图。 2 is a schematic view of a transposition head for micro component transfer described in Embodiment 2. [0019] FIG.
[0020] 图 3是实施例 3所述的用于微元件转移的转置头的示意图。 3 is a schematic view of a transposition head for micro component transfer described in Embodiment 3. [0020] FIG.
[0021] 图 4是实施例 4所述的用于微元件转移的转置头的示意图。 4 is a schematic view of a transposition head for micro component transfer described in Embodiment 4. [0021] FIG.
[0022] 图中部件符号说明： 100: 基板本体； 101 : 凸起结构； 200: 柔性粘附层； 300 ： 微元件； 400: 承载基板； 500: 通孔。  [0022] In the drawings, the symbol description: 100: substrate body; 101: raised structure; 200: flexible adhesive layer; 300: micro-component; 400: carrier substrate; 500: through-hole.
本发明的实施方式 Embodiments of the invention
[0023] 下面结合具体实施例来对本实用新型进行详细的说明。 [0023] The present invention will be described in detail below in conjunction with specific embodiments.
[0024] 实施例 1 Embodiment 1
[0025] 如图 1所示， 提供一承载基板 400， 材质可为玻璃、 硅、 聚碳酸酯 （PC) 、 丙烯 腈-丁二烯-苯乙烯 （ABS) 或其任意组合。 在承载基板 400上放置若干个微元件 3 00， 微元件可以是发光元件、 液晶控制元件、 光电变换元件、 压电元件、 薄膜 电晶体元件、 薄膜二极体元件、 电阻元件、 幵关元件、 微小磁性元件、 微小光 学元件等， 本实施例优选微元件为薄膜 LED (Thin Light-emitting Diode) 发光元 件， 厚度可为约 0.5μηι至约 100μηι。 微元件 300的形状可为圆柱体， 且圆柱体的半 径可为约 0.5μηι至约 500μηι， 但并不限于此， 微元件 300还可以制作成三角柱体、 立方体、 长方体、 六角柱体、 八角柱体或其他多角柱体。  [0025] As shown in FIG. 1, a carrier substrate 400 is provided, which may be made of glass, silicon, polycarbonate (PC), acrylonitrile butadiene styrene (ABS), or any combination thereof. A plurality of micro-elements 300 are placed on the carrier substrate 400, and the micro-components may be a light-emitting element, a liquid crystal control element, a photoelectric conversion element, a piezoelectric element, a thin film transistor element, a thin film diode element, a resistance element, a gate element, For the micro magnetic element, the micro optical element, etc., in this embodiment, the micro element is preferably a thin film LED (Thin Light-emitting Diode) light emitting element, and has a thickness of about 0.5 μm to about 100 μm. The shape of the micro-component 300 may be a cylinder, and the radius of the cylinder may be about 0.5 μm to about 500 μm. However, the micro-element 300 may be formed into a triangular cylinder, a cube, a rectangular parallelepiped, a hexagonal cylinder, and an octagonal prism. Body or other polygonal cylinder.
[0026] 继续参考图 1所示， 本实施例的用于微元件转移的转置头， 包括： 基板本体 100 ； 凸起结构 101， 包括侧表面和下表面形成的台面， 其从基板本体 100凸出； 以 及柔性粘附层 200， 其覆盖于所述凸起结构的台面， 即凸起结构的下表面以及侧 表面。 当该转置头用于转移微元件吋， 将转置头朝向位于承载基板 400上的微元 件 300， 进一步地， 将转置头的凸起结构 101对准位于承载基板上的微元件 300， 其中凸起结构从基板本体中凸出， 以提供用于吸附微元件的有效接触点， 利用 柔性粘附层对微元件的吸附力进行吸附， 以实现微元件的转移。  [0026] With continued reference to FIG. 1, the transposition head for micro component transfer of the present embodiment includes: a substrate body 100; a convex structure 101 including a mesa formed by a side surface and a lower surface, which is removed from the substrate body 100. And a flexible adhesive layer 200 covering the mesa of the raised structure, that is, the lower surface of the raised structure and the side surface. When the transposition head is used to transfer the micro-component 吋, the transposition head is directed toward the micro-element 300 located on the carrier substrate 400, and further, the protruding structure 101 of the transposition head is aligned with the micro-element 300 located on the carrier substrate, The protruding structure protrudes from the substrate body to provide an effective contact point for adsorbing the micro-component, and the adsorption force of the micro-component is adsorbed by the flexible adhesive layer to realize the transfer of the micro-component.
[0027] 上述基板本体 100选用硅或陶瓷或金属或聚合物或前述任意组合之一， 本实施 例优选硅作为基板本体， 其可以是单晶硅或者多晶硅。 柔性粘附层 200选用硅树 脂或玻璃或聚酰亚胺 （ΡΙ) 或聚二甲硅氧烷 （PDMS) 或聚甲基丙烯酸甲酯 （Ρ MMA) 或前述任意组合之一， 本实施例优选 PDMS作为柔性粘附层， 其厚度为 微米量级， 优选介于 10μηι~1000μιη之间， 具有足够薄且优良的柔性。 [0027] The substrate body 100 is made of silicon or ceramic or metal or polymer or any combination of the foregoing. In this embodiment, silicon is preferably used as the substrate body, which may be monocrystalline silicon or polycrystalline silicon. The flexible adhesive layer 200 is made of silicone resin or glass or polyimide (PD) or polydimethylsiloxane (PDMS) or polymethyl methacrylate (Ρ). MMA) or one of any combination of the foregoing, this embodiment preferably uses PDMS as a flexible adhesive layer having a thickness on the order of micrometers, preferably between 10 μm and 1000 μm, having a sufficiently thin and excellent flexibility.
[0028] 一般来说， 转置头在不具有粗糙度的平整表面的微元件上实现有效的夹持力， 以进行吸附或抓取。 而在吸附或抓取具有一定表面粗糙度的微元件情况下， 存 在困难。 此外， 若同吋地拾取若干个微元件吋， 可能在高度方向上的产生偏差 。 藉由本实施例中具有优良柔性 （用作缓冲） 的柔性粘附层， 可在一定程度上 克服该偏差， 从而提高微元件转移的可靠性。  [0028] In general, the transposition head achieves an effective clamping force on a micro-component that does not have a flat surface of roughness for adsorption or grasping. In the case of adsorbing or grasping a micro-element having a certain surface roughness, it is difficult. In addition, if several micro-components are picked up in the same way, there may be a deviation in the height direction. With the flexible adhesive layer having excellent flexibility (used as a buffer) in this embodiment, the deviation can be overcome to some extent, thereby improving the reliability of the transfer of the micro-component.
[0029] 实施例 2  [0029] Example 2
[0030] 如图 2所示， 与实施例 1不同的是， 本实施例转置头的柔性粘附层 200除了覆盖 于凸起结构 101的下表面以及侧表面， 还覆盖于基板本体 100的部分下表面， 即 柔性粘附层 200覆盖于若干个凸起结构的间隙之间， 即增加了柔性粘附层的覆盖 面积， 有利于增强柔性粘附层与微元件的接触面积， 从而增强吸附不平整表面 的微元件的夹持力， 适合吸附或者抓取形状较不规整的微元件， 如表面具有粗 化或者凹槽结构的微元件。 基于范德华力作用， 本实施例提供的转置头可以对 较不规整的微元件表面提供更大的夹持力。  [0030] As shown in FIG. 2, unlike the first embodiment, the flexible adhesive layer 200 of the transposition head of the present embodiment covers the lower surface and the side surface of the convex structure 101, and covers the substrate body 100. Part of the lower surface, that is, the flexible adhesive layer 200 covers between the gaps of the plurality of convex structures, that is, the coverage area of the flexible adhesive layer is increased, which is advantageous for enhancing the contact area between the flexible adhesive layer and the micro-component, thereby enhancing adsorption. The clamping force of the micro-components on the uneven surface is suitable for adsorbing or grasping micro-components with irregular shapes, such as micro-components having a roughened or grooved structure on the surface. Based on the van der Waals force, the transposition head provided in this embodiment can provide a greater clamping force to the surface of the less irregular micro-component.
[0031] 实施例 3  Example 3
[0032] 如图 3所示， 与实施例 1不同的是， 本实施例转置头的柔性粘附层 200不覆盖于 凸起结构 101的侧表面， 仅覆盖于凸起结构 101的下表面， 适合吸附或者抓取形 状较为规整 （高度差较低） 的微元件。  [0032] As shown in FIG. 3, unlike the first embodiment, the flexible adhesive layer 200 of the transposition head of the present embodiment does not cover the side surface of the convex structure 101, and covers only the lower surface of the convex structure 101. Suitable for absorbing or grabbing micro-components with a regular shape (lower height difference).
[0033] 实施例 4  Embodiment 4
[0034] 如图 4所示， 与实施例 1不同的是， 本实施例转置头的凸起结构 101还包括一通 孔 500， 该通孔从基板本体 100延伸， 并且贯穿柔性粘附层 200。 本实施例利用凸 起结构的通孔排除空气， 藉由真空压力以实现对微元件转移。 由于本实施例的 转置头可以提供利用真空状态的夹持力， 所以进一步提高了高质量快速转移微 元件的可靠性。  As shown in FIG. 4, unlike the first embodiment, the protruding structure 101 of the transposition head of the embodiment further includes a through hole 500 extending from the substrate body 100 and penetrating through the flexible adhesive layer 200. . This embodiment utilizes the through holes of the raised structure to remove air, and vacuum transfer is performed to effect transfer of the micro-elements. Since the transposition head of the present embodiment can provide the clamping force using the vacuum state, the reliability of the high-quality rapid transfer micro-element is further improved.
[0035] 尽管已经描述本实用新型的示例性实施例， 但是应该理解的是， 本实用新型不 局限于这些示例性实施例， 而是包括本领域的技术人员能够在如上文的权利要 求所要求的本实用新型的精神和范围内进行各种变化和修改。  Although the exemplary embodiments of the present invention have been described, it is understood that the present invention is not limited to the exemplary embodiments, but includes those skilled in the art as claimed in the claims above. Various changes and modifications are made within the spirit and scope of the invention.

Claims

权利要求书 Claim
[权利要求 1] 一种用于微元件转移的转置头， 包括： 基板本体； 凸起结构， 其从所 述基板本体凸出； 以及柔性粘附层， 其覆盖于所述凸起结构的表面。  [Claim 1] A transposition head for transfer of a micro-component, comprising: a substrate body; a convex structure protruding from the substrate body; and a flexible adhesive layer covering the convex structure surface.
[权利要求 2] 根据权利要求 1所述的一种用于微元件转移的转置头， 其特征在于： 所述凸起结构利用柔性粘附层对微元件的吸附力进行转移。  [Claim 2] A transposition head for micro-component transfer according to claim 1, wherein: the convex structure utilizes a flexible adhesive layer to transfer the adsorption force of the micro-component.
[权利要求 3] 根据权利要求 1所述的一种用于微元件转移的转置头， 其特征在于： 所述凸起结构包括侧表面和下表面形成的台面。 [Claim 3] A transposition head for micro-component transfer according to claim 1, wherein: the convex structure includes a mesa formed by a side surface and a lower surface.
[权利要求 4] 根据权利要求 1所述的一种用于微元件转移的转置头， 其特征在于： 所述凸起结构包括一通孔， 所述通孔从基板本体延伸， 并且贯穿柔性 粘附层。 [Claim 4] A transposition head for micro component transfer according to claim 1, wherein: the convex structure includes a through hole extending from the substrate body and penetrating through the flexible layer Attachment.
[权利要求 5] 根据权利要求 4所述的一种用于微元件转移的转置头， 其特征在于： 所述凸起结构利用通孔排除空气， 藉由真空压力对微元件进行转移。  [Claim 5] A transposition head for micro component transfer according to claim 4, wherein: the convex structure excludes air by a through hole, and the micro element is transferred by vacuum pressure.
[权利要求 6] 根据权利要求 1所述的一种用于微元件转移的转置头， 其特征在于： 所述柔性粘附层覆盖于所述凸起结构的侧表面以及所述基板本体的部 分下表面。  [Claim 6] A transposition head for micro component transfer according to claim 1, wherein: the flexible adhesive layer covers a side surface of the convex structure and the substrate body Part of the lower surface.
[权利要求 7] 根据权利要求 1所述的一种用于微元件转移的转置头， 其特征在于： 所述基板本体选用硅或陶瓷或金属或聚合物或前述任意组合之一。  [Claim 7] A transposition head for micro-component transfer according to claim 1, wherein: the substrate body is made of silicon or ceramic or metal or polymer or one of any combination of the foregoing.
[权利要求 8] 根据权利要求 1所述的一种用于微元件转移的转置头， 其特征在于： 所述柔性粘附层选用硅树脂或玻璃或聚酰亚胺或聚二甲硅氧烷或聚甲 基丙烯酸甲酯或前述任意组合之一。 [Claim 8] A transposition head for micro component transfer according to claim 1, wherein: the flexible adhesive layer is made of silicone or glass or polyimide or polydimethylsiloxane Alkane or polymethyl methacrylate or one of any combination of the foregoing.
[权利要求 9] 根据权利要求 1所述的一种用于微元件转移的转置头， 其特征在于： 所述柔性粘附层的厚度为微米量级。 [Claim 9] A transposition head for micro component transfer according to claim 1, wherein: the thickness of the flexible adhesive layer is on the order of micrometers.
[权利要求 10] 根据权利要求 9所述的一种用于微元件转移的转置头， 其特征在于： 所述柔性粘附层的厚度为 10μηι~1000μιη。 [Claim 10] A transposition head for micro-component transfer according to claim 9, wherein: the flexible adhesive layer has a thickness of 10 μm to 1000 μm.
PCT/CN2018/082436 2017-04-21 2018-04-10 Transposing head for transferring micro-elements WO2018192389A1 (en)

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