WO2018181273A1 - Probe, probe unit, and semiconductor inspection device provided with probe unit - Google Patents

Probe, probe unit, and semiconductor inspection device provided with probe unit Download PDF

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Publication number
WO2018181273A1
WO2018181273A1 PCT/JP2018/012350 JP2018012350W WO2018181273A1 WO 2018181273 A1 WO2018181273 A1 WO 2018181273A1 JP 2018012350 W JP2018012350 W JP 2018012350W WO 2018181273 A1 WO2018181273 A1 WO 2018181273A1
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WO
WIPO (PCT)
Prior art keywords
pipe
probe
plunger
notch
spiral groove
Prior art date
Application number
PCT/JP2018/012350
Other languages
French (fr)
Japanese (ja)
Inventor
一也 相馬
雅宏 高橋
Original Assignee
日本発條株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本発條株式会社 filed Critical 日本発條株式会社
Priority to JP2019509866A priority Critical patent/JP7023276B2/en
Publication of WO2018181273A1 publication Critical patent/WO2018181273A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices

Definitions

  • the present invention relates to a probe.
  • the present invention relates to a probe for inspecting an inspection object such as an electronic component having a circuit using a semiconductor such as a semiconductor integrated circuit, or an electronic device including the electronic component, a probe unit, and a semiconductor inspection apparatus including the probe unit.
  • An electronic component having a semiconductor integrated circuit is also used for an electronic device such as a display device represented by a liquid crystal display device, an EL (Electroluminescence) display device, and the like.
  • a display device represented by a liquid crystal display device, an EL (Electroluminescence) display device, and the like.
  • EL Electrode-emitting diode
  • the electronic component includes, for example, elements such as a semiconductor element, a resistor element, and a capacitor element, or a circuit including a plurality of these elements. These elements are produced, for example, by forming a pattern such as an electrode, a wiring, and a hole for electrically connecting the wiring on a substrate such as a silicon wafer or a glass substrate.
  • Electronic components are manufactured through several hundred or more manufacturing steps for manufacturing a plurality of elements as described above.
  • Manufacture of an electronic component includes a plurality of manufacturing steps for manufacturing a plurality of elements as described above. For this reason, although it is performed in an environment where the contamination of foreign matters is highly regulated, it is difficult to completely suppress the damage to the substrate and circuit, the occurrence of patterning defects, and the like. Therefore, it is necessary to inspect various characteristics of the electronic component in order to investigate damage to the substrate and circuit, occurrence of patterning defects, and prevent the introduction of defective products.
  • the inspection of the characteristics of electronic parts is generally performed using an inspection device called a semiconductor inspection device.
  • a semiconductor inspection device for example, the tip of a thin needle electrode called a probe (also referred to as a conductive contact) is electrically connected to each of a plurality of electrodes and a plurality of wirings formed on a semiconductor integrated circuit, Acquire various electrical information.
  • One of the objects of the present invention is to provide a probe that can reliably achieve electrical connection with a semiconductor integrated circuit to be inspected or an electrode or wiring of an electronic component including the semiconductor integrated circuit.
  • One of the objects of the present invention is to provide a probe having excellent durability, for example, durability of an end portion in contact with an electrode or wiring.
  • One of the objects of the present invention is to provide a probe unit including one or two or more probes, or a semiconductor inspection apparatus including the probe unit.
  • a probe according to an embodiment of the present invention includes a first plunger, a first end having a first notch for fitting the first plunger, and a first spiral having a first spiral groove. And a first pipe having a first cylindrical portion.
  • the probe which concerns on one Embodiment of this invention is equipped with the 2nd plunger
  • the 1st pipe may be provided with the 2nd end part which has a 2nd notch which fits a 2nd plunger. .
  • the first plunger of the probe according to the embodiment of the present invention may further include a first sliding portion, and the first sliding portion may be in contact with the first cylindrical portion.
  • the first pipe of the probe according to the embodiment of the present invention may include a second spiral portion having a second spiral groove.
  • the second plunger of the probe according to the embodiment of the present invention may further include a second sliding portion, and the second sliding portion may be in contact with the first cylindrical portion.
  • the probe according to one embodiment of the present invention may further include a second pipe disposed inside the first pipe and in contact with the first cylindrical portion.
  • the second pipe of the probe according to the embodiment of the present invention may have a third spiral groove.
  • At least one end has a notch, and the notch of the second pipe is the first plunger or A second plunger may be fitted.
  • the probe according to one embodiment of the present invention is fitted to the first pipe in either the first plunger or the second plunger fitted to both the first pipe and the second pipe of the probe.
  • the second boss portion may protrude from the first boss portion.
  • the probe includes a second pipe disposed inside the first pipe, in contact with the first cylindrical portion, and having a third spiral groove.
  • the second pipe has a notch in at least one of the two ends, and the first spiral portion is the first sliding portion in the first pipe and the second pipe.
  • the second spiral portion extends over the entire length, overlaps with the second cylindrical portion of the second pipe, or the notch of the second pipe, and the third spiral groove extends over the entire length, You may overlap with the notch which a 1st cylindrical part or a 2nd pipe has.
  • One embodiment of the present invention is a probe unit having a probe.
  • One embodiment of the present invention is a semiconductor inspection apparatus having a probe unit.
  • FIG. 1 is a schematic view showing a configuration of a semiconductor inspection apparatus according to the first embodiment of the present invention.
  • the semiconductor inspection apparatus 100 includes a probe unit 120 and a probe 110 provided therein.
  • the number of the probes 110 may be one or more, and usually a plurality of (for example, several tens to several thousand) probes 110 are installed.
  • the probe 110 exchanges electric signals with the circuit board 140.
  • the circuit board 140 is connected to the tester 150.
  • the tester 150 includes units such as a measurement power supply 152, an LCR measurement device 154, and a pulse generator 156.
  • FIG. 2A is a schematic cross-sectional view of the probe 110 and the probe unit 120 shown in FIG. A specific example of the first pipe 10 will be described later with reference to FIG. 3A.
  • the probe 110 is housed in the probe unit 120, and a part of the first plunger 14 is exposed.
  • the first tip 12 comes into contact with the electrode or wiring of the inspection object 170, and the electrical characteristics are measured.
  • Examples of the inspection object 170 include an IC package formed on a silicon wafer.
  • the portions facing the first tip portion 12 and the first plunger 14 are the second tip portion 22 and the second plunger 24.
  • the probe unit 120 may be composed of a probe holder 70 having a first probe holder member 72 and a second probe holder member 74, for example.
  • the first probe holder member 72 and the second probe holder member 74 may be formed using an insulator such as resin or ceramic.
  • the plurality of probes 110 are arranged so as to have the same height. Further, the arrangement may be determined according to the electrode to be inspected and the wiring pattern.
  • the probe 110 includes a conductive material, and may include, for example, a metal such as gold, copper, nickel, palladium, tungsten, or an alloy of the above metals. Alternatively, the probe 110 may include a conductive material, and the surface may be plated using gold or the like.
  • the probe 110 has a first plunger 14, a second plunger 24, and a first pipe.
  • the first plunger 14 has a first tip portion 12, a first plunger boss portion 16, and a first sliding portion 18.
  • the second plunger 24 has a second tip portion 22, a second plunger boss portion 26, and a second sliding portion 28.
  • the first pipe 10 has a first end portion 30 having a first notch 20, a first spiral portion 40 having a first spiral groove 41, and a second end portion having a second notch 21.
  • a second spiral portion 60 having two end portions 31, a second spiral groove 61, and a first cylindrical portion 50.
  • the first notch 20 is continuous with the first spiral groove 41.
  • the second notch 21 is continuous with the second spiral groove 61.
  • a first plunger boss 16 is fitted in the first notch 20.
  • a second plunger boss portion 26 is fitted in the second notch 21.
  • the first plunger 14 is electrically connected to the electrode and wiring of the inspection object 170 at the first tip portion 12.
  • the 1st plunger 14 and the 2nd plunger 24 have a cylindrical shape, and it demonstrates as a cylindrical shape also in this embodiment.
  • channel contained in the 1st spiral part 40 and the 2nd spiral part 60 is not limited to the case shown in drawing.
  • the number of grooves can be changed without departing from the spirit of the present invention.
  • the length and thickness of each part are not limited to those shown in the drawings, and can be changed without departing from the gist of the present invention.
  • the first plunger 14 is press-fitted into the first pipe 10, and the first notch 20 is fitted with the first plunger boss portion 16.
  • the second plunger 24 is also press-fitted into the first pipe 10, and the second plunger boss portion 26 is fitted into the second notch 21. Since there is a notch, the diameter of the first pipe 10 is likely to be widened, so that the load for press-fitting the plunger into the pipe can be reduced. Further, even if the plunger and the pipe diameter are somewhat varied, it can be tolerated.
  • the first sliding portion 18 is relatively thinner than the diameter of the first plunger boss portion 16.
  • the thin part of the 1st sliding part 18 may contain two different diameters.
  • the second sliding portion 28 is relatively thinner than the diameter of the second plunger boss portion 26.
  • the thin part of the 2nd sliding part 28 may contain two different diameters.
  • the tip portion slightly narrower than the first plunger boss portion 16 has a first cylindrical portion due to the bending of the first pipe 10 that occurs when receiving a load from the electrode or wiring to be inspected. 50.
  • the tip part slightly thinner than the second plunger boss part 26 is in contact with the first cylindrical part 50.
  • the first plunger 14, the first cylindrical portion 50, and the second plunger 24 may be used as a conduction path when electrically connected to the electrode and wiring of the inspection target 170. it can. Therefore, since the electrode or wiring and the probe can be conducted without using the spiral portion, the resistance value and inductance of the probe can be reduced. It should be noted that the conduction path not passing through the spiral portion only needs to be secured when electrically connected to the electrode or wiring of the inspection object 170, and this conduction path may not be secured before the connection.
  • the probe 110 having such a configuration allows the first pipe 10 to expand and contract in the axial direction when the first tip portion 12 of the probe 110 comes into contact with the electrode and the wiring of the inspection target 170, so Can reduce the impact.
  • each end of the first pipe 10 has one notch (also referred to as one place) has been described as an example, but there are two or more notches (also referred to as two or more places). There may be. Further, the length of the cutout may be longer or shorter than the illustrated length without departing from the spirit described in the present invention. Since there are two or more cutouts, the diameter of the first pipe 10 is more easily expanded, and therefore the load for press-fitting the plunger into the pipe can be further reduced.
  • the notch and the spiral groove may not be continuous. Since the notch and the spiral groove are not continuous, the strength of the pipe can be increased. Further, the length of the notch and the spiral groove is not limited to the length shown in FIG. 2A.
  • FIG. 2B is different from the configuration of FIG. 2A in that it has a second pipe 32 and the structure of the second plunger 24 is different.
  • the second pipe 32 is in contact with the first pipe 10. Note that one end of the second pipe 32 has a notch. A specific example of the second pipe 32 will be described later with reference to FIG. 3F.
  • the third plunger boss portion 29 of the second plunger 24 has a relatively smaller diameter and protrudes from the second plunger boss portion 26.
  • the second plunger boss portion 26 is fitted in the second cutout 21, and the third plunger boss portion 29 is fitted in the third cutout 23.
  • the first plunger 14 has the same configuration as the second plunger 24, and a pipe without a spiral groove similar to the second pipe may be fitted therein.
  • the manufacturing can be simplified.
  • the first sliding portion 18 and the second pipe 32 do not go through the first spiral portion 40 and the second spiral portion 60, Since it is electrically connected via the first cylindrical portion 50, the resistance value of the probe can be lowered.
  • FIG. 2C shows an example in which the second pipe 32 has a spiral groove with respect to the configuration of FIG. 2B.
  • a portion without a spiral groove and notch is defined as a second cylindrical portion.
  • the load resistance of the probe 110 can be increased.
  • a movable range can be expanded.
  • channel which the 2nd pipe 32 has, the 1st spiral part 40, and the 2nd spiral part 60 have shown the example which has not overlapped. That is, the first pipe 10 and the second pipe 32 can overlap at least one of the portions without the spiral groove, and the spiral groove does not have to be a conduction path. The value can be further reduced.
  • the spiral groove of the second pipe 32, the first spiral groove 41, and the second spiral groove 61 may overlap each other. In that case, the movable range of the probe 110 can be further expanded.
  • the 1st sliding part 18 has shown the example which is in contact with the 2nd pipe 32, it is not limited to this example. It is only necessary that the first sliding portion 18 is in contact with the second pipe 32 when the electric signal is transmitted and received. In the state of FIG. 2C, the first sliding portion 18 is not in contact with the second pipe 32. Also good.
  • FIG. 2D shows an example in which the first plunger 14 is inserted into the second pipe with respect to the configuration of FIG. 2C.
  • the first plunger 14 may also be press-fitted into the second pipe.
  • the first plunger boss portion 16 of the first plunger 14 is fitted into the first notch 20, and the fourth plunger boss portion 19 is fitted into the other end of the second pipe 32. Is done.
  • the second pipe 32 is in contact with the first plunger 14 and the second plunger 24 even when the probe 110 is not receiving a load from the electrode or wiring to be inspected. Therefore, a conduction path is always secured, and the resistance value of the probe can be kept low.
  • FIGS. 3A to 3E are schematic plan views of the first pipe 10 included in the probe 110.
  • FIG. 3F shows a schematic plan view of the second pipe 32.
  • FIG. 3A has the same configuration as the first pipe 10 shown in FIG. 2A, and the description thereof is omitted here.
  • FIG. 3B is different from FIG. 3A in that the first notch 20 has an angle with respect to the end surface of the first end portion 30, and the second notch 21 has an angle with respect to the end surface of the second end portion 31.
  • An example having an angle is shown. Even if the second notch 21 has an angle with respect to the end surface of the second end portion 31, the end surface of the second end portion 31 is approximately horizontal. Therefore, when the second plunger 24 is press-fitted into the first pipe 10, the diameter of the second end portion 31 is widened so that the second plunger 24 is expanded and contracted with respect to the first pipe 10. It is possible to press-fit without difficulty. Therefore, it is possible to provide a highly reliable probe with little damage and the like.
  • FIG. 3C is different from FIG. 3B in that the first notch 20 is not continuous with the first spiral groove 41, and the second notch 21 is also continuous with the second spiral groove 61.
  • the boss portion 16 is press-fitted approximately straight with respect to the expansion and contraction direction of the first pipe 10. Therefore, the first pipe 10 and the first plunger 14 are connected approximately horizontally, and electrical connection can be ensured.
  • the second plunger 24 the surface area of the pipe is increased due to the fewer grooves as compared with FIGS. 3A and 3B, so that a probe with higher durability can be realized. Therefore, it is possible to provide a highly reliable probe with little damage and the like.
  • FIGS. 3D and 3E show the first notch 20, one spiral groove 42, one second notch 21, and a spiral shape with respect to FIGS. 3A and 3C, respectively.
  • the spring constant of the first pipe is reduced, and the first pipe is more easily expanded and contracted in the axial direction. The impact at the time of contact with can be further reduced.
  • FIG. 3F shows a schematic plan view of the second pipe 32 included in the probe 110.
  • FIG. 3F is a plan view of the second pipe 32 shown in FIG. 2B.
  • One end of the second pipe 32 has a third notch 23. Since the pipe has the notch, the plunger can be press-fitted substantially straight with respect to the expansion and contraction direction of the pipe. Therefore, the electrical connection between the pipe and the plunger can be ensured.
  • the probe 110 having such a configuration can mitigate the impact on the inspection target by the first pipe 10 extending and contracting in the axial direction.
  • the second pipe 32 may also have a spiral groove as shown in FIGS. 2C and 2D.
  • the 3rd notch 23 may have an angle with respect to the end surface of the 2nd pipe 32, as shown to FIG. 3B. Further, the spiral groove and the third notch 23 may be continuous as shown in FIG. 3A or may not be continuous as shown in FIG. 3C. Further, the spiral groove may be two as shown in FIGS. 3D and 3E.
  • the notch may be parallel to the direction in which the pipe expands or contracts, or may have an angle.
  • the length of the cutout may be longer or shorter than the illustrated length without departing from the spirit described in the present invention.
  • the shape of each edge part may differ.
  • channel has shown the example which is 2 strip
  • the length of the spiral groove may be longer or shorter than the illustrated length without departing from the spirit described in the present invention.
  • the number of notches may be at least one.
  • the notch may be continuous with the spiral groove.
  • the notches and the spiral groove may not be continuous or may be continuous. However, one side may be continuous and the other may not be continuous.
  • the probe 110 has the first notch 20 when the first plunger 14 is press-fitted into the first pipe 10, so that the first notch 20 Compared with the case where there is no notch 20, the diameter of the first pipe 10 is increased, and the load for press-fitting the plunger into the pipe can be reduced. Further, in the probe 110, the first end 30 is kept approximately horizontal. Therefore, the first plunger 14 is press-fitted approximately straight with respect to the expansion / contraction direction of the first pipe 10. The same applies to the press-fitting of the second plunger boss portion 26 and the second end portion 31 of the second plunger 24.
  • the electrical connection can be ensured.
  • the pressure can be applied almost straight to the tip of the probe, even if contact with the electrodes and wiring of the semiconductor integrated circuit is repeated, the tip of the probe is prevented from being bent or quickly worn out, making it durable.
  • a probe with high performance can be realized.
  • the positional accuracy of the tip of the probe can be increased.
  • the probe unit provided with these probes, or a semiconductor inspection apparatus provided with the same can be provided.
  • Second Embodiment In this embodiment, another configuration of the probe according to one embodiment of the present invention will be described. In addition, description may be abbreviate
  • FIG. 4 shows a schematic cross-sectional view of the probe 112 and a schematic plan view of the first pipe 80 included in the probe 112.
  • the probe 112 is housed and used in the probe unit 120 shown in FIG. 2A. 4A to 4C show an example in which the second spiral groove 61 is not provided for the probe 110 of FIGS. 2B to 2D. 4, the description of the same configuration as that of FIG. 2 may be omitted.
  • the second plunger 24 included in the probe 112 has a second tip portion 22 and a second plunger boss portion 26.
  • the first pipe 80 includes a first end portion 30 having a first notch 20, a first spiral portion 40 having a first spiral groove 41, and It has the 1st cylindrical part 50 and the 2nd edge part 31 which has the 2nd notch 21.
  • a second plunger boss portion 26 is fitted in the second notch 21.
  • channel contained in the 1st spiral part 40 is not limited to the case shown in drawing.
  • the number of grooves can be changed without departing from the spirit of the present invention.
  • the length and thickness of each portion are not limited to those shown in the drawings, and can be changed without departing from the spirit of the present invention.
  • the length and thickness of each part are not limited to those shown in the drawings, and can be changed without departing from the gist of the present invention.
  • FIG. 4B shows an example in which the second pipe 32 has a spiral groove and the structure of the second plunger 24 is different from the configuration of FIG. 4A.
  • the description of the same configuration as in FIG. 4A is omitted here.
  • the second pipe 32 is in contact with the first pipe 80.
  • the load resistance of the probe 112 can be increased.
  • the movable range of the probe 112 can be expanded.
  • an example in which the spiral groove of the second pipe 32 and the first spiral groove 41 do not overlap is shown. That is, since it is not necessary to use a spiral groove as a conduction path, the resistance value of the probe can be further reduced.
  • 4B has one spiral groove on one side of the first pipe and one contact point on the sliding portion.
  • the second pipe has one spiral groove. Therefore, the movable range of the probe can be widened.
  • hub part 29 has shown the example which is a column shape, it is not limited to this example.
  • the third plunger boss portion 29 is press-fitted into the second pipe 32 by forming a pointed shape like a conical shape, it is possible to facilitate press-fitting.
  • FIG. 4C shows an example in which the first plunger 14 is also inserted into the second pipe with respect to the configuration of FIG. 4B.
  • the description of the same configuration as in FIG. 4B is omitted here.
  • the second pipe 32 is in contact with the first plunger 14 and the second plunger 24 even when the probe 112 is not receiving a load from the electrode or wiring to be inspected. Therefore, a conduction path is always secured, and the resistance value of the probe can be kept low.
  • the spiral groove may be two as shown in FIGS. 3D and 3E. Further, the spiral groove may be three or more (not shown).
  • the case where the first end portion 30 has one notch (also referred to as one location) has been described as an example, but the number of notches may be two or more (also referred to as two locations or more). .
  • the first cylindrical portion 50 has one notch (also referred to as one place) has been described as an example, the number of notches may be two or more (also referred to as two or more places).
  • the length of the notch may be longer or shorter than the illustrated length without departing from the spirit described in the present invention. Since there are two or more cutouts, the diameter of the first pipe 80 is more easily expanded, and therefore the load for press-fitting the plunger into the pipe can be further reduced. Further, the length of the spiral groove may be longer or shorter than the illustrated length without departing from the spirit described in the present invention.
  • the notch may be parallel to the direction in which the pipe expands or contracts, or may have an angle.
  • the length of the cutout may be longer or shorter than the illustrated length without departing from the spirit described in the present invention.
  • the shape of each edge part may differ.
  • the both ends of the 1st edge part 30 and the 2nd edge part 31 have a notch, the number of the notches which each edge part has may differ.
  • the length of the spiral groove may be longer or shorter than the illustrated length without departing from the spirit described in the present invention.
  • the number of notches may be at least one.
  • the notch may be continuous with the spiral groove.
  • the notches and the spiral groove may not be continuous or may be continuous. However, one side may be continuous and the other may not be continuous.
  • a conductive path having a small resistance value can be secured when electrically connected to an electrode or wiring of a semiconductor integrated circuit to be inspected or an electronic component including the semiconductor integrated circuit.
  • a probe that can reliably achieve electrical connection.
  • a probe that is excellent in durability at an end portion in contact with an electrode or wiring.
  • a probe unit including these probes or a semiconductor inspection apparatus including the probe unit can be provided.
  • FIG. 5 shows a schematic cross-sectional view of the probe 113 and the probe unit 120 and a schematic plan view of the first pipe 90 included in the probe 112.
  • the probe 113 shown in FIG. 5A shows an example in which the second plunger 24 is not provided and the first pipe 90 does not have the second notch 21 with respect to the configuration of the probe 112 shown in FIG. 4A. Yes.
  • the other configuration is the same as that in FIG. 4A, and a description thereof is omitted here.
  • the first pipe 90 includes a first end 30 having a first notch 20, a first spiral 40 having a first spiral groove 41, and a first And a second end portion 31 having no notch.
  • the first end portion 30 into which the first plunger 14 that comes into contact with the electrode or wiring of the semiconductor integrated circuit is press-fitted has a first notch 20, so that the first plunger 14 can expand and contract the first pipe 90.
  • the first pipe 90 and the first plunger 14 are connected approximately horizontally, and electrical connection can be ensured.
  • the tip of the probe is not inclined with respect to the electrode or wiring surface of the semiconductor integrated circuit but can be contacted approximately vertically, the probe tip can be prevented from being bent or quickly worn out, and has high durability. Can be realized.
  • the first pipe 90 does not have the second notch 21, the manufacture of the probe can be simplified.
  • channel contained in the 1st spiral part 40 is not limited to the case shown in drawing. The number of grooves can be changed without departing from the spirit of the present invention.
  • each portion is not limited to those shown in the drawings, and can be changed without departing from the spirit of the present invention.
  • the length and thickness of each part are not limited to those shown in the drawings, and can be changed without departing from the gist of the present invention.
  • the probe holder 70 can be formed by only the first probe holder member 72. Therefore, the manufacturing cost can be reduced as compared with FIG. 2A.
  • FIG. 5C shows an example of the first pipe 90.
  • FIG. 5C shows an example in which a plurality of tapered claws are provided at the second end portion 31 in the configuration of FIG. 5B to form a crown-shaped tip portion 180 (also referred to as a crown shape).
  • the probe 113 can perform more reliable electrical connection with the electrode or wiring on the circuit board 140.
  • the spiral groove may be two as shown in FIGS. 3D and 3E. Further, the spiral groove may be three or more.
  • FIG. 5 illustrates an example in which the first pipe has one notch (also referred to as one place), but the number of notches may be two or more (also referred to as two or more places). Further, the length of the cutout may be longer or shorter than the illustrated length without departing from the spirit described in the present invention. Since there are two or more notches, the diameter of the first pipe 90 becomes easier to expand, so that the load for press-fitting the plunger into the pipe can be further reduced. Further, the length of the spiral groove may be longer or shorter than the illustrated length without departing from the spirit described in the present invention.
  • FIG. 5 shows examples of probes according to an embodiment of the present invention, but the present invention is not limited to these examples.
  • the notch may be parallel to the direction in which the pipe expands or contracts, or may have an angle.
  • the length of the cutout may be longer or shorter than the illustrated length without departing from the spirit described in the present invention.
  • each notch may be parallel with respect to the direction where a pipe expands / contracts, may have an angle, and is parallel.
  • a notch and a notch having an angle may be mixed.
  • the length of the spiral groove may be longer or shorter than the illustrated length without departing from the spirit described in the present invention.
  • the number of notches may be at least one.
  • the notch may be continuous with the spiral groove or may not be continuous. When there are two notches, one may be continuous and the other may not be continuous.
  • a conductive path having a small resistance value can be secured when electrically connected to an electrode or wiring of a semiconductor integrated circuit to be inspected or an electronic component including the semiconductor integrated circuit.
  • a probe that can reliably achieve electrical connection.
  • a probe that is excellent in durability at an end portion in contact with an electrode or wiring.
  • a probe unit including these probes or a semiconductor inspection apparatus including the probe unit can be provided.
  • FIG. 6 is a schematic plan view of the first tip portion 12 or the second tip portion 22 included in the probe according to the embodiment of the present invention.
  • FIG. 6A shows a tip shaped like a crown. Such a shape is also called a crown type, for example.
  • the shape shown in FIG. 6A is used for the first tip 12, for example.
  • By making the first tip portion 12 into a crown shape it is possible to make contact with the electrodes or wirings of a semiconductor integrated circuit to be inspected or an electronic component including the same at a plurality of vertices of the crown. Therefore, more reliable electrical connection with the electrode or wiring to be inspected is possible.
  • FIG. 6B shows a conical tip.
  • the shape shown in FIG. 6B is used for the first tip portion 12, for example.
  • the contact with the electrode or wiring of the semiconductor integrated circuit to be inspected or the electronic component including the semiconductor integrated circuit can be performed with a point, so that local contact is possible.
  • the contact with the electrode or wiring of the semiconductor integrated circuit to be inspected or the electronic component including the semiconductor integrated circuit can be performed with a point, so that local contact is possible.
  • mold it can contact with a bigger load.
  • reliable electrical connection with the electrodes and wirings to be inspected becomes possible.
  • FIG. 6C shows a tip having a rounded tip with respect to FIG. 6B.
  • the shape shown in FIG. 6C is used for the first tip portion 12 or the second tip portion 22, for example. With such a shape, it is possible to increase an area electrically connected to an electrode or wiring of a semiconductor integrated circuit to be inspected or an electronic component including the semiconductor integrated circuit. Therefore, the surface pressure between the electrode or wiring to be inspected and the probe can be lowered.

Abstract

The probe according to one embodiment of the present invention is provided with: a first plunger; a first end section having a first cutout for fitting in the first plunger; a first spiral section having a first spiral groove; and a first pipe having a first cylindrical section.

Description

プローブ、プローブユニット、およびプローブユニットを備える半導体検査装置Probe, probe unit, and semiconductor inspection apparatus including probe unit
　本発明はプローブに関する。例えば、半導体集積回路などの半導体を用いた回路を有する電子部品、あるいは、電子部品を備える電子機器などの検査対象物を検査するためのプローブ、プローブユニット、およびプローブユニットを備える半導体検査装置に関する。 The present invention relates to a probe. For example, the present invention relates to a probe for inspecting an inspection object such as an electronic component having a circuit using a semiconductor such as a semiconductor integrated circuit, or an electronic device including the electronic component, a probe unit, and a semiconductor inspection apparatus including the probe unit.
　半導体集積回路は、様々な電子部品に用いられている。また、液晶表示装置、ＥＬ（Ｅｌｅｃｔｒｏｌｕｍｉｎｅｓｃｅｎｃｅ）表示装置などに代表される表示装置などの電子機器にも、半導体集積回路を有する電子部品が用いられている。以下では、これらの電子部品や電子機器を纏めて電子部品と記す。 Semiconductor integrated circuits are used in various electronic components. An electronic component having a semiconductor integrated circuit is also used for an electronic device such as a display device represented by a liquid crystal display device, an EL (Electroluminescence) display device, and the like. Hereinafter, these electronic components and electronic devices are collectively referred to as electronic components.
　電子部品は、例えば、半導体素子、抵抗素子および容量素子などの素子、または、それらの複数の素子などを含む回路から構成される。これらの素子は、例えば、シリコンウエハーやガラス基板などの基板上に、電極、配線及び配線を電気的に接続するための穴などのパターンを形成することで作製される。電子部品は、以上のような複数の素子を作製する数百以上の製造工程を経て製造される。電子部品の製造は、以上のように複数の素子を作製するための複数の製造工程を含む。そのため、異物の混入を高度に規制する環境下で行われるものの、基板や回路の損傷、パターニング不良の発生などを完全に抑制することは困難である。よって、基板や回路の損傷、パターニング不良の発生などを調査し、不良品の混入を防止するため、電子部品の種々な特性を検査する必要がある。 The electronic component includes, for example, elements such as a semiconductor element, a resistor element, and a capacitor element, or a circuit including a plurality of these elements. These elements are produced, for example, by forming a pattern such as an electrode, a wiring, and a hole for electrically connecting the wiring on a substrate such as a silicon wafer or a glass substrate. Electronic components are manufactured through several hundred or more manufacturing steps for manufacturing a plurality of elements as described above. Manufacture of an electronic component includes a plurality of manufacturing steps for manufacturing a plurality of elements as described above. For this reason, although it is performed in an environment where the contamination of foreign matters is highly regulated, it is difficult to completely suppress the damage to the substrate and circuit, the occurrence of patterning defects, and the like. Therefore, it is necessary to inspect various characteristics of the electronic component in order to investigate damage to the substrate and circuit, occurrence of patterning defects, and prevent the introduction of defective products.
　電子部品の特性の検査は、一般的に、半導体検査装置と呼ばれる検査装置を用いて行われる。これらの検査では、例えば、半導体集積回路上に形成された複数の電極や複数の配線のそれぞれに、プローブ（導電性接触子とも呼ぶ）と呼ばれる細い針状電極の先端を電気的に接続させ、種々の電気的な情報を取得する。 The inspection of the characteristics of electronic parts is generally performed using an inspection device called a semiconductor inspection device. In these inspections, for example, the tip of a thin needle electrode called a probe (also referred to as a conductive contact) is electrically connected to each of a plurality of electrodes and a plurality of wirings formed on a semiconductor integrated circuit, Acquire various electrical information.
　近年、半導体集積回路や表示装置の高集積化、微細化が進展し、半導体集積回路などの電子部品に形成された複数の電極や複数の配線も縮小化されている。電子部品によっては、電極や配線の寸法が、百数十μｍ以下である電子部品もある。よって、半導体検査装置が有するプローブにおいても、例えば、プローブの外径を縮小すること、プローブとプローブとの間隔を狭小化することなどが求められる。そして、プローブのサイズが縮小されると、プローブと、電子部品に形成された電極や配線との電気的な接続や、プローブの耐久性が問題になる。そこで、半導体検査装置が有するプローブの構造や、プローブの端部の形状を工夫する試みがなされている。 In recent years, semiconductor integrated circuits and display devices have been highly integrated and miniaturized, and a plurality of electrodes and a plurality of wirings formed on electronic parts such as semiconductor integrated circuits have also been reduced. Depending on the electronic component, there is also an electronic component in which the dimensions of electrodes and wiring are hundreds of tens of micrometers or less. Therefore, in a probe included in a semiconductor inspection apparatus, for example, it is required to reduce the outer diameter of the probe and to narrow the interval between the probe and the like. When the size of the probe is reduced, the electrical connection between the probe and the electrodes and wirings formed on the electronic component and the durability of the probe become problems. Therefore, attempts have been made to devise the structure of the probe included in the semiconductor inspection apparatus and the shape of the end of the probe.
特開２０１６－０８０６５７号公報JP 2016-080657 A 特開２０１０－２８１５８３号公報JP 2010-281585 A
　本発明の課題の一つは、検査対象である半導体集積回路、あるいはこれを含む電子部品の電極あるいは配線との電気的な接続を確実に達成できるプローブを提供することである。本発明の課題の一つは、耐久性、例えば電極あるいは配線と接触する端部の耐久性に優れたプローブを提供することである。本発明の課題の一つは、上記プローブを一つ、あるいは二つ以上備えるプローブユニット、またはこれを備える半導体検査装置を提供することである。 One of the objects of the present invention is to provide a probe that can reliably achieve electrical connection with a semiconductor integrated circuit to be inspected or an electrode or wiring of an electronic component including the semiconductor integrated circuit. One of the objects of the present invention is to provide a probe having excellent durability, for example, durability of an end portion in contact with an electrode or wiring. One of the objects of the present invention is to provide a probe unit including one or two or more probes, or a semiconductor inspection apparatus including the probe unit.
　本発明の一実施形態に係るプローブは、第１のプランジャ、第１のプランジャを嵌合する第１の切り欠きを有する第１の端部、第１の螺旋状の溝を有する第１の螺旋部、および第１の円筒部を有する第１のパイプを備える。 A probe according to an embodiment of the present invention includes a first plunger, a first end having a first notch for fitting the first plunger, and a first spiral having a first spiral groove. And a first pipe having a first cylindrical portion.
　本発明の一実施形態に係るプローブは、第２のプランジャを備え、第１のパイプは、第２のプランジャを嵌合する第２の切り欠きを有する第２の端部を備えていてもよい。 The probe which concerns on one Embodiment of this invention is equipped with the 2nd plunger, The 1st pipe may be provided with the 2nd end part which has a 2nd notch which fits a 2nd plunger. .
　本発明の一実施形態に係るプローブが有する第１のプランジャは、さらに第１の摺動部を有し、第１の摺動部は、第１の円筒部と接していてもよい。 The first plunger of the probe according to the embodiment of the present invention may further include a first sliding portion, and the first sliding portion may be in contact with the first cylindrical portion.
　本発明の一実施形態に係るプローブが有する第１のパイプは、第２の螺旋状の溝を有する第２の螺旋部を備えていてもよい。 The first pipe of the probe according to the embodiment of the present invention may include a second spiral portion having a second spiral groove.
　本発明の一実施形態に係るプローブが有する第２のプランジャは、さらに第２の摺動部を有し、第２の摺動部は、第１の円筒部と接していてもよい。 The second plunger of the probe according to the embodiment of the present invention may further include a second sliding portion, and the second sliding portion may be in contact with the first cylindrical portion.
　本発明の一実施形態に係るプローブは、さらに、第１のパイプの内側に配置され、第１の円筒部に接する第２のパイプを備えていてもよい。 The probe according to one embodiment of the present invention may further include a second pipe disposed inside the first pipe and in contact with the first cylindrical portion.
　本発明の一実施形態に係るプローブが有する第２のパイプは、第３の螺旋状の溝を有していてもよい。 The second pipe of the probe according to the embodiment of the present invention may have a third spiral groove.
　本発明の一実施形態に係るプローブが有する第２のパイプが有する二つの端部のうち、少なくとも一方の端部に切り欠きを有し、第２のパイプが有する切り欠きは第１のプランジャまたは第２のプランジャを嵌合していてもよい。 Of the two ends of the second pipe of the probe according to the embodiment of the present invention, at least one end has a notch, and the notch of the second pipe is the first plunger or A second plunger may be fitted.
　本発明の一実施形態に係るプローブが有する第１のパイプおよび第２のパイプの両方に嵌合されている第１のプランジャまたは第２のプランジャの何れか一方において、第１のパイプに嵌合されている第１のボス部と、第２のパイプに嵌合されている第２のボス部とを有し、第１のボス部の径は第２のボス部の径と比して大きく、第２のボス部は第１のボス部よりも突出していてもよい。 The probe according to one embodiment of the present invention is fitted to the first pipe in either the first plunger or the second plunger fitted to both the first pipe and the second pipe of the probe. A first boss portion and a second boss portion fitted to the second pipe, and the diameter of the first boss portion is larger than the diameter of the second boss portion. The second boss portion may protrude from the first boss portion.
　本発明の一実施形態に係るプローブにおいて、第１のパイプの内側に配置され、第１の円筒部に接し、第３の螺旋状の溝を有する第２のパイプを備え、第２のパイプは、第２のパイプが有する二つの端部のうち、少なくとも一方の端部に切り欠きを有し、第１のパイプと第２のパイプとにおいて、第１の螺旋部は第１の摺動部と重なり、第２の螺旋部は全長に渡り、第２のパイプが有する第２の円筒部、または第２のパイプが有する切り欠きと重なり、前記第３の螺旋状の溝は全長に渡り、第１の円筒部または第２のパイプが有する切り欠きと重なってもよい。 In the probe according to the embodiment of the present invention, the probe includes a second pipe disposed inside the first pipe, in contact with the first cylindrical portion, and having a third spiral groove. The second pipe has a notch in at least one of the two ends, and the first spiral portion is the first sliding portion in the first pipe and the second pipe. And the second spiral portion extends over the entire length, overlaps with the second cylindrical portion of the second pipe, or the notch of the second pipe, and the third spiral groove extends over the entire length, You may overlap with the notch which a 1st cylindrical part or a 2nd pipe has.
　本発明の一実施形態は、プローブを有するプローブユニットである。 One embodiment of the present invention is a probe unit having a probe.
　本発明の一実施形態は、プローブユニットを有する半導体検査装置である。 One embodiment of the present invention is a semiconductor inspection apparatus having a probe unit.
本発明の一実施形態の半導体検査装置の模式図である。It is a schematic diagram of the semiconductor inspection apparatus of one Embodiment of this invention. 本発明の一実施形態のプローブユニットの模式図である。It is a schematic diagram of the probe unit of one Embodiment of this invention. 本発明の一実施形態のプローブの模式図である。It is a schematic diagram of the probe of one Embodiment of this invention. 本発明の一実施形態のプローブの模式図である。It is a schematic diagram of the probe of one Embodiment of this invention. 本発明の一実施形態のプローブの模式図である。It is a schematic diagram of the probe of one Embodiment of this invention. 本発明の一実施形態の第１のパイプの模式図である。It is a schematic diagram of the 1st pipe of one Embodiment of this invention. 本発明の一実施形態の第１のパイプの模式図である。It is a schematic diagram of the 1st pipe of one Embodiment of this invention. 本発明の一実施形態の第１のパイプの模式図である。It is a schematic diagram of the 1st pipe of one Embodiment of this invention. 本発明の一実施形態の第１のパイプの模式図である。It is a schematic diagram of the 1st pipe of one Embodiment of this invention. 本発明の一実施形態の第１のパイプの模式図である。It is a schematic diagram of the 1st pipe of one Embodiment of this invention. 本発明の一実施形態の第２のパイプの模式図である。It is a schematic diagram of the 2nd pipe of one Embodiment of this invention. 本発明の一実施形態のプローブの模式図である。It is a schematic diagram of the probe of one Embodiment of this invention. 本発明の一実施形態のプローブの模式図である。It is a schematic diagram of the probe of one Embodiment of this invention. 本発明の一実施形態のプローブの模式図である。It is a schematic diagram of the probe of one Embodiment of this invention. 本発明の一実施形態の第１のパイプの模式図である。It is a schematic diagram of the 1st pipe of one Embodiment of this invention. 本発明の一実施形態のプローブユニットの模式図である。It is a schematic diagram of the probe unit of one Embodiment of this invention. 本発明の一実施形態の第１のパイプの模式図である。It is a schematic diagram of the 1st pipe of one Embodiment of this invention. 本発明の一実施形態の第１のパイプの模式図である。It is a schematic diagram of the 1st pipe of one Embodiment of this invention. 本発明の一実施形態のプローブが有する先端部の模式図である。It is a schematic diagram of the front-end | tip part which the probe of one Embodiment of this invention has. 本発明の一実施形態のプローブが有する先端部の模式図である。It is a schematic diagram of the front-end | tip part which the probe of one Embodiment of this invention has. 本発明の一実施形態のプローブが有する先端部の模式図である。It is a schematic diagram of the front-end | tip part which the probe of one Embodiment of this invention has.
　以下、本出願で開示される発明の各実施形態について、図面を参照しつつ説明する。但し、本発明は、その要旨を逸脱しない範囲において様々な形態で実施することができ、以下に例示する実施形態の記載内容に限定して解釈されるものではない。 Hereinafter, embodiments of the invention disclosed in the present application will be described with reference to the drawings. However, the present invention can be implemented in various forms without departing from the gist thereof, and is not construed as being limited to the description of the embodiments exemplified below.
　また、図面は、説明をより明確にするため、実際の態様に比べ、各部の幅、厚さ、形状等について模式的に表される場合があるが、あくまで一例であって、本発明の解釈を限定するものではない。また、本明細書と各図において、既出の図に関して説明したものと同様の機能を備えた要素には、同一の符号を付して、重複する説明を省略することがある。 Further, in order to make the explanation clearer, the drawings may be schematically represented with respect to the width, thickness, shape, and the like of each part as compared with the actual embodiment, but are merely examples, and the interpretation of the present invention. It is not intended to limit. In addition, in the present specification and each drawing, elements having the same functions as those described with reference to the previous drawings may be denoted by the same reference numerals and redundant description may be omitted.
　＜第１実施形態＞
　本実施形態では、本発明の一実施形態に係る半導体検査装置の構成を説明する。また、半導体検査装置が有するプローブユニットおよびプローブの構成を説明する。 <First Embodiment>
In the present embodiment, a configuration of a semiconductor inspection apparatus according to an embodiment of the present invention will be described. In addition, the configuration of the probe unit and the probe included in the semiconductor inspection apparatus will be described.
　図１は第１実施形態に係る本発明の半導体検査装置の構成を示す模式図である。半導体検査装置１００は、プローブユニット１２０と、それに備えられたプローブ１１０を有する。プローブ１１０は１つ以上であればよく、通常複数（例えば数十から数千）のプローブ１１０が設置される。プローブ１１０は回路基板１４０との間で電気信号の授受を行う。なお、図１では、回路基板１４０はテスタ１５０と接続される。テスタ１５０には計測電源１５２やＬＣＲ測定器１５４、パルス発生器１５６などのユニットが含まれる。 FIG. 1 is a schematic view showing a configuration of a semiconductor inspection apparatus according to the first embodiment of the present invention. The semiconductor inspection apparatus 100 includes a probe unit 120 and a probe 110 provided therein. The number of the probes 110 may be one or more, and usually a plurality of (for example, several tens to several thousand) probes 110 are installed. The probe 110 exchanges electric signals with the circuit board 140. In FIG. 1, the circuit board 140 is connected to the tester 150. The tester 150 includes units such as a measurement power supply 152, an LCR measurement device 154, and a pulse generator 156.
　図２Ａは図１で示したプローブ１１０、およびプローブユニット１２０の断面模式図である。なお、第１のパイプ１０の具体的な例は図３Ａにて後述する。図２Ａに示すように、プローブ１１０はプローブユニット１２０に収納されており、第１のプランジャ１４の一部が露出している。第１の先端部１２が検査対象１７０の電極や配線と接触し、電気特性が測定される。検査対象１７０は、例えば、シリコンウエハー上に形成されたＩＣパッケージなどが挙げられる。なお、第１の先端部１２および第１のプランジャ１４に対向する部分が、第２の先端部２２および第２のプランジャ２４である。 FIG. 2A is a schematic cross-sectional view of the probe 110 and the probe unit 120 shown in FIG. A specific example of the first pipe 10 will be described later with reference to FIG. 3A. As shown in FIG. 2A, the probe 110 is housed in the probe unit 120, and a part of the first plunger 14 is exposed. The first tip 12 comes into contact with the electrode or wiring of the inspection object 170, and the electrical characteristics are measured. Examples of the inspection object 170 include an IC package formed on a silicon wafer. The portions facing the first tip portion 12 and the first plunger 14 are the second tip portion 22 and the second plunger 24.
　プローブユニット１２０は、例えば、第１のプローブホルダ部材７２、及び第２のプローブホルダ部材７４を有するプローブホルダ７０から構成されてもよい。第１のプローブホルダ部材７２、及び第２のプローブホルダ部材７４は、樹脂やセラミックなどの絶縁物を用いて形成されてもよい。複数のプローブ１１０は、高さが揃うように配置されている。また、検査対象の電極や配線パターンに応じてその配置を決定してもよい。プローブ１１０は導電性材料を含み、例えば、金、銅、ニッケル、パラジウム、タングステンなどの金属、あるいは上記金属の合金を含んでいてもよい。あるいは、プローブ１１０は導電性材料を含み、かつ表面を金などを用いてめっき加工してもよい。 The probe unit 120 may be composed of a probe holder 70 having a first probe holder member 72 and a second probe holder member 74, for example. The first probe holder member 72 and the second probe holder member 74 may be formed using an insulator such as resin or ceramic. The plurality of probes 110 are arranged so as to have the same height. Further, the arrangement may be determined according to the electrode to be inspected and the wiring pattern. The probe 110 includes a conductive material, and may include, for example, a metal such as gold, copper, nickel, palladium, tungsten, or an alloy of the above metals. Alternatively, the probe 110 may include a conductive material, and the surface may be plated using gold or the like.
　プローブ１１０は、第１のプランジャ１４、第２のプランジャ２４、および第１のパイプを有する。第１のプランジャ１４は、第１の先端部１２と、第１のプランジャボス部１６と、第１の摺動部１８とを有する。第２のプランジャ２４は、第２の先端部２２と、第２のプランジャボス部２６と、第２の摺動部２８とを有する。第１のパイプ１０は、第１の切り欠き２０を有する第１の端部３０と、第１の螺旋状の溝４１を有する第１の螺旋部４０と、第２の切り欠き２１を有する第２の端部３１と、第２の螺旋状の溝６１とを有する第２の螺旋部６０と、第１の円筒部５０とを有する。第１の切り欠き２０は第１の螺旋状の溝４１と連続している。また、第２の切り欠き２１は第２の螺旋状の溝６１と連続している。第１の切り欠き２０には第１のプランジャボス部１６が嵌合されている。また、第２の切り欠き２１には第２のプランジャボス部２６が嵌合されている。第１のプランジャ１４は、第１の先端部１２において検査対象１７０の電極や配線と電気的な接続を行う。第１のプランジャ１４と第２のプランジャ２４は円柱形状を有することが好ましく、本実施形態でも円柱状の形状として説明を行う。なお、第１の螺旋部４０と、第２の螺旋部６０に含まれる溝と溝の間隔は、図面に示した場合に限定されない。溝の数は、本発明の趣旨から逸脱しない範囲において、変更が可能である。また、各部分の長さや太さも同様に、図面に示した場合に限定されず、本発明の趣旨から逸脱しない範囲において、変更が可能であることはいうまでもない。 The probe 110 has a first plunger 14, a second plunger 24, and a first pipe. The first plunger 14 has a first tip portion 12, a first plunger boss portion 16, and a first sliding portion 18. The second plunger 24 has a second tip portion 22, a second plunger boss portion 26, and a second sliding portion 28. The first pipe 10 has a first end portion 30 having a first notch 20, a first spiral portion 40 having a first spiral groove 41, and a second end portion having a second notch 21. A second spiral portion 60 having two end portions 31, a second spiral groove 61, and a first cylindrical portion 50. The first notch 20 is continuous with the first spiral groove 41. Further, the second notch 21 is continuous with the second spiral groove 61. A first plunger boss 16 is fitted in the first notch 20. A second plunger boss portion 26 is fitted in the second notch 21. The first plunger 14 is electrically connected to the electrode and wiring of the inspection object 170 at the first tip portion 12. It is preferable that the 1st plunger 14 and the 2nd plunger 24 have a cylindrical shape, and it demonstrates as a cylindrical shape also in this embodiment. In addition, the space | interval of the groove | channel contained in the 1st spiral part 40 and the 2nd spiral part 60 is not limited to the case shown in drawing. The number of grooves can be changed without departing from the spirit of the present invention. Similarly, the length and thickness of each part are not limited to those shown in the drawings, and can be changed without departing from the gist of the present invention.
　プローブ１１０を作製する際、第１のプランジャ１４が、第１のパイプ１０に圧入され、第１の切り欠き２０には第１のプランジャボス部１６が嵌合される。また、第２のプランジャ２４も、第１のパイプ１０に圧入され、第２の切り欠き２１には第２のプランジャボス部２６が嵌合される。切り欠きがあることにより、第１のパイプ１０の径が広がりやすくなるため、プランジャをパイプへ圧入する負荷を減らすことができる。また、プランジャおよびパイプの径に多少バラつきが生じても許容することができる。 When the probe 110 is manufactured, the first plunger 14 is press-fitted into the first pipe 10, and the first notch 20 is fitted with the first plunger boss portion 16. The second plunger 24 is also press-fitted into the first pipe 10, and the second plunger boss portion 26 is fitted into the second notch 21. Since there is a notch, the diameter of the first pipe 10 is likely to be widened, so that the load for press-fitting the plunger into the pipe can be reduced. Further, even if the plunger and the pipe diameter are somewhat varied, it can be tolerated.
　第１の摺動部１８は、第１のプランジャボス部１６の径よりも相対的に細い。なお、図２Ａに示すように、第１の摺動部１８の細い部分は、異なる２つの径を含んでいてもよい。また、第２の摺動部２８は、第２のプランジャボス部２６の径よりも相対的に細い。なお、図２Ａに示すように、第２の摺動部２８の細い部分は、異なる２つの径を含んでいてもよい。第１の摺動部１８において、第１のプランジャボス部１６よりも若干細い先端部は、検査対象の電極または配線から荷重を受けた時に生じる第１のパイプ１０の撓みにより第１の円筒部５０と接する。同様に、第２の摺動部２８において、第２のプランジャボス部２６よりも若干細い先端部は、第１の円筒部５０と接する。このような構成のプローブ１１０は、検査対象１７０の電極や配線と電気的に接続した時の導通経路を、第１のプランジャ１４と第１の円筒部５０と第２のプランジャ２４とすることができる。よって、螺旋部を介さずに、電極や配線とプローブとを導通させることができるため、プローブの抵抗値およびインダクタンス小さくすることができる。なお、螺旋部を介さない導通経路は検査対象１７０の電極や配線と電気的に接続した時に確保されていればよく、接続前にはこの導通経路が確保されていなくてもよい。 The first sliding portion 18 is relatively thinner than the diameter of the first plunger boss portion 16. In addition, as shown to FIG. 2A, the thin part of the 1st sliding part 18 may contain two different diameters. Further, the second sliding portion 28 is relatively thinner than the diameter of the second plunger boss portion 26. In addition, as shown to FIG. 2A, the thin part of the 2nd sliding part 28 may contain two different diameters. In the first sliding portion 18, the tip portion slightly narrower than the first plunger boss portion 16 has a first cylindrical portion due to the bending of the first pipe 10 that occurs when receiving a load from the electrode or wiring to be inspected. 50. Similarly, in the second sliding part 28, the tip part slightly thinner than the second plunger boss part 26 is in contact with the first cylindrical part 50. In the probe 110 having such a configuration, the first plunger 14, the first cylindrical portion 50, and the second plunger 24 may be used as a conduction path when electrically connected to the electrode and wiring of the inspection target 170. it can. Therefore, since the electrode or wiring and the probe can be conducted without using the spiral portion, the resistance value and inductance of the probe can be reduced. It should be noted that the conduction path not passing through the spiral portion only needs to be secured when electrically connected to the electrode or wiring of the inspection object 170, and this conduction path may not be secured before the connection.
　また、このような構成のプローブ１１０は、プローブ１１０の第１の先端部１２が検査対象１７０の電極や配線と接触する際、第１のパイプ１０が軸方向に伸縮することによって検査対象への衝撃を和らげることができる。 In addition, the probe 110 having such a configuration allows the first pipe 10 to expand and contract in the axial direction when the first tip portion 12 of the probe 110 comes into contact with the electrode and the wiring of the inspection target 170, so Can reduce the impact.
　図２Ａでは、第１のパイプ１０の各々の端部が有する切り欠きが１つ（１箇所ともいう）の場合を例に説明したが、切り欠きは２つ以上（２箇所以上ともいう）であってもよい。また、切り欠きの長さも、本発明に記載された趣旨を逸脱しない範囲において、図示した長さよりも長くてもよいし、短くてもよい。切り欠きが２つ以上あることによって、第１のパイプ１０の径がより広がりやすくなるため、プランジャをパイプへ圧入する負荷をさらに減らすことができる。 In FIG. 2A, the case where each end of the first pipe 10 has one notch (also referred to as one place) has been described as an example, but there are two or more notches (also referred to as two or more places). There may be. Further, the length of the cutout may be longer or shorter than the illustrated length without departing from the spirit described in the present invention. Since there are two or more cutouts, the diameter of the first pipe 10 is more easily expanded, and therefore the load for press-fitting the plunger into the pipe can be further reduced.
　さらに、図２Ａでは、切り欠きが螺旋状の溝と連続している場合を例に説明したが、切り欠きと螺旋状の溝とは、連続していなくてもよい。切り欠きと螺旋状の溝とが連続していないことで、パイプの強度を増すことができる。また、切り欠きおよび螺旋状の溝の長さは、図２Ａに示した長さに限定されない。 Furthermore, in FIG. 2A, the case where the notch is continuous with the spiral groove has been described as an example, but the notch and the spiral groove may not be continuous. Since the notch and the spiral groove are not continuous, the strength of the pipe can be increased. Further, the length of the notch and the spiral groove is not limited to the length shown in FIG. 2A.
　図２Ｂは、図２Ａの構成に対して、第２のパイプ３２を有し、第２のプランジャ２４の構造が異なる。第２のパイプ３２は、第１のパイプ１０と接している。なお、第２のパイプ３２の一方の端部は切り欠きを有している。なお、第２のパイプ３２の具体的な例は図３Ｆにて後述する。第２のプランジャ２４が有する第３のプランジャボス部２９は、第２のプランジャボス部２６よりも相対的に径が細く、かつ突出している。第２のプランジャボス部２６は第２の切り欠き２１に嵌合され、第３のプランジャボス部２９は第３の切り欠き２３に嵌合されている。なお、第１のプランジャ１４は第２のプランジャ２４と同様の構成を有し、第２のパイプと同様の螺旋状の溝が無いパイプが嵌合されていてもいてよい。その場合、第１のプランジャ１４は摺動部を設ける必要がないため、製造が簡素化できる。また、検査対象１７０の電極や配線と電気的に接続した時、第１の摺動部１８と、第２のパイプ３２とが第１の螺旋部４０および第２の螺旋部６０を介さず、第１の円筒部５０を介して電気的に接続されるため、プローブの抵抗値を低くすることができる。 FIG. 2B is different from the configuration of FIG. 2A in that it has a second pipe 32 and the structure of the second plunger 24 is different. The second pipe 32 is in contact with the first pipe 10. Note that one end of the second pipe 32 has a notch. A specific example of the second pipe 32 will be described later with reference to FIG. 3F. The third plunger boss portion 29 of the second plunger 24 has a relatively smaller diameter and protrudes from the second plunger boss portion 26. The second plunger boss portion 26 is fitted in the second cutout 21, and the third plunger boss portion 29 is fitted in the third cutout 23. The first plunger 14 has the same configuration as the second plunger 24, and a pipe without a spiral groove similar to the second pipe may be fitted therein. In that case, since the first plunger 14 does not need to be provided with a sliding portion, the manufacturing can be simplified. In addition, when electrically connected to the electrode and wiring of the inspection object 170, the first sliding portion 18 and the second pipe 32 do not go through the first spiral portion 40 and the second spiral portion 60, Since it is electrically connected via the first cylindrical portion 50, the resistance value of the probe can be lowered.
　図２Ｃは、図２Ｂの構成に対して、第２のパイプ３２が螺旋状の溝を有する例を示す。なお、第２のパイプ３２において、螺旋状の溝および切り欠きのない部分を第２の円筒部と定義する。螺旋状の溝を有する第２のパイプ３２を用いることで、プローブ１１０の耐荷重を増すことができる。また、可動域を広げることができる。また、第２のパイプ３２が有する螺旋状の溝と、第１の螺旋部４０、および第２の螺旋部６０とは、重なっていない例を示している。すなわち、第１のパイプ１０と第２のパイプ３２とは、少なくともいずれか一方の螺旋状の溝が無い部分において重なることができ、螺旋状の溝を導通経路としなくてよいため、プローブの抵抗値をさらに低くすることができる。なお、第２のパイプ３２が有する螺旋状の溝と、第１の螺旋状の溝４１、および第２の螺旋状の溝６１は、重なっていてもよい。その場合は、プローブ１１０の可動域をさらに広げることができる。なお、第１の摺動部１８は、第２のパイプ３２に接している例を示しているが、この例に限定されない。電気信号の授受を行う時に第１の摺動部１８が第２のパイプ３２に接していればよく、図２Ｃの状態では第１の摺動部１８が第２のパイプ３２に接していなくてもよい。 FIG. 2C shows an example in which the second pipe 32 has a spiral groove with respect to the configuration of FIG. 2B. In the second pipe 32, a portion without a spiral groove and notch is defined as a second cylindrical portion. By using the second pipe 32 having a spiral groove, the load resistance of the probe 110 can be increased. Moreover, a movable range can be expanded. Moreover, the spiral groove | channel which the 2nd pipe 32 has, the 1st spiral part 40, and the 2nd spiral part 60 have shown the example which has not overlapped. That is, the first pipe 10 and the second pipe 32 can overlap at least one of the portions without the spiral groove, and the spiral groove does not have to be a conduction path. The value can be further reduced. Note that the spiral groove of the second pipe 32, the first spiral groove 41, and the second spiral groove 61 may overlap each other. In that case, the movable range of the probe 110 can be further expanded. In addition, although the 1st sliding part 18 has shown the example which is in contact with the 2nd pipe 32, it is not limited to this example. It is only necessary that the first sliding portion 18 is in contact with the second pipe 32 when the electric signal is transmitted and received. In the state of FIG. 2C, the first sliding portion 18 is not in contact with the second pipe 32. Also good.
　図２Ｄは、図２Ｃの構成に対して、第１のプランジャ１４が第２のパイプに挿入されている例を示す。なお、第１のプランジャ１４も第２のパイプに圧入されていてもよい。その場合、第１のプランジャ１４が有する第１のプランジャボス部１６が第１の切り欠き２０に嵌合され、第４のプランジャボス部１９が第２のパイプ３２の他方の端部に嵌合される。プローブ１１０が検査対象の電極または配線から荷重を受けていない状態においても、第２のパイプ３２が第１のプランジャ１４および第２のプランジャ２４に接触している。よって、導通経路が常に確保されており、プローブの抵抗値はおおよそ低い状態を保つことができる。 FIG. 2D shows an example in which the first plunger 14 is inserted into the second pipe with respect to the configuration of FIG. 2C. Note that the first plunger 14 may also be press-fitted into the second pipe. In that case, the first plunger boss portion 16 of the first plunger 14 is fitted into the first notch 20, and the fourth plunger boss portion 19 is fitted into the other end of the second pipe 32. Is done. The second pipe 32 is in contact with the first plunger 14 and the second plunger 24 even when the probe 110 is not receiving a load from the electrode or wiring to be inspected. Therefore, a conduction path is always secured, and the resistance value of the probe can be kept low.
　図３Ａから図３Ｅに、プローブ１１０が有する第１のパイプ１０の模式的な平面図を示す。図３Ｆに第２のパイプ３２の模式的な平面図を示す。 3A to 3E are schematic plan views of the first pipe 10 included in the probe 110. FIG. FIG. 3F shows a schematic plan view of the second pipe 32.
　図３Ａは図２Ａが有する第１のパイプ１０と同様の構成であり、ここでの説明を省略する。 FIG. 3A has the same configuration as the first pipe 10 shown in FIG. 2A, and the description thereof is omitted here.
　図３Ｂは図３Ａに対して、第１の切り欠き２０が第１の端部３０の端面に対して角度を有し、第２の切り欠き２１は第２の端部３１の端面に対して角度を有している例を示す。第２の切り欠き２１が第２の端部３１の端面に対して角度を有していても、第２の端部３１の端面はおおよそ水平である。よって、第２のプランジャ２４を第１のパイプ１０に圧入する際に、第２の端部３１の径が広がることで、第２のプランジャ２４が第１のパイプ１０の伸縮方向に対して、おおよそまっすぐに、無理の無い圧入が可能となる。したがって、破損などが少ない、信頼性の高いプローブを提供することができる。 3B is different from FIG. 3A in that the first notch 20 has an angle with respect to the end surface of the first end portion 30, and the second notch 21 has an angle with respect to the end surface of the second end portion 31. An example having an angle is shown. Even if the second notch 21 has an angle with respect to the end surface of the second end portion 31, the end surface of the second end portion 31 is approximately horizontal. Therefore, when the second plunger 24 is press-fitted into the first pipe 10, the diameter of the second end portion 31 is widened so that the second plunger 24 is expanded and contracted with respect to the first pipe 10. It is possible to press-fit without difficulty. Therefore, it is possible to provide a highly reliable probe with little damage and the like.
　図３Ｃは図３Ｂに対して、第１の切り欠き２０が第１の螺旋状の溝４１と連続していない、また、第２の切り欠き２１も第２の螺旋状の溝６１と連続していない例を示す。第１の切り欠き２０が、第１の螺旋状の溝４１と連続していなくても、第１の端部３０の端面はおおよそ水平であるから、第１のプランジャ１４が有する第１のプランジャボス部１６は、第１のパイプ１０の伸縮方向に対して、おおよそまっすぐに圧入される。したがって、第１のパイプ１０と第１のプランジャ１４とがおおよそ水平に接続され、電気的な接続を確実にできる。第２のプランジャ２４についても同様である。また、図３Ｃは図３Ａや図３Ｂと比較して、溝が少ないことによって、パイプの表面積が大きくなるため、さらに耐久性が高いプローブを実現することができる。したがって、破損などが少ない、信頼性の高いプローブを提供することができる。 3C is different from FIG. 3B in that the first notch 20 is not continuous with the first spiral groove 41, and the second notch 21 is also continuous with the second spiral groove 61. An example that does not. Even if the first notch 20 is not continuous with the first spiral groove 41, the end surface of the first end portion 30 is approximately horizontal, so the first plunger of the first plunger 14 has the first plunger. The boss portion 16 is press-fitted approximately straight with respect to the expansion and contraction direction of the first pipe 10. Therefore, the first pipe 10 and the first plunger 14 are connected approximately horizontally, and electrical connection can be ensured. The same applies to the second plunger 24. Further, in FIG. 3C, the surface area of the pipe is increased due to the fewer grooves as compared with FIGS. 3A and 3B, so that a probe with higher durability can be realized. Therefore, it is possible to provide a highly reliable probe with little damage and the like.
　図３Ｄ及び図３Ｅは、図３Ａ及び図３Ｃのそれぞれに対して、第１の切り欠き２０が１個所、螺旋状の溝４２が１条、第２の切り欠き２１が１個所、および螺旋状の溝６２が１条増えた例を示している。それ以外は同じ構成であり、詳細な説明は省略する。螺旋状の溝が１条増えて２条になることで、第１のパイプのばね定数が小さくなり、第１のパイプが軸方向にさらに伸縮しやすくなるため、プローブが検査対象の電極または配線に接触した際の衝撃をさらに緩和させることができる。 FIGS. 3D and 3E show the first notch 20, one spiral groove 42, one second notch 21, and a spiral shape with respect to FIGS. 3A and 3C, respectively. This shows an example in which the number of grooves 62 is increased by one. The rest of the configuration is the same, and a detailed description is omitted. By increasing the number of spiral grooves by one to two, the spring constant of the first pipe is reduced, and the first pipe is more easily expanded and contracted in the axial direction. The impact at the time of contact with can be further reduced.
　図３Ｆに、プローブ１１０が有する第２のパイプ３２の模式的な平面図を示す。図３Ｆは図２Ｂに示す第２のパイプ３２の平面図である。第２のパイプ３２の一方の端部は第３の切り欠き２３を有している。パイプが切り欠きを有することで、プランジャをパイプの伸縮方向に対して、おおよそまっすぐに圧入することができる。したがって、パイプとプランジャとの電気的な接続を確実にできる。このような構成を有するプローブ１１０は、第１のパイプ１０が軸方向に伸縮することによって検査対象への衝撃を和らげることができる。なお、第２のパイプ３２においても、図２Ｃ及び図２Ｄに示すような、螺旋状の溝を有していてもよい。また、第３の切り欠き２３は、図３Ｂに示すように第２のパイプ３２の端面に対して角度を有していてもよい。また、螺旋状の溝と第３の切り欠き２３は図３Ａに示すように連続していてもよいし、図３Ｃに示すように連続していなくてもよい。また、螺旋状の溝は、図３Ｄ及び図３Ｅに示すように２条であってもよい。 FIG. 3F shows a schematic plan view of the second pipe 32 included in the probe 110. FIG. 3F is a plan view of the second pipe 32 shown in FIG. 2B. One end of the second pipe 32 has a third notch 23. Since the pipe has the notch, the plunger can be press-fitted substantially straight with respect to the expansion and contraction direction of the pipe. Therefore, the electrical connection between the pipe and the plunger can be ensured. The probe 110 having such a configuration can mitigate the impact on the inspection target by the first pipe 10 extending and contracting in the axial direction. Note that the second pipe 32 may also have a spiral groove as shown in FIGS. 2C and 2D. Moreover, the 3rd notch 23 may have an angle with respect to the end surface of the 2nd pipe 32, as shown to FIG. 3B. Further, the spiral groove and the third notch 23 may be continuous as shown in FIG. 3A or may not be continuous as shown in FIG. 3C. Further, the spiral groove may be two as shown in FIGS. 3D and 3E.
　図３Ａから図３Ｆでは、本発明の一実施形態にかかるプローブの例を示したが、プローブはこれらの例に限定されない。第１のパイプ及び第２のパイプにおいて、例えば、切り欠きはパイプが伸縮する方向に対して、平行でもよいし、角度を有していてもよい。また、切り欠きの長さも、本発明に記載された趣旨を逸脱しない範囲において、図示した長さよりも長くてもよいし、短くてもよい。また、第１の端部３０と第２の端部３１の両方の端部が切り欠きを有する場合、それぞれの端部の形状は異なっていてもよい。また、第１の端部３０と第２の端部３１の両方の端部が切り欠きを有する場合、それぞれの端部が有する切り欠きの数は異なっていてもよい。また、螺旋状の溝は２条である例を示したが、螺旋状の溝は３条以上であってもよい。さらに、螺旋状の溝の長さも、本発明に記載された趣旨を逸脱しない範囲において、図示した長さよりも長くてもよいし、短くてもよい。 3A to 3F show examples of probes according to an embodiment of the present invention, but the probes are not limited to these examples. In the first pipe and the second pipe, for example, the notch may be parallel to the direction in which the pipe expands or contracts, or may have an angle. Further, the length of the cutout may be longer or shorter than the illustrated length without departing from the spirit described in the present invention. Moreover, when both the edge parts of the 1st edge part 30 and the 2nd edge part 31 have a notch, the shape of each edge part may differ. Moreover, when the both ends of the 1st edge part 30 and the 2nd edge part 31 have a notch, the number of the notches which each edge part has may differ. Moreover, although the spiral groove | channel has shown the example which is 2 strip | lines, 3 or more may be sufficient as a spiral groove | channel. Further, the length of the spiral groove may be longer or shorter than the illustrated length without departing from the spirit described in the present invention.
　また、第１のパイプ１０は、例えば、螺旋状の溝が２条以上である場合、切り欠きの数は少なくとも１つあればよい。また、切り欠きは螺旋状の溝と連続していてもよい。第１の端部３０と第２の端部３１の両方の端部が切り欠きを有する場合、切り欠きと螺旋状の溝とは、連続していなくてもよいし、連続していてもよいし、一方が連続していて、他方が連続していなくてもよい。 Further, for example, when the first pipe 10 has two or more spiral grooves, the number of notches may be at least one. Moreover, the notch may be continuous with the spiral groove. When both end portions of the first end portion 30 and the second end portion 31 have notches, the notches and the spiral groove may not be continuous or may be continuous. However, one side may be continuous and the other may not be continuous.
　以上のような構成を有する本発明の一実施形態に係るプローブ１１０は、第１のプランジャ１４を第１のパイプ１０に圧入する際、第１の切り欠き２０があることで、第１の切り欠き２０が無い場合と比較して、第１のパイプ１０の径が広がり、プランジャをパイプへ圧入する負荷を減らすことができる。また、プローブ１１０において、第１の端部３０はおおよそ水平に保たれている。そのため、第１のプランジャ１４は、第１のパイプ１０の伸縮方向に対して、おおよそまっすぐに圧入される。第２のプランジャ２４が有する第２のプランジャボス部２６と第２の端部３１との圧入も同様である。したがって、第１のパイプ１０と第１のプランジャ１４および第２のプランジャ２４とがおおよそ水平に嵌合されるため、電気的な接続を確実にできる。また、プローブの先端に、圧力をおおよそまっすぐにかけることができるため、半導体集積回路の電極や配線との接触を繰り返しても、プローブの先端が折れること、すぐに摩耗することなどを防ぎ、耐久性が高いプローブを実現することができる。また、プローブの先端の位置精度を高めることができる。そして、これらのプローブを備えたプローブユニット、またはこれを備える半導体検査装置を提供することができる。 The probe 110 according to an embodiment of the present invention having the above-described configuration has the first notch 20 when the first plunger 14 is press-fitted into the first pipe 10, so that the first notch 20 Compared with the case where there is no notch 20, the diameter of the first pipe 10 is increased, and the load for press-fitting the plunger into the pipe can be reduced. Further, in the probe 110, the first end 30 is kept approximately horizontal. Therefore, the first plunger 14 is press-fitted approximately straight with respect to the expansion / contraction direction of the first pipe 10. The same applies to the press-fitting of the second plunger boss portion 26 and the second end portion 31 of the second plunger 24. Therefore, since the first pipe 10 and the first plunger 14 and the second plunger 24 are fitted approximately horizontally, the electrical connection can be ensured. In addition, since the pressure can be applied almost straight to the tip of the probe, even if contact with the electrodes and wiring of the semiconductor integrated circuit is repeated, the tip of the probe is prevented from being bent or quickly worn out, making it durable. A probe with high performance can be realized. In addition, the positional accuracy of the tip of the probe can be increased. And the probe unit provided with these probes, or a semiconductor inspection apparatus provided with the same can be provided.
　＜第２実施形態＞
　本実施形態では、本発明の一実施形態に係るプローブの他の構成を説明する。なお、第１実施形態と同様の構成に関しては説明を省略することがある。 Second Embodiment
In this embodiment, another configuration of the probe according to one embodiment of the present invention will be described. In addition, description may be abbreviate | omitted regarding the structure similar to 1st Embodiment.
　図４にプローブ１１２の模式的な断面図、及びプローブ１１２が有する第１のパイプ８０の模式的な平面図を示す。なお、プローブ１１２は、図２Ａに示されるプローブユニット１２０に収納されて、使用される。図４Ａから図４Ｃは、図２Ｂから図２Ｄのプローブ１１０に対して、第２の螺旋状の溝６１を有さない例を示している。図４において、図２と同様の構成は説明を省略することがある。 FIG. 4 shows a schematic cross-sectional view of the probe 112 and a schematic plan view of the first pipe 80 included in the probe 112. The probe 112 is housed and used in the probe unit 120 shown in FIG. 2A. 4A to 4C show an example in which the second spiral groove 61 is not provided for the probe 110 of FIGS. 2B to 2D. 4, the description of the same configuration as that of FIG. 2 may be omitted.
　図４Ａは、図２Ａの構成に対して、第１のパイプ８０が螺旋状の溝を１つのみ有し、第２のプランジャ２４の構造が異なる。図２Ａと同様の構成は、ここでの説明を省略する。プローブ１１２が有する第２のプランジャ２４は、第２の先端部２２と、第２のプランジャボス部２６とを有する。なお、図４Ｄに示すように、第１のパイプ８０は、第１の切り欠き２０を有する第１の端部３０と、第１の螺旋状の溝４１を有する第１の螺旋部４０と、第１の円筒部５０と、第２の切り欠き２１を有する第２の端部３１とを有する。第２の切り欠き２１には第２のプランジャボス部２６が嵌合されている。なお、第１の螺旋部４０に含まれる溝と溝との間隔は、図面に示した場合に限定されない。溝の数は、本発明の趣旨から逸脱しない範囲において、変更が可能である。また、各部分の長さや太さも同様に、図面に示した場合に限定されず、本発明の趣旨から逸脱しない範囲において、変更が可能である。また、各部分の長さや太さも同様に、図面に示した場合に限定されず、本発明の趣旨から逸脱しない範囲において、変更が可能であることはいうまでもない。 4A is different from the configuration of FIG. 2A in that the first pipe 80 has only one spiral groove and the structure of the second plunger 24 is different. The description of the same configuration as in FIG. 2A is omitted here. The second plunger 24 included in the probe 112 has a second tip portion 22 and a second plunger boss portion 26. As shown in FIG. 4D, the first pipe 80 includes a first end portion 30 having a first notch 20, a first spiral portion 40 having a first spiral groove 41, and It has the 1st cylindrical part 50 and the 2nd edge part 31 which has the 2nd notch 21. As shown in FIG. A second plunger boss portion 26 is fitted in the second notch 21. In addition, the space | interval of the groove | channel contained in the 1st spiral part 40 is not limited to the case shown in drawing. The number of grooves can be changed without departing from the spirit of the present invention. Similarly, the length and thickness of each portion are not limited to those shown in the drawings, and can be changed without departing from the spirit of the present invention. Similarly, the length and thickness of each part are not limited to those shown in the drawings, and can be changed without departing from the gist of the present invention.
　図４Ｂは、図４Ａの構成に対して、第２のパイプ３２が螺旋状の溝を有し、第２のプランジャ２４の構造が異なる例を示す。図４Ａと同様の構成は、ここでの説明を省略する。第２のパイプ３２は、第１のパイプ８０と接している。螺旋状の溝を有する第２のパイプ３２を用いることで、プローブ１１２の耐荷重を増すことができる。また、プローブ１１２の可動域を広げることができる。また、第２のパイプ３２が有する螺旋状の溝と、第１の螺旋状の溝４１とは、重なっていない例を示している。すなわち、螺旋状の溝を導通経路としなくてよいため、プローブの抵抗値をさらに低くすることができる。また、図４Ｂの構成は、螺旋状の溝が第１のパイプの片側に１箇所、摺動部の接点が１箇所である。また、第２のパイプに螺旋状の溝が１箇所ある。よって、プローブの可動域を広くすることができる。また、第３のプランジャボス部２９の形状は円柱状である例を示しているが、この例に限定されない。例えば、円錐状のように先が尖った形状にすることで、第３のプランジャボス部２９が第２のパイプ３２へ圧入されるときのガイドの役割を担い、圧入しやすくすることができる。 FIG. 4B shows an example in which the second pipe 32 has a spiral groove and the structure of the second plunger 24 is different from the configuration of FIG. 4A. The description of the same configuration as in FIG. 4A is omitted here. The second pipe 32 is in contact with the first pipe 80. By using the second pipe 32 having the spiral groove, the load resistance of the probe 112 can be increased. In addition, the movable range of the probe 112 can be expanded. In addition, an example in which the spiral groove of the second pipe 32 and the first spiral groove 41 do not overlap is shown. That is, since it is not necessary to use a spiral groove as a conduction path, the resistance value of the probe can be further reduced. 4B has one spiral groove on one side of the first pipe and one contact point on the sliding portion. The second pipe has one spiral groove. Therefore, the movable range of the probe can be widened. Moreover, although the shape of the 3rd plunger boss | hub part 29 has shown the example which is a column shape, it is not limited to this example. For example, when the third plunger boss portion 29 is press-fitted into the second pipe 32 by forming a pointed shape like a conical shape, it is possible to facilitate press-fitting.
　図４Ｃは、図４Ｂの構成に対して、第１のプランジャ１４も第２のパイプに挿入されている例を示す。図４Ｂと同様の構成は、ここでの説明を省略する。プローブ１１２が検査対象の電極または配線から荷重を受けていない状態においても、第２のパイプ３２が第１のプランジャ１４および第２のプランジャ２４に接触している。よって、導通経路が常に確保されており、プローブの抵抗値はおおよそ低い状態を保つことができる。 FIG. 4C shows an example in which the first plunger 14 is also inserted into the second pipe with respect to the configuration of FIG. 4B. The description of the same configuration as in FIG. 4B is omitted here. The second pipe 32 is in contact with the first plunger 14 and the second plunger 24 even when the probe 112 is not receiving a load from the electrode or wiring to be inspected. Therefore, a conduction path is always secured, and the resistance value of the probe can be kept low.
　なお、図４に示した第１のパイプ８０、及び第２のパイプ３２において、螺旋状の溝は、図３Ｄ及び図３Ｅに示すように２条であってもよい。また、螺旋状の溝は３条以上であってもよい（図示せず）。 In the first pipe 80 and the second pipe 32 shown in FIG. 4, the spiral groove may be two as shown in FIGS. 3D and 3E. Further, the spiral groove may be three or more (not shown).
　図４では、第１の端部３０が有する切り欠きが１つ（１箇所ともいう）の場合を例に説明したが、切り欠きは２つ以上（２箇所以上ともいう）であってもよい。また、第１の円筒部５０が有する切り欠きも１つ（１箇所ともいう）の場合を例に説明したが、切り欠きは２つ以上（２箇所以上ともいう）であってもよい。なお、切り欠きの長さも、本発明に記載された趣旨を逸脱しない範囲において、図示した長さよりも長くてもよいし、短くてもよい。切り欠きが２つ以上であることによって、第１のパイプ８０の径がより広がりやすくなるため、プランジャをパイプへ圧入する負荷をさらに減らすことができる。さらに、螺旋状の溝の長さも、本発明に記載された趣旨を逸脱しない範囲において、図示した長さよりも長くてもよいし、短くてもよい。 In FIG. 4, the case where the first end portion 30 has one notch (also referred to as one location) has been described as an example, but the number of notches may be two or more (also referred to as two locations or more). . Moreover, although the case where the first cylindrical portion 50 has one notch (also referred to as one place) has been described as an example, the number of notches may be two or more (also referred to as two or more places). In addition, the length of the notch may be longer or shorter than the illustrated length without departing from the spirit described in the present invention. Since there are two or more cutouts, the diameter of the first pipe 80 is more easily expanded, and therefore the load for press-fitting the plunger into the pipe can be further reduced. Further, the length of the spiral groove may be longer or shorter than the illustrated length without departing from the spirit described in the present invention.
　図４Ａから図４Ｄでは、本発明の一実施形態にかかるプローブの例を示したが、プローブはこれらの例に限定されない。第１のパイプ８０及び第２のパイプ３２は、例えば、切り欠きはパイプが伸縮する方向に対して、平行でもよいし、角度を有していてもよい。また、切り欠きの長さも、本発明に記載された趣旨を逸脱しない範囲において、図示した長さよりも長くてもよいし、短くてもよい。また、第１の端部３０と第２の端部３１の両方の端部が切り欠きを有する場合、それぞれの端部の形状は異なっていてもよい。また、第１の端部３０と第２の端部３１の両方の端部が切り欠きを有する場合、それぞれの端部が有する切り欠きの数は異なっていてもよい。さらに、螺旋状の溝の長さも、本発明に記載された趣旨を逸脱しない範囲において、図示した長さよりも長くてもよいし、短くてもよい。 4A to 4D show examples of probes according to an embodiment of the present invention, but the probes are not limited to these examples. In the first pipe 80 and the second pipe 32, for example, the notch may be parallel to the direction in which the pipe expands or contracts, or may have an angle. Further, the length of the cutout may be longer or shorter than the illustrated length without departing from the spirit described in the present invention. Moreover, when both the edge parts of the 1st edge part 30 and the 2nd edge part 31 have a notch, the shape of each edge part may differ. Moreover, when the both ends of the 1st edge part 30 and the 2nd edge part 31 have a notch, the number of the notches which each edge part has may differ. Further, the length of the spiral groove may be longer or shorter than the illustrated length without departing from the spirit described in the present invention.
　また、第１のパイプ８０は、例えば、螺旋状の溝が２条以上である場合、切り欠きの数は少なくとも１つあればよい。また、切り欠きは螺旋状の溝と連続していてもよい。第１の端部３０と第２の端部３１の両方の端部が切り欠きを有する場合、切り欠きと螺旋状の溝とは、連続していなくてもよいし、連続していてもよいし、一方が連続していて、他方が連続していなくてもよい。 Further, for example, when the first pipe 80 has two or more spiral grooves, the number of notches may be at least one. Moreover, the notch may be continuous with the spiral groove. When both end portions of the first end portion 30 and the second end portion 31 have notches, the notches and the spiral groove may not be continuous or may be continuous. However, one side may be continuous and the other may not be continuous.
　以上のような構成とすることで、検査対象である半導体集積回路、あるいはこれを含む電子部品の電極あるいは配線と電気的に接続した際に、抵抗値が小さい導通経路を確保することができることから、電気的な接続を確実に達成できるプローブを提供することができる。また、電極あるいは配線と接触する端部の耐久性に優れたプローブを提供することができる。さらに、これらのプローブを備えたプローブユニット、またはこれを備える半導体検査装置を提供することができる。 With the configuration as described above, a conductive path having a small resistance value can be secured when electrically connected to an electrode or wiring of a semiconductor integrated circuit to be inspected or an electronic component including the semiconductor integrated circuit. In addition, it is possible to provide a probe that can reliably achieve electrical connection. In addition, it is possible to provide a probe that is excellent in durability at an end portion in contact with an electrode or wiring. Furthermore, a probe unit including these probes or a semiconductor inspection apparatus including the probe unit can be provided.
　＜第３実施形態＞
　本実施形態では、本発明の一実施形態に係るプローブのさらに別の構成を説明する。なお、第１実施形態または第２実施形態と同様の構成に関しては説明を省略することがある。 <Third Embodiment>
In this embodiment, another configuration of the probe according to one embodiment of the present invention will be described. In addition, description may be abbreviate | omitted regarding the structure similar to 1st Embodiment or 2nd Embodiment.
　図５にプローブ１１３、プローブユニット１２０の模式的な断面図、及び、プローブ１１２が有する第１のパイプ９０の模式的な平面図を示す。 FIG. 5 shows a schematic cross-sectional view of the probe 113 and the probe unit 120 and a schematic plan view of the first pipe 90 included in the probe 112.
　図５Ａに示されるプローブ１１３は、図４Ａのプローブ１１２の構成に対して、第２のプランジャ２４を有さず、第１のパイプ９０が第２の切り欠き２１を有さない例を示している。それ以外の構成は図４Ａと同様であり、ここでの説明を省略する。図５Ｂに示すように、第１のパイプ９０は、第１の切り欠き２０を有する第１の端部３０と、第１の螺旋状の溝４１を有する第１の螺旋部４０と、第１の円筒部５０と、切り欠きを有さない第２の端部３１とを有する。半導体集積回路の電極や配線と接触する第１のプランジャ１４が圧入される第１の端部３０は第１の切り欠き２０を有することで、第１のプランジャ１４が第１のパイプ９０の伸縮方向に対して、おおよそまっすぐに圧入される。したがって、第１のパイプ９０と第１のプランジャ１４とがおおよそ水平に接続され、電気的な接続を確実にできる。また、プローブの先端が半導体集積回路の電極や配線の面に対して斜めでなく、おおよそ垂直に接触できるため、プローブの先端が折れること、すぐに摩耗することなどを防ぎ、耐久性が高いプローブを実現することができる。また、第１のパイプ９０が第２の切り欠き２１を有さないことによって、プローブの製造を簡略化することができる。なお、第１の螺旋部４０に含まれる溝と溝との間隔は、図面に示した場合に限定されない。溝の数は、本発明の趣旨から逸脱しない範囲において、変更が可能である。また、各部分の長さや太さも同様に、図面に示した場合に限定されず、本発明の趣旨から逸脱しない範囲において、変更が可能である。また、各部分の長さや太さも同様に、図面に示した場合に限定されず、本発明の趣旨から逸脱しない範囲において、変更が可能であることはいうまでもない。 The probe 113 shown in FIG. 5A shows an example in which the second plunger 24 is not provided and the first pipe 90 does not have the second notch 21 with respect to the configuration of the probe 112 shown in FIG. 4A. Yes. The other configuration is the same as that in FIG. 4A, and a description thereof is omitted here. As shown in FIG. 5B, the first pipe 90 includes a first end 30 having a first notch 20, a first spiral 40 having a first spiral groove 41, and a first And a second end portion 31 having no notch. The first end portion 30 into which the first plunger 14 that comes into contact with the electrode or wiring of the semiconductor integrated circuit is press-fitted has a first notch 20, so that the first plunger 14 can expand and contract the first pipe 90. It is press-fitted approximately straight to the direction. Therefore, the first pipe 90 and the first plunger 14 are connected approximately horizontally, and electrical connection can be ensured. In addition, since the tip of the probe is not inclined with respect to the electrode or wiring surface of the semiconductor integrated circuit but can be contacted approximately vertically, the probe tip can be prevented from being bent or quickly worn out, and has high durability. Can be realized. Further, since the first pipe 90 does not have the second notch 21, the manufacture of the probe can be simplified. In addition, the space | interval of the groove | channel contained in the 1st spiral part 40 is not limited to the case shown in drawing. The number of grooves can be changed without departing from the spirit of the present invention. Similarly, the length and thickness of each portion are not limited to those shown in the drawings, and can be changed without departing from the spirit of the present invention. Similarly, the length and thickness of each part are not limited to those shown in the drawings, and can be changed without departing from the gist of the present invention.
　プローブホルダ７０は第１のプローブホルダ部材７２のみで形成できる。したがって、図２Ａと比較して、製造コストを下げることができる。 The probe holder 70 can be formed by only the first probe holder member 72. Therefore, the manufacturing cost can be reduced as compared with FIG. 2A.
　図５Ｃは、第１のパイプ９０の一例を示す。図５Ｃは、図５Ｂの構成に、第２の端部３１に複数の先細りした爪を設けて王冠のような形状（クラウン型ともいう）の先端部１８０が形成された例を示す。このような構成とすることで、プローブ１１３は回路基板１４０上の電極または配線と、より確実な電気的接続を行うことができる。 FIG. 5C shows an example of the first pipe 90. FIG. 5C shows an example in which a plurality of tapered claws are provided at the second end portion 31 in the configuration of FIG. 5B to form a crown-shaped tip portion 180 (also referred to as a crown shape). With such a configuration, the probe 113 can perform more reliable electrical connection with the electrode or wiring on the circuit board 140.
　なお、図５に示した第１のパイプ９０において、螺旋状の溝は、図３Ｄ及び図３Ｅに示すように２条であってもよい。また、螺旋状の溝は３条以上であってもよい。 In the first pipe 90 shown in FIG. 5, the spiral groove may be two as shown in FIGS. 3D and 3E. Further, the spiral groove may be three or more.
　図５では、第１のパイプが有する切り欠きが１つ（１箇所ともいう）の場合を例に説明したが、切り欠きは２つ以上（２箇所以上ともいう）であってもよい。また、切り欠きの長さも、本発明に記載された趣旨を逸脱しない範囲において、図示した長さよりも長くてもよいし、短くてもよい。切り欠きが２つ以上であることによって、第１のパイプ９０の径がより広がりやすくなるため、プランジャをパイプへ圧入する負荷をさらに減らすことができる。さらに、螺旋状の溝の長さも、本発明に記載された趣旨を逸脱しない範囲において、図示した長さよりも長くてもよいし、短くてもよい。 FIG. 5 illustrates an example in which the first pipe has one notch (also referred to as one place), but the number of notches may be two or more (also referred to as two or more places). Further, the length of the cutout may be longer or shorter than the illustrated length without departing from the spirit described in the present invention. Since there are two or more notches, the diameter of the first pipe 90 becomes easier to expand, so that the load for press-fitting the plunger into the pipe can be further reduced. Further, the length of the spiral groove may be longer or shorter than the illustrated length without departing from the spirit described in the present invention.
　図５では、本発明の一実施形態にかかるプローブの例を示したが、これらの例に限定されない。第１のパイプ９０は、例えば、切り欠きはパイプが伸縮する方向に対して、平行でもよいし、角度を有していてもよい。また、切り欠きの長さも、本発明に記載された趣旨を逸脱しない範囲において、図示した長さよりも長くてもよいし、短くてもよい。また、第１の端部３０が複数の切り欠きを有する場合、切り欠きのそれぞれが、パイプが伸縮する方向に対して、平行でもよいし、角度を有していてもよいし、平行である切り欠きと角度を有する切り欠きが混在していてもよい。さらに、螺旋状の溝の長さも、本発明に記載された趣旨を逸脱しない範囲において、図示した長さよりも長くてもよいし、短くてもよい。 FIG. 5 shows examples of probes according to an embodiment of the present invention, but the present invention is not limited to these examples. In the first pipe 90, for example, the notch may be parallel to the direction in which the pipe expands or contracts, or may have an angle. Further, the length of the cutout may be longer or shorter than the illustrated length without departing from the spirit described in the present invention. Moreover, when the 1st edge part 30 has a some notch, each notch may be parallel with respect to the direction where a pipe expands / contracts, may have an angle, and is parallel. A notch and a notch having an angle may be mixed. Further, the length of the spiral groove may be longer or shorter than the illustrated length without departing from the spirit described in the present invention.
　また、第１のパイプ９０は、例えば、螺旋状の溝が２条以上である場合、切り欠きの数は少なくとも１つあればよい。また、切り欠きは螺旋状の溝と連続していてもよいし、連続していなくてもよい。切り欠きが二つある場合、一方が連続していて、他方が連続していなくてもよい。 Further, for example, when the first pipe 90 has two or more spiral grooves, the number of notches may be at least one. Moreover, the notch may be continuous with the spiral groove or may not be continuous. When there are two notches, one may be continuous and the other may not be continuous.
　以上のような構成とすることで、検査対象である半導体集積回路、あるいはこれを含む電子部品の電極あるいは配線と電気的に接続した際に、抵抗値が小さい導通経路を確保することができることから、電気的な接続を確実に達成できるプローブを提供することができる。また、電極あるいは配線と接触する端部の耐久性に優れたプローブを提供することができる。さらに、これらのプローブを備えたプローブユニット、またはこれを備える半導体検査装置を提供することができる。 With the configuration as described above, a conductive path having a small resistance value can be secured when electrically connected to an electrode or wiring of a semiconductor integrated circuit to be inspected or an electronic component including the semiconductor integrated circuit. In addition, it is possible to provide a probe that can reliably achieve electrical connection. In addition, it is possible to provide a probe that is excellent in durability at an end portion in contact with an electrode or wiring. Furthermore, a probe unit including these probes or a semiconductor inspection apparatus including the probe unit can be provided.
　＜第４実施形態＞
　本実施形態では、本発明の一実施形態に係るプローブの先端部の構成を説明する。なお、第１実施形態乃至第３実施形態と同様の構成に関しては説明を省略することがある。 <Fourth embodiment>
In the present embodiment, the configuration of the distal end portion of the probe according to an embodiment of the present invention will be described. In addition, description may be abbreviate | omitted regarding the structure similar to 1st Embodiment thru | or 3rd Embodiment.
　図６に本発明の一実施形態のプローブが有する第１の先端部１２または第２の先端部２２の模式的な平面図を示す。 FIG. 6 is a schematic plan view of the first tip portion 12 or the second tip portion 22 included in the probe according to the embodiment of the present invention.
　図６Ａは、王冠のような形状の先端部を示す。このような形状は、例えば、クラウン型とも呼ばれる。図６Ａに示す形状は、例えば、第１の先端部１２に用いられる。第１の先端部１２をクラウン型とすることで、検査対象である半導体集積回路、あるいはこれを含む電子部品の電極あるいは配線との接触を、王冠の複数の頂点で行うことができる。したがって、検査対象の電極や配線とより確実な電気的な接続が可能となる。 FIG. 6A shows a tip shaped like a crown. Such a shape is also called a crown type, for example. The shape shown in FIG. 6A is used for the first tip 12, for example. By making the first tip portion 12 into a crown shape, it is possible to make contact with the electrodes or wirings of a semiconductor integrated circuit to be inspected or an electronic component including the same at a plurality of vertices of the crown. Therefore, more reliable electrical connection with the electrode or wiring to be inspected is possible.
　図６Ｂは、円錐のような形状の先端部を示す。図６Ｂに示す形状は、例えば、第１の先端部１２に用いられる。このような形状とすることで、検査対象である半導体集積回路、あるいはこれを含む電子部品の電極あるいは配線との接触を、点で行うことができるため、局所的な接触が可能となる。また、クラウン型のように、複数個の爪が接触する場合と比較して、より大きな荷重で接触できる。また、検査対象の電極や配線と確実な電気的接続が可能となる。 FIG. 6B shows a conical tip. The shape shown in FIG. 6B is used for the first tip portion 12, for example. With such a shape, the contact with the electrode or wiring of the semiconductor integrated circuit to be inspected or the electronic component including the semiconductor integrated circuit can be performed with a point, so that local contact is possible. Moreover, compared with the case where a some nail | claw contacts like a crown type | mold, it can contact with a bigger load. In addition, reliable electrical connection with the electrodes and wirings to be inspected becomes possible.
　図６Ｃは、図６Ｂに対して、先端が丸みを帯びた形状の先端部を示す。図６Ｃに示す形状は、例えば、第１の先端部１２または第２の先端部２２に用いられる。このような形状とすることで、検査対象である半導体集積回路、あるいはこれを含む電子部品の電極あるいは配線と電気的に接続する面積を大きくすることができる。したがって、検査対象の電極や配線とプローブとの面圧を低くすることが可能となる。 FIG. 6C shows a tip having a rounded tip with respect to FIG. 6B. The shape shown in FIG. 6C is used for the first tip portion 12 or the second tip portion 22, for example. With such a shape, it is possible to increase an area electrically connected to an electrode or wiring of a semiconductor integrated circuit to be inspected or an electronic component including the semiconductor integrated circuit. Therefore, the surface pressure between the electrode or wiring to be inspected and the probe can be lowered.
　本発明の実施形態として上述した各実施形態は、相互に矛盾しない限りにおいて、適宜組み合わせて実施することができる。また、各実施形態を基にして、当業者が適宜構成要素の追加、削除もしくは設計変更を行ったものも、本発明の要旨を備えている限り、本発明の範囲に含まれる。 The embodiments described above as embodiments of the present invention can be implemented in appropriate combination as long as they do not contradict each other. Moreover, what the person skilled in the art added, deleted, or changed the design as appropriate based on each embodiment is also included in the scope of the present invention as long as the gist of the present invention is included.
　また、上述した各実施形態によりもたらされる作用効果とは異なる他の作用効果であっても、本明細書の記載から明らかなもの、又は、当業者において容易に予測し得るものについては、当然に本発明によりもたらされるものと理解される。 Of course, other operational effects that are different from the operational effects provided by each of the above-described embodiments are obvious from the description of the present specification or can be easily predicted by those skilled in the art. It is understood that this is brought about by the present invention.
　１０、８０、９０：第１のパイプ、１２：第１の先端部、１４：第１のプランジャ、１６：第１のプランジャボス部、１８：第１の摺動部、１９：第４のプランジャボス部、２０：第１の切り欠き、２１：第２の切り欠き、２２：第２の先端部、２３：第３の切り欠き、２４：第２のプランジャ、２６：第２のプランジャボス部、２８：第２の摺動部、２９：第３のプランジャボス部、３０：第１の端部、３１：第２の端部、３２：第２のパイプ、４０：第１の螺旋部、４１：第１の螺旋状の溝、４２、６２：螺旋状の溝、５０：第１の円筒部、６０：第２の螺旋部、６１：第２の螺旋状の溝、７０：プローブホルダ、７２：第１のプローブホルダ部材、７４：第２のプローブホルダ部材、１００：半導体検査装置、１１０、１１２、１１３：プローブ、１２０：プローブユニット、１４０：回路基板、１５０：テスタ、１５２：計測電源、１５４：ＬＣＲ測定器、１５６：パルス発生器、１７０：検査対象、１８０：先端部 10, 80, 90: 1st pipe, 12: 1st tip part, 14: 1st plunger, 16: 1st plunger boss | hub part, 18: 1st sliding part, 19: 4th plunger Boss part, 20: 1st notch, 21: 2nd notch, 22: 2nd front-end | tip part, 23: 3rd notch, 24: 2nd plunger, 26: 2nd plunger boss part , 28: second sliding portion, 29: third plunger boss portion, 30: first end portion, 31: second end portion, 32: second pipe, 40: first spiral portion, 41: first spiral groove, 42, 62: spiral groove, 50: first cylindrical portion, 60: second spiral portion, 61: second spiral groove, 70: probe holder, 72: First probe holder member, 74: Second probe holder member, 100: Semiconductor inspection apparatus, 110, 112, 11 : Probe, 120: probe unit, 140: circuit board, 150: tester, 152: Measurement Power, 154: LCR meter, 156: pulse generator 170: inspected, 180: tip

Claims (13)

  1. 　第１のプランジャ、前記第１のプランジャを嵌合する第１の切り欠きを有する第１の端部、第１の螺旋状の溝を有する第１の螺旋部、および第１の円筒部を有する第１のパイプを備えるプローブ。 A first plunger, a first end having a first notch for fitting the first plunger, a first spiral having a first spiral groove, and a first cylinder; A probe comprising a first pipe.
  2. 　さらに、第２のプランジャを備え、前記第１のパイプは、前記第２のプランジャを嵌合する第２の切り欠きを有する第２の端部を備える請求項１に記載のプローブ。 The probe according to claim 1, further comprising a second plunger, wherein the first pipe includes a second end portion having a second notch for fitting the second plunger.
  3. 　前記第１のプランジャはさらに第１の摺動部を有し、前記第１の摺動部は、前記第１の円筒部と接する請求項２に記載のプローブ。 The probe according to claim 2, wherein the first plunger further includes a first sliding portion, and the first sliding portion is in contact with the first cylindrical portion.
  4. 　前記第１のパイプは、第２の螺旋状の溝を有する第２の螺旋部を備える、請求項３に記載のプローブ。 The probe according to claim 3, wherein the first pipe includes a second spiral portion having a second spiral groove.
  5. 　前記第２のプランジャはさらに第２の摺動部を有し、前記第２の摺動部は、前記第１の円筒部と接する請求項４に記載のプローブ。 The probe according to claim 4, wherein the second plunger further includes a second sliding portion, and the second sliding portion is in contact with the first cylindrical portion.
  6. 　前記第１のプランジャはさらに第１の摺動部を有し、前記第１の摺動部は、前記第１の円筒部と接する請求項１に記載のプローブ。 The probe according to claim 1, wherein the first plunger further includes a first sliding portion, and the first sliding portion is in contact with the first cylindrical portion.
  7. 　さらに前記第１のパイプの内側に配置され、前記第１の円筒部に接する第２のパイプを備える、請求項２に記載のプローブ。 The probe according to claim 2, further comprising a second pipe disposed inside the first pipe and in contact with the first cylindrical portion.
  8. 　前記第２のパイプは、第３の螺旋状の溝を有する請求項７に記載のプローブ。 The probe according to claim 7, wherein the second pipe has a third spiral groove.
  9. 　前記第２のパイプが有する二つの端部のうち、少なくとも一方の端部に切り欠きを有し、前記第２のパイプが有する切り欠きは前記第１のプランジャまたは前記第２のプランジャを嵌合する請求項７に記載のプローブ。 Of the two ends of the second pipe, at least one end has a notch, and the notch of the second pipe fits the first plunger or the second plunger. The probe according to claim 7.
  10. 　前記第１のパイプおよび前記第２のパイプの両方に嵌合されている前記第１のプランジャまたは前記第２のプランジャの何れか一方において、
    　前記第１のパイプに嵌合されている第１のボス部と、前記第２のパイプに嵌合されている第２のボス部とを有し、
    　前記第１のボス部の径は前記第２のボス部の径と比して大きく、
    　前記第２のボス部は前記第１のボス部よりも突出している、
    　請求項９に記載のプローブ。     In either the first plunger or the second plunger fitted to both the first pipe and the second pipe,
    A first boss portion fitted to the first pipe and a second boss portion fitted to the second pipe;
    The diameter of the first boss part is larger than the diameter of the second boss part,
    The second boss part protrudes from the first boss part,
    The probe according to claim 9.
  11. 　さらに前記第１のパイプの内側に配置され、前記第１の円筒部に接し、第３の螺旋状の溝を有する第２のパイプを備え、
    　前記第２のパイプは、前記第２のパイプが有する二つの端部のうち、少なくとも一方の端部に切り欠きを有し、
    　前記第１のパイプと前記第２のパイプとにおいて、
    　前記第１の螺旋部は前記第１の摺動部と重なり、
    　前記第２の螺旋部は全長に渡り、前記第２のパイプが有する第２の円筒部または前記第２のパイプが有する切り欠きと重なり、
    　前記第３の螺旋状の溝は全長に渡り、前記第１の円筒部または前記第２の切り欠きと重なる請求項４に記載のプローブ。     And a second pipe disposed inside the first pipe, in contact with the first cylindrical portion, and having a third spiral groove,
    The second pipe has a notch at at least one of the two ends of the second pipe,
    In the first pipe and the second pipe,
    The first spiral portion overlaps the first sliding portion;
    The second spiral part extends over the entire length, and overlaps with a second cylindrical part of the second pipe or a notch of the second pipe,
    The probe according to claim 4, wherein the third spiral groove extends over the entire length and overlaps the first cylindrical portion or the second cutout.
  12. 　請求項１に記載の前記プローブを有するプローブユニット。 A probe unit having the probe according to claim 1.
  13. 　請求項１２に記載の前記プローブユニットを有する半導体検査装置。 A semiconductor inspection apparatus having the probe unit according to claim 12.
PCT/JP2018/012350 2017-03-29 2018-03-27 Probe, probe unit, and semiconductor inspection device provided with probe unit WO2018181273A1 (en)

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TW201837476A (en) 2018-10-16
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